JP2013104869A - Resin cure shrinkage measuring instrument - Google Patents

Resin cure shrinkage measuring instrument Download PDF

Info

Publication number
JP2013104869A
JP2013104869A JP2011262919A JP2011262919A JP2013104869A JP 2013104869 A JP2013104869 A JP 2013104869A JP 2011262919 A JP2011262919 A JP 2011262919A JP 2011262919 A JP2011262919 A JP 2011262919A JP 2013104869 A JP2013104869 A JP 2013104869A
Authority
JP
Japan
Prior art keywords
resin
shrinkage
curing
cured
volume
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011262919A
Other languages
Japanese (ja)
Other versions
JP5848109B2 (en
Inventor
Kenichi Nakamune
憲一 中宗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SENTEKKU KK
Sentec Co Ltd Japan
Original Assignee
SENTEKKU KK
Sentec Co Ltd Japan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SENTEKKU KK, Sentec Co Ltd Japan filed Critical SENTEKKU KK
Priority to JP2011262919A priority Critical patent/JP5848109B2/en
Publication of JP2013104869A publication Critical patent/JP2013104869A/en
Application granted granted Critical
Publication of JP5848109B2 publication Critical patent/JP5848109B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Length Measuring Devices By Optical Means (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

PROBLEM TO BE SOLVED: To solve such a problem that resin shrinkage due to resin curing causes troubles such as slippage and distortion of adhesive members, one-side detachment, and adhesion failure, and even a small shrinkage, when fixing a precision component and an optical component, may lead to slippage of an optical axis to cause a trouble.SOLUTION: The resin cure shrinkage measuring instrument, while curing an adhesive resin, measures the shrinkage thereof and obtains a shrinkage ratio of the resin. When the shrinkage ratio is obtained, it becomes possible to design the component arrangement, with the resin shrinkage previously taken into account. Further, the shrinkage ratio may become basic data in inferring a cause so as to shorten a time for dissolving the trouble.

Description

本発明は、接着剤、コーテング剤など樹脂を塗布した後、紫外線照射や光線照射、加熱などを行い樹脂を硬化させる時、樹脂の体積が減少するため、この硬化収縮を測定するものである。硬化後の樹脂の体積が予測できると、その収縮を加味した製品設計が出来るので、収縮後目標位置に部材を配置させ正常な製品を作ることを可能とする硬化収縮測定装置を提供するものである。  In the present invention, when a resin such as an adhesive or a coating agent is applied, and then the resin is cured by ultraviolet irradiation, light irradiation, heating, or the like, the volume of the resin is decreased, and thus the curing shrinkage is measured. If the volume of the cured resin can be predicted, the product can be designed in consideration of the shrinkage. Therefore, a device for measuring the shrinkage of shrinkage that can make a normal product by placing a member at the target position after shrinkage is provided. is there.

電子部品や光学部品を固定する時、比較的硬化収縮が小さい紫外線硬化樹脂を使う。しかし、精密な製品を製作する時は、この樹脂硬化時に起こる樹脂の収縮が問題となる場合がある。硬化前と硬化後の樹脂の収縮率が把握できると、製品設計時にそれを加味して設計する事が出来るので、収縮率を測定する装置の要請が多く、本発明の装置製作となった。樹脂の収縮率測定は、紫外線硬化樹脂に限らず光反応樹脂や熱反応樹脂でも同じように測定可能で、用途が広い。When fixing electronic parts and optical parts, use UV curable resin with relatively small cure shrinkage. However, when manufacturing a precise product, the shrinkage of the resin that occurs when the resin is cured may be a problem. If the shrinkage rate of the resin before and after curing can be grasped, it can be designed in consideration of the product design, so there are many requests for an apparatus for measuring the shrinkage rate, and the device of the present invention has been manufactured. The measurement of resin shrinkage is not limited to ultraviolet curable resins, but can be similarly performed on photoreactive resins and heat-reactive resins, and has a wide range of applications.

フイルムの貼り合わせやコーテングに樹脂を塗布して硬化させる。樹脂部分の収縮率によりフイルムのカールや歪みが発生する現象が異なる。あらかじめ樹脂の収縮率を測定する事が出来れば、コーテング材の選定時に比較検討する事が出来る。また、コーテングするフイルムの厚さや腰を検討する事が出来る。或いはコーテングする樹脂の厚さを設定する上でも樹脂の収縮率をあらかじめ把握しておくと樹脂選定枝が広がる。Resin is applied to film lamination or coating and cured. The phenomenon of film curling and distortion varies depending on the shrinkage ratio of the resin part. If the shrinkage of the resin can be measured in advance, it can be compared when selecting the coating material. In addition, the thickness and waist of the film to be coated can be examined. Alternatively, when selecting the thickness of the resin to be coated, if the shrinkage rate of the resin is known in advance, the resin selection branch is expanded.

特開平08−011471「ICカードの基板用補強枠及びカード基板の製造方法並びにICカードの製造方法」Japanese Patent Application Laid-Open No. 08-011471 "IC Card Substrate Reinforcing Frame, Card Substrate Manufacturing Method, and IC Card Manufacturing Method" 特開平08−314126「感光性樹脂板の製版方法」Japanese Patent Application Laid-Open No. 08-314126 "Method for making a photosensitive resin plate"

接着やコーテングをする時、一液性硬化樹脂、二液性硬化樹脂、紫外線硬化樹脂、光反応樹脂など殆どの樹脂は未硬化時に比べ硬化後は収縮をする。樹脂硬化に伴う樹脂の収縮は、接着部材のずれ、ゆがみ、外れ、接着不良等の不具合が発生する原因となる。When bonding or coating, most resins such as one-component curable resins, two-component curable resins, ultraviolet curable resins, and photoreactive resins shrink after curing compared to uncured. The shrinkage of the resin accompanying the curing of the resin causes problems such as displacement, distortion, detachment and poor adhesion of the adhesive member.

比較的収縮が少ないとされる紫外線硬化樹脂においても、多少の収縮が見られる。精密部品や光学部品の固定には小さな収縮率でも、光軸のずれなどが起りトラブルの原因となっている。Some shrinkage is also seen in the UV curable resin, which is said to have relatively little shrinkage. Even when the shrinkage rate is small for fixing precision parts and optical parts, the optical axis shifts and causes trouble.

紫外線硬化樹脂においては、作業性の簡便さと、短時間硬化による作業性向上で、ますます採用が増え、新しい樹脂が参入されるものの、それらの硬化収縮はメーカーにより、或いは品番により、それぞれの特質をもっているため、その数値化が必要であるが、現在は測定方法が難しく未整備である。With UV curable resins, the adoption of new resins is increasing due to the ease of workability and the improvement of workability by short-time curing, but their curing shrinkage is a characteristic of each manufacturer or by product number. Therefore, it is necessary to digitize it, but currently the measurement method is difficult and undeveloped.

接着用樹脂を硬化させながら、その収縮を測定することにより樹脂の収縮率を把握する。収縮率が把握できると、あらかじめ樹脂収縮を加味して部品配置の設計が可能となる。
また、原因を推察する上で参考となり、トラブル解消が短縮される。
The shrinkage rate of the resin is grasped by measuring the shrinkage while curing the adhesive resin. If the shrinkage rate can be grasped, it is possible to design the component arrangement taking into account the resin shrinkage in advance.
In addition, it is helpful in inferring the cause, and trouble resolution is shortened.

コーテングやラミネート時における樹脂の収縮は品質に大きな影響を与える。樹脂の収縮でカールや歪みが発生する、樹脂の持つ収縮率をあらかじめ把握しておくと、その対策を立てる事が容易となる。Resin shrinkage during coating and laminating greatly affects quality. If the shrinkage rate of the resin, which causes curling and distortion due to the shrinkage of the resin, is known in advance, it becomes easy to take countermeasures.

紫外線硬化樹脂には図−3に示す通り、底部から紫外線を照射して樹脂の硬化を促す、表面からはレーザーセンサーで距離を測定する。硬化前と硬化後の表面距離により樹脂全体の厚さが測定できる。As shown in FIG. 3, the ultraviolet curable resin is irradiated with ultraviolet rays from the bottom to promote the curing of the resin. From the surface, the distance is measured with a laser sensor. The thickness of the entire resin can be measured by the surface distance before and after curing.

硬化樹脂を入れる外枠はフッ素樹脂等接着し難い樹脂を使う、硬化樹脂は硬化時に収縮するので、外枠に接着すると周囲に引っ張られて正確な厚さや表面積を測定できない、フッ素樹脂外枠により、接着することなくフリーの状態で収縮するので、直径が測定でき、厚さと併せて表面積が測定できるため体積を算出する事が出来る。これにより硬化収縮の前後が数値化できる。The outer frame that contains the cured resin uses a resin that is difficult to adhere, such as fluororesin.The cured resin shrinks when cured, so if you adhere to the outer frame, it will be pulled around and you will not be able to measure the exact thickness or surface area. Since it shrinks in a free state without bonding, the diameter can be measured, and the surface area can be measured together with the thickness, so that the volume can be calculated. Thereby, before and after curing shrinkage can be quantified.

硬化樹脂の収縮が把握できる事で、部材の収まる位置が予測できる、この事であらかじめ設計時に樹脂硬化を計算して配置する事が出来る。樹脂により収縮率が変わるので,充分検証して仕様書を決める事が出来る。Since the shrinkage of the cured resin can be grasped, the position where the member is accommodated can be predicted. With this, the resin curing can be calculated and arranged in advance at the time of design. Since the shrinkage varies depending on the resin, the specifications can be determined after sufficient verification.

本発明の樹脂硬化収縮測定装置は光学機器や精密電子機器の部材固定用に使用する事で用途が広がる。従来樹脂の硬化収縮が解らないまま使用していて、原因不明の不具合が発生した時その対策は正確に数値化できなかったが、本発明の装置であらかじめ樹脂の変化を予測して設計をする事が出来るようになった。The resin curing shrinkage measuring apparatus of the present invention can be used for fixing members of optical equipment and precision electronic equipment. Conventionally, it has been used without knowing the cure shrinkage of the resin, and when a malfunction of unknown cause occurred, the countermeasure could not be accurately quantified, but design by predicting the change of the resin in advance with the device of the present invention I can do things.

フイルムのラミネートやコーテング時に起こるカールや歪みは、樹脂の硬化収縮による場合が多い、あらかじめ樹脂の硬化収縮率が判明していると、加工前にシュミレーションして問題を事前に把握する事が出来る。問題を予測して事前に対策を立てる事でトラブルを未然に防ぐ事が出来る。Curling and distortion that occur during film lamination and coating are often due to cure shrinkage of the resin. If the cure shrinkage rate of the resin is known in advance, the problem can be grasped in advance by simulation. It is possible to prevent problems by predicting problems and taking measures in advance.

図1は、光学部品の固定位置で樹脂硬化前の断面図Fig. 1 is a cross-sectional view of the optical component before fixing the resin 図2は、光学部品の固定位置で樹脂硬化後の断面図2 is a cross-sectional view of the optical component after the resin is cured at the fixed position. 図3は、樹脂硬化収縮測定装置の断面図3 is a cross-sectional view of a resin curing shrinkage measuring apparatus. 図4は、樹脂硬化前の(A)断面図と(B)平面図4A is a cross-sectional view before curing the resin, and FIG. 4B is a plan view. 図5は、樹脂硬化後の(A)断面図と(B)平面図5A is a cross-sectional view after curing the resin, and FIG. 5B is a plan view.

ガラス板上に設けられた外枠に内に樹脂(11)を投入する、硬化前の樹脂の厚さと表面積を測定しておく、ガラス板下部から紫外線(10)を照射して樹脂を硬化させる、樹脂の硬化後の厚さと表面積を測定すると硬化後の樹脂体積が判明する、この硬化前・後の体積比較で樹脂の収縮率を数値化して把握する事が出来る。  The resin (11) is put into the outer frame provided on the glass plate, the thickness and surface area of the resin before curing are measured, and the resin is cured by irradiating ultraviolet rays (10) from the bottom of the glass plate. By measuring the thickness and surface area of the resin after curing, the resin volume after curing can be determined. By comparing the volume before and after curing, the shrinkage ratio of the resin can be quantified and grasped.

ガラス表面に設ける外枠(12)はフッ素樹脂で製作する、樹脂が硬化する時周囲に接着して引っ張られ歪みや変形しないようにしておく、フッ素樹脂は接着しないため硬化樹脂の外周はフリーの状態になり均一な収縮樹脂を実現する事が出来る。The outer frame (12) provided on the glass surface is made of fluororesin. When the resin is cured, it is attached to the surroundings so that it is not pulled or deformed. The fluororesin does not adhere, so the outer periphery of the cured resin is free. It becomes a state and a uniform shrink resin can be realized.

ガラス板の下部から照射する紫外線照射部(9)はUV−LEDを使用する。UV−LEDはコンパクトで狭いスペースに設置出来る。また、発熱も少なく予備点灯も必要ないので、使用する瞬間に点灯する事が出来るため測定装置の取り扱いが簡単である。UV-LED is used for the ultraviolet irradiation part (9) irradiated from the lower part of a glass plate. UV-LED is compact and can be installed in a narrow space. In addition, since it generates little heat and does not require preliminary lighting, it can be lit at the moment it is used, so the measuring device is easy to handle.

紫外線照射のUV−LEDは365nmや385nmの単波長であり、オゾン発生の危険性も無く取り扱いが簡単である。このため、排気装置や遮光装置などの周辺装置が必要でなく、設置場所を選ばない。UV-irradiated UV-LEDs have a single wavelength of 365 nm or 385 nm and are easy to handle without risk of ozone generation. For this reason, peripheral devices, such as an exhaust apparatus and a light-shielding device, are unnecessary, and an installation place is not chosen.

図1は、光学部品の固定用に樹脂を塗布した状態で、樹脂は未硬化である。In FIG. 1, the resin is uncured in a state where the resin is applied for fixing the optical component.

図2は、光学部品を固定する時、樹脂を硬化させた状態である、樹脂の硬化収縮で一方に引っ張られ、光軸がずれている。FIG. 2 shows that when the optical component is fixed, the optical axis is shifted due to the resin being cured and contracted due to the curing shrinkage of the resin.

図3は、樹脂硬化収縮測定装置の全体図である。外枠内に樹脂を流し込み、下部のUV−LED(9)から紫外線を照射して樹脂を硬化させる。表面からレーザーセンサー(7)で距離と面積を測り樹脂の変化を測定し数値化する。FIG. 3 is an overall view of the resin curing shrinkage measuring apparatus. The resin is poured into the outer frame, and the resin is cured by irradiating ultraviolet rays from the lower UV-LED (9). The distance and area are measured with a laser sensor (7) from the surface, and the change in the resin is measured and digitized.

図4、図5は、紫外線硬化樹脂の硬化前(11)と硬化後(18)の体積変化の状態である。それぞれの表面積と厚さを測定すると体積が算出される。4 and 5 show the state of volume change before curing (11) and after curing (18) of the ultraviolet curable resin. When each surface area and thickness is measured, the volume is calculated.

表1、表2、表3、は(株)ケミテック製紫外線硬化樹脂の硬化収縮状態を測定したものである。硬化樹脂の構成により品番別に 硬化状態が変わる。遅いスピードで硬化するものや速く硬化するものもある。また、硬化終了時での収縮率もそれぞれ違って いる。この内容を把握することで、精密機器の部品固定を設計する事が出来る。  Table 1, Table 2, and Table 3 show the measured shrinkage of the UV curable resin manufactured by Chemtech. Depending on the configuration of the cured resin, the cured state varies depending on the product number. Some cure slowly and others cure faster. The shrinkage at the end of curing is also different. By grasping this content, it is possible to design the fixing of parts for precision equipment.

Figure 2013104869
Figure 2013104869
Figure 2013104869
Figure 2013104869
Figure 2013104869
Figure 2013104869

樹脂の硬化後の収縮が測定できる事は、紫外線硬化樹脂に限らず1液性硬化樹脂、2液性硬化樹脂、光反応性樹脂、熱反 応性樹脂など、あらゆる樹脂の硬化収縮が測定できる。この事は従来樹脂の収縮でトラブルがあった場合、経験値で対処して いたものが、数値化して対処出来るため、樹脂を硬化させるあらゆる用途で、より正確な対策が可能となる。The fact that the shrinkage after curing of the resin can be measured is not limited to the ultraviolet curable resin, but the cure shrinkage of any resin such as a one-component curable resin, a two-component curable resin, a photoreactive resin, and a thermo-responsive resin can be measured. This can be dealt with by quantifying what has been dealt with by empirical values when there is a problem with shrinkage of the resin in the past, so it becomes possible to take more accurate measures for every application to cure the resin.

1 レンズ
2 硬化前の樹脂
3 固定部
4 設計時の光軸
5 移動した光軸
6 硬化後の樹脂
7 レーザーセンサー
8 レーザー光で距離測定
9 UV−LED
10 紫外線照射
11 硬化前樹脂
12 フッ素樹脂外枠
13 紫外線透過ガラス板
14 硬化前の樹脂厚
15 硬化前の樹脂直径
16 硬化後の樹脂厚
17 硬化後の樹脂直径
16 硬化後の樹脂表面
19 測定器躯体
DESCRIPTION OF SYMBOLS 1 Lens 2 Resin before hardening 3 Fixed part 4 Optical axis 5 at the time of design 5 Moved optical axis 6 Resin after hardening 7 Laser sensor 8 Distance measurement with laser light 9 UV-LED
DESCRIPTION OF SYMBOLS 10 Ultraviolet irradiation 11 Resin before hardening 12 Fluorine resin outer frame 13 Ultraviolet transparent glass plate 14 Resin thickness before hardening 15 Resin diameter before hardening 16 Resin thickness after hardening 17 Resin diameter after hardening 16 Resin surface after hardening 19 Measuring instrument Body

Claims (3)

接着剤の硬化収縮を測定する装置であり、紫外線を透過させるガラス板上に紫外線硬化樹脂を置き、その上部に非接触で距離を測るレーザーセンサーを設け、ガラス板下部より紫外線を照射して樹脂を硬化させ、その表面と底部の距離を及び表面積を測定する事で、収縮状態が数値化できるようにした、樹脂硬化収縮測定装置。It is a device that measures the curing shrinkage of the adhesive. Place a UV curable resin on a glass plate that transmits UV light, and install a laser sensor that measures the distance in a non-contact manner on the glass plate. Is a resin curing shrinkage measuring device that can measure the shrinkage state by measuring the distance between the surface and the bottom and the surface area. ガラス板上に設ける硬化樹脂用外枠にはフッ素樹脂等接着し難い樹脂を使用して、樹脂が硬化する時外枠に接着して収縮と逆の力が発生し変形する事を防ぎながらフリーの状態で硬化樹脂の体積が測定可能な前記請求項1記載の樹脂硬化収縮測定装置。The outer frame for the cured resin provided on the glass plate is made of a resin that is difficult to adhere, such as fluororesin, and it adheres to the outer frame when the resin is cured and is free from deformation that is the opposite of shrinkage. The resin curing shrinkage measuring apparatus according to claim 1, wherein the volume of the cured resin can be measured in the state. 上部から測定するレーザーセンサーはガラス板表面と外枠内側を測定して、樹脂を投入した後未硬化の状態で樹脂の表面を測定体積を算出する、樹脂硬化後は樹脂の表面積と厚さを測る事で硬化後の樹脂体積を算出し硬化前後の体積を数値化できるようにした前記請求項1記載の樹脂硬化収縮測定装置。The laser sensor that measures from the top measures the surface of the glass plate and the inside of the outer frame, calculates the measured volume of the resin surface in an uncured state after charging the resin, and after curing the resin surface area and thickness The resin curing shrinkage measuring apparatus according to claim 1, wherein the resin volume after curing is calculated by measuring the volume before and after curing so that the volume before and after curing can be digitized.
JP2011262919A 2011-11-11 2011-11-11 Resin cure shrinkage measurement method Active JP5848109B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011262919A JP5848109B2 (en) 2011-11-11 2011-11-11 Resin cure shrinkage measurement method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011262919A JP5848109B2 (en) 2011-11-11 2011-11-11 Resin cure shrinkage measurement method

Publications (2)

Publication Number Publication Date
JP2013104869A true JP2013104869A (en) 2013-05-30
JP5848109B2 JP5848109B2 (en) 2016-01-27

Family

ID=48624480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011262919A Active JP5848109B2 (en) 2011-11-11 2011-11-11 Resin cure shrinkage measurement method

Country Status (1)

Country Link
JP (1) JP5848109B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014200852A1 (en) * 2013-06-11 2014-12-18 3M Innovative Properties Company Apparatus for image controlled, localized polymerization, method of use thereof and article therefrom
CN107084661A (en) * 2017-05-11 2017-08-22 中国科学院西安光学精密机械研究所 A kind of structure glue solidification internal stress test device and method of testing
CN109975531A (en) * 2019-04-18 2019-07-05 清华大学 Gelling solidifies the test device and test method of cubical contraction
WO2020171064A1 (en) * 2019-02-19 2020-08-27 株式会社アクロエッジ Method for evaluating expansion or contraction over time of curable composition due to curing, coating member, method for designing curing conditions for curable composition, and method for designing curable composition

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6654078B2 (en) * 2016-03-24 2020-02-26 株式会社アクロエッジ Stress measurement method

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4874948A (en) * 1986-12-29 1989-10-17 Canadian Patents And Development Limited Method and apparatus for evaluating the degree of cure in polymeric composites
JPH08136223A (en) * 1994-11-07 1996-05-31 Murata Mfg Co Ltd Method for measuring resin amount in electronic part
JPH1123568A (en) * 1997-07-01 1999-01-29 Taiyo Ink Mfg Ltd Hardening characteristic measuring method of photohardening reaction system and device thereof
JP2006038533A (en) * 2004-07-23 2006-02-09 Toyota Central Res & Dev Lab Inc Method and apparatus for evaluating substrate concealability of coating
JP2007043009A (en) * 2005-08-05 2007-02-15 Matsushita Electric Ind Co Ltd Mounting inspection system
WO2007029503A1 (en) * 2005-09-02 2007-03-15 Nippon Steel Chemical Co., Ltd. Epoxy resin composition
JP2007071716A (en) * 2005-09-07 2007-03-22 Olympus Corp Confocal scanning microscope
JP2009186426A (en) * 2008-02-08 2009-08-20 Konica Minolta Business Technologies Inc Measuring device
JP2011060843A (en) * 2009-09-07 2011-03-24 Shimadzu Corp Characteristic testing device of photocurable resin, holder used by testing device, and characteristic testing method
JP2011094089A (en) * 2009-11-02 2011-05-12 Osaka Organic Chem Ind Ltd Photocurable low shrinkage monomer compound
JP2011162733A (en) * 2010-02-15 2011-08-25 Hitachi Chem Co Ltd Heat-resistant resin composition and coating using the same

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4874948A (en) * 1986-12-29 1989-10-17 Canadian Patents And Development Limited Method and apparatus for evaluating the degree of cure in polymeric composites
JPH08136223A (en) * 1994-11-07 1996-05-31 Murata Mfg Co Ltd Method for measuring resin amount in electronic part
JPH1123568A (en) * 1997-07-01 1999-01-29 Taiyo Ink Mfg Ltd Hardening characteristic measuring method of photohardening reaction system and device thereof
JP2006038533A (en) * 2004-07-23 2006-02-09 Toyota Central Res & Dev Lab Inc Method and apparatus for evaluating substrate concealability of coating
JP2007043009A (en) * 2005-08-05 2007-02-15 Matsushita Electric Ind Co Ltd Mounting inspection system
WO2007029503A1 (en) * 2005-09-02 2007-03-15 Nippon Steel Chemical Co., Ltd. Epoxy resin composition
JP2007071716A (en) * 2005-09-07 2007-03-22 Olympus Corp Confocal scanning microscope
JP2009186426A (en) * 2008-02-08 2009-08-20 Konica Minolta Business Technologies Inc Measuring device
JP2011060843A (en) * 2009-09-07 2011-03-24 Shimadzu Corp Characteristic testing device of photocurable resin, holder used by testing device, and characteristic testing method
JP2011094089A (en) * 2009-11-02 2011-05-12 Osaka Organic Chem Ind Ltd Photocurable low shrinkage monomer compound
JP2011162733A (en) * 2010-02-15 2011-08-25 Hitachi Chem Co Ltd Heat-resistant resin composition and coating using the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014200852A1 (en) * 2013-06-11 2014-12-18 3M Innovative Properties Company Apparatus for image controlled, localized polymerization, method of use thereof and article therefrom
CN107084661A (en) * 2017-05-11 2017-08-22 中国科学院西安光学精密机械研究所 A kind of structure glue solidification internal stress test device and method of testing
WO2020171064A1 (en) * 2019-02-19 2020-08-27 株式会社アクロエッジ Method for evaluating expansion or contraction over time of curable composition due to curing, coating member, method for designing curing conditions for curable composition, and method for designing curable composition
JP2020134293A (en) * 2019-02-19 2020-08-31 株式会社アクロエッジ Method for evaluating expansion or contraction over time of curable composition due to curing, coating member, method for designing curing condition of curable composition and method for designing curable composition
CN109975531A (en) * 2019-04-18 2019-07-05 清华大学 Gelling solidifies the test device and test method of cubical contraction

Also Published As

Publication number Publication date
JP5848109B2 (en) 2016-01-27

Similar Documents

Publication Publication Date Title
JP5848109B2 (en) Resin cure shrinkage measurement method
TWI616941B (en) Releasable substrate on a carrier, and method and system for providing the same
Prussak et al. Evaluation of residual stress development in FRP-metal hybrids using fiber Bragg grating sensors
JP2009283970A5 (en)
US10189203B2 (en) Method for forming micropattern of polyimide using imprinting
JP2010251186A (en) Conductive transcription film, and forming method of conductive pattern using it
CN106201080A (en) A kind of curved touch screen and manufacture method and electronic equipment
Wang et al. Modeling and Application of Planar‐to‐3D Structures via Optically Programmed Frontal Photopolymerization
JP2012093563A (en) Method of manufacturing optical waveguide for touch panel
Papenheim et al. Reducing the risk of failure with flexible composite stamps
Gruetzner et al. UV-curable hybrid polymers for optical applications: technical challenges, industrial solutions, and future developments
Baëtens et al. Planarization and edge bead reduction of spin-coated polydimethylsiloxane
GB2551215A (en) Fabrication of air gap regions in multicomponent lens systems
JP2016118570A (en) Stress measurement method
TW201818060A (en) Reference device, measuring device using spectroscopic interference method, coating device, measurement accuracy assurance method of measuring device using spectroscopic interference method, and method for producing coating film
WO2020171064A1 (en) Method for evaluating expansion or contraction over time of curable composition due to curing, coating member, method for designing curing conditions for curable composition, and method for designing curable composition
Ali et al. 3D‐Printed Holographic Fresnel Lenses
Missinne et al. Flexible thin polymer waveguide Bragg grating sensor foils for strain sensing
JP5224395B2 (en) MEMS-based exposure module and related technology
KR20120081856A (en) Method for manufacturing lens and lens
Manizani et al. Investigating the Effect of Separation Speed and Image Cross-Section Geometry on The Separation Force in DLP Method using FEP and PP Polymer Membranes.
JP5567960B2 (en) Manufacturing method of optical scale
JP2016197226A (en) Photosensitive resin composition and etching method
JP6503211B2 (en) Imprint molding mold and manufacturing method thereof
JP2011017976A (en) Method for forming light shielding film

Legal Events

Date Code Title Description
RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20141107

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20141110

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150914

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150929

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151009

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20151117

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20151126

R150 Certificate of patent or registration of utility model

Ref document number: 5848109

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250