JP2013138077A - Three-dimensional mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a three-dimensional mounting device capable of mounting even a plurality of laminated chips each having a different thickness by pressing the chips at a time with the same pressure and improving throughput.SOLUTION: A three-dimensional mounting device 10 includes: a sealable processing chamber 11; a plurality of mounting tables 14 arranged in the processing chamber 11, for mounting laminated chips 30a-30c, respectively; a pressure chamber 12 arranged opposite to the processing chamber 11; a plurality of pistons 15 arranged corresponding to the mounting tables 14, in which one ends are projected into the processing chamber 11 to form pressing surfaces 15a opposite to mounting surfaces of the plurality of mounting tables 14, respectively, and the other ends are projected into the pressure chamber 12 to form apex flat surfaces 15b, respectively; and a pressure reduction pump 13 for forming differential pressure between pressure in the processing chamber 11 and pressure in the pressure chamber 12. The pressing surfaces 15a of the plurality of pistons 15 press the laminated chips 30a-30c at a time with the same pressing force on the basis of the differential pressure to mount the chips.

Description

  The present invention relates to a three-dimensional mounting apparatus for mounting a plurality of chips.

  In recent years, in order to reduce the footprint of a semiconductor device, a three-dimensional mounting apparatus for manufacturing a semiconductor device by stacking a plurality of IC substrates (chips) has been developed. In the mounting method using this three-dimensional mounting apparatus, a wiring made of a conductor that penetrates the chip in the thickness direction, for example, TSV (Through Silicon Via), is formed in each chip, and is formed at the end of the wiring of one chip. The formed electrode pads are joined to solder bumps formed at the ends of the wirings of other chips to form a three-dimensional circuit. As a three-dimensional mounting method, a COW (Chip On Wafer) method, a COC (Chip On Chip) method, and the like are known. In any method, in order to prevent displacement of the stacked chips, each chip is temporarily bonded prior to the main bonding between the chips, and the plurality of temporarily bonded chips are finally bonded by reflow. It is known (see, for example, Patent Document 1).

JP 2009-110995 A

  However, in the conventional three-dimensional mounting method, a set of a plurality of stacked chips (hereinafter referred to as “stacked chips”) constituting a semiconductor device is reflowed one by one in one chamber, for example, a reflow furnace. In the method of performing reflowing on the number of stacked chips at the same pressure with respect to individual stacked chips, there is a problem that the operation is complicated, the cost per stacked chip increases, and the cost increases as the number of stacked chips increases.

  Also, in the method of absorbing the layer thickness difference between the laminated chips when reflowing the laminated chips having different thicknesses at the same time, for example, in the method of laying the elastomer member under the laminated chip, the laminated chips are pressed simultaneously. As the pressing member increases in size, the temperature rise or cooling time of the pressing member becomes longer, resulting in a decrease in thermal efficiency and a lack of elastomer material that can withstand the environmental conditions of use for a long time. There is a problem of becoming.

  On the other hand, in the method of manufacturing a jig that pressurizes each individual laminated chip independently and placing a plurality of laminated chips respectively to adjust the temperature of the jig or its atmosphere, the laminated chip to each jig There is a problem that the placement and removal of the camera becomes complicated and the throughput is lowered.

  An object of the present invention is to provide a three-dimensional mounting capable of mounting a plurality of laminated chips having different thicknesses by pressing the same pressure at a time and improving the throughput in the mounting process of the laminated chips. To provide an apparatus.

  In order to solve the above-described problem, a three-dimensional mounting apparatus according to claim 1 includes a process chamber that can be sealed, and a plurality of mounting tables that are disposed in the processing chamber and each mount a stacked chip in which a plurality of chips are stacked. And a pressure chamber disposed opposite to the processing chamber, and a pressure provided to correspond to the plurality of mounting tables, one end projecting into the processing chamber and facing the mounting surfaces of the plurality of mounting tables, respectively. A plurality of pistons, the other end of which protrudes into the pressure chamber and forms a top plane, and communicates with the processing chamber and the pressure chamber, and the pressure difference between the pressure in the processing chamber and the pressure chamber A pressure adjusting device to be formed, and the pressing surfaces of the plurality of pistons press and mount the plurality of laminated chips mounted on the plurality of mounting tables at a time based on the differential pressure. It is characterized by.

  The three-dimensional mounting apparatus according to claim 2 is the three-dimensional mounting apparatus according to claim 1, wherein when the pressure in the pressure chamber is higher than the pressure in the processing chamber, the pressing surfaces of the plurality of pistons are the plurality of the plurality of pistons. When the laminated chip is pressed and the pressure in the pressure chamber is lower than the pressure in the processing chamber, the pressing is released.

  The three-dimensional mounting apparatus according to a third aspect is the three-dimensional mounting apparatus according to the first or second aspect, wherein the top plane areas of the plurality of pistons are all equal.

  The three-dimensional mounting apparatus according to claim 4 is the three-dimensional mounting apparatus according to any one of claims 1 to 3, wherein a fishing line for finely adjusting a displacement of the top plane of the piston in the pressure chamber. A support member is provided.

  The three-dimensional mounting apparatus according to claim 5, wherein the piston includes a heating member that heats a pressing surface of the piston and a cooling member that cools the piston. Is embedded.

  The three-dimensional mounting apparatus according to claim 6 is the three-dimensional mounting apparatus according to any one of claims 1 to 5, wherein the mounting table includes a heating member that heats a mounting surface of the mounting table and a cooling device. The cooling member to be embedded is embedded.

  The three-dimensional mounting apparatus according to claim 7 is the three-dimensional mounting apparatus according to any one of claims 1 to 6, wherein the processing chamber includes a plurality of units provided corresponding to the plurality of mounting tables. The processing chamber is connected by a communication pipe.

  The three-dimensional mounting apparatus according to claim 8, wherein the pressure chamber is a plurality of unit pressures provided corresponding to the plurality of pistons. The chamber is communicated by a communication pipe.

  The three-dimensional mounting apparatus according to claim 9, wherein the processing chamber of the connecting rod connecting the pressing surface and the top plane of the piston is the three-dimensional mounting apparatus according to any one of claims 1 to 8. A part of the side is surrounded by a pressure-resistant bellows, and the bellows ensures a sealed state of the processing chamber when the pressing surface of the piston is displaced.

  The three-dimensional mounting apparatus according to claim 10 is the three-dimensional mounting apparatus according to any one of claims 1 to 9, wherein a part of the connecting rod of the piston on the pressure chamber side is a pressure-resistant bellows. It is enclosed, The sealing state of the said pressure chamber when the said top plane of the said piston displaces by this bellows is ensured, It is characterized by the above-mentioned.

  The three-dimensional mounting apparatus according to claim 11 is the three-dimensional mounting apparatus according to any one of claims 1 to 10, wherein the processing chamber and the pressure chamber each open and close an air communication portion. An opening is provided.

  According to the present invention, a processing chamber in which a plurality of mounting tables are disposed, a pressure chamber disposed to face the processing chamber, and a piston provided corresponding to the plurality of mounting tables, one end of which is disposed in the processing chamber A plurality of pistons that form pressure surfaces facing the mounting surfaces of the plurality of mounting tables, the other ends projecting into the pressure chamber to form a top plane, and a pressure in the processing chamber and a pressure in the pressure chamber A pressure adjusting device for forming a differential pressure, and the pressing surface of each piston is configured so that a plurality of stacked chips mounted on the mounting table are moved at a time based on the pressure difference between the pressure in the processing chamber and the pressure in the pressure chamber. Since it presses, even if it is a several laminated chip from which thickness differs, it can mount by pressing at the same pressure at the same time. Moreover, this can improve the throughput in the mounting process of the laminated chip.

It is sectional drawing which shows roughly the structure of the three-dimensional mounting apparatus which concerns on embodiment of this invention. FIG. 2 is a cross-sectional view schematically illustrating a configuration of a laminated chip on which the three-dimensional mounting apparatus in FIG. 1 performs mounting processing, FIG. 2A illustrates a configuration before performing mounting processing, and FIG. The structure after processing is shown. It is a figure for demonstrating the process of the three-dimensional mounting method of the laminated chip which the three-dimensional mounting apparatus of FIG. 1 performs. It is the elements on larger scale figure of the piston which inserted the spherical bearing in the connection part of a press surface and a connecting rod. It is a partial expanded sectional view which shows the modification of the three-dimensional mounting apparatus of FIG.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a cross-sectional view showing a configuration of a three-dimensional mounting apparatus according to an embodiment of the present invention.

  In FIG. 1, a three-dimensional mounting apparatus 10 is connected to a process chamber 11 that can be sealed, a pressure chamber 12 that is disposed on the upper side of the process chamber 11, a process chamber 11, and a pressure chamber 12. It is mainly comprised from the pressure reduction pump 13 as a pressure regulator which forms the differential pressure | voltage between them.

  In the processing chamber 11, a plurality of, for example, three mounting tables 14 are arranged. For example, the stacked chips 30a to 30c having different thicknesses are mounted on the mounting surfaces of the three mounting tables 14, and a mounting process is performed on the stacked chips 30a to 30c. Here, the laminated chip refers to a set of a plurality of chips laminated to constitute a semiconductor device, and the mounting process refers to heating and pressing the laminated chip at a predetermined temperature to melt the solder bumps of each chip. A process of forming a semiconductor device by electrically connecting each chip.

  FIG. 2 is a cross-sectional view schematically showing the configuration of the laminated chip on which the three-dimensional mounting apparatus in FIG. 1 performs the mounting process, and FIG. 2A shows the configuration before the mounting process is performed. B) shows the configuration after the mounting process is performed.

  In FIG. 2A, the laminated chip 30 is configured by laminating a plurality of chips 32 on a base chip 31 arranged at the bottom. A plurality of electrode pads 33 are formed on the upper surface of the base chip 31, a plurality of solder bumps 34 are formed on the lower surface of each chip 32, and a stopper 35 is formed so as to avoid the solder bumps 34. A plurality of electrode pads 36 are formed on the upper surface of the chip 32. The solder bumps 34 on the lower surface of the chip 32 are formed by solder paste attached to the lower surface of the chip 32. Further, a flux (not shown) layer is formed on the surface of each solder bump 34. In each chip 32, the solder bump 34 on the lower surface is connected to the electrode pad 36 on the upper surface by wiring that penetrates the chip 32 in the thickness direction, for example, TSV (not shown).

  When the laminated chip 30 is formed, the chip 32 is overlaid on the base chip 31 so that the solder bumps 34 on the lower surface of the chip 32 are brought into contact with the electrode pads 33 on the upper surface of the base chip 31. The chip 32 is stacked on the base chip 31 so that the solder bumps 34 on the lower surface of the other chip 32 are brought into contact with the electrode pads 36, and thereafter, the stacking of the chips 32 is repeated. At this time, since the total thickness of the electrode pad 36 and the solder bump 34 is larger than the thickness of the stopper 35, the stopper 35 of the upper chip 32 is placed on the upper surface of the lower chip 32 before the mounting process is performed on the laminated chip 30. Will not abut.

  On the other hand, when the mounting process is performed on the laminated chip 30, the solder bumps 34 of the upper chip 32 are melted and joined to the electrode pads 36 of the lower chip 32. At this time, the shape of the solder bumps 34 collapses, The upper chip 32 sinks toward the lower chip 32, and the stopper 35 of the upper chip 32 comes into contact with the upper surface of the lower chip 32 (FIG. 2B). Thereby, a semiconductor device is manufactured from the laminated chip 30.

  Returning to FIG. 1, corresponding to each mounting table 14, the same number of pistons 15 as the mounting table 14 are provided on the upper part thereof. One end of the piston 15 protrudes into the processing chamber 11, and the other end protrudes into the pressure chamber 12. One end of the piston 15 that protrudes into the processing chamber 11, and an end that protrudes into the pressure chamber 12, which is the other end, is formed with a pressing surface 15 a at the end facing the upper plane of the mounting table 14. Is formed with a top plane 15b. The area of the pressing surface 15a of each piston 15 is set to be equal, and the area of the top flat surface 15b of each piston 15 is also set to be equal.

  The pressure chamber 12 is formed by a connection body of three unit pressure chambers 12 a corresponding to the respective pistons 15, and the unit pressure chambers are integrally communicated with each other by a communication pipe 16 to form the pressure chamber 12.

  The boundary between the processing chamber 11 and the pressure chamber 12 is a boundary wall 17 that also serves as an upper wall surface that forms the processing chamber 11 and a lower wall surface that forms the pressure chamber 12. A bearing (hereinafter referred to as “bearing”) 18 such as a bearing is disposed on the sliding contact surface.

  The boundary wall 17 is provided with a slit 17a penetrating vertically in FIG. 1 corresponding to each unit pressure chamber 12a. One end of the slit 17a is opened to the atmosphere, and the other end is connected to the boundary wall 17. It communicates with a space 17b surrounding a part of the connecting rod of the piston 15 in sliding contact on the processing chamber 11 side. That is, a part of the connecting rod of the piston 15 is open to the atmosphere, which is a space that does not belong to either the processing chamber 11 or the pressure chamber 12. Here, the space 17 b refers to a space that is isolated from the space in the processing chamber 11 by the bellows 19 that surrounds a part of the connecting rod of the piston 15 on the pressing surface 15 a side in the processing chamber 11.

  That is, the bellows 19 is a pressure-resistant bellows having a cylindrical shape, for example, the outer peripheral portion of the pressing surface 15a of the piston 15 and the lower surface of the boundary wall 17 facing the outer peripheral portion, and the piston 15 passes therethrough. A space inside the processing chamber 11 that is an outer space of the bellows 19 and an inner space that are arranged so as to connect the through hole and the outer periphery of the surface that includes the portion where the slit 17a communicates. The space 17a surrounding a part of the connecting rod of the piston 15 is isolated. Accordingly, the bellows 19 ensures a sealed state of the processing chamber 11 when the pressing surface 15a of the piston 15 is displaced.

  Further, a part of the connecting rod of the piston 15 on the pressure chamber 12 side is surrounded by a pressure-resistant bellows 20 having a cylindrical shape, for example. That is, the bellows 20 is disposed so as to connect the outer peripheral portion of the top flat surface 15b of the piston 15 and the outer peripheral portion of the surface including the bearing 18 on the upper surface of the partition wall 17 facing the outer peripheral portion. The sealed state of the pressure chamber 12 when the top flat surface 15b of the piston 15 is displaced by the bellows 20 is ensured.

  A heating member 15c for heating the pressing surface 15a of the piston 15 and a cooling member (not shown) for cooling are embedded in the piston 15 that presses the laminated chips 30a to 30c. In addition, the mounting table 14 on which the stacked chips 30a to 30c are mounted is embedded with a heating member 14a for heating the mounting surface of the mounting table 14 and a cooling member (not shown) for cooling. As the heating members 15c and 14a, for example, electric heaters to which electric wirings 15d and 14b are connected are preferably used. In addition, when cooling the mounting surface of the mounting table 14 or the pressing surface 15a of the piston 15, for example, the electric heater is turned off, and cooling air is supplied to the mounting table 14 or the piston 15 having a heat exchange function. Supplied.

  The processing chamber 11 and the pressure chamber 12 are each connected to a decompression pump 13 as a pressure adjusting device by a T-shaped communication pipe 21. An opening / closing valve 22 is provided at a connection portion of the T-shaped communication pipe 21 with the processing chamber 11, an opening / closing valve 23 is provided at a connection portion with the pressure chamber 12, and a connection portion with the decompression pump 13 is provided at the connection portion. An opening / closing valve 24 is provided.

  In addition, the processing chamber 11 and the pressure chamber 12 are provided with a mass flow controller 27 attached to an open valve 25 as an atmospheric release unit and a connection pipe 28 communicating with the atmospheric air, respectively.

  The operation of various devices including the decompression pump 13 and the open / close valves 22 to 24 in the three-dimensional mounting apparatus 10 corresponds to, for example, a CPU of a control unit (not shown) included in the three-dimensional mounting apparatus 10 corresponding to the three-dimensional mounting method. Control according to the program.

  Next, the three-dimensional mounting method of the laminated chip executed by the three-dimensional mounting apparatus of FIG. 1 will be described. First, the principle of movement of the piston 15 in the mounting method using the three-dimensional mounting apparatus 10 of FIG. 1 will be described.

  1, the piston 15 is slidably supported with respect to the inner wall surface of the through hole penetrating the boundary wall 17 in the vertical direction in FIG.

  The space surrounded by the bellows 19 in the processing chamber 11 is isolated from the space in the processing chamber 11, and the space surrounded by the bellows 20 in the pressure chamber 12 is also isolated from the space in the pressure chamber 12. Yes. Accordingly, the piston 15 is configured to be slidable in the vertical direction in FIG. 1 while maintaining the pressure in the space surrounded by the bellows 19 and the space surrounded by the bellows 20 at a predetermined pressure, for example, atmospheric pressure. Yes. In this state, for example, when the pressure in the processing chamber 11 is reduced to a pressure lower than the atmospheric pressure while the pressure in the pressure chamber 12 is maintained at atmospheric pressure, the processing chamber 11 and the pressure chamber 12 are all treated on the inner wall surfaces. A force that reduces the volume in the chamber 11 and increases the volume in the pressure chamber 12 to balance the pressure in both chambers acts, and this acting force also acts on the top plane 15 b of the piston 15. The top plane 15b that has received the acting force tends to be displaced downward in FIG. 1, whereby the entire piston 15 is pressed downward and pulled into the processing chamber 11, and as a result, is provided at the lower end of the piston 15. The upper surface of the laminated chip 30 mounted on the mounting table 14 is pressed by the pressing surface 15a.

  The magnitude of the force that balances the pressures in the two chambers described above is determined by the difference between the pressure in the processing chamber 11 and the pressure in the pressure chamber 12 (differential pressure). In the three-dimensional mounting apparatus 10 of FIG. 1, the pressures in the three unit pressure chambers 12 a corresponding to the respective pistons 15 are kept the same because they are integrally communicated by the communication pipe 16, while the pistons 15 are the same. It faces the processing chamber 11 maintained at pressure. Further, the area of the top flat surface 15b of each piston 15 is set equal. Accordingly, all of the acting forces on the pistons 15 resulting from the differential pressure are equal. Thereby, it is possible to press the plurality of laminated chips 30a to 30c placed on the placing table 14 by the pressing surface 15a of each piston 15 at the same time regardless of the thickness of each laminated chip 30a to 30c. it can.

  FIG. 3 ((A)-(D)) is a figure for demonstrating the process of the three-dimensional mounting method of the laminated chip which the three-dimensional mounting apparatus of FIG. 1 performs.

  In FIG. 3, first, each piston 15 is positioned at the top in the vertical direction, and in the initial state where the pressure in the processing chamber 11 and the pressure in the pressure chamber 12 are the same, for example, atmospheric pressure, for example, an unillustrated transfer device. Thus, the stacked chips 30 a to 30 c having different heights are carried into the processing chamber 12 and placed on the mounting tables 14. Further, the mounting surfaces of the mounting tables 14 and the pressing surfaces 15a of the pistons 15 are heated by the heating members 14a and 15c, for example, in accordance with a solder reflow profile (FIG. 3A).

  Next, the stacked chips 30 a to 30 c placed on the respective placement tables 14 are left until they are equal to the surface temperature of the placement table 14, and then the processing chamber 11 and the pressure chamber 12 are hermetically sealed to open and close the communication pipe 21. The valve 23 is closed, the open / close valves 22 and 24 are opened, and the decompression pump 13 is activated to reduce the internal pressure of the processing chamber 11 to, for example, 133 Pa (1 Torr). When the pressure in the processing chamber 11 is reduced, a pressure difference ΔP is generated between the processing chamber 11 and the pressure in the pressure chamber 12 that is, for example, atmospheric pressure, and as described above, based on the pressure difference ΔP. Each piston 15 is drawn into the processing chamber 11, and the pressing surface 15a of the piston 15 is displaced to press the upper surfaces of the laminated chips 30a to 30c downward with the same pressing force.

  At this time, first, the pressing surface 15a of the piston 15 facing the thickest laminated chip 30a contacts the upper surface of the laminated chip 30a to press the laminated chip 30a (FIG. 3B), and then second. The pressing surface 15a of the piston 15 facing the thick laminated chip 30b contacts the upper surface of the laminated chip 30b and presses the laminated chip 30b (FIG. 3C). Finally, the piston facing the thinnest laminated chip 30c. The 15 pressing surfaces 15a come into contact with the upper surface of the laminated chip 30c and press the laminated chip 30c (FIG. 3D). The relationship between the pressure in the processing chamber 11 (pressure 2) and the pressure in the pressure chamber 12 (pressure 3) at the time of pressing the laminated chip is as shown in Expression (1).

Pressure 2 <Pressure 3 (1)
When the differential pressure ΔP is formed between the processing chamber 11 and the pressure chamber 12, the open valve 25 provided in the processing chamber 11 and the mass flow meter 27 of the communication pipe 28 connected to the pressure chamber 12 can be used in combination. At this time, using the mass flow meter 27, for example, an inert gas such as external air or N ₂ gas can be introduced into the pressure chamber 12 to increase the pressure in the pressure chamber 12.
In addition, the time difference at which the pressing in the laminated chips 30a to 30c is started is very small, and the laminated chips 30a to 30c are pressed at a time with substantially the same pressure.

  In the laminated chips 30a to 30c pressed in this manner, the solder bumps of each chip, which is a constituent member of the laminated chip, are melted and joined to the adjacent, for example, electrode pads of the lower chip, thereby increasing the thickness. Different semiconductor devices are manufactured.

  Next, the decompression pump 13, the on-off valves 22 to 24, etc. are controlled to return the pressure in the processing chamber 11 to the same pressure as the pressure in the pressure chamber 12, for example, atmospheric pressure, so that each piston 15 is in the initial state which is the highest level. After returning and cooling the semiconductor device to a predetermined temperature, for example, room temperature, if necessary, the sealed state of the processing chamber 11 is released, and the semiconductor device as a product is carried out.

  According to the three-dimensional mounting apparatus 10 according to the present embodiment, the processing chamber 11 in which the plurality of mounting tables 14 are disposed, the pressure chamber 12 that is disposed to face the processing chamber 11, and the plurality of mounting tables 4. A plurality of pistons 15 provided correspondingly and a decompression pump 13 that forms a differential pressure between the processing chamber 11 and the pressure chamber 12, and the processing chamber 11 and the pressure chamber generated by operating the decompression pump 13. Since the plurality of stacked chips 30a to 30c mounted on the mounting table 14 are pressed by the pressing surface 15a of the piston 15 based on the differential pressure of 12, even the plurality of stacked chips having different thicknesses are at the same pressure. A plurality of semiconductor devices can be manufactured by pressing and mounting at one time.

  In addition, according to the present embodiment, a power source such as a motor or an actuator for displacing the pressing surface 15a of each piston 15 is not required, so that the number of necessary parts is reduced as compared with the conventional technique, and the processing chamber is reduced. A mounting process can be performed on a plurality of laminated chips by a simple operation of providing a differential pressure ΔP between the pressure chamber 11 and the pressure chamber 12, maintaining the differential pressure ΔP for a predetermined time, and then eliminating the differential pressure ΔP. . Therefore, complicated operations are not required, and the throughput in the mounting process can be improved.

  In addition, according to the present embodiment, a rug made of, for example, an elastomer material for absorbing the difference in thickness between a plurality of laminated chips, which has been necessary in the conventional apparatus, becomes unnecessary, and the running cost can be reduced. Can be planned. Furthermore, since the mounting table 14 on which the stacked chips 30a to 30c are mounted and the pressing surface 15a of the piston 15 to be pressed are used as individual mounting tables and pressing surfaces respectively corresponding to the stacked chips 30a to 30c, a large one-piece unit is provided. Compared with the prior art using the mounting table or the pressing surface, the thermal efficiency when heating and cooling the laminated chips 30a to 30c is improved.

  In the present embodiment, the pressure difference ΔP between the processing chamber 11 and the pressure chamber 12 is ΔP that is obtained in advance through experiments or the like and that provides the pressing force required to press the laminated chips 30a to 30c by the pressing surface 15a of the piston 15. It is preferable to set to. This makes it possible to set ΔP at which a necessary pressing force can be easily obtained.

  In the present embodiment, the relationship among the atmospheric pressure (pressure 1), the pressure in the processing chamber 11 (pressure 2), and the pressure in the pressure chamber 12 (pressure 3) is expressed by the following equation (2 It is preferable that the relationship of the following formula (3) is satisfied when the semiconductor device as a product is taken out.

Pressure 1 ≤ Pressure 2> Pressure 3 (2)
Pressure 1 ≤ Pressure 2 ≤ Pressure 3 (3)
As a result, even if the pressure chamber 12 is accidentally opened to the atmosphere, the piston 15 is displaced in the direction of moving upward in FIG. 1, so that the pressing force against the stacked chucks 30a to 30c suddenly increases. Inconvenience can be avoided.

  In the present embodiment, the internal volumes of the processing chamber 11 and the pressure chamber 12 are usually set to the same volume, but are not necessarily the same. When the pressure in the processing chamber 12 is set to a pressure close to the atmosphere and the pressure in the pressure chamber 12 is set higher than the pressure in the processing chamber 11 to perform the mounting process, the pressure is larger than the inner volume of the processing chamber 12. It is preferable to reduce the internal volume of the chamber 12, so that the power consumption of the decompression pump 13 can be saved. On the other hand, by making the internal volume of the pressure chamber 12 larger than the internal volume of the processing chamber 11, the amount of change in the pressure in the pressure chamber 12 with respect to the driving force or operating time of the decompression pump 13 becomes small. The displacement of the surface 15a can be finely adjusted.

  In the present embodiment, the slit 17a provided in the boundary wall 17 and the space 17b communicating with the slit 17a are open to the atmosphere, so that it can be easily used as piping or wiring space. The pressure in the slit 17a and the space 17b communicating with the slit 17a is not limited to the atmospheric pressure, and may be a pressure other than the atmospheric pressure as long as no pressure fluctuation is involved.

  In the present embodiment, the number of mounting bases 14 in the processing chamber 12 is three, but the number of mounting bases 14, that is, the number of stacked chips 30 that perform mounting processing at a time is not limited. There may be four or more.

  In the present embodiment, a spherical bearing can be interposed in the connection portion between the pressing surface 15a and the connecting rod in the piston 15.

  FIG. 4 is a partially enlarged cross-sectional view of the piston 15 in which a spherical bearing is interposed at the connecting portion between the pressing surface 15a and the connecting rod.

  In FIG. 4, at the end of the connecting rod 41 of the piston 15 on the side of the pressing surface 15a, there is a spherically-shaped convex portion 42 on the opposite side of the pressing surface 15a, and the coupling is opposed to the concave-shaped convex portion 42. The end of the rod 41 has a spherical recess 43, and the protrusion 42 is fitted in the recess 43. Since the radius of curvature of the concave portion 43 is set slightly larger than the radius of curvature of the convex portion 42, the convex portion 42 is fitted into the concave portion 43, and the convex portion 42 is in the concave portion 43. Move to trace. Thereby, since the freedom degree of the inclination with respect to the perpendicular direction of the press surface 15a improves, even if it is a lamination | stacking chip | tip whose upper surface is not horizontal, for example, the press surface 15a can be contact | abutted correctly and reliably pressed. it can.

  Further, a spherical bearing as shown in FIG. 4 can be interposed between the mounting surface of the mounting table 14 and the mounting table main body that supports the mounting surface, and this also provides the same effects as described above. Is obtained.

  In the present embodiment, it is preferable to provide a fishing support member for adjusting the solid difference in the displacement amount of the top plane of each piston 15 in the pressure chamber 12 including the area error of the top plane 15b of each piston 15. .

  FIG. 5 is a partial cross-sectional view of a three-dimensional mounting apparatus showing a modification of the present embodiment.

  In FIG. 5, the top flat surface 15b of the piston 15 in the unit pressure chamber 12a is supported by, for example, a spring member 51b as an elastic member having one end fixed to a support member 51a fixed to the upper wall surface of the pressure chamber 12a. Yes. The support member 51a and the spring member 51b constitute a fishing support member 51.

  In such a fishing support member 51, by adjusting the restoring force of the spring member 51b, the amount of displacement of the top flat surface 15b that is displaced based on the differential pressure ΔP between the processing chamber 11 and the pressure chamber 12 can be adjusted and adjusted. The amount of displacement of the top surface 15b of the piston 15, in other words, the amount of displacement of the pressing surface 15a can be adjusted to eliminate the solid difference in each piston 15. In contrast to the above case, in the laminated chips 30a to 30c, when it is desired to provide a difference in the pressing force by each piston 15, the restoring force of the spring member 51b can be adjusted as such. Such an operation is used, for example, for adjusting the individual difference of the device immediately after the device is assembled.

  As mentioned above, although this invention was demonstrated in detail using embodiment, this invention is not limited to these embodiment.

DESCRIPTION OF SYMBOLS 10 Three-dimensional mounting apparatus 11 Processing chamber 12 Pressure chamber 13 Pressure reduction pump 14 Mounting stand 15 Piston 15a Pressing surface 15b Top part plane 30a-30c Multilayer chip | tip

Claims (11)

A processable chamber,
A plurality of mounting tables, each of which is placed in the processing chamber and on which a stacked chip in which a plurality of chips are stacked is mounted;
A pressure chamber disposed opposite the processing chamber;
Provided corresponding to the plurality of mounting tables, one end protrudes into the processing chamber to form a pressing surface respectively facing the mounting surface of the plurality of mounting tables, and the other end protrudes into the pressure chamber. A plurality of pistons forming
A pressure adjusting device that communicates with the processing chamber and the pressure chamber and forms a differential pressure between the pressure in the processing chamber and the pressure in the pressure chamber;
The three-dimensional mounting apparatus characterized in that the pressing surfaces of the plurality of pistons press and mount the plurality of laminated chips mounted on the plurality of mounting tables at a time based on the differential pressure.   When the pressure in the pressure chamber is higher than the pressure in the processing chamber, the pressing surfaces of the plurality of pistons press the plurality of laminated chips, and when the pressure in the pressure chamber is lower than the pressure in the processing chamber, The three-dimensional mounting apparatus according to claim 1, wherein the pressing is eliminated.   3. The three-dimensional mounting apparatus according to claim 1, wherein areas of the top planes of the plurality of pistons are all equal.   4. The three-dimensional mounting apparatus according to claim 1, wherein a fishing support member for finely adjusting a displacement of the top plane of the piston is provided in the pressure chamber. 5.   5. The three-dimensional mounting apparatus according to claim 1, wherein a heating member that heats a pressing surface of the piston and a cooling member that cools the piston are embedded in the piston.   The three-dimensional mounting apparatus according to any one of claims 1 to 5, wherein a heating member that heats a mounting surface of the mounting table and a cooling member that cools the mounting surface are embedded in the mounting table. .   7. The processing chamber according to claim 1, wherein a plurality of unit processing chambers provided corresponding to the plurality of mounting tables are communicated with each other by a communication pipe. Three-dimensional mounting device.   The tertiary according to any one of claims 1 to 7, wherein the pressure chamber is a unit in which a plurality of unit pressure chambers provided corresponding to the plurality of pistons are connected by a communication pipe. Former mounting device.   A part of the processing chamber side of the connecting rod that connects the pressing surface and the top plane of the piston is surrounded by a pressure-resistant bellows, and the pressing surface of the piston is displaced by the bellows. The three-dimensional mounting apparatus according to claim 1, wherein a sealed state of the processing chamber is ensured.   A part of the connecting rod of the piston on the pressure chamber side is surrounded by a pressure-resistant bellows, and the bellows ensures a sealed state of the pressure chamber when the top plane of the piston is displaced. The three-dimensional mounting apparatus according to any one of claims 1 to 9, wherein   11. The three-dimensional mounting apparatus according to claim 1, wherein each of the processing chamber and the pressure chamber is provided with an atmosphere opening portion that opens and closes a communication portion with the atmosphere.

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