JP2013084642A - Resin case, manufacturing method thereof, and electronic control device using resin case - Google Patents

Resin case, manufacturing method thereof, and electronic control device using resin case Download PDF

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JP2013084642A
JP2013084642A JP2011221476A JP2011221476A JP2013084642A JP 2013084642 A JP2013084642 A JP 2013084642A JP 2011221476 A JP2011221476 A JP 2011221476A JP 2011221476 A JP2011221476 A JP 2011221476A JP 2013084642 A JP2013084642 A JP 2013084642A
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resin
resin case
shape
sealing
passage
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JP5703185B2 (en
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Katsuhide Ohashi
克英 大橋
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Hitachi Astemo Ltd
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Hitachi Automotive Systems Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a resin case with improved reliability.SOLUTION: A resin case has a through path communicating a connector with an inside part in which a circuit board is mounted. The through path is constituted by plural branch passages, and a tip of at least one of the branch passages is sealed with resin, and a shape of resin sealing is conical. When a height of the conical shape is designated as H and an outside diameter of a bottom face of the conical shape is designated as L, H>1/2L is satisfied.

Description

本発明は、インサート部材をインサートした樹脂ケース及びその樹脂ケースを用いた電子制御装置に係り、特に、複数本の電気的接続用端子が樹脂で一体にインサート成形された複合一体樹脂成形品およびその成形品を用いた電子制御装置に関する。   The present invention relates to a resin case in which an insert member is inserted and an electronic control device using the resin case, and in particular, a composite integrated resin molded product in which a plurality of electrical connection terminals are integrally insert-molded with a resin, and the same The present invention relates to an electronic control device using a molded product.

電子化が進む中、複数本の外部との電気的接続用端子を樹脂でインサート成形した樹脂ケース本体において、ケース周囲の温度変化に伴うケース内部空気の内圧変化に対し、内圧緩和するためにケース内部と外部とをバイパスする連通した貫通孔が設けられている。   As the computerization progresses, in the resin case body in which a plurality of terminals for electrical connection with the outside are insert-molded with resin, a case is used to relieve the internal pressure against the internal pressure change of the case internal air due to the temperature change around the case A communicating through hole that bypasses the inside and the outside is provided.

また、外部側の貫通孔開口部は水の浸入を防ぐため、コネクタ内にパッキン等のシール部材で防水する処置が一般的に採用されている。   In addition, in order to prevent water from entering the outer through-hole opening, a measure of waterproofing with a seal member such as packing is generally employed in the connector.

更に、コネクタの方向も部品の取り付けスペースに対応するため、樹脂ケース本体に対して、垂直方向に曲げることが求められる。   Furthermore, since the direction of the connector also corresponds to the mounting space of the parts, it is required to bend the resin case body in the vertical direction.

なお、樹脂ケース本体には本体内部に電子部品を搭載した回路基板の保護にゲルが用いられるため、このゲルが外部へ流れ出さないようにする必要があった。   In the resin case main body, gel is used to protect the circuit board on which the electronic components are mounted inside the main body. Therefore, it is necessary to prevent the gel from flowing out.

このような場合、特許文献1では、予めケースを成形する金型で3方向に開口した開口口を有する貫通孔を形成し、樹脂が冷却固化した後、金型より取り出し、成形とは別の工程となる二次加工作業で3方向に開口した開口口の一ヶ所に対し、加熱した治具を用いて開口口近傍の樹脂を溶かし、台形もしくはドーム型形状で開口口を塞いでいた。   In such a case, in Patent Document 1, a through hole having openings opened in three directions is formed in advance by a mold for molding a case, and after the resin is cooled and solidified, it is taken out from the mold and is separate from molding. The resin in the vicinity of the opening was melted at one location of the opening that was opened in three directions in the secondary processing operation as a process, and the opening was closed with a trapezoidal or dome shape.

特開2004−55829号公報JP 2004-55829 A

しかしながら、開口穴を特許文献1に記載のような台形もしくはドーム型形状にすると、穴奥方向への押し込みが過大であり、封止に用いられる溶融樹脂のほとんどが穴内部の奥方向に流れ込んでしまう。更に穴内部の界面と台形もしくはドーム型形状の表面との距離が近接となり、外部からの浸水に対し、封止不足が生じやすくなる問題があった。   However, when the opening hole has a trapezoidal or dome shape as described in Patent Document 1, the pushing into the hole back direction is excessive, and most of the molten resin used for sealing flows into the hole inside the hole. End up. Furthermore, the distance between the interface inside the hole and the trapezoidal or dome-shaped surface becomes close, and there is a problem that sealing is likely to occur due to water immersion from the outside.

本発明の目的は、信頼性を向上させた樹脂ケースを提供することにある。   An object of the present invention is to provide a resin case with improved reliability.

上記目的を達成するために、本発明の樹脂ケースは、コネクタと回路基板が搭載された内部とを連通する貫通路を有する樹脂ケースにおいて、前記貫通路は、複数の分岐通路から構成され、前記分岐通路のうち少なくとも一つの分岐通路の先端部が樹脂で封止されており、前記樹脂封止の形状は、円錐形状であり、前記円錐形状の高さをH、前記円錐形状の底面の外径をLとするとH>1/2Lとした。   In order to achieve the above object, the resin case of the present invention is a resin case having a through passage that communicates a connector and an inside in which a circuit board is mounted, wherein the through passage is composed of a plurality of branch passages, The tip of at least one of the branch passages is sealed with resin, and the shape of the resin seal is a cone shape, the height of the cone shape is H, and the outside of the bottom surface of the cone shape is When the diameter is L, H> 1 / 2L.

本発明によれば、信頼性を向上させた樹脂ケースを提供することが可能となる。   According to the present invention, it is possible to provide a resin case with improved reliability.

第1実施例の樹脂ケースS−S断面図。The resin case SS sectional drawing of 1st Example. 第1実施例の樹脂ケースの平面図。The top view of the resin case of 1st Example. 第1実施例の樹脂ケースの上面図。The top view of the resin case of 1st Example. 第1実施例の樹脂ケース封止前の断面図。Sectional drawing before resin case sealing of 1st Example. 第1実施例の樹脂ケース封止前の部分拡大断面図。The partial expanded sectional view before resin case sealing of the 1st example. 第1実施例の樹脂ケース封止時の部分拡大断面図。The partial expanded sectional view at the time of resin case sealing of the 1st example. 第1実施例の樹脂ケース封止後の部分拡大断面図。The partial expanded sectional view after the resin case sealing of 1st Example. 第1実施例の樹脂ケース封止後の部分拡大断面図。The partial expanded sectional view after the resin case sealing of 1st Example. 従来の樹脂ケース封止時の部分拡大断面図。The partial expanded sectional view at the time of the conventional resin case sealing. 従来の樹脂ケース封止後の部分拡大断面図。The partial expanded sectional view after the conventional resin case sealing. 従来の樹脂ケース封止後の部分拡大断面図。The partial expanded sectional view after the conventional resin case sealing. 第2実施例の樹脂ケース封止時の部分拡大断面図。The partial expanded sectional view at the time of resin case sealing of 2nd Example. 第2実施例の樹脂ケース封止後の部分拡大断面図。The partial expanded sectional view after resin case sealing of 2nd Example. 第2実施例の樹脂ケース封止後の部分拡大断面図。The partial expanded sectional view after resin case sealing of 2nd Example. 第3実施例の樹脂ケース封止時の部分拡大断面図。The partial expanded sectional view at the time of resin case sealing of 3rd Example. 第3実施例の樹脂ケース封止後の部分拡大断面図。The partial expanded sectional view after resin case sealing of 3rd Example. 第3実施例の樹脂ケース封止後の部分拡大断面図。The partial expanded sectional view after resin case sealing of 3rd Example. 第1実施例の樹脂ケース封止後の部分拡大断面写真。The partial expanded sectional photograph after the resin case sealing of 1st Example. 樹脂ケース封止後の部分拡大断面写真。Partial enlarged cross-sectional photograph after resin case sealing. 第2実施例の樹脂ケース封止後の部分拡大断面写真。The partial expanded cross-section photograph after resin case sealing of 2nd Example.

以下に図面を用いて本発明の望ましい実施例について説明する。   Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

図1は、本発明にかかる第1実施例として示した樹脂ケース1の要所断面図S−Sである。   FIG. 1 is a cross-sectional view SS of a resin case 1 shown as a first embodiment according to the present invention.

ここで樹脂ケース1は、以下図2で示すような構成で作られている。   Here, the resin case 1 is made as shown in FIG.

具体的には、樹脂ケース1は外部と電気的接続を行うために、複数の端子5と樹脂ケース1のセンシング機能を組み付ける端子8、また樹脂ケース1を車両に取り付け固定する部位として設けられた金属製のベース6をインサート部材として、樹脂9で一体的に包みこんだインサート成形品である。図3にQ方向から見た樹脂ケース1の外観を示す。   Specifically, the resin case 1 is provided as a portion for assembling a plurality of terminals 5 and the sensing function of the resin case 1 and attaching the resin case 1 to the vehicle for electrical connection with the outside. This is an insert-molded product in which a metal base 6 is used as an insert member and is integrally wrapped with a resin 9. FIG. 3 shows the appearance of the resin case 1 as viewed from the Q direction.

更に、樹脂ケース1は、組み込み工程でケース枠7の内部に回路基板を搭載し、センシング機能を付加した電子制御装置として用いられる。ここで電子制御装置は、前記回路基板の保護及び機密性を持たせるために、ケース枠7の裏側と表側に他部品を接着剤で組み付けている。この接着剤を硬化させるときに、加熱処理が伴い、密閉したケース枠7内の空気が膨張してしまうため、膨張した空気を外部へ放出する貫通孔2を設ける必要があった。尚、この時外部からの浸水も防止する必要性があるため、車両へ組み込んだ際、防水構造が保たれる、コネクタ3内側へ設置する制約が生じていた。   Further, the resin case 1 is used as an electronic control device in which a circuit board is mounted inside the case frame 7 and a sensing function is added in an assembling process. Here, the electronic control device is assembled with other parts on the back side and the front side of the case frame 7 with an adhesive to protect the circuit board and provide confidentiality. When this adhesive is cured, the heat treatment is accompanied and the air in the sealed case frame 7 expands, so that it is necessary to provide the through hole 2 for releasing the expanded air to the outside. At this time, since it is necessary to prevent water from entering from the outside, there has been a restriction that the waterproof structure is maintained when it is assembled in the vehicle, and the connector 3 is installed inside the connector 3.

そこで樹脂ケース1の構造及び製法を詳細に示すため、図面を用いて以下に説明する。   Therefore, in order to show the structure and manufacturing method of the resin case 1 in detail, it will be described below with reference to the drawings.

樹脂ケース1はインサート部材を金型にセットし、樹脂で一体的にインサート成形した後、金型から取り出す。その時の樹脂ケース1の部分断面図を図4に示す。   The resin case 1 has an insert member set in a mold, is integrally insert-molded with resin, and is then taken out from the mold. FIG. 4 shows a partial sectional view of the resin case 1 at that time.

樹脂ケース1は図2の回路基板を搭載する面11に対して、図4に示す略垂直面に向く外部とのコネクタ3を有し、更に前記コネクタ3内と回路基板を搭載する内部とを連通する貫通孔2を有し、前記貫通孔2は3方向に屈曲した通路であり、前記通路は回路基板搭載面11に略垂直方向に形成する樹脂ケース内側の通路2aと、コネクタ内にコネクタの向きと略平行に形成する通路2bと、回路基板搭載面に略平行方向で前記2ヶ所の通路をバイパスするバイパス通路2cからなり、前記バイパス通路2cの樹脂ケース1外部側の開口口2dにおいて、外側開口口2dの付根に、図5で示すようにバイパス通路2cと平行で外側へ突起した煙突状の樹脂帯9aを一体的に有している。この時、前記樹脂帯9aの外形と板厚を、それぞれLとTとする。   The resin case 1 has an external connector 3 facing a substantially vertical plane shown in FIG. 4 with respect to the surface 11 on which the circuit board of FIG. 2 is mounted, and further includes an inside of the connector 3 and an interior of the circuit board. There is a through hole 2 that communicates, and the through hole 2 is a passage that is bent in three directions. The passage is a passage 2a that is formed in a direction substantially perpendicular to the circuit board mounting surface 11 and a connector in the connector. And a bypass passage 2c that bypasses the two passages in a direction substantially parallel to the circuit board mounting surface, and an opening 2d on the outside of the resin case 1 of the bypass passage 2c. As shown in FIG. 5, a chimney-like resin band 9a protruding outward in parallel with the bypass passage 2c is integrally provided at the root of the outer opening 2d. At this time, the outer shape and the plate thickness of the resin band 9a are L and T, respectively.

この断面図からも判るように、開口口2dは外面に開口しているため、上記で記述したように、外部からの浸水防止を図るため、開口口2dの封止を施さなければ成らない。   As can be seen from this cross-sectional view, since the opening 2d is open to the outer surface, as described above, the opening 2d must be sealed in order to prevent water from entering from the outside.

そこで開口口2dにおける、従来の浸水防止製法を以下に説明する。   Therefore, a conventional method for preventing flooding at the opening 2d will be described below.

初めに、図5で示すように煙突状の樹脂帯9a部位に熱を加え、樹脂帯9a部位を軟らかく溶融させる。次に図9で示すような先端がドーム型110に加工された封止治具10bを用いて、樹脂帯9aの上方向からバイパス通路2cの奥側へ向けて、軟らかく溶融している樹脂帯9aの上部から付根方向に封止治具10bで押し込む。   First, as shown in FIG. 5, heat is applied to the chimney-shaped resin band 9 a site to melt the resin band 9 a site softly. Next, using a sealing jig 10b whose tip is processed into a dome shape 110 as shown in FIG. 9, the resin band is softly melted from the upper direction of the resin band 9a toward the back side of the bypass passage 2c. The sealing jig 10b is pushed in from the top of 9a in the root direction.

この時、軟らかく溶融している樹脂帯9aは、封止治具10bのドーム型110形状に倣い樹脂が流動する。流動する前の樹脂帯9aの開口口2d形状から、初めに封止治具10bのドーム型110形状と接触する樹脂帯9a上部においては、樹脂の流動は樹脂流動111のようにドーム型110形状のR面に沿って、開口口2dの中央に集められる、しかしドーム型中央部には流動した樹脂を溜めるスペースが少ないために、中央に集められて溶融樹脂は、行き場所が無くなり、バイパス通路2c内部奥方向に樹脂流動112し始める。また、ドーム型110形状の中央部は比較的平面に近い形状をしているため、封止治具10bにより中央へ樹脂を寄せる力よりも、下面へ押し付ける力の方が遥かに大きく作用する。   At this time, in the resin band 9a that is softly melted, the resin flows following the shape of the dome shape 110 of the sealing jig 10b. From the shape of the opening 2d of the resin band 9a before flowing, the resin flows from the shape of the dome shape 110 like the resin flow 111 in the upper part of the resin band 9a first contacting the shape of the dome shape 110 of the sealing jig 10b. In the center of the opening 2d along the R surface of the dome shape, there is little space for the resin to flow in the center of the dome shape. 2c The resin flow 112 starts in the inner depth direction. In addition, since the central portion of the dome shape 110 has a shape that is relatively close to a flat surface, the force that presses the resin to the lower surface acts more greatly than the force that draws the resin to the center by the sealing jig 10b.

封止治具10bの先端が樹脂帯9aの付根に到達するまで、上記樹脂流動111,112が順次働き、最終段階での樹脂帯9aの付根部位Uにおける樹脂の流動は、樹脂流動113のような動きと成る。補足として樹脂流動113はドーム型110形状と接触すると同時に、前記樹脂流動112に引き寄せられ、バイパス通路2c内部奥方向へカール状に流動させられている。   The resin flows 111 and 112 sequentially operate until the tip of the sealing jig 10b reaches the root of the resin band 9a, and the resin flow at the root portion U of the resin band 9a at the final stage is like the resin flow 113. It becomes a movement. As a supplement, the resin flow 113 is brought into contact with the shape of the dome mold 110 and at the same time, is attracted to the resin flow 112 and is caused to flow in a curl shape toward the inner depth of the bypass passage 2c.

この時、バイパス通路2cの内部及び内部周囲の樹脂9は元々常温であるため、カール状に流動した樹脂は、瞬時に冷やされ、バイパス通路2cの内部界面Eと融合することなく、界面Eはカール状に流動した樹脂の間に介在する。   At this time, since the resin 9 inside and around the bypass passage 2c is originally at room temperature, the resin that has flowed in a curled shape is instantaneously cooled, and the interface E is not fused with the internal interface E of the bypass passage 2c. It intervenes between the resin that flows in a curled shape.

一定の冷却時間を経た後、封止治具10bを取り外し、開口口2dを封止したドーム型封止部位4dは、図10で示す断面形状と成る。   After a certain cooling time, the dome-shaped sealing portion 4d in which the sealing jig 10b is removed and the opening 2d is sealed has a cross-sectional shape shown in FIG.

ここで本発明の課題である、前記界面Eとドーム型封止部位4dの外部表面との距離が近接であるほど、バイパス通路2cと外部からの封止が不十分であり、使用環境で繰り返され受ける熱履歴により、亀裂の進行と同じように界面Eが外部表面へと進行する。界面Eが外部表面までに達すると、外部からの浸水防止を図ることが困難と成る。   Here, as the distance between the interface E and the outer surface of the dome-shaped sealing portion 4d, which is the subject of the present invention, is closer, the sealing from the bypass passage 2c and the outside is insufficient, and is repeated in the use environment. Due to the thermal history received, the interface E advances to the outer surface in the same manner as the progress of cracks. When the interface E reaches the outer surface, it becomes difficult to prevent water from entering from the outside.

従来の製法により封止したドーム型封止部位4dにおける、樹脂帯9aの外形L及び板厚T、ドーム型封止高さH2、界面Eとドーム型封止部位4dの外部表面との距離Gの相関関係は、図11で示す比率となっていた。   In the dome-shaped sealing portion 4d sealed by the conventional manufacturing method, the outer shape L and plate thickness T of the resin band 9a, the dome-shaped sealing height H2, and the distance G between the interface E and the outer surface of the dome-shaped sealing portion 4d. The correlation was the ratio shown in FIG.

ドーム型封止高さH2 < 樹脂帯9aの外形L/2・・・・・・・・・・・・・21
外部表面との距離G < 樹脂帯9aの板厚T・・・・・・・・・・・・・・・・22
図19に実製品によるドーム型封止部位4dの断面写真を示す。この断面写真からも判るように、樹脂帯の樹脂はバイパス通路内部に多く流れ込み、更にバイパス通路内部の界面がドーム型封止部位上面に接近していることが確認される。また上記関係式が成り立っていることも確認できる。
Dome-shaped sealing height H2 <Outline L / 2 of resin strip 9a ... 21
Distance G to external surface <Thickness T of resin strip 9a ... 22
FIG. 19 shows a cross-sectional photograph of the dome-shaped sealing portion 4d using an actual product. As can be seen from this cross-sectional photograph, it is confirmed that a large amount of resin in the resin band flows into the bypass passage, and that the interface inside the bypass passage is close to the upper surface of the dome-shaped sealing portion. It can also be confirmed that the above relational expression holds.

上記課題を解決するため、本発明の第1の実施例として、図6に示すように、封止する封止治具10aの先端形状を断面が逆V字型100形状から成る円錐形状とし、故に前記封止治具10aにより封止した封止部位4aの形状が図8に示すような比率に予め設定した。   In order to solve the above problems, as a first embodiment of the present invention, as shown in FIG. 6, the tip shape of the sealing jig 10a to be sealed is a conical shape whose cross section is an inverted V-shaped 100 shape, Therefore, the shape of the sealing portion 4a sealed by the sealing jig 10a is set in advance at a ratio as shown in FIG.

円錐形状封止高さH1 ≧ 樹脂帯9aの外形L/2・・・・・・・・・・・・・20
ここで本実施例1の製法及び樹脂の流動を以下に説明する。
Conical sealing height H1 ≧ External shape L / 2 of resin band 9a 20
Here, the manufacturing method of this Example 1 and the flow of the resin will be described below.

初めに、図5で示すように煙突状の樹脂帯9a部位に熱を加え、樹脂帯9a部位を軟らかく溶融させる。次に図6で示すような先端が逆V字型100に加工された封止治具10aを用いて、樹脂帯9aの上方向からバイパス通路2cの奥側へ向けて、軟らかく溶融している樹脂帯9aの上部から付根方向に封止治具10aで押し込む。   First, as shown in FIG. 5, heat is applied to the chimney-shaped resin band 9 a site to melt the resin band 9 a site softly. Next, using a sealing jig 10a whose tip is processed into an inverted V-shaped 100 as shown in FIG. 6, the resin band 9a is softly melted from the upper direction toward the inner side of the bypass passage 2c. The sealing jig 10a is pushed in from the upper part of the resin strip 9a in the root direction.

この時、軟らかく溶融している樹脂帯9aは、封止治具10aの逆V字型100状に倣い樹脂が流動する。流動する前の樹脂帯9aの開口口2d形状から、初めに封止治具10aの逆V字型100形状と接触する樹脂帯9a上部においては、樹脂の流動は樹脂流動101のように逆V字型100形状の傾斜面に沿って、開口口2dの中央に集められる。   At this time, the softly molten resin band 9a follows the inverted V-shaped 100 shape of the sealing jig 10a and the resin flows. From the shape of the opening 2d of the resin band 9a before flowing, the resin flow is reversed V like the resin flow 101 in the upper part of the resin band 9a that first contacts the inverted V-shaped 100 shape of the sealing jig 10a. Collected at the center of the opening 2d along the inclined surface of the shape 100.

ここで本実施例1の特徴として、封止治具10aの中央部を逆V字型100形状から成る円錐形状とし、更に円錐形状封止高さH1≧樹脂帯9aの外形L/2に成るよう設定しているため、封止治具10aの中央部は深い凹部位を有している。これにより前記樹脂流動101は開口口2d中央部で合流した後、前記凹部位の方向へ流れ込む。この流れ込みにより樹脂帯9aの付根部位Uの樹脂流動103においても引き寄せられる傾向が働き、封止治具10aの傾斜面の影響で若干下向きではあるが、バイパス通路2cの中央へと樹脂流動103を示す。前記凹部位が流動樹脂で満たされた後、余剰樹脂はバイパス通路2cの内部下方向へ樹脂流動102を行う。   Here, as a feature of the first embodiment, the central portion of the sealing jig 10a is formed into a conical shape having an inverted V-shaped 100 shape, and further, the outer shape L / 2 of the conical sealing height H1 ≧ resin strip 9a is satisfied. Thus, the central portion of the sealing jig 10a has a deep concave portion. As a result, the resin flow 101 joins at the center of the opening 2d and then flows in the direction of the recess. This flow tends to attract the resin flow 103 at the root portion U of the resin band 9a, and is slightly downward due to the inclined surface of the sealing jig 10a, but the resin flow 103 is moved to the center of the bypass passage 2c. Show. After the concave portion is filled with the fluid resin, the surplus resin performs the resin flow 102 in the downward direction inside the bypass passage 2c.

尚、前記凹部位により前記余剰樹脂の量は、先に記述した従来製法の図9で示したようなバイパス通路2c内へ流れ込む余剰樹脂量を大幅に低減する。これは封止治具10a中央の平面面積(下方向へ押し込み力が作用する働き)がほとんど無く、傾斜面の面積がほぼ全体を占めているため、樹脂を中央へ寄せる力が大きく働き、バイパス通路2c内へ流れ込む余剰樹脂量を大幅に低減したと考えられる。   In addition, the amount of the excess resin greatly reduces the amount of the excess resin flowing into the bypass passage 2c as shown in FIG. Since there is almost no plane area at the center of the sealing jig 10a (the action of pushing downward), and the area of the inclined surface occupies almost the entire area, the force to move the resin toward the center is large, bypassing It is considered that the amount of surplus resin flowing into the passage 2c has been greatly reduced.

また、前記傾斜面により中央へ寄せた樹脂に圧縮力を加えることができるため、封止した樹脂の気密性も向上させる働きが発生する。   Further, since the compressive force can be applied to the resin that has been moved to the center by the inclined surface, the function of improving the hermeticity of the sealed resin occurs.

一定の冷却時間を経た後、封止治具10aを取り外し、開口口2dを封止した逆V字型100形状から成る円錐形状の封止部位4aは、図10で示す断面形状と成る。   After passing through a certain cooling time, the sealing jig 4a is removed, and the conical sealing portion 4a having an inverted V-shaped 100 shape in which the opening 2d is sealed has a cross-sectional shape shown in FIG.

図18に実製品によるV字型100形状から成る円錐形状の封止部位4aの断面写真を示す。この断面写真からも判断できるように、本発明の課題である、バイパス通路2cの界面と封止部位4aの外部表面との距離が従来品図19と比較して、十分確保されていることが判る。これによりバイパス通路2cと外部からの封止の高信頼性が図れ、使用環境で繰り返され受ける熱履歴からも回避可能となる。よって外部からの浸水防止を図ることができる。   FIG. 18 shows a cross-sectional photograph of a conical sealing portion 4a having a V-shaped 100 shape as an actual product. As can be judged from this cross-sectional photograph, the distance between the interface of the bypass passage 2c and the outer surface of the sealing portion 4a, which is the subject of the present invention, is sufficiently ensured as compared with the conventional product FIG. I understand. Thereby, the high reliability of the bypass passage 2c and the sealing from the outside can be achieved, and it can be avoided from the heat history repeatedly received in the use environment. Therefore, it is possible to prevent water from entering from the outside.

本発明に撚れば、外部と電気的接続を行うための複数の端子を樹脂で固定している樹脂ケースと、前記樹脂ケース内部に搭載した回路基板と、前記回路基板を覆ったゲルを有する電子制御装置において、外部からの浸水に対し、高信頼性のある封止が可能であり、防水型の樹脂ケース及び防水型の電子制御装置を提供できる。   If twisted according to the present invention, a resin case in which a plurality of terminals for electrical connection with the outside are fixed with a resin, a circuit board mounted inside the resin case, and a gel covering the circuit board are included. In the electronic control device, it is possible to perform sealing with high reliability against external water immersion, and a waterproof resin case and a waterproof electronic control device can be provided.

次に、本発明の一実施例である第2の実施例について説明する。   Next, a second embodiment which is an embodiment of the present invention will be described.

図12に示すように、封止する封止治具10cの先端形状を断面が逆ラッパ型120形状から成る末広がりの円錐形状とし、故に前記封止治具10cにより封止した封止部位4cの形状が図14に示すような比率に予め設定した。   As shown in FIG. 12, the tip shape of the sealing jig 10c to be sealed is a conical shape having a divergent section whose cross-section is a reverse trumpet shape 120, and therefore the sealing portion 4c sealed by the sealing jig 10c is formed. The shape was preset to a ratio as shown in FIG.

円錐形状封止高さH3 ≧ 樹脂帯9aの外形L/2・・・・・・・・・・・・・23
ここで本実施例における製法及び樹脂の流動を以下に説明する。
Cone-shaped sealing height H3 ≧ outer dimension L / 2 of the resin band 9a 23
Here, the production method and the flow of the resin in this example will be described below.

初めに、図5で示すように煙突状の樹脂帯9a部位に熱を加え、樹脂帯9a部位を軟らかく溶融させる。次に図12で示すような先端が逆ラッパ型120に加工された封止治具10cを用いて、樹脂帯9aの上方向からバイパス通路2cの奥側へ向けて、軟らかく溶融している樹脂帯9aの上部から付根方向に封止治具10cで押し込む。   First, as shown in FIG. 5, heat is applied to the chimney-shaped resin band 9 a site to melt the resin band 9 a site softly. Next, a resin that is softly melted from the upper direction of the resin band 9a toward the inner side of the bypass passage 2c using the sealing jig 10c whose tip is processed into the reverse trumpet mold 120 as shown in FIG. It pushes with the sealing jig 10c from the upper part of the belt | band | zone 9a to a root direction.

この時、軟らかく溶融している樹脂帯9aは、封止治具10cの逆ラッパ型120状に倣い樹脂が流動する。流動する前の樹脂帯9aの開口口2d形状から、初めに封止治具10cの逆ラッパ型120形状と接触する樹脂帯9a上部においては、樹脂の流動は樹脂流動121のように逆ラッパ型120形状の傾斜面に沿って、開口口2dの中央に集められる。   At this time, the softly molten resin band 9a follows the reverse trumpet shape 120 of the sealing jig 10c and the resin flows. From the shape of the opening 2d of the resin band 9a before flowing, the resin flows from the shape of the opening portion 2d of the sealing jig 10c to the upper portion of the resin band 9a first. Collected in the center of the opening 2d along the 120-shaped inclined surface.

ここで本実施例2の特徴として、封止治具10cの中央部を逆ラッパ型120形状から成る末広がりの円錐形状とし、更に円錐形状封止高さH3≧樹脂帯9aの外形L/2に成るよう設定しているため、封止治具10cの中央部は深い凹部位を有している。これにより前記樹脂流動121は開口口2d中央部で合流した後、前記凹部位の方向へ流れ込む。この流れ込みにより樹脂帯9aの付根部位Uの樹脂流動123においても引き寄せられる傾向が働き、封止治具10cの傾斜面の影響で若干下向きではあるが、バイパス通路2cの中央へと樹脂流動123を示す。前記凹部位が流動樹脂で満たされた後、余剰樹脂はバイパス通路2cの内部下方向へ樹脂流動122を行う。   Here, as a feature of the second embodiment, the central portion of the sealing jig 10c is formed in a conical shape having a divergent shape having an inverted trumpet shape 120, and further, the outer shape L / 2 of the conical sealing height H3 ≧ resin band 9a. Therefore, the central portion of the sealing jig 10c has a deep concave portion. Accordingly, the resin flow 121 joins at the center of the opening 2d and then flows in the direction of the recess. This flow tends to attract the resin flow 123 at the root portion U of the resin band 9a, and is slightly downward due to the inclined surface of the sealing jig 10c, but the resin flow 123 is moved toward the center of the bypass passage 2c. Show. After the concave portion is filled with the fluid resin, the surplus resin performs the resin flow 122 in the downward direction inside the bypass passage 2c.

尚、前記凹部位により前記余剰樹脂の量は、先に記述した従来製法の図9で示したようなバイパス通路2c内へ流れ込む余剰樹脂量を大幅に低減する。これは封止治具10c中央の平面面積(下方向へ押し込み力が作用する働き)がほとんど無く、逆ラッパ型傾斜面の面積がほぼ全体を占めているため、樹脂を中央へ寄せる力が大きく働き、バイパス通路2c内へ流れ込む余剰樹脂量を大幅に低減したと考えられる。   In addition, the amount of the excess resin greatly reduces the amount of the excess resin flowing into the bypass passage 2c as shown in FIG. This has almost no planar area at the center of the sealing jig 10c (the action of pressing force downward), and the area of the reverse trumpet type inclined surface occupies almost the whole, so that the force to bring the resin to the center is large. It is considered that the amount of surplus resin flowing into the bypass passage 2c is greatly reduced.

また、前記傾斜面により中央へ寄せた樹脂に圧縮力を加えることができるため、封止した樹脂の気密性も向上させる働きが発生する。   Further, since the compressive force can be applied to the resin that has been moved to the center by the inclined surface, the function of improving the hermeticity of the sealed resin occurs.

一定の冷却時間を経た後、封止治具10cを取り外し、開口口2dを封止した逆ラッパ型120形状から成る末広がりの円錐形状の封止部位4cは、図13で示す断面形状と成る。   After a certain cooling time, the sealing jig 4c is removed, and the conical sealing part 4c having a divergent conical shape having the shape of the inverted trumpet 120 in which the opening 2d is sealed has a cross-sectional shape shown in FIG.

図20に実製品による逆ラッパ型120形状から成る末広がりの円錐形状の封止部位4cの断面写真を示す。この断面写真からも判断できるように、本発明の課題である、バイパス通路2cの界面と封止部位4aの外部表面との距離が従来品図19と比較して、十分確保されていることが判る。これによりバイパス通路2cと外部からの封止の高信頼性が図れ、使用環境で繰り返され受ける熱履歴からも回避可能となる。よって外部からの浸水防止を図ることができる。   FIG. 20 shows a cross-sectional photograph of a conical sealing portion 4c having a divergent shape composed of an inverted trumpet shape 120 of an actual product. As can be judged from this cross-sectional photograph, the distance between the interface of the bypass passage 2c and the outer surface of the sealing portion 4a, which is the subject of the present invention, is sufficiently ensured as compared with the conventional product FIG. I understand. Thereby, the high reliability of the bypass passage 2c and the sealing from the outside can be achieved, and it can be avoided from the heat history repeatedly received in the use environment. Therefore, it is possible to prevent water from entering from the outside.

従来技術の課題を解決するため、本発明の第3の実施例として、図15に示すように、封止する封止治具10dの先端形状を大きさの異なるドーム型を縦に2段重ねた略円錐形状とし、故に前記封止治具10dにより封止した封止部位4dの形状が図17に示すような比率に予め設定した。   In order to solve the problems of the prior art, as a third embodiment of the present invention, as shown in FIG. 15, the tip shape of the sealing jig 10d to be sealed is vertically overlapped with two dome shapes having different sizes. Therefore, the shape of the sealing portion 4d sealed by the sealing jig 10d was set to a ratio as shown in FIG.

円錐形状封止高さH4 ≧ 樹脂帯9aの外形L/2・・・・・・・・・・・・・24
ここで本実施例2の製法及び樹脂の流動を以下に説明する。
Conical shape sealing height H4 ≧ Outline L / 2 of the resin band 9a... 24
Here, the manufacturing method of this Example 2 and the flow of the resin will be described below.

初めに、図5で示すように煙突状の樹脂帯9a部位に熱を加え、樹脂帯9a部位を軟らかく溶融させる。次に図15で示すような先端が大きさの異なるドーム型を縦に2段重ねた、2段ドーム型130に加工された封止治具10dを用いて、樹脂帯9aの上方向からバイパス通路2cの奥側へ向けて、軟らかく溶融している樹脂帯9aの上部から付根方向に封止治具10dで押し込む。   First, as shown in FIG. 5, heat is applied to the chimney-shaped resin band 9 a site to melt the resin band 9 a site softly. Next, the resin band 9a is bypassed from above by using a sealing jig 10d processed into a two-stage dome mold 130 in which two dome molds having different tip sizes are vertically stacked as shown in FIG. Toward the back side of the passage 2c, the sealing jig 10d is pushed in from the upper part of the softly melted resin band 9a in the root direction.

この時、軟らかく溶融している樹脂帯9aは、封止治具10dの2段ドーム型状に倣い樹脂が流動する。流動する前の樹脂帯9aの開口口2d形状から、初めに封止治具10dの2段ドーム型130形状の大径ドームと接触する樹脂帯9a上部においては、樹脂の流動は樹脂流動131のように2段ドーム型130形状の大径ドーム傾斜面に沿って、開口口2dの中央に集められる。   At this time, the resin band 9a that is softly melted follows the two-stage dome shape of the sealing jig 10d and the resin flows. From the shape of the opening 2d of the resin band 9a before flowing, the resin flow is the flow of the resin flow 131 at the upper part of the resin band 9a that first contacts the large-diameter dome of the two-stage dome shape 130 of the sealing jig 10d. Thus, the two-stage dome shape 130 is gathered at the center of the opening 2d along the inclined surface of the large-diameter dome.

ここで本実施例の特徴として、封止治具10dの中央部を2段ドーム型130形状から略円錐形状とし、更に略円錐形状封止高さH4≧樹脂帯9aの外形L/2に成るよう設定しているため、封止治具10dの中央部は深い凹部位を有している。これにより前記樹脂流動131は開口口2d中央部で合流した後、前記凹部位の方向へ流れ込む。この流れ込みにより樹脂帯9aの付根部位Uの樹脂流動133においても引き寄せられる傾向が働き、封止治具10dの傾斜面の影響で若干下向きではあるが、バイパス通路2cの中央へと樹脂流動133を示す。前記凹部位が流動樹脂で満たされた後、余剰樹脂はバイパス通路2cの内部下方向へ樹脂流動132を行う。   Here, as a feature of the present embodiment, the central portion of the sealing jig 10d is changed from the two-stage dome shape 130 shape to a substantially conical shape, and further, the outer shape L / 2 of the substantially conical sealing height H4 ≧ resin strip 9a. Therefore, the central portion of the sealing jig 10d has a deep concave portion. As a result, the resin flow 131 joins at the center of the opening 2d and then flows in the direction of the recess. This flow tends to attract the resin flow 133 at the root portion U of the resin band 9a, and is slightly downward due to the inclined surface of the sealing jig 10d, but the resin flow 133 is moved downward to the center of the bypass passage 2c. Show. After the concave portion is filled with the fluid resin, the surplus resin performs the resin flow 132 downward in the bypass passage 2c.

尚、前記凹部位により前記余剰樹脂の量は、先に記述した従来製法の図9で示したようなバイパス通路2c内へ流れ込む余剰樹脂量を大幅に低減する。これは封止治具10d中央の平面面積(下方向へ押し込み力が作用する働き)がほとんど無く、2段ドーム型傾斜面の面積がほぼ全体を占めているため、樹脂を中央へ寄せる力が大きく働き、バイパス通路2c内へ流れ込む余剰樹脂量を大幅に低減したと考えられる。   In addition, the amount of the excess resin greatly reduces the amount of the excess resin flowing into the bypass passage 2c as shown in FIG. This has almost no planar area at the center of the sealing jig 10d (the action of pushing force downward), and the area of the two-step dome-shaped inclined surface occupies almost the entire area. It is considered that the amount of surplus resin flowing into the bypass passage 2c has been greatly reduced.

また、前記傾斜面により中央へ寄せた樹脂に圧縮力を加えることができるため、封止した樹脂の気密性も向上させる働きが発生する。   Further, since the compressive force can be applied to the resin that has been moved to the center by the inclined surface, the function of improving the hermeticity of the sealed resin occurs.

一定の冷却時間を経た後、封止治具10dを取り外し、開口口2dを封止した2段ドーム型130形状から略円錐形状の封止部位4dは、図16で示す断面形状と成る。   After a certain cooling time, the sealing part 4d having a substantially conical shape from the two-stage dome shape 130 shape in which the sealing jig 10d is removed and the opening 2d is sealed has a cross-sectional shape shown in FIG.

これにより本発明の課題である、バイパス通路2cの界面と封止部位4aの外部表面との距離が十分確保されることが判る。よってバイパス通路2cと外部からの封止の高信頼性が図れ、使用環境で繰り返され受ける熱履歴からも回避可能となる。よって外部からの浸水防止を図ることができる。   Thereby, it can be seen that a sufficient distance between the interface of the bypass passage 2c and the outer surface of the sealing portion 4a, which is the subject of the present invention, is secured. Therefore, high reliability of sealing from the bypass passage 2c and the outside can be achieved, and it is possible to avoid the heat history repeatedly received in the use environment. Therefore, it is possible to prevent water from entering from the outside.

以上、実施例1〜3にかかる何れかの本発明に撚れば、外部と電気的接続を行うための複数の端子を樹脂で固定している樹脂ケースと、前記樹脂ケース内部に搭載した回路基板と、前記回路基板を覆ったゲルを有する電子制御装置において、外部からの浸水に対し、高信頼性のある封止が可能であり、防水型の樹脂ケース及び防水型の電子制御装置を提供できる。   As described above, if any one of the present inventions according to the first to third embodiments is twisted, a resin case in which a plurality of terminals for electrical connection with the outside are fixed with resin, and a circuit mounted inside the resin case An electronic control device having a substrate and a gel covering the circuit board is capable of highly reliable sealing against external water immersion, and provides a waterproof resin case and a waterproof electronic control device it can.

なお、本発明は、自動車分野における流入空気量を測定するエアフローセンサや空気量調整するスロットルポジションセンサ、アクセル開度を調整するアクセル開度センサ、これらセンサを一連に制御構成するための各種センサなど防水型の樹脂ケースを用いる各種センシングセンサに適用可能である。また本発明の課題を解決する物であれば、上記の列記した製品に限定されること無く適用できる。   The present invention relates to an airflow sensor that measures the amount of inflow air in the automobile field, a throttle position sensor that adjusts the air amount, an accelerator position sensor that adjusts the accelerator position, and various sensors that control and configure these sensors in series. The present invention can be applied to various sensing sensors using a waterproof resin case. In addition, any product that solves the problems of the present invention can be applied without being limited to the products listed above.

1 樹脂ケース
2 貫通孔
2a,2b,2c 通路
2d 開口口
3 コネクタ
4a,4b,4c,4d 封止部位
5,8 端子
6 ベース
7 ケース枠
9 樹脂
9a 樹脂帯
10a,10b,10c,10d 封止治具
20,21,22,23 関係式
100 逆V字型
101,102,103,111,112,113,121,122,123,131,132,133 樹脂流動
110 ドーム型
120 逆ラッパ型
130 2段ドーム型
E 界面
G 距離
H1,H2,H3,H4 封止高さ
L 樹脂帯外径
P,U 部位
Q 方向
S 断面
T 板厚
DESCRIPTION OF SYMBOLS 1 Resin case 2 Through-hole 2a, 2b, 2c Passage 2d Opening port 3 Connector 4a, 4b, 4c, 4d Sealing part 5, 8 Terminal 6 Base 7 Case frame 9 Resin 9a Resin strip 10a, 10b, 10c, 10d Sealing Jig 20, 21, 22, 23 Relational expression 100 Inverted V shape 101, 102, 103, 111, 112, 113, 121, 122, 123, 131, 132, 133 Resin flow 110 Dome shape 120 Reverse wrapper type 130 2 Step dome type E Interface G Distance H1, H2, H3, H4 Sealing height L Resin strip outer diameter P, U Site Q Direction S Section T Plate thickness

Claims (6)

コネクタと回路基板が搭載された内部とを連通する貫通路を有する樹脂ケースにおいて、
前記貫通路は、複数の分岐通路から構成され、
前記分岐通路のうち少なくとも一つの分岐通路の先端部が樹脂で封止されており、
前記樹脂封止の形状は、円錐形状であり、前記円錐形状の高さをH、前記円錐形状の底面の外径をLとするとH>1/2Lであることを特徴とする樹脂ケース。
In a resin case having a through path that communicates between the connector and the inside where the circuit board is mounted,
The through passage is composed of a plurality of branch passages,
The tip of at least one of the branch passages is sealed with resin,
The resin sealing shape is a conical shape, wherein H> 1 / 2L where H is the height of the conical shape and L is the outer diameter of the bottom surface of the conical shape.
請求項1に記載の樹脂ケースにおいて、
前記円錐形状の断面は、逆V字型断面であることを特徴とする樹脂ケース。
The resin case according to claim 1,
The resin case, wherein the conical section is an inverted V-shaped section.
請求項1に記載の樹脂ケースにおいて、
前記円錐形状の断面は、逆ラッパ型断面であることを特徴とする樹脂ケース。
The resin case according to claim 1,
The resin case characterized in that the conical section is an inverted trumpet section.
請求項1に記載の樹脂ケースにおいて、
前記円錐形状は、径の大きさが異なるドーム型形状を二段重ねた形状からなることを特徴とする樹脂ケース。
The resin case according to claim 1,
The resin case is characterized in that the conical shape is formed by overlapping two dome-shaped shapes having different diameters.
請求項1乃至4のいずれかに記載の樹脂ケースにおいて、
前記貫通路は3方向に屈曲した通路であり、前記回路基板が搭載される面に対して垂直方向に形成された第1の通路と、前記コネクタの向きと平行に形成された第2の通路と、前記回路基板が搭載される面に対して平行方向に形成され前記第1の通路と前記第2の通路とをバイパスする第3の通路とからなり、
前記第3の通路の先端部に前記封止形状を有することを特徴とする樹脂ケース。
In the resin case in any one of Claims 1 thru | or 4,
The through passage is a passage bent in three directions, a first passage formed in a direction perpendicular to a surface on which the circuit board is mounted, and a second passage formed in parallel with the direction of the connector. And a third passage formed in a direction parallel to the surface on which the circuit board is mounted and bypassing the first passage and the second passage,
A resin case having the sealing shape at a tip portion of the third passage.
請求項1乃至5のいずれかに記載の樹脂ケースを用いた電子制御装置。   An electronic control device using the resin case according to claim 1.
JP2011221476A 2011-10-06 2011-10-06 Resin case and manufacturing method thereof, and electronic control device using resin case Active JP5703185B2 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61256535A (en) * 1985-05-08 1986-11-14 オムロン株式会社 Sealing of sealed type electric equipment
JPH0343737U (en) * 1989-09-06 1991-04-24
JPH05116219A (en) * 1991-10-25 1993-05-14 Nec Tohoku Ltd Ventilation heat caulking method for plastic electronic component
JPH10229033A (en) * 1997-02-17 1998-08-25 Shoei Kk Method and apparatus for sealing thermoplastic resin container
JP2004055829A (en) * 2002-07-19 2004-02-19 Hitachi Ltd Waterproof case incorporating electronic component

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61256535A (en) * 1985-05-08 1986-11-14 オムロン株式会社 Sealing of sealed type electric equipment
JPH0343737U (en) * 1989-09-06 1991-04-24
JPH05116219A (en) * 1991-10-25 1993-05-14 Nec Tohoku Ltd Ventilation heat caulking method for plastic electronic component
JPH10229033A (en) * 1997-02-17 1998-08-25 Shoei Kk Method and apparatus for sealing thermoplastic resin container
JP2004055829A (en) * 2002-07-19 2004-02-19 Hitachi Ltd Waterproof case incorporating electronic component

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