JP2013088445A - Drive module for image display panel, and image display device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a drive module of small heat resistance and a few assembly man-hours.SOLUTION: For a drive module 50 for an image display panel, an IC chip 60 for driving an electrode of the image display panel is loaded on a flexible wiring board 52. At least one surface of the IC chip 60 and a surface of the flexible wiring board 52 around the IC chip are covered with a heat conductive resin to form a heat radiation layer 64, and the surface is exposed.

Description

  The present invention relates to a drive module for an image display panel such as a plasma display panel, and an image display apparatus using the same.

  A plasma display device using a typical plasma display panel (hereinafter simply abbreviated as “panel”) as an image display panel has a wide viewing angle, is easy to enlarge, is self-luminous, and has an image display quality. Is the mainstream of large-screen image display devices.

  In the panel, a large number of discharge cells are formed between a front substrate and a rear substrate which are arranged to face each other. On the front substrate, a plurality of display electrode pairs including a pair of scan electrodes and sustain electrodes are formed in parallel to each other, and a dielectric layer and a protective layer are formed so as to cover the display electrode pairs. On the back substrate, a plurality of parallel data electrodes, a dielectric layer so as to cover them, and a plurality of barrier ribs in parallel with the data electrodes are formed thereon, respectively. A phosphor layer is formed on the side surface. Then, the front substrate and the rear substrate are arranged to face each other and sealed so that the display electrode pair and the data electrode are three-dimensionally crossed, and a discharge gas containing, for example, xenon is sealed in the internal discharge space. Here, a discharge cell is formed in a portion where the display electrode pair and the data electrode face each other.

  In order to configure a plasma display device using such a panel, a flexible wiring board (hereinafter abbreviated as “FPC”) for applying a driving voltage to each electrode is connected to the panel. In particular, the data electrode FPC for applying a driving voltage to the data electrode is equipped with a data electrode driving IC chip (hereinafter simply referred to as “IC chip”) for driving each of the data electrodes. . A device having such a function of driving an electrode is referred to as a drive module for an image display panel (hereinafter simply referred to as “drive module”). The data electrode drive module has an output terminal for connecting the output of the IC chip and the data electrode, and an input terminal for connecting the input of the IC chip and the drive circuit portion. Is electrically connected to each of the electrode lead portions of the data electrode of the panel via an anisotropic conductive adhesive or the like.

  Here, since the temperature of the IC chip for driving the data electrode is high, it is necessary to mount the IC chip in consideration of sufficiently low thermal resistance. Therefore, a structure in which a heat radiating plate for heat dissipation is attached as a drive module on which this IC chip is mounted is disclosed. The heat sink is provided with a recess into which the IC chip is fitted, and a small thermal resistance can be realized by filling the recess with a heat conductive member (see, for example, Patent Document 1).

JP 2005-338706 A

  However, even when the drive module having such a configuration is used, there is a problem in that peeling occurs between the IC chip and the heat radiating plate during use, and the thermal resistance increases. In addition, processing of the heat radiating plate, an increase in the number of assembling steps for attaching the heat radiating plate to the FPC, and an increase in the number of man-hours for attaching the drive module to the chassis have also caused cost increase.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a drive module having a low thermal resistance and a small number of assembly steps, and an image display device using the drive module.

  In order to achieve the above object, the present invention provides a drive module for an image display panel in which an IC chip for driving an electrode of the image display panel is mounted on a flexible wiring board, and includes at least one surface of the IC chip and the IC chip. The surface of the surrounding flexible wiring board is covered with a heat conductive resin to form a heat dissipation layer, and the surface is exposed. With this configuration, it is possible to provide a drive module having a low thermal resistance and a small number of assembly steps.

  Moreover, you may provide a slit-shaped ventilation hole in the area | region which does not form the thermal radiation layer of the flexible wiring board of the drive module of this invention.

  Further, the heat conductive resin of the drive module of the present invention may be a silicon resin in which a heat conductive filler is dispersed.

  The present invention also provides an image display device comprising: an image display panel; the drive module described above; a circuit board that supplies signals and power to the drive module; and a chassis that holds the image display panel and the circuit board. The drive module is connected to the electrode of the image display panel and the circuit board, and is mounted with a predetermined space between the drive module and the chassis. With this configuration, it is possible to provide an image display device including a drive module having a low thermal resistance and a small number of assembly steps.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide a drive module with small thermal resistance and few assembly steps, and an image display apparatus using the same.

It is a disassembled perspective view of the panel of the plasma display apparatus in embodiment of this invention. It is an electrode array figure of the panel of the plasma display apparatus. It is a schematic diagram of the external appearance of the panel of the plasma display apparatus. It is a schematic diagram of the external appearance of the panel of the plasma display apparatus. It is detail drawing of the drive module of the plasma display apparatus. It is detail drawing of the drive module of the plasma display apparatus. It is a top view of the drive module of the plasma display apparatus. It is a side view of the drive module of the plasma display apparatus. It is a disassembled perspective view of the drive module of the plasma display apparatus. It is sectional drawing of the drive module of the plasma display apparatus. It is a disassembled perspective view which shows the structure of the plasma display apparatus. It is a figure which shows the mode of mounting of the drive module of the plasma display apparatus. It is a figure which shows the mode of mounting of the drive module of the plasma display apparatus.

  Hereinafter, as an image display apparatus according to an embodiment of the present invention, a plasma display apparatus using a plasma display panel will be described as an example with reference to the drawings.

(Embodiment)
FIG. 1 is an exploded perspective view of panel 10 of the plasma display device in accordance with the exemplary embodiment of the present invention. The panel 10 is configured such that a glass front substrate 21 and a rear substrate 31 are arranged to face each other and a discharge space is formed therebetween. On the front substrate 21, a plurality of scanning electrodes 22 and sustaining electrodes 23 constituting a display electrode pair are formed in parallel with each other. A dielectric layer 24 is formed so as to cover the scan electrodes 22 and the sustain electrodes 23, and a protective layer 25 is formed on the dielectric layer 24. A plurality of data electrodes 32 are formed on the back substrate 31, and a dielectric layer 33 is formed so as to cover the data electrodes 32. On the dielectric layer 33, a grid-like partition wall 34 is provided. Further, a phosphor layer 35 is provided on the surface of the dielectric layer 33 and the side surfaces of the partition walls 34. The front substrate 21 and the rear substrate 31 are arranged to face each other in the direction in which the scan electrode 22 and the sustain electrode 23 intersect with the data electrode 32, and in the discharge space formed therebetween, for example, neon And a mixed gas of xenon. Note that the structure of the panel 10 is not limited to the above-described structure, and for example, the panel 10 may include a stripe-shaped partition wall.

  FIG. 2 is an electrode array diagram of panel 10 of the plasma display device in accordance with the exemplary embodiment of the present invention. N scanning electrodes 22 and n sustain electrodes 23 that are long in the row direction are arranged, and m data electrodes 32 that are long in the column direction are arranged. A discharge cell is formed at a portion where one pair of scan electrode 22 and sustain electrode 23 intersects with one data electrode 32, and m × n discharge cells are formed in the discharge space.

  3A and 3B are schematic views of the appearance of the panel 10 of the plasma display device in accordance with the exemplary embodiment of the present invention. FIG. 3A is a view of the panel 10 viewed from the rear substrate 31 side, and FIG. 3B is a front substrate. It is the figure seen from 21 side.

  The front substrate 21 and the rear substrate 31 of the panel 10 are rectangular and have a long side and a short side. As shown in FIG. 3A, an electrode lead portion 42 for a scanning electrode is formed on the right side of the short side of the front substrate 21. Each of the electrode lead portions 42 is connected to each of the n scanning electrodes 22. Further, an electrode lead-out portion 43 for a sustain electrode is formed on the left side of the short side of the front substrate 21. Each of the electrode lead portions 43 is connected to each of the n sustain electrodes 23. Each of the electrode lead portions 42 and 43 is divided into a plurality of blocks, and a scan electrode FPC and a sustain electrode FPC are connected to each block. As shown in FIG. 3B, an electrode lead-out portion 44 for data electrodes is formed below the long side of the back substrate 31. Each of the electrode lead portions 44 is connected to each of the m data electrodes 32. The electrode lead portion 44 is also divided into a plurality of blocks, and a drive module 50 for driving the data electrode 32 is connected to each block.

  4A and 4B are detailed views of the driving module 50 of the plasma display device according to the embodiment of the present invention. FIG. 4A is a view of the driving module 50 as seen from one side, and FIG. It is the figure which looked at from the other side.

  In the drive module 50, an IC chip for driving the data electrode 32 is mounted face up on an FPC 52 made of a flexible polyimide resin film or the like. 4A, a sealing resin 62 such as an epoxy resin is filled so as to cover the element surface side of the IC chip to protect the IC chip from mechanical damage. As shown in FIG. 4B, a heat dissipation layer 64 for heat dissipation of the IC chip is formed on the substrate surface side of the IC chip. The heat radiation layer 64 is formed by applying and curing a heat conductive resin on a wide area of the IC chip and the surrounding FPC 52. And the surface of the heat dissipation layer 64 is exposed without attaching a heat dissipation plate or the like.

  A plurality of output terminals 56 connected to the output of the IC chip are formed on one side of the FPC 52. The output terminal 56 is used for connection to each of the electrode lead portions 44 for data electrodes of the panel 10 using an anisotropic conductive adhesive or the like. On the other side of the FPC 52, an input terminal 58 connected to the input of the IC chip is formed. The input terminal 58 is for connection to a circuit board that supplies signals and power to the drive module 50. Furthermore, in the drive module 50 of the present embodiment, a slit-like ventilation hole 54 is provided in a region where the heat dissipation layer 64 of the FPC 52 is not formed in order to form a ventilation path when the drive module 50 is mounted.

  5A to 5D are diagrams showing details of the driving module 50 of the plasma display device in accordance with the exemplary embodiment of the present invention. FIG. 5A is a plan view, FIG. 5B is a side view, FIG. 5C is an exploded perspective view, and FIG. FIG. 4 is a cross-sectional view of the surface including the IC chip 60.

  The dimensions of the IC chip 60 are, for example, 1 (mm) × 12 (mm), and projecting electrodes made of Au or the like are provided as input / output terminals on the element surface side. The bump electrode is mounted by eutectic connection to the wiring portion exposed at the opening 53 of the FPC 52. The dimension of the sealing resin 62 covering the element surface side of the IC chip 60 is, for example, 3 (mm) × 15 (mm).

  The heat dissipation layer 64 covering the substrate surface side of the IC chip 60 is formed by applying and curing a heat conductive resin as described above. The heat conductive resin in the present embodiment is a silicon resin in which a heat conductive filler is dispersed. Such a heat conductive silicon resin has, for example, a room temperature curable type or thermosetting type silicon resin as a main material, and Al 2 O 3 and SiO 2 are dispersed as a heat conductive filler material, and the heat conductivity is, for example, 0 2 to 5 (W / m · K). The dimensions of the heat dissipation layer 64 are, for example, an area of 8 (mm) × 30 (mm) and a thickness of 1.3 (mm).

  As described above, the drive module 50 according to the present embodiment has the IC chip 60 that drives the data electrode 32 of the panel 10 mounted on the FPC 52, and at least one surface of the IC chip 60 and the surface of the FPC 52 around the IC chip 60 are arranged. The heat radiation layer 64 is formed by covering with a heat conductive resin, and the surface thereof is exposed. That is, instead of the conventional heat dissipation plate, a heat dissipation layer 64 made of thermally conductive silicon resin is formed on one surface of the IC chip 60 and the surface of the FPC 52. Thereby, the assembly man-hour and cost of the drive module 50 can be significantly reduced.

  FIG. 6 is an exploded perspective view showing the structure of plasma display device 80 in accordance with the exemplary embodiment of the present invention. The plasma display device 80 drives the panel 10 such as the panel 10 to which the drive module 50 is connected, the chassis 81, the heat conductive sheet 82, the power supply circuit, the scan electrode drive circuit, the sustain electrode drive circuit, and the timing generation circuit. The circuit board group 83 on which these circuits are mounted, and a front frame 84 and a back cover 85 for storing them.

  The scan electrode flexible substrate and the sustain electrode flexible substrate are connected to the scan electrode electrode lead portion and the sustain electrode electrode lead portion provided on the short side of the panel 10, respectively. An output terminal 56 of the drive module 50 is connected to the electrode lead portion 44 for the data electrode provided on the lower side of the long side of the panel 10.

  The heat conductive sheet 82 is provided to adhere the panel 10 to the chassis 81 and to release the heat generated in the panel 10 to the chassis 81. The chassis 81 holds the panel 10 on one side via the heat conductive sheet 82, and each circuit board of the circuit board group 83 is attached to the other side.

  FIG. 6 clearly shows a circuit board 90 on which a circuit for supplying signals and power to the drive module 50 is mounted in the circuit board group 83. The circuit board 90 is provided with a plurality of connectors 92 for connecting the input terminals 58 of the drive module 50.

  7A and 7B are views showing a state of mounting of the drive module 50 of the plasma display device 80 in the embodiment of the present invention. FIG. 7A is an enlarged view seen from the back cover 85 side, and FIG. It is sectional drawing along the AA of 7A. The drive module 50 having the output terminal 56 connected to the electrode lead portion 44 of the data electrode 32 of the panel 10 passes over the chassis 81, and the input terminal 58 is connected to the connector 92. At this time, as shown in FIG. 7B, the drive module 50 is mounted at a predetermined interval so as not to contact the chassis 81. Therefore, an air flow indicated by a dotted line B is generated through the vent hole 54 of the FPC 52, and the IC chip is also cooled from the sealing resin 62 side of the drive module 50. Further, since the sealing resin 62 of the drive module 50 and the chassis 81 are not in contact with each other, there is no possibility that the sealing resin 62 is broken.

  Furthermore, since it is not necessary to fix the drive module 50 to the chassis 81, the assembly man-hour of the plasma display apparatus 80 can also be reduced.

  As described above, the image display device 80 includes the image display panel 10, the drive module 50, the circuit board 90 that supplies signals and power to the drive module 50, and the chassis 81 that holds the image display panel 10 and the circuit board 90. In addition, the drive module 50 is connected to the data electrode 32 and the circuit board 90 of the image display panel 10, and is mounted at a predetermined interval from the chassis 81.

  In the present embodiment, it has been described that the electrode lead portion 44 for data electrodes is formed on the lower side of the long side of the back substrate 31 and the drive module 50 is also connected to the lower side of the panel 10. However, when the electrode lead portion 44 for the data electrode is formed on the upper side of the long side of the panel 10, the drive module 50 is also connected to the upper side of the panel 10 and is formed on the upper side and the lower side of the long side. In this case, the drive module 50 may be connected to the upper side and the lower side of the panel 10.

  Further, the specific numerical values and the like shown in the embodiments are merely examples, and the present invention is not limited to these numerical values. These numerical values and the like are desirably set optimally in accordance with the characteristics of the image display device to be used and the specifications of the image display apparatus.

  INDUSTRIAL APPLICABILITY The present invention can provide a drive module having a low thermal resistance and a small number of assembly steps, and is useful as an image display device.

DESCRIPTION OF SYMBOLS 10 Panel 21 Front substrate 22 Scan electrode 23 Sustain electrode 31 Back substrate 32 Data electrode 42 Electrode extraction part (for sustain electrode) 43 Electrode extraction part (for scan electrode) 44 Electrode extraction part (for data electrode) 50 Drive module 52 FPC (for data electrodes)
53 FPC opening 54 Ventilation hole 56 Output terminal 58 Input terminal 60 IC chip 62 Sealing resin 64 Heat radiation layer 80 Plasma display device 81 Chassis 82 Thermal conductive sheet 83 Circuit board group 84 Front frame 85 Back cover 90 Circuit board 92 Connector

Claims (4)

A drive module for an image display panel in which an IC chip for driving an electrode of the image display panel is mounted on a flexible wiring board,
An image display panel characterized in that at least one surface of the IC chip and a surface of a flexible wiring board around the IC chip are covered with a heat conductive resin to form a heat dissipation layer and the surface is exposed. Drive module. The drive module for an image display panel according to claim 1, wherein a slit-shaped ventilation hole is provided in a region where the heat dissipation layer of the flexible wiring board is not formed. The drive module for an image display panel according to claim 1, wherein the heat conductive resin is a silicon resin in which a heat conductive filler is dispersed. An image display device comprising: an image display panel; a drive module according to claim 1; a circuit board that supplies signals and power to the drive module; and a chassis that holds the image display panel and the circuit board. And
An image display device, wherein the drive module is connected to an electrode of the image display panel and the circuit board, and is mounted at a predetermined interval from the chassis.

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