JP2013115256A - Photoelectric conversion element and method for manufacturing photoelectric conversion element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a back passivation type photoelectric conversion element capable of improving conversion efficiency by homogeneously forming a BSF around a back electrode.SOLUTION: A photoelectric conversion element 1 comprises: a p-type crystalline silicon substrate 10 having an n-type diffusion layer 11 formed on one surface thereof and a recessed part 10b on the surface opposite to the one surface; a passivation film 30 formed in contact with the surface opposite to the one surface of the p-type crystalline silicon substrate 10 and having an opening 30b at a position corresponding to the recessed part 10b; and an aluminum electrode 43 formed so as to contact with the recessed part 10b through the opening 30b. The p-type crystalline silicon substrate 10 has a p-type diffusion layer 13 having dopant concentration higher than that of the p-type crystalline silicon substrate 10 in the recessed part 10b. The aluminum electrode 43 is recessed along the recessed part 10b of the p-type crystalline silicon substrate 10.

Description

  The present invention relates to a photoelectric conversion element and a method for manufacturing the photoelectric conversion element.

  Conventionally, a so-called back surface passivation type photoelectric conversion element is known (see, for example, Japanese Patent Application Laid-Open No. 2009-21358 (Patent Document 1)). In the back surface passivation type photoelectric conversion element, the back surface electrodes are discretely formed in a dot shape, and the other part of the back surface is covered with an insulating film (passivation film).

  As the passivation film, a silicon oxide film, a silicon nitride film, a silicon carbide film, or the like is used. In particular, since the silicon nitride film can be formed at a relatively low temperature by plasma CVD, damage to the substrate during formation can be reduced. Further, since a silicon nitride film formed by plasma CVD contains a lot of hydrogen, a higher passivation effect can be expected.

JP 2009-21358 A

  However, the silicon nitride film has a positive fixed charge in the film. Therefore, when a silicon nitride film is formed on a p-type silicon substrate, an inversion layer is formed at the interface. When the inversion layer and the back electrode are in contact with each other, there is a problem that carriers in the inversion layer flow into the back electrode as a leakage current.

  For this problem, there is a measure of forming a local back surface field layer (BSF) around the back electrode. Specifically, first, an opening for contact is formed in the passivation film covering the entire back surface of the silicon substrate. An aluminum paste is applied to cover the opening. Next, the aluminum paste is baked to form a back electrode. At the same time, aluminum diffuses into the silicon substrate. As a result, the BSF is formed on the silicon substrate at a portion in contact with the back electrode. According to this method, the back electrode and the BSF can be formed at the same time, and the manufacturing process can be simplified.

  However, the BSF formed by this method is inhomogeneous and the leakage current may not be sufficiently suppressed.

  An object of the present invention is to form a BSF uniformly around a back electrode in a back surface passivation type photoelectric conversion element, thereby improving conversion efficiency.

  The photoelectric conversion element disclosed herein includes a p-type crystal silicon substrate having an n-type diffusion layer formed on one side and having a recess on a surface opposite to the one side, and a side opposite to the one side of the p-type crystal silicon substrate. A passivation film formed in contact with a surface and having an opening at a position corresponding to the recess, and an aluminum electrode formed in contact with the recess through the opening, the p-type crystalline silicon substrate comprising: The recessed portion has a high-concentration p-type diffusion layer having a dopant concentration higher than that of the p-type crystalline silicon substrate, and the aluminum electrode is recessed along the recessed portion of the p-type crystalline silicon substrate.

  The photoelectric conversion element manufacturing method disclosed herein includes a step of preparing a p-type crystalline silicon substrate having an n-type diffusion layer formed on one side, and a surface opposite to the one side of the p-type crystalline silicon substrate. A step of forming a passivation film, a step of forming an opening in the passivation film, a step of forming an aluminum film covering the opening, a step of firing the aluminum film, and a step of removing the aluminum film And after the removing step, a step of covering the opening and forming an aluminum electrode, and a step of firing the aluminum electrode.

  According to the configuration of the photoelectric conversion element described above, the p-type crystalline silicon substrate has a recess. The aluminum electrode is formed along this recess. When this aluminum electrode is baked and aluminum is diffused isotropically from the recess, a homogeneous high-concentration p-type diffusion layer is formed in the recess.

  A uniform high-concentration p-type diffusion layer provides a sufficient barrier effect against minority carriers. Further, a sufficient inversion layer suppressing effect can be obtained. Furthermore, better ohmic contact is obtained. Therefore, conversion efficiency is improved.

  According to the method for manufacturing a photoelectric conversion element, an alloy layer of aluminum and silicon is formed at a portion where the p-type crystalline silicon substrate and the aluminum film are in contact with each other by the step of baking the aluminum film. Thereafter, the alloy layer is also removed in the step of removing the aluminum film. As a result, a recess is formed in the p-type crystalline silicon substrate. Subsequently, an aluminum electrode is formed in contact with the recess.

  By baking this aluminum electrode, aluminum diffuses from the recess to the p-type crystalline silicon substrate. By diffusing aluminum from the recess, aluminum can be diffused more isotropically into the p-type crystalline silicon substrate than when diffusing from a flat surface. Therefore, a homogeneous high concentration p-type diffusion layer is obtained, and the conversion efficiency of the photoelectric conversion element is improved.

FIG. 1 is a cross-sectional view schematically showing a configuration of a photoelectric conversion element according to an embodiment of the present invention. FIG. 2 is a cross-sectional view schematically showing a method for manufacturing a photoelectric conversion element according to an embodiment of the present invention. FIG. 3 is a cross-sectional view schematically showing a method for manufacturing a photoelectric conversion element according to an embodiment of the present invention. FIG. 4 is an enlarged view of FIG. FIG. 5: is sectional drawing which shows typically the manufacturing method of the photoelectric conversion element concerning one Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and description thereof will not be repeated. In addition, in order to make the explanation easy to understand, in the drawings referred to below, the configuration is shown in a simplified or schematic manner, or some components are omitted. Further, the dimensional ratio between the constituent members shown in each drawing does not necessarily indicate an actual dimensional ratio.

  FIG. 1 is a cross-sectional view schematically showing a configuration of a photoelectric conversion element 1 according to an embodiment of the present invention. The photoelectric conversion element 1 includes a p-type crystalline silicon substrate (hereinafter referred to as a substrate) 10, an antireflection film 20, a back surface passivation film 30, a back surface electrode 43, a light receiving surface electrode 50, and an alloy layer 61.

  The substrate 10 may be a single crystal substrate or a polycrystalline substrate. Although the specific resistance of the board | substrate 10 is not specifically limited, For example, it is 0.1-1.0 ohm-cm. Although the thickness of the board | substrate 10 is not specifically limited, Preferably it is 100-300 micrometers. More preferably, it is 100-200 micrometers.

  On one surface of the substrate 10, a texture structure 10 a composed of random pyramidal irregularities is formed. The texture structure 10a reduces light reflection and confines light incident on the substrate 10 to increase the light utilization rate.

  Hereinafter, the surface of the substrate 10 on which the texture structure 10a is formed is referred to as a light receiving surface, and the opposite surface is referred to as a back surface.

An n-type diffusion layer 11 is formed on the surface of the substrate 10 on the light receiving surface side. The n-type diffusion layer 11 forms a pn junction with the bulk region of the substrate 10. The dopant concentration of the n-type diffusion layer 11 is not particularly limited, but is, for example, 10 ¹⁸ to 10 ¹⁹ cm ⁻³ .

  An antireflection film 20 is formed so as to cover the n-type diffusion layer 11. As the antireflection film 20, a film of silicon oxide, silicon nitride, silicon carbide, or the like is used. In particular, a silicon nitride film is preferably used. The thickness of the antireflection film 20 is not particularly limited, but is, for example, 5 to 100 nm.

  A light receiving surface electrode 50 is formed on the light receiving surface side of the substrate 10. The light-receiving surface electrode 50 penetrates the antireflection film 20 and is in contact with the n-type diffusion layer 11. The light-receiving surface electrode 50 is obtained by baking a conductive paste containing silver powder or the like, and is generally formed in a stripe shape (line shape). Although the thickness of the light-receiving surface electrode 50 is not specifically limited, For example, it is 0.5-50 micrometers. Although FIG. 1 is a schematic diagram and is simplified, the width of each light receiving surface electrode 50 is 50 to 100 μm and is formed over the entire light receiving surface of the substrate 10 at a pitch of 0.5 to 2.0 mm. Yes. Although not shown in FIG. 1, the photoelectric conversion element 1 may include a main electrode (bus bar) formed so as to be orthogonal to the light receiving surface electrode 50 and to be in contact with the plurality of light receiving surface electrodes 50.

  A back surface passivation film 30 is formed so as to cover the entire back surface of the substrate 10 (excluding an opening 30b described later). The back surface passivation film 30 suppresses recombination of photogenerated carriers on the back surface and increases the conversion efficiency of the photoelectric conversion element 1. A film made of silicon oxide, silicon nitride, silicon carbide, or the like is used as the back surface passivation film 30. In particular, silicon nitride is preferably used. Although the thickness of the back surface passivation film 30 is not specifically limited, For example, it is 50-150 nm.

  Further, a back electrode 43 is formed on the entire surface so as to cover the back surface passivation film 30. The back electrode 43 is obtained by baking a conductive paste containing aluminum powder. Although the thickness of the back surface electrode 43 is not specifically limited, It is 0.5-40 micrometers.

  A plurality of openings 30 b are formed in the back surface passivation film 30 at regular intervals. Although FIG. 1 is a schematic diagram and is simplified, the opening 30b is, for example, a square of 150 μm × 150 μm, and is formed over the entire surface of the substrate across the length and breadth at intervals of about 1 mm.

  The back electrode 43 is in contact with the substrate 10 through the opening 30b. The size (area) of the opening 30b is preferably as small as possible in a range in which the conduction between the back electrode 43 and the substrate 10 can be stably secured. This is because a higher passivation effect can be obtained by covering a large area with the passivation film 30. The length of one side of the opening 30b is preferably 200 μm or less.

  In the portion of the substrate 10 that is in contact with the back electrode 43, a recess 10 b that is recessed by approximately 30 to 40 μm from the back surface of the substrate 10 is formed. An alloy layer 61 made of aluminum-silicon is formed on the peripheral edge of the recess 10 b of the substrate 10. Further, a high concentration p-type diffusion layer 13 is formed in the vicinity of the recess 10 b and the alloy layer 61. The thickness of the high-concentration p-type diffusion layer 13 is approximately 10 μm.

The dopant concentration of the high-concentration p-type diffusion layer 13 is higher than the dopant concentration of the substrate 10 and is, for example, 10 ¹⁹ to 10 ²⁰ cm ⁻³ .

  The high-concentration p-type diffusion layer 13 functions as a local BSF that generates a barrier electric field for minority carriers and improves the collection efficiency of majority carriers. Further, the occurrence of leakage current due to the inversion layer is prevented.

  In this embodiment, the back surface electrode 43 is formed over the entire back surface side. However, the back surface electrode 43 may be formed only in a portion corresponding to the opening 30b.

[Production Method of Photoelectric Conversion Element 1]
Hereinafter, the manufacturing method of the photoelectric conversion element 1 will be described with reference to FIGS.

  As shown in FIG. 2A, a substrate 10 is prepared. As described above, the substrate 10 may be a single crystal substrate or a polycrystalline substrate. The substrate 10 is sliced from a single crystal or polycrystalline silicon ingot to a thickness of 100 to 300 μm, preferably 100 to 200 μm. Prior to the following steps, the substrate 10 may be immersed in an acid solution or the like to remove the damaged layer formed by slicing.

  As shown in FIG. 2B, the texture structure 10 a is formed on one surface (light receiving surface) of the substrate 10. The texture structure 10a is formed by wet etching the surface of the substrate 10 with an alkaline solution or the like. When the substrate 10 is polycrystalline silicon, the texture structure 10a can be formed by a dry etching process such as RIE.

As shown in FIG. 2C, the n-type diffusion layer 11 is formed on the light receiving surface of the substrate 10. The n-type diffusion layer 11 can be formed by heat-treating the substrate 10 in an atmosphere containing an n-type dopant. For example, it can be formed by heat treatment at 700 to 1000 ° C. in an atmosphere containing phosphorus oxychloride (POCl ₃ ). In this case, diffusion layers are formed on all of the main and side main surfaces of the substrate 10. In order to leave the n-type diffusion layer 11 only on the light receiving surface, the light receiving surface may be covered with a resist and unnecessary diffusion layers may be removed by etching. In addition, since an unnecessary phosphorous glass layer may be formed on the light receiving surface, etching for removing this may be performed.

  In addition to the above, the n-type diffusion layer 11 may be formed by forming an n-type dopant source on the light receiving surface side of the substrate 10 and diffusing the dopant into the substrate 10 by heat treatment. The n-type dopant source may be formed by being stacked on the substrate 10 by CVD or the like, or may be formed by applying a paste containing an n-type dopant to the substrate 10.

  As shown in FIG. 2D, an antireflection film 20 is formed so as to cover the n-type diffusion layer 11. The thickness of the antireflection film 20 is, for example, 5 to 100 nm.

  As shown in FIG. 3A, a back surface passivation film 30 is formed on the back surface of the substrate 10. The thickness of the back surface passivation film 30 is 50 to 150 nm.

  As shown in FIG. 3B, an opening 30 a is formed in the back surface passivation film 30. The opening 30a is obtained by, for example, forming a resist that covers the portion other than the portion where the opening 30a is formed by photolithography, and etching the back surface passivation film 30 using this resist as a mask. The opening 30a can also be formed by laser light.

  As a more preferable method for forming the opening 30a, there is a method using an etching paste. The etching paste includes phosphoric acid, hydrogen fluoride, ammonium fluoride, ammonium hydrogen fluoride, and the like as etching components, and is a mixture of water, an organic solvent, and a thickener. The opening 30a can be formed in the back surface passivation film 30 by applying an etching paste by a screen printing method or the like and heating.

  The size of the opening 30a needs to be large enough to allow the aluminum paste 40 (see FIG. 3C) to be formed in the next process to flow and to contact the substrate 10 sufficiently. On the other hand, the larger the area that the back surface passivation film 30 covers the substrate 10, the greater the passivation effect. Therefore, the size of the opening 30a is preferably small. Further, in the subsequent step, the substrate 10 and the aluminum paste 40 brought into contact with each other through the opening 30a are reacted, and this reaction becomes stronger as the size of the opening 30a is smaller. Also in this respect, it is preferable that the size of the opening 30a is small. The length of one side of the opening 30a is, for example, 100 μm.

  As shown in FIG. 3C, an aluminum paste 40 is formed so as to cover the opening 30a. The aluminum paste 40 is a mixture of aluminum powder, water, an organic solvent, a thickener, and the like. The aluminum paste 40 is formed at a position corresponding to the opening 30a by a screen printing method or the like. The aluminum paste 40 is formed in a size that covers at least the opening 30a. Preferably, it is formed to be slightly larger than the opening 30a in consideration of the positional deviation at the time of formation. As for the size of the aluminum paste 40, for example, the length (or diameter) of one side is 300 μm. The thickness of the aluminum paste 40 is, for example, 30 to 40 μm.

  After forming the aluminum paste 40, it is dried at 100 to 400 ° C. Thereafter, as shown in FIG. 3D, the aluminum paste 40 is baked to form an aluminum film 41. Firing is performed at 600 to 900 ° C. for 1 to 300 seconds, for example.

  At this time, in the portion of the substrate 10 in contact with the aluminum film 41 (aluminum paste 40), the aluminum in the aluminum paste 40 and the silicon in the substrate 10 react to form an aluminum-silicon alloy layer 60. . The alloy layer 60 has a thickness of 30 to 40 μm. The reaction between aluminum and silicon mainly proceeds in the depth direction of the substrate 10 (vertical direction in FIG. 3), but also slightly proceeds in the in-plane direction of the substrate 10 (horizontal direction in FIG. 3). Therefore, the area of the alloy layer 60 is larger than the opening 30a. When the alloy layer 60 is formed, a part of the back surface passivation film 30 is also removed, and the opening 30a becomes an opening 30b having a slightly larger diameter than the opening 30a.

  Further, when the aluminum paste 40 is fired, aluminum, which is a p-type dopant, diffuses from the aluminum paste 40 and the alloy layer 60 to the substrate 10. Thereby, the high concentration p-type diffusion layer 12 is formed in the vicinity of the alloy layer 60. The thickness of the high concentration p-type diffusion layer 12 is about 10 μm.

  FIG. 4 is an enlarged view of FIG. 3 (d). The reaction between aluminum and silicon in the substrate 10 occurs between the aluminum paste 40 formed in contact with the back surface of the substrate 10 through the opening 30a and the silicon in the substrate 10. Therefore, as described above, the reaction between aluminum and silicon proceeds mainly in the depth direction of the substrate 10 (vertical direction in FIG. 4). Similarly, aluminum diffuses mainly in the depth direction of the substrate 10. That is, although it diffuses relatively deeply in the depth direction of the substrate 10, it does not diffuse so much in the in-plane direction of the substrate 10.

  Thereby, the thickness of the high concentration p-type diffusion layer 12 becomes non-uniform. In particular, in the region S1 surrounded by the alternate long and short dash line in FIG. 4, the high concentration p-type diffusion layer 12 may not be sufficiently formed. In that case, a sufficient barrier effect against minority carriers cannot be obtained. Moreover, when the back surface passivation film 30 is a silicon nitride film, the inversion layer suppressing effect cannot be sufficiently obtained.

  In this embodiment, the photoelectric conversion element 1 is completed through the following steps from FIG.

  The aluminum film 41 and the alloy layer 60 are removed by etching with hydrochloric acid. Thereby, as shown in FIG. 5A, a recess 10 b is formed in the substrate 10. The size of the recess 10 b is the same as the size of the alloy layer 60.

  As shown in FIG. 5B, an aluminum film 42 is formed on the entire surface so as to cover the back surface passivation film 30 and the recess 10 b of the substrate 10. The aluminum film 42 is in contact with the recess 10b of the substrate 10 through the opening 30b.

  Unlike the aluminum paste 40 (see FIG. 3C) or the aluminum film 41 (see FIGS. 3D and 4), the aluminum film 42 preferably has a uniform thickness. This is because, if the aluminum film 41 has a protruding shape as shown in FIG. 4, the substrate 10 may be broken in a later process due to a difference in thermal shrinkage between the aluminum and the substrate 10. This becomes a problem particularly when the thickness of the substrate 10 is reduced. Examples of a method for forming the aluminum film 42 having a uniform thickness include vapor deposition and sputtering. The thickness of the aluminum film 42 is, for example, 0.5 to 40 μm. When the aluminum film 42 is thus formed, the aluminum film 42 has a structure that is recessed along the recess 10b.

  As shown in FIG. 5C, the aluminum film 42 is baked to form the back electrode 43. Firing is performed at 600 to 900 ° C. for 1 to 300 seconds, for example.

  At this time, in the portion of the substrate 10 that is in contact with the back electrode 43 (aluminum film 42), aluminum in the aluminum film 42 and silicon in the substrate 10 react. Thereby, an alloy layer 61 made of aluminum-silicon is formed on the peripheral edge of the recess 10b. Further, a high-concentration p-type diffusion layer is newly formed in the vicinity of the alloy layer 61. Thereby, the high concentration p-type diffusion layer 13 is formed over the entire periphery of the recess 10b. The thickness of the high concentration p-type diffusion layer 13 is approximately 10 μm.

  Finally, as shown in FIG. 5D, the light receiving surface electrode 50 is formed on the light receiving surface side. In order to form the light-receiving surface electrode 50, first, an anti-reflection film 20 is prepared by screen printing or the like using a conductive paste obtained by mixing conductive fine particles such as silver powder, glass powder, water, an organic solvent, and a thickener. Form on top. And this is baked. Firing is performed at 600 to 900 ° C. for 1 to 300 seconds, for example. At this time, the light receiving surface electrode 50 breaks the antireflection film 20 by the action of the glass powder mixed in the conductive paste, and the light receiving surface electrode 50 and the n-type diffusion layer 11 of the substrate 10 come into contact with each other.

  In the above, the light receiving surface electrode 50 is formed by a so-called fire-through method. However, the light receiving surface electrode 50 may be formed without using fire-through. That is, after the opening is formed in the antireflection film 20, the light receiving surface electrode 50 may be formed.

  The configuration and the manufacturing method of the photoelectric conversion element 1 according to this embodiment have been described above.

  With reference to FIG. 1 again, the effect of the configuration of the photoelectric conversion element 1 will be described. According to the configuration of the photoelectric conversion element 1 according to the present embodiment, the substrate 10 has the recess 10b. The back electrode 43 is formed along the recess 10b. The back electrode 43 is baked and aluminum is diffused isotropically from the recess 10b, whereby the homogeneous high concentration diffusion layer 13 is formed in the recess 10b.

  In FIG. 1, the recess 10b is formed in a circular arc shape in cross section. However, the recess 10b can take various shapes depending on the crystal orientation of the substrate 10 or the like. However, regardless of the shape of the recess 10b, the high-concentration p-type diffusion layer 13 can be formed more uniformly than when aluminum is diffused from a flat surface.

  If a uniform high-concentration p-type diffusion layer 13 is obtained, a sufficient barrier effect against minority carriers can be obtained. Further, a sufficient inversion layer suppressing effect can be obtained. Furthermore, better ohmic contact is obtained. Therefore, conversion efficiency is improved.

  Moreover, according to the method for manufacturing the photoelectric conversion element 1 according to the present embodiment, the alloy layer 60 of aluminum and silicon is formed at the portion where the substrate 10 and the aluminum paste 40 are in contact with each other by the step of baking the aluminum paste 40. The Thereafter, in the step of removing the aluminum film 41, the alloy layer 60 is also removed. As a result, a recess 10 b is formed in the substrate 10. Subsequently, an aluminum film 42 is formed in contact with the recess 10b.

  By baking the aluminum film 42, aluminum diffuses from the recess 10b. Compared with the case of diffusing from a flat surface, aluminum can be diffused more isotropically to the substrate 10 by diffusing from the recess 10b. Therefore, a homogeneous high concentration p-type diffusion layer 13 is obtained, and the conversion efficiency of the photoelectric conversion element 1 is improved.

  As mentioned above, although embodiment about this invention was described, this invention is not limited only to the above-mentioned embodiment, A various change is possible within the scope of the invention.

  INDUSTRIAL APPLICATION This invention can be utilized industrially as a photoelectric conversion element and the manufacturing method of a photoelectric conversion element.

  DESCRIPTION OF SYMBOLS 1 Photoelectric conversion element, 10 p-type crystal silicon substrate, 10a Texture structure, 10b Recessed part, 11 n-type diffused layer, 12, 13 High concentration p-type diffused layer, 20 Antireflection film, 30 Back surface passivation film, 30a, 30b Opening 40 Aluminum paste, 41, 42 Aluminum film, 43 Back electrode, 50 Light receiving surface electrode, 60, 61 Alloy layer

Claims (11)

A p-type crystalline silicon substrate having an n-type diffusion layer formed on one surface and having a recess on the surface opposite to the one surface;
A passivation film formed in contact with a surface opposite to the one surface of the p-type crystalline silicon substrate and having an opening at a position corresponding to the recess;
An aluminum electrode formed so as to be in contact with the recess through the opening;
The p-type crystalline silicon substrate has a high-concentration p-type diffusion layer having a higher dopant concentration than the p-type crystalline silicon substrate in the recess,
The aluminum electrode is a photoelectric conversion element that is recessed along a recess of the p-type crystalline silicon substrate.   The photoelectric conversion element according to claim 1, wherein a length of one side of the opening is 200 μm or less.   The photoelectric conversion element according to claim 1, wherein the passivation film is a silicon nitride film.   The photoelectric conversion element according to claim 1, wherein the p-type crystalline silicon substrate is a p-type polycrystalline silicon substrate.   The photoelectric conversion element according to claim 1, wherein the p-type crystal silicon substrate is a p-type single crystal silicon substrate. Preparing a p-type crystalline silicon substrate having an n-type diffusion layer formed on one side;
Forming a passivation film on a surface opposite to the one surface of the p-type crystalline silicon substrate;
Forming an opening in the passivation film;
Forming an aluminum film covering the opening;
Firing the aluminum film;
Removing the aluminum film;
After the removing step, covering the opening and forming an aluminum electrode;
And a step of firing the aluminum electrode.   The said aluminum electrode is a manufacturing method of the photoelectric conversion element of Claim 6 formed by sputtering or vapor deposition.   The method for manufacturing a photoelectric conversion element according to claim 6 or 7, wherein a length of one side of the opening is 200 µm or less.   The method for manufacturing a photoelectric conversion element according to any one of claims 6 to 8, wherein the passivation film is a silicon nitride film.   The said p-type crystalline silicon substrate is a manufacturing method of the photoelectric conversion element as described in any one of Claims 6-9 which is a p-type polycrystalline silicon substrate.   The said p-type crystalline silicon substrate is a manufacturing method of the photoelectric conversion element as described in any one of Claims 6-9 which is a p-type single crystal silicon substrate.

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