JP2013153061A - Laser annealing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser annealing device that is capable of suppressing a reduction in manufacturing yield.SOLUTION: A laser annealing device includes: a cylindrical enclosure that surrounds an optical path between a laser device, which emits a pulse laser beam, and an anneal chamber provided with a stage on which a processing substrate is placed; a lens that gives a predetermined optical characteristic to the pulse laser beam; and a lens holder that holds the lens and is fixed inside the enclosure, wherein the lens holder includes a first frame body that is formed in a rectangular frame shape including a first lower frame positioned in a gravity direction and to which the lens is attached, a second frame body that includes a second lower frame that is formed in a rectangular frame shape surrounding the outside of the first frame body, is positioned in the gravity direction with respect to the first lower frame, and in which a female thread is formed, a connection member that connects the first frame body and the second frame body to each other, and a spindle member that includes a male thread rotatable with respect to the female thread of the second lower frame, contacts the first lower frame, and is capable of pushing up the first frame body in an antigravity direction.

Description

  Embodiments described herein relate generally to a laser annealing apparatus.

  2. Description of the Related Art Flat display devices such as liquid crystal display devices and organic electroluminescence display devices are used in various fields by taking advantage of their characteristics. In such a flat display device, a thin film transistor (TFT) including a polysilicon semiconductor layer is beginning to be applied as a switching element of each pixel.

  Such a polysilicon semiconductor layer can be formed by an excimer laser annealing (ELA) method in which a laser beam is pulse-irradiated from an excimer laser device toward amorphous silicon formed on an insulating substrate. In such an excimer laser annealing method, it is required to stably form polysilicon over the entire area.

JP 2000-208850 A JP 2001-338893 A JP 2003-59830 A

  An object of the present embodiment is to provide a laser annealing apparatus capable of suppressing a decrease in manufacturing yield.

According to this embodiment,
A laser apparatus that emits a pulsed laser beam; an annealing chamber that includes a stage on which a processing substrate on which an amorphous silicon thin film is formed; and a cylindrical casing that surrounds an optical path between the laser apparatus and the annealing chamber. A body, a reflecting mirror that is fixed in the casing and guides the pulse laser beam emitted from the laser device to the annealing chamber, a lens that imparts predetermined optical characteristics to the pulse laser beam, and the lens And an optical module including a lens holder fixed in the housing, and the lens holder is formed in a rectangular frame shape including a first lower frame located in the gravitational direction, and the lens is attached to the optical module. A first frame and a rectangular frame that surrounds the outside of the first frame and are positioned in the direction of gravity with respect to the first lower frame. A second frame including a lower frame and having a female screw formed on the second lower frame; a connecting member connecting the first frame and the second frame; and the female screw of the second lower frame And a spindle member that has a male screw rotatable relative to the first lower frame and can push up the first frame in the anti-gravity direction. Is done.

According to this embodiment,
A laser device, an annealing chamber, and an optical module that is installed between the laser device and the annealing chamber and includes a lens and a lens holder that holds the lens and is fixed in a housing of the optical module. In the annealing apparatus, the lens holder includes a first lower frame positioned in a gravitational direction, a first upper frame positioned above the first lower frame, and the first lower frame and the first upper frame. A first frame to which the lens is attached, a second lower frame positioned in the direction of gravity with respect to the first lower frame, and a second lower frame. A second upper frame positioned above and outside the first upper frame; and a second vertical frame connecting the second lower frame and the second upper frame and positioned outside the first vertical frame. A rectangular frame is formed, and the second lower frame is A second frame in which a female screw and a second female screw are formed, a first elastic member connecting the first lower frame and the second lower frame, and a midway portion thereof are fixed to the second vertical frame. And a second elastic member having one end fixed to the first lower frame and the other end fixed to the first upper frame, and a second elastic member rotatable with respect to the first female screw of the second lower frame. A first spindle member having one male screw, and a second spindle member having a second male screw rotatable with respect to the second female screw of the second lower frame, the first spindle member and the A laser annealing apparatus is provided, wherein the second spindle member is configured to be able to adjust the position of the lens held on the first frame by contacting the first lower frame.

FIG. 1 is a diagram schematically showing the configuration of the laser annealing apparatus of the present embodiment. FIG. 2 is a front view of a lens holder applicable to the laser annealing apparatus shown in FIG. FIG. 3 is a front view of the lens holder 30 of the comparative example.

  Hereinafter, the present embodiment will be described in detail with reference to the drawings. In each figure, the same reference numerals are given to components that exhibit the same or similar functions, and duplicate descriptions are omitted.

  FIG. 1 is a diagram schematically showing the configuration of the laser annealing apparatus of the present embodiment.

  That is, the laser annealing apparatus includes a laser apparatus 10, an optical module 20, an annealing chamber 40, and the like. The laser device 10 includes an excimer laser oscillator 11 that emits a pulse laser beam having an ultraviolet wavelength. The annealing chamber 40 includes a stage 41 on which a processing substrate SUB on which an amorphous silicon thin film is formed is placed. The stage 41 is movable in two directions or a rotation direction orthogonal to each other in a plane parallel to the processing substrate SUB. The optical module 20 includes a housing 21, a plurality of reflecting mirrors 22, a plurality of lenses 23, a lens holder 30, and the like.

  The casing 21 is formed in a cylindrical shape surrounding the optical path between the laser device 10 and the annealing chamber 40. A first window 21 </ b> A that captures a pulsed laser beam emitted from the laser device 10 is provided on the side of the housing 21 that faces the laser device 10. A second window 21 </ b> B that emits a laser beam toward the annealing chamber 40 is provided on the side of the housing 21 that faces the annealing chamber 40. Further, a door 21 </ b> C positioned on the side of the lens holder 30 is provided on the side surface of the housing 21.

  The reflecting mirror 22 mainly guides a pulsed laser beam emitted from the laser device 10 to the annealing chamber 40 and is fixed in the housing 21. Such a reflecting mirror 22 includes, for example, a reflecting mirror 22A that reflects the pulse laser beam captured from the first window 21A upward, and a reflecting mirror 22B that bends the optical path of the pulse laser beam reflected by the reflecting mirror 22A. , A reflecting mirror 22C for reflecting the pulse laser beam reflected by the reflecting mirror 22B toward the second window 21B below is included. The optical module 20 may be included as the reflecting mirror 22 other than the illustrated one.

  The lens 23 is disposed in an optical path between the first window 21A and the second window 21B, and imparts predetermined optical characteristics to the pulse laser beam. The lens 23 has a desired beam profile. A beam shaping optical system for shaping is formed. For example, the pulse laser beam that has passed through each lens 23 is diverged, focused, or collimated. Then, the pulse laser beam that has passed through the plurality of lenses 23 is shaped so as to have a desired beam profile, for example, a laterally long rectangular outer shape in a plane orthogonal to the beam traveling direction. The optical module 20 may be included as the lens 23 other than the lens 23 shown in the figure.

  The lens holder 30 holds the lens 23 and is fixed in the housing 21. A more detailed structure of the lens holder 30 that holds the plurality of lenses 23 positioned between the reflecting mirror 22B and the reflecting mirror 22C will be described below.

  FIG. 2 is a front view of a lens holder 30 applicable to the laser annealing apparatus shown in FIG. Here, the horizontal direction is the first direction X, the vertical direction or the height direction is the second direction Y, and the beam traveling direction is the third direction Z. The XY plane is orthogonal to the beam traveling direction Z. The front view in is shown. The direction of gravity corresponds to a downward direction along the second direction Y.

  That is, the lens holder 30 includes a first frame 31, a second frame 32, a connection member 33, a spindle member 34, and the like. In addition, the broken line in a figure has shown the external shape of the lens 23 hold | maintained, and the length along the 1st direction X is longer than the length along the 2nd direction Y in the lens 23 on the XY plane. It has a long rectangular shape.

  The first frame 31 is formed in a rectangular frame shape. That is, the first frame 31 has a lower frame 31A positioned in the direction of gravity, an upper frame 31B positioned above the lower frame 31A, and a pair of vertical frames 31C and 31D that connect the lower frame 31A and the upper frame 31B. Yes. The lower frame 31A and the upper frame 31B extend along the first direction X, respectively. The vertical frames 31C and 31D extend along the second direction Y, respectively. In such a first frame 31, the length along the first direction X of the lower frame 31A and the upper frame 31B (the length in the width direction of the first frame 31) is the second direction of the vertical frames 31C and 31D. It is a horizontally long shape longer than the length along Y (the length of the first frame 31 in the height direction). Inside the first frame 31, a rectangular opening AP whose length along the first direction X is longer than the length along the second direction Y is formed. The lens 23 is attached to the first frame body 31 so as to close the opening AP. At this time, the lens 23 is fixed to the first frame 31 by a fixing member such as a leaf spring.

  The second frame 32 is formed in a rectangular frame shape surrounding the outside of the first frame 31. That is, the first frame 31 includes a lower frame 32A positioned in the gravity direction with respect to the lower frame 31A, an upper frame 32B positioned above the lower frame 32A, a pair of vertical frames 32C that connect the lower frame 32A and the upper frame 32B. And 32D. The lower frame 32A and the upper frame 32B extend along the first direction X, and are longer than the lower frame 31A and the upper frame 31B. The vertical frames 32C and 32D extend along the second direction Y, respectively, and are longer than the vertical frames 31C and 31D.

  The lower frame 32A is located outside the lower frame 31A and is separated from the lower frame 31A. The upper frame 32B is located outside the upper frame 31B and is separated from the upper frame 31B. The vertical frame 32C is located outside the vertical frame 31C and is separated from the vertical frame 31C. The vertical frame 32D is located outside the vertical frame 31D and is separated from the vertical frame 31D. In such a second frame 32, the length along the first direction X of the lower frame 32A and the upper frame 32B (the length in the width direction of the second frame 32) is the second direction of the vertical frames 32C and 32D. It is a horizontally long shape longer than the length along Y (the length of the second frame 32 in the height direction).

  In addition, a plurality of female screws arranged in the first direction X are formed on the lower frame 32A of the second frame body 32. In the illustrated example, a female screw 32E is formed on the vertical frame 32C side of the lower frame 32A, and a female screw 32F is formed on the vertical frame 32D side of the lower frame 32A. The female screw 32E and the female screw 32F are formed and penetrated along the second direction Y. Furthermore, the internal thread 32G is also formed in the vertical frame 32D of the second frame. The female screw 32G is formed and penetrates along the first direction X.

  The connection member 33 is a member that connects the first frame body 31 and the second frame body 32. Such a connection member 33 is configured by an elastic member having elasticity. A spring 33A, which is one of the connection members 33, is installed in the vicinity of the female screw 32E and in the vicinity of the female screw 32F, and connects the lower frame 31A and the lower frame 32A. These springs 33 </ b> A are given a tension that lowers the lower frame 31 </ b> A in the direction of gravity.

  Further, the leaf spring 33B, which is one of the connection members 33, has an intermediate portion fixed to the vertical frame 32C, one end portion fixed to the lower frame 31A, and the other end portion fixed to the upper frame 31B. . Further, the leaf spring 33C, which is one of the connection members 33, has an intermediate portion fixed to the vertical frame 32D, one end portion fixed to the lower frame 31A, and the other end portion fixed to the upper frame 31B. . With such a connection member 33, the first frame 31 is connected to the second frame 32 with a gap between the first frame 31 and the second frame 32 and with elasticity.

  As the spindle member 34, a micrometer can be applied. Such a spindle member 34 includes a spindle member 34A having a male screw rotatable with respect to the female screw 32E of the lower frame 32A, and a spindle member 34B having a male screw rotatable with respect to the female screw 32F of the lower frame 32A. , And a spindle member 34C having a male screw rotatable with respect to the female screw 32G of the vertical frame 32D.

  The spindle member 34A and the spindle member 34B can contact the lower frame 31A of the first frame body 31 to push up the first frame body 31 in the antigravity direction. For example, when the spindle member 34A is pushed upward along the second direction Y while rotating forward with respect to the female screw 32E, the spindle member 34A comes into contact with the lower frame 31A of the first frame body 31 and contacts the first frame body 31. Push up in the antigravity direction. When the spindle member 34A is pulled back downward along the second direction Y while rotating in reverse with respect to the female screw 32E, the first frame body 31 is pulled down in the direction of gravity. The same applies to the spindle member 34B.

  That is, the spindle member 34A and the spindle member 34B can move the first frame 31 (or the lens 23) along the second direction Y, respectively, and are used for position adjustment in the second direction Y. . Further, the spindle member 34A and the spindle member 34B can also rotate and move the first frame 31 (or the lens 23) in the XY plane, respectively, in the rotational direction in the XY plane. Also used for position adjustment.

  The spindle member 34 </ b> C is provided at a position facing the door 21 </ b> C of the housing 21. The spindle member 34 </ b> C can contact the vertical frame 31 </ b> D of the first frame 31 to shift the first frame 31 in the first direction X. For example, when the spindle member 34C is pushed toward the left side in the drawing along the first direction X while rotating forward with respect to the female screw 32G, the spindle member 34C comes into contact with the vertical frame 31D of the first frame 31 and first The frame body 31 is shifted to the left along the first direction X. When the spindle member 34C is pulled back toward the right side in the drawing along the first direction X while rotating backward with respect to the female screw 32G, the first frame body 31 is moved to the right side along the first direction X. Shift. That is, the spindle member 34 </ b> C can move the first frame 31 (or the lens 23) along the first direction X, and is used for position adjustment in the first direction X.

  Such a lens holder 30 is fixed to the housing 21 by a support column 35 extending in the direction of gravity from the lower frame 32A of the second frame 32.

  In the laser annealing apparatus having such a configuration, adjustment of the pulse laser beam is performed as follows. That is, the laser device 10 emits a pulsed laser beam set to a relatively low output. In the optical module 20, the position of the lens 23 is adjusted by the worker using the spindle members 34 </ b> A to 34 </ b> C with the door 21 </ b> C of the housing 21 opened.

  At this time, the operator adjusts the position of the lens 23 in the height direction (second direction Y) by operating the spindle member 34A and the spindle member 34B, and also balances the push-up by the spindle member 34A and the spindle member 34B. Thus, the position of the lens 23 in the rotational direction within the XY plane is adjusted. The worker adjusts the position of the lens 23 in the horizontal direction (first direction X) by operating the spindle member 34C.

  By such an operation, the position of the lens 23 is adjusted, and the optical axis and beam profile of the pulse laser beam are adjusted.

  According to such a laser annealing apparatus, the processing substrate SUB on which the amorphous silicon thin film has been formed is placed on the stage 41 of the annealing chamber 40, and the stage 41 is operated to adjust the position of the processing substrate SUB, and then the laser A pulse laser beam set at a relatively high output is emitted from the apparatus 10.

  The pulse laser beam emitted from the laser device 10 is guided to the annealing chamber 40 through the optical module 20 and is irradiated onto the processing substrate SUB. As a result, amorphous silicon grows and polysilicon is formed. The processing substrate SUB formed with such polysilicon is then patterned according to the shape of the thin film transistor provided for each pixel. Then, an array substrate for a flat display device such as a liquid crystal display device is manufactured using such a processing substrate SUB.

  FIG. 3 is a front view of the lens holder 30 of the comparative example. The same components as those in the configuration example shown in FIG. 2 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the comparative example shown in FIG. 3, the spindle member 34 </ b> A and the spindle member 34 </ b> B are attached to the upper frame 32 </ b> B of the second frame 32, respectively, compared to the configuration example shown in FIG. 2. The first frame 31 is configured to be pressed down in the direction of gravity in contact with the frame 31B, and is different in that the spring 33A connects the upper frame 31B and the upper frame 32B.

  In the lens holder 30 of such a comparative example, the first frame 31 is connected to the second frame 32 with a gap and elasticity with the second frame 32 by the spring 33A. Yes. The tension of the spring 33A is applied in the direction of pulling upward against gravity.

  In such a comparative example, when the position of the lens 23 is adjusted, the position of the lens 23 in the horizontal direction (first direction X) is adjusted by the spindle member 34C, while the lens 33 is pulled up in the antigravity direction by the spring 33A. The position of the lens 23 in the height direction (second direction Y) or the rotation direction in the XY plane is adjusted by pushing down the one frame 31 in the direction of gravity by the spindle member 34A and the spindle member 34B.

  However, when the weight of the lens itself increases with the increase in size of the lens 23, when the moment of the lens 23 is generated by the surrounding vibration, a force to cancel the moment generated in the lens 23 by the spring 33A is also necessary, and gravity is required. Easy to vibrate in the direction. Such vibration of the lens 23 becomes a factor that destabilizes the beam profile of the pulse laser beam applied to the processing substrate SUB. For this reason, it becomes difficult to form desired polysilicon. When the vibration of the lens 23 continues, it may be necessary to take measures such as interrupting the irradiation of the pulse laser beam to the processing substrate SUB.

  Further, when the laser annealing apparatus is enlarged, when adjusting the position of the lens 23, an operator needs to work at a high place in order to operate the spindle member 34A and the spindle member 34B located above the lens holder 30. There are dangers. Further, when the spindle member 34A and the spindle member 34B located above the lens holder 30 are operated, there is a possibility that particles dropped from an operator's arm or hand may adhere to the lens 23.

  On the other hand, according to the present embodiment, the spindle member 34A and the spindle member 34B are respectively attached to the lower frame 32A of the second frame body 32, and come into contact with the lower frame 31A of the first frame body 31 so that the first frame body 31 is attached. It is configured to push up in the anti-gravity direction. For this reason, the first frame 31 holding the lens 23 is held by the spindle member 34A and the spindle member 34B in the gravitational direction, and the vibration of the first frame 31 in the gravitational direction can be suppressed. It becomes. Further, even when the lens 23 and the first frame 31 are increased in size due to an increase in the size of the device, the vibration is suppressed because they are held by the spindle member 34A and the spindle member 34B. Is possible.

  Further, the spring 33A connects the lower frame 31A and the lower frame 32A, and the tension of the spring 33A is applied in the direction of pulling down the first frame 31 in the direction of gravity. For this reason, when the gravity of the first frame 31 and the lens 23 is applied, a large tension is not applied to the spring 33A, and the force to cancel the moment generated in the lens 23 is not necessary. Accordingly, it is difficult for ambient vibration to propagate to the lens 23, and vibration of the lens 23 can be suppressed. As a result, the beam profile of the pulse laser beam applied to the processing substrate SUB is stabilized, and it is possible to suppress a decrease in manufacturing yield.

  Further, according to the present embodiment, even when the laser annealing apparatus is increased in size, the spindle member located below the lens holder 30 from the door 21 </ b> C provided on the side of the casing 21 of the optical module 20. 34A and the spindle member 34B can be operated, so that work at a high place can be reduced and the safety of workers can be ensured. Further, when adjusting the position of the lens 23, the spindle member 34A and the spindle member 34B located below the lens holder 30 are operated, so that even if particles fall from the arm or hand of the worker, it is difficult to adhere to the lens 23. It is possible to reduce the maintenance burden.

  As described above, according to the present embodiment, it is possible to provide a laser annealing apparatus that can suppress a decrease in manufacturing yield.

  In addition, although some embodiment of this invention was described, these embodiment is shown as an example and is not intending limiting the range of invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

DESCRIPTION OF SYMBOLS 10 ... Laser apparatus 20 ... Optical module 21 ... Housing 22 ... Reflector 23 ... Lens 30 ... Lens holder 31 ... 1st frame 32 ... 2nd frame 33 ... Connection member 34 ... Spindle member 40 ... Annealing chamber

Claims (7)

A laser device for emitting a pulsed laser beam;
An annealing chamber having a stage on which a processing substrate on which an amorphous silicon thin film is formed is placed;
A cylindrical housing enclosing an optical path between the laser device and the annealing chamber; a reflecting mirror fixed in the housing for guiding the pulse laser beam emitted from the laser device to the annealing chamber; and a pulse laser An optical module comprising: a lens that imparts predetermined optical characteristics to the beam; and a lens holder that holds the lens and is fixed in the housing.
The lens holder is formed in a rectangular frame shape including a first lower frame located in a gravitational direction, the first frame body to which the lens is attached, and the rectangular frame shape surrounding the outer side of the first frame body. A second frame including a second lower frame positioned in the direction of gravity with respect to the first lower frame and having a female screw formed on the second lower frame, and the first frame and the second frame are connected to each other. A connection member, and a spindle member that has a male screw that can rotate with respect to the female screw of the second lower frame, and that can contact the first lower frame and push up the first frame body in the antigravity direction; A laser annealing apparatus comprising:   The laser annealing apparatus according to claim 1, wherein the connection member includes an elastic member that connects the first lower frame and the second lower frame.   The laser annealing apparatus according to claim 1, wherein a plurality of the female screws are formed on the second lower frame, and the spindle member is provided for each of the female screws.   4. The laser annealing according to claim 1, wherein the first frame body and the second frame body have a shape in which a length in a width direction is longer than a length in a height direction. 5. apparatus.   The laser annealing apparatus according to claim 1, wherein the housing includes a door on a side of the lens holder. A laser device, an annealing chamber, and an optical module that is installed between the laser device and the annealing chamber and includes a lens and a lens holder that holds the lens and is fixed in a housing of the optical module. An annealing apparatus,
The lens holder is
In a rectangular frame shape including a first lower frame positioned in the direction of gravity, a first upper frame positioned above the first lower frame, and a first vertical frame connecting the first lower frame and the first upper frame. A first frame formed and to which the lens is attached;
A second lower frame positioned in a gravitational direction with respect to the first lower frame; a second upper frame positioned above the second lower frame and positioned outside the first upper frame; and the second lower frame And the second upper frame is connected to the second vertical frame, and the second lower frame is formed with a first female screw and a second female screw. A second frame,
A first elastic member connecting the first lower frame and the second lower frame;
A second elastic member having an intermediate portion fixed to the second vertical frame, one end portion fixed to the first lower frame, and the other end portion fixed to the first upper frame;
A first spindle member having a first male screw rotatable with respect to the first female screw of the second lower frame;
A second spindle member having a second male screw rotatable with respect to the second female screw of the second lower frame,
The laser annealing apparatus, wherein the first spindle member and the second spindle member are in contact with the first lower frame so that the position of the lens held by the first frame can be adjusted. A third female screw is formed on the second vertical frame of the second frame,
The laser annealing apparatus according to claim 6, further comprising a third spindle member having a third male screw rotatable with respect to the third female screw.

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