JP2013131093A - Power supply system and power supply module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a power supply system and a power supply module capable of stably supplying power.SOLUTION: A power supply system includes: a main substrate 100; an SSD 190 to which power is supplied from the main substrate 100; and a power supply module M in which a laminated energy device 18 sealing two or more layers of laminating bodies by a laminate sheet is mounted on a module substrate together with a peripheral circuit. When the power of the main substrate 100 is normally supplied, power is supplied to the SSD 190 from the power of the main substrate 100, and the laminated energy device 18 is charged by the power of the main substrate 100. When the power of the main substrate 100 is not normally supplied, the laminated energy device 18 is discharged, and power is supplied from the laminated energy device 18 to the SSD 190.

Description

  The present invention relates to a power supply system and a power supply module that perform temporary power supply.

  Conventionally, when power is not supplied due to a power failure or the like, it is known to temporarily supply power using a button-type battery or a large-capacitance capacitor (for example, see Patent Document 1).

JP 05-095641 A

  However, conventional batteries and capacitors may not be able to supply a large amount of power instantaneously. Therefore, when power is not supplied due to a power failure or the like, data stored in a storage device having a volatile memory such as an SSD may be lost.

  An object of the present invention is to provide a power supply system and a power supply module that can perform stable power supply.

  According to one aspect of the present invention, a main substrate, a supply target device to which power is supplied from the main substrate, an active material electrode having positive and negative electrodes, and an active electrode having positive and negative electrodes formed integrally are provided. Two or more layers laminated so that the extraction electrode is exposed and the positive electrode and the negative electrode of the active material electrode are alternated while interposing a separator through which electrolyte and ions can pass through the material electrode portion When the laminate type energy device in which the laminate is sealed with a laminate sheet is provided with a power supply module mounted on a module substrate integrally with its peripheral circuit, and the main substrate is supplied with power normally, the main substrate Power from the power source to the supply target device, and the laminate type energy device is charged by the power source of the main board, If the power of the plate is not supplied correctly, it discharges the laminate type energy device, a power supply system for supplying power to the supply target device from the laminate type energy device is provided.

  According to another aspect of the present invention, a separator capable of passing an electrolyte and ions is interposed in the active material electrode portion of the electrode in which the positive and negative active material electrodes and the positive and negative lead electrodes are integrally formed. A laminate type energy device in which a laminate of two or more layers laminated so that the lead electrode is exposed and the positive electrode and the negative electrode of the active material electrode are alternated is sealed with a laminate sheet, A peripheral circuit of the laminate type energy device, and a module substrate on which the laminate type energy device and the peripheral circuit are mounted, and when the power of the main board is normally supplied, the supply target from the power of the main board Supplying power to the apparatus, and charging the laminated energy device with the power source of the main board, If the power of the plate is not supplied correctly, the discharges the laminate type energy device, a power supply module supplies power to the supply target device from the laminate type energy device is provided.

  ADVANTAGE OF THE INVENTION According to this invention, the power supply system and power supply module which can perform the stable power supply can be provided.

1 is a schematic bird's-eye view structure diagram of a power supply system according to a first embodiment. The typical block block diagram of the main board | substrate which concerns on 1st Embodiment. It is a figure for demonstrating the power supply module which concerns on 1st Embodiment, Comprising: (a) Typical bird's-eye view structural drawing, (b) Typical side view. The typical block block diagram of the power supply module which concerns on 1st Embodiment. The flowchart which shows operation | movement of the power supply module which concerns on 1st Embodiment. The typical bird's-eye view structure figure of the power supply system which concerns on 2nd Embodiment. The typical bird's-eye view structure figure of the power supply module which concerns on 2nd Embodiment. The typical bird's-eye view structure figure of the power supply system which concerns on 3rd Embodiment. The typical bird's-eye view structure figure of the power supply system which concerns on 4th Embodiment. The typical block block diagram of the power supply module which concerns on 4th Embodiment. It is a timing chart which shows operation | movement of the power supply module which concerns on 4th Embodiment, (a) Power supply voltage waveform, (b) Output voltage waveform of reset IC. The typical block block diagram of the other power supply module which concerns on 4th Embodiment. The typical bird's-eye view structure figure of the lamination type energy device which concerns on 5th Embodiment. The typical cross-section figure of the seal | sticker part which concerns on 5th Embodiment. It is a figure for demonstrating the mounting method of the lamination type energy device which concerns on 5th Embodiment, (a) Typical sectional structure figure which shows the state before peeling paper is peeled, (b) The typical cross-section figure which shows the state after peeling paper is peeled off. The typical plane pattern block diagram of the module board which mounted the lamination type energy device which concerns on 5th Embodiment. The typical cross-section figure of the module board which mounted the lamination type energy device which concerns on 5th Embodiment. The typical cross-section figure of the module board which mounted the lamination type energy device which concerns on 5th Embodiment. The typical plane pattern block diagram of the laminate type energy device of 3 terminals which concerns on 5th Embodiment. The typical plane pattern block diagram which illustrates the variation of the laminate type energy device of 3 terminals which concerns on 5th Embodiment. The typical plane pattern block diagram which illustrates the variation of the laminate type energy device of 3 terminals which concerns on 5th Embodiment. The typical bird's-eye view structural diagram for demonstrating the other mounting method of the lamination type energy device which concerns on 5th Embodiment. The typical cross-section figure for demonstrating the other mounting method of the lamination type energy device which concerns on 5th Embodiment. The typical bird's-eye view structural diagram for demonstrating the other mounting method of the lamination type energy device which concerns on 5th Embodiment. The typical cross-section figure for demonstrating the other mounting method of the lamination type energy device which concerns on 5th Embodiment. It is a figure for demonstrating the lamination type energy device which concerns on 5th Embodiment, Comprising: (a) Typical plane pattern block diagram, (b) Typical cross-sectional structure figure at the time of mounting | wearing with a main board | substrate. The typical cross-section figure for demonstrating the other mounting method of the lamination type energy device which concerns on 5th Embodiment. The typical cross-section figure for demonstrating the other mounting method of the lamination type energy device which concerns on 5th Embodiment. In the power supply module which concerns on 5th Embodiment, it is a figure for demonstrating the variation of the bending process of an extraction electrode, Comprising: (a) Typical cross-section figure in case the bending process is not given, (b) Bending Schematic cross-sectional structure diagram when processing is performed, (c) Schematic cross-sectional structure diagram when module processing is not performed, (d) Schematic diagram on module substrate when processing is performed FIG. In the power supply module which concerns on 5th Embodiment, it is typical sectional structure drawing for demonstrating the other mounting method of EDLC, (a) The extraction electrode 34 is turned around and the adhesive of EDLC is exposed. Example of structure in which the surface is bonded to the outer surface of the hard coat, (b) The lead electrode is folded back, and the surface where the EDLC adhesive is exposed is equipped with components such as an EDLC charger circuit and a DC / DC converter An example of a structure that is bonded to the opposite surface. In the power supply module which concerns on 5th Embodiment, it is typical sectional structure drawing for demonstrating the other mounting method of EDLC, Comprising: (a) EDLC is fixed to the back side of a main board | substrate, Example of structure in which only the substrate surface opposite to the substrate surface on which the EDLC is mounted is covered by the provided laminate sheet, (b) the end of the laminate sheet is in contact with a specific component, or a specific component is Covered structure example. The typical cross-section figure for demonstrating the other mounting method of EDLC in the power supply module which concerns on 5th Embodiment. It is a figure for demonstrating the power supply module which concerns on 5th Embodiment, Comprising: (a) Typical plane pattern block diagram, (b) Typical side surface pattern structure figure. The typical top view which shows a mode that the power supply module which concerns on 5th Embodiment is powder-coated. It is a figure for demonstrating the power supply module after the powder coating which concerns on 5th Embodiment, (a) Typical plane pattern block diagram, (b) Typical side surface pattern structure figure. The typical bird's-eye view structural view which shows a mode that the power supply module which concerns on 5th Embodiment is mounted in a main board | substrate. The typical plane pattern block diagram which illustrates the basic structure of an EDLC internal electrode in the power supply module which concerns on 5th Embodiment. The typical plane pattern block diagram which illustrates the basic structure of the lithium ion capacitor internal electrode in the power supply module which concerns on 5th Embodiment. The typical plane pattern block diagram which illustrates the basic structure of the lithium ion battery internal electrode in the power supply module which concerns on 5th Embodiment.

  Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the relationship between the thickness of each component and the planar dimensions, the ratio of the thickness of each layer, and the like are different from the actual ones. Therefore, specific thicknesses and dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

  Further, the embodiments described below exemplify apparatuses and methods for embodying the technical idea of the present invention, and the embodiments of the present invention include the material, shape, and structure of each component. The arrangement is not specified below. Various modifications can be made to the embodiment of the present invention within the scope of the claims.

[First Embodiment]
Hereinafter, the first embodiment will be described with reference to FIGS.

(Power supply system)
In the power supply system according to the first embodiment, the main substrate 100, the supply target device 190 to which power is supplied from the main substrate 100, the positive and negative active material electrodes, and the positive and negative lead electrodes 34 are integrated. The extraction electrode 34 is exposed and the positive electrode and the negative electrode of the active material electrode are alternated while the separator 30 capable of passing the electrolytic solution and ions is interposed in the active material electrode portion of the formed electrode. A laminated energy device 18 in which a laminate of two or more layers laminated on each other is sealed with a laminate sheet is provided with a power supply module M mounted on a module substrate integrally with its peripheral circuit, and the power of the main substrate 100 is normally supplied. If the power is supplied from the main board 100 to the supply target device 190, the main board 100 is powered by the laminator. Charge the type energy device 18, when the power of the main substrate 100 is not supplied correctly, the laminate type energy device 18 is discharged to supply power to the supply target device 190 from the laminate type energy device 18. For example, the supply target device 190 is a storage device (SSD) having a volatile memory, and the power supply module M supplies power necessary for backup of data stored in the volatile memory.

  FIG. 1 is a schematic bird's-eye view of the power supply system according to the first embodiment. As shown in this figure, a large number of IC chips 160 and 170, a transformer 120, and other device components 140 are mounted on the main board 100. An SSD 190 is connected to the connector 101 on the main board 100 via a cable 192. The SSD is a storage device used as a substitute for a hard disk, and includes a nonvolatile memory and a volatile memory. Therefore, if power is not supplied due to a power failure or the like, data stored in the volatile memory may be lost. Therefore, the power supply module M is inserted into the connector 102 provided on the end surface of the main board 100. In an emergency such as a power failure, the power supply module M supplies temporary power to the SSD 190 to protect data stored in the volatile memory (described later).

(Main board)
FIG. 2 is a schematic block configuration diagram of the main board 100 according to the first embodiment. The main board 100 is a motherboard mounted on a notebook personal computer, for example. As shown in the figure, the main board 100 includes a power supply circuit 104, a CPU 105, a memory 106, an interface 107, an image display unit 108, and a storage device 109. The power supply circuit 104 is a circuit that generates necessary power from input power (power). The power generated by the power supply circuit 104 is supplied to the SSD 190.

(Power module)
The power supply module M according to the first embodiment includes a separator 30 that allows an electrolyte and ions to pass through an active material electrode portion of an electrode in which a positive and negative active material electrode and a positive and negative electrode lead electrode 34 are integrally formed. A laminated energy device in which a laminate of two or more layers laminated so that the extraction electrode 34 is exposed and the positive electrode and the negative electrode of the active material electrode are alternated is interposed with a laminate sheet. 18, a peripheral circuit of the laminated energy device 18, and a module substrate 111 on which the laminated energy device 18 and the peripheral circuit are mounted, and when the power of the main substrate 100 is normally supplied, Power to the SSD 190 from the main body 100 and the laminate type energy device 18 charges, when the power of the main substrate 100 is not supplied correctly, the laminate type energy device 18 is discharged to supply power from the laminate type energy device 18 to SSD190.

  3A and 3B are diagrams for explaining the power supply module M according to the first embodiment, in which FIG. 3A is a schematic bird's-eye view structural view, and FIG. 3B is a schematic side view. The power supply module M is a power supply module that assists the battery. As shown in FIG. 3, the laminated energy device 18 is integrated with the EDLC charger circuit 150 and the DC / DC converter (or switching regulator) 160 as a module substrate. 111. Other peripheral circuits (such as the voltage monitoring IC 170) may be mounted on the module substrate 111. The peripheral circuit is a circuit necessary for the laminated energy device 18 to function normally. On the end surface of the module substrate 111, a connection terminal 110 for an add-on connection to the connector 102 of the main substrate 100 is provided. The laminate type energy device 18 is, for example, an electric double layer capacitor (EDLC). Although it is thin, it can supply a large amount of power instantaneously. The configuration of the laminate type energy device 18 and the method of mounting the laminate type energy device 18 on the module substrate 111 will be described in detail later.

  FIG. 4 is a schematic block diagram of the power supply module M according to the first embodiment. The EDLC charger circuit 150 is a circuit for charging the laminated energy device 18 with the power supply of the main board 100. The voltage monitoring IC 170 monitors the voltage of the power source of the main board 100 and switches the switch from the power source of the main board 100 to the laminate type energy device 18 when a power source abnormality is detected. The DC / DC converter 160 is a circuit for stepping up and down the voltage of the power supply.

  Hereinafter, the operation of the power supply module M will be described with reference to FIG.

First, when the voltages _{V 1} is supplied normally (Fig. 5, step S1 → S2: Yes), while the MOS switch _{Q 1} in the ON state, the MOS switches _{Q 2} in the OFF state (FIG. 5, step S3). Thereby, the power of the main board 100 is supplied to the SSD 190 via the DC / DC converter 160 (FIG. 5, step S4), and the laminate type energy device 18 is charged by the power of the main board 100 (FIG. 5, Step S5).

On the other hand, when the voltages _{V 1} due to power failure or the like is not supplied (Fig. 5, step S1 → S2: No), as well as the MOS switch _{Q 1} in the OFF state, the MOS switches _{Q 2} in the ON state (FIG. 5, Step S6). Thereby, the laminate type energy device 18 is discharged (FIG. 5, step S7), and power is supplied from the laminate type energy device 18 to the SSD 190 via the DC / DC converter 160 (FIG. 5, step S8).

Thereafter, when the power supply of the main board 100 is restored (Fig. 5, step S1 → S2: Yes), while the MOS switch _{Q 1} in the ON state by sensing the voltage monitoring IC170 that the, the MOS switch _{Q 2} An off state is set (FIG. 5, step S3). Subsequent operations are as described above (FIG. 5, steps S4 → S5).

On the other hand, when the power of the main substrate 100 has not recovered (FIG. 5, step S1 → S2: No), MOS switch _{Q 1} is turned off, MOS switch _{Q 2} is remains on (Fig. 5, step S6) . As a result, power is supplied only for the capacity of the laminate type energy device 18 (FIG. 5, steps S7 → S8).

  While temporary power is supplied from the laminate type energy device 18, the SSD 190 writes data stored in the volatile memory to the nonvolatile memory. As a result, the data stored in the volatile memory can be backed up.

  Here, the power supply module M has a storage capacity corresponding to the storage capacity of the SSD 190. That is, when the SSD 190 is replaced and the storage capacity is changed, the time required for backing up data also changes. Therefore, when the power supply module M is modularized for SSD and the SSD 190 is replaced, the power supply module M is removed from the connector 102 of the main board 100, and the power supply module having a storage capacity corresponding to the storage capacity of the new SSD 190 Replace with M. Such an operation is very easy because it is only necessary to replace the power supply module M of the connector 102.

  As described above, according to the first embodiment, even when the power of the main board 100 is suddenly stopped, a large amount of power is instantaneously supplied from the laminated energy device 18 such as EDLC to the SSD 190. Is supplied. Therefore, stable power supply can be performed as compared with the case where a conventional battery or capacitor is used, and data stored in the SSD 190 can be reliably protected. In addition, since the power supply module M is modularized for SSD, when the storage capacity of the SSD 190 changes, it can be immediately replaced with an appropriate power supply module M, which is very convenient.

(Second Embodiment)
Incidentally, the connector 102 for inserting the connection terminal 110 of the power supply module M may not be prepared on the main board 100. In such a case, as shown in FIG. 6, the power supply module M may be connected to a connector 193 provided on the main body 191 of the SSD 190.

  FIG. 7 is a schematic bird's-eye view structure diagram of the power supply module M according to the second embodiment. As shown in this figure, a thin wiring 112 such as an FPC is connected to the connection terminal 110 of the module substrate 111. The FPC is a module substrate in which an electric circuit is wired on a flexible film having insulating properties. It is flexible and can be bent freely, and can be arranged in three dimensions in a slight gap between components. When the connection portion 113 of such a thin wiring 112 is inserted into the connector 193 of the SSD 190, the power supply module M and the SSD 190 can be electrically connected. Other points are the same as those of the first embodiment.

  As described above, in the second embodiment, the thin wiring is connected to the connection terminal 110 provided on the end surface of the module substrate 111 of the power supply module M, and the thin wiring is connected to the SSD 190. Thereby, even when the connector 102 for inserting the power supply module M is not prepared on the main board 100, the same effect as that of the first embodiment can be obtained.

(Third embodiment)
Hereinafter, only different points of the present embodiment from the first or second embodiment will be described.

  FIG. 8 is a schematic bird's-eye view of the power supply system according to the third embodiment. As shown in this figure, the power supply module M may be attached to a replacement cable 192 a that connects the main board 100 and the SSD 190. The replacement cable 192a is a cable used when replacing an existing hard disk with a component having different performance, such as when replacing an existing hard disk with an SSD. When the connector 194 is provided on such a replacement cable 192a and the power supply module M is connected, the power supply module M and the SSD 190 can be electrically connected. Of course, when the replacement cable 192a is divided into two, the SSD 190 may be connected to one side and the power supply module M may be connected to the other side. Other points are the same as those of the first embodiment.

  As described above, in the second embodiment, the power supply module M is attached to the replacement cable 192a that connects the main board 100 and the SSD 190. Thereby, even when the connector 102 for inserting the power supply module M is not prepared on the main board 100, the same effect as that of the first embodiment can be obtained.

(Fourth embodiment)
Hereinafter, only different points of the present embodiment from the first to third embodiments will be described.

  FIG. 9 is a schematic bird's-eye view of the power supply system according to the fourth embodiment. Here, the power supply module M whose outer surface is covered with an insulating film 60 by powder coating or resin molding is illustrated. The end of the module substrate 111 of the power supply module M is sandwiched between clip pins P1, P2, and P3, and the clip pins P1, P2, and P3 are inserted into the pads P1a, P2a, and P3a provided on the main substrate 100 and soldered. (To be described later).

  In this embodiment, a circuit configuration different from that in FIG. 4 is illustrated. That is, since the voltage monitoring IC 170 is generally expensive, a configuration that does not use the voltage monitoring IC 170 as shown in FIG. 10 may be adopted. In this case, a reset IC 171 that monitors the power supply voltage V and continues to issue a reset signal until it reaches a normal voltage is provided. The SW open / close circuit 172 switches between the power source of the main board 100 and the laminate type energy device 18 by turning on / off the MOS switches Q1, Q2. Reference numerals P1, P2, and P3 in FIG. 10 represent the positions where the clip pins P1, P2, and P3 are joined, respectively. Here, the power supply module M including three clip pins P1, P2, and P3 is illustrated, but the number of clip pins is appropriately changed according to the circuit configuration.

11 (a) shows the waveform of the supply voltage V, FIG. 11 (b) is a waveform of the output voltage _{V r} of the reset IC 171. As shown in this figure, the power supply of the main board 100 is also turned on, while the power supply voltage V does not reach the detection value V _H of the reset IC171 has a reset state. At the time t1 when the detection value _VH is exceeded, the reset state is released, the MOS switch Q1 is turned on, and the MOS switch Q2 is turned off. As a result, power is supplied from the power source of the main board 100 to the SSD 190, and the laminate type energy device 18 is charged by the power source of the main board 100. On the other hand, when the power of the main board 100 is turned off, instantaneously becomes a reset state when the power supply voltage V is below the detection value _{V H} of the reset IC 171, MOS switch _{Q 1} is turned off, the MOS switch _{Q 2} is turned on Become. Thereby, the laminate type energy device 18 is discharged, and power is supplied from the laminate type energy device 18 to the SSD 190. Of course, the characteristics of the reset IC 171 are not limited to this.

FIG. 12 is a schematic block diagram of another power supply module M according to the fourth embodiment. When a lithium ion battery is used as the power source, the voltage is 3.7 V, for example, but an output voltage V _{O of} 5 V is sometimes required. Therefore, as shown in FIG. 12, a DC / DC converter (buck-boost circuit) 160 that steps up and down the power supply voltage V may be provided on one or both of the input side and the output side. In this way, the desired output voltage V _O can be obtained by stepping up and down the power supply voltage V by the DC / DC converter 160.

  As described above, according to the fourth embodiment, the same effect as that of the first embodiment can be obtained with an inexpensive configuration that does not use the voltage monitoring IC 170. Further, since the clip pins P1, P2, and P3 are inserted into the main board 100, the power supply module M is mounted in an upright state with respect to the main board 100, so that the limited board space is effectively used. Can be used.

(Fifth embodiment)
In the present embodiment, a configuration of the laminated energy device 18 and a method of mounting the laminated energy device 18 on the module substrate 111 will be mainly described. The configurations described below can be appropriately employed in the first to fourth embodiments. About another structure, it is the same as that of the said 1st-4th embodiment.

(Laminated energy device)
FIG. 13 is a schematic bird's-eye view structural view of a laminate type energy device 18 according to the fifth embodiment. As shown in this figure, a seal portion 14 is attached to one surface of a laminate sheet that covers the main body of the laminate type energy device 18. As shown in FIG. 14, the seal portion 14 includes an adhesive 13 applied to one surface of the laminate sheet, and a peeled paper 15 that covers the surface of the adhesive 13. As the pressure-sensitive adhesive 13, it is preferable to use an insulating material having good thermal conductivity. The peeled paper 15 is obtained by performing a peeling process on the surface of the paper. A method for attaching the seal portion 14 to the laminate sheet is not particularly limited, but it is easy to peel off the peeled paper on one side of the double-sided tape and attach the one side to the laminate sheet. Here, the case where the seal portion 14 is attached to one surface of the laminate sheet is illustrated, but the seal portion 14 may be attached to both surfaces of the laminate sheet.

(Lamination type energy device mounting method)
Next, a method for mounting the laminate type energy device 18 will be described.

  First, as shown in FIG. 15A, the peeling paper 15 covering the laminate sheet is peeled off. The laminated energy device 18 is fixed to a predetermined mounting position of the module substrate 111 as shown in FIG. 15B in a state where the adhesive 13 is exposed at the part where the peeling paper 15 is peeled off. FIG. 16 shows a schematic plane pattern configuration diagram of the module substrate 111 in this state, and FIG. 17 shows a schematic cross-sectional structure taken along line II of FIG. As shown in these drawings, the leading ends 34t of the lead electrodes 34a and 34b are located in the vicinity of the welding holes 25a and 25b of the solder joint portions 24a and 24b. At this time, the main body of the laminate type energy device 18 is fixed to the module substrate 111 by the adhesive 13, but the long and soft lead electrodes 34a and 34b are not fixed to the module substrate 111 and are in an unstable state. Therefore, as shown in FIG. 18, the extraction electrodes 34a and 34b are pressed to the module substrate 111 side using a heat-resistant rubber 26 and the like, and solder welding (electrically connected) is performed in the welding holes 25a and 25b of the solder joint portions 24a and 24b. )I do. In this way, it is possible to perform solder welding of the extraction electrodes 34a and 34b in a state where both the main body of the laminated energy device 18 and the extraction electrodes 34a and 34b are fixed.

  The extraction electrodes 34 a and 34 b are preferably bent in advance in the height direction of the module substrate 111 (hereinafter referred to as “substrate height direction”). The substrate height direction corresponds to the vertical direction in FIGS. In this way, the tips 34t of the lead electrodes 34a and 34b approach the welding holes 25a and 25b of the solder joints 24a and 24b, so that solder welding can be performed more easily. The degree of bending may be appropriately changed according to the thickness of the laminated energy device 18 and the mounting position, but it is appropriate to set the degree to about several mm to several tens mm.

  Here, the configuration including the two extraction electrodes 34a and 34b is illustrated, but as illustrated in FIG. 19, the three extraction electrodes 34a, 34b, and 34c may be provided. The three-terminal laminated energy device 18 is formed by connecting two two-terminal laminated energy devices 18 in series. 20 and 21 illustrate variations of the arrangement of the three extraction electrodes 34a, 34b, and 34c included in the three-terminal laminated energy device 18. FIG. As shown in these figures, the three extraction electrodes 34 a, 34 b, 34 c can be extracted from any side of the laminated energy device 18. Even in such a three-terminal laminated energy device 18, the laminated sheet is provided with the seal portion 14 in the same manner as in the case of the two-terminal. In the following description, the individual extraction electrodes 34a, 34b, and 34c may be simply referred to as “extraction electrodes 34” without distinction.

  22 and 23 are diagrams for explaining another mounting method of the laminate type energy device 18. First, as shown in FIG. 22, components such as the EDLC charger circuit 150 and the DC / DC converter 160 are mounted on the module substrate 111 and are electrically connected by wire bonding. Further, the welding electrodes 34 a, 34 b, 34 c of the laminate type energy device 18 are pressed at predetermined positions on the module substrate 111 to perform solder welding. Next, as shown in FIG. 23, components such as the EDLC charger circuit 150 and the DC / DC converter 160 are covered with the hard coat 200. The lead-out electrodes 34 a, 34 b, 34 c are folded in a state where the peel-off paper 15 of the laminate type energy device 18 is peeled off, and the surface of the laminate type energy device 18 where the adhesive 13 is exposed is the outer surface of the hard coat 200. Paste to. In this way, not only can the module substrate 111 insulated by the hard coat 200 be provided, but the laminated energy device 18 is fixed on the hard coat 200, so that a limited board space is effectively used. It becomes possible to utilize it.

  24 and 25 are diagrams for explaining another mounting method of the laminate type energy device 18. Except that the lead-out electrodes 34a, 34b, and 34c are further extended to fix the laminated energy device 18 to the back surface of the module substrate 111, this is the same as FIG. 22 and FIG. That is, as shown in FIG. 24, components such as the EDLC charger circuit 150 and the DC / DC converter 160 are mounted on the module substrate 111 and are electrically connected by wire bonding. Further, the welding electrodes 34 a, 34 b, 34 c of the laminate type energy device 18 are pressed at predetermined positions on the module substrate 111 to perform solder welding. Next, as shown in FIG. 25, components such as the EDLC charger circuit 150 and the DC / DC converter 160 are covered with the hard coat 200. The lead-out electrodes 34 a, 34 b, and 34 c are bent with the peel-off paper 15 of the laminate type energy device 18 being peeled off, and the surface of the laminate type energy device 18 where the adhesive 13 is exposed is the back side of the module substrate 111. Paste to. The back surface of the module substrate 111 is a surface opposite to a surface on which components such as the EDLC charger circuit 150 and the DC / DC converter 160 are mounted. In this way, the module substrate 111 insulated by the hard coat 200 can be provided and, of course, the laminated energy device 18 is fixed to the back surface of the module substrate 111, so that the limited substrate space is effectively used. It becomes possible to utilize it.

  Here, the laminate type energy device 18 is bonded to the outer surface of the hard coat 200 or the back surface of the module substrate 111 after soldering the lead electrodes 34a, 34b, and 34c, but the mounting procedure is limited to this. It is not a thing. That is, it is also possible to perform solder welding of the extraction electrodes 34a, 34b, and 34c after the laminate type energy device 18 is bonded to the outer surface of the hard coat 200 or the back surface of the module substrate 111.

  As described above, according to the fifth embodiment, since the laminate type energy device 18 is fixed to the mounting position by the adhesive 13, the laminate type energy device 18 is stably mounted on the module substrate 111. be able to. As a result, the reliability of electrical connection is improved, which is particularly effective when the module substrate 111 is mass-produced by automating the mounting of the laminated energy device 18. Further, when the laminate type energy device 18 is fixed to the outer surface of the hard coat 200 or the back surface of the module substrate 111, the limited substrate space can be effectively utilized.

  FIG. 26 is a diagram for explaining another laminate type energy device 18 according to the fifth embodiment, in which FIG. 26 (a) is a schematic plane pattern configuration diagram, and FIG. 26 (b) is a module substrate. FIG. 11 is a schematic cross-sectional structure diagram when mounted on 111. As shown in this figure, the laminate sheet 40 is subjected to a press process so as to have an outer shape that encloses the module substrate 111. That is, usually, after a laminate sheet is compression-sealed along a predetermined laminate line, an unnecessary laminate sheet is removed by performing a press treatment on a line slightly outside the laminate line. On the other hand, in this embodiment, as shown in FIG. 26 (a), a press process is performed in a state where the laminate sheets 40 are largely left on both the left and right sides of the laminate type energy device 18. In this way, as shown in FIG. 26B, when the laminated energy device 18 is mounted on the module substrate 111, the module substrate 111 is formed by the laminated sheets 40 provided on the left and right sides of the laminated energy device 18. Can be wrapped. Since there are various modes for wrapping the module substrate 111, a detailed description will be given later. It is sufficient that at least the laminate type energy device 18 can be fixed to the module substrate 111. The material of the laminate sheet 40 may be an insulating film or the like, but a material having high adhesiveness to the module substrate 111 is preferable.

  27 and 28 are diagrams for explaining another mounting method of the laminated energy device 18. Reference numerals 210a and 210b in FIG. 27 are wires for connecting various components. As shown in these drawings, in a state where components such as the EDLC charger circuit 150 and the DC / DC converter 160 are covered with the hard coat 200, the laminate type energy device 18 is fixed to the back side of the module substrate 111, and the laminate type energy device is obtained. The module substrate 111 may be wrapped by the laminate sheets 40 provided on the left and right sides of 18.

  As described above, according to the fifth embodiment, since the module substrate 111 can be wrapped by the laminate sheet 40, the laminate type energy device 18 can be stably mounted on the module substrate 111. is there. In addition, when components such as the EDLC charger circuit 150 and the DC / DC converter 160 are encased in the laminate sheet 40, these components can be stably mounted, and unnecessary electrical connection is possible. There is also an advantage of protecting from.

  In addition, although the case where the laminate type energy device 18 is fixed to the module substrate 111 by the adhesive 13 is illustrated here, whether or not the adhesive 13 is used is particularly limited in the present embodiment. is not. That is, even if the module substrate 111 is simply wrapped with the laminate sheet 40, a certain effect can be expected in that the laminate type energy device 18 is fixed to the module substrate 111.

  FIG. 29 is a diagram for explaining a variation of bending of the extraction electrode 34 in the power supply module according to the fifth embodiment. FIG. 29A illustrates the case where the bending process is not performed, and FIG. 29B illustrates the case where the U-shaped bending process 34 s is performed at the substantially central portion of the extraction electrode 34. By applying such a U-shaped bending process 34s, the stress can be absorbed even when the extraction electrode 34 receives some load. FIG. 29 (c) shows a case in which the bending is gently inclined to the left side in the drawing, and FIG. 29 (d) shows a case in which a bending operation 34k that is abruptly inclined to the left in the drawing is applied. Is illustrated. Although it is possible to adjust the height position of the tip 34t of the extraction electrode 34 by either FIG. 29C or FIG. 29D, FIG. 29D is more than FIG. 29C. The leading end 34t of the extraction electrode 34 can be brought closer to the laminated energy device 18 side.

  FIG. 30 is a diagram for explaining another mounting method of the laminate type energy device 18 in the power supply module according to the fifth embodiment. In FIG. 30A, the lead electrode 34 is folded back and the surface of the laminated energy device 18 where the adhesive 13 is exposed is bonded to the outer surface of the hard coat 200. In FIG. 30B, the lead electrode 34 is folded back, and the surface of the laminated energy device 18 where the adhesive 13 is exposed is the surface on which components such as the EDLC charger circuit 150 and the DC / DC converter 160 are mounted. It is pasted on the opposite side. In other words, the extraction electrode 34 covers only the substrate surface opposite to the substrate surface on which the laminated energy device 18 is mounted. Therefore, in this case, the length ΔL1 of the extraction electrode 34 in the substrate height direction is set to be longer than the height ΔT of the module substrate 111.

  FIG. 31 is a diagram for explaining another method for mounting the laminated energy device 18 in the power supply module according to the fifth embodiment. In FIG. 31A, the laminated energy device 18 is fixed to the back side of the module substrate 111, and the laminated sheet 40 provided on the left and right sides of the laminated energy device 18 is mounted on the substrate surface on which the laminated energy device 18 is mounted. Only the opposite substrate surface is covered. Such a configuration is particularly effective when the component denoted by reference numeral 210 is an LED. That is, the module substrate 111 can be wrapped by the laminate sheet 40 without blocking the light from the LED 210. The laminate sheet 40 may cover only the substrate surface, but as shown in FIG. 31 (b), the end of the laminate sheet 40 comes into contact with a specific component 42a or covers a specific component 42a. Also good. Also in this case, the length ΔL2 of the laminate sheet 40 in the substrate height direction is made longer than the height ΔT of the module substrate 111.

  FIG. 32 is a diagram for explaining another mounting method of the laminated energy device 18 in the power supply module according to the fifth embodiment. Here, the laminate type energy device 18 is fixed to the module substrate 111 by both the extraction electrodes 34 a and 34 b and the laminate sheet 40. The end portion of the laminate sheet 40 covers the outer surface of the hard coat 200. As described above, various mounting modes can be appropriately combined.

  FIGS. 33A and 33B are diagrams for explaining another power supply module M according to the fifth embodiment. FIG. 33A is a schematic plane pattern configuration diagram, and FIG. 33B is a schematic side pattern. FIG. The power supply module M supplies power from the laminate type energy device 18 via clip pins P1, P2, and P3 sandwiching the end portion of the module substrate 111. For example, the peripheral circuit 150/160 is mounted on one surface of the module substrate 111, the tip 34t of the extraction electrode 34 of the laminated energy device 18 is connected to one surface, and the extraction electrode 34 is bent into a U-shape. Then, the main body of the laminate type energy device 18 is mounted on the other surface of the module substrate 111.

  A tip 34t of the extraction electrode 34 of the laminate type energy device 18 is welded to the upper end of the surface of the module substrate 111. The length of the extraction electrode 34 can be shortened as compared with the case where the welding is performed by soldering. The lead electrode 34 is bent in a U shape, and the main body of the laminate type energy device 18 is mounted on the back surface of the module substrate 111. At that time, it is desirable that the main body of the laminated energy device 18 and the module substrate 111 are fixed by the adhesive 13.

  A solder joint is provided at the lower end of the module substrate 111, and the solder weld is sandwiched between the clip pins P1, P2, P3 and soldered. The joining positions of the clip pins P1, P2, P3 will be described in detail later. The interval between the clip pins P1, P2, P3 is, for example, 2.54 mm, and the length of the clip pins P1, P2, P3 is, for example, 10 mm.

  The outer surface of such a power supply module M is powder-coated. For example, as shown in FIG. 34, the resin base powder 50 is melted and sprayed onto the power supply module M in the coating apparatus 51, and the sprayed melt is cooled. Thereby, as shown in FIG. 35, the insulating film 60 by which powder coating was carried out on the outer surface of the power supply module M can be formed. In order to avoid the power supply module M from becoming high temperature, the outer surface of the power supply module M may be covered with an insulating film by a room temperature curing resin mold, for example. Various known methods can be employed as a method of powder coating or resin molding.

  FIG. 36 is a schematic bird's-eye view showing a state in which the power supply module M according to the fifth embodiment is mounted on the main board 100. As shown in this figure, the clip pins P1, P2, P3 of the power supply module M are inserted into the pads P1a, P2a, P3a provided on the main board 100 and soldered. Thereby, the clip pins P1, P2, and P3 are electrically connected to the circuit pattern of the main board 100. As a result, power can be supplied from the laminate type energy device 18 to the SSD 190 via the clip pins P1, P2, P3.

  As described above, according to the fifth embodiment, since the laminate type energy device 18 and its peripheral circuit are integrally mounted on the module substrate 111, a compact and easy-to-use power supply module M is provided. It is possible.

  As described above, it is possible to provide the power supply module M that supplies temporary power to the SSD 190 in an emergency using the laminated energy device 18. By making the laminate type energy device 18 as an add-on module in this way, the degree of freedom of capacity and shape is increased, so that the layout efficiency can be increased. Since such a power supply module uses a laminated energy device 18 such as EDLC, the power supply module has a good response and is suitable for measures against instantaneous power failure.

  In the above description, EDLC is exemplified as the laminate type energy device 18, but a lithium ion capacitor, a lithium ion battery, or the like may be adopted as the laminate type energy device 18. Hereinafter, the basic structure of each internal electrode will be described.

(EDLC internal electrode)
FIG. 37 illustrates a basic structure of an EDLC internal electrode as the laminated energy device 18 in the power supply module according to the fifth embodiment. The EDLC internal electrode is configured such that the separator 30 through which only the electrolytic solution and ions pass is interposed in at least one layer of the active material electrodes 10 and 12, and the extraction electrodes 34 a and 34 b are exposed from the active material electrodes 10 and 12. The extraction electrodes 34a and 34b are connected to the power supply voltage. The extraction electrodes 34a and 34b are made of, for example, aluminum foil, and the active material electrodes 10 and 12 are made of, for example, activated carbon. The separator 30 is larger than the active material electrodes 10 and 12 (having a large area) so as to cover the entire active material electrodes 10 and 12. The separator 30 does not depend on the type of energy device in principle, but heat resistance is required particularly when reflow treatment is required. When heat resistance is not required, polypropylene or the like can be used, and when heat resistance is required, a cellulosic material can be used. The EDLC internal electrode is impregnated with the electrolytic solution 44, and the electrolytic solution and ions move through the separator 30 during charging and discharging.

(Lithium ion capacitor internal electrode)
FIG. 38 illustrates a basic structure of a lithium ion capacitor internal electrode as the laminated energy device 18 in the power supply module according to the fifth embodiment. In the lithium ion capacitor internal electrode, a separator 30 through which only the electrolyte and ions pass is interposed between at least one layer of the active material electrodes 11 and 12 so that the extraction electrodes 34 a and 34 b 1 are exposed from the active material electrodes 10 and 12. The extraction electrodes 34a and 34b1 are connected to the power supply voltage. The active material electrode 12 on the positive electrode side is made of, for example, activated carbon, and the active material electrode 11 on the negative electrode side is made of, for example, Li-doped carbon. The lead electrode 34a on the positive electrode side is made of, for example, an aluminum foil, and the lead electrode 34b1 on the negative electrode side is made of, for example, a copper foil. The separator 30 is larger than the active material electrodes 11 and 12 (having a large area) so as to cover the entire active material electrodes 11 and 12. The lithium ion capacitor internal electrode is impregnated with the electrolytic solution 44, and the electrolytic solution and ions move through the separator 30 during charging and discharging.

(Lithium ion battery internal electrode)
FIG. 39 illustrates a basic structure of a lithium ion battery internal electrode as the laminate type energy device 18 in the power supply module according to the fifth embodiment. In the lithium ion battery internal electrode according to the fifth embodiment, the separator 30 through which only the electrolyte and ions pass is interposed in at least one layer of the active material electrodes 11 and 12a, and the extraction electrodes 34a and 34b1 are the active material electrodes. 11 and 12a, the lead electrodes 34a and 34b1 are connected to a power supply voltage. The active material electrode 12a on the positive electrode side is made of, for example, LiCoO _2, and the active material electrode 11 on the negative electrode side is made of, for example, Li-doped carbon. The lead electrode 34a on the positive electrode side is made of, for example, an aluminum foil, and the lead electrode 34b1 on the negative electrode side is made of, for example, a copper foil. The separator 30 is larger than the active material electrodes 11 and 12a (having a large area) so as to cover the entire active material electrodes 11 and 12a. The lithium ion battery internal electrode is impregnated with the electrolytic solution 44, and the electrolytic solution and ions move through the separator 30 during charging and discharging.

  As described above, according to the present invention, it is possible to provide a power supply system and a power supply module that can perform stable power supply.

[Other embodiments]
As described above, the present invention has been described with reference to the first to fifth embodiments. However, it should be understood that the descriptions and drawings constituting a part of this disclosure are exemplary and limit the present invention. should not do. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

  As described above, the present invention includes various embodiments not described herein. For example, power is supplied to the SSD 190, but it is also possible to supply power to a device other than the SSD 190 such as a hard disk.

  The power supply system and the power supply module according to the present invention are useful for various systems that need countermeasures against momentary power interruption, and in particular, are applied to a system including a storage device that needs to protect data in a volatile memory. Is effective.

18 ... Laminate type energy device 30 ... Separator 34a, 34b, 34c ... Lead electrode 40, 180 ... Laminate sheet 100 ... Main board 102 ... Main board connector 110 ... Connection terminal 111 ... Module board 112 ... Thin wiring 150 ... EDLC charger circuit 170 ... Voltage monitoring IC (monitoring circuit, switching circuit)
171 ... Reset IC (monitoring circuit)
172 ... SW open / close circuit (switching circuit)
190 ... SSD (storage device, supply target device)
192a ... Replacement cable M ... Power supply modules P1, P2, P3 ... Clip pins

Claims (18)

A main board,
A supply target device to which power is supplied from the main board;
While interposing a separator that allows electrolyte and ions to pass through the active material electrode portion of the electrode in which the positive and negative electrode active material electrodes and the positive and negative electrode lead electrodes are integrally formed, the lead electrode is exposed. A laminate type energy device in which a laminate of two or more layers in which the positive electrode and the negative electrode of the active material electrode are alternately laminated is sealed with a laminate sheet is mounted on the module substrate integrally with the peripheral circuit. A power supply module and
When the power of the main board is normally supplied, power is supplied from the power of the main board to the supply target device, and the laminate type energy device is charged by the power of the main board. When the power is not normally supplied, the laminate type energy device is discharged, and the power is supplied from the laminate type energy device to the supply target device. The supply target device is a storage device including a volatile memory,
The power supply system according to claim 1, wherein the power supply module supplies power necessary for backup of data stored in the volatile memory.   The power supply system according to claim 2, wherein the power supply module includes a storage capacity corresponding to a storage capacity of the storage device.   The power supply system according to claim 1, wherein a connection terminal provided on an end surface of the module board of the power module is inserted into a connector of the main board.   The power supply system according to claim 1, wherein a thin wiring is connected to a connection terminal provided on an end surface of the module substrate of the power supply module, and the thin wiring is connected to the supply target device.   The power supply system according to claim 1, wherein the power supply module is attached to a replacement cable that connects the main board and the supply target device.   The power supply system according to claim 1, wherein a clip pin sandwiching an end portion of the module substrate of the power supply module is inserted into the main substrate.   The power supply system according to claim 1, wherein the laminated energy device includes two terminals.   The power supply system according to claim 1, wherein the laminated energy device includes three terminals.   The power supply system according to claim 1, wherein the laminated energy device is an electric double layer capacitor.   The power supply system according to claim 1, wherein the laminated energy device is a lithium ion capacitor.   The power supply system according to claim 1, wherein the laminate type energy device is a lithium ion battery. While interposing a separator that allows electrolyte and ions to pass through the active material electrode portion of the electrode in which the positive and negative electrode active material electrodes and the positive and negative electrode lead electrodes are integrally formed, the lead electrode is exposed. And a laminated energy device in which a laminate of two or more layers laminated such that the positive electrode and the negative electrode of the active material electrode are alternated is sealed with a laminate sheet;
A peripheral circuit of the laminated energy device;
A module substrate on which the laminated energy device and the peripheral circuit are mounted;
When the power of the main board is normally supplied, power is supplied to the supply target device from the power of the main board, and the laminate type energy device is charged by the power of the main board, and the power of the main board is A power supply module that discharges the laminated energy device and supplies power to the supply target device from the laminated energy device when it is not normally supplied.   The peripheral circuit includes a charger circuit that charges the laminated energy device, a monitoring circuit that monitors the voltage of the power source of the main board, and a switching circuit that switches between the power source of the main board and the laminated energy device. The power supply module according to claim 13.   The power supply module according to claim 13, wherein a connection terminal provided on an end surface of the module board is inserted into a connector of the main board.   The power supply module according to claim 13, wherein a thin wiring is connected to a connection terminal provided on an end surface of the module substrate, and the thin wiring is connected to the supply target device.   The power supply module according to claim 13, wherein the power supply module is attached to a replacement cable that connects the main board and the supply target device.   The power supply module according to claim 13, wherein a clip pin sandwiching an end of the module substrate is inserted into the main substrate.

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