JP2013143219A - Lighting system, display device and television receiver - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology for suppressing luminance unevenness of a lighting system.SOLUTION: The lighting system 12 includes a light source 24, a light source substrate 25 which has a mounting surface 25a1 on which the light source 24 is mounted and a reflection layer 30 which is formed on the mounting surface 25a1 and reflects light from the light source 4, an optical lens 27 which is installed on the mounting surface 25a1 opposed to the light source 4 and transmits light from the light source 4, and an absorption layer 31 which is formed at least on the mounting surface 25a1 of the part opposed to the optical lens 27 and absorbs the light from the light source 4.

Description

  The present invention relates to a lighting device, a display device, and a television receiver.

  Liquid crystal panels are used in display devices such as televisions, mobile phones, and portable information terminals. The liquid crystal panel needs to use external light in order to display an image. Therefore, as shown in Patent Document 1, this type of display device includes an illumination device (a so-called backlight device) for supplying light to the liquid crystal panel in addition to the liquid crystal panel. This illuminating device is arranged on the back side of the liquid crystal panel, and is configured to irradiate light spread in a planar shape toward the back side of the liquid crystal panel.

  As the illuminating device, as disclosed in Patent Document 1, a device in which a light source is arranged on the back side of a liquid crystal panel (so-called direct type) is known. This type of lighting device mainly includes the light source, a box-shaped chassis that accommodates the light source and opens toward the back side of the liquid crystal panel, and is disposed so as to cover the opening and transmits light from the light source. However, an optical member that adjusts while adjusting, and a reflection sheet that is arranged so as to cover the inside of the chassis. As the light source, as disclosed in Patent Document 1, an LED (Light Emitting Diode) has been used in recent years. The LED is housed in the chassis in a state of being mounted on the LED substrate.

  On the LED substrate, as shown in Patent Document 1, an optical lens (a diffusion lens) is provided so as to cover the LED. Since the LED has a strong directivity (high), the light emitted from the LED has a high straightness. Therefore, the light emitted from the LED is supplied to the liquid crystal panel side in a state where it is diffused by transmitting through the optical lens. Some of the light emitted from the LED is reflected by an optical lens or the like and returns to the LED substrate side. Some of the light is reflected on the LED substrate, travels again toward the optical lens, and is emitted from the optical lens.

JP 2011-90977 A

  The function of the optical lens alone may not sufficiently diffuse the light emitted from the LED, which has been a problem. In such a case, in the light emitted from the illuminating device, luminance unevenness occurs in which the portion corresponding to the LED placement location becomes too brighter than the other portions, which is a problem.

  The objective of this invention is providing the technique which suppresses the brightness nonuniformity in an illuminating device.

  An illumination device according to the present invention includes a light source, a light source substrate having a light source, a mounting surface on which the light source is mounted, a reflective layer that is formed on the mounting surface and reflects light from the light source, and the light source. An optical lens that is provided on the mounting surface in an opposed state, transmits light from the light source, and is formed at least on the mounting surface in a portion facing the optical lens, and transmits light from the light source. An absorbing layer for absorbing. In the illumination device, at least the absorption layer that absorbs light from the light source is formed on the mounting surface of the optical substrate at a portion facing the optical lens. When the light emitted from the light source is reflected by the optical lens or the like and travels toward the absorption layer, the absorption layer absorbs the light. As a result, the light applied to the absorption layer is suppressed from entering the optical lens. Therefore, it is suppressed that the light emitted from the optical lens becomes excessive, and the occurrence of uneven brightness in the lighting device is suppressed.

  In the illuminating device, the reflective layer is formed on at least the mounting surface near the light source so as to surround the light source, and the optical lens faces the light source and the reflective layer near the light source, respectively. The absorption layer provided on the mounting surface may be formed in a form of being laminated at least on the reflection layer facing the optical lens. In the illuminating device, the reflective layer is formed on at least the mounting surface near the light source so as to surround the light source, and the optical lens faces the light source and the reflective layer near the light source, respectively. Provided on the mounting surface, the absorbing layer is formed so as to be laminated at least on the reflective layer facing the optical lens. Thus, if the said absorption layer is comprised in the form laminated | stacked on the said reflection layer at least, it will become easy to provide the said absorption layer in a predetermined location, and will become easy to manufacture the said illuminating device.

  In the lighting device, the absorption layer may be disposed on the mounting surface so as to surround the light source. In the illumination device, when the absorption layer is disposed on the mounting surface so as to surround the light source, the amount of light absorbed by the absorption layer is a circle centered on the light source. Non-uniformity in the circumferential direction is suppressed.

  In the lighting device, the absorption layer may be composed of a plurality of pattern portions. When the absorption layer includes a plurality of pattern portions, the light absorption amount in the absorption layer can be adjusted by appropriately setting the pattern portions.

  In the illuminating device, the pattern portion may have a dot shape, and a surface area of the pattern portion may gradually decrease in a direction away from the light source. When the pattern portion has a dot shape and its surface area gradually decreases in the direction away from the light source, the amount of light absorbed by the absorption layer decreases in the direction away from the light source. . That is, the closer to the light source, the more light is absorbed by the absorption layer. Therefore, excessive light emitted from the central portion of the optical lens is suppressed.

  In the illuminating device, the pattern portion may be formed in a dot shape, and an interval adjacent to each other in a circumferential direction centering on the light source may sequentially increase in a direction away from the light source. Good. When the pattern portion is formed in a dot shape and the interval between adjacent ones in the circumferential direction centering on the light source is sequentially increased in the direction away from the light source, the light absorbed by the absorption layer The amount decreases in the direction away from the light source. That is, the closer to the light source, the more light is absorbed by the absorption layer. Therefore, excessive light emitted from the central portion of the optical lens is suppressed.

  In the illuminating device, the pattern portion may have an annular shape centering on the light source, and a surface area of the pattern portion may gradually decrease in a direction away from the light source. A direction in which the amount of light absorbed by the absorption layer moves away from the light source when the pattern portion has an annular shape centered on the light source and the surface area gradually decreases in a direction away from the light source. Towards less. That is, the closer to the light source, the more light is absorbed by the absorption layer. Therefore, excessive light emitted from the central portion of the optical lens is suppressed.

  In the illumination device, the pattern portion may have a shape extending radially from the light source. When the pattern portion has a shape extending radially from the light source, the proportion of the absorbing layer on the mounting surface is gradually reduced in the direction away from the light source. That is, the amount of light absorbed by the absorption layer decreases in the direction away from the light source (in other words, the closer to the light source, the more light is absorbed by the absorption layer). . Therefore, excessive light emitted from the central portion of the optical lens is suppressed.

  The illumination device includes a reflection member that includes a sheet-like reflection portion that reflects light from the light source, and an opening that exposes the optical lens together with the light source. There may be.

  In the illuminating device, the optical lens may be a diffusing lens that emits light while diffusing light from the light source.

  In the illumination device, the absorbing layer may exhibit a black color.

  In the illuminating device, the absorption layer may sequentially have a light absorption rate that decreases in a direction away from the light source. As the light absorption rate of the absorption layer gradually decreases in the direction away from the light source, more light is absorbed by the absorption layer as it approaches the light source. Therefore, excessive light emitted from the central portion of the optical lens is suppressed.

  In the illumination device, the absorption layer may be formed over a wider range than a range facing the optical lens when the mounting surface is viewed in a plane.

  The display device according to the present invention includes the illumination device and a display panel that performs display using light from the illumination device.

  The television receiver which concerns on this invention is provided with the said display apparatus.

  ADVANTAGE OF THE INVENTION According to this invention, the technique which suppresses the brightness nonuniformity in an illuminating device can be provided.

1 is an exploded perspective view showing a schematic configuration of a television receiver according to Embodiment 1 of the present invention. Exploded perspective view showing schematic configuration of liquid crystal display device The top view which shows arrangement | positioning structure, such as a diffuser lens in a chassis which comprises an illuminating device, an LED board, a holding member, a reflective sheet. Sectional drawing which shows the cross-sectional structure along the short side direction (vii-vii line of FIG. 3) of a liquid crystal display device Sectional drawing which shows the cross-sectional structure along the long side direction (viii-viii line of FIG. 3) of a liquid crystal display device An enlarged plan view of the vicinity of the LED on the LED substrate constituting the illumination device FIG. 5 is an enlarged sectional view of the vicinity of the LED and the diffusing lens. Xi-xi sectional view of FIG. The enlarged plan view of LED vicinity in the LED board which comprises the illuminating device which concerns on Embodiment 2. FIG. The enlarged plan view of LED vicinity in the LED board which comprises the illuminating device which concerns on Embodiment 3. FIG. The enlarged plan view of LED vicinity in the LED board which comprises the illuminating device which concerns on Embodiment 4. FIG. FIG. 6 is an enlarged sectional view of the vicinity of an LED and a diffusing lens that constitute a liquid crystal display device according to a fifth embodiment. FIG. 6 is an enlarged cross-sectional view of the vicinity of an LED and a diffusing lens that constitute a liquid crystal display device according to a sixth embodiment. The enlarged plan view of LED vicinity in the LED board which comprises the illuminating device which concerns on Embodiment 7. FIG. The enlarged plan view of LED vicinity in the LED board which comprises the illuminating device which concerns on Embodiment 8. FIG.

<Embodiment 1>
Embodiment 1 of the present invention will be described with reference to FIGS. In this embodiment, the illumination device 12, the liquid crystal display device 10, and the television receiver TV are illustrated. A part of each drawing shows an X-axis, a Y-axis, and a Z-axis, and each axis is drawn so as to be a common direction in each drawing. Further, the lighting device 12 and the like will be described with the upper side shown in FIGS. 7 and 8 as the front side and the lower side of the figure as the back side.

(TV receiver)
As shown in FIG. 1, the television receiver TV according to the present embodiment includes a liquid crystal display device 10 that is a display device, front and back cabinets Ca and Cb that are accommodated with the liquid crystal display device 10 interposed therebetween, and power supply. Power supply circuit board P, a tuner (receiver) T capable of receiving a television image signal, and an image conversion circuit board VC for converting the television image signal output from the tuner T into an image signal for the liquid crystal display device 10 And a stand S. The liquid crystal display device 10 has a horizontally long (longitudinal) rectangular shape (rectangular shape) as a whole, the long side direction is the horizontal direction (X-axis direction), and the short side direction is the vertical direction (Y-axis direction, vertical direction). They are housed in a state of almost matching each other. As shown in FIG. 2, the liquid crystal display device 10 includes a liquid crystal panel 11 that is a display panel and an illumination device (backlight device) 12 that is an external light source, and these are integrated by a frame-like bezel 13 or the like. It is designed to be retained.

(LCD panel)
The configuration of the liquid crystal panel 11 in the liquid crystal display device 10 will be described. The liquid crystal panel 11 has a horizontally long (longitudinal) rectangular shape as a whole, and is interposed between a pair of transparent (translucent) glass substrates and both substrates as shown in FIG. And a liquid crystal layer containing liquid crystal, which is a substance whose optical characteristics change with application of an electric field. Both substrates are bonded together with a sealing agent while maintaining a gap corresponding to the thickness of the liquid crystal layer. In addition, polarizing plates are respectively attached to the outer surface sides of both substrates. Note that the long side direction of the liquid crystal panel 11 coincides with the X-axis direction, and the short side direction coincides with the Y-axis direction.

  Of the two substrates, the front side (front side) is a color filter (hereinafter referred to as CF) substrate, and the back side (back side) is an array substrate. A large number of TFTs (Thin Film Transistors) that are switching elements and pixel electrodes are provided in parallel in a matrix (matrix) on the inner surface of the array substrate (that is, the surface on the liquid crystal layer side). Around the electrode, a grid-shaped gate wiring and source wiring are disposed so as to surround the electrode. The pixel electrode has a vertically long (longitudinal) rectangular shape (rectangular shape) in which the long side direction coincides with the Y-axis direction and the short side direction coincides with the X-axis direction, and includes ITO (Indium Tin Oxide), ZnO ( Zinc Oxide) and the like. The gate wiring and the source wiring are connected to the gate electrode and the source electrode of the TFT, respectively, and the pixel electrode is connected to the drain electrode of the TFT. An alignment film for aligning liquid crystal molecules is provided on the liquid crystal layer side of the TFT and the pixel electrode. A terminal portion led from a gate wiring and a source wiring is formed at an end portion of the array substrate, and a driver component for driving a liquid crystal is formed on this terminal portion by an anisotropic conductive film (ACF: Anisotropic Conductive Film). ), And the driver component for driving the liquid crystal is electrically connected to the display control circuit board via various wiring boards. This display control circuit board is connected to an image conversion circuit board VC (see FIG. 1) in the television receiver TV, and each gate wiring and source via a driver component based on an output signal from the image conversion circuit board VC. A drive signal is supplied to the wiring.

  On the other hand, the inner surface of the CF substrate (that is, the surface on the liquid crystal layer side) is provided with a color filter in which a large number of colored portions are arranged in a matrix (matrix) corresponding to each pixel on the array substrate side. ing. The color filter includes a red (R) colored portion, a green (G) colored portion G, and a blue (B) colored portion which are the three primary colors of light. The colored portion of each color (R, G, B) selectively transmits light of each corresponding color (each wavelength). A grid-like light shielding layer (black matrix) is provided between the colored portions to prevent color mixing. A counter electrode and an alignment film are sequentially stacked on the liquid crystal layer side of the color filter in the CF substrate.

(Lighting device)
Next, the configuration of the illumination device (backlight device) 12 in the liquid crystal display device 10 will be described. As shown in FIG. 2, the illuminating device 12 is arranged so as to cover the chassis 22 having a substantially box shape having an opening on the light emitting surface side (the liquid crystal panel 11 side), and the opening of the chassis 22. And a frame 26 that is disposed along the outer edge of the chassis 22 and holds the outer edge of the group of optical members 23 between the chassis 22 and the chassis 22. Further, in the chassis 22, the LED 24 arranged opposite to the position directly below the optical member 23 (the liquid crystal panel 11), the LED board 25 on which the LED 24 is mounted, and a position corresponding to the LED 24 on the LED board 25. And a diffusing lens 27 attached to the lens. Thus, the illumination device 12 according to the present embodiment is a so-called direct type. In addition, in the chassis 22, a holding member 28 that can hold the LED substrate 25 between the chassis 22 and a reflection sheet 29 that reflects the light in the chassis 22 toward the optical member 23 are provided. ing. Then, each component of the illuminating device 12 is demonstrated in detail.

(Chassis)
The chassis 22 is made of metal, and as shown in FIGS. 3 to 5, as in the liquid crystal panel 11, the bottom plate 22 a has a horizontally long rectangular shape and each side of the bottom plate 22 a (a pair of long sides and a pair of short plates). Each side plate 22b rising from the outer end of each side plate toward the front side (light emitting side) and a receiving plate 22c projecting outward from the rising end of each side plate 22b. It is almost box-shaped (substantially shallow dish). The long side direction of the chassis 22 coincides with the X-axis direction (horizontal direction), and the short side direction coincides with the Y-axis direction (vertical direction). A frame 26 and an optical member 23 to be described below can be placed on each receiving plate 22c in the chassis 22 from the front side. A frame 26 is screwed to each receiving plate 22c. An attachment hole for attaching the holding member 28 is provided in the bottom plate 22 a of the chassis 22. A plurality of mounting holes are arranged in a distributed manner corresponding to the mounting position of the holding member 28 on the bottom plate 22a.

(Optical member)
As shown in FIG. 2, the optical member 23 has a horizontally long rectangular shape when viewed in a plane, like the liquid crystal panel 11 and the chassis 22. As shown in FIGS. 4 and 5, the optical member 23 covers the opening of the chassis 22 by placing the outer edge portion of the optical member 23 on the receiving plate 22 c, and the liquid crystal panel 11 and the LED 24 (LED substrate 25). Arranged between them. The optical member 23 includes a diffusion plate 23a disposed on the back side (the LED 24 side, opposite to the light emitting side) and an optical sheet 23b disposed on the front side (the liquid crystal panel 11 side, the light emitting side). . The diffusing plate 23a has a structure in which a large number of diffusing particles are dispersed in a substrate made of a substantially transparent resin having a predetermined thickness and has a function of diffusing transmitted light. The optical sheet 23b has a sheet shape that is thinner than the diffusion plate 23a, and two optical sheets 23b are laminated. Specific types of the optical sheet 23b include, for example, a diffusion sheet, a lens sheet (including a prism sheet), a reflective polarizing sheet, and the like, which can be appropriately selected and used.

(flame)
As shown in FIG. 2, the frame 26 has a frame shape along the outer peripheral edge portions of the liquid crystal panel 11 and the optical member 23. An outer edge portion of the optical member 23 can be sandwiched between the frame 26 and each receiving plate 22c (see FIGS. 4 and 5). The frame 26 can receive the outer edge portion of the liquid crystal panel 11 from the back side, and can sandwich the outer edge portion of the liquid crystal panel 11 with the bezel 13 arranged on the front side (FIGS. 4 and 5). reference).

(LED)
As shown in FIG. 5, the LED 24 is a so-called top-emitting type in which the LED 24 is mounted on the LED substrate 25 and the top surface opposite to the mounting side with respect to the LED substrate 25 is the light emitting surface. The LED 24 includes an LED chip that emits blue light as a light emission source, and includes a green phosphor and a red phosphor as phosphors that emit light when excited by blue light. Specifically, the LED 24 has a configuration in which an LED chip made of, for example, an InGaN-based material is sealed with a resin material on a substrate portion fixed to the LED substrate 25. The LED chip mounted on the substrate unit has a main emission wavelength in the range of 420 nm to 500 nm, that is, in the blue wavelength region, and can emit blue light (blue monochromatic light) with excellent color purity. Is done. As a specific main emission wavelength of the LED chip, for example, 451 nm is preferable. On the other hand, the resin material that seals the LED chip is excited by the blue phosphor emitted from the LED chip and the green phosphor that emits green light by being excited by the blue light emitted from the LED chip. And a red phosphor emitting red light is dispersed and blended at a predetermined ratio. The LED 24 is made up of blue light (blue component light) emitted from these LED chips, green light (green component light) emitted from the green phosphor, and red light (red component light) emitted from the red phosphor. Is capable of emitting light of a predetermined color as a whole, for example, white or blueish white. Since yellow light is obtained by synthesizing the green component light from the green phosphor and the red component light from the red phosphor, the LED 24 includes the blue component light and the yellow component from the LED chip. It can be said that it also has the light of. The chromaticity of the LED 24 varies depending on, for example, the absolute value or relative value of the content of the green phosphor and the red phosphor, and accordingly the content of the green phosphor and the red phosphor is adjusted as appropriate. Thus, the chromaticity of the LED 24 can be adjusted. In this embodiment, the green phosphor has a main emission peak in the green wavelength region of 500 nm to 570 nm, and the red phosphor has a main emission peak in the red wavelength region of 600 nm to 780 nm. It is said.

Next, the green phosphor and the red phosphor provided in the LED 24 will be described in detail. As the green phosphor, β-SiAlON, which is a kind of sialon phosphor, is preferably used. The sialon-based phosphor is a substance in which a part of silicon atoms of silicon nitride is replaced with aluminum atoms and a part of nitrogen atoms with oxygen atoms, that is, a nitride. A sialon-based phosphor that is a nitride is superior in luminous efficiency and durability as compared with other phosphors made of, for example, sulfides or oxides. Here, “excellent in durability” specifically means that, even when exposed to high-energy excitation light from an LED chip, the luminance does not easily decrease over time. For sialon phosphors, rare earth elements (eg, Tb, Yg, Ag, etc.) are used as activators. Β-SiAlON, which is a kind of sialon-based phosphor, has a general formula Si _6-Z Al _z O _z N _{8 -z} : Eu (z is a solid solution amount) in which aluminum and oxygen are dissolved in β-type silicon nitride crystal. Or (Si, Al) ₆ (O, N) ₈ : a substance represented by Eu. In the β-SiAlON according to the present embodiment, for example, Eu (europium) is used as an activator, and thereby the color purity of green light that is emitted light is particularly high. It is extremely useful in adjusting On the other hand, as the red phosphor, it is preferable to use casoon, which is a kind of cadmium-based phosphor. Cousin-based phosphors are nitrides containing calcium atoms (Ca), aluminum atoms (Al), silicon atoms (Si), and nitrogen atoms (N). For example, other phosphors made of sulfides, oxides, etc. In comparison, it is excellent in luminous efficiency and durability. The cascading phosphor uses rare earth elements (for example, Tb, Yg, Ag, etc.) as an activator. Casun, which is a kind of cousin phosphor, uses Eu (europium) as an activator and is represented by the composition formula CaAlSiN ₃ : Eu.

(LED board)
As shown in FIG. 3, the LED substrate 25 has a base material portion 25 a that has a horizontally long rectangular shape when seen in a plan view. The LED board 25 is accommodated while extending along the bottom plate 22a in the chassis 22 in a state where the long side direction coincides with the X-axis direction and the short side direction coincides with the Y-axis direction. Among the plate surfaces of the base material portion 25a of the LED substrate 25, the LED 24 is surface-mounted on the plate surface facing the front side (surface facing the optical member 23 side), and this is the mounting surface 25a1. . The mounted LED 24 has a light emitting surface facing the optical member 23 (the liquid crystal panel 11), and its optical axis coincides with the Z-axis direction (that is, a direction orthogonal to the display surface of the liquid crystal panel 11). Yes. A plurality of (for example, 15 in FIG. 3) LEDs 24 are arranged in a straight line along the long side direction (X-axis direction) on the LED substrate 25 and are connected to the LEDs 24 arranged in parallel. A pattern (wiring portion) 25c is formed (see FIG. 6). The arrangement pitch of the LEDs 24 on the LED substrate 25 is substantially constant, that is, the LEDs 24 are arranged at substantially equal intervals in the X-axis direction.

  As shown in FIG. 3, a plurality of LED substrates 25 are arranged in parallel in the chassis 22 in a state where the long side direction and the short side direction are aligned with each other in the X-axis direction and the Y-axis direction. That is, the LED substrate 25 and the LED 24 mounted thereon are both set in the X-axis direction (the long side direction of the chassis 22 and the LED substrate 25) in the chassis 22 and in the Y-axis direction (the chassis 22 and the LED substrate 25). The short side direction is arranged in a matrix with the column direction (arranged in a matrix, planar arrangement). Specifically, 28 LED boards 25 are arranged in parallel in a matrix in the chassis 22, two in the X-axis direction (row direction) and 14 in the Y-axis direction (column direction). ing. The LED substrates 25 arranged in parallel in the Y-axis direction have a so-called unequal pitch arrangement in which the arrangement pitch changes according to the position. Specifically, the arrangement pitch is narrower toward the center side in the Y-axis direction of the chassis 22 (liquid crystal display device 10) and wider toward both ends in the Y-axis direction. In addition, the arrangement | sequence about the Y-axis direction in each LED24 mounted on each LED board 25 is also made into an unequal pitch arrangement | sequence similarly to the above. Of both end portions of each LED substrate 25 in the long side direction, an end portion on the outer edge side in the long side direction of the chassis 22 (an end portion on the opposite side to the LED substrate 25 side adjacent in the X-axis direction) has a wiring pattern. A connector portion 25d connected to the end portion of 25c is provided (see FIG. 5). The connector 25d is electrically connected to an external LED drive circuit side connector, so that the drive of each LED 24 on the LED board 25 can be controlled. Further, a through hole 25b through which the holding member 28 is passed is formed at a position corresponding to the mounting position of the holding member 28 in the LED substrate 25 (see FIGS. 4 and 5).

(Diffusion lens)
The diffusion lens (optical lens) 27 is made of a synthetic resin material (for example, polycarbonate, acrylic, etc.) that is substantially transparent (having high translucency) and has a refractive index higher than that of air. As shown in FIGS. 3 and 5, the diffusion lens 27 has a predetermined thickness and is formed in a substantially circular shape when seen in a plan view. To be individually covered (that is, so as to overlap each LED 24 in a plan view). The diffusing lens 27 can emit light having a high directivity (high) emitted from the LED 24 while being diffused to some extent. That is, since the directivity of the light emitted from the LED 24 is relaxed through the diffusion lens 27, the area between the adjacent LEDs 24 is difficult to be visually recognized as a dark part even if the interval between the adjacent LEDs 24 is wide. Thereby, it is possible to reduce the number of installed LEDs 24. The diffusing lens 27 is disposed at a position that is substantially concentric with the LED 24 in a plan view. In FIG. 4, since the cross-sectional configuration of the holding member 28 is illustrated, the side surface of the diffusing lens 27 disposed on the back side of the paper surface is illustrated.

  As shown in FIG. 6, the diffusing lens 27 has a diameter dimension that is sufficiently larger than the outer dimension of the LED 24, but is slightly smaller than the short side dimension of the LED substrate 25. A surface of the diffusing lens 27 that faces the back side and faces the LED 24 is a light incident surface 27a on which light from the LED 24 is incident, as shown in FIG. On the other hand, the surface facing the front side and facing the optical member 23 is a light emitting surface 27b that emits light. Of these, the light incident surface 27a has a planar shape that is arranged in parallel along the plate surface (X-axis direction and Y-axis direction) of the LED substrate 25 as a whole, but overlaps the LED 24 when viewed in plan. In particular, the light incident side concave portion 27 c is formed to have an inclined surface inclined with respect to the optical axis of the LED 24. The light incident side concave portion 27 c has a substantially conical shape with an inverted V-shaped cross section and is disposed at a substantially central position in the diffusing lens 27. The light emitted from the LED 24 and entering the light incident side concave portion 27 c enters the diffusion lens 27 while being refracted at a wide angle by the inclined surface. Further, from the vicinity of the outer edge portion of the light incident surface 27a, a mounting leg portion 27d as a mounting structure for the LED substrate 25 is projected, and this mounting leg portion 27d is an adhesive with respect to the mounting surface 25a1 of the LED substrate 25. It is fixed by. The light emission surface 27b is formed in a flat and substantially spherical shape that bulges to the front side, and thereby allows light emitted from the diffusion lens 27 to be emitted while being refracted at a wide angle. A light emitting side concave portion 27e having a substantially bowl shape is formed in a region of the light emitting surface 27b that overlaps the LED 24 when seen in a plan view. By this light emitting side concave portion 27e, most of the light from the LED 24 can be emitted while being refracted at a wide angle, or a part of the light from the LED 24 can be reflected to the LED substrate 25 side.

(Holding member)
The holding member 28 is a molded product made of a synthetic resin such as polycarbonate and has a white surface with excellent light reflectivity. As shown in FIGS. 3 to 5, the holding member 28 protrudes from the main body 28 a toward the back side (that is, the chassis 22 side) from the main body 28 a along the plate surface of the LED substrate 25. And a fixing portion 28b fixed to the head. The main body 28 a has a substantially circular plate shape when seen in a plan view, and is set so that at least the LED substrate 25 can be sandwiched between the main body 28 a and the bottom plate 22 a of the chassis 22. The fixing portion 28b can be locked to the bottom plate 22a while penetrating the insertion holes 25b and the attachment holes respectively formed corresponding to the mounting positions of the holding member 28 on the LED board 25 and the bottom plate 22a of the chassis 22. . As shown in FIG. 3, a plurality of holding members 28 are appropriately distributed in the plane of the LED substrate 25, and are arranged at positions adjacent to the diffusion lens 27 (LED 24) in the X-axis direction. ing.

  3 and 5, the holding member 28 sandwiches the LED board 25 between the main body 28 a and the bottom plate 22 a of the chassis 22 without the bottom 29 a of the reflection sheet 29 being interposed ( Two types are included: a first holding member) and a member (second holding member) that holds the bottom portion 29a of the reflection sheet 29 together with the LED substrate 25 between the main body portion 28a and the bottom plate 22a of the chassis 22. Of these, the holding member 28 (second holding member) that holds the bottom 29a of the reflection sheet 29 together with the LED substrate 25 is provided with a support portion 28c that protrudes from the main body portion 28a to the front side, and the support portion 28c. Two types are included. The support portion 28c can support the optical member 23 (directly the diffusion plate 23a) from the back side, thereby maintaining a constant positional relationship between the LED 24 and the optical member 23 in the Z-axis direction. In addition, unnecessary deformation of the optical member 23 can be restricted.

(Reflective sheet)
The reflective sheet (reflective member) 29 is made of a foamed plastic sheet (for example, a foamed polyethylene terephthalate sheet), and has a white surface with excellent light reflectivity. As shown in FIGS. 3 to 5, the reflection sheet 29 has a size that is laid over substantially the entire inner surface of the chassis 22, so that all the LED boards 25 arranged in parallel in the chassis 22. Can be collectively covered from the front side. The reflection sheet 29 can efficiently raise the light in the chassis 22 toward the optical member 23 side. The reflection sheet 29 extends along the bottom plate 22a of the chassis 22 and covers a large portion of the bottom plate 22a. The reflection sheet 29 rises from each outer end of the bottom portion 29a to the front side and rises to the bottom portion 29a. And four rising portions 29b that are inclined, and extending portions 29c that extend outward from the outer ends of the respective rising portions 29b and are placed on the receiving plate 22c of the chassis 22. The bottom portion 29a of the reflection sheet 29 is arranged so as to overlap the front side with respect to the front side surface of each LED substrate 25 (that is, the mounting surface 25a1 of the LED 24). As shown in FIG. 7, the bottom 29a of the reflection sheet 29 has lens insertion holes (openings) 29d through which the diffusion lenses 27 and the LEDs 24 are inserted in positions overlapping with the diffusion lenses 27 and the LEDs 24 in plan view. An opening is provided. The diameter of the lens insertion hole 29d is larger than the outer diameter of the diffusing lens 27, so that the diffusing lens 27 can be surely inserted even when a dimensional error or assembly error occurs in manufacturing. It is supposed to be possible. Therefore, the mounting surface 25a1 of the LED substrate 25 includes a portion that is not covered by the bottom portion 29a of the reflection sheet 29, that is, a portion that is exposed to the front side through the lens insertion hole 29d.

  Further, as shown in FIGS. 4 and 5, the bottom portion 29a is provided with holding member insertion holes for passing the fixing portions 28b at positions overlapping with the holding members 28 in plan view. The holding member insertion hole corresponding to the holding member 28 (first holding member) that holds the LED substrate 25 without passing through the bottom portion 29a has a size that allows the main body portion 28a to pass therethrough. Thereby, the LED board 25 accommodated in the chassis 22 can be held in advance on the bottom plate 22a of the chassis 22 by the holding member 28 (first holding member), and then when the reflective sheet 29 is laid in the chassis 22 The bottom 29a is prevented from riding on the main body 28a of the holding member 28 (first holding member). The bottom 29a is held on the chassis 22 together with the LED board 25 by a holding member 28 (second holding member) attached after being laid in the chassis 22, and is unlikely to float or bend.

(Description of the configuration according to the main part of the present embodiment)
Of the mounting surface 25a1 of the LED 24 in the base material portion 25a constituting the LED substrate 25, at least a portion in the lens insertion hole 29d covers the wiring pattern 25c as shown in FIGS. A reflective layer 30 that reflects light is formed. In addition, an absorption layer 31 that absorbs light is formed so as to partially overlap the reflection layer 30 (a shape overlapping a part of the reflection layer 30). The base material portion 25a of the LED substrate 25 is made of a metal material such as an aluminum-based material like the chassis 22, and has an insulating layer (not shown) formed on the surface thereof. Therefore, the wiring pattern 25c and the reflective layer 30 described above are formed so as to be laminated on the insulating layer in the base material portion 25a, as shown in FIG.

  As shown in FIGS. 6 to 8, the reflective layer 30 is provided in a solid shape over substantially the entire area of the mounting surface 25 a 1 of the LED substrate 25 except for the mounting area of mounting components such as the LED 24 and the connector portion 25 d. It has been. Therefore, the reflective layer 30 is also disposed around the LED 24 so that a part thereof surrounds the LED 24, and is disposed in the lens insertion hole 29 d in a state where the reflective sheet 29 is laid. The reflective layer 30 has a function of preventing the oxidation of the wiring pattern 25c and the short circuit between the wiring patterns 25c by covering the wiring pattern 25c as described above. The reflective layer 30 of the present embodiment is made of a so-called solder resist, and mainly contains a photocurable resin material or a thermosetting resin material. In the manufacturing process of the LED substrate 25, they are applied to the mounting surface 25a1 of the LED substrate 25 in a liquid state, and then cured by irradiation (exposure) or heating with light of a specific wavelength (for example, UV), A reflective layer 30 is formed. In addition, when apply | coating the reflective layer 30 of a liquid state to the mounting surface 25a1 of LED board 25, screen printing, a spray method, a curtain coat method, an electrostatic application method etc. can be taken, for example.

  The reflective layer 30 is made of a material whose surface color is, for example, white, and has excellent light reflectivity. The reflective layer 30 can improve the light use efficiency in the lighting device 12 by efficiently reflecting the light from the LED 24 on the surface 25e of the LED substrate 25. Such a reflective layer 30 having excellent light reflectivity is obtained, for example, by dispersing and blending a predetermined amount of a white pigment (for example, titanium oxide) into the above-described photocurable resin material or thermosetting resin material. . In the case of this embodiment, the light reflectance of the reflective layer 30 is set to be approximately equal to the light reflectance of the reflective sheet 29.

  As shown in FIGS. 6 and 7, the reflective layer 30 is formed over almost the entire mounting surface 25 a 1 of the LED substrate 25, but most of the reflective layer 30 is covered with the bottom 29 a of the reflective sheet 29. . Therefore, it is the portion (the portion exposed from the lens insertion hole 29d) disposed in the lens insertion hole 29d that substantially exhibits the light reflection function. A portion of the reflective layer 30a (hereinafter also referred to as an exposed reflective layer) 30a disposed in the lens insertion hole 29d transmits the light reflected by the diffusing lens 27 or the like and returned to the LED substrate 25 side again. The light is reflected toward the diffusing lens 27. That is, the exposed reflective layer 30 a has a function of supplying light to the diffusion lens 27.

  The diffusing lens 27 has an optimum value of the amount of light supplied in terms of optical design. When light is supplied to the diffusing lens 27 with an optimized light amount, the planar light emitted from the illumination device 12 becomes uniform light with no luminance unevenness (light intensity unevenness) as a whole. However, when light is supplied to the diffusion lens 27 with a light amount exceeding the above-described optimum value, among the planar light emitted from the lighting device 12, the LED 24 and the light directly above the diffusion lens 27 (light of the LED 24). Only the portion corresponding to the axial direction and the normal direction of the diffusing lens 27 has a luminance that is too high compared to the other portions, resulting in uneven luminance as a whole. As a cause of the excessive supply of light to the diffusion lens 27 in this way, for example, there is an excessive amount of light reflected by the exposed reflection layer 30a and supplied to the diffusion lens 27.

  Therefore, in the present embodiment, as shown in FIGS. 6 and 7, the reflective layer is formed on a portion (exposed reflective layer 30 a) in the lens insertion hole 29 d of the surface 25 e (mounting surface 25 a 1) of the LED substrate 25. A film-like absorption layer 31 that absorbs light is formed (laminated) so as to partially overlap with 30. More specifically, the absorbing layer 31 is formed so as to overlap with a portion of the exposed reflective layer 30a that faces the diffusing lens 27 (hereinafter sometimes referred to as an opposed exposed reflective layer 30a1). The absorbing layer 31 is made of a photo-curing resin material or a thermosetting resin material, like the reflecting layer 30, but unlike the reflecting layer 30, the absorbing layer 31 has a surface color of, for example, black. The absorption layer 31 is obtained, for example, by dispersing and blending a predetermined amount of black pigment (for example, carbon black) into the above-described photocurable resin material or thermosetting resin material. In the manufacturing process of the LED substrate 25, they are applied on the reflective layer 30 of the LED substrate 25 in a liquid state, and then cured by irradiation (exposure) or heating with light of a specific wavelength (for example, UV). The absorption layer 31 is formed. In addition, when apply | coating the liquid absorption layer 31 on the reflective layer 30 of LED board 25, screen printing, a spray method, a curtain coat method, an electrostatic application method etc. can be taken, for example.

  As described above, the absorbing layer 31 is formed on the opposed exposed reflective layer 30a1 facing the diffusing lens 27 in the reflective layer 30 on the LED substrate 25. As shown in FIG. 6, the absorption layer 31 has a generally circular shape corresponding to the shape of the diffusion lens 27. In the central part of the absorption layer 31 having a circular shape, there is a rectangular blank portion (hole) where the absorption layer 31 is not formed. This portion is a mounting area of the LED 24. The light absorption rate of the absorption layer 31 is set to be substantially the same.

(Description of functions and effects according to the main part of the present embodiment)
When the power of the liquid crystal display device 10 is turned on (turned on), power is supplied to each LED board 25 from the LED drive circuit provided in the illumination device 12. Then, each LED 24 on each LED board 25 is turned on, and driving of the liquid crystal panel 11 is controlled by a display control circuit board (not shown). Then, a predetermined image is displayed on the display surface of the liquid crystal panel 11.

  More specifically, the light emitted from the LED 24 is first incident on the light incident surface 27 a of the diffusion lens 27. At this time, most of the light is incident on the inclined surface of the light incident side recess 27c in the light incident surface 27a. The light incident on the inclined surface enters the diffusing lens 27 while being refracted at a wide angle according to the inclination angle. The incident light propagates through the diffusion lens 27 and then exits from the light exit surface 27b. The light emitting surface 27b has a flat and substantially spherical shape, and light is emitted while being refracted at a wider angle at the interface between the light emitting surface 27b and the external air layer. A light emitting side concave portion 27e having a substantially bowl shape is formed in a region of the light emitting surface 27b where the amount of light supplied from the LED 24 is the largest. The peripheral surface of the light emitting side concave portion 27e has a flat and substantially spherical shape, and the light is emitted while being refracted at a wide angle on the peripheral surface. Note that some of the light supplied from the LED 24 is reflected toward the LED substrate 25 by the peripheral surface of the light emitting side recess 27e.

  The light emitted from the diffusion lens 27 is incident on the optical member 23 directly or indirectly by being reflected by the reflection sheet 29 or the like. The light incident on the optical member 23 is adjusted by being given a predetermined optical action (such as a diffusing action or a light collecting action) in the process of passing through the optical member 23. Then, the light transmitted through the optical member 23 is irradiated onto the liquid crystal panel 11, whereby a predetermined image is displayed on the display surface of the liquid crystal panel 11 as described above.

  Meanwhile, some of the light emitted from the LED 24 toward the diffusion lens 27 side is reflected by the diffusion lens 27 and returned to the LED substrate 25 side. Some of the light emitted from the diffusing lens 27 is reflected by the optical member 27, the reflective sheet 29, and the like and returned to the LED substrate 25 side. If the above-described absorption layer 31 is formed at a predetermined position of the reflection layer 30 included in the LED substrate 25, even if the light reflected by the diffusion lens 27 or the like returns to the LED substrate 25 side, the absorption layer 31. Will be absorbed to some extent. That is, the light reflected by the diffusion lens 27 and the like (reflected light) is suppressed from being supplied again to the diffusion lens 27 side by the absorption layer 31. As a result, the reflected light is suppressed from being supplied into the diffusion lens 27, and the amount of light emitted from the diffusion lens 27 is suppressed. Therefore, by providing the absorption layer 31 on the mounting surface 25a1 (reflection layer 30) of the LED substrate 25, the amount of light supplied to the diffusion lens 27 can be adjusted to an appropriate value. In this manner, the illumination device 12 according to the present embodiment suppresses occurrence of luminance unevenness in the planar light irradiated toward the liquid crystal panel 11.

  In the lighting device 12 of the present embodiment, the absorption layer 31 is formed on the reflection layer 30 facing the diffusion lens 27 in a stacked manner. Thus, when the absorption layer 31 is provided on the reflection layer 30, the absorption layer 31 can be easily formed at a predetermined location. For example, in another embodiment, it is conceivable to form the absorption layer and the reflection layer as a single layer. However, if the absorption layer 31 is laminated on the reflection layer 30 as in the present embodiment, the absorption layer 31 can be easily placed at a predetermined position of the reflection layer 30 using a known coating film forming method. Can be arranged. Therefore, the illuminating device 12 of this embodiment is easy to provide the absorption layer 31 at a predetermined location and easy to manufacture.

  Moreover, in the illuminating device 12 of this embodiment, the absorption layer 31 is distribute | arranged on the mounting surface 25a1 so that LED24 may be surrounded. When the absorption layer 31 is arranged on the mounting surface 25a1 so as to surround the LED 24, the amount of light absorbed from the LED 24 by the absorption layer 31 is not uniform in the circumferential direction around the LED 24. Is suppressed. That is, the light emitted from the diffusing lens 27 is suppressed from becoming nonuniform radial light, and the luminance unevenness of the lighting device 12 is suppressed.

<Embodiment 2>
Hereinafter, Embodiment 2 of the present invention will be described with reference to FIG. In the following embodiments, the same parts as those in the first embodiment are denoted by the same reference numerals as those in the first embodiment, and the detailed description (structure, operation, and effect) is omitted. FIG. 9 is an enlarged plan view of the vicinity of the LED 24 in the LED substrate 25 </ b> A constituting the illumination device according to the second embodiment. The basic configuration of the illumination device of this embodiment is the same as that of the first embodiment. However, in the present embodiment, the absorption layer 31A formed on the LED substrate 25A is different from that of the first embodiment. Specifically, as illustrated in FIG. 9, the absorption layer 31 </ b> A according to the present embodiment includes a plurality of pattern portions 31 a 1 and 31 a 2 having a dot shape (circular shape). The absorbing layer 31A is made of the same material as in the first embodiment, and is formed in a form that is laminated on the reflective layer 30 using a screen printing technique or the like as in the first embodiment. The pattern portions 31a1 and 31a2 forming the absorption layer 31A are arranged so as to surround the LED 24 as a whole, and are arranged radially from the LED 24 as a whole. The pattern part 31a1 is arranged along the circumference centering on the LED 24. On the other hand, the pattern part 31a2 is a circle larger than the circle formed by the pattern part 31a1, and is arranged along a circumference centering on the LED 24. Note that the shapes (sizes) of the pattern portions 31a1 and 31a2 are set to be the same. Moreover, the light absorption rate (blackness) of each pattern part 31a1 and 31a2 is also set mutually the same.

  The interval between the pattern portions 31a2 adjacent in the circumferential direction around the LED 24 is larger than the interval between the pattern portions 31a1 adjacent in the circumferential direction around the LED 24. Therefore, on the surface 25e of the LED substrate 25A, the closer to the LED 24, the higher the density of the absorption layer 31A (that is, the further away from the LED 24, the lower the density of the absorption layer 31A). Therefore, the closer to the LED 24, the more light is absorbed by the absorption layer 31A. By providing the LED substrate 25A on which such an absorption layer 31A is formed, in the illumination device according to the present embodiment, the light emitted from the central portion of the diffusion lens 27 is suppressed, and the illumination device It is possible to suppress the occurrence of luminance unevenness in the planar light emitted from.

  Moreover, when the absorption layer 31A is composed of a plurality of pattern portions 31a1 and 31a2 as in the illumination device of the present embodiment, the arrangement, shape, and light absorption rate (blackness) of the pattern portions 1a1 and 31a2 are set as appropriate. Thus, the amount of light absorption in the absorption layer can be appropriately adjusted according to the purpose.

<Embodiment 3>
Hereinafter, Embodiment 3 of the present invention will be described with reference to FIG. FIG. 10 is an enlarged plan view of the vicinity of the LED 24 in the LED substrate 25B that configures the illumination device according to the third embodiment. The basic configuration of the lighting device of the present embodiment is the same as that of the first embodiment. However, in the present embodiment, the absorption layer 31B formed on the LED substrate 25B is different from that of the first embodiment. Specifically, as illustrated in FIG. 10, the absorption layer 31 </ b> B according to the present embodiment includes two types of pattern portions 31 b 1 and 31 b 2 having different dot sizes (circular shapes). The absorbing layer 31B is made of the same material as in the first embodiment, and is formed on the reflective layer 30 by using a screen printing technique or the like as in the first embodiment. The light absorption rates of the patterns 31b1 and 31b2 are set to be the same.

  The pattern portions 31b1 and 31b2 forming the absorption layer 31B are arranged so as to surround the LED 24 as a whole. The pattern portion 31b1 has a larger circular shape than the pattern portion 31b2, and is formed on the reflective layer 30 in the vicinity of the LED 24 so as to surround the LED 24. The pattern part 31b1 is arranged along the circumference centering on the LED 24. On the other hand, the pattern portion 31b2 has a smaller circular shape than the pattern portion 31b1. Each pattern part 31b2 surrounds the periphery of the LED 24, and is arranged along the circumference centering on the LED 24 so as to be arranged outside the pattern part 31b1. Further, the interval between the pattern portions 31b2 adjacent in the circumferential direction around the LED 24 is larger than the interval between the pattern portions 3b1 adjacent in the circumferential direction around the LED 24.

  Also on the surface 25e of the LED substrate 25B of the present embodiment, the density of the absorption layer 31B increases as it approaches the LED 24 as in the second embodiment (that is, the density of the absorption layer 31B decreases as the distance from the LED 24 increases). ing). Therefore, the closer to the LED 24, the more light is absorbed by the absorption layer 31B. By including the LED substrate 25B on which such an absorption layer 31B is formed, in the illumination device according to the present embodiment, the light emitted from the central portion of the diffusion lens 27 is suppressed, and the illumination device It is possible to suppress the occurrence of luminance unevenness in the planar light emitted from.

<Embodiment 4>
Embodiment 4 of the present invention will be described below with reference to FIG. FIG. 11 is an enlarged plan view of the vicinity of the LED 24 in the LED substrate 25C that constitutes the illumination device according to the fourth embodiment. The basic configuration of the lighting device of the present embodiment is the same as that of the first embodiment. However, in the present embodiment, the absorption layer 31C formed on the LED substrate 25C is different from that of the first embodiment. Specifically, as illustrated in FIG. 11, the absorption layer 31 </ b> B of the present embodiment includes a plurality of (three) pattern portions 31 c 1, 31 c 2, and 31 c 3 that form an annular shape. The absorption layer 31C of the present embodiment is made of the same material as that of the first embodiment, and is formed on the reflective layer 30 by using a screen printing technique or the like as in the first embodiment. . The light absorptances of the pattern portions 31c1, 31c2, and 31c3 are set to be the same.

  Each of the pattern portions 31c1, 31c2, and 31c3 forming the absorption layer 31C is generally formed in an annular shape (concentric circle) with the LED 24 as the center. Further, the surface area of each pattern portion 31c1, 31c2, 31c3 (ratio per unit area occupied by the absorption layer 31C on the surface 25e of the LED substrate 25C) is directed away from the LED 24 (that is, the radial direction of each pattern portion). Are getting smaller. In the case of the present embodiment, the width of each pattern portion (the width in the radial direction) is gradually reduced (narrowed) toward the direction. Furthermore, in the absorption layer 31 </ b> C of the present embodiment, the interval between the pattern portions is sequentially increased in the direction away from the LED 24.

  Also on the surface 25e of the LED substrate 25C of the present embodiment, the density of the absorption layer 31C increases as it approaches the LED 24 as in the second embodiment (that is, the density of the absorption layer 31C decreases as the distance from the LED 24 increases). ing). Therefore, the closer to the LED 24, the more light is absorbed by the absorption layer 31C. By including the LED substrate 25C on which such an absorption layer 31C is formed, in the illumination device of the present embodiment, the light emitted from the central portion of the diffusion lens 27 is suppressed, and the illumination device It is possible to suppress the occurrence of luminance unevenness in the planar light emitted from.

<Embodiment 5>
Hereinafter, Embodiment 5 of the present invention will be described with reference to FIG. FIG. 12 is an enlarged cross-sectional view of the vicinity of the LED 24 and the diffusing lens 27 constituting the liquid crystal display device 10D according to the fifth embodiment. The basic configuration of the liquid crystal display device 10D of the present embodiment is the same as that of the first embodiment. However, LED board 25D with which illuminating device 12D which comprises liquid crystal display device 10D is provided differs from the thing of Embodiment 1. FIG. Specifically, the LED substrate 25D of this embodiment is different from that of Embodiment 1 in that the absorption layer 31D is directly formed on the same mounting surface 25a1 as the reflection layer 30D. That is, the reflecting layer 30D and the absorbing layer 31D are provided on the LED substrate 25D as one layer (film shape). As in the present embodiment, the absorbing layer 30D may be formed directly on the mounting surface 25a1. In addition, as a method of forming the reflective layer 30D and the absorption layer 31D in predetermined ranges on the surface (mounting surface 25a1) of the base material portion 25a, for example, a known film formation technique such as a photolithography technique is used. The method of using is mentioned.

<Embodiment 6>
The sixth embodiment of the present invention will be described below with reference to FIG. FIG. 13 is an enlarged cross-sectional view of the vicinity of the LED 24 and the diffusing lens 27 constituting the liquid crystal display device 10E according to the sixth embodiment. The basic configuration of the liquid crystal display device 10E of the present embodiment is the same as that of the first embodiment. However, LED board 25E with which the illuminating device 12E which comprises the liquid crystal display device 10E is provided differs from the thing of Embodiment 1. FIG. Specifically, the LED substrate 25E of the present embodiment is implemented in that the absorption layer 31E is formed over a wider range than the range facing the diffusion lens 27 when the mounting surface 25a1 is viewed in a plane. Different from Form 1. Thus, the absorbing layer 31E may be formed in a range outside the range facing the diffusing lens 27.

<Embodiment 7>
The seventh embodiment of the present invention will be described below with reference to FIG. FIG. 14 is an enlarged plan view of the vicinity of the LED 24 in the LED board 25E that constitutes the illumination device according to the seventh embodiment. The basic configuration of the lighting device of the present embodiment is the same as that of the first embodiment. However, in this embodiment, the absorption layer 31F formed on the LED substrate 25F is different from that of the first embodiment. Specifically, as shown in FIG. 14, the absorption layer 31 </ b> F of the present embodiment includes a plurality of (three) pattern portions 31 f 1, 31 f 2, and 31 f 3 that are each annular and adjacent to each other.

  The overall shape of the absorption layer 31F of this embodiment is the same as that of the absorption layer 31 of Embodiment 1 (see FIG. 6) when the surface 25e of the LED substrate 25F is viewed in plan, and has a generally circular shape. However, the absorption layer 31F of the present embodiment is set such that the light absorption rate is small (low) for each pattern portion in the direction away from the LED 24 (the radial direction of the absorption layer 31F having a circular shape). Of the three pattern portions 31f1, 31f2, and 31f3 described above, the pattern portion 31f1 arranged on the innermost side (the LED 24 side) is set to have the highest blackness and the highest (higher) light absorption rate. On the other hand, among the three pattern portions 31f1, 31f2, 31f3, the pattern portion 31f3 arranged on the outermost side is set to have the lowest blackness and the light absorption rate (low). The pattern portion 31f2 sandwiched between the pattern portion 31f1 and the pattern portion 31f3 is set to an intermediate blackness level and light absorption rate. In addition, the light absorption rate (blackness) of each pattern part can be adjusted by selecting suitably the compounding quantity of the pigment (colorant) in the absorption layer 31F, the material utilized for the absorption layer 31F, etc. Moreover, the absorption layer 31E provided with such pattern portions 31f1, 31f2, and 31f3 can be formed by using a known coating film forming method such as screen printing.

  As the surface 25e of the LED substrate 25F of this embodiment approaches the LED 24, the light absorption rate (blackness) of the absorption layer 31F increases (that is, the light absorption rate (black color) of the absorption layer 31F increases as the distance from the LED 24 increases. Degree) is low). Therefore, the closer to the LED 24, the more light is absorbed by the absorption layer 31F. By providing the LED substrate 25 </ b> B on which such an absorption layer 31 </ b> F is formed, in the illumination device according to the present embodiment, the light emitted from the central portion of the diffusion lens 27 is suppressed, and the illumination device It is possible to suppress the occurrence of luminance unevenness in the planar light emitted from.

<Eighth embodiment>
Hereinafter, an eighth embodiment of the present invention will be described with reference to FIG. FIG. 15 is an enlarged plan view of the vicinity of the LED 24 in the LED substrate 25G constituting the lighting apparatus according to the eighth embodiment. The basic configuration of the lighting device of the present embodiment is the same as that of the first embodiment. However, in the present embodiment, the shape of the absorption layer 31G formed on the LED substrate 25G is different from that of the first embodiment. Specifically, as shown in FIG. 15, the absorption layer 31 </ b> G of the present embodiment is composed of pattern portions 31 g each having a shape extending radially from the LED 24. The absorbing layer 31G is made of the same material as that of the first embodiment, and is formed on the reflective layer 30 by using a screen printing technique or the like as in the first embodiment. The light absorption rate of each pattern 31g is set to be the same. In the case of the present embodiment, each pattern portion 31g has an elongated rectangular shape.

  As shown in FIG. 15, when each pattern portion 31 g has a shape extending radially from the LED 24, the proportion of the absorption layer on the mounting surface (surface 25 e) is directed away from the LED 24. , Get smaller. That is, the amount of light absorbed by the absorption layer 31G decreases in the direction away from the LED 24 (in other words, the closer to the LED 24, the more light is absorbed by the absorption layer 31G). Therefore, in the illuminating device of this embodiment, excessive light emitted from the central portion of the diffusing lens 27 is suppressed, and luminance unevenness may occur in the planar light emitted from the illuminating device. It is suppressed.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.

  (1) In Embodiment 1 and the like described above, an absorption layer having the same configuration is provided on the LED substrate for every LED included in the lighting device. In other embodiments, absorption assigned to each LED is used. The type (shape) of the layer may be changed.

  (2) In each of the above-described embodiments, the absorbing layer is formed by applying a liquid material to the mounting surface of the LED substrate and curing it, but the film-like material is mounted on the mounting surface of the LED substrate ( A structure in which an absorbing layer is formed at a predetermined location by being attached to the reflective layer is also included in the present invention. In this case, the film-like material may be adhered on the mounting surface (reflective layer) of the LED substrate by using the adhesive force of the film-like material itself, or the lower surface of the film-like material. Alternatively, an adhesive layer may be formed in advance, and the film-like material may be pasted on the mounting surface (reflective layer) via the adhesive layer.

  (3) In each of the above-described embodiments, the reflective layer is made of a solder resist that covers the entire mounting surface of the LED substrate. However, the reflective layer is formed separately from the solder resist. May be. In that case, the formation range of the reflective layer can be limited to only the portion of the mounting surface of the LED substrate that is within the lens insertion hole of the reflective sheet. Even in this case, it is preferable that the formation range of the reflective layer is slightly expanded outside the lens insertion hole in consideration of assembly errors and the like.

  (4) In each of the above-described embodiments, the case where an LED is used as a light source has been exemplified.

  (5) In each of the above-described embodiments, an optical lens using a diffusion lens that diffuses light from the LED is exemplified, but an optical lens other than the diffusion lens (for example, a condensing lens having a condensing function). Those using are also included in the present invention. The absorption layer provided on the LED substrate is appropriately set according to the structure of the optical lens to be used.

  (6) In each of the above-described embodiments, the case where the material used for the base part of the LED substrate is a metal material is exemplified. However, as the material used for the base part of the LED substrate, an insulating material such as ceramic is used. Is also possible.

  (7) Besides the above-described embodiments, the number and arrangement of LED substrates, the number and arrangement of LEDs mounted on the LED substrate, and the like can be changed as appropriate.

  (8) In the above embodiment, the liquid crystal panel and the chassis are illustrated in a vertically placed shape in which the short side direction coincides with the vertical direction, but the liquid crystal panel and chassis coincide with the long side direction in the vertical direction. What was made into the vertically placed state made into the above is also contained in this invention.

  (9) In the above embodiment, the TFT is used as the switching element of the liquid crystal display device. However, the present invention can also be applied to a liquid crystal display device using a switching element other than the TFT (for example, a thin film diode (TFD)). . In addition to a liquid crystal display device that performs color display, the present invention can also be applied to a liquid crystal display device that performs monochrome display.

  (10) In the above embodiment, a liquid crystal display device using a liquid crystal panel as the display panel has been illustrated, but the present invention is also applicable to a display device using another type of display panel.

  (11) In the above embodiment, the television receiver provided with the tuner is exemplified, but the present invention is also applicable to a display device not provided with the tuner.

  (12) In the above embodiment, the pattern portion forming the reflective layer has a circular shape or an annular shape. However, in other embodiments, a dot shape other than a circular shape (for example, a triangular shape, a square shape, etc.) Polygonal shape) or other shapes such as a spiral shape or a mosaic shape.

  DESCRIPTION OF SYMBOLS 10 ... Liquid crystal display device (display device), 11 ... Liquid crystal panel (display panel), 12 ... Illumination device (backlight device), 24 ... LED (light source, point light source), 25 ... LED substrate (light source substrate), 25a1 ... LED substrate mounting surface, 25a ... base part, 25c ... wiring pattern, 27 ... diffuse lens (optical lens), 29 ... reflective sheet (reflective member), 29d ... lens insertion hole (opening), 30 ... reflective layer 31 ... Absorbing layer, TV ... TV receiver

Claims (15)

A light source;
A light source substrate having a mounting surface on which the light source is mounted, and a reflective layer that is formed on the mounting surface and reflects light from the light source;
An optical lens that is provided on the mounting surface in a state of facing the light source, and transmits light from the light source;
An illumination device comprising: an absorption layer that is formed at least on the mounting surface of the portion facing the optical lens and absorbs light from the light source. The reflective layer is formed on the mounting surface at least near the light source so as to surround the light source,
The optical lens is provided on the mounting surface in a state of facing the light source and the reflective layer near the light source, respectively.
The illuminating device according to claim 1, wherein the absorption layer is formed so as to be laminated at least on the reflection layer facing the optical lens.   The lighting device according to claim 1, wherein the absorption layer is disposed on the mounting surface so as to surround the light source.   The lighting device according to any one of claims 1 to 3, wherein the absorption layer includes a plurality of pattern portions.   The illumination device according to claim 4, wherein each of the pattern portions has a dot shape, and a surface area of the pattern portions sequentially decreases in a direction away from the light source.   The pattern portions are each formed in a dot shape, and an interval between adjacent ones in a circumferential direction centering on the light source is sequentially increased in a direction away from the light source. 5. The lighting device according to 5.   The lighting device according to claim 4, wherein each of the pattern portions has an annular shape centered on the light source, and a surface area of each of the pattern portions gradually decreases in a direction away from the light source.   The illumination device according to any one of claims 4 to 7, wherein the pattern portion has a shape extending radially from the light source.   9. The reflecting member according to claim 1, further comprising: a sheet-like reflecting portion that reflects light from the light source; and a reflecting member that includes a hole penetrating the reflecting portion and exposes the optical lens together with the light source. The illumination device according to any one of the above.   The illumination device according to any one of claims 1 to 9, wherein the optical lens is a diffusion lens that emits light while diffusing light from the light source.   The lighting device according to any one of claims 1 to 10, wherein the absorption layer is black.   The lighting device according to any one of claims 1 to 11, wherein the absorption layer sequentially decreases in light absorption rate in a direction away from the light source.   The lighting device according to any one of claims 1 to 12, wherein the absorption layer is formed over a wider range than a range facing the optical lens when the mounting surface is viewed in a plane.   A display device comprising: the illumination device according to any one of claims 1 to 13; and a display panel that performs display using light from the illumination device.   A television receiver comprising the display device according to claim 14.

Images