JP2013161890A - Resistance substrate and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resistance substrate having excellent micro linearity characteristics, and to provide a manufacturing method therefor.SOLUTION: On an insulation substrate 11, a resistor pattern 12 on which a slider BR slides and a collector pattern 13 are provided with a space between one other, and a pair of conductive electrode patterns 14 are formed, respectively, at both ends of the resistor pattern 12. In such a resistance substrate 1, the resistance substrate 1 includes an insulation pattern 15 provided on the insulation substrate 11 so as to connect the pair of conductive electrode patterns 14. Both ends of the insulation pattern 15 are superimposed on the pair of conductive electrode patterns 14, and the resistor pattern 12 is laminated on the insulation pattern 15 and the exposed parts 14a of the pair of conductive electrode patterns 14 exposed from the insulation pattern 15.

Description

  The present invention relates to a resistance substrate and a manufacturing method thereof, and more particularly to a resistance substrate having excellent microlinearity characteristics and a manufacturing method thereof.

  A variable resistance sensor is used as a position detection sensor. In recent years, in order to perform finer control in various electric devices, a sensor with higher position detection accuracy than before has been demanded.

  In order to realize a position detection sensor with better position detection accuracy than before, there is a demand for a resistance substrate with good micro linearity characteristics, which is linearity of output in a minute signal region.

  Here, the micro linearity characteristic will be described with reference to FIG. FIG. 7 is a graph for explaining the micro linearity characteristic, and a case of a slide type sensor capable of linear sliding operation will be described.

  The variable resistance type position detection sensor has a structure in which a slider made of a metal plate slides on a resistor printed and formed linearly on a substrate. As a general usage, there are many usages in which a rated voltage is applied to both ends of a resistor and an output voltage that varies depending on the sliding position of the slider is taken out of the slider. Further, many output voltage characteristics change in proportion to the amount of movement of the slider, and FIG. 7 also shows examples of such characteristics.

  In the graph shown in FIG. 7, the rated voltage Vin is applied to the length L in the sliding direction of the slider in the resistor pattern, and the output V from the slider sliding on the resistor pattern is expressed in the vertical direction. The horizontal axis represents the position X of the slider on the resistor pattern. Under the assumption that the resistivity of the resistor is constant regardless of position, the output change when the slider moves by ΔX from an arbitrary point on the resistor is an ideal straight line having a slope of Vin / L. Should be indicated by P.

  In the ideal straight line P, the reference output displacement when the slider moves by ΔX from the point A to the point B can be expressed as ΔV = (ΔX / L) × Vin, but the actual output S is the ideal straight line P. Deviate from. As shown in the following equation, the micro linearity characteristic was obtained by calculating the difference of the reference output displacement from the output difference VB−VA of the actual outputs VA and VB at the points A and B, and this difference was obtained as a percentage with respect to the applied voltage Vin. It is defined as a thing. The micro linearity characteristic is more accurate as it approaches 0%. In a position sensor that requires high performance, a particularly excellent micro linearity characteristic in which the actual output S is close to the ideal straight line P is desired.

However,
VA: Output value when the slider is at point A on the resistor VB: Output value when the slider is at point B on the resistor Vin: Applied voltage in the resistor length L direction ΔX: Point Distance between A and B L: Resistor length

  Next, micro linearity in the case of a rotary sensor in which a slider is rotatably mounted on a resistor formed in an arc shape as shown in FIG. 8 is defined as the following equation. Is similar to the slide type sensor. FIG. 8 is a diagram showing a resistance substrate in the case of a rotary sensor.

However,
Vin: Applied voltage ΔV: Output voltage difference between measurements (= VB−VA)
Θ: Angle between electrodes Δθ: Angle difference between ∠A and ∠B (angle between measurement patterns)

  As a conventional resistance substrate, a resistance substrate described in Patent Document 1 below is known.

  Hereinafter, the resistance substrate described in Patent Document 1 will be described with reference to FIG. FIG. 9 is a view showing the resistance substrate 100.

  As shown in FIG. 9, the resistance substrate 100 used in the sensor described in Patent Document 1 has a resistor 120 and a current collector 130 on the top surface of the insulating substrate 110 having an insulating property. The terminals 150 are arranged so as to extend in parallel along the direction, and a terminal portion 150 is provided at one end portion.

  A lead pattern 140 is extended from the other end of the resistor 120, and the lead pattern 140 is printed and arranged in parallel to the resistor 120 and the current collector 130 on the opposite side of the current collector 130 with the resistor 120 interposed therebetween. Yes.

  A terminal portion 150 is disposed at one end of the lead pattern 140.

  The terminal portion 150 disposed at one end of the resistor 120, the current collector 130, and the lead pattern 140 is led out to the lower surface side of the insulating substrate 110.

JP 2010-45242 A

  The resistance substrate 100 described in Patent Document 1 can be used without any problem as a resistance substrate of a position detection sensor as long as the position detection accuracy is conventionally required.

  However, if it is used for a sensor that requires position detection with higher detection accuracy than conventional ones, the resistance substrate 100 cannot achieve satisfactory position detection accuracy.

  This is because the upper surface of the insulating substrate 110 is not smooth, and if the resistor 120 is printed and arranged directly on the surface, the output in the minute signal region of the sensor is disturbed due to the unevenness of the upper surface of the insulating substrate 110 (micrometers). This is because the linearity characteristics deteriorate.

  Therefore, in order to eliminate the influence of the unevenness of the surface of the insulating substrate 110, the present applicant tried to improve the resistance substrate 100. Hereinafter, the improvement plan will be described with reference to FIG. FIG. 10 is a diagram showing an improvement plan for the resistance substrate 100. Although the resistance substrate 100 shown in FIG. 9 and the improvement plan have different structures, the resistance substrate is also referred to as the resistance substrate 100 in FIG. The names and numbers used in 9 are used.

  In the improvement plan, as shown in FIG. 10, an insulating layer 160 is formed on the upper surface of the insulating substrate 110 so as to have a surface smoother than the upper surface of the insulating substrate 110, and a resistor is formed on the upper surface of the insulating layer 160. 120 is formed.

  This makes it possible to obtain a resistance substrate with good microlinearity characteristics.

  However, since the insulating layer 160 is provided on the upper surface of the insulating substrate 110 and the insulating property of the insulating substrate 110 is increased, static electricity is more easily generated than in the past, and foreign substances such as dust are easily attracted.

  When the resistor 120 is formed with foreign matter attached, the resistance substrate 100 having poor microlinearity characteristics is formed due to the attached foreign matter, and the yield of the resistance substrate 100 is deteriorated.

  The present invention solves the above-described problems, and provides a resistance substrate with good yield and excellent microlinearity characteristics, and a method for manufacturing the same.

  According to the first aspect of the present invention, the resistor pattern on which the slider slides and the current collector pattern are provided apart from each other on the insulating substrate, and are electrically connected to both ends of the resistor pattern. In the resistance substrate on which a pair of electrode patterns are formed, an insulating pattern provided on the insulating substrate is provided so as to connect between the pair of electrode patterns, and both ends of the insulating pattern are provided on the pair of electrodes. The resistor pattern is superimposed on the pair of electrode patterns in a state where a part of the pattern is exposed to form an exposed portion, and the resistor pattern is exposed on the insulating pattern and the insulating pattern. It is characterized by being laminated on the exposed portion.

  The resistance substrate according to claim 2, wherein the pair of electrode patterns has an extending portion facing the resistor pattern via the insulating pattern so as to extend along a lower surface of the resistor pattern. It has the feature of being.

  The resistor substrate according to claim 3 is characterized in that a non-sliding region in which the slider does not slide is formed on the resistor pattern located on the extending portion.

  According to a fourth aspect of the present invention, there is provided a feature that the resistance board is included in a sliding area where the slider slides on the resistor pattern located on the extending portion.

  The resistance substrate according to claim 5 is characterized in that the current collector pattern is made of the same material as the pair of electrode patterns.

  The resistance substrate according to claim 6 is characterized in that the insulating substrate is made of a glass epoxy substrate, and the insulating pattern is made of an epoxy resin.

  According to a seventh aspect of the present invention, there is provided a method of manufacturing a resistance substrate, wherein the resistor pattern on which the slider slides and the current collector pattern are provided separately on the insulating substrate, and at both ends of the resistor pattern. In the method of manufacturing a resistance substrate in which a pair of conductive electrode patterns are formed, a first step of printing and forming the pair of electrode patterns on the insulating substrate in a state of being separated from each other, and a part of the pair of electrode patterns A second step of printing and forming an insulating pattern on the insulating substrate so that both end portions overlap each other on the pair of electrode patterns, and the insulating pattern and the insulating pattern And a third step of printing the resistor pattern so that the resistor pattern is stacked on the exposed portions of the exposed pair of electrode patterns. With a butterfly.

  The resistance substrate manufacturing method according to claim 8, wherein in the first step, the extending portion that extends from the pair of electrode patterns and is disposed to face the resistor pattern via the insulating pattern, and the current collector The method includes a step of printing a pattern on the insulating substrate with the same material as the pair of electrode patterns.

  The resistance substrate manufacturing method according to claim 9, wherein the first step, the second step, and the third step are performed on a plurality of locations on a substrate base material on which a plurality of the insulating substrates are provided. The first step includes a step of printing and forming a conductive dummy conductive pattern on a portion of the substrate base material that does not constitute the insulating substrate, using the same material as the pair of electrode patterns. The insulating substrate is separated from the substrate base material after the second step and the third step are performed.

  According to the first aspect of the present invention, since the electrode pattern is disposed below the insulating pattern, the electrode pattern is formed before the insulating pattern is printed. For this reason, the conductivity of the insulating substrate on which the electrode pattern is formed is increased, and the generation of static electricity is suppressed. This makes it difficult for foreign matter to adhere and improves the yield of the resistance substrate. In addition, since the resist pattern has an insulating pattern capable of smoothing the surface as an undercoat layer of the resistor pattern, it is possible to provide a resistance substrate with good microlinearity characteristics.

  According to the invention of claim 2, by providing the extension part in the electrode pattern, the conductivity of the insulating substrate can be further increased, so that it is possible to reduce the generation of static electricity.

  According to the invention of claim 3, it is formed by laminating the insulating pattern on the electrode pattern by forming the non-sliding region where the slider does not slide on the resistor pattern located on the extending portion. There is no effect that the slider slides on a minute step, and a stable sliding contact between the slider and the resistor pattern can be ensured in the sliding region.

  According to the invention of claim 4, since the extended portions of the pair of electrode patterns can be provided long as long as the extended portions do not conduct each other, the conductivity of the insulating substrate can be further increased, and the generation of static electricity can be prevented. Further reduction can be achieved. In addition, since the sliding range of the slider can be increased, the insulating substrate can be reduced in size.

  According to the invention of claim 5, since the current collector pattern can be printed and formed simultaneously with the electrode pattern, the productivity is improved. In addition, since the current collector pattern can be formed before the insulating pattern, the conductivity of the insulating substrate is further improved, static electricity is less likely to be generated, and foreign matter adheres to the insulating substrate when the insulating pattern is printed. There is an effect that it can be made difficult.

  According to invention of Claim 6, since the insulating pattern which consists of an epoxy resin, and the insulating substrate which consists of a glass epoxy board | substrate are the same kind of materials, both adhesiveness is good. Further, the surface of the printed insulating pattern is formed more smoothly than the surface of the insulating substrate. For this reason, by printing the resistor pattern on the insulating pattern, there is an effect that the deterioration of the micro linearity due to the unevenness of the surface on which the resistor pattern is printed is less likely to occur.

  According to the invention of claim 7, by forming the electrode pattern before the insulating pattern, the insulating substrate when printing the insulating pattern is enhanced in conductivity, and the generation of static electricity is suppressed. This makes it difficult for foreign matter to adhere and improves the yield of the resistance substrate. In addition, since it is difficult for foreign matter to adhere and the insulating pattern is provided as an undercoat layer of the resistor pattern, it is possible to produce a resistance substrate with better microlinearity characteristics.

  According to the invention of claim 8, the extension portion is printed and formed in the electrode pattern in the first step, and the current collector pattern is printed and formed, whereby the conductivity of the insulating substrate is further increased and the generation of static electricity is prevented. It can be further reduced. Thereby, in the 2nd process, adhesion of the foreign material by static electricity decreases, and the yield of a resistance board improves. In addition, when the insulating pattern is printed and formed, foreign substances are less likely to adhere to the insulating pattern, thereby providing an effect that it is possible to provide a resistance substrate having better microlinearity characteristics.

  According to the ninth aspect of the present invention, the conductivity of the substrate base material (insulating substrate) is further enhanced by providing the substrate base material with a conductive dummy conductive pattern in the first step. Thereby, generation | occurrence | production of the static electricity in a board | substrate base material (insulating board | substrate) can further be suppressed, and when an insulating pattern is printed at a 2nd process, it becomes difficult to adhere a foreign material, and the further improvement of a yield is attained. Further, when the insulating pattern is printed and formed, foreign substances are less likely to adhere to the insulating pattern, so that it is possible to obtain a resistance substrate with improved microlinearity characteristics.

It is a figure which shows the structure of the resistance board | substrate 1 in embodiment of this invention. It is an enlarged view of the B section shown in Drawing 1 (b). FIG. 3 is a diagram illustrating an arrangement example of a resistance substrate 1 and a dummy conductive pattern 17 on a substrate base material 10. It is a figure which shows the sliding area | region of the slider BR. It is a figure which shows the case where it is set as the structure where the both ends of the insulating pattern 15 do not overlap on a pair of electrode pattern 14 temporarily. It is a figure showing resistance board 1 in the case of a rotation type sensor. It is a graph for demonstrating a micro linearity characteristic. It is a figure which shows the resistance board | substrate in the case of a rotation type sensor. It is a figure which shows the resistance board | substrate 100 in background art. It is a figure which shows the improvement plan of the resistance substrate.

[First Embodiment]
The resistance substrate 1 in the first embodiment will be described below.

  First, the configuration of the resistance substrate 1 in this embodiment will be described with reference to FIGS. FIG. 1 is a diagram showing a configuration of a resistance substrate 1, FIG. 1A is a diagram showing the resistance substrate 1 from the upper surface side, and FIG. 1B is a cross-sectional view taken along a line AA shown in FIG. FIG. FIG. 2 is an enlarged view of a portion B shown in FIG.

  As shown in FIGS. 1A and 1B, the resistance substrate 1 includes a resistor pattern 12 on which an electrically conductive slider BR slides on an insulating substrate 11 having insulation properties. A pair of electrode patterns 14 that are electrically connected to both ends of the resistor pattern 12 are formed while being separated from the current collector pattern 13 and provided in parallel. Further, the current collector pattern 13 and the pair of electrode patterns 14 are respectively formed with connection portions 16 in conduction.

  The insulating substrate 11 is made of an insulating glass epoxy substrate and is formed in a rectangular shape.

  The resistor pattern 12 is made of a material containing carbon particles and a phenol resin as a binder resin.

  The current collector pattern 13 is made of a material containing silver particles and a phenol resin as a binder resin, which is the same material as the pair of electrode patterns 14.

  The electrode pattern 14 is made of a material containing silver particles and a phenol resin as a binder resin.

  The insulating pattern 15 is made of an epoxy resin having an insulating property.

  The connection portion 16 is made of a material containing silver particles and a phenol resin as a binder resin, which are the same material as the current collector pattern 13 and the electrode pattern 14.

  The pair of electrode patterns 14 are respectively provided on the insulating substrate 11 at locations in the longitudinal direction of the insulating substrate 11 from the vicinity of both ends of the insulating substrate 11 in the longitudinal direction, and are formed in a rectangular shape.

  The insulating pattern 15 is formed in a straight line so as to connect the pair of electrode patterns 14 and is provided on the insulating substrate 11. Further, both end portions of the insulating pattern 15 are provided so as to be overlapped on the pair of electrode patterns 14.

  The resistor pattern 12 is laminated on the insulating pattern 15 and on the exposed portions 14a of the pair of electrode patterns 14 exposed from the insulating pattern 15, and is formed in a linear shape.

  The width dimension of the resistor pattern 12 is larger than the width dimension of the electrode pattern 14, and the width dimension of the insulating pattern 15 is larger than the width dimension of the resistor pattern 12.

  Further, as shown in FIG. 2, the pair of electrode patterns 14 has an extended portion 14 b that faces the resistor pattern 12 through the insulating pattern 15 so as to extend along the lower surface of the resistor pattern 12. Yes. In addition, when the width dimension of the electrode pattern 14 and the width dimension of the extension part 14b are the same as shown in FIG. 1 and FIG. 2, there is no clear boundary between the electrode pattern 14 and the extension part 14b. In FIG. 2, for easy explanation, the exposed portion 14 a and the extended portion 14 b of the electrode pattern 14 are separated for convenience. That is, the portion of the electrode pattern 14 covered with the insulating pattern 15 is an extended portion 14b, and the portion exposed from the insulating pattern 15 is an exposed portion 14a.

  As shown in FIG. 1A, the current collector pattern 13 is provided on the insulating substrate 11 in parallel with the resistor pattern 12, the electrode pattern 14, and the insulating pattern 15 along the longitudinal direction of the insulating substrate 11. It has been.

  The current collector pattern 13 is linearly formed on the rear side shown in FIG. 1A with respect to the resistor pattern 12, the electrode pattern 14, and the insulating pattern 15.

  The connection portion 16 includes a first connection portion 16a, a second connection portion 16b, a third connection portion 16c, and a lead pattern 16d.

  The first connection portion 16 a is disposed on the right side of the electrode pattern 14 disposed on the right end side of the insulating substrate 11 and is electrically connected to the electrode pattern 14 disposed on the right end side of the insulating substrate 11.

  The second connection portion 16 b is disposed on the right side of the current collector pattern 13 and is electrically connected to the current collector pattern 13.

  One end of the lead pattern 16d is disposed on the left side of the electrode pattern 14 disposed on the left end side of the insulating substrate 11, is electrically connected to the electrode pattern 14 disposed on the left end side of the insulating substrate 11, and the other end is the third connection portion. It is electrically connected to 16c.

  The first connection portion 16a, the second connection portion 16b, and the third connection portion 16c are arranged in order of the second connection portion 16b, the first connection portion 16a, and the third connection portion 16c from the rear side to the right end side of the insulating substrate 11. The lead pattern 16d is a resistor along the longitudinal direction of the insulating substrate 11 so as to be parallel to the resistor pattern 12, the electrode pattern 14, and the insulating pattern 15 along the longitudinal direction of the insulating substrate 11. It is routed to the front side of the body pattern 12, the electrode pattern 14, and the insulating pattern 15.

  In FIG. 1A, FIG. 1B, and FIG. 2, although not shown for ease of explanation, the silver migration (silver migration) of the silver contained in the current collector pattern 13 is not shown. In order to prevent this, the current collector pattern 13 is covered with an overcoat made of the same material as the resistor pattern 12. The same applies to the electrode pattern 14 and the connection portion 16, which are not shown, but are covered with the same material as the resistor pattern 12.

  Next, a method for manufacturing the resistance substrate 1 will be described with reference to FIG. FIG. 3 is a diagram illustrating an arrangement example of the resistance substrate 1 and the dummy conductive pattern 17 on the substrate base material 10.

  The process of manufacturing the resistance substrate 1 includes a first process P1, a second process P2, and a third process P3. First, the first process P1 is performed, then the second process P2 is performed, and finally the third process P3 is performed. The resistance substrate 1 is formed by performing the process P3.

  As shown in FIG. 3, the resistance substrate 1 is subjected to a first step P1, a second step P2, and a third step P3 at a plurality of locations on a substrate base material 10 on which a plurality of insulating substrates 11 are provided. After the first step P1, the second step P2, and the third step P3 are performed, the insulating substrate 11 is separated from the substrate base material 10.

  Further, for example, as shown in FIG. 3, a dummy conductive pattern 17 having conductivity is formed in a portion of the substrate base material 10 that does not constitute the insulating substrate 11 (resistive substrate 1). The dummy conductive pattern 17 and the resistance substrate 1 are not conductive.

  The first step P1 is a step of printing and forming the pair of electrode patterns 14 on the insulating substrate 11 in a state of being separated from each other. More specifically, a conductive paste in which silver particles are mixed in a binder resin (for example, phenol resin) solution dissolved in a solvent such as carbitol is screen-printed in the shape of the electrode pattern 14. Then, the conductive paste after printing is subjected to a heat treatment to obtain a solidified electrode pattern 14.

  In the first step P1, the extended portion 14b, the connecting portion 16, and the current collector pattern 13 that extend from the pair of electrode patterns 14 and are arranged to face the resistor pattern 12 via the insulating pattern 15 And a print forming step in which the same material (the conductive paste) as the electrode pattern 14 is simultaneously screen-printed on the insulating substrate 11 and heated.

  Further, the first process P1 includes a print forming process in which the dummy conductive pattern 17 is simultaneously screen-printed and heated with the same material (the conductive paste) as the pair of electrode patterns 14.

  The second step P2 is a step of printing and forming the insulating pattern 15 on the insulating substrate 11 so that both end portions overlap each other on the pair of electrode patterns 14. More specifically, for example, a resin paste in which an epoxy resin is dissolved in a solvent such as carbitol is screen-printed in the shape of the insulating pattern 15. Thereafter, the resin paste is heat-treated to obtain a solidified insulating pattern 15.

  The third step P3 is a step of printing and forming the resistor pattern 12 so that the resistor pattern 12 is laminated on the insulating pattern 15 and the exposed portion 14a of the electrode pattern 14. More specifically, a carbon paste mixed with carbon particles in a binder resin solution such as a phenol resin dissolved in a solvent such as carbitol is screen-printed in the shape of the resistor pattern 12. And the heat processing is performed with respect to the carbon paste after printing, and the solidified resistor pattern is obtained. The heat treatment in each step is performed by placing the substrate base material 10 in a firing furnace.

  The third step P3 includes a step of overcoating the current collector pattern 13, the electrode pattern 14, and the connection portion 16 with the same material as the resistor pattern 12. As described above, this is performed to prevent silver migration, and the overcoat is not shown in FIGS. 1 (a), 1 (b), 2 and 3 for ease of explanation. .

  As described above, the resistance substrate 1 is formed by separating the insulating substrate 11 from the substrate base material 10 that has been subjected to the first step P1, the second step P2, and the third step P3 by a punching process or the like using a press.

  Hereinafter, how the resistor substrate 1 is used will be briefly described with reference to FIGS. 1 and 4. FIG. 4 is a diagram showing a sliding area of the slider BR.

  A voltage is applied between the first connection portion 16a and the third connection portion 16c of the resistance substrate 1, and the slider BR is placed on the resistor pattern 12 as shown in FIGS. 1 (a) and 1 (b). And the current collector pattern 13 can be slid, and an output voltage that changes in accordance with the position of the slider BR can be obtained from the second connection portion 16b.

  In the present embodiment, the resistor pattern 12 positioned on the extension portion 14b is set as a non-sliding region where the slider BR does not slide, and the range S1 shown in FIG. The area.

  Hereinafter, the effect by having set it as this embodiment is demonstrated.

  In the resistance substrate 1 of the present embodiment, the resistor pattern 12 and the current collector pattern 13 on which the slider BR slides are provided on the insulating substrate 11 so as to be separated from each other, and at both ends of the resistor pattern 12. The resistance substrate 1 on which the pair of conductive electrode patterns 14 are formed is provided with an insulating pattern 15 provided on the insulating substrate 11 so as to connect the pair of electrode patterns 14, and both end portions of the insulating pattern 15. Are overlaid on the pair of electrode patterns 14, and the resistor pattern 12 is laminated on the insulating pattern 15 and on the exposed portions 14 a of the pair of electrode patterns 14 exposed from the insulating pattern 15. .

  Accordingly, since the electrode pattern 14 is disposed below the insulating pattern 15, the electrode pattern 14 is formed before the insulating pattern 15 is printed. For this reason, the insulating substrate 11 in a state where the electrode pattern 14 is formed has enhanced conductivity, and generation of static electricity is suppressed. Thereby, it becomes difficult for foreign matter to adhere to it, and the yield of the resistance substrate 1 is improved. In addition, since the insulating pattern 15 having a smooth surface can be provided as an undercoat layer of the resistor pattern 12 because foreign matter is less likely to adhere, the resistance substrate 1 having good microlinearity characteristics can be provided. Play.

  Furthermore, the both end portions of the insulating pattern 15 are configured to overlap each other on the pair of electrode patterns 14, so that partial disturbance of output voltage characteristics and micro linearity characteristics can be prevented for the following reasons. As shown in FIG. 5A, in the case where both ends of the insulating pattern 15 are not overlapped with the pair of electrode patterns 14, as shown in FIG. There is a concern that a groove gu may be formed between the pattern 14 and the insulating pattern 15. If the resistor pattern 12 is formed with the groove gu between the electrode pattern 14 and the insulating pattern 15, a recess de is generated in the portion of the resistor pattern 12 corresponding to the groove gu. When the slider BR slides, partial disturbance of output voltage characteristics and micro linearity characteristics occurs. Therefore, the both end portions of the insulating pattern 15 are overlapped on the pair of electrode patterns 14, so that it is difficult to form a groove gu between the electrode pattern 14 and the insulating pattern 15 even if there is variation during manufacturing. Thus, partial disturbance of the output voltage characteristics and micro linearity characteristics can be prevented.

  Further, in the resistance substrate 1 of this embodiment, the pair of electrode patterns 14 has an extending portion 14 b that faces the resistor pattern 12 with the insulating pattern 15 interposed therebetween so as to extend along the lower surface of the resistor pattern 12. It has been configured.

  Thereby, by providing the extension part 14b in the electrode pattern 14, a part with high electroconductivity increases. Since the conductivity of the insulating substrate 11 is further improved, the effect of reducing the generation of static electricity is achieved.

  Further, in the resistance substrate 1 of the present embodiment, the non-sliding region where the slider BR does not slide is formed on the resistor pattern 12 located on the extending portion 14b.

  Thereby, the non-sliding region where the slider BR does not slide is formed on the resistor pattern 12 located on the extending portion 14b, so that the minute pattern formed by laminating the insulating pattern 15 on the electrode pattern 14 is formed. Thus, the slider BR is not slid on such a level difference, and there is an effect that a stable sliding contact between the slider BR and the resistor pattern 12 can be ensured in the sliding region.

  In the resistance substrate 1 of the present embodiment, the current collector pattern 13 is made of the same material as the pair of electrode patterns 14.

  As a result, the current collector pattern 13 can be printed and formed simultaneously with the electrode pattern 14, thereby improving productivity. Further, since the current collector pattern 13 can also be formed before the insulating pattern 15, the conductivity of the insulating substrate 11 is further improved, and static electricity is less likely to be generated. Therefore, when the insulating pattern 15 is printed and formed, there is an effect that it is difficult for foreign matter to adhere to the insulating substrate 11.

  In the resistance substrate 1 of the present embodiment, the insulating substrate 11 is made of a glass epoxy substrate, and the insulating pattern 15 is made of an epoxy resin.

  Thereby, since the insulating pattern 15 made of an epoxy resin and the insulating substrate 11 made of a glass epoxy substrate are the same type of material, both have good adhesion. Further, the surface of the printed insulating pattern 15 is smoother than the surface of the insulating substrate 11. For this reason, by printing the resistor pattern 12 on the insulating pattern 15, there is an effect that the deterioration of the micro linearity due to the unevenness of the surface on which the resistor pattern 12 is printed is less likely to occur.

  In the method for manufacturing the resistance substrate 1 of the present embodiment, the resistor pattern 12 and the current collector pattern 13 on which the slider BR slides are provided on the insulating substrate 11 so as to be separated from each other. In the manufacturing method of the resistance substrate 1 in which the pair of electrode patterns 14 respectively formed on both ends of the resistor 12 are formed, a first step P1 is formed by printing the pair of electrode patterns 14 on the insulating substrate 11 in a separated state; A second step P2 for printing and forming the insulating pattern 15 on the insulating substrate 11 so that both ends overlap each other on the pair of electrode patterns 14, and the exposure of the pair of electrode patterns 14 exposed on and from the insulating pattern 15 And a third process P3 for printing and forming the resistor pattern 12 so that the resistor pattern 12 is laminated on the portion 14a.

  Thereby, since the electrode pattern 14 is formed before the insulating pattern 15, the insulating substrate 11 when the insulating pattern 15 is printed has increased conductivity, and the generation of static electricity is suppressed. Therefore, foreign substances are less likely to adhere to the insulating substrate 11, and the yield of the resistance substrate 1 is improved. In addition, since the foreign matter is less likely to adhere to the insulating substrate 11 and the insulating pattern 15 is provided as the undercoat layer of the resistor pattern 12, the unevenness on the surface on which the resistor pattern 12 is printed is smaller than that of the prior art, and more microscopic. There is an effect that the resistance substrate 1 having good linearity characteristics can be manufactured.

  Further, in the method for manufacturing the resistance substrate 1 of the present embodiment, the first step P1 extends from the pair of electrode patterns 14 and extends through the insulating pattern 15 so as to face the resistor pattern 12 and the current collector. The body pattern 13 includes a step of printing and forming on the insulating substrate 11 with the same material as the pair of electrode patterns 14.

  Thus, in the first step P1, the extension portion 14b is printed and formed on the electrode pattern 14 and the current collector pattern 13 is printed and formed, whereby the conductivity of the insulating substrate 11 is further increased and the generation of static electricity is prevented. It can be further reduced. Thereby, in the 2nd process P2, adhesion of the foreign material by static electricity decreases, and the yield of resistance board 1 improves. In addition, when the insulating pattern 15 is printed and formed, it is difficult for foreign matter to adhere to the insulating pattern 15, thereby providing an effect that the resistance substrate 1 having better microlinearity characteristics can be provided.

  In the resistance substrate 1 of the present embodiment, the first step P1, the second step P2, and the third step P3 are performed on a plurality of locations on the substrate base material 10 on which a plurality of insulating substrates 11 are provided. P1 includes a step of printing a conductive dummy conductive pattern 17 on the substrate base material 10 where the insulating substrate 11 is not formed with the same material as the electrode pattern 14. After the two steps P2 and the third step P3 were performed, the insulating substrate 11 was separated from the substrate base material 10.

  Thus, the conductivity of the substrate base material 10 (insulating substrate 11) is further enhanced by providing the conductive dummy pattern 17 on the substrate base material 10 in the first step P1. Thereby, generation | occurrence | production of the static electricity in the board | substrate base material 10 (insulating board | substrate 11) can further be suppressed, a foreign material becomes difficult to adhere when printing the insulating pattern 15 by 2nd process P2, and the further improvement of a yield is carried out. It becomes possible. In addition, when the insulating pattern 15 is printed and formed, foreign substances are less likely to adhere to the insulating pattern 15, so that the resistance substrate 1 with further improved microlinearity characteristics can be obtained.

[Second Embodiment]
The resistance substrate 2 in the second embodiment will be described below with reference to FIG.

  The resistance board 2 is the same resistance board as the resistance board 1 of the first embodiment including the manufacturing process, but the sliding area of the slider BR is different.

  In the first embodiment, the resistor pattern 12 positioned on the extending portion 14b is set as a non-sliding region where the slider BR does not slide, and the range S1 shown in FIG. In the second embodiment, it is assumed that the resistor pattern 12 located on the extended portion 14b is included in the sliding region where the slider BR slides, and the range shown in FIG. S2 is defined as a sliding area of the slider BR.

  Hereinafter, the effect by having set it as this embodiment is demonstrated.

  In the resistance substrate 2 of the present embodiment, the resistor pattern 12 positioned on the extending portion 14b is included in the sliding area where the slider BR slides.

  Thereby, since the extension part 14b of a pair of electrode pattern 14 can be provided long in the range in which both extension parts 14b do not conduct | electrically_connect, the electroconductivity of the insulated substrate 11 can be improved more and generation | occurrence | production of static electricity is further reduced. Can be made. In addition, since the sliding range of the slider BR can be made wider, there is an effect that the size of the insulating substrate can be reduced.

  As described above, the resistance substrate according to the embodiment of the present invention has been specifically described. However, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention. Is possible. For example, the present invention can be modified as follows, and these embodiments also belong to the technical scope of the present invention.

  (1) In the first embodiment, the length of the extending portion 14b extending from the electrode pattern 14 is an arbitrary length within a range in which a sliding region can be secured and the extending portions 14b are not electrically connected to each other. May be set.

  (2) In 2nd Embodiment, you may set the length which the extension part 14b extends from the electrode pattern 14 to arbitrary lengths in the range in which the extension parts 14b are not electrically connected.

  (3) In the first embodiment and the second embodiment, the width dimension of the extended portion 14b is the same as the width dimension of the electrode pattern 14, but the width dimension may not be the same.

  (4) In the first embodiment and the second embodiment, as shown in FIG. 1A, the first connection portion 16a, the second connection portion 16b, and the third connection portion 16c are arranged on the right side of the resistance substrate 1. It is arranged. However, for example, the third connection portion 16c is disposed on the left side of the resistance substrate 1, the lead pattern 16d is deleted, and the connection portion is directly connected to the electrode pattern 14 disposed on the left side of the resistance substrate 1. The arrangement of 16 may be changed.

  (5) In the first embodiment and the second embodiment, the resistor substrate 1 has the resistor pattern 12, the current collector pattern 13, and the insulating pattern 15 formed in a straight line. As shown, the same effect can be obtained even when the resistor pattern 12, the current collector pattern 13, and the insulating pattern 15 are formed in an arc shape.

DESCRIPTION OF SYMBOLS 1 Resistance board 2 Resistance board 10 Board | substrate base material 11 Insulation board 12 Resistor pattern 13 Current collector pattern 14 Electrode pattern 14a Exposed part 14b Extension part 15 Insulation pattern 16 Connection part 16a 1st connection part 16b 2nd connection part 16c 2nd 3 connection part 16d lead pattern 17 dummy conductive pattern P1 1st process P2 2nd process P3 3rd process BR Slider

Claims (9)

A resistor substrate on which a resistor pattern on which a slider slides and a current collector pattern are provided apart from each other on an insulating substrate, and a pair of electrode patterns respectively conducting to both ends of the resistor pattern are formed In
An insulating pattern provided on the insulating substrate is provided so as to connect between the pair of electrode patterns, and both end portions of the insulating pattern form exposed portions by exposing a part of the pair of electrode patterns. In a state where it is overlaid on the pair of electrode patterns,
The resistor substrate, wherein the resistor pattern is laminated on the insulating pattern and on the exposed portion of the pair of electrode patterns exposed from the insulating pattern.   2. The pair of electrode patterns, wherein an extending portion facing the resistor pattern via the insulating pattern extends so as to extend along a lower surface of the resistor pattern. The resistance substrate described.   The resistance substrate according to claim 2, wherein a non-sliding region in which the slider does not slide is formed on the resistor pattern located on the extending portion.   The resistance substrate according to claim 2, wherein the resistor pattern located on the extending portion is included in a sliding area where the slider slides.   5. The resistance substrate according to claim 1, wherein the current collector pattern is made of the same material as the pair of electrode patterns. The insulating substrate is made of a glass epoxy substrate,
6. The resistance substrate according to claim 1, wherein the insulating pattern is made of an epoxy resin. A resistor substrate on which a resistor pattern on which a slider slides and a current collector pattern are provided apart from each other on an insulating substrate, and a pair of electrode patterns respectively conducting to both ends of the resistor pattern are formed In the manufacturing method of
A first step of printing and forming the pair of electrode patterns apart on the insulating substrate;
A second step of exposing a part of the pair of electrode patterns to form an exposed portion and printing and forming an insulating pattern on the insulating substrate so that both end portions overlap the pair of electrode patterns;
A third step of printing the resistor pattern so that the resistor pattern is laminated on the insulating pattern and on the exposed portion of the pair of electrode patterns exposed from the insulating pattern;
A method for manufacturing a resistance substrate, comprising:     In the first step, an extension portion extending from the pair of electrode patterns and opposed to the resistor pattern via the insulating pattern and the current collector pattern are made of the same material as the pair of electrode patterns. The method of manufacturing a resistance substrate according to claim 7, further comprising a step of printing on the insulating substrate. The first step, the second step and the third step are performed on a plurality of locations on a substrate base material on which a plurality of the insulating substrates are provided,
The first step includes a step of printing and forming a dummy conductive pattern having conductivity with the same material as the pair of electrode patterns in a portion of the substrate base material that does not constitute the insulating substrate,
9. The resistance substrate according to claim 7, wherein the insulating substrate is separated from the substrate base material after the first step, the second step, and the third step are performed. Production method.