JP2013114999A - Cable module and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cable module having a structure in which bending of cables and the like is hardly caused in a solder connection work, and to provide a method of manufacturing the cable module capable of suppressing bending of cables and the like in the solder connection work.SOLUTION: A cable module 1 includes a wiring board 10 and a plurality of cables. A connection terminal 12 corresponding to a cable having smallest outer diameter of connection terminals 12 formed on the wiring board 10, is arranged on an end of a connection terminal column 13. Respective cables are connected to respective corresponding connection terminals 12.

Description

  The present invention relates to a cable module including a wiring board and a plurality of cables, and a manufacturing method thereof.

  The cable module is used as a signal transmission line for connecting between the apparatus main body and the information input / output terminal. For example, in the ultrasonic diagnostic apparatus disclosed in Patent Document 1, a cable module is used as a signal transmission line that connects an ultrasonic probe (information input / output terminal) and the apparatus main body. In the folding portable device, a cable module is used as a signal transmission line for connecting the liquid crystal display device (information input / output terminal) and the device main body.

  The cable module is required to have repeated bending resistance from the viewpoint of operability of the information input / output terminal. In addition, cable high-density mounting is required because of an increase in transmission information amount and weight reduction.

  Specifically, the cable module includes a wiring board and tens to hundreds of cables. The reason why the cable is employed as the signal transmission line is that the resistance to repeated bending is higher than that of wiring using a flexible substrate. In addition, a cable having an outer diameter of 500 μm or less is adopted due to a demand for high-density mounting.

JP 2001-54194 A

  By the way, in the cable module of patent document 1, although the positioning guide is provided in the wiring board for positioning of a cable, these positioning guides are abbreviate | omitted in the apparatus which requires the cable high density mounting. In this case, the cables are soldered one by one in order from the end side of the wiring board. However, since the cable used in the cable module for high-density mounting is thin, the tip of the cable may be bent or bent at the time of solder connection. If a bent cable or a bent cable is included, the resistance to repeated bending deteriorates. Therefore, the bent cable or the bent cable is removed in the manufacturing process. Since cable bending or bending in the solder connection operation greatly affects the product yield, a cable module having a structure in which the cable tip portion is not easily bent in the solder connection operation is required.

  The present invention has been made to solve such a problem, and an object of the present invention is to provide a cable module having a structure in which cable breakage or the like is unlikely to occur during solder connection work, and to perform cable connection in solder connection work. An object of the present invention is to provide a cable module manufacturing method capable of suppressing the occurrence of breakage and the like.

  (1) The invention according to claim 1 includes a wiring board and a plurality of cables connected to the wiring board, and the outer diameter of at least one of the cables is the outer diameter of the other cable. In the smaller cable module, the connection terminal corresponding to the cable having the smallest outer diameter among the connection terminals formed on the wiring board is arranged at the end of the connection terminal row, and each cable corresponds to each corresponding connection. The gist is that it is connected to the terminal. In the following description, “fold” is a concept including folding and bending.

  A case is assumed in which the connection terminal connected to the cable having the smallest outer diameter (hereinafter also referred to as the minimum diameter cable) is arranged in the center in the connection terminal row. In this configuration, it is assumed that a solder connection procedure is adopted in which another cable is first solder-connected and then the smallest diameter cable is solder-connected. In this case, the minimum diameter cable is arranged between the cables previously soldered. However, it is difficult to arrange the minimum diameter cable without touching the cable so that the cable previously soldered does not break, and the tip of the cable may break during this operation. Therefore, it is conceivable to adopt a solder connection procedure in which the smallest diameter cable is first solder-connected to the connection terminal and then another cable is solder-connected to the connection terminal. However, in the case of this procedure, when other cables are connected by soldering, the operator's hand or a soldering iron may hit the minimum diameter cable, and the tip of the minimum diameter cable may be broken.

  In the present invention, the connection terminal to which the minimum diameter cable is connected is arranged at the end of the connection terminal row. For this reason, the minimum diameter cable can be finally solder-connected without performing the operation of arranging the minimum diameter cable between the other cables previously soldered. For this reason, the frequency with which an operator's hand, a soldering iron, etc. contact a minimum diameter cable decreases. That is, according to the cable module having the above configuration, it is possible to suppress the occurrence of cable breakage in the solder connection work.

  (2) The invention according to claim 2 is that, in the cable module according to claim 1, the connection terminals are arranged so that the cables are arranged in descending order of the outer diameter. To do.

  According to the present invention, the cables can be soldered in order of the cables having the larger outer diameters and in order from the end of the connection terminal row. That is, the order of solder connection of cables having a small outer diameter can be postponed without performing the operation of arranging the cables between the cables previously soldered.

  (3) The invention according to claim 3 is the cable module according to claim 2, comprising a plurality of the wiring boards, wherein the cables are arranged in descending order of the outer diameter. The wiring boards are stacked so that the connection terminals are arranged in such a manner that the cable arrangement portions having the largest outer diameter and the cable arrangement portions having the smallest outer diameter are alternately arranged. It is a summary.

  When the cables are irregularly arranged, the gap inside the laminate of the wiring board becomes large. In the present invention, since the cables are regularly arranged as in the above configuration, it is possible to reduce the volume of the wiring board laminate compared to the wiring board lamination in which the cables are not arranged in order of increasing outer diameter. it can.

  (4) The invention according to claim 4 is the cable module according to claim 1, wherein the cable having the largest outer diameter is arranged in the center, and the cable having the largest outer diameter is directed outward from the cable. The gist is that the connection terminals are arranged so that the cables are arranged in order of increasing outer diameter.

  According to the present invention, the cables can be solder-connected in order of the cables having the larger outer diameters and sequentially from the center of the connection terminal row to the outside. That is, the order of solder connection of cables having a small outer diameter can be postponed without performing the operation of arranging the cables between the cables previously soldered.

  (5) The invention according to claim 5 is summarized in that, in the cable module according to any one of claims 1 to 4, the outer diameter of each cable is 200 μm or less. In the case of a cable having an outer diameter of 200 μm or less, the frequency at which the tip of the cable breaks during solder connection work is high. For this reason, in a cable module including a cable having an outer diameter of 200 μm or less, the above-described effect is remarkably exhibited by applying the configuration of the present invention.

  (6) The invention according to claim 6 is the method for manufacturing the cable module according to any one of claims 1 to 5, wherein the cable module is soldered in order from the cable having the largest outer diameter. Is the gist.

  Solder connection to the wiring board in order from the cable with the largest outer diameter. That is, the more easily the cable is broken, the solder connection is performed later. For this reason, the easier the cable breaks, the fewer the chances of the operator's hand or soldering iron coming into contact with the cable. Thereby, it is possible to suppress the frequency of occurrence of breakage of the cable tip in the solder connection operation.

  ADVANTAGE OF THE INVENTION According to this invention, the cable module which has a structure which a cable front-end | tip part does not generate | occur | produce easily in the soldering operation can be provided. Moreover, according to the said cable module manufacturing method, generation | occurrence | production of a cable break etc. can be suppressed.

The perspective view of a connection part about the cable module which concerns on embodiment. The perspective view explaining the solder connection method about a cable module. The perspective view of a connection part about the cable module of a comparative structure. The perspective view explaining an example of solder connection about the cable module of a comparative structure. The perspective view explaining the other example of solder connection about the cable module of a comparative structure. The top view of a connection part about the cable module of a 1st modification. Sectional drawing in alignment with the AA of FIG. Sectional drawing of the laminated body of a wiring board about the cable module of a 2nd modification. Sectional drawing of the laminated body of a wiring board about the cable module of a comparison structure. The top view of a connection part about the cable module of a 3rd modification.

An embodiment of a cable module of the present invention will be described with reference to FIG.
The cable module 1 includes a plurality of wiring boards 10 and a plurality of cables. The number of cables is determined by the electrical equipment in which the cable module is used. For example, hundreds of cables are used for an ultrasonic probe of an ultrasonic diagnostic apparatus.

  The cable is bundled with a binder tape. The outer periphery of the cable bundle is covered with insulating resin. These cables are divided into a plurality of groups. There is a one-to-one correspondence between the group and the wiring board 10. That is, the cables in each group are connected to the same wiring board 10.

  Each group includes a plurality of types of cables such as a signal transmission cable and a power supply cable. The outer diameters of these cables are different. For example, a very thin single wire is used as a signal transmission cable. As the power supply cable, a cable having a diameter larger than that of the signal transmission cable is used.

  Specifically, a cable having an outer diameter of 200 μm or less is used. In the medical cable module 1, 40 or more cables are used as signal transmission cables according to the AWG (American wire gauge) standard.

  As the wiring board 10, a multilayer flexible board is used. The wiring substrate 10 includes a substrate 11 and a conductor pattern formed on the substrate 11. A part of the conductor pattern is formed as the connection terminal 12. The conductor pattern is protected by a resist 14. Each connection terminal 12 and each cable are associated on a one-to-one basis.

With reference to FIG. 1, the connection structure between the wiring board 10 and the cable will be described.
In the following description, an example of the cable module 1 using the single-core cable 20 as a cable will be given. FIG. 1 shows a part of the connection portion.

  The single-core cable 20 includes a conductor 21 and an insulator 23 that covers the conductor 21. The conductor 21 is formed by twisting seven tin-plated annealed copper wires. The insulator 23 is made of an insulating resin such as a flame retardant polyolefin resin.

The outer diameter of each single-core cable 20 is 200 μm or less.
The single-core cable 20 is classified into three or more types according to the outer diameter size. In FIG. 1, three types of single-core cables 20 are shown.

Connection terminals 12 are formed on the wiring board 10 so as to correspond to the single-core cables 20. The arrangement order of the connection terminals 12 is configured as follows.
The arrangement of the connection terminals 12 is set so that when the single-core cables 20 corresponding to the connection terminals 12 are solder-connected, the single-core cables 20 are arranged in descending order of the outer diameter. That is, the inter-terminal distance Lp of the connection terminals 12 decreases in order from the end of the connection terminal row 13.

  Further, the inter-terminal distance Lp of each connection terminal 12 is set so that the single-core cables 20 come into contact with each other when the single-core cables 20 are soldered. That is, the inter-terminal distance Lp between the connection terminals 12 adjacent to each other is substantially equal to the average value of the outer diameters of the two single-core cables 20 connected to the connection terminals 12. For example, when the single-core cable 20 having an outer diameter of 300 μm and the single-core cable 20 having an outer diameter of 400 μm are adjacent to each other, the inter-terminal distance Lp between the connection terminals 12 corresponding to these single-core cables 20 is set to 350 μm.

With reference to FIG. 2, the manufacturing method of the cable module 1 is demonstrated.
First, the single-core cable 20 corresponding to the outermost connection terminal 12 in the connection terminal row 13 is prepared. The single-core cable 20 has the largest outer diameter among the single-core cables 20 connected to the wiring board 10.

  Next, the insulator 23 of the single-core cable 20 is removed by a laser, the conductor 21 is exposed, and the conductor connection portion 22 is formed. Then, the single-core cable 20 is disposed on the wiring board 10 and the conductor connection portion 22 and the connection terminal 12 are connected by solder.

  Next, a single-core cable 20 adjacent to the single-core cable 20 connected by soldering is prepared. And the conductor connection part 22 and the connection terminal 12 are connected with solder by the method similar to the above. Such solder connection is repeated, and the single-core cables 20 are sequentially soldered. Finally, as shown in FIG. 2, the single core cable 20 having the smallest outer diameter is soldered. That is, the single-core cables 20 are soldered in the order of the single-core cables 20 having the larger outer diameters and in the order in which the connection terminals 12 are arranged.

  When each single-core cable 20 is soldered, the single-core cable 20 is bonded to the wiring board 10 using an adhesive. The connection operation of the single core cable 20 is performed on each wiring board 10. And each wiring board 10 is laminated | stacked, and the laminated body 40 is formed.

The characteristics of the cable module 1 of the embodiment will be described with reference to FIGS. 3 to 5 in comparison with the cable module 1 of the comparative structure.
FIG. 3 shows a cable module 100 having a comparative structure. In the cable module 100 having the comparative structure, the single-core cables 20 are not arranged in the order of the outer diameter. In the example illustrated in FIG. 3, the single-core cable 20 having the smallest outer diameter is disposed between the single-core cable 20 having the largest outer diameter and the single-core cable 20 having the second largest outer diameter.

FIG. 4 shows an example of solder connection of the cable module 100 having a comparative structure.
FIG. 4 shows a state in which the single-core cables 20 are connected in order from the end of the connection terminal row 13 and the single-core cable 20 having the smallest outer diameter is solder-connected.

In this example, the single-core cables 20 are connected in order from the end of the connection terminal row 13.
At the time of solder connection work, the single-core cable 20 is not fixed with an adhesive or the like in order to allow the broken single-core cable 20 to be replaced. For this reason, the single core cable 20 is easy to move. When the single-core cable 20 moves and the conductor connecting portion 22 is broken, it is necessary to remove the single-core cable 20 as a defect. Therefore, when the operator connects the single-core cable 20 by soldering, the adjacent single-core cable 20 is not connected. The single-core cable 20 is soldered with great care so as not to move. However, since the smaller the outer diameter of the single-core cable 20 is, the easier it is to move and break. Therefore, when the single-core cable 20 having a smaller outer diameter is connected by soldering first, the bending failure due to the contact of the operator's hand or the soldering iron May occur frequently. Under such circumstances, it is considered that the occurrence of defects can be suppressed by performing the solder connection to the wiring board 10 in the order of the single-core cable 20 having the largest outer diameter.

  With reference to FIG. 5, an example of solder connection in order of single-core cables 20 having a large outer diameter in the cable module 100 having a comparative structure will be described. FIG. 5 shows a state in which the single-core cable 20 having a larger outer diameter is soldered in order, and the remaining single-core cable 20 is soldered.

  When the solder connection is performed in the order of the single-core cables 20 having the larger outer diameters, the smaller the outer diameter, the more the single-core cables 20 that remain after the solder connection order remain. The operation | work which arrange | positions the small single-core cable 20 occurs. Since the distance Lp between the terminals of the two single-core cables 20 is substantially equal to the dimension into which the single-core cable 20 is inserted, the single-core cable 20 is the wiring board 10 or another single-core cable 20 or the like unless careful attention is paid. The conductor connecting portion 22 is broken. In addition, since the single-core cable 20 having a small outer diameter is easily broken, it is difficult to suppress the occurrence of the bending failure even in this solder connection order.

  As described above, in the cable module 100 having the comparative structure, the frequency of occurrence of the bending failure of the single-core cable 20 having a small outer diameter is low by either the method shown in FIG. 4 or the method shown in FIG. There is a problem of not becoming.

  In the present embodiment, in order to solve the above problems, the arrangement order of the connection terminals 12 of the wiring board 10 is configured to follow a prescribed rule. That is, as described above, when the single-core cables 20 corresponding to the connection terminals 12 are solder-connected, the connection terminals 12 are arranged so that the outer diameters of the single-core cables 20 are arranged in descending order. In the case of this configuration, the solder connection operation can be performed later for the single-core cable 20 having the smaller outer diameter by performing the solder connection in order of the single-core cable 20 having the larger outer diameter from the end of the connection terminal row 13. Further, there is no work for disposing the single-core cable 20 between the two single-core cables 20 that are solder-connected. For this reason, generation | occurrence | production of the bending defect of the single core cable 20 with a small outer diameter is suppressed.

(First modification)
A cable module 1 </ b> A including the wiring substrate 10 and a plurality of coaxial cables 30 will be described with reference to FIGS. 6 and 7.

In this modification, a coaxial cable 30 is used as the cable. Hereinafter, the same reference numerals are given to configurations common to the above-described embodiment, and description thereof is omitted.
In the said embodiment, the example of the cable module 1 which used the single core cable 20 as a cable was given. Here, the cable module 1A using the coaxial cable 30 as a cable will be described. As shown in FIGS. 6 and 7, the coaxial cable 30 includes a conductor 31, an internal insulating layer 33, a shield conductor 34, and an insulator 36. A conductor connection portion 32 that is an exposed portion of the conductor 31 is formed at the distal end portion of the coaxial cable 30.

  The basic structure is the same also in the cable module 1 </ b> A using the coaxial cable 30. That is, the connection terminals 12 are formed on the wiring board 10 so as to correspond to the respective coaxial cables 30. The coaxial cable 30 and the connection terminal 12 are associated with each other on a one-to-one basis. Further, in the state where the coaxial cables 30 are soldered, the coaxial cables 30 are in contact with each other.

The arrangement order of the connection terminals 12 is configured as follows.
The arrangement of the connection terminals 12 is set so that when the coaxial cables 30 corresponding to the connection terminals 12 are solder-connected, the coaxial cables 30 are arranged in descending order of the outer diameter. For this reason, the inter-terminal distance Lp of the connection terminals 12 decreases in order from the end of the connection terminal row 13.

The connection structure of the shield conductor 34 of the coaxial cable 30 will be described with reference to FIG.
The shield conductor 34 of the coaxial cable 30 is connected to the ground bar 15 of the wiring board 10. The ground bar 15 is formed so as to extend over each coaxial cable 30.

  The shield conductor 34 of the coaxial cable 30 is stretched. The stretched portion (hereinafter referred to as the shield extension portion 35) is disposed below the adjacent coaxial cable 30. That is, the mounting density of the coaxial cable 30 is increased by disposing the connection portion between the shield extension 35 and the ground bar 15 below the coaxial cable 30.

(Second modification)
With reference to FIGS. 8 and 9, a cable module 1 </ b> C of the second modification will be described.
In the embodiment, the laminated body 40 of the wiring board 10 has a structure in which the wiring boards 10 are simply overlapped. However, in this modification, two types of wiring boards 10 having different arrangement directions of the single-core cables 20 are alternately stacked. Structure. The arrangement direction of the single-core cables 20 indicates the direction in which the single-core cables 20 having a large outer diameter are arranged. That is, it indicates the right direction or the left direction in cross-sectional view. Hereinafter, the same reference numerals are given to configurations common to the above-described embodiment.

FIG. 8 shows a cross-sectional view of the laminate 40 of the wiring board 10 in the cable module 1B of the present modification.
The arrangement direction of the single core cables 20 with respect to the wiring board 10 is defined by the stacking order of the wiring boards 10. That is, in the stacking order, the connection terminals 12 are arranged in the first arrangement direction on the odd-numbered wiring boards 10A from the bottom. In the stacking order, the connection terminals 12 are arranged in the second arrangement direction on the wiring boards 10B in even order from the bottom.

The wiring board 10A arranged in the first arrangement direction has the following configuration.
When the single-core cables 20 corresponding to the connection terminals 12 are solder-connected to the wiring board 10A, the arrangement of the connection terminals 12 is set so that the single-core cables 20 are arranged in descending order of the outer diameter. And in the cross-sectional view, the arrangement of the connection terminals 12 is set in order of decreasing outer diameter of the single-core cable 20 in the left direction.

The wiring board 10B arranged in the second arrangement direction has the following configuration.
The arrangement of the connection terminals 12 is set so that when the single-core cables 20 corresponding to the connection terminals 12 are solder-connected to the wiring board 10B, the single-core cables 20 are arranged in descending order of the outer diameter. And in the cross sectional view, the arrangement of the connection terminals 12 is set in the order of decreasing the outer diameter of the single-core cable 20 in the right direction.

  The laminated body 40 of the wiring substrate 10 is formed by alternately laminating the wiring substrate 10A in the first arrangement direction and the wiring substrate 10B in the second arrangement direction. That is, the arrangement part of the single core cable 20 with the largest outer diameter and the arrangement part of the single core cable 20 with the smallest outer diameter are alternately arranged. For this reason, the height HA of the laminated body 40 of the wiring board 10 is smaller than the height HB of the laminated body 40X of the wiring board 10 of the comparative structure shown below. This point will be described below.

FIG. 9 is a cross-sectional view of a stacked body 40X in which wiring boards 10 having a comparative structure are stacked.
In the wiring board 10 having a comparative structure, single-core cables 20 having a large outer diameter are arranged on both sides of the connection terminal row 13, and single-core cables 20 having a small outer diameter are arranged at the center. A gap is formed in the central portion when the wiring boards 10 of the comparative structure are overlapped, but the gap formed in the central portion in the laminated body 40X is larger than the gap formed in the central portion in the laminated body 40 of this modification. Is also big.

  That is, the laminated body 40 of the wiring board 10 of this modification has a higher mounting density of the single-core cables 20 than the laminated body 40X of the wiring board 10 having the comparative structure. Further, the height HA of the multilayer body 40 of the wiring substrate 10 is smaller than the height HB of the multilayer body 40X of this comparative structure.

  In addition, in the cross-sectional view of the laminate 40 of the wiring board 10, the wiring board 10 </ b> A arranged in the first arrangement direction and the wiring board 10 </ b> B arranged in the second arrangement direction so that only the left side or only the right side does not rise. Are alternately stacked, the stacked body 40 is more stable than the stacked body 40 in which only the wiring boards 10A or 10B having the same arrangement direction are stacked.

Hereinafter, the effect of this embodiment will be described.
(1) In the above embodiment, the connection terminal 12 corresponding to the cable having the smallest outer diameter (minimum diameter cable) is disposed at the end of the connection terminal row 13.

  For this reason, it is possible to finally solder the minimum diameter cable without performing the operation of arranging the minimum diameter cable between the other cables previously soldered (hereinafter, the inter-cable arrangement operation). . By soldering the smallest diameter cable last, the frequency with which the operator's hand or soldering iron contacts the smallest diameter cable can be reduced, and there is no occurrence of cable breakage due to the arrangement work between the cables. That is, according to the cable module 1 having the above-described structure, the occurrence of cable breakage can be suppressed in the solder connection work.

  (2) In the above-described embodiment, the connection terminals 12 corresponding to the cables are arranged so that the cables are arranged in order of increasing outer diameter. For this reason, the cables can be solder-connected in order of the cables having the larger outer diameters and in order from the end of the connection terminal row 13. That is, a cable having a smaller outer diameter can be postponed in the solder connection order without performing an operation (solder connection operation) of arranging the cables between the cables previously soldered.

  (3) In the above-described embodiment, the wiring boards 10 are overlapped so that the arrangement portion of the cable having the largest outer diameter and the arrangement portion of the cable having the smallest outer diameter are alternately arranged. For this reason, the volume of the laminated body 40 of the wiring board 10 can be reduced.

  (4) In the said embodiment, the structure of said (1)-(3) is applied about the cable module 1 using the cable whose outer diameter is 200 micrometers or less. The effects (1) to (3) remarkably appear as compared with the case where the above (1) to (3) are applied to the cable module 1 formed using a cable larger than 200 μm.

  (5) In the cable module manufacturing method of the above-described embodiment, the cable having the largest outer diameter is soldered to the wiring board 10 in order. It is possible to suppress the frequency of occurrence of breakage of the cable tip in the solder connection operation.

(Other embodiments)
In addition, the embodiment of the present invention is not limited to the embodiment shown in the above embodiment, and can be implemented by changing it as shown below, for example. In addition, the following modifications can be implemented by combining different modifications with each other.

  In the above embodiment, the connection terminals 12 are arranged so that the single-core cables 20 having a large outer diameter are arranged from the end of the connection terminal row 13 of the wiring board 10, but the connection terminals 12 are as follows. You can also change the array.

With reference to FIG. 10, a cable module 1C according to a third modification will be described.
As shown in FIG. 10, the single-core cable 20 having the largest outer diameter is disposed in the center. The connection terminals 12 are arranged so that the single-core cables 20 are arranged in order of increasing outer diameter from the single-core cable 20 having the largest outer diameter toward the outside.

  Even with this configuration, as in the embodiment, the solder connection of the single-core cables 20 is performed in descending order of the outer diameter without performing the operation of arranging the single-core cables 20 between the single-core cables 20 previously soldered. It can be carried out. For this reason, the occurrence frequency of the breakage of the single-core cable 20 can be suppressed.

  In the above embodiment, the cable module 1 having a configuration in which the single-core cables 20 having a large outer diameter are arranged in order from the end of the connection terminal row 13 of the wiring board 10 has been described. The effect of (1), that is, the effect of suppressing breakage of the conductor connection portion 22 of the single-core cable 20 is obtained. That is, the arrangement of the connection terminals 12 is set so that the single-core cable 20 having the smallest outer diameter is arranged at the end of the connection terminal row 13. That is, if the single-core cable 20 having the smallest outer diameter among the plurality of single-core cables 20 is arranged at the end of the connection terminal row 13, the solder connection of the single-core cable 20 having the smallest outer diameter can be changed. Therefore, the effect according to the above (1) can be obtained. The same applies to the coaxial cable 30.

  In the above embodiment, a multilayer flexible board is used as the wiring board 10 of the cable module 1, but a rigid board or a rigid-flexible composite board may be used as the wiring board 10. If the wiring structure is simple, a single layer flexible substrate may be used.

  In the above embodiment, solder is used for connection between the connection terminal 12 of the wiring board 10 and the single-core cable 20, but the material for connecting both is not limited to solder. For example, a conductive paste or the like may be used.

  In the above embodiment, the cable module 1 in which the same type of cable is connected to the wiring board 10 is described. However, the present invention is also applied to the cable module 1 in which different types of cables are soldered to the wiring board 10. be able to. For example, the present invention can be applied to the cable module 1 in which the coaxial cable 30 and the single-core cable 20 are solder-connected to the same wiring board 10.

  In the above embodiment, the cable module 1 used for a medical device has been described. However, the application range of the present invention is not limited to the use of the cable module 1. That is, the present invention can be applied to the cable module 1 having a configuration in which a plurality of cables having a small outer diameter are arranged and solder-connected to the wiring board 10.

  DESCRIPTION OF SYMBOLS 1,1A, 1B, 1C, 100 ... Cable module 10, 10A, 10B ... Wiring board, 11 ... Board, 12 ... Connection terminal, 13 ... Connection terminal row, 14 ... Resist, 15 ... Ground bar, 20 ... Single core Cable, 21 ... conductor, 22 ... conductor connection, 23 ... insulator, 30 ... coaxial cable, 31 ... conductor, 32 ... conductor connection, 33 ... inner insulation layer, 34 ... shield conductor, 35 ... shield extension, 36 ... insulator, 40, 40X ... laminate.

Claims (6)

In a cable module comprising a wiring board and a plurality of cables connected to the wiring board, the outer diameter of at least one of the cables is smaller than the outer diameter of the other cable,
The connection terminal corresponding to the cable having the smallest outer diameter among the connection terminals formed on the wiring board is disposed at an end of the connection terminal row,
Each said cable is connected to each said corresponding connecting terminal. The cable module characterized by the above-mentioned. The cable module according to claim 1,
Each of the connection terminals is arranged so that the cables are arranged in descending order of the outer diameter. The cable module according to claim 2, wherein
A plurality of the wiring boards;
In each of the wiring boards, the connection terminals are arranged so that the cables are arranged in descending order of the outer diameter,
The cable module is characterized in that the wiring boards are stacked so that the arrangement portion of the cable having the largest outer diameter and the arrangement portion of the cable having the smallest outer diameter are alternately arranged. The cable module according to claim 1,
The cable having the largest outer diameter is arranged in the center;
Each of the connection terminals is arranged so that the cables are arranged in order of increasing outer diameter from the cable having the largest outer diameter toward the outside. In the cable module as described in any one of Claims 1-4,
The outer diameter of each said cable is 200 micrometers or less. The cable module characterized by the above-mentioned. It is a manufacturing method of the cable module as described in any one of Claims 1-5,
A method of manufacturing a cable module, comprising: solder-connecting to the wiring board in order from the cable having the largest outer diameter.