JP2013129106A - Liquid ejection head - Google Patents
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Abstract
Description
本発明は、圧電部材の変位を利用してノズルより液体を吐出する液体吐出ヘッドに関する。 The present invention relates to a liquid discharge head that discharges liquid from a nozzle by using displacement of a piezoelectric member.
インクを吐出して記録媒体に画像を記録するインクジェット記録装置には、一般的に、インクを吐出する液体吐出ヘッドが搭載されている。液体吐出ヘッドがインクを吐出する機構として、圧電部材によって収縮可能な圧力室を用いる機構が知られている。この機構では、電圧を印加された圧電部材の変形により圧力室が収縮することによって、圧力室内のインクが、圧力室の一端に形成された吐出口から押し出され吐出する。 2. Description of the Related Art Generally, a liquid discharge head that discharges ink is mounted on an ink jet recording apparatus that records an image on a recording medium by discharging ink. As a mechanism for ejecting ink by a liquid ejection head, a mechanism using a pressure chamber that can be contracted by a piezoelectric member is known. In this mechanism, the pressure chamber contracts due to the deformation of the piezoelectric member to which a voltage is applied, so that the ink in the pressure chamber is pushed out and ejected from the ejection port formed at one end of the pressure chamber.
工業用途のインクジェット装置では、高粘度の液体を使用したいという要求がある。高粘度の液体を吐出するためには、液体吐出ヘッドに大きな吐出力が求められる。グールドタイプの液体吐出ヘッドでは、圧力室の壁面が全て変形し、その変形がインクの吐出力に寄与するので、大きな吐出力を得ることができる。 In an inkjet device for industrial use, there is a demand for using a highly viscous liquid. In order to eject a highly viscous liquid, a large ejection force is required for the liquid ejection head. In the Gould type liquid discharge head, all the wall surfaces of the pressure chamber are deformed and the deformation contributes to the ink discharge force, so that a large discharge force can be obtained.
グールドタイプの液体吐出ヘッドにおいて、高い解像度を得るためには、吐出口を増やすとともに、各々の吐出口を高密度に配置、つまり、各々の吐出口に対応する圧力室も高密度に配置する必要がある。しかし、圧力室を高密度に配置した場合においては、単ノズル駆動時（インクを吐出する吐出口の周囲の吐出口からインク吐出なし）と全ノズル駆動時（全ての吐出口からインクが吐出）の吐出性能が異なるといった構造的クロストークの発生を低減する必要がある。構造的クロストークの原因として、圧力室の変形が隣接する圧力室の圧電部材に伝搬することが考えられる。 In order to obtain high resolution in a Gould-type liquid discharge head, it is necessary to increase the number of discharge ports and to arrange each discharge port at high density, that is, to arrange pressure chambers corresponding to each discharge port at high density. There is. However, when the pressure chambers are arranged at high density, when single nozzles are driven (no ink is discharged from the discharge ports around the discharge ports that discharge ink) and when all nozzles are driven (ink is discharged from all the discharge ports) It is necessary to reduce the occurrence of structural crosstalk such as different discharge performances. As a cause of the structural crosstalk, it is considered that the deformation of the pressure chamber propagates to the piezoelectric member of the adjacent pressure chamber.
特許文献１の液体吐出ヘッドの製造方法では、インクチャネルとインクチャネルより深いダミーチャネルを交互に複数の形成した圧電部材を、インクチャネルの位置と重なるようにスリットを設けたトッププレートで覆っている。このようにすることで、インクチャネルの側壁が変形しても、ダミーチャネル底部がインクチャネル底部よりも深い場所に存在するため、変形したインクチャネルに隣接するダミーチャネル底部での変形が起こらない。また、トッププレートにスリットを設けているので、インクチャネルの変形が容易になる。そのため、変形したインクチャネルに隣接するインクチャネルへの干渉が発生せず、クロストークが低減される。 In the method of manufacturing a liquid discharge head disclosed in Patent Document 1, a piezoelectric member in which a plurality of ink channels and dummy channels deeper than the ink channels are alternately formed is covered with a top plate provided with a slit so as to overlap the position of the ink channel. . By doing so, even when the side wall of the ink channel is deformed, the bottom of the dummy channel is present at a deeper position than the bottom of the ink channel, so that deformation at the bottom of the dummy channel adjacent to the deformed ink channel does not occur. Further, since the top plate is provided with the slit, the ink channel can be easily deformed. Therefore, interference with the ink channel adjacent to the deformed ink channel does not occur, and crosstalk is reduced.
また、特許文献２の液体吐出ヘッドの製造方法では、圧力室を有する流路基板に振動板と圧電部材とを積層した構造において、圧電部材と振動板を貫通し、流路基板の、圧力室同士を分離する側壁に至る凹部が設けられている。このようにすることで、隣接する圧力室の変形の影響を減らし、クロストークが発生するという問題点を解決している。 Further, in the method for manufacturing a liquid discharge head disclosed in Patent Document 2, in a structure in which a diaphragm and a piezoelectric member are stacked on a flow path substrate having a pressure chamber, the piezoelectric member and the vibration plate are penetrated, and the pressure chamber of the flow path substrate is A recess reaching the side wall that separates each other is provided. By doing so, the influence of deformation of adjacent pressure chambers is reduced, and the problem that crosstalk occurs is solved.
液体吐出ヘッドにおいて、さらに高い解像度を得るためには、複数の吐出口と各吐出口に対応して設けられる圧力室を２次元的により高密度に配置する必要がある。 In order to obtain a higher resolution in the liquid discharge head, it is necessary to arrange a plurality of discharge ports and pressure chambers provided corresponding to the respective discharge ports in a two-dimensionally higher density.
特許文献１、２に示されている液体吐出ヘッドでは、同様の構成を直接重ねることができない。そのため、直線的には吐出口と圧力室を増やせるが、２次元的に増やす場合には液体吐出ヘッドのサイズが大きくなる。 In the liquid discharge heads disclosed in Patent Documents 1 and 2, the same configuration cannot be directly stacked. For this reason, the number of ejection ports and pressure chambers can be increased linearly, but the size of the liquid ejection head increases when it is increased two-dimensionally.
そこで、本発明の目的は、ノズルおよび圧力室を高密度に二次元配置することを可能とし、かつ、構造的クロストークを低減できる液体吐出ヘッドを提供することである。 SUMMARY OF THE INVENTION An object of the present invention is to provide a liquid ejection head that enables two-dimensional arrangement of nozzles and pressure chambers with high density and can reduce structural crosstalk.
本発明の液体吐出ヘッドは、液体を吐出する吐出口に連通し、該吐出口から吐出される液体を貯留するための圧力室が複数設けられ、圧力室の収縮変形に応じて吐出口から液体を吐出する液体吐出ヘッドである。 The liquid discharge head of the present invention is provided with a plurality of pressure chambers that communicate with the discharge port for discharging the liquid and store the liquid discharged from the discharge port, and the liquid is discharged from the discharge port according to contraction deformation of the pressure chamber. This is a liquid discharge head that discharges water.
また、本発明の液体吐出ヘッドには、圧力室の周囲に、圧力室と同じ方向に延びる複数の凹部が設けられ、圧力室の少なくとも一部が圧電部材で構成されている。 In the liquid discharge head of the present invention, a plurality of recesses extending in the same direction as the pressure chamber are provided around the pressure chamber, and at least a part of the pressure chamber is formed of a piezoelectric member.
一方の面に第１の凹部と第４の凹部が交互に設けられた第１の基板と、第２の凹部と第３の凹部がそれぞれ複数設けられた第２の基板とが交互に積層した積層体が設けられている。第２の凹部４は、第２の基板２の、第１の基板１の一方の面と接しない面に設けられ、積層方向から見て第２の凹部４と第４の凹部１５とが重なっている。圧力室は、第４の凹部と第２の基板の、第１の基板の一方の面と接する面とで形成されている。さらに、第１の凹部または第２の凹部と、第３の凹部が連通している。 The 1st board | substrate with which the 1st recessed part and the 4th recessed part were alternately provided in one surface, and the 2nd board | substrate with which the 2nd recessed part and the 3rd recessed part were each provided in plurality were laminated | stacked alternately A laminate is provided. The second recess 4 is provided on a surface of the second substrate 2 that does not contact one surface of the first substrate 1, and the second recess 4 and the fourth recess 15 overlap when viewed from the stacking direction. ing. The pressure chamber is formed by the fourth recess and a surface of the second substrate that contacts one surface of the first substrate. Furthermore, the first or second recess and the third recess communicate with each other.
本発明によれば、圧力室が二次元的に高密度に配置された液体吐出ヘッドあっても、圧力室の収縮変形による構造的クロストークを低減できる。その結果、吐出パターンに関係なく均一な吐出性能を発現する液体吐出ヘッドを提供することができる。 According to the present invention, even if there is a liquid discharge head in which pressure chambers are two-dimensionally arranged at high density, structural crosstalk due to contraction deformation of the pressure chambers can be reduced. As a result, it is possible to provide a liquid discharge head that exhibits uniform discharge performance regardless of the discharge pattern.
以下に、添付の図面に基づき、本発明の実施の形態の詳細について説明する。なお、同一の機能を有する構成には添付図面中、同一の番号を付与し、その説明を省略することがある。 Details of embodiments of the present invention will be described below with reference to the accompanying drawings. In addition, the same number is attached | subjected to the structure which has the same function in an accompanying drawing, and the description may be abbreviate | omitted.
［第１の実施例］
本発明の第１の実施例を説明する。図１は、本発明に係る液体吐出ヘッドの概略斜視図である。
[First embodiment]
A first embodiment of the present invention will be described. FIG. 1 is a schematic perspective view of a liquid discharge head according to the present invention.
本実施例の液体吐出ヘッド９０は、図１に示すように、後方絞りプレート６と、圧電ブロック体５と、ノズルプレート８とを有する。圧電ブロック体５の一方の面（前面）に、ノズルプレート８が接合されている。ノズルプレート８には、たとえば円形貫通孔からなる複数の吐出口７が形成されており、これらの吐出口７は所定の間隔で二次元に配置されている。圧電ブロック体５の他方の面（後面）には、後方絞りプレート６が接合されている。圧電ブロック体５は、あらかじめ分極処理された第１の圧電基板（第１の基板）１と第２の圧電基板（第２の基板）２とを不図示の接着層を介して交互に複数積層し、第３の圧電基板１１で積層方向の両端を挟んで構成される積層体である。ここで第２の圧電基板２は、チタン酸ジルコン酸鉛（ＰＺＴ）を用いることが望ましいが、圧電効果を得られる材料であればこれに限定されるものではない。また、第３の圧電基板１１は圧電材料以外の例えばセラミック材料であっても構わない。 As shown in FIG. 1, the liquid discharge head 90 according to the present embodiment includes a rear diaphragm plate 6, a piezoelectric block body 5, and a nozzle plate 8. A nozzle plate 8 is joined to one surface (front surface) of the piezoelectric block body 5. The nozzle plate 8 is formed with a plurality of discharge ports 7 made of, for example, circular through holes, and these discharge ports 7 are two-dimensionally arranged at predetermined intervals. A rear diaphragm plate 6 is joined to the other surface (rear surface) of the piezoelectric block body 5. The piezoelectric block body 5 includes a plurality of first piezoelectric substrates (first substrates) 1 and second piezoelectric substrates (second substrates) 2 that are polarized in advance, alternately stacked via an adhesive layer (not shown). In addition, the laminated body is configured by sandwiching both ends of the third piezoelectric substrate 11 in the stacking direction. Here, it is desirable to use lead zirconate titanate (PZT) for the second piezoelectric substrate 2, but the material is not limited to this as long as the material can obtain the piezoelectric effect. The third piezoelectric substrate 11 may be a ceramic material other than the piezoelectric material, for example.
図２は、図１に示す液体吐出ヘッドのＡ−Ａ’断面の概略図である。本発明の圧電ブロック体５は、圧電部材からなる第１の圧電基板１と第２の圧電基板２とが交互に積層されており、積層方向の両端には、第３の圧電基板１１が設けられた積層体である。第１の圧電基板１には、溝状の第４の凹部１５と溝状の第１の凹部９とが一方の面に交互に間隔をあけて複数設けられている。第４の凹部１５は、第２の圧電基板２に積層方向の開口を塞がれることで、インクを貯留する圧力室３となる。また、第２の圧電基板２の、第１の圧電基板１の一方の面とは接しない面である一方の面には溝状の第２の凹部４が間隔を空けて複数設けられ、第１の圧電基板１の一方の面と接する面である他方の面には溝状の第３の凹部１０が複数設けられている。第２の凹部４と第３の凹部１０とは積層方向からみて、互いに重ならないように位置する。第３の凹部１０と第１の凹部９とは互いに向かい合い連通している。第２の凹部４は、積層方向からみて、第４の凹部１５（圧力室３）と重なるようになっている。つまり、第２の凹部４と圧力室３は、積層方向において交互に配置されている。 FIG. 2 is a schematic diagram of the A-A ′ cross section of the liquid ejection head shown in FIG. 1. In the piezoelectric block body 5 of the present invention, the first piezoelectric substrate 1 and the second piezoelectric substrate 2 made of piezoelectric members are alternately stacked, and third piezoelectric substrates 11 are provided at both ends in the stacking direction. Is a laminated body. The first piezoelectric substrate 1 is provided with a plurality of groove-shaped fourth recesses 15 and groove-shaped first recesses 9 alternately spaced on one surface. The fourth recess 15 becomes the pressure chamber 3 for storing ink by closing the opening in the stacking direction in the second piezoelectric substrate 2. In addition, a plurality of groove-like second recesses 4 are provided on one surface of the second piezoelectric substrate 2 that is not in contact with one surface of the first piezoelectric substrate 1 with a space therebetween. A plurality of groove-shaped third recesses 10 are provided on the other surface, which is a surface in contact with one surface of one piezoelectric substrate 1. The second concave portion 4 and the third concave portion 10 are positioned so as not to overlap each other when viewed from the stacking direction. The third recess 10 and the first recess 9 face each other and communicate with each other. The second recess 4 overlaps the fourth recess 15 (pressure chamber 3) when viewed from the stacking direction. That is, the second recesses 4 and the pressure chambers 3 are alternately arranged in the stacking direction.
また、圧力室３となる第４の凹部１５以外も、第１の基板１と第２の基板２とが積層することで、第２の凹部４と第１の基板１および第１の凹部９と第３の凹部１０とでそれぞれ空洞が形成されている。 In addition to the fourth recess 15 serving as the pressure chamber 3, the second recess 4, the first substrate 1, and the first recess 9 are formed by stacking the first substrate 1 and the second substrate 2. A cavity is formed in each of the third recess 10 and the third recess 10.
第１の凹部９は第１の圧電基板１において、圧力室３に平行に延びている。第２の凹部４と第３の凹部１０は第２の圧電基板２において、圧力室３に平行に延びている。つまり、第１〜３の凹部４、９、１０と第１と第２の基板１、２とで形成される空洞も圧力室３に平行である。 The first recess 9 extends in parallel with the pressure chamber 3 in the first piezoelectric substrate 1. The second recess 4 and the third recess 10 extend in parallel to the pressure chamber 3 in the second piezoelectric substrate 2. That is, the cavity formed by the first to third recesses 4, 9, 10 and the first and second substrates 1, 2 is also parallel to the pressure chamber 3.
圧力室３の内壁の４面には、第１の電極１２が形成されている。第１の電極１２は、圧力室３の内壁４面のうちの、第１の圧電基板１によって圧力室３を構成する３面に形成された第１−１の電極１２ａ、および、第２の圧電基板２によって圧力室３を構成する１面に形成された第１−２の電極１２ｂからなる。またこの第１の電極１２は、圧電ブロック体５の後面に形成された不図示の電極に接続される。第１の圧電基板１に形成された第１の凹部９の内壁の３面には、第２の電極１３が形成されている。 First electrodes 12 are formed on four surfaces of the inner wall of the pressure chamber 3. The first electrode 12 includes a first electrode 12 a formed on the three surfaces constituting the pressure chamber 3 by the first piezoelectric substrate 1 of the inner wall 4 surface of the pressure chamber 3, and a second electrode 12 a The piezoelectric substrate 2 includes a first-second electrode 12 b formed on one surface constituting the pressure chamber 3. The first electrode 12 is connected to an electrode (not shown) formed on the rear surface of the piezoelectric block body 5. On the three surfaces of the inner wall of the first recess 9 formed on the first piezoelectric substrate 1, the second electrode 13 is formed.
第２の凹部４の内壁の底面と、積層方向で第２の凹部４の開口を塞ぐ位置の第１の圧電基板１には、それぞれ第３−１の電極１４ａと第３−２の電極１４ｂとが設けられ、この２つの電極１４ａ、１４ｂで第３の電極１４を形成している。 The 3-1 electrode 14a and the 3-2 electrode 14b are respectively provided on the bottom surface of the inner wall of the second recess 4 and the first piezoelectric substrate 1 at the position where the opening of the second recess 4 is closed in the stacking direction. And the third electrode 14 is formed by the two electrodes 14a and 14b.
圧電ブロック体５の後面の不図示の電極は、個々の圧力室３に応じた個別の配線がなされ、圧電ブロック体５の前面の不図示の電極は、第２の電極１３および第３の電極１４に共通の電極として配線される。これにより、圧力室３の内壁に形成されている第１の電極１２と、それ以外の第２の電極１３および第３の電極１４との間で、別々に駆動電圧を印加することが出来る。 The electrodes (not shown) on the rear surface of the piezoelectric block body 5 are individually wired according to the individual pressure chambers 3. The electrodes (not shown) on the front surface of the piezoelectric block body 5 are the second electrode 13 and the third electrode. 14 is wired as a common electrode. Thereby, a drive voltage can be separately applied between the first electrode 12 formed on the inner wall of the pressure chamber 3 and the other second electrode 13 and third electrode 14.
圧電ブロック体５の前面にはノズルプレート８が貼り合わされ、ノズルプレート８に形成されている吐出口７と圧力室３とが連通している。また、圧電ブロック体５の後面には後方絞りプレート６が貼り合わされ、後方絞りプレート６に形成されている不図示の孔と圧力室３とが連通している。 A nozzle plate 8 is bonded to the front surface of the piezoelectric block body 5, and the discharge port 7 formed in the nozzle plate 8 and the pressure chamber 3 communicate with each other. A rear diaphragm plate 6 is bonded to the rear surface of the piezoelectric block body 5, and a hole (not shown) formed in the rear diaphragm plate 6 communicates with the pressure chamber 3.
図示しない共通液室から供給されたインクは、後方絞りプレート６内に形成された孔を通り、圧力室３を通過して、さらに吐出口７まで満たされる。インクは、図示しない共通液室の上流において負圧にコントロールされており、メニスカスと呼ばれる気液界面は毛管力により吐出口７で保持される。電極に駆動電圧を印加して圧力室３を収縮変形させて圧力室の容積を変化させることにより、圧力室３内のインクに圧力が付与されて吐出口７からインクが吐出する。 Ink supplied from a common liquid chamber (not shown) passes through a hole formed in the rear diaphragm plate 6, passes through the pressure chamber 3, and is further filled up to the discharge port 7. The ink is controlled to a negative pressure upstream of a common liquid chamber (not shown), and a gas-liquid interface called a meniscus is held at the discharge port 7 by capillary force. By applying a driving voltage to the electrodes to contract and deform the pressure chamber 3 to change the volume of the pressure chamber, pressure is applied to the ink in the pressure chamber 3 and ink is ejected from the ejection port 7.
圧電ブロック体５の製造方法を、図３と図４を用いて説明する。まず、第２の圧電基板２の一方の面（上面）に、溝状の第２の凹部４をダイシングにより形成し（図３（ａ））、選択めっきにより第３−１の電極１４ａを、第２の凹部４の他方の面（下面）側の内壁に形成する（図３（ｂ））。その後、第２の圧電基板２の上面に、第３の圧電基板１１を接着し（図３（ｃ））、第３の圧電基板１１に接着した第２の圧電基板２の下面に溝状の第３の凹部１０を、積層方向からみて第２の凹部４とは重ならない位置にダイシングにより形成する（図３（ｄ））。このとき、第３の凹部１０は第２の圧電基板２を貫通してもよい。さらに、第２の圧電基板２の下面から、第２の圧電基板２の下面の、第３の凹部１０同士の間であり、圧力室３の内壁の一部となる部分に選択めっきを施し、第１−２の電極１２ｂを形成する（図３（ｅ））。 The manufacturing method of the piezoelectric block body 5 is demonstrated using FIG. 3 and FIG. First, a groove-shaped second recess 4 is formed on one surface (upper surface) of the second piezoelectric substrate 2 by dicing (FIG. 3A), and the 3-1 electrode 14a is formed by selective plating. It forms in the inner wall by the side of the other side (lower surface) of the 2nd recessed part 4 (FIG.3 (b)). Thereafter, the third piezoelectric substrate 11 is bonded to the upper surface of the second piezoelectric substrate 2 (FIG. 3C), and the lower surface of the second piezoelectric substrate 2 bonded to the third piezoelectric substrate 11 is groove-shaped. The third recess 10 is formed by dicing at a position that does not overlap with the second recess 4 when viewed from the stacking direction (FIG. 3D). At this time, the third recess 10 may penetrate the second piezoelectric substrate 2. Furthermore, the selective plating is performed on the part between the third recesses 10 of the lower surface of the second piezoelectric substrate 2 and the part of the inner wall of the pressure chamber 3 from the lower surface of the second piezoelectric substrate 2, A 1-2 electrode 12b is formed (FIG. 3E).
次に、圧力室３の一部を構成する溝状の第４の凹部１５、および、溝状の第１の凹部９を、第１の圧電基板１の一方の面（上面）にダイシングにより交互に形成する（図４（ａ））。ただし、第４の凹部１５と第１の凹部９とを、上記の工程で作製された第２の圧電基板２の第１−２の電極１２ｂと第３の凹部１０とをそれぞれ覆うことができる位置に形成する。第１の圧電基板１の上面の第４の凹部１５と第１の凹部凹部９とに、選択めっきを施し、第１−１の電極１２ａおよび第２の電極１３をそれぞれ形成する（図４（ｂ））。図３で作製した第２の圧電基板２の下面に、凹部９、１５と電極１２ａ、１３を形成した第１の圧電基板１の上面を接着する。これにより圧力室３が出来上がる（図４（ｃ））。次に、第１の圧電基板１の他方の面（下面）の一面にめっきを施し、第３−２の電極１４ｂを形成する（図４（ｄ））。さらに、第１の圧電基板１の下面に、第２の凹部４と第３−１の電極１４ａとを形成した状態の第２の圧電基板２（図３（ｂ）参照）を接着し、第３の凹部１０と第１−２の電極１２ｂを上記と同様に形成する（図４（ｅ））。このように、凹部形成と電極形成と積層接合とを繰り返し、最後に第３の圧電基板１１を接合すことで、第１の圧電基板１と第２の圧電基板２とが交互に積層し、それらが第３の圧電基板１１に挟まれる圧電ブロック体５が完成する。 Next, the groove-shaped fourth recess 15 and the groove-shaped first recess 9 constituting a part of the pressure chamber 3 are alternately formed on one surface (upper surface) of the first piezoelectric substrate 1 by dicing. (FIG. 4A). However, the 4th recessed part 15 and the 1st recessed part 9 can each cover the 1st-2 electrode 12b and the 3rd recessed part 10 of the 2nd piezoelectric substrate 2 produced at said process, respectively. Form in position. The fourth recess 15 and the first recess recess 9 on the upper surface of the first piezoelectric substrate 1 are subjected to selective plating to form the 1-1 electrode 12a and the second electrode 13, respectively (FIG. 4 ( b)). The upper surface of the first piezoelectric substrate 1 on which the recesses 9 and 15 and the electrodes 12a and 13 are formed is bonded to the lower surface of the second piezoelectric substrate 2 manufactured in FIG. Thereby, the pressure chamber 3 is completed (FIG. 4C). Next, the other surface (lower surface) of the first piezoelectric substrate 1 is plated to form a third-second electrode 14b (FIG. 4D). Further, the second piezoelectric substrate 2 (see FIG. 3B) in which the second recess 4 and the 3-1 electrode 14a are formed is adhered to the lower surface of the first piezoelectric substrate 1, 3 recesses 10 and the 1-2 electrode 12b are formed in the same manner as above (FIG. 4E). In this way, the first piezoelectric substrate 1 and the second piezoelectric substrate 2 are alternately stacked by repeating the recess formation, electrode formation, and lamination bonding, and finally bonding the third piezoelectric substrate 11. The piezoelectric block body 5 in which they are sandwiched between the third piezoelectric substrates 11 is completed.
電極形成した圧電ブロック体５は分極処理が施される。分極処理工程は、圧電ブロック体５をシリコンオイルなどの絶縁体液体に浸し、例えば２００℃の温度に加熱し、形成した電極間に１~２ｋＶ／ｍｍ程度の電界を印加することで行われる。 Electrode-formed piezoelectric block body 5 is subjected to polarization treatment. The polarization treatment step is performed by immersing the piezoelectric block body 5 in an insulating liquid such as silicon oil, heating to a temperature of, for example, 200 ° C., and applying an electric field of about 1 to 2 kV / mm between the formed electrodes.
ここで、本発明の構造的クロストーク低減効果を示すシミュレーション結果を、図５を用いて説明する。図５は、第１の凹部９が第１の圧電基板１に形成され、第２の凹部４と第３の凹部１０が第２の圧電基板２に形成されたモデルで、図２中の領域Ｂのみを示している。また、駆動電圧を印加した際の圧力室３の変形を示しており、鎖線で変形前の輪郭を示している。 Here, a simulation result showing the structural crosstalk reduction effect of the present invention will be described with reference to FIG. FIG. 5 is a model in which the first concave portion 9 is formed in the first piezoelectric substrate 1 and the second concave portion 4 and the third concave portion 10 are formed in the second piezoelectric substrate 2. Only B is shown. Moreover, the deformation | transformation of the pressure chamber 3 at the time of applying a drive voltage is shown, and the outline before a deformation | transformation is shown with the dashed line.
変形前と変形後とを比べると圧力室３が収縮していることが分かる。この時、点Ｃにおける圧力室３が収縮する方向への全ノズル駆動時（全ての吐出口からインクが吐出）の変位量は、単ノズル駆動時（インクを吐出する吐出口の周囲の吐出口からインク吐出なし）の変位量の９８％程度となり、ほぼ同程度の変位量が得られる。これは第３の凹部１０があることで、第２の圧電基板２の領域Ｄが圧力室３方向へ変形しやすくなっており、隣接するノズルの影響を受けにくいためである。 Comparing before and after deformation, it can be seen that the pressure chamber 3 is contracted. At this time, the displacement amount when all nozzles are driven in the direction in which the pressure chamber 3 contracts at the point C (ink is discharged from all the discharge ports) is the same as that when the single nozzle is driven (discharge ports around the discharge ports discharging ink) To about 98% of the amount of displacement (no ink discharge), and almost the same amount of displacement is obtained. This is because the region D of the second piezoelectric substrate 2 is easily deformed in the direction of the pressure chamber 3 due to the presence of the third recess 10 and is not easily influenced by the adjacent nozzle.
比較例として、第１の実施例の第３の凹部１０が無いモデルのシミュレーション結果を、図６を用いて説明する。図６は、第１の凹部９が第１の圧電基板１に形成され、第２の凹部４が第２の圧電基板２に形成されたモデルで、図２中の領域Ｂに相当する領域のみを示している。駆動電圧を印加した際の圧力室３の変形を示しており、鎖線で変形前の輪郭を示している。 As a comparative example, a simulation result of a model without the third recess 10 of the first embodiment will be described with reference to FIG. FIG. 6 shows a model in which the first recess 9 is formed in the first piezoelectric substrate 1 and the second recess 4 is formed in the second piezoelectric substrate 2, and only the region corresponding to the region B in FIG. Is shown. The deformation | transformation of the pressure chamber 3 at the time of applying a drive voltage is shown, and the outline before a deformation | transformation is shown with the dashed line.
変形前と変形後とを比べると圧力室３が収縮していることが分かる。図５と同様に、点Ｃにおける圧力室３が収縮する方向への変位量を見てみると、全ノズル駆動時の変位量は、単ノズル駆動時の変位量の９０％程度であり、本発明に比べて１０％変位量が低減してしまう。 Comparing before and after deformation, it can be seen that the pressure chamber 3 is contracted. Similarly to FIG. 5, when looking at the displacement amount in the direction in which the pressure chamber 3 contracts at the point C, the displacement amount when driving all nozzles is about 90% of the displacement amount when driving single nozzles. Compared with the invention, the displacement amount is reduced by 10%.
以上説明したように、本発明の液体吐出ヘッドは、圧力室３の変形が周囲の圧力室の変形の有無に干渉されにくい構成であり、構造的クロストークを低減することが出来る。そのため、圧力室を二次元的に高密度に配置しても、小型で構造的クロストークを低減した均一な吐出性能を実現する液体吐出ヘッドを提供することが出来る。 As described above, the liquid discharge head of the present invention has a configuration in which the deformation of the pressure chamber 3 is not easily interfered with the presence or absence of the deformation of the surrounding pressure chamber, and structural crosstalk can be reduced. Therefore, even if the pressure chambers are two-dimensionally arranged at high density, it is possible to provide a liquid discharge head that realizes a uniform discharge performance that is small and has reduced structural crosstalk.
［第２の実施例］
本発明の第２の実施例を説明する。本実施例は、第１の実施例の圧電ブロック体１５とは構成が異なる。他の構成については同様である。したがって、圧電ブロック体の構成のみ説明する。
[Second Embodiment]
A second embodiment of the present invention will be described. This embodiment is different in configuration from the piezoelectric block body 15 of the first embodiment. The other configurations are the same. Therefore, only the configuration of the piezoelectric block body will be described.
図７に、本実施例を適用した液体吐出ヘッドの圧電ブロック体２５の断面図を示す。なお、図１の位置Ａ−Ａ’での断面である。圧電ブロック体２５は、第１の圧電基板２１と第２の圧電基板２２とを不図示の接着層を介して交互に複数積層されており、両端に第３の圧電基板３１が設けられた積層体である。 FIG. 7 is a cross-sectional view of the piezoelectric block body 25 of the liquid discharge head to which this embodiment is applied. It is a cross-section at position A-A ′ in FIG. 1. In the piezoelectric block body 25, a plurality of first piezoelectric substrates 21 and second piezoelectric substrates 22 are alternately stacked via an adhesive layer (not shown), and a third piezoelectric substrate 31 is provided at both ends. Is the body.
第１の圧電基板２１には、溝状の第４の凹部３５と溝状の第１の凹部２９とが一方の面に間隔を空けて交互に複数設けられている。第４の凹部３５は、第２の圧電基板２２に積層方向の開口を塞がれることで、圧力室２３となる。また、第２の圧電基板２２の両面には、互いに対向するように溝状の第３の凹部３０ａ、３０ｂがそれぞれ複数設けられ、さらに、一方の面には、溝状の第２の凹部２４が複数設けられている。第１の凹部２９と第３の凹部３０ａ、３０ｂは連通している。 The first piezoelectric substrate 21 is provided with a plurality of groove-shaped fourth recesses 35 and groove-shaped first recesses 29 alternately on one surface with an interval. The fourth recess 35 becomes the pressure chamber 23 by closing the opening in the stacking direction on the second piezoelectric substrate 22. Further, a plurality of groove-shaped third recesses 30a and 30b are provided on both surfaces of the second piezoelectric substrate 22 so as to face each other, and the groove-shaped second recess 24 is provided on one surface. Are provided. The first recess 29 and the third recesses 30a and 30b communicate with each other.
第１の基板２１と第２の基板２２とが積層することで、第２の凹部２４と第１の基板２１および第１の凹部２９と第３の凹部３０ａ、３０ｂとでそれぞれ空洞が形成されている。 By stacking the first substrate 21 and the second substrate 22, cavities are formed in the second recess 24, the first substrate 21, the first recess 29, and the third recesses 30a and 30b, respectively. ing.
圧力室２３の内壁の４面には、第１の電極３２が形成されている。第１の電極３２は、圧力室２３の内壁４面のうちの、第１の圧電基板２１によって圧力室２３を構成する３面に形成された第１−１の電極３２ａ、および、第２の圧電基板２２によって圧力室２３を構成する１面に形成された第１−２の電極３２ｂからなる。また、この第１の電極３２は、圧電ブロック体２５の後面に形成された電極に接続される。第１の圧電基板２１に形成された第１の凹部２９には、第２の電極３３が形成されている。 First electrodes 32 are formed on the four surfaces of the inner wall of the pressure chamber 23. The first electrode 32 includes a first electrode 32 a formed on the three surfaces constituting the pressure chamber 23 by the first piezoelectric substrate 21 among the four inner wall surfaces of the pressure chamber 23, and a second electrode 32 a. The piezoelectric substrate 22 includes a first-second electrode 32 b formed on one surface constituting the pressure chamber 23. The first electrode 32 is connected to an electrode formed on the rear surface of the piezoelectric block body 25. A second electrode 33 is formed in the first recess 29 formed in the first piezoelectric substrate 21.
第２の凹部２４の底面と、積層方向で第２の凹部２４を塞ぐ位置の第１の圧電基板２１には、それぞれ第３−１の電極３４ａと第３−２の電極３４ｂとが設けられ、これらの電極４３ａ、３４ｂで第３の電極３４が形成されている。 A 3-1 electrode 34a and a 3-2 electrode 34b are provided on the bottom surface of the second recess 24 and the first piezoelectric substrate 21 at the position where the second recess 24 is closed in the stacking direction. These electrodes 43a and 34b form a third electrode 34.
圧電ブロック体２５の後面の電極は、個々の圧力室２３に応じた個別の配線がなされ、圧電ブロック体２５の前面の不図示の電極は、第２の電極３３および第３の電極３４に共通の電極として配線される。これにより、圧力室２３の内壁に形成されている第１の電極３２と、第２の電極３３及び第３の電極３４との間で、別々に駆動電圧を印加することが出来る。 The electrodes on the rear surface of the piezoelectric block body 25 are individually wired according to the individual pressure chambers 23, and the electrodes (not shown) on the front surface of the piezoelectric block body 25 are common to the second electrode 33 and the third electrode 34. It is wired as an electrode. As a result, it is possible to apply drive voltages separately between the first electrode 32 formed on the inner wall of the pressure chamber 23, the second electrode 33, and the third electrode 34.
圧電ブロック体２５の作製方法を、図８と図９を用いて説明する。まず、第２の圧電基板２２の上面に、溝状の第２の凹部２４、および、溝状の第３の凹部３０ｂを、ダイシングにより形成し（図８（ａ））、第２の凹部２４の下面側の内壁に選択めっきを施し、第３−１の電極３４ａを形成する（図８（ｂ））。その後、第２の圧電基板２２の上面に、第３の圧電基板３１を接着する（図８（ｃ））。第３の圧電基板３１に接着した第２の圧電基板２２の下面に溝状の第３の凹部３０ａを、積層方向からみて第３の凹部３０ｂと重なる位置にダイシングにより形成する（図８（ｄ））。このとき、第３の凹部３０ａは第２の圧電基板２２を貫通してもよい。さらに、第２の圧電基板２２の下面から、圧力室２３の内壁面を構成する面に選択めっきを施し、第１−２の電極３２ｂを形成する（図８（ｅ））。 A method for producing the piezoelectric block body 25 will be described with reference to FIGS. First, the groove-shaped second recess 24 and the groove-shaped third recess 30b are formed on the upper surface of the second piezoelectric substrate 22 by dicing (FIG. 8A), and the second recess 24 is formed. The inner wall on the lower surface side is selectively plated to form a 3-1 electrode 34a (FIG. 8B). Thereafter, the third piezoelectric substrate 31 is bonded to the upper surface of the second piezoelectric substrate 22 (FIG. 8C). A groove-shaped third recess 30a is formed on the lower surface of the second piezoelectric substrate 22 bonded to the third piezoelectric substrate 31 by dicing at a position overlapping the third recess 30b when viewed from the stacking direction (FIG. 8D). )). At this time, the third recess 30 a may penetrate the second piezoelectric substrate 22. Further, selective plating is performed on the surface constituting the inner wall surface of the pressure chamber 23 from the lower surface of the second piezoelectric substrate 22 to form the 1-2 electrode 32b (FIG. 8E).
次に、圧力室２３の一部を構成する溝状の第４の凹部３５、および、溝状の第１の凹部２９を、第１の圧電基板２１の上面にダイシングにより交互に形成する（図９（ａ））。ただし、第４の凹部３５と第１の凹部２９とを、上記の工程で作製された第２の圧電基板２２の第１の電極３２ｂと第３の凹部３０ａとをそれぞれ覆うことができる位置に形成する。第１の圧電基板２１の上面の第４の凹部３５と第１の凹部２９とに、選択めっきを施し、第１−１の電極３２ａおよび第２の電極３３を形成する（図９（ｂ））。次に、図８で作製した第２の圧電基板２２の下面に第１の圧電基板２１の上面を接着する。これにより圧力室２３が出来上がる。（図９（ｃ））。次に、第１の圧電基板２１の他方の面（下面）の一面にめっきを施し、第３−２の電極３４ｂを形成する（図９（ｄ））。さらに、第１の圧電基板２１の下面から第１の凹部２９に至る貫通路２９ｂを、ダイシングにより形成する（図９（ｅ））。次に、第１の圧電基板２１の下面に形成した第３−２の電極３４ｂに、第２の凹部２４と第３−１の電極３４ａとが形成されている第２の圧電基板２２（図８（ｂ）参照）を接着し、第３の凹部３０ａと第１−２の電極３２ｂを上記と同様に形成する（図９（ｆ））。このように、凹部形成と電極形成と積層接合を繰り返し、最後に不図示の第３の圧電基板を接合することで、本実施例の圧電ブロック体２５が作製される。 Next, groove-shaped fourth recesses 35 and groove-shaped first recesses 29 constituting a part of the pressure chamber 23 are alternately formed on the upper surface of the first piezoelectric substrate 21 by dicing (see FIG. 9 (a)). However, the 4th recessed part 35 and the 1st recessed part 29 are in the position which can each cover the 1st electrode 32b and the 3rd recessed part 30a of the 2nd piezoelectric substrate 22 produced at said process. Form. Selective plating is performed on the fourth recess 35 and the first recess 29 on the upper surface of the first piezoelectric substrate 21 to form the first-first electrode 32a and the second electrode 33 (FIG. 9B). ). Next, the upper surface of the first piezoelectric substrate 21 is bonded to the lower surface of the second piezoelectric substrate 22 manufactured in FIG. Thereby, the pressure chamber 23 is completed. (FIG. 9 (c)). Next, plating is performed on one surface of the other surface (lower surface) of the first piezoelectric substrate 21 to form a 3-2 electrode 34b (FIG. 9D). Further, a through path 29b from the lower surface of the first piezoelectric substrate 21 to the first recess 29 is formed by dicing (FIG. 9E). Next, the second piezoelectric substrate 22 (see FIG. 3) in which the second recesses 24 and the 3-1 electrode 34a are formed on the third and second electrodes 34b formed on the lower surface of the first piezoelectric substrate 21. 8 (b)) is bonded, and the third recess 30a and the 1-2 electrode 32b are formed in the same manner as described above (FIG. 9F). In this manner, the formation of the recesses, the formation of the electrodes, and the lamination bonding are repeated, and finally the third piezoelectric substrate (not shown) is bonded, whereby the piezoelectric block body 25 of this embodiment is manufactured.
以上のように作製された本実施例の液体吐ヘッドでは、第３の凹部が２つの部分３０ａ、３０ｂに分かれており、第１の凹部２９を介してつながっている。そのため、第１の実施例で示した領域Ｄのみならず、第１の圧電基板２１の、領域Ｄと第１の凹部２９を挟んで対向する領域においても変形しやすくなっている。したがって、圧力室２３の変形が、より干渉されにくくなり、構造的クロストークを低減することが出来る。 In the liquid ejection head according to the present embodiment manufactured as described above, the third recess is divided into two portions 30 a and 30 b and is connected via the first recess 29. Therefore, not only the region D shown in the first embodiment but also the region of the first piezoelectric substrate 21 facing the region D across the first recess 29 is easily deformed. Therefore, the deformation of the pressure chamber 23 is less likely to be interfered, and structural crosstalk can be reduced.
［第３の実施例］
本発明の第３の実施例を説明する。本実施例は、上述の実施例の圧電ブロック体とは構成が異なる。他の構成については同様である。したがって、圧電ブロック体の構成のみ説明する。
[Third embodiment]
A third embodiment of the present invention will be described. This embodiment is different in configuration from the piezoelectric block body of the above-described embodiment. The other configurations are the same. Therefore, only the configuration of the piezoelectric block body will be described.
図１０に本実施例を適用した液体吐出ヘッドの圧電ブロック体４５の断面図を示す。なお、図１の位置Ａ−Ａ’での断面である。圧電ブロック体４５は、第１の圧電基板４１と第２の圧電基板４２とを不図示の接着層を介して交互に複数積層されており、両端に第３の圧電基板５１が設けられた積層体である。 FIG. 10 shows a cross-sectional view of the piezoelectric block body 45 of the liquid discharge head to which this embodiment is applied. It is a cross-section at position A-A ′ in FIG. 1. In the piezoelectric block body 45, a plurality of first piezoelectric substrates 41 and second piezoelectric substrates 42 are alternately stacked via an adhesive layer (not shown), and a third piezoelectric substrate 51 is provided at both ends. Is the body.
第１の圧電基板４１には、溝状の第４の凹部５５と凹状の第１の凹部４９とが一方の面に間隔を空けて交互に複数設けられている。第４の凹部５５は、第２の圧電基板４２に積層方向の開口を塞がれることで圧力室４３となる。また、第２の圧電基板４２には、一方の面に第２の凹部４４と、第２の凹部４４を挟むように、第３の凹部５０ａ、５０ｂが設けられている。第２の凹部４４と第３の凹部５０ａ、５０ｂは連通している。 The first piezoelectric substrate 41 is provided with a plurality of groove-like fourth recesses 55 and recess-like first recesses 49 alternately on one surface at intervals. The fourth recess 55 becomes the pressure chamber 43 by closing the opening in the stacking direction with the second piezoelectric substrate 42. The second piezoelectric substrate 42 is provided with third recesses 50a and 50b on one surface so as to sandwich the second recess 44 and the second recess 44 therebetween. The second recess 44 and the third recesses 50a and 50b communicate with each other.
第１の基板４１と第２の基板４２とが積層することで、第２の凹部４４と第３の凹部５０ａ、５０ｂおよび第１の凹部４９と第２の基板４２とでそれぞれ空洞が形成されている。 By stacking the first substrate 41 and the second substrate 42, cavities are formed in the second recess 44 and the third recesses 50a and 50b, and the first recess 49 and the second substrate 42, respectively. ing.
圧力室４３の内壁の４面には、第１の電極５２が形成されている。第１の電極５２は、圧力室４３の内壁４面のうちの、第１の圧電基板４１によって圧力室４３を構成する３面に形成された第１−１の電極５２ａ、および、第２の圧電基板４２によって圧力室４３を構成する１面に形成された第１−２の電極５２ｂからなる。また、この第１の電極５２は、圧電ブロック体４５の後面に形成された電極に接続される。第１の圧電基板４１に形成された第１の凹部４９の内壁の３面には、第２の電極５３が形成されている。 First electrodes 52 are formed on four surfaces of the inner wall of the pressure chamber 43. The first electrode 52 includes a first electrode 52 a formed on the three surfaces constituting the pressure chamber 43 by the first piezoelectric substrate 41 among the four inner walls of the pressure chamber 43, and a second electrode 52 a The piezoelectric substrate 42 includes a first-second electrode 52 b formed on one surface constituting the pressure chamber 43. Further, the first electrode 52 is connected to an electrode formed on the rear surface of the piezoelectric block body 45. On the three surfaces of the inner wall of the first recess 49 formed on the first piezoelectric substrate 41, a second electrode 53 is formed.
第２の凹部４４の底面と、積層方向で第２の凹部４４を塞ぐ位置の第１の圧電基板４１にはそれぞれ第３−１の電極５４ａと第３−２の５４ｂとが設けられ、これらの電極５４ａ、５４ｂで第３の電極５４が形成されている。 A 3-1 electrode 54a and a 3-2 54b are respectively provided on the bottom surface of the second recess 44 and the first piezoelectric substrate 41 at a position closing the second recess 44 in the stacking direction. The third electrode 54 is formed of the electrodes 54a and 54b.
圧電ブロック体４５の後面の電極は、個々の圧力室４３に応じた個別の配線がなされ、圧電ブロック体４５の前面の電極は、圧力室４第２の電極５３と第３の電極５４に共通の電極として配線される。これにより、圧力室４３の内壁に形成されている第１の電極５２と、第２の電極５３および第３の電極５４との間で、別々に駆動電圧を印加することが出来る。 The electrodes on the rear surface of the piezoelectric block body 45 are individually wired according to the individual pressure chambers 43, and the electrodes on the front surface of the piezoelectric block body 45 are common to the second electrode 53 and the third electrode 54 of the pressure chamber 4. It is wired as an electrode. As a result, it is possible to apply drive voltages separately between the first electrode 52 formed on the inner wall of the pressure chamber 43, the second electrode 53, and the third electrode 54.
以上のように構成した液体吐出ヘッドでは、第２の圧電基板４２において第３の凹部５０ａ、５０ｂと第２の凹部４４とが連通している。そのため、第１の圧電基板４１と第２の圧電基板４２とが接する部分が少なく、また、積層方向から見て、隣接する圧力室４３同士の間の中心で第１の圧電基板４１と第２の圧電基板４２とが接する。これにより、特に積層方向で隣接する圧力室４３の影響が小さくなるため、圧力室４３の内壁の変形が、変形しない圧力室４３により干渉されにくくなり、構造的クロストークを低減することが出来る。 In the liquid ejection head configured as described above, the third recesses 50 a and 50 b and the second recess 44 communicate with each other in the second piezoelectric substrate 42. Therefore, there are few portions where the first piezoelectric substrate 41 and the second piezoelectric substrate 42 are in contact with each other, and the first piezoelectric substrate 41 and the second piezoelectric substrate 41 are in the center between the adjacent pressure chambers 43 when viewed from the stacking direction. In contact with the piezoelectric substrate 42. As a result, the influence of the pressure chambers 43 adjacent to each other in the stacking direction is reduced, so that the deformation of the inner wall of the pressure chamber 43 is less likely to be interfered by the pressure chambers 43 that are not deformed, and structural crosstalk can be reduced.
本発明の液体吐出ヘッドは、例えば、液滴を吐出する印刷装置や塗布装置あるいは造形装置などに適用可能である。 The liquid discharge head of the present invention can be applied to, for example, a printing apparatus, a coating apparatus, or a modeling apparatus that discharges droplets.
１、２１、４１ 第１の圧電基板
２、２２、４２ 第２の圧電基板
３、２３、４３ 圧力室
４、２４、４４ 第２の凹部
５、２５、４５ 圧電ブロック体
７ 吐出口
９、２９、４９ 第１の凹部
１０、３０、５０ 第３の凹部
１５、３５、５５ 第４の凹部
９０ 液体吐出ヘッド
1, 2, 41 First piezoelectric substrate 2, 22, 42 Second piezoelectric substrate 3, 23, 43 Pressure chamber 4, 24, 44 Second recess 5, 25, 45 Piezoelectric block 7 Discharge port 9, 29 , 49 First recess 10, 30, 50 Third recess 15, 35, 55 Fourth recess 90 Liquid discharge head
Claims (5)
一方の面に第１の凹部と第４の凹部とが交互に複数設けられた第１の基板と、第２の凹部と第３の凹部がそれぞれ複数設けられた第２の基板とが交互に積層された積層体を有し、
前記第２の凹部は、前記第２の基板の、前記第１の基板の前記一方の面と接しない面に設けられ、積層方向から見て前記第２の凹部と前記第４の凹部とが重なっており、
前記圧力室が、前記第４の凹部と前記第２の基板の、前記第１の基板の前記一方の面と接する面とで形成されており、
前記第１の凹部または前記第２の凹部と、前記第３の凹部が連通していることを特徴とする、液体吐出ヘッド。 A liquid that communicates with a discharge port that discharges the liquid, a plurality of pressure chambers are provided for storing the liquid discharged from the discharge port, and discharges the liquid from the discharge port according to contraction deformation of the pressure chamber In the liquid discharge head, wherein a plurality of recesses extending in the same direction as the pressure chamber are provided around each pressure chamber, and at least a part of the pressure chamber is configured by a piezoelectric member.
A first substrate provided with a plurality of alternating first and fourth recesses on one surface and a second substrate provided with a plurality of second and third recesses alternately Having a laminated body,
The second recess is provided on a surface of the second substrate that is not in contact with the one surface of the first substrate, and the second recess and the fourth recess are seen from the stacking direction. Overlap,
The pressure chamber is formed by the fourth recess and a surface of the second substrate in contact with the one surface of the first substrate;
The liquid discharge head, wherein the first recess or the second recess and the third recess communicate with each other.
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