JP2009186426A - Measuring device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a measuring device capable of efficiently measuring simultaneously the shrinkage force and shrinking displacement in resin curing. <P>SOLUTION: The molten resin C is arranged on respective opposing sides of a first member A and of a second member B, and the measuring device measures the behavior when the resin C is cured. The second member B is fixed to a load cell 10 which measures the shrinkage force in curing the resin C, and the first member A is attached onto a substrate 8 with a predetermined constraint force. The shrinking displacement in curing the resin C is measured with a laser displacement gauge 20, and the shrinkage force is measured by the load cell 10. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a measuring apparatus, and more particularly to a measuring apparatus for measuring shrinkage behavior when a resin is cured.

  When fixing parts that require high-precision positioning during assembly, such as optical elements such as laser diodes and lenses, and sensors, with resin (adhesive), it is necessary to evaluate the shrinkage behavior when the resin cures There is. A general method for measuring the shrinkage behavior of a conventional resin utilizes a change in volume before and after curing. Therefore, not only the shrinkage force could not be measured, but also the behavior during curing could not be measured continuously.

  By the way, for spatial positioning of optical elements and various sensors included in optical systems such as exposure devices and optical pickups installed in digital copiers and printers, optical components can be reduced to reduce the number of components and improve assembly. After adjusting the element three-dimensionally, a method of holding the position with a resin adhesive is used. Hereinafter, this method is referred to as a three-dimensional precision bonding method.

  In the three-dimensional precision bonding method, a margin for adjusting the parts is also provided in the thickness direction of the resin. Therefore, compared to the conventional bonding method in which two-dimensional bonding is fixed, the influence of curing shrinkage is likely to occur. In particular, there is a difference in the amount of displacement due to the shrinkage before and after the resin is cured depending on the holding force for holding the component. However, since the shrinkage force cannot be measured by the conventional evaluation method, the influence of the component holding force on the amount of displacement cannot be measured. Further, when the three-dimensional precision bonding method is used, the adhesive fixing structure greatly affects the positional accuracy during or after the resin is cured.

  Such an adhesive fixing structure that affects the assembling accuracy, a holding method, a displacement amount when changing a holding load, and a contraction force cannot be measured. In particular, since the behavior during curing cannot be measured continuously, it cannot be determined whether the curing reaction is complete. Therefore, conventionally, an alternative evaluation of measuring the adhesive strength by changing the curing conditions in various ways has been unavoidable.

  As for the amount of shrinkage, there was a divergence between the actual displacement amount due to the influence of the external restraining force and the shrinkage amount obtained by the conventional method with respect to the parts fixed with resin. Furthermore, since the shrinkage rate obtained by the conventional method is the volume shrinkage rate obtained from the change in volume, it is assumed that the resin is uniformly shrunk in all directions. However, in reality, the contraction force does not act equally in all directions in relation to the component holding structure. Therefore, depending on the holding structure, there is a difference between the measured shrinkage rate and the amount of displacement of the component. In addition, since the resin cannot shrink at the interface between the component and the resin, the resin is bonded to the component while leaving an internal stress.

  Therefore, since there are various problems in bonding and fixing parts with resin, when creating a model of an actual holding structure and curing the resin with a predetermined holding force applied from the outside, It is necessary to continuously measure the behavior of

  Patent Document 1 uses a measuring device for curing shrinkage composed of two containers and a pressure gauge, and a change in specific gravity before and after curing, and obtains a change in volume from a change in measured value of the pressure gauge before and after curing. The shrinkage rate measuring method for obtaining the shrinkage rate is described. However, this device and method cannot measure contractile force.

  Patent Document 2 describes a curing behavior observation apparatus using vibration and a method for continuously observing the behavior of the warpage of a plate-shaped member during adhesive curing. However, this device and method cannot measure contractile force.

Non-Patent Document 1 describes a measurement method in which a shrinkage force of an adhesive is measured using a strain gauge and a shrinkage amount of the adhesive is measured with a caliper. However, since the shrinkage rate and the shrinkage amount are not measured at the same time, it is inefficient.
JP 7-333034 A JP 2004-340810 A Architectural Institute of Japan, 583, pp. 17-22

  Accordingly, an object of the present invention is to provide a measuring apparatus that can efficiently and simultaneously measure the contraction force and contraction displacement during curing of a resin.

In order to achieve the above object, a measuring apparatus according to the present invention provides:
A measuring device that arranges a molten resin on each of the opposing surfaces of the first member and the second member, and measures the behavior when the resin is cured,
Force measuring means for measuring the contraction force when the resin is cured;
Displacement measuring means for measuring displacement due to shrinkage when the resin is cured;
It is provided with.

  In the measuring apparatus according to the present invention, the first and second members prepared as models for bonding and fixing with resin are used to simultaneously measure the contraction force and the amount of contraction by the force measurement unit and the displacement measurement unit. be able to. The measurement result is fed back to the design of the component, and the assembly accuracy error of the component due to the curing shrinkage of the resin can be extremely reduced.

  In the measuring apparatus according to the present invention, the first member is fixed to the substrate, the second member is fixed to the force measuring means, and each of the first member and the second member is one or more substantially parallel. It is preferable that the first member and the second member are not in contact with each other. A resin film having a predetermined thickness is formed in the gap between the opposing surfaces, and the measurement can be performed by changing the thickness of the resin by adjusting the interval between the opposing surfaces.

  The force measuring means may have one or more measuring directions, and at least one of the measuring directions may be substantially parallel or substantially perpendicular to the normal direction of the facing surface. The shrinkage force in the film thickness direction of the resin or the shrinkage force in the direction perpendicular to the film thickness can be measured.

  The displacement measuring means may have one or more measuring directions, and at least one of the measuring directions may be substantially parallel or substantially perpendicular to the normal direction of the facing surface. It is possible to measure the shrinkage amount / position shift amount in the film thickness direction of the resin or the shrinkage amount / position shift amount in the direction perpendicular to the film thickness.

  Further, it is preferable that the substrate includes a restraining means for restraining the first member, and the restraining means can change the restraining force of the first member. The contraction behavior when the restraining force is changed can be measured.

  You may provide the means to irradiate light to resin arrange | positioned at the clearance gap formed in the said opposing surface. A photo-curing resin such as an ultraviolet ray can be measured. Moreover, you may provide the means to apply heat to resin arrange | positioned at the clearance gap formed in the said opposing surface. A thermosetting resin can be the object of measurement.

  The force measuring means preferably generates a vertical force that balances the second member with its own weight. It is possible to measure the contraction behavior without the influence of its own weight.

  It is preferable that at least one of the force measuring unit and the displacement measuring unit can continuously output a measurement value. The measured value during curing can be continuously monitored, and the degree of curing can be easily determined.

  The first member may be constrained via a detachable spacer on the substrate. By removing the spacer, the first member can be kept out of contact with the substrate, and the contraction force and contraction displacement when the restraining force on the first member is eliminated can be measured.

  The force measuring means may be a load cell using a strain gauge. There is no drift when measuring a static load, and even a slow contraction can be measured accurately. Further, the displacement measuring means may be a non-contact type sensor. If it is a non-contact type, an excessive force will not be added to a resin part and a displacement measurement error can be reduced.

At least one of the first member and the second member preferably has a linear expansion coefficient of 20 × 10 ⁻⁶ / ° C. or less. Deformation due to heat is suppressed, and measurement errors can be reduced. Moreover, it is preferable that at least one of the first member and the second member has a Young's modulus of 150 GPa or more. Deformation due to contraction force is suppressed, and measurement errors can be reduced.

  Embodiments of a measuring apparatus according to the present invention will be described below with reference to the accompanying drawings. In addition, in each drawing, the same code | symbol is attached | subjected to the same member and part, and the overlapping description is abbreviate | omitted.

  FIG. 1 shows a schematic configuration of a measuring apparatus according to an embodiment of the present invention and a measuring circuit. In this measuring apparatus, a melted ultraviolet curable resin C is disposed between opposing surfaces of a first member A and a second member B prepared as a model for fixing with a resin, and the resin C is cured. The load cell 10 is a force measuring means for measuring the contraction force when the resin C is cured, and the laser displacement meter is a displacement measuring means for measuring the displacement due to the contraction when the resin C is cured. 20 is provided. Both the load cell 10 and the laser displacement meter 20 are well known.

  The measuring device further includes an ultraviolet irradiator 30 that irradiates ultraviolet rays to cure the resin C and a controller 31 thereof. As the ultraviolet curable resin, for example, an acrylic or epoxy resin is used.

  As shown in FIG. 2, the first member A includes a base portion 1, a vertical portion 2, and a protrusion 3 protruding in the horizontal direction from the vertical portion 2. The second member B has a recess 5 that is slightly larger than the protrusion 3. The position of the first member A is determined by a screw 11 on the substrate 8 of the measuring apparatus, and a binding force is set by a coil spring 12 wound around the screw 11 provided on the substrate 8. The second member B is fixed to the load cell 10 attached on the substrate 8. Regarding the first and second members A and B, by setting the first and second members A and B on the substrate 8, four parallel surfaces are formed by the protrusion and the recess.

  A predetermined amount of the resin C in the molten state is applied to the position D on the protrusion 3 of the first member A, and the protrusion 3 is inserted into the recess 5 of the second member B. It arrange | positions on the opposing surface of the members A and B. FIG. Holes 4 and 6 for irradiating ultraviolet rays for curing the resin C are formed in the first and second members A and B, and ultraviolet rays are irradiated to the resin C through the holes 4 and 6. In addition, the opposing surface is open | released also on both sides, and can also irradiate an ultraviolet-ray from both sides.

  Further, the first member A and the second member B are not in contact with each other. The resin C having a predetermined thickness is applied to the gap between the opposing surfaces, and the contraction force and the contraction displacement can be measured by changing the thickness of the resin C by adjusting the interval between the opposing surfaces.

  In this measuring apparatus, the displacement of the first member A caused by the curing of the resin C by the irradiation of ultraviolet rays is continuously measured by the laser displacement meter 20 and the contraction force is continuously applied by the load cell 10 through the second member B. Measure automatically. This measurement result is fed back to the design of the component, and the assembly accuracy error of the component due to the curing shrinkage of the resin can be extremely reduced.

  The measurement circuit 40 includes a sensor amplifier 41 to which detection data of the laser displacement meter 20 is input, a distortion amplifier 42 to which detection data of the load cell 10 is input, and a data logger 43 that monitors and records each data. ing. For data recording, the data logger 43 may be replaced with a personal computer via an A / D conversion board. Alternatively, a digital storage oscilloscope may be used. Furthermore, an A / D converter and a processing circuit may be provided to take measurement data into the memory.

  The laser displacement meter 20 and the load cell 10 continuously output detection data. Therefore, the measured value during curing can be continuously monitored, and the degree of curing can be easily determined.

  The resin used as the sample may be a thermosetting type or an instantaneous adhesive other than the above-described acrylic (eg, epoxy) light (ultraviolet) type. If it is a thermosetting type, it will replace with the ultraviolet irradiation device 30, and will provide a heating means.

Since the first and second members A and B may generate heat or be heated when the resin is cured, the coefficient of linear expansion is preferably low, specifically 20 × 10 ⁻⁶ / ° C. or less. It is preferable. Deformation due to heat is suppressed, and measurement errors can be reduced. Moreover, in order to suppress the deformation | transformation by the shrinkage force of resin, it is preferable that the 1st member A and the 2nd member B have a high Young's modulus, and it is preferable that it is specifically 150 GPa or more. Deformation due to contraction force is suppressed, and measurement errors can be reduced. In the present embodiment, SUS304 is used as the first and second members A and B. SUS304 has a linear expansion coefficient of 17.3 × 10 ⁻⁶ / ° C. and a Young's modulus of 197 GPa.

  Regarding the restraining force with respect to the first member A, the spring force of the coil spring 12 can be changed and adjusted by moving the screw 11 back and forth with respect to the substrate 8. The coil spring 12 itself may be replaced with one having a different spring constant. In the present embodiment, the shrinkage behavior of the resin when the restraining force is varied can be measured by the restraining means using the coil spring 12. As the restraining means, in addition to the coil spring 12, a weight may be used, or a load may be applied by an air cylinder, a hydraulic cylinder, or an electric motor.

  The first member A may be constrained via a spacer 13 (see FIG. 3) that can be attached to and detached from the substrate 8. The spacer 13 has a recess 13a that can be fitted to the outer peripheral portion of the screw 11, and is inserted in advance between the substrate 8 and the first member A, and the spacer 13 is removed after the resin C is cured. The first member A is not brought into contact with the substrate 8. Thus, the contraction force and contraction displacement when the restraining force on the first member A is excluded can be measured.

  As the laser displacement meter 20, a confocal scan type laser displacement sensor LT-9010 manufactured by Keyence Corporation can be suitably used. In this embodiment, the upper surfaces of the first and second members A and B are set to the same height, and the displacement amounts of the upper surfaces of the first and second members A and B are simultaneously measured by the laser displacement meter 20. is doing. The second member B is completely fixed to the load cell 10 and hardly generates any displacement. However, since the rigidity of the load cell 10 is finite, the second member B is also slightly displaced. If the displacement of the second member B is not negligible with respect to the displacement of the first member A, the difference between the displacement amounts of the first and second members A and B is obtained, and the substantiality of the first member A is obtained. It is preferable that the amount of displacement be a constant amount. If the deformation due to heat is not a problem, the displacement amount may be obtained using only the first member A.

  The displacement measuring means is preferably a non-contact type. If it is a non-contact type, an excessive force will not be added to resin and a displacement measurement error can be reduced. In addition to the confocal method, a triangulation method, a capacitance displacement meter, or the like can be used. Further, the displacement measuring means may be of a contact type when the measuring force is sufficiently small with respect to the contraction force of the resin, or may be an electric micrometer or a differential transformer.

  The measurement position by the laser displacement meter 20 is preferably set as high as possible on the resin C in order to reduce Abbe error from the measurement result.

  On the other hand, the curing behavior becomes a quasi-static phenomenon depending on the type of the resin C. The force sensor used as the force measuring means mainly includes a piezoelectric element type and a strain gauge type. In the piezoelectric element type, when a quasi-static phenomenon is measured, an electric charge is discharged during the measurement, so that an error occurs in the measured value. Therefore, it is preferable to use a strain gauge type load cell. A load cell using a strain gauge has no drift when measuring a static load, and can accurately measure even a slow contraction.

  Further, it is preferable that the load cell 10 has high rigidity, but as the rigidity increases, the S / N ratio of the force detection signal deteriorates. Therefore, it is necessary to select a sensor that has high rigidity and can ensure a necessary S / N ratio. As a strain gauge type load cell and force sensor, Kyowa Denki Co., Ltd. LUR-A-2kNSAI, Nano Control Co., Ltd. GS110, GS120, GS200, etc. can be used suitably.

  Further, the force measuring means preferably has a function of generating a vertical force that balances the second member B with its own weight. It is possible to measure the contraction behavior excluding the influence of the second member B due to its own weight.

  Next, an example of measurement by the measurement apparatus is shown in the graphs of FIGS. FIG. 4 shows the amount of displacement that is the detection output of the laser displacement meter 20. The gap between the opposing surfaces of the first and second members A and B was 0.7 mm, and 12 mg of World Rock 8840L manufactured by Kyoritsu Chemical Industry Co., Ltd. was applied and cured by irradiation with an ultraviolet illuminance of 70 mW for 45 seconds. The downward restraining force on the first member A was zero. The ultraviolet irradiator 30 was a high pressure mercury lamp type ultraviolet irradiator SP-5 manufactured by USHIO INC.

  The data in FIG. 5 indicates the contractile force that is the detection output of the load cell 10. The gap between the opposing surfaces of the first and second members A and B was set to 0.5 mm, and the same resin as described above was irradiated and cured for 45 seconds at an ultraviolet illuminance of 70 mW. The downward restraining force for the first member A was 100N.

  Next, various adhesive fixing structures to be measured by the measuring apparatus according to the present invention will be described with reference to FIGS. These are light source units of an image exposure apparatus such as a copying machine or a printer, and include holders 50 and 51 having a heat radiation function for holding a laser diode 71 and holders 60, 61 and 62 for holding condensing optical elements 72 and 73. It is a structure that is bonded and fixed with resin. Using these adhesive fixing structures as models, the behavior when the resin C is cured can be measured / evaluated by the measuring device and fed back to the design.

  FIG. 6 shows a structure in which the holders 50 and 60 are fixed with resin C at two locations. The holder 50 corresponds to the first member A, and the holder 60 corresponds to the second member B. FIG. 7 shows examples in which the arrangement position of the resin C on the holder 50 is variously changed. As shown in FIG. 8, a model in which the resin C is continuously stacked and arranged in an annular shape may be used. Moreover, as shown in FIG. 9, the model which has arrange | positioned the resin C non-targeted up and down may be sufficient.

  10 to 15 show an adhesive fixing structure of a holder 51 having a bent portion to which a laser diode 71 is attached and a holder 61 to which a condensing optical element 72 is attached. In each figure, X indicates the optical axis direction, Y indicates the main scanning direction, and Z indicates the sub-scanning direction.

  FIG. 10 shows an adhesive fixing structure in which a resin is disposed in the gap between the both-end bent portion 51 b of the holder 51 and both side surfaces 61 a of the holder 61. FIG. 11 shows an adhesive fixing structure in which a resin C is disposed in the gap between the lower portion and the upper bent portion 51c of the vertical portion 51a of the holder 51 and the end surface 61b and the upper surface 61c of the holder 61. FIG. 12 shows an adhesive fixing structure in which the resin C is disposed in the vertical portion 51a of the holder 51 at two locations, the upper and lower bent portions 51c and 51d, and the gap between the end surface 61b of the holder 61 and the upper and lower surfaces 61c and 61d. FIG. 13 shows an adhesive fixing structure in which the bent portions 51 c and 51 d of the holder 51 are inserted into the concave portion 61 e of the holder 61 and the resin C is arranged.

  In FIG. 14, recesses 61f are formed in the upper and lower surfaces 61c and 61d of the holder 61, and the resin C is placed in the gap between the upper and lower bent portions 51c and 51d of the holder 51 and the upper and lower surfaces 61c and 61d of the holder 61 including the recesses 61f. This is an arranged adhesive fixing structure. FIG. 15 shows an adhesive fixing structure in which convex portions 61g are formed on the upper and lower surfaces 61c and 61d of the holder 61, and the resin C is disposed in the gap between the convex portions 61g and the upper and lower bent portions 51c and 51d of the holder 51. .

  In FIG. 16, a convex portion 62 a is formed on the end face of the holder 62 that holds the condensing optical element (collimator lens) 73, and the resin C is disposed between the convex portion 62 a and the holder 50 that holds the laser diode 71. Adhesive fixing structure. FIG. 17 shows a structure in which a bent portion 50a is formed in the holder 50, and the resin C is arranged in the gap between the bent portion 50a and the convex portion 62a.

(Other examples)
In addition, the measuring apparatus according to the present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the gist thereof.

It is a typical block diagram of the measuring apparatus which is one Example of this invention. It is a perspective view which shows the 1st and 2nd member which is a to-be-measured model. It is a perspective view which shows the spacer for canceling | restraining force. It is a graph which shows the data of the displacement amount by the said measuring apparatus. It is a graph which shows the data of the contractile force by the said measuring apparatus. The other example of an adhesion fixing structure is shown, (A) is sectional drawing, (B) is a front view. (A), (B), (C) is a perspective view which shows the other example of an adhesion fixing structure, respectively. (A), (B) is a perspective view which shows the other example of the adhesion fixing structure, respectively. (A), (B), (C) is a perspective view which shows the other example of an adhesion fixing structure, respectively. The other example of an adhesion fixing structure is shown, (A) is a perspective view, (B) is a top view, (C) is a front view. It is a front view which shows the other example of the adhesion fixing structure. It is a front view which shows the other example of the adhesion fixing structure. It is a front view which shows the other example of the adhesion fixing structure. It is a front view which shows the other example of the adhesion fixing structure. It is a front view which shows the other example of the adhesion fixing structure. It is a perspective view which shows the other example of the adhesion fixing structure. It is a perspective view which shows the other example of the adhesion fixing structure.

Explanation of symbols

A ... 1st member B ... 2nd member C ... Resin 8 ... Board | substrate 10 ... Load cell (force measuring means)
12 ... Coil spring (restraint means)
13 ... Spacer 20 ... Laser displacement meter (displacement measuring means)
30 ... UV irradiator 40 ... Measurement circuit

Claims (16)

A measuring device that arranges a molten resin on each of the opposing surfaces of the first member and the second member, and measures the behavior when the resin is cured,
Force measuring means for measuring the contraction force when the resin is cured;
Displacement measuring means for measuring displacement due to shrinkage when the resin is cured;
A measuring apparatus comprising:   The first member is fixed to the substrate, the second member is fixed to the force measuring means, the first member and the second member each have one or more substantially parallel facing surfaces; and The measuring apparatus according to claim 1, wherein the first member and the second member are not in contact with each other.   The said force measurement means has one or more measurement directions, At least 1 direction of the measurement direction is substantially parallel to the normal line direction of the said opposing surface, The Claim 1 or Claim 2 characterized by the above-mentioned. measuring device.   The said force measurement means has one or more measurement directions, At least 1 direction of the measurement direction is substantially perpendicular to the normal line direction of the said opposing surface, The Claim 1 or Claim 2 characterized by the above-mentioned. measuring device.   The displacement measuring means has one or more measurement directions, and at least one direction of the measurement directions is substantially parallel to a normal direction of the facing surface. measuring device.   The displacement measuring means has one or more measurement directions, and at least one direction of the measurement directions is substantially perpendicular to a normal direction of the facing surface. measuring device.   The measurement according to any one of claims 2 to 6, wherein the substrate includes a restraining means for restraining the first member, and the restraining means can change a restraining force of the first member. apparatus.   The measuring apparatus according to claim 1, further comprising means for irradiating light to a resin disposed in a gap formed on the facing surface.   8. The measuring apparatus according to claim 1, further comprising means for applying heat to the resin disposed in the gap formed on the facing surface.   10. The measuring apparatus according to claim 1, wherein the force measuring means generates a vertical force that balances the second member with its own weight.   The measuring apparatus according to claim 1, wherein at least one of the force measuring unit and the displacement measuring unit can continuously output a measurement value.   12. The measuring apparatus according to claim 2, wherein the first member is constrained via a detachable spacer on the substrate.   The measuring apparatus according to claim 1, wherein the force measuring means is a load cell using a strain gauge.   The measuring apparatus according to claim 1, wherein the displacement measuring unit is a non-contact type sensor. 15. The measuring apparatus according to claim 1, wherein at least one of the first member and the second member has a linear expansion coefficient of 20 × 10 ⁻⁶ / ° C. or less.   16. The measuring apparatus according to claim 1, wherein at least one of the first member and the second member has a Young's modulus of 150 GPa or more.

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