JP2013105117A5

JP2013105117A5 -

Info

Publication number: JP2013105117A5
Application number: JP2011250382A
Authority: JP
Filing date: 2011-11-16
Publication date: 2014-12-18
Anticipated expiration: 2031-11-16

Description

また、可動板１１（光反射部１２）と、軸部材１３ａ、１３ｂと、永久磁石２０と、半田層２１と、下地層２２、２３とで、軸部材１３ａ、１３ｂを回動軸とする振動系が構成される。
可動板１１は、軸部材１３ａ、１３ｂによって支持枠１８に支持されている。また、支持枠１８は、ホルダー１９に支持されている。
可動板１１の形状は、図示の構成では、平面視で円形をなしているが、これに限定されず、平面視で、例えば、楕円形、四角形等の多角形であってもよい。 The movable plate 11 (light reflecting portion 12), the shaft members 13a and 13b, the permanent magnet 20, the solder layer 21, and the base layers 22 and 23 are vibrations having the shaft members 13a and 13b as pivot axes. A system is constructed.
The movable plate 11 is supported on the support frame 18 by shaft members 13a and 13b. The support frame 18 is supported by the holder 19.
The shape of the movable plate 11 is circular in a plan view in the illustrated configuration, but is not limited thereto, and may be, for example, a polygon such as an ellipse or a rectangle in a plan view.

また、下地層２３は、永久磁石２０の表面全体に設けられている。そして、下地層２３は、その表面の半田の濡れ性が永久磁石２０よりも高くなるように構成されている。これにより半田層２１により永久磁石２０を接合する際、下地層２３上に半田が確実に、かつ均一に濡れ広がることができる。なお、下地層２３は、軟磁性体を含んでいることが好ましい。
このように、可動板１１と半田層２１との間に下地層２２を介在させ、永久磁石２０と半田層２１との間に下地層２３を介在させることにより、それらの下地層２２、２３を介して可動板１１と永久磁石２０とを確実に接合することができる。 The underlayer 23 is provided on the entire surface of the permanent magnet 20. The underlayer 23 is configured so that the solder wettability of the surface thereof is higher than that of the permanent magnet 20. As a result, when the permanent magnet 20 is joined by the solder layer 21, the solder can reliably and uniformly spread on the underlayer 23. The underlayer 23 preferably contains a soft magnetic material.
Thus, the base layer 22 is interposed between the movable plate 11 and the solder layer 21, by interposing an undercoat layer 23 between the permanent magnet 20 and the solder layer 21, those of the underlying layer 22, 23 Thus, the movable plate 11 and the permanent magnet 20 can be reliably joined.

なお、コイル３０に印加する交流電圧の周波数は、可動板１１と軸部材１３ａ、１３ｂと、永久磁石２０と、半田層２１と、下地層２２、２３とで構成される振動系のねじり共振周波数（共振周波数）と一致していてもよいし、異なっていてもよい。
また、本実施形態では、電圧印加手段４０によりコイル３０へ図４に示す交流電圧を印加するものについて説明したが、可動板１１を回動させることができれば、これに限定されず、例えば、電圧印加手段４０によりコイル３０へ直流電圧を間欠的に印加するように構成されていてもよい。 The frequency of the alternating voltage applied to the coil 30 is the torsional resonance frequency of the vibration system composed of the movable plate 11, the shaft members 13a and 13b , the permanent magnet 20, the solder layer 21, and the base layers 22 and 23. (Resonance frequency) may be the same or different.
Moreover, although this embodiment demonstrated what applied the alternating voltage shown in FIG. 4 to the coil 30 by the voltage application means 40, if the movable plate 11 can be rotated, it will not be limited to this, For example, voltage The application unit 40 may be configured to intermittently apply a direct current voltage to the coil 30.

図９および図１０に示すように、光スキャナー１０は、ミラーデバイス１と、ホルダー１７と、コイル３０と、コイル３０に電圧を印加する電圧印加手段４０とを備えている。ミラーデバイス１は、可動板本体１１０および光反射性を有する光反射部１２を備える可動板１１と、１対の軸部材（第２の軸部材）１３ａ、１３ｂと、枠状部材１４と、１対の軸部材（第１の軸部材）１５ａ、１５ｂと、支持枠１６と、１対の永久磁石（磁石）２０ａ、２０ｂと、枠状部材１４と永久磁石２０ａとを接合する半田層２１ａと、枠状部材１４と永久磁石２０ｂとを接合する半田層２１ｂと、枠状部材１４と半田層２１ａとの間に介在する下地層２２ａと、枠状部材１４と半田層２１ｂとの間に介在する下地層２２ｂと、永久磁石２０ａと半田層２１ａとの間に介在する下地層２３ａと、永久磁石２０ｂと半田層２１ｂとの間に介在する下地層２３ｂとを備えている。光反射部１２は、可動板本体１１０の上面に設けられている。なお、可動板１１と、軸部材１３ａ、１３ｂと、枠状部材１４と、軸部材１５ａ、１５ｂとにより、可動部が構成される。 As shown in FIGS. 9 and 10, the optical scanner 10 includes a mirror device 1, a holder 17, a coil 30, and a voltage applying unit 40 that applies a voltage to the coil 30. The mirror device 1 includes a movable plate 11 including a movable plate main body 110 and a light reflecting portion 12 having light reflectivity, a pair of shaft members (second shaft members) 13a and 13b, a frame-shaped member 14, and 1 A pair of shaft members (first shaft members) 15a and 15b, a support frame 16, a pair of permanent magnets (magnets) 20a and 20b, and a solder layer 21a that joins the frame-shaped member 14 and the permanent magnet 20a. The solder layer 21b for joining the frame-shaped member 14 and the permanent magnet 20b, the base layer 22a interposed between the frame-shaped member 14 and the solder layer 21a, and interposed between the frame-shaped member 14 and the solder layer 21b. A base layer 22b interposed between the permanent magnet 20b and the solder layer 21b, and a base layer 23b interposed between the permanent magnet 20b and the solder layer 21b. The light reflecting portion 12 is provided on the upper surface of the movable plate main body 110. The movable plate 11, the shaft members 13a and 13b, the frame member 14, and the shaft members 15a and 15b constitute a movable portion.

また、ホルダー１７の上面には、永久磁石２０ａ、２０ｂに作用する磁界を発生するコイル３０が設けられている。コイル３０は電圧印加手段４０に電気的に接続されている。永久磁石２０ａ、２０ｂ、コイル３０および電圧印加手段４０によって可動板１１および枠状部材１４を回動させる駆動手段が構成される。
永久磁石２０ａ、２０ｂは、それぞれ、長手形状、図示の構成では、直方体形状、すなわち、横断面が四角形をなす真っ直ぐな棒状をなしており、その長手方向に磁化されている。すなわち、永久磁石２０ａのＳ極とＮ極とを結ぶ線分の方向が、永久磁石２０ａの長手方向と一致している。換言すれば、永久磁石２０ａのＳ極とＮ極とを結ぶ線分が、永久磁石２０ａの軸線と一致している。永久磁石２０ｂについても同様である。 A coil 30 that generates a magnetic field that acts on the permanent magnets 20a and 20b is provided on the upper surface of the holder 17. The coil 30 is electrically connected to the voltage applying means 40 . The permanent magnets 20a and 20b, the coil 30, and the voltage applying means 40 constitute driving means for rotating the movable plate 11 and the frame-like member 14.
Each of the permanent magnets 20a and 20b has a longitudinal shape, in the illustrated configuration, a rectangular parallelepiped shape, that is, a straight bar shape having a square cross section, and is magnetized in the longitudinal direction. In other words, the direction of the line segment connecting the south pole and the north pole of the permanent magnet 20a coincides with the longitudinal direction of the permanent magnet 20a. In other words, the line segment connecting the S pole and the N pole of the permanent magnet 20a coincides with the axis of the permanent magnet 20a. The same applies to the permanent magnet 20b.

１…ミラーデバイス１０…光スキャナー１１…可動板１１０…可動板本体１２…光反射部１３ａ、１３ｂ…軸部材１４…枠状部材１５ａ、１５ｂ…軸部材１６、１８…支持枠１７、１９…ホルダー２０、２０ａ、２０ｂ…永久磁石２００…硬磁性体２１、２１ａ、２１ｂ…半田層２２、２２ａ、２２ｂ、２３、２３ａ、２３ｂ…下地層２２１、２３１…第１層２２２、２３２…第２層２２３、２３３…第３層２２４、２２５…突出した部位２２６ａ、２２６ｂ、２２６ｃ、２２６ｄ…斜辺３０…コイル４０…電圧印加手段４１…第１の電圧発生部４２…第２の電圧発生部４３…電圧重畳部４３ａ…加算器５…基板６１、６３…レジスト膜６２…層６４、６７…フラックス膜６５…半田ボール６６…半田７…制御部９…プロジェクター９１…光源装置９１１…赤色光源装置９１２…青色光源装置９１３…緑色光源装置９２…ダイクロイックミラーＫ…固定ミラーＳ…スクリーン DESCRIPTION OF SYMBOLS 1 ... Mirror device 10 ... Optical scanner 11 ... Movable plate 110 ... Movable plate main body 12 ... Light reflection part 13a, 13b ... Shaft member 14 ... Frame-shaped member 15a, 15b ... Shaft member 16, 18 ... Support frame 17, 19 ... Holder 20, 20a, 20b ... Permanent magnet 200 ... Hard magnetic material 21, 21a, 21b ... Solder layer 22, 22a, 22b, 23, 23a, 23b ... Underlayer 221, 231 ... First layer 222, 232 ... Second layer 223 233 ... third layer 224, 225 ... protruded portion 226a, 226b, 226c, 226d ... slanted side 30 ... coil 40 ... voltage applying means 41 ... first voltage generator 42 ... second voltage generator 43 ... voltage superposition Part 43a ... Adder 5 ... Substrate 61, 63 ... Resist film 62 ... Layer 64, 67 ... Flux film 65 ... Solder ball 66 ... Solder 7 ... Control part 9 ... Projector 91 ... light source device 911 ... red light source device 912 ... blue light source device 913 ... green light source device 92 ... dichroic mirror K ... fixed mirror S ... screen

Claims

A movable portion including a light reflecting portion having light reflectivity and swingable about a first axis;
A first shaft member connected to an end of the movable portion in the direction along the first axis;
A magnet disposed in the movable portion, wherein one magnetic pole and the other magnetic pole are disposed across the first axis;
An underlayer provided on a surface different from the surface including the light reflecting portion of the movable portion,
The base layer and the magnet are joined by a solder layer composed of solder,
The underlayer includes a soft magnetic material, and the solder has higher wettability than the movable part,
The mirror device, wherein the base layer is formed in a first region where the movable part and the magnet overlap in a plan view of the movable part .

2. The mirror device according to claim 1, wherein the base layer includes a second region formed continuously from the first region in a plan view of the movable part.

The underlayer is composed of a laminate in which a first layer, a second layer, and a third layer made of different materials are laminated in this order from the side opposite to the solder layer,
The first layer has a function of improving the adhesion between the movable part and the second layer,
The second layer is composed of the soft magnetic material,
It said third layer mirror device according to claim 1 or 2 has a function of improving the solder wettability.

The constituent material of the first layer includes at least one of Cr, Ti and Ta,
The constituent material of the second layer includes Ni,
The mirror device according to claim 3 , wherein the constituent material of the third layer includes at least one of Au and Pd.

Wherein interposed between the magnet and the solder layer, a mirror device according to any one of claims 1 to 4 having a magnet-side undercoat layer is high the solder wettability than the magnet.

The mirror device according to claim 5 , wherein the magnet-side underlayer is provided on a surface of the magnet on the movable part side.

The mirror device according to claim 5 or 6 , wherein the magnet-side underlayer is provided on a side surface of the magnet.

In the plan view of the movable part, the underlying layer, the provided Oite the second region in the direction of a line connecting both poles of the magnet is formed, the direction of the line segment from the magnet of the underlying layer in the length in the direction perpendicular to the line segment at the site which is formed in the second region, toward the direction away from the magnet along the line, increasing to have claim 2 8. The mirror device according to any one of 7 to 7 .

In the plan view of the movable part, the underlying layer, the second region is a mirror device according to any one of claims 1 to 8 is formed surrounding the first region.

The movable part is a frame-shaped member,
A movable plate provided inside the frame-shaped member, provided with the light reflecting portion, and swingable around a second axis perpendicular to the first axis;
A second shaft member connected to the end of the movable plate in the direction along the second axis, and connecting the movable plate and the frame-shaped member;
The first shaft member is connected to an end of the frame-shaped member in the direction along the first axis so that the frame-shaped member can swing around the first axis. mirror device according to a any one of claims 1 to 9.

A pair of the magnets are arranged on the frame-shaped member, and each of the pair of magnets has a line segment connecting both poles of the magnets, the axis of the first shaft member and the axis of the second shaft member. Are arranged to be inclined with respect to each other,
A pair of the solder layers are arranged, and the pair of solder layers are interposed between the frame-shaped member and the pair of magnets to join the frame-shaped member and the pair of magnets. And
A pair of the underlayers are disposed, and each of the pair of underlayers has higher wettability of the solder than the frame-shaped member, and is interposed between the frame-shaped member and the pair of solder layers. The mirror device according to claim 10 .

A light reflection part having light reflectivity, and a movable part swingable around an axis;
A shaft member connected to an end of the movable portion in the direction along the axis;
A magnet device disposed on the movable part, the magnet having one magnetic pole and the other magnetic pole disposed with the axis interposed therebetween,
The movable part has a solder wettability higher than that of the movable part, includes a soft magnetic material, and can be formed in a first region where the movable part and the magnet overlap in a plan view of the movable part. Forming, and
Placing solder on the underlayer;
The solder is melted, and in a plan view of the movable part, the base layer is formed in a first region where the movable part and the magnet overlap , and at least a part of the base layer includes the first region, A step of joining the magnet or the magnet before magnetization to the base layer with a solder layer so as to form a second region continuously with the first region . Production method.

13. The method of manufacturing a mirror device according to claim 12 , wherein after the base layer is formed at a predetermined position of the substrate, the substrate is processed into a predetermined shape to form the movable portion and the shaft member.

A light reflection part having light reflectivity, and a movable part swingable around an axis;
A shaft member connected to both ends of the movable portion in the direction along the axis;
A magnet disposed in the movable portion, wherein one magnetic pole and the other magnetic pole are disposed across the axis;
A solder layer composed of solder, joining the movable part and the magnet interposed between the movable part and the magnet;
Intervening between the movable part and the solder layer, the wettability of the solder is higher than the movable part, and an underlayer containing a soft magnetic material,
A coil disposed opposite to the movable part and generating a magnetic field acting on the magnet by application of a voltage;
Voltage application means for applying a voltage to the coil,
In a plan view of the movable part, the base layer is formed in a first region where the movable part and the magnet overlap with each other , and at least a part of the base layer is continuous with the first region in a second region. An area is formed ,
An optical scanner configured to swing the movable portion around the axis at the predetermined frequency by applying a voltage of a predetermined frequency to the coil by the voltage applying means.

A light source that emits light;
An optical scanner that scans the light from the light source,
The optical scanner includes a light reflecting portion having light reflectivity, and a movable portion that can swing around an axis;
A shaft member connected to both ends of the movable portion in the direction along the axis;
A magnet disposed in the movable portion, wherein one magnetic pole and the other magnetic pole are disposed across the axis;
A solder layer composed of solder, joining the movable part and the magnet interposed between the movable part and the magnet;
Intervening between the movable part and the solder layer, the wettability of the solder is higher than the movable part, and an underlayer containing a soft magnetic material,
A coil disposed opposite to the movable part and generating a magnetic field acting on the magnet by application of a voltage;
Voltage application means for applying a voltage to the coil,
In a plan view of the movable part, the base layer is formed in a first region where the movable part and the magnet overlap , and at least a part of the base layer is the first region and the first region. Is formed continuously in the area adjacent to
An image forming apparatus configured to swing the movable portion around the axis at the predetermined frequency by applying a voltage of a predetermined frequency to the coil by the voltage applying unit.