JP2013110042A - Housing - Google Patents

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JP2013110042A
JP2013110042A JP2011255638A JP2011255638A JP2013110042A JP 2013110042 A JP2013110042 A JP 2013110042A JP 2011255638 A JP2011255638 A JP 2011255638A JP 2011255638 A JP2011255638 A JP 2011255638A JP 2013110042 A JP2013110042 A JP 2013110042A
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wall portion
circuit board
depth direction
inclined surface
wall
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JP5556795B2 (en
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Yuji Watanabe
裕司 渡辺
Taku Iida
卓 飯田
Takashi Kamiya
隆志 神谷
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Denso Corp
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Denso Corp
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Priority to DE102012221007.5A priority patent/DE102012221007B4/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0026Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0039Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a tubular housing wherein the PCB is inserted longitudinally
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0026Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0069Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/72Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits

Abstract

PROBLEM TO BE SOLVED: To provide a housing for a card edge connector capable of easily arranging a circuit board while restraining intrusion of foreign matters.SOLUTION: A cylinder part of a first case constituting a housing has a wall projecting from an inner wall and partially narrowing an internal space. The wall has a first wall opposed to one face of the circuit board, and a second wall opposed to a rear face. The opposed face of the first wall has an inclined face whose outside end in a depth direction is nearer the second wall than an end on a deep side in the depth direction, and the opposed face of the second wall has an inclined face whose end on a deep side in the depth direction is nearer the first wall than an outside end in the depth direction. On the inclined faces of the first and second walls, a distance D1 between the outside end in the depth direction on the inclined face of the first wall and the deep side end in the depth direction of the inclined face of the second wall along a height direction is minimum at a distance between the opposed face of the first wall and the opposed face of the second wall along the height direction, longer than thickness T1 of the circuit board, and shorter than a minimum value D2 of an opposite distance of the inclined faces in a direction orthogonal to the inclined faces.

Description

本発明は、回路基板及びカードエッジコネクタとともに電子装置を構成する、カードエッジコネクタ用の筐体に関するものである。   The present invention relates to a housing for a card edge connector that constitutes an electronic device together with a circuit board and a card edge connector.

従来、特許文献1に示されるように、回路基板及びカードエッジコネクタとともに電子装置を構成する、カードエッジコネクタ用の筐体が知られている。カードエッジコネクタでは、回路基板そのものがオス端子の役割を果たし、その回路基板の端部をカードエッジコネクタを構成するハウジングの差込空間に挿入することにより、回路基板の端部表面に設けられた電極と、ハウジングから差込空間に突出する端子の接点部とが接触して電気的な導通が図られる。そして、カードエッジコネクタ用の筐体は、カードエッジコネクタの差込空間に回路基板の一方の端部が挿入配置され、端子に回路基板の電極が接触された状態で、差込空間を含むカードエッジコネクタの一部及び回路基板を、内部空間に収容すべく袋形状をなしている。   Conventionally, as disclosed in Patent Document 1, a housing for a card edge connector that constitutes an electronic device together with a circuit board and a card edge connector is known. In the card edge connector, the circuit board itself serves as a male terminal, and the end of the circuit board is provided on the end surface of the circuit board by inserting it into the insertion space of the housing constituting the card edge connector. The electrode and the contact portion of the terminal projecting from the housing into the insertion space come into contact with each other to achieve electrical conduction. The card edge connector case includes a card including an insertion space in a state in which one end of the circuit board is inserted and disposed in the insertion space of the card edge connector and the electrode of the circuit board is in contact with the terminal. A part of the edge connector and the circuit board are formed in a bag shape so as to be accommodated in the internal space.

特開2011−28994号公報JP 2011-28994 A

カードエッジコネクタでは、筐体に回路基板を収容した状態で、カードエッジコネクタを、差込空間が開口する先端面側から筐体の内部空間に挿入することで、ハウジングの差込空間に回路基板の端部が挿入されて、端子が電極と電気的に接続されるようになっている。したがって、カードエッジコネクタが挿入されるまでは、筐体の内部空間に異物が侵入しやすく、回路基板に実装された電子部品間のショートといった不具合が生じる虞がある。   In the card edge connector, the circuit board is inserted into the insertion space of the housing by inserting the card edge connector into the internal space of the housing from the front end surface side where the insertion space opens while the circuit board is accommodated in the housing. The terminal is electrically connected to the electrode. Therefore, until the card edge connector is inserted, foreign matter is likely to enter the internal space of the housing, and there is a possibility that a problem such as a short circuit between electronic components mounted on the circuit board may occur.

これに対し、従来周知ではない技術として、筐体に、袋形状の内壁から突出する壁部を設けることで、内部空間への異物の侵入を抑制することも考えられる。しかしながら、異物の侵入抑制効果を高めるために壁部における回路基板の通過領域(空間)を狭くするほど、回路基板が壁部を通過しにくくなる。   On the other hand, as a technique not conventionally known, it is also conceivable to suppress the intrusion of foreign matter into the internal space by providing the casing with a wall portion protruding from the bag-shaped inner wall. However, the narrower the passage area (space) of the circuit board in the wall in order to enhance the effect of suppressing the entry of foreign matter, the more difficult the circuit board passes through the wall.

本発明は上記問題点に鑑み、異物の侵入を抑制しつつ回路基板を配置しやすくすることのできるカードエッジコネクタ用の筐体を提供することを目的とする。   In view of the above problems, an object of the present invention is to provide a case for a card edge connector that can easily arrange a circuit board while suppressing entry of foreign matter.

上記目的を達成する為に、請求項1に係る発明は、
回路基板の一方の端部が挿入される差込空間を有するハウジングと、該ハウジングに保持され、差込空間内に突出する端子とを備えるカードエッジコネクタの差込空間に、回路基板の一方の端部が挿入配置されて端子に回路基板の電極が接触された状態で、差込空間を含むカードエッジコネクタの少なくとも一部及び回路基板を、内部空間に収容する袋形状の筐体であって、
ハウジングの外周面を覆うように両端が開口する筒状に形成された筒部を有する第1ケースと、該第1ケースに組み付けられて、第1ケースとともに内部空間を構成する第2ケースと、を有し、
第1ケースの筒部は、内部空間の深さ方向において、ハウジングにおける差込空間の開口する先端面と、回路基板における電子部品の実装領域との間に位置するように内壁から突出して設けられ、内部空間を部分的に狭める壁部を有し、
壁部は、深さ方向と直交する高さ方向において、回路基板の一面と対向する第1壁部と、回路基板における一面と反対の裏面と対向する第2壁部を有し、
第1壁部における回路基板との対向面は、深さ方向外側の端部が深さ方向奥側の端部よりも高さ方向において第2壁部に近い傾斜面を有し、
第2壁部における回路基板との対向面は、深さ方向奥側の端部が深さ方向外側の端部よりも高さ方向において第1壁部に近い傾斜面を有し、
第1壁部の傾斜面と第2壁部の傾斜面とは、第1壁部の傾斜面における深さ方向外側の端部と、第2壁部の傾斜面における深さ方向奥側の端部との高さ方向に沿う距離D1が、第1壁部の対向面と第2壁部の対向面との高さ方向に沿う距離において最小であり、且つ、距離D1は、回路基板の厚さT1よりも長く、傾斜面に直交する方向において第1壁部の傾斜面と第2壁部の傾斜面との対向距離の最小値D2よりも短くなるように設けられ、
高さ方向において、第1壁部の傾斜面における深さ方向外側の端部と第2壁部の傾斜面における深さ方向奥側の端部との中心と、回路基板における一方の端部と反対の端部(以下、回路基板の反対の端部と示す)における厚さの中心とが一致するように、回路基板の反対の端部を固定する固定部を有することを特徴とする。
In order to achieve the above object, the invention according to claim 1
One end of the circuit board is inserted into the insertion space of the card edge connector including a housing having an insertion space into which one end of the circuit board is inserted, and a terminal held in the housing and protruding into the insertion space. A bag-shaped housing for accommodating at least a part of the card edge connector including the insertion space and the circuit board in the internal space in a state where the end portion is inserted and the electrode of the circuit board is in contact with the terminal. ,
A first case having a cylindrical portion formed in a cylindrical shape whose both ends are open so as to cover the outer peripheral surface of the housing; a second case which is assembled to the first case and forms an internal space together with the first case; Have
The cylindrical portion of the first case is provided so as to protrude from the inner wall so as to be positioned between the leading end surface of the insertion space in the housing and the mounting area of the electronic component on the circuit board in the depth direction of the internal space. , Having a wall that partially narrows the interior space,
The wall portion has a first wall portion facing one surface of the circuit board in a height direction orthogonal to the depth direction, and a second wall portion facing the back surface opposite to the one surface of the circuit board,
The facing surface of the first wall portion facing the circuit board has an inclined surface that is closer to the second wall portion in the height direction than the end portion in the depth direction on the outer side in the depth direction,
The surface facing the circuit board in the second wall portion has an inclined surface closer to the first wall portion in the height direction than the end portion on the depth direction outer side on the depth direction outer side,
The inclined surface of the first wall portion and the inclined surface of the second wall portion are an end portion on the outer side in the depth direction on the inclined surface of the first wall portion, and an end on the far side in the depth direction on the inclined surface of the second wall portion. The distance D1 along the height direction with respect to the portion is the smallest in the distance along the height direction between the facing surface of the first wall portion and the facing surface of the second wall portion, and the distance D1 is the thickness of the circuit board. Longer than the length T1 and provided to be shorter than the minimum value D2 of the facing distance between the inclined surface of the first wall portion and the inclined surface of the second wall portion in the direction orthogonal to the inclined surface,
In the height direction, the center of the end in the depth direction on the inclined surface of the first wall and the end on the back in the depth direction of the inclined surface of the second wall, and one end of the circuit board It has a fixing portion for fixing the opposite end portion of the circuit board so that the center of the thickness at the opposite end portion (hereinafter referred to as the opposite end portion of the circuit board) coincides.

これによれば、筐体が、内部空間を部分的に狭める壁部を有しているため、筐体内に回路基板を挿入した状態で、壁部よりも深さ方向奥側への異物の侵入を抑制することができる。すなわち、壁部よりも深さ方向奥側に位置することとなる電子部品に、ショートなどの不具合が生じるのを抑制することができる。   According to this, since the housing has a wall portion that partially narrows the internal space, intrusion of foreign matter deeper in the depth direction than the wall portion with the circuit board inserted into the housing. Can be suppressed. That is, it is possible to suppress the occurrence of defects such as a short circuit in the electronic component that is located on the deeper side in the depth direction than the wall portion.

ところで、筐体の内部空間に回路基板を配置する際、回路基板のうち電極が形成された一方の端部は、カードエッジコネクタの差込空間に挿入可能なように、壁部よりも深さ方向外側に配置され、電子部品が実装された電子部品の実装領域及び固定部により固定される端部は、壁部よりも深さ方向奥側に配置されることとなる。筐体が1つの部材のみからなる場合、回路基板を、袋形状をなす筐体の開口端から内部空間に挿入することとなるが、この場合、第1壁部と第2壁部との間の空間を介して、内部空間における壁部よりも深さ方向の奥側に配置させなければならない。したがって、電子部品が通過可能に壁部を設けなければならず、異物抑制の効果が弱まる。これに対し、本発明では、筐体が、壁部の設けられた筒部を有する第1ケースと、第2ケースとの2つの部材からなる。このため、回路基板を配置する際に、第1ケースの筒部における筐体の開口端をなす側の開口端と反対の開口端側から、第1壁部と第2壁部との間の空間に対し、回路基板を挿通させることができる。したがって、第1壁部と第2壁部との間の空間を通過するのは、電極が形成された一方の端部など、電子部品の実装されていない領域であり、電子部品を通過させる必要はないので、第1壁部と第2壁部との間の空間を狭く設定することができる。すなわち、壁部よりも深さ方向奥側への異物侵入抑制の効果を高めることができる。   By the way, when placing the circuit board in the internal space of the housing, one end of the circuit board on which the electrode is formed is deeper than the wall so that it can be inserted into the insertion space of the card edge connector. The mounting area of the electronic component on which the electronic component is mounted and the end portion fixed by the fixing portion are arranged on the far side in the depth direction from the wall portion. When the casing is composed of only one member, the circuit board is inserted into the internal space from the open end of the bag-shaped casing. In this case, the circuit board is inserted between the first wall portion and the second wall portion. It is necessary to arrange it through the inner space in the depth direction from the wall portion in the inner space. Therefore, the wall portion must be provided so that the electronic component can pass through, and the effect of suppressing foreign matter is weakened. On the other hand, in this invention, a housing | casing consists of two members, the 1st case which has a cylinder part in which the wall part was provided, and a 2nd case. For this reason, when arranging the circuit board, from the opening end side opposite to the opening end on the side that forms the opening end of the housing in the cylindrical portion of the first case, between the first wall portion and the second wall portion. The circuit board can be inserted into the space. Accordingly, the space between the first wall portion and the second wall portion passes through the space where the electronic component is not mounted, such as one end where the electrode is formed, and it is necessary to pass the electronic component. Therefore, the space between the first wall portion and the second wall portion can be set narrow. That is, it is possible to enhance the effect of suppressing the entry of foreign matter into the depth direction depth side from the wall portion.

また、本発明では、第1壁部の対向面に、深さ方向外側の端部が深さ方向奥側の端部よりも第2壁部に近い傾斜面を有し、第2壁部の対向面に、深さ方向奥側の端部が深さ方向外側の端部よりも第1壁部に近い傾斜面を有する。そして、高さ方向に沿う対向面間の最小距離である距離D1を、傾斜面の対向距離の最小値D2よりも短くしている。また、距離D1を回路基板の厚さT1よりも長くしている。したがって、傾斜面のうち、対向距離の最小値D2をなす部分に対して回路基板の一面及び裏面が平行となるようにすることで、距離D1よりも長い対向距離の最小値D2の空間を回路基板が挿通することとなり、回路基板を配置しやすくすることができる。なお、本発明では、回路基板を筐体に配置する際に、上記したように、回路基板の電極形成領域が、第1壁部と第2壁部との間の空間を通過するため、電極が壁部に接触することで、電極が損傷したり、剥がれた屑などにより短絡が生じる虞がある。したがって、少なくとも回路基板の電極形成領域が、対向距離の最小値D2の空間を通過する際に、傾斜面のうち、対向距離の最小値D2をなす部分に対して回路基板の一面及び裏面が平行となるようにすれば良い。   Further, in the present invention, the opposing surface of the first wall portion has an inclined surface whose end portion on the outer side in the depth direction is closer to the second wall portion than the end portion on the back side in the depth direction, The opposite surface has an inclined surface closer to the first wall than the end on the depth direction outer side than the end on the outer side in the depth direction. And distance D1 which is the minimum distance between the opposing surfaces along a height direction is made shorter than minimum value D2 of the opposing distance of an inclined surface. Further, the distance D1 is longer than the thickness T1 of the circuit board. Therefore, by making the one surface and the back surface of the circuit board parallel to the portion of the inclined surface that forms the minimum value D2 of the facing distance, the space of the minimum value D2 of the facing distance that is longer than the distance D1 is formed in the circuit. The board is inserted, and the circuit board can be easily arranged. In the present invention, when the circuit board is disposed in the housing, the electrode formation region of the circuit board passes through the space between the first wall portion and the second wall portion as described above, so that the electrode There is a possibility that the electrode may be damaged or a short circuit may occur due to debris peeled off due to contact with the wall portion. Therefore, when at least the electrode formation region of the circuit board passes through the space having the minimum value D2 of the opposing distance, one surface and the back surface of the circuit board are parallel to the portion of the inclined surface that forms the minimum value D2 of the opposing distance. It should be so that.

一方、内部空間に回路基板が配置された状態では、理想的には、回路基板の一面及び裏面が高さ方向に対して略垂直となるように配置されるため、壁部よりも奥側への異物の侵入しやすさは、高さ方向に沿う対向面間の最小距離である距離D1に依存する。本発明では、上記したように、距離D1が、傾斜面間の対向距離の最小値D2よりも短いため、壁部よりも深さ方向奥側への異物の侵入を抑制することができる。このように、本発明によれば、壁部よりも深さ方向奥側への異物の侵入を抑制しつつ回路基板を配置しやすることができる。   On the other hand, in a state where the circuit board is arranged in the internal space, ideally, since the one surface and the back surface of the circuit board are arranged so as to be substantially perpendicular to the height direction, it is further to the back than the wall portion. The ease of entry of foreign matter depends on the distance D1, which is the minimum distance between the opposing surfaces along the height direction. In the present invention, as described above, since the distance D1 is shorter than the minimum value D2 of the facing distance between the inclined surfaces, it is possible to suppress the intrusion of the foreign matter in the depth direction deeper than the wall portion. As described above, according to the present invention, it is possible to arrange the circuit board while suppressing the intrusion of the foreign matter into the depth direction rear side of the wall portion.

なお、本発明では、固定部が、第1壁部の傾斜面における深さ方向外側の端部と第2壁部の傾斜面における深さ方向奥側の端部との中心と、回路基板の反対の端部における厚さの中心とが一致するように、回路基板の反対の端部を固定すべく設けられている。このため、固定部を支点として高さ方向に回路基板が傾き、第1壁部又は第2壁部の傾斜面に接触するとしても、第1壁部の傾斜面における深さ方向外側の端部又は第2壁部の傾斜面における深さ方向奥側の端部のいずれかに接触することとなる。したがって、回路基板がいずれかの傾斜面全面に接触することはないので、壁部よりも深さ方向奥側への異物の侵入を抑制することができる。   In the present invention, the fixing portion includes the center of the end portion on the outer side in the depth direction on the inclined surface of the first wall portion and the end portion on the inner side in the depth direction on the inclined surface of the second wall portion, and the circuit board. It is provided to fix the opposite end of the circuit board so that the center of thickness at the opposite end coincides. For this reason, even if the circuit board is inclined in the height direction with the fixed portion as a fulcrum and contacts the inclined surface of the first wall portion or the second wall portion, the end portion on the outer side in the depth direction on the inclined surface of the first wall portion Or it will contact either of the edge part of the depth direction back | inner side in the inclined surface of a 2nd wall part. Therefore, since the circuit board does not contact the entire surface of any one of the inclined surfaces, it is possible to suppress the intrusion of foreign matters to the depth direction depth side rather than the wall portion.

請求項2に記載のように、
第1壁部の傾斜面と第2壁部の傾斜面とは、第1壁部の傾斜面における深さ方向外側の端部が第2壁部の傾斜面における深さ方向奥側の端部よりも深さ方向において外側に位置しつつ、深さ方向において互いに重ならないようにずれて設けられると良い。
As claimed in claim 2,
The inclined surface of the first wall portion and the inclined surface of the second wall portion are the end portions in the depth direction outer side of the inclined surface of the second wall portion in the depth direction outer side of the inclined surface of the first wall portion. It is preferable that they are provided so as not to overlap each other in the depth direction while being located outside in the depth direction.

これによれば、深さ方向において少なくとも一部が重なる構成に較べて、距離D1を一定としつつ傾斜面間の対向距離の最小値D2を長くとることができる。したがって、異物を抑制しつつ回路基板を筐体に対して配置しやすくすることができる。換言すれば、回路基板の電極形成領域が、第1壁部と第2壁部との間の空間を通過しやすくすることができる。   According to this, the minimum value D2 of the facing distance between the inclined surfaces can be increased while keeping the distance D1 constant as compared with the configuration in which at least a part overlaps in the depth direction. Therefore, it is possible to easily arrange the circuit board with respect to the housing while suppressing foreign matters. In other words, the electrode formation region of the circuit board can easily pass through the space between the first wall portion and the second wall portion.

請求項3に記載のように、
第1壁部の傾斜面と第2壁部の傾斜面とは、第1壁部の傾斜面における深さ方向外側の端部が第2壁部の傾斜面における深さ方向奥側の端部よりも深さ方向において外側に位置しつつ、深さ方向において少なくとも一部が重なるようにしても良い。
As claimed in claim 3,
The inclined surface of the first wall portion and the inclined surface of the second wall portion are the end portions in the depth direction outer side of the inclined surface of the second wall portion in the depth direction outer side of the inclined surface of the first wall portion. Alternatively, at least a portion may overlap in the depth direction while being positioned outside in the depth direction.

これによれば、深さ方向において互いに重ならないようにずれて設けられる構成に較べて、深さ方向における筐体の長さを一定としつつ、壁部よりも深さ方向奥側における内部空間の容積を大きくする、すなわち回路基板における電子部品の実装領域を大きくすることができる。換言すれば、回路基板において、電子部品の実装領域を一定とすると、深さ方向において筐体の体格を小型化することができる。   According to this, the length of the inner space on the back side in the depth direction from the wall portion is made constant while the length of the casing in the depth direction is made constant as compared with the configuration in which they are provided so as not to overlap each other in the depth direction. The volume can be increased, that is, the mounting area of the electronic component on the circuit board can be increased. In other words, if the mounting area of the electronic component is fixed in the circuit board, the physique of the housing can be reduced in the depth direction.

さらには、請求項4に記載のように、第1壁部の傾斜面と第2壁部の傾斜面とは、深さ方向において完全に一致するようにしても良い。これによれば、例えば深さ方向において筐体の体格を小型化する効果を高めることができる。   Furthermore, as described in claim 4, the inclined surface of the first wall portion and the inclined surface of the second wall portion may completely coincide with each other in the depth direction. According to this, for example, the effect of downsizing the physique of the housing in the depth direction can be enhanced.

請求項5に記載のように、
深さ方向及び高さ方向の両方に直交する幅方向において、壁部の少なくとも一部における距離D1が、ハウジングの先端面に開口する差込空間の高さ方向の寸法D3よりも短くされた構成とすると良い。
As claimed in claim 5,
In the width direction orthogonal to both the depth direction and the height direction, the distance D1 in at least a part of the wall portion is made shorter than the dimension D3 in the height direction of the insertion space opened in the front end surface of the housing. And good.

これによれば、壁部が、回路基板の傾きを制限する機能を有する。このため、カードエッジコネクタを筐体の内部空間に挿入しつつ、ハウジングの差込空間に回路基板の一方の端部を挿入する際に、差込空間に回路基板を挿入しやすくすることができる。   According to this, the wall portion has a function of limiting the inclination of the circuit board. For this reason, it is possible to facilitate insertion of the circuit board into the insertion space when inserting one end of the circuit board into the insertion space of the housing while inserting the card edge connector into the internal space of the housing. .

請求項6に記載のように、
幅方向において、第1壁部及び第2壁部は、回路基板と対向する部分の全域に傾斜面を有しており、回路基板の電極形成領域に対応する部分を除く部分の少なくとも一部(以下、非電極形成領域に対応する部分と示す)が寸法D3よりも距離D1の小さい部分とされ、電極形成領域に対応する部分は寸法D3よりも距離D1の大きい部分とされても良い。
As claimed in claim 6,
In the width direction, the first wall portion and the second wall portion have an inclined surface over the entire portion facing the circuit board, and at least a part of the portion excluding the portion corresponding to the electrode formation region of the circuit board ( Hereinafter, the portion corresponding to the non-electrode formation region) may be a portion having a distance D1 smaller than the dimension D3, and the portion corresponding to the electrode formation region may be a portion having a distance D1 larger than the dimension D3.

これによれば、回路基板の非電極形成領域に対応する部分よりも電極形成領域に対応する部分のほうが距離D1が長いため、差込空間に回路基板を挿入しやすくしつつ、壁部に対して電極を接触しにくくすることができる。   According to this, since the distance D1 is longer in the portion corresponding to the electrode formation region than in the portion corresponding to the non-electrode formation region of the circuit board, it is easier to insert the circuit board into the insertion space and The electrode can be made difficult to contact.

請求項7に記載のように、
壁部において、寸法D3よりも距離D1の小さい部分おける第1壁部及び第2壁部の少なくとも一方の傾斜面が、寸法D3よりも距離D1の大きい部分における第1壁部の傾斜面及び第2壁部の傾斜面よりも、深さ方向奥側に設けられると良い。
As claimed in claim 7,
In the wall portion, at least one inclined surface of the first wall portion and the second wall portion in the portion having the distance D1 smaller than the dimension D3 is the inclined surface of the first wall portion and the first surface in the portion having the distance D1 larger than the dimension D3. It is good to be provided in the depth direction depth side rather than the inclined surface of the two wall portions.

これによれば、非電極形成領域に対応する部分の傾斜面が、電極形成領域に対応する部分の傾斜面よりも深さ方向奥側に位置するため、非電極形成領域に対応する部分の傾斜面により回路基板が誘導される。したがって、壁部に対して電極を接触しにくくする効果を高めることができる。   According to this, since the inclined surface of the portion corresponding to the non-electrode forming region is located on the deeper side in the depth direction than the inclined surface of the portion corresponding to the electrode forming region, the inclined portion of the portion corresponding to the non-electrode forming region is The circuit board is guided by the surface. Therefore, the effect of making it difficult for the electrode to come into contact with the wall portion can be enhanced.

請求項8に記載のように、
回路基板は、電極を一面及び裏面の両方に有し、
カードエッジコネクタは、端子として、ハウジングにおける回路基板の一面と対向する壁面から突出する端子と、ハウジングにおける回路基板の裏面と対向する壁面から突出する端子と、を有し、これら端子と固定部とにより回路基板が保持されるようになっており、
第1壁部は、高さ方向において内部空間を等分する中心により区画される一方の内部空間のみに位置し、
第2壁部は、高さ方向において内部空間の中心により区画される内部空間のうち、第1壁部の対向面と反対の内部空間のみに位置し、
第1壁部の傾斜面における深さ方向外側の端部と、第2壁部の傾斜面における深さ方向奥側の端部との中心が、高さ方向において筐体の内部空間を等分する中心と一致する構成としても良い。
As claimed in claim 8,
The circuit board has electrodes on one side and the back side,
The card edge connector has, as terminals, a terminal protruding from a wall surface facing the one surface of the circuit board in the housing, and a terminal protruding from a wall surface facing the back surface of the circuit board in the housing. The circuit board is held by
The first wall portion is located only in one internal space defined by a center that equally divides the internal space in the height direction,
A 2nd wall part is located only in the internal space opposite to the opposing surface of a 1st wall part among the internal spaces divided by the center of an internal space in a height direction,
The center of the outer edge in the depth direction on the inclined surface of the first wall and the inner edge of the second wall in the depth direction equally divides the internal space of the housing in the height direction. It is good also as a structure which corresponds to the center to do.

筐体が、回路基板の反対の端部を固定する固定部以外に、回路基板の両端部間の部分を固定する固定部を有する場合、筐体に回路基板を配置した状態で、深さ方向において複数設けられた固定部により、高さ方向における回路基板の位置が決定される。したがって、回路基板の厚さばらつきなどにより、回路基板の厚さの中心と、高さ方向において筐体の内部空間を等分する中心とがずれると、回路基板の一面上に位置する端子と裏面上に位置する端子とでばね変形の量に差が生じる。すなわち、端子と電極との電気的な接続状態にばらつきが生じる。これに対し、本発明では、回路基板の反対の端部を固定する固定部と、回路基板の両面側に位置する端子とで、回路基板が保持されるようになっている。このため、カードエッジコネクタが挿入される前の状態で、回路基板は、固定部により反対の端部が固定されるとともに、壁部により傾きが制限され、高さ方向の位置が完全には決定されていない。したがって、カードエッジコネクタを筐体の内部空間に挿入し、ハウジングの差込空間に回路基板の一方の端部を挿入する際に、回路基板の両面に位置する端子のばね変形による反力によって、回路基板の厚さの中心を、カードエッジコネクタの差込空間の高さ方向の中心に一致させることができる。換言すれば、回路基板の一面上に位置する端子と裏面上に位置する端子とでばね変形の量をほぼ等しくし、端子と電極との電気的な接続状態にばらつきが生じるのを抑制することができる。   When the case has a fixing part that fixes the portion between both ends of the circuit board in addition to the fixing part that fixes the opposite end of the circuit board, the depth direction can be obtained with the circuit board arranged in the case. The position of the circuit board in the height direction is determined by a plurality of fixing portions provided in FIG. Therefore, if the center of the thickness of the circuit board deviates from the center that equally divides the internal space of the housing in the height direction due to variations in the thickness of the circuit board or the like, the terminals and the back surface located on one surface of the circuit board There is a difference in the amount of spring deformation between the terminals located above. That is, the electrical connection state between the terminal and the electrode varies. On the other hand, in the present invention, the circuit board is held by the fixing portion that fixes the opposite end of the circuit board and the terminals located on both sides of the circuit board. For this reason, before the card edge connector is inserted, the opposite end of the circuit board is fixed by the fixing part, and the inclination is limited by the wall part, and the position in the height direction is completely determined. It has not been. Therefore, when inserting the card edge connector into the internal space of the housing and inserting one end of the circuit board into the insertion space of the housing, by the reaction force due to the spring deformation of the terminals located on both sides of the circuit board, The center of the thickness of the circuit board can be made coincident with the center in the height direction of the insertion space of the card edge connector. In other words, the amount of spring deformation is made substantially equal between the terminal located on one surface of the circuit board and the terminal located on the back surface, thereby suppressing variations in the electrical connection state between the terminal and the electrode. Can do.

筐体としては、例えば請求項9に記載のように、
第2ケースは、一端が開口する袋形状をなし、固定部が設けられており、
第2ケースの開口端部と、第1ケースの筒部における一方の端部とが接続されてなる構成を採用することができる。
As the case, for example, as described in claim 9,
The second case has a bag shape with one end opened, and is provided with a fixing portion.
A configuration in which the opening end portion of the second case is connected to one end portion of the cylindrical portion of the first case can be employed.

この構成では、第2ケースの袋形状内部に回路基板を収容しつつ固定部に回路基板を固定し、この状態で、筒部における筐体の開口端をなす開口端とは反対の開口端側から回路基板が挿通するように、第1ケースを第2ケースの開口端部に接続することで、内部空間に回路基板が収容された筐体とすることができる。   In this configuration, the circuit board is fixed to the fixing portion while the circuit board is housed inside the bag shape of the second case, and in this state, the opening end side opposite to the opening end forming the opening end of the casing in the cylindrical portion By connecting the first case to the opening end of the second case so that the circuit board can be inserted through the housing, a housing in which the circuit board is accommodated in the internal space can be obtained.

本実施形態に係る筐体を含む電子装置の概略構成を示す、電極形成領域での断面図である。It is sectional drawing in an electrode formation area which shows schematic structure of the electronic device containing the housing | casing which concerns on this embodiment. 本実施形態に係る筐体を含む電子装置の概略構成を示す、非電極形成領域での断面図である。It is sectional drawing in the non-electrode formation area which shows schematic structure of the electronic device containing the housing | casing which concerns on this embodiment. 図1,図2のIII-III線に沿う断面図である。なお、図1は、図3のI-I線に沿う断面図である。図2には、図3のII-II線に沿う断面図である。It is sectional drawing which follows the III-III line of FIG. 1, FIG. 1 is a cross-sectional view taken along the line II of FIG. FIG. 2 is a cross-sectional view taken along the line II-II in FIG. 図1,図2のIV-IV線に沿う断面図である。なお、図4に示すI-I線は、図3のI-I線に対応しており、図4に示すII-II線は、図3のII-II線に対応している。It is sectional drawing which follows the IV-IV line of FIG. 1, FIG. 4 corresponds to the II line in FIG. 3, and the II-II line in FIG. 4 corresponds to the II-II line in FIG. 筐体のうち、第1ケースの概略構成を示す断面図である。図5は、電極形成領域に対応する部分を示している。It is sectional drawing which shows schematic structure of a 1st case among housing | casings. FIG. 5 shows a portion corresponding to the electrode formation region. 筐体のうち、第1ケースの概略構成を示す断面図である。図6は、非電極形成領域に対応する部分を示している。It is sectional drawing which shows schematic structure of a 1st case among housing | casings. FIG. 6 shows a portion corresponding to the non-electrode formation region. 第2ケースへの第1ケースの組み付けを説明するための断面図である。図7は、電極形成領域に対応する部分を示している。It is sectional drawing for demonstrating the assembly | attachment of the 1st case to a 2nd case. FIG. 7 shows a portion corresponding to the electrode formation region. 第2ケースへの第1ケースの組み付けを説明するための断面図である。図8は、非電極形成領域に対応する部分を示している。It is sectional drawing for demonstrating the assembly | attachment of the 1st case to a 2nd case. FIG. 8 shows a portion corresponding to the non-electrode formation region. 第2ケースへ第1ケースを組み付けた状態を示す断面図である。図9は、電極形成領域に対応する部分を示している。It is sectional drawing which shows the state which assembled | attached the 1st case to the 2nd case. FIG. 9 shows a portion corresponding to the electrode formation region. 第2ケースへ第1ケースを組み付けた状態を示す断面図である。図10は、非電極形成領域に対応する部分を示している。It is sectional drawing which shows the state which assembled | attached the 1st case to the 2nd case. FIG. 10 shows a portion corresponding to the non-electrode formation region. 傾斜面同士が、深さ方向において完全にオーバーラップする例を示す断面図である。It is sectional drawing which shows the example in which inclined surfaces completely overlap in the depth direction. 傾斜面同士が、深さ方向において一部オーバーラップする例を示す断面図である。It is sectional drawing which shows the example in which inclined surfaces partially overlap in the depth direction. 傾斜面同士が、深さ方向においてオーバーラップせずにずれて設けられる例を示す断面図である。It is sectional drawing which shows the example in which inclined surfaces are shifted | deviated and provided without overlapping in the depth direction. 距離D1が寸法D3よりも大きいときの、カードエッジコネクタの挿入を示す断面図である。便宜上、第2ケースを省略して図示している。It is sectional drawing which shows insertion of a card edge connector when the distance D1 is larger than the dimension D3. For convenience, the second case is not shown. 筐体が、深さ方向において、回路基板の両端部の間の部分を固定する固定部を備える構成の断面図である。It is sectional drawing of a structure with which a housing | casing is provided with the fixing | fixed part which fixes the part between the both ends of a circuit board in a depth direction. 本1実施形態に係る電子装置において、カードエッジコネクタを挿入する際の断面図である。It is sectional drawing at the time of inserting a card edge connector in the electronic device which concerns on this 1st Embodiment. カードエッジコネクタを挿入した状態の断面図である。It is sectional drawing of the state which inserted the card edge connector. 壁部の変形例を示す断面図であり、図4に対応している。It is sectional drawing which shows the modification of a wall part, and respond | corresponds to FIG. 壁部の変形例を示す断面図であり、図4に対応している。It is sectional drawing which shows the modification of a wall part, and respond | corresponds to FIG. 筐体の変形例を示す断面図であり、第2ケースを第1ケースに組み付ける途中を示している。It is sectional drawing which shows the modification of a housing | casing, and has shown the middle of the 2nd case being assembled | attached to a 1st case.

以下、本発明の実施の形態を、図面を参照して説明する。なお、以下に示す各実施形態において、共通乃至関連する要素には同一の符号を付与するものとする。また、袋形状とされた筐体の深さ方向、換言すれば回路基板のカードエッジコネクタに対する挿抜方向を単に深さ方向と示す。また、深さ方向に直交する筐体の高さ方向、換言すれば回路基板の厚さ方向を単に高さ方向と示す。また、深さ方向及び高さ方向の両方向に直交する筐体の幅方向、換言すれば回路基板に形成された電極の配列方向を単に幅方向と示す。また、深さ方向において、筐体の内部空間の底に近い側を深さ方向奥側、内部空間の開口端に近い側を深さ方向外側とする。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, common or related elements are given the same reference numerals. In addition, the depth direction of the bag-shaped housing, in other words, the insertion / extraction direction of the circuit board with respect to the card edge connector is simply referred to as the depth direction. Further, the height direction of the casing orthogonal to the depth direction, in other words, the thickness direction of the circuit board is simply indicated as the height direction. Further, the width direction of the casing orthogonal to both the depth direction and the height direction, in other words, the arrangement direction of the electrodes formed on the circuit board is simply referred to as the width direction. Further, in the depth direction, the side close to the bottom of the internal space of the casing is defined as the back side in the depth direction, and the side close to the open end of the internal space is defined as the outside in the depth direction.

先ず、本実施形態に係る筐体を含む、電子装置の概略構成について説明する。   First, a schematic configuration of an electronic device including a housing according to the present embodiment will be described.

図1〜図4に示すように、電子装置10は、回路基板12、カードエッジコネクタ14、筐体16、及びシール材18を備える。すなわち、電子装置10は、防水構造の電子装置10となっている。このような電子装置10は、例えば車両のエンジンECU(Electric Control Unit)として用いられる防水構造の電子制御装置に好適である。   As shown in FIGS. 1 to 4, the electronic device 10 includes a circuit board 12, a card edge connector 14, a housing 16, and a sealing material 18. That is, the electronic device 10 is a waterproof electronic device 10. Such an electronic device 10 is suitable for a waterproof electronic control device used as an engine ECU (Electric Control Unit) of a vehicle, for example.

回路基板12は、樹脂などの電気絶縁材料からなる絶縁基材20と、該絶縁基材20に形成された図示しない配線と、配線の一部としての電極22(ランド)に電気的に接続された図示しない電子部品と、を有して構成されている。   The circuit board 12 is electrically connected to an insulating base material 20 made of an electrically insulating material such as a resin, wiring (not shown) formed on the insulating base material 20, and an electrode 22 (land) as a part of the wiring. And an electronic component (not shown).

電極22は、回路基板12(絶縁基材20)において、深さ方向における一方の端部に形成される。また、一方の端部のうち、一面12a及び該一面12aと反対の裏面12bのうち少なくとも一面12a上に形成される。また、電極22は、回路基板12における形成された面内において、幅方向に沿って配列される。本実施形態では、図1及び図4に示すように、一面12a及び裏面12bの両面に電極22がそれぞれ形成されている。   The electrode 22 is formed at one end in the depth direction on the circuit board 12 (insulating base material 20). Moreover, it forms on at least one surface 12a among the one surface 12a and the back surface 12b opposite to this one surface 12a among one edge parts. In addition, the electrodes 22 are arranged along the width direction within the formed surface of the circuit board 12. In the present embodiment, as shown in FIGS. 1 and 4, electrodes 22 are formed on both the one surface 12 a and the back surface 12 b, respectively.

電子部品としては、マイコン、パワートランジスタ、抵抗、コンデンサ等を採用することができる。この電子部品は、回路基板12において、電極22の形成領域とは異なる領域に実装されている。具体的には、回路基板12のうち、深さ方向において、電極22の形成された一方の端部と反対の端部が、後述の固定部46により固定される部分となっている。そして、深さ方向において、電極22の形成領域と固定部46により固定される領域との間の領域に、電子部品が実装されている。   As the electronic component, a microcomputer, a power transistor, a resistor, a capacitor, or the like can be used. This electronic component is mounted on the circuit board 12 in a region different from the region where the electrodes 22 are formed. Specifically, in the depth direction of the circuit board 12, an end opposite to the one end where the electrode 22 is formed is a portion fixed by a fixing portion 46 described later. In the depth direction, an electronic component is mounted in a region between the formation region of the electrode 22 and the region fixed by the fixing unit 46.

カードエッジコネクタ14は、図示しないハーネスと回路基板12に構成された回路とを電気的に接続する中継部材であり、要部として、電気絶縁材料からなるハウジング30と、ハウジング30に保持された複数の端子32を有する。   The card edge connector 14 is a relay member that electrically connects a harness (not shown) and a circuit formed on the circuit board 12, and includes a housing 30 made of an electrically insulating material as a main part, and a plurality of pieces held by the housing 30. Terminal 32.

ハウジング30は、例えば樹脂を射出成形してなり、回路基板12の一方の端部、すなわち電極形成領域を有する端部、が挿入配置される差込空間34を有する。この差込空間34は、図1及び図2に示すように、ハウジング30の先端面30aに開口しており、回路基板12における一方の端部を収容すべく、回路基板12の厚さに応じた所定の高さと回路基板12の挿入深さに応じた所定深さを有する。本実施形態では、ハウジング30が、ハーネスを収納する図示しない収納空間を有し、この収納空間にハーネスが挿入されると、端子32とハーネスが電気的に接続されるようになっている。なお、ハーネスと一体化した構造の端子32を採用することもできる。また、ハウジング30の外周面には、筐体16との図示しない嵌合部が設けられている。   The housing 30 is formed by, for example, injection molding of resin, and has an insertion space 34 into which one end of the circuit board 12, that is, an end having an electrode formation region is inserted and arranged. As shown in FIGS. 1 and 2, the insertion space 34 is open to the front end surface 30 a of the housing 30, and is in accordance with the thickness of the circuit board 12 to accommodate one end of the circuit board 12. And a predetermined depth corresponding to the insertion depth of the circuit board 12. In the present embodiment, the housing 30 has a storage space (not shown) for storing the harness, and when the harness is inserted into the storage space, the terminal 32 and the harness are electrically connected. In addition, the terminal 32 of the structure integrated with the harness is also employable. Further, a fitting portion (not shown) with the housing 16 is provided on the outer peripheral surface of the housing 30.

端子32は、導電性が良好な金属材料を用いて形成されている。例えばりん青銅をニッケルメッキで被覆し、さらに金メッキで被覆してなるものを採用することができる。この端子32は、図1に示すように、ハウジング30に保持される保持部と、該保持部から延びて差込空間34内に突出し、ばね変形可能に設けられた突出部を有する。そして、突出部が弾性変形した状態で、突出部の一部(所謂接点)が電極22と接触する。したがって、回路基板12の電極22との間で安定した接触圧を確保することができる。なお、端子32の接点は、回路基板12の電極22に対応し、幅方向に沿って配列されている。   The terminal 32 is formed using a metal material having good conductivity. For example, phosphor bronze coated with nickel plating and further coated with gold plating can be employed. As shown in FIG. 1, the terminal 32 includes a holding portion held by the housing 30, and a protruding portion that extends from the holding portion and protrudes into the insertion space 34 so as to be spring-deformable. Then, a part of the protrusion (so-called contact) comes into contact with the electrode 22 in a state where the protrusion is elastically deformed. Therefore, a stable contact pressure with the electrode 22 of the circuit board 12 can be ensured. The contacts of the terminals 32 correspond to the electrodes 22 of the circuit board 12 and are arranged along the width direction.

本実施形態では、差込空間34を構成する壁面のうち、高さ方向において相対する壁面から差込空間34内に端子32の突出部が突出しており、回路基板12の両面側に位置する端子32の弾性変形による反力(付勢力)により、回路基板12が固定されるようになっている。また、回路基板12の両面側に位置する端子32の突出部が、差込空間34の高さ方向の中心を通り、深さ方向に沿った仮想線に対して線対称配置となっている。   In the present embodiment, of the wall surfaces constituting the insertion space 34, the protruding portions of the terminals 32 protrude into the insertion space 34 from the wall surfaces facing in the height direction, and the terminals located on both sides of the circuit board 12. The circuit board 12 is fixed by a reaction force (biasing force) due to the elastic deformation of 32. Further, the protruding portions of the terminals 32 located on both sides of the circuit board 12 pass through the center of the insertion space 34 in the height direction and are arranged in line symmetry with respect to the imaginary line along the depth direction.

筐体16は、カードエッジコネクタ14の差込空間34に、回路基板12の一方の端部が挿入配置されて端子32に回路基板12の電極22が接触された状態で、差込空間34を含むカードエッジコネクタ14の少なくとも一部及び回路基板12を、内部空間に収容する袋形状の部材である。また、ハウジング30の外周面を覆うように両端が開口する筒状に形成された筒部42を有する第1ケース40と、該第1ケース40に組み付けられて、第1ケース40とともに筐体16を構成する第2ケース44と、を有する。この筐体16が、本実施形態に示す電子装置10のうち、主たる特徴部分を有する部材である。その詳細については後述する。なお、第1ケース40の筒部42には、カードエッジコネクタ14を構成するハウジング30との図示しない嵌合部が設けられている。また、第1ケース40と第2ケース44との間にも、図示しない嵌合部が設けられている。   The housing 16 has the insertion space 34 in a state where one end of the circuit board 12 is inserted and disposed in the insertion space 34 of the card edge connector 14 and the electrode 22 of the circuit board 12 is in contact with the terminal 32. It is a bag-shaped member that accommodates at least a part of the card edge connector 14 and the circuit board 12 in the internal space. In addition, a first case 40 having a cylindrical part 42 formed in a cylindrical shape whose both ends open so as to cover the outer peripheral surface of the housing 30, and the first case 40 and the casing 16 together with the first case 40 are assembled. 2nd case 44 which comprises. The casing 16 is a member having a main characteristic portion in the electronic device 10 shown in the present embodiment. Details thereof will be described later. The cylindrical portion 42 of the first case 40 is provided with a fitting portion (not shown) with the housing 30 constituting the card edge connector 14. A fitting portion (not shown) is also provided between the first case 40 and the second case 44.

また、筐体16は、回路基板12の固定部として、回路基板12における電極22が形成された一方の端部と反対の端部(以下、反対の端部と示す)を固定する固定部46を少なくとも有している。本実施形態では、筐体16が回路基板12の固定部として固定部46のみを有しており、この固定部46と、回路基板12の両面側に位置する端子32とにより、回路基板12が固定(保持)される。また、固定部46は、高さ方向において、後述の第1壁部52の傾斜面52bの頂点部52cと第2壁部54の傾斜面54bの頂点部54cとの中心と、回路基板12の反対の端部における厚さの中心とが一致するように設けられている。本実施形態では、筐体16を構成する第2ケース44に固定部46が設けられている。また、固定部46は、幅方向における回路基板12のほぼ中央位置において、回路基板12の一面12aを支持する固定部46と、幅方向における回路基板12の両端付近それぞれにおいて、回路基板12の裏面12bを支持する固定部46と、により構成されている。   The housing 16 is a fixing portion 46 for fixing an end portion (hereinafter referred to as an opposite end portion) opposite to one end portion of the circuit board 12 on which the electrode 22 is formed as a fixing portion of the circuit board 12. At least. In the present embodiment, the housing 16 has only the fixing part 46 as a fixing part of the circuit board 12, and the circuit board 12 is formed by the fixing part 46 and the terminals 32 located on both sides of the circuit board 12. Fixed (held). In addition, the fixing portion 46 has, in the height direction, a center of an apex portion 52c of an inclined surface 52b of the first wall portion 52 and an apex portion 54c of the inclined surface 54b of the second wall portion 54, which will be described later, It is provided so that the center of the thickness at the opposite end coincides. In the present embodiment, a fixing portion 46 is provided in the second case 44 constituting the housing 16. In addition, the fixing portion 46 is provided at the substantially central position of the circuit board 12 in the width direction, and the fixing portion 46 that supports the one surface 12a of the circuit board 12 and the back surface of the circuit board 12 in the vicinity of both ends of the circuit board 12 in the width direction. And a fixing portion 46 for supporting the 12b.

シール材18は、カードエッジコネクタ14が筐体16に挿入された状態で、筐体16の内部空間とカードエッジコネクタ14のハウジング30の差込空間34とにより構成される回路基板12の収容空間を気密に封止し、収容空間に水などが侵入するのを防止する機能を果たすものである。このシール材18は、図1及び図2に示すように、カードエッジコネクタ14を構成するハウジング30と筐体16を構成する第1ケース40の筒部42との対向部位間に配置される。また、第1ケース40と第2ケース44との対向部位間にも配置される。本実施形態では、筐体16のうち、第1ケース40の筒部42のみが、カードエッジコネクタ14を構成するハウジング30の外周面と対向する。すなわち、第1ケース40及びハウジング30のシール部位が、第1ケース40及び第2ケース44のシール部位と連結されないようになっている。このように、シール材18の分岐部(三叉部)が存在しないので、分岐部が存在するような筐体16の構造を有するものに較べて、気密性を向上することができる。なお、ハウジング30と第1ケース40の筒部42との対向部位間に配置されるシール材18としては、カードエッジコネクタ14の挿抜などを考慮し、ゴム製のリング部材(例えばOリング)を採用することができる。一方、第1ケース40と第2ケース44との対向部位間に配置されるシール材18としては、上記したゴム製のリング部材や硬化型接着剤などを採用することができる。硬化型接着剤としては、例えばシリコン系の湿気硬化型接着材を用いることができる。本実施形態では、第1ケース40と第2ケース44との対向部位間に配置されるシール材18も、ゴム製のリング部材を採用している。   The sealing material 18 is an accommodation space for the circuit board 12 that is configured by the internal space of the housing 16 and the insertion space 34 of the housing 30 of the card edge connector 14 in a state where the card edge connector 14 is inserted into the housing 16. Is hermetically sealed to prevent water and the like from entering the housing space. As shown in FIGS. 1 and 2, the sealing material 18 is disposed between opposing portions of the housing 30 constituting the card edge connector 14 and the cylindrical portion 42 of the first case 40 constituting the housing 16. Further, the first case 40 and the second case 44 are also disposed between opposing portions. In the present embodiment, only the cylindrical portion 42 of the first case 40 of the housing 16 faces the outer peripheral surface of the housing 30 that constitutes the card edge connector 14. That is, the seal parts of the first case 40 and the housing 30 are not connected to the seal parts of the first case 40 and the second case 44. Thus, since the branch part (three-pronged part) of the sealing material 18 does not exist, airtightness can be improved compared with what has the structure of the housing | casing 16 in which a branch part exists. Note that a rubber ring member (for example, an O-ring) is used as the sealing material 18 disposed between the facing portions of the housing 30 and the cylindrical portion 42 of the first case 40 in consideration of insertion and removal of the card edge connector 14 and the like. Can be adopted. On the other hand, as the sealing material 18 disposed between the facing portions of the first case 40 and the second case 44, the above-described rubber ring member, curable adhesive, or the like can be employed. As the curable adhesive, for example, a silicon-based moisture curable adhesive can be used. In the present embodiment, the seal member 18 disposed between the facing portions of the first case 40 and the second case 44 also employs a rubber ring member.

次に、筐体16における特徴部分の構造について、図1〜図6を用いて説明する。   Next, the structure of the characteristic part in the housing | casing 16 is demonstrated using FIGS.

第1ケース40の筒部42は、内壁から突出し、筐体16の内部空間を部分的に狭める壁部48を有する。また、壁部48により内部空間が狭めれた部分は、筐体16の内部空間に回路基板12を収容する際に、回路基板12が挿通されるスリット50となっている。壁部48は、深さ方向において、ハウジング30の先端面30aと、回路基板12における電子部品の実装領域との間に位置するように設けられている。   The cylindrical portion 42 of the first case 40 has a wall portion 48 that protrudes from the inner wall and partially narrows the internal space of the housing 16. Further, the portion where the internal space is narrowed by the wall portion 48 is a slit 50 through which the circuit board 12 is inserted when the circuit board 12 is accommodated in the internal space of the housing 16. The wall portion 48 is provided so as to be positioned between the front end surface 30a of the housing 30 and the electronic component mounting region on the circuit board 12 in the depth direction.

この壁部48は、高さ方向において、回路基板12の一面12aと対向する第1壁部52と、回路基板12の裏面12bと対向する第2壁部54を有する。第1壁部52は、回路基板12の一面12aとの対向面52aとして、深さ方向外側の端部52c(以下、頂点部52cと示す)が深さ方向奥側の端部よりも高さ方向において第2壁部54に近い傾斜面52bを有する。一方、第2壁部54は、回路基板12の裏面12bとの対向面として、深さ方向奥側の端部54c(以下、頂点部54cと示す)が深さ方向外側の端部よりも高さ方向において第1壁部52に近い傾斜面54bを有する。   The wall 48 has a first wall 52 that faces the one surface 12 a of the circuit board 12 and a second wall 54 that faces the back surface 12 b of the circuit board 12 in the height direction. The first wall 52 is a surface 52a facing the one surface 12a of the circuit board 12, and an end 52c (hereinafter referred to as a vertex 52c) on the outer side in the depth direction is higher than an end on the far side in the depth direction. It has the inclined surface 52b close | similar to the 2nd wall part 54 in a direction. On the other hand, the second wall portion 54 is a surface facing the back surface 12b of the circuit board 12 such that an end portion 54c on the back side in the depth direction (hereinafter referred to as a vertex portion 54c) is higher than an end portion on the outer side in the depth direction. It has an inclined surface 54b close to the first wall portion 52 in the vertical direction.

ここで、第1壁部52の傾斜面52bにおける頂点部52cと、第2壁部54の傾斜面54bにおける頂点部54cとの高さ方向に沿う距離をD1とする。また、回路基板12(絶縁基材20)の厚さをT1、傾斜面52b,54bに直交する方向において傾斜面52bと傾斜面54bとの対向距離の最小値をD2とする。すると、距離D1が、第1壁部52の対向面52aと第2壁部54の対向面54aとの高さ方向に沿う距離において最小であり、且つ、回路基板の厚さT1よりも長く、傾斜面52b,54b間の対向距離の最小値D2よりも短くなるように、第1壁部52及び第2壁部54が設けられている。   Here, the distance along the height direction between the apex portion 52c of the inclined surface 52b of the first wall portion 52 and the apex portion 54c of the inclined surface 54b of the second wall portion 54 is defined as D1. Further, the thickness of the circuit board 12 (insulating base material 20) is T1, and the minimum value of the facing distance between the inclined surface 52b and the inclined surface 54b in the direction orthogonal to the inclined surfaces 52b and 54b is D2. Then, the distance D1 is minimum in the distance along the height direction between the facing surface 52a of the first wall portion 52 and the facing surface 54a of the second wall portion 54, and is longer than the thickness T1 of the circuit board. The first wall portion 52 and the second wall portion 54 are provided so as to be shorter than the minimum value D2 of the facing distance between the inclined surfaces 52b and 54b.

本実施形態では、図3に示すように、深さ方向に垂直な断面が略矩形筒状の筒部42の内壁全周にわたって、壁部48が設けられている。また、壁部48は、第1ケース40の一部として一体的に成形されている。図3では、二点鎖線よりも内側の部分が壁部48となっている。第1壁部52の傾斜面52b及び第2壁部54の傾斜面54bは、それぞれ深さ方向に対する高さ方向の変化量が一定となっている。さらには、傾斜面52b,54b同士が平行となっている。このため、本実施形態では、傾斜面52b,54bの全域で、対向距離が最小値D2となっている。また、図3に示すように、幅方向において、電極22の形成領域に対応する第1壁部52及び第2壁部54の部分と、幅方向両端の非電極形成領域に対応する第1壁部52及び第2壁部54の部分とで、構造が異なっている。   In the present embodiment, as shown in FIG. 3, a wall portion 48 is provided over the entire inner wall of the cylindrical portion 42 whose cross section perpendicular to the depth direction is substantially rectangular. The wall 48 is integrally formed as a part of the first case 40. In FIG. 3, the portion inside the two-dot chain line is the wall portion 48. The inclined surface 52b of the first wall portion 52 and the inclined surface 54b of the second wall portion 54 each have a constant amount of change in the height direction with respect to the depth direction. Furthermore, the inclined surfaces 52b and 54b are parallel to each other. For this reason, in this embodiment, the opposing distance is the minimum value D2 over the entire area of the inclined surfaces 52b and 54b. In addition, as shown in FIG. 3, in the width direction, the first wall 52 and the second wall 54 corresponding to the formation region of the electrode 22 and the first wall corresponding to the non-electrode formation regions at both ends in the width direction. The structure is different between the portion 52 and the second wall portion 54.

電極22の形成領域に対応する第1壁部52及び第2壁部54の部分は、図1及び図5に示すように、対向面52a,54aとして、それぞれ傾斜面52b,54bのみを有している。また、深さ方向において、傾斜面52b,54b同士が完全にオーバーラップしており、第1壁部52の頂点部52cが、第2壁部54の頂点部54cよりも深さ方向外側に位置している。すなわち、第1壁部52の頂点部52cが、第2壁部54の深さ方向外側の端部と一致し、第2壁部54の頂点部54cが、第1壁部52の深さ方向奥側の端部と一致している。そして、幅方向において、電極22の形成領域に対応する第1壁部52及び第2壁部54の部分では、図5に示すように、距離D1が、第1壁部52の対向面52aと第2壁部54の対向面54aとの高さ方向に沿う距離において最小であり、且つ、回路基板の厚さT1よりも長く、傾斜面52b,54b間の対向距離の最小値D2よりも短くなっている。   As shown in FIGS. 1 and 5, the portions of the first wall portion 52 and the second wall portion 54 corresponding to the formation region of the electrode 22 have only inclined surfaces 52b and 54b as opposed surfaces 52a and 54a, respectively. ing. Further, in the depth direction, the inclined surfaces 52b and 54b completely overlap each other, and the apex portion 52c of the first wall portion 52 is positioned outside the apex portion 54c of the second wall portion 54 in the depth direction. doing. That is, the vertex portion 52c of the first wall portion 52 coincides with the end portion on the outer side in the depth direction of the second wall portion 54, and the vertex portion 54c of the second wall portion 54 is in the depth direction of the first wall portion 52. It matches the end on the far side. Then, in the width direction, in the portions of the first wall portion 52 and the second wall portion 54 corresponding to the formation region of the electrode 22, the distance D <b> 1 is equal to the facing surface 52 a of the first wall portion 52 as shown in FIG. 5. The minimum distance along the height direction of the second wall portion 54 with the facing surface 54a is longer than the thickness T1 of the circuit board and shorter than the minimum value D2 of the facing distance between the inclined surfaces 52b and 54b. It has become.

一方、非電極形成領域に対応する第1壁部52及び第2壁部54の部分は、図2及び図6に示すように、対向面52a,54aとして、それぞれ傾斜面52b,54bを有するとともに、深さ方向に対して平行な平行面52d,54dも有している。また、深さ方向において、傾斜面52b,54b同士が一部のみオーバーラップするようにずれて設けられており、第1壁部52の頂点部52cが、第2壁部54の頂点部54cよりも深さ方向外側に位置している。具体的には、対向面52a,54a同士が完全にオーバーラップしており、第1壁部52では、深さ方向外側に平行面52d、奥側に傾斜面52bが位置している。第2壁部54では、深さ方向外側に傾斜面54b、奥側に平行面54dが位置している。また、第2壁部54の深さ方向外側の端部が、第1壁部52の頂点部52cよりも深さ方向において外側に位置している。そして、幅方向において、非電極形成領域に対応する第1壁部52及び第2壁部54の部分では、図6に示すように、距離D1が、第1壁部52の対向面52aと第2壁部54の対向面54aとの高さ方向に沿う距離において最小であり、且つ、回路基板の厚さT1よりも長く、傾斜面52b,54b間の対向距離の最小値D2よりも短くなっている。さらに、本実施形態では、図3,図5,図6に示すように、非電極形成領域に対応する第1壁部52及び第2壁部54の部分のほうが、電極22の形成領域に対応する第1壁部52及び第2壁部54の部分よりも、距離D1が短くなっている。   On the other hand, as shown in FIGS. 2 and 6, the portions of the first wall portion 52 and the second wall portion 54 corresponding to the non-electrode forming region have inclined surfaces 52b and 54b as opposed surfaces 52a and 54a, respectively. Also, parallel surfaces 52d and 54d parallel to the depth direction are provided. Further, in the depth direction, the inclined surfaces 52 b and 54 b are provided so as to be partially overlapped with each other, and the vertex portion 52 c of the first wall portion 52 is more than the vertex portion 54 c of the second wall portion 54. Is also located outside in the depth direction. Specifically, the opposing surfaces 52a and 54a completely overlap each other, and in the first wall portion 52, the parallel surface 52d is located on the outer side in the depth direction, and the inclined surface 52b is located on the far side. In the 2nd wall part 54, the inclined surface 54b is located in the depth direction outer side, and the parallel surface 54d is located in the back | inner side. In addition, the end portion of the second wall portion 54 on the outer side in the depth direction is located on the outer side in the depth direction with respect to the apex portion 52 c of the first wall portion 52. In the width direction, in the first wall portion 52 and the second wall portion 54 corresponding to the non-electrode forming region, the distance D1 is equal to the opposing surface 52a of the first wall portion 52 and the first wall portion 52 as shown in FIG. 2 The minimum distance along the height direction of the wall portion 54 with the facing surface 54a, which is longer than the thickness T1 of the circuit board, and shorter than the minimum value D2 of the facing distance between the inclined surfaces 52b and 54b. ing. Furthermore, in this embodiment, as shown in FIGS. 3, 5, and 6, the first wall portion 52 and the second wall portion 54 corresponding to the non-electrode formation region correspond to the formation region of the electrode 22. The distance D <b> 1 is shorter than the first wall portion 52 and the second wall portion 54.

このように本実施形態では、幅方向の全域において、第1壁部52の対向面52aに傾斜面52bが設けられ、第2壁部54の対向面54aに傾斜面54bが設けられている。そして、図1〜図3に示すように、距離D1は、非電極形成領域に対応する第1壁部52及び第2壁部54の部分で、ハウジング30の先端面30aに開口する差込空間34の高さ方向の寸法D3よりも短くなっている。また、電極22の形成領域に対応する第1壁部52及び第2壁部54の部分で寸法D3よりも長くなっている。   Thus, in the present embodiment, the inclined surface 52b is provided on the opposing surface 52a of the first wall portion 52 and the inclined surface 54b is provided on the opposing surface 54a of the second wall portion 54 in the entire width direction. As shown in FIGS. 1 to 3, the distance D <b> 1 is the insertion space that opens to the front end surface 30 a of the housing 30 at the first wall portion 52 and the second wall portion 54 corresponding to the non-electrode forming region. 34 is shorter than the dimension D3 in the height direction. Further, the first wall portion 52 and the second wall portion 54 corresponding to the formation region of the electrode 22 are longer than the dimension D3.

さらに、本実施形態では、図5及び図6に示すように、第1壁部52が、高さ方向において筐体16の内部空間を等分する中心線CL1により区画される一方の内部空間のみに位置している。また、第2壁部54は、上記中心線CL1により区画される内部空間のうち、第1壁部52と反対の内部空間のみに位置している。そして、第1壁部52の傾斜面52bの頂点部52cと、第2壁部54の傾斜面54bの頂点部54cとの高さ方向の中心が、中心線CL1と一致している。   Furthermore, in the present embodiment, as shown in FIGS. 5 and 6, only the one inner space in which the first wall portion 52 is partitioned by the center line CL1 that equally divides the inner space of the housing 16 in the height direction. Is located. The second wall portion 54 is located only in the internal space opposite to the first wall portion 52 among the internal spaces defined by the center line CL1. And the center of the height direction of the vertex part 52c of the inclined surface 52b of the 1st wall part 52 and the vertex part 54c of the inclined surface 54b of the 2nd wall part 54 corresponds with the centerline CL1.

次に、筐体16内への回路基板12の配置の手順について、図7〜図10を用いて説明する。   Next, the procedure for arranging the circuit board 12 in the housing 16 will be described with reference to FIGS.

図7及び図8に示すように、第2ケース44の内部に回路基板12を収容しつつ、固定部46により回路基板12を固定する。次いで、第2ケース44に第1ケース40を組み付ける。この組み付けでは、第1ケース40の筒部42における一方の開口端、具体的にはカードエッジコネクタ14が挿入される開口端と反対の開口端、の第2ケース44との合わせ面に、予めシール材18として、ゴム製のリング部材を配置しておく。   As shown in FIGS. 7 and 8, the circuit board 12 is fixed by the fixing portion 46 while the circuit board 12 is housed in the second case 44. Next, the first case 40 is assembled to the second case 44. In this assembling, the one end of the cylindrical portion 42 of the first case 40, more specifically, the opening end opposite to the opening end into which the card edge connector 14 is inserted, the mating surface with the second case 44 in advance. A rubber ring member is disposed as the seal material 18.

そして、壁部48のスリット50に回路基板12を挿通させつつ、シール材18が配置された開口端を第2ケース44に近づける。ここで、回路基板12の少なくとも電極22の形成領域が壁部48のスリット50を通過する際に、傾斜面52b,54bのうち、対向距離の最小値D2をなす部分に対して回路基板12の一面12a及び裏面12bが平行となるように、第1ケース40を傾けて第2ケース44に近づける。本実施形態では、第1壁部52及び第2壁部54のうち、少なくとも電極22の形成領域に対応する部分の対向面52a,52bを、回路基板12における電極22の形成領域が通過する際に、傾斜面52b,54bが回路基板12の一面12a及び裏面12bと平行となるようにすればよい。   Then, the circuit board 12 is inserted through the slit 50 of the wall 48, and the opening end where the sealing material 18 is disposed is brought close to the second case 44. Here, when at least the formation region of the electrode 22 of the circuit board 12 passes through the slit 50 of the wall 48, the portion of the inclined surface 52 b, 54 b of the circuit board 12 with respect to the portion that forms the minimum value D 2 of the opposing distance. The first case 40 is tilted and brought closer to the second case 44 so that the one surface 12a and the back surface 12b are parallel to each other. In this embodiment, when the formation region of the electrode 22 in the circuit board 12 passes through the opposing surfaces 52a and 52b of at least a portion corresponding to the formation region of the electrode 22 in the first wall portion 52 and the second wall portion 54. In addition, the inclined surfaces 52b and 54b may be parallel to the one surface 12a and the back surface 12b of the circuit board 12.

そして、回路基板12の少なくとも電極22の形成領域が壁部48を構成する第1壁部52及び第2壁部54の対向面52a,54aを通過した後、筒部42の伸延方向が、深さ方向と平行となるように第1ケース40の傾きを戻して、図9及び図10に示すように、第2ケース44に組み付ける。これにより、筐体16が構成されるとともに、筐体16の内部空間に回路基板12が収容された状態となる。この状態で、第1壁部52及び第2壁部54の平行面52d,54dは、回路基板12の一面12a及び裏面12bと略平行となる。   Then, after at least the formation region of the electrode 22 of the circuit board 12 passes through the opposing surfaces 52a and 54a of the first wall portion 52 and the second wall portion 54 constituting the wall portion 48, the extending direction of the cylindrical portion 42 is deep. The inclination of the first case 40 is returned so as to be parallel to the vertical direction, and the first case 40 is assembled to the second case 44 as shown in FIGS. Thereby, the housing 16 is configured, and the circuit board 12 is accommodated in the internal space of the housing 16. In this state, the parallel surfaces 52d and 54d of the first wall portion 52 and the second wall portion 54 are substantially parallel to the one surface 12a and the back surface 12b of the circuit board 12.

そして、ハウジング30の外周面にシール材18としてのリング部材が配置されたカードエッジコネクタ14を、その差込空間34に回路基板12の一方の端部が挿入配置されるように、筐体16の内部に挿入することで、図1〜図4に示す電子装置10を得ることができる。   Then, the card edge connector 14 in which the ring member as the sealing material 18 is arranged on the outer peripheral surface of the housing 30 is inserted into the insertion space 34 so that one end of the circuit board 12 is inserted and arranged in the casing 16. 1 to 4 can be obtained.

次に、本実施形態に係る筐体16及び電子装置10の、主たる特徴部分の効果について説明する。   Next, effects of main characteristic portions of the casing 16 and the electronic device 10 according to the present embodiment will be described.

本実施形態では、筐体16が、その内部空間を部分的に狭める壁部48を有している。したがって、回路基板12が筐体16内に配置され、カードエッジコネクタ14が筐体16に挿入される前の状態で、壁部48よりも深さ方向奥側への異物の侵入を抑制することができる。すなわち、壁部48よりも深さ方向奥側に位置する回路基板12の電子部品に、ショートなどの不具合が生じるのを抑制することができる。   In this embodiment, the housing | casing 16 has the wall part 48 which narrows the internal space partially. Therefore, intrusion of foreign matter deeper in the depth direction than the wall portion 48 in a state before the circuit board 12 is disposed in the housing 16 and the card edge connector 14 is inserted into the housing 16 is suppressed. Can do. That is, it is possible to suppress the occurrence of defects such as a short circuit in the electronic component of the circuit board 12 located on the deeper side in the depth direction than the wall portion 48.

ところで、筐体16の内部空間に回路基板12を配置する際、回路基板12のうち電極22が形成された一方の端部は、カードエッジコネクタ14の差込空間34に挿入可能なように、壁部48よりも深さ方向外側に配置される。また、回路基板12における電子部品の実装領域及び固定部46により固定される端部は、壁部48よりも深さ方向奥側に配置される。筐体16が1つの部材のみからなる場合、回路基板12を、袋形状をなす筐体16の開口端から内部空間に挿入することとなる。この場合、第1壁部52と第2壁部54との間のスリット50を介して、壁部48よりも深さ方向の奥側に配置させなければならない。したがって、電子部品が通過可能に壁部48を設けなければならず、スリット50の高さ方向の寸法が広くなり、異物抑制の効果が弱まる。これに対し、本実施形態では、筐体16が、壁部48の設けられた筒部42を有する第1ケース40と、第2ケース44との2つの部材からなる。このため、回路基板12を配置する際に、第1ケース40の筒部42における第2ケース44側の開口端から、壁部48のスリット50に対し、回路基板12を挿通させることができる。したがって、スリット50を通過するのは、電極の形成領域など、回路基板12において電子部品の実装されていない領域であり、電子部品を通過させなくとも良い。これにより、高さ方向においてスリット50を狭く設定することができ、壁部48よりも深さ方向奥側への異物侵入抑制の効果を高めることができる。   By the way, when the circuit board 12 is arranged in the internal space of the housing 16, one end of the circuit board 12 where the electrode 22 is formed can be inserted into the insertion space 34 of the card edge connector 14. It is disposed outside the wall 48 in the depth direction. Further, the mounting area of the electronic component on the circuit board 12 and the end portion fixed by the fixing portion 46 are arranged on the far side in the depth direction from the wall portion 48. When the casing 16 is composed of only one member, the circuit board 12 is inserted into the internal space from the opening end of the casing 16 having a bag shape. In this case, it has to be arranged on the far side in the depth direction from the wall portion 48 through the slit 50 between the first wall portion 52 and the second wall portion 54. Therefore, the wall part 48 must be provided so that electronic components can pass through, and the dimension in the height direction of the slit 50 becomes wide, and the effect of suppressing foreign matter is weakened. On the other hand, in the present embodiment, the casing 16 is composed of two members, a first case 40 having a cylindrical portion 42 provided with a wall portion 48 and a second case 44. For this reason, when the circuit board 12 is arranged, the circuit board 12 can be inserted into the slit 50 of the wall part 48 from the opening end of the cylindrical part 42 of the first case 40 on the second case 44 side. Therefore, the portion that passes through the slit 50 is a region on the circuit board 12 where no electronic component is mounted, such as a region where an electrode is formed. Thereby, the slit 50 can be set narrowly in the height direction, and the effect of suppressing foreign matter intrusion into the depth direction rear side than the wall portion 48 can be enhanced.

また、本実施形態では、第1壁部52と第2壁部54との対向面52a,54aの少なくとも一部に、互いに平行な位置関係をなす傾斜面52b,54bをそれぞれ設けている。そして、頂点部52c,54c間の高さ方向に沿う距離D1を、傾斜面52b,54bの対向距離D2よりも短くしている。また、距離D1を回路基板12の厚さT1よりも長くしている。したがって、第1ケース40を第2ケース44に組み付ける際に、回路基板12の一面12a及び裏面12bに対して第1壁部52及び第2壁部54の傾斜面52b,54bが平行となるようにすると、距離D1よりも長い対向距離の最小値D2の空間を回路基板12が挿通することとなる。これにより、回路基板12を筐体16に配置しやすくすることができる。本実施形態では、上記したように、第1壁部52及び第2壁部54のうち、少なくとも電極22の形成領域に対応する部分の対向面52a,52bを、回路基板12における電極22の形成領域が通過する際に、傾斜面52b,54bが回路基板12の一面12a及び裏面12bと平行となるようにする。したがって、回路基板12の電極22に壁部48が接触することで、電極22が損傷したり、剥がれた屑などにより短絡が生じるのを抑制することができる。   In the present embodiment, inclined surfaces 52b and 54b that are in parallel with each other are provided on at least a part of the opposing surfaces 52a and 54a of the first wall portion 52 and the second wall portion 54, respectively. And the distance D1 along the height direction between the vertex parts 52c and 54c is made shorter than the opposing distance D2 of the inclined surfaces 52b and 54b. Further, the distance D1 is longer than the thickness T1 of the circuit board 12. Therefore, when the first case 40 is assembled to the second case 44, the inclined surfaces 52b and 54b of the first wall portion 52 and the second wall portion 54 are parallel to the one surface 12a and the back surface 12b of the circuit board 12. Then, the circuit board 12 passes through the space of the minimum value D2 of the facing distance longer than the distance D1. Thereby, the circuit board 12 can be easily arranged in the housing 16. In the present embodiment, as described above, the opposing surfaces 52a and 52b of the first wall portion 52 and the second wall portion 54 corresponding to at least the formation region of the electrode 22 are formed on the formation of the electrode 22 on the circuit board 12. When the region passes, the inclined surfaces 52b and 54b are made parallel to the one surface 12a and the back surface 12b of the circuit board 12. Therefore, when the wall part 48 contacts the electrode 22 of the circuit board 12, it can suppress that the electrode 22 is damaged, or a short circuit arises by the debris which peeled.

また、筐体16の内部空間に回路基板12が配置され、カードエッジコネクタ14が筐体16内に挿入される前の状態では、理想的には、回路基板12の一面12a及び裏面12bが高さ方向に対して略垂直となるように配置される。したがって、壁部48よりも深さ方向奥側への異物の侵入しやすさは、頂点部52c,54c間の高さ方向に沿う距離D1に依存する。本実施形態では、距離D1が、傾斜面52b,54b間の対向距離の最小値D2よりも短いため、壁部48よりも深さ方向奥側への異物の侵入を抑制することができる。このように、本実施形態に係る筐体16及び電子装置10によれば、壁部48よりも深さ方向奥側への異物の侵入を抑制しつつ回路基板12を筐体16内に配置しやすくすることができる。   Also, in a state before the circuit board 12 is disposed in the internal space of the housing 16 and the card edge connector 14 is inserted into the housing 16, the one surface 12a and the back surface 12b of the circuit substrate 12 are ideally high. Arranged so as to be substantially perpendicular to the vertical direction. Therefore, the ease of entry of foreign matter into the depth direction rear side of the wall portion 48 depends on the distance D1 along the height direction between the vertex portions 52c and 54c. In the present embodiment, since the distance D1 is shorter than the minimum value D2 of the facing distance between the inclined surfaces 52b and 54b, it is possible to suppress the intrusion of foreign matters to the far side in the depth direction from the wall portion 48. As described above, according to the housing 16 and the electronic device 10 according to the present embodiment, the circuit board 12 is arranged in the housing 16 while suppressing the intrusion of foreign matter deeper in the depth direction than the wall portion 48. It can be made easier.

なお、本実施形態では、固定部46が、第1壁部52の傾斜面52bの頂点部52cと第2壁部54の傾斜面54bの頂点部54cとの高さ方向の中心と、回路基板12の反対の端部における厚さの中心とが一致するように、回路基板12の反対の端部を固定すべく設けられている。このため、固定部46を支点として回路基板12が高さ方向に傾き、第1壁部52の傾斜面52b又は第2壁部54の傾斜面54bに接触するとしても、第1壁部52の頂点部52c又は第2壁部54の頂点部54cのいずれかに接触することとなる。したがって、回路基板12がいずれかの傾斜面52b,54b全面に接触する、すなわち傾斜面52b,54bと平行となることはないので、壁部48よりも深さ方向奥側への異物の侵入を抑制することができる。なお、回路基板12に反りがないものとすると、本実施形態では、回路基板12が傾いた場合に、非電極形成領域に対応する部分の壁部48に接触する。具体的には、第1壁部52の平行面52dにおける深さ方向外側の端部、又は、第2壁部の傾斜面54bの頂点部54cに接触する。したがって、回路基板12が傾いても、いずれかの傾斜面52b,54b全面に接触することはない。   In the present embodiment, the fixing portion 46 includes the center in the height direction between the apex portion 52c of the inclined surface 52b of the first wall portion 52 and the apex portion 54c of the inclined surface 54b of the second wall portion 54, and the circuit board. The opposite end of the circuit board 12 is provided so as to be fixed so that the center of thickness at the opposite end of 12 coincides. For this reason, even if the circuit board 12 is inclined in the height direction with the fixed portion 46 as a fulcrum and contacts the inclined surface 52b of the first wall portion 52 or the inclined surface 54b of the second wall portion 54, the first wall portion 52 Either the apex portion 52c or the apex portion 54c of the second wall portion 54 comes into contact. Accordingly, since the circuit board 12 does not contact the entire surface of any of the inclined surfaces 52b and 54b, that is, is not parallel to the inclined surfaces 52b and 54b, the foreign substance can enter the depth direction deeper than the wall portion 48. Can be suppressed. Assuming that the circuit board 12 is not warped, in this embodiment, when the circuit board 12 is tilted, the circuit board 12 comes into contact with the wall portion 48 of the portion corresponding to the non-electrode forming region. Specifically, it contacts the end portion on the outer side in the depth direction of the parallel surface 52d of the first wall portion 52 or the apex portion 54c of the inclined surface 54b of the second wall portion. Therefore, even if the circuit board 12 is inclined, it does not come into contact with any one of the inclined surfaces 52b and 54b.

次に、本実施形態に係る筐体16及び電子装置10の、その他特徴部分の効果について説明する。   Next, effects of other characteristic portions of the housing 16 and the electronic device 10 according to the present embodiment will be described.

ここで、第1壁部52と第2壁部54の傾斜面52b,54bの深さ方向での位置関係と効果について説明する。図11では、第1壁部52の傾斜面52bと第2壁部54の傾斜面54bが、深さ方向において完全に一致している。本実施形態では、電極22の形成領域に対応する部分の壁部48が、この配置となっている。   Here, the positional relationship and the effect in the depth direction of the inclined surfaces 52b and 54b of the 1st wall part 52 and the 2nd wall part 54 are demonstrated. In FIG. 11, the inclined surface 52 b of the first wall portion 52 and the inclined surface 54 b of the second wall portion 54 completely coincide with each other in the depth direction. In this embodiment, the portion of the wall 48 corresponding to the formation region of the electrode 22 has this arrangement.

このような配置とすると、筐体16の深さ方向の長さを一定とすると、筐体16における壁部48よりも深さ方向奥側の内部空間を広くすることができる。すなわち、回路基板12において、電子部品の実装領域を広くとることができる。換言すれば、回路基板12における電子部品の実装領域を一定とすると、筐体16の深さ方向の体格を小型化することができる。   With such an arrangement, if the length of the casing 16 in the depth direction is constant, the inner space on the far side in the depth direction than the wall portion 48 in the casing 16 can be made wider. That is, in the circuit board 12, a mounting area for electronic components can be widened. In other words, if the mounting area of the electronic components on the circuit board 12 is constant, the body size in the depth direction of the housing 16 can be reduced.

図12では、第1壁部52の傾斜面52bの頂点部52cが第2壁部54の傾斜面54bの頂点部54cよりも深さ方向において外側に位置しつつ、第1壁部52の傾斜面52bと第2壁部54の傾斜面54bの一部が、深さ方向において重なっている。本実施形態では、非電極形成領域に対応する部分の壁部48が、この配置となっている。このような配置とすると、図11に示す配置に較べて、回路基板12における電子部品の実装領域を一定としたときに筐体16の深さ方向の体格が大きくなる。しかしながら、距離D1を一定としつつ、傾斜面52b,54b間の対向距離の最小値D2を長くすることができる。すなわち、異物の侵入を抑制しつつ回路基板12を筐体16に配置しやすくすることができる。換言すれば、回路基板12の電極22の形成領域が、壁部48のスリット50を通過しやすくすることができる。   In FIG. 12, the inclination of the first wall portion 52 is performed while the apex portion 52c of the inclined surface 52b of the first wall portion 52 is located on the outer side in the depth direction than the apex portion 54c of the inclined surface 54b of the second wall portion 54. A part of the inclined surface 54b of the surface 52b and the second wall portion 54 overlaps in the depth direction. In the present embodiment, the wall portion 48 corresponding to the non-electrode forming region has this arrangement. With such an arrangement, the physique in the depth direction of the housing 16 becomes larger when the mounting area of the electronic component on the circuit board 12 is fixed as compared with the arrangement shown in FIG. However, the minimum value D2 of the facing distance between the inclined surfaces 52b and 54b can be increased while keeping the distance D1 constant. That is, the circuit board 12 can be easily arranged in the housing 16 while suppressing the intrusion of foreign matter. In other words, the formation region of the electrode 22 of the circuit board 12 can easily pass through the slit 50 of the wall portion 48.

なお、図11及び図12では、傾斜面52b,54bの少なくとも一部が重なる例を示した。しかしながら、図13に示すように、第1壁部52の傾斜面52bの頂点部52cが第2壁部54の傾斜面54bの頂点部54cよりも深さ方向において外側に位置しつつ、第1壁部52の傾斜面52bと第2壁部54の傾斜面54bが、深さ方向において互いに重ならないようにずれて設けても良い。これによれば、傾斜面52b,54bの少なくとも一部が重なる構成に較べて、距離D1を一定としつつ傾斜面52b,54b間の対向距離の最小値D2をさらに長くとることができる。したがって、異物の侵入を抑制しつつ回路基板12を筐体16に対して、より配置しやすくすることができる。   In addition, in FIG.11 and FIG.12, the example in which at least one part of inclined surface 52b, 54b overlaps was shown. However, as shown in FIG. 13, the apex portion 52 c of the inclined surface 52 b of the first wall portion 52 is positioned on the outer side in the depth direction than the apex portion 54 c of the inclined surface 54 b of the second wall portion 54. The inclined surface 52b of the wall portion 52 and the inclined surface 54b of the second wall portion 54 may be provided so as not to overlap each other in the depth direction. According to this, the minimum value D2 of the facing distance between the inclined surfaces 52b and 54b can be further increased while keeping the distance D1 constant as compared with the configuration in which at least a part of the inclined surfaces 52b and 54b overlap. Therefore, the circuit board 12 can be more easily arranged with respect to the housing 16 while suppressing the entry of foreign matter.

本実施形態に示すように筐体16が壁部48を有すると、回路基板12が高さ方向において中心線CL1から傾いたとしても、壁部48により、回路基板12の傾きは制限される。すなわち、壁部48は、回路基板12の傾きを制限する機能を有する。例えば図14に示すように、壁部48の距離D1が、ハウジング30の先端面30aに開口する差込空間34の高さ方向の寸法D3よりも長い場合、回路基板12の一方の端部がハウジング30の先端面30aに接触し、差込空間34に挿入しにくいことも考えられる。これに対し、本実施形態では、幅方向において、壁部48の少なくとも一部における距離D1が寸法D3よりも短くなっている。具体的には、非電極形成領域である回路基板12の幅方向両端に対応する壁部48の部分において、距離D1が寸法D3よりも短くなっている。したがって、カードエッジコネクタ14を筐体16の内部空間に挿入しつつ、ハウジング30の差込空間34に回路基板12の一方の端部を挿入する際に、差込空間34に回路基板12を挿入しやすくすることができる。   When the housing 16 has the wall portion 48 as shown in the present embodiment, even if the circuit board 12 is inclined from the center line CL1 in the height direction, the inclination of the circuit board 12 is limited by the wall portion 48. That is, the wall 48 has a function of limiting the inclination of the circuit board 12. For example, as shown in FIG. 14, when the distance D <b> 1 of the wall 48 is longer than the height dimension D <b> 3 of the insertion space 34 that opens to the front end surface 30 a of the housing 30, one end of the circuit board 12 is It is also conceivable that the tip 30 a contacts the housing 30 and is difficult to insert into the insertion space 34. On the other hand, in this embodiment, the distance D1 in at least a part of the wall portion 48 is shorter than the dimension D3 in the width direction. Specifically, the distance D1 is shorter than the dimension D3 in the portion of the wall portion 48 corresponding to both ends in the width direction of the circuit board 12 which is the non-electrode forming region. Therefore, when one end of the circuit board 12 is inserted into the insertion space 34 of the housing 30 while the card edge connector 14 is inserted into the internal space of the housing 16, the circuit board 12 is inserted into the insertion space 34. Can be easier.

特に本実施形態では、幅方向において、第1壁部52及び第2壁部54が、回路基板12と対向する部分の全域に傾斜面52b,54bをそれぞれ有している。そして、回路基板12の非電極形成領域に対応する部分が寸法D3よりも距離D1の小さい部分とされ、電極22の形成領域に対応する部分は寸法D3よりも距離D1の大きい部分となっている。このように、距離D1に差を設けると、理想的には距離D1の最も短い部分に回路基板12が接触することとなる。したがって、ハウジング30の差込空間34に回路基板12を挿入しやすくしつつ、壁部48に電極22が接触するのを効果的に抑制することができる。   In particular, in the present embodiment, in the width direction, the first wall portion 52 and the second wall portion 54 have inclined surfaces 52b and 54b over the entire area facing the circuit board 12, respectively. A portion corresponding to the non-electrode forming region of the circuit board 12 is a portion having a distance D1 smaller than the dimension D3, and a portion corresponding to the forming region of the electrode 22 is a portion having a distance D1 larger than the dimension D3. . Thus, if a difference is provided in the distance D1, the circuit board 12 will ideally contact the shortest part of the distance D1. Therefore, it is possible to effectively prevent the electrode 22 from contacting the wall portion 48 while making it easy to insert the circuit board 12 into the insertion space 34 of the housing 30.

さらに本実施形態では、壁部48において、寸法D3よりも距離D1の小さい部分おける第1壁部52の傾斜面52b及び第2壁部54の傾斜面54bの少なくとも一方が、寸法D3よりも距離D1の大きい部分における第1壁部52の傾斜面52b及び第2壁部54の傾斜面54bよりも、深さ方向奥側に設けられている。具体的には、非電極形成領域に対応する壁部48の部分の傾斜面52b,54bそれぞれの一部が、電極22の形成領域に対応する壁部48の部分の傾斜面52b,54bよりも深さ方向奥側に設けられている。このため、回路基板12が壁部48のスリット50を挿通する際に、非電極形成領域に対応する部分の傾斜面52b,54bにより回路基板12が誘導される。したがって、壁部48に電極22が接触するのを、さらに効果的に抑制することができる。   Further, in the present embodiment, in the wall portion 48, at least one of the inclined surface 52b of the first wall portion 52 and the inclined surface 54b of the second wall portion 54 in a portion having a distance D1 smaller than the dimension D3 is a distance greater than the dimension D3. It is provided in the depth direction back side rather than the inclined surface 52b of the 1st wall part 52 and the inclined surface 54b of the 2nd wall part 54 in a part with large D1. Specifically, each of the inclined surfaces 52b and 54b in the portion of the wall portion 48 corresponding to the non-electrode forming region is more than the inclined surfaces 52b and 54b in the portion of the wall portion 48 corresponding to the forming region of the electrode 22. It is provided on the back side in the depth direction. For this reason, when the circuit board 12 passes through the slit 50 of the wall portion 48, the circuit board 12 is guided by the inclined surfaces 52b and 54b of the portion corresponding to the non-electrode forming region. Therefore, the electrode 22 can be more effectively suppressed from contacting the wall portion 48.

ところで、図15に示すように、筐体16が、回路基板12の反対の端部を固定する固定部46以外に、回路基板12の両端部間の部分を固定する固定部56を有する場合、筐体16に回路基板12を配置した状態で、深さ方向において複数設けられた固定部46,56により、回路基板12の高さ方向の位置が決定される。したがって、回路基板12(絶縁基材20)の厚さばらつき、固定部56の座面高さのばらつきなどにより、回路基板12の厚さの中心線CL2が、上記した中心線CL1に対してずれる虞がある。このようにずれが生じると、回路基板12の一面12a上に位置する端子32と裏面12b上に位置する端子32とでばね変形の量に差が生じる。すなわち、端子32と電極22との電気的な接続状態にばらつきが生じる。なお、中心線CL1は、カードエッジコネクタ14を筐体16に組み付けた状態で、ハウジング30の差込空間34を等分する高さ方向の中心線(図示略)とほぼ一致する。これに対し、本実施形態では、筐体16が、回路基板12の反対の端部を固定する固定部46のみを有しており、この固定部46と回路基板12の両面側に位置する端子32とで、回路基板12が保持されるようになっている。このため、カードエッジコネクタ14が挿入される前の状態で、回路基板12は、固定部46により反対の端部が固定されるとともに、壁部48により傾きが制限されるものの、高さ方向の位置が完全には決定されていない。したがって、図16に示すように、カードエッジコネクタ14を筐体16に挿入する初期状態で、中心線CL1,CL2がずれていたとしても、回路基板12の両面に位置する端子32のばね変形による反力によって、図17に示すように、中心線CL2を中心線CL1にほぼ一致させることができる。すなわち、中心線CL2を、ハウジング30の差込空間34を等分する図示しない中心線とほぼ一致させることができる。換言すれば、回路基板12の一面12a上に位置する端子32と裏面12b上に位置する端子32とでばね変形の量をほぼ等しくし、端子32と電極22との電気的な接続状態にばらつきが生じるのを抑制することができる。本実施形態では、第1壁部52が、高さ方向において筐体16の内部空間を等分する中心線CL1により区画される一方の内部空間のみに位置している。また、第2壁部54は、上記中心線CL1により区画される内部空間のうち、第1壁部52と反対の内部空間のみに位置している。そして、第1壁部52の傾斜面52bの頂点部52cと、第2壁部54の傾斜面54bの頂点部54cとの高さ方向の中心が、中心線CL1と一致している。したがって、中心線CL2を中心線CL1にほぼ一致させることができる。   By the way, as shown in FIG. 15, in the case where the housing 16 has a fixing portion 56 that fixes a portion between both ends of the circuit board 12 in addition to the fixing portion 46 that fixes the opposite end of the circuit board 12. With the circuit board 12 disposed in the housing 16, the position in the height direction of the circuit board 12 is determined by a plurality of fixing portions 46 and 56 provided in the depth direction. Therefore, the center line CL2 of the thickness of the circuit board 12 is deviated from the center line CL1 due to variations in the thickness of the circuit board 12 (insulating base material 20), variations in the seating surface height of the fixing portion 56, and the like. There is a fear. When such a deviation occurs, a difference occurs in the amount of spring deformation between the terminal 32 located on the one surface 12a of the circuit board 12 and the terminal 32 located on the back surface 12b. That is, the electrical connection state between the terminal 32 and the electrode 22 varies. The center line CL1 substantially coincides with a center line (not shown) in the height direction that equally divides the insertion space 34 of the housing 30 in a state where the card edge connector 14 is assembled to the housing 16. On the other hand, in the present embodiment, the housing 16 has only a fixing portion 46 that fixes the opposite end of the circuit board 12, and terminals that are located on both sides of the fixing portion 46 and the circuit board 12. 32, the circuit board 12 is held. Therefore, in the state before the card edge connector 14 is inserted, the opposite end of the circuit board 12 is fixed by the fixing part 46 and the inclination of the circuit board 12 is limited by the wall part 48, The position is not completely determined. Therefore, as shown in FIG. 16, even if the center lines CL1 and CL2 are shifted in the initial state of inserting the card edge connector 14 into the housing 16, it is caused by the spring deformation of the terminals 32 located on both surfaces of the circuit board 12. With the reaction force, as shown in FIG. 17, the center line CL2 can be made substantially coincident with the center line CL1. That is, the center line CL2 can be made to substantially coincide with a center line (not shown) that equally divides the insertion space 34 of the housing 30. In other words, the amount of spring deformation is made substantially equal between the terminal 32 located on the one surface 12a of the circuit board 12 and the terminal 32 located on the back surface 12b, and the electrical connection state between the terminal 32 and the electrode 22 varies. Can be suppressed. In this embodiment, the 1st wall part 52 is located only in one internal space divided by the centerline CL1 which equally divides the internal space of the housing | casing 16 in a height direction. The second wall portion 54 is located only in the internal space opposite to the first wall portion 52 among the internal spaces defined by the center line CL1. And the center of the height direction of the vertex part 52c of the inclined surface 52b of the 1st wall part 52 and the vertex part 54c of the inclined surface 54b of the 2nd wall part 54 corresponds with the centerline CL1. Therefore, it is possible to make the center line CL2 substantially coincide with the center line CL1.

以上、本発明の好ましい実施形態について説明したが、本発明は上述した実施形態になんら制限されることなく、本発明の主旨を逸脱しない範囲において、種々変形して実施することが可能である。   The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

本実施形態では、幅方向において、非電極形成領域である回路基板12の両端に対応する壁部48の部分を、距離D1が差込空間34の寸法D3よりも短い部分とする例を示した。しかしながら、例えば図18に示すように、回路基板12の幅方向中央部分に電極22を設けずに、上記した幅方向両端に対応する壁部48の部分と、幅方向中央に対応する壁部48の部分を、距離D1が寸法D3よりも短い部分としても良い。さらには、図19に示すように、幅方向全域において、距離D1が差込空間34の寸法D3よりも短い部分となるように、壁部48を設けても良い。   In the present embodiment, an example in which the portions of the wall portions 48 corresponding to both ends of the circuit board 12 that is the non-electrode forming region in the width direction are portions where the distance D1 is shorter than the dimension D3 of the insertion space 34 is shown. . However, for example, as shown in FIG. 18, without providing the electrode 22 at the center portion in the width direction of the circuit board 12, the portion of the wall portion 48 corresponding to both ends in the width direction and the wall portion 48 corresponding to the center in the width direction. This portion may be a portion where the distance D1 is shorter than the dimension D3. Furthermore, as shown in FIG. 19, the wall portion 48 may be provided so that the distance D <b> 1 is a portion shorter than the dimension D <b> 3 of the insertion space 34 in the entire width direction.

本実施形態では、筐体16が、筒部42を有する第1ケース40と、袋状の第2ケース44とにより構成される例を示した。しかしながら、第2ケース44は袋状に限定されるものではない。例えば図20に示す例では、上記実施形態で示した第2ケース44を例えば中心線CL1で分割し、中心線CL1よりも第1壁部52側の部分を、筒部42に連結させて第1ケース40の一部とし、第2壁部54側の部分を第2ケース44としている。このような構成の筐体16を採用しても、壁部48のスリット50に対し、筒部42における筐体16の開口端をなす開口端とは反対の開口端側から回路基板12を挿通させることができる。また、第1ケース40及びハウジング30に介在されたシール材18が、第1ケース40及び第2ケース44に介在されたシール材18と連結されないようになっている。このように、シール材18の分岐部(三叉部)が存在しないと、分岐部が存在するような筐体16の構造を有するものに較べて、気密性を向上することができる。なお、図20に示す構成においては、第1ケース40及び第2ケース44に介在されるシール材18として、シリコン系の湿気硬化型接着材を採用している。   In the present embodiment, an example in which the housing 16 is configured by the first case 40 having the cylindrical portion 42 and the bag-like second case 44 has been described. However, the second case 44 is not limited to a bag shape. For example, in the example shown in FIG. 20, the second case 44 shown in the above embodiment is divided by, for example, the center line CL1, and the portion closer to the first wall portion 52 than the center line CL1 is connected to the cylindrical portion 42. A part of one case 40 is used, and a part on the second wall 54 side is a second case 44. Even when the housing 16 having such a configuration is adopted, the circuit board 12 is inserted into the slit 50 of the wall portion 48 from the opening end side opposite to the opening end forming the opening end of the housing 16 in the cylindrical portion 42. Can be made. Further, the sealing material 18 interposed between the first case 40 and the housing 30 is not connected to the sealing material 18 interposed between the first case 40 and the second case 44. As described above, when the branch portion (three-forked portion) of the sealing material 18 does not exist, airtightness can be improved as compared with the case 16 having the structure of the casing 16 in which the branch portion exists. In the configuration shown in FIG. 20, a silicon-based moisture-curing adhesive is used as the sealing material 18 interposed between the first case 40 and the second case 44.

本実施形態では、回路基板12が両面12a,12bに電極22を有し、両面側に配置された端子32により、回路基板12が保持される例を示した。しかしながら、回路基板12の一方の面のみに電極22が設けられ、電極22の形成された面側のみに端子32が配置される構成を採用することもできる。例えば回路基板12を固定するために、回路基板12の他方の面側を、ハウジング30に一体的に設けた支持部にて支持するようにしても良い。   In this embodiment, the circuit board 12 has the electrodes 22 on both surfaces 12a and 12b, and the circuit board 12 is held by the terminals 32 arranged on both surfaces. However, it is also possible to employ a configuration in which the electrode 22 is provided only on one surface of the circuit board 12 and the terminal 32 is disposed only on the surface side on which the electrode 22 is formed. For example, in order to fix the circuit board 12, the other surface side of the circuit board 12 may be supported by a support portion provided integrally with the housing 30.

本実施形態では、壁部48が、幅方向の一部の対向面52a,54aに傾斜面52b,54bと平行面52d,54dを有し、残りの部分に傾斜面52b,54bのみを有する例を示した。しかしながら、壁部48が、幅方向全域において、対向面52a,54aとして傾斜面52b,52bのみを有する構成としても良い。また、幅方向全域において、対向面52a,54aとして、傾斜面52b,54bと平行面52d,54dを有する構成としても良い。さらには、壁部48における幅方向の一部のみに傾斜部を有し、残りの部分に傾斜部を有さず、平行部のみを有する構成としても良い。例えば、本実施形態に示した構成において、非電極形成領域に対応する壁部48の部分を、少なくとも傾斜面52b,54bを有する構造とし、電極22の形成領域に対応する壁部48の部分を、平行面52d,54dのみを有する構造としても良い。   In the present embodiment, the wall portion 48 has inclined surfaces 52b, 54b and parallel surfaces 52d, 54d on a part of the facing surfaces 52a, 54a in the width direction, and only the inclined surfaces 52b, 54b in the remaining portions. showed that. However, the wall portion 48 may have only the inclined surfaces 52b and 52b as the opposed surfaces 52a and 54a in the entire width direction. Moreover, it is good also as a structure which has the inclined surfaces 52b and 54b and the parallel surfaces 52d and 54d as opposing surfaces 52a and 54a in the whole width direction. Furthermore, it is good also as a structure which has an inclination part only in the part of the width direction in the wall part 48, does not have an inclination part in the remaining part, and has only a parallel part. For example, in the configuration shown in the present embodiment, the portion of the wall portion 48 corresponding to the non-electrode forming region has a structure having at least inclined surfaces 52b and 54b, and the portion of the wall portion 48 corresponding to the forming region of the electrode 22 is set. A structure having only parallel surfaces 52d and 54d may be used.

本実施形態では、第1壁部52の傾斜面52b及び第2壁部54の傾斜面54bが、それぞれ深さ方向に対する高さ方向の変化量が一定の傾斜を有し、傾斜面52b,54b同士が平行とされる例を示した。しかしながら、傾斜面52bと傾斜面54bとで、深さ方向に対する高さ方向の変化量(すなわち傾き)が異なる構成を採用することもできる。例えば、図5において、傾斜面52bの傾きを大きくすることで、深さ方向奥側ほど高さ方向におけるスリット50の間隔が広くなるようにしても良い。   In the present embodiment, the inclined surface 52b of the first wall portion 52 and the inclined surface 54b of the second wall portion 54 each have an inclination in which the amount of change in the height direction with respect to the depth direction is constant, and the inclined surfaces 52b and 54b. An example is shown in which the two are parallel to each other. However, the inclined surface 52b and the inclined surface 54b may be configured so that the amount of change in the height direction (that is, the inclination) differs from the depth direction. For example, in FIG. 5, by increasing the inclination of the inclined surface 52b, the distance between the slits 50 in the height direction may be increased toward the back in the depth direction.

また、傾斜面52b,54bとして、深さ方向に対する高さ方向の変化量が一定でない傾斜を有する構成を採用することもできる。例えば、深さ方向奥側に近づくほど、変化量が大きくなる傾斜としても良い。   Further, as the inclined surfaces 52b and 54b, it is possible to adopt a configuration having an inclination in which the amount of change in the height direction with respect to the depth direction is not constant. For example, it is good also as the inclination from which a variation | change_quantity becomes large, so that it approaches the depth direction back side.

10・・・電子装置、12・・・回路基板、14・・・カードエッジコネクタ、16・・・筐体、22・・・電極、30・・・ハウジング、32・・・端子、34・・・差込空間、40・・・第1ケース、42・・・筒部、44・・・第2ケース、46・・・固定部、48・・・壁部、52・・・第1壁部、52a・・・対向面、52b・・・傾斜面、52c・・・頂点部(深さ方向外側の端部)、54・・・第2壁部、54a・・・対向面、54b・・・傾斜面、54c・・・頂点部(深さ方向内側の端部) DESCRIPTION OF SYMBOLS 10 ... Electronic device, 12 ... Circuit board, 14 ... Card edge connector, 16 ... Case, 22 ... Electrode, 30 ... Housing, 32 ... Terminal, 34 ... -Insertion space, 40 ... first case, 42 ... cylindrical part, 44 ... second case, 46 ... fixing part, 48 ... wall part, 52 ... first wall part , 52a ... opposing surface, 52b ... inclined surface, 52c ... apex (end in the depth direction), 54 ... second wall, 54a ... opposing surface, 54b ... -Inclined surface, 54c ... apex (end in the depth direction)

Claims (9)

回路基板の一方の端部が挿入される差込空間を有するハウジングと、該ハウジングに保持され、前記差込空間内に突出する端子とを備えるカードエッジコネクタの差込空間に、前記回路基板の一方の端部が挿入配置されて前記端子に前記回路基板の電極が接触された状態で、前記差込空間を含むカードエッジコネクタの少なくとも一部及び前記回路基板を、内部空間に収容する袋形状の筐体であって、
前記ハウジングの外周面を覆うように両端が開口する筒状に形成された筒部を有する第1ケースと、該第1ケースに組み付けられて、前記第1ケースとともに前記内部空間を構成する第2ケースと、を有し、
前記第1ケースの筒部は、前記内部空間の深さ方向において、前記ハウジングにおける差込空間の開口する先端面と、前記回路基板における電子部品の実装領域との間に位置するように内壁から突出して設けられ、前記内部空間を部分的に狭める壁部を有し、
前記壁部は、前記深さ方向と直交する高さ方向において、前記回路基板の一面と対向する第1壁部と、前記回路基板における一面と反対の裏面と対向する第2壁部を有し、
前記第1壁部における回路基板との対向面は、深さ方向外側の端部が深さ方向奥側の端部よりも高さ方向において前記第2壁部に近い傾斜面を有し、
前記第2壁部における回路基板との対向面は、深さ方向奥側の端部が深さ方向外側の端部よりも高さ方向において前記第1壁部に近い傾斜面を有し、
前記第1壁部の傾斜面と前記第2壁部の傾斜面とは、前記第1壁部の傾斜面における深さ方向外側の端部と、前記第2壁部の傾斜面における深さ方向奥側の端部との高さ方向に沿う距離D1が、前記第1壁部の対向面と前記第2壁部の対向面との高さ方向に沿う距離において最小であり、且つ、前記距離D1は、前記回路基板の厚さT1よりも長く、前記傾斜面に直交する方向において前記第1壁部の傾斜面と前記第2壁部の傾斜面との対向距離の最小値D2よりも短くなるように設けられ、
前記高さ方向において、前記第1壁部の傾斜面における深さ方向外側の端部と前記第2壁部の傾斜面における深さ方向奥側の端部との中心と、前記回路基板における一方の端部と反対の端部における厚さの中心とが一致するように、前記回路基板の反対の端部を固定する固定部を有することを特徴とする筐体。
A card edge connector having a housing having an insertion space into which one end of the circuit board is inserted, and a terminal held in the housing and protruding into the insertion space. A bag shape in which at least a part of the card edge connector including the insertion space and the circuit board are accommodated in the internal space in a state where one end is inserted and arranged and the electrode of the circuit board is in contact with the terminal. A housing of
A first case having a cylindrical portion that is formed in a cylindrical shape that opens at both ends so as to cover the outer peripheral surface of the housing, and a second case that is assembled to the first case and forms the internal space together with the first case. A case, and
The cylindrical portion of the first case extends from the inner wall so as to be positioned between the leading end surface of the insertion space in the housing and the mounting area of the electronic component on the circuit board in the depth direction of the internal space. Projectingly provided, having a wall portion that partially narrows the internal space,
The wall portion includes a first wall portion facing one surface of the circuit board and a second wall portion facing a back surface opposite to the one surface of the circuit board in a height direction perpendicular to the depth direction. ,
The surface facing the circuit board in the first wall portion has an inclined surface that is closer to the second wall portion in the height direction than the end portion in the depth direction on the outer side in the depth direction,
The surface facing the circuit board in the second wall portion has an inclined surface that is closer to the first wall portion in the height direction than the end portion in the depth direction outside the end portion in the depth direction,
The inclined surface of the first wall portion and the inclined surface of the second wall portion are the depth direction outer end of the inclined surface of the first wall portion and the depth direction of the inclined surface of the second wall portion. The distance D1 along the height direction with the end on the back side is the minimum in the distance along the height direction between the facing surface of the first wall portion and the facing surface of the second wall portion, and the distance D1 is longer than the thickness T1 of the circuit board and shorter than the minimum value D2 of the facing distance between the inclined surface of the first wall portion and the inclined surface of the second wall portion in the direction orthogonal to the inclined surface. Provided,
In the height direction, the center of the end portion on the outer side in the depth direction on the inclined surface of the first wall portion and the end portion on the rear side in the depth direction on the inclined surface of the second wall portion, and one of the circuit board A housing having a fixing portion for fixing the opposite end portion of the circuit board so that the center of the thickness at the opposite end portion coincides with the center of the thickness.
前記第1壁部の傾斜面と前記第2壁部の傾斜面とは、前記第1壁部の傾斜面における深さ方向外側の端部が前記第2壁部の傾斜面における深さ方向奥側の端部よりも深さ方向において外側に位置しつつ、前記深さ方向において互いに重ならないようにずれて設けられていることを特徴とする請求項1に記載の筐体。   The inclined surface of the first wall portion and the inclined surface of the second wall portion are such that the outer end in the depth direction of the inclined surface of the first wall portion is the depth direction depth of the inclined surface of the second wall portion. The housing according to claim 1, wherein the casing is provided so as to be located outside in the depth direction with respect to the end portion on the side, and so as not to overlap each other in the depth direction. 前記第1壁部の傾斜面と前記第2壁部の傾斜面とは、前記第1壁部の傾斜面における深さ方向外側の端部が前記第2壁部の傾斜面における深さ方向奥側の端部よりも深さ方向において外側に位置しつつ、前記深さ方向において少なくとも一部が重なっていることを特徴とする請求項1に記載の筐体。   The inclined surface of the first wall portion and the inclined surface of the second wall portion are such that the outer end in the depth direction of the inclined surface of the first wall portion is the depth direction depth of the inclined surface of the second wall portion. The casing according to claim 1, wherein at least a part of the casing overlaps in the depth direction while being positioned on the outer side in the depth direction than the end portion on the side. 前記第1壁部の傾斜面と前記第2壁部の傾斜面とは、前記深さ方向において完全に一致していることを特徴とする請求項3に記載の筐体。   The casing according to claim 3, wherein the inclined surface of the first wall portion and the inclined surface of the second wall portion completely coincide with each other in the depth direction. 前記深さ方向及び前記高さ方向の両方に直交する幅方向において、前記壁部の少なくとも一部における距離D1が、前記ハウジングの先端面に開口する差込空間の高さ方向の寸法D3よりも短いことを特徴とする請求項1〜4いずれか1項に記載の筐体。   In the width direction orthogonal to both the depth direction and the height direction, the distance D1 in at least a part of the wall portion is larger than the height direction dimension D3 of the insertion space opened in the front end surface of the housing. The casing according to any one of claims 1 to 4, wherein the casing is short. 前記幅方向において、前記第1壁部及び前記第2壁部は、前記回路基板と対向する部分の全域に傾斜面を有しており、前記回路基板の電極形成領域に対応する部分を除く部分の少なくとも一部が寸法D3よりも距離D1の小さい部分とされ、前記電極形成領域に対応する部分は寸法D3よりも距離D1の大きい部分とされていることを特徴とする請求項5に記載の筐体。   In the width direction, the first wall portion and the second wall portion have an inclined surface over the entire portion facing the circuit board, and a portion excluding a portion corresponding to an electrode formation region of the circuit board 6. At least a part of the portion is a portion having a distance D1 smaller than the dimension D3, and a portion corresponding to the electrode formation region is a portion having a distance D1 larger than the dimension D3. Enclosure. 前記壁部において、寸法D3よりも距離D1の小さい部分における前記第1壁部及び前記第2壁部の少なくとも一方の傾斜面が、寸法D3よりも距離D1の大きい部分における前記第1壁部の傾斜面及び前記第2壁部の傾斜面よりも深さ方向奥側に設けられていることを特徴とする請求項6に記載の筐体。   In the wall portion, at least one inclined surface of the first wall portion and the second wall portion in the portion having the distance D1 smaller than the dimension D3 is the height of the first wall portion in the portion having the distance D1 larger than the dimension D3. The housing according to claim 6, wherein the housing is provided on a deeper side in the depth direction than the inclined surface and the inclined surface of the second wall portion. 前記回路基板は、前記電極を一面及び裏面の両方に有し、
前記カードエッジコネクタは、前記端子として、前記ハウジングにおける回路基板の一面と対向する壁面から突出する端子と、前記ハウジングにおける回路基板の裏面と対向する壁面から突出する端子と、を有し、これら端子と前記固定部とにより前記回路基板が保持されるようになっており、
前記第1壁部は、前記高さ方向において内部空間を等分する中心により区画される一方の内部空間のみに位置し、
前記第2壁部は、前記高さ方向において内部空間の中心により区画される内部空間のうち、前記第1壁部の対向面と反対の内部空間のみに位置し、
前記第1壁部の傾斜面における深さ方向外側の端部と、前記第2壁部の傾斜面における深さ方向奥側の端部との中心が、前記高さ方向において筐体の内部空間を等分する中心と一致することを特徴とする請求項1〜7いずれか1項に記載の筐体。
The circuit board has the electrodes on one side and the back side,
The card edge connector includes, as the terminals, a terminal protruding from a wall surface facing one surface of the circuit board in the housing, and a terminal protruding from a wall surface facing the back surface of the circuit board in the housing, and these terminals And the circuit board is held by the fixing portion,
The first wall is located only in one internal space defined by a center that equally divides the internal space in the height direction,
The second wall portion is located only in the internal space opposite to the facing surface of the first wall portion among the internal spaces defined by the center of the internal space in the height direction,
The center of the depth direction outer end portion of the inclined surface of the first wall portion and the depth direction rear end portion of the inclined surface of the second wall portion is the internal space of the housing in the height direction. The casing according to claim 1, wherein the casing coincides with a center that equally divides.
前記第2ケースは、一端が開口する袋形状をなし、前記固定部が設けられており、
前記第2ケースの開口端部と、前記第1ケースの筒部における一方の端部とが接続されていることを特徴とする請求項1〜8いずれか1項に記載の筐体。
The second case has a bag shape with one end opened, and the fixing portion is provided.
The housing according to any one of claims 1 to 8, wherein an opening end portion of the second case is connected to one end portion of the cylindrical portion of the first case.
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