JP2013119616A - Polyamide resin composition and molded article - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polyamide resin composition and a molded article having stable surface appearance, excellent impact resistance, and excellent heat aging resistance.SOLUTION: The polyamide resin composition contains: 100 pts.mass of (A) a polyamide containing (a) a unit comprising adipic acid and hexamethylenediamine and (b) a unit comprising isophthalic acid and hexamethylenediamine, wherein the ratio (x) of the isophthalic acid component in all carboxylic acid components in the polyamide is 0.05≤(x)≤0.5, and (Y) represented by specific expression (1) is -0.3≤(Y)≤0.8; and 0.005-0.6 pt.mass of (B) a copper compound.

Description

  The present invention relates to a polyamide resin composition and a molded article.

  Polyamide resins have been widely used as various component materials for clothing, industrial materials, automobiles, electrical / electronics, and industrial use because of their excellent molding processability, mechanical properties, and chemical resistance. It has been.

In recent years, a molded body using a polyamide resin may be molded under high cycle molding conditions in which a molding temperature is increased and a mold temperature is lowered in order to improve productivity.
Polyamide resins are widely used in the automotive field. However, in such applications, the usage environment is severe in terms of heat and dynamics. Especially in automobile exterior parts such as door mirrors, impact characteristics and surface appearance In many cases, both are required.

On the other hand, when molding is performed under a high temperature condition, there is a problem that the molded product may not be stably obtained due to degradation of the polyamide resin or a change in fluidity.
Accordingly, there is a demand for a polyamide resin that has improved stability of the molded product surface appearance during high cycle molding as described above, and further improved impact resistance characteristics, and has little change in physical properties even under severe molding conditions.

In order to meet such requirements, a polyamide made of polyamide 66 / 6I into which an isophthalic acid component is introduced is disclosed as a material that can improve the surface appearance and mechanical properties of a molded product (for example, Patent Documents 1 to 4). 4).
Further, as a material capable of improving impact resistance, a polyamide composed of polyamide 6T / 6I into which a terephthalic acid component and an isophthalic acid component are introduced is disclosed (for example, see Patent Document 5).

JP-A-6-32976 JP-A-6-32980 Japanese Patent Laid-Open No. 7-118522 JP 2000-219808 A JP 2000-191771 A

  However, polyamides produced by the techniques disclosed in Patent Documents 1 to 4 have a high ratio in which the 6I chain units in polyamide 66 / 6I are copolymerized into blocks in the polyamide chains. Although the surface appearance of the molded product under the molding conditions is improved, under severe molding conditions such as high cycle molding conditions, the appearance and stability of the molding surface are reduced, and depending on the usage environment. May greatly change the physical properties.

  Further, although the polyamides produced by the techniques disclosed in Patent Documents 1 to 4 have improved mechanical properties such as elastic modulus, as described above, the 6I chain unit in the polyamide 66 / 6I is contained in the polyamide chain. Since the ratio of copolymerized to the block is high, the impact resistance is reduced due to the polymer structure, that is, the structure having a high ratio of 6I chain units copolymerized to the block in the polyamide chain. It may decrease.

  Furthermore, although the polyamide manufactured by the manufacturing technique disclosed in Patent Document 5 has improved impact resistance, it has a problem that the appearance of the molding surface is deteriorated.

As described above, in the polyamide 66 / 6I obtained by the prior art, the ratio of the 6I chain unit in the polyamide 66 / 6I copolymerized to the block is higher than that of an ideal random copolymer. While maintaining the balance of properties, it may be difficult to maintain the stability of the molded product surface appearance and improve the impact resistance properties. The fact is that a polyamide with little change in physical properties even in a high temperature use environment is not yet known.
In addition, it is difficult to maintain the stability of the appearance of the molded product while maintaining the balance of mechanical properties, which is a characteristic of polyamide, and such a polyamide is desired.

  Therefore, in the present invention, in view of the above circumstances, even when molded under severe molding conditions, the polyamide resin has excellent surface appearance stability, excellent impact resistance, and excellent heat aging resistance. The main object is to provide a composition and a molded article.

As a result of intensive studies to solve the problems specific to the above-mentioned polyamide 66 / 6I, the present inventors have found that (a) a unit comprising adipic acid and hexamethylenediamine, and (b) isophthalic acid and hexamethylenediamine. In the polyamide including the unit consisting of: and the range of the isophthalic acid component ratio (x) in the total carboxylic acid component in the polyamide, and (EG) = isophthalic acid end group amount / total carboxyl end group amount The value of (Y), {(Y) = [(EG) − (x)] / [1- (x)]}, which is an index in which the 6I chain unit in polyamide 66 / 6I is blocked The present inventors have found that a polyamide resin composition containing a polyamide (A) and a copper compound (B) that specify a numerical range can solve the above problems, and have completed the present invention.
That is, the present invention is as follows.

[1]
(A): (a) a unit comprising adipic acid and hexamethylenediamine;
(B) a unit consisting of isophthalic acid and hexamethylenediamine;
A polyamide comprising
The isophthalic acid component ratio (x) in all carboxylic acid components in the polyamide is 0.05 ≦ (x) ≦ 0.5,
And (Y) shown by following formula (1) is -0.3 <= (Y) <= 0.8 (A) 100 mass parts of polyamides,
(Y) = [(EG)-(x)] / [1- (x)] (1)
(In the formula (1), (EG) represents the ratio of isophthalic acid end groups in all carboxyl end groups contained in the polyamide (A), and is represented by the following formula (2).
(EG) = isophthalic acid end group amount / total carboxyl end group amount (2))
(B): 0.005 to 0.6 parts by mass of a copper compound;
Containing a polyamide resin composition.
[2]
The polyamide resin composition according to [1], wherein the range of (Y) represented by the formula (1) is 0.05 ≦ (Y) ≦ 0.8.
[3]
The polyamide resin composition according to [1] or [2], wherein the (B) copper compound is at least one selected from the group consisting of copper acetate and copper iodide.
[4]
The polyamide resin according to any one of [1] to [3], further comprising at least one (C) metal halide selected from the group consisting of alkali metal halides and alkaline earth metal halides. Composition.
[5]
The polyamide resin composition according to [4], wherein the metal halide compound (C) is potassium iodide.
[6]
The polyamide resin composition according to [4] or [5] above, wherein a molar ratio of halogen content to copper content (halogen / copper) is 2/1 to 50/1.
[7]
The polyamide resin composition according to any one of [1] to [6], wherein a copper content is 0.005 to 0.2 parts by mass with respect to 100 parts by mass of the polyamide (A).
[8]
The polyamide resin composition according to any one of [1] to [7], further including 1 to 200 parts by mass of (D) an inorganic filler with respect to 100 parts by mass of the (A) polyamide.
[9]
A molded article comprising the polyamide resin composition according to any one of [1] to [8].

  According to the present invention, there is provided a polyamide resin composition and a molded product having a stable surface appearance, excellent impact resistance characteristics and excellent heat aging resistance even when molded under severe molding conditions. can do.

It is a figure showing the relationship between blocking ratio (Y) and the isophthalic-acid component ratio (x) in all the carboxylic acid components in a polyamide.

Hereinafter, a mode for carrying out the present invention (hereinafter referred to as “the present embodiment”) will be described in detail.
In addition, this invention is not restrict | limited to the following embodiment, A various deformation | transformation can be implemented within the range of the summary.

[Polyamide resin composition]
The polyamide resin composition of this embodiment is
(A): (a) a unit comprising adipic acid and hexamethylenediamine;
(B) a unit consisting of isophthalic acid and hexamethylenediamine;
A polyamide comprising
The isophthalic acid component ratio (x) in all carboxylic acid components in the polyamide is 0.05 ≦ (x) ≦ 0.5,
And (Y) shown by following formula (1) is -0.3 <= (Y) <= 0.8 (A) 100 mass parts of polyamides,
(Y) = [(EG)-(x)] / [1- (x)] (1)
(In the formula (1), (EG) represents the ratio of isophthalic acid end groups in all carboxyl end groups contained in the polyamide (A), and is represented by the following formula (2).
(EG) = isophthalic acid end group amount / total carboxyl end group amount (2))
(B): 0.005 to 0.6 parts by mass of a copper compound;
Is a polyamide resin composition containing
Hereinafter, the components of the polyamide resin composition of the present embodiment will be described.

((A) Polyamide)
The polyamide constituting the polyamide resin composition of the present embodiment (hereinafter sometimes referred to as (A) polyamide, polyamide (A), or simply polyamide) is
(A) a unit consisting of adipic acid and hexamethylenediamine;
(B) a unit consisting of isophthalic acid and hexamethylenediamine;
including.
The isophthalic acid component ratio (x) in all carboxylic acid components in the polyamide (A) is 0.05 ≦ (x) ≦ 0.5, preferably 0.05 ≦ (x) ≦ 0.4. Yes, and more preferably 0.05 ≦ (x) ≦ 0.3.
Here, (A) isophthalic acid component ratio (x) in all carboxylic acid components in the polyamide indicates the ratio of the unit consisting of (b) isophthalic acid and hexamethylenediamine contained in the polyamide.
When the isophthalic acid component ratio (x) is 0.05 or more, the melting point and the solidification temperature of the polyamide are suppressed, and the molded product surface appearance of the polyamide resin composition of the present embodiment becomes stable. Moreover, when the isophthalic acid component ratio (x) is 0.5 or less, a decrease in the crystallinity of the polyamide can be suppressed, and sufficient mechanical strength can be obtained in the molded article of the polyamide resin composition of the present embodiment.

In the (A) polyamide, the range of (Y) represented by the following formula (1) is −0.3 ≦ (Y) ≦ 0.8.
(Y) = [(EG)-(x)] / [1- (x)] (1)
In formula (1), (x) is the ratio of isophthalic acid components in all carboxylic acid components in (A) polyamide, as described above, and consists of (b) isophthalic acid and hexamethylenediamine in polyamide. Indicates the unit ratio.
(EG) indicates the ratio of isophthalic acid end groups in all carboxyl end groups, and is represented by the following formula (2).
(EG) = isophthalic acid end group amount / total carboxyl end group amount (2)

  In the above formula (1), (Y) is an index indicating how much isophthalic acid end groups are present in all carboxyl end groups (hereinafter also referred to as “blocking ratio (Y)”). To do.)

  (A) Correlation between isophthalic acid component ratio (x) in all carboxylic acid components in polyamide and isophthalic acid end group ratio (EG) in all carboxyl terminal groups contained in (A) polyamide That is, the blocking ratio (Y) indicates how much the 6I chain unit in polyamide 66 / 6I shifts to the theoretical value (x = EG), that is, how much of the 6I chain unit in the polyamide The ratio is high, and it is also an index indicating whether the isophthalic acid end group ratio is high.

Accordingly, the denominator [1- (x)] of the formula (1) is the ratio of end groups other than the isophthalic acid end groups in all carboxylic acid components in the polyamide (A), and the numerator [1] (EG)-(x)] is the difference between the theoretical isophthalic acid end group ratio (= isophthalic acid component ratio), that is, the actual isophthalic acid end group ratio and the theoretical isophthalic acid end group ratio. Since this is the difference from the ratio, (Y), which is an index of the blocking ratio, can be obtained from the equation (1).
FIG. 1 is a diagram showing the relationship between the blocking ratio (Y) and the isophthalic acid component ratio (x) in all carboxylic acid components in the polyamide, based on this example described later.
An explanation of FIG. 1 is given below.
Horizontal axis: Isophthalic acid component ratio in all carboxylic acids (x)
Vertical axis: Isophthalic acid end group ratio (EG) in all carboxyl end groups
Area surrounded by solid quadrilateral: Area where the area surrounded by all two squares is 0.05 ≦ (x) ≦ 0.5 and −0.3 ≦ (Y) ≦ 0.8. 1 is a region where 0.05 ≦ (x) ≦ 0.5 and 0.05 ≦ (Y) ≦ 0.8.
Dotted line: (EG) = (x)
Broken line arrow: shows the relationship between [(EG)-(x)] and [1- (x)].
◇: Polyamide used in examples described later ■: Polyamide used in comparative examples described later

In the polyamide (A) constituting the polyamide resin composition of the present embodiment, the blocking ratio (Y) is −0.3 ≦ (Y) ≦ 0.8, preferably 0.05 ≦ (Y) ≦. 0.8, more preferably 0.05 ≦ (Y) ≦ 0.7, and still more preferably 0.1 ≦ (Y) ≦ 0.6.
By setting the isophthalic acid component ratio (x) within the above range and setting the range of (Y) to −0.3 ≦ (Y) ≦ 0.8, the polyamide resin composition of the present embodiment is harsh. The molded article surface appearance stability and impact resistance characteristics are excellent under molding conditions, and the heat aging resistance is excellent.
The method for determining the isophthalic acid component ratio (x), the amount of isophthalic acid end groups, and the total amount of carboxyl end groups in the polyamide is not particularly limited, but can be determined by a nuclear magnetic resonance method (NMR). Specifically, it can be determined by ¹ H-NMR.

<Copolymerization components other than adipic acid and isophthalic acid>
The polyamide (A) constituting the polyamide resin composition of the present embodiment includes an aliphatic dicarboxylic acid, an alicyclic dicarboxylic acid, an aromatic other than adipic acid and isophthalic acid as long as the purpose of the present embodiment is not impaired. Dicarboxylic acid and diamine having a substituent branched from the main chain other than hexamethylenediamine, aliphatic diamine, aromatic diamine, polycondensable amino acid, lactam, and the like can be used as a copolymerization component.

  Examples of the aliphatic dicarboxylic acid include malonic acid, dimethylmalonic acid, succinic acid, 2,2-dimethylsuccinic acid, 2,3-dimethylglutaric acid, 2,2-diethylsuccinic acid, and 2,3-diethylglutaric acid. Acid, glutaric acid, 2,2-dimethylglutaric acid, 2-methyladipic acid, trimethyladipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, dodecanedioic acid, tetradecanedioic acid, hexadecanedioic acid, octadecanedioic acid And straight chain or branched saturated aliphatic dicarboxylic acid having 3 to 20 carbon atoms such as eicosandioic acid and diglycolic acid.

Examples of the alicyclic dicarboxylic acid include alicyclic structures such as 1,3-cyclohexanedicarboxylic acid and 1,3-cyclopentanedicarboxylic acid having 3 to 10 carbon atoms, preferably 5 carbon atoms. Alicyclic dicarboxylic acid etc. which are 10-10.
The alicyclic dicarboxylic acid may be unsubstituted or may have a substituent.

Examples of the aromatic dicarboxylic acid include unsubstituted or various terephthalic acid, naphthalenedicarboxylic acid, 2-chloroterephthalic acid, 2-methylterephthalic acid, 5-methylisophthalic acid, and 5-sodium sulfoisophthalic acid. Examples thereof include aromatic dicarboxylic acids having 8 to 20 carbon atoms and substituted with a substituent.
Examples of the various substituents include halogen groups such as an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 12 carbon atoms, an arylalkyl group having 7 to 20 carbon atoms, a chloro group and a bromo group, and 3 carbon atoms. -10 alkylsilyl groups, and sulfonic acid groups and groups such as sodium salts thereof.

  Examples of the diamine having a substituent branched from the main chain other than the hexamethylenediamine include 2-methylpentamethylenediamine (also referred to as 2-methyl-1,5-diaminopentane), 2,2,4. -C3-C20 branched saturated aliphatic diamines such as trimethylhexamethylenediamine, 2,4,4-trimethylhexamethylenediamine, 2-methyloctamethylenediamine, and 2,4-dimethyloctamethylenediamine It is done.

  Examples of the aliphatic diamine include ethylene diamine, propylene diamine, tetramethylene diamine, pentamethylene diamine, heptamethylene diamine, octamethylene diamine, nonamethylene diamine, decamethylene diamine, undecamethylene diamine, dodecamethylene diamine, and trideca diamine. C2-C20 linear saturated aliphatic diamines, such as methylene diamine, etc. are mentioned.

  Examples of the aromatic diamine include metaxylylenediamine.

  Examples of the amino acid capable of polycondensation include 6-aminocaproic acid, 11-aminoundecanoic acid, 12-aminododecanoic acid, paraaminomethylbenzoic acid and the like.

  Examples of the lactam include butyl lactam, pivalolactam, caprolactam, capryl lactam, enantolactam, undecanolactam, dodecanolactam and the like.

  Each of the above-described dicarboxylic acid component, diamine component, amino acid component, and lactam component may be used alone or in combination of two or more.

<End sealant>
As a raw material of a polyamide copolymer obtained by polymerizing the polyamide constituting the polyamide resin composition of the present embodiment and other copolymerization components, an end-capping agent may be further added to adjust the molecular weight or improve hot water resistance. it can.
For example, when polymerizing the polyamide used in this embodiment or the above-described polyamide copolymer, the polymerization amount can be controlled by further adding a known end-capping agent.

The end-capping agent is not particularly limited, and examples thereof include acid anhydrides such as monocarboxylic acids, monoamines, and phthalic anhydride, monoisocyanates, monoacid halides, monoesters, and monoalcohols. .
Of these, monocarboxylic acids and monoamines are preferred.
These end capping agents may be used alone or in combination of two or more.

The monocarboxylic acid used as the end-capping agent is not particularly limited as long as it is a monocarboxylic acid having reactivity with an amino group. For example, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, caprylic acid , Lauric acid, tridecylic acid, myristic acid, palmitic acid, stearic acid, pivalic acid, and aliphatic monocarboxylic acid such as isobutyric acid; cycloaliphatic monocarboxylic acid such as cyclohexanecarboxylic acid; benzoic acid, toluic acid, α- And aromatic monocarboxylic acids such as naphthalenecarboxylic acid, β-naphthalenecarboxylic acid, methylnaphthalenecarboxylic acid, and phenylacetic acid.
These monocarboxylic acids may be used individually by 1 type, and may be used in combination of 2 or more types.

The monoamine used as the terminal blocking agent is not particularly limited as long as it is a monoamine having reactivity with a carboxyl group. For example, methylamine, ethylamine, propylamine, butylamine, hexylamine, octylamine, decylamine, stearyl And aliphatic monoamines such as amine, dimethylamine, diethylamine, dipropylamine and dibutylamine; alicyclic monoamines such as cyclohexylamine and dicyclohexylamine; aromatic monoamines such as aniline, toluidine, diphenylamine and naphthylamine;
These monoamines may be used alone or in combination of two or more.

((A) Polyamide production method)
As a manufacturing method of (A) polyamide which comprises the polyamide resin composition of this embodiment, including the case where it is a polyamide copolymer which has another copolymerization component as mentioned above, in the said all carboxylic acid component The isophthalic acid component ratio (x) is 0.05 ≦ (x) ≦ 0.5, and the range of (Y), which is an index of the blocking ratio in the above formula (1), is −0.3 ≦ (Y) ≦. It is only necessary to obtain a polyamide (or polyamide copolymer) satisfying 0.8, preferably 0.05 ≦ (Y) ≦ 0.8.
Examples of the method for producing polyamide include heating an aqueous solution of a mixture of adipic acid, isophthalic acid, hexamethylenediamine, and other components as necessary, or a suspension of water, and polymerizing while maintaining the molten state. Method (hot melt polymerization method); Method of increasing the degree of polymerization of the polyamide obtained by the hot melt polymerization method while maintaining the solid state at a temperature below the melting point (hot melt polymerization / solid phase polymerization method); Adipic acid, isophthalic acid Heat an aqueous solution of a mixture of acid, hexamethylenediamine, and other components as necessary, or a suspension of water, and melt the precipitated prepolymer again with an extruder such as a kneader to increase the degree of polymerization. Method (prepolymer / extrusion polymerization method); adipic acid, isophthalic acid, hexamethylenediamine, and other components as necessary, solid salt or Condensates and methods of polymerizing while maintaining the solid state (solid-phase polymerization method).
As a method for controlling the isophthalic acid component ratio (x) in all carboxylic acid components within the above numerical range, adjustment of the amount of raw materials charged and adjustment of polymerization conditions are effective.
In order to control (Y), which is an index of the blocking ratio in the above formula (1), within the above numerical range, it is necessary to control the blocking of the isophthalic acid component. Specifically, in the polymerization system, the pressure is appropriately adjusted while maintaining the molten state, and the mixing temperature is preferably 100 ° C. or higher, more preferably 120 ° C. or higher, and further preferably 170 ° C. or higher. It can be controlled by using a hot melt polymerization method in which the polycondensation reaction proceeds and the final polymerization internal temperature is preferably 250 ° C. or higher, more preferably 260 ° C. or higher.

It does not specifically limit as a polymerization form, Either a batch type and a continuous type may be sufficient.
The polymerization apparatus is not particularly limited, and a known apparatus such as an autoclave type reactor, a tumbler type reactor, an extruder type reactor such as a kneader, or the like can be used.

As described above, in order for (Y) to be in the range of −0.3 ≦ (Y) ≦ 0.8, a hot melt polymerization method is preferable, and a batch type hot melt polymerization method is more preferable. It is done.
An example of the batch-type hot melt polymerization method will be described below.
Although it does not specifically limit about polymerization temperature conditions, Preferably it is 100 degreeC or more, More preferably, it is 120 degreeC or more, More preferably, it is 170 degreeC or more.
For example, a mixture, solid salt, or aqueous solution of adipic acid, isophthalic acid, and hexamethylenediamine is stirred at a temperature of 110 to 200 ° C., and steam is gradually removed to about 60 to 90% and concentrated by heating.
Thereafter, heating is continued until the internal pressure becomes about 1.5 to 5.0 MPa (gauge pressure).
Thereafter, while removing water and / or gas components, the pressure is maintained at about 1.5 to 5.0 MPa (gauge pressure), and when the internal temperature reaches 240 ° C. or higher, more preferably 245 ° C. or higher, The pressure is gradually removed while removing water and / or gas components, and the heat-melting polymerization is carried out by polycondensation at normal pressure or reduced pressure so that the final internal temperature is preferably 250 ° C. or higher, more preferably 260 ° C. or higher. Legal methods can be used.
Furthermore, a solid phase polymerization method in which a mixture of adipic acid, isophthalic acid and hexamethylenediamine, a solid salt or a polycondensate is thermally polycondensed at a temperature below the melting point can be used. These methods may be combined as necessary.

When using an extrusion type reactor such as a kneader, the degree of pressure reduction is preferably about 0 to 0.07 MPa.
The extrusion temperature is preferably about 1 to 100 ° C. higher than the melting point obtained by differential scanning calorimetry (DSC) measurement according to JIS-K7121.
The shear rate is preferably about 100 (sec ⁻¹ ) or more, and the average residence time is preferably about 0.1 to 15 minutes.
By setting it as the said extrusion conditions, generation | occurrence | production of problems, such as coloring and high molecular weight being unable to be suppressed, can be suppressed effectively.

In the production of the polyamide (A) constituting the polyamide resin composition of the present embodiment (including a polyamide copolymer, the same shall apply hereinafter), it is preferable to use a predetermined catalyst.
The catalyst is not particularly limited as long as it is a known one used for polyamide. For example, phosphoric acid, phosphorous acid, hypophosphorous acid, orthophosphorous acid, pyrophosphorous acid, phenylphosphinic acid, phenylphosphonic acid , 2-methoxyphenylphosphonic acid, 2- (2′-pyridyl) ethylphosphonic acid, and metal salts thereof.
Examples of the metal of the metal salt include metal salts such as potassium, sodium, magnesium, vanadium, calcium, zinc, cobalt, manganese, tin, tungsten, germanium, titanium, and antimony, and ammonium salts.
Further, phosphate esters such as ethyl ester, isopropyl ester, butyl ester, hexyl ester, decyl ester, isodecyl ester, octadecyl ester, stearyl ester, and phenyl ester can also be used.

((A) Physical properties of polyamide)
The polyamide (A) constituting the polyamide resin composition of this embodiment preferably has a formic acid solution viscosity (JIS K 6816) of 10 to 40.
When the formic acid solution viscosity is 10 or more, a molded product having practically sufficient mechanical properties can be obtained, and when the formic acid solution viscosity is 40 or less, the fluidity during molding becomes good and the surface appearance is improved. An excellent molded body can be obtained.

((B) Copper compound)
The polyamide resin composition of this embodiment contains (B) copper compound 0.005-0.6 mass part.
Examples of the copper compound (hereinafter referred to as (B) copper compound, copper compound (B), or simply copper compound) used in the present embodiment include copper halide, copper acetate, and copper propionate. Copper benzoate, copper adipate, copper terephthalate, copper isophthalate, copper salicylate, copper nicotinate, and copper stearate, and copper complex salts coordinated to chelating agents such as ethylenediamine and ethylenediaminetetraacetic acid It is done.

As a copper compound, it has excellent heat aging resistance and can suppress metal corrosion of the screw and cylinder part during extrusion (hereinafter sometimes abbreviated as “metal corrosion”). Cuprous, cupric bromide, cuprous chloride, and copper acetate are preferred, and copper iodide and / or copper acetate are more preferred.
As a copper compound, you may use by 1 type and may be used in combination of 2 or more types.

Content of the copper compound in a polyamide resin composition is 0.005-0.6 mass part with respect to 100 mass parts of (A) polyamide, More preferably, it is 0.01-0.4 mass part. More preferably, it is 0.01-0.2 mass part.
By making content of a copper compound into the said range, heat aging property improves and copper precipitation and metal corrosion can be suppressed.

The content of copper in the polyamide resin composition is preferably 0.005 to 0.2 parts by mass, more preferably 0.005 to 0.15 parts by mass with respect to 100 parts by mass of the polyamide. 0.006 to 0.1 part by mass is even more preferable.
By containing copper in the above range in the polyamide resin composition, a polyamide resin composition having excellent heat aging resistance can be obtained.

((C) metal halogen compound)
The polyamide resin composition of the present embodiment preferably further contains a metal halogen compound (hereinafter sometimes referred to as (C) a metal halogen compound, a metal halogen compound (C), or simply a metal halogen compound). .
As the metal halide used in the present embodiment, copper halide is excluded.
The metal halide is preferably at least one selected from the group consisting of alkali metal halides and alkaline earth metal halides, such as potassium iodide, potassium bromide, potassium chloride, sodium iodide, And sodium chloride, and potassium iodide and potassium bromide are preferable.
As the metal halide, one kind may be used, or two or more kinds may be used in combination.
As the metal halide, potassium iodide is preferable because it is excellent in heat aging resistance and can further suppress metal corrosion.

The content of the metal halide in the polyamide resin composition is preferably 0.05 to 20 parts by mass, more preferably 0.05 to 10 parts by mass with respect to 100 parts by mass of the (A) polyamide. More preferably, it is 0.07-5 mass parts.
By setting the content of the metal halide within the above range, heat aging resistance can be improved, and copper precipitation and metal corrosion can be suppressed.

In the polyamide resin composition of the present embodiment, a copper compound and a metal are added to the polyamide resin composition so that the molar ratio of halogen content to copper content (halogen / copper) is 2/1 to 50/1. It is preferable to contain a halide. The molar ratio (halogen / copper) between the halogen content and the copper content is more preferably 2/1 to 40/1, and even more preferably 5/1 to 30/1.
In the polyamide resin composition of the present embodiment, when the molar ratio of the halogen content and the copper content is 2/1 or more, it is preferable because copper precipitation and metal corrosion can be suppressed, If the molar ratio of the halogen content and the copper content is 50/1 or less, the problem of corroding the screw of the molding machine can be suppressed without impairing mechanical properties such as toughness and rigidity.

  The effect can be obtained even if the copper compound and the metal halide are blended singly, but it is preferable to blend both in the present embodiment in order to improve the performance of the obtained polyamide resin composition.

You may add the other component for disperse | distributing a copper compound and a metal halide in polyamide to such an extent that the objective of this embodiment is not impaired.
Examples of other components include higher fatty acids such as lauric acid as lubricants, higher fatty acid metal salts of higher fatty acids and metals such as aluminum, higher fatty acid amides such as ethylene bisstearyl amide, and waxes such as polyethylene wax. Can be mentioned. Moreover, the organic compound which has at least 1 amide group is also mentioned.

((D) inorganic filler)
It is preferable that the polyamide resin composition of this embodiment further contains (D) 1 to 200 parts by mass of an inorganic filler with respect to 100 parts by mass of the (A) polyamide.
The inorganic filler (D) used in the present embodiment is not limited to the following, but examples thereof include glass fiber, carbon fiber, calcium silicate fiber, potassium titanate fiber, aluminum borate fiber, glass flake, talc, and kaolin. , Mica, hydrotalcite, calcium carbonate, zinc carbonate, zinc oxide, calcium monohydrogen phosphate, wollastonite, silica, zeolite, alumina, boehmite, aluminum hydroxide, titanium oxide, silicon oxide, magnesium oxide, calcium silicate , Sodium aluminosilicate, magnesium silicate, ketjen black, acetylene black, furnace black, carbon nanotubes, graphite, brass, copper, silver, aluminum, nickel, iron, calcium fluoride, montmorillonite, swelling fluorine mica Fine apatite, and the like.

  Among these, from the viewpoint of strength and surface appearance, glass fiber, carbon fiber, wollastonite, kaolin, mica, talc, calcium carbonate, magnesium carbonate, potassium titanate fiber, aluminum borate fiber, calcium silicate, aluminosilicate Sodium and magnesium silicate are preferred. More preferred are glass fiber, carbon fiber, wollastonite, kaolin, mica and talc, still more preferred are glass fiber, wollastonite and mica, and particularly preferred is glass fiber. The above-mentioned inorganic fillers may be used alone or in combination of two or more.

Glass fibers and carbon fibers have a number average fiber diameter of 3 to 30 μm, a weight average fiber length of 100 to 750 μm, and a weight average fiber length (L) and a number from the viewpoint of imparting excellent mechanical strength. Those having an aspect ratio (L / D) of 10 to 100 with respect to the average fiber diameter (D) are preferably used.
Here, the number average fiber diameter and the weight average fiber length of the glass fiber and carbon fiber in the present specification are values obtained by the following method. Place the molded product in an electric furnace and incinerate the contained organic matter. From the residue after the treatment, 100 or more glass fibers and carbon fibers are arbitrarily selected, and these glass fibers are observed with a scanning electron microscope (SEM) (manufactured by JEOL Ltd., JSM-6700F). The number average fiber diameter is determined by measuring the fiber diameter of the carbon fiber. In addition, the weight average fiber length is obtained by measuring the fiber length using SEM photographs of the 100 or more glass fibers and carbon fibers taken at a magnification of 1,000 times.

You may surface-treat said glass fiber and carbon fiber with a silane coupling agent etc. Examples of the silane coupling agent include, but are not limited to, γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, and N-β- (aminoethyl) -γ-aminopropylmethyldimethoxysilane. Examples include aminosilanes, mercaptosilanes such as γ-mercaptopropyltrimethoxysilane and γ-mercaptopropyltriethoxysilane, epoxy silanes, and vinyl silanes. Among these, one or more selected from the group consisting of the above-mentioned components is preferable, and aminosilanes are more preferable.
In addition, for the above glass fiber and carbon fiber, as a sizing agent, an unsaturated vinyl monomer excluding the carboxylic acid anhydride-containing unsaturated vinyl monomer and the unsaturated vinyl monomer containing the carboxylic acid anhydride-containing unsaturated vinyl monomer; Copolymer, epoxy compound, polyurethane resin, homopolymer of acrylic acid, copolymers of acrylic acid and other copolymerizable monomers, and primary, secondary and tertiary amines thereof And a copolymer containing a carboxylic acid anhydride-containing unsaturated vinyl monomer and an unsaturated vinyl monomer excluding the carboxylic acid anhydride-containing unsaturated vinyl monomer. These may be used individually by 1 type and may be used in combination of 2 or more type.

In the polyamide resin composition of the present embodiment, the content of the (D) inorganic filler is preferably 1 to 200 parts by mass, more preferably 1 to 180 parts with respect to 100 parts by mass of the polyamide (A) described above. It is a mass part, More preferably, it is 1-160 mass part, Most preferably, it is 5-150 mass part.
(D) By making content of an inorganic filler into 1 mass part or more with respect to 100 mass parts of (A) polyamide, the mechanical strength etc. of the polyamide resin composition of this embodiment improve, By setting the content to 200 parts by mass or less, a polyamide resin composition having excellent moldability can be obtained.

(Degradation inhibitor)
In the polyamide resin composition of the present embodiment, if necessary, the deterioration is suppressed for the purpose of improving thermal deterioration, preventing discoloration during heat, heat aging resistance, and weather resistance, as long as the purpose of the present embodiment is not impaired. An agent may be added.
Although it does not specifically limit as a deterioration inhibitor, For example, phenol type stabilizers, such as a hindered phenol compound; Phosphite type stabilizers; Hindered amine type stabilizers; Triazine type stabilizers; and sulfur type stabilizers etc. are mentioned.
One of these deterioration inhibitors may be used alone, or two or more thereof may be used in combination.

(Formability improver)
If necessary, a moldability improver may be added to the polyamide resin composition of the present embodiment as long as the purpose of the present embodiment is not impaired.
Although it does not specifically limit as a moldability improving agent, A higher fatty acid, a higher fatty acid metal salt, a higher fatty acid ester, a higher fatty acid amide, etc. are mentioned.

Examples of the higher fatty acids include stearic acid, palmitic acid, behenic acid, erucic acid, oleic acid, lauric acid, and montanic acid, which are saturated or unsaturated, linear or branched fatty acids having 8 to 40 carbon atoms. Group monocarboxylic acid and the like.
Among these, stearic acid and montanic acid are preferable.

The higher fatty acid metal salt is a metal salt of the higher fatty acid.
As the metal element of the metal salt, group 1, 2, 3 elements of the periodic table, zinc, aluminum, etc. are preferable, group 1, 2, elements such as calcium, sodium, potassium, and magnesium, and aluminum Etc. are more preferable.
Examples of the higher fatty acid metal salt include calcium stearate, aluminum stearate, zinc stearate, magnesium stearate, calcium montanate, sodium montanate, calcium palmitate and the like.
Among these, a metal salt of montanic acid and a metal salt of stearic acid are preferable.

The higher fatty acid ester is an esterified product of the higher fatty acid and alcohol.
Esters of an aliphatic carboxylic acid having 8 to 40 carbon atoms and an aliphatic alcohol having 8 to 40 carbon atoms are preferred.
Examples of the aliphatic alcohol include stearyl alcohol, behenyl alcohol, and lauryl alcohol.
Examples of higher fatty acid esters include stearyl stearate and behenyl behenate.

The higher fatty acid amide is an amide compound of the higher fatty acid.
Examples of the higher fatty acid amide include stearic acid amide, oleic acid amide, erucic acid amide, ethylene bisstearyl amide, ethylene bisoleyl amide, N-stearyl stearyl amide, N-stearyl erucic amide, and the like.
The higher fatty acid amide is preferably stearic acid amide, erucic acid amide, ethylene bisstearyl amide, and N-stearyl erucic acid amide, and more preferably ethylene bisstearyl amide and N-stearyl erucic acid amide.

  These higher fatty acids, higher fatty acid metal salts, higher fatty acid esters, and higher fatty acid amides may be used singly or in combination of two or more.

(Coloring agent)
You may add a coloring agent to the polyamide resin composition of this embodiment in the range which does not impair the objective of this embodiment as needed.
Although it does not specifically limit as a coloring agent, For example, pigments, such as dyes, such as nigrosine, titanium oxide, and carbon black; Aluminum, colored aluminum, nickel, tin, copper, gold, silver, platinum, iron oxide, stainless steel, and titanium Metallic pigments such as mica pearl pigments, color graphite, color glass fibers, and color glass flakes.

(Other resins)
If necessary, other resins may be added to the polyamide resin composition of the present embodiment as long as the purpose of the present embodiment is not impaired.
Such a resin is not particularly limited, and examples thereof include a thermoplastic resin and a rubber component described later.

Examples of the thermoplastic resin include polystyrene resins such as atactic polystyrene, isotactic polystyrene, syndiotactic polystyrene, AS resin, and ABS resin; polyester resins such as polyethylene terephthalate and polybutylene terephthalate; nylon 6,66. , 612 and other polyamides (polyamides other than the polyamide used in this embodiment);
Polyether resins such as polycarbonate, polyphenylene ether, polysulfone, and polyethersulfone; condensation resins such as polyphenylene sulfide and polyoxymethylene; acrylic resins such as polyacrylic acid, polyacrylic acid ester, and polymethyl methacrylate; polyethylene, polypropylene Polyolefin resins such as polybutene and ethylene-propylene copolymer; halogen-containing vinyl compound resins such as polyvinyl chloride and polyvinylidene chloride; phenol resins; epoxy resins and the like.
One type of these thermoplastic resins may be used alone, or two or more types may be used in combination.

Examples of the rubber component include natural rubber, polybutadiene, polyisoprene, polyisobutylene, neoprene, polysulfide rubber, thiocol rubber, acrylic rubber, urethane rubber, silicone rubber, epichlorohydrin rubber, and styrene-butadiene block copolymer (SBR). , Hydrogenated styrene-butadiene block copolymer (SEB), styrene-butadiene-styrene block copolymer (SBS), hydrogenated styrene-butadiene-styrene block copolymer (SEBS), styrene-isoprene block copolymer ( SIR), hydrogenated styrene-isoprene block copolymer (SEP), styrene-isoprene-styrene block copolymer (SIS), hydrogenated styrene-isoprene-styrene block copolymer (SEPS), Tylene-butadiene random copolymer, hydrogenated styrene-butadiene random copolymer, styrene-ethylene-propylene random copolymer, styrene-ethylene-butylene random copolymer, ethylene-propylene copolymer (EPR), ethylene- (1-butene) copolymer, ethylene- (1-hexene) copolymer, ethylene- (1-octene) copolymer, ethylene-propylene-diene copolymer (EPDM), butadiene-acrylonitrile-styrene- Core shell rubber (ABS), methyl methacrylate-butadiene-styrene-core shell rubber (MBS), methyl methacrylate-butyl acrylate-styrene-core shell rubber (MAS), octyl acrylate-butadiene-styrene-core shell rubber (MABS), Al Le acrylate - butadiene - acrylonitrile - styrene core-shell rubbers (AABS), butadiene - styrene - core shell rubber (SBR), methyl methacrylate - include core-shell type, etc. such as a siloxane-containing core-shell rubber, including butyl acrylate siloxane.
These rubber components may be used alone or in combination of two or more.

[Production method of polyamide resin composition]
The polyamide resin composition of the present embodiment includes (A) polyamide, (B) copper compound, and (C) metal halide, (D) inorganic filler, deterioration inhibitor, and moldability improvement as described above. It can be prepared by blending various additives such as a colorant and a colorant, and other resins.
As a blending method, a known extrusion technique can be used.
For example, the melt kneading temperature is preferably about 250 to 350 ° C. as the resin temperature. The melt kneading time is preferably about 1 to 30 minutes.
Moreover, the method of supplying the components constituting the polyamide resin composition to the melt kneader may supply all the components at the same time to the same supply port, or supply the components from different supply ports. Also good.
Specifically, for example, (A) polyamide, (B) copper compound, and (C) metal halide, and (D) inorganic filler are mixed using a Henschel mixer or the like, for example. , A method of feeding and kneading to a melt kneader, or (A) a single-screw or twin-screw extruder equipped with a decompression device by mixing (B) a copper compound and, if necessary, (C) a metal halide, into a polyamide And a method of blending (D) an inorganic filler from the side feeder after the molten state is obtained.

  Moreover, as a manufacturing method of the polyamide resin composition of this embodiment, the method of adding (B) a copper compound and (C) metal halide individually or in a mixture, for example in the polymerization process of (A) polyamide ( Hereinafter, it may be abbreviated as “Production Method 1”), or a method of adding (B) a copper compound and (C) a metal halide compound alone or in a mixture to (A) polyamide using a melt kneader ( Hereinafter, it may be abbreviated as “Production Method 2”).

In the method for producing a polyamide resin composition of the present embodiment, when (B) a copper compound and (C) a metal halogen compound are added, they may be added in solid form or in an aqueous solution state. The polyamide polymerization step in production method 1 is any step from the raw material monomer to the completion of polymerization of the polyamide, and may be at any step.
The melt kneader used in production method 2 is not particularly limited, and a known apparatus such as a single kneader or twin screw extruder, a Banbury mixer, a melt kneader such as a mixing roll, or the like can be used. Of these, a twin screw extruder is preferably used.
The temperature of melt kneading is preferably a temperature that is about 1 to 100 ° C. higher than the melting point of (A) polyamide, and more preferably a temperature that is about 10 to 50 ° C. higher.
The shear rate in the melt kneader is preferably about 100 sec ⁻¹ or more, and the average residence time during melt kneading is preferably about 0.5 to 5 minutes.

[Molded product of polyamide resin composition]
A predetermined molded product is obtained by molding the polyamide resin composition of the present embodiment.
It does not specifically limit as a method of obtaining a molded article, A well-known shaping | molding method can be used.
For example, extrusion molding, injection molding, vacuum molding, blow molding, injection compression molding, decorative molding, other material molding, gas assist injection molding, gunshot injection molding, low pressure molding, ultra thin injection molding (ultra high speed injection molding), And molding methods such as in-mold composite molding (insert molding, outsert molding) and the like.

[Use]
The molded article of this embodiment contains the above-mentioned polyamide resin composition, is excellent in the stability of the surface appearance of the molded article under severe molding conditions, impact resistance characteristics, and heat aging resistance, and can be used for various applications. .
For example, it can be suitably used in the automotive field, electrical / electronic field, machine / industrial field, office equipment field, aerospace field.

  Hereinafter, the present invention will be described in detail with reference to specific examples and comparative examples, but the present invention is not limited to the following examples.

First, constituent elements of polyamide, methods for measuring physical properties, and methods for evaluating properties are shown below.
〔Measuring method〕
<Quantity of polyamide isophthalic acid component ratio, isophthalic acid end groups, and total carboxyl end groups>
It calculated | required by < ¹ > H-NMR using polyamide.
Bisulfuric acid was used as the solvent.
As an apparatus, “ECA400 type” manufactured by JEOL Ltd. was used.
The repetition time was 12 seconds, and the number of integration was 64.
Calculate the amount of isophthalic acid component, the amount of isophthalic acid end groups, and the amount of other carboxy terminal groups (for example, adipic acid end groups) from the integral value of the characteristic signal of each component, and from these values, isophthalic acid in the total carboxylic acid The component ratio (x), the isophthalic acid end group ratio (EG) in the total carboxyl end groups, and the parameter (Y) in the above formula (1) were further calculated.

<Viscosity of formic acid solution>
Polyamide was dissolved in formic acid and measured according to JIS K6810.

<Appearance stability during high cycle molding / Evaluation of gloss value>
The apparatus used was “FN3000” manufactured by Nissei Resin Co., Ltd.
Cylinder temperature is set to 320 ° C, mold temperature is set to 70 ° C, and molding is performed up to 100 shots using polyamide or polyamide resin composition under injection molding conditions of injection 17 seconds and cooling 20 seconds to obtain ISO test pieces. It was.
The appearance stability of the obtained molded body (ISO test piece) was determined by the following method by measuring the gloss value using a handy gloss meter “IG320” manufactured by Horiba.
Appearance stability = ((1): Gloss average value of 20-30 shot ISO test piece) − ((2): Gloss average value of 90-100 shot ISO test piece)
It was judged that the smaller the above numerical difference, the better the appearance stability.
In Tables 1 and 2, “(1)-(2)” indicates a gloss value calculated by the above-described appearance stability formula.

<Measurement of impact properties Charpy impact strength>
Charpy impact strength was measured according to ISO 179 using 20 to 25 shot ISO test pieces obtained in the appearance stability test.
The measured value was an average value of n = 6.

<Evaluation of heat aging resistance>
The ISO test piece (ISO dumbbell having a thickness of 4 mm) obtained by the above-described appearance stability test was treated in a hot air oven at 200 ° C. for a predetermined time. Then, according to ISO527, the tensile strength of the test piece after the heat treatment was measured (measurement number n = 3). And the ratio (%) of the tensile strength (n = 3 average) of the test piece after the heat treatment to the tensile strength (n = 3 average) of the test piece measured before the heat treatment is calculated as the tensile strength retention rate. The heat treatment time at which the tensile strength retention was 50% was defined as the strength half-life (aging half-life). The longer the strength half-life (aging half-life), the better the heat aging resistance.

[(A) Polyamide]
<Production Example 1: Production of polyamide (A1)>
1237 g of equimolar salt of adipic acid and hexamethylenediamine, 263 g of equimolar salt of isophthalic acid and hexamethylenediamine, and 0.5 mol% excess of adipic acid with respect to all equimolar salt components are dissolved in 1500 g of distilled water. Thus, an equimolar 50 mass% uniform aqueous solution of the raw material monomer was prepared.
This aqueous solution was charged into an autoclave having an internal volume of 5.4 L and purged with nitrogen.
While stirring the aqueous solution at a temperature of 110 to 150 ° C., the water vapor was gradually removed to concentrate to a solution concentration of 70% by mass.
Thereafter, the internal temperature of the autoclave was raised to 220 ° C.
At this time, the autoclave was pressurized to 1.8 MPa.
The autoclave was heated as it was for 1 hour until the internal temperature of the autoclave reached 245 ° C., and the reaction was carried out for 1 hour while gradually removing water vapor and maintaining the pressure at 1.8 MPa.
Next, the pressure inside the autoclave was lowered to 1 MPa over 1 hour, and then the inside of the autoclave was maintained under a reduced pressure of 650 torr with a vacuum apparatus for 10 minutes.
At this time, the final internal temperature of the polymerization was 265 ° C.
Thereafter, the inside of the autoclave is pressurized with nitrogen, and the polymer obtained from the lower nozzle (nozzle) is discharged as a strand, cooled with water, cut into pellets, dried at 100 ° C. in a nitrogen atmosphere for 12 hours, and polyamide Got.
Isophthalic acid component ratio (x) in all carboxylic acids of the obtained polyamide, isophthalic acid end group ratio (EG) in all carboxyl end groups, parameter (Y) represented by the above formula (1), formic acid solution viscosity, etc. The polymer properties were measured and calculated by the method described above. These are shown in Table 1 below.

<Production Example 2: Production of polyamide (A2)>
1132 g of an equimolar salt of adipic acid and hexamethylenediamine and 368 g of an equimolar salt of isophthalic acid and hexamethylenediamine were used.
Under other conditions, a polyamide was obtained by the same method as in Production Example 1.
Isophthalic acid component ratio (x) in all carboxylic acids of the obtained polyamide, isophthalic acid end group ratio (EG) in all carboxyl end groups, parameter (Y) represented by the above formula (1), formic acid solution viscosity, etc. The polymer properties were measured and calculated by the method described above. These are shown in Table 1 below.

<Production Example 3: Production of polyamide (A3)>
1044 g of equimolar salt of adipic acid and hexamethylenediamine and 456 g of equimolar salt of isophthalic acid and hexamethylenediamine were used.
Under other conditions, a polyamide was obtained by the same method as in Production Example 1.
Isophthalic acid component ratio (x) in all carboxylic acids of the obtained polyamide, isophthalic acid end group ratio (EG) in all carboxyl end groups, parameter (Y) represented by the above formula (1), formic acid solution viscosity, etc. The polymer properties were measured and calculated by the method described above. These are shown in Table 1 below.

<Production Example 4: Production of polyamide (A4)>
816 g of equimolar salt of adipic acid and hexamethylenediamine and 684 g of equimolar salt of isophthalic acid and hexamethylenediamine were used.
Under other conditions, a polyamide was obtained by the same method as in Production Example 1.
Isophthalic acid component ratio (x) in all carboxylic acids of the obtained polyamide, isophthalic acid end group ratio (EG) in all carboxyl end groups, parameter (Y) represented by the above formula (1), formic acid solution viscosity, etc. The polymer properties were measured and calculated by the method described above. These are shown in Table 1 below.

<Production Example 5: Production of polyamide (A5)>
1237 g of equimolar salt of adipic acid and hexamethylenediamine and 263 g of equimolar salt of isophthalic acid and hexamethylenediamine were used. No 0.5 mol% excess of adipic acid was added relative to all equimolar salt components.
Under other conditions, polyamide was obtained by the method of Production Example 1.
Isophthalic acid component ratio (x) in all carboxylic acids of the obtained polyamide, isophthalic acid end group ratio (EG) in all carboxyl end groups, parameter (Y) represented by the above formula (1), formic acid solution viscosity, etc. The polymer properties were measured and calculated by the method described above. These are shown in Table 1 below.

<Production Example 6: Production of polyamide (A6)>
1044 g of equimolar salt of adipic acid and hexamethylenediamine and 456 g of equimolar salt of isophthalic acid and hexamethylenediamine were used. No 0.5 mol% excess of adipic acid was added relative to all equimolar salt components.
Under other conditions, polyamide was obtained by the method of Production Example 1.
Isophthalic acid component ratio (x) in all carboxylic acids of the obtained polyamide, isophthalic acid end group ratio (EG) in all carboxyl end groups, parameter (Y) represented by the above formula (1), formic acid solution viscosity, etc. The polymer properties were measured and calculated by the method described above. These are shown in Table 1 below.

<Production Example 7: Production of polyamide (A7)>
1114 g of equimolar salt of adipic acid and hexamethylene diamine, 386 g of equimolar salt of isophthalic acid and hexamethylene diamine, and 0.5 mol% excess of adipic acid with respect to all equimolar salt components are dissolved in 1500 g of distilled water. Thus, an equimolar 50 mass% uniform aqueous solution of the raw material monomer was prepared.
This aqueous solution was charged into an autoclave having an internal volume of 5.4 L and purged with nitrogen.
While stirring the aqueous solution at a temperature of 110 to 150 ° C., the water vapor was gradually removed to concentrate to a solution concentration of 70% by mass.
Thereafter, the internal temperature of the autoclave was raised to 220 ° C.
At this time, the autoclave was pressurized to 1.8 MPa.
The autoclave was heated as it was for 1 hour until the internal temperature of the autoclave reached 245 ° C., and the reaction was carried out for 1 hour while gradually removing water vapor and maintaining the pressure at 1.8 MPa.
Next, the pressure inside the autoclave was lowered to 1 MPa over 1 hour, and then the inside of the autoclave was maintained under a reduced pressure of 400 torr for 10 minutes with a vacuum apparatus.
At this time, the final internal temperature of the polymerization was 265 ° C.
Thereafter, the inside of the autoclave is pressurized with nitrogen, and the polymer obtained from the lower nozzle (nozzle) is discharged as a strand, cooled with water, cut into pellets, dried at 100 ° C. in a nitrogen atmosphere for 12 hours, and polyamide Got.
Isophthalic acid component ratio (x) in all carboxylic acids of the obtained polyamide, isophthalic acid end group ratio (EG) in all carboxyl end groups, parameter (Y) represented by the above formula (1), formic acid solution viscosity, etc. The polymer properties were measured and calculated by the method described above. These are shown in Table 1 below.

<Production Example 8: Production of polyamide (A8)>
1114 g of equimolar salt of adipic acid and hexamethylene diamine, 368 g of equimolar salt of isophthalic acid and hexamethylene diamine, and 0.5 mol% excess of adipic acid with respect to all equimolar salt components are dissolved in 1500 g of distilled water. Thus, an equimolar 50 mass% uniform aqueous solution of the raw material monomer was prepared.
This aqueous solution was charged into an autoclave having an internal volume of 5.4 L and purged with nitrogen.
While stirring the aqueous solution at a temperature of 110 to 150 ° C., the water vapor was gradually removed to concentrate to a solution concentration of 70% by mass.
Thereafter, the internal temperature of the autoclave was raised to 220 ° C.
At this time, the autoclave was pressurized to 1.8 MPa.
The autoclave was heated as it was for 1 hour until the internal temperature of the autoclave reached 245 ° C., and the reaction was carried out for 1 hour while gradually removing water vapor and maintaining the pressure at 1.8 MPa.
Next, the pressure inside the autoclave was lowered to 1 MPa over 1 hour, and then the inside of the autoclave was maintained under a reduced pressure of 650 torr with a vacuum apparatus for 20 minutes.
At this time, the final internal temperature of the polymerization was 270 ° C.
Thereafter, the inside of the autoclave is pressurized with nitrogen, and the polymer obtained from the lower nozzle (nozzle) is discharged as a strand, cooled with water, cut into pellets, dried at 100 ° C. in a nitrogen atmosphere for 12 hours, and polyamide Got.
Isophthalic acid component ratio (x) in all carboxylic acids of the obtained polyamide, isophthalic acid end group ratio (EG) in all carboxyl end groups, parameter (Y) represented by the above formula (1), formic acid solution viscosity, etc. The polymer properties were measured and calculated by the method described above. These are shown in Table 1 below.

<Production Example 9: Production of polyamide (A9)>
Distilled 1109 g of equimolar salt of adipic acid and hexamethylene diamine, 368 g of equimolar salt of isophthalic acid and hexamethylene diamine, 5 g of ε caprolactam, and 0.5 mol% excess of adipic acid with respect to all equimolar salt components It was dissolved in 1500 g of water, and an equimolar 50 mass% uniform aqueous solution of the raw material monomer was prepared.
This aqueous solution was charged into an autoclave having an internal volume of 5.4 L and purged with nitrogen.
While stirring the aqueous solution at a temperature of 110 to 150 ° C., the water vapor was gradually removed to concentrate to a solution concentration of 70% by mass.
Thereafter, the internal temperature of the autoclave was raised to 220 ° C.
At this time, the autoclave was pressurized to 1.8 MPa.
The autoclave was heated as it was for 1 hour until the internal temperature of the autoclave reached 245 ° C., and the reaction was carried out for 1 hour while gradually removing water vapor and maintaining the pressure at 1.8 MPa.
Next, the pressure inside the autoclave was lowered to 1 MPa over 1 hour, and then the inside of the autoclave was maintained under a reduced pressure of 650 torr with a vacuum apparatus for 10 minutes.
At this time, the final internal temperature of the polymerization was 265 ° C.
Thereafter, the inside of the autoclave is pressurized with nitrogen, and the polymer obtained from the lower nozzle (nozzle) is discharged as a strand, cooled with water, cut into pellets, dried at 100 ° C. in a nitrogen atmosphere for 12 hours, and polyamide Got.
Isophthalic acid component ratio (x) in all carboxylic acids of the obtained polyamide, isophthalic acid end group ratio (EG) in all carboxyl end groups, parameter (Y) represented by the above formula (1), formic acid solution viscosity, etc. The polymer properties were measured and calculated by the method described above. These are shown in Table 1 below.

<Production Example 10: Production of polyamide (A10)>
1500 g of equimolar salt of adipic acid and hexamethylenediamine, 0.5 mol% excess adipic acid with respect to all equimolar salt components is dissolved in 1500 g of distilled water, and an equimolar 50 mass% homogeneous aqueous solution of the raw material monomer is prepared. did.
This aqueous solution was charged into an autoclave having an internal volume of 5.4 L and purged with nitrogen.
While stirring the aqueous solution at a temperature of 110 to 150 ° C., the water vapor was gradually removed to concentrate to a solution concentration of 70% by mass.
Thereafter, the internal temperature of the autoclave was raised to 220 ° C.
At this time, the autoclave was pressurized to 1.8 MPa.
The autoclave was heated for 1 hour until the internal temperature of the autoclave reached 260 ° C., and the reaction was carried out for 1 hour while gradually removing water vapor and maintaining the pressure at 1.8 MPa.
Next, the pressure inside the autoclave was lowered to 1 MPa over 1 hour, and then the inside of the autoclave was maintained under a reduced pressure of 650 torr with a vacuum apparatus for 10 minutes.
At this time, the final internal temperature of the polymerization was 290 ° C.
Thereafter, the inside of the autoclave is pressurized with nitrogen, and the polymer obtained from the lower nozzle (nozzle) is discharged as a strand, cooled with water, cut into pellets, dried at 100 ° C. in a nitrogen atmosphere for 12 hours, and polyamide Got.
Isophthalic acid component ratio (x) in all carboxylic acids of the obtained polyamide, isophthalic acid end group ratio (EG) in all carboxyl end groups, parameter (Y) represented by the above formula (1), formic acid solution viscosity, etc. The polymer properties were measured and calculated by the method described above. These are shown in Table 2 below.

<Production Example 11: Production of polyamide (A11)>
1455 g of an equimolar salt of adipic acid and hexamethylenediamine and 45 g of an equimolar salt of isophthalic acid and hexamethylenediamine were used.
Under other conditions, a polyamide was obtained by the same method as in Production Example 10.
Isophthalic acid component ratio (x) in all carboxylic acids of the obtained polyamide, isophthalic acid end group ratio (EG) in all carboxyl end groups, parameter (Y) represented by the above formula (1), formic acid solution viscosity, etc. The polymer properties were measured and calculated by the method described above. These are shown in Table 2 below.

<Production Example 12: Production of polyamide (A12)>
1237 g of equimolar salt of adipic acid and hexamethylenediamine, 263 g of equimolar salt of isophthalic acid and hexamethylenediamine, and 0.5 mol% excess of adipic acid with respect to all equimolar salt components are dissolved in 1500 g of distilled water. Thus, an equimolar 50 mass% uniform aqueous solution of the raw material monomer was prepared.
This aqueous solution was charged into an autoclave having an internal volume of 5.4 L and purged with nitrogen.
While stirring the aqueous solution at a temperature of 110 to 150 ° C., the water vapor was gradually removed to concentrate to a solution concentration of 70% by mass.
Thereafter, the internal temperature of the autoclave was raised to 220 ° C.
At this time, the autoclave was pressurized to 1.8 MPa.
The autoclave was heated for 1 hour until the internal temperature of the autoclave reached 260 ° C., and the reaction was carried out for 1 hour while gradually removing water vapor and maintaining the pressure at 1.8 MPa.
Next, the valve was closed, the heater was turned off, and the internal temperature of the autoclave was cooled to room temperature over about 8 hours to obtain a polyamide having a formic acid solution viscosity of 7.
After the obtained polyamide was pulverized, it was put into an evaporator having an internal volume of 10 L and subjected to solid phase polymerization at 200 ° C. for 10 hours under a nitrogen stream.
Isophthalic acid component ratio (x) in all carboxylic acids of the obtained polyamide, isophthalic acid end group ratio (EG) in all carboxyl end groups, parameter (Y) represented by the above formula (1), formic acid solution viscosity, etc. The polymer properties were measured and calculated by the method described above. These are shown in Table 2 below.

<Production Example 13: Production of polyamide (A13)>
816 g of equimolar salt of adipic acid and hexamethylenediamine and 684 g of equimolar salt of isophthalic acid and hexamethylenediamine were used.
Under other conditions, polyamide was obtained by the same method as in Production Example 12.
Isophthalic acid component ratio (x) in all carboxylic acids of the obtained polyamide, isophthalic acid end group ratio (EG) in all carboxyl end groups, parameter (Y) represented by the above formula (1), formic acid solution viscosity, etc. The polymer properties were measured and calculated by the method described above. These are shown in Table 2 below.

<Production Example 14: Production of polyamide (A14)>
1220 g of equimolar salt of adipic acid and hexamethylene diamine, 280 g of equimolar salt of isophthalic acid and hexamethylene diamine, and 0.5 mol% excess of adipic acid with respect to all equimolar salt components are dissolved in 1500 g of distilled water. Thus, an equimolar 50 mass% uniform aqueous solution of the raw material monomer was prepared.
This aqueous solution was charged into an autoclave having an internal volume of 5.4 L and purged with nitrogen.
While stirring the aqueous solution at a temperature of 110 to 150 ° C., the water vapor was gradually removed to concentrate to a solution concentration of 70% by mass.
Thereafter, the internal temperature of the autoclave was raised to 220 ° C.
At this time, the autoclave was pressurized to 1.8 MPa.
The autoclave was heated for 2 hours as it was until the internal temperature of the autoclave reached 260 ° C., and the reaction was carried out for 1 hour while gradually removing water vapor and maintaining the pressure at 1.8 MPa.
Next, the pressure in the autoclave was lowered to 1 MPa over 1 hour, then the valve was closed, the heater was turned off, and the internal temperature of the autoclave was cooled to room temperature over about 8 hours to obtain polyamide. After pulverizing the obtained polyamide, it was dried at 100 ° C. under a nitrogen atmosphere for 12 hours to obtain a polyamide.
Isophthalic acid component ratio (x) in all carboxylic acids of the obtained polyamide, isophthalic acid end group ratio (EG) in all carboxyl end groups, parameter (Y) represented by the above formula (1), formic acid solution viscosity, etc. The polymer properties were measured and calculated by the method described above. These are shown in Table 2 below.

<Production Example 15: Production of polyamide (A15)>
570 g of an equimolar salt of adipic acid and hexamethylenediamine and 930 g of an equimolar salt of isophthalic acid and hexamethylenediamine were used.
Under other conditions, a polyamide was obtained by the same method as in Production Example 1.
Isophthalic acid component ratio (x) in all carboxylic acids of the obtained polyamide, isophthalic acid end group ratio (EG) in all carboxyl end groups, parameter (Y) represented by the above formula (1), formic acid solution viscosity, etc. The polymer properties were measured and calculated by the method described above. These are shown in Table 2 below.

<Production Example 16: Production of polyamide (A16)>
570 g of an equimolar salt of adipic acid and hexamethylenediamine and 930 g of an equimolar salt of isophthalic acid and hexamethylenediamine were used.
No 0.5 mol% excess of adipic acid was added relative to all equimolar salt components.
Under other conditions, a polyamide was obtained by the same method as in Production Example 1.
Isophthalic acid component ratio (x) in all carboxylic acids of the obtained polyamide, isophthalic acid end group ratio (EG) in all carboxyl end groups, parameter (Y) represented by the above formula (1), formic acid solution viscosity, etc. The polymer properties were measured and calculated by the method described above. These are shown in Table 2 below.

<Production Example 17: Production of polyamide (A17)>
1237 g of equimolar salt of adipic acid and hexamethylenediamine, 263 g of equimolar salt of isophthalic acid and hexamethylenediamine, and 0.5 mol% excess of adipic acid with respect to all equimolar salt components are dissolved in 1500 g of distilled water. Thus, an equimolar 50 mass% uniform aqueous solution of the raw material monomer was prepared.
This aqueous solution was charged into an autoclave having an internal volume of 5.4 L and purged with nitrogen.
While stirring the aqueous solution at a temperature of 110 to 150 ° C., the water vapor was gradually removed to concentrate to a solution concentration of 70% by mass.
Thereafter, the internal temperature of the autoclave was raised to 220 ° C.
At this time, the autoclave was pressurized to 1.8 MPa.
The autoclave was heated for 1 hour until the internal temperature of the autoclave reached 260 ° C., and the reaction was carried out for 1 hour while gradually removing water vapor and maintaining the pressure at 1.8 MPa.
Next, the valve was closed, the heater was turned off, and the internal temperature of the autoclave was cooled to room temperature over about 8 hours to obtain a polyamide having a formic acid solution viscosity of 7.
Isophthalic acid component ratio (x) in all carboxylic acids of the obtained polyamide, isophthalic acid end group ratio (EG) in all carboxyl end groups, parameter (Y) represented by the above formula (1), formic acid solution viscosity, etc. The polymer properties were measured and calculated by the method described above. These are shown in Table 2 below.

In the production of the polyamide resin compositions in Examples and Comparative Examples, the following materials were used in addition to the polyamide.
[(B) Copper compound]
(B) As a copper compound, copper iodide (CuI) (made by Wako Pure Chemical Industries, trade name: copper iodide (I)) was used.
[(C) Metal halide]
(C) Potassium iodide (KI) (trade name: potassium iodide manufactured by Wako Pure Chemical Industries, Ltd.) was used as the metal halide.
[(D) inorganic filler]
(D) As an inorganic filler, glass fiber (manufactured by Congqing Polycomp International Corporation, trade name: ECS301HP, average fiber diameter: 10 μm, cut length: 3 mm) was used.

[Example 1]
Blended with polyamide (A1), copper compound (B) (copper iodide) and metal halide compound (C) (potassium iodide) at the blending ratio shown in Table 1, manufactured by Toshiba Machine Co., Ltd., TEM 35 mm twin screw extruder (Set temperature: 290 ° C., screw rotation speed: 300 rpm) was supplied from a feed hopper and melt kneaded. The melt-kneaded product extruded from the spinning nozzle was cooled in a strand shape and pelletized to obtain a pellet-like polyamide resin composition.
Moreover, using the obtained polyamide resin composition, a molded product was produced by the method described above, and the appearance stability, impact characteristics, and heat aging resistance during high cycle molding were evaluated. The evaluation results are shown in Table 1 below.

[Example 2]
A polyamide resin composition was obtained in the same manner as described in Example 1 except that polyamide (A2) was used instead of polyamide (A1).
Moreover, using the obtained polyamide resin composition, a molded product was produced by the method described above, and the appearance stability, impact characteristics, and heat aging resistance during high cycle molding were evaluated. The evaluation results are shown in Table 1 below.

Example 3
A polyamide resin composition was obtained in the same manner as described in Example 1, except that polyamide (A3) was used instead of polyamide (A1).
Moreover, using the obtained polyamide resin composition, a molded product was produced by the method described above, and the appearance stability, impact characteristics, and heat aging resistance during high cycle molding were evaluated. The evaluation results are shown in Table 1 below.

Example 4
A polyamide resin composition was obtained in the same manner as described in Example 1 except that polyamide (A4) was used instead of polyamide (A1).
Moreover, using the obtained polyamide resin composition, a molded product was produced by the method described above, and the appearance stability, impact characteristics, and heat aging resistance during high cycle molding were evaluated. The evaluation results are shown in Table 1 below.

Example 5
A polyamide resin composition was obtained in the same manner as described in Example 1, except that polyamide (A5) was used instead of polyamide (A1).
Moreover, using the obtained polyamide resin composition, a molded product was produced by the method described above, and the appearance stability, impact characteristics, and heat aging resistance during high cycle molding were evaluated. The evaluation results are shown in Table 1 below.

Example 6
A polyamide resin composition was obtained in the same manner as described in Example 1 except that polyamide (A6) was used instead of polyamide (A1).
Moreover, using the obtained polyamide resin composition, a molded product was produced by the method described above, and the appearance stability, impact characteristics, and heat aging resistance during high cycle molding were evaluated. The evaluation results are shown in Table 1 below.

Example 7
A polyamide resin composition was obtained in the same manner as described in Example 1 except that polyamide (A7) was used instead of polyamide (A1).
Moreover, using the obtained polyamide resin composition, a molded product was produced by the method described above, and the appearance stability, impact characteristics, and heat aging resistance during high cycle molding were evaluated. The evaluation results are shown in Table 1 below.

Example 8
A polyamide resin composition was obtained in the same manner as described in Example 1 except that polyamide (A8) was used instead of polyamide (A1).
Moreover, using the obtained polyamide resin composition, a molded product was produced by the method described above, and the appearance stability, impact characteristics, and heat aging resistance during high cycle molding were evaluated. The evaluation results are shown in Table 1 below.

Example 9
A polyamide resin composition was obtained in the same manner as described in Example 1 except that polyamide (A9) was used instead of polyamide (A1).
Moreover, using the obtained polyamide resin composition, a molded product was produced by the method described above, and the appearance stability, impact characteristics, and heat aging resistance during high cycle molding were evaluated. The evaluation results are shown in Table 1 below.

Example 10
Blended with polyamide (A1), copper compound (B) (copper iodide) and metal halide compound (C) (potassium iodide) at the blending ratio shown in Table 1, manufactured by Toshiba Machine Co., Ltd., TEM 35 mm twin screw extruder (Set temperature: 290 ° C., screw rotation speed: 300 rpm) was supplied from a feed hopper.
Furthermore, the inorganic filler (D) (glass fiber) was supplied at a ratio of 50 parts by mass to 100 parts by mass of the polyamide from the side feed port, and melt kneading was performed.
Moreover, using the obtained polyamide resin composition, a molded product was produced by the method described above, and the appearance stability, impact characteristics, and heat aging resistance during high cycle molding were evaluated. The evaluation results are shown in Table 1 below.

Example 11
A polyamide resin composition was prepared in the same manner as described in Example 10 except that the inorganic filler (D) (glass fiber) was supplied at a ratio of 100 parts by mass with respect to 100 parts by mass of polyamide from the side feed port. I got a thing.
Moreover, using the obtained polyamide resin composition, a molded product was produced by the method described above, and the appearance stability, impact characteristics, and heat aging resistance during high cycle molding were evaluated. The evaluation results are shown in Table 1 below.

[Comparative Example 1]
A polyamide resin composition was obtained in the same manner as described in Example 1, except that polyamide (A10) was used instead of polyamide (A1).
Moreover, using the obtained polyamide resin composition, a molded product was produced by the method described above, and the appearance stability, impact characteristics, and heat aging resistance during high cycle molding were evaluated. The evaluation results are shown in Table 2 below.

[Comparative Example 2]
A polyamide resin composition was obtained in the same manner as described in Example 1, except that polyamide (A11) was used instead of polyamide (A1).
Moreover, using the obtained polyamide resin composition, a molded product was produced by the method described above, and the appearance stability, impact characteristics, and heat aging resistance during high cycle molding were evaluated. The evaluation results are shown in Table 2 below.

[Comparative Example 3]
A polyamide resin composition was obtained in the same manner as described in Example 1, except that polyamide (A12) was used instead of polyamide (A1).
Moreover, using the obtained polyamide resin composition, a molded product was produced by the method described above, and the appearance stability, impact characteristics, and heat aging resistance during high cycle molding were evaluated. The evaluation results are shown in Table 2 below.

[Comparative Example 4]
A polyamide resin composition was obtained in the same manner as described in Example 1 except that polyamide (A13) was used instead of polyamide (A1).
Moreover, using the obtained polyamide resin composition, a molded product was produced by the method described above, and the appearance stability, impact characteristics, and heat aging resistance during high cycle molding were evaluated. The evaluation results are shown in Table 2 below.

[Comparative Example 5]
A polyamide resin composition was obtained in the same manner as described in Example 1 except that polyamide (A14) was used instead of polyamide (A1).
Moreover, using the obtained polyamide resin composition, a molded product was produced by the method described above, and the appearance stability, impact characteristics, and heat aging resistance during high cycle molding were evaluated. The evaluation results are shown in Table 2 below.

[Comparative Example 6]
A polyamide resin composition was obtained in the same manner as described in Example 1, except that polyamide (A15) was used instead of polyamide (A1).
Moreover, using the obtained polyamide resin composition, a molded product was produced by the method described above, and the appearance stability, impact characteristics, and heat aging resistance during high cycle molding were evaluated. The evaluation results are shown in Table 2 below.

[Comparative Example 7]
A polyamide resin composition was obtained in the same manner as described in Example 1, except that polyamide (A16) was used instead of polyamide (A1).
Moreover, using the obtained polyamide resin composition, a molded product was produced by the method described above, and the appearance stability, impact characteristics, and heat aging resistance during high cycle molding were evaluated. The evaluation results are shown in Table 2 below.

[Comparative Example 8]
A polyamide resin composition was obtained in the same manner as described in Example 1 except that polyamide (A17) was used instead of polyamide (A1).
Further, using the obtained polyamide resin composition, an attempt was made to obtain a molded product by the above-described method. However, the releasability was poor and continuous molding could not be performed, and a molded product could not be obtained.

[Comparative Example 9]
A polyamide resin composition was obtained in the same manner as described in Example 10 except that polyamide (A12) was used instead of polyamide (A1).
Moreover, using the obtained polyamide resin composition, a molded product was produced by the method described above, and the appearance stability, impact characteristics, and heat aging resistance during high cycle molding were evaluated. The evaluation results are shown in Table 2 below.

[Comparative Example 10]
Using the pellet-like polyamide (A1) obtained in Production Example 1, a molded product was produced by the method described above, and appearance stability, impact characteristics, and heat aging resistance during high cycle molding were evaluated. The evaluation results are shown in Table 2 below.

As shown in Table 1, it was confirmed that the molded articles of the polyamide resin compositions of Examples 1 to 11 all had a very good balance of appearance stability, impact characteristics and heat aging resistance.
On the other hand, the molded product of the polyamide resin composition of Comparative Examples 3, 4, 5, and 9 in which (Y) is outside the range of −0.3 ≦ (Y) ≦ 0.8, and (x) 05 ≦ (x) ≦ 0.5 is a molded product of the polyamide resin composition of Comparative Examples 1, 2, 6, and 7 and a comparison in which (B) a copper compound and (C) a metal halogen compound are not blended In the molded article of polyamide of Example 10, any one of the stability of the surface appearance, impact characteristics and heat aging resistance was deteriorated. In Comparative Example 8, a molded product could not be obtained.

  The polyamide resin composition of the present invention and a molded article using the same have industrial applicability in the automotive field, electrical / electronic field, mechanical / industrial field, office equipment field, aerospace field, and the like.

Claims (9)

(A): (a) a unit comprising adipic acid and hexamethylenediamine;
(B) a unit consisting of isophthalic acid and hexamethylenediamine;
A polyamide comprising
The isophthalic acid component ratio (x) in all carboxylic acid components in the polyamide is 0.05 ≦ (x) ≦ 0.5,
And (Y) shown by following formula (1) is -0.3 <= (Y) <= 0.8 (A) 100 mass parts of polyamides,
(Y) = [(EG)-(x)] / [1- (x)] (1)
(In the formula (1), (EG) represents the ratio of isophthalic acid end groups in all carboxyl end groups contained in the polyamide (A), and is represented by the following formula (2).
(EG) = isophthalic acid end group amount / total carboxyl end group amount (2))
(B): 0.005 to 0.6 parts by mass of a copper compound;
Containing a polyamide resin composition.   The polyamide resin composition according to claim 1, wherein the range of (Y) represented by the formula (1) is 0.05 ≦ (Y) ≦ 0.8.   The polyamide resin composition according to claim 1 or 2, wherein the (B) copper compound is at least one selected from the group consisting of copper acetate and copper iodide.   The polyamide resin composition according to any one of claims 1 to 3, further comprising at least one (C) metal halide selected from the group consisting of alkali metal halides and alkaline earth metal halides. .   The polyamide resin composition according to claim 4, wherein the (C) metal halide compound is potassium iodide.   The polyamide resin composition according to claim 4 or 5, wherein a molar ratio of halogen content to copper content (halogen / copper) is 2/1 to 50/1.   The polyamide resin composition according to any one of claims 1 to 6, wherein a copper content is 0.005 to 0.2 parts by mass with respect to 100 parts by mass of the (A) polyamide.   The polyamide resin composition according to any one of claims 1 to 7, further comprising (D) 1 to 200 parts by mass of an inorganic filler with respect to 100 parts by mass of the (A) polyamide.   The molded article containing the polyamide resin composition as described in any one of Claims 1-8.