JP2013120612A - Substrate for suspension, suspension, suspension with element and hard disk drive - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate for suspension capable of accurately controlling the timing of writing and heating in thermally assisted recording.SOLUTION: There is provided a substrate for suspension which comprises: a metal support substrate; an insulating layer formed on the metal support substrate; and a wiring layer formed on the insulating layer, wherein the wiring layer is connected to a recording and reproducing element and has a writing wiring layer constituted from a first writing wiring layer and a second writing wiring layer, and a thermally assisted writing layer connected to a thermally assisted element is branched from at least one of the first writing wiring layer and the second writing wiring layer.

Description

  The present invention relates to a suspension substrate used for heat-assisted recording.

  In recent years, due to the spread of the Internet and the like, there has been a demand for an increase in the amount of information processing of personal computers and an increase in information processing speed. Increasing information transmission speed is required.

  In order to increase the capacity (high recording density) of the HDD, it is effective to reduce the size of the magnetic particles in the recording medium. However, if the size of the magnetic particles is too small, the magnetization of the individual magnetic particles becomes thermally unstable, making it difficult to maintain the recorded information for a long time. This is because when the size of the magnetic particles is reduced, the anisotropic magnetic energy KuV (Ku is the magnetic anisotropy energy per unit volume and V is the volume of the magnetic particles) is reduced, and the magnetization is fluctuated by thermal fluctuation kT ( This is because k is oriented randomly according to the Boltzmann constant and T is the absolute temperature), resulting in demagnetization. This limit is called the superparamagnetic limit.

  In order to extend the superparamagnetic limit, it is effective to use magnetic particles having a large coercive force. However, when magnetic particles having a large coercive force are used, the reversal magnetic field strength necessary for reversing the polarity of magnetization increases, making it difficult to record information on the recording medium. Thermally assisted recording is known as a technique for solving this problem (Patent Documents 1 to 4). In the heat-assisted recording, the recording medium is heated immediately before recording to perform recording while temporarily reducing the coercive force of the magnetic particles. Therefore, even when magnetic particles having a large coercive force are used, there is an advantage that information can be easily recorded on the recording medium.

JP 2009-301597 A JP 2010-40112 A JP 2008-159159 A JP 2008-59695 A

  In the heat-assisted recording, it is necessary to control the timing at which the heat assist element heats the recording medium and the timing at which the recording / reproducing element writes to the recording medium. The present invention has been made in view of the above circumstances, and a main object of the present invention is to provide a suspension substrate that can accurately control the timing of writing and heating.

  In order to solve the above problems, the present invention is a suspension substrate having a metal support substrate, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer. The wiring layer has a writing wiring layer connected to the recording / reproducing element and composed of a first writing wiring layer and a second writing wiring layer. A suspension substrate is provided in which a thermal assist wiring layer connected to the thermal assist element is branched from at least one of the layer and the second writing wiring layer.

  According to the present invention, the thermal assist wiring layer connected to the thermal assist element is branched from at least one of the first writing wiring layer and the second writing wiring layer. Heating can be turned on / off in accordance with (digital signal on / off). Thus, by synchronizing the writing and heating signals, it is possible to provide a suspension substrate capable of controlling both timings with high accuracy.

  In the above invention, the first thermal assist wiring layer and the second thermal assist wiring layer are branched from the first writing wiring layer and the second writing wiring layer as the thermal assist wiring layer, respectively. The first writing wiring layer, the second writing wiring layer, the first thermal assist wiring layer, and the second thermal assist wiring layer preferably constitute an interleaved structure.

  In the above invention, the first writing wiring layer and the second writing wiring layer have a first interleaving wiring layer and a second interleaving wiring layer, respectively. The layer, the second writing wiring layer, the first interleaving wiring layer, and the second interleaving wiring layer preferably form an interleaved structure.

  In the present invention, the metal support substrate, the first insulating layer formed on the metal support substrate, the first wiring layer formed on the first insulating layer, and the first wiring layer A suspension substrate having a second insulating layer formed and a second wiring layer formed on the second insulating layer, wherein at least one of the first wiring layer and the second wiring layer is: It has at least one of the first writing wiring layer and the second writing wiring layer constituting the writing wiring layer connected to the recording / reproducing element, and the first writing wiring layer and the second writing wiring layer A suspension substrate is provided in which a thermal assist wiring layer connected to a thermal assist element is branched from at least one of the write wiring layers.

  According to the present invention, the thermal assist wiring layer connected to the thermal assist element is branched from at least one of the first writing wiring layer and the second writing wiring layer. Heating can be turned on / off in accordance with (digital signal on / off). Thus, by synchronizing the writing and heating signals, it is possible to provide a suspension substrate capable of controlling both timings with high accuracy.

  In the above invention, it is preferable that the first wiring layer has the first writing wiring layer and the second wiring layer has the second writing wiring layer.

  In the above invention, the second wiring layer preferably includes the first writing wiring layer and the second writing wiring layer.

  In the above invention, it is preferable that the first wiring layer has the first writing wiring layer and the second writing wiring layer.

  In the above invention, it is preferable that the write wiring layer or the heat assist wiring layer has a signal delay means. This is because the timing of writing and heating can be controlled with higher accuracy.

  The present invention also provides a suspension comprising the above-described suspension substrate and a load beam provided on the surface of the suspension substrate on the metal support substrate side.

  According to the present invention, by using the suspension substrate described above, a suspension capable of controlling the timing of writing and heating with high accuracy can be obtained.

  The present invention also provides an element-equipped suspension comprising the above-described suspension, and a recording / reproducing element and a thermal assist element disposed on the suspension.

  According to the present invention, by using the above-described suspension, it is possible to provide a suspension with an element capable of accurately controlling the timing of writing and heating.

  The present invention also provides a hard disk drive having the above-described suspension with an element.

  According to the present invention, a hard disk drive with higher functionality can be obtained by using the above-described suspension with an element.

  The suspension substrate of the present invention has an effect that the timing of writing and heating can be accurately controlled in the heat-assisted recording.

It is a schematic diagram which shows an example of the board | substrate for suspensions of a 1st embodiment. It is a schematic diagram which illustrates the element area | region for recording / reproducing in the board | substrate for suspensions of a 1st embodiment. It is a schematic sectional drawing which shows an example of the element for general heat assistance, and the element for recording / reproducing. It is a schematic sectional drawing explaining the detour method of the wiring layer for heat assistance. FIG. 3 is a schematic plan view illustrating a write wiring layer and a heat assist wiring layer in the first embodiment. FIG. 3 is a schematic plan view illustrating a write wiring layer and a heat assist wiring layer in the first embodiment. FIG. 3 is a schematic plan view illustrating a write wiring layer and a heat assist wiring layer in the first embodiment. FIG. 3 is a schematic plan view illustrating a write wiring layer and a heat assist wiring layer in the first embodiment. FIG. 3 is a schematic plan view illustrating a write wiring layer and a heat assist wiring layer in the first embodiment. FIG. 3 is a schematic plan view illustrating a write wiring layer and a heat assist wiring layer in the first embodiment. It is a schematic sectional drawing which shows an example of the manufacturing method of the board | substrate for suspensions of a 1st embodiment. It is a schematic diagram which shows an example of the board | substrate for suspensions of a 2nd embodiment. It is a schematic perspective view illustrating the wiring layer for writing and the wiring layer for heat assist in the suspension substrate of the second embodiment. It is a schematic perspective view which illustrates the wiring layer for writing in the 2nd embodiment, and the wiring layer for thermal assistance. It is a schematic perspective view which illustrates the wiring layer for writing in the 2nd embodiment, and the wiring layer for thermal assistance. It is a schematic sectional drawing which shows an example of the manufacturing method of the board | substrate for suspensions of a 2nd embodiment. It is a schematic plan view which shows an example of the suspension of this invention. It is a schematic plan view which shows an example of the suspension with an element of this invention. It is a schematic plan view which shows an example of the hard disk drive of this invention.

  The suspension substrate, suspension, suspension with element, and hard disk drive of the present invention will be described in detail below.

A. Suspension substrate The suspension substrate of the present invention can be roughly divided into two embodiments. Hereinafter, the suspension substrate of the present invention will be described separately for the first embodiment and the second embodiment.

1. First Embodiment A suspension substrate according to a first embodiment is a suspension substrate having a metal support substrate, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer. The wiring layer includes a writing wiring layer connected to the recording / reproducing element and configured by a first writing wiring layer and a second writing wiring layer. The thermal assist wiring layer connected to the thermal assist element is branched from at least one of the wiring layer and the second writing wiring layer.

  FIG. 1 is a schematic diagram showing an example of a suspension substrate according to the first embodiment. FIG. 1A is a schematic plan view of a suspension substrate, and FIG. 1B is a cross-sectional view taken along line AA in FIG. In FIG. 1A, illustration of the insulating layer and the cover layer is omitted for convenience. A suspension substrate 100 shown in FIG. 1A includes a recording / reproducing element mounting region 101 formed at one tip portion, an external circuit board connection region 102 formed at the other tip portion, and a recording / playback device. A plurality of wiring layers 103a to 103d for electrically connecting the element mounting region 101 and the external circuit board connection region 102 are provided. The wiring layer 103a and the wiring layer 103b are a pair of wiring layers. Similarly, the wiring layer 103c and the wiring layer 103d are also a pair of wiring layers. One of these two wiring layers is a writing wiring layer, and the other is a reading wiring layer. As shown in FIG. 1B, the suspension substrate includes a metal support substrate 1, an insulating layer 2 formed on the metal support substrate 1, and a wiring layer 3 formed on the insulating layer 2. And a cover layer 4 formed so as to cover the wiring layer 3.

FIG. 2 is a schematic view illustrating the recording / reproducing element mounting region on the suspension substrate of the first embodiment. 2A is a schematic plan view of the recording / reproducing element mounting region, and FIG. 2B is a cross-sectional view taken along the line AA of FIG. 2A. In FIG. 2A, only the wiring layer is shown for convenience. The recording and reproducing element mounting region in FIG. 2 (a), the first write wiring layer W ₁ and the second write wiring layer W ₂ constitute a pair of wiring layers, a first read wiring layer R ₁ and the second reading wiring layer R ₂ also constitute a pair of wiring layers, and each wiring layer is electrically connected to the recording / reproducing element at the terminal portion 3a. Further, from the first writing wiring layer W ₁ and the second writing wiring layer W ₂ in FIG. 2A, the first thermal assist wiring layer H ₁ and the second thermal assist wiring layer H _{2, respectively.} Is branched. Further, as shown in FIG. 2B, the second writing wiring layer W ₂ and the second thermal assist wiring layer H ₂ include a via portion 5 penetrating the insulating layer 2 and another metal supporting board. 1 is electrically connected via a jumper portion 1a which is electrically insulated from 1.

  FIG. 3A is a schematic cross-sectional view showing an example of a general thermal assist element and a recording / reproducing element. The thermal assist element 210 in FIG. 3A includes a semiconductor substrate 201, a first cladding layer 202, an active layer 203, a second cladding layer 204, and a reflection mirror 205. On the other hand, the recording / reproducing element 220 in FIG. 3A includes a slider 211, a magnetic field generating element 212, a near-field light generating element 213, and an optical waveguide 214. Further, the heat assist element 210 and the recording / reproducing element 220 are joined by an adhesive layer 230. Here, the output light from the active layer 203 is reflected by the reflection mirror 205, passes through the optical waveguide 214, and reaches the near-field light generating element 213. Thus, the recording medium can be heated immediately before the magnetic field generating element 212 performs recording, and the coercivity of the magnetic particles can be temporarily reduced. Further, as shown in FIG. 3B, the recording / reproducing element 220 is usually mounted on the surface of the suspension substrate 100 on the cover layer side, and the thermal assist element 210 includes, for example, the suspension substrate 100 and the load. Mounted in the opening of the beam 300.

According to the first embodiment, the thermal assist wiring layer connected to the thermal assist element is branched from at least one of the first writing wiring layer and the second writing wiring layer. The heating can be turned on / off in accordance with the turn-on signal (digital signal on / off). Thus, by synchronizing the writing and heating signals, it is possible to provide a suspension substrate capable of controlling both timings with high accuracy. Although it depends on the wiring design, the number of wiring layers can be reduced by sharing the writing wiring layer and the heat assist wiring layer, and the wiring layer associated with the higher functionality of the suspension substrate can be reduced. There is an advantage that it can easily cope with the increase. On the other hand, as will be described later, when the write wiring layer and the heat assist wiring layer are not used in common and the interleave structure is adopted between the write wiring layer and the heat assist wiring layer, signal transmission is performed. There is also an advantage that characteristics can be improved (for example, low impedance).
Hereinafter, the suspension substrate according to the first embodiment will be described separately for the suspension substrate member and the suspension substrate configuration.

(1) Suspension Board Member First, the suspension board member of the first embodiment will be described. The suspension substrate of the first embodiment has at least a metal support substrate, an insulating layer, and a wiring layer.

  The metal support substrate in the first embodiment functions as a support for the suspension substrate. The material of the metal support substrate is preferably a metal having a spring property, and specific examples include stainless steel. Moreover, although the thickness of a metal support substrate changes with kinds of the material, it exists in the range of 10 micrometers-20 micrometers, for example.

  The insulating layer in the first embodiment is formed on the metal support substrate. The material of the insulating layer is not particularly limited as long as it has insulating properties, and examples thereof include a resin. Examples of the resin include polyimide resin, polybenzoxazole resin, polybenzimidazole resin, acrylic resin, polyether nitrile resin, polyether sulfone resin, polyethylene terephthalate resin, polyethylene naphthalate resin, and polyvinyl chloride resin. Of these, polyimide resin is preferred. It is because it is excellent in insulation, heat resistance and chemical resistance. In addition, the material of the insulating layer may be a photosensitive material or a non-photosensitive material. The thickness of the insulating layer is, for example, preferably in the range of 5 μm to 30 μm, more preferably in the range of 5 μm to 18 μm, and still more preferably in the range of 5 μm to 12 μm.

  The wiring layer in the first embodiment is formed on the insulating layer. The material of the wiring layer is not particularly limited as long as it has conductivity, but for example, a metal can be cited, and copper (Cu) is particularly preferable. Moreover, the material of the wiring layer may be rolled copper or electrolytic copper. The thickness of the wiring layer is preferably in the range of 5 μm to 18 μm, for example, and more preferably in the range of 5 μm to 12 μm.

  The wiring layer has at least a writing wiring layer and a reading wiring layer. In addition, the above wiring layers are, as necessary, a noise shielding wiring layer, a crosstalk preventing wiring layer, a power wiring layer, a ground wiring layer, a flight height control wiring layer, a sensor wiring layer, and an actuator element. A wiring layer or the like may be provided.

  Moreover, it is preferable that the protective plating part is formed in the one part surface of a wiring layer. This is because by providing the protective plating portion, it is possible to prevent deterioration (corrosion or the like) of the wiring layer. In particular, in the first embodiment, it is preferable that a protective plating portion is formed on a terminal portion that is connected to an element or an external circuit board. The type of the protective plating portion is not particularly limited, and examples thereof include Au plating, Ni plating, Ag plating, and Cu plating. Especially, it is preferable that Ni plating and Au plating are formed from the wiring layer side. The thickness of the protective plating portion is, for example, in the range of 0.1 μm to 4 μm.

  The suspension substrate of the first embodiment may have a cover layer that covers the wiring layer. By providing the cover layer, deterioration (corrosion etc.) of the wiring layer can be prevented. Examples of the material for the cover layer include those described above as the material for the insulating layer, and among them, a polyimide resin is preferable. The material of the cover layer may be a photosensitive material or a non-photosensitive material. The thickness of the cover layer is preferably in the range of 2 μm to 30 μm, for example, and more preferably in the range of 2 μm to 10 μm.

  Further, as shown in FIG. 2B described above, the wiring layer and the metal supporting board 1 (for example, the jumper portion 1a) in the first embodiment may have a via portion 5 penetrating the insulating layer 2. . The material of the via portion is not particularly limited as long as it has conductivity, and examples thereof include plating. Examples of the type of plating include Ni plating, Au plating, Ag plating, Cu plating and the like, and among them, Ni plating is preferable. This is because it is excellent in conductivity and corrosion resistance and is inexpensive. When the via plating portion is formed by the electrolytic Ni plating method, examples of the electrolytic Ni plating bath used include a Watt bath and a sulfamic acid bath. Further, the material of the wiring layer and the material of the via part may be the same or different.

(2) Configuration of Suspension Substrate Next, the configuration of the suspension substrate of the first embodiment will be described. The first embodiment is characterized in that the thermal assist wiring layer connected to the thermal assist element is branched from at least one of the first writing wiring layer and the second writing wiring layer. To do. The thermal assist wiring layer has at least a terminal portion for connection to the thermal assist element. The thermal assist wiring layer usually has a wiring portion branched from the writing wiring layer and a terminal portion formed continuously from the wiring portion. Note that the heat-assist wiring layer may be composed of only the terminal portion. That is, a part of the write wiring layer may be a terminal portion of the heat assist wiring layer. Also in this case, it can be considered that the thermal assist wiring layer (terminal portion) is branched from the writing wiring layer.

Further, as the second thermal assist wiring layer H ₂ shown in FIG. 2 described above, when the wiring layer for heat-assisted from the write wiring layers branches, on the wiring design, heat to other wiring layers There is a case where the assist wiring layer needs to be detoured. In such a case, it is preferable to use a part of the metal support substrate 1 as the jumper portion 1a as shown in FIG. Moreover, as another example of the detouring method of the heat assist wiring layer, as shown in FIG. 4A, as shown in FIG. 4A, as shown in FIG. The connection by the electrically conductive paste 7 can be mentioned.

FIG. 5A is a schematic plan view illustrating the write wiring layer and the heat assist wiring layer in the first embodiment. Figure 5 (a), the first write wiring layer W ₁ from the first thermal assist wiring layer H ₁ is branched directly, the second heat-assisted wiring layer from the second writing wiring layer W ₂ H ₂ However, it branches via the via part 5 and the jumper part 1a. FIG. 5A can be simply expressed as shown in FIG. 5B. 6 to 10 described later are also expressed as shown in FIG. 5B for convenience.

  In the first embodiment, according to the specification of the thermal assist element, the thermal assist wiring layer connected to the thermal assist element from at least one of the first writing wiring layer and the second writing wiring layer Should be branched. That is, the thermal assist wiring layer may be branched from the first writing wiring layer or the second writing wiring layer, and the first writing wiring layer and the second writing wiring layer may be used for the thermal assist. The wiring layer may be branched. Specific examples of the former are shown in FIGS. 6 (a) and 6 (b). A specific example of the latter is as shown in FIG.

As in the latter, the first thermal assist wiring layer and the second thermal assist wiring layer are branched from the first writing wiring layer and the second writing wiring layer as the thermal assist wiring layer, respectively. In this case, as shown in FIG. 7, the first writing wiring layer W ₁ , the second writing wiring layer W ₂ , the first thermal assist wiring layer H _1, and the second thermal assist wiring layer H ₂ are: It is preferable to constitute an interleave structure. This is because signal transmission characteristics can be improved (for example, low impedance). The interleave structure means that a wiring layer (W ₁ , H ₁ ) belonging to the first writing wiring layer W ₁ and a wiring layer (W ₂ , H ₂ ) belonging to the second writing wiring layer W ₂ are: An alternating structure. For example, as shown in FIG. 7, when the length of the region constituting the interleave structure is X, X is preferably larger.

In the first embodiment, the first writing wiring layer and the second writing wiring layer preferably have a first interleaving wiring layer and a second interleaving wiring layer, respectively. This is because signal transmission characteristics can be improved (for example, low impedance). Specific examples thereof are shown in FIGS. In FIG. 8 (a) ~ (c) , both the first writing wiring layer W ₁ and the second write wiring layer W ₂ are each, wiring layers for the first interleaving I ₁ and a second interleave and a wiring layer _{I 2.} In FIGS. 8A to 8C, only one interleaving wiring layer is provided for each writing wiring layer, but two or more interleaving wiring layers may be provided.

Further, in FIG. 8 (a), the at the beginning of the interleave _{structure, W 2, H 2, I} 2 are connected by a single jumper section, in FIG. 8 (b), at the end of the interleaved structure, _{W 2} , H ₂ and I ₂ are connected by a single jumper portion. On the other hand, as shown in FIG. 8 (c), in the first embodiment, the first interleave wiring layers I ₁ and the second interleave wiring layer I _2, wiring layers H ₁ and second for the first heat-assisted respectively second heat-assisted wiring layer H ₂ may be branched. The same applies to other types of interleave structures described later.

In the first embodiment, as shown in FIG. 9, the first writing wiring layer W ₁ , the second writing wiring layer W ₂ , the first interleaving wiring layer I ₁ , and the second interleaving wiring. The layer I ₂ , the first heat assist wiring layer H _1, and the second heat assist wiring layer H ₂ may form an interleaved structure. In this case, the wiring layer belonging to the first writing wiring layer _{W 1 (W 1, I 1} , H 1) and the wiring layer belonging to the second write wiring layer _{W 2 (W 2, I 2} , H 2 Are alternately arranged. Furthermore, in the first embodiment, the first thermal assist wiring layer and the second thermal assist wiring layer may each have a branch wiring layer, and these wiring layers may constitute an interleaved structure. Specifically, as shown in FIG. 10, the first thermal assist wiring layer H ₁ and the second thermal assist wiring layer H ₂ have branch wiring layers H ₁₁ and H ₁₂ , respectively. Constitutes an interleaved structure. In FIG 10, the wiring layer belonging to the first writing wiring layer _{W 1 (W 1, I 1} , H 1, H 11) and a wiring layer which belongs to the second write wiring layer _{W 2 (W 2} , I ₂ , H ₂ , H ₁₂ ) are alternately arranged.

  On the other hand, although not shown, the thermal assist wiring layer may be branched from the write wiring layer in the vicinity of the thermal assist element (for example, within a range of 500 μm or less from the thermal assist element in plan view). . By sharing the wiring layer for writing and the wiring layer for heat assist, there is an advantage that the number of wiring layers can be reduced and it is easy to cope with an increase in the number of wiring layers due to higher functionality of the suspension substrate. Because.

  In the heat-assisted recording, it is preferable that the coercive force of the magnetic particles is reduced by heating immediately before the recording / reproducing element is written. Therefore, it is preferable to provide a time lag so that the heating signal can be transmitted to the heat assisting element before the writing signal is transmitted to the recording / reproducing element. In order to provide this time lag, in the first embodiment, the write wiring layer or the heat assist wiring layer preferably has a signal delay means. As the signal delay means, for example, means for providing a difference in length between the branched write wiring layer and the thermal assist wiring layer, the wiring width of the write wiring layer or the thermal assist wiring layer wiring layer Means for thickening, means for narrowing the wiring width of the wiring layer for writing or the heat assisting wiring layer, means for providing a resistance (capacitor, etc.) in the wiring layer for writing or the heat assisting wiring layer, etc. Can be mentioned.

  The recording / reproducing element in the first embodiment is not particularly limited, but preferably has a magnetic generating element. Specifically, a magnetic head slider can be mentioned. The heat assist element in the first embodiment is not particularly limited as long as it can assist the recording of the recording / reproducing element with heat. Especially, it is preferable that the element for heat assistance is an element using light. This is because heat-assisted recording by an optical dominant recording method can be performed. Examples of the heat assist element using light include a semiconductor laser diode element. The semiconductor laser diode element may be a pn-type element, or a pnp-type or npn-type element.

  Next, the manufacturing method of the suspension substrate of the first embodiment will be described. The manufacturing method of the suspension substrate of the first embodiment is not particularly limited as long as it is a method capable of obtaining the above-described suspension substrate. FIG. 11 is a schematic cross-sectional view showing an example of a manufacturing method of the suspension substrate of the first embodiment. FIG. 11 is a schematic cross-sectional view corresponding to FIG. In FIG. 11, first, a laminated member in which the metal supporting member 1A, the insulating member 2A, and the conductor member 3A are laminated in this order is prepared (FIG. 11A). Next, the conductive member 3A is patterned by wet etching to form the wiring layer 3 (FIG. 11B). Next, the cover layer 4 is formed on the wiring layer 3 (FIG. 11C). Next, wet etching is performed on the insulating member 2A to form the insulating layer 2 (FIG. 11D). Next, the via portion 5 is formed by feeding power from the metal support member 1 </ b> A, and finally, the metal support member 1 </ b> A is wet-etched to form the metal support substrate 1. Thereby, a suspension substrate is obtained (FIG. 11E).

2. Second Embodiment Next, a second embodiment of the suspension substrate of the present invention will be described. The suspension substrate according to the second embodiment includes a metal support substrate, a first insulating layer formed on the metal support substrate, a first wiring layer formed on the first insulating layer, and the first wiring. A suspension substrate having a second insulating layer formed on the layer and a second wiring layer formed on the second insulating layer, wherein at least one of the first wiring layer and the second wiring layer One has at least one of a first writing wiring layer and a second writing wiring layer constituting a writing wiring layer connected to the recording / reproducing element, and the first writing wiring layer and The thermal assist wiring layer connected to the thermal assist element is branched from at least one of the second write wiring layers.

  FIG. 12 is a schematic view showing an example of the suspension substrate of the second embodiment. FIG. 12A is a schematic plan view of the suspension substrate, and FIG. 12B is a cross-sectional view taken along the line AA in FIG. In FIG. 12A, illustration of the insulating layer and the cover layer is omitted for convenience. A suspension substrate 100 shown in FIG. 12A includes a recording / reproducing element mounting region 101 formed at one tip portion, an external circuit board connection region 102 formed at the other tip portion, and a recording / playback device. A wiring layer 103 that electrically connects the element mounting region 101 and the external circuit board connection region 102 is provided. In addition, one of the wiring layers 103 in FIG. 12A is a writing wiring layer, and the other is a reading wiring layer. 12B, the suspension substrate 100 is formed on the metal support substrate 1, the first insulating layer 2x formed on the metal support substrate 1, and the first insulating layer 2x. The first wiring layer 3x, the second insulating layer 2y formed on the first wiring layer 3x, the second wiring layer 3y formed on the second insulating layer 2y, and the second wiring layer 3y are covered. And a cover layer 4 formed.

FIG. 13A is a schematic perspective view illustrating the write wiring layer and the heat assist wiring layer in the suspension substrate of the second embodiment. In FIG. 13 (a), the first wiring layer 3x has a first write wiring layer W _1, the second wiring layer 3y has a second write wiring layer W _2. Further, the first thermal assist wiring layer H ₁ branches directly from the first writing wiring layer W _1, and the second thermal assist wiring layer H ₂ branches directly from the second writing wiring layer W ₂ . Yes. FIG. 13A can be represented simply as shown in FIG. 13B. 14 and 15 to be described later are also represented as shown in FIG. 13B for convenience.

  According to the second embodiment, the thermal assist wiring layer connected to the thermal assist element is branched from at least one of the first writing wiring layer and the second writing wiring layer. The heating can be turned on / off in accordance with the turn-on signal (digital signal on / off). Thus, by synchronizing the writing and heating signals, it is possible to provide a suspension substrate capable of controlling both timings with high accuracy. Although it depends on the wiring design, the number of wiring layers can be reduced by sharing the writing wiring layer and the heat assist wiring layer, and the wiring layer associated with the higher functionality of the suspension substrate can be reduced. There is an advantage that it can easily cope with the increase. On the other hand, as will be described later, when the write wiring layer and the heat assist wiring layer are not used in common and the interleave structure is adopted between the write wiring layer and the heat assist wiring layer, signal transmission is performed. There is also an advantage that the characteristics are improved. Furthermore, since the suspension board of the second embodiment can arrange the first wiring layer and the second wiring layer via the second insulating layer, the suspension board of the first embodiment described above can be compared with the suspension board of the first embodiment. There is an advantage that it can easily cope with the increase.

(1) Suspension Substrate Member The suspension substrate of the second embodiment includes at least a metal support substrate, a first insulating layer, a first wiring layer, a second insulating layer, and a second wiring layer. The metal support substrate, the first insulating layer, and the first wiring layer in the second embodiment are the same as the contents described in the metal support substrate, the insulating layer, and the wiring layer in the first embodiment, respectively. Description is omitted. The cover layer and via layer are the same as those described in the first embodiment.

  The second insulating layer in the second embodiment is formed on the first wiring layer. The material for the second insulating layer is not particularly limited as long as it has insulating properties. For example, those described as the material for the insulating layer in the first embodiment can be used. Especially, it is preferable that the material of a 2nd insulating layer is a polyimide resin. The material of the second insulating layer may be a photosensitive material or a non-photosensitive material. The thickness of the second insulating layer (inter-wiring thickness) between the first wiring layer and the second wiring layer is not particularly limited, but is preferably in the range of 5 μm to 30 μm, for example, 5 μm. It is more preferably in the range of ˜18 μm, and still more preferably in the range of 5 μm to 12 μm.

  The second wiring layer in the second embodiment is formed on the second insulating layer. The material of the second wiring layer is not particularly limited as long as it has conductivity. For example, the material described as the material of the wiring layer in the first embodiment can be used. Especially, it is preferable that the material of a 2nd wiring layer is copper (Cu). Moreover, since the preferable range of the dimension of a 2nd wiring layer is the same as the preferable range of the dimension of the wiring layer in the 1st embodiment mentioned above, description here is abbreviate | omitted.

(2) Configuration of Suspension Substrate Next, the configuration of the suspension substrate of the second embodiment will be described. The second embodiment is characterized in that the thermal assist wiring layer connected to the thermal assist element is branched from at least one of the first writing wiring layer and the second writing wiring layer. To do. In addition, since it is the same as that of the content described in the 1st embodiment mentioned above about the wiring layer for heat assistance, description here is abbreviate | omitted.

  In the second embodiment, at least one of the first wiring layer and the second wiring layer is connected to the recording / reproducing element, and includes the first writing wiring layer and the second writing wiring layer. A write wiring layer is included. This combination will be described separately for each case.

As a first form, a form in which the first wiring layer has a first writing wiring layer and the second wiring layer has a second writing wiring layer can be mentioned. For example, in FIG. 13 (b), the first write wiring layer W ₁ is formed as a first wiring layer 3x, second write wiring layer W ₂ is formed as a second wiring layer 3y. Further, in FIG. 13 (b), the first heat-assisted wiring layer H ₁ is formed as a first wiring layer 3x, but the second heat-assisted wiring layer H ₂ is formed as a second wiring layer 3y, For example, by using a via portion penetrating the insulating layer, the thermal assist wiring layer can be disposed as the first wiring layer 3x or the second wiring layer 3y before reaching the thermal assist terminal portion. It is. The combination can be arbitrarily adopted depending on the configuration of the thermal assist element.

As a second form, a form in which the second wiring layer has a first writing wiring layer and a second writing wiring layer can be mentioned. In example FIG. 14 (a), the first write wiring layer W ₁ and the second write wiring layer W ₂ is formed as a second wiring layer 3y. Further, in FIG. 14 (a), the but first thermal assist wiring layer H ₁ and the second thermal assist wiring layer H ₂ is formed as a first wiring layer 3x, as shown in FIG. 14 (b) the first heat-assisted wiring layers H ₁ and the second thermal assist wiring layer H ₂ may be formed as a second wiring layer 3y. Further, for example, as shown in FIGS. 14A and 14B, by using the via portion 5 penetrating the insulating layer, the thermal assist wiring layer is changed to the first wiring layer before reaching the thermal assist terminal portion. It is possible to arrange as 3x or as the second wiring layer 3y. The combination can be arbitrarily adopted depending on the configuration of the thermal assist element.

As a third mode, a mode in which the first wiring layer has a first writing wiring layer and a second writing wiring layer can be mentioned. For example, in FIG. 15 (a), the first write wiring layer W ₁ and the second write wiring layer W ₂ is formed as a first wiring layer 3x. Further, in FIG. 15 (a), the but first thermal assist wiring layer H ₁ and the second thermal assist wiring layer H ₂ is formed as a second wiring layer 3y, as shown in FIG. 15 (b) the first heat-assisted wiring layers H ₁ and the second thermal assist wiring layer H ₂ may be formed as a first wiring layer 3x. Further, for example, as shown in FIGS. 15A and 15B, by using the via portion 5 penetrating the insulating layer, the thermal assist wiring layer is changed to the first wiring layer before reaching the thermal assist terminal portion. It is possible to arrange as 3x or as the second wiring layer 3y. The combination can be arbitrarily adopted depending on the configuration of the thermal assist element. 13 to 15 show only the write wiring layer and the heat assist wiring layer, the first wiring layer and the second wiring layer further include wiring layers having other functions. May be.

  Further, the writing wiring layer and the heat assisting wiring layer in the second embodiment may each constitute an interleaved structure. About the combination of interleaving, since it is the same as that of the content described in the first embodiment, description here is abbreviate | omitted. In addition, other matters are basically the same as the contents described in the first embodiment, and therefore description thereof is omitted here.

  Next, a method for manufacturing the suspension substrate according to the second embodiment will be described. The manufacturing method of the suspension substrate of the second embodiment is not particularly limited as long as it is a method capable of obtaining the above-described suspension substrate. FIG. 16 is a schematic cross-sectional view showing an example of a manufacturing method of the suspension substrate of the second embodiment. In FIG. 16, first, a laminated member in which the metal supporting member 1A, the insulating member 2A, and the conductor member 3A are laminated in this order is prepared (FIG. 16 (a)). Next, the conductive member 3A is patterned by wet etching to form the first wiring layer 3x (FIG. 16B). Next, the second insulating layer 2y is formed on the first wiring layer 3x (FIG. 16C). Next, a seed layer (not shown) is formed on the surface of the second insulating layer 2y by sputtering, a predetermined resist pattern is formed on the seed layer, and a surface of the seed layer exposed from the resist pattern is formed. A second wiring layer 3y is formed (FIG. 16D). Next, the cover layer 4 is formed on the second wiring layer 3y (FIG. 16E). Next, wet etching is performed on the insulating member 2A to form the first insulating layer 2x (FIG. 16F). Next, although not shown, the via portion 5 is formed by power feeding from the metal support member 1A as necessary. Finally, wet etching is performed on the metal support member 1 </ b> A to form the metal support substrate 1. As a result, a suspension substrate is obtained (FIG. 16G).

B. Suspension Next, the suspension of the present invention will be described. The suspension according to the present invention includes the suspension substrate described above and a load beam provided on the surface of the suspension substrate on the metal support substrate side.

  FIG. 17 is a schematic plan view showing an example of the suspension of the present invention. A suspension 400 shown in FIG. 17 includes the suspension substrate 100 described above and a load beam 300 provided on the surface of the suspension substrate 100 on the metal support substrate side.

  According to the present invention, by using the suspension substrate described above, a suspension capable of controlling the timing of writing and heating with high accuracy can be obtained.

  The suspension of the present invention has at least a suspension substrate and a load beam. The suspension substrate in the present invention is the same as the content described in the above “A. Suspension substrate”, and therefore description thereof is omitted here. On the other hand, the load beam in the present invention is provided on the surface of the suspension substrate on the metal support substrate side. Although the material of the load beam is not particularly limited, for example, a metal can be used, and stainless steel is preferable.

C. Next, the suspension with an element of the present invention will be described. A suspension with an element of the present invention includes the above-described suspension, and a recording / reproducing element and a thermal assist element disposed on the suspension.

  FIG. 18 is a schematic plan view showing an example of the suspension with an element of the present invention. 18 includes a suspension 400 described above, a recording / reproducing element 401 and a thermal assist element (not shown) mounted on the suspension 400 (recording / reproducing element mounting region 101 of the suspension substrate 100). Z)).

  According to the present invention, by using the above-described suspension, it is possible to provide a suspension with an element capable of accurately controlling the timing of writing and heating.

  The element-mounted suspension of the present invention includes at least a suspension, a recording / reproducing element, and a thermal assist element. The suspension according to the present invention is the same as the content described in “B. Suspension” above, and thus the description thereof is omitted here. In addition, the recording / reproducing element and the heat assist element in the present invention are the same as the contents described in the above “A. Suspension substrate”, and therefore the description thereof is omitted here. Moreover, the suspension with an element of the present invention may have an actuator element.

D. Next, the hard disk drive of the present invention will be described. The hard disk drive of the present invention has the above-described suspension with an element.

  FIG. 19 is a schematic plan view showing an example of the hard disk drive of the present invention. A hard disk drive 600 shown in FIG. 19 includes the above-described suspension 500 with an element, a disk 501 on which the suspension 500 with an element writes and reads data, a spindle motor 502 that rotates the disk 501, and elements of the suspension 500 with an element. Arm 503 and voice coil motor 504, and a case 505 for sealing the above members.

  According to the present invention, a hard disk drive with higher functionality can be obtained by using the above-described suspension with an element.

  The hard disk drive of the present invention has at least a suspension with an element, and usually further includes a disk, a spindle motor, an arm, and a voice coil motor. Since the suspension with an element is the same as the content described in “C. Suspension with an element”, description thereof is omitted here. As other members, the same members as those used in a general hard disk drive can be used.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the technical idea described in the claims of the present invention has substantially the same configuration and exhibits the same function and effect regardless of the case. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be described more specifically with reference to examples.

[Example 1]
First, a laminated member having SUS304 (metal support member) having a thickness of 18 μm, a polyimide resin layer (insulating member) having a thickness of 10 μm, and an electrolytic copper layer (conductor member) having a thickness of 9 μm was prepared (FIG. 11A). . Next, a dry film resist was laminated on both surfaces of the laminated member to form a resist pattern. Next, etching was performed using a ferric chloride solution, and a resist film was removed after the etching. Thereby, a wiring layer was formed from the conductor member (FIG. 11B), and a jig hole was formed in the metal support member.

  Thereafter, a polyimide precursor solution was coated on the patterned wiring layer with a die coater, and a cover layer was formed by predetermined patterning (FIG. 11C). Next, in order to pattern the insulating member, resist plate-making was performed, and the exposed polyimide resin was removed by wet etching to form an insulating layer (FIG. 11D). Next, a via portion (electrolytic Ni plating) for electrically connecting the metal support member and the wiring layer was formed by power feeding from the metal support member (FIG. 11E). Next, a protective plating portion was formed on the terminal portion of the wiring layer by electrolytic Au plating. Finally, the outer shape of the metal support substrate was processed. As a result, a suspension substrate was obtained.

[Example 2]
First, a laminated member having SUS304 (metal support member) having a thickness of 18 μm, a polyimide resin layer (insulating member) having a thickness of 10 μm, and an electrolytic copper layer (conductor member) having a thickness of 9 μm was prepared (FIG. 16A). . Next, a dry film resist was laminated on both surfaces of the laminated member to form a resist pattern. Next, etching was performed using a ferric chloride solution, and a resist film was removed after the etching. Thereby, the first wiring layer was formed from the conductor member (FIG. 16B), and the jig hole was formed in the metal support member.

  Thereafter, a polyimide precursor solution was coated on the patterned first wiring layer with a die coater, and a second insulating layer was formed by a predetermined patterning (FIG. 16C). Next, a seed layer made of Cr was formed on the surface on the second insulating layer side by a sputtering method. Next, a predetermined resist pattern was formed on the seed layer, and a second wiring layer was formed on the portion exposed from the resist pattern by electrolytic copper plating (FIG. 16D).

  After removing the seed layer, a polyimide precursor solution was coated on the patterned second wiring layer with a die coater, and a cover layer was formed by predetermined patterning (FIG. 16 (e)). Next, in order to pattern the insulating member, resist plate-making was performed, and the exposed polyimide resin was removed by wet etching to form a first insulating layer (FIG. 16F). Next, via portions (electrolytic Ni plating) for electrically connecting the metal support member and the wiring layer were formed by power feeding from the metal support member. Next, a protective plating portion was formed on the terminal portion of the wiring layer by electrolytic Au plating. Finally, the outer shape of the metal support substrate was processed. As a result, a suspension substrate was obtained.

  DESCRIPTION OF SYMBOLS 1 ... Metal support substrate, 1a ... Jumper part, 2 ... Insulating layer, 2x ... First insulating layer, 2y ... Second insulating layer, 3 ... Wiring layer, 3a ... Terminal part, 3x ... First wiring layer, 3y ... First Two wiring layers, 4 ... Cover layer, 5 ... Via part, 100 ... Suspension substrate, 101 ... Recording / reproducing element mounting area, 102 ... External circuit board connection area, 103 ... Wiring layer, 210 ... Thermal assist element, 220 ... Recording / reproducing elements

Claims (11)

A suspension substrate having a metal support substrate, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer,
The wiring layer is connected to a recording / reproducing element and has a writing wiring layer composed of a first writing wiring layer and a second writing wiring layer;
A suspension substrate, wherein a thermal assist wiring layer connected to the thermal assist element is branched from at least one of the first writing wiring layer and the second writing wiring layer. From the first writing wiring layer and the second writing wiring layer, the first thermal assistance wiring layer and the second thermal assistance wiring layer are branched as the thermal assistance wiring layer, respectively.
The first write wiring layer, the second write wiring layer, the first thermal assist wiring layer, and the second thermal assist wiring layer form an interleaved structure. Item 2. The suspension substrate according to Item 1. The first writing wiring layer and the second writing wiring layer have a first interleaving wiring layer and a second interleaving wiring layer, respectively.
2. The first writing wiring layer, the second writing wiring layer, the first interleaving wiring layer, and the second interleaving wiring layer constitute an interleaved structure. The suspension substrate as described in 1. A metal support substrate, a first insulating layer formed on the metal support substrate, a first wiring layer formed on the first insulating layer, and a second insulating layer formed on the first wiring layer A suspension substrate having a second wiring layer formed on the second insulating layer,
At least one of the first wiring layer and the second wiring layer is at least one of a first writing wiring layer and a second writing wiring layer constituting a writing wiring layer connected to the recording / reproducing element. Have
A suspension substrate, wherein a thermal assist wiring layer connected to the thermal assist element is branched from at least one of the first writing wiring layer and the second writing wiring layer.   5. The suspension substrate according to claim 4, wherein the first wiring layer has the first writing wiring layer, and the second wiring layer has the second writing wiring layer.   The suspension substrate according to claim 4, wherein the second wiring layer includes the first writing wiring layer and the second writing wiring layer.   The suspension substrate according to claim 4, wherein the first wiring layer includes the first writing wiring layer and the second writing wiring layer.   The suspension substrate according to any one of claims 1 to 7, wherein the write wiring layer or the heat assist wiring layer includes a signal delay unit.   A suspension board comprising: the suspension board according to any one of claims 1 to 8; and a load beam provided on a surface of the suspension board on the metal support board side. .   A suspension with an element, comprising: the suspension according to claim 9; and a recording / reproducing element and a thermal assist element disposed on the suspension.   A hard disk drive comprising the suspension with an element according to claim 10.

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