JP2013162008A - Temperature adjustment system and charged particle beam drawing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a temperature adjustment system capable of reducing power consumption.SOLUTION: There is provided a temperature adjustment system including: a first circulation path which is connected to a first cooled part and in which a first liquid refrigerant circulates; a first cooling unit which is connected to the first circulation path and includes a compressor, a condenser, and an evaporator; and a second cooling unit which is connected to the first circulation path between the first cooled part and first cooling unit on an upstream side of the first cooling unit, and includes a heat exchanger for exchanging heat between a liquid and a liquid.

Description

  The present invention relates to a temperature control system and a charged particle beam drawing apparatus.

  Lithography technology is used to form a desired circuit pattern on a semiconductor device. In lithography technology, a pattern is transferred using an original pattern called a mask (reticle). In order to manufacture a highly accurate reticle, an electron beam drawing apparatus having an excellent resolution is used.

  In the electron beam drawing apparatus, in order to ensure the drawing accuracy on the sample, the sample and its peripheral portion, specifically, the drawing chamber in which the sample is placed on the stage and stored, and the sample is irradiated with the electron beam. Therefore, high-precision temperature control is required for an electronic lens barrel and the like.

  Patent Document 1 discloses a temperature control system and a charged particle beam drawing apparatus that include two temperature control units and can be miniaturized.

JP 2011-108954 A

  However, when the thermal load for cooling the charged particle beam drawing apparatus increases, a refrigeration circuit having a cooling capacity corresponding to the thermal load is required, resulting in a problem that the power consumption of the apparatus increases.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a temperature control system and a charged particle beam drawing apparatus capable of reducing power consumption.

  A temperature control system according to an aspect of the present invention is connected to a first cooled part, and is connected to a first circulation path through which a first liquid refrigerant circulates, and to the first circulation path. A first cooling unit including an evaporator and connected to the first circulation path upstream of the first cooling unit and between the first cooled portion and the first cooling unit. And a second cooling unit including a heat exchanger for exchanging heat between the liquid and the liquid.

  In the temperature control system of the above aspect, the first cooling path is provided downstream of the second cooling unit and between the second cooling unit and the first cooling unit. A thermometer for measuring the temperature of the liquid refrigerant, and a mass flow controller for controlling the flow rate of the coolant flowing into the second cooling unit to cool the first liquid refrigerant based on the measurement result of the thermometer It is desirable to further include

  In the temperature control system according to the above aspect, the second circulation path connected to the second cooled part and through which the second liquid refrigerant circulates, and the third circulation path connected to the second circulation path and provided with a thermoelectric conversion element. And the third cooling unit that branches from the first circulation path downstream of the first cooling unit and between the first cooling unit and the first cooled portion. A branch path that is upstream of the second cooling unit and that joins the first circulation path between the second cooling unit and the first cooled portion via the unit; It is desirable to have more.

  The charged particle beam drawing apparatus of one embodiment of the present invention includes a first cooled portion, a first circulation path that is connected to the first cooled portion and in which a first liquid refrigerant circulates, and the first A first cooling unit including a compressor, a condenser, and an evaporator, upstream of the first cooling unit, the first cooled portion, and the first cooling unit. And a second cooling unit provided with a heat exchanger for exchanging heat between the liquids and connected to the first circulation path between the liquid and the temperature control system.

  In the charged particle beam drawing apparatus of the above aspect, connected to the lens barrel that irradiates the sample with the charged particle beam, the drawing chamber in which the sample is accommodated, the second cooled portion, and the second cooled portion, A second circulation path through which the second liquid refrigerant circulates, a second cooling unit connected to the second circulation path and provided with a thermoelectric conversion element, and downstream of the first cooling unit, and Branching from the first circulation path between the first cooling unit and the first cooled part, via the second cooling unit, upstream of the second cooling unit, The temperature control system further comprising: a branch path that joins the first circulation path between the second cooling unit and the first cooled part, and the first cooled target Is a device provided in the lens barrel or the lens barrel, and the second object to be cooled It is desirable but is a device provided in the drawing chamber or the drawing chamber.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the temperature control system and charged particle beam drawing apparatus which can aim at reduction of power consumption.

It is the schematic which shows the structure of the electron beam drawing apparatus of 1st Embodiment. It is the schematic which shows the structure of the temperature control system of 1st Embodiment. It is the schematic which shows the structure of the 1st cooling unit of 1st Embodiment. It is the schematic which shows the structure of the 2nd cooling unit of 1st Embodiment. It is a figure which shows the temperature change of the 1st liquid refrigerant in 1st Embodiment. It is the schematic which shows the structure of the temperature control system of 2nd Embodiment. It is the schematic which shows the structure of the temperature control system of 3rd Embodiment. It is the schematic which shows the structure of the 3rd cooling unit of 3rd Embodiment. It is a figure which shows the temperature change of the 1st and 2nd liquid refrigerant in 3rd Embodiment. It is the schematic which shows the structure of the temperature control system of the modification of 3rd Embodiment.

  Embodiments of the present invention will be described below with reference to the drawings. Hereinafter, in the embodiment, a configuration using an electron beam will be described as an example of a charged particle beam. However, the charged particle beam is not limited to the electron beam, and may be a beam using charged particles such as an ion beam.

  In the embodiment, a mask substrate (or mask) used for manufacturing a semiconductor or the like will be described as an example of a “sample” on which a drawing pattern is drawn.

  In this specification, “drawing data” is basic data of a pattern to be drawn on a sample. The drawing data is data obtained by converting the format of design data generated by a designer using CAD or the like so that arithmetic processing can be performed in the drawing apparatus. A drawing pattern such as a figure is defined by coordinates such as a vertex of the figure, for example.

  Further, in this specification, the side on which the liquid flows into the cooling unit, the portion to be cooled, etc. is referred to as “upstream side”, and the side on which the liquid flows out is referred to as “downstream side”.

  In addition, in this specification, “a heat exchanger that exchanges heat between liquids” means, for example, heat exchange in which heat exchange is performed by directly connecting a pipe that passes a high-temperature liquid and a pipe that passes a low-temperature liquid. It means a heat exchanger of a type that exchanges heat between liquids only by simple heat conduction without using power such as electricity.

(First embodiment)

  FIG. 1 is a schematic diagram showing a configuration of an electron beam drawing apparatus according to the present embodiment.

  In FIG. 1, the electron beam drawing apparatus 100 includes a drawing unit 150, a control unit 160, and a temperature adjustment system 170. The electron beam drawing apparatus 100 is an example of a charged particle beam drawing apparatus. The electron beam drawing apparatus 100 draws a desired pattern on the sample 101.

  The drawing unit 150 includes an electronic lens barrel 102 and a drawing chamber 103 which are examples of a lens barrel. In the electron column 102, an electron gun 201, an illumination lens 202, a blanking (BLK) deflector 212, a blanking (BLK) aperture 214, a first aperture 203, a projection lens 204, a deflector 205, a second An aperture 206, an objective lens 207, and a deflector 208 are arranged.

  In the drawing chamber 103, an XY stage 105 is arranged so as to be movable. A sample 101 is placed on the XY stage 105. Examples of the sample 101 include an exposure mask substrate that transfers a pattern onto a wafer. The mask substrate includes mask blanks on which nothing is drawn yet.

  The control unit 160 includes an input unit 111, a memory 109, a digital-analog converter (DAC: not shown), a control computer 120, and a memory 121.

  Drawing data stored in the memory 109 is input to the control computer 120. Information input to the control computer 120 or information during and after the arithmetic processing is stored in the memory 121 each time. A memory 121, a memory 109, and the like are connected to the control computer 120 via a bus.

  An electron beam 200 is emitted from an electron gun 201 which is an example of an irradiation unit. The electron beam 200 emitted from the electron gun 201 illuminates the entire first aperture 203 having a rectangular hole by the illumination lens 202.

  Here, the electron beam 200 is first shaped into a rectangle. Then, the electron beam 200 of the first aperture image that has passed through the first aperture 203 is projected onto the second aperture 206 by the projection lens 204. The position of the first aperture image on the second aperture 206 is deflection-controlled by the deflector 205, and the beam shape and size can be changed. As a result, the electron beam 200 is shaped.

  Then, the electron beam 200 of the second aperture image that has passed through the second aperture 206 is focused by the objective lens 207 and deflected by the deflector 208. As a result, the desired position of the sample 101 on the continuously moving XY stage 105 is irradiated.

  Here, when the electron beam 200 on the sample 101 reaches the irradiation time t in which a desired irradiation amount is incident on the sample 101, blanking is performed as follows. That is, in order to prevent the sample 101 from being irradiated with the electron beam 200 more than necessary, for example, the electron beam 200 is deflected by the electrostatic BLK deflector 212 and the electron beam 200 is cut by the BLK aperture 214. This prevents the electron beam 200 from reaching the surface of the sample 101.

  When the beam is ON (blanking OFF), the electron beam 200 emitted from the electron gun 201 follows the trajectory indicated by the solid line in FIG. On the other hand, in the case of beam OFF (blanking ON), the electron beam 200 emitted from the electron gun 201 follows the trajectory indicated by the dotted line in FIG. In addition, the inside of the electron column 102 and the drawing chamber 103 are evacuated by a vacuum pump (not shown) to form a vacuum atmosphere in which the pressure is lower than the atmospheric pressure.

  The temperature control system 170 cools the equipment of the drawing unit 150 and the control unit 160, the transfer chamber (not shown) for transferring the sample to the drawing chamber 150, and the alignment chamber (not shown) for aligning the sample. Control to a predetermined temperature to ensure the drawing accuracy on the sample.

  Using the drawing apparatus 100 configured as described above, a drawing pattern is drawn on the mask substrate 101.

  In FIG. 1, components necessary for explaining the present embodiment are shown. Needless to say, the electron beam drawing apparatus 100 normally includes other necessary components.

  In FIG. 1, the control computer 120, which is an example of a computer, is described as executing processing related to drawing control, but the present invention is not limited to this. For example, it may be implemented by hardware using an electric circuit. Or you may make it implement by the combination of the hardware and software by an electrical circuit. Alternatively, a combination of such hardware and firmware may be used.

  FIG. 2 is a schematic diagram showing the configuration of the temperature control system of the present embodiment. The arrows in the figure indicate the direction in which the liquid refrigerant or the coolant flows.

  The temperature control system 170 according to the present embodiment is connected to the first cooled part 10, and the first circulation path 12 through which the first liquid refrigerant circulates and the first circulation path 12 connected to the first circulation path 12. The cooling unit 14 is provided. And the 2nd cooling unit 16 connected to the 1st circuit 12 between the 1st to-be-cooled part 10 and the 1st cooling unit 14 in the upper stream side of the 1st cooling unit 14, It has.

  The first cooled portion 10 is a device provided in the drawing unit 150 and the control unit 160 of the electron beam drawing apparatus 100 shown in FIG. The first liquid refrigerant is, for example, water.

  Furthermore, the temperature control system 170 includes a tank 18 that stores the first liquid refrigerant. Further, a pump 20 for circulating the first liquid refrigerant in the first circulation path 12 is provided.

  The first cooling unit 14 is connected to a flow path 24 for supplying a coolant. The second cooling unit 16 is connected to a flow path 26 for supplying a coolant. The cooling liquid is, for example, city water or cooling water circulating in the factory. The flow path 26 may be a flow path branched from the flow path 24.

The first liquid refrigerant that has exchanged heat with the first cooled part 10 and has reached a high temperature (temperature T ₁ ) flows through the first circulation path 12 in the direction of the arrow. Then, the heat removal by the second cooling unit 16, a temperature lower than the temperature _{T 1} (temperature _{T 2).} Further, the temperature is adjusted by the first cooling unit 14 so as to reach the target temperature T ₀ .

  The temperature-adjusted first liquid refrigerant is once stored in the tank 18 and then flowed to the first circulation path 12 by the pump 20. And it goes to the 1st to-be-cooled part 10, heat-exchanges with the 1st to-be-cooled part 10, and the 1st to-be-cooled part 10 is hold | maintained at desired temperature.

  FIG. 3 is a schematic diagram showing the configuration of the first cooling unit of the present embodiment. As shown in FIG. 3, the first cooling unit 14 includes, for example, a flow path 14a through which a refrigerant such as Freon flows, a compressor 14b connected to the flow path 14a, a condenser 14c, an evaporator 14d, and an expansion valve 14e.

  And the flow path 24 which supplies a cooling fluid is connected to the condenser 14c, and the 1st circulation path 12 through which a 1st liquid refrigerant flows is connected to the evaporator 14d.

The first liquid refrigerant temperatures T ₁ flowing from the first circulation path 12 in the first cooling unit 14, the temperature T ₀ is cooled by refrigerant heat exchange with Freon to vaporize in the evaporator 14d. The vaporized refrigerant is liquefied by the compressor 14b and further liquefied by the cooling water flowing through the flow path 24 by the condenser 14c. Thereafter, the liquefied refrigerant is injected into the evaporator 14d by the expansion valve 14e and vaporized. As described above, the first liquid refrigerant is cooled, and temperature-regulated so as to be temperature T _0.

  Thus, the 1st cooling unit 14 is a refrigerating circuit (refrigeration cycle) which exhausts heat from a low-temperature heat source to a high-temperature heat source using energy from a power source such as a power source.

  FIG. 4 is a schematic diagram showing the configuration of the second cooling unit of the present embodiment. As shown in FIG. 4, the second cooling unit 16 includes a heat exchanger 16 a that exchanges heat between liquids. The heat exchanger 16a is a type of heat exchanger that exchanges heat by direct heat conduction between liquids without using a power source such as a power source.

  For example, the heat exchanger 16a is a heat exchanger that performs heat exchange by conducting heat by physically contacting the flow path through which the first liquid passes and the flow path through which the second liquid passes. Specific examples include a spiral heat exchanger, a plate heat exchanger, a double tube heat exchanger, a spiral tube heat exchanger, a tank coil heat exchanger, and the like.

  The second cooling unit 16 uses a heat exchanger 16a that exchanges heat between the liquids, so that, for example, a power source that is used to drive the compressor of the first cooling unit 14 becomes unnecessary. .

FIG. 5 is a diagram showing a temperature change of the first liquid refrigerant in the present embodiment. In FIG. 5, the vertical axis indicates the temperature, and the horizontal axis indicates the path of the liquid refrigerant. As described above, the first liquid refrigerant supplied to the first cooled portion 10 is heated to the temperature T ₁ by removing heat from the first cooled portion 10. Then, it is heat removal by the second cooling unit 16 and cooled to a temperature T _2. Then, it is further cooled in the first cooling unit 14, and temperature-regulated to the target temperature T _0.

For example, if the target temperature T ₀ is 23 ° C., the second liquid cooling unit 16 removes the first liquid refrigerant that has been deprived of heat from the first cooled part 10 and has reached 28 ° C. ± 1 ° C., for example. Heated to 25 ° C. ± 0.5 ° C., for example. Further, the temperature is adjusted to 23 ° C. ± 0.1 ° C. by the first cooling unit 14.

  According to the present embodiment, the second cooling unit 16 that does not use a power source is provided between the first cooled part 10 and the first cooling unit 14 to remove heat. Therefore, compared with the case where the second cooling unit 16 is not provided, the thermal load on the first cooling unit 14 is reduced. Therefore, it is possible to provide a temperature control system and a charged particle beam drawing apparatus that reduce power consumption.

  Furthermore, as shown in FIG. 5, the temperature variation of the first liquid refrigerant flowing into the first cooling unit 14 is reduced by removing heat from the second cooling unit 16. Therefore, it is possible to adjust the temperature in the first cooling unit 14 with higher accuracy.

  Furthermore, according to the present embodiment, even when there is a change in the heat load for maintaining the predetermined temperature due to the change of the first cooled part 10 or the like, the first cooling unit 14 which is an expensive refrigeration circuit. Can be accommodated by changing the inexpensive second cooling unit 16 while keeping it. For example, even when a design change occurs in the drawing unit 150 or the control unit 160 of the electron beam drawing apparatus and the thermal load changes, it is possible to cope with the change only by changing the second cooling unit. Therefore, it is possible to provide a temperature control system and a charged particle beam drawing apparatus that can easily and inexpensively respond to changes in thermal load.

(Second Embodiment)
The present embodiment is provided in the first circulation path between the second cooling unit and the first cooling unit on the downstream side of the second cooling unit, and measures the temperature of the first liquid refrigerant. And a mass flow controller for controlling the flow rate of the cooling liquid flowing into the second cooling unit to cool the first liquid refrigerant based on the measurement result of the thermometer. This is the same as the first embodiment. Therefore, the description overlapping with that of the first embodiment is omitted.

  FIG. 6 is a schematic diagram showing the configuration of the temperature control system of the present embodiment. As shown in the figure, the temperature adjustment system 170 is located downstream of the second cooling unit 16 and in the first circulation path 12 between the second cooling unit 16 and the first cooling unit 14. A total of 30 is provided. The thermometer 30 measures the temperature of the first liquid refrigerant flowing through the first circulation path 12.

  In addition, a mass flow controller 32 that controls the flow rate of the coolant flowing into the second cooling unit 16 is provided to cool the first liquid refrigerant based on the measurement result of the thermometer 30. The mass flow controller 32 is provided on the inflow side of the coolant flow path 26 to the second cooling unit 16.

  For example, when the temperature of the first liquid refrigerant is higher than the assumed temperature, the mass flow controller 32 increases the flow rate of the coolant. On the other hand, when the temperature of the first liquid refrigerant is lower than the assumed temperature, the mass flow controller 32 reduces the flow rate of the coolant.

  As a result, the temperature of the first liquid refrigerant flowing out of the second cooling unit 16 and flowing into the first cooling unit 14 can be stabilized. Therefore, the temperature of the first liquid refrigerant after the temperature is adjusted by the first cooling unit 14 is stabilized, and the temperature variation is also reduced. Therefore, a temperature control system and an electron beam drawing apparatus capable of more stable temperature control are realized.

(Third embodiment)
A second circulation path that is connected to the second cooled part and through which the second liquid refrigerant circulates, a third cooling unit that is connected to the second circulation path and includes a thermoelectric conversion element, and a first cooling Downstream of the unit, branched from the first circulation path between the first cooling unit and the first cooled portion, and upstream of the second cooling unit via the third cooling unit And it is the same as that of 2nd Embodiment except having further provided the branch path merged with the 1st circulation path between a 2nd cooling unit and a 1st to-be-cooled part. Therefore, the description overlapping with the second embodiment is omitted.

  FIG. 7 is a schematic diagram showing the configuration of the temperature control system of the present embodiment. As shown in FIG. 7, the temperature adjustment system 170 includes a second circulation path 42 that is connected to the second cooled part 40 and in which the second liquid refrigerant circulates. And the 3rd cooling unit 44 provided with a thermoelectric conversion element is provided. Then, it is branched from the first circulation path 12 downstream of the first cooling unit 14 and between the first cooling unit 14 and the first cooled part 10, and passes through the third cooling unit 44. In addition, a branch path 46 that is upstream of the second cooling unit 16 and joins the first circulation path 12 between the second cooling unit 16 and the first cooled portion 10 is provided.

  The second liquid refrigerant is, for example, water.

  FIG. 8 is a schematic diagram showing the configuration of the third cooling unit of the present embodiment. As shown in FIG. 8, the third cooling unit 44 includes a thermoelectric conversion element 44a. The thermoelectric conversion element 44a is, for example, a Peltier element.

  The heat of the second liquid refrigerant flowing into the third cooling unit 44 from the second cooled part 40 moves to the first liquid refrigerant flowing in from the branch path 46 by the thermoelectric conversion element 44a. Thus, the second liquid refrigerant is cooled and adjusted to a predetermined temperature and temperature variation.

FIG. 9 is a diagram showing temperature changes of the first and second liquid refrigerants in the present embodiment. The first liquid refrigerant supplied to the first cooled part 10 and the third cooling unit 44 takes the heat from the first cooled part 10 and the third cooling unit 44, thereby increasing the temperature to T ₁ . Raise the temperature. Then, it is heat removal by the second cooling unit 16 and cooled to a temperature T _2. Then, it is further cooled in the first cooling unit 14, and temperature-regulated to the target temperature T _0. Further, the temperature of the second liquid refrigerant is controlled by the third cooling unit 44 so that the variation is smaller than that of the first liquid refrigerant.

For example, if the target temperature T ₀ is 23 ° C., the first liquid refrigerant that has deprived heat from the first cooled part 10 and the third cooling unit 44 to 28 ° C. ± 1 ° C., for example, The heat is removed by the two cooling units 16 and becomes 25 ° C. ± 0.5 ° C., for example. Further, the first cooling unit 14 adjusts the temperature to 23 ° C. ± 0.1 ° C. (first temperature adjustment), for example. Further, the third cooling unit 44 adjusts the temperature of the second liquid refrigerant to, for example, 23 ° C. ± 0.01 ° C. (second temperature adjustment).

  In the present embodiment, the second cooled part 40 is a part that requires more precise temperature control than the first cooled part 10. For example, the first cooled portion 10 is an electronic lens barrel 102 in FIG. 1 or a device provided in the electronic lens barrel 102. A device provided in the electron column 102 is, for example, a deflector or an aperture. Moreover, the 1st to-be-cooled part 10 is an apparatus provided in control parts 160, such as the control computer 120, for example.

  The second cooled portion 40 that requires temperature adjustment with higher accuracy is, for example, a drawing chamber 103 or a device provided in the drawing chamber 103 such as a laser head.

  According to the present embodiment, by providing the branch path 46 and the third cooling unit 44, highly accurate temperature adjustment is performed on a portion where temperature adjustment is required with higher accuracy. Therefore, a temperature adjustment system and an electron beam drawing apparatus that can adjust the temperature according to the required accuracy are realized.

  FIG. 10 is a schematic diagram illustrating a configuration of a temperature control system according to a modification of the present embodiment. As in the present modification, a plurality of third cooling units 44, second cooled parts 40, and second circulation paths 42 can be provided in the branch path 46. Each of the plurality of second cooled parts 40 is a different part of the electron beam drawing apparatus.

  The embodiments have been described above with reference to specific examples. However, the present invention is not limited to these specific examples.

  In addition, although descriptions are omitted for parts and the like that are not directly required for the description of the present invention, such as a device configuration and a control method, a required device configuration and a control method can be appropriately selected and used. For example, the details of the configuration of the control unit for controlling the charged particle beam drawing apparatus have been omitted, but it goes without saying that the required control unit configuration is appropriately selected and used.

  In addition, all temperature control systems and charged particle beam drawing apparatuses that include elements of the present invention and that can be appropriately modified by those skilled in the art are included in the scope of the present invention.

DESCRIPTION OF SYMBOLS 10 1st to-be-cooled part 12 1st circulation path 14 1st cooling unit 14b Compressor 14c Condenser 14d Evaporator 16 2nd cooling unit 30 Thermometer 32 Mass flow controller 40 2nd to-be-cooled part 42 2nd Circulation path 44 Third cooling unit 44a Thermoelectric conversion element 46 Branch path 100 Electron beam drawing apparatus 102 Electron barrel 103 Drawing chamber 170 Temperature control system

Claims (5)

A first circulation path connected to the first cooled part and through which the first liquid refrigerant circulates;
A first cooling unit connected to the first circulation path and comprising a compressor, a condenser, and an evaporator;
Heat that is upstream of the first cooling unit and is connected to the first circulation path between the first cooled part and the first cooling unit, and exchanges heat between the liquids. A second cooling unit comprising an exchanger;
A temperature control system comprising: Provided in the first circulation path downstream of the second cooling unit and between the second cooling unit and the first cooling unit, and measures the temperature of the first liquid refrigerant. A thermometer,
Based on the measurement result of the thermometer, a mass flow controller that controls the flow rate of the coolant flowing into the second cooling unit in order to cool the first liquid refrigerant;
The temperature control system according to claim 1, further comprising: A second circulation path connected to the second cooled part and through which the second liquid refrigerant circulates;
A third cooling unit connected to the second circulation path and comprising a thermoelectric conversion element;
Branches from the first circulation path downstream of the first cooling unit and between the first cooling unit and the first cooled part, and passes through the third cooling unit. A branch path that is upstream of the second cooling unit and joins the first circulation path between the second cooling unit and the first cooled part;
The temperature control system according to claim 1, further comprising: A first cooled part;
A first cooling unit connected to the first cooled part and connected to the first circulation path through which the first liquid refrigerant circulates and having a compressor, a condenser, and an evaporator And connected to the first circulation path upstream of the first cooling unit and between the first cooled part and the first cooling unit, and exchanges heat between the liquids. A second cooling unit comprising a heat exchanger that
A charged particle beam drawing apparatus comprising: A lens barrel for irradiating a specimen with a charged particle beam;
A drawing room in which a sample is stored;
A second cooled part;
A second circulation path connected to the second cooled part and through which a second liquid refrigerant circulates; a second cooling unit connected to the second circulation path and provided with a thermoelectric conversion element; Branching from the first circulation path downstream of the first cooling unit and between the first cooling unit and the first part to be cooled, via the second cooling unit, A temperature control system having a branch path that is upstream of a second cooling unit and joins the first circulation path between the second cooling unit and the first cooled part; Further comprising
The first cooled portion is a device provided in the lens barrel or the lens barrel, and the second cooled portion is a device provided in the drawing chamber or the drawing chamber. 4. The charged particle beam drawing apparatus according to 4.

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