JP2012021124A5 - - Google Patents
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- Publication number
- JP2012021124A5 JP2012021124A5 JP2010162308A JP2010162308A JP2012021124A5 JP 2012021124 A5 JP2012021124 A5 JP 2012021124A5 JP 2010162308 A JP2010162308 A JP 2010162308A JP 2010162308 A JP2010162308 A JP 2010162308A JP 2012021124 A5 JP2012021124 A5 JP 2012021124A5
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- adhesive
- molding
- film form
- adhesive according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010162308A JP5686543B2 (en) | 2010-07-16 | 2010-07-16 | Adhesive and adhesive sheet using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010162308A JP5686543B2 (en) | 2010-07-16 | 2010-07-16 | Adhesive and adhesive sheet using the same |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012021124A JP2012021124A (en) | 2012-02-02 |
JP2012021124A5 true JP2012021124A5 (en) | 2013-08-29 |
JP5686543B2 JP5686543B2 (en) | 2015-03-18 |
Family
ID=45775634
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010162308A Active JP5686543B2 (en) | 2010-07-16 | 2010-07-16 | Adhesive and adhesive sheet using the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5686543B2 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5871477B2 (en) * | 2011-03-16 | 2016-03-01 | ソマール株式会社 | Adhesive sheet |
JP6423603B2 (en) * | 2014-03-21 | 2018-11-14 | ナミックス株式会社 | Insulating film and semiconductor device |
JP2016033953A (en) * | 2014-07-31 | 2016-03-10 | 日立化成株式会社 | Temporarily fixing resin composition, temporarily fixing resin film and temporarily fixing resin film sheet |
WO2017010189A1 (en) * | 2015-07-15 | 2017-01-19 | 株式会社村田製作所 | Composition for forming coating film, and electronic component |
JPWO2020040177A1 (en) | 2018-08-23 | 2021-08-12 | 三洋化成工業株式会社 | The composition, the method for producing the composition, the urethane resin, and the cooling parts and articles provided with the urethane resin. |
JP7278810B2 (en) * | 2019-03-14 | 2023-05-22 | 株式会社クラレ | Acrylic resin film and its manufacturing method |
WO2021153619A1 (en) * | 2020-01-28 | 2021-08-05 | 積水化学工業株式会社 | Pressure-sensitive adhesive tape |
JP7472755B2 (en) | 2020-10-27 | 2024-04-23 | artience株式会社 | Laminate |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4911839B2 (en) * | 2001-07-09 | 2012-04-04 | ソマール株式会社 | Conductive pressure-sensitive adhesive composition excellent in flame retardancy and pressure-sensitive adhesive processed product using the same |
JP4709980B2 (en) * | 2005-09-08 | 2011-06-29 | 綜研化学株式会社 | Adhesive layer for EMI film lamination and EMI laminate film |
-
2010
- 2010-07-16 JP JP2010162308A patent/JP5686543B2/en active Active
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