JP2013158995A - Pressure buffer device, liquid jet head, liquid jet device and method for manufacturing pressure buffer device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a structure which prevents a crack from being generated in a base 5 when screwing a lid 6 to a base 5 in which a flexible film 4 is joined to an upper end face TS.SOLUTION: A pressure buffer device 1 includes a recess 2 whose peripheral upper end face TS is flat, a screw hole 22 opened to the upper end face TS, the base 5 having an inflow communication port 3a or an inflow communication port 3b which communicates with an outer region on an internal face of the recess section 2, and the flexible film 4 which is joined to the upper end face TS and closes an opening port of the recess 2. The flexible film 4 and the upper end face TS are joined excluding the region of the peripheral of the screw hole 22.

Description

  The present invention relates to a pressure buffering device that relieves pressure fluctuations of a liquid, a liquid jet head using the same, a liquid jetting device, and a method of manufacturing the pressure buffering device.

  In recent years, ink jet type liquid ejecting heads have been used in which ink droplets are ejected onto recording paper or the like to draw characters and figures, or liquid material is ejected onto the surface of an element substrate to form a functional thin film. In this method, ink or liquid material is supplied from a liquid tank to a liquid ejecting head via a supply pipe, and ink or liquid material filled in the channel is discharged from a nozzle communicating with the channel and recorded on a recording medium. When ejecting the liquid, the liquid ejecting head or the recording medium for recording the ejected liquid is moved to draw characters or graphics, or a functional thin film having a predetermined shape is formed.

  9 and 10 show a configuration diagram and a cross-sectional view of a portion hh 'of the pressure buffer device 100 connected to the ink jet head 120 which is this type of liquid jet head (FIGS. 4 and 5 of Patent Document 1). The pressure buffer device 100 includes a recess 114 formed in a main body 112, an ink flow path 107 including a side wall 117, an ink outlet 108 communicating with the ink flow path 107, and openings of the recess 114 and the ink flow path 107. It is comprised from the flexible film | membrane 111 which plugs up. The ink flow path 107 and the chamber 115 are separated by a partition wall 110. The ink flowing from the ink inlet 102 is reduced in pressure fluctuation in the chamber 115 and is supplied from the ink outlet 108 to the inkjet head 120 via the opening 101 and the ink flow path 107.

  The inkjet head 120 and the pressure buffer 100 move while ejecting liquid. For this reason, pressure fluctuation due to inertia occurs in the ink filled in the pressure buffer 100 or the ink held in the tube connecting the liquid tank and the ink inlet 102. The flexible film 111 reduces the pressure fluctuation of the ink by the expansion and contraction of the film, and reduces the pressure fluctuation of the ink flowing out from the ink outflow path 108. As a result, the meniscus 104 formed on the nozzles of the inkjet head 120 can be kept in a constant shape, and a constant amount of ink droplets can be ejected from the nozzles at a constant speed.

JP 2008-110599 A

  The pressure buffer device 100 molds a synthetic resin to form a recess 114 or the like in the main body 112, and then joins the synthetic resin flexible film 111 to the upper end surface of the main body 112 by heat welding. FIG. 11 is an explanatory diagram of the pressure buffering device, and shows a state in which the flexible film 111 is thermally welded to the main body 112 and joined. FIG. 11A is a schematic cross-sectional view illustrating a state in which the flexible film 111 is thermally welded to the upper end surface of the recess 114 having a flat upper end surface. A concave portion 114, an ink flow path 107, and a screw hole 122 are formed in the main body 112. As shown in FIG. 11C, the screw hole 122 is provided to screw a metal lid 125 installed on the upper part of the flexible film 111 with a screw 123. The flexible film 111 is installed on the upper end surface of the main body 112, and the flexible film 111 is heat-welded to the main body 112 by bringing the heating surface plate 124 into contact with the entire surface of the flexible film 111 and heating.

  However, as shown in FIG. 11A, when the flexible film 111 is thermally welded to the entire upper end surface of the main body 112, the material of the main body 112 is melted in the opening of the screw hole 122 to form a thin burr. The thin burr has uneven thickness and length, and when the screw 123 is passed through the screw hole 122 and the metal lid 125 is fixed to the main body 112 with a screw, a crack is generated from the vicinity of the screw hole 122 of the main body 112, This causes the liquid filled in the chamber 115 to leak out.

  In order to solve this problem, as shown in FIG. 11B, a bank 126 protruding from the upper end surface of the recess 114 is formed in the vicinity of the opening end of the recess 114, and the upper end surface of the bank 126 is flexible. The film 111 is thermally welded. In this way, if the flexible film 111 and the main body 112 are heat-welded, no burr is generated at the opening of the screw hole 122. However, as shown in FIG. 11C, when the metal lid 125 is placed on the flexible film 111, a gap Δ is generated between the metal lid 125 and the main body 112 with the flexible film 111 interposed therebetween. In this state, when the metal lid 125 is screwed to the main body 112 through the screw 123 through the screw hole 122, a bending stress is applied to the main body 112 due to the presence of the gap Δ, which causes liquid leakage.

  An object of the present invention is to solve the above problems and to provide a highly reliable pressure buffering device that does not cause liquid leakage.

  The pressure buffering device of the present invention includes a base having a recess having a flat upper end surface, a screw hole opening in the upper end surface, a communication port communicating with an external region on the inner surface of the recess, and the upper end surface. And a flexible membrane for closing the opening of the concave portion, and the flexible membrane and the upper end surface are joined except for a region around the screw hole.

  Further, the flexible film and the upper end surface are joined by thermal welding from the opening end of the concave portion to the peripheral portion of the opening end.

  The base is made of polyethylene, and the flexible film is made of a multilayer film containing polyethylene.

  Further, a lid body is provided on the flexible film, and the lid body is fixed to the screw hole.

  According to another aspect of the invention, a liquid ejecting head includes the pressure buffer device and a discharge unit that discharges the liquid supplied from the pressure buffer device.

  The liquid ejecting apparatus according to the aspect of the invention includes the liquid ejecting head, a moving mechanism that reciprocates the liquid ejecting head, a liquid supply pipe that supplies the liquid to the liquid ejecting head, and the liquid that is supplied to the liquid supply pipe. And a liquid tank.

  The method of manufacturing a pressure buffer device according to the present invention includes a recess forming step of forming a recess on one surface of a base and a screw hole opened on the upper end of the base, and a flexible film on the upper end of the recess. A flexible film installation step to be installed and a platen on which a convex part is formed in an area corresponding to the peripheral part of the opening end from the opening end of the concave part except for the periphery of the screw hole, and the convex part And a heat welding step of heat-welding by contacting the flexible film.

  Further, in the thermal welding step, the convex portion is in thermal contact with the flexible film so as to protrude inside the opening end.

  In the thermal welding step, the upper end corner of the convex portion corresponding to the outer edge of the peripheral portion is chamfered, and the upper end corner is flexible when the convex portion abuts on the flexible film. The surface of the conductive film is inclined to contact.

  The pressure buffer device of the present invention has a recess having a flat upper end surface around the periphery, a screw hole that opens to the upper end surface, a base that has a communication port that communicates with an external region on the inner surface of the recess, and is bonded to the upper end surface of the recess. And a flexible membrane that closes the opening of the recess. The flexible membrane and the upper end surface are joined except for the region around the screw hole that opens to the upper end surface. As a result, the base, the flexible film, or the adhesive melted in the screw hole opened in the upper end surface of the base does not flow in. Further, since the upper end surface of the recess is flat, the lid is placed on the upper side of the flexible film. When the screw is fixed to the base, the base is not deformed, and it is possible to prevent the base from being cracked.

It is explanatory drawing of the pressure buffer apparatus which concerns on 1st embodiment in this invention. It is explanatory drawing of the pressure buffer apparatus which concerns on 2nd embodiment in this invention. It is explanatory drawing of the pressure buffer apparatus which concerns on 3rd embodiment of this invention. It is a figure for demonstrating the manufacturing method of the pressure buffer apparatus which concerns on 4th embodiment to this invention. It is a figure for demonstrating the manufacturing method of the pressure buffer apparatus which concerns on 5th embodiment of this invention. It is a figure for demonstrating the manufacturing method of the pressure buffer apparatus which concerns on 6th embodiment of this invention. FIG. 10 is a configuration diagram of a liquid jet head according to a seventh embodiment of the present invention. FIG. 10 is a schematic perspective view of a liquid ejecting apparatus according to an eighth embodiment of the present invention. It is a schematic diagram of the conventionally well-known inkjet head and the pressure buffering apparatus installed on it. Sectional drawing of a conventionally well-known pressure buffer apparatus is represented. It is explanatory drawing of a conventionally well-known pressure buffer apparatus.

(First embodiment)
FIG. 1 is an explanatory view of a pressure buffer device 1 according to a first embodiment of the present invention, and FIG. 1 (a) is a schematic plan view of a substrate 5 from which a flexible film 4 of the pressure buffer device 1 is removed. FIG.1 (b) is a cross-sectional schematic diagram of the part AA. The pressure buffer device 1 includes a base 5 and a flexible film 4 bonded to the upper end surface TS of the base 5. The base body 5 has a concave portion 2 having a flat upper end surface TS, a screw hole 22 that opens to the upper end surface, an inflow communication port 3a that opens to the inner surface of the concave portion 2 and flows in the liquid, and an outflow that flows out of the liquid. And a communication port 3b. The flexible film 4 is bonded to the upper end surface TS of the recess 2 and closes the opening of the recess 2. The flexible membrane 4 and the upper end surface TS are joined except for the region around the screw hole 22. That is, the periphery of the opening where the screw hole 22 opens is a non-bonding region 13 where the flexible film 4 and the upper end surface TS are not bonded, and the other bonding region where the flexible film 4 and the upper end surface TS are bonded. 12.

  The flexible film 4 and the upper end surface TS of the recess 2 can be joined by heat welding. In this case, since the periphery of the screw hole 22 is the non-bonding region 13, the base 5 melted by heat welding does not flow into the opening of the screw hole 22. Further, since the upper end surface TS of the concave portion 2 is flat, there is no gap between the upper end surface TS and the lid body sandwiching the flexible film 4 when screwing a not-shown lid body to the base 5 through the screw holes 22. In addition, since the gap is small, the bending stress applied to the base body 5 when the screws are fixed is eliminated or reduced, and the base body 5 is not cracked.

  In addition, a metal material, glass, ceramics, other inorganic materials, synthetic resin materials, etc. can be used for the base | substrate 5. FIG. As the flexible film 4, a metal material, a synthetic resin material, or the like can be used. For example, polyethylene can be used as the substrate 5 and the flexible film 4 can be composed of a multilayer film containing polyethylene. If polyethylene is used, the substrate 5 and the flexible film 4 can be thermally welded at a temperature of approximately 150 ° C. Further, instead of heat welding, the flexible film 4 and the upper end surface TS of the substrate 5 can be joined by an adhesive. In this case, since the region around the screw hole 22 is the non-bonding region 13 without the adhesive, the adhesive does not flow into the screw hole 22.

(Second embodiment)
FIG. 2 is an explanatory view of the pressure buffering device 1 according to the second embodiment of the present invention, and FIG. 2A is a schematic plan view of the base 5 from which the flexible film 4 of the pressure buffering device 1 is removed. FIG. 2B is a schematic cross-sectional view of the portion BB. The difference from the first embodiment is that the joining region 12 is only a region near the opening end KT of the upper end surface TS, and the other portions are the same as in the first embodiment. Therefore, a different part from 1st embodiment is demonstrated below and description is abbreviate | omitted about the same part. The same reference numerals are assigned to the same parts or parts having the same function.

  As shown in FIGS. 2A and 2B, the flexible film 4 and the upper end surface TS of the concave portion 2 are joint regions 12 that are joined by thermal welding from the opening end KT of the concave portion 2 to the periphery thereof, The other region of the upper end surface TS is a non-joined region 13 that is not thermally welded. Since the opening portion of the screw hole 22 is included in the non-joining region 13, the base 5 and the flexible film 4 that are melted at the time of heat welding do not flow into the screw hole 22. Since the upper end surface TS of the recess 2 is flat, the bending stress applied to the base 5 when a lid (not shown) is screwed to the base 5 through the screw hole 22 is sufficiently small, so that the base 5 is cracked. There is nothing to do. Further, since only the bonding region 12 in the vicinity of the opening end KT has to be bonded, the bonding time can be shortened.

(Third embodiment)
FIG. 3 is an explanatory view of the pressure buffering device 1 according to the third embodiment of the present invention. FIG. 3A is a plan view of the base body 5 from which the flexible film 4 and the lid 6 of the pressure buffering device 1 are removed. FIG. 3B is a schematic cross-sectional view of the portion CC of the pressure buffer 1, and FIG. 3C is a cross-sectional schematic view of the lid 6 screwed on the flexible film 4. is there. The same portions or portions having the same function are denoted by the same reference numerals.

  The pressure buffer device 1 includes a base 5 having a recess 2, a flexible film 4 that is bonded to the upper end surface TS of the recess 2 and closes the opening of the recess 2, and a lid that is installed on the flexible film 4. 6. The base body 5 includes a recess 2, a screw hole 22 that opens in the upper end surface TS of the recess 2, an inflow communication port 3 a and an outflow communication port 3 b that communicate with the bottom surface BS or the inner surface SS that is the inner surface of the recess 2 and the outer region. Have The flexible film 4 is bonded to the upper end surface TS of the recess 2 and closes the opening of the recess 2. The lid 6 is screwed and fixed to the base body 5 with a flexible film 4 sandwiched by screws (not shown) inserted into the screw holes 22.

  This will be described more specifically. The recess 2 includes a chamber 15 that holds the liquid flowing in from the inflow communication port 3 a and a flow path 11 that guides the liquid flowing out from the chamber 15 to the outflow port 17. The upper end surface TS of the concave portion 2 has a flat surface, a bonding region 12 where the flexible film 4 and the upper end surface TS are heat-welded from the opening end KT of the opening of the concave portion 2 to the periphery thereof, and the flexibility The film 4 and the non-joining region 13 where the upper end surface TS is not thermally welded are provided, and the screw hole 22 opens into the non-joining region 13.

  The recess 2 is installed on the bottom surface BS of the chamber 15 and houses a spring member 9 that biases the flexible membrane 4 upward. The base 5 includes an inflow connection portion 7a through which liquid flows into the outer surface GS from the outside and an outflow connection portion 7b through which liquid flows out. The inflow connection portion 7 a communicates with an inflow communication port 3 a formed in the bottom surface BS of the recess 2. The outflow connection portion 7 b communicates with the bottom surface BS of the recess 2, that is, the outflow port 17 formed in the bottom surface BS of the flow path 11, and the flow path 11 communicates with the outflow communication port 3 b that opens to the chamber 15.

  The liquid flows into the chamber 15 from the inflow connection portion 7a through the inflow communication port 3a, and flows out from the outflow connection portion 7b through the outflow communication port 3b and the flow path 11. A plate spring is used as the spring member 9. The hole provided at the end of the leaf spring is fitted into the protrusion 16 provided on the bottom surface BS of the recess 2, and the spring member 9 is engaged with the base 5. The upper end surface of the spring member 9 is in contact with the flexible membrane 4, and even when the chamber 15 has a large negative pressure, the flexible membrane 4 is adsorbed to the bottom surface BS and the inflow communication port 3 a and the outflow communication port 3 b are blocked. Prevent peeling. The lid 6 suppresses the expansion of the flexible film 4 when the chamber 15 becomes a large positive pressure, and prevents the flexible film 4 from rupturing. When pressure fluctuation occurs in the liquid filled in the chamber 15, the flexible film 4 expands and contracts and is displaced in the y direction (FIG. 3A), thereby relaxing the liquid pressure fluctuation.

  In FIG. 3A, if the pressure buffering device 1 is erected with the upper side of the base 5 facing upward (+ z direction) with respect to the gravity g and the lower side facing downward (−z direction) with respect to the gravity g, Bubbles mixed in the liquid gather above the chamber 15. Therefore, the bubbles mixed in the liquid can be easily discharged from the flow path 11, and liquid replacement and cleaning are facilitated.

  In the present embodiment, polyethylene is used as the base 5, a film having a two-layer structure of polyethylene and nylon is used as the flexible film 4, and the base 5 and the flexible film 4 are heat-welded with polyethylene. The lid 6 uses a metal material. Note that the present invention is not limited to these materials.

  In the present embodiment, the flexible film 4 and the upper end surface TS of the recess 2 are thermally welded in the joining region 12 and are not thermally welded in the non-joining region 13 where the screw holes 22 are opened. Therefore, no burr is formed at the opening of the screw hole 22 during heat welding. Further, since the upper end surface TS is flat, the bending stress applied to the base 5 is sufficiently small when the lid 6 is fixed to the base 5 with screws, and the base 5 does not crack.

(Fourth embodiment)
FIG. 4 is a diagram for explaining a method of manufacturing the pressure damper 1 according to the fourth embodiment of the present invention. The same portions or portions having the same function are denoted by the same reference numerals.

  FIG. 4A is a schematic cross-sectional view of the substrate 5 formed by the recess forming process. In the recess forming step, the base material is molded to form the recess 2 and the screw hole 22. The upper end surface TS around the recess 2 is formed flat. Next, in the flexible film installation step, the flexible film 4 is placed on the upper end surface TS of the recess 2. In this embodiment, polyethylene resin is used as the base material, but the present invention is not limited to this material.

  FIG. 4B is a schematic cross-sectional view illustrating a state in which the flexible film 4 and the substrate 5 are thermally welded in the heat welding process. The surface plate 18 includes a convex portion 19 in an area corresponding to the peripheral portion of the opening end KT from the opening end KT of the concave portion 2 except for the periphery of the screw hole 22. The base plate 18 is heated in advance, the convex portion 19 is aligned with the concave portion 2, the base plate 18 is relatively lowered, and the convex portion 19 is brought into contact with the upper surface of the flexible film 4, thereby TS and the flexible film 4 are heat-welded. As a result, only the joining region 12 from the opening end KT of the recess 2 to the peripheral portion of the opening end KT is thermally welded to the flexible film 4 and the upper end surface TS of the base body 5. The non-bonding region 13 including the periphery is not thermally welded.

  FIG. 4C is a schematic cross-sectional view of the pressure buffer device 1 in which the lid body 6 is fixed to the base body 5 in the lid body attaching step. The lid body 6 is placed on the flexible film 4, and screws 23 are inserted into the screw holes 22 to fix the lid body 6 to the base 5 with screws.

  As a result, the resin melted into the screw hole 22 does not flow and burr is not formed, and since the upper end surface TS is flat, even if the lid body 6 is screwed to the base body 5, the stress applied to the base body 5 is sufficiently small. No cracks are generated in the substrate 5. Moreover, since only the peripheral part of the opening end KT from the opening end KT of the concave portion 2 is thermally welded, the heat capacity is small and the heat welding can be performed in a short time. Furthermore, since the area of the joining region 12 can be reduced with respect to the entire upper end surface TS, warpage and thickness unevenness due to heat of the base body 5 are reduced, and the cover body 6 is added to the base body 5 when fixed to the base body 5 with screws. The stress can be further reduced.

(Fifth embodiment)
FIG. 5 is a schematic cross-sectional view of a portion R (FIG. 4B) for describing a method for manufacturing the pressure damper 1 according to the fifth embodiment of the present invention. As shown in FIG. 5, in the heat welding step, the convex portion 19 of the surface plate 18 abuts on the flexible film 4 and is thermally welded so that the distance Δd protrudes inside the opening end KT. The flexible film 4 is welded to the position of the inner surface SS, that is, to the open end KT. Pressure fluctuation is transmitted to the liquid filled in the chamber 15, and the flexible film 4 fluctuates up and down based on this pressure fluctuation. However, the flexible film 4 is flexibly welded to the opening end KT. The peel strength of the conductive film 4 against this vertical movement can be improved.

(Sixth embodiment)
FIG. 6 is a diagram for explaining a method of manufacturing the pressure damper 1 according to the sixth embodiment of the present invention. 6A is a schematic cross-sectional view of the portion R (FIG. 4B), FIG. 6B is a schematic cross-sectional view of the portion R after heat welding, and FIG. It is a cross-sectional schematic diagram of the part R when it heat-welds without forming chamfering in 24. As shown in FIG. 6A, the outer edge of the peripheral portion of the opening end KT, that is, the upper end corner 24 of the convex portion 19 corresponding to the outer edge of the joining region 12 is chamfered, and the upper end corner 24 is acceptable in the heat welding process. The surface of the flexible film 4 is in contact with the inclined surface.

  As a result, as shown in FIG. 6B, after the thermal welding, the fusion burr 25 formed on the upper end surface TS has an inclined structure, and its height is h1. On the other hand, as shown in FIG. 6C, when the upper end corner 24 is thermally welded without chamfering the upper end corner 24, the molten burr 25 formed on the upper end corner 24 of the convex portion 19 is more than h1. It becomes high h2. That is, the height of the molten burr 25 can be reduced by chamfering the upper end corner 24. As a result, when the lid 6 is fixed to the base 5 with screws, the gap between the lid 6 or the flexible film 4 and the base 5 is reduced, and when the lid 6 is fixed to the base 5 with screws. In addition, the bending stress applied to the base 5 can be reduced, and the occurrence of cracks in the base 5 can be prevented.

(Seventh embodiment)
FIG. 7 is a configuration diagram of the liquid jet head 10 according to the seventh embodiment of the present invention. The same portions or portions having the same function are denoted by the same reference numerals.

  As shown in FIG. 7, the liquid jet head 10 includes a pressure buffer device 1, a head chip 20, and a fixing member 21 for fixing the head chip 20. The liquid jet head 10 is erected with the pressure buffer 1 upward and the head chip 20 downward with respect to the direction of gravity g. In the pressure buffer device 1, liquid flows in from an inflow connection portion 7 a fixed above the base 5, and liquid with reduced pressure fluctuation flows out from the outflow connection portion 7 b and is supplied to the head chip 20. The head chip 20 discharges droplets downward from a number of nozzles (not shown) and records on a recording medium (not shown). Although the pressure buffer device 1 used in the third embodiment is used, the pressure buffer device 1 of the first or second embodiment can be used.

(Eighth embodiment)
FIG. 8 is a schematic perspective view of the liquid ejecting apparatus 30 according to the eighth embodiment of the present invention. The liquid ejecting apparatus 30 includes a moving mechanism 40 that reciprocates the liquid ejecting heads 10 and 10 ′, flow path portions 35 and 35 ′ that supply liquid to the liquid ejecting heads 10 and 10 ′, and flow path portions 35 and 35 ′. Liquid pumps 33 and 33 'for supplying liquid to the liquid tanks and liquid tanks 34 and 34'. Each liquid ejecting head 10, 10 ′ includes a plurality of ejection grooves, and ejects liquid droplets from nozzles communicating with the ejection grooves. The liquid ejecting heads 10 and 10 ′ use the liquid ejecting heads described in the seventh embodiment.

  The liquid ejecting apparatus 30 includes a pair of conveying units 41 and 42 that convey a recording medium 44 such as paper in the main scanning direction, liquid ejecting heads 10 and 10 ′ that eject liquid onto the recording medium 44, and a liquid ejecting head. 10 and 10 ′, liquid pumps 33 and 33 ′ for supplying the liquid stored in the liquid tanks 34 and 34 ′ to the flow path sections 35 and 35 ′, and the liquid jet heads 10 and 10 ′. And a moving mechanism 40 that scans 10 ′ in the sub-scanning direction orthogonal to the main scanning direction. A control unit (not shown) controls and drives the liquid ejecting heads 10 and 10 ′, the moving mechanism 40, and the transporting units 41 and 42.

  The pair of conveying means 41 and 42 includes a grid roller and a pinch roller that extend in the sub-scanning direction and rotate while contacting the roller surface. A grid roller and a pinch roller are moved around the axis by a motor (not shown), and the recording medium 44 sandwiched between the rollers is conveyed in the main scanning direction. The moving mechanism 40 couples a pair of guide rails 36 and 37 extending in the sub-scanning direction, a carriage unit 43 slidable along the pair of guide rails 36 and 37, and the carriage unit 43 to move in the sub-scanning direction. An endless belt 38 is provided, and a motor 39 that rotates the endless belt 38 via a pulley (not shown) is provided.

  The carriage unit 43 mounts a plurality of liquid jet heads 10 and 10 ′, and discharges four types of liquid droplets, for example, yellow, magenta, cyan, and black. The liquid tanks 34 and 34 'store liquids of corresponding colors and supply them to the liquid jet heads 10 and 10' via the liquid pumps 33 and 33 'and the flow path portions 35 and 35'. Each liquid ejecting head 10, 10 ′ ejects droplets of each color according to the drive signal. An arbitrary pattern is recorded on the recording medium 44 by controlling the timing of ejecting the liquid from the liquid ejecting heads 10, 10 ′, the rotation of the motor 39 that drives the carriage unit 43, and the conveyance speed of the recording medium 44. I can.

DESCRIPTION OF SYMBOLS 1 Pressure buffer 2 Recessed part 3a Inflow communication port, 3b Outflow communication port 4 Flexible membrane 5 Base body 6 Lid body 7a Inflow connection part, 7b Outflow connection part 9 Spring member 10 Liquid jet head 11 Channel 11
12 Joining region 13 Non-joining region 15 Chamber 17 Outlet 18 Surface plate 19 Protruding part 20 Head chip 30 Liquid ejecting apparatus TS Upper end surface KT Open end

Claims (9)

A base having a recess having a flat upper end surface, a screw hole opening in the upper end surface, and a communication port communicating with an external region on the inner surface of the recess;
A flexible membrane bonded to the upper end surface and closing the opening of the recess,
The flexible film and the upper end surface are pressure buffering devices that are joined except for a region around the screw hole.   2. The pressure buffering device according to claim 1, wherein the flexible film and the upper end surface are joined by heat welding from an opening end of the concave portion to a peripheral portion of the opening end.   The pressure buffering device according to claim 1 or 2, wherein the base is made of polyethylene, and the flexible film is made of a multilayer film containing polyethylene. A lid installed on top of the flexible membrane;
The pressure buffer according to claim 1, wherein the lid is fixed to the screw hole. A pressure damper according to claim 1;
A liquid ejecting head comprising: a discharge unit that discharges the liquid supplied from the pressure buffering device. A liquid jet head according to claim 5;
A moving mechanism for reciprocating the liquid jet head;
A liquid supply pipe for supplying a liquid to the liquid ejecting head;
And a liquid tank that supplies the liquid to the liquid supply pipe. A recess forming step of forming a recess on one surface of the base and a screw hole opened on the upper end surface of the base;
A flexible membrane installation step of installing a flexible membrane on the upper end surface;
Except for the periphery of the screw hole, a platen having a convex portion formed in an area corresponding to the peripheral portion of the open end is heated from the open end of the concave portion, and the convex portion is brought into contact with the flexible film. And a heat welding step for heat welding.   The manufacturing method of the pressure buffering device according to claim 7, wherein, in the thermal welding step, the convex portion comes into contact with the flexible film so as to protrude from the inside of the opening end and is thermally welded.   In the thermal welding step, the upper end corner of the convex portion corresponding to the outer edge of the peripheral portion is chamfered, and the upper end corner is the flexible membrane when the convex portion comes into contact with the flexible membrane. The manufacturing method of the pressure buffering apparatus of Claim 7 or 8 which inclines and contacts with the surface of this.

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