JP2013124373A - Vapor deposition apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a highly precise thin film pattern and to improve film deposition efficiency.SOLUTION: A vapor deposition apparatus includes in a vacuum chamber 1: a vapor deposition source 2; a substrate holder 3 which houses an electromagnet therein and holds a substrate 10 to face the vapor deposition source 2; a composite mask 4 which has such a structure that a plurality of opening patterns having the same shape as that of a thin film pattern are formed in a visible light transmitting long film at the same alignment pitch as that of the thin film pattern side by side in the major axis direction of the film, and a plurality of penetrated opening parts each having a size larger than the shape of the opening pattern are formed in accordance with the opening pattern in a magnetic metal thin plate stuck to the surface on the vapor deposition source 2 side of the film, and which moves stepwise in parallel with the surface of the substrate holder 3 through between the vapor deposition source 2 and the substrate holder 3 in the major axis direction of the film; a delivering reel 5 which is provided to one side with the substrate holder 3 in-between and delivers the composite mask 4; and a winding-up reel 6 which is provided to the other side with the substrate holder 3 in-between and winds up the composite mask 4.

Description

  The present invention relates to a vapor deposition apparatus that forms a plurality of thin film patterns having a predetermined shape on a substrate through a mask and arranges them at a constant arrangement pitch. In particular, the present invention enables formation of a high-definition thin film pattern and improves film formation efficiency. The present invention relates to a vapor deposition apparatus that can be improved.

  A conventional vapor deposition apparatus closely attaches a metal mask made of a ferromagnetic material provided with a plurality of openings corresponding to a predetermined film formation pattern to the substrate so as to cover one surface of the substrate, and is disposed on the other surface side of the substrate. The thin film pattern is formed by attaching the vapor deposition material to one surface of the substrate through the opening in the vacuum chamber using the magnetic force of the magnet (see, for example, Patent Document 1).

JP 2009-164020 A

  However, in such a conventional vapor deposition apparatus, in general, a mask is made by forming openings corresponding to a thin film pattern on a metal plate having a thickness of several tens of μm to several mm by etching or the like. When the thickness of the metal plate is thick, it is difficult to form the opening with high accuracy, and it is difficult to form a high-definition thin film pattern of, for example, 300 dpi or more due to the position shift or warpage due to the thermal expansion of the metal plate.

  In addition, after the mask is used for film formation several times, it is necessary to break and recover the vacuum in the deposition chamber and attach a new mask to evacuate the deposition chamber again. Even in an in-line deposition apparatus that can sequentially supply a plurality of substrates, the film formation efficiency could not be improved.

  In view of the above, an object of the present invention is to provide a vapor deposition apparatus that can cope with such problems and can form a high-definition thin film pattern and improve the film formation efficiency.

  In order to achieve the above object, a vapor deposition apparatus according to the present invention is a vapor deposition apparatus that forms a plurality of thin film patterns having a predetermined shape on a substrate through a mask at a constant arrangement pitch. A deposition source that heats and evaporates the deposition material, a substrate holder that contains an electromagnet and holds the substrate facing the deposition source, and a long film that transmits visible light and has the same shape as the thin film pattern A plurality of opening patterns are formed side by side in the major axis direction of the film at the same arrangement pitch as the arrangement pitch of the thin film pattern, and correspond to the opening pattern on a magnetic metal thin plate bonded to the surface on the vapor deposition source side of the film Thus, a structure is formed in which a plurality of openings penetrating larger than the shape of the opening pattern are formed, and the space between the vapor deposition source and the substrate holder is parallel to the surface of the substrate holder. A composite mask that moves stepwise in the long axis direction of the film; provided on one side with the substrate holder in between; a delivery reel that delivers the composite mask; provided on the other side with the substrate holder in between; A take-up reel that winds up the composite mask.

  With such a configuration, the substrate holder is held facing the vapor deposition source by the substrate holder with a built-in electromagnet, and a plurality of opening patterns having the same shape as the thin film pattern are formed on a long film that transmits visible light. A plurality of apertures penetrating through the magnetic metal thin plate bonded to the film deposition source side surface with the same arrangement pitch as the aperture pattern corresponding to the aperture pattern. The composite mask in which the part is formed is sent out from the delivery reel and taken up on the take-up reel, and is stepped between the vapor deposition source and the substrate holder parallel to the surface of the substrate holder in the longitudinal direction of the film. The magnetic mask thin plate of the composite mask is attracted with an electromagnet, the film is brought into close contact with the substrate surface, and the vapor deposition material is evaporated with a vapor deposition source to open the composite mask opening pattern Through to form side by side thin film pattern of a predetermined shape on the substrate at a constant arrangement pitch.

  Preferably, transport means for sequentially transporting the plurality of substrate holders in a direction intersecting with the moving direction of the composite mask is further provided, and each substrate holder is moved stepwise to be disposed opposite the deposition source. desirable.

  More preferably, the vacuum chamber is provided with a cleaning area by partitioning at least the take-up reel side of the film forming area including the vapor deposition source and the substrate holder by a side wall in which an opening through which the composite mask can pass is formed. The composite mask may be configured to be able to remove the vapor deposition material attached to the composite mask by irradiating the composite mask with a laser beam, an ion beam or an electron beam from the magnetic metal thin plate side.

  In this case, the cleaning area is provided on both the delivery reel side and the take-up reel side across the film formation area, and the delivery reel and the take-up reel rotate forward and backward to reciprocate the composite mask. It is configured to be movable, and one mask area where film formation of the composite mask has been completed is moved to one of the cleaning areas, and another mask area that has not yet been formed is moved to the film formation area to complete film formation. It is desirable to move the other mask area to the other cleaning area and move the one mask area that has been cleaned to the film forming area.

  More preferably, the substrate holder is configured to be movable in a two-dimensional direction in a plane parallel to a holding surface for holding the substrate, and to be rotatable about the center of the holding surface, and is previously attached to the composite mask. The mask-side alignment mark formed and the substrate-side alignment mark previously formed on the substrate held by the substrate holder are photographed at the same time, and based on the photographed image, the marks are in a fixed positional relationship with each other. It is desirable to provide an image pickup means for moving the substrate holder so that the composite mask and the substrate can be aligned.

  According to the vapor deposition apparatus of the present invention, a composite mask to be used forms a thin film with an opening pattern in accordance with the thin film pattern of the substrate, and a magnetic metal thin plate having an opening larger than the opening pattern is bonded to the film. Thus, the opening pattern can be formed with high accuracy and the position of the opening pattern can be maintained. Therefore, for example, a high-definition thin film pattern of 300 dpi or more can be easily formed.

  In addition, since a long composite mask can be moved stepwise in the major axis direction of the mask between the deposition source and the substrate holder in parallel with the surface of the substrate holder, film formation using one mask region is possible. When finished, the composite mask can be stepped without breaking the vacuum in the vacuum chamber so that other mask areas can be used. Accordingly, film formation efficiency can be improved.

It is a figure which shows 1st Embodiment of the vapor deposition apparatus by this invention, (a) is front sectional drawing, (b) is plane sectional drawing. It is a top view which shows one structural example of the board | substrate used in the said 1st Embodiment. It is a figure which shows the composite mask used for the said 1st Embodiment, (a) is a plane perspective view, (b) is an OO line cross-sectional arrow view. It is explanatory drawing shown about the washing | cleaning of the said composite film. It is a flowchart explaining the operation | movement of the said 1st Embodiment. It is front sectional drawing which shows the modification of the said 1st Embodiment. It is a figure which shows 2nd Embodiment of the vapor deposition apparatus by this invention, (a) is plane sectional drawing, (b) is side sectional drawing.

  Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. 1A and 1B are views showing a first embodiment of a vapor deposition apparatus according to the present invention, in which FIG. 1A is a front sectional view and FIG. 1B is a plan sectional view. This vapor deposition apparatus forms a plurality of thin film patterns having a fixed shape on a substrate 10 through a mask by arranging them at a constant arrangement pitch. In the vacuum chamber 1, a vapor deposition source 2, a substrate holder 3, and a composite A mask 4, a delivery reel 5, a take-up reel 6, a transport unit 7, and an imaging unit 8 are provided.

  The vapor deposition source 2 heats and vaporizes the vapor deposition material put in the crucible, and includes a heating source (not shown) for heating the crucible, for example. An open / close shutter 9 is provided above the crucible so that the film thickness of the thin film pattern formed can be controlled by controlling the opening time.

  A substrate holder 3 is provided above the vapor deposition source 2. The substrate holder 3 holds a substrate 10 on a flat holding surface in a state of facing the vapor deposition source 2, and includes an electromagnet (not shown).

  A composite mask 4 is stretched between the vapor deposition source 2 and the substrate holder 3. This composite mask 4 shields the portion outside the stripe-shaped thin film pattern formation region 11 of the substrate 10 as shown in FIG. 2 held by the substrate holder 3, and visible light as shown in FIG. A plurality of stripe-shaped opening patterns 13 having the same shape as the thin film pattern are arranged on the long film 12 that passes through the film 12 in the long axis direction of the film 12 at the same arrangement pitch as the thin film pattern. A structure in which a plurality of openings 15 penetrating larger than the shape of the opening pattern 13 are formed in a magnetic metal thin plate 14 made of, for example, nickel or a nickel alloy, which is bonded to the surface on the source 2 side, corresponding to the opening pattern 13. None, so as to step and move in the long axis direction (arrow direction shown in FIG. 3) of the film 12 in close proximity to the surface of the substrate 10 held by the substrate holder 3 You have me. Further, the magnetic metal thin plate 14 has a substrate-side alignment mark 27 (see FIG. 2) formed in advance on the substrate 10 in a portion outside the formation region of the plurality of openings 15 as shown in FIG. Correspondingly, a mask side alignment mark 16 is formed.

  A delivery reel 5 is provided on one side (left side in FIG. 1) with the substrate holder 3 in between. The delivery reel 5 holds the composite mask 4 wound up in a roll shape and delivers it by a fixed amount. The delivery reel 5 is supported by a shaft 18 connected to the rotation shaft of the delivery motor 17 and rotates forward and backward. It is like that.

  A take-up reel 6 is provided on the other side (right side in FIG. 1) with the substrate holder 3 in between. The take-up reel 6 takes up the composite mask 4 by a certain amount, and is supported by a shaft 20 connected to the rotation shaft of the take-up motor 19 so as to rotate forward and backward. A constant tension is applied to the composite mask 4 by applying rotational forces in opposite directions to the delivery reel 5 and the take-up reel 6, respectively.

  Here, in the vacuum chamber 1, the delivery reel 5 side and the take-up reel 6 side of the film formation area 23 including the vapor deposition source 2 and the substrate holder 3 are separated by the side wall 22 in which the opening 21 through which the composite mask 4 can pass is formed. The washing area 24 is provided on both sides. In the cleaning area 24, the composite mask 4 can be irradiated with a laser beam, an ion beam, or an electron beam from the magnetic metal thin plate 14 side to remove the vapor deposition material attached to the composite mask 4. Here, a case where the laser 25 is provided and cleaning is performed with a laser beam will be described.

  In this case, the mask area used for film formation is cleaned by rotating the delivery reel 5 and the take-up reel 6 forward and backward and reciprocating the composite mask 4 in the directions of arrows A and B shown in FIG. More specifically, as shown in FIG. 4A, when the film formation using the first mask region 26A is completed, the composite mask 4 is wound on the take-up reel 6 by a certain amount, and the first cleaning area is obtained. At 24A, the first mask region 26A is cleaned, and at the same time, the film formation using the second mask region 26B is performed, and the film formation using the second mask region 26B is completed as shown in FIG. Then, the composite mask 4 is rewound onto the delivery reel 5 by a certain amount, and the second mask area 26B is cleaned in the second cleaning area 24B, and at the same time, film formation is performed using the cleaned first mask area 26A. Then, when the film formation using the first mask region 26A is completed again as shown in FIG. 5C, the composite mask 4 is wound on the take-up reel 6 by a certain amount, and the first cleaning area 24A performs the first cleaning. Re-cleaning of one mask area 26A Then run the film formation using the second mask region 26B cleaning is completed at the same time again. By repeatedly executing this, the usage efficiency of the composite mask 4 can be improved. Further, when the film formation-cleaning-film formation using the first and second mask regions 26A and 26B is executed a predetermined number of times, the use of the mask region is finished and the composite mask 4 is fixed. The next new mask area is used for film formation after being wound on the take-up reel 6 by the amount.

  A transport means 7 is provided so that the substrate holder 3 can be transported in a direction crossing the moving direction of the composite mask 4. This transport means 7 holds a plurality of substrate holders 3 and transports them in the order of arrows C shown in FIG. 1 in order at regular intervals. Each substrate holder 3 is held by each substrate holder 3 by step movement. The substrate 10 is arranged to face the vapor deposition source 2. The transport means 7 also includes an alignment mechanism (not shown) that moves each substrate holder 3 individually in a two-dimensional direction in a plane parallel to the holding surface of the substrate 10 and rotates the center of the holding surface as an axis. Is provided. Furthermore, the transport means 7 is provided in the vacuum chamber 1 in a closed loop structure, and can circulate and transport a plurality of substrate holders 3. Furthermore, a supply area in which the substrate 10 can be supplied without breaking the vacuum in the vacuum chamber 1 and a carry-out area in which the substrate 10 can be carried out are provided in the middle of the loop-shaped transfer means 7. When the area is reached, the substrate 10 carried from the outside of the vacuum chamber 1 to the supply area is held by, for example, a carry-in robot. It can be taken out of the room 1.

  An imaging unit 8 is provided so as to be able to advance and retreat between the inside of the film forming area 23 and the retracted position outside the film forming area 23. This imaging means 8 is a two-dimensional camera that simultaneously images the mask-side alignment mark 16 of the composite mask 4 and the substrate-side alignment mark 27 formed in advance on the substrate 10 in the film-forming area 23, and is a two-dimensional camera. Based on the above, the alignment mechanism is driven to move the substrate holder 3 so that both marks are in a fixed positional relationship with each other, so that the composite mask 4 and the substrate 10 can be aligned.

Next, operation | movement of the vapor deposition apparatus comprised in this way is demonstrated with reference to the flowchart of FIG.
First, in step S <b> 1, the substrate 10 is transported by the transport unit 7 and positioned above the vapor deposition source 2. On the other hand, the first mask region 26 </ b> A of the composite mask 4 is disposed to face the substrate 10. In this state, the imaging unit 8 moves from the retracted position into the film forming area 23 and is positioned directly below the mask side alignment mark 16 provided in the first mask region 26A of the composite mask 4. Then, the masking alignment mark 16 and the substrate alignment mark 27 provided on the substrate 10 are simultaneously photographed by the image pickup means 8, and the photographed image is processed by a control device (not shown) so that both marks have a certain positional relationship. As described above (for example, the alignment position provided in the substrate holder 3 is driven and controlled) so that the alignment between the first mask region 26A and the substrate 10 is executed.

  In step S2, the electromagnet of the substrate holder 3 is turned on, the magnetic metal thin plate of the composite mask 4 is attracted by the magnetic force of the electromagnet, and the film 12 is brought into close contact with the surface of the substrate 10. Then, the shutter 9 of the vapor deposition source 2 is opened for a certain time, and vapor deposition is executed. As a result, the vapor deposition material evaporated from the vapor deposition source 2 adheres to the thin film pattern formation region 11 of the substrate 10 through the opening pattern 13 of the composite mask 4, thereby forming a thin film pattern with a constant film thickness.

  In step S3, the shutter 9 of the vapor deposition source 2 is closed, the electromagnet of the substrate holder 3 is turned off, and the film 12 of the composite mask 4 is peeled from the surface of the substrate 10. At this time, a peeling means may be provided on the film 12 surface side of the composite mask 4, and the composite mask 4 may be pushed down by the peeling means to peel off.

  In step S4, the transport means 7 is driven and the film-formed substrate 10 is unloaded in the direction of arrow C in FIG. 1, while a new substrate 10 is loaded and above the vapor deposition source 2 in the film-forming area 23. Positioned.

  In step S5, it is determined whether or not the number of depositions using the first mask region 26A has reached a predetermined number. Here, when the film formation is performed 100 times using the first mask region 26A, for example, “YES” determination is made in step S5, and the process proceeds to step S6. If step S5 is “NO”, the process returns to step S1, and steps S1 to S5 are repeatedly executed until step S5 is “YES”.

  In step S6, the composite mask 4 is wound on the take-up reel 6 by a certain amount and the first mask area 26A is moved to the first cleaning area 24A, while the second mask area 26B is formed in the film forming area. 23.

  In step S7, the alignment between the substrate 10 and the second mask region 26B of the composite mask 4 is executed in the same manner as in step S1.

  In step S8, the vapor deposition material is deposited on the new substrate 10 using the second mask region 26B in the same manner as in step S2, and a thin film pattern is formed. At the same time, in the first cleaning area 24 </ b> A, laser light is irradiated from the magnetic metal thin plate 14 side of the composite mask 4, and the vapor deposition material attached to the edge of the opening pattern 13 of the film 12 is removed.

  In step S9, as shown in FIG. 5, a predetermined number of repetitions of the number of repetitions of film formation-cleaning-film formation using the first mask area 26A and the second mask area 26B of the composite mask 4 are performed. It is determined whether or not. If “NO” determination is made here, the process proceeds to step S10.

  In step S10, the composite mask 4 is rewound onto the delivery reel 5 by a fixed amount, the second mask area 26B is moved to the second cleaning area 24, and the cleaned first mask area 26A is formed. It moves to the film area 23 and is positioned above the vapor deposition source 2. Then, returning to step S1, steps S1 to S10 are repeatedly executed until “YES” is determined in step S9. In this case, in step S2, the cleaning of the second mask region 26B is performed in parallel with the film formation using the first mask region 26A.

  In step S9, if “YES” is determined, the film formation using the first mask region 26A and the second mask region 26B of the composite mask 4 is terminated. Then, the composite mask 4 is wound on the take-up reel 6 by a certain amount, the next new mask area is positioned above the vapor deposition source 2, and film formation using the new mask area is started.

  In the above description, the case where the opening pattern 13 of the composite mask 4 has a stripe shape has been described. However, the present invention is not limited to this, and the opening pattern 13 has a plurality of small units formed by a plurality of elongated bridges. May be separated.

  FIG. 6 shows a modification of the first embodiment. The path of the composite mask 4 is bent vertically upward by the guide roller 28 to have a vertical structure. Thereby, the installation area of an apparatus can be narrowed.

FIG. 7 is a view showing a second embodiment of the vapor deposition apparatus according to the present invention. Here, a different part from 1st Embodiment is demonstrated.
In the second embodiment, a plurality of types of vapor deposition materials can be formed in the same vacuum chamber 1, and a plurality of film formation areas 23 having different vapor deposition materials are arranged in the order of film formation on the substrate 10. For example, it is a vapor deposition apparatus for an organic EL display substrate capable of forming a plurality of types of thin film patterns. Hereinafter, a case where the substrate 10 is a TFT substrate for organic EL display will be described.

  The plurality of film formation areas 23 are respectively red (hereinafter referred to as “R”) organic EL layer film formation area 23r, green (hereinafter referred to as “G”) organic EL layer film formation area 23g, and blue (hereinafter referred to as “B”). The organic EL layer deposition area 23b. Further, in the R organic EL layer deposition area 23r, a hole injection layer deposition area 29r, a hole transport layer deposition area 30r, an R light emitting layer deposition area 31r, and an electron transport layer deposition area 32r are provided in this order. Thus, an R organic EL layer can be formed by sequentially forming a hole injection layer, a hole transport layer, an R light emitting layer, and an electron transport layer. Similarly, the G organic EL layer deposition area 23g includes a hole injection layer deposition area 29g, a hole transport layer deposition area 30g, a G light emitting layer deposition area 31g, and an electron transport layer deposition area 32g. A G organic EL layer can be formed in this order. Further, in the B organic EL layer forming area 23b, a hole injection layer forming area 29b, a hole transport layer forming area 30b, a B light emitting layer forming area 31b, and an electron transport layer forming area 32b are provided in this order. Thus, a B organic EL layer can be formed.

  Further, in each of the film formation areas 29r to 32r in the R organic EL layer film formation area 23r, an R-compatible composite mask 4r is provided so as to be movable in a direction intersecting with the arrangement direction of the film formation areas 29r to 32r. First and second cleaning areas 24A and 24B are provided on both sides of each of the film formation areas 29r to 32r in the moving direction of the composite mask 4r. Similarly, composite masks 4g and 4b of corresponding colors are formed in the respective film forming areas 29g to 32g and 29b to 32b in the G organic EL layer forming area 23g and in the B organic EL layer forming area 23b. 29g to 32g and 29b to 32b are provided so as to be movable in a direction crossing the arrangement direction of the composite masks 4g and 4b. Two cleaning areas 24A and 24B are provided.

  Further, the plurality of substrate holders 3 can be sequentially moved in the direction in which the respective film formation areas are arranged, and the plurality of TFT substrates 10 held by the respective substrate holders 3 can be positioned above the vapor deposition source 2 in each film formation area. A conveying means 7 is provided on the surface.

The operation of the second embodiment will be described below.
First, the first TFT substrate 10 held by the substrate holder 3 is transported by the transport means 7 to the hole injection layer deposition area 29r in the R organic EL layer deposition area 23r, and a deposition source for the hole injection layer is obtained. 2 above.

  Next, after the alignment of the TFT substrate 10 with respect to the first mask region 26A of the R composite mask 4r is executed, the electromagnet of the substrate holder 3 is turned on and the magnetic metal thin plate 14 of the composite mask 4r is attracted to the TFT substrate 10. The film 12 of the composite mask 4r is brought into close contact with the surface.

  Subsequently, the shutter 9 of the evaporation source 2 for the hole injection layer is opened for a certain period of time, and a hole injection layer having a certain film thickness is formed on the R corresponding anode electrode of the TFT substrate 10.

  When film formation of the hole injection layer is completed, the transport means 7 is activated and the first TFT substrate 10 is transported to the hole transport layer deposition area 30r and positioned above the vapor deposition source 2 for the hole transport layer. It is done. At the same time, the second TFT substrate 10 is transported to the hole injection layer deposition area 30r. In the same manner as described above, a hole transport layer is formed on the first TFT substrate 10 on the hole injection layer, and a hole injection layer is formed on the R corresponding anode electrode of the second TFT substrate 10. Is deposited.

  Thereafter, while sequentially supplying new TFT substrates 10, each TFT substrate 10 is sequentially conveyed through the R organic EL layer forming area 23 r, the G organic EL layer forming area 23 g and the B organic EL layer forming area 23 b. Then, an organic EL layer of a corresponding color is formed on each anode electrode of the TFT substrate 10. Then, the TFT substrate 10 on which all the organic EL layers have been formed is unloaded from the unloading area.

  In the second embodiment, each organic EL layer deposition area 23r, 23g, 23b is provided with a plurality of composite masks 4r, 4g, 4b of corresponding colors. Then, as described in the first embodiment, each of the composite masks 4r to 4b reciprocates a predetermined distance so that the first and second mask regions 26A and 26B are separated from the film formation area 23 and the first and second mask regions 26A and 26B. The film is moved back and forth between the cleaning areas 24A and 24B, and the film formation / cleaning / film formation using the first and second mask regions 26A and 26B is performed a predetermined number of times.

  In the first and second embodiments, the case where the cleaning area 24 is provided on both sides of the film forming area 23 has been described. However, the present invention is not limited to this, and the cleaning area 24 includes the film forming area 23. You may provide only on one side. In this case, the composite mask 4 moves to the cleaning area 24 when the predetermined number of times of film formation using the first mask area 26A is completed, and cleans the first mask area 26A. The mask region 26A may be moved to the film formation area 23 and used for film formation, and the film formation may not be performed during the cleaning of the first mask region 26A.

In the first and second embodiments, the case where the cleaning area 24 is provided in the vacuum chamber 1 has been described. However, the cleaning area 24 may not be provided. In this case, when film formation using all the mask regions of the composite mask 4 is completed, the composite mask 4 for one roll may be cleaned in a separate cleaning apparatus. Thereby, plasma cleaning using O ₂ , Ar gas, or a mixed gas thereof can be performed, and cleaning efficiency can be increased.

DESCRIPTION OF SYMBOLS 1 ... Vacuum chamber 2 ... Deposition source 3 ... Substrate holder 4 ... Composite mask 5 ... Delivery reel 6 ... Take-up reel 7 ... Conveyance means 8 ... Imaging means 10 ... Substrate 12 ... Film 13 ... Opening pattern 14 ... Magnetic metal thin plate 15 ... Opening 16 ... Mask-side alignment mark 21 ... Opening 22 ... Side wall 23 ... Deposition area 24 ... Cleaning area 24A ... First cleaning area 24B ... Second cleaning area 26A ... First mask area (one mask area)
26B 2nd mask area (other mask area)
27 ... Substrate side alignment mark

Claims (5)

A vapor deposition apparatus that forms a plurality of thin film patterns having a predetermined shape on a substrate through a mask by arranging them at a constant arrangement pitch,
In the vacuum chamber,
A deposition source for heating and evaporating the deposition material;
A substrate holder containing an electromagnet and holding the substrate facing the vapor deposition source;
A plurality of opening patterns having the same shape as the thin film pattern are arranged in a long film that transmits visible light and arranged in the major axis direction of the film at the same arrangement pitch as the thin film pattern, and the deposition of the film A magnetic metal thin plate bonded to the surface on the source side has a structure in which a plurality of openings that penetrates larger than the shape of the opening pattern are formed corresponding to the opening pattern, and between the vapor deposition source and the substrate holder A composite mask that moves stepwise in the longitudinal direction of the film parallel to the surface of the substrate holder;
A delivery reel provided on one side with the substrate holder in between, for delivering the composite mask;
A take-up reel provided on the other side with the substrate holder in between, and winding the composite mask;
A vapor deposition apparatus comprising:   The apparatus further comprises transport means for sequentially transporting the plurality of substrate holders in a direction intersecting with the moving direction of the composite mask, and each substrate holder is moved stepwise to be disposed opposite the deposition source. The vapor deposition apparatus according to claim 1.   The vacuum chamber is provided with a cleaning area by partitioning at least the take-up reel side of the film formation area including the vapor deposition source and the substrate holder by a side wall in which an opening through which the composite mask can pass is formed. 3. The vapor deposition according to claim 1, wherein the vapor deposition material attached to the composite mask can be removed by irradiating a laser beam, an ion beam, or an electron beam from the magnetic metal thin plate side. apparatus. The cleaning area is provided on both the delivery reel side and the take-up reel side across the film formation area,
The delivery reel and the take-up reel are configured to be able to reciprocally move the composite mask by rotating forward and reverse, move one mask area where the composite mask has been formed to one of the cleaning areas, and The other mask area of the film is moved to the film formation area, the other mask area after film formation is moved to the other cleaning area, and the one mask area after the cleaning is moved to the film formation area. The vapor deposition apparatus according to claim 3, wherein The substrate holder is configured to be movable in a two-dimensional direction in a plane parallel to a holding surface that holds the substrate, and to be rotatable about the center of the holding surface,
The mask side alignment mark previously formed on the composite mask and the substrate side alignment mark previously formed on the substrate held by the substrate holder are photographed at the same time, and both marks are in a certain positional relationship based on the photographed image. 5. The imaging device according to claim 1, further comprising an imaging unit that moves the substrate holder so that the composite mask and the substrate can be aligned. Vapor deposition equipment.