JP2013131961A - Composite electronic component and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a composite electronic component in which elements such as an electronic component and a sensor component are integrated and which is further miniaturized by efficiently arranging mounting terminals of the composite electronic component.SOLUTION: A crystal oscillator (10) as the composite electronic component comprises a package (11), a crystal oscillating piece (12) as an electronic element housed in the package (11), external terminals (20, 23) which are electrically connected to the crystal oscillating piece (12) and are formed on an outer peripheral surface of the package (11), and a thermistor (13) as a sensor component which is fixed to the package (11) and has terminals (19, 22). The crystal oscillator (10) is mounted on a mounting substrate (26) by the external terminals (20, 23) and the terminals (19, 22) of the thermistor (13).

Description

  The present invention relates to a composite electronic component and an electronic apparatus including the composite electronic component.

  As an example of a composite electronic component, a quartz crystal resonator piece, a chip type capacitor as a sensor component, or a crystal resonator in which a thermistor (temperature sensitive resistance element) is integrally packaged is known (for example, see Patent Document 1). ).

An outline of such a conventional crystal unit will be described with reference to FIG. As shown in FIG. 8, a conventional crystal unit 100 has a package 101 made of, for example, ceramic or the like that stores a crystal resonator element (not shown). The package 101 is provided with a recess 103 on the outer peripheral surface 102 on the side where the crystal unit 100 is connected to a mounting substrate (not shown), and a sensor such as a chip capacitor 104 is provided in the recess 103. Parts are stored.
The chip capacitor 104 has its electrode portions 111 and 112 electrically connected and fixed to connection terminals 105 and 106 provided on the bottom surface of the recessed portion 103. The chip capacitor 104 is connected to mounting terminals 107 and 108 provided on the outer peripheral surface 102 of the package 101 by wiring (not shown) extending from the connection terminals 105 and 106. On the outer peripheral surface 102, mounting terminals 109 and 110 connected to electrodes of a crystal vibrating piece (not shown) are also provided.

Japanese Patent No. 3130830

In recent years, the spread of portable electronic devices has been rapidly progressing, and there has been a strong demand for miniaturization of electronic components used in the electronic devices.
However, in the above-described crystal unit 100, the planar size becomes large because it is necessary to provide the recess 103 for housing the sensor component and the four mounting terminals 107, 108, 109, 110 on the outer peripheral surface 102. Therefore, it was one of the issues that hindered downsizing.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 The composite electronic component according to this application example is a composite electronic component in which a sensor component having a terminal is fixed to the electronic component, and the terminal of the sensor component is used as a mounting terminal for the composite electronic component. It is characterized by including.

  According to the composite electronic component described in this application example, since the mounting terminals for mounting the composite electronic component on the mounting substrate include the terminals of the sensor components constituting the composite electronic component, the sensor component Can be directly mounted on a mounting board. Therefore, the mounting terminal for mounting the sensor component provided on the mounting surface of the composite electronic component is not necessary, and the size of the composite electronic component in plan view (planar size) can be reduced.

  Application Example 2 In the composite electronic component according to the application example described above, the electronic component includes a package in which an external terminal serving as a mounting terminal for the composite electronic component is formed on an outer peripheral surface, and an electronic housed in the package. And the composite electronic component is mounted on a substrate by the external terminal and the terminal of the sensor component.

  According to this application example, the composite electronic component is a mounting terminal for the composite electronic component, and is mounted on the mounting substrate by the external terminal formed on the outer surface of the package of the electronic component and the terminal of the sensor component. For this reason, the connection terminal for mounting the sensor component is not necessary on the outer surface of the package, and the size of the composite electronic component in plan view (planar size) can be reduced.

  Application Example 3 The composite electronic component according to the application example described above includes a plurality of the terminals having different potentials, and the plurality of terminals are provided on a surface of the sensor component that is mounted on the substrate. It is characterized by that.

  According to this application example, a plurality of terminals having different potentials are provided on the sensor component on the same surface on the side where the sensor component is mounted on the mounting board, so that the plurality of terminals can be simultaneously mounted on the mounting board. In addition, since the heights of the plurality of terminals are constant, the terminal mounting state can be stabilized.

  Application Example 4 In the composite electronic component according to the application example described above, the sensor component includes the terminals having different potentials on the front surface and the back surface, and the terminals on the surface are the mounting terminals, The terminal on the back surface is a connection terminal provided on a side fixed to the electronic component.

  According to this application example, terminals having different potentials are formed on the front surface and the back surface, so that it becomes a smaller sensor component, and it is possible to provide a small composite electronic component by using this sensor component. Become. In addition, since a small sensor component can be used, a composite electronic component having a plurality of sensor components can be provided.

  Application Example 5 In the composite electronic component according to the application example described above, the sensor component is fixed to a stepped surface formed with a step from the mounting surface of the electronic component.

According to this application example, since the sensor component is fixed to the step surface formed to have a step with the mounting surface of the electronic component, the height of the sensor component terminal and the mounting surface of the electronic component is made closer. In addition, the height of the terminal of the sensor component and the mounting surface of the electronic component can be on the same plane. This makes it possible to stabilize the mounting state when mounting the composite electronic component.
Application Example 6 In the composite electronic component according to the application example, the sensor component is a temperature sensitive element.

  According to this application example, in addition to the above-described effects, it is possible to provide a composite electronic component capable of detecting the ambient temperature and correcting the temperature even for an electronic component having temperature dependence. Become.

  Application Example 7 An electronic apparatus according to this application example includes the composite electronic component described in the application example.

  According to the electronic device described in this application example, since the composite electronic component having a small size in a plan view (planar size) is used, the electronic device using the electronic device can be downsized.

The quartz crystal resonator as a composite electronic component concerning a 1st embodiment is shown, (a) is a front sectional view and (b) is a bottom view seen from the P direction of (a). The circuit block diagram of the crystal oscillator of 1st Embodiment. The crystal resonator as a composite electronic component concerning 2nd Embodiment is shown, (a) is the bottom view seen from the mounting surface side, (b) is a side view of (a). FIG. 9 is a front sectional view showing a crystal oscillator as a composite electronic component according to a third embodiment. 1 is a perspective view illustrating an outline of a mobile phone as an example of an electronic apparatus according to the invention. 1 is a circuit block diagram of a mobile phone as an example of an electronic apparatus according to the invention. 1 is a perspective view showing an outline of a personal computer as an example of an electronic apparatus according to the invention. The bottom view which looked at the conventional composite electronic component from the mounting surface side.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings. In the first embodiment and the second embodiment, as an example of a composite electronic component, a crystal resonator in which a thermistor (temperature-sensitive resistance element) as a sensor component and a crystal resonator element as an electronic component are joined (fixed) in the same package The configuration of will be described. In the third embodiment, a configuration of a crystal oscillator in which a semiconductor element is further connected in addition to the crystal resonators described in the first embodiment and the second embodiment will be described.

(First embodiment)
1st Embodiment is described using FIG. 1, FIG. 1A and 1B show a schematic configuration of a crystal resonator as a composite electronic component according to the first embodiment. FIG. 1A is a front sectional view, and FIG. 1B is a bottom (mounting surface) direction of FIG. FIG. 2 is a circuit configuration diagram of the crystal resonator.

First, a schematic configuration of the crystal resonator will be described.
As shown in FIG. 1A, a quartz crystal resonator 10 as a composite electronic component has an electronic element placed in a concave vibrating piece storage portion 14 provided in the upper portion of a package 11 formed using ceramic or the like. A piezoelectric vibrating piece as an example (in this example, a crystal vibrating piece formed from quartz is described, and hereinafter, described as a quartz vibrating piece 12) is housed.

The quartz crystal resonator element 12 includes a quartz substrate made of a piezoelectric material such as quartz (for example, an AT-cut quartz substrate), excitation electrodes formed on the vibration regions on both the front and back surfaces of the quartz substrate, and from each excitation electrode to the edge of the quartz substrate. A lead electrode that extends and a pad provided at an end of each lead terminal are provided. In addition, illustration of each part which comprises the crystal vibrating piece 12 mentioned above is abbreviate | omitted.
The crystal vibrating piece 12 is bonded to the above-described pad and an electrode (not shown) provided on the step portion 15 of the vibrating piece storage portion 14 while being electrically connected by the conductive adhesive 16, and the package 11 It is fixed to. The crystal resonator element 12 is hermetically sealed and stored in the package 11 by a metal (for example, Kovar) lid body 25 provided so as to cover the opening of the resonator element storage section 14.

The package 11 has a crystal on one surface of the lower portion of the package 11 (one surface on the outer surface of the package), in other words, on the bottom surface (mounting surface) 24 facing the mounting substrate 26 on which the crystal resonator 10 is mounted. External terminals 20 and 23 for mounting the vibrator 10 on the mounting substrate 26 are formed.
The external terminals 20 and 23 are mounting terminals for the crystal unit 10. The external terminals 20 and 23 are connected to an electrode (not shown) that fixes the crystal vibrating piece 12 by a connection wiring 21. The external terminals 20 and 23 may be provided extending on the side surface of the package 11.

Further, the crystal unit 10 is provided with a temperature sensor (hereinafter referred to as the thermistor 13) as a sensor component fixed to a stepped portion 17 provided in the lower part of the package 11 in the figure.
The stepped portion 17 has a step that becomes lower from the bottom surface (mounting surface) 24 of the package 11 on the side facing the mounting substrate 26 on which the crystal resonator 10 is mounted toward the side where the lid 25 is provided. Is formed. Further, as shown in FIG. 1B, the stepped portion 17 of this example includes the outer side surface of the package 11 when viewed from the bottom surface 24 side (so that the stepped surface 17a covers the side surface). ing. In other words, the stepped portion 17 has a shape in which the three side surfaces of the package 11 are opened.

  In this example, the stepped portion 17 has been described as having a shape opened on the three side surfaces of the package 11. However, the present invention is not limited to this. For example, the stepped portion 17 is opened on one side surface of the package 11. The stepped portion 17 is open on the two side surfaces of the package 11, or the stepped portion 17 does not reach the side surface of the package 11 and is formed in the bottom surface (mounting surface) 24 of the package 11. (The four sides are surrounded by a package wall).

The thermistor 13 has a fixed surface 29 that is fixed to the step surface 17 a of the step portion 17 provided in the package 11, and a mounting surface 28 that is the front and back surfaces of the fixed surface 29. Two terminals 19 and 22 having different potentials are provided. The two terminals 19 and 22 may be provided so as to extend from the mounting surface 28 to the side surface 27 of the thermistor 13.
The thermistor 13 is housed in the stepped portion 17 so that the two terminals 19 and 22 are on the bottom surface 24 side of the package 11, and the fixed surface 29 on the opposite side of the mounting surface 28 provided with the terminals 19 and 22 is the stepped portion. It is fixed to the stepped surface 17 a of the portion 17 with a bonding material 18. In other words, the two terminals 19 and 22 are provided on the mounting surface 28 which is one surface of the thermistor 13 exposed to the bottom surface 24 side when the thermistor 13 is fixed to the package 11. These two terminals 19 and 22 are the mounting terminals for the thermistor 13 and also have the function as the mounting terminals for the crystal unit 10.

  As described above, since the two terminals 19 and 22 of the thermistor 13 are provided on the same surface, the two terminals 19 and 22 can be mounted on the mounting substrate 26 at the same time. Therefore, the mounting state of the terminals 19 and 22 can be stabilized.

  The crystal unit 10 is a composite electronic component for surface mounting. The crystal resonator 10 is mounted by external terminals 20 and 23 (terminals for connection to the crystal resonator element 12) provided on the bottom surface 24 of the package 11 and terminals 19 and 22 which are mounting terminals for the thermistor 13. Connected to the substrate 26.

  Next, an example of a circuit configuration using the above-described crystal resonator 10 will be described with reference to FIG. In the circuit diagram shown in FIG. 2, the crystal resonator 10 includes a crystal resonator element 12 connected to an oscillation circuit 131 described later, and a thermistor 13 as a temperature sensor connected to a power source 136. The IC component 130 externally attached to the crystal unit 10 includes an oscillation circuit 131, a temperature compensation circuit 133, an A / D converter 135, and the like. The output (temperature information) of the thermistor 13 mounted on the crystal unit 10 is input to the temperature compensation circuit 133 as temperature information 134 converted into a digital signal by the A / D converter 135. The temperature compensation circuit 133 outputs the frequency control information 132 generated based on the temperature information 134 to the oscillation circuit 131. The oscillation circuit 131 outputs a frequency whose temperature is corrected based on the frequency control information 132.

  As described above, the crystal resonator 10 is a composite electronic component in which the crystal resonator element 12 and the temperature sensor (thermistor 13) as a sensor component are provided in the same package 11. The terminals for mounting the crystal resonator 10 on the mounting substrate 26 are external terminals 20 and 23 (mounting terminals connected to the crystal resonator element 12) provided on the bottom surface 24 of the package 11, and the thermistor 13. Terminals 19 and 22 which are mounting terminals are used. That is, the terminals 19 and 22 that are mounting terminals of the thermistor 13 are used as mounting terminals of the crystal unit 10.

By using this configuration, a mounting connection terminal for connecting the sensor component connected to the sensor component by wiring and the mounting substrate provided on the mounting surface of the composite electronic component (quartz crystal unit) becomes unnecessary. . In other words, a mounting connection terminal for connecting the sensor component and the mounting substrate provided at a position different from the mounting position of the sensor component becomes unnecessary. As a result, the crystal resonator 10 described in the first embodiment can be reduced in size (planar size) in plan view (P view direction in the drawing or the opposite direction). It becomes possible to achieve further miniaturization.
Further, it is possible to increase the size (planar size) of the external terminals 20 and 23 and the terminals 19 and 22 in the plan view (P view direction shown in the drawing or the opposite direction), which contributes to the improvement of the bonding strength. It becomes possible.

  Furthermore, in this configuration, the external terminals 20 and 23 connected to the crystal resonator element 12 formed in the package 11 and the terminals 19 and 22 which are mounting terminals of the thermistor 13 are opposed to each other. The wiring of the thermistor 13 does not exist in the package 11. With this configuration, it is possible to prevent the wiring (terminal) for oscillating the quartz crystal vibrating piece 12 and the wiring (terminal) of the thermistor 13 from crossing in a plan view, and to further increase the distance between them. In other words, the wiring (terminal) for oscillating the crystal vibrating piece 12 and the wiring (terminal) of the thermistor 13 are electrically loosely coupled to prevent the occurrence of capacitive coupling between the wirings. it can. From these, the crystal resonator 10 having the configuration of the present embodiment can prevent characteristic deterioration due to capacitive coupling between the wiring (terminal) for oscillating the crystal vibrating piece 12 and the wiring (terminal) of the thermistor 13, It becomes possible to obtain more stable characteristics.

  In the above description, the crystal resonator using quartz is described. However, the present invention is not limited to this, and a piezoelectric resonator using another piezoelectric element such as a piezoelectric ceramic or lithium tantalate may be used.

(Second Embodiment)
Next, a second embodiment will be described with reference to FIG. 3A and 3B show a crystal resonator as a composite electronic component according to the second embodiment, in which FIG. 3A is a bottom view viewed from the mounting surface side, and FIG. 3B is a side view of FIG. In the description of the second embodiment, the description of the same configuration as that of the first embodiment is simplified or the description is omitted.

  As shown in FIG. 3, a crystal resonator 30 as a composite electronic component is provided as an example of an electronic element in a concave vibration piece storage portion 34 provided at an upper portion of a package 31 made of ceramic or the like. A piezoelectric vibrating piece (in this example, described as a quartz vibrating piece formed of quartz and hereinafter described as a quartz vibrating piece 32) is accommodated. The quartz crystal resonator element 32 connected to the resonator element housing portion 34 in the same manner as in the first embodiment is hermetically sealed by a lid 45 provided so as to cover the opening of the resonator element housing portion 34. It is stored in.

  In the package 31, the crystal unit 30 is mounted on one surface of the outer surface of the package 31, in other words, on the bottom surface (mounting surface) 44 facing the mounting substrate (not shown) on which the crystal unit 30 is mounted. External terminals 40, 42, 43 for mounting on the substrate are formed. Of these, the external terminals 40 and 43 are terminals for mounting the crystal resonator 30 and also have a function as terminals for electrical connection of the crystal resonator element 32. That is, the external terminals 40 and 43 are connected to the excitation electrode (not shown) of the crystal vibrating piece 32 by the connection wiring. Another external terminal 42 is a mounting terminal for a connection electrode 52 provided at the bottom of a step 47 described later and one electrode of a thermistor 33 described later electrically connected by a wiring 49. Note that the external terminals 40, 42, and 43 may be provided extending on the side surface of the package 31.

Further, the crystal unit 30 is provided with a temperature sensor (hereinafter referred to as a thermistor 33) as a sensor component fixed to a step surface 53 which is a bottom surface of a step portion 47 provided in the lower portion of the package 31 in the figure. ing.
The stepped portion 47 is formed with a stepped portion that becomes lower from the bottom surface (mounting surface) 44 of the package toward the side where the lid 45 is provided. Further, the stepped portion 47 of this example is formed so that the stepped surface 53 covers the side surface of the package 31. In other words, the stepped portion 47 has a shape opened to two side surfaces of the package 31.

  In this example, the stepped portion 47 has been described as having a shape opened on two side surfaces of the package 31. However, the present invention is not limited to this. For example, the stepped portion 47 is opened on one side surface of the package 31. Alternatively, the stepped portion 47 does not extend to the side surface of the package 31 and is a recessed portion (four sides are surrounded by the package wall) formed on the bottom surface (mounting surface) 44 of the package 31. Also good. A connection electrode 52 for connecting the thermistor 33 is provided at the bottom of the step 47 (step 53).

The thermistor 33 has a fixed surface (back surface) 50 that is fixed to the step surface 53 of the step portion 47 provided in the package 31, and a mounting surface (front surface) 48 that is the front and back surfaces of the fixed surface 50. Yes.
The mounting surface 48 and the fixed surface 50 are provided with two terminals 39 and 51 having different potentials, and one terminal 51 is connected to a connection electrode 52 provided at the bottom of the stepped portion 47 with a conductive connecting material (not shown). It is connected. The other terminal 39 is provided on the bottom surface 44 side of the package 31 and serves as a mounting terminal for the thermistor 33 and one mounting terminal for the crystal unit 30. The terminal 39 may be provided so as to extend from the mounting surface 48 to the side surface 54 of the thermistor 33.

  As described above, the crystal unit 30 is connected to the mounting substrate by the external terminals 40, 42, 43 provided on the bottom surface 44 of the package 31 and the terminal 39 that is the mounting terminal of the thermistor 33.

According to the crystal resonator 30 as the composite electronic component of the second embodiment described above, the thermistor 33 is provided with the mounting terminal 39 and the connection terminal 51 to the package 31 in a front-back relationship. Therefore, further downsizing can be achieved. Therefore, the crystal resonator 30 using the small thermistor 33 can be further reduced in size in plan view (planar size).
In addition, since the thermistor 33 as a sensor component can be reduced in size, a plurality of thermistors 33 (sensor components) can be mounted on the crystal unit 30 (composite electronic component). Thereby, it becomes possible to mount sensor parts having different characteristics.

(Third embodiment)
Next, a third embodiment will be described with reference to FIG. FIG. 4 is a front sectional view showing a crystal oscillator as a composite electronic component according to the third embodiment. In the description of the third embodiment, the description of the same configuration as that of the first embodiment is simplified or the description is omitted.

As shown in FIG. 4, a crystal oscillator 60 as a composite electronic component includes a piezoelectric resonator as an example of an electronic element in a concave vibration piece storage portion 64 provided at an upper portion of a package 61 formed of ceramic or the like. A resonator element (in this example, a crystal resonator element made of crystal is described, and hereinafter, described as a crystal resonator element 62) is accommodated.
Further, the resonator element housing portion 64 is provided with a semiconductor element 80 in which, for example, an oscillation circuit of a crystal resonator element 62 and a temperature compensation circuit are formed. The semiconductor element 80 is below the crystal vibrating piece 62 and is connected to an internal terminal (not shown) by, for example, a metal bump 81 or the like. Then, the quartz crystal vibrating piece 62 and the semiconductor element 80 connected to the vibrating piece storage portion 64 in the same manner as in the first embodiment are aired by a lid 75 provided so as to cover the opening of the vibrating piece storage portion 64. It is hermetically sealed and stored in the package 61.

  The package 61 is disposed on one surface of the lower portion of the package 61 (one surface on the outer surface of the package), in other words, on the bottom surface (mounting surface) 74 facing the mounting substrate 76 on which the crystal oscillator 60 is mounted. Are formed on the mounting substrate 76. The external terminal 70 is a mounting terminal for the crystal oscillator 60 and is electrically connected to the semiconductor element 80. The driving power supply terminal (Vcc terminal), the control voltage application mounting terminal (Vcon terminal), and the signal output terminal (Out) Terminal) and a connection terminal such as a ground terminal (Gnd terminal). The external terminal 70 may be provided extending on the side surface of the package 61. Further, illustration of connection wiring between the external terminal 70 and the semiconductor element 80 is omitted.

  Further, the crystal oscillator 60 is provided with a temperature sensor (hereinafter referred to as the thermistor 63) as a sensor component fixed to a stepped portion 67 provided in the lower part of the package 61 in the figure. The thermistor 63 is connected to the bottom of the stepped portion 67 with a bonding material 68. Note that the configuration of the stepped portion 67 and the configuration of the thermistor 63 are the same as those in the above-described embodiment, and thus description thereof is omitted.

  The crystal oscillator 60 is connected to the mounting substrate 76 by an external terminal 70 provided on the bottom surface 74 of the package 61 and terminals 69 and 72 provided on the mounting surface 78 of the thermistor 63.

According to the crystal oscillator 60 of this configuration, as in the first embodiment, the size in plan view (planar size) can be reduced, and a smaller crystal oscillator 60 can be obtained.
Further, it is possible to increase the size of the external terminal 70 and the terminals 69 and 72 in a plan view (planar size), and it is possible to contribute to the improvement of the bonding strength.

In the first to third embodiments described above, the composite electronic component has been described by taking a crystal resonator and a crystal oscillator using a crystal resonator element as an electronic element as an example. However, the present invention is not limited to this. For example, the present invention can be applied to an acceleration sensor using an acceleration detection element or an angular velocity sensor (gyro sensor) using an angular velocity detection element (gyro element) as an electronic element.
Further, the electronic element may be a MEMS element (Micro-Electro-Mechanical Systems) including at least these functions (generation of reference signal, acceleration detection, angular velocity detection, etc.).

  In the first to third embodiments described above, the thermistor as an example of the temperature sensitive element is used as the sensor component. However, the present invention is not limited to this. For example, a chip type capacitor, a semiconductor element using a PN junction, etc. Any element (component) having the property of changing its characteristics due to temperature changes may be used.

In the first embodiment and the third embodiment described above, the mounting surfaces 28 and 78 of the thermistors 13 and 63 on which the terminals 19, 22, 69, and 72 used for mounting have been described as planar. As long as mounting is possible, the surface may not be flat, and may be uneven or curved.
Further, in the first embodiment and the third embodiment described above, the example in which the sensor component is arranged in the stepped portion of the mounting surface of the package has been described, but the present invention is not limited to this, and if it can be mounted on the mounting board, The sensor component may be arranged on the same surface as the mounting surface of the package.

(Electronics)
The composite crystal resonators 10 and 30 or the temperature compensated crystal oscillator 60 as the composite electronic component of each embodiment described above can be applied to various electronic devices. It is possible to reduce the size.
5 and 6 show a mobile phone as an example of an electronic apparatus according to the present invention. FIG. 5 is a perspective view showing an outline of the appearance of the mobile phone, and FIG. 6 is a circuit block diagram for explaining a circuit portion of the mobile phone.

  This cellular phone 300 can use a crystal resonator (composite crystal resonator) or a crystal oscillator as the above-described composite electronic component. In this example, an example using a crystal resonator will be described. In addition, the same reference numerals are used for the configuration and operation of the crystal unit, and the description thereof is omitted.

  As shown in FIG. 5, the mobile phone 300 is provided with an LCD (Liquid Crystal Display) 301 as a display unit, a key 302 as an input unit for numbers, a microphone 303, a speaker 311, a circuit unit (not shown), and the like. A part of these constituent members, a circuit portion, and the like are connected to a mounting substrate on which a circuit wiring pattern is formed by using, for example, soldering.

  As shown in FIG. 6, when transmitting by mobile phone 300, when the user inputs his / her voice to microphone 303, the signal passes through pulse width modulation / coding block 304 and modulator / demodulator block 305. The data is transmitted from the antenna 308 via the transmitter 306 and the antenna switch 307.

On the other hand, a signal transmitted from another telephone is received by the antenna 308, and is input to the modulator / demodulator block 305 from the receiver 310 via the antenna switch 307 and the reception filter + amplifier 309. The modulated or demodulated signal is output as a voice to the speaker 311 via the pulse width modulation / coding block 304.
Among these, a controller 312 for controlling the antenna switch 307, the modulator / demodulator block 305, and the like is provided.

In addition to the above, the controller 312 controls the LCD 301 which is a display unit, the key 302 which is an input unit for numbers and the like, and further the RAM 313, the ROM 314 and the like. There is also a demand for miniaturization of the mobile phone 300.
The above-described crystal resonator 315 and other crystal resonators 50 are used to meet such requirements. Note that a quartz crystal resonator as another example of the composite electronic component described above can be used for the quartz crystal resonator 50.
The mobile phone 300 includes a receiver synthesizer 316, a transmitter synthesizer 317, and the like as other constituent blocks, but the description thereof is omitted.

  A crystal resonator 315 as a composite electronic device used in the cellular phone 300 (this example is the crystal resonator 10 described in the first embodiment, and the subsequent description of the constituent parts is the first embodiment. The temperature sensor (thermistor) 13 and the crystal vibrating piece 12 are fixed and housed in one package 11 to form one component, and can be connected to the mounting board. The external terminals 20 and 23 of the package 11 and the terminals 19 and 22 of the thermistor 13 are used. Accordingly, in the mounting of the crystal unit 315, as described above, it is possible to realize area saving (small size) in a plan view, and it is possible to contribute to downsizing of the electronic device (the mobile phone 300). .

  As an electronic apparatus including the composite electronic component according to the present invention, a personal computer (mobile personal computer) 400 shown in FIG. The personal computer 400 includes a display unit 401, an input key unit 402, and the like, and an electronic device for electrical control thereof, or a crystal resonator 315 as a reference clock source is used.

  In addition to the above, the electronic apparatus including the composite electronic component of the present invention includes, for example, a digital still camera, an ink jet type ejection device (for example, an ink jet printer), a laptop personal computer, a television, a video camera, a video tape recorder, a car Navigation devices, pagers, electronic notebooks (including communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations, videophones, crime prevention TV monitors, electronic binoculars, POS terminals, medical devices (for example, electronic thermometers, Blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring instruments, instruments (eg, vehicle, aircraft, ship instruments), flight simulator, etc. .

  As mentioned above, although the electronic device of the present invention has been described based on the illustrated embodiment, the present invention is not limited to this, and the configuration of each part is replaced with an arbitrary configuration having the same function. be able to.

  DESCRIPTION OF SYMBOLS 10,30 ... Quartz crystal | crystallization vibrator as composite electronic component, 11 ... Package, 12 ... Quartz vibrating piece, 13 ... Thermistor as sensor component, 14 ... Vibrating piece storage part, 15 ... Step part, 16 ... Conductive adhesive agent, DESCRIPTION OF SYMBOLS 17 ... Step part, 18 ... Bonding material, 19, 22 ... Terminal, 20, 23 ... External terminal, 21 ... Wiring, 24 ... Bottom face (mounting surface) of crystal resonator, 25 ... Cover, 26 ... Mounting substrate, 27 A side surface of the thermistor, 28 a mounting surface of the thermistor, 29 a fixing surface of the thermistor, 60 a crystal oscillator as a composite electronic component

Claims (7)

A sensor component having a terminal is a composite electronic component fixed to an electronic component,
A composite electronic component comprising the terminal of the sensor component as a mounting terminal for the composite electronic component. The composite electronic component of claim 1,
The electronic component is
A package in which external terminals to be terminals for mounting the composite electronic component are formed on the outer peripheral surface;
An electronic device housed in the package,
The composite electronic component is mounted on a substrate by the external terminal and the terminal of the sensor component. In the composite electronic component according to claim 1 or 2,
The sensor component includes a plurality of terminals having different potentials,
A plurality of the terminals are provided on a surface of the sensor component that is mounted on the substrate. In the composite electronic component according to claim 1 or 2,
The sensor component includes the terminals having different potentials on the front surface and the back surface,
The terminal on the surface is the mounting terminal,
The composite electronic component according to claim 1, wherein the terminal on the back surface is a connection terminal provided on a side fixed to the electronic component. The composite electronic component according to any one of claims 1 to 4,
The composite electronic component according to claim 1, wherein the sensor component is fixed to a stepped surface formed with a step from the mounting surface of the electronic component. The composite electronic component according to any one of claims 1 to 5,
The sensor component is a temperature sensitive element.   An electronic apparatus comprising the composite electronic component according to any one of claims 1 to 6.

Images