JP2013105115A - Lens holder mechanism, electronic device analyzer and solid immersion lens controlling method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lens holder mechanism, an electronic device analyzer and a solid immersion lens controlling method, which enable the movement of a solid immersion lens to be performed smoothly and the adhesion of the solid immersion lens with an observation object to be increased.SOLUTION: An electronic device analyzer 100 has a solid immersion lens 101 for detecting light emitted by an electronic device, a magnet 112 attached to the solid immersion lens, an electric magnet 114 to adjust a magnet position by magnetic force, a sensor 115 for detecting a magnet displacement, and a control circuit for controlling the magnetic force and position of the electric magnet according to information from the sensor.

Description

  The present invention relates to a lens holder mechanism applicable in a microscope or the like. The present invention also relates to an electronic apparatus analyzing apparatus having the lens holder mechanism. Furthermore, the present invention relates to a method for controlling a solid immersion lens in a microscope or the like.

  In an analysis apparatus for an electronic device that identifies a failure location of an electronic device such as a semiconductor device, the failure location is identified by detecting an abnormal signal generated by the electronic device during operation, for example, light (see, for example, Non-Patent Document 1). ).

  In semiconductor devices, the number of wiring layers is increasing, and abnormal signals are often shielded by upper-layer wiring and cannot be detected by measurement from the wiring side (surface). In order to avoid this, an abnormal signal is usually measured from the semiconductor substrate side (back surface). In this case, an abnormal signal transmitted through a silicon (Si) layer having a thickness of 0.1 mm or more is observed, but visible light cannot be used because silicon does not transmit light in the wavelength region of visible light. Therefore, for observation and measurement from the back surface of the semiconductor device, light having a wavelength in the infrared region that can transmit silicon is used. However, since the optical resolution is determined by the wavelength of light, the resolution is lowered in the observation using infrared rays having a wavelength longer than that of visible light. In particular, the refractive index of silicon is about 3.5, whereas the refractive index of air is about 1. Therefore, when observation is performed in a state where air is interposed between the lens and the analysis target, the resolution is further increased. The circuit shape of the minimum size cannot be confirmed, and the source of the detected abnormal signal cannot be specified as a single candidate.

  Therefore, for example, in the analysis of a semiconductor device, the resolution with respect to infrared rays is increased by bringing a hemispherical lens having a refractive index close to that of silicon in the infrared wavelength region into contact with the analysis target (see, for example, Patent Document 1). . This lens is generally called a solid immersion lens or a solid immersion lens (SIL).

  In the observation system described in Patent Document 1, a numerical aperture increasing lens (NAIL) corresponding to a solid immersion lens is placed over the specimen. Light from the object in the substrate passes through the NAIL and then through the objective lens and exit lens of the microscope system into a video camera or the like.

  In the emission microscope described in Non-Patent Document 2, the solid immersion lens and the objective lens are integrally configured.

  In the semiconductor device described in Patent Document 2, an integrated circuit is formed on the surface of a semiconductor substrate, and a hemispherical protrusion is formed integrally with the semiconductor substrate on a part of the back surface of the semiconductor substrate.

  The solid immersion lens holder described in Patent Document 3 is a solid immersion lens holder that holds a solid immersion lens arranged on the front side of the objective lens, and holds the lens in a free state without fixing the solid immersion lens. The holder main body which has a part and the vibration generation part which vibrates a holder main body are provided.

Special table 2003-502705 gazette JP 2002-189000 A JP 2009-3133

PHEMOS Series General Catalog Emission Microscope PHEMOS Series, [online], Hamamatsu Photonics Co., Ltd., [October 17, 2011 Search], Internet <http://jp.hamamatsu.com/resources/products/sys/pdf/jpn /phemos.pdf> Photograph of “Standard Solid Invasion Lens (SIL)” in “Meridian” product introduction, [online], DCG Systems, Inc., [October 17, 2011 search], Internet <URL: http: // www. dcgsystems.co.jp/products/meridian/〉

  The following analysis is given from the perspective of the present invention.

  In a semiconductor device analysis apparatus, as a method for mounting a solid immersion lens, first, as described in Non-Patent Document 2, a method for integrally forming a solid immersion lens and an objective lens, second, A method of placing a solid immersion lens on an object to be analyzed as described in Patent Document 1 and a method of forming a solid immersion lens directly on the back surface of a semiconductor substrate as described in Patent Document 2 are known. It has been.

  FIG. 9 shows a schematic cross-sectional view of the background art when the solid immersion lens and the objective lens are integrally formed. The electronic device 920 to be observed is electrically connected to the socket 903 and fixed by the cover 904. The cover 904 presses the outer peripheral portion of the electronic device 920 in order to electrically connect or fix the electronic device 920 such as QFP (Quad Flat Package) or FCBGA (Flip Chip Ball Grid Array) to the socket 903, for example. In addition to having such a shape, an opening 904a for securing an observation location is provided. Further, when the cover 904 is screwed to the socket 903, the cover 904 needs to have a certain height (thickness). On the other hand, when the solid immersion lens and the objective lens are integrated, the lens 902 has a conical shape (conical frustum shape) having a tapered surface. In this case, the lens 902 cannot be inserted into the opening 904a and comes into contact with the cover 904. Then, the solid immersion lens of the lens 902 cannot contact the electronic element 921 of the electronic device 920. Even if contact can be made, the movement of the lens 902 in the lateral direction is obstructed by the cover 904. Also in the solid immersion lens holder described in Patent Document 3, there is a possibility that the lens holding portion cannot be inserted into the opening 904a of the cover 904, or the solid immersion lens is moved to a desired position by contact between the cover 904 and the lens holding portion. There is a possibility that it cannot be made.

  In the method of placing the solid immersion lens on the observation target, means for moving the solid immersion lens simply and quickly is required. Further, in an inverted type analysis apparatus in which the solid immersion lens is positioned below the analysis target as shown in FIG. 10, the adhesion between the solid immersion lens 901 and the electronic element 921 is weakened due to the influence of gravity. In this case, focusing cannot be performed, and high-resolution analysis cannot be realized.

  When the solid immersion lens is directly formed on the semiconductor substrate, the processing cost is high.

  According to the first aspect of the present invention, a magnet attached to a solid immersion lens for detecting light emitted from an observation object, an electromagnet that adjusts the position of the magnet by magnetic force, a sensor that detects the displacement of the magnet, and a sensor And a control circuit for controlling the magnetic force and position of the electromagnet according to the information from the lens holder mechanism.

  According to a second aspect of the present invention, a solid immersion lens for detecting light emitted by an electronic device, a magnet attached to the solid immersion lens, an electromagnet for adjusting the position of the magnet by magnetic force, and detecting a displacement of the magnet There is provided an analysis device for an electronic device, which includes a sensor that performs a control, and a control circuit that controls a magnetic force and a position of an electromagnet according to information from the sensor.

  According to a third aspect of the present invention, there is provided a solid immersion lens control method including a step of controlling the position of the solid immersion lens by moving a magnet attached to the solid immersion lens by the magnetic force of an electromagnet.

  The present invention has at least one of the following effects.

  In the present invention, the movement of the solid immersion lens is controlled by the magnetic force. Thereby, it can prevent that the contact and movement of a solid immersion lens are obstructed by the physical contact with a cover.

  In the present invention, the position of the solid immersion lens is controlled by the electromagnet. As a result, the adhesion between the solid immersion lens and the observation target can be improved by adjusting the magnetic force of the electromagnet, so even when applied to an inverted analyzer or when observing the peripheral edge of an electronic element, Resolution analysis can be realized.

  In the present invention, for example, it is not necessary to process a semiconductor substrate into a solid immersion lens shape. Therefore, the cost can be kept lower than when a solid immersion lens is formed on the back surface of the semiconductor substrate.

1 is a schematic cross-sectional view of an electronic device analysis apparatus according to a first embodiment of the present invention. The schematic plan view which shows an example of the positional relationship of a solid immersion lens, an objective lens, a magnet, an electromagnet, and a 1st sensor. The schematic block diagram of a lens holder mechanism. The schematic sectional drawing of the solid immersion lens accommodated in the magnet. The schematic plan view for demonstrating how to wind the coil of an electromagnet. The flowchart for demonstrating the control method of a solid immersion lens. The schematic sectional drawing of the analyzer of the electronic device concerning a 2nd embodiment of the present invention. The schematic sectional drawing for demonstrating the control method of the solid immersion lens which concerns on 3rd Embodiment. The schematic sectional drawing for demonstrating the problem of background art. The schematic sectional drawing for demonstrating the problem of background art.

  The preferable form of each said viewpoint is described below.

  According to the preferable form of the first aspect, the magnet is magnetically supported by the magnetic force of the electromagnet together with the solid immersion lens.

  According to the preferable form of the first viewpoint, the magnet and the electromagnet are arranged on the same side with respect to the observation target.

  According to the preferable form of the first viewpoint, the magnet is arranged on one side with respect to the observation object. The electromagnet is arranged on the other side opposite to the one side with respect to the observation target.

  According to the preferable form of the second viewpoint, the solid immersion lens and the magnet can be magnetically supported by the magnetic force of the electromagnet.

  According to a preferred embodiment of the second aspect, the electronic apparatus analyzing apparatus further includes an objective lens that receives light from the solid immersion lens. The magnet is attached at a position that does not block the optical path from the solid immersion lens to the objective lens.

  According to the preferable form of the second viewpoint, the magnet is provided in a range of 30 ° or less from the center of the contact surface with the electronic device of the solid immersion lens with respect to the contact surface.

  According to the preferable form of the second viewpoint, the magnet has a cylindrical shape. The solid immersion lens is inserted in the cylinder of the magnet.

  According to the preferable form of the second viewpoint, at least a part of the magnet is composed of a neodymium magnet.

  According to a preferred embodiment of the second aspect, the electronic device analysis device further includes a socket for electrically connecting the electronic device and a cover for fixing the electronic device to the socket. The solid immersion lens and the magnet are disposed in the cover.

  According to the preferable form of the second viewpoint, the electromagnet is arranged on the solid immersion lens side with respect to the electronic device.

  According to the preferable form of the second viewpoint, the electromagnet is arranged outside the cover.

  According to a preferred form of the second aspect, the electromagnet has a cylindrical shape. An objective lens that receives light from the solid immersion lens is disposed in the cylinder of the electromagnet.

  According to a preferred form of the second viewpoint, the sensor includes a first Hall element that detects a displacement of the magnet in the first direction and a second Hall element that detects a displacement of the magnet in the second direction. The first Hall element is disposed in the cover. The second hall element is arranged outside the cover.

  According to a preferred form of the second aspect, the electromagnet is arranged on the opposite side of the solid immersion lens with respect to the electronic device.

  According to a preferred form of the second aspect, the sensor is disposed on the opposite side of the solid immersion lens with respect to the electronic device.

  According to the preferred form of the third viewpoint, the position of the solid immersion lens is also controlled by moving the electromagnet.

  According to a preferred embodiment of the third aspect, the solid immersion lens control method further includes a step of detecting displacement of the magnet by a sensor. The position of the solid immersion lens is controlled based on the information acquired by the sensor.

  According to the preferable form of the third viewpoint, the electromagnet moves the solid immersion lens from the same side as the solid immersion lens with respect to the observation target by using the repulsive force with the magnet.

  According to the preferable form of the third viewpoint, the electromagnet moves the solid immersion lens from the side opposite to the solid immersion lens with respect to the observation target by using the attractive force with the magnet.

  According to a preferred mode of the third aspect, the method for controlling the solid immersion lens further includes the step of bringing the solid immersion lens and the observation object into close contact with each other by increasing the magnetic force of the electromagnet after moving the solid immersion lens.

  According to a preferred embodiment of the third aspect, the solid immersion lens control method includes a step of supplying an adhesive between the solid immersion lens and the observation target, and a step of fixing the solid immersion lens to the observation target with the adhesive. And further including.

  According to a preferred form of the third aspect, the adhesive has transparency to the light to be observed and has a refractive index of 3-4.

  An electronic apparatus analysis device and a lens holder mechanism according to a first embodiment of the present invention will be described. FIG. 1 is a schematic cross-sectional view of an electronic apparatus analyzing apparatus according to the first embodiment of the present invention. When the electronic device 121 mounted on the electronic device 120 has a failure, the analysis device 100 of the electronic device can detect light emitted from the failure portion and identify the failure portion. Examples of the electronic device 120 to be analyzed include a semiconductor device having a semiconductor chip as the electronic element 121.

  The solid immersion lens 101 uses a material that is transparent to the light to be observed. The solid immersion lens 101 preferably has a refractive index close to that of the electronic element 121. When the electronic element 121 is a semiconductor chip, silicon, gallium arsenide, or the like can be used as the material of the solid immersion lens 101. Further, the solid immersion lens 101 can be made of, for example, zirconia or diamond as a material that is transparent to infrared rays and has a refractive index close to that of silicon.

  The electronic apparatus analyzing apparatus 100 is electrically connected to a solid immersion lens 101 for measuring a signal emitted from the electronic apparatus 120, an objective lens 102 that receives light from the solid immersion lens 101, and a test substrate (not shown). A socket 103 for electrically connecting the electronic device 120 and the test board, a cover 104 for fixing the electronic device 120 to the socket 103, and a lens holder mechanism 110 for holding the solid immersion lens 101. Prepare. In the form shown in FIG. 1, the solid immersion lens 101 and the lens holder mechanism 110 are arranged on the substrate side (back side) of the electronic element 121.

  FIG. 2 shows a schematic plan view of some elements in the analysis device of the electronic device. FIG. 3 shows a schematic block diagram of the lens holder mechanism. The lens holder mechanism 110 includes a magnet 112 attached to the solid immersion lens 101, a first sensor 115 that detects the horizontal displacement and speed of the magnet 112, and a second sensor that detects the vertical displacement and speed of the magnet 112. 116 and the magnet 112 can be applied with attraction and repulsion, and at least based on the information from the electromagnet 114 movable in the horizontal direction and the information from the first sensor 115 and the second sensor 116, the magnetic force of the electromagnet 114 can be reduced. A control circuit 117 for controlling strength and direction. For example, the solid immersion lens 101 and the magnet 112 are bonded by a bonding agent 113 such as an adhesive.

  In this document, the horizontal direction means a direction along the surface of the electronic device 120 (a direction perpendicular to the optical axis of the analysis device 100; a left-right direction in FIG. 1). Further, the vertical direction means a direction perpendicular to the surface of the electronic device 120 (the optical axis direction of the analysis device 100; the vertical direction in FIG. 1).

  The magnet 112 is attached to the solid immersion lens 101 so as not to block the optical path from the solid immersion lens 101 to the objective lens 102. Further, the magnet 112 is attached to the solid immersion lens 101 so as not to inhibit the close contact between the solid immersion lens 101 and the electronic device 120. For example, the magnet 112 can have a cylindrical shape. In this case, the solid immersion lens 101 can be accommodated in the cylinder. FIG. 4 shows a schematic cross-sectional view of the solid immersion lens 101 in which the magnet 112 has a cylindrical shape and is accommodated in the cylinder. For example, the magnet 112 can have a ring shape with an outer diameter of 1.5 mm and an inner diameter of 1 mm. The magnet 112 has a height H that does not block light from the solid immersion lens 101 to the objective lens 102. For example, the height H of the cylinder is set such that an opening angle α from the center of the contact surface 101a with the observation target of the solid immersion lens 101 can be secured 120 ° or more. That is, it is preferable that the magnet 112 exists in a range where the angle β with respect to the contact surface 101a from the center of the contact surface 101a with the observation target of the solid immersion lens 101 is 30 ° or less. At this time, assuming that the solid immersion lens 101 is a part of a sphere and its radius is r, the height H is preferably not more than (r × tan β). For example, when the solid immersion lens 101 is a hemisphere and the diameter of the sphere is 1 mm, the height H of the magnet 112 is preferably 0.28 mm or less. In the form shown in FIGS. 1 to 4, the magnet 112 is directly joined to the solid immersion lens 101, but the magnet 112 may be indirectly joined to the solid immersion lens 101. For example, the magnet 112 may be contained in a resin that houses the solid immersion lens 101.

  The magnet 112 has a magnetic force whose position can be controlled by an attractive force and a repulsive force (repulsive force) with the electromagnet 114. For example, a neodymium magnet can be used as the magnet 112. Accordingly, the magnet 112 and the solid immersion lens 101 can be magnetically supported by the electromagnet 114 without physical (mechanical) support.

  The electromagnet 114 controls the position of the solid immersion lens 101 by controlling the position of the magnet 112 by adjusting the strength and direction of the magnetic force. The electromagnet 114 is arranged so that the magnet 112 and the solid immersion lens 101 can be controlled by the magnetic force, and light from the solid immersion lens 101 to the objective lens 102 is not shielded. For example, the electromagnet 114 can have a cylindrical shape. When the electromagnet 114 has a cylindrical shape, the objective lens 102 is preferably disposed within the cylinder of the electromagnet 114. In the case of an inverted microscope as shown in FIG. 1, the objective lens 102 exists below the cylinder of the electromagnet 114.

  The electromagnet 114 is configured to be movable at least in the horizontal direction so that the magnet 112 and the solid immersion lens 101 can be moved in the horizontal direction by the magnetic force. The electromagnet 114 may be configured to be movable in a vertical direction or an oblique direction. When the electromagnet 114 moves, the electromagnet 114 and the objective lens 102 are prevented from contacting each other. For example, when the shape of the electromagnet 114 is cylindrical and the objective lens 102 is disposed in the cylinder of the electromagnet 114, the inner diameter of the cylinder of the electromagnet 114 is set to 7 cm or more in order to prevent interference with the objective lens 102. preferable.

  FIG. 5 is a schematic plan view for explaining how to wind the coil of the electromagnet 114. The electromagnet 114 makes the direction connecting the magnetic poles at both ends perpendicular to the electronic device 120 so that the magnet 112 can be moved closer to or away from the electronic device 120 by the magnetic force of the electromagnet 114. That is, the coil of the electromagnet 114 is wound so that the magnet 112 can be moved in the vertical direction. For example, when the electromagnet 114 is cylindrical, it is preferable that the hole (opening) faces the solid immersion lens 101 and the coil is wound along the outer peripheral direction of the cylinder.

  When the first sensor 115 and the second sensor 116 detect the displacement and speed of the magnet 112, the displacement of the solid immersion lens 101 is grasped. As the first sensor 115 and the second sensor 116, for example, a Hall element can be used. In the case of using a hall element, the first sensor 115 preferably has at least two hall elements. The first sensor 115 can be configured to be movable together with the magnet 112, but it is preferable that the position of the first sensor 115 be fixed in order to prevent contact with the cover 104.

  The control circuit 117 is connected to the electromagnet 114, the first sensor 115, and the second sensor 116. Based on the displacement and speed information of the magnet 112 detected by the first sensor 115 and the second sensor 116, the control circuit 117 moves the magnet 112 to a desired position, and the magnetic strength and direction of the electromagnet 114. And the position of the electromagnet 114 are controlled. Thereby, when the magnet 112 is moved to a desired position, the solid immersion lens 101 integrated with the magnet 112 can be moved to a desired position.

  The cover 104 fixes the electronic device 120 to the socket 103 and maintains an electrical connection between the electronic device 120 and the analysis device 100. The cover 104 covers the electronic device 120 and has an opening 104 a for conducting light from the electronic device 120. The solid immersion lens 101, the magnet 112, and the first sensor 115 are disposed in the cover 104. The objective lens 102, the electromagnet 114, and the second sensor 116 are disposed outside the cover 104. Light from the solid immersion lens 101 is conducted to the objective lens 102 through the opening 104 a of the cover 104. The cover 104 is preferably formed of a material that does not hinder the magnetic force between the electromagnet 114 and the magnet 112.

  Next, a method for controlling the solid immersion lens of the present invention will be described. FIG. 6 is a flowchart for explaining the method for controlling the solid immersion lens. First, the control circuit 117 adjusts the magnetic force of the electromagnet 114 to make the magnet 112 and the solid immersion lens 101 movable in the horizontal direction (S101). For example, a repulsive force with the electromagnet 114 is used to float the magnet 112 so that the contact surface 101 a of the solid immersion lens 101 is in light contact with the electronic element 121.

  Next, the control circuit 117 observes the solid immersion lens 101 using the repulsive force with the electromagnet 114 by moving the electromagnet 114 while detecting the magnet 112 with the first sensor 115 and the second sensor 116. Move to position (S102).

  Next, it is confirmed whether the solid immersion lens 101 is in an appropriate position (S103). For example, the pattern image after the movement of the solid immersion lens 101 is compared with the layout image of the location to be observed, the amount of displacement is calculated, and it is confirmed whether or not the observation location is displayed in the pattern image. The calculation of the positional deviation can be performed by automatic calculation, but the positional deviation may be confirmed visually. If the solid immersion lens 101 is not in an appropriate position, the solid immersion lens 101 is moved again (S102).

  When the solid immersion lens 101 is in an appropriate position, the control circuit 117 increases the repulsive force between the electromagnet 114 and the magnet 112 by increasing the current passed through the electromagnet 114. Thereby, the contact surface 101a of the solid immersion lens 101 can be brought into close contact with the electronic element 121, and the solid immersion lens 101 can be fixed to the electronic device 120 (S104).

  Next, the analysis apparatus 100 operates the electronic apparatus 120 and observes an abnormal signal from the electronic element 121 (S105).

  When the observation is completed, the control circuit 117 releases the fixation of the solid immersion lens 101 to the electronic device 120 (S106).

  Next, when measuring at another position, the steps from S102 are repeated. If measurement is not performed at another position, the observation is terminated.

  Thus, according to a further aspect of the present invention, the position of the solid immersion lens is controlled by moving the magnet attached to the solid immersion lens by the magnetic force of the electromagnet, for example, by observing abnormal signals. An analysis method is provided that includes the step of analyzing the device.

  According to the present invention, since the solid immersion lens is controlled by the magnetic force, it is possible to prevent the solid immersion lens or the objective lens from coming into contact with the cover and hindering the movement of the solid immersion lens. Further, by using magnetic force, the solid immersion lens can be firmly attached to the electronic element even in an inverted type analysis apparatus. In particular, good adhesion between the solid immersion lens and the electronic element can be obtained even at the periphery of the semiconductor chip with low flatness. Thereby, high resolution analysis can be realized. Furthermore, the cost can be kept lower than when a solid immersion lens is formed on the back surface of the semiconductor substrate.

  Next, an electronic apparatus analyzing apparatus and a lens holder mechanism according to a second embodiment of the present invention will be described. FIG. 7 is a schematic cross-sectional view of an electronic apparatus analyzing apparatus according to the second embodiment of the present invention. In FIG. 7, the same elements as those in the first embodiment are denoted by the same reference numerals. The elements included in the analysis device 200 of the electronic device are the same as the elements included in the analysis device according to the first embodiment. In the first embodiment, the electromagnet and the sensor are disposed on the same side as the solid immersion lens with respect to the electronic device. However, in the second embodiment, the electromagnet 114 and the sensor 115 are disposed on the electronic device 120. It is arranged on the side opposite to the solid immersion lens 101, that is, on the wiring side (surface side) of the electronic element 121. In the second embodiment, since the shape of the electromagnet 114 is not on the optical path, the shape is not limited to a cylindrical shape, and for example, a columnar shape or the like can be adopted. Thereby, the volume which the electromagnet 114 occupies can be reduced.

  The sensor 115 can be disposed between the electromagnet 114 and the solid immersion lens 101, for example. The sensor 115 is preferably configured to be movable in the same direction and at the same speed as the electromagnet 114 in accordance with the movement of the electromagnet 114. In particular, the sensor 115 is preferably disposed on the central axis of the electromagnet 114. As a result, the distance between the sensor 115 and the electromagnet 114 can be kept constant. Particularly, when the sensor 115 is arranged on the central axis of the electromagnet 114, the influence of the magnetic field from the electromagnet 114 can be caused to occur, and the solid immersion lens 101 The accuracy of position control can be improved.

  In the control method of the solid immersion lens 101, the repulsive force of the electromagnet 114 and the magnet 112 is used in the first embodiment, but the attractive force of the electromagnet 114 and the magnet 112 is used in the second embodiment. Other methods are the same as those in the first embodiment.

  Other aspects of the second embodiment are the same as those of the first embodiment.

  According to the second embodiment, since there is no need to consider contact between the electromagnet and the objective lens, the degree of freedom of movement of the electromagnet can be increased. In addition, the solid immersion lens can be easily moved to the periphery of the electronic element. Furthermore, since the position control of the solid immersion lens can be performed with high accuracy, the movement of the solid immersion lens can be facilitated.

  Next, a solid immersion lens control method according to a third embodiment of the present invention will be described. FIG. 8 is a schematic cross-sectional view for explaining the control method for the solid immersion lens according to the third embodiment of the present invention. FIG. 8 shows an example of an analysis apparatus and a lens holder mechanism according to the second embodiment.

  In the third embodiment, the fault location is observed in a state where the solid immersion lens 101 and the electronic device 120 are bonded with the adhesive 301. The adhesive 301 is preferably a material having a high transmittance with respect to light to be observed and a refractive index equivalent to that of the electronic element 121, for example, silicon, for example, 3 to 4, at the time of curing. For example, an ultraviolet curable acrylic resin adhesive can be used as the adhesive 301.

  First, the location to be observed is specified in advance by using, for example, an infrared microscope. Next, the adhesive 301 is applied to at least a portion to be observed. The adhesive 301 may be applied over a wide range including the part to be observed. Next, as in the first embodiment, the solid immersion lens 101 is moved to the observation location, and the solid immersion lens 101 is fixed to the electronic device 120 via the adhesive 301. Next, the adhesive 301 is cured. The lens holder mechanism 110 can fix the solid immersion lens 101 at a desired position until the adhesive 301 is cured. Next, the fault location is observed with the solid immersion lens 101 fixed with the adhesive 301.

  According to the third embodiment, the solid immersion lens can be used as a marker, and the failure location can be specified at low cost. For example, as a means to identify the location of abnormal signal generation, first identify the location of the abnormal signal generation with a macro lens with low resolution but high detection sensitivity of the abnormal signal, and then observe while gradually increasing the magnification of the lens. However, there is a method of narrowing down the failure location by observation with a lens with the highest resolution. In order to implement this method, it is necessary to automatically replace multiple lenses and implement a system that enables observation of the same coordinates even if lenses are replaced. The position control function at the time also needs to be highly functional, which contributes to the high price of the analysis device. However, according to the third embodiment, it is possible to specify a failure location without using an expensive lens turret with high position reproducibility.

  Although FIG. 8 shows the analysis apparatus and the lens holder mechanism according to the second embodiment, the solid immersion lens control method according to the third embodiment even in the case of the analysis apparatus and the lens holder mechanism according to the first embodiment. Can be applied.

  Other aspects of the third embodiment are the same as in the first embodiment.

  In the above description, an inverted microscope that observes the analysis target from below is taken as an example, but the present invention can be applied to an upright microscope that observes the analysis target from above.

  In the above description, an example of observation from the substrate side (back side) of the electronic element has been shown, but the present invention can also be applied to the case of observation from the wiring side (front side) of the electronic element.

  The lens holder mechanism, the electronic apparatus analysis device, and the solid immersion lens control method of the present invention have been described based on the above embodiment, but are not limited to the above embodiment, and within the scope of the present invention, Based on the basic technical idea of the present invention, various modifications, changes and improvements can be made to various disclosed elements (including each element of each claim, each element of each embodiment, each element of each drawing, etc.). It goes without saying that it can be included. Further, within the scope of the claims of the present invention, various combinations, substitutions or selections of various disclosed elements (including each element of each claim, each element of each embodiment, each element of each drawing, etc.) are possible. Is possible.

  Further problems, objects, and developments of the present invention will become apparent from the entire disclosure of the present invention including the claims.

DESCRIPTION OF SYMBOLS 100 Analysis apparatus of electronic device 101 Solid immersion lens 101a Contact surface 102 Objective lens 103 Socket 104 Cover 104a Opening 110 Lens holder mechanism 112 Magnet 113 Bonding material 114 Electromagnet 115 First sensor 116 Second sensor 117 Control circuit 120 Electronic device 121 Electronic element 301 Adhesive 901 Solid immersion lens 902 Lens 903 Socket 904 Cover 904a Opening 920 Electronic device 921 Electronic element

Claims (5)

A magnet attached to a solid immersion lens for detecting light emitted by an observation target;
An electromagnet for adjusting the position of the magnet by magnetic force;
A sensor for detecting the displacement of the magnet;
And a control circuit that controls the magnetic force and position of the electromagnet according to information from the sensor. A solid immersion lens for detecting light emitted by the electronic device;
A magnet attached to the solid immersion lens;
An electromagnet for adjusting the position of the magnet by magnetic force;
A sensor for detecting the displacement of the magnet;
And a control circuit for controlling the magnetic force and position of the electromagnet according to information from the sensor.   3. The electronic apparatus analyzing apparatus according to claim 2, wherein the solid immersion lens and the magnet can be magnetically supported by a magnetic force generated by the electromagnet. A socket for electrically connecting an electronic device;
A cover for fixing the electronic device to the socket;
4. The electronic apparatus analyzing apparatus according to claim 2, wherein the solid immersion lens and the magnet are disposed in the cover.   A method for controlling a solid immersion lens, comprising the step of controlling a position of the solid immersion lens by moving a magnet attached to the solid immersion lens by a magnetic force of an electromagnet.

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