JP2013122938A - Laminate type energy device, laminate type energy device mounting method, and power supply module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminate type energy device, a laminate type energy device mounting method, and a power supply module which can be mounted in place stably on a module substrate.SOLUTION: A laminate type energy device comprises: a laminate which is laminated in two or more layers via a separator 30 capable of transmitting ions of the electrolyte on the active material electrodes 10 and 12 portions of an electrode consisting of cathode and anode active material electrodes 10 and 12 and cathode and anode extraction electrodes 34a and 34b which are formed as an integral body in such a way that the extraction electrodes 34a and 34b are exposed and that the cathode and the anode of the active material electrodes 10 and 12 alternate with each other; a laminate sheet 40 which seals the laminate; adhesive 13 which is coated on faces on both sides or a face on one side of the laminate sheet 40; and release paper 15 covering the surface of the adhesive 13.

Description

  The present invention relates to a laminate type energy device, a laminate type energy device mounting method, a laminate type energy device mounting structure, and a power supply module.

  Conventionally, as a laminate type energy device, an electric double layer capacitor (EDLC), a lithium ion capacitor, a lithium ion battery, and the like are known (see Patent Documents 1 to 3). For example, as shown in FIG. 35A, a pair of positive and negative lead electrodes 34 a and 34 b are drawn from the laminate type energy device 18. When such a laminated energy device 18 is mounted on the module substrate 100, as shown in FIG. 35B, the lead electrodes 34a and 34b are pressed to the module substrate 100 side at a predetermined mounting position, and the solder joint portion 24a. 24b, solder welding is performed in the welding holes 25a and 25b.

JP 2000-12407 A JP 2001-338848 A JP 2003-217646 A

  However, unlike a package such as a ceramic package, the laminate type has a large shape and the lead electrodes 34a and 34b are long and soft. Therefore, when soldering, there is a problem that it is difficult to hold the extraction electrodes 34a and 34b, and the mounting becomes unstable.

  An object of the present invention is to provide a laminate type energy device, a laminate type energy device mounting method, and a power supply module that can be stably mounted on a module substrate.

  According to one aspect of the present invention, while interposing a separator through which ions of the electrolytic solution can pass through the active material electrode portion of the electrode in which the positive and negative electrode active material electrodes and the positive and negative electrode lead electrodes are integrally formed, A laminate in which two or more layers are laminated so that the lead electrode is exposed and the positive electrode and the negative electrode of the active material electrode are alternately laminated, and a laminate sheet for sealing the laminate, There is provided a laminate type energy device comprising an adhesive applied to both or one side of the laminate sheet, and a paper strip covering the surface of the adhesive.

  According to another aspect of the present invention, a separator capable of allowing electrolyte ions to pass through the active material electrode portion of an electrode in which positive and negative active material electrodes and positive and negative electrode lead electrodes are integrally formed is interposed. And a laminate having two or more layers so that the extraction electrode is exposed and the positive electrode and the negative electrode of the active material electrode are alternately laminated, and a laminate sheet for sealing the laminate And laminating type energy device mounting when mounting the laminating type energy device on the substrate, the adhesive applied to both surfaces or one surface of the laminating sheet, and the paper that covers the surface of the adhesive In the method, the step of peeling off the peeling paper covering both sides or one side of the laminate sheet, and the adhesive is exposed at the part where the peeling paper is peeled off And fixing the laminate type energy device in a fixed mounting position, laminate type energy device mounting method and a step of electrically connecting to hold the lead electrode on the substrate side is provided.

  According to one aspect of the present invention, the power supply module includes a laminate type energy device and a peripheral circuit of the laminate type energy device, and the laminate type energy device is mounted on a substrate integrally with the peripheral circuit. Is provided.

  According to the present invention, it is possible to provide a laminate type energy device, a laminate type energy device mounting method, and a power supply module that can be stably mounted on a module substrate.

The typical bird's-eye view structure figure of the module board which mounted the lamination type energy device concerning a 1st embodiment. The typical bird's-eye view structure figure of the lamination type energy device which concerns on 1st Embodiment. The typical cross-section figure of the seal | sticker part which concerns on 1st Embodiment. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure for demonstrating the mounting method of the lamination type energy device which concerns on 1st Embodiment, Comprising: (a) Typical sectional structure figure which shows the state before peeling paper is removed, (b) The typical cross-section figure which shows the state after peeling paper is peeled off. The typical plane pattern block diagram of the module board which mounted the lamination type energy device which concerns on 1st Embodiment. The typical cross-section figure of the module board which mounted the lamination type energy device concerning a 1st embodiment. The typical cross-section figure of the module board which mounted the lamination type energy device concerning a 1st embodiment. The typical plane pattern block diagram of the laminate type energy device of 3 terminals which concerns on 1st Embodiment. The typical plane pattern block diagram which illustrates the variation of the lamination type energy device of 3 terminals which concerns on 1st Embodiment. The typical plane pattern block diagram which illustrates the variation of the lamination type energy device of 3 terminals which concerns on 1st Embodiment. The typical bird's-eye view structure figure for demonstrating the other mounting method of the lamination type energy device which concerns on 1st Embodiment. The typical cross-section figure for demonstrating the other mounting method of the lamination type energy device which concerns on 1st Embodiment. The typical bird's-eye view structure figure for demonstrating the other mounting method of the lamination type energy device which concerns on 1st Embodiment. The typical cross-section figure for demonstrating the other mounting method of the lamination type energy device which concerns on 1st Embodiment. It is a figure for demonstrating the laminate type energy device which concerns on 2nd Embodiment, Comprising: (a) Typical plane pattern block diagram, (b) Typical sectional structure view at the time of mounting | wearing with a module board | substrate. The typical cross-section figure for demonstrating the other mounting method of the lamination type energy device which concerns on 2nd Embodiment. The typical cross-section figure for demonstrating the other mounting method of the lamination type energy device which concerns on 2nd Embodiment. It is a figure for demonstrating the battery assist power supply module which concerns on 3rd Embodiment, (a) Typical plane pattern block diagram, (b) II-II typical sectional structure drawing of Fig.18 (a). The typical block block diagram of the battery assist power supply module which concerns on 3rd Embodiment. In the battery assist power supply module according to the third embodiment, it is a diagram for explaining variations of the bending process of the extraction electrode, (a) a schematic cross-sectional structure diagram when the bending process is not performed, (b) ) Schematic cross-sectional structure diagram when bending is performed, (c) Schematic cross-sectional structure diagram when mounting is not performed, (d) On mounting substrate when bending is performed FIG. In the battery assist power supply module which concerns on 3rd Embodiment, it is a figure for demonstrating the other mounting method of EDLC, Comprising: (a) Typical plane pattern block diagram, (b) Bottom view, (c) Right side Plan view. In the battery assist power supply module which concerns on 3rd Embodiment, it is a typical cross-section figure for demonstrating the other mounting method of EDLC, (a) The extraction electrode 34 is turned up and the adhesive of EDLC is exposed Example of structure in which the surface is bonded to the outer surface of the hard coat, (b) The lead electrode is folded back, and the surface where the EDLC adhesive is exposed is equipped with components such as an EDLC charger circuit and a DC / DC converter An example of a structure that is bonded to the opposite side of the surface. In the battery assist power supply module which concerns on 3rd Embodiment, it is typical sectional structure drawing for demonstrating the other mounting method of EDLC, Comprising: (a) EDLC is fixed to the back side of a module board, An example of a structure in which the laminate sheet provided on both sides covers only the substrate surface opposite to the substrate surface on which the EDLC is mounted, (b) the end of the laminate sheet is in contact with a specific component, An example of a structure that covers parts. The typical cross-section figure for demonstrating the other mounting method of EDLC in the battery assist power supply module which concerns on 3rd Embodiment. The typical plane pattern block diagram which illustrates the basic structure of an EDLC internal electrode in the battery assist power supply module which concerns on 3rd Embodiment. FIG. 9 is a schematic planar pattern configuration diagram illustrating a basic structure of a lithium ion capacitor internal electrode in a battery-assisted power supply module according to a third embodiment. The typical plane pattern block diagram which illustrates the basic structure of a lithium ion battery internal electrode in the battery assist power supply module which concerns on 3rd Embodiment. It is a figure for demonstrating the battery assist power supply module which concerns on 4th Embodiment, (a) Typical plane pattern block diagram, (b) Typical side surface pattern structure figure. The typical top view which shows a mode that powder coating the battery assist power supply module which concerns on 4th Embodiment. It is a figure for demonstrating the battery assist power supply module after the powder coating which concerns on 4th Embodiment, (a) Typical plane pattern block diagram, (b) Typical side surface pattern structure figure. The typical bird's-eye view structure figure which shows a mode that the battery assist power supply module which concerns on 4th Embodiment is mounted in a main board | substrate. The typical block block diagram of the battery assist power supply module which concerns on 4th Embodiment. It is a timing chart which shows operation | movement of the battery assist power supply module which concerns on 4th Embodiment, (a) Power supply voltage waveform, (b) Output voltage waveform of reset IC. The typical block block diagram of the other battery assist power supply module which concerns on 4th Embodiment. It is a figure for demonstrating the conventional lamination type energy device, Comprising: (a) Typical bird's-eye view structure figure, (b) Typical bird's-eye view structure figure which shows the state mounted in the module board | substrate.

  Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the relationship between the thickness of each component and the planar dimensions, the ratio of the thickness of each layer, and the like are different from the actual ones. Therefore, specific thicknesses and dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

  Further, the embodiments described below exemplify apparatuses and methods for embodying the technical idea of the present invention, and the embodiments of the present invention include the material, shape, and structure of each component. The arrangement is not specified below. Various modifications can be made to the embodiment of the present invention within the scope of the claims.

[First Embodiment]
(Basic structure of laminated energy device)
As shown in FIG. 1, the laminated energy device 18 according to the first embodiment is assumed to be used as a basic module and mounted on a printed circuit board (module board) 100, for example. In general, in addition to the laminated energy device 18, many IC chips 160 and 170, a transformer 120, and other device components 140 are mounted on the module substrate 100.

  The laminate type energy device 18 according to the first embodiment is provided in the active material electrodes 10 and 12 of an electrode in which positive and negative active material electrodes 10 and 12 and positive and negative lead electrodes 34a and 34b are integrally formed. 2 so that the extraction electrodes 34a and 34b are exposed while interposing the separator 30 through which only ions of the electrolytic solution 44 pass, and the positive and negative electrodes of the active material electrodes 10 and 12 are alternately stacked. A laminate in which more than one layer is laminated, a laminate sheet 40 that seals the laminate, an adhesive 13 that is applied to both or one side of the laminate sheet 40, and a paper that covers the surface of the adhesive 13 15.

  The lead electrodes 34 a and 34 b may be bent in the height direction of the module substrate 100 when the laminated energy device 18 is mounted on the module substrate 100.

  Further, the laminate sheet 40 may be subjected to a press process so as to have an outer shape that wraps the module substrate 100 when the laminate type energy device 18 is mounted on the module substrate 100.

  Further, the extraction electrodes 34a, 34b or the laminate sheet 40 may cover only the module substrate surface opposite to the module substrate surface on which the laminate type energy device 18 is mounted.

  Further, the length in the height direction of the module substrate 100 of the extraction electrodes 34 a and 34 b or the laminate sheet 40 may be longer than the height of the module substrate 100.

  The laminate-type energy device 18 has an active material electrode portion of an electrode in which positive and negative electrode active material electrodes and positive and negative electrode lead electrodes 34a and 34b are integrally formed, with a separator through which electrolyte ions can pass, It has a structure in which two or more layers are laminated so that the extraction electrodes 34a and 34b are exposed and the positive electrode and the negative electrode of the active material electrode are alternately laminated. The laminate is impregnated with an electrolytic solution, and a laminate sheet is stacked and compressed and sealed from the front and rear surfaces of the laminate. The basic structure of the internal electrode of the laminate sheet will be described in detail later.

  FIG. 2 is a schematic bird's-eye view structural view of the laminate type energy device 18 according to the first embodiment. As shown in this figure, a seal portion 14 is attached to one surface of a laminate sheet that covers the main body of the laminate type energy device 18. As shown in FIG. 3, the seal portion 14 is composed of an adhesive 13 applied to one surface of the laminate sheet, and a peeled paper 15 that covers the surface of the adhesive 13. As the pressure-sensitive adhesive 13, it is preferable to use an insulating material having good thermal conductivity. The peeled paper 15 is obtained by performing a peeling process on the surface of the paper. A method for attaching the seal portion 14 to the laminate sheet is not particularly limited, but it is easy to peel off the peeled paper on one side of the double-sided tape and attach the one side to the laminate sheet. Here, the case where the seal portion 14 is attached to one surface of the laminate sheet is illustrated, but the seal portion 14 may be attached to both surfaces of the laminate sheet.

(Lamination type energy device mounting method)
Next, a method for mounting the laminated energy device 18 according to the first embodiment on the module substrate 100 will be described.

  The laminate type energy device mounting method according to the first embodiment is a laminate type energy device mounting method when mounting the above-described laminate type energy device 18 on the module substrate 100, and includes both surfaces of the laminate sheet 40 or Laminating type energy device 18 is fixed at a predetermined mounting position in a state in which adhesive paper 13 is exposed at a portion where peeling paper 15 is peeled off, and a step of removing peeling paper 15 covering one surface A process and a process of electrically connecting the extraction electrodes 34a and 34b to the module substrate 100 side.

  The laminate type energy device according to the first embodiment includes a laminate type energy device mounting structure mounted on the module substrate 100 using the above-described laminate type energy device mounting method.

  First, as shown in FIG. 4A, the peeling paper 15 covering the laminate sheet is peeled off. The laminated energy device 18 is fixed to a predetermined mounting position of the module substrate 100 as shown in FIG. 4B in a state where the adhesive 13 is exposed at the part where the peeled paper 15 is peeled off. FIG. 5 shows a schematic plane pattern configuration diagram of the module substrate 100 in this state, and FIG. 6 shows a schematic cross-sectional structure taken along line II of FIG. As shown in these drawings, the leading ends 34t of the lead electrodes 34a and 34b are located in the vicinity of the welding holes 25a and 25b of the solder joint portions 24a and 24b. At this time, the main body of the laminate type energy device 18 is fixed to the module substrate 100 by the adhesive 13, but the long and soft lead electrodes 34a and 34b are not fixed to the module substrate 100 and are in an unstable state. Therefore, as shown in FIG. 7, the extraction electrodes 34a and 34b are pressed to the module substrate 100 side using a heat-resistant rubber 26 or the like, and solder welding (electrically connected) is performed at the welding holes 25a and 25b of the solder joint portions 24a and 24b. )I do. In this way, it is possible to perform solder welding of the extraction electrodes 34a and 34b in a state where both the main body of the laminated energy device 18 and the extraction electrodes 34a and 34b are fixed.

  The extraction electrodes 34 a and 34 b are preferably bent in advance in the height direction of the module substrate 100 (hereinafter referred to as “substrate height direction”). The substrate height direction corresponds to the vertical direction in FIGS. In this way, the tips 34t of the lead electrodes 34a and 34b approach the welding holes 25a and 25b of the solder joints 24a and 24b, so that solder welding can be performed more easily. The degree of bending may be appropriately changed according to the thickness of the laminated energy device 18 and the mounting position, but it is appropriate to set the degree to about several mm to several tens mm.

  Here, the configuration including the two extraction electrodes 34a and 34b is illustrated, but as illustrated in FIG. 8, three extraction electrodes 34a, 34b, and 34c may be provided. The three-terminal laminated energy device 18 is formed by connecting two two-terminal laminated energy devices 18 in series. 9 and 10 illustrate variations in the arrangement of the three extraction electrodes 34a, 34b, and 34c included in the three-terminal laminated energy device 18. FIG. As shown in these figures, the three extraction electrodes 34 a, 34 b, 34 c can be extracted from any side of the laminated energy device 18. Even in such a three-terminal laminated energy device 18, the laminated sheet is provided with the seal portion 14 in the same manner as in the case of the two-terminal. In the following description, the individual extraction electrodes 34a, 34b, and 34c may be simply referred to as “extraction electrodes 34” without distinction.

  11 and 12 are diagrams for explaining another method for mounting the laminated energy device 18. First, as shown in FIG. 11, components such as IC chips 160 and 170 and a transformer 120 are mounted on a bare chip on the module substrate 100 and are electrically connected by wire bonding. Further, the welding electrodes 34a, 34b, 34c of the laminate type energy device 18 are pressed at a predetermined position of the bare chip to perform solder welding. Next, as shown in FIG. 12, components such as the IC chips 160 and 170 and the transformer 120 are covered with the hard coat 200. The lead-out electrodes 34 a, 34 b, 34 c are folded in a state where the peel-off paper 15 of the laminate type energy device 18 is peeled off, and the surface of the laminate type energy device 18 where the adhesive 13 is exposed is the outer surface of the hard coat 200. Paste to. In this way, not only can the module substrate 100 insulated by the hard coat 200 be provided, but the laminated energy device 18 is fixed on the hard coat 200, so that a limited board space is effectively used. It becomes possible to utilize it.

  13 and 14 are diagrams for explaining another mounting method of the laminated energy device 18. 11 and 12 except that the lead-out electrodes 34a, 34b, 34c are further extended to fix the laminated energy device 18 to the back surface of the module substrate 100. That is, as shown in FIG. 13, components such as IC chips 160 and 170 and a transformer 120 are mounted on a bare chip on the module substrate 100 and are electrically connected by wire bonding. Further, the welding electrodes 34a, 34b, 34c of the laminate type energy device 18 are pressed at a predetermined position of the bare chip to perform solder welding. Next, as shown in FIG. 14, components such as the IC chips 160 and 170 and the transformer 120 are covered with the hard coat 200. The lead-out electrodes 34a, 34b, and 34c are bent with the peel-off paper 15 of the laminated energy device 18 peeled off, and the surface of the laminated energy device 18 where the adhesive 13 is exposed is the back surface of the module substrate 100. Paste to. The back surface of the module substrate 100 is a surface opposite to the surface on which components such as the IC chips 160 and 170 and the transformer 120 are mounted. In this way, not only can the module substrate 100 insulated by the hard coat 200 be provided, but also the laminated energy device 18 is fixed to the back surface of the module substrate 100, so that a limited substrate space is effectively used. It becomes possible to utilize it.

  Here, the laminate type energy device 18 is bonded to the outer surface of the hard coat 200 or the back surface of the module substrate 100 after soldering the lead electrodes 34a, 34b, and 34c, but the mounting procedure is limited to this. It is not a thing. That is, after the laminate type energy device 18 is bonded to the outer surface of the hard coat 200 or the back surface of the module substrate 100, the lead electrodes 34a, 34b, and 34c can be solder-welded.

  As described above, according to the first embodiment, since the laminate type energy device 18 is fixed to the mounting position by the adhesive 13, the laminate type energy device 18 is stably mounted on the module substrate 100. be able to. As a result, the reliability of electrical connection is improved, and this is particularly effective when the module substrate 100 is mass-produced by automating the mounting of the laminated energy device 18. Further, when the laminate type energy device 18 is fixed to the outer surface of the hard coat 200 or the back surface of the module substrate 100, the limited substrate space can be effectively utilized.

[Second Embodiment]
Hereinafter, only differences between the second embodiment and the first embodiment will be described.

  FIGS. 15A and 15B are diagrams for explaining a laminated energy device 18 according to the second embodiment. FIG. 15A is a schematic plane pattern configuration diagram, and FIG. It is a typical section structure figure at the time of wearing. As shown in this figure, the laminate sheet 40 is subjected to a press process so as to have an outer shape that encloses the module substrate 100. That is, usually, after a laminate sheet is compression-sealed along a predetermined laminate line, an unnecessary laminate sheet is removed by performing a press treatment on a line slightly outside the laminate line. On the other hand, in the present embodiment, as shown in FIG. 15A, the press processing is performed in a state where the laminate sheets 40 are largely left on both the left and right sides of the laminate type energy device 18. In this way, as shown in FIG. 15B, when the laminated energy device 18 is mounted on the module substrate 100, the module substrate 100 is provided by the laminated sheets 40 provided on the left and right sides of the laminated energy device 18. Can be wrapped. Since there are various modes for wrapping the module substrate 100, a detailed description will be given later. It is sufficient that at least the laminate type energy device 18 can be fixed to the module substrate 100. The material of the laminate sheet 40 may be an insulating film or the like, but a material having high adhesion to the module substrate 100 is preferable.

  16 and 17 are diagrams for explaining another method for mounting the laminated energy device 18. Reference numerals 210a and 210b in FIG. 16 are wires for connecting various components. As shown in these drawings, in a state where components such as the IC chips 160 and 170 and the transformer 120 are covered with the hard coat 200, the laminate type energy device 18 is fixed to the back side of the module substrate 100, and the laminate type energy device 18 The module substrate 100 may be wrapped by the laminate sheets 40 provided on the left and right sides.

  As described above, according to the second embodiment, since the module substrate 100 can be wrapped by the laminate sheet 40, the laminate type energy device 18 can be stably mounted on the module substrate 100. is there. In addition, when components such as the IC chips 160 and 170 and the transformer 120 are encased in the laminate sheet 40, these components can be stably mounted and are protected from unnecessary electrical connection. There is also an advantage of doing.

  In addition, although the case where the laminate type energy device 18 is fixed to the module substrate 100 by the adhesive 13 is illustrated here, whether or not the adhesive 13 is used is particularly limited in the present embodiment. is not. That is, even if the module substrate 100 is simply wrapped with the laminate sheet 40, a certain effect can be expected in that the laminate type energy device 18 is fixed to the module substrate 100.

[Third Embodiment]
Hereinafter, only differences between the third embodiment and the first or second embodiment will be described.

  18A and 18B are diagrams for explaining a battery-assisted power supply module according to the third embodiment. FIG. 18A is a schematic plane pattern configuration diagram, and FIG. 18B is a diagram in FIG. It is typical sectional structure drawing which follows the II-II line. Here, an EDLC will be described as an example of the laminated energy device 18.

  A power supply module according to the third embodiment includes the laminated energy device 18 described above, an EDLC charger circuit 150, a voltage monitoring IC 170, and a DC / DC converter 160. Here, the laminated energy device 18 is mounted on the module substrate 100 integrally with the EDLC charger circuit 150, the voltage monitoring IC 170, and the DC / DC converter 160.

  Furthermore, the power supply module according to the third embodiment may include a connection unit 110 for add-on connection to the main board.

  The battery assist power supply module is a power supply module that assists the battery and supplies a minimum power to the main board in an emergency to protect the device. Specifically, as shown in FIG. 18, the laminated energy device 18 is mounted on the module substrate 100 integrally with the EDLC charger circuit 150, the voltage monitoring IC 170, and the DC / DC converter (or switching regulator) 160. The method of mounting the laminated energy device 18 on the module substrate 100 is the same as that in the first or second embodiment unless otherwise specified. That is, in FIG. 18B, the surface of the laminated energy device 18 where the adhesive 13 is exposed is bonded to the outer surface of the hard coat 200, but other mounting methods may be employed. The module substrate 100 includes a connector (connection portion) 110 for add-on connection to the main substrate. The connector 110 is directly connected to the connector on the main board or connected to the main board through a cable or the like.

FIG. 19 is a schematic block diagram of a battery-assisted power supply module according to the third embodiment. Here, the SSD 190 is illustrated as the main board (load). The EDLC charger circuit 150 is a circuit for charging the laminated energy device 18 with a DC power source. The voltage monitoring IC 170 monitors the voltage of the DC power supply, and when a power supply abnormality is detected, switches the switch from the DC power supply to the laminate type energy device 18. Specifically, when the voltages _{V 1} is supplied normally, with the MOS switch _{Q 1} in the ON state, the MOS switches _{Q 2} off. Accordingly, power is supplied from the DC power source to the SSD 190 via the DC / DC converter 160, and the laminate type energy device 18 is charged by the DC power source. On the other hand, if the power failure or the like is voltages V ₁ is not supplied due with the MOS switch Q ₁ in the OFF state, the MOS switches Q ₂ to the ON state. As a result, the laminate type energy device 18 is discharged, and power is supplied from the laminate type energy device 18 to the SSD 190 via the DC / DC converter 160.

  FIG. 20 is a diagram for explaining a variation of bending of the extraction electrode 34 in the power supply module according to the third embodiment. FIG. 20A illustrates a case where bending is not performed, and FIG. 20B illustrates a case where a bent-shaped bending process 34 s is performed at a substantially central portion of the extraction electrode 34. By applying such a U-shaped bending process 34s, the stress can be absorbed even when the extraction electrode 34 receives some load. FIG. 20 (c) shows a case in which the bending is gently inclined to the left side in the drawing, and FIG. 20 (d) shows a case in which a bending operation 34k that is inclined sharply to the left in the drawing is applied. Is illustrated. Although it is possible to adjust the height position of the tip 34t of the extraction electrode 34 by either FIG. 20C or FIG. 20D, FIG. 20D is more than FIG. 20C. The leading end 34t of the extraction electrode 34 can be brought closer to the laminated energy device 18 side.

  FIG. 21 is a diagram for explaining another mounting method of the laminated energy device 18 in the power supply module according to the third embodiment, and FIG. 21A is a schematic plan pattern configuration diagram, FIG. 21 (b) is a bottom view and FIG. 21 (c) is a right side view. As shown in this figure, the laminate type energy device 18 is fixed to the back side of the module substrate 100, and the laminate sheet 180 provided on the left and right sides of the laminate type energy device 18 is used for the EDLC charger circuit 150, voltage monitoring IC 170, DC / DC. The converter 160 may be wrapped.

  FIG. 22 is a diagram for explaining another method for mounting the laminated energy device 18 in the power supply module according to the third embodiment. In FIG. 22A, the lead electrode 34 is folded back and the surface of the laminated energy device 18 where the adhesive 13 is exposed is bonded to the outer surface of the hard coat 200. In FIG. 22B, the lead electrode 34 is folded back, and the surface of the laminated energy device 18 where the adhesive 13 is exposed is the surface on which components such as the EDLC charger circuit 150 and the DC / DC converter 160 are mounted. It is pasted on the opposite side. In other words, the extraction electrode 34 covers only the substrate surface opposite to the substrate surface on which the laminated energy device 18 is mounted. Therefore, in this case, the length ΔL1 of the extraction electrode 34 in the substrate height direction is set to be longer than the height ΔT of the module substrate 100.

  FIG. 23 is a diagram for explaining another mounting method of the laminated energy device 18 in the power supply module according to the third embodiment. In FIG. 23A, the laminated energy device 18 is fixed to the back side of the module substrate 100, and the laminated sheet 40 provided on the left and right sides of the laminated energy device 18 is mounted on the substrate surface on which the laminated energy device 18 is mounted. Only the opposite substrate surface is covered. Such a configuration is particularly effective when the component denoted by reference numeral 210 is an LED. That is, the module substrate 100 can be wrapped by the laminate sheet 40 without blocking the light from the LED 210. The laminate sheet 40 may cover only the substrate surface, but as shown in FIG. 23 (b), the end of the laminate sheet 40 comes into contact with the specific component 42a or covers the specific component 42a. Also good. Also in this case, the length ΔL2 of the laminate sheet 40 in the substrate height direction is made longer than the height ΔT of the module substrate 100.

  FIG. 24 is a diagram for explaining another method for mounting the laminated energy device 18 in the power supply module according to the third embodiment. Here, the laminate type energy device 18 is fixed to the module substrate 100 by both the extraction electrodes 34 a and 34 b and the laminate sheet 40. The end portion of the laminate sheet 40 covers the outer surface of the hard coat 200. As described above, various mounting modes can be appropriately combined.

  As described above, according to the third embodiment, it is possible to provide a battery-assisted power supply module that protects a device by supplying a minimum power to the main board in an emergency. By making the laminate type energy device 18 as an add-on module in this way, the degree of freedom of capacity and shape is increased, so that the layout efficiency can be increased. Since such a power supply module uses a laminated energy device 18 such as EDLC, the power supply module has a good response and is suitable for measures against instantaneous power failure.

  In the above description, in the battery-assisted power supply module according to the third embodiment, the EDLC is exemplified as the laminate type energy device 18, but a lithium ion capacitor, a lithium ion battery, or the like is adopted as the laminate type energy device 18. May be. Hereinafter, the basic structure of each internal electrode will be described.

(EDLC internal electrode)
FIG. 25 illustrates a basic structure of an EDLC internal electrode as the laminated energy device 18 in the power supply module according to the third embodiment. The EDLC internal electrode is configured so that at least one layer of the active material electrodes 10 and 12 is interposed with a separator 30 through which only ions of the electrolytic solution 44 pass, and the extraction electrodes 34 a and 34 b are exposed from the active material electrodes 10 and 12. The extraction electrodes 34a and 34b are connected to the power supply voltage. The extraction electrodes 34a and 34b are made of, for example, aluminum foil, and the active material electrodes 10 and 12 are made of, for example, activated carbon. The separator 30 is larger than the active material electrodes 10 and 12 (having a large area) so as to cover the entire active material electrodes 10 and 12. The separator 30 does not depend on the type of energy device in principle, but heat resistance is required particularly when reflow treatment is required. When heat resistance is not required, polypropylene or the like can be used, and when heat resistance is required, a cellulosic material can be used. The EDLC internal electrode is impregnated with the electrolytic solution 44, and ions of the electrolytic solution move through the separator 30 during charging and discharging.

(Lithium ion capacitor internal electrode)
FIG. 26 illustrates a basic structure of a lithium ion capacitor internal electrode as the laminated energy device 18 in the power supply module according to the third embodiment. In the internal electrode of the lithium ion capacitor, the separator 30 through which only ions of the electrolytic solution 44 pass is interposed between the active material electrodes 11 and 12 of at least one layer, and the extraction electrodes 34a and 34b1 are exposed from the active material electrodes 10 and 12. The extraction electrodes 34a and 34b1 are connected to the power supply voltage. The active material electrode 12 on the positive electrode side is made of, for example, activated carbon, and the active material electrode 11 on the negative electrode side is made of, for example, Li-doped carbon. The lead electrode 34a on the positive electrode side is made of, for example, an aluminum foil, and the lead electrode 34b1 on the negative electrode side is made of, for example, a copper foil. The separator 30 is larger than the active material electrodes 11 and 12 (having a large area) so as to cover the entire active material electrodes 11 and 12. The lithium ion capacitor internal electrode is impregnated with the electrolytic solution 44, and ions of the electrolytic solution move through the separator 30 during charging and discharging.

(Lithium ion battery internal electrode)
FIG. 27 illustrates a basic structure of a lithium ion battery internal electrode as the laminate type energy device 18 in the power supply module according to the third embodiment. In the lithium ion battery internal electrode according to the third embodiment, the separator 30 through which only ions of the electrolytic solution 44 pass is interposed in at least one layer of the active material electrodes 11 and 12a, and the extraction electrodes 34a and 34b1 are active materials. The lead electrodes 34a and 34b1 are configured to be exposed from the electrodes 11 and 12a, and are connected to a power supply voltage. The active material electrode 12a on the positive electrode side is made of, for example, LiCoO _2, and the active material electrode 11 on the negative electrode side is made of, for example, Li-doped carbon. The lead electrode 34a on the positive electrode side is made of, for example, an aluminum foil, and the lead electrode 34b1 on the negative electrode side is made of, for example, a copper foil. The separator 30 is larger than the active material electrodes 11 and 12a (having a large area) so as to cover the entire active material electrodes 11 and 12a. The internal electrode of the lithium ion battery is impregnated with the electrolytic solution 44, and ions of the electrolytic solution move through the separator 30 during charging and discharging.

[Fourth Embodiment]
Hereinafter, only differences between the fourth embodiment and the first to third embodiments will be described.

  28A and 28B are diagrams for explaining a power supply module M according to the fourth embodiment. FIG. 28A is a schematic plane pattern configuration diagram, and FIG. 28B is a schematic side pattern structure diagram. It is. The power supply module M supplies power from the laminated energy device 18 to the main board 300 via clip pins P1, P2, and P3 sandwiching the end of the module board 100. For example, the peripheral circuit 150/160 is mounted on one surface of the module substrate 100, the tip 34t of the extraction electrode 34 of the laminated energy device 18 is connected to one surface, and the extraction electrode 34 is bent into a U-shape. Then, the main body of the laminate type energy device 18 is mounted on the other surface of the module substrate 100. The main body of the laminate type energy device 18 may be fixed to the other surface of the module substrate 100 with an adhesive. The outer surface of the power supply module M may be covered with an insulating film by powder coating or resin molding.

  The peripheral circuit is a circuit necessary for the laminated energy device 18 to function normally. The peripheral circuit may include an EDLC charger circuit 150 that charges the laminated energy device 18, a monitoring circuit that monitors the voltage of the power source, and a switching circuit that switches between the power source and the laminated energy device 18. Furthermore, a DC / DC converter (buck-boost circuit) 160 for stepping up and down the voltage of the power supply may be included.

  Hereinafter, the power supply module M will be described in more detail.

  The tip 34t of the extraction electrode 34 of the laminate type energy device 18 is welded to the upper end of the surface of the module substrate 100. The length of the extraction electrode 34 can be shortened as compared with the case where the welding is performed by soldering. The lead electrode 34 is bent into a U shape, and the main body of the laminate type energy device 18 is mounted on the back surface of the module substrate 100. At that time, it is desirable that the main body of the laminated energy device 18 and the module substrate 100 be fixed by the adhesive 13.

  A solder joint is provided at the lower end of the module substrate 100, and the solder weld is sandwiched between the clip pins P1, P2, P3 and soldered. The joining positions of the clip pins P1, P2, P3 will be described in detail later. The interval between the clip pins P1, P2, P3 is, for example, 2.54 mm, and the length of the clip pins P1, P2, P3 is, for example, 10 mm.

  The outer surface of such a power supply module M is powder-coated. For example, as shown in FIG. 29, the resin base powder 50 is melted and sprayed onto the power supply module M in the coating apparatus 51, and the sprayed melt is cooled. Thereby, as shown in FIG. 30, an insulating film 60 coated with powder can be formed on the outer surface of the power supply module M. In order to avoid the power supply module M from becoming high temperature, the outer surface of the power supply module M may be covered with an insulating film by a room temperature curing resin mold, for example. Various known methods can be employed as a method of powder coating or resin molding.

  FIG. 31 is a schematic bird's-eye view showing a state in which the power supply module M according to the fourth embodiment is mounted on the main board 300. As shown in this figure, the clip pins P1, P2, P3 of the power supply module M are inserted into the pads P1a, P2a, P3a provided on the main board 300 and soldered. Thereby, the clip pins P1, P2, and P3 are electrically connected to the circuit pattern of the main board 300. As a result, it is possible to supply power from the laminate type energy device 18 to the main board 300 via the clip pins P1, P2, P3.

  Hereinafter, the peripheral circuit of the laminate type energy device 18 will be described in more detail. As already described, the peripheral circuit is a circuit necessary for the laminated energy device 18 to function normally. As such a peripheral circuit, the circuit configuration (FIG. 19) described in the third embodiment can be employed. However, since the voltage monitoring IC 170 is generally expensive, a configuration that does not use the voltage monitoring IC 170 as shown in FIG. 32 may be adopted. In this case, a reset IC 171 that monitors the power supply voltage V and continues to issue a reset signal until it reaches a normal voltage is provided. The SW opening / closing circuit 172 switches between the DC power source and the laminate type energy device 18 by turning on / off the MOS switches Q1, Q2. The EDLC charger circuit 150 is as described in the third embodiment. Symbols P1, P2, and P3 in FIG. 32 represent joint positions with the clip pins P1, P2, and P3, respectively. Here, the power supply module M including three clip pins P1, P2, and P3 is illustrated, but the number of clip pins is appropriately changed according to the circuit configuration.

Shown in FIG. 33 (a) is a waveform of the power supply voltage V, FIG. 33 (b) is a waveform of the output voltage _{V r} of the reset IC 171. As shown in this figure, even if the DC power is on, while the power supply voltage V does not reach the detection value V _H of the reset IC171 is a reset state. At the time t1 when the detection value _VH is exceeded, the reset state is released, the MOS switch Q1 is turned on, and the MOS switch Q2 is turned off. Thus, power is supplied from the DC power source to the main board 300, and the laminate type energy device 18 is charged by the DC power source. On the other hand, DC power supply is turned off, instantaneously becomes a reset state when the power supply voltage V is below the detection value _{V H} of the reset IC 171, MOS switch _{Q 1} is turned off, MOS switch _{Q 2} is turned on. As a result, the laminate type energy device 18 is discharged, and power is supplied from the laminate type energy device 18 to the main substrate 300. Of course, the characteristics of the reset IC 171 are not limited to this.

FIG. 34 is a schematic block diagram of another power supply module M according to the fourth embodiment. When a lithium ion battery is used as the power source, the voltage is 3.7 V, for example, but an output voltage V _{O of} 5 V is sometimes required. Therefore, as shown in FIG. 34, a DC / DC converter (buck-boost circuit) 160 that steps up and down the power supply voltage V may be provided on one or both of the input side and the output side. In this way, the desired output voltage V _O can be obtained by stepping up and down the power supply voltage V by the DC / DC converter 160.

  As described above, according to the fourth embodiment, since the laminated energy device 18 and its peripheral circuit are integrally mounted on the module substrate 100, a compact and easy-to-use power supply module M is provided. It is possible.

  In addition, since power is supplied from the laminated energy device 18 to the main board 300 via the clip pins P1, P2, P3, the power supply module M is mounted in an upright state with respect to the main board 300. Thus, the limited board space can be effectively utilized. By using the clip pins P1, P2, P3, soldering with the main board 300 is facilitated, and there is an advantage that mounting property is improved.

  Further, although not particularly mentioned in the above description, conventionally, an aluminum electrolytic capacitor has been generally inserted in order to suppress the peak current of the power supply section. However, aluminum electrolytic capacitors cannot follow high-speed and high-speed fluctuations. On the other hand, in the power supply module M according to the present embodiment, since the laminated energy device 18 such as EDLC is adopted, it is possible to smooth the peak current that cannot be followed by the aluminum electrolytic capacitor. Such a power supply module M can be easily attached to the main substrate 300 like a conventional aluminum electrolytic capacitor, and can be said to have a very high practical value.

  As described above, according to the present invention, it is possible to provide a laminated energy device, a laminated energy device mounting method, and a power supply module that can be stably mounted on a module substrate.

[Other embodiments]
As described above, the present invention has been described according to the first to third embodiments. However, it should be understood that the descriptions and drawings constituting a part of this disclosure are exemplary and limit the present invention. should not do. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

  As described above, the present invention includes various embodiments not described herein. For example, the present invention includes a laminate type energy device mounting structure when the laminate type energy device 18 is mounted on the module substrate 100 by the laminate type energy device mounting method described in the first to third embodiments. Of course.

  The laminate type energy device according to the present invention can be applied to electric double layer capacitors, lithium ion capacitors, lithium ion batteries and the like. Moreover, the laminate type energy device according to the present invention can be applied to an LED-Flash module, a communication (high output) module, a solar cell module, a power supply module, a backup power supply for toys and the like.

  In addition, as an electric double layer capacitor internal electrode, LED-Flash, motor drive power supply (for example, for toys), electric vehicle storage element (for example, for regeneration and starter), energy from solar cells and vibration power generation The present invention can be applied to power storage elements, power storage elements for high-power communication, environment-resistant power storage elements (for example, power storage elements for roadsides and bicycle lights), and the like. The lithium ion capacitor internal electrode can be applied to an energy storage element from a solar cell or wind power generation, a power source for driving a motor, or the like. As an internal electrode of a lithium ion battery capacitor, it can be applied to a battery for a portable device, a storage element for an electric vehicle (during steady operation), a large-scale storage element (for general household use), and the like.

DESCRIPTION OF SYMBOLS 10, 11, 12 ... Active material electrode 13 ... Adhesive 15 ... Peeling paper 18 ... Laminate type energy device 30 ... Separator 34a, 34b, 34c ... Extraction electrode 34s, 34k ... Bending process 40, 180 ... Laminate sheet 44 ... Electrolysis Liquid 50 ... powder 60 ... insulating film 100 ... module substrate (substrate)
110 ... Connector (connection part)
150 ... EDLC charger circuit 160 ... DC / DC converter (buck-boost circuit)
170 ... Voltage monitoring IC (monitoring circuit, switching circuit)
171 ... Reset IC (monitoring circuit)
172 ... SW open / close circuit (switching circuit)
300... Main board .DELTA.L1... Length of extraction electrode .DELTA.L2... Length of laminate sheet in board height direction .DELTA.T... Module board height (board height)
P1, P2, P3 ... Clip pins

Claims (17)

Laminated energy device,
And a peripheral circuit of the laminate type energy device, wherein the laminate type energy device is mounted on a substrate integrally with the peripheral circuit.   2. The power supply module according to claim 1, wherein power is supplied to the main board from the laminated energy device via a clip pin sandwiching an end of the board.   The peripheral circuit is mounted on one surface of the substrate, the tip of the lead electrode of the laminated energy device is connected to one surface of the peripheral circuit, and the lead electrode is bent into a U-shape so that the other surface of the substrate is The power supply module according to claim 1, wherein a main body of the laminated energy device is mounted on the power supply module.   The power module according to claim 3, wherein a main body of the laminated energy device is fixed to the other surface of the substrate with an adhesive.   The power supply module according to any one of claims 1 to 4, wherein an outer surface is covered with an insulating film by powder coating or a resin mold.   The peripheral circuit includes a charger circuit that charges the laminated energy device, a monitoring circuit that monitors a voltage of the power source, and a switching circuit that switches between the power source and the laminated energy device. Item 6. The power supply module according to any one of Items 1 to 5.   The power supply module according to claim 6, wherein the peripheral circuit further includes a step-up / step-down circuit that step-up / step-down the voltage of the power source.   The power supply module according to claim 1, further comprising a connection part for add-on connection to the main board.   The power module according to claim 1, wherein the laminate type energy device is an electric double layer capacitor.   The power module according to claim 1, wherein the laminated energy device is a lithium ion capacitor.   The power module according to claim 1, wherein the laminate type energy device is a lithium ion battery. While interposing a separator through which ions of the electrolyte can pass through the active material electrode portion of the electrode in which the positive and negative electrode active material electrodes and the positive and negative electrode lead electrodes are integrally formed, the lead electrode is exposed. And the laminated body laminated | stacked two or more layers so that the positive electrode and negative electrode of the said active material electrode may be laminated | stacked alternately,
A laminate sheet for sealing the laminate,
An adhesive applied to both sides or one side of the laminate sheet;
A laminate-type energy device comprising: a paper sheet covering a surface of the pressure-sensitive adhesive.   The laminate type energy device according to claim 12, wherein the lead electrode is bent in a height direction of the substrate when the laminate type energy device is mounted on the substrate.   The laminate type energy according to claim 12 or 13, wherein the laminate sheet is pressed so as to have an outer shape that wraps around the substrate when the laminate type energy device is mounted on the substrate. device.   The lead-out electrode or the laminate sheet covers only the substrate surface opposite to the substrate surface on which the laminated energy device is mounted. Laminate type energy device.   The laminate type energy device according to any one of claims 12 to 15, wherein a length of the extraction electrode or the laminate sheet in a height direction of the substrate is longer than a height of the substrate. While interposing a separator through which ions of the electrolyte can pass through the active material electrode portion of the electrode in which the positive and negative electrode active material electrodes and the positive and negative electrode lead electrodes are integrally formed, the lead electrode is exposed. And the laminated body laminated | stacked two or more layers so that the positive electrode and negative electrode of the said active material electrode may be laminated | stacked alternately, the laminated sheet which seals the said laminated body, and both surfaces or one side of the said laminated sheet A laminated energy device mounting method for mounting a laminated energy device comprising a pressure-sensitive adhesive applied to the surface of the adhesive and a paper sheet covering the surface of the pressure-sensitive adhesive on a substrate,
Peeling off the peeling paper covering both sides or one side of the laminate sheet;
Fixing the laminated energy device at a predetermined mounting position in a state where the adhesive is exposed at the part where the peeling paper is peeled off, and
A laminate type energy device mounting method, comprising: pressing the lead electrode toward the substrate to electrically connect the lead electrode.

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