JP2013134942A - Lighting device, display device, and tv receiver - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress luminance unevenness and improve heat dissipation as well.SOLUTION: A backlight device (lighting device) 12 includes LEDs (light sources) 17, a light guide plate 19 arranged to face the LEDs 17 and having light incident surfaces 19b into which light from the LEDs 17 enter and a light emission surface 19a emitting an incident light, a chassis 14 which houses the LEDs 17 and the light guide plate 19 and has an exposed face 14d exposed to the outside, LED-fitting parts 24 to which the LEDs 17 are fitted, and a heat dissipation member 22 which includes a light guide plate supporting part 25 which extends out from the LED-fitting parts 24 toward a light guide plate 19 side and supports the light guide plate 19 from an opposite side to a light emission surface 19a side and a reinforcing part 26 extending out from the light guide plate supporting part 25 toward the opposite side of the light guide plate 19 side and, moreover, constituting at least a portion of the chassis 14.

Description

  The present invention relates to a lighting device, a display device, and a television receiver.

In recent years, display elements of image display devices such as television receivers are shifting from conventional cathode ray tubes to thin display panels such as liquid crystal panels and plasma display panels, which enables thinning of image display devices. Since the liquid crystal panel used for the liquid crystal display device does not emit light by itself, a backlight device is separately required as a lighting device, and the backlight device is roughly classified into a direct type and an edge light type according to the mechanism. In order to further reduce the thickness of the liquid crystal display device, it is preferable to use an edge light type backlight device, and an example described in Patent Document 1 below is known.
In the device described in Patent Document 1, an LED is used as a light source, an LED substrate on which a plurality of LEDs are mounted is attached to a heat radiating member, and heat is radiated so that the LED faces the light incident surface of the light guide plate. The members are arranged.

JP 2010-9787 A

By the way, when the liquid crystal display device including the backlight device as described above is enlarged, a long heat radiating member is used accordingly, and thus the heat radiating member is likely to be deformed. Then, the position of the LED attached to the heat dissipation member is likely to fluctuate, and the positional relationship between the light incident surface of the light guide plate and the LED becomes unstable, so that the incident efficiency of light incident from the LED to the light incident surface Becomes unstable, and as a result, there is a concern that unevenness in luminance occurs in the light emitted from the light exit surface of the light guide plate.
On the other hand, when the size of the liquid crystal display device is increased, the number of installed LEDs increases accordingly, and the amount of heat generated from the LEDs increases. For this reason, the further improvement of the thermal radiation performance by a thermal radiation member was desired.

  The present invention has been completed based on the above circumstances, and an object thereof is to suppress unevenness in luminance and improve heat dissipation.

  The illumination device of the present invention includes a light source, a light guide plate that is arranged to face the light source and receives light from the light source, and a light output surface that emits the incident light. A chassis having an exposed surface that accommodates the light source and the light guide plate and is exposed to the outside, a light source attachment portion to which the light source is attached, and extends from the light source attachment portion toward the light guide plate and the light guide plate A light guide plate support portion that supports the light output surface side from the opposite side, and a reinforcing portion that protrudes from the light guide plate support portion toward the opposite side of the light guide plate side, and at least of the chassis A heat dissipating member constituting a part.

  If it does in this way, after the light emitted from the light source attached to the light source attachment part of a heat radiating member will inject into the light-incidence surface of a light-guide plate, is propagated in the inside of a light-guide plate, and is radiate | emitted from a light-projection surface. . Since the heat dissipation member is reinforced by a reinforcing portion that protrudes from the light guide plate support portion toward the side opposite to the light guide plate side, the light source mounting portion is less likely to be deformed, such as warping. The relative position of the light source attached to the attachment portion with respect to the light incident surface is unlikely to fluctuate, so that the light incident efficiency on the light incident surface can be stabilized. Moreover, since the reinforcement is reinforced by the reinforcement part, the light guide plate support part is less likely to be deformed such as warpage, so that the light guide plate can be stably supported from the side opposite to the light emitting surface side. As a result, the relative position of the light incident surface of the light guide plate with respect to the light source does not easily change, and the light incident efficiency on the light incident surface can be stabilized. As described above, since the light incident efficiency on the light incident surface of the light guide plate is stabilized, the occurrence of uneven brightness in the light emitted from the light emitting surface is suppressed. In addition, the heat dissipating member constitutes at least a part of the chassis, and the chassis has an exposed surface that is exposed to the outside of the lighting device, and thus is generated as the light source emits light. When the heat is transmitted to the heat radiating member, the heat can be efficiently dissipated from the heat radiating member exposed to the outside, and thereby high heat dissipation can be obtained.

  By the way, when the lighting device is increased in size, the heat dissipating member also increases, so that the strength is insufficient and deformation such as warpage is likely to occur, and the amount of heat generated from the light source increases, improving the heat dissipating performance. However, as described above, the heat radiation member is reinforced by the reinforcing portion, so that deformation such as warpage is difficult to occur, and at least a part of the chassis where the heat radiation member is exposed to the outside is configured. Therefore, it is suitable for increasing the size of the lighting device.

The following configuration is preferable as an embodiment of the present invention.
(1) The chassis includes the heat radiating member and a bottom plate member that is coupled to the heat radiating member and extends along a plate surface of the light guide plate opposite to the light emitting surface. In this way, since the chassis is configured by the heat radiating member and the bottom plate member, for example, when changing the size of the lighting device, it is possible to cope by changing the size of only the bottom plate member. Is done. As a result, the heat dissipating member can be reused, so that the manufacturing cost can be reduced and the size of the lighting device can be increased more easily.

(2) The said baseplate member is connected with the protrusion front-end | tip part from the said light-guide plate support part in the said reinforcement part among the said heat radiating members. In this way, the protruding tip of the reinforcing portion can be prevented from protruding outward from the bottom plate member, so that problems such as the reinforcing portion being caught by other members are less likely to occur, thereby improving productivity. Can do.

(3) The bottom plate member is arranged at a position having a gap between the bottom plate member and the light guide plate. If it does in this way, it will become difficult to produce heat transfer from a baseplate member to a light-guide plate.

(4) The said reinforcement part is provided in the edge part on the opposite side to the said light source attachment part side in the said light-guide plate support part. If it does in this way, compared with the case where a reinforcement part is provided in parts other than the said edge part among light-guide plate support parts, since the shape of a heat radiating member will become simple, manufacture of a heat radiating member is easy. Thus, the manufacturing cost related to the heat radiating member can be reduced.

(5) The heat radiating member is formed in such a size that the light source mounting portion extends over substantially the entire length of the light incident surface of the light guide plate, and the light guide plate support portion and the reinforcing portion are the light source mounting portion. It is formed in a size that extends over almost the entire length. In this way, with respect to the light source mounting portion formed to extend to almost the entire length of the light incident surface of the light guide plate, the light guide plate support portion and the reinforcing portion are set to extend to almost the entire length. Therefore, the strength of the heat dissipating member can be made higher.

(6) A plurality of the light sources are intermittently arranged in the light source mounting portion of the heat radiating member. If it does in this way, since deformation, such as curvature, will not arise easily in a light source attaching part by a reinforcement part, what differs in a position differs between a plurality of light sources arranged along with intermittently in a light source attaching part. Become. As a result, the incident efficiency of light incident on the light incident surface from each light source can be made stable, which is more suitable for reducing luminance unevenness.

(7) The light source and the heat radiating member are arranged at least one pair so as to sandwich the light guide plate from both sides, and at least a pair of the light guide plate support portions are arranged to support both end portions of the light guide plate. Yes. In this way, since both ends of the light guide plate are supported by the light guide plate support portions of the at least one pair of heat dissipating members arranged so as to sandwich the light guide plate from both sides, each light source plate attached to each light source attachment portion The positional relationship of the light guide plate with respect to the light source becomes more stable. Thereby, the incident efficiency of light to each light incident surface of the light guide plate is stabilized, which is more suitable for suppressing luminance unevenness.

(8) The light source is mounted and a light source substrate attached to the light source mounting portion of the heat dissipation member is provided. In this way, the light source mounting part is less likely to be warped by the reinforcing part, so that it is possible to avoid a situation in which the light source board attached to the light source mounting part is detached from the light source mounting part. it can.

(9) The heat dissipation member is made of a metal material, and an oxide layer is formed on the surface thereof. If it does in this way, since the emissivity of the heat | fever in a heat radiating member will become high by forming an oxide layer in the surface of the heat radiating member which consists of metal materials, the heat dissipation of a heat radiating member can be improved more.

(10) The heat radiating member has aluminum as the metal material and an alumite layer formed on the surface thereof. In this way, in addition to the good thermal conductivity of aluminum, the emissivity is increased by forming an alumite layer on the surface, so that the heat dissipation of the heat dissipation member can be further improved.

(11) The heat dissipating member is coated with a heat dissipating paint containing a metal oxide on the surface thereof. If it does in this way, the heat dissipation of a heat radiating member can be improved more by apply | coating the heat radiating coating material containing the metal oxide to the surface of the heat radiating member.

(12) The heat radiating member has a black surface. If it does in this way, the radiation of the heat in a heat radiating member will become high by making the surface black, and, therefore, the heat radiating property of a heat radiating member can be improved more.

  Next, in order to solve the above problem, a display device of the present invention includes the above-described illumination device and a display panel that performs display using light from the illumination device.

  According to such a display device, the illuminating device that supplies light to the display panel is less likely to cause uneven luminance and has excellent heat dissipation, so that display with excellent display quality and operational reliability are achieved. Can be improved.

  An example of the display panel is a liquid crystal panel. Such a display device can be applied as a liquid crystal display device to various uses such as a display of a television or a personal computer, and is particularly suitable for a large screen.

  According to the present invention, luminance unevenness can be suppressed and heat dissipation can be improved.

1 is an exploded perspective view showing a schematic configuration of a television receiver according to Embodiment 1 of the present invention. Exploded perspective view showing schematic configuration of liquid crystal display device Sectional drawing which shows the cross-sectional structure along the short side direction in a liquid crystal display device The top view which shows arrangement | positioning structure of the chassis (a heat radiating member and a baseplate member), a light-guide plate, and an LED board in the backlight apparatus with which a liquid crystal display device is equipped. Front view of heat dissipation member and LED board Sectional drawing of the thermal radiation member which concerns on Embodiment 2 of this invention Sectional drawing of the thermal radiation member which concerns on Embodiment 3 of this invention Sectional drawing of the thermal radiation member which concerns on Embodiment 4 of this invention Sectional drawing of the thermal radiation member which concerns on Embodiment 5 of this invention, and a baseplate member Sectional drawing of the thermal radiation member which concerns on Embodiment 6 of this invention. Sectional drawing of the thermal radiation member which concerns on Embodiment 7 of this invention, and a baseplate member The top view which shows the arrangement configuration of the chassis (heat radiating member and bottom plate member), light-guide plate, and LED board concerning Embodiment 8 of this invention. Sectional drawing of the chassis which concerns on Embodiment 9 of this invention.

<Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS. In this embodiment, the liquid crystal display device 10 is illustrated. In addition, a part of each drawing shows an X axis, a Y axis, and a Z axis, and each axis direction is drawn to be a direction shown in each drawing. Moreover, let the upper side shown in FIG. 4 be a front side, and let the lower side of the figure be a back side.

  As shown in FIG. 1, the television receiver TV according to the present embodiment includes a liquid crystal display device 10, front and back cabinets Ca and Cb that are accommodated so as to sandwich the liquid crystal display device 10, a power source P, a tuner T, And a stand S. The liquid crystal display device (display device) 10 has a horizontally long rectangular shape (rectangular shape, longitudinal shape) as a whole, and is accommodated in a vertically placed state. As shown in FIG. 2, the liquid crystal display device 10 includes a liquid crystal panel 11 that is a display panel and a backlight device (illumination device) 12 that is an external light source, which are integrated by a frame-like bezel 13 or the like. Is supposed to be retained.

  As shown in FIG. 2, the liquid crystal panel 11 has a horizontally long rectangular shape (rectangular shape, longitudinal shape) in a plan view, and a pair of glass substrates having excellent translucency are separated by a predetermined gap. In addition, the liquid crystal is sealed between both substrates. One substrate is provided with a switching element (for example, TFT) connected to a source wiring and a gate wiring orthogonal to each other, a pixel electrode connected to the switching element, an alignment film, and the like. Are provided with a color filter in which colored portions such as R (red), G (green), and B (blue) are arranged in a predetermined arrangement, a counter electrode, and an alignment film. A polarizing plate is disposed on the outside of both substrates.

  As shown in FIG. 2, the backlight device 12 covers the chassis 14 having a light emitting portion 14 c that opens toward the front side (light emitting side, liquid crystal panel 11 side), and the light emitting portion 14 c of the chassis 14. The optical member 15 is provided. Furthermore, in the chassis 14, an LED (Light Emitting Diode) 17 that is a light source, an LED substrate 18 on which the LED 17 is mounted, and light from the LED 17 are guided to the optical member 15 (liquid crystal panel 11). And a frame (pressing member) 16 for pressing the light guide plate 19 and the optical member 15 from the front side. The backlight device 12 includes LED substrates 18 having LEDs 17 at both ends on the long side, and a light guide plate 19 disposed at the center between the LED substrates 18 on both sides. The so-called edge light type (side light type) is used. Below, each component of the backlight apparatus 12 is demonstrated in detail.

  The chassis 14 is made of metal, and as shown in FIGS. 2 and 4, the chassis 14 has a horizontally-long rectangular shape in the same manner as the liquid crystal panel 11 in a plan view, and its long side direction is the X-axis direction (horizontal direction). ) And the short side direction matches the Y-axis direction (vertical direction). The chassis 14 has a bottom plate 14a disposed opposite to the light guide plate 19 on the back side, and a pair of side plates 14b rising from both ends of the long side of the bottom plate 14a toward the front side. The LED board 18 is attached to each of the pair of side plates 14b. The bottom plate 14a is bent stepwise along the way. The outer surfaces of the bottom plate 14 a and the side plates 14 b are exposed surfaces 14 d that are exposed to the outside of the backlight device 12. Further, the frame 16 and the bezel 13 can be screwed to the side plate 14b. The chassis 14 includes a pair of heat radiating members 22 having a part of the bottom plate 14 a and a side plate 14 b, and a bottom plate member 23 having a part of the bottom plate 14 a and connected to the pair of heat radiating members 22. . The heat radiating member 22 and the bottom plate member 23 will be described in detail later.

  As shown in FIG. 2, the optical member 15 has a horizontally long rectangular shape in a plan view, like the liquid crystal panel 11 and the chassis 14. The optical member 15 is placed on the front side (light emitting side) of the light guide plate 19 and is interposed between the liquid crystal panel 11 and the light guide plate 19. The optical member 15 includes a diffusion plate 15a disposed on the back side and an optical sheet 15b disposed on the front side. The diffusing plate 15a has a structure in which a large number of diffusing particles are dispersed in a base material made of a substantially transparent synthetic resin having a predetermined thickness and has a function of diffusing transmitted light. The optical sheet 15b has a sheet shape that is thinner than the diffusion plate 15a, and three optical sheets are laminated. Specific types of the optical sheet 15b include, for example, a diffusion sheet, a lens sheet, a reflective polarizing sheet, and the like, which can be appropriately selected and used. In FIG. 3, the illustration of the optical member 15 is simplified.

  As shown in FIG. 2, the frame 16 is formed in a frame shape (frame shape) extending along the outer peripheral edge portions of the optical member 15 and the light guide plate 19, and the outer peripheral edge of the optical member 15 and the light guide plate 19. It can be pressed from the front side over almost the entire circumference while facing the part. The frame 16 is made of a synthetic resin and has a light shielding property by having a surface with, for example, a black color. As shown in FIG. 3, a first reflecting sheet 20 for reflecting light is attached to the back side surfaces of both long sides of the frame 16, that is, the surface facing the light guide plate 19 and the LED substrate 18 (LED 17). It has been. The first reflection sheet 20 has a size extending over substantially the entire length of the long side portion of the frame 16 and covers the LED 17 side end portion of the light guide plate 19 and the LED substrate 18 from the front side. It is said. Further, the frame 16 can receive the outer peripheral edge of the liquid crystal panel 11 from the back side.

  As shown in FIGS. 3 and 4, the LED 17 has a configuration in which an LED chip is sealed with a resin material on a substrate portion fixed to the LED substrate 18. The LED chip mounted on the substrate unit has one main emission wavelength, and specifically, one that emits blue light in a single color is used. On the other hand, the resin material that seals the LED chip is dispersed and blended with a phosphor that emits a predetermined color when excited by the blue light emitted from the LED chip, and generally emits white light as a whole. It is said. In addition, as the phosphor, for example, a yellow phosphor that emits yellow light, a green phosphor that emits green light, and a red phosphor that emits red light are used in appropriate combination, or any one of them is used. It can be used alone. The LED 17 is a so-called top surface light emitting type in which a surface opposite to the mounting surface with respect to the LED substrate 18 is a light emitting surface.

  As shown in FIGS. 2 to 4, the LED substrate 18 has an elongated plate shape extending along the long side direction of the chassis 14 (X-axis direction, the longitudinal direction of the light incident surface 19 b of the light guide plate 19). The main surface is accommodated in the chassis 14 in a posture parallel to the X-axis direction and the Z-axis direction, that is, in a posture orthogonal to the plate surfaces of the liquid crystal panel 11 and the light guide plate 19 (optical member 15). The LED 17 having the above-described configuration is surface-mounted on the inner surface, that is, the surface facing the light guide plate 19 side (the surface facing the light guide plate 19) of the LED substrate 18, and this is the mounting surface 18a. Is done. A plurality of LEDs 17 are arranged in a line (linearly) in parallel on the mounting surface 18a of the LED substrate 18 along the length direction (X-axis direction) with a predetermined interval. That is, it can be said that a plurality of LEDs 17 are intermittently arranged in parallel along the long side direction at both ends on the long side of the backlight device 12. The interval between adjacent LEDs 17 in the X-axis direction, that is, the arrangement pitch of the LEDs 17 is substantially equal. Note that the arrangement direction of the LEDs 17 coincides with the length direction (X-axis direction) of the LED substrate 18.

  In addition, a wiring pattern (not shown) made of a metal film (such as copper foil) is provided on the mounting surface 18a of the LED substrate 18 and extends in the X-axis direction and connects adjacent LEDs 17 in series across the LED 17 group. And the terminal portions formed at both ends of the wiring pattern are connected to an external LED driving circuit board (not shown), so that driving power can be supplied to each LED 17. It is said. Since the pair of LED substrates 18 are housed in the chassis 14 in such a manner that the mounting surfaces 18a of the LEDs 17 are opposed to each other, the light emitting surfaces of the LEDs 17 respectively mounted on the LED substrates 18 are opposed to each other, The optical axis of each LED 17 substantially coincides with the Y-axis direction. In other words, the LEDs 17 mounted on the pair of LED substrates 18 are respectively arranged in opposition to both ends in the Y-axis direction (both ends on the long side) of the light guide plate 19. Further, the base material of the LED substrate 18 is made of metal like the chassis 14, and the wiring pattern (not shown) described above is formed on the surface thereof via an insulating layer. In addition, as a material used for the base material of LED board 18, insulating materials, such as a ceramic, can also be used.

  The light guide plate 19 is made of a synthetic resin material (for example, acrylic resin such as PMMA or polycarbonate) having a refractive index sufficiently higher than that of air and substantially transparent (excellent translucency). As shown in FIG. 2, the light guide plate 19 has a horizontally long rectangular shape when viewed in plan as in the case of the liquid crystal panel 11 and the chassis 14, and has a plate shape that is thicker than the optical member 15. The long side direction in FIG. 4 coincides with the X-axis direction, the short side direction coincides with the Y-axis direction, and the plate thickness direction perpendicular to the plate surface coincides with the Z-axis direction. As shown in FIG. 3, the light guide plate 19 is disposed in the chassis 14 so as to overlap the positions immediately below the liquid crystal panel 11 and the optical member 15, and is disposed at both ends of the long side of the chassis 14. Are arranged so as to be sandwiched between the LED substrates 18 in the Y-axis direction. Therefore, the alignment direction of the LED 17 (LED substrate 18) and the light guide plate 19 matches the Y-axis direction, while the alignment direction of the optical member 15 (liquid crystal panel 11) and the light guide plate 19 matches the Z-axis direction. It is assumed that both directions are orthogonal to each other. The light guide plate 19 has a function of introducing the light emitted from the LED 17 in the Y-axis direction and raising and emitting the light to the optical member 15 side (front side) while propagating the light inside. .

  The light guide plate 19 has a substantially flat plate shape extending along the plate surfaces of the bottom plate 14a of the chassis 14 and the optical member 15, and the plate surfaces are parallel to the X-axis direction and the Y-axis direction. . Of the plate surfaces of the light guide plate 19, the plate surface facing the front side (the surface facing the optical member 15) is a light emitting surface 19 a that emits internal light toward the optical member 15 and the liquid crystal panel 11. Of the outer peripheral end surfaces adjacent to the plate surface of the light guide plate 19, both end surfaces on the long side forming a longitudinal shape along the X-axis direction are opposed to the LED 17 (LED substrate 18) with a predetermined space therebetween. These constitute a pair of light incident surfaces 19b on which the light emitted from the LEDs 17 is incident. Each light incident surface 19b is a surface parallel to the X-axis direction (the LED 17 arrangement direction) and the Z-axis direction, that is, along the main plate surface of the LED substrate 18, and is a surface substantially orthogonal to the light emitting surface 19a. The Further, the alignment direction of the LED 17 and the light incident surface 19b coincides with the Y-axis direction and is parallel to the light emitting surface 19a.

  The second reflection sheet that can reflect the light in the light guide member 19 and rise to the front side on the back side of the plate surface of the light guide member 19, that is, the plate surface 19c opposite to the light emitting surface 19a. 21 is provided so as to cover the entire area. The second reflection sheet 21 has both ends on the long side extending outward from the light incident surfaces 19 b of the light guide plate 19, and the extended portion is on the back side of the first reflection sheet 20 described above. Are arranged opposite to each other. Since the space held between the LED 17 and the light incident surface 19b is sandwiched between the extending portions of the first reflecting sheet 20 and the second reflecting sheet 21 that face each other, the distance from the LED 17 By repeatedly reflecting light between the reflecting sheets 20 and 21, the light can be efficiently incident on the light incident surface 19b. Note that at least one of the light exit surface 19a and the plate surface 19c on the opposite side of the light guide member 19 has a reflecting portion (not shown) that reflects internal light or a scattering portion that scatters internal light ( (Not shown) is patterned so as to have a predetermined in-plane distribution, and thereby, the emitted light from the light emitting surface 19a is controlled to have a uniform distribution in the surface.

  By the way, when there is a request to increase the size of the liquid crystal display device 10, each member constituting the liquid crystal display device 10 is increased in size accordingly, and a long heat dissipation member 22 is used. The heat dissipation member 22 is likely to be deformed such as warpage. If it becomes so, the position of LED17 attached to the heat radiating member 22 will change easily, and the positional relationship of the light-incidence surface 19b of the light-guide plate 19 and LED17 will become unstable. For this reason, there is a concern that the incident efficiency of light incident on the light incident surface 19b from the LED 17 becomes unstable, and as a result, luminance unevenness occurs in the emitted light from the light emitting surface 19a of the light guide plate 19. On the other hand, when the size of the liquid crystal display device 10 is increased, the number of installed LEDs 17 is increased accordingly, so that the amount of heat generated from the LEDs 17 is increased and heat is easily accumulated in the backlight device 12. For this reason, when the liquid crystal display device 10 is increased in size, further improvement in heat dissipation performance by the heat dissipation member 22 has been demanded.

  Therefore, in the present embodiment, as shown in FIGS. 2 and 3, a reinforcing portion 26 is provided on the heat radiating member 22, and a part of the chassis 14 is configured by the heat radiating member 22. Since the mechanical strength can be increased by providing the radiating member 22 with the radiating member 22, even if the radiating member 22 is long, deformation such as warpage hardly occurs. Thereby, the position of the LED 17 included in the LED substrate 18 attached to the heat radiating member 22 is unlikely to fluctuate, so that the light incident efficiency to the light incident surface 19b of the light guide plate 19 is stabilized and the luminance unevenness is suppressed. Can do. And since the heat radiating member 22 forms a part of the chassis 14 and the heat radiating member 22 has a part of the exposed surface 14d exposed to the outside of the backlight device 12, the heat generated from the LED 17 is generated. When transmitted to the heat dissipation member 22, the heat can be efficiently dissipated to the outside of the backlight device 12. Thereby, high heat dissipation performance can be obtained. Below, the structure of the baseplate member 23 which comprises the chassis 14 with the heat radiating member 22 and the heat radiating member 22 is demonstrated in detail.

  The heat radiating member 22 is made of a metal such as aluminum, and is made of a plate material extending along the long side direction of the chassis 14 as shown in FIGS. The heat radiating member 22 has an LED mounting portion (light source mounting portion) 24 to which the LED substrate 18 is mounted, and a light guide plate support that extends from the LED mounting portion 23 to the inside, that is, the light guide plate 19 side and supports the light guide plate 19. And a reinforcing portion 26 protruding from the light guide plate support portion 25 toward the back side, that is, the side opposite to the light guide plate 19 side. That is, the heat radiating member 22 is made of a long metal plate extending along the X-axis direction (the length direction of the light incident surface 19b of the light guide plate 19) and the Y-axis direction (the LED 17 and the light guide plate 19). By bending along the X-axis direction at two positions separated in the (alignment direction), there are two bent portions.

  As shown in FIGS. 3 to 5, the LED mounting portion 24 of the heat dissipation member 22 has a plate surface parallel to the plate surface of the LED substrate 18, and the LED substrate 18 is attached to the inner plate surface. It is attached. The LED mounting portion 24 has a length direction that coincides with the X-axis direction, a width direction that coincides with the Z-axis direction, and a thickness direction that coincides with the Y-axis direction. The LED mounting portion 24 constitutes the entire side plate 14b of the chassis 14, and the outer plate surface is an exposed surface 14d that is exposed to the outside of the backlight device 12 over almost the entire area. The LED mounting portion 24 has a length that substantially coincides with the long side dimension of the chassis 14 and that extends over substantially the entire length of the light incident surface 19 b of the light guide plate 19. In addition, this LED attaching part 24 is an outer side edge part of the light-guide plate support part 25 mentioned below, ie, an edge part on the opposite side to the reinforcement part 26 side, and a front side (opposite side to the protrusion direction of the reinforcement part 26). It can be said that the light guide plate is bent at a substantially right angle with respect to the light guide plate support portion 25.

  As shown in FIGS. 3 to 5, the light guide plate support portion 25 of the heat radiating member 22 extends in the Y-axis direction from the end of the back side of the LED mounting portion 24 in the Z-axis direction (the side opposite to the light emitting surface 19 a side). And is bent at a substantially right angle with respect to the LED mounting portion 24. The light guide plate support portion 25 has a plate surface parallel to the plate surface of the light guide plate 19 (the light emitting surface 19a and the opposite plate surface 19c), and is guided to the inner (front side) plate surface. The optical plate 19 is placed on the front side so as to overlap with the second reflection sheet 21. That is, the light guide plate support portion 25 supports the end portion on the long side having the light incident surface 19b of the light guide plate 19 from the back side, that is, the side opposite to the light emission surface 19a side, via the second reflection sheet 21. doing. Since the heat radiating members 22 are arranged in a pair so as to sandwich the light guide plate 19 from both sides in the short side direction, both ends on the long side of the light guide plate 19 are provided by the light guide plate support portions 25 included in the pair of heat radiating members 22. Both parts are stably supported. The length direction of the light guide plate support portion 25 coincides with the X-axis direction, the width direction coincides with the Y-axis direction, and the thickness direction coincides with the Z-axis direction. The light guide plate support portion 25 constitutes a part of the bottom plate 14a of the chassis 14, and the outer (back side) plate surface thereof is an exposed surface 14d exposed to the outside of the backlight device 12 over almost the entire area. . The light guide plate support portion 25 has a length that substantially coincides with the long side dimension of the chassis 14 and that extends over substantially the entire length of the LED attachment portion 24 and the end portions on the long side of the light guide plate 19. doing.

  As shown in FIGS. 3 to 5, the reinforcing portion 26 of the heat radiating member 22 is an end on the inner side of the light guide plate support portion 25 in the Y-axis direction (the side opposite to the LED mounting portion 24 side), that is, the light guide plate support. It protrudes from the extended tip of the portion 25 toward the back side (the direction away from the light guide plate 19) along the Z-axis direction, and is bent at a substantially right angle with respect to the light guide plate support portion 25. Although the reinforcing portion 26 has a plate surface parallel to the plate surface of the LED mounting portion 24 and the LED substrate 18, the protruding direction from the end portion of the light guide plate support portion 25 is the same protruding direction of the LED mounting portion 24. Is reversed. The reinforcing portion 26 has a length direction that coincides with the X-axis direction, a width direction that coincides with the Z-axis direction, and a thickness direction that coincides with the Y-axis direction. The reinforcing portion 26 has an exposed surface 14d that is exposed to the outside of the backlight device 12 over substantially the entire plate surface. The reinforcing part 26 has a length that substantially coincides with the long side dimension of the chassis 14 and extends over substantially the entire length of the LED mounting part 24 and the light guide plate support part 25. Therefore, the LED mounting portion 24 and the light guide plate support portion 25 constituting the heat dissipation member 22 are reinforced so that sufficient rigidity can be obtained by the reinforcing portion 26 provided so as to extend over the entire length thereof. As a result, deformation such as warpage and bending is less likely to occur in the LED mounting portion 24 and the light guide plate support portion 25. Specifically, when the LED mounting portion 24 and the light guide plate support portion 25 are warped or bent, the central side portion is perpendicular to the plate surface with respect to the end side portion in the length direction (X-axis direction). Although the relative displacement occurs in the Y-axis direction in the case of the LED mounting portion 24 and the Z-axis direction in the case of the light guide plate support portion 25, the relative displacement as described above is achieved by the reinforcement by the reinforcement portion 26. Is unlikely to occur.

  Next, the bottom plate member 23 that constitutes the chassis 14 together with the heat dissipation member 22 will be described. The bottom plate member 23 is made of the same metal material as that of the heat dissipation member 22 such as aluminum, and is made of a plate material extending along the long side direction of the chassis 14 as shown in FIGS. . The bottom plate member 23 has a horizontally long rectangular shape when seen in a plane, and the plate surfaces thereof are parallel to the plate surfaces of the light guide plate support portion 25 and the light guide plate 19. The length direction of the bottom plate member 23 coincides with the X-axis direction, the width direction coincides with the Y-axis direction, and the thickness direction coincides with the Z-axis direction. The bottom plate member 23 is disposed between the pair of heat radiation members 22 disposed on both sides thereof, and both end portions on the long side of the bottom plate member 23 are respectively disposed on the pair of heat radiation members 22. The reinforcing part 26 is connected. The bottom plate member 23 and the heat radiating member 22 are integrally formed by forming a sheet metal separately and then connecting the mutual connection portions by means such as welding or welding to form the chassis 14 of the backlight device 12. Yes.

  Specifically, as shown in FIG. 3, the bottom plate member 23 is connected to the inner plate surface of the reinforcing portion 26 at the protruding tip portion from the light guide plate support portion 25, and the protruding tip surface of the reinforcing portion 26. On the other hand, the outer plate surface (exposed surface 14d) of the bottom plate member 23 is substantially flush. That is, the reinforcing portion 26 does not protrude outward from the outer plate surface of the bottom plate member 23 along the Z-axis direction. Further, as shown in FIGS. 2 and 4, the bottom plate member 23 has a length dimension that substantially matches the long side dimension of the chassis 14, and ends of the reinforcing part 26 and the light guide plate 19 on the long side side. Therefore, the reinforcing portion 26 is connected to the projecting tip portion of the reinforcing portion 26 over almost the entire length. As shown in FIG. 3, the bottom plate member 23 has an inner (front side) plate surface disposed so as to face the light guide plate 19 via the second reflection sheet 21. A gap with a predetermined interval is held between the light plate 19 and the plate surface 19c) opposite to the light emitting surface 19a. That is, since the bottom plate member 23 is kept in non-contact with the light guide plate 19 and the second reflection sheet 21 and an air layer is interposed therebetween, the air layer functions as a heat insulating layer. Heat transfer from the bottom plate member 23 side to the light guide plate 19 side is difficult. On the outer plate surface (exposed surface 14d) of the bottom plate member 23, although not shown, there are an LED drive circuit board that supplies driving power to the LED 17 and a control board that supplies various signals to the liquid crystal panel 11. It is attached and the heat generated from each of the substrates is prevented from being transferred to the light guide plate 19 by the air layer. The distance between the bottom plate member 23 and the light guide plate 19 (the thickness of the air layer) is the same as the protruding dimension of the reinforcing portion 26 from the light guide plate support portion 25. The bottom plate member 23 constitutes a part of the bottom plate 14 a in the chassis 14, and the outer (back side) plate surface is an exposed surface 14 d that is exposed to the outside of the backlight device 12 over almost the entire area.

  This embodiment has the structure as described above, and the operation thereof will be described subsequently. When the power supply of the liquid crystal display device 10 having the above-described configuration is turned on, the drive of the liquid crystal panel 11 is controlled by a control circuit of a control board (not shown), and the drive power from the LED drive circuit of the LED drive circuit board (not shown) The drive is controlled by being supplied to each of the 18 LEDs 17. The light from each LED 17 is guided by the light guide plate 19, so that the liquid crystal panel 11 is irradiated through the optical member 15, and a predetermined image is displayed on the liquid crystal panel 11. Hereinafter, the operation of the backlight device 12 will be described in detail.

  When each LED 17 is turned on, the light emitted from each LED 17 enters the light incident surface 19b of the light guide plate 19 as shown in FIG. Here, although a predetermined space is held between the LED 17 and the light incident surface 19b, the space is sandwiched between the first reflective sheet 20 on the front side and the second reflective sheet 21 on the back side. The light from the LED 17 is repeatedly reflected by both the reflection sheets 20 and 21, so that it is efficiently incident on the light incident surface 19b. The light incident on the light incident surface 19b is totally reflected at the interface with the external air layer in the light guide plate 19 or reflected by the second reflection sheet 21 and then propagated through the light guide plate 19 to be light. The light is emitted from the emission surface 19a toward the front optical member 15.

  Here, the incident efficiency of light incident on the light incident surface 19b of the light guide plate 19 from the LED 17 can vary according to the relative positional relationship between the LED 17 and the light incident surface 19b of the light guide plate 19. . Specifically, the light incident efficiency increases as the distance in the Y-axis direction between the LED 17 and the light incident surface 19b of the light guide plate 19 decreases, and conversely, the light incident efficiency increases as the distance increases. It tends to be lower. Further, as the above-mentioned distance between the LED 17 and the light incident surface 19b of the light guide plate 19 becomes narrower, the light incident area in the X-axis direction that directly enters the light incident surface 19b from each LED 17 becomes narrower. A dark portion is likely to be generated between the light regions, and conversely, as the above-described interval is widened, the light incident region is widened. In the backlight device 12 according to the present embodiment, the light incident efficiency is good as the distance in the Y-axis direction between the LED 17 and the light incident surface 19b of the light guide plate 19, and between adjacent light incident regions. Although it is designed to a value that does not cause a dark part, if the LED mounting part 24 of the heat radiating member 22 to which the LED board 18 on which the LED 17 is mounted is attached is deformed such as warping or bending, the LED 17 is designed. Is shifted from the normal position in the Y-axis direction, and the incident efficiency of the light incident on the light incident surface 19b from the LED 17 shifted in position and the incident light in the X-axis direction directly incident on the light incident surface 19b. As a result, there is a possibility that luminance unevenness occurs in the light emitted from the light guide plate 19. On the other hand, even when the positional relationship in the Z-axis direction between the LED 17 and the light incident surface 19b of the light guide plate 19 varies, the light incident efficiency on the light incident surface 19b can vary. For this reason, if deformation such as warping or bending occurs in the light guide plate support portion 25 that supports the light guide plate 19 from the back side of the heat dissipation member 22, the supported light guide plate 19 is displaced in the Z-axis direction, There was a possibility that the light incident efficiency on the light incident surface 19b fluctuated and luminance unevenness occurred in the light emitted from the light guide plate 19.

  However, as shown in FIGS. 2 to 4, the heat dissipating member 22 according to the present embodiment is provided with a reinforcing portion 26 in a form extending along the length direction (X-axis direction). Since the mechanical strength is improved, the LED mounting portion 24 to which the LED board 18 is mounted in the heat radiating member 22 is less likely to be deformed such as warping or bending. Therefore, the LED 17 of the LED board 18 attached to the LED attachment portion 24 is less likely to be displaced in the Y axis direction from the normal position. In particular, on the LED substrate 18 according to the present embodiment, although the plurality of LEDs 17 are intermittently arranged along the X-axis direction, the deformation of the LED mounting portion 24 is suppressed as described above. Thus, it is possible to avoid a relative displacement between the LEDs 17 in the Y-axis direction. Thereby, since the positional relationship in the Y-axis direction between each LED 17 and the light incident surface 19b of the light guide plate 19 is stable, the incident efficiency and light incidence of light incident on the light incident surface 19b from each LED 17 Both light incident areas on the surface 19b are stabilized. Moreover, among the heat radiating member 22, the light guide plate support portion 25 that supports the end portion on the long side having the light incident surface 19 b of the light guide plate 19 from the back side is also warped by being reinforced by the above-described reinforcement portion 26. Therefore, the end of the light guide plate 19 on the long side can be stably supported, and the position of the light incident surface 19b of the end in the Z-axis direction can be stably supported. Can be stabilized. Thereby, since the positional relationship in the Z-axis direction between the LED 17 and the light incident surface 19b of the light guide plate 19 is stable, the incident efficiency of light incident from the LED 17 onto the light incident surface 19b is stabilized. . As described above, since the heat radiating member 22 is reinforced by the reinforcing portion 26, the liquid crystal display device 10 and the backlight device 12 are enlarged, and accordingly, a long heat radiating member 22 is used. Even in such a case, it is possible to make it difficult for the heat radiating member 22 to be warped or bent, so that the light incident efficiency to the light incident surface 19b of the light guide plate 19 can be stabilized and guided. Luminance unevenness can be made difficult to occur in the light emitted from the light exit surface 19a of the optical plate 19, so that it is possible to easily cope with an increase in size.

  By the way, the heat generated as the LED 17 emits light is transmitted to the heat radiating member 22 through the LED substrate 18 as shown in FIG. The heat radiating member 22 constitutes a part of the chassis 14 and has an exposed surface 14d exposed to the outside of the backlight device 12. Therefore, the heat radiating member is temporarily accommodated inside the chassis and exposed to the outside. Compared with the case where it is set as the structure which is not made, the heat transmitted from LED17 can be dissipated efficiently outside. In particular, when the liquid crystal display device 10 and the backlight device 12 are enlarged, the number of LEDs 17 is increased and the amount of emitted light tends to increase. Since the heat dissipation performance by the heat dissipation member 22 is improved as described above, it is possible to easily cope with an increase in size.

  As described above, the backlight device (illumination device) 12 according to the present embodiment includes the LED (light source) 17, the light incident surface 19 b that is disposed so as to face the LED 17 and that receives light from the LED 17, and the incident light. A light guide plate 19 having a light emitting surface 19a for emitting the light, a chassis 14 having an exposed surface 14d that accommodates the LED 17 and the light guide plate 19 and is exposed to the outside, an LED mounting portion 24 to which the LED 17 is attached, and an LED The light guide plate support portion 25 that extends from the mounting portion 24 toward the light guide plate 19 side and supports the light guide plate 19 from the side opposite to the light emitting surface 19a side, and the light guide plate support portion 25 to the light guide plate 19 side. And a heat radiating member 22 having at least a part of the chassis 14 and having a reinforcing portion 26 protruding toward the opposite side.

  In this way, the light emitted from the LED 17 attached to the LED attachment portion 24 of the heat radiating member 22 enters the light incident surface 19b of the light guide plate 19 and propagates through the light guide plate 19, and then emits light. The light is emitted from the surface 19a. Since the heat dissipation member 22 is reinforced by the reinforcing portion 26 that protrudes from the light guide plate support portion 25 toward the side opposite to the light guide plate 19 side, the LED mounting portion 24 is less likely to be deformed. As a result, the relative position of the LED 17 mounted on the LED mounting portion 24 with respect to the light incident surface 19b is unlikely to fluctuate, so that the light incident efficiency on the light incident surface 19b can be stabilized. . Moreover, since the light guide plate support portion 25 is hardly deformed by being reinforced by the reinforcing portion 26, the light guide plate 19 is stably supported from the side opposite to the light emitting surface 19a side. As a result, the relative position of the light incident surface 19b of the light guide plate 19 with respect to the LED 17 is unlikely to fluctuate, so that the light incident efficiency on the light incident surface 19b can be stabilized. As described above, since the light incident efficiency on the light incident surface 19b of the light guide plate 19 is stabilized, the occurrence of luminance unevenness in the emitted light from the light emitting surface 19a is suppressed. In addition, the heat radiating member 22 forms at least a part of the chassis 14, and the chassis 14 has an exposed surface 14 d exposed to the outside of the backlight device 12, so that the LED 17 emits light. When the heat generated as a result is transmitted to the heat radiating member 22, the heat can be efficiently dissipated from the heat radiating member 22 exposed to the outside, and thereby high heat dissipation can be obtained. .

  By the way, when the backlight device 12 is enlarged, the heat radiating member 22 is also enlarged accordingly, so that the strength is insufficient and deformation such as warpage is likely to occur, and the amount of heat generated from the LED 17 increases, so that heat is radiated. Although there is a tendency to improve performance, as described above, since the heat radiating member 22 is reinforced by the reinforcing portion 26, deformation such as warpage is hardly caused, and the heat radiating member 22 is exposed to the outside. Since the heat radiation performance is improved by constituting at least a part, it is suitable for increasing the size of the backlight device 12.

  The chassis 14 includes a heat radiating member 22 and a bottom plate member 23 that is connected to the heat radiating member 22 and extends along a plate surface 19c on the light guide plate 19 opposite to the light emitting surface 19a. In this way, since the chassis 14 is constituted by the heat radiating member 22 and the bottom plate member 23, for example, when changing the size of the backlight device 12, the size of only the bottom plate member 23 can be changed. It is possible to respond. Thereby, since the heat radiating member 22 can be reused, the manufacturing cost can be reduced, and the backlight device 12 can be more easily enlarged.

  Further, the bottom plate member 23 is connected to a protruding tip portion from the light guide plate support portion 25 in the reinforcing portion 26 of the heat radiating member 22. In this way, the protruding tip portion of the reinforcing portion 26 can be prevented from projecting to the outside from the bottom plate member 23, so that problems such as the reinforcing portion 26 being caught by other members are less likely to occur, thereby improving productivity, etc. Can be achieved.

  Further, the bottom plate member 23 is disposed at a position having a gap with the light guide plate 19. In this way, heat transfer is less likely to occur from the bottom plate member 23 to the light guide plate 19.

  The reinforcing portion 26 is provided at the end of the light guide plate support 25 opposite to the LED mounting portion 24 side. In this case, the shape of the heat radiating member 22 becomes simpler than the case where the reinforcing portion 26 is provided in a portion of the light guide plate support portion 25 other than the end portion. Thus, the manufacturing cost of the heat radiating member 22 can be reduced.

  The heat dissipating member 22 is formed to have a size such that the LED mounting portion 24 extends over almost the entire length of the light incident surface 19 b of the light guide plate 19, and the light guide plate support portion 25 and the reinforcing portion 26 are provided on the LED mounting portion 24. It is formed in a size extending substantially over the entire length. If it does in this way, with respect to the LED attachment part 24 formed in the magnitude | size extended over the full length of the light-incidence surface 19b in the light guide plate 19, the light guide plate support part made into the magnitude | size extended over the substantially full length 25 and the reinforcement part 26 are connected, Therefore The intensity | strength of the heat radiating member 22 can be made higher.

  Further, a plurality of LEDs 17 are intermittently arranged in the LED mounting portion 24 of the heat dissipation member 22. If it does in this way, since deformation, such as curvature, will not arise easily in the LED attaching part 24 by the reinforcement part 26, a position differs between several LED17 arrange | positioned along with intermittently in the LED attaching part 24 Is less likely to occur. Thereby, the incident efficiency of light incident on the light incident surface 19b from each LED 17 can be made stable, which is more suitable for reducing luminance unevenness.

  The LEDs 17 and the heat radiating member 22 are arranged at least one pair so as to sandwich the light guide plate 19 from both sides, and at least a pair of light guide plate support portions 25 are arranged to support both end portions of the light guide plate 19. In this case, since both end portions of the light guide plate 19 are supported by the respective light guide plate support portions 25 included in at least the pair of heat radiation members 22 arranged so as to sandwich the light guide plate 19 from both sides, each LED mounting portion 24 is supported. The positional relationship of the light guide plate 19 with respect to the LEDs 17 attached to the LED 17 becomes more stable. Thereby, the incident efficiency of the light to each light incident surface 19b of the light guide plate 19 is stabilized, which is more suitable for suppressing luminance unevenness.

  In addition, an LED board 18 that is mounted on the LED mounting portion 24 of the heat dissipation member 22 while the LED 17 is mounted is provided. By doing so, the reinforcement part 26 makes it difficult for the LED attachment part 24 to be deformed, such as warping, so that the LED board 18 attached to the LED attachment part 24 may be detached from the LED attachment part 24. Can be avoided.

<Embodiment 2>
A second embodiment of the present invention will be described with reference to FIG. In the second embodiment, an alumite layer 27 is formed on the surface of the heat dissipation member 122 as an oxide layer. In addition, the overlapping description about the same structure, an effect | action, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.

  The heat dissipating member 122 according to the present embodiment is made of aluminum which is a metal material, and an alumite layer 27 is formed as an oxide layer on the surface thereof as shown in FIG. The alumite layer 27 is a so-called anodic oxide film, and the surface thereof is electrochemically oxidized by electrolysis using a heat dissipation member 122 made of aluminum as an anode in a treatment bath filled with, for example, dilute sulfuric acid or oxalic acid. And forming an oxide film of aluminum oxide (alumina). Since the alumite layer 27 is formed so as to cover almost the entire outer surface (including the exposed surface 114d) of the heat dissipation member 122, the heat emissivity of the heat dissipation member 122 is increased. Thereby, the heat dissipation performance of the heat dissipation member 122 can be further improved. Moreover, since aluminum used as a material for the heat dissipation member 122 has a relatively high thermal conductivity compared to iron, heat from the LED 117 can be efficiently transmitted to other members such as the bottom plate member 123. . Therefore, combined with the effect of the alumite layer 27, the heat dissipation performance of the heat dissipation member 122 is further improved.

  As described above, according to the present embodiment, the heat radiating member 122 is made of a metal material, and an oxide layer is formed on the surface thereof. In this way, by forming an oxide layer on the surface of the heat radiating member 122 made of a metal material, the heat emissivity of the heat radiating member 122 is increased, so that the heat radiating property of the heat radiating member 122 can be further improved. .

  The heat radiating member 122 is made of aluminum as a metal material, and an alumite layer 27 is formed on the surface thereof. In this way, in addition to the good thermal conductivity of aluminum, the emissivity is increased by forming the alumite layer 27 on the surface, so that the heat dissipation of the heat dissipation member 122 can be further improved. .

<Embodiment 3>
A third embodiment of the present invention will be described with reference to FIG. In the third embodiment, the surface of the heat radiating member 222 is colored black. In addition, the overlapping description about the same structure, an effect | action, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.

  As shown in FIG. 7, the heat radiating member 222 according to the present embodiment has a black surface by applying a black paint on the surface. A colored layer 28 made of a black paint is formed on the surface of the heat dissipation member 222. The colored layer 28 is formed so as to cover almost the entire area of the outer surface (including the exposed surface 214 d) of the heat radiating member 222. Thereby, compared with the case where the surface of the heat radiating member is configured to exhibit another color such as white, the heat radiation rate of the heat radiating member 222 is increased, so that the heat radiating performance of the heat radiating member 222 can be improved. .

  As described above, according to the present embodiment, the heat radiating member 222 has a black surface. In this way, by making the surface black, the heat radiation of the heat radiating member 222 is increased, and thus the heat radiating property of the heat radiating member 222 can be further improved.

<Embodiment 4>
A fourth embodiment of the present invention will be described with reference to FIG. In the fourth embodiment, the surface of the heat radiating member 322 is applied with a heat radiating paint. In addition, the overlapping description about the same structure, an effect | action, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.

  As shown in FIG. 8, the heat dissipating member 322 according to the present embodiment is coated with a heat dissipating paint containing a metal oxide (ceramic). For example, Unicool (registered trademark) manufactured by Godo Ink Co., Ltd. is preferably used as the heat dissipating paint. On the surface of the heat radiating member 322, a heat radiating promotion layer 29 made of a heat radiating paint is formed. The heat dissipation promotion layer 29 is formed so as to cover almost the entire area of the outer surface (including the exposed surface 314d) of the heat dissipation member 322. Since the heat dissipation promoting layer 29 contains a metal oxide, the heat emissivity of the heat dissipation member 322 is increased by the metal oxide, and thus the heat dissipation performance of the heat dissipation member 322 can be improved.

  As described above, according to the present embodiment, the heat dissipating member 322 is coated with a heat dissipating paint containing a metal oxide on its surface. If it does in this way, the heat dissipation of the heat radiating member 322 can be improved more by apply | coating the heat radiating coating material containing the metal oxide to the surface of the heat radiating member 322.

<Embodiment 5>
Embodiment 5 of the present invention will be described with reference to FIG. In the fifth embodiment, a structure in which the structure relating to the connection portion between the reinforcing portion 426 of the heat radiation member 422 and the bottom plate member 423 is changed is shown. In addition, the overlapping description about the same structure, an effect | action, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.

  As shown in FIG. 9, the bottom plate member 423 according to the present embodiment is connected so as to cover the protruding tip surface of the protruding tip portion from the light guide plate support portion 425 in the reinforcing portion 426 of the heat dissipation member 422. Specifically, the bottom plate member 423 is joined in such a manner that the inner (front side) plate surface at the end portion on the long side is directed to the protruding tip surface of the reinforcing portion 426, and at the end portion on the long side side. The end surface is substantially flush with the outer plate surface (exposed surface 414d) of the reinforcing portion 426. That is, the bottom plate member 423 does not protrude outward from the plate surface outside the reinforcing portion 426 along the Y-axis direction.

<Embodiment 6>
A sixth embodiment of the present invention will be described with reference to FIG. In the sixth embodiment, the shape of the reinforcing portion 526 of the heat dissipation member 522 is changed. In addition, the overlapping description about the same structure, an effect | action, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.

  As shown in FIG. 10, the heat dissipating member 522 according to this embodiment is configured such that the reinforcing portion 526 protrudes in an inclined manner from the light guide plate support portion 525. Specifically, the reinforcing portion 526 protrudes from the leading end portion extending from the LED mounting portion 524 in the light guide plate support portion 525 in a direction intersecting both the Z-axis direction and the Y-axis direction, and its plate surface Is formed in an inclined shape that forms an obtuse angle with respect to the plate surface of the light guide plate support 525. The reinforcing portion 526 has an inclination such that the reinforcing portion 526 moves away from both the light guide plate support portion 525 and the light guide plate 519 as it goes from the protruding proximal end side to the protruding distal end side. A long side end of the bottom plate member 523 is connected to the projecting tip of the reinforcing portion 526. The end surface of the end portion on the long side of the bottom plate member 523 is formed in an inclined shape following the plate surface of the reinforcing portion 526.

<Embodiment 7>
A seventh embodiment of the present invention will be described with reference to FIG. In this Embodiment 7, what changed arrangement | positioning and shape of the reinforcement part 626 of the thermal radiation member 622 is shown. In addition, the overlapping description about the same structure, an effect | action, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.

  As shown in FIG. 11, in the heat dissipation member 622 according to the present embodiment, the reinforcing portion 626 is provided in the middle portion (intermediate portion) between the both end portions of the light guide plate support portion 625. Specifically, the reinforcing portion 626 is disposed between the end portion of the light guide plate support portion 625 on the LED attachment portion 624 side and the end portion on the opposite side to the LED attachment portion 624 side (extension tip portion). The central part is formed by partially protruding to the back side. The reinforcing portion 626 includes a pair of projecting portions 30 projecting from the light guide plate support portion 625 toward the back side, and a bridging portion 31 that bridges between projecting tip portions of the pair of projecting portions 30. It has a rail shape extending along the axial direction. The reinforcing portion 626 having such a configuration can sufficiently reinforce the LED mounting portion 624 and the light guide plate support portion 625. In addition, an end portion on the long side of the bottom plate member 623 is connected to the extending tip portion of the light guide plate support portion 625. The bottom plate member 623 supports the light guide plate 619 together with the light guide plate support 625 from the back side.

<Eighth embodiment>
An eighth embodiment of the present invention will be described with reference to FIG. In the eighth embodiment, the arrangement of the heat dissipating member 722 and the bottom plate member 723 in the chassis 714 is changed. In addition, the overlapping description about the same structure, an effect | action, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.

  As shown in FIG. 8, a pair of heat radiation members 722 according to the present embodiment are arranged in a manner to sandwich the light guide plate 719 from both sides in the long side direction in the chassis 714. The heat dissipating member 722 is made of a plate material extending along the short side direction (Y-axis direction) of the chassis 714. Each of the LED attachment portion 724, the light guide plate support portion 725, and the reinforcement portion 726, which are constituent parts thereof. All the length directions coincide with the Y-axis direction. The LED board 718 is configured to extend along the length direction of the LED mounting portion 724, and a plurality of mounted LEDs 717 are arranged intermittently along the Y-axis direction. In addition, the light guide plate 719 has a pair of short-side end surfaces as light incident surfaces 719b that face the LEDs 717, respectively. The bottom plate member 723 constituting the chassis 714 is formed of a plate material that is sandwiched between the pair of heat radiation members 722 and extends along the short side direction of the chassis 14, and both end portions on the long side thereof are The heat radiating member 722 is connected to the reinforcing portion 726. Even in such a configuration, the same operations and effects as those of the first embodiment can be obtained.

<Ninth Embodiment>
Embodiment 9 of the present invention will be described with reference to FIG. In the ninth embodiment, a chassis 814 having a one-part configuration is shown. In addition, the overlapping description about the same structure, an effect | action, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.

  As shown in FIG. 13, the chassis 814 according to the present embodiment has a one-part configuration in which the heat dissipation member 22 and the bottom plate member 23 described in the first embodiment are integrated. Specifically, the bottom plate 814a of the chassis 814 includes a light guide plate support portion 825 that supports the light guide plate 819 from the back side, and a back side from the end of the light guide plate support portion 825 opposite to the side plate 814b (LED mounting portion 824) side. A pair of reinforcing portions 826 projecting toward each other. With such a configuration, the manufacturing cost of the chassis 814 can be reduced.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) Besides the above-described embodiments, the shape of the reinforcing portion can be changed as appropriate. For example, with respect to the reinforcing part formed so as to protrude from the extending tip part of the light guide plate support part, a protruding part protruding in parallel with the plate surface of the light guide plate is formed from the protruding tip part from the light guide plate support part. In addition, the cross-sectional shape of the reinforcing portion can be L-shaped.

  (2) In each of the above-described embodiments (except for the ninth embodiment), the case where one heat radiating member is provided on the heat radiating member has been described. However, a plurality of reinforcing portions may be provided on the heat radiating member. Specifically, for example, the reinforcing portion described in the seventh embodiment may be provided in addition to the heat dissipating member described in the other embodiments (the first to sixth and eighth embodiments). Moreover, you may make it provide multiple reinforcement parts described in Embodiment 7 in a thermal radiation member.

  (3) In each of the above-described embodiments, the reinforcing part is formed to have a size extending over almost the entire length of the heat dissipation member or chassis. However, the reinforcing part is partially provided in the heat dissipation member or chassis. Are also included in the present invention.

  (4) In each of the above-described embodiments (except for the ninth embodiment), the heat dissipation member has a length that covers almost the entire length of one side of the chassis. However, the length of the heat dissipation member is less than the total length of one side of the chassis. What is done is also included in the present invention.

  (5) In the above (4), it is possible to arrange a plurality of heat dissipating members along one side of the chassis.

  (6) In each of the above-described embodiments (excluding Embodiments 7 and 9), the configuration in which the bottom plate member is connected to the protruding tip portion of the reinforcing portion of the heat dissipation member is shown, but rather than the protruding tip portion of the reinforcing portion. A structure in which the bottom plate member is connected to a position near the base end is also included in the present invention.

  (7) In each of the above-described embodiments (excluding Embodiments 7 and 9), a configuration in which the bottom plate member is connected to the reinforcing portion provided at the extending tip portion of the light guide plate support portion in the heat dissipation member is shown. However, a structure in which the bottom plate member is connected to the light guide plate support portion or the LED mounting portion is also included in the present invention.

  (8) In each of the above-described embodiments, the LED substrate and the heat radiating member are arranged in pairs so as to face the ends on both long sides or the ends on both short sides of the light guide plate. The LED board and the heat radiating member are arranged only at one long side end of the light guide plate, and the LED board and the heat radiating member are arranged only at one short side end of the light guide plate. Included in the invention. In that case, an alternative portion (a part of the bottom plate and a side plate) may be provided on the bottom plate portion of the chassis where the heat dissipation member is not disposed.

  (9) In addition to the above (8), the LED substrate and the heat radiating member are arranged so as to oppose each end of any three sides of the light guide plate, or the LED substrate and the heat radiating member are arranged in the light guide plate. Those arranged so as to face all four sides are also included in the present invention.

  (10) In each of the above-described embodiments, one LED substrate and one heat dissipation member are arranged for one side of the light guide plate. However, two LED substrates and heat dissipation members are provided for one side of the light guide plate. Two or more may be arranged.

  (11) A combination of Embodiment 2 and Embodiment 3 described above and coloring the alumite layer in black is also included in the present invention. If it does in this way, the radiation of the heat in a heat radiating member will improve further, and still higher heat dissipation performance can be exhibited.

  (12) It is possible to combine the above-described Embodiment 3 and Embodiment 4 so that the heat dissipating paint applied to the surface of the heat dissipating member exhibits a black color. If it does in this way, the radiation of the heat in a heat radiating member will improve further, and still higher heat dissipation performance can be exhibited.

  (13) As a modification of the above-described sixth embodiment, for example, the reinforcing portion may be formed in an inclined shape so as to form an acute angle with respect to the plate surface of the light guide plate support portion.

  (14) As a modification of the above-described seventh embodiment, for example, either one or both of the pair of projecting portions may be formed in an inclined shape so as to form an obtuse angle or an acute angle with respect to the plate surface of the light guide plate support portion. Good.

  (15) In each of the above embodiments, the color filter of the color filter included in the liquid crystal panel is exemplified by three colors R, G, and B. However, the color part may be four or more colors.

  (16) In the above-described embodiments, the LED is used as the light source. However, other light sources such as an organic EL can be used.

  (17) In each of the above-described embodiments, the TFT is used as a switching element of the liquid crystal display device. In addition to the liquid crystal display device for display, the present invention can also be applied to a liquid crystal display device for monochrome display.

  (18) In each of the above-described embodiments, the liquid crystal display device using the liquid crystal panel as the display panel has been exemplified. However, the present invention can be applied to display devices using other types of display panels.

  (19) In each of the above-described embodiments, the television receiver including the tuner unit has been illustrated. However, the present invention can also be applied to a display device that does not include the tuner unit.

  (20) In each of the above-described embodiments, the case where aluminum is used as the metal material constituting the heat radiating member has been shown. However, other than aluminum, for example, iron or copper can be used as the metal material constituting the heat radiating member. It is.

  DESCRIPTION OF SYMBOLS 10 ... Liquid crystal display device (display device), 11 ... Liquid crystal panel (display panel), 12 ... Backlight device (illumination device), 14, 714, 814 ... Chassis, 14d, 114d, 214d, 314d, 414d ... Exposed surface, 17, 117, 717 ... LED (light source), 18, 718 ... LED substrate (light source substrate), 19, 519, 619, 719, 819 ... light guide plate, 19a ... light exit surface, 19b, 719b ... light entrance surface, 19c ... Plate surface, 22, 122, 222, 322, 422, 522, 622, 722 ... Heat dissipation member, 23, 123, 423, 523, 623, 723 ... Bottom plate member, 24, 524, 624, 724, 824 ... LED mounting Part (light source attachment part), 25, 425, 525, 625, 725, 825... Light guide plate support part, 26, 426, 526, 626, 726, 82 ... reinforcing portion, 27 ... alumite layer (oxide layer), TV ... television receiver apparatus

Claims (15)

A light source;
A light guide plate that is arranged opposite to the light source and has a light incident surface on which light from the light source is incident, and a light emitting surface that emits the incident light;
A chassis that houses the light source and the light guide plate and is exposed to the outside;
A light source mounting portion to which the light source is mounted; a light guide plate support portion that extends from the light source mounting portion toward the light guide plate side and supports the light guide plate from the side opposite to the light exit surface side; An illuminating device comprising: a reinforcing member that protrudes from the light plate support portion toward the side opposite to the light guide plate side, and a heat radiating member that constitutes at least a part of the chassis.   The said chassis is comprised from the said heat radiating member and the baseplate member extended along the plate surface on the opposite side to the said light-projection surface in the said light guide plate while being connected to the said heat radiating member. Lighting device.   The lighting device according to claim 2, wherein the bottom plate member is connected to a protruding tip portion from the light guide plate support portion in the reinforcing portion of the heat dissipation member.   The lighting device according to claim 2, wherein the bottom plate member is disposed at a position having a gap between the bottom plate member and the light guide plate.   The lighting device according to any one of claims 1 to 4, wherein the reinforcing portion is provided at an end portion of the light guide plate support portion opposite to the light source mounting portion side.   The heat radiating member is formed in such a size that the light source mounting portion extends over substantially the entire length of the light incident surface of the light guide plate, and the light guide plate support portion and the reinforcing portion are substantially the entire length of the light source mounting portion. The lighting device according to any one of claims 1 to 5, wherein the lighting device is formed in a size extending over the entire area.   The lighting device according to any one of claims 1 to 6, wherein a plurality of the light sources are intermittently arranged in the light source mounting portion of the heat radiating member.   The light source and the heat dissipating member are arranged at least one pair so as to sandwich the light guide plate from both sides, and at least a pair of the light guide plate support parts are arranged to support both ends of the light guide plate. The illumination device according to any one of claims 1 to 7.   The lighting device according to claim 1, further comprising: a light source board that is mounted on the light source mounting portion of the heat dissipation member while the light source is mounted thereon.   The lighting device according to any one of claims 1 to 9, wherein the heat dissipating member is made of a metal material, and an oxide layer is formed on a surface thereof.   The lighting device according to claim 10, wherein aluminum is used as the metal material for the heat dissipation member, and an alumite layer is formed on a surface thereof.   The lighting device according to any one of claims 1 to 9, wherein a heat dissipating paint containing a metal oxide is applied to a surface of the heat dissipating member.   The lighting device according to any one of claims 1 to 12, wherein the heat radiating member has a black surface.   A display device comprising: the illumination device according to any one of claims 1 to 13; and a display panel that performs display using light from the illumination device.   A television receiver comprising the display device according to claim 14.

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