JP2013138152A5 - - Google Patents
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- Publication number
- JP2013138152A5 JP2013138152A5 JP2011289257A JP2011289257A JP2013138152A5 JP 2013138152 A5 JP2013138152 A5 JP 2013138152A5 JP 2011289257 A JP2011289257 A JP 2011289257A JP 2011289257 A JP2011289257 A JP 2011289257A JP 2013138152 A5 JP2013138152 A5 JP 2013138152A5
- Authority
- JP
- Japan
- Prior art keywords
- manufactured
- present
- conveyance jig
- transport board
- sliontec
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
Description
（実施例１）
以下、本発明の搬送治具１について、実施例によって具体的に説明する。但し、本発明の搬送治具１はこれらに限定されるものではない。
搬送ボード３は、ニッカン工業株式会社社製のニカプレートＬＳ−６７０６を用いた。サイズ縦２５０ｍｍ×横５００ｍｍ。
粘着性シート５は、オールシリコーン粘着テープＮｏ．６７１０（シングルコート）（マクセルスリオンテック社製）、テープ厚さ３００μｍ、ゴム硬度７０度のものを用いて、搬送ボード３の上に、貼着した。
(Example 1)
Hereinafter, the conveyance jig 1 of the present invention will be specifically described with reference to examples. However, the conveyance jig 1 of the present invention is not limited to these.
As the transport board 3, Nika Plate LS-6706 manufactured by Nikkan Kogyo Co., Ltd. was used. Size length 250mm x width 500mm.
The adhesive sheet 5 is an all-silicone adhesive tape no. 6710 (Single coat) (manufactured by Ma habit Le Sliontec Co.), tape thickness 300 [mu] m, using those rubber hardness of 70 degrees, on the transport board 3, and adhered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011289257A JP5905718B2 (en) | 2011-12-28 | 2011-12-28 | Conveying jig, conveying method, and conveying jig material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011289257A JP5905718B2 (en) | 2011-12-28 | 2011-12-28 | Conveying jig, conveying method, and conveying jig material |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013138152A JP2013138152A (en) | 2013-07-11 |
| JP2013138152A5 true JP2013138152A5 (en) | 2015-03-12 |
| JP5905718B2 JP5905718B2 (en) | 2016-04-20 |
Family
ID=48913626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011289257A Expired - Fee Related JP5905718B2 (en) | 2011-12-28 | 2011-12-28 | Conveying jig, conveying method, and conveying jig material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5905718B2 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6696128B2 (en) * | 2015-08-25 | 2020-05-20 | 大日本印刷株式会社 | Manufacturing method of component mounting thin film wiring substrate |
| JP6742098B2 (en) | 2016-01-15 | 2020-08-19 | 日東電工株式会社 | Mounting member |
| JP6616194B2 (en) | 2016-01-15 | 2019-12-04 | 日東電工株式会社 | Placement member |
| JP6549995B2 (en) | 2016-01-15 | 2019-07-24 | 日東電工株式会社 | Mounting member |
| JP2017175126A (en) | 2016-03-18 | 2017-09-28 | 日東電工株式会社 | Conveying fixing jig |
| WO2018030182A1 (en) | 2016-08-12 | 2018-02-15 | 日東電工株式会社 | Carbon nanotube aggregate |
| JP7051300B2 (en) | 2016-08-12 | 2022-04-11 | 日東電工株式会社 | Carbon nanotube aggregate |
| JP6879692B2 (en) | 2016-08-12 | 2021-06-02 | 日東電工株式会社 | Adhesive structure |
| JP6796984B2 (en) | 2016-10-03 | 2020-12-09 | 日東電工株式会社 | Carbon nanotube aggregate |
| JP6975545B2 (en) | 2016-10-03 | 2021-12-01 | 日東電工株式会社 | Carbon nanotube aggregate |
| JP7144149B2 (en) | 2018-02-06 | 2022-09-29 | 日東電工株式会社 | carbon nanotube assembly |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3081122B2 (en) * | 1994-07-18 | 2000-08-28 | シャープ株式会社 | Jig for transporting substrate and method of manufacturing liquid crystal display element using the same |
| JP2000261193A (en) * | 1999-03-11 | 2000-09-22 | Misuzu Kogyo:Kk | Method of fixing fpc board to carrier board |
| JP4511159B2 (en) * | 2003-11-26 | 2010-07-28 | シバタ工業株式会社 | Adhesive |
| JP2005183424A (en) * | 2003-12-16 | 2005-07-07 | Shin Etsu Polymer Co Ltd | Thin substrate fixing jig |
| JP4522890B2 (en) * | 2005-03-03 | 2010-08-11 | 株式会社 大昌電子 | Board mounting method using sheet unit for printed wiring board |
| JP4459111B2 (en) * | 2005-05-24 | 2010-04-28 | 信越ポリマー株式会社 | Manufacturing method of electronic component holder |
-
2011
- 2011-12-28 JP JP2011289257A patent/JP5905718B2/en not_active Expired - Fee Related
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