JP2013117540A - Interface board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology for developing and modifying, at low cost, semiconductor integrated circuit testers that mount both analog processing and digital processing that have a cost advantage, because semiconductor devices to be tested by analog/digital mixed testers are undergoing an evolution within an extremely short period of time and sometimes a revision of a test module is required at such timing as when facility investment or development and improvement costs are collected.SOLUTION: A test of an analog circuit is performed by an interface board 1 and a test sequence is transmitted from a digital tester 3 to the interface board 1. Since the test of the analog circuit is performed by the interface board 1 that can be developed and modified at a low TAT, facility investment and development/modification costs can be easily collected. Furthermore, since the test can be performed near DUTs, a phase rotation and noise inflow due to wiring can be suppressed, thereby allowing the analog circuit to be tested with high accuracy.

Description

  The present invention relates to a semiconductor integrated circuit test apparatus and a semiconductor integrated circuit test method.

  As a semiconductor integrated circuit, a semiconductor integrated circuit having an analog input / output in addition to a digital input / output is widely used. Such a test of a semiconductor integrated circuit is generally performed using a test apparatus having an analog test function. For example, Patent Document 1 discloses a specific example thereof.

  A test apparatus having an analog test function includes an analog signal generator for generating an analog signal to input an analog signal to the semiconductor integrated circuit, and a digitizer for receiving and storing the analog signal from the semiconductor integrated circuit. It is common. Here, the analog operation of the semiconductor integrated circuit provided with the analog input / output has a different configuration for each semiconductor integrated circuit, and the analog input / output unit of the analog / digital mixed testing apparatus is adapted to such a configuration. It is necessary to continue.

JP-A-3-144383

  However, an analog / digital mixed test apparatus having an analog test function in addition to a digital test function is more expensive than a normal digital tester because it is necessary to separately provide a device for handling analog signals.

  For this reason, in recent years, analog test signals and digital test signals have been combined into test modules so that they can be combined with the analog signals and digital signals of the semiconductor device under test in an optimal manner. If the life span is short and the shipment quantity is small, several types of products must be tested with a single analog / digital mixed test equipment. Recombination of test modules for each product type is the cost of test modules and the overhead of recombination. Not realistic from time.

  The function for testing the analog characteristics of the analog signal processing circuit in the semiconductor integrated circuit is to analyze the analog input signal waveform to the semiconductor integrated circuit and the analog output waveform from the semiconductor integrated circuit, and Gain, phase difference of output waveform with respect to input waveform, SNR (SN ratio: signal-to-noise ratio), SFDR (spurious free dynamic range), SINAD (signal) from spectrum analysis of waveform by FFT (Fast Fourier Transform) operation Noise to distortion ratio), THD (total harmonic distortion), etc. need to be determined according to the purpose of the analog circuit.

  In this case, it is necessary to shorten the transmission path between the analog / digital mixed test apparatus and the DUT (device under test). However, the analog / digital mixed test apparatus and the prober usually have a large casing. Therefore, it is difficult to shorten the transmission path to the DUT. When the transmission line is long, for example, at a wavelength in the vicinity of 1 GHz, if the wavelength shortening rate of the transmission line is taken into consideration, phase rotation occurs for one cycle in about 20 cm. Further, when a minute signal such as a current of μA order is handled, the transmission line becomes a capacitive load, and the detection time for charging this capacity becomes long, and TAT increases. In addition, since noise is transmitted through the transmission line, there is a problem that precise testing is difficult.

  In addition, the price of the test module is expensive, and the price of the mixed analog / digital test apparatus requires a large capital investment compared to a normal digital test apparatus. In recent years, the evolution of semiconductor devices under test has been performed in a very short period of time. For this reason, it may be necessary to revise the test module at the timing when the capital investment is recovered, and a test apparatus for semiconductor integrated circuits that incorporates analog processing and digital processing, which are advantageous in terms of cost, can be developed at a low price. Techniques for remodeling are required.

  The present invention has been made to solve the above-described problems, and can be realized as the following forms or application examples.

  [Application Example 1] A semiconductor integrated circuit test apparatus for testing a semiconductor integrated circuit under test having an analog processing function according to this application example, and receiving a control signal from the main test apparatus and the main test apparatus An interface board for transferring analog signals to and from the semiconductor integrated circuit under test, the interface board outputting an analog signal for testing to the semiconductor integrated circuit under test, and the analog signal for testing A first digital signal storage device that performs analog-to-digital conversion and stores it as a first digital signal; and an analog output signal that is supplied from the test analog signal and is output from the semiconductor integrated circuit to be analog-to-digital converted. A second digital signal storage device for storing two digital signals, the first digital signal and the second digital signal Characterized by comprising a digital signal from the comparison operation and quality determination results obtained an arithmetic unit.

  According to this, it becomes possible to handle the main test apparatus mainly for digital processing and the interface board mainly for analog processing as one analog / digital mixed test apparatus. Changing the specifications of the interface board is easier than changing the specifications of the analog / digital mixed test apparatus, and therefore it is possible to more easily test the analog processing circuits of a wide variety of semiconductor integrated circuits.

  In addition, the interface board is disposed closer to the semiconductor integrated circuit under test than the main test apparatus. Therefore, it is possible to suppress delay due to phase rotation in the high frequency region caused by the transmission line, increase of the test time of a minute voltage / current test, and noise intrusion from the transmission line.

  In addition, the development and improvement of the interface board can usually be developed and improved at a lower cost than the development and improvement of the mixed analog / digital test apparatus, and the cost competitiveness can be kept high.

  Note that a part of the main test apparatus provided with an analog test function may be used. In this case, a part of the analog test may be used as an element of the pass / fail judgment using the analog test function. In this case, it becomes possible to reduce the development / improvement load of the interface board.

  Application Example 2 A semiconductor integrated circuit test apparatus according to the application example described above, in which the interface board outputs a control signal to the main test apparatus and a control reception apparatus that receives a control signal from the main test apparatus. A control transmission device is provided.

  According to the application example described above, the control signal from the main test apparatus is transmitted to the interface board. Therefore, the interface board can be controlled by changing the program of the main test apparatus, and the program can be centrally managed.

  In addition, an interrupt signal from the interface board can be output to the main test apparatus. Therefore, it is possible to perform control in accordance with the processing progress state in the interface board, and it is possible to reduce waiting time and the like.

  Application Example 3 A semiconductor integrated circuit test apparatus according to the application example described above, wherein the main test apparatus and the interface board operate with independent clocks.

  According to the application example described above, since the clocks of the main test device and the interface board are set independently, the development and modification of the interface board can be performed independently of the digital test device. It is possible to improve the interface board.

  Application Example 4 The semiconductor integrated circuit test apparatus according to the application example described above, wherein the interface board further includes a pass / fail storage apparatus that stores the pass / fail judgment result and outputs the result to the main test apparatus. And

  According to the application example described above, since the pass / fail judgment result can be transmitted from the interface board to the main test apparatus without synchronizing the main test apparatus and the interface board, it is possible to easily create an operation program for the main test apparatus. It becomes.

  Application Example 5 In the semiconductor integrated circuit test apparatus according to the application example described above, the interface board is a probe card in a wafer test.

  According to the application example described above, it is possible to perform analog processing on the closest substrate in the wafer state, delay due to phase rotation in the high frequency range caused by the transmission path, and increase in test time of minute voltage / current test And noise intrusion from the transmission line can be suppressed.

  Application Example 6 In the semiconductor integrated circuit test apparatus according to the application example described above, the interface board is a fixture board in a package test.

  According to the application example described above, it is possible to perform analog processing on the closest substrate in the packaged state, delay due to phase rotation in the high frequency range caused by the transmission path, and testing of minute voltage / current tests. It becomes possible to suppress time increase and noise intrusion from the transmission line.

  Application Example 7 A semiconductor integrated circuit test apparatus according to the application example described above, wherein the first digital signal storage device stores the test analog signal, and the second digital signal storage device is the analog A BUSY signal A line for outputting to the main test apparatus a signal indicating a state in which both operations are completed and an operation for storing the output signal, and a BUSY signal B line for outputting to the main test apparatus that the pass / fail judgment has been completed. And.

  According to the application example described above, two BUSY signals, BUSY signal A and BUSY signal B, are returned from the interface board to the main test apparatus. The BUSY signal A indicates the status of analog processing, and the BUSY signal B indicates the status of digital processing. By separately processing the status of analog processing and digital processing in this way, it becomes possible to operate the main test device without waiting for the processing of the digital signal after acquiring the analog signal, and the interface board and the main test device Can be activated simultaneously.

  As a result, the test time can be shortened. In addition, since the processing end at the interface board can be received via the BUSY signal B line, the main test device can obtain the later end signal of the interface board and the main test device. It is possible to provide a test apparatus for a semiconductor integrated circuit that can be tested without occurring. Also, by eliminating useless time lag, the test time can be shortened and the inspection cost per one can be reduced.

  Application Example 8 A semiconductor integrated circuit test apparatus according to the application example described above, which is equivalent to a non-defective product of the semiconductor integrated circuit under test between the analog signal generation device and the first digital signal storage device. An analog processing circuit for performing the operation is provided.

  According to the application example described above, when the semiconductor integrated circuit under test is subjected to processing different from the input signal, such as modulation, the semiconductor integrated circuit under test can be tested with reference to a signal that can be directly compared. It becomes. By directly comparing the signals, it becomes possible to compare more precise waveforms and frequency distributions. Furthermore, in this case, it is extremely difficult to fit a device that performs an operation equivalent to a non-defective product of the semiconductor integrated circuit under test into a normal analog / digital mixed testing device, and requires a great deal of cost. It is possible to perform pass / fail determination easily and at low cost.

  Application Example 9 In the semiconductor integrated circuit testing apparatus according to the application example described above, the analog processing circuit adjusts a phase difference between the first digital signal and the second digital signal in the interface board. The phase adjustment circuit is obtained.

  According to the application example described above, when an analog signal having a slight delay characteristic is handled for each type of semiconductor integrated circuit under test, the delay characteristic between the first digital signal and the second digital signal is locally set. It can be corrected by doing. By resetting the delay time between the first digital signal and the second digital signal within the interface board, it is possible to make a pass / fail judgment without changing the program of the main test apparatus. In addition, since the buffer circuit for driving the semiconductor integrated circuit under test and the homogeneous buffer circuit are passed through, when comparing the first digital signal and the second digital signal, the values of distortion and noise received from the buffer circuit can be made uniform. Therefore, it is possible to easily correct the influence of distortion and noise.

  Application Example 10 A semiconductor integrated circuit test apparatus according to the application example described above, wherein the semiconductor integrated circuit under test is connected to the buffer circuit included in the analog signal generator and a relay unit in which a relay is integrated. And electrically connected.

  According to the application example described above, each semiconductor integrated circuit under test has an independent buffer circuit. Therefore, it is possible to shield the influence of the parasitic capacitance and the like of the adjacent semiconductor integrated circuit to be tested. Further, since the buffer circuit is connected via the relay, the test can be performed while avoiding the influence of a surge voltage or the like that may occur when the semiconductor integrated circuit to be tested is switched. Further, by controlling this relay unit according to an interrupt request from the main test apparatus, an analog test such as a DC test by the main test apparatus can be performed.

  Application Example 11 A semiconductor integrated circuit test apparatus according to the application example described above, wherein the first digital signal storage device stores a digital signal processor (DSP) and a signal processed by the DSP. The second digital signal storage device includes a DSP corresponding to each of the second digital signal storage devices, and a second signal storage unit that stores a signal processed by the DSP. And

  According to the application example described above, it is possible to perform signal processing so that the analog output signal output from each semiconductor integrated circuit under test can be easily processed, reducing the load on the digital arithmetic device, and increasing the speed. Processing can be performed.

  Application Example 12 A semiconductor integrated circuit test apparatus according to the application example described above, which is a sampling clock for controlling the analog signal generation device and sampling for controlling analog-digital conversion in the first digital signal storage device. The clock and the sampling clock for controlling the analog / digital conversion by the second digital signal storage device are provided independently of each other.

  According to the above application example, when the bandwidth of the first analog signal and the second analog signal is changed, unnecessary sampling is suppressed by providing a clock necessary for sampling each signal, and the analog signal is reduced with a small memory capacity. Can be stored. As a typical example, when a high frequency of about 80 MHz is modulated with a signal of 20 KHz at most, the analog signal generator and the first digital signal storage device use sampling timing that can correspond to 20 KHz, and only the second digital signal storage device. Sampling timing corresponding to 80 MHz can be used, and signal processing can be performed with necessary and sufficient sampling timing.

  Application Example 13 A semiconductor integrated circuit test method according to this application example is a test method for a semiconductor integrated circuit using a main test apparatus and an interface board for testing a semiconductor integrated circuit under test having an analog processing function. A is a step in which the interface board receives a control signal from the main test apparatus, and B is a step in which an analog signal for test is supplied from the analog signal generator included in the interface board to the semiconductor integrated circuit to be tested and The analog signal for test is converted from analog to digital and stored as a first digital signal. In step C, the analog signal output from the semiconductor integrated circuit under test is supplied with the analog signal for test. In the interface board And digitally converting and storing as a second digital signal, step D as a step D, comparing the first digital signal and the second digital signal in the interface board and performing a pass / fail judgment, step E as Outputting the pass / fail judgment result to the main test apparatus.

  According to this, the test status performed by the interface board is sent to the main test apparatus. The main test apparatus detects that the semiconductor integrated circuit under test has been electrically opened by outputting to the main test apparatus that the accumulation of the first digital signal and the second digital signal has been completed. Can do. As a result, the test of the semiconductor integrated circuit under test by the main test apparatus and the calculation by the digital arithmetic unit on the interface board can be performed in parallel, and the time required for the test can be shortened.

  Application Example 14 In the semiconductor integrated circuit test method according to the application example described above, before step A, as step F, a reset signal is output from the main test apparatus to the interface board, and the reset signal And at least part of the stored contents in the interface board is reset.

  According to the application example described above, since the test is performed after resetting at least a part of the stored contents in the interface board before the test is started, the test can be performed regardless of the history.

  Application Example 15 A semiconductor integrated circuit test method according to the application example described above, wherein a relay control signal is output from the main test apparatus to the relay unit as Step G between Step F and Step A. And closing the relay unit to electrically connect the semiconductor integrated circuit under test and the interface board.

  According to the application example described above, since the interface board that has received the signal from the main test apparatus finishes the information processing and the relay unit is closed in an electrically stable state, the semiconductor integrated circuit under test is electrically damaged. The test can be performed without giving.

  Application Example 16 A semiconductor integrated circuit test method according to the application example described above, wherein a test mode selection signal is sent from the main test apparatus to the interface board as Step H between Step F and Step G. And selecting test conditions on the interface board.

  According to the application example described above, the test parameter set included in the control device can be directly called by the main test device. As a result, the test parameter set can be centrally managed by the main test apparatus, and the test conditions can be set more efficiently.

  Application Example 17 A semiconductor integrated circuit test method according to the application example described above, wherein a digital signal corresponding to an analog signal is digitized by the interface board in accordance with a control signal output from the main test apparatus. An analog test function is given to the main test apparatus by returning a signal to the main test apparatus.

  According to the application example described above, a test function of an analog processing function with low versatility is given to an easily compatible interface board and used as a measurement system in which the interface board for managing analog processing and a digital test apparatus are linked. Thus, it becomes possible to test a semiconductor integrated circuit having an analog processing function with a short setup time using a digital test apparatus. In addition, by shortening the setup time, it is possible to reduce the cost associated with depreciation used for each inspection.

1 is a block diagram showing the configuration of a semiconductor integrated circuit test apparatus according to an embodiment. The block diagram for demonstrating the communication part between a digital test device and an interface board. It is an example of a test pattern description for driving a semiconductor integrated circuit test apparatus. FIG. 4 is an example of a process flow diagram illustrating steps for supplementing a test pattern description example in FIG. 3. The partial wiring diagram which shows the structure at the time of giving a buffer circuit to the branch of a branch part. The partial wiring diagram in the case of using the DC test function with which a digital test device is provided.

  Hereinafter, embodiments embodying the present invention will be described with reference to the drawings.

(First Embodiment: Configuration of Test Device for Semiconductor Integrated Circuit)
The configuration of the semiconductor integrated circuit test apparatus according to the present embodiment will be described below with reference to the drawings. FIG. 1 is a block diagram showing a configuration of a semiconductor integrated circuit test apparatus according to the present embodiment. FIG. 1 illustrates a block diagram when four semiconductor integrated circuits DUT_A, DUT_B, DUT_C, and DUT_D are connected at the same time. However, the number is not limited to four, and one or five There may be more than one. In this embodiment, four cases are illustrated. Here, when any one of the operations is indicated, it is also referred to as a semiconductor integrated circuit DUT to be tested. Further, the case where two types of test modes (test mode A and test mode B) are provided as a program for testing the semiconductor integrated circuit DUT under test is intended to be limited to two types. is not.

FIG. 2 is a block diagram for explaining a communication portion between the digital test apparatus as the main test apparatus and the interface board. Here, a case where a digital test apparatus is used as the main test apparatus is described. However, a digital / analog mixed test apparatus may be used. In this case, the load applied to the development / modification of the interface board described later is used. It becomes possible to reduce.
A semiconductor integrated circuit test apparatus 100 includes a digital test apparatus 3, an interface board 1, and a computer 13 as a control apparatus.

  The digital test apparatus 3 includes digital input lines 4A, 4B, 4C, 4D, digital output lines 5A, 5B, 5C, 5D, digital input / output buses 6A, 6B, 6C, 6D, analog input signal lines 7A, 7B, 7C, 7D, analog output signal lines 8A, 8B, 8C, 8D, relay unit drive line 16, reset line 51, test start line 52, test mode A line 53, test mode B line 54, and these lines are The digital test apparatus 3 is connected to the interface board 1 through a relay unit 10.

  The interface board 1 includes an analog signal generator 65, a digitizer 25R as a first digital signal storage device, digitizers 25A, 25B, 25C, and 25D as second digital signal storage devices, an analog processing circuit 30, and a relay unit in which relays are integrated. 15, logic control circuit 70, BUSY signal A line 55, BUSY signal B line 56, DUT_A test result signal line 57, DUT_B test result signal line 58, DUT_C test result signal line 59, DUT_D test result signal line 60, bus line 26 A control receiving device 71, a control transmitting device 72, a pass / fail storage device 46, and a relay unit 10.

  Here, the interface board 1 has a probe card configuration when the semiconductor integrated circuit DUT under test is in a wafer state, and a fixture board configuration when in a package state. Here, the probe card refers to a board with a probe for detecting the operating state of the semiconductor integrated circuit DUT by applying a probe to the bonding pad of the semiconductor integrated circuit DUT to be tested. It also serves as a connector for connecting the electrode of the semiconductor integrated circuit DUT and the digital test apparatus 3. The fixture board is a packaged board for contacting the electrodes corresponding to the electrode arrangement of the packaged semiconductor integrated circuit DUT to detect the operating state of the semiconductor integrated circuit DUT. It also serves as a connector for connecting the electrode of the test semiconductor integrated circuit DUT and the digital test apparatus 3. The digital test apparatus 3 is synchronized according to the main clock generated by the digital test apparatus 3. The interface board 1 is synchronized by a sub clock independent of the digital test apparatus 3.

  The digital test apparatus 3 controls a sequence related to the test along with the execution of the digital test. The digital input lines 4A, 4B, 4C and 4D have a function of transmitting a test digital signal to the semiconductor integrated circuits DUT_A, DUT_B, DUT_C and DUT_D. The digital output lines 5A, 5B, 5C, and 5D have a function of receiving a test digital signal from the semiconductor integrated circuits DUT_A, DUT_B, DUT_C, and DUT_D. The digital input / output buses 6A, 6B, 6C, 6D are connected to the semiconductor integrated circuits DUT_A, DUT_B, DUT_C, DUT_D and the digital test apparatus 3 with digital input lines 4A, 4B, 4C, 4D, and digital outputs. A large amount of signals are transmitted and received to synchronize through the lines 5A, 5B, 5C, and 5D and to test the digital portion of the semiconductor integrated circuits DUT_A, DUT_B, DUT_C, and DUT_D. As described above, the digital input lines 4A, 4B, 4C, and 4D, the digital output lines 5A, 5B, 5C, and 5D, and the digital input / output buses 6A, 6B, 6C, and 6D pass through the relay unit 10 included in the interface board 1. The digital test apparatus 3 is connected. When the digital test apparatus 3 includes an analog test apparatus, the analog test apparatus may be used together to test the semiconductor integrated circuit DUT to be tested. In this case, the interface board 1 It is possible to reduce the components of the analog processing part provided.

  The interface board 1 is controlled by a digital test apparatus 3 and mainly performs an analog test. The control receiving device 71 included in the interface board 1 receives a control signal from the digital test device 3. Specifically, control signals related to the reset line 51, the test start line 52, the test mode A line 53, and the test mode B line 54 are received.

  The control transmission device 72 returns a status signal from the interface board 1 to the digital test device 3. Specifically, a status signal is returned from the interface board 1 to the digital test apparatus 3 via the BUSY signal A line 55 and the BUSY signal B line 56.

  The analog signal generator 65 includes a waveform memory 34, a reference voltage generator 35, a digital / analog (DA) converter 33, a low pass filter (LPF) 32, and buffer circuits 31IN and 31R.

  The waveform memory 34 stores waveform data corresponding to an input signal applied to the semiconductor integrated circuit DUT. The waveform data in the waveform memory 34 is received from the test program memory 43 in the logic control circuit 70. The DA converter 33 receives the waveform data from the waveform memory 34 and performs digital / analog conversion. The reference voltage generator 35 defines a voltage per bit of the DA converter 33. In other words, the waveform shape is provided from the DA converter 33 and the waveform magnitude is provided from the reference voltage generator 35. The LPF 32 passes a frequency band output as a signal by the DA converter 33 and blocks signals of frequencies exceeding the frequency band so as to remove quantization noise and the like of the DA converter 33.

  The buffer circuit 31IN is provided for separating the influence of the input capacitance and impedance of the semiconductor integrated circuit DUT under test from the LPF 32. The buffer circuit 31R is provided to separate the influence of the input capacity and impedance of the analog processing circuit 30 from the LPF 32. The characteristics of the buffer circuit 31IN and the buffer circuit 31R are preferably aligned with each other. In this case, distortion and noise generated in the buffer circuit 31IN and the buffer circuit 31R are aligned. For this reason, when determining the quality of the semiconductor integrated circuit DUT under test, it is possible to eliminate the influence by aligning distortion and noise, and it is possible to determine the quality with higher accuracy.

  The analog processing circuit 30 is configured according to the semiconductor integrated circuit DUT to be tested, such as down-conversion, upper conversion, IV conversion circuit, amplifier circuit, filter circuit, mixer, rectifier circuit, and the like. As the analog processing circuit 30, it is preferable to use a circuit equivalent to a non-defective product of the semiconductor integrated circuit DUT to be tested or a non-defective product of the semiconductor integrated circuit DUT to be tested. In this case, the test should be performed more precisely and easily. Is possible. In this case, particularly when a high-frequency signal is handled, the signal may be separated into a plurality of signals including a baseband signal. In that case, it is preferable to provide a plurality of signal processing systems so as to cope with a plurality of signals. FIG. 1 shows a system in which one output is obtained for one input signal. Here, when the semiconductor integrated circuit DUT to be tested or a circuit equivalent to a non-defective product of the semiconductor integrated circuit DUT to be tested supports a plurality of input / outputs, it is preferable to increase the number of terminals. Become.

  Further, when the input waveform and the output waveform of the semiconductor integrated circuit DUT to be tested are substantially similar, a phase adjustment circuit can be used as the analog processing circuit 30. When the phase adjustment circuit is used, it is desirable that the delay amount can be adjusted on the interface board 1 using a trimmer resistor, a dip switch, or the like. In this case, it is possible to adjust the phase adjustment more quickly than in the case where the phase adjustment is changed using a program or the like. It is also possible to perform phase adjustment by being incorporated in a program. In this case, phase adjustment can be made to correspond to many patterns.

  Further, when the analog processing circuit 30 is used as a phase adjustment circuit, the delay amount of the delay due to the buffer circuit 31IN and the delay due to the semiconductor integrated circuit DUT under test corresponds to the delay of the buffer circuit 31R. If the influence on the pass / fail judgment is small, it can be omitted. Further, when the load driving capability of the LPF 32 is sufficiently high and the influence of the disturbance of the analog signal on the pass / fail judgment is small, the buffer circuit 31IN and the buffer circuit 31R can be omitted. If the sampling interval of the DA converter 33 is sufficiently shorter than the frequency band output as a signal by the DA converter 33, the LPF 32 can be omitted. In this case, the load drive capability of the DA converter 33 is sufficiently high. In this case, in addition to the LPF 32, the buffer circuit 31IN and the buffer circuit 31R can be omitted.

  FIG. 5 is a partial wiring diagram showing a configuration when a buffer circuit is provided to the branch of branching section 75 shown in FIG. As described above, a configuration in which the buffer circuits 76A, 76B, 76C, and 76D are provided for each semiconductor integrated circuit DUT is also preferable, and the influence of the input capacitance, inductance, etc. between the semiconductor integrated circuits DUT is separated and tested. Is possible.

  The digitizer 25R includes a buffer circuit 20R, an analog / digital (AD) converter 21R, a storage device 22R, a digital signal processor (DSP) device 23R, and a storage device 24R. Then, a signal from the buffer circuit 31R included in the analog signal generator 65 is received by the buffer circuit 20R via the analog processing circuit 30.

  The buffer circuit 20R is provided in order to separate the influence of the output capacity, impedance, etc. of the analog processing circuit 30 from the AD converter 21R. The AD converter 21R has a function of AD-converting the signal received from the analog processing circuit 30 and converting it into a digitally storable amount. The storage device 22R has a function of storing the digital signal converted by the AD converter 21R. The DSP device 23R has a function of performing preprocessing so that digital signals stored in the storage device 22R can be easily compared. The storage device 24R has a function of storing a signal preprocessed by the DSP device 23R and outputting the signal to the digital arithmetic device 44 via the bus line 26.

  Since the digitizers 25A, 25B, 25C, and 25D have the same configuration, only the digitizer 25A will be described in detail. The digitizer 25A includes a buffer circuit 20A, an AD converter 21A, a storage device 22A, a DSP device 23A, and a storage device 24A.

  The buffer circuit 20A is provided to separate the influence of the output capacity, impedance, etc. of the semiconductor integrated circuit DUT_A from the AD converter 21A. The AD converter 21A has a function of AD-converting a signal received from the semiconductor integrated circuit DUT_A to be converted into a digitally storable amount. The storage device 22A has a function of storing the digital signal converted by the AD converter 21A. The DSP device 23A has a function of performing preprocessing so that digital signals stored in the storage device 22A can be easily compared.

  The storage device 24 </ b> A has a function of storing a signal that has been preprocessed by the DSP device 23 </ b> A and outputting the signal to the digital arithmetic device 44 via the bus line 26. Here, even if the load driving capability of the semiconductor integrated circuit DUT to be tested directly drives the AD converter 21A, for example, the influence of the waveform deformation amount on the pass / fail judgment is small, and the driving capability in the previous stage of the buffer circuit 20R is high. Even if the AD converter 21R is directly driven, the buffer circuit 20R and the buffer circuits 20A, B, C, and D can be omitted if the waveform deformation amount has little influence on the quality determination.

  Further, it is preferable that the characteristics of the buffer circuit 20A and the buffer circuit 20R are aligned with each other. In this case, distortion and noise generated in the buffer circuit 20A and the buffer circuit 20R are aligned. For this reason, when determining the quality of the semiconductor integrated circuit DUT under test, it is possible to eliminate the influence by aligning distortion and noise, and it is possible to determine the quality with higher accuracy.

  In addition, the time required for digital signal processing is shorter than the time required for the analog quantity test of the semiconductor integrated circuit DUT to be tested, and the influence on the test time is small even if the time required for digital signal processing is extended. When the time required for digital signal processing is short compared to the processing time in FIG. 3, the DSP devices 23A, 23B, 23C, and 23D included in the digitizers 25A, 25B, 25C, and 25D, and the storage devices 24A, 24B, 24C, and 24D Can be omitted.

  The relay unit 15 is provided in the interface board 1. Opening and closing of the relays constituting the relay unit 15 is controlled by a signal of the relay unit drive line 16 provided from the digital test apparatus 3.

  Further, as shown in FIG. 6, when using the DC test function provided in the digital test apparatus 3, the relay unit 15 performs control by interrupting the digital test apparatus 3, switching the relay unit 15, and digital test apparatus 3. You may make it test by.

  The computer 13 includes a data bus 12 and a data request output line 14. The computer 13 receives a command from the digital test apparatus 3 via the data request output line 14 and sets the voltage of the waveform memory 34 and the reference voltage generator 35 to the interface board 1 via the data bus 12. Is going.

  The logic control circuit 70 includes a sampling clock A generator 40, a sampling clock R generator 41, a sampling clock S generator 42, a test program memory 43, a digital arithmetic device 44, a counter 45, a pass / fail storage device 46, and a judgment standard memory 47. I have. The sampling clock A generator 40 generates a sampling clock to be given to the analog signal generator 65 based on the sub clock that controls the interface board 1. The sampling clock R generator 41 generates a sampling clock to be supplied to the digitizer 25R based on the sub clock that controls the interface board 1. The sampling clock S generator 42 provides a sampling clock to be supplied to the digitizers 25A, 25B, 25C, and 25D based on the sub clock that controls the interface board 1.

  The semiconductor integrated circuit DUT to be tested is, for example, a modulation circuit or the like by independently providing a sampling clock supplied to the analog signal generator 65, a sampling clock supplied to the digitizer 25R, and a sampling clock supplied to the digitizers 25A, 25B, 25C, 25D. When the frequency input to the semiconductor integrated circuit DUT to be tested is different from the output frequency, it is possible to provide a sampling clock that achieves both necessary and sufficient accuracy.

  Here, a circuit equivalent to a non-defective product of the semiconductor integrated circuit DUT to be tested is used as the analog processing circuit 30, and the signals of the digitizer 25R and the digitizers 25A, 25B, 25C, and 25D are substantially similar signals, whereas the analog signal When the configuration of the signal waveform of the generator 65 is different from the others, the sampling clock R generator 41 may be omitted and the sampling clock from the sampling clock S generator 42 may be received. In this case, the analog circuit can be simplified by using only the sampling clock A generator 40 and the sampling clock S generator 42.

  When the semiconductor integrated circuit DUT to be tested uses a circuit that does not involve modulation in the frequency domain, such as a linear amplifier, the sampling clock A generator 40 and the sampling clock R generator 41 are omitted, and an analog signal The sampling clock from the sampling clock S generator 42 may also be provided to the generator 65 and the digitizer 25R. Here, by outputting a common sampling clock to the digitizers 25A, 25B, 25C, and 25D, a plurality of digitizers 25A, 25B, 25C, and 25D can be controlled by a single sampling clock S generator 42. There is no need to handle a plurality of circuits 42, and the analog circuit can be simplified. The interface board 1 may include a fixture board and a probe card.

  The test program memory 43 has a function of providing information including, for example, an algorithm accompanying the calculation to the digital calculation device 44 when the digital calculation device 44 performs the calculation. The determination standard memory 47 stores a normal value range in the digital arithmetic unit 44 so as to provide a normal value range. The counter 45 counts the number of clocks given to the analog signal generator 65 and outputs the fact that the signal generation of the analog signal generator 65 is completed to the bus line 26 when it reaches a specified value. The digital arithmetic unit 44 compares the signal output from the digitizer 25R with the signals output from the digitizers 25A, 25B, 25C, and 25D, and determines whether or not the signal is within the signal range received from the determination standard memory 47. test.

  The pass / fail storage device 46 stores the pass / fail signal from the digital arithmetic unit 44, and when requested, to the digital test device 3, the DUT_A test result signal line 57, the DUT_B test result signal line 58, and the DUT_C test result signal line. 59, a pass / fail signal is transmitted through the DUT_D test result signal line 60. By providing the above-described configuration, an analog test function is provided to the interface board 1 so as to measure the digital test apparatus 3 and the semiconductor integrated circuit DUT to be tested. Since it becomes possible to cope with DUT, it is possible to easily cope with switching of the semiconductor integrated circuit DUT as a product while reducing the investment amount.

  Further, since the analog test function can be mounted on the interface board 1, the analog test circuit can be arranged in the vicinity of the semiconductor integrated circuit DUT to be tested. Therefore, it is possible to perform tests with high accuracy while avoiding the influence of noise, wiring impedance, and parasitic capacitance. In addition, although the cost for remodeling and development of the digital test apparatus 3 is usually high, the cost for development and remodeling of the interface board 1 is low. Furthermore, the configuration of the interface board 1 can be simplified by operating the digital test apparatus 3 and the interface board 1 asynchronously. Therefore, the development / modification period can be shortened, and from this point of view, the test of each semiconductor integrated circuit DUT under test per unit time can be kept at a low cost.

(Second Embodiment: Operation Sequence of Semiconductor Integrated Circuit Test Apparatus)
The operation sequence of the semiconductor integrated circuit test apparatus according to the present embodiment will be described below with reference to the drawings. FIG. 3 shows an example of test pattern description for driving a semiconductor integrated circuit test apparatus. FIG. 4 is an example of a process flow diagram showing steps for supplementing the test pattern description example in FIG. In FIG. 3, “0” and “1” represent signals output from the digital test apparatus 3 to the interface board 1, and are represented by “L”, “H”, and “X”. Represents a signal output from the interface board 1 to the digital test apparatus 3. Note that “X” indicates a state in which “H” or “L” does not matter. The hardware configuration has been described with reference to FIGS.

  First, as step 1 (corresponding to step F), the digital test apparatus 3 outputs a reset signal to the interface board 1 via the reset line 51. The interface board 1 that has received the reset signal initializes the BUSY signal A and the BUSY signal B (for example, drops them to L). Then, the stored contents of the analog signal generator 65, the digitizer 25R, the digitizers 25A, 25B, 25C, 25D and the logic control circuit 70 are initialized. Here, when the similar semiconductor integrated circuit DUT to be tested is continuously tested, the storage device 22R, the storage device 24R, the storage devices 22A, 22B, 22C, 22D, the storage devices 24A, 24B, 24C, 24D, the counter 45, the memory of the pass / fail storage device 46 may be initialized. In this case, step 2 described later can be omitted. Furthermore, in this case, the computer 13, the data request output line 14, and the data bus 12 as the control device can be omitted.

  Next, as step 2 (corresponding to step H), a test mode is set. For example, the digital test apparatus 3 sets the test mode A line 53 to “1” so that the interface board 1 selects the test mode A. Upon receiving this signal, the interface board 1 transmits a data request signal related to the test mode A to the computer 13 as the control device via the data request output line 14. After receiving the data request signal, the computer 13 outputs data relating to the test mode A to the interface board 1 via the data bus 12.

  The data includes, for example, the potential of the reference voltage generator 35, the waveform signal of the waveform memory 34, the sampling clock frequency of the sampling clock R generator 41, the sampling clock frequency of the sampling clock S generator 42, information in the test program memory, The calculation conditions of the digital calculation device 44, the calculation conditions of the DSP device 23R, and the calculation conditions of the DSP devices 23A, 23B, 23C, and 23D are output to the interface board 1.

  Next, as step 3 (corresponding to step G), the output from the digital test apparatus 3 is output to the relay unit 15 via the relay unit drive line 16 to perform a connection operation. Specifically, the semiconductor integrated circuit DUT_A and the digitizer 25A, the semiconductor integrated circuit DUT_B and the digitizer 25B, the semiconductor integrated circuit DUT_C and the digitizer 25C, and the semiconductor integrated circuit DUT_D and the digitizer 25D are connected.

  Next, in step 4 (corresponding to step A), the digital test apparatus 3 outputs “1” to the interface board 1 as a test start signal on the test start line 52. The interface board 1 starts the test and outputs “H” to the BUSY signal A line 55 as a signal for starting the analog test, and outputs to the digital test apparatus 3 that the analog test has started.

  Next, as step 5 (corresponding to step B), when the interface board 1 completes the analog test, the interface board 1 outputs the BUSY signal B line 56 to output to the digital testing device 3 that the analog test has been completed. In addition, “H” is output to the digital test apparatus 3 indicating that the analog test has been completed.

  Next, as step 6 (corresponding to step C), the interface board 1 continues the analog test, and the digital signal AD-converted by the AD converter 21R and AD converters 21A, 21B, 21C, and 21D is converted into a DSP device. The pass / fail judgment is performed by calculation using 23A, 23B, 23C, and 23D, or calculation using the digital calculation device 44. In this case, when the DSP device 23R, the DSP devices 23A, 23B, 23C, and 23D and the storage devices 24A, 24B, 24C, and 24D are omitted, AD conversion is performed by the AD converters 21A, 21B, 21C, and 21D. Then, the digital signals stored in the storage devices 22A, 22B, 22C, and 22D are output to the digital arithmetic unit 44. At the same time, the digital test apparatus 3 performs a digital function test of the semiconductor integrated circuit DUT under test.

  By performing timing control in this way, the interface board 1 and the digital test apparatus 3 can perform processing in parallel at the same time, and the test time can be shortened. When the digital test apparatus 3 includes an analog test apparatus, the analog test apparatus may be used together to test the semiconductor integrated circuit DUT to be tested. In this case, the interface board 1 It is possible to reduce the components of the analog processing part provided.

  Next, in step 7 (corresponding to step D), the pass / fail judgment of the semiconductor integrated circuit DUT to be tested in the interface board 1 is completed, and the interface board 1 receives the DUT_A test result signal line 57, the DUT_B test result signal line 58, and the DUT_C. When the test result is output to the test result signal line 59 and the DUT_D test result signal line 60, “L” is output to the BUSY signal A line 55 to output to the digital test apparatus 3 that the pass / fail judgment has been completed. The fact that the digital test has been completed is output to the digital test apparatus 3. If the test in the digital test apparatus 3 has been completed first, the next test is started when the BUSY signal A line 55 becomes “L”. If the test in the digital test apparatus 3 has been continued, the test is completed after the test in the digital test apparatus 3 is completed. FIG. 3 shows an example in which the semiconductor integrated circuit DUT_D to be tested is defective.

  As described above, the BUSY signal B line 56 is provided, and the completion of the analog signal processing in the interface board 1 is output to the digital test apparatus 3 so that the interface board 1 and the digital test apparatus 3 perform processing simultaneously and in parallel. Is possible. That is, the test time can be shortened.

  If the computer 13, the data request output line 14, and the data bus 12 are provided as a control device, the analog signal generator 65, digitizer 25 R, digitizers 25 A, 25 B, 25 C, 25 D, and logic control circuit 70 are provided. Since processing conditions can be written and read out via the keyboard and mouse of the computer 13, the parameters can be easily changed.

  DESCRIPTION OF SYMBOLS 1 ... Interface board, 3 ... Digital test apparatus as main test apparatus, 4A ... Digital input line, 5A ... Digital output line, 6A ... Digital input / output bus, 7A ... Analog input signal line, 8A ... Analog output signal line, 10 DESCRIPTION OF SYMBOLS ... Relay part, 12 ... Data bus, 13 ... Computer as control apparatus, 14 ... Data request output line, 15 ... Relay unit, 16 ... Relay unit drive line, 20A ... Buffer circuit, 20R ... Buffer circuit, 21A ... AD conversion 21R ... AD converter, 22A ... storage device, 22R ... storage device, 23A ... DSP device, 23R ... DSP device, 24A ... storage device, 24R ... storage device, 25A ... digitizer, 25B ... digitizer, 25C ... digitizer, 25D ... Digitizer, 25R ... Digitizer, 26 ... Bus line, 30 ... A Log processing circuit, 31IN ... buffer circuit, 31R ... buffer circuit, 32 ... LPF, 33 ... DA converter, 34 ... waveform memory, 35 ... reference voltage generator, 41 ... sampling clock R generator, 42 ... sampling clock S generation Device: 43 ... Test program memory, 44 ... Digital arithmetic unit, 45 ... Counter, 46 ... Pass / fail memory device, 47 ... Judgment standard memory, 51 ... Reset line, 52 ... Test start line, 53 ... Test mode A line, 54 ... Test mode B line, 55 ... BUSY signal A line, 56 ... BUSY signal B line, 57 ... DUT_A test result signal line, 58 ... DUT_B test result signal line, 59 ... DUT_C test result signal line, 60 ... DUT_D test result signal line 65 ... analog signal generator 70 ... logic control circuit 71 ... control receiver 72 ... control Transmitting device, 75 ... branch portion, 76A ... buffer circuit, 76B ... buffer circuit, 76C ... buffers circuit, 76D ... buffer circuit, 100 ... test apparatus.

Claims (17)

A semiconductor integrated circuit test apparatus for testing a semiconductor integrated circuit under test having an analog processing function,
Main test equipment;
An interface board that receives a control signal from the main test apparatus and exchanges analog signals with the semiconductor integrated circuit under test;
The interface board is
An analog signal generator for outputting a test analog signal to the semiconductor integrated circuit under test;
A first digital signal storage device for analog-to-digital conversion of the test analog signal and storing it as a first digital signal;
A second digital signal storage device for receiving the supply of the test analog signal and converting the analog output signal output from the semiconductor integrated circuit under test from analog to digital and storing it as a second digital signal;
A test apparatus for a semiconductor integrated circuit, comprising: an arithmetic unit that compares and calculates the first digital signal and the second digital signal to obtain a pass / fail judgment result. A test apparatus for a semiconductor integrated circuit according to claim 1,
The interface board includes a control receiving device that receives a control signal from the main test device, and a control transmission device that outputs the control signal to the main test device. A test apparatus for a semiconductor integrated circuit according to claim 1 or 2,
A test apparatus for a semiconductor integrated circuit, wherein the main test apparatus and the interface board operate with independent clocks. A test apparatus for a semiconductor integrated circuit according to any one of claims 1 to 3,
The interface board further includes a pass / fail storage device that stores the pass / fail judgment result and outputs the result to the main test device. A test apparatus for a semiconductor integrated circuit according to claim 1,
2. The semiconductor integrated circuit testing apparatus according to claim 1, wherein the interface board is a probe card in a wafer test. A test apparatus for a semiconductor integrated circuit according to claim 1,
A test apparatus for a semiconductor integrated circuit, wherein the interface board is a fixture board in a package test. A test apparatus for a semiconductor integrated circuit according to any one of claims 1 to 6,
An operation in which the first digital signal storage device stores the test analog signal;
An operation in which the second digital signal storage device stores the analog output signal;
A BUSY signal A line for outputting a signal indicating a state of completing both operations to the main test device;
BUSY signal B line for outputting to the main test device that the pass / fail judgment has been completed;
A test apparatus for a semiconductor integrated circuit, comprising: A test apparatus for a semiconductor integrated circuit according to any one of claims 1 to 7,
A test apparatus for a semiconductor integrated circuit, comprising an analog processing circuit that performs an operation equivalent to a non-defective product of the semiconductor integrated circuit under test between the analog signal generator and the first digital signal storage device. A test apparatus for a semiconductor integrated circuit according to claim 8,
2. The semiconductor integrated circuit testing device according to claim 1, wherein the analog processing circuit is a phase adjustment circuit capable of adjusting a phase difference between the first digital signal and the second digital signal in the interface board. A test apparatus for a semiconductor integrated circuit according to any one of claims 1 to 9,
The semiconductor integrated circuit testing apparatus, wherein the semiconductor integrated circuit under test is electrically connected to a buffer circuit included in the analog signal generator via a relay unit in which relays are integrated. A test apparatus for a semiconductor integrated circuit according to any one of claims 1 to 10,
The first digital signal storage device includes a digital signal processor (DSP) and a first signal storage unit that stores a signal processed by the DSP,
The second digital signal storage device includes a DSP corresponding to each of the second digital signal storage devices, and a second signal storage unit that stores a signal processed by the DSP. Testing equipment. A test apparatus for a semiconductor integrated circuit according to any one of claims 1 to 11,
A sampling clock for controlling the analog signal generator;
A sampling clock for controlling analog-digital conversion in the first digital signal storage device;
A sampling clock for controlling analog-digital conversion in the second digital signal storage device;
Are provided independently of each other, a semiconductor integrated circuit testing apparatus. A test method of a semiconductor integrated circuit using a main test apparatus and an interface board for testing a semiconductor integrated circuit under test having an analog processing function,
As step A, the interface board receives a control signal from the main test apparatus;
As Step B, a test analog signal is supplied from the analog signal generator included in the interface board to the semiconductor integrated circuit to be tested, and the test analog signal is converted from analog to digital in the interface board to be a first digital signal Step to remember as,
As step C, the analog signal output from the semiconductor integrated circuit under test supplied with the test analog signal is converted from analog to digital in the interface board and stored as a second digital signal;
As step D, comparing the first digital signal and the second digital signal in the interface board and performing pass / fail judgment,
A step E for outputting the pass / fail judgment result to the main test apparatus as step E. A method for testing a semiconductor integrated circuit according to claim 13, comprising:
Before Step A, as Step F, a reset signal is output from the main test apparatus to the interface board,
A method for testing a semiconductor integrated circuit, comprising: receiving at least one reset signal and resetting at least a part of the contents stored in the interface board. 15. A test method for a semiconductor integrated circuit according to claim 14, comprising:
Between Step F and Step A, as Step G, a relay control signal is output from the main test apparatus to the relay unit, the relay unit is closed, and the semiconductor integrated circuit under test and the interface board are electrically connected. And a step of automatically connecting the semiconductor integrated circuit. A method for testing a semiconductor integrated circuit according to claim 15, comprising:
Between the step F and the step G, the method further includes, as step H, outputting a test mode selection signal from the main test apparatus to the interface board and selecting test conditions on the interface board. A method for testing a semiconductor integrated circuit. A test method for a semiconductor integrated circuit according to any one of claims 13 to 16, comprising:
According to the control signal output from the main test apparatus, the analog signal is digitized by the interface board, and a digital signal corresponding to the analog signal is returned to the main test apparatus, whereby an analog test function is provided to the main test apparatus. A method for testing a semiconductor integrated circuit, characterized in that:

Images