JP2013098306A - Solar cell module and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique for reducing the thickness of a glass while satisfying a desired strength of a solar cell module.SOLUTION: A solar cell module 10 includes: a front surface glass plate 16 arranged on the light receiving side; a rear surface glass plate 26 provided so as to face the front surface glass plate 16; a photovoltaic device 12 provided between the front surface glass plate 16 and the rear surface glass plate 26; and a resin member 18 which is provided between the front surface glass plate 16 and the rear surface glass plate 26 so as to cover the photovoltaic device 12 and generates compressive stress inside the front surface glass plate 16 and the rear surface glass plate 26.

Description

  The present invention relates to a solar cell module and a manufacturing method thereof.

  2. Description of the Related Art Conventionally, so-called solar cells have been vigorously developed in various fields as photoelectric conversion devices that convert light energy into electrical energy. Solar cells are expected to be a new energy source because they can directly convert light from the sun, a clean and inexhaustible energy source, into electricity.

  Since the solar cell module is used outdoors, a certain degree of strength is required as the module. Therefore, a solar cell module in which the photoelectric conversion device is sandwiched between two pieces of glass on the sunlight receiving side and the back side has been devised (see, for example, Patent Document 1).

JP 11-31834 A

  Since glass as a transparent member used in the solar cell module as described above is heavier than plastic or the like, it is desirable that the glass be thin from the viewpoint of weight reduction. However, it is difficult to obtain the desired strength of the solar cell module simply by thinning the glass.

  This invention is made | formed in view of such a condition, The place made into the objective is to provide the technique which improves the intensity | strength of a solar cell module.

  In order to solve the above-described problems, a solar cell module according to an aspect of the present invention includes a first glass plate disposed on the light receiving side and a second glass plate provided to face the first glass plate. And the photovoltaic device provided between the first glass plate and the second glass plate, and the photovoltaic device is covered between the first glass plate and the second glass plate. And a compressive stress generating member that generates compressive stress inside the first glass plate and the second glass plate.

  Another aspect of the present invention is a method for manufacturing a solar cell module. In this method, a photovoltaic device is formed on one surface and a first glass plate disposed on the light receiving side is prepared, and a resin member is placed from one surface side so as to cover the photovoltaic device. A step of superposing the first glass plate, a step of superposing the second glass plate on the resin member so as to face the first glass plate, and a resin between the first glass plate and the second glass plate. Heating in a state of sandwiching the member, bonding the first glass plate and the second glass plate through the resin member, and the first glass plate and the second glass bonded through the resin member Cooling the plate.

  According to the present invention, the strength of the solar cell module can be improved.

It is a top view at the time of seeing the solar cell module which concerns on this Embodiment from the opposite side to a sunlight light-receiving surface. It is AA sectional drawing of the solar cell module shown in FIG. It is BB sectional drawing of the photovoltaic element shown in FIG. It is a schematic diagram of the cross section for demonstrating the process of the manufacturing method of the solar cell module which concerns on this Embodiment. It is a schematic diagram of the cross section for demonstrating the process of the manufacturing method of the solar cell module which concerns on this Embodiment. It is a schematic diagram of the cross section for demonstrating the process of the manufacturing method of the solar cell module which concerns on this Embodiment. It is a schematic diagram of the cross section for demonstrating the process of the manufacturing method of the solar cell module which concerns on this Embodiment. It is a schematic diagram of the cross section for demonstrating the process of the manufacturing method of the solar cell module which concerns on this Embodiment. FIG. 9A is a schematic view seen from the top surface of the panel for explaining the breaking strength test, FIG. 9B is a side view of the panel for explaining the breaking strength test, and FIG. It is the schematic diagram seen from. It is a figure which shows the result of the fracture strength test of the panel from which the presence or absence of the resin material and the kind of resin material differ. It is a figure which shows the relationship between the thickness of a glass plate in a panel, and breaking strength.

  Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and repeated descriptions are omitted as appropriate.

  The scales and shapes of each layer and each part shown in the following drawings are set for convenience of explanation, and are not limitedly interpreted unless otherwise specified.

  FIG. 1 is a top view when the solar cell module according to the present embodiment is viewed from the side opposite to the sunlight receiving surface. 2 is a cross-sectional view taken along the line AA of the solar cell module shown in FIG. 3 is a cross-sectional view of the photovoltaic element shown in FIG. In FIG. 1, the sealing member, the filler, the resin member, and the back glass plate are omitted.

  The solar cell module 10 includes a photovoltaic device 12, a sealing member 14, a surface glass plate 16, which is a first glass plate, a resin member 18, an insulator 20, an interconnector 22, fillers 24a and 24b, and a second material. A back glass plate 26 which is a glass plate is provided.

  The photovoltaic device 12 is a rectangular flat plate or film-like unit, and a plurality of photovoltaic elements 28 are arranged in an aligned state. Each photovoltaic element 28 is appropriately connected to each other in series or in parallel.

  The front glass plate 16 disposed on the light receiving side is made of a material that transmits light, and a plurality of photovoltaic elements 28 serving as the photovoltaic device 12 are formed on the back surface 16b opposite to the light receiving surface 16a. Is formed.

  Thus, the surface glass plate 16 is arrange | positioned so that the photovoltaic apparatus 12 may be covered when the light-receiving surface 16a is seen from the front. In addition, as the surface glass plate 16, the material with the high transmittance | permeability with respect to the light of the wavelength contained in sunlight is especially suitable.

  Next, the photovoltaic element 28 will be described. As shown in FIG. 3, the photovoltaic element 28 includes a first electrode layer 30, a semiconductor layer 32, a transparent conductive film 34, and a second electrode layer 36. The first electrode layer 30, the semiconductor layer 32, the transparent conductive film 34, and the second electrode layer 36 are sequentially stacked on the surface glass plate 16 while being subjected to known laser patterning. Further, on the second electrode layer 36, the filler 24a, the resin member 18, the filler 24b, and the back glass plate 26 are sequentially laminated.

  The 1st electrode layer 30 is formed on the surface of the surface glass plate 16, and has electroconductivity and translucency. As the first electrode layer 30, a transparent conductive oxide (TCO) is used, and in particular, zinc oxide (ZnO) having high light transmittance, low resistance, and low cost is used.

  The semiconductor layer 32 generates charges (electrons and holes) by incident light from the first electrode layer 30 side. As the semiconductor layer 32, for example, an amorphous (amorphous) silicon semiconductor layer having a pin junction or a pn junction as a basic structure, or a single layer or a stacked body of a microcrystalline silicon semiconductor layer can be used. The semiconductor layer 32 is configured by laminating an amorphous silicon semiconductor and a microcrystalline silicon semiconductor from the first electrode layer 30 side. Note that in this specification, the term “microcrystal” means not only a complete crystal state but also a state partially including an amorphous state.

  The transparent conductive film 34 is formed on the semiconductor layer 32. For the transparent conductive film 34, a transparent conductive oxide (TCO) such as zinc oxide (ZnO) is used. The transparent conductive film 34 prevents the semiconductor layer 32 and the second electrode layer 36 from being alloyed, and the connection resistance between the semiconductor layer 32 and the second electrode layer 36 can be reduced.

  The second electrode layer 36 is formed on the transparent conductive film 34. A reflective metal such as silver (Ag) is used for the second electrode layer 36. The transparent conductive film 34 and the second electrode layer 36 of one photovoltaic element 28 are in contact with the first electrode layer 30 of another adjacent photovoltaic element 28. Thereby, one photovoltaic element 28 and the other photovoltaic element 28 are electrically connected in series.

  The interconnector 22 guides the electric charge generated by the plurality of photovoltaic elements 28 connected in series in this way to the outside of the solar cell module 10. The interconnector 22 has a conduction portion 22a that is electrically connected to the photovoltaic elements 28 at both ends among the plurality of photovoltaic elements 28 connected in series. The interconnector 22 is preferably a low resistivity material such as copper (Cu). An insulator 20 is disposed in a predetermined region between the interconnector 22 and the plurality of photovoltaic elements 28, and the lead-out wiring 22b of the interconnector 22 and the plurality of photovoltaic elements 28 are partially insulated. Is done.

  The resin member 18 and the fillers 24a and 24b seal the photovoltaic device 12 and the interconnector 22 between the front glass plate 16 and the rear glass plate 26, and buffer the impact applied to the photovoltaic element 28. To be arranged. Examples of the resin member 18 include polycarbonate resin (PC), polypropylene resin (PP), acrylic resin, and vinyl chloride resin. In the present embodiment, for the reasons described later, polycarbonate resin (PC), polypropylene resin ( More preferably, PP) is used. In the present embodiment, ethylene vinyl acetate (EVA) is used as the fillers 24a and 24b. In the present embodiment, inexpensive blue plate glass (float glass) is used as the back glass plate 26. In addition, the blue plate glass contains alkali metals, such as sodium (Na), as an impurity ion, for example. The back glass plate 26 improves the strength of the entire solar cell module 10 and prevents moisture and impurities from entering from the back side of the solar cell module 10.

  Through holes 38 are provided in the resin member 18, the fillers 24 a and 24 b, and the back glass plate 26. One end of the lead-out wiring 22 b of the interconnector 22 is drawn out from the through hole 38 and connected to the terminal box 40. The sealing member 14 is sandwiched between the end portions of the front glass plate 16 and the back glass plate 26.

(Method for manufacturing solar cell module)
Next, the manufacturing method of a solar cell module provided with the above-mentioned solar cell is demonstrated. In the following, a solar cell module including a plurality of photovoltaic elements 28 will be described. However, a solar cell module including one photovoltaic element 28 may be used.

  4 to 8 are schematic cross-sectional views for explaining the steps of the method for manufacturing the solar cell module according to the present embodiment.

First, as shown in FIG. 4A, a first electrode layer 30 made of zinc oxide (ZnO) having a thickness of 600 nm is formed on a surface glass plate 16 made of glass having a thickness of 4 mm by sputtering. And the YAG laser is irradiated from the 1st electrode layer 30 side of the surface glass plate 16, and the 1st electrode layer 30 is patterned in strip shape. For the laser separation processing, an Nd (neodymium): YAG laser having a wavelength of 1064 nm, an energy density of 13 J / cm ² and a pulse frequency of 3 kHz is used.

  Next, as shown in FIG. 4B, a semiconductor layer 32 is formed by a plasma processing apparatus (plasma CVD). The semiconductor layer 32 includes a p-type amorphous silicon semiconductor film having a thickness of 15 nm, an i-type amorphous silicon semiconductor film having a thickness of 200 nm, an n-type amorphous silicon semiconductor film having a thickness of 30 nm, a p-type microcrystalline silicon semiconductor film having a thickness of 30 nm, An i-type microcrystalline silicon semiconductor film having a thickness of 2000 nm and an n-type microcrystalline silicon semiconductor film having a thickness of 30 nm are sequentially stacked on the first electrode layer 30.

The p-type amorphous silicon semiconductor film is formed using a mixed gas of monosilane (SiH ₄ ), methane (CH ₄ ), hydrogen (H ₂ ), and diborane (B ₂ H ₆ ) as a source gas. The i-type amorphous silicon semiconductor film is formed using a mixed gas of monosilane (SiH ₄ ) and hydrogen (H ₂ ) as a source gas. The n-type amorphous silicon semiconductor film is formed using a mixed gas of monosilane (SiH ₄ ), hydrogen (H ₂ ) and phosphine (PH ₃ ) as a source gas.

The p-type microcrystalline silicon semiconductor film is formed using a mixed gas of monosilane (SiH ₄ ), hydrogen (H ₂ ), and diborane (B ₂ H ₆ ) as a source gas. The i-type microcrystalline silicon semiconductor film is formed using a mixed gas of monosilane (SiH ₄ ) and hydrogen (H ₂ ) as a source gas. The n-type microcrystalline silicon semiconductor film is formed using a mixed gas of monosilane (SiH ₄ ), hydrogen (H ₂ ), and phosphine (PH ₃ ) as a source gas. The details of the film forming conditions of each film by the plasma processing apparatus are shown in Table 1 below.

Note that 30 nm-thick silicon oxide (SiO _x ) may be provided as an intermediate layer between the n-type amorphous silicon semiconductor film and the p-type microcrystalline silicon semiconductor film. Such an intermediate layer is formed by sputtering or the like.

Next, the semiconductor layer 32 formed on the back surface side of the front glass plate 16 is irradiated with a YAG laser from the front surface side (front glass plate 16 side) to a position deviated from the patterning position of the first electrode layer 30. , A part thereof is removed so as to be separated into a plurality of regions (see FIG. 4B) and patterned into strips. For the laser separation processing, an Nd (neodymium): YAG laser having a wavelength of 532 nm (second harmonic), an energy density of 0.7 J / cm ² , and a pulse frequency of 3 kHz is used.

  Next, as shown in FIG. 4C, a transparent conductive film 34 made of zinc oxide (ZnO) is formed on the semiconductor layer 32 by sputtering. The transparent conductive film 34 is also formed in regions and side edges where the semiconductor layer 32 has been removed by patterning.

  Then, as shown in FIG. 5A, a 200 nm-thick silver (Ag) film is formed on the transparent conductive film 34 by sputtering to form the second electrode layer 36. At this time, the second electrode layer 36 is also formed on the transparent conductive film 34 in the region where the semiconductor layer 32 is removed by patterning.

Next, as shown in FIG. 5B, the semiconductor layer 32 and the transparent conductive film 34 are irradiated by irradiating a portion of the semiconductor layer 32 shifted from the patterning position with a YAG laser from the surface side (surface glass plate 16 side). The second electrode layer 36 is separated and patterned into a strip shape. For the laser separation processing, an Nd (neodymium): YAG laser having a wavelength of 532 nm, an energy density of 0.7 J / cm ² , and a pulse frequency of 4 kHz is used. Thereby, a plurality of photovoltaic elements 28 are formed.

Next, as shown in FIG.5 (c), the transparent conductive film 34 and the 2nd electrode layer 36 which wrap around the side part (outermost periphery) of the 1st electrode layer 30 or the semiconductor layer 32 are surface side (surface glass). It is removed by the laser irradiated from the plate 16 side. For the laser removal processing, an Nd (neodymium): YAG laser having a wavelength of 1064 nm, an energy density of 13 J / cm ² and a pulse frequency of 3 kHz is used.

  Thus, a plurality of photovoltaic elements 28 connected in series with each other are formed on the surface glass plate 16. As a result, as shown in FIG. 6, the photovoltaic device 12 is formed on one surface, and the surface glass plate 16 disposed on the light receiving side is produced. In addition, like the above-mentioned amorphous silicon type solar cell, when manufacturing the photovoltaic element 28 on a glass plate, if there exists a process using a laser, there exists a situation that it is difficult to employ | adopt tempered glass. In the case of such a type of solar cell module, it is particularly useful to include the resin member 18 according to the present embodiment.

  Next, as shown in FIG. 7, a sealing member 14 made of tape-like butyl rubber is disposed on the outer edge portion 16 c of the surface glass plate 16 so as to surround the photovoltaic device 12. Further, a sheet-like filler 24 a made of ethylene vinyl acetate (EVA) is disposed on the photovoltaic device 12. In addition, the resin member 18 is stacked on the surface glass plate 16 from the side opposite to the light receiving surface so as to cover the photovoltaic device 12. Further, a sheet-like filler 24 b made of ethylene vinyl acetate (EVA) is disposed on the resin member 18. And the back surface glass plate 26 is piled up on the resin member 18 so that the surface glass plate 16 may be opposed.

  In other words, the back glass plate 26 is disposed so that the sealing member 14, the resin member 18, the filler 24 a, and the filler 24 b made of butyl rubber are sandwiched between the front glass plate 16.

  In this state, the front glass plate 16 and the rear glass plate 26 are heated while being pressed in a vacuum atmosphere, thereby bonding the front glass plate 16 and the rear glass plate 26 via the resin member 18 and the fillers 24a and 24b. (Refer to FIG. 8A, but some members such as the photovoltaic device 12 are not shown). In addition, what is necessary is just to set a heating temperature suitably with the material and combination of the sealing member 14, the resin member 18, the filler 24a, and the filler 24b. In addition, the resin member 18 is preferably a thermoplastic material, and is preferably a material that generates fluidity when heated. Thereby, the adhesiveness of the resin member 18 and another member improves.

  Thereafter, the front glass plate 16 and the back glass plate 26 bonded through the resin member 18 are cooled to room temperature, and the solar cell module 10 is manufactured. In this cooling process, a compressive stress is generated inside the glass plate due to a difference in thermal expansion coefficient between the resin member 18 and the front glass plate 16 or the back glass plate 26.

  In other words, since the resin member 18 has a larger thermal expansion coefficient than glass, the resin member 18 contracts more than glass when cooled (see FIG. 8B). At that time, the front glass plate 16 and the back glass plate 26 bonded directly or indirectly are also subjected to compressive stress substantially parallel to the direction in which the resin member 18 contracts. That is, the resin member 18 functions as a compressive stress generating member that generates compressive stress inside the front glass plate 16 and the back glass plate 26.

  Even if there is a large difference in thermal expansion coefficient between the resin member 18 and the glass plate, if the resin member 18 easily expands after cooling (room temperature), a large compressive stress is generated between the resin member 18 and the glass plate. It is difficult to produce. Therefore, the resin member 18 is required to have a characteristic that the resin member 18 hardly expands after cooling (high tensile strength) in addition to a large difference in thermal expansion coefficient between the resin member 18 and the glass plate. Therefore, the resin member 18 can generate a larger compressive stress by being made of a material having a high tensile strength after cooling (room temperature) (see Table 2 described later).

  As described above, the solar cell module 10 according to the present embodiment includes the front glass plate 16 disposed on the light receiving side, the back glass plate 26 provided to face the front glass plate 16, and the front glass plate. The photovoltaic device 12 provided between 16 and the back glass plate 26, and between the front glass plate 16 and the back glass plate 26 so as to cover the photovoltaic device 12, and the front glass plate 16 and the back glass plate 26 are provided with a resin member 18 as a compressive stress generating member that generates a compressive stress.

  In the solar cell module 10, since compressive stress is generated in at least one of the front glass plate 16 and the back glass plate 26, the strength of the front glass plate 16 and the back glass plate 26 is improved. Therefore, a solar cell module having a desired strength can be realized even if the thickness of the glass plate is made thinner than before.

The resin member 18 is preferably selected from materials that can cause the front glass plate 16 and the back glass plate 26 to have a strain of 10 ⁻⁴ or more. Thereby, the intensity | strength of a glass plate can be improved significantly. Strain is measured using a strain gauge. The measuring method is to install a strain gauge on the glass plate in the state of the panel, and gradually remove other members that are bonded to the glass plate. Is a distortion.

  Next, an experiment for selecting a resin more suitable for the resin member 18 will be described below. First, as shown in FIG. 8A, the front glass plate 16, the filler 24a, the resin member 18, the filler 24b, and the back glass plate 26 of the same size are laminated and heated at 150 ° C. to be bonded. Panel. Here, the panel size is 55 mm × 65 mm. Thereafter, the panel is cooled to room temperature and a fracture strength test is performed.

  FIG. 9A is a schematic view seen from the top surface of the panel for explaining the breaking strength test, FIG. 9B is a side view of the panel for explaining the breaking strength test, and FIG. It is the schematic diagram seen from.

  In the breaking strength test, as shown in FIGS. 9A and 9B, the prepared panel 82 is placed on a bar-like member 80 having a width of 60 mm, and the panel 82 is placed at predetermined positions Pi. It is done by applying a load evenly from above with a pad. And the load at the time of the panel being destroyed was made into the breaking strength (load bearing strength) [kPa].

  FIG. 10 is a diagram illustrating a result of a fracture strength test of panels having different resin materials and different types of resin materials.

Example 1
The panel according to Example 1 includes a surface glass plate 16 having a thickness of 2 mm, a filler 24a made of ethylene vinyl acetate (EVA) having a thickness of 0.5 mm, a resin member 18 made of polypropylene resin (PP) having a thickness of 2 mm, A filler 24a made of ethylene vinyl acetate (EVA) having a thickness of 0.5 mm and a back glass plate 26 having a thickness of 2 mm are sequentially laminated. The panels laminated in this way were heated at 150 ° C., and the layers were bonded to each other. Thereafter, the panel was cooled to room temperature. And the above-mentioned breaking strength test was done and the breaking strength was measured. In addition, the sample number n of the breaking strength test in each Example and a comparative example is three. In the panel according to Example 1, the fracture strengths of the three samples were 9.24, 10.82, and 9.24 [kPa], respectively, and the average was 9.93 [kPa].

(Example 2)
The panel according to Example 2 includes a surface glass plate 16 having a thickness of 2 mm, a filler 24a made of ethylene vinyl acetate (EVA) having a thickness of 0.5 mm, a resin member 18 made of polycarbonate resin (PC) having a thickness of 2 mm, A filler 24a made of ethylene vinyl acetate (EVA) having a thickness of 0.5 mm and a back glass plate 26 having a thickness of 2 mm are sequentially laminated. The panel thus laminated was treated in the same manner as in Example 1. And the above-mentioned breaking strength test was done and the breaking strength was measured. In the panel according to Example 2, the breaking strength of each of the three samples was 10.71, 10.46, 10.17 [kPa], and the average was 10.45 [kPa].

(Comparative Example 1)
The panel according to Comparative Example 1 is obtained by sequentially laminating a surface glass plate 16 having a thickness of 2 mm, a filler made of ethylene vinyl acetate (EVA) having a thickness of 0.5 mm, and a back glass plate 26 having a thickness of 2 mm. . Comparative Example 1 does not include the resin member 18 described above. The panel thus laminated was treated in the same manner as in Example 1. And the above-mentioned breaking strength test was done and the breaking strength was measured. In the panel according to Comparative Example 1, the breaking strength of each of the three samples was 4.79, 4.11, 4.99 [kPa], and the average was 4.63 [kPa].

  As shown in Examples 1 and 2, a comparative example that does not include the resin member 18 by sandwiching a resin member 18 of polycarbonate resin (PC) or polypropylene resin (PP) inside the solar cell module, heat treatment, and cooling. Compared to the case of 1, the breaking strength was improved more than twice. Thus, by adopting a general-purpose resin such as polycarbonate resin (PC) or polypropylene resin (PP) as the compressive stress generating member, the strength of the solar cell module can be improved at a relatively low cost.

  Next, the relationship between the breaking strength and the glass plate thickness will be described. FIG. 11 is a diagram showing the relationship between the thickness of the glass plate in the panel and the breaking strength.

(Example 3)
The panel according to Example 3 includes a surface glass plate 16 having a thickness of 1.1 mm, a filler 24a made of ethylene vinyl acetate (EVA) having a thickness of 0.5 mm, and a resin member made of polypropylene resin (PP) having a thickness of 2 mm. 18. A filler 24a made of ethylene vinyl acetate (EVA) having a thickness of 0.5 mm and a back glass plate 26 having a thickness of 1.1 mm are sequentially laminated. The panel thus laminated was treated in the same manner as in Example 1. And the above-mentioned breaking strength test was done and the breaking strength was measured. In the panel according to Example 3, the fracture strengths of the three samples were 12.18, 14.88, and 11.82 [kPa], respectively, and the average was 12.96 [kPa].

(Comparative Example 2)
In the panel according to Comparative Example 2, a surface glass plate 16 having a thickness of 1.1 mm, a filler made of ethylene vinyl acetate (EVA) having a thickness of 0.5 mm, and a back glass plate 26 having a thickness of 1.1 mm are sequentially laminated. It is a thing. Comparative Example 2 does not include the resin member 18 described above. The panel thus laminated was treated in the same manner as in Example 1. And the above-mentioned breaking strength test was done and the breaking strength was measured. In the panel according to Comparative Example 2, the breaking strength of each of the three samples was 5.58, 4.68, 4.00 [kPa], and the average was 4.75 [kPa].

Example 4
The panel according to Example 4 includes a surface glass plate 16 having a thickness of 0.5 mm, a filler 24a made of ethylene vinyl acetate (EVA) having a thickness of 0.5 mm, and a resin member made of polypropylene resin (PP) having a thickness of 2 mm. 18. A filler 24a made of ethylene vinyl acetate (EVA) having a thickness of 0.5 mm and a back glass plate 26 having a thickness of 0.5 mm are sequentially laminated. The panel thus laminated was treated in the same manner as in Example 1. And the above-mentioned breaking strength test was done and the breaking strength was measured. In the panel according to Example 4, the breaking strengths of the three samples were 7.65, 7.82, and 6.52 [kPa], respectively, and the average was 7.33 [kPa].

(Comparative Example 3)
In the panel according to Comparative Example 3, a surface glass plate 16 having a thickness of 0.5 mm, a filler made of ethylene vinyl acetate (EVA) having a thickness of 0.5 mm, and a back glass plate 26 having a thickness of 0.5 mm are sequentially laminated. It is a thing. Comparative Example 3 does not include the resin member 18 described above. The panel thus laminated was treated in the same manner as in Example 1. And the above-mentioned breaking strength test was done and the breaking strength was measured. In the panel according to Comparative Example 3, the breaking strengths of the three samples were 3.66, 3.57, and 1.87 [kPa], respectively, and the average was 3.03 [kPa].

  As shown in Examples 1, 3, and 4, the solar cell module sandwiching the resin member sets the thickness of the front glass plate 16 and the back glass plate 26 in a range of at least 0.5 to 2.0 mm. Compared with the solar cell module in which the resin member shown in Comparative Examples 1 to 3 is not sandwiched, the breaking strength is improved twice or more. Therefore, by setting the thickness of the glass plate in a range of at least 0.5 to 2.0 mm, it is possible to reduce the thickness of the glass while satisfying a desired strength.

  Next, physical properties of a preferable resin material will be described. Table 2 shows some examples of resin materials and their physical property values.

Although ethylene vinyl acetate (EVA) has a relatively high coefficient of thermal expansion, its tensile strength is low, so that the compressive stress that can be generated on the glass plate after cooling the panel is not sufficient. On the other hand, polycarbonate resin (PC), polypropylene resin (PP), vinyl chloride resin, etc. have a thermal expansion coefficient of 6.0 × 10 ⁻⁵ [1 / K] or more and a tensile strength of 300 [kg / cm ² ] or more. It is preferable because a sufficient compressive stress can be generated in the glass plate. In view of the heat resistant temperature, a material of 100 ° C. or higher is more preferable.

  As described above, in the present embodiment, ethylene vinyl acetate (EVA) is further provided as an adhesive layer disposed between the resin member 18 and the front glass plate 16 and the back glass plate 26. . Thereby, even if it is a resin member with bad adhesiveness with a glass plate, it can employ | adopt as a compressive-stress generating member.

  Thus, since the resin member 18 can generate a compressive stress inside the front glass plate 16 or the back glass plate 26, the strength of the front glass plate 16 or the back glass plate 26 can be improved. Therefore, a solar cell module having a desired strength can be realized even if the thickness of the glass plate is made thinner than before.

  As described above, the present invention has been described with reference to the above-described embodiment. However, the present invention is not limited to the above-described embodiment, and the present invention can be appropriately combined or replaced with the configuration of the embodiment. It is included in the present invention. In addition, it is possible to appropriately change the combination and processing order in the embodiment based on the knowledge of those skilled in the art and to add various modifications such as various design changes to the embodiment. The described embodiments can also be included in the scope of the present invention.

  As the sealing member 14 and the fillers 24a and 24b according to the above-described embodiment, in addition to butyl rubber and ethylene vinyl acetate (EVA), a material used for caulking such as silicone, a filling resin material such as polyvinyl butyral (PVB), ethylene Ethylene resins such as ethyl acrylate copolymer (EEA), urethane, acrylic, epoxy resin, and the like may be used.

As the first electrode layer 30 according to each of the above-described embodiments, in addition to zinc oxide (ZnO), tin oxide (SnO ₂ ), indium oxide (In ₂ O ₃ ), titanium oxide (TiO ₂ ), zinc stannate (Zn 2 _{SnO 4)} may be configured by a metal one kind selected from oxides or plural kinds of laminates such. Note that these metal oxides may be doped with fluorine (F), tin (Sn), aluminum (Al), gallium (Ga), niobium (Nb), or the like.

  DESCRIPTION OF SYMBOLS 10 Solar cell module, 12 Photovoltaic apparatus, 14 Sealing member, 16 Surface glass plate, 16a Light-receiving surface, 16b Back surface, 16c Outer edge part, 18 Resin member, 20 Insulator, 22 Interconnector, 22a Conductive part, 22b Wiring 24a, 24b filler, 26 back glass plate, 28 photovoltaic element, 38 through-hole, 40 terminal box.

Claims (6)

A first glass plate disposed on the light receiving side;
A second glass plate provided to face the first glass plate;
A photovoltaic device provided between the first glass plate and the second glass plate;
Provided between the first glass plate and the second glass plate so as to cover the photovoltaic device, and generates compressive stress inside the first glass plate and the second glass plate A compressive stress generating member,
A solar cell module comprising: 2. The solar cell module according to claim 1, wherein the compressive stress generating member causes a strain of 10 ⁻⁴ or more in the first glass plate and the second glass plate.   The solar cell module according to claim 1, wherein the compressive stress generating member is a polycarbonate resin or a polypropylene resin. The compressive stress generating member has a thermal expansion coefficient of 6.0 × 10 ⁻⁵ [1 / K] or more and a tensile strength of 300 [kg / cm ² ] or more. The solar cell module of any one of Claims. An adhesive layer disposed between the compression stress generating member, the first glass plate and the second glass plate;
5. The adhesive layer according to claim 1, wherein the adhesive layer increases an adhesive strength between the compressive stress generating member, the first glass plate, and the second glass plate. 6. Solar cell module. A step of preparing a first glass plate on one side where a photovoltaic device is formed and disposed on the light receiving side;
A step of superposing a resin member on the first glass plate from the one surface side so as to cover the photovoltaic device;
Stacking a second glass plate on the resin member so as to face the first glass plate;
Heating with the resin member sandwiched between the first glass plate and the second glass plate, and bonding the first glass plate and the second glass plate through the resin member And a process of
Cooling the first glass plate and the second glass plate bonded via the resin member;
A method for producing a solar cell module, comprising:

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