JP2013098376A - Method for repairing surface-mounted component and mask member for use in the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for repairing a surface-mounted component, which avoids displacement of applied solder not to require a high attention and a high work capability, and to provide a mask member which is easily removed from a substrate.SOLUTION: When cream solder for repair is applied through an opening 45, a mask member 40 is peeled from a substrate 11 by lifting a projection 44. Even when adjacent components 15 are mounted in the periphery of a surface-mounted component 10 to be repaired, the projection 44 does not interfere with the adjacent components 15, so that the mask member 40 is easily peeled from the substrate 11 only by lifting the projection 44. Thus, displacement of the applied cream solder is avoided, and the surface-mounted component 10 is easily repaired without requiring a high attention and a high work capability.

Description

  The present invention relates to a surface mounting component repair method and a mask member used therefor.

  In general, the mounting of surface-mounted components to a substrate is automated. However, for example, when there is a deviation or soldering failure in the mounting position of the surface-mounted component, it is necessary to repair the surface-mounted component to a predetermined position or to perform soldering again. On the other hand, in recent years, as surface mount components have been miniaturized, surface mount components having heat radiation pads and terminals on the back surface have become widespread. Therefore, when re-applying solder or replacing surface-mounted components for repair, it is necessary to partially apply solder to the lands of the target surface-mounted components so as not to affect other components. . In Patent Document 1, in order to supply solder to this specific land, a land for a mark different from the land for mounting is provided on the substrate. Thereby, in patent document 1, determination of the position of a metal mask is made easy, and supply of the solder to a specific land is simplified.

  However, the metal mask disclosed in Patent Document 1 is formed in a thin plate shape. This metal mask has a small outer shape with respect to the substrate in order to supply solder to a specific land. Therefore, after applying solder using a metal mask, it is necessary to remove the small and thin metal mask from the substrate. A plurality of components are mounted on the substrate in addition to the surface mount components to be repaired. As a result, high caution and work ability are required to remove the metal mask placed on the board for repair from the board while avoiding interference with surrounding parts and avoiding the deviation of the applied solder. To do.

JP 2005-223230 A

Accordingly, an object of the present invention is to provide a method for repairing a surface-mounted component that avoids deviation of applied solder and does not require high attention and work ability.
Another object of the present invention is to provide a mask member that can be easily removed from a substrate without requiring high attention and work ability.

  According to the first aspect of the present invention, when repairing solder is applied through the opening, the mask member is peeled off the substrate by lifting the portion protruding to the opposite side of the substrate. That is, the mask member is easily removed from the substrate by lifting the portion protruding to the opposite side of the substrate to the opposite side of the substrate. Therefore, even when other components are mounted around the surface mount component to be repaired, the protruding portion of the mask member does not interfere with these other components. As a result, the mask member is easily peeled from the substrate simply by lifting the protruding portion. Further, the mask member is lifted substantially vertically from the substrate by lifting the protruding portion. Therefore, the mask member is not easily tilted with respect to the substrate, and the applied solder is also prevented from being displaced by the mask member. Therefore, deviation of the applied solder can be avoided, and the surface mount component can be repaired without requiring high attention and work ability.

  In the invention according to claim 2, the mask main body has an opening corresponding to the mounting portion on which the surface mounting component is mounted. Therefore, the solder for repair is applied to the mounting portion of the substrate through the opening of the mask body. Thereby, the solder for repair is easily apply | coated to a mounting part by making an opening into a mark. Further, the protruding portion rises from the mask main body to the side opposite to the substrate. Therefore, the thin and small mask body is peeled off from the substrate by picking up the protrusion. Therefore, it can be easily removed from the substrate without requiring high attention and work ability.

  In the invention described in claim 3, the wall portion extends from the mask main body to the side opposite to the substrate and surrounds the periphery of the mask main body. Therefore, leakage of the applied solder to the outside of the mask main body is reduced by the wall portion. Thereby, the adhesion of the solder for repair to other than the target mounting portion is reduced. Therefore, the repair accuracy of the surface mount component can be increased.

  In the invention described in claim 4, the connecting portion is provided between the mask body and the protruding portion. The connecting portion has a total length smaller than the distance from the mounting portion to an adjacent component adjacent to the mounting portion. For this reason, the mask main body and the protruding portion are reduced in interference with adjacent components adjacent to the mounting portion. Moreover, this connection part has a some bending line part. The protruding portion is bent from the fold line portion to form an angle with the mask body. That is, an angle is formed between the mask body parallel to the mounting portion of the substrate and the protruding portion by bending at the bending line portion of the connecting portion, and the protruding portion rises to the opposite side of the substrate. Since a plurality of fold line portions are provided, the fold position is changed according to the distance between the mounting portion and the adjacent component. Therefore, it is possible to apply the solder to the mounting portion while reducing interference between the mask main body and the protruding portion and adjacent components.

The schematic diagram which shows the board | substrate and mask member by one Embodiment The schematic diagram which shows the surface mounting components mounted in the board | substrate by one Embodiment The schematic diagram which shows the board | plate material which expand | deployed the mask member by one Embodiment The schematic diagram which shows the board | plate material which developed the mask member by one Embodiment, and a processing jig The schematic diagram which shows the procedure of the repair method of the surface mounting components by one Embodiment

Hereinafter, an embodiment of a surface mounting component repair method and a mask member will be described with reference to the drawings.
First, the configuration of the substrate 11 including the target surface mount component 10 will be described with reference to FIG. The substrate 11 has a mounting surface 12 on one surface. The substrate 11 has a plurality of wiring lands 13 on the mounting surface 12. Further, the substrate 11 has a heat dissipation land 14 for heat dissipation of the surface mount component 10. In the case of the present embodiment, the wiring land 13 is arranged around the heat radiation land 14 as shown in FIG. The substrate 11 has an adjacent component 15 in addition to the surface mount component 10.

  As shown in FIG. 2, the surface mounting component 10 is mounted on the mounting surface 12 of the substrate 11. The surface mount component 10 includes a component main body 21, a lead portion 22, and a heat dissipation pad 23. The component main body 21 is composed of a resin package that houses various elements such as a semiconductor element mounted on a mounting board (not shown). The lead portion 22 is formed of a conductive metal and protrudes around the component main body 21. The heat dissipating pad 23 is formed of a thermally conductive metal or ceramic and is provided on the back surface of the component body 21, that is, on the mounting surface 12 side. The heat dissipating pad 23 is exposed on the back surface of the component main body 21.

  The surface mount component 10 and the substrate 11 are connected by solder 30. Specifically, the lead portion 22 of the surface mount component 10 is connected to the wiring land 13 with the solder 30 interposed therebetween. Further, the heat dissipating pad 23 of the surface mount component 10 is connected to the heat dissipating land 14 with the solder 30 interposed therebetween. Thereby, the lead part 22 of the surface mount component 10 is electrically connected to the land 13 for wiring by the solder 30. The heat dissipating pad 23 of the surface mount component 10 is connected to the heat dissipating land 14 by the solder 30. As a result, heat generated from the component main body 21 of the surface mount component 10 is transmitted to the heat dissipation land 14 via the heat dissipation pad 23 and the solder 30, and is radiated from the heat dissipation land 14 to the substrate 11.

Next, the mask member 40 shown in FIG. 1 will be described.
The mask member 40 includes a mask main body 41, a wall portion 42, a connection portion 43, and a protruding portion 44. The mask body 41 is formed in a plate shape. The mask main body 41 has an opening 45 that can be overlapped with the heat radiation land 14 corresponding to the mounting portion of the substrate 11. The size of the opening 45 is set to be the same as or slightly smaller than the heat radiation land 14. The wall portion 42 is provided around the mask main body 41 and rises from the mask main body 41 to the side opposite to the substrate 11. In the case of this embodiment, the wall part 42 is not provided in the connection part 43 and the protrusion part 44 side of the mask main body 41. The connecting portion 43 is provided integrally with the mask main body 41 at one end of the mask main body 41. The connecting portion 43 connects the mask main body 41 and the protruding portion 44. Thus, in the case of this embodiment, the mask main body 41, the wall part 42, the connection part 43, and the protrusion part 44 are integrally shape | molded from one board | plate material 50, such as stainless steel, as shown in FIG. The wall 42 rises to the opposite side of the substrate 11 by being bent from a connection portion with the mask main body 41.

  As shown in FIG. 4, the mask member 40 is combined with a processing jig 51 together with a plate material 50 in which the mask main body 41, the wall portion 42, the connection portion 43 and the protruding portion 44 are integrated. The processing jig 51 is formed of a material having a larger plate thickness than the plate material 50 forming the mask member 40. The integrated plate member 50 is bent with reference to the processing jig 51 after the processing jig 51 is superimposed on the mask body 41. Since the processing jig 51 is thicker and harder than the plate material 50, the plate material 50 is easily bent with reference to the end of the processing jig 51. By bending the plate member 50, the wall portion 42 is formed, and the mask member 40 is formed. This processing jig 51 is used as a so-called squeegee when cream solder is applied during repair of the surface-mounted component 10.

  As shown in FIGS. 1 and 3, the connecting portion 43 has a plurality of grooves 61 to 64. The grooves 61 to 64 are cut to the middle of the connecting portion 43 in the plate thickness direction. Thereby, the connection part 43 can be bent using the grooves 61-64. That is, these grooves 61 to 64 correspond to fold line portions in the claims. By bending the connecting portion 43 using the grooves 61 to 64, an angle is formed between the mask main body 41 and the protruding portion 44 as shown in FIG. That is, the protrusion 44 rises from the mask body 41 to the opposite side of the substrate 11 by bending the protrusion 44 from the grooves 61 to 64 of the connection portion 43 to the opposite side of the substrate 11. Since the grooves 61 to 64 are provided in the connecting portion 43, the total length of the connecting portion 43 varies depending on the positions of the grooves 61 to 64 to be bent. For example, when the distance between the heat dissipation land 14 and the adjacent component 15 adjacent to the heat dissipation land 14 is small, the connection portion 43 is bent by the groove 61 at a position close to the mask body 41 among the plurality of grooves 61 to 64. . Thereby, the full length of the connection part 43 from the mask main body 41 to the protrusion part 44 is shortened, and interference with the mask main body 41 and the adjacent component 15 which aligned the heat radiation land 14 is reduced. On the other hand, when the distance between the heat radiation land 14 and the adjacent component 15 is large, the connecting portion 43 may be bent at the groove 64 far from the mask body 41 among the plurality of grooves 61 to 64. As described above, the connection portion 43 is bent at any one of the grooves 61 to 64 according to the distance between the heat radiation land 14 and the adjacent component 15.

Next, a method for repairing the surface-mounted component 10 using the mask member 40 having the above configuration will be described.
The mask member 40 is placed on the mounting surface 12 of the substrate 11 as shown in FIG. At this time, the mask member 40 is placed on the substrate 11 such that the opening 45 provided in the mask main body 41 is aligned with the heat radiation land 14 provided on the mounting surface 12 of the substrate 11. The distance between the substrate 11 and the mask member 40 is a minute distance corresponding to the thickness of the heat dissipation land 14.

  When the mask member 40 is placed on the substrate 11, the cream solder 70 is applied to the heat radiation land 14 through the opening 45 of the mask member 40 as shown in FIG. The cream solder 70 is thinly and uniformly supplied to the opening 45 using, for example, the processing jig 51 as a squeegee. The cream solder 70 applied to the opening 45 is applied to the heat radiation land 14 as a thin and uniform layer. The cream solder 70 to be supplied is reduced in leakage to the outside of the mask body 41 by the wall portion 42. At this time, the thickness of the cream solder 70 applied to the heat radiation land 14 approximates the plate thickness of the mask main body 41 of the mask member 40.

  When the cream solder 70 is applied to the heat dissipation land 14, the mask member 40 is lifted upward using the protrusion 44. That is, in the mask member 40, the mask main body 41 integrated with the protruding portion 44 is peeled from the substrate 11 by lifting the protruding portion 44 upward. At this time, the inclination of the mask body 41 is reduced by lifting the protrusion 44 upward from the substrate 11 substantially vertically. As a result, the cream solder 70 applied to the heat dissipation land 14 is reduced from leaking to the substrate 11 around the heat dissipation land 14 or being displaced from the heat dissipation land 14. Further, the unnecessary cream solder 70 that has become excessive remains in the mask body 41. Therefore, the excessive cream solder 70 is removed without adhering to the substrate 11 together with the lifted mask member 40.

  When the mask member 40 is peeled off, the surface mount component 10 is mounted at a predetermined position. At this time, the surface mount component 10 is mounted on the substrate 11 so that the heat dissipation pad 23 overlaps the heat dissipation land 14. The substrate 11 on which the surface mount component 10 is mounted is sent to a reflow furnace (not shown). Thereby, the surface mount component 10 is fixed to the substrate 11.

  In the embodiment described above, when the repairing cream solder 70 is applied through the opening 45, the mask member 40 is lifted off the protruding portion 44 and peeled off from the substrate 11. That is, the mask member 40 is easily removed from the substrate 11 by lifting the protruding portion 44 that protrudes on the opposite side of the substrate 11 to the opposite side of the substrate 11. Even when other adjacent components 15 are mounted around the surface mount component 10 to be repaired, the protruding portion 44 does not interfere with the other adjacent components 15. As a result, the mask member 40 is easily peeled off from the substrate 11 simply by lifting the protrusion 44. Further, the mask member 40 is lifted substantially vertically from the substrate 11 by lifting the protrusion 44. Therefore, the mask member 40 is not easily tilted with respect to the substrate 11, and the applied cream solder 70 is also prevented from being displaced by the mask member 40. Therefore, deviation of the applied cream solder 70 is avoided, and the surface-mounted component 10 can be repaired without requiring high attention and work ability.

  In one embodiment, the mask body 41 has an opening 45 corresponding to the heat dissipation land 14. Therefore, the cream solder 70 for repair is applied to the heat radiation land 14 of the substrate 11 through the opening 45 of the mask body 41. Thereby, the cream solder 70 for repair is easily applied to the heat radiation land 14 with the opening 45 as a mark. Further, the protrusion 44 rises from the mask body 41 to the side opposite to the substrate 11. Therefore, the thin and small mask body 41 is peeled off from the substrate 11 by picking up the protrusion 44. Therefore, it can be easily removed from the substrate 11 without requiring high attention and work ability.

  In one embodiment, the wall portion 42 extends from the mask main body 41 to the side opposite to the substrate 11 and surrounds the mask main body 41. Therefore, leakage of the applied cream solder 70 to the outside of the mask main body 41 is reduced by the wall portion 42. As a result, the cream solder 70 for repair is less adhered to the heat dissipation land 14 other than the target. Therefore, the repair accuracy of the surface mount component 10 can be increased.

  Furthermore, in one embodiment, the connection portion 43 is provided between the mask main body 41 and the protruding portion 44. The connecting portion 43 has a total length smaller than the distance from the heat radiation land 14 to the adjacent component 15. Therefore, interference between the mask main body 41 and the protrusion 44 with the adjacent component 15 adjacent to the heat dissipation land 14 is reduced. Further, the connection portion 43 has a plurality of grooves 61 to 64. The protrusion 44 forms an angle with the mask body 41 by bending using the grooves 61 to 64. That is, an angle is formed between the mask body 41 parallel to the heat radiation land 14 of the substrate 11 and the protruding portion 44 by bending at the grooves 61 to 64 of the connecting portion 43, and the protruding portion 44 is opposite to the substrate 11. Stand up to the side. Since a plurality of the grooves 61 to 64 are provided in the connection portion 43, the bending position can be changed according to the distance between the heat radiation land 14 and the adjacent component 15. Therefore, the cream solder 70 for repair can be applied to the heat radiation land 14 while reducing the interference between the mask body 41 and the protruding portion 44 and the adjacent component 15.

The above-described present invention is not limited to the above-described embodiment, and can be applied to various embodiments without departing from the gist thereof.
For example, the shape of the wall portion 42 and the opening 45 can be arbitrarily changed according to the surface mount component 10 and the substrate 11 to be applied. Moreover, the number of the grooves 61-64 can also be set arbitrarily. Further, the protruding portion 44 may be provided directly on the mask main body 41 without the connection portion 43 being sandwiched between the protruding portion 44 and the mask main body 41.

  In the drawings, 10 is a surface mount component, 11 is a substrate, 12 is a mounting surface, 14 is a heat dissipation land (mounting portion), 40 is a mask member, 41 is a mask body, 42 is a wall portion, 43 is a connection portion, and 44 is a protrusion. Reference numeral 45 denotes an opening, and reference numerals 61 to 64 denote grooves (bending line portions).

Claims (4)

A method for repairing a surface mount component mounted on a mounting surface of a board,
Placing a mask member on the mounting surface;
Applying a repair solder to the opening of the mask member placed on the substrate from the side opposite to the mounting surface;
After applying the solder for repair, lifting the portion protruding from the mask member to the opposite side of the substrate and peeling the mask member from the substrate;
Repair method for surface mount parts including A mask member used in the method for repairing a surface-mounted component according to claim 1,
A mask body having an opening corresponding to a mounting portion on which the surface mounting component is mounted on the substrate;
A protrusion rising from the mask body on the opposite side of the substrate;
A mask member comprising:   The mask member according to claim 2, further comprising a wall portion surrounding the periphery of the mask body and extending from the mask body to the side opposite to the substrate. A connecting portion that is provided between the mask main body and the protruding portion and has a total length smaller than the distance from the mounting portion to an adjacent component adjacent to the mounting portion;
The mask member according to claim 2 or 3, wherein the connecting portion has a plurality of bending line portions for forming an angle between the mask main body and the protruding portion.

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