JP2013082166A - Die with temperature-adjusting function of outer deckle for multilayer or single-layer die and mechanism for attaching outer deckle frame to the die - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a die, in which an outer deckle frame is easily attached to the die, a lip width is easily adjusted, resin adhesion to a deckle distal end is prevented to eliminate a trouble in a winding process, and which is suitable for high-speed productivity, and to provide a mechanism for attaching an outer deckle frame to the die.SOLUTION: A die includes a means for changing or adjusting a die lip width, wherein the die has an outer deckle on a lip lower surface, and the one outer deckle has a function capable of performing temperature adjustment. A slide groove is provided at die front and rear surfaces so as to be parallel to the lip at a die distal end. An outer deckle frame section is turned into a substantial die sectional shape so that an outer deckle frame may be moved and fixed to the slide groove. Two locations of an upper part (open edge part) of the die sectional shape protrude inward and are fitted into the slide groove. A lower part (closed part) inner side of the die sectional shape is turned into a deckle bar receiving part. A deckle bar having a temperature-adjusting function is provided at the deckle bar receiving part.

Description

  The present invention relates to a T die having an outer deckle for changing or adjusting a multilayer or single layer die width. Specifically, the outer deckle is pressed and fixed to a die lip, and the temperature of the deckle is adjusted by a heater and a thermocouple. The present invention relates to an extrusion die for forming a film which is improved so as to surely prevent the resin from adhering to the tip of the deckle.

Plastics are lightweight, transparent, flexible, heat-sealable, heat-resistant, cold-resistant, oil-resistant, water-resistant, and other packaging materials such as food packaging, and electrical and electronic materials such as insulating materials and capacitor dielectrics. Widely used in gas separation / gas barriers, decorative / printing materials, protective films for displays, composite films with metals, etc., and high-tech fields, etc. In many cases, it is processed into a stacked shape.
For example, many packaging films and packaging moldings that have been used in recent years are composites in which a plurality of layers are laminated, and a layer made of polyethylene resin is flexible and adhesive to other layers.・ Excellent in water resistance (water vapor barrier resistance), etc. Also, a layer made of polypropylene resin is excellent in heat resistance, good heat seal characteristics, oil resistance, transparency, etc. Is used for various purposes.

There are two methods for making multilayer films: coextrusion method that uses multiple extruders to extrude while laminating, laminating method that bonds the films, and heat sealing method that heats them together. There is an extrusion laminating method that extrudes resin from a machine and a method of bonding using an adhesive. Currently, a multilayer film is often made from a single film by a laminating method, but it is necessary to use a film having a thickness that can be handled, and this tends to result in an excessive packaging of an excessive thickness. In the case of the co-extrusion method, it can be suppressed to an optimum thickness, and the number of processes is reduced.
The co-extrusion method is roughly divided into an inflation method and a T-die method, and the former can be co-extruded with relatively simple equipment, but the type of resin is limited and cannot be used for combinations inferior in interlayer adhesion. Therefore, the latter T-die method has become mainstream.
The T-die method is classified into two types, a single manifold method and a multi-manifold method, depending on the position where different resins are combined. In the single manifold method, a feed block is installed just before a die, and a plurality of extruders are connected to the feed block through adapters, and after making a resin contact in the feed block, a film is formed through the die. The number of layers can be set by exchanging the adapter, and a multilayer film can be obtained relatively easily. The feature of the feed block is that various films and sheets can be produced by switching the switching valves such as 2 types, 3 layers, 3 types, 3 layers, and single layer.
On the other hand, in the multi-manifold method, a T die having a plurality of manifolds is used, and the resins supplied from a plurality of extruders are brought into contact with each other immediately before the lip portion and laminated. Since each layer is expanded in each manifold and merged in the vicinity of the lip outlet in the T-die, the variation in thickness is reduced because the molding time after the merge is short.

Single layer films and multilayer films by coextrusion have different film widths depending on the application and must be made to meet these requirements. In addition, the film formed by extrusion is necked in, and a phenomenon occurs in which the end portion of the film called edge bead becomes thicker than the center portion, so that the required film width is taken into consideration. In the T-die method, it is not efficient or economical to prepare a large number of T dies with different lip widths and replace them according to the film width, so the film width is the width that is extruded from the lip of the T die. It is done with adjustment. The adjustment of the lip width is performed using a deckle. By using this deckle, the trimming amount can be reduced.
In the deckle, a round bar or the like is inserted at both ends of the manifold of the T die to narrow the flow path of the molten resin and adjust the width of the film extruded from the lip. There is an outer deckle that regulates the film width by regulating the flow of resin.

  In manufacturing a film, as a method for adjusting the lip width of a die using an outer deckle, for example, there is a method shown below.

  (1) FIG. 6 is a view of the T-die as seen from the direction in which the film is extruded, with the support member fixed to the upper lip and the lower lip, and the slit width attached to the screw rod via the connecting portion. The adjusting plate is slid by turning the handle to close the discharge slit, thereby adjusting the outflow width of the molten resin. This is provided at both ends of the slit of the T die (see Patent Document 1).

  (2) FIG. 7 shows a method in which a lip seal of an outer deckle for adjusting the lip width and a rectifying plate for preventing an end thickening are provided and inserted into the lip land (see, for example, Patent Document 2). It is disclosed that the lip seal is resistant to high temperatures such as silicon and polytetrafluoroethylene resin, and has a sealing property that is attached so that there is no leakage of the molten resin, and a stainless steel rectifying plate is inserted 5 mm or more. ing.

  (3) FIG. 8 is a T-die that has a manifold part, a round part, and a lip part through which molten resin flows, and regulates the film width using both an inner deckle and an outer deckle (for example, Patent Document 3). reference). The inner deckle is located from the manifold portion to the lip portion outlet, and the lower end of the inner deckle located at the lip portion outlet has one or more inflection points (in FIG. 8, three of a, b, and c), Finely adjust the film width at the upper end of the outer deckle contacting the inflection point and the lip exit.

  In any method, the lip width is adjusted by a method of regulating the flow of resin inside and outside the die.

Japanese Patent Laid-Open No. 51-145666 JP-A-52-147762 Japanese Patent Application Laid-Open No. 08-52783

The above-described conventional outer deckle requires a space for fixing the support member on the lower surface of the lip. However, when a space is provided on the lower surface of the lip, the lower surface of the die becomes wider and the distance for guiding the molten resin film to the cooling roll is small. It becomes longer and the neck-in becomes larger, or the film cannot be cooled rapidly and becomes a crystalline film.
Further, the above-described conventional outer deckle restricts the outflow of the molten resin on the lower surface of the lip and receives heat from the vicinity of the lower surface of the lip of the die, so that the temperature is lower than the lip surface and a temperature difference is generated with the molten resin.
In addition, since the outer deckle receives heat from the die, even if the temperature of the die is adjusted, the temperature of the portion where the outer deckle is provided tends to be lower than the portion where the outer deckle is not provided. There was a tendency that the fluidity of the molten resin at both ends of the die provided with the deckle was further lowered as compared with the portion not provided.
As described above, the outer deckle body that comes into contact with the molten resin has a temperature difference, the molten resin that has contacted at the end of the outer deckle is cooled, and the resin adheres to the end of the deckle. At the same time, the cooled and hardened resin adheres to the edge of the film and flows into the cooling roll, etc., and even if it is rolled with a roll, it cannot be rolled sufficiently in the solidified state, causing the film to break from the edge of the film, causing problems in the process Resulting in. This is a major obstacle especially during high-speed production.

  The present invention was made in order to solve the above problems, and it is easy to attach the outer deckle to the die, easily adjust the lip width, prevent resin adhesion to the tip of the deckle, It provides a die suitable for high-speed productivity and an outer deckle frame mounting mechanism to the die, eliminating in-process troubles.

The present invention has been made as a result of various studies on the structure of the deckle, and in order to prevent the resin from adhering to the tip of the deckle, the outer deckle has a temperature control function to solve the problem. A slide groove is provided in the longitudinal direction of the front and rear surfaces, an outer deckle frame having a substantially die cross-section shape that reaches the other slide groove from one slide groove via the lip tip, and the end of the outer deckle frame is provided in the slide groove. By fitting, the outer deckle frame is made slidable, and a deckle bar having a temperature adjusting function is provided by closing the lip surface inside the lower surface of the outer deckle frame.
The outer deckle according to the present invention includes a frame that moves in parallel with the lip surface supported by the die, a deckle that seals the lip surface of the die in close contact with the seal, and a heater that controls the temperature of the deckle and a temperature measurement. An apparatus (thermocouple) is provided, and an indicator for adjusting the temperature of the Dickel is installed outside to adjust the Deckel tip temperature to a constant temperature.

That is, according to the present invention, by controlling the temperature of the Dickel body, even if the extruded resin adheres to the tip of the Dickel, it does not solidify and is difficult to adhere. It is.
The present invention relates to [1] a die having means for changing or adjusting the die lip width, the die having an outer deckle on the lower surface of the lip, and the outer deckle having a function capable of adjusting the temperature.
The present invention also relates to [2] the die according to the above [1], wherein the die has a heater and a thermocouple in the outer deckle body, and independently adjusts the temperature separately from the die temperature control.
In the present invention, [3] the die is a metal material (thickness 0.1 to 0.5 mm), heat resistant packing (heat resistant 180 to 250 ° C., thickness 0.5 to 2) as a sealing material for the outer deckle and the lower surface of the lip. .5 mm) and a heat insulating packing (thickness 0.5 to 2.5 mm), the die according to the above [1] or [2], which uses a sealing material.

Further, the present invention provides a die having [4] manifold and lip, and a slide groove is provided on the front and rear surfaces in the die width direction so as to be parallel to the lip at the tip of the die, and the outer deckle frame is moved to the slide groove. The outer deckle frame has a substantially die cross section so that it can be fixed. The upper part (open end) of the die cross section protrudes inward and fits into the slide groove, and the lower part of the die cross section (blocking part) The present invention relates to a mechanism for attaching an outer deckle frame to a die in which a deckle bar receiving portion is provided on the inner side and a deckle bar having a temperature control function is provided in the deckle bar receiving portion.
The present invention also relates to a mechanism for attaching an outer deckle frame to a die as described in [4] above, wherein the cross section of the outer deckle frame is V-shaped.
The present invention also provides [6] the die according to [4] or [5], wherein the temperature adjustment function includes a heater and a thermocouple in the outer deckle body, and independently adjusts the temperature separately from the die temperature control. The present invention relates to an outer deckle frame mounting mechanism.
The present invention also provides [7] a metal material (thickness 0.1 to 0.5 mm), a heat resistant packing (heat resistant 180 to 250 ° C., thickness 0.5 to 2.5 mm), and heat insulation between the lip of the dickel bar and the die. The present invention relates to a mechanism for attaching an outer deckle frame to a die according to any one of [4] to [6] above, which has a structure in which packings (thicknesses of 0.5 to 2.5 mm) are combined, and is provided with a sealing material.

  According to the present invention, by adjusting the temperature of the Dickel body, even if the extruded resin adheres to the tip of the Dickel, the Dickel is heated and does not solidify and is difficult to adhere. It is no longer attached to the end of the film, and troubles in the process can be suppressed. Since the Dickel is heated, there is little adhesion of the molten resin, and when the Dickel body is raised above the lip temperature, the molten resin has increased fluidity and the temperature is high, so there is little neck-in, and the molten resin adheres to the end of the Dickel. Even if the temperature of the Dickel is high, the molten state is maintained, and even if it adheres to the film edge, it can be easily rolled with a roll or the like from the high resin temperature, resulting in a thick film edge. Can solve the trouble.

It is a top view which shows the outline of embodiment of the die | dye which concerns on this invention. 1 is a cross-sectional view of an embodiment of a die according to the present invention. FIG. 5 is an enlarged cross-sectional view illustrating attachment of the outer deckle to the die according to the present invention. It is a disassembled perspective view of the principal part of the outer deckle according to the present invention. It is a combination side view of the sealing material which concerns on this invention. It is a schematic plan view of a conventional die lip width changing device. It is front sectional drawing of the conventional die lip width changing apparatus. It is front sectional drawing of the conventional die lip width changing apparatus.

  A die having a temperature adjusting function for a multilayer or single-layer die for an outer deckle according to the present invention and an outer deckle frame mounting mechanism to the die will be described in detail below with reference to the accompanying drawings.

  1-5 illustrate one embodiment of an outer deckle for a multilayer or single layer die according to the present invention. FIG. 1 is a schematic plan view along a resin flow path of a T die used in the present invention. The T die 1 has side plates 15 on the left and right sides in the die width direction, and the molten resin is pushed out by the manifold 3 from the top of the figure, and is extruded into a film shape from the opening 4 of the lip surface 5 through the lip. At this time, the outer deckle 6 is provided at both ends of the die to change or adjust the width of the film, thereby closing the resin flow and extruding the molten resin like the flow path 2. By moving the outer deckle 6 in the direction of the die center, the blocked portion of the resin flow is widened, the film width is narrowed, and conversely, the film width can be widened by moving in the opposite direction.

FIG. 2 is a schematic cross-sectional view of the T die viewed from the side (from the side plate side) with respect to the width direction of the die, and is a diagram illustrating the outer deckle frame mounting mechanism. FIG. 3 is an enlarged view of a portion of the outer deckle frame mounting mechanism shown in FIG. 2, and FIG. 4 is an exploded perspective view of the main part of the outer deckle according to the present invention.
As shown in FIG. 3, a slide groove 10 is provided on the front and rear surfaces of the die in the die width direction of the die having a manifold and a lip so as to be parallel to the lip surface 5 at the tip of the die, and an outer deckle frame 14 is provided in the slide groove 10. The outer deckle frame 14 has a substantially die cross section so that it can be moved and fixed. The upper part (open end) of the die cross section protrudes inward and fits into the slide groove, and the lower part of the die cross section (blocking) Part) A dickel bar groove is provided on the inner side to form a dickel bar receiving part 13, and a deckle bar 16 having a temperature adjusting function is fitted into the dickel bar receiving part (groove).

  When viewed from the side plate side of the die, the area of the lip surface at the tip of the lip is small, and when the die tip has a V-shaped cross section, the distance from the cooling roll can be shortened, and the molten resin adheres to the lip surface. Therefore, the die is preferably V-shaped. In this case, the outer deckle frame of the deckle bar preferably has a V-shaped cross section along the V shape. If there is a push-pull bolt for adjusting the opening gap of the lip opening 4 on the front and rear die surfaces in the die width direction (film width direction), slightly touch the frame so that it does not hit the outer deckle frame. A recessed groove having a margin and a hole for bolt adjustment may be provided so that the push-pull bolt can be adjusted through the hole provided in the frame without contacting the push-pull bolt when the slide groove is moved. By adjusting the lip gap in advance with a push-pull bolt before attaching the outer deckle frame, the bolt adjustment hole may be unnecessary. Also, the bolt adjustment holes can be adjusted by making the oblong or rectangular oblong or rectangular shape, and if the push-pull bolt hits the frame, slide the frame and adjust the push-pull bolt, then the original location You may take the method of returning to. The outer Dickel frame is supported by its groove and the weight and when it is machined with a highly rigid metal, it is drilled so that it is supported at three points near both ends and the center of the frame. The processed portion can be a bolt adjustment hole.

  FIG. 4 is an exploded perspective view of the main part of the outer deckle. The outer deckle frame 14 has a V-shaped cross section and the upper part (open end) of the die cross section protrudes inward to fit into the slide groove. It is supposed to be. Further, a concave groove is provided on the inner side so as not to hit the push-pull bolt. The hole for adjusting the push-pull bolt is not provided because it may be adjusted in advance, but it can be provided. Further, the inside of the lower part (blocking part) of the die cross-sectional shape having a V-shaped cross section is used as a dickel bar receiving part 13, and a dickel bar 16 is installed there. The dickel bar is provided with a groove for placing the packing 8 (8a, 8b, 8c), and a hole for the heater 9 and a thermocouple for providing a temperature adjusting function. A pair is inserted so that the temperature can be adjusted independently from the temperature control (temperature control) of the die. The packing 8 has a heat insulating packing 8a, a heat resistant packing 8b, and a metal material 8c stacked from the side of the deck bar (see FIG. 5), and the metal material comes into contact with the lip surface 5 of the die so as to suppress the outflow of the molten resin. .

The heat insulating packing 8a has a thickness of 0.5 to 2.5 mm and uses ceramic fibers such as alumina and silica. The heat resistant packing 8b has a heat resistance of 180 to 250 ° C. and a thickness of 0.5 to 2. 5mm expanded graphite, polytetrafluoroethylene resin, polyimide resin or the like is used, and the metal material 8c is a metal plate such as an iron plate, copper plate, brass plate, aluminum plate, stainless steel plate having a thickness of 0.1 to 0.5 mm. It is preferable to use it. The metal plate is brought into contact with the lip surface to prevent the molten resin from flowing out, and the heating of the dickel bar is set to a temperature higher than the lip surface temperature in order to suppress the cooling of the portion where the molten resin film at the end of the deckle is in contact and keep the molten state. Therefore, this heat is transmitted to the lip surface, and the lip surface temperature is not raised and the fluidity of the molten resin at the lip is not changed, so the heat transfer is mainly suppressed by the heat insulating packing, and the metal plate is formed by the heat insulating packing and the heat resistant packing. Make contact with the lip surface evenly. A bolt hole is provided on the outer side of the lower portion (blocking portion) of the outer cross section of the outer deckle frame 14 so that the bolt hole reaches the inner side. A screw groove is provided in the bolt hole, and the deckle bar 16 is pushed up by the bolt 7 to form the groove 10 of the die. Move the outer deckle along, and fix the deckle whose die lip width has been changed or adjusted. Simultaneously with the fixing, the packing 8 is strongly pressed against the lip surface to suppress the outflow of the molten resin. The bolts may be provided if necessary, and may be provided one or more bolts.
When the die has the side plate 15, it is preferable to provide a slide groove on the side plate as well as the front and rear surfaces in the die width direction.

The heater 9 provided in the deckle bar may be provided with a hole in the deckle bar as described above and a round bar heater inserted therein, or a plate heater. The temperature setting in this heater is preferably such that the temperature of the part where the molten resin film is in contact with the end of the deckle is equal to or higher than the temperature of the molten resin extruded from the lip surface, and is preferably higher by 10 ° C. or more. The temperature is preferably set to 50 ° C. or less from the viewpoint that the temperature adjustment does not adversely affect the temperature rise of the lip surface.
In the above description, the example in which the temperature adjustment function is provided in the deckle bar has been described. However, the temperature adjustment function can be provided in any one of the outer deckle bodies such as the side surface and the end surface of the outer deckle frame.
The width of the outer deckle is preferably ¼ or less of the die width and more preferably ８ or less from the viewpoint of film thickness accuracy. The outer deckle of the present invention can be used in combination with the inner deckle.

Melt flow rate (MFR) 2 g / 10 min (190 ° C), density 0.922 g / cm ³ polyethylene (Sumitomo Chemical Co., Ltd. Sumikasen F235P; F1), melt flow rate (MFR) 19 g / 10 min (230 ° C), density Using 0.900 g / cm ³ of polypropylene (Prime Polypro Y-2000GP manufactured by Prime Polymer Co., Ltd .; G1), a 40 μm multilayer film having a thickness ratio of 1/2/1 with an F1 / G1 / F1 configuration was used for experiments. Extrusion was performed using a seed three-layer coextrusion T-die molding machine. The die width was 600 mm, the lip opening was 0.9 mm, the one-side lip surface width was 2 mm, the molding temperature was 200 ° C., the take-off speed was 60 m / min, the discharge rate was 71 kg / hr, the chill roll temperature was 80 ° C., and the chill roll diameter was 500 mm. Slide grooves with a width of 50 mm and a depth of 5 mm are provided at both ends of the T die in the width direction, outer deckles with the shape shown in FIGS. 3 and 4 (width 25 mm) are attached, and plate heaters are attached to both sides of the V-shaped T die. The temperature was set to 200 ° C. in the same manner as described above. Then, a Dickel bar was provided in the Dickel bar receiving part inside the V-shaped lower part (closed part), a heater and a thermocouple were provided, and the Dickel end face with which the molten resin film was in contact was 210 ° C. The packing used a 0.3 mm stainless steel plate as the metal material, a 0.5 mm thick polytetrafluoroethylene resin sheet as the heat resistant packing, and an alumina / silica ceramic fiber having a thickness of 0.5 mm as the heat insulating packing. A three-layer film having a width of about 550 mm was obtained by the outer deckle, and the resin in contact with the deckle was melted and adhered to the deckle without being retained for a long time. Thus, a film having a uniform thickness was obtained.

  As a comparative example, when all the heaters of the deckle bar of the outer deckle were turned off and extruded in the same manner as described above, the temperature of the deckle end face with which the molten resin film was in contact was 165 ° C. The resin in Fig. 2 was whitened, which sometimes peeled off and flowed out with the molten film, which triggered the film to break and could not be formed.

  By providing the outer deckle with a function capable of adjusting the temperature as in the present invention, it is possible to prevent the resin from adhering to the tip of the deckle, thereby eliminating in-process troubles and enabling high-speed production. In addition, it is possible to provide an outer deckle frame mounting mechanism in which the outer deckle is easily attached to the die and the lip width can be easily adjusted.

DESCRIPTION OF SYMBOLS 1 Die 2 Flow path 3 Manifold 4 Opening part 5 Lip surface 6 Outer deckle 7 Bolt 8a Heat insulation packing 8b Heat resistant packing 8c Metal plate 9 Heater 10 Slide groove 11 Holder 12 Dickel bar groove 13 Dickel bar receiving part 14 Outer deckle frame 15 Side plate 16 Dickel bar

Claims (7)

  A die having means for changing or adjusting a die lip width, wherein the die has an outer deckle on a lower surface of the lip, and the outer deckle has a function of adjusting a temperature.   The die according to claim 1, wherein the die has a heater and a thermocouple in the outer deckle body, and independently adjusts the temperature separately from the die temperature control.   The die is a metal material (thickness 0.1-0.5 mm), heat-resistant packing (heat-resistant 180-250 ° C., thickness 0.5-2.5 mm) and heat-insulating packing (thickness 0) as a sealant for the outer deckle and the lower surface of the lip. The die according to claim 1 or 2, wherein a sealing material having a combined structure of .5 to 2.5 mm) is used.   A die having a manifold and a lip, in which a slide groove is provided on the front and rear surfaces in the die width direction so as to be parallel to the lip at the tip of the die, and the outer deckle frame is moved and fixed to the slide groove. The cross section of the die has a substantially die cross section, and the upper part (open end) of the die cross section protrudes inward and fits into the slide groove, and the lower part (closed part) of the die cross section forms the dickel bar receiving part. Outer deckel frame mounting mechanism to the die with a deckel bar that has a temperature control function in the part.   The outer deckle frame attachment mechanism to the die according to claim 4, wherein a cross section of the outer deckle frame is V-shaped.   6. A mechanism for attaching an outer deckle frame to a die according to claim 4, wherein the temperature adjustment function includes a heater and a thermocouple in the outer deckle body, and independently adjusts the temperature separately from the die temperature control.   Between the Dickel bar and the lip of the die, a metal material (thickness 0.1 to 0.5 mm), heat resistant packing (heat resistant 180 to 250 ° C., thickness 0.5 to 2.5 mm) and heat insulating packing (thickness 0.5 to 2. mm). The outer deckle frame attachment mechanism to the die according to any one of claims 4 to 6, wherein a sealing material having a structure in which 5mm) is combined is provided.

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