JP2013109927A - Battery wiring module, method of manufacturing the same, and power supply device having battery wiring module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a battery wiring module, a method of manufacturing the same, and a power supply device having the battery wiring module, capable of simplifying a manufacturing step.SOLUTION: A battery wiring module 10 connects a plurality of battery cells 2 in series, and detects voltages between terminals of the respective battery cells 2. The battery wiring module 10 has: a plurality of connection members 30 connecting between positive electrode terminals 3 and negative electrode terminals 4 of the battery cells 2; and a wiring substrate 20 on which detection wires connected to the respective connection members 30 are formed. Each connection member 30 has a first connector connecting between the positive electrode terminal 3 and the negative electrode terminal 4, and a second connector to which the detection wires are connected. The wiring substrate 20 has a fixing region to which the second connectors are fixed. Each detection wire has a lead wire and a land part. The second connectors and the wiring substrate 20 are bonded with each other in the fixing region, and the second connectors and the land parts are connected by solder.

Description

  The present invention relates to a battery wiring module for connecting a plurality of battery cells in series and detecting a voltage between terminals of each battery cell, a method for manufacturing the battery wiring module, and a power supply device including the battery wiring module.

  A power supply device including a plurality of battery cells is used as a secondary battery for vehicles and a power storage device for home use. As this type of power supply device, for example, a technique described in Patent Document 1 is known.

  The power supply device described in Patent Literature 1 includes a plurality of battery cells and a battery wiring module that connects the battery cells in series. The battery wiring module includes a plurality of connecting members that connect the positive electrode terminal and the negative electrode terminal of the adjacent power supply cell, and an electric wire (wiring). Each electric wire is connected to a corresponding connecting member. These electric wires are provided in order to acquire the voltage between terminals of each battery cell. This is due to the following reason.

  Since the individual battery cells have a variation in performance, the voltage between the terminals varies during discharging or charging. If the battery cell terminal voltage exceeds the specified range, the battery cell will deteriorate, so monitor the terminal voltage for each battery cell, and make sure that each battery cell terminal voltage is within the specified range. Be controlled.

JP 2011-49047 A

  By the way, in recent years, the number of battery cells connected in series has increased due to the increase in voltage of the power supply device, and the number of electric wires has increased accordingly. For this reason, the work time which connects each electric wire was long. Under such circumstances, it is required to improve the efficiency of the manufacturing process of the battery wiring module.

  The present invention has been made to solve such problems, and its object is to provide a battery wiring module capable of simplifying the manufacturing process, a method for manufacturing the battery wiring module, and a power supply including the battery wiring module. To provide an apparatus.

  (1) The invention according to claim 1 is a battery wiring module in which a plurality of battery cells are connected in series and a voltage between terminals of each battery cell is detected, and a positive electrode terminal and a negative electrode terminal of the adjacent battery cells are connected. A plurality of connecting members connected to each other and a wiring board on which wiring connected to each connecting member is formed, and the connecting member connects the positive electrode terminal and the negative electrode terminal of the adjacent battery cells. A first connection portion to which the wiring is connected, and a second connection portion to which the wiring is connected. The wiring board has a fixed region to which the second connection portion is fixed. A land portion provided in the fixed region so as to correspond to the second connection portion of the connection member, the second connection portion and the wiring board are bonded to each other in the fixed region, and the second The connection part and the land part are soldered It is the gist of.

  According to this invention, since the land portion of the wiring is provided in the fixed region to which the second connecting portion of the connecting member adheres, the connecting member is disposed in the fixed region of the wiring board and the both are fixed, The land portion and the connection member can be soldered to each other. That is, in the conventional structure, in order to connect each electric wire as a wiring to the connecting member, it is necessary to work around the electric wire and fix the electric wire so that it does not move. However, these operations are omitted. can do. For this reason, the manufacturing process of a battery wiring module can be simplified.

  (2) The invention described in claim 2 is the battery wiring module according to claim 1, wherein the land portion is formed on a surface of the wiring board opposite to a surface on which the second connection portion is fixed. The land portion is provided with a land hole penetrating the wiring board, and the land portion and the second connection portion are solder-connected through the land hole.

  When the land portion and the second connection portion are solder-connected on the same side as the surface to which the second connection portion is fixed in the wiring board, the following troubles occur. In other words, the connection member is placed at a predetermined position, the wiring board is placed on the connection member and bonded and fixed to each other, and then the land portion and the second connection portion are connected by soldering. It is necessary to reverse the assembly in which the member and the wiring board are bonded and fixed.

  On the other hand, according to the present invention, the connecting members are arranged at predetermined positions, the wiring boards are placed on these connecting members and bonded and fixed to each other, and then this state is maintained to connect the land portion and the second connecting portion. Solder connection is possible. That is, with this configuration, the manufacturing process of the battery wiring module can be simplified.

  (3) The invention according to claim 3 is the battery wiring module according to claim 2, wherein the second connection portion has the second connection portion corresponding to the land hole provided in the land portion. The gist is that a connection through-hole penetrating the part is provided.

  When the connection member does not have a connection through hole, the solder connection state between the land portion and the second connection portion cannot be accurately confirmed. That is, since the land hole is filled with the solder by the solder connection, it is difficult to visually confirm whether or not the land hole is sufficiently expanded.

  In the present invention, a connection through hole is formed at a location corresponding to the land hole in the second connection portion. For this reason, since solder can be visually observed through this connection through-hole, the quality of solder connection can be determined by confirming the spread of solder.

  (4) The invention according to claim 4 is the battery wiring module according to claim 2, wherein the second connection portion extends from a position corresponding to the land portion to an edge of the second connection portion. The gist is that a ventilation groove is formed.

  The land portion of the wiring board and the second connection portion of the connection member are solder-connected through the land hole. By the way, during solder connection, flux may accumulate between the wiring board and the second connection part through the land hole, and solder may not sufficiently flow between the land part and the second connection part.

  In the present invention, since there is a ventilation groove in the second connection portion corresponding to the land portion, the flux gas generated at the time of solder connection can be discharged to the outside through this ventilation groove. This prevents the flux gas from accumulating in the internal space between the wiring board and the second connection portion, thereby suppressing the occurrence of an event that the solder does not sufficiently flow between the land portion and the second connection portion. can do.

  (5) The invention according to claim 5 is the battery wiring module according to any one of claims 2 to 4, wherein the wiring board includes an insulating layer and the wiring formed on both surfaces of the insulating layer. A first cover lay covering one surface of the conductive layer, and a second cover lay covering the other surface of the conductive layer, wherein the land portions are formed on both surfaces of the insulating layer and the insulating layer is formed. The gist is that the lands formed on both sides of the layer are connected to each other through the land holes.

  Since the land part is formed over both surfaces of the wiring board, the solder connection area can be increased as compared with the case where the land part is formed only on one side. Thereby, the intensity | strength of the solder connection part of a land part and a 2nd connection part can be enlarged.

(6) The invention according to claim 6 is the battery wiring module according to any one of claims 1 to 5, wherein the conducting wire passes through the fixed region of the wiring board.
The conductive wire passes through a fixed region of the wiring board, that is, a region where the second connection portion is bonded to the wiring substrate. According to this configuration, compared to a configuration in which no conducting wire is arranged in the fixed region of the wiring board, an arrangement area where the conducting wire can be arranged can be increased, and thus the wiring board can be made small as a whole.

  (7) The invention according to claim 7 is the battery wiring module according to any one of claims 1 to 6, wherein the fixing region of the wiring board and the second connecting portion of the connecting member are bonded. The gist is that they are bonded to each other via a sheet.

  As a method for bonding the wiring board and the second connection portion of the connection member, there is a method such as thermocompression bonding. In this invention, an adhesive sheet is employ | adopted for both adhesion | attachment. Thereby, since temporary adhesion | attachment is attained, a wiring board and a connection member can be fixed simply.

(8) The invention according to claim 8 is summarized in that in the battery wiring module according to any one of claims 1 to 7, the wiring substrate is formed of a flexible substrate.
According to the present invention, each connection member is fixed to the wiring board, but since the wiring board has flexibility, the connection member is movable. When the connection member is fixed to the battery cell, when the battery cell expands or contracts, the wiring board that has been bent in advance can absorb expansion and contraction, so that the second connection portion of the connection member and the land portion are solder-connected. An excessive force is suppressed from being applied to the part. That is, the deterioration of the solder connection portion can be suppressed.

  (9) The invention according to claim 9 is the battery wiring module according to any one of claims 1 to 8, wherein the first connection portion of the connection member is accommodated and the adjacent battery cell is The gist is that a holding member fitted to the positive electrode terminal and the negative electrode terminal is provided.

  According to this invention, since the 1st connection part is stored in the holding member, the contact of the adjoining 1st connection parts can be controlled. That is, a short circuit between adjacent connecting members can be suppressed.

  (10) The invention according to claim 10 is the battery wiring module according to any one of claims 1 to 9, wherein the wiring board is provided with a bypass circuit for each of the battery cells. It is a summary.

  The battery cell may be overcharged or overdischarged. In particular, in the case of a lithium secondary battery, the battery cell deteriorates due to overcharge and overdischarge. For this reason, in order to suppress overcharge or overdischarge of the battery cell, a bypass circuit is provided. In the present invention, a bypass circuit is provided on the wiring board. For this reason, the external substrate can be made smaller than when the bypass circuit is provided on the external substrate.

  (11) The invention according to claim 11 is a power supply device including the battery wiring module according to any one of claims 1 to 10. Since the battery wiring module is provided, the manufacturing process of the power supply device can be simplified.

  (12) The invention according to claim 12 includes a plurality of connecting members that connect positive and negative terminals of adjacent battery cells to each other, and a wiring board on which wirings connected to the connecting members are formed. The connection member has a first connection part that connects the positive electrode terminal and the negative electrode terminal of the adjacent battery cell, and a second connection part to which the wiring is connected, and the wiring board is The second connection portion is fixed, and the wiring has a conductive wire and a land portion provided in the fixed region so as to correspond to the second connection portion of the connection member. A method of manufacturing a battery wiring module in which the second connection portion and the wiring substrate are bonded to each other in the fixed region, and the second connection portion and the land portion are solder-connected, A step of arranging connecting members, and in front of the wiring board A step of applying an adhesive to the fixed region, a step of bonding a plurality of the connection members and the wiring board with the adhesive, and applying solder to the land portion of the wiring board; And a step of soldering the substrate by reflow.

  In the conventional structure, in order to connect the electric wire as the wiring to the connecting member, the electric wire is routed and fixed so that the electric wire does not move, and thereafter, it is necessary to perform welding individually. In the present invention, since each second connection portion and each land portion are solder-connected together by reflow, the time of the connection process for connecting the second connection portion and the land portion can be shortened.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of a battery wiring module which can simplify a manufacturing process, the manufacturing method of a battery wiring module, and the power supply device provided with the battery wiring module can be provided.

The perspective view of the power supply device of one Embodiment. The circuit diagram of a power supply device. The exploded perspective view of a battery wiring module. Sectional drawing of the wiring board of a battery wiring module. The disassembled perspective view of the solder connection part of a battery wiring module. Sectional drawing of the solder connection part of a battery wiring module. The solder connection part of a battery wiring module is shown, (a) is sectional drawing of a comparison form, (b) is sectional drawing of embodiment. The solder connection part of a battery wiring module is shown, (a) is sectional drawing of the solder connection part by which pass determination was carried out, (b) is sectional drawing of the solder connection part by which pass determination was carried out. The solder connection part of a battery wiring module is shown, (a) is sectional drawing of the solder connection part by which pass determination was carried out, (b) is sectional drawing of the solder connection part by which failure determination was carried out. Sectional drawing of a solder connection part which shows the modification of a solder connection part. The perspective view of the connection member used for the solder connection part of a modification.

With reference to FIG. 1, an embodiment of a power supply device of the present invention will be described.
The power supply device 1 described below is used as, for example, a power supply power source for vehicles and a storage battery for home use or office use.

  The power supply device 1 includes a plurality of battery cells 2 and a battery wiring module 10 that connects the battery cells 2 in series. For example, dozens to dozens of battery cells 2 are connected in series. As the battery cell 2, for example, a nickel metal hydride battery, a lithium ion battery, a molten salt battery, or the like is used.

  The battery cell 2 is a rectangular parallelepiped, and a positive electrode terminal 3 and a negative electrode terminal 4 are provided on the upper surface. The battery cells 2 are arranged so that the polarities of the electrode terminals are alternately changed like the positive electrode terminal 3, the negative electrode terminal 4, the positive electrode terminal 3.

  The battery wiring module 10 has a connection function for connecting the battery cells 2 in series, a monitoring mechanism for monitoring the voltage between the positive terminal 3 and the negative terminal 4 for each battery cell 2, and controls the voltage between the terminals. Control function. The control function works in cooperation with the battery management device 200 provided outside the power supply device 1.

The circuit configuration of the power supply device 1 will be described with reference to FIG.
The power supply device 1 includes a plurality of battery cells 2, a control device 50 that controls the inter-terminal voltage of the battery cell 2, and a communication device 60 that controls communication between the control device 50 and the external battery management device 200. I have. The control device 50 and the communication device 60 are included in the battery wiring module 10.

  Each battery cell 2 is connected to a detection wiring 26 (wiring) for measuring a terminal voltage between the positive electrode terminal 3 and the negative electrode terminal 4. In addition, since the positive electrode terminal 3 and the negative electrode terminal 4 of two adjacent battery cells 2 are short-circuited, the detection wiring 26 of the positive electrode terminal 3 and the detection wiring 26 of the negative electrode terminal 4 become a common line. These detection wirings 26 are connected to the control device 50 via a resistor 140. In addition, the control apparatus 50 and the communication apparatus 60 are comprised by IC (Integrated Circuit).

  A bypass circuit 100 is connected to the battery cell 2 between the positive electrode terminal 3 and the negative electrode terminal 4 of each battery cell 2. The bypass circuit 100 includes a resistor 110 and a switching element 120. As the switching element 120, a field effect transistor (hereinafter referred to as FET), a transistor, or the like is used. A control terminal of each switching element 120 (a gate terminal in the case of an FET and a base terminal in the case of a transistor) is connected to the control device 50 by a control wiring 27.

  The control device 50 detects the voltage between the terminals of each battery cell 2. And the control apparatus 50 transmits the data of the voltage between terminals about each battery cell 2 to the battery management apparatus 200 through the communication apparatus 60. FIG.

Further, the control device 50 controls the switching element 120 based on a command from the battery management device 200.
For example, when the battery management device 200 determines that a discharge is necessary for a predetermined battery cell 2 based on the data on the voltage between terminals, and issues a discharge command to the control device 50, the control device 50 is based on the discharge command. Then, the switching element 120 is controlled to discharge the battery cell 2.

  A temperature sensor 130 that detects the temperature of the battery cell 2 is connected to the control device 50. The control device 50 transmits the output value from the temperature sensor 130 to the battery management device 200 through the communication device 60. The output value from the temperature sensor 130 is used for charge / discharge control of the power supply device 1.

The battery wiring module 10 will be described with reference to FIG.
The battery wiring module 10 includes a wiring substrate 20 formed of a flexible substrate, a connection member 30 that connects the positive electrode terminal 3 and the negative electrode terminal 4 of the adjacent battery cells 2, and a holding member 40 that houses the connection member 30. It has. The wiring board 20 and the connection member 30 are bonded to each other by an adhesive sheet 80.

  The connection member 30 includes a first connection part 31 that connects the positive electrode terminal 3 and the negative electrode terminal 4 of the adjacent battery cell 2, a second connection part 32 to which the detection wiring 26 is connected, a first connection part 31, and a first connection part 31. The intermediate part 33 which connects the 2 connection parts 32 is provided. The connection member 30 is formed by pressing a pure copper or tough pitch copper substrate. That is, the first connection part 31, the second connection part 32, and the intermediate part 33 are integrated.

The first connection portion 31 is provided with a positive electrode insertion hole 31A into which the positive electrode terminal 3 is inserted and a negative electrode insertion hole 31B into which the negative electrode terminal 4 is inserted.
The second connection portion 32 is provided with three connection through holes 32A. The connection through hole 32A is formed corresponding to the land hole 29 (see FIG. 6) of the wiring board 20. The dimension of the second connection portion 32 is set to a size necessary for the connection member 30 to be firmly fixed to the wiring board 20.

  The holding member 40 includes a bottom wall 41 and a peripheral wall 42 surrounding the bottom wall 41. The bottom wall 41 and the peripheral wall 42 constitute an accommodating portion that accommodates the first connecting portion 31 of the connecting member 30. The bottom wall 41 is formed with a positive hole 41A through which the positive terminal 3 is inserted and a negative hole 41B through which the negative terminal 4 is inserted. The holding member 40 is made of an insulating resin.

  The holding member 40 is attached to the battery cell 2 by fitting the positive hole 41 </ b> A and the positive terminal 3 and fitting the negative hole 41 </ b> B and the negative terminal 4. The connection member 30 is fixed to the battery cell 2 as follows.

  That is, the positive electrode terminal 3 is inserted into the positive electrode insertion hole 31A and the negative electrode terminal 4 is inserted into the negative electrode insertion hole 31B in a state where the first connection portion 31 is accommodated in the accommodation portion. Then, the first nut is fitted to the positive electrode terminal 3, the second nut is fitted to the negative electrode terminal 4, the first connection portion 31 and the positive electrode terminal 3 are fastened together, and the first connection portion 31 and the negative electrode terminal 4 are Are fastened together.

  In addition, when the connection member 30 and the holding member 40 are fixed to the battery cell 2, a portion corresponding to the space between the two adjacent connection members 30 in the wiring board 20 (hereinafter referred to as an inter-connection member portion 20X, see FIG. 1). Will bend. That is, the wiring board 20 is formed such that the connecting member-to-member portion 20 </ b> X bends when the battery wiring module 10 is assembled to a set of a plurality of battery cells 2.

The wiring board 20 will be described with reference to FIG.
The wiring board 20 includes a conductive layer 23 on which wirings such as a detection wiring 26 and a control wiring 27 are formed, a first coverlay 21 that covers one surface of the conductive layer 23, and a second coverlay that covers the other surface of the conductive layer 23. 22. In addition, in the wiring board 20, the surface side on which the second coverlay 22 is attached is defined as a back surface 20R, and the opposite side of the back surface 20R is defined as a front surface 20S.

  The first coverlay 21 is made of a polyimide resin. The first coverlay 21 is attached to the conductive layer 23 with an adhesive 24A. The second coverlay 22 is made of a polyimide resin. The second coverlay 22 is affixed to the conductive layer 23 with an adhesive 24B.

  A connection member 30 is fixed to the back surface 20 </ b> R of the wiring board 20. The connection member 30 is fixed using the adhesive sheet 80. In the following description, a portion of the wiring board 20 to which the second connection portion 32 adheres is referred to as a fixed region 20C (see FIG. 5).

  A resistor 140, a resistor 110 of the bypass circuit 100, a switching element 120, a control device 50, a communication device 60, and a connector 70 are disposed on the surface 20S of the wiring board 20 (see FIGS. 1 and 5). As shown in FIG. 3, the connector 70 is provided on the lead portion 20 </ b> B extending from the main body portion 20 </ b> A of the wiring board 20. The connector 70 is connected to wiring derived from the battery management device 200.

  The conductive layer 23 includes an insulating layer 23C, a first conductive layer 23A formed on one surface of the insulating layer 23C, and a second conductive layer 23B formed on the other surface of the insulating layer 23C. . The first conductive layer 23A and the second conductive layer 23B include wirings such as a detection wiring 26 and a control wiring 27. These wirings are formed by etching. As shown in FIG. 5, the detection wiring 26 is connected to the second connection portion 32 of the connection member 30 by solder. In the following description, the solder connection portion between the detection wiring 26 and the second connection portion 32 is referred to as a solder connection portion 25.

With reference to FIGS. 5 and 6, the structure of the solder connection portion 25 will be described.
FIG. 5 shows an arrangement relationship of each member when the wiring board 20 and the connection member 30 are bonded with the adhesive sheet 80. Note that the detection wiring 26 is formed in both the first conductive layer 23A and the second conductive layer 23B. However, for convenience of explanation, it is assumed here that the detection wiring 26 is formed in the first conductive layer 23A. To do.

  The detection wiring 26 has a conductive wire 26 </ b> A and a land portion 28. Specifically, the tip of the conducting wire 26A is divided into three branch lines, and a land portion 28 is formed on each branch line. The land portions 28 are arranged at equal intervals in the fixed region 20 </ b> C and on the end side of the wiring board 20. In the fixed region 20 </ b> C, in addition to the branch line or land portion 28, the conducting wire 26 </ b> A or the control wiring 27 of the detection wiring 26 is arranged. A resistor may be arranged in the fixed region 20C.

  Each land portion 28 is disposed at a position corresponding to the connection through hole 32 </ b> A of the second connection portion 32. That is, when the second connection portion 32 is bonded to the wiring board 20, the center axis of the land portion 28 and the center axis of the connection through hole 32A coincide.

  The adhesive sheet 80 is formed in a shape corresponding to the fixed region 20C. A through hole 81 is provided in the adhesive sheet 80 so as to correspond to the land portion 28. The size of the through hole 81 is larger than that of the land portion 28. That is, it is configured such that the adhesive does not enter the land portion 28 when the wiring board 20 and the second connection portion 32 are bonded.

  As shown in FIG. 6, a land hole 29 penetrating the wiring board 20 is formed in the center portion of the land portion 28. The inner diameter of the land hole 29 is larger than the inner diameter of the connection through hole 32A. The land portion 28 includes a first land portion 28A and a second land portion 28B that are formed to face each other with the insulating layer 23C interposed therebetween. The first land portion 28 </ b> A and the second land portion 28 </ b> B are connected via a land hole 29.

  The first land portion 28A is formed as the first conductive layer 23A. The second land portion 28B is formed as the second conductive layer 23B. A portion of the first coverlay 21 corresponding to the first land portion 28A is removed. That is, the first land portion 28A is exposed to the outside. Similarly, the portion corresponding to the second land portion 28B in the second cover lay 22 is removed.

  An adhesive layer 36 is formed between the wiring board 20 and the second connection portion 32. The adhesive layer 36 is formed by thermocompression bonding of the wiring board 20 and the second connection portion 32 with an adhesive sheet 80 interposed therebetween. The adhesive layer 36 does not exist between the second land portion 28 </ b> B and the second connection portion 32.

With reference to FIG. 6, the solder filling aspect of the solder connection part 25 is demonstrated.
The solder 37 covers the entire first land portion 28 </ b> A, enters the internal space 34 between the second land portion 28 </ b> B and the second connection portion 32 through the land hole 29, and connects to the connection through hole of the second connection portion 32. 32A is invaded. A fillet 38 of solder 37 is formed on the inner surface of the connection through hole 32A.

  The solder 37 contacts the first land portion 28A and the second land portion 28B. That is, the contact area between the solder 37 and the land portion 28 is larger than the contact area of the solder connection portion where the land portion is formed only on one surface of the insulating layer 23C.

  The solder 37 spreads on both the front surface 20S side (first land portion 28A side) and the back surface 20R side (second land portion 28B side) of the wiring board 20. Such a structure produces the following effects.

  When a force acts on the solder 37 due to thermal expansion and contraction of the wiring board 20, the solder portion spreading on the first land portion 28 </ b> A and the solder portion spreading on the second land portion 28 </ b> B become resistances so that the solder 37 It catches on the wiring board 20. For this reason, the strength of the solder connection portion 25 is higher than the strength of the solder connection portion in which the land portion is formed only on one surface of the insulating layer 23C.

  In addition, the solder 37 enters the connection through hole 32 </ b> A of the second connection portion 32. The solder 37 that has entered the connection through hole 32 </ b> A is caught by the second connection portion 32. For this reason, the strength of the solder connection portion 25 is higher than the strength of the solder connection portion where the connection through hole 32A is not provided in the second connection portion 32.

  The action exerted by entering the connection through hole 32A of the second connection part 32, that is, the action of catching is also caused by forming a groove in the second connection part 32 instead of the connection through hole 32A. That is, the strength of the solder connection portion 25 can be increased also by this groove. In addition, since the structure by the connection through-hole 32A has the effect of suppressing solder unfilling in addition to the effect of catching, this point will be described below.

  With reference to FIG. 7, a description will be given in comparison with the solder connection portion 25 having the connection through hole 32A and the solder connection portion 250 having no connection through hole 32A. In addition, the figure shown to the upper side of Fig.7 (a) shows the land part 28 seen from the surface 20S side of the wiring board 20, and the figure shown below shows the cross-sectional structure along the AA line. 7B shows the land portion 28 viewed from the front surface 20S side of the wiring board 20, and the lower view shows a cross-sectional structure along the line BB.

FIG. 7A shows a cross-sectional view of the solder connection portion 250 (comparative form) without the connection through hole 32A.
In the case of this structure, solder may not flow to the second connection portion 32 at the time of solder connection. In this case, as shown in FIG. 7A, the land portion 28 and the second connection portion 32 are not connected. Such unfilling of the solder is caused by one or both of the following two events overlapping.

  First, when solder is applied, air is confined in the internal space 34 between the second land portion 28B and the second connection portion 32, and the air confined in the internal space 34 when the solder melts is outside. It is an event that makes it difficult to be discharged.

  Second, the flux contained in the solder or the flux used during solder application becomes a flux gas when the solder melts, and this flux gas is confined in the internal space 34 between the second land portion 28B and the second connection portion 32. This is an event that makes it difficult for the solder to flow to the second connection portion 32. That is, in any event, unfilled solder is formed due to air or flux gas being confined in the internal space 34 between the second land portion 28 </ b> B and the second connection portion 32.

  There is also a problem that such unfilled solder cannot be confirmed from the outside. That is, when the solder covers the first land portion 28 </ b> A, the solder unfilled cannot be found only by observing the land portion 28 from the surface 20 </ b> S side of the wiring board 20.

FIG. 7B is a cross-sectional view of the solder connection portion 25 having the connection through hole 32A.
In the case of such a structure, as shown in FIG. 7B, the solder flows to the second connection portion 32, and the land portion 28 and the second connection portion 32 are connected. This is due to the following reason.

  That is, since there is a connection through hole 32A that communicates with the external space, the frequency of air or flux gas being confined in the internal space 34 between the second land portion 28B and the second connection portion 32 by applying solder is reduced. . For this reason, the frequency with which unfilled solder is formed is reduced.

  Further, even if the solder unfilling that the solder did not reach the second connection portion 32 is formed, the solder filling state can be confirmed from the back surface 32R of the second connection portion 32, so that the solder connection state Inspection can be done visually.

With reference to FIGS. 8 and 9, an example of the appearance inspection determination condition of the solder connection portion 25 will be described.
In addition, the figure shown to the upper side of Fig.8 (a) shows the land part 28 seen from the surface 20S side of the wiring board 20, and the figure shown below shows the cross-sectional structure along CC line. 8B shows the land portion 28 viewed from the front surface 20S side of the wiring board 20, and the lower drawing shows a cross-sectional structure along the line DD. 9A shows the land portion 28 viewed from the surface 20S side of the wiring board 20, and the lower view shows a cross-sectional structure taken along line EE. 9B shows the land portion 28 viewed from the surface 20S side of the wiring board 20, and the lower view shows a cross-sectional structure along the line FF.

  Two determination conditions are set as the pass / fail determination conditions for the appearance inspection of the solder connection portion 25. When both of the following two determination conditions are positively determined, it is determined to be a pass determination in the appearance inspection. Two determination conditions are as follows.

(Judgment conditions for appearance inspection of solder joints)
(A) The first reference is that at least the inner periphery of the land hole 29 is covered with the solder 37 when viewed from the surface 20S side of the wiring board 20.
(B) The second reference is that the solder 37 has entered the connection through hole 32 </ b> A when viewed from the back surface 32 </ b> R side of the second connection portion 32.

According to the first standard, it is confirmed that the solder 37 flows to the second connection portion 32 through the land hole 29.
Specific examples of satisfying the first standard include, for example, that the land hole 29 is blocked by the solder 37, and that the solder adheres to the inner periphery of the land hole 29.

According to the second standard, it is confirmed that the solder 37 reaches the second connection portion 32.
Specific examples of satisfying the second standard include, for example, that the connection through hole 32A is filled with the solder 37, and that the fillet 38 of the solder 37 is formed in the connection through hole 32A.

  The condition (A) indicates the connection state between the wiring board 20 and the solder 37, and the condition (B) indicates the connection state between the second connection portion 32 and the solder 37. Therefore, the two determination conditions (A) and (B ), It can be determined that the wiring board 20 and the second connection portion 32 are connected to each other via the solder 37. Hereinafter, an example of the pass determination of the solder connection state and an example of the fail determination will be described.

  The solder connection portion 25 shown in FIG. 8A has the following appearance. The land hole 29 is closed with the solder 37 when viewed from the front surface 20S side of the wiring board 20, and the connection through hole 32 </ b> A is filled with the solder 37 when viewed from the back surface 32 </ b> R side of the second connection portion 32. That is, since the solder connection portion 25 satisfies the above two determination conditions (A) and (B), it is determined to be acceptable in the appearance inspection.

The solder connection portion 25 shown in FIG. 8B has the following appearance. The inner periphery of the land hole 29 is covered with the solder 37 when viewed from the front surface 20S side of the wiring board 20, and the fillet 38 of the solder 37 is formed in the connection through hole 32A when viewed from the back surface 32R side of the second connection portion 32. . That is, in order to satisfy the above two determination conditions (A) and (B), it is determined to be acceptable in the appearance inspection. That is,
The solder connection portion 25 shown in FIG. 9A has the following appearance. The land hole 29 is closed with the solder 37 when viewed from the front surface 20S side of the wiring board 20, and the fillet 38 of the solder 37 is formed in the connection through hole 32A when viewed from the back surface 32R side of the second connection portion 32. That is, in order to satisfy the above two determination conditions (A) and (B), it is determined to be acceptable in the appearance inspection.

  The solder connection portion 25 shown in FIG. 9B has the following appearance. The inner periphery of the land hole 29 is covered with the solder 37 when viewed from the front surface 20S side of the wiring board 20, and the solder 37 does not enter the connection through hole 32A when viewed from the rear surface 32R side of the second connection portion 32. That is, the condition (A) is satisfied among the above two determination conditions, but the condition (B) is not satisfied.

With reference to FIGS. 10 and 11, a modified example of the solder connection portion 25 is shown.
FIG. 10 shows a cross-sectional view of a modified example of the solder connection portion 25. FIG. 11 is a perspective view of a connection member 300 used in a modified example of the solder connection portion 25. In this modification, a ventilation groove 310 is formed in the second connection portion 32 instead of the connection through hole 32A of the above embodiment.

  As shown in the perspective view of the connection member 300 in FIG. 11, the ventilation groove 310 extends to the edge 35 of the second connection portion 32. That is, in the solder connection portion 25, the ventilation groove 310 is formed so that the internal space 34 between the second land portion 28B and the second connection portion 32 communicates with the external space. According to such a configuration, the internal space 34 between the second land portion 28B and the second connection portion 32 is not sealed when the solder is applied. For this reason, generation | occurrence | production of solder unfilling can be suppressed.

Next, with reference to FIG. 3, the manufacturing method of the battery wiring module 10 is demonstrated.
The connection members 30 are arranged in two rows. At this time, the positive electrode insertion hole 31A and the negative electrode insertion hole 31B of the connection member 30 are arranged at equal intervals. That is, the connection members 30 are arranged according to the arrangement of the battery cells 2.

  Next, the adhesive sheet 80 is attached to the fixed region 20 </ b> C of the wiring board 20. At this time, the adhesive sheet 80 is pasted so that the central axis of the land hole 29 of the wiring board 20 and the central axis of the through hole 81 of the adhesive sheet 80 coincide with each other.

  And the connection member 30 is arrange | positioned in the place which affixed the adhesive sheet 80, and the connection member 30 is temporarily fixed. At this time, the center axis of the land hole 29 and the center axis of the connection through hole 32A of the second connection portion 32 are made to coincide. Next, the connection member 30 is fixed to the wiring board 20 using a hot press machine. For example, the wiring board 20 and the second connection part 32 are pressurized under the conditions of 170 ° C., 2 MP, and a press holding time of 30 minutes.

  Next, solder is applied to the land portion 28 of the wiring board 20, and the assembly of the wiring board 20 and the connection member 30 is heated by reflow to solder-connect the land portion 28 and the second connection portion 32. The battery wiring module 10 is completed through the above steps.

Hereinafter, the effect of this embodiment will be described.
(1) In the above embodiment, the second connection portion 32 of the connection member 30 and the wiring board 20 are bonded to each other in the fixed region 20C, and the second connection portion 32 and the land portion 28 are soldered in the fixed region 20C. To do. That is, the land portion 28 and the connection member 30 can be soldered to each other in a state where the connection member 30 is fixed to the fixing region 20C of the wiring board 20. In the case of the conventional structure, it is necessary to connect the electric wires to the connecting member 30 one by one, which is troublesome, but these operations can be omitted. For this reason, the manufacturing process of the battery wiring module 10 can be simplified.

  Moreover, in the battery wiring module 10 of the said embodiment, the following subjects of a conventional structure are also solved. That is, in the battery wiring module 10 having the conventional structure, there is a concern that erroneous wiring of electric wires frequently occurs as the number of the battery cells 2 increases, that is, the number of electric wires increases. In this respect, since the wiring board 20 is used in the present embodiment, there is no wiring work and there is almost no possibility of wiring.

  There are also the following effects. That is, since the periphery of the land portion 28 and the second connection portion 32 are bonded to each other, an excessive force is suppressed from being applied to the solder connection portion 25. For this reason, deterioration of the solder connection part 25 is suppressed.

  (2) In the above embodiment, the first land portion 28 </ b> A is formed on the surface 20 </ b> S side of the wiring board 20. Then, the land portion 28 and the second connection portion 32 are soldered through the land hole 29.

  According to this configuration, the connection member 30 is arranged at a predetermined position, the wiring board 20 is placed on the connection member 30 and bonded and fixed to each other, and then this state is maintained and the land portion 28 and the second connection portion are maintained. 32 can be solder-connected. That is, with this configuration, the manufacturing process of the battery wiring module 10 can be simplified.

(3) In the above embodiment, the connection through hole 32 </ b> A is provided in the second connection portion 32 at a place corresponding to the land hole 29.
When the connection through hole 32 </ b> A is not formed in the second connection portion 32, the solder connection state between the land portion 28 and the second connection portion 32 cannot be accurately confirmed. That is, the entire first land portion 28 </ b> A is covered with the solder by the solder connection, and the land hole 29 is blocked, so it is difficult to visually confirm whether or not the second connection portion 32 is sufficiently widened. In this regard, according to the above-described configuration, the solder can be visually observed through the connection through hole 32A. Therefore, whether the solder connection is good or not can be determined by confirming the spread of the solder.

  Further, since the flux gas generated during the solder connection is discharged to the outside through the connection through hole 32A, the flux gas is suppressed from being accumulated in the internal space 34 between the wiring board 20 and the second connection portion 32. . Thereby, it is possible to suppress the occurrence of unfilled solder such that the solder does not sufficiently flow between the land portion 28 and the second connection portion 32.

  (4) In the modification of the above embodiment, as shown in FIGS. 10 and 11, instead of the connection through hole 32 </ b> A, the end of the second connection portion 32 from the place corresponding to the land portion 28 in the second connection portion 32. A ventilation groove 310 extending to the edge 35 is formed.

  According to this configuration, since there is the ventilation groove 310, the flux gas generated at the time of solder connection is discharged to the outside through the ventilation groove 310. For this reason, generation | occurrence | production of solder unfilling can be suppressed.

  (5) In the above embodiment, the first land portion 28 </ b> A and the second land portion 28 </ b> B are formed on both surfaces of the insulating layer 23 </ b> C, and both lands are connected to each other through the land holes 29. That is, the solder connection area can be increased as compared with the case where the land portion 28 is formed only on one surface of the insulating layer 23C. Thereby, the strength of the solder connection portion 25 between the land portion 28 and the second connection portion 32 can be increased.

  (6) In the above embodiment, the conducting wire 26A of the detection wiring 26 passes through the fixed region 20C. According to this configuration, the layout area in which the conductor 26A can be disposed can be increased as compared with a configuration in which the conductor 26A is not disposed in the fixed region 20C in the wiring substrate 20, and thus the wiring substrate 20 is reduced as a whole. be able to. This configuration is particularly useful when the number of wirings is large.

(7) In the above embodiment, the fixing region 20 </ b> C of the wiring board 20 and the second connection portion 32 of the connection member 30 are bonded to each other by the adhesive sheet 80.
As a method for bonding the wiring board 20 and the second connection portion 32, there is a method such as thermocompression bonding. In this configuration, the adhesive sheet 80 is employed for bonding the two. Thereby, since temporary adhesion | attachment is attained, the wiring board 20 and the connection member 30 can be fixed simply. That is, rework is possible and the production yield can be increased.

(8) In the above embodiment, the wiring substrate 20 is formed of a flexible substrate.
With this configuration, the connection member 30 can be moved. That is, when the connection member 30 is fixed to the battery cell 2, when the battery cell 2 expands or contracts, the wiring substrate 20 that has been bent in advance can absorb the expansion and contraction. Is suppressed from being added. For this reason, deterioration of the solder connection part 25 can be suppressed.

(9) In the said embodiment, the holding member 40 which accommodates the positive electrode terminal 3 and the negative electrode terminal 4 of the battery cell 2 which accommodates the 1st connection part 31 and is adjacent is provided.
Since the 1st connection part 31 is accommodated in the holding member 40, the contact of adjacent 1st connection parts 31 can be suppressed. That is, a short circuit between adjacent connecting members 30 can be suppressed.

  (10) In the above embodiment, the circuit board 20 is provided with the bypass circuit 100 for each of the battery cells 2. The bypass circuit 100 can be provided on an external board other than the wiring board 20, but in this case, the external board becomes large. In this regard, since the bypass circuit 100 is provided on the wiring board 20, the area of the external board can be reduced.

(11) The power supply device 1 of the present embodiment includes the battery wiring module 10 having the above configuration. For this reason, the manufacturing process of the power supply device 1 can be simplified.
(12) In the method for manufacturing the battery wiring module 10 of the present embodiment, the assembly of the connection member 30 and the wiring board 20 is heated by reflow to solder-connect the solder connection portions 25 together. In the conventional structure, in order to connect the electric wire to the connecting member 30, the electric wire is routed and fixed so that the electric wire does not move, and thereafter, an operation of individually welding is required. On the other hand, in this manufacturing method, since the second connection portion 32 and each land portion 28 are collectively solder-connected by reflow, the connection work time in the connection process for connecting the second connection portion 32 and the land portion 28 is performed. Can be shortened.

(Other embodiments)
In addition, the embodiment of the present invention is not limited to the embodiment shown in the above embodiment, and can be implemented by changing it as shown below, for example. In addition, the following modifications can be implemented by combining different modifications with each other.

  In the above embodiment, the first connection part 31 and the second connection part 32 of the connection member 30 are connected via the intermediate part 33, but the intermediate part 33 may be omitted. That is, the connection member 30 can also be formed so that the first connection portion 31 and the second connection portion 32 of the connection member 30 constitute the same plane.

  In the above embodiment, the land portions 28 are formed on both surfaces of the wiring board 20. That is, the land portion 28 includes a first land portion 28A and a second land portion 28B that face each other with the insulating layer 23C interposed therebetween. In this configuration, the second land portion 28B can be omitted. Even with this configuration, at least the effect (1) is achieved.

  In the above embodiment, the conductive layer 23 of the wiring board 20 has a three-layer structure, but it can also have a multilayer structure. Further, as the wiring board 20, a so-called rigid flexible board that is partially rigid can be used. In this case, a portion corresponding to the space between the battery cells 2 is made flexible.

  In the above embodiment, the connection through hole 32 </ b> A or the ventilation groove 310 is provided as an air or flux gas discharge port in the internal space 34 of the solder connection portion 25. Instead of these configurations or in addition to these configurations, a through-hole leading to the internal space 34 may be formed in the wiring board 20. This configuration also has the same effect as the above (3).

  In the above embodiment, the wiring board 20 and the connection member 30 are bonded by the adhesive sheet 80, but the adhesive is not limited to this. Also, the bonding method is not limited to this. For example, a liquid adhesive can be used. Alternatively, an adhesive method in which a thermoplastic layer is formed on the outermost surface of the bonding surface of the wiring board 20 and the wiring board 20 and the connection member 30 are bonded by thermocompression bonding can be employed.

  In the above embodiment, the present invention is applied to the power supply device 1 used as a vehicle secondary battery or a household storage battery, but the scope of application of the present invention is not limited to this. That is, the present invention can be applied to any power supply device 1 having a structure in which the battery cells 2 are connected in series and a wiring is connected to each connection member 30.

  DESCRIPTION OF SYMBOLS 1 ... Power supply device, 2 ... Battery cell, 3 ... Positive electrode terminal, 4 ... Negative electrode terminal, 10 ... Battery wiring module, 20 ... Wiring board, 20A ... Main-body part, 20B ... Lead part, 20C ... Fixed area | region, 20R ... Back surface, 20S ... surface, 20X ... interconnection member, 21 ... first cover lay, 22 ... second cover lay, 23 ... conductive layer, 23A ... first conductive layer, 23B ... second conductive layer, 23C ... insulating layer, 24A ... adhesive, 24B ... adhesive, 25 ... solder connection part, 26 ... detection wiring, 26A ... conductive wire, 27 ... control wiring, 28 ... land part, 28A ... first land part, 28B ... second land part, 29 ... Land hole, 30 ... connection member, 31 ... first connection part, 31A ... positive electrode insertion hole, 31B ... negative electrode insertion hole, 32 ... second connection part, 32A ... connection through hole, 32R ... back surface, 33 ... intermediate part, 34 ... Internal space, 35 ... edge, 36 ... adhesive layer 37 ... solder, 38 ... fillet, 40 ... holding member, 41 ... bottom wall, 41A ... positive electrode hole, 41B ... negative electrode hole, 42 ... peripheral wall, 50 ... control device, 60 ... communication device, 70 ... connector, 80 ... adhesive sheet (Adhesive), 81 ... through hole, 100 ... bypass circuit, 110 ... resistance, 120 ... switching element, 130 ... temperature sensor, 140 ... resistance, 200 ... battery management device, 250 ... solder connection part, 300 ... connection member, 310: A ventilation groove.

Claims (12)

In the battery wiring module for connecting a plurality of battery cells in series and detecting the voltage between the terminals of each battery cell,
A plurality of connecting members for connecting the positive and negative terminals of the adjacent battery cells to each other, and a wiring board on which wirings connected to the respective connecting members are formed,
The connection member includes a first connection portion that connects the positive electrode terminal and the negative electrode terminal of the adjacent battery cells, and a second connection portion to which the wiring is connected,
The wiring board has a fixed region to which the second connection portion is fixed;
The wiring includes a conductive wire and a land portion provided in the fixed region so as to correspond to the second connection portion of the connection member,
The battery wiring module, wherein the second connection portion and the wiring substrate are bonded to each other in the fixing region, and the second connection portion and the land portion are solder-connected. The battery wiring module according to claim 1,
The land portion is formed on a surface of the wiring board opposite to a surface to which the second connection portion is fixed, and the land portion is provided with a land hole penetrating the wiring substrate,
The battery wiring module, wherein the land portion and the second connection portion are solder-connected through the land hole. In the battery wiring module according to claim 2,
The battery wiring module, wherein the second connection portion is provided with a connection through hole penetrating the second connection portion at a location corresponding to the land hole provided in the land portion. In the battery wiring module according to claim 2,
The battery wiring module according to claim 1, wherein a ventilation groove extending from a position corresponding to the land portion to an edge of the second connection portion is formed in the second connection portion. In the battery wiring module according to any one of claims 2 to 4,
The wiring board includes a conductive layer including an insulating layer and the wiring formed on both surfaces of the insulating layer, a first cover lay covering one surface of the conductive layer, and a second cover covering the other surface of the conductive layer. With Ray,
The land portion is formed on both surfaces of the insulating layer, and the lands formed on both surfaces of the insulating layer are connected to each other through the land hole. In the battery wiring module according to any one of claims 1 to 5,
The battery wiring module, wherein the conductive wire passes through the fixed region of the wiring board. In the battery wiring module according to any one of claims 1 to 6,
The battery wiring module, wherein the fixing region of the wiring board and the second connection portion of the connection member are bonded to each other via an adhesive sheet. In the battery wiring module according to any one of claims 1 to 7,
The battery wiring module, wherein the wiring substrate is formed of a flexible substrate. In the battery wiring module according to any one of claims 1 to 8,
A battery wiring module comprising: a holding member that accommodates the first connection portion of the connection member and fits to a positive electrode terminal and a negative electrode terminal of the adjacent battery cell. In the battery wiring module according to any one of claims 1 to 9,
The circuit board is provided with a bypass circuit for each of the battery cells.   The power supply device provided with the battery wiring module as described in any one of Claims 1-10. A plurality of connecting members for connecting the positive electrode terminal and the negative electrode terminal of the adjacent battery cells to each other, and a wiring board on which wiring connected to each connecting member is formed,
The connection member includes a first connection portion that connects the positive electrode terminal and the negative electrode terminal of the adjacent battery cells, and a second connection portion to which the wiring is connected,
The wiring board has a fixed region to which the second connection portion is fixed;
The wiring includes a conductive wire and a land portion provided in the fixed region so as to correspond to the second connection portion of the connection member,
The method of manufacturing a battery wiring module, wherein the second connection portion and the wiring board are bonded to each other in the fixed region, and the second connection portion and the land portion are solder-connected,
Arranging a plurality of the connecting members;
Applying an adhesive to the fixed region of the wiring board;
Bonding the plurality of connection members and the wiring board with the adhesive; and
A method of manufacturing a battery wiring module, comprising: applying solder to the land portion of the wiring board; and heating and soldering the connection member and the wiring board by reflow.