JP2013129461A5 - - Google Patents
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- Publication number
- JP2013129461A5 JP2013129461A5 JP2011282172A JP2011282172A JP2013129461A5 JP 2013129461 A5 JP2013129461 A5 JP 2013129461A5 JP 2011282172 A JP2011282172 A JP 2011282172A JP 2011282172 A JP2011282172 A JP 2011282172A JP 2013129461 A5 JP2013129461 A5 JP 2013129461A5
- Authority
- JP
- Japan
- Prior art keywords
- support substrate
- solar cell
- cell module
- long side
- supporting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 14
- 238000004806 packaging method and process Methods 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 2
- 238000006073 displacement reaction Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011282172A JP5756007B2 (ja) | 2011-12-22 | 2011-12-22 | 支持基板及び梱包方法 |
| CN201280070316.7A CN104125920A (zh) | 2011-12-21 | 2012-10-31 | 支承构造体、装载捆包装置、支承基板及捆包方法 |
| PCT/JP2012/078116 WO2013094317A1 (ja) | 2011-12-21 | 2012-10-31 | 支持構造体、積載梱包具、支持基板及び梱包方法 |
| US14/368,128 US20140367305A1 (en) | 2011-12-21 | 2012-10-31 | Supporting structure, loading and packing device, supporting base plate, and packing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011282172A JP5756007B2 (ja) | 2011-12-22 | 2011-12-22 | 支持基板及び梱包方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013129461A JP2013129461A (ja) | 2013-07-04 |
| JP2013129461A5 true JP2013129461A5 (enExample) | 2014-11-06 |
| JP5756007B2 JP5756007B2 (ja) | 2015-07-29 |
Family
ID=48907368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011282172A Expired - Fee Related JP5756007B2 (ja) | 2011-12-21 | 2011-12-22 | 支持基板及び梱包方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5756007B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6291870B2 (ja) * | 2014-01-30 | 2018-03-14 | 大同特殊鋼株式会社 | 太陽光発電モジュール積層体 |
-
2011
- 2011-12-22 JP JP2011282172A patent/JP5756007B2/ja not_active Expired - Fee Related
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