JP2013161798A - Circuit board, print material housing body, and printer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit board which prevents occurrence of malfunction of components of the circuit board due to breakage, a print material housing body, a printer, and the like.SOLUTION: A circuit board 200 includes: a memory device 203; a circuit element 210; terminal blocks (TA1, TA2) having a memory device terminal, a first terminal CO1, and a second terminal CO2; and a connection line LC connecting the first terminal CO1 and the second terminal CO2. The terminal blocks include a plurality of terminals aligned on a second direction DR2 side of a first side SD1 of the circuit board in a first direction DR1. Between the terminal block and a second side SD2 of the circuit board 200, a fixing hole HL for fixing the circuit board 200 to a print material housing body is provided. The connection line LS has a bypass connection line which is arranged on the opposite side thereof across the fixing hole HL.

Description

  The present invention relates to a circuit board, a printing material container, a printing apparatus, and the like.

  A circuit board is attached to a printing material container (such as an ink cartridge) of a printing apparatus such as an ink jet printer, and a storage device that stores printing material container information such as ink information is mounted on the circuit board. The The circuit board is provided with a terminal group for connection to a connector terminal on the printing apparatus main body side. As a conventional technique of such a circuit board, for example, there are techniques disclosed in Patent Documents 1 and 2.

  However, these Patent Documents 1 and 2 do not disclose any problems regarding an efficient wiring layout method of circuit board connection lines and breakage of components such as circuit board wiring.

JP 2002-198627 A JP 2007-196664 A

  In addition, according to some aspects of the present invention, it is possible to provide a circuit board, a printing material container, a printing apparatus, and the like that can suppress the occurrence of problems due to breakage of components of the circuit board.

  One embodiment of the present invention is a circuit board attached to a printing material container, a storage device that stores printing material information, a plurality of storage device terminals connected to the storage device, a first terminal, A terminal group that has a second terminal and is connected to a connector terminal on the printing apparatus main body when the printing material container is mounted on the printing apparatus main body; the first terminal; and the second terminal The terminal group when the direction orthogonal to the first direction is the second direction and the side opposite to the first side of the circuit board is the second side. Has a plurality of terminals arranged along the first direction on the second direction side of the first side of the circuit board, the terminal group, and the second side of the circuit board, Between, a hole for fixing the circuit board to the printing material container is provided, the connection line is Across the serial fixing holes related to the circuit board to be bypassed wiring.

  In one embodiment of the present invention, a storage device that stores printing material information and a terminal group including storage device terminals are provided on a circuit board. The terminal group includes a plurality of terminals arranged along the first direction on the second direction side of the first side of the circuit board, and between the terminal group and the second side of the circuit board. A hole for fixing the circuit board to the printing material container is provided. In this case, according to one embodiment of the present invention, the connection line between the first terminal and the second terminal included in the terminal group is bypass-wired with the fixing hole interposed therebetween. In this way, even when a part of the connection line connecting the first and second terminals is disconnected or the line width is narrowed at the time of manufacturing the circuit board, the first and second by the bypass wiring. The electrical continuity between the two terminals can be maintained. Accordingly, it is possible to suppress the occurrence of problems due to damage to the components (terminals, wirings, circuit elements, etc.) of the circuit board.

  In one embodiment of the present invention, the connection line is wired from the first terminal to the second terminal through the second side of the circuit board and the fixing hole. You may have a main connection line and a bypass connection line by which one end and the other end are connected to the main connection line, and are wired between the terminal group and the fixing hole.

  In this way, even when the main connection line is disconnected or the line width is reduced at the time of manufacturing a circuit board, the first and second ends are connected by the bypass connection line having one end and the other end connected to the main connection line. The electrical continuity between the two terminals can be maintained.

  In the aspect of the invention, the terminal group may be a first terminal group in which M terminals are arranged along the first direction on the second direction side of the first side of the circuit board. And, on the second direction side of the first terminal group, a second terminal in which N terminals (M and N are integers of 2 or more satisfying M <N) are arranged along the first direction. Group, and when the side facing the third side of the circuit board is the fourth side, the first terminal is the M terminals of the first terminal group, It is a terminal provided on the third side, and the second terminal may be a terminal provided on the fourth side among the M terminals of the first terminal group. .

  Thus, if the first and second terminals are provided at both ends of the first terminal group, the first and second terminals can be connected by an efficient layout wiring by the connection line.

  In the aspect of the invention, the circuit further includes a circuit element, and the second terminal group includes a first detection terminal and a second detection terminal connected to the circuit element, and the first detection The terminal is a terminal provided on the third side of the N terminals of the second terminal group, and the second detection terminal is the N terminals of the second terminal group. Among the terminals, the terminal is provided on the fourth side, and the connection line extends from the first terminal to the first detection terminal and a terminal adjacent to the first detection terminal. Wired through, fixedly bypassed in the fixing hole, routed between the second detection terminal and a terminal adjacent to the second detection terminal, and connected to the second terminal. May be.

  In this case, even when the first and second detection terminals are provided as the terminals of the second terminal group and the first and second terminals are provided as the terminals of the first terminal group, the first, An efficient layout wiring that connects the second detection terminal to the circuit element and connects the first and second terminals via the connection line can be realized.

  In one aspect of the present invention, the terminal group is disposed on a first surface that is a connection side surface of the connector terminal of the circuit board, and a second surface that is the back surface of the first surface of the circuit board. The memory device and the circuit element are arranged on a surface, and a first connection line having one end connected to one end of the circuit element and one end of the circuit board are connected to the second surface of the circuit board. A second connection line connected to the other end of the element is wired, and the other end of the first connection line is connected to the first surface of the first surface through the first through hole of the circuit board. The other end of the second connection line may be connected to the detection terminal, and the other end of the second connection line may be connected to the second detection terminal on the first surface through a second through hole of the circuit board.

  According to this configuration, when the first and second detection terminals are arranged on both sides of the second terminal group on the first surface of the circuit board, the first and second detection terminals are Through the first and second through holes and the first and second connection lines, the circuit elements provided on the second surface of the circuit board can be connected with efficient layout wiring.

  In the aspect of the invention, the second connection line may be bypass-wired across the fixing hole on the second surface of the circuit board.

  According to this configuration, even when a part of the second connection line is disconnected or the line width is narrowed at the time of manufacturing the circuit board or the like, the circuit element and the first and second detections are detected by the bypass wiring. The electrical continuity between the terminals can be maintained.

  In one embodiment of the present invention, the circuit element is disposed on the second surface between a position corresponding to an arrangement position of the second terminal group and the second side of the circuit board. May be.

  In this way, a suitable layout arrangement of circuit elements on the circuit board can be realized. In addition, for example, when a cut surface for separating a single circuit board is provided on the first terminal group side, the distance between the cut surface and the circuit element can be increased. It is also possible to suppress the occurrence of problems due to damages (terminals, wiring, circuit elements, etc.).

  In the aspect of the invention, the circuit element may be a resistance element, and the first detection terminal and the second detection terminal may be mounting detection terminals used for mounting detection of the printing material container. Good.

  This makes it possible to detect the mounting of the printing material container using the first and second detection terminals and the circuit elements that are the resistance elements.

  In the aspect of the invention, the first terminal and the second terminal may be short-circuit detection terminals used for short-circuit detection with other terminals.

  In this way, when short-circuit detection with other terminals is realized using the first and second terminals, the short-circuit detection is made more reliable by bypassing the connection line. Is possible.

  In the aspect of the invention, the first terminal and the second terminal may be a short-circuit detection terminal and a mounting detection terminal used for detecting the mounting of the printing material container.

  In this way, when short-circuit detection and mounting detection with other terminals are realized using the first and second terminals, the short-circuit detection and mounting detection can be further performed by bypassing the connection line. It becomes possible to make sure.

  In one embodiment of the present invention, an identification pattern of the circuit board may be formed by the connection line.

  In this way, the circuit board can be identified by the connection line identification pattern while maintaining efficient layout wiring.

  In the aspect of the invention, the identification pattern may be at least one pattern of letters, numbers, and patterns.

  However, the identification pattern is not limited to such letters, numbers, and patterns.

  In one embodiment of the present invention, the circuit board may have a cut surface cut in a cutting step in single-piece separation of the circuit board on a side other than the second side.

  In this way, the cut surface cut by the cutting process for separating the circuit board separately exists at a location away from the second side where the circuit element is arranged. Accordingly, it is possible to suppress the occurrence of problems due to damage to circuit elements, terminals, or the like or the application of cutting stress during the cutting process.

  Moreover, the other aspect of this invention is related with the printing material container containing the said circuit board in any one of said.

  Moreover, the other aspect of this invention is related with the printing apparatus containing the printing material container as described above, and the said printing apparatus main body.

  In another aspect of the present invention, the printing apparatus main body may include a short circuit detection unit that detects a short circuit between at least one of the first terminal and the second terminal and another terminal.

  If it does in this way, it will become possible to implement | achieve simply the short circuit detection between terminals using the 1st, 2nd terminal connected via a connection line.

  In another aspect of the present invention, the circuit board further includes a circuit element, and the terminal group includes a first detection terminal and a second detection terminal connected to the circuit element, and the circuit element Is a resistance element, and the printing apparatus body detects a current flowing through the resistance element by applying a voltage application unit for applying a mounting detection voltage to the first detection terminal and applying the mounting detection voltage. And a mounting detector that detects the mounting of the printing material container.

  If it does in this way, it becomes possible to implement | achieve suitable mounting | wearing detection of a printing material container using the circuit element which is a 1st, 2nd detection terminal and resistance element provided in a circuit board.

FIG. 3 is a perspective view illustrating a configuration example of a printing apparatus. FIG. 2A and FIG. 2B are perspective views showing the appearance of the printing material container. The structural example of a circuit board. The structural example of a circuit board. The structural example of a circuit board. An example of a circuit board sheet. Explanatory drawing about isolation | separation of the single circuit board of a circuit board from a circuit board sheet | seat. The example of a manufacturing process of a circuit board sheet and a circuit board. FIGS. 9A and 9B are explanatory diagrams for setting the width from the side of the circuit board to the short side of the detection terminal. The connection structural example of the circuit board of an apparatus side circuit board and a printing material container. 1 is a configuration example of a printing apparatus. The structural example of the circuit related to a short circuit detection and mounting | wearing detection. The flowchart of mounting | wearing detection and memory access. FIG. 14A and FIG. 14B are diagrams for explaining a method for detecting mounting of a printing material container.

  Hereinafter, preferred embodiments of the present invention will be described in detail. The present embodiment described below does not unduly limit the contents of the present invention described in the claims, and all the configurations described in the present embodiment are indispensable as means for solving the present invention. Not necessarily.

1. Configuration of Printing Apparatus and Printing Material Container FIG. 1 is a perspective view illustrating a configuration example of a printing apparatus according to the present embodiment. The printing apparatus 1000 includes a container mounting unit 1100 (cartridge mounting unit) on which a printing material container 100 (an ink cartridge in a narrow sense) is mounted, a rotatable cover 1200, and an operation unit 1300. The container mounting portion 1100 is called, for example, a “cartridge holder” or simply “holder” of an ink cartridge. In the example shown in FIG. 1, four printing material containers can be independently mounted on the container mounting portion 1100. For example, four types of printing material containers 100 (ink cartridges) of black, yellow, magenta, and cyan are used. ) Is installed. The cover 1200 can be omitted. The operation unit 1300 is an input device for the user to make various instructions and settings, and includes a display unit for making various notifications to the user.

  2A and 2B are perspective views showing the appearance of the printing material container 100. FIG. The XYZ axes in FIGS. 2A and 2B correspond to the XYZ axes in FIG. The printing material container 100 has a flat, substantially rectangular parallelepiped outer shape, and has the largest length L1 (size in the insertion direction) and the largest width L2 among the three dimensions L1, L2, and L3. Small, height L3 is intermediate between length L1 and width L2.

  The printing material container 100 includes a front end surface (first surface) Sf, a rear end surface (second surface) Sr, a ceiling surface (third surface) St, a bottom surface (fourth surface) Sb, Two side surfaces (fifth and sixth surfaces) Sc and Sd are provided. Inside the printing material container 100, a printing material storage chamber 120 (ink storage chamber, ink storage bag) is provided. The front end surface Sf has two positioning holes 131 and 132 and a printing material supply port 110 (ink supply port).

  A circuit board 200 is provided on the ceiling surface st. The circuit board 200 is equipped with a storage device (nonvolatile memory) for storing information on the printing material and the printing material container (information on ink and cartridge). The concave / convex fitting portion 134 is disposed at a position where the second side surface Sd and the front end surface Sf intersect.

2. Configuration of Circuit Board FIGS. 3, 4 and 5 show configuration examples of the circuit board 200 of the present embodiment. 3 is a view of the circuit board 200 as viewed from the first surface SF1 side (front surface side), and FIGS. 4 and 5 are views of the circuit board 200 as viewed from the second surface SF2 side (back surface side). . 4 is a diagram illustrating a state after the storage device 203 and the circuit element 210 are mounted, and FIG. 5 is a diagram illustrating a state before the storage device 203 and the circuit element 210 are mounted.

  6 and 7 show an example of a circuit board sheet 190 having a structure in which a plurality of circuit boards 200 are connected in an array. Each circuit board 200 is separated from the circuit board sheet 190 by itself.

  The first surface SF1 of the circuit board 200 is a surface exposed to the outside in a state where the circuit board 200 is attached to the printing material container 100 (FIGS. 2A and 2B). . The second surface SF2 is the back surface of the first surface SF1. Further, a direction DIS in FIG. 3 indicates a mounting direction of the printing material container 100 to the container mounting portion 1100. This mounting direction DIS coincides with the X direction, which is the mounting direction of the printing material container 100 shown in FIGS. 2 (A) and 2 (B).

  The circuit board 200 is provided with fixing holes HL (boss holes) for attaching the circuit board 200 to the printing material container 100. Further, the circuit board 200 is provided with fixing grooves NT1, NT2, and NT3 (boss grooves).

  3 to 5, a direction orthogonal to the first direction DR1 is a second direction DR2. The direction opposite to the first direction DR1 is defined as a third direction DR3, and the direction opposite to the second direction DR2 is defined as a fourth direction DR4. Here, the second direction DR2 coincides with the mounting direction DIS.

  The substantially rectangular circuit board 200 has first to fourth sides SD1 to SD4. The side facing the first side SD1 is the second side SD2, and the side facing the third side SD3 is the fourth side SD4. The first and second sides SD1 and SD2 and the third and fourth sides SD3 and SD4 intersect (orthogonal) at least at their extension lines. In addition, a notch part is provided in the corner part corresponding to the crossing position of 1st-4th edge | side SD1-SD4, or it is curvilinear.

  The circuit board 200 of this embodiment attached to the printing material container 100 includes a storage device 203 and a terminal group (TA1, TA2).

  The storage device 203 illustrated in FIG. 4 stores printing material information. This printing material information is information relating to the printing material stored in the printing material container 100, and is, for example, ink amount information (ink consumption information or remaining ink information), ink color information, and the like. Further, the storage device 203 can further store printing material container information that is information about the printing material container 100. The printing material container information is, for example, ID information or manufacturing information of the printing material container 100. The storage device 203 is realized by, for example, a nonvolatile memory (EEPROM or the like).

  The terminal group (TA1, TA2) includes a plurality of terminals provided on the circuit board 200. Specifically, the terminal group includes a plurality of storage device terminals (RST, SCK, VDD, VSS, SDA) connected to the storage device 203. This terminal group is connected to a connector terminal (connector terminal provided on the container mounting portion) on the printing apparatus main body side when the printing material container 100 is mounted on the printing apparatus main body (container mounting portion). is there.

  The terminal group (TA1, TA2) includes a plurality of terminals (CO1, RST, SCK, CO2, and the like arranged along the first direction DR1 on the second direction DR2 side of the first side SD1 of the circuit board 200. DT1, VDD, VSS, SDA, DT2).

  For example, the terminal group provided on the circuit board 200 includes a first terminal group TA1 and a second terminal group TA2.

  The first terminal group TA1 is a terminal group in which M terminals are arranged along the first direction DR1 on the second direction DR2 side of the first side SD1 of the circuit board 200. On the other hand, the second terminal group TA2 is a terminal group in which N terminals are arranged along the first direction DR1 on the second direction DR2 side of the first terminal group TA1. Here, M and N are integers of 2 or more that satisfy M <N, and the number M of terminals in the first terminal group TA1 is smaller than the number N of terminals in the second terminal group TA2.

  Specifically, each terminal of the first and second terminal groups TA1 and TA2 is formed in a substantially rectangular shape, and is arranged so as to form two rows perpendicular (substantially perpendicular) to the mounting direction DIS. . For example, among these two columns, a column along the first line A1 on the near side in the mounting direction DIS (a column positioned on the upper side in FIG. 3) is an upper column (first column), and the column in the mounting direction DIS A row (row located in the lower side in FIG. 3) along the second line A2 on the back side (tip side in the mounting direction) is defined as a lower row (second row). In this case, the first terminal group TA1 is a terminal group in the upper row along the line A1, and the second terminal group TA2 is a terminal group in the lower row along the line A2. These lines A1 and A2 can also be considered as lines formed by contact portions CP of a plurality of terminals. The contact portion CP is a portion where a connector terminal provided in the holder for connecting the apparatus-side circuit board and the circuit board 200 comes into contact with each terminal when the printing material container 100 is mounted on the printing apparatus main body. It is.

  That is, each terminal includes a contact portion CP in contact with a corresponding connector terminal among the plurality of connector terminals on the printing apparatus main body side at the center thereof. The contact portions CP of the terminals of the first terminal group TA1 along the line A1 and the contact portions CP of the terminals of the second terminal group TA2 along the line A2 are alternately arranged, so-called staggered. Make up the arrangement. That is, the terminals of the first terminal group TA1 and the terminals of the second terminal group TA2 are arranged in a staggered manner so that the terminal centers are not aligned in the mounting direction DIS. ing.

  In the present embodiment, a hole HL for fixing the circuit board 200 to the printing material container 100 is provided between the terminal group (TA1, TA2) and the second side SD2 of the circuit board 200. That is, in FIG. 2 (A) and FIG. 2 (B), the circuit board 200 is attached and fixed to the printing material container 100 using the fixing holes HL. Specifically, the circuit board 200 is attached and fixed using the fixing holes HL and the fixing grooves NT1, NT2, and NT3.

  The terminal group includes a first terminal CO1 and a second terminal CO2. These first and second terminals CO1 and CO2 are connected via a connection line LC. That is, on the first surface SF1 of the circuit board 200, the first and second terminals CO1 and CO2 are short-circuited by the connection line LC.

  By providing such first and second terminals CO1 and CO2, it is possible to realize short circuit detection, mounting detection (cartridge out detection), and the like, as will be described later.

  In the present embodiment, as indicated by F1 in FIG. 3, the connection line LC of the first and second terminals CO1 and CO2 is bypassed with the fixing hole HL interposed therebetween. That is, the connection line LC is branched and wired to, for example, two connection lines at the position of the fixing hole HL.

  Specifically, the connection line LC includes a main connection line LM1 and a bypass connection line LB1. The main connection line LM1 is wired from the first terminal CO1 to the second terminal CO2 between the side SD2 of the circuit board 200 and the fixing hole HL. On the other hand, the bypass connection line LB1 has one end and the other end connected to the main connection line LM1, and is wired between the terminal group (TA2) and the fixing hole HL. Specifically, the bypass connection line LB1 is wired so as to surround the fixing hole HL.

  The connection line LC is wired in a region between the terminal group (TA1, TA2) and the second side SD2 of the circuit board 200, as shown in FIG. For this reason, as will be described in detail later, the connection line LC is disconnected in the manufacturing process of the circuit board 200 and the first and second terminals CO1 and CO2 are not electrically connected, and the line width is narrow. There is a risk that problems such as reduced reliability may occur.

  In this respect, in this embodiment, as shown by F1 in FIG. 3, since the connection line LC is bypass-wired with the fixing hole HL interposed therebetween, the occurrence of the above-described problems can be effectively suppressed. For example, the main connection line LM1 wired between the side SD2 of the circuit board 200 and the fixing hole HL may be disconnected in a cutting process or a board sheet cutting process in the manufacturing process of the circuit board 200, or the line width may be increased. Even if it becomes thinner, the electrical continuity between the first and second terminals CO1 and CO2 is maintained by the bypass connection line LB1 routed between the terminal group and the fixing hole HL. become. Therefore, it is possible to suppress the occurrence of problems due to damage of the components of the circuit board 200 or the like.

  Next, the reason why such a problem occurs will be described in more detail. For example, in the present embodiment, the side other than the second side SD <b> 2 of the circuit board 200 has a cut surface cut by a cutting process in single-piece separation of the circuit board 200. Taking FIG. 3 as an example, the third side SD3 has the first cut surface CSFA cut in the cutting step, and the fourth side SD4 has the second cut surface CSFB cut in the cutting step. Have Specifically, the third side SD3 of the circuit board 200 has the first cut surface CSFA at a position closer to the first side SD1 than to the second side SD2. Further, the fourth side SD4 of the circuit board 200 has the second cut surface CSFB at a position closer to the first side SD1 than to the second side SD2. A cut surface may be formed on the first side SD1.

  For example, as shown in H1 of FIG. 6 and H2 of FIG. 7, the circuit board 200 is separated from the circuit board sheet 190 by cutting through a cutting process. That is, the circuit board 200 is separated by cutting the portions indicated by H3 and H4 in FIG. 7 in the cutting process. In this case, the cut portions indicated by H3 and H4 correspond to the first and second cut surfaces CSFA and CSFB in FIG.

  FIG. 8 shows an example of the manufacturing process of the circuit board sheet and the circuit board. In this manufacturing process, first, a step of forming holes such as the through holes TH1 and TH2 and the fixing holes HL in FIG. 3 in the substrate sheet is performed (SP11).

  Next, a step of forming metal patterns of terminals and wirings of the terminal groups TA1 and TA2 on the substrate sheet by, for example, electroplating (electrolytic plating) is performed (SP12).

  Next, the step of forming the outer shape of the circuit board 200 is performed by cutting out the gaps indicated by H5, H6, etc. in FIG. 6 from the board sheet (SP13).

  Next, a step of mounting the storage device 203 and the circuit element 210 of FIG. 4 on each circuit board 200 is performed (SP14).

  Finally, a single product separation step of cutting the circuit board 200 by cutting the cutting portions indicated by H3 and H4 in FIG. 7 is performed (SP15).

  The reason for forming a hole such as a through-hole in step SP11 before the metal pattern forming process in step SP12 is that a metal is formed in the through-hole to electrically connect the surfaces SF1 and SF2 of the circuit board 200. This is for realizing conduction.

  In addition, before the single item separation step of step SP15, the storage device 203 and the circuit element 210 are mounted in step SP14 in the state of the circuit board sheet 190, and a large number of storage devices 203 and circuit elements 210 are mounted together. This is because it is more efficient. That is, if the storage device 203 or the circuit element 210 is to be mounted on the circuit board 200 after being separated separately, the mounting efficiency is low and the mounting accuracy is also low. On the other hand, if mounting is performed in the state of the circuit board sheet 190, a large number of storage devices 203 and circuit elements 210 can be mounted on the circuit board 200 on the circuit board sheet 190 with high mounting efficiency and high accuracy. It becomes possible to implement.

  In the present embodiment, as shown in step SP15 in FIG. 8, the circuit board is separated in the last step. For example, a manufacturer of a printing material container delivers a circuit board sheet from a board sheet manufacturer. Then, by cutting the parts indicated by H3 and H4 in FIG. 7, the circuit board is separated separately and attached to the printing material container, thereby completing the production of the printing material container. In this case, in this embodiment, the circuit board can be separated only by the cutting process of H3 and H4 in FIG. 7, so that the process work at the manufacturer of the printing material container can be simplified and the cost of the product can be reduced. Etc.

  The reason why the metal pattern is formed in step SP12 before the outer shape forming step in step SP13 is to realize the metal pattern formation in step SP12 by electroplating.

  That is, in order to form a metal pattern by electroplating, it is necessary to connect wires between the plurality of circuit boards 200 of the circuit board sheet 190 of FIG. 6 and set them to the same potential during electroplating. For this reason, it is necessary to form the metal pattern of the lead wire for electroplating in the gap part of H5 and H6 of FIG. 6 in step SP12 of FIG. The lead wires for electroplating are connected to the electroplating connection lines indicated by E1, E2, etc. of the circuit board 200 in FIG. 3, thereby forming metal patterns of terminals and wirings on the circuit board 200 by electroplating. become able to. This lead wire for electroplating is removed together with the gap when the gap is cut out in the outer shape forming process in step SP13 in FIG. And in order to form such a lead wire for electroplating, a metal pattern forming process is performed before the outer shape forming process of step SP13, and when forming terminals and wirings on the circuit board 200, It is necessary to form a lead wire for electroplating in the gap or the like.

  As described above, in the manufacturing process of FIG. 8, before the outer shape forming process of the circuit board 200 in step SP <b> 13, the process of forming the terminal and wiring metal patterns in step SP <b> 12 is performed. Thereby, formation of the metal pattern of step SP12 can be performed by electroplating.

  Then, in the outer shape forming step of step SP13, the outer shape of the circuit board 200 is formed by cutting out the gap portion as indicated by H5 and H6 in FIG.

  However, in the outer shape forming process, there is a possibility that a defect such as disconnection of the metal pattern formed in step SP12 before the outer shape forming process may occur. Specifically, the main connection line LM1 indicated by F1 in FIG. 3 is broken when the gap portion is cut off in the outer shape forming process of step SP13, or the line width is narrowed to reduce the reliability. Arise.

  In this regard, in FIG. 3, the connection line LC is bypassed so as to surround the fixing hole HL. Therefore, even when the main connection line LM1 is disconnected, the electrical continuity is maintained by the bypass connection line LB1. As a result, even when the outer shape is formed in step SP13 after step SP12 in FIG. 8 to form a metal pattern by electroplating, problems due to disconnection of the connection line LC and narrowing of the line width occur. Effective deterrence becomes possible.

3. Details of Configuration of Circuit Board Next, details of the configuration of the circuit board will be described. In the present embodiment, as described above, the terminal group includes the first terminal group TA1 and the second terminal group TA2. The first terminal group TA1 includes the first terminal CO1 and the second terminal CO2 that are connected via the connection line LC as described above. Here, the first terminal CO1 is a terminal provided on the third side SD3 side among the M (= 4) terminals of the first terminal group TA1. That is, it is a terminal provided at a position (left end side) closest to the third side SD3 in FIG. On the other hand, the second terminal CO2 is a terminal provided on the fourth side SD4 side among the M terminals of the first terminal group TA1. That is, it is a terminal provided at a position (right end side) closest to the fourth side SD4. The other terminals RST and SCK of the first terminal group TA1 are provided between the first and second terminals CO1 and CO2.

  Thus, if the first and second terminals CO1 and CO2 are provided at both ends of the first terminal group TA1, the first and second terminals CO1 and CO2 are connected by the connection line LC as shown in FIG. It becomes possible to connect with efficient layout wiring.

  In the present embodiment, the circuit board 200 includes a circuit element 210 as shown in FIG. This circuit element 210 is an element for various detections, for example, a resistance element (RD). The circuit element 210 may be a passive element (such as a capacitor) or an active element (such as a semiconductor element) other than the resistance element.

  Specifically, as shown in FIG. 3, first and second terminal groups TA <b> 1 and TA <b> 2 are arranged on the first surface SF <b> 1 of the circuit board 200. The first surface SF1 is a connection side surface of the connector terminal on the printing apparatus main body side. On the other hand, as shown in FIG. 4, the storage device 203 and the circuit element 210 are arranged (mounted) on the second surface SF <b> 2 that is the back surface of the first surface SF <b> 1 of the circuit board 200.

  The second terminal group TA2 includes a first detection terminal DT1 and a second detection terminal DT2 connected to the circuit element 210.

  Here, the first detection terminal DT1 is a terminal provided on the third side SD3 side among the N (= 5) terminals of the second terminal group TA2. That is, it is a terminal provided at a position (left end side) closest to the third side SD3 in FIG. On the other hand, the second detection terminal DT2 is a terminal provided on the fourth side SD4 side among the N terminals of the second terminal group TA2. That is, it is a terminal provided at a position (right end side) closest to the fourth side SD4. The other terminals VDD, VSS, SDA of the second terminal group TA2 are provided between the first and second detection terminals DT1, DT2.

  The connection line LC connecting the first and second terminals CO1 and CO2 is wired from the first terminal CO1 through the first detection terminal DT1 and the terminal VDD adjacent to DT1. Further, the connection line LC is bypassed in the fixing hole HC as described above. The connection line LC is wired between the second detection terminal DT2 and the terminal SDA adjacent to DT2, and is connected to the second terminal CO2.

  In this way, when the first and second detection terminals DT1 and DT2 are provided as the terminals at both ends of the second terminal group TA2, the first and second terminals as the terminals at both ends of the first terminal group TA1. The terminals CO1 and CO2 are provided, and the first and second terminals CO1 and CO2 can be efficiently connected by the connection line LC.

  That is, in the present embodiment, the circuit element 210 is disposed at a position away from the cut surfaces CSFA and CSFB. Therefore, the detection terminals DT1 and DT2 connected to both ends of the circuit element 210 are desirably provided as terminals of the lower terminal group TA2 in FIG.

  When the detection terminals DT1 and DT2 are provided as the terminals of the lower terminal group TA2 in this way, the number of terminals is limited, so the terminals CO1 and CO2 are used as the terminals of the upper terminal group TA1. It is desirable to provide it. Further, the terminals CO1 and CO2 need to be connected by a connection line LC for short circuit detection or the like. For this reason, how to wire the connection line LC on the surface SF1 of the circuit board 200 becomes a problem.

  In this regard, in this embodiment, as shown in FIG. 3, the detection terminals DT1 and DT2 are arranged at both ends of the terminal group TA2, and as shown in FIG. 4 through the through holes TC1 and TC2 and the connection lines LD1 and LD2. The circuit element 210 is connected to both ends. In this way, the connection line LC is wired by effectively using the empty area between the detection terminal DT1 and the adjacent terminal VDD and between the detection terminal DT2 and the adjacent terminal SDA. The terminals CO1 and CO2 can be connected by the line LC. Therefore, the connection between the detection terminals DT1 and DT2 and the circuit element 210 and the connection between the terminals CO1 and CO2 can be connected by an efficient layout wiring. Therefore, while realizing efficient layout wiring on the circuit board 200, as described later, the individual mounting detection of the printing material container 100 using the detection terminals DT1 and DT2, and the terminals using the terminals CO1 and CO2 It becomes possible to realize short circuit detection and mounting detection. Further, according to this layout wiring, the terminals CO1 and CO2 can be arranged at both ends of the terminal group TA1, and the detection terminals DT1 and DT2 can be arranged at both ends of the terminal group TA2. Therefore, it is possible to prevent a short circuit or the like from occurring in a storage device terminal (RST, SCK, SDA, etc.) due to ink mist as will be described later.

  In the present embodiment, as shown in FIG. 4, the circuit element 210 has a position (line) corresponding to the arrangement position (arrangement position line) of the second terminal group TA2 on the second surface SF2, and the circuit board 200. It arrange | positions between 2nd edge | side SD2.

  For example, as shown in FIG. 3, the second terminal group TA2 is arranged on the first surface SF1 of the circuit board 200, and the position corresponding to the arrangement position of the second terminal group TA2 is the second terminal group. This is a position on the second surface SF2 corresponding to the arrangement position on the first surface SF1 of TA2. For example, as shown in FIG. 3, the contact portions CP of the terminals of the second terminal group TA2 are arranged along the lower line A2. As shown in FIG. 4, the circuit element 210 is arranged between the line A2 ′ corresponding to the line A2 (arrangement position line) and the second side SD2 of the circuit board 200 on the second surface SF2. Is done. More specifically, for example, in FIG. 3, a line connecting the lower side edges (back side in the mounting direction) of each terminal of the second terminal group TA2 is A3. In this case, as shown in FIG. 4, the circuit element 210 includes a line A3 ′ corresponding to the line A3 (arrangement position line) and the second side SD2 of the circuit board 200 on the second surface SF2. Arranged between. In other words, the circuit element 210 is disposed between the storage device 203 and the second side SD2 on the second surface SF2.

  Thus, in the present embodiment, the circuit element 210 is arranged on the second side SD2 side of the circuit board 200. That is, the circuit element 210 is disposed closer to the second side SD2 than the first side SD1.

  That is, in the present embodiment, as described above, the first and second cut surfaces CSFA, CSFB cut in the cutting process in the single product separation of the circuit board 200 on the side other than the second side SD2 of the circuit board 200. Have As shown in H1 of FIG. 6 and H2 of FIG. 7, the circuit board 200 is separated from the circuit board sheet 190 by cutting from the circuit board sheet 190 at the first and second cut surfaces CSFA and CSFB.

  In the present embodiment, as shown in step SP15 of FIG. 8 described above, the single circuit board separation is performed in the last step. In this way, since the circuit board can be separated only by the cutting process of H3 and H4 in FIG. 7, the process work at the manufacturer of the printing material container can be simplified and the cost of the product can be reduced. I can plan.

  However, in the cutting process in this single item separation, there is a possibility that a component such as a circuit board (terminal, wiring, circuit element, or the like) may be damaged or a reliability may be lowered due to cutting stress.

  On the other hand, as shown in FIG. 3, in the circuit board 200 of the present embodiment, the number of terminals (M = 4) in the terminal group TA1 along the line A1 is larger than the number of terminals (N in the terminal group TA2 along the line A2). = 5) less. That is, when the printing material container 100 to which the circuit board 200 is attached is mounted in the mounting direction DIS of FIG. 3, the connector terminal on the printing apparatus main body side passes from the lower side to the upper side of FIG. It contacts each terminal of the terminal group TA1, TA2. Therefore, the terminals of the terminal groups TA1 and TA2 are alternately arranged in a staggered manner as shown in FIG. 3, and the number of terminals of the upper terminal group TA1 is smaller.

  In the present embodiment, focusing on this point, the positions of the first and second cut surfaces CSFA and CSFB in the single item separation are positioned on the first terminal group TA1 side. That is, as shown in FIG. 3, in the third side SD3 of the circuit board 200, the first cut surface CSFA is provided at a position closer to the first side SD1 than to the second side SD2. In the fourth side SD4 of the circuit board 200, the second cut surface CSFB is provided at a position closer to the first side SD1 than to the second side SD2.

  By doing so, it is possible to suppress the occurrence of problems such as damage to the terminals formed on the circuit board 200 during the single-part separation cutting process of step SP15 in FIG. 8 or a decrease in reliability due to cutting stress. For example, in the terminals DT1 and DT2 at both ends of the second terminal group TA2, the distance W from the side of the circuit board 200 is narrowed as shown in FIGS. 9A and 9B described later. Therefore, if the cut surface is set close to these terminals DT1 and DT2, there is a risk that the terminals may be damaged or the reliability may be lowered due to cutting stress. In contrast, if the first and second cut surfaces CSFA and CSFB are provided closer to the first terminal group TA1 than the second terminal group TA2 as shown in FIG. Occurrence can be suppressed.

  In the present embodiment, the circuit element 210 is disposed closer to the second side SD2 than the first side SD1. Accordingly, the distance between the circuit element 210 and the cut surfaces CSFA and CSFB can be increased, and the occurrence of problems such as damage to the circuit element 210 due to the cutting process or reduction in reliability due to cutting stress is suppressed. become able to.

  Further, the first and second terminals CO1 and CO2 are connected by a connection line LC, and a wiring space for wiring of the connection line LC is required. In this case, if the circuit element 210 is arranged at the location shown in FIG. 4, the free space on the second surface SF2 that is generated to provide the wiring space for the connection line LC on the first surface SF1 is effectively utilized. The circuit element 210 can be mounted.

  In the present embodiment, as shown in FIG. 4, the second surface SF <b> 2 of the circuit board 200 has a first connection line LD <b> 1 having one end connected to one end of the circuit element 210, and one end connected to the circuit element. A second connection line LD2 connected to the other end of 210 is wired. The other end of the first connection line LD1 is connected to the first detection terminal DT1 of the first surface SF1 through the first through hole TC1 of the circuit board 200 as shown in FIG. On the other hand, the other end of the second connection line LD2 is connected to the second detection terminal DT2 of the first surface SF1 through the second through hole TC2 of the circuit board 200 as shown in FIG.

  In this way, the first detection terminal DT1 that is electrically connected to one end of the circuit element 210 is disposed on the third side SD3 side in FIG. 3 and is electrically connected to the other end of the circuit element 210. The second detection terminal DT2 to be connected can be arranged on the fourth side SD4 side in FIG. That is, when the circuit element 210 is arranged on the second side SD2 side so as to be far from the cut planes CSFA and CSFB as shown in FIG. 4, the first and second detections connected to both ends of the circuit element 210. The terminals DT1 and DT2 are provided on the first surface SF1 side as the terminals of the second terminal group TA2, and can be connected to the connector terminal on the printing apparatus main body side.

  Thus, in the present embodiment, the first detection terminal DT1 is connected to one end of the circuit element 210 via the first through hole TH1 and the first connection line LD1, and the second detection terminal DT2 is connected to the first detection terminal DT2. 2 is connected to the other end of the circuit element 210 through the second through hole TH2 and the second connection line LD2.

  In this case, as shown by F2 in FIG. 4, the second connection line LD2 is bypass-wired across the fixing hole HL on the second surface SF2 of the circuit board 200. Specifically, the second connection line LD2 includes a main connection line LM2 and a bypass connection line LB2. The main connection line LM2 is wired from the second through hole TC2 to the other end of the circuit element 210, passing between the side SD2 of the circuit board 200 and the fixing hole HL. On the other hand, the bypass connection line LB2 has one end and the other end connected to the main connection line LM2, and passes between the position corresponding to the terminal group (TA2) (line A2 ′ or A3 ′) and the fixing hole HL. Is done. Specifically, the bypass connection line LB2 is routed so as to surround the fixing hole HL.

  That is, as described above, in the manufacturing process of FIG. 8, the terminal and wiring metal pattern forming process of step SP12 is performed before the outer shape forming process of the circuit board 200 of step SP13. As a result, the metal pattern can be formed by electroplating.

  However, in the outer shape forming process, there is a possibility that a defect such as disconnection of the metal pattern formed in step SP12 before the outer shape forming process may occur.

  In this regard, in FIG. 4, the connection line LD2 is bypass-wired so as to surround the fixing hole HL. Therefore, even if the main connection line LM2 is disconnected, the electrical continuity is maintained by the bypass connection line LB2. As a result, even when the outer shape is formed in step SP13 after step SP12 in FIG. 8 for forming a metal pattern by electroplating, the occurrence of problems due to disconnection of the connection line LD2 and narrowing of the line width occurs. Effective deterrence becomes possible.

  Further, as described above, the circuit element 210 is, for example, a resistance element, and the first and second detection terminals DT1 and DT2 are mounting detection terminals used for detecting the mounting of the printing material container 100.

  In this way, as will be described later, the printing apparatus main body side (voltage application unit) applies the mounting detection voltage to the first and second detection terminals DT1 and DT2, and the resistance that is the circuit element 210. By detecting the current flowing through the element, mounting detection (individual mounting detection) of the printing material container 100 can be realized. That is, the mounting detection of the printing material container 100 can be realized by the first and second detection terminals DT1 and DT2 provided on both sides of the storage device terminals VDD, VSS, and SDA of the second terminal group TA2. Become.

  The first and second terminals CO1 and CO2 are short circuit detection terminals used for short circuit detection with other terminals. More specifically, the first and second terminals CO <b> 1 and CO <b> 2 are short-circuit detection terminals and mounting detection terminals used for detecting the mounting of the printing material container 100. That is, by providing the first and second terminals CO1 and CO2, short circuit detection with other terminals, detection of mounting of the printing material container 100 (cartridge out detection), and the like as described later are realized. Is possible.

  In FIG. 3, as shown by G1 and G2, the identification pattern of the circuit board 200 is formed by the connection line LC connecting the first and second terminals CO1 and CO2. This identification pattern is, for example, at least one pattern of letters, numbers, and patterns. This identification pattern is a pattern indicating various information such as manufacturing information (manufacturer, manufacturing number) of the circuit board 200.

  That is, the connection line LC connects the first and second terminals CO1 and CO2, and is wired using the empty area below (in the second direction DR2) the second terminal group TA2. The Specifically, the main connection line LM1 of the connection line LC is wired in an empty area below the line A3 in FIG. Further, as shown in FIG. 4, the circuit element 210 is arranged on the second side SD <b> 2 side of the circuit board 200. That is, the circuit element 210 is disposed below the line A3 'corresponding to the line A3. For this reason, as shown in FIG. 3, a relatively free space can be secured below the line A3.

  Therefore, in G1 and G2 in FIG. 3, the vacant space is effectively used, and the identification pattern of the circuit board 200 is formed by the connection line LC between the first and second terminals CO1 and CO2. By doing so, the circuit board 200 can be identified by the identification pattern of the connection line LC while maintaining efficient layout wiring.

  In this embodiment, as shown in FIGS. 9A and 9B, the end of the first detection terminal DT1 on the third side SD3 side and the third side SD3 of the circuit board 200 The distance W is very narrow. For example, when the minimum formation line width of the wiring of the circuit board 200 is MNW, the distance W is narrower than twice the MNW. The same is true for the distance W between the end on the fourth side SD4 side of the second detection terminal DT2 and the fourth side SD4, and the relationship of W <2 × MNW is established. That is, the first and second detection terminals DT1 and DT2 are placed at positions where the distances from the sides SD3 and SD4 of the circuit board 200 to the end sides of the first and second detection terminals DT1 and DT2 are the last distance. It is arranged.

  As described above, if W <2 × MNW and the width W of the gap is narrowed, the width of the circuit board 200 in the direction DR1 can be reduced. Therefore, for example, the number of circuit boards 200 to be removed from the circuit board sheet 190 of FIGS. 6 and 7 can be increased, and the cost of the circuit board 200 can be reduced.

Next, each terminal of the terminal groups TA1 and TA2 will be described in more detail. 3, terminals CO1, RST, SCK, CO2 of the terminal group TA1 arranged along the upper line A1, and terminals DT1, VDD, VSS, of the terminal group TA2 arranged along the lower line A2. Each of SDA and DT2 has the following functions (uses).
<Terminal group TA1>
(1) First short-circuit detection terminal CO1
(2) Reset terminal RST
(3) Clock terminal SCK
(4) Second short-circuit detection terminal CO2
<Terminal group TA2>
(5) First mounting detection terminal DT1
(6) Power supply terminal (first power supply terminal) VDD
(7) Ground terminal (second power supply terminal) VSS
(8) Data terminal SDA
(9) Second mounting detection terminal DT2
The first and second mounting detection terminals DT1 and DT2 are used when detecting whether or not the printing material container 100 is correctly mounted on the container mounting portion 1100, as will be described later. The first and second short circuit detection terminals CO1 and CO2 are used to detect a short circuit between the terminals. Specifically, it is used when detecting a short circuit with the first and second mounting detection terminals DT1 and DT2. The terminals CO1 and CO2 can also be used as cartridge-out detection terminals. The other five terminals RST, SCK, VDD, VSS, and SDA are terminals for the storage device 203 and are also referred to as “memory terminals”.

  Specifically, the reset terminal RST, the clock terminal SCK, the power supply terminal VDD, the data terminal SDA, and the ground terminal VSS are electrically connected to the storage device 203. The storage device 203 does not have an address terminal, and a memory cell to be accessed is determined based on the number of pulses of the clock signal input from the clock terminal SCK and command data input from the data terminal SDA, and is synchronized with the clock signal. Then, data is received from the data terminal SDA, or data is transmitted from the data terminal SDA. The clock terminal SCK is used to supply a clock signal from the printing apparatus main body side.

  The contact portions of the first and second short-circuit detection terminals CO1 and CO2 of the terminal group TA1 are arranged at both ends of the terminal group TA1, that is, the outermost side of the terminal group TA1. Further, the contact portions of the first and second mounting detection terminals DT1 and DT2 of the terminal group TA2 are arranged at both ends of the terminal group TA2, that is, the outermost side of the terminal group TA2. The contact portions of the storage device terminals RST, SCK, VDD, VSS, and SDA are collectively arranged at the center in the region where the entire nine terminals are arranged. The contact portions of the first and second short-circuit detection terminals CO1 and CO2 and the first and second mounting detection terminals DT1 and DT2 are at the four corners of the set of storage device terminals RST, SCK, VDD, VSS, and SDA. Has been placed.

4). Next, a short circuit detection method and a mounting detection method according to this embodiment will be described. In a printing apparatus such as an ink jet printer, conductive ink or the like may adhere to the terminal side of the circuit board 200. As shown in FIG. 3, the first short circuit detection terminal CO1 and the first mounting detection terminal DT1 are adjacent in the vertical direction, and the second short circuit detection terminal CO2 and the second mounting detection terminal DT2 are also Adjacent in the vertical direction. Therefore, for example, when conductive ink or the like adheres to the terminal side of the circuit board 200, two adjacent terminals CO1 and DT1 or CO2 and DT2 can be short-circuited (leaked) by the conductive ink or the like. There is sex. In addition, the first mounting detection terminal DT1 and the power supply terminal VDD may be short-circuited, or the second mounting detection terminal DT2 and the data terminal SDA may be short-circuited.

  The first and second mounting detection terminals DT1 and DT2 are terminals for detecting the mounting (individual mounting) of the printing material container 100. In this mounting detection, a high voltage (for example, 42V) is applied to DT1. , Applied to DT2. Therefore, when DT1 or DT2 is short-circuited with other terminals by conductive ink or the like, for example, a high voltage may be applied to a circuit such as the storage device 203, and the circuit may be destroyed.

  As will be described below, according to the printing apparatus of the present embodiment, even when a short circuit occurs between terminals due to conductive ink or the like, the high voltage applied to the attachment detection terminals DT1 and DT2 stores data when the attachment is detected. It is possible to prevent a circuit such as the device 203 from being destroyed.

  FIG. 10 shows a connection configuration example of the printing material container and the apparatus-side circuit board in the printing apparatus of this embodiment.

  The controller 300 is provided on the device side circuit board 450. The control unit 300 includes a plurality of storage devices of first to fourth printing material containers 100-1 to 100-4 (first to nth printing material containers in a broad sense; n is an integer of 2 or more). Connected to the terminals RST, SCK, VDD, VSS, and SDA, and controls reading or writing of data with respect to the storage device 203.

  The printing material containers 100-1 to 100-4 have circuit boards 200-1 to 200-4, respectively. The storage device 203 and the terminals are actually connected to the circuit boards 200-1 to 200-4. Is provided. However, in the following, for simplification of description, the circuit boards 200-1 to 200-4 are described as printing material containers 100-1 to 100-4 as appropriate.

  Of the first to fourth printing material containers 100-1 to 100-4, the second printing material container 100-2 to the third printing material container 100-3 (i to j in the broad sense). A plurality of storage device terminals RST, SCK, VDD, VSS, and SDA, where i and j are integers satisfying 1 <i <n-1 and i <j <n, are determined by bus MBS. Commonly connected to the control unit 300. The plurality of storage device terminals RST, SCK, VDD, VSS, and SDA of the first printing material container 100-1 are separated from the bus MBS and connected to the control unit 300. The plurality of storage device terminals RST, SCK, VDD, VSS, and SDA of the fourth printing material container 100-4 (nth printing material container) are separated from the bus MBS and connected to the control unit 300. .

  The device-side circuit board 450 is a circuit board for the printing apparatus main body, on which the control unit 300 is mounted. The first to fourth terminal groups TG1 to TG4 on the main body side (first to nth on the main body side in a broad sense). Terminal group) and bus wiring of the bus MBS. The first to fourth terminal groups TG1 to TG4 on the main body side are first to fourth printing material containers 100-1 to 100-4 (first to fourth circuit boards 200-1 to 200-4). Is connected. The first to fourth terminal groups TG1 to TG4 on the main body side are a plurality for accessing the storage devices 203-1 to 203-4 included in the first to fourth printing material containers 100-1 to 100-4. Storage device terminals CRST, CSCK, CVDD, CVSS, and CSDA. Further, it has mounting detection terminals CDT1 and CDT2 for detecting the mounting of the first to fourth printing material containers 100-1 to 100-4, respectively.

  The first terminal group TG1 on the main body side is arranged on the first end side of the device-side circuit board 450, and the fourth terminal group TG4 (n-th terminal group) on the main body side is the device-side circuit board 450. It is arranged on the second end side facing the first end side. Among the first to fourth terminal groups TG1 to TG4, the second to third terminal groups TG2 to TG3 (i.e., the i-th to j-th terminal groups in a broad sense) are connected to the control unit 300 by the bus wiring of the bus MBS. Commonly connected. The first terminal group TG1 is separated from the bus wiring of the bus MBS and connected to the control unit 300. The fourth terminal group TG4 is separated from the bus wiring of the bus MBS and connected to the control unit 300.

  As described above, in the printing apparatus having the configuration shown in FIG. 10, the first terminal group TG1 disposed on the first end side of the apparatus-side circuit board 450 and the second end side facing the first end side. The arranged fourth terminal group TG4 is separated from the bus MBS and connected to the control unit 300.

  In an inkjet printer or the like, when ink is ejected from a print head, a part of the ink is atomized (mist) and released into the air. Since this ink mist wraps around from the end side of the apparatus-side circuit board 450, the printing material containers 100-1 and 100 located closer to the end side than the printing material containers 100-2 and 100-3 far from the end side. -4 is more likely to cause a short circuit between terminals due to ink mist adhesion.

  According to the configuration of FIG. 10, even when a short circuit occurs in the printing material containers 100-1 and 100-4 on the edge side, it is separated from the other printing material containers 100-2 and 100-3. Therefore, it is possible to suppress adverse effects on communication between the control unit 300 and the storage devices 203-2 and 203-3 of other printing material containers. Further, it is possible to prevent a high voltage from being applied to the storage devices 203-2 and 203-3 at the time of mounting detection. As a result, it is possible to reliably and safely detect the mounting of the printing material containers 100-1 to 100-4.

5. Printing Device FIG. 11 shows a basic configuration example of the printing device of the present embodiment. This printing apparatus has a printing apparatus main body and a printing material container 100. The printing apparatus main body includes a device-side circuit board 450 on which the control unit 300 is provided, a main control unit 400, and a display unit 430. Although FIG. 11 illustrates one printing material container 100, the printing apparatus according to the present embodiment can include a plurality of printing material containers 100.

  The device-side circuit board 450 includes a terminal group having nine terminals and a plurality of wirings that electrically connect each terminal of the terminal group and the control unit 300. Specifically, the terminal group includes a reset terminal CRST, a clock terminal CSCK, a power supply terminal CVDD, a ground terminal CVSS, a data terminal CSDA, mounting detection terminals CDT1, CDT2, and short circuit detection terminals CCO1, CCO2. The device side circuit board 450 is provided, for example, in the container mounting portion 1100 (cartridge mounting portion) of FIG.

  The control unit 300 includes a communication processing unit 350, and controls reading or writing of data with respect to the storage device 203 together with the main control unit 400. For example, when the main control unit 400 controls data writing or reading with respect to the storage device 203, the communication processing unit 350 relays communication of writing data or reading data. Further, the control unit 300 includes a mounting detection unit 330, a CO detection unit 340, a short circuit detection unit 310, a voltage application unit 320, and a high voltage control unit 360, and processes such as mounting detection, CO detection, short circuit detection, and high voltage interruption. I do.

  The main control unit 400 includes a CPU 410 and a memory 420, and controls printing processing. In addition, necessary communication is performed with the control unit 300 via the bus BUS. In the configuration example illustrated in FIG. 11, the control unit is divided into the main control unit 400 and the control unit 300, but may be configured as one control unit.

  The display unit 430 is for notifying the user of various kinds of information such as the operating state of the printing apparatus and the mounting state of the ink cartridge.

  The low voltage power supply 441 generates a low voltage power supply voltage (first power supply voltage) VDD. The voltage VDD is a normal power supply voltage (rated 3.3V) used in the logic circuit. The high voltage power supply 442 generates a high voltage power supply voltage (second power supply voltage) VHV. The voltage VHV is a high voltage (for example, rated 42 V) that is used to drive the print head and eject ink, and is also used to generate a mounting detection voltage VHO that is applied to the mounting detection terminal DT1. These voltages VDD and VHV are supplied to the controller 300, and are also supplied to other circuits as necessary. Specifically, for example, the high voltage power supply voltage VHV is supplied from the high voltage power supply 442 to the voltage applying unit 320 of the control unit 300, and the mounting detection voltage VHO output from the voltage applying unit 320 is the printing material container 100. This is supplied to the mounting detection terminal DT1 and the mounting detection unit 330. The attachment detection voltage VHO is higher than a high-potential side power supply voltage (for example, 3.3 V) supplied to the storage device 203.

  Of the nine terminals provided on the circuit board 200 (FIG. 3) of the printing material container 100, the terminals RST, SCK, VDD, SDA, and VSS are electrically connected to the storage device 203.

  On the other hand, the attachment detection terminals DT <b> 1 and DT <b> 2 are used when detecting whether or not the printing material container 100 is correctly attached to the container attachment portion 1100. Between the mounting detection terminals DT1 and DT2, a resistance element RD (circuit element in a broad sense) for mounting detection is provided. The mounting detection unit 330 detects mounting of the printing material container 100 based on the mounting detection voltage VHO output from the voltage application unit 320 and the current flowing through the mounting detection resistance element RD. Specifically, when the mounting detection voltage VHO output from the voltage application unit 320 is applied to the mounting detection terminal DT1, a voltage is applied to the mounting detection resistance element RD and a current flows, and this current is mounted. The detection is detected by the detection unit 330. The method for detecting the mounting will be described in detail later.

  The short circuit detection terminals CO1 and CO2 are electrically connected by wiring inside the printing material container 100 (specifically, the circuit board 200). As will be described later, the CO detection unit 340 detects electrical continuity between CO1 and CO2 to determine whether CO1 and CO2 are in electrical contact with corresponding terminals of the container mounting unit 1100, respectively. That is, it is possible to detect whether or not the printing material container 100 is correctly mounted. However, in the printing apparatus according to the present embodiment, the mounting detection terminals DT1 and DT2 and the mounting detection unit 330 are provided, and by using these, the mounting of the printing material container 100 can be detected. 340 can be omitted.

  In the following description, the mounting detection by the mounting detection unit 330 is referred to as “mounting detection”, and the mounting detection by the CO detection unit 340 is referred to as “cartridge out detection” or “CO detection”.

  The short circuit detection unit 310 is connected to the short circuit detection terminals CO1 and CO2 directly or via diodes D1 and D2 (given circuit elements in a broad sense). For example, a high voltage that is not originally applied to the short-circuit detection terminals CO1 and CO2 is applied due to a short circuit between at least one of the short-circuit detection terminals CO1 and CO2 and at least one of the mounting detection terminals DT1 and DT2. (Application of abnormal voltage) is detected based on a comparison between the voltage of the detection node ND and the reference voltage. That is, a short circuit (abnormal voltage) is detected when the voltage at the detection node ND is higher than the reference voltage. When the short circuit detection unit 310 detects a short circuit, it outputs a short circuit detection signal VSHT to the high voltage control unit 360, and the high voltage control unit 360 controls the voltage application unit 320 based on the short circuit detection signal VSHT. The signal VCNT is output. The voltage application unit 320 stops the supply of the mounting detection voltage VHO based on the control signal VCNT from the high voltage control unit 360.

  Here, the reference voltage is set to a voltage value that does not destroy the storage device 203 (or a circuit such as the CO detection unit 340) when the short circuit occurs. In this way, the short circuit detection unit 310 can detect a short circuit before the voltage of the detection node ND reaches a voltage value that destroys a circuit such as the storage device 203.

  As shown in FIG. 3, the short circuit detection terminal CO1 and the mounting detection terminal DT1 are adjacent to each other, and the short circuit detection terminal CO2 and the mounting detection terminal DT2 are adjacent to each other. Therefore, for example, when conductive ink or the like adheres to the terminal side of the circuit board 200, two adjacent terminals CO1 and DT1 or CO2 and DT2 can be short-circuited (leaked) by the conductive ink or the like. There is sex. In addition, the mounting detection terminal DT1 and the power supply terminal VDD may be short-circuited, or the mounting detection terminal DT2 and the data terminal SDA may be short-circuited.

  As described above, when mounting is detected by the mounting detector 330, the mounting detection voltage VHO is applied to the mounting detection terminal DT1. Therefore, when the first mounting detection terminals DT1 and DT2 and the short circuit detection terminals CO1 and CO2 are short-circuited (leaked) due to conductive ink or the like, a high voltage may be applied to the CO detection unit 340 during mounting detection. is there. Further, when the mounting detection terminals DT1 and DT2 and the power supply terminal VDD or the data terminal SDA are short-circuited, a high voltage may be applied to the storage device 203.

  According to the printing apparatus of the present embodiment, when the short circuit detection unit 310 detects that a short circuit may occur between the terminals and detects that there is a possibility that a short circuit has occurred. The voltage application unit 320 can stop the supply of the mounting detection voltage VHO.

  Specifically, for example, as shown in B1 of FIG. 11, when DT1 and CO1 are short-circuited, a forward current of the diode D1 flows from DT1 to CO1, and from CO1 to the detection node ND, As a result, the potential of the detection node ND increases. Further, as shown in B2 of FIG. 11, when DT2 and CO2 are short-circuited, the forward current of the diode D2 flows from DT2 to CO2 and from CO2 to the detection node ND. As a result, the detection node The potential of ND increases. The short circuit detection unit 310 can detect a short circuit by comparing the voltage of the detection node ND with the reference voltage.

  Further, according to the printing apparatus of the present embodiment, the control unit 300, when the voltage application unit 320 applies the mounting detection voltage VHO to the mounting detection terminal DT1, is configured to include a plurality of storage device terminals (RST, SCK, VDD). , VSS, SDA) are set to a high impedance state (floating state). By doing so, for example, even when DT1, CO1, and VDD are short-circuited, or even when DT2, CO2, and SDA are short-circuited, a high voltage is applied to the storage device 203 at the time of mounting detection. Before, the short circuit detection unit 310 detects that an overvoltage is applied to the node ND, and based on this, the control unit 300 can stop the supply of the attachment detection voltage VHO. Accordingly, it is possible to prevent a voltage exceeding the maximum rating of the storage device 203 from being applied to the storage device 203.

  When the main control unit 400 reads data from the storage device 203 or writes data to the storage device 203, the main control unit 400 accesses the communication processing unit 350 of the control unit 300 before starting access. Instructs the state of the terminals of the plurality of storage device terminals RST, SCK, VDD, VSS, and SDA to be set from the high impedance state to the ground level (GND level, VSS level, broadly constant voltage level). After the plurality of storage device terminals are set to the ground level, the main control unit 400 reads or writes data from or to the storage device 203 via the communication processing unit 350.

  Specifically, after setting the plurality of storage device terminals to the ground level, the communication processing unit 350 controls the plurality of storage device terminals from the ground level to a predetermined voltage level, so that the main control unit 400 stores the data. Data is read from or written to the device 203. In this way, since all the memory terminals can be set to the same potential before writing or reading to the storage device 203, a stable memory operation can be obtained. Here, the predetermined voltage level is a voltage level applied to each storage device terminal in order to read or write data.

  The voltage application unit 320 stops applying the mounting detection voltage VHO before the control unit 300 reads or writes data from or to the storage device 203. By doing so, the mounting detection voltage VHO is not applied to the mounting detection terminals DT1 and DT2 during execution of reading or writing with respect to the storage device 203, so that the generation of noise due to VHO can be suppressed. As a result, communication errors and memory errors due to noise can be reduced.

  In addition, after the control unit 300 finishes reading or writing data to the storage device 203, the plurality of storage device terminals are set to the ground level (constant voltage level in a broad sense). After the plurality of storage device terminals are set to the ground level, the voltage application unit 320 applies the attachment detection voltage VHO to the first attachment detection terminal DT1, and sets the plurality of storage device terminals to the high impedance state. Is done. By doing so, mounting detection can be performed except when reading or writing to the storage device 203 is not performed.

  As described above, according to the printing apparatus of the present embodiment, even when a short circuit occurs between terminals due to adhesion of a printing material such as ink, a high voltage is applied to the storage device 203 when mounting is detected. The possibility can be reduced. Further, the memory terminal can be set to the same potential before access to the storage device 203, and application of a high voltage can be stopped during access. As a result, reliable and safe mounting detection and highly reliable memory access can be realized.

  FIG. 12 shows a configuration example of a circuit related to short circuit detection and mounting detection. In the following, “printing material container” will be referred to as “ink cartridge” or “cartridge” as appropriate.

  The configuration example shown in FIG. 12 includes four ink cartridges 100-1 to 100-4 (IC1 to IC4). The number of ink cartridges is not limited to four, and may be two, three, or five or more. In FIG. 12, for convenience of explanation, the CO detection unit 340 is divided into a CO detection unit (output side) 340 a and a CO detection unit (input side) 340 b.

  When the printing apparatus includes a plurality of ink cartridges, the short-circuit detection terminals CO1 and CO2 of each ink cartridge of the plurality of ink cartridges (for example, IC1 to IC4) are 1 through a plurality of diode elements (for example, D1 to D5). The two short-circuit detection units 310 are connected to the detection node ND. Specifically, in FIG. 12, for example, CO1 of IC1 is connected via diode D1, CO2 of IC1 and CO1 of IC2 are connected via diode D2, and CO2 of IC2 and CO1 of IC3 are connected via diode D3. Each is connected to a detection node ND. The cathode (negative electrode) of each diode is connected to the detection node ND. By doing in this way, the short circuit detection part 310 can detect a short circuit, without interfering with the cartridge out detection by the CO detection part 340.

  The short circuit detection unit 310 detects based on a comparison between the voltage of the detection node ND and the reference voltage. That is, a short circuit (abnormal voltage) is detected when the voltage at the detection node ND is higher than the reference voltage. When the short circuit detection unit 310 detects a short circuit, it outputs a short circuit detection signal VSHT to the high voltage control unit 360, and the high voltage control unit 360 controls the voltage application unit 320 based on the short circuit detection signal VSHT. The signal VCNT is output. The voltage application unit 320 stops the supply of the mounting detection voltage VHO based on the control signal VCNT from the high voltage control unit 360.

  The resistance elements RB1 to RB4 (circuit elements in a broad sense) are used for mounting detection by the mounting detection unit 330, and have different resistance values. By doing so, it is possible to detect in which mounting position of the ink cartridges IC1 to IC4 the ink cartridge is not mounted. This wearing detection method will be described later in detail.

  The cartridge out detection by the CO detection unit 340 (340a, 340b) is performed as follows. When all four ink cartridges are mounted, as shown in FIG. 12, the first short circuit detection terminal CO1 of the IC1 is electrically connected to the second short circuit detection terminal CO2 of the IC4. Therefore, the signal DPins output from the CO detection unit (output side) 340a is detected as the signal DPres by the CO detection unit (input side) 340b. On the other hand, if any one of the four ink cartridges is not installed, it is electrically non-conductive, so the CO detection unit (input side) 340b does not detect the signal DPres. In this way, cartridge out can be detected depending on whether or not the CO detection unit (input side) 340b detects the signal DPres.

  FIG. 13 is a flowchart of mounting detection and memory access in the printing apparatus of this embodiment. As described above, in the printing apparatus according to the present embodiment, ink information (printing material information in a broad sense) is stored in the storage device 203 provided in the ink cartridge 100. This ink information is obtained by the main control unit 400 via the control unit 300 every time when a predetermined unit amount of ink in the ink cartridge is consumed by the head cleaning or printing, or when the printing apparatus is turned off. It is written in the storage device 203. Ink information is read from the storage device 203 via the control unit 300 in response to a request from the main control unit 400 when the printing apparatus is powered on. This flow is executed under the control of the main control unit 400 and the control unit 300.

  The main control unit 400 and the control unit 300 always set the memory terminals to a high impedance state after the printing apparatus is turned on except during memory access. In addition, mounting detection and CO detection are always or periodically executed. Note that CO detection (cartridge out detection) is executed even during memory access.

  When the main control unit 400 starts memory access, first, attachment detection is stopped. That is, the process of detecting the mounting by applying VHO is stopped (step SP1).

  In step SP2, the memory terminal is set from the high impedance state HZ to the GND level (ground level, VSS level). At this time, if a short circuit occurs between the CO terminal (CO1 or CO2) and the memory terminal, for example, between CO1 and VDD, or between CO2 and SDA, the CO detection unit 340 can detect the short circuit.

  In step SP3, it is determined whether or not the ink cartridge 100 is normal. That is, it is determined whether or not the ink cartridge 100 is properly installed and a short circuit between the terminals has not occurred. If it is normal, the process proceeds to the next step SP4, and if it is not normal, error processing is executed. The error process is a process of displaying an error message on the display unit 430, for example.

  In step SP4, memory access to the storage device 203 is performed. That is, the control unit 300 supplies necessary signals and power supply voltages to each memory terminal, and performs data writing processing or reading processing on the storage device 203.

  In step SP5, it is determined whether or not the memory access has been normally performed. Specifically, at the time of writing, a write completion signal is transmitted from the storage device 203 to the control unit 300 at a predetermined timing after the control unit 300 transmits a write command and write data to the storage device 203. The Upon receiving this write completion signal, the control unit 300 determines whether the memory access has been normally completed. At the time of reading, since the parity bit is added to the data read from the storage device 203 and transmitted to the control unit 300, a parity check is performed, and whether or not the data read from the storage device 203 is normal. Can be determined. If the memory access is normal, the process proceeds to step SP6, and if it is not normal, error processing is executed.

  When the memory access ends normally, in step SP6, the memory terminal is set to the GND level. Here, cartridge out detection by the CO detection unit 340 can be performed. At this time, if a short circuit between the terminals (for example, CO1-VDD, CO2-SDA) occurs, the CO detection unit 340 can detect the short circuit.

  In step SP7, the mounting detection voltage VHO is applied to the mounting detection terminals DT1 and DT2, and mounting detection is resumed.

  In step SP8, the memory terminal is set to the high impedance state HZ. Here, when a short circuit between terminals (for example, DT1-CO1, DT2-CO2) has occurred, the short circuit detection unit 310 can detect this.

  As shown in the flowchart of FIG. 13, according to the printing apparatus of this embodiment, when the printing apparatus is powered on, mounting detection and CO detection are always performed, and all the cartridges are mounted or the cartridges are mounted correctly. Detect if it is. At the time of memory access, the application of VHO is stopped to reduce noise at the time of memory access, and even if the mounting detection terminals DT1, DT2 and the memory terminal are short-circuited, VHO is prevented from being applied to the memory terminal.

  When the memory is not accessed, by setting the memory terminal in a high impedance state, if the mounting detection terminals DT1 and DT2 and the short circuit detection terminals CO1 and CO2 are short-circuited, the memory terminal may also be short-circuited to the mounting detection terminals DT1 and DT2. Therefore, the application of VHO is stopped, and the possibility that VHO is applied to the storage device 203 can be reduced. As a result, it is possible to realize highly reliable memory access while performing mounting detection.

  As described above, the printing apparatus of the present embodiment includes the printing apparatus main body and the printing material container 100 as shown in FIG. The printing apparatus main body includes a short circuit detection unit 310 that detects a short circuit between at least one of the first and second terminals CO1 and CO2 and the other terminals (DT1, DT2, etc.).

  As shown in FIG. 3, the circuit board 200 includes a circuit element 210, and the circuit element 210 is, for example, a resistance element RD. The terminal group includes first and second detection terminals DT1 and DT2 connected to the circuit element 210.

  The printing apparatus main body includes a voltage application unit 320 and a mounting detection unit 330. The voltage application unit 320 applies the mounting detection voltage VHO to the first detection terminal DT1. The attachment detection unit 330 detects the attachment of the printing material container 100 by detecting the current flowing through the resistance element RD by applying the attachment detection voltage VHO. As a result, the individual mounting detection of the printing material container 100 can be realized.

6). Mounting Detection Method FIGS. 14A and 14B are detailed explanatory diagrams of the mounting detection method of the ink cartridge (printing material container) in the printing apparatus according to the present embodiment. FIG. 14A shows a state where all of the cartridges IC1 to IC4 that can be mounted on the container mounting portion 1100 of the printing apparatus are mounted. The resistance values of the mounting detection resistance elements RD of the four cartridges IC1 to IC4 are set to the same value R. Resistance elements RB1 to RB4 connected in series with the resistance elements RD for mounting detection of the respective cartridges are provided. The resistance values of the resistance elements RB1 to RB4 are set to different values. Specifically, among these resistance elements RB1 to RB4, the resistance value of the resistance element RBn associated with the nth (n = 1 to 4) cartridge ICn is (2 ⁿ −1) R (R is Is set to a certain value). As a result, a resistor having a resistance value of 2 ⁿ R is formed by the series connection of the mounting detection resistance element RD in the nth cartridge and the resistance element RBn. The 2 ⁿ R resistors for the n-th (n = 1 to N) cartridge are connected to the mounting detection unit 330 in parallel. Hereinafter, the combined resistors 701 to 704 formed by the serial connection of the mounting detection resistance element RD and the resistance elements RB1 to RB4 are also simply referred to as “resistance”.

  The detection current IDET detected by the attachment detection unit 330 is a value obtained by dividing the voltage (VHO−VREF) by the combined resistance value Rc of these four resistors 701 to 704, assuming that the bias voltage of the attachment detection unit 330 is VREF. VHO-VREF) / Rc. Here, when the number of cartridges is N, when all N cartridges are mounted, the detection current IDET and the combined resistance value Rc are given by the following equations (1) and (2).

  If one or more cartridges are not mounted, the combined resistance value Rc increases accordingly, and the detection current IDET decreases.

  FIG. 14B shows the relationship between the mounted state of the cartridges IC1 to IC4 and the detection current IDET. The horizontal axis of the figure shows 16 types of mounting states, and the vertical axis shows the value of the detected current IDET in these mounting states. The 16 types of mounting states correspond to 16 combinations obtained by arbitrarily selecting 1 to 4 cartridges from the four cartridges IC1 to IC4. The detection current IDET has a current value that can uniquely identify these 16 types of mounting states. In other words, the individual resistance values of the four resistors 701 to 704 associated with the four cartridges IC1 to IC4 are such that the 16 types of mounting states that the four cartridges can take give different combined resistance values Rc. Is set to

  If all of the four cartridges IC1 to IC4 are in the mounted state, the detected current IDET has the maximum value Imax. On the other hand, when only the cartridge IC4 associated with the resistor 704 having the largest resistance value is not mounted, the detected current IDET is 0.93 times the maximum value Imax. Accordingly, whether or not the cartridges IC1 to IC4 are mounted is detected by checking whether or not the detection current IDET is equal to or greater than a threshold current Ithmax set in advance as a value between these two current values. It becomes possible to do.

The cartridge mounting detection process described above utilizes the fact that the combined resistance value Rc is uniquely determined according to ^2N types of mounting states related to ^N cartridges, and the detection current IDET is uniquely determined according to this. Here, it is assumed that the tolerance of the resistance values of the resistors 701 to 704 is ε. Further, assuming that the first combined resistance value when all the cartridges IC1 to IC4 are mounted is Rc1, and the second combined resistance value when only the fourth cartridge IC4 is not mounted is Rc2, Rc1 <Rc2. Is established (FIG. 14B). This relationship Rc1 <Rc2 is preferably established even when the resistance values of the resistors 701 to 704 vary within the allowable error ± ε. At this time, the worst condition is a case where the first combined resistance value Rc1 takes the maximum value Rc1max and the second combined resistance value Rc2 takes the minimum value Rc2min when the allowable error ± ε is considered. In order to be able to identify these combined resistance values Rc1max and Rc2min, it is only necessary that the condition Rc1max <Rc2min is satisfied. From this condition Rc1max <Rc2min, the following expression (3) is derived.

  That is, when the tolerance ± ε satisfies the expression (3), it is guaranteed that the combined resistance value Rc is always uniquely determined according to the mounted state of N cartridges, and the detected current IDET is uniquely determined according to this. can do.

  Although the present embodiment has been described in detail as described above, it will be easily understood by those skilled in the art that many modifications can be made without departing from the novel matters and effects of the present invention. Therefore, all such modifications are included in the scope of the present invention. For example, a term described with a different term having a broader meaning or the same meaning at least once in the specification or the drawings can be replaced with the different term in any part of the specification or the drawings. Further, the configurations and operations of the circuit board, the printing material container, and the printing apparatus are not limited to those described in the present embodiment, and various modifications can be made.

100 printing material container (ink cartridge), 190 circuit board sheet,
200 circuit board, 203 storage device, 210 circuit element,
300 control unit, 310 short-circuit detection unit, 320 voltage application unit, 330 wearing detection unit,
340 CO detector, 350 communication processor, 360 high voltage controller,
400 main control unit, 410 CPU, 420 memory, 430 display unit,
441 Low voltage power supply, 442 High voltage power supply, 450 Device side circuit board,
TA1, TA2 first and second terminal groups,
DT1, DT2 first and second detection terminals (first and second mounting detection terminals),
CO1, CO2 first and second terminals (first and second short-circuit detection terminals),
RST reset terminal, SCK clock terminal, SDA data terminal,
VDD power supply terminal, VSS ground terminal, CP contact part,
HL fixing holes, TH1, TH2 first and second through holes,
SD1 to SD4, first to fourth sides, DR1 to DR4, first to fourth directions,
DIS mounting direction, LC connection line, LD1, LD2 first and second connection lines,
LM1, LM2 main connection line, LB1, LB2 bypass connection line

Claims (17)

A circuit board attached to the printing material container,
A storage device for storing printing material information;
A plurality of storage device terminals connected to the storage device, a first terminal and a second terminal, and the connector on the printing apparatus main body side when the printing material container is mounted on the printing apparatus main body; A group of terminals connected to the terminals;
A connection line connecting the first terminal and the second terminal;
Including
When the direction orthogonal to the first direction is the second direction, and the side facing the first side of the circuit board is the second side,
The terminal group includes a plurality of terminals arranged along the first direction on the second direction side of the first side of the circuit board;
A hole for fixing the circuit board to the printing material container is provided between the terminal group and the second side of the circuit board.
The connection line is
A circuit board, wherein the wiring is bypassed across the fixing hole. In claim 1,
The connection line is
A main connection line wired from the first terminal to the second terminal through the second side of the circuit board and the fixing hole;
A circuit board comprising a bypass connection line having one end and the other end connected to the main connection line and wired between the terminal group and the fixing hole. In claim 1 or 2,
The terminal group is
A first terminal group in which M terminals are arranged along the first direction on the second direction side of the first side of the circuit board;
A second terminal group in which N terminals (M, N is an integer of 2 or more satisfying M <N) are arranged along the first direction on the second direction side of the first terminal group; Have
When the side facing the third side of the circuit board is the fourth side,
The first terminal is a terminal provided on the third side of the M terminals of the first terminal group,
The circuit board, wherein the second terminal is a terminal provided on the fourth side of the M terminals of the first terminal group. In claim 3,
A circuit element,
The second terminal group includes:
A first detection terminal and a second detection terminal connected to the circuit element;
The first detection terminal is a terminal provided on the third side of the N terminals of the second terminal group,
The second detection terminal is a terminal provided on the fourth side of the N terminals of the second terminal group,
The connection line is
The first terminal is wired between the first detection terminal and a terminal adjacent to the first detection terminal, bypassed in the fixing hole, and the second detection terminal. A circuit board, wherein the circuit board is wired between a terminal adjacent to the second detection terminal and connected to the second terminal. In claim 4,
The terminal group is disposed on a first surface of the circuit board that is a connection side surface of the connector terminal, and the storage device and the second surface that is the back surface of the first surface of the circuit board are disposed on the first surface. Circuit elements are arranged,
The second surface of the circuit board has a first connection line having one end connected to one end of the circuit element, and a second connection line having one end connected to the other end of the circuit element. Wired and
The other end of the first connection line is connected to the first detection terminal on the first surface via a first through hole of the circuit board,
The other end of the second connection line is connected to the second detection terminal of the first surface through a second through hole of the circuit board. In claim 5,
The circuit board, wherein the second connection line is bypass-wired across the fixing hole on the second surface of the circuit board. In any one of Claims 4 thru | or 6.
The circuit element is:
The circuit board, wherein the circuit board is arranged between a position corresponding to an arrangement position of the second terminal group on the second surface and the second side of the circuit board. In any of claims 4 to 7,
The circuit element is a resistance element;
The circuit board, wherein the first detection terminal and the second detection terminal are attachment detection terminals used for attachment detection of the printing material container. In any one of Claims 1 thru | or 8.
The circuit board, wherein the first terminal and the second terminal are short-circuit detection terminals used for short-circuit detection with other terminals. In claim 9,
The circuit board, wherein the first terminal and the second terminal are the short-circuit detection terminals and are mounting detection terminals used for detecting the mounting of the printing material container. In any one of Claims 1 thru | or 10.
An identification pattern of the circuit board is formed by the connection line. In claim 11,
The circuit board according to claim 1, wherein the identification pattern is at least one pattern of letters, numbers, and patterns. In any one of Claims 1 to 12,
A circuit board having a cut surface cut by a cutting process in single product separation of the circuit board on a side other than the second side of the circuit board.   A printing material container comprising the circuit board according to claim 1. The printing material container according to claim 14,
The printing apparatus body;
A printing apparatus comprising: In claim 15,
The printing apparatus body is
A printing apparatus, comprising: a short circuit detection unit that detects a short circuit between at least one of the first terminal and the second terminal and another terminal. In claim 15 or 16,
The circuit board further includes a circuit element,
The terminal group is
A first detection terminal and a second detection terminal connected to the circuit element;
The circuit element is a resistance element;
The printing apparatus body is
A voltage application unit for applying a mounting detection voltage to the first detection terminal;
A printing apparatus comprising: a mounting detection unit configured to detect mounting of the printing material container by detecting a current flowing through the resistance element by applying the mounting detection voltage.

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