JP2013081219A - ワイヤレス通信ポート - Google Patents
ワイヤレス通信ポート Download PDFInfo
- Publication number
- JP2013081219A JP2013081219A JP2012265700A JP2012265700A JP2013081219A JP 2013081219 A JP2013081219 A JP 2013081219A JP 2012265700 A JP2012265700 A JP 2012265700A JP 2012265700 A JP2012265700 A JP 2012265700A JP 2013081219 A JP2013081219 A JP 2013081219A
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- JP
- Japan
- Prior art keywords
- module
- board
- serial
- pcb
- wireless communication
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004891 communication Methods 0.000 title claims abstract description 19
- 238000006243 chemical reaction Methods 0.000 claims abstract description 15
- 230000006870 function Effects 0.000 claims description 21
- 230000006855 networking Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- KKIMDKMETPPURN-UHFFFAOYSA-N 1-(3-(trifluoromethyl)phenyl)piperazine Chemical compound FC(F)(F)C1=CC=CC(N2CCNCC2)=C1 KKIMDKMETPPURN-UHFFFAOYSA-N 0.000 claims description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 14
- ALFHIHDQSYXSGP-UHFFFAOYSA-N 1,2-dichloro-3-(2,4-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC=C1C1=CC=CC(Cl)=C1Cl ALFHIHDQSYXSGP-UHFFFAOYSA-N 0.000 description 7
- VLLVVZDKBSYMCG-UHFFFAOYSA-N 1,3,5-trichloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=CC=CC=C1Cl VLLVVZDKBSYMCG-UHFFFAOYSA-N 0.000 description 7
- AIURIRUDHVDRFQ-UHFFFAOYSA-N 1,2,3,4-tetrachloro-5-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC=C1C1=CC(Cl)=C(Cl)C(Cl)=C1Cl AIURIRUDHVDRFQ-UHFFFAOYSA-N 0.000 description 6
- QGDKRLQRLFUJPP-UHFFFAOYSA-N 1,2,3,5-tetrachloro-4-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC=C1C1=C(Cl)C=C(Cl)C(Cl)=C1Cl QGDKRLQRLFUJPP-UHFFFAOYSA-N 0.000 description 5
- GOFFZTAPOOICFT-UHFFFAOYSA-N 1,3,5-trichloro-2-(2,3-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=CC=CC(Cl)=C1Cl GOFFZTAPOOICFT-UHFFFAOYSA-N 0.000 description 5
- RKUAZJIXKHPFRK-UHFFFAOYSA-N 1,3,5-trichloro-2-(2,4-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC=C1C1=C(Cl)C=C(Cl)C=C1Cl RKUAZJIXKHPFRK-UHFFFAOYSA-N 0.000 description 5
- XBTHILIDLBPRPM-UHFFFAOYSA-N 2,2',4,5-tetrachlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC(Cl)=C(Cl)C=C1Cl XBTHILIDLBPRPM-UHFFFAOYSA-N 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 239000011324 bead Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- SXHLTVKPNQVZGL-UHFFFAOYSA-N 1,2-dichloro-3-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C(=C(Cl)C=CC=2)Cl)=C1 SXHLTVKPNQVZGL-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L67/00—Network arrangements or protocols for supporting network services or applications
- H04L67/01—Protocols
- H04L67/02—Protocols based on web technology, e.g. hypertext transfer protocol [HTTP]
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L69/00—Network arrangements, protocols or services independent of the application payload and not provided for in the other groups of this subclass
- H04L69/08—Protocols for interworking; Protocol conversion
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L69/00—Network arrangements, protocols or services independent of the application payload and not provided for in the other groups of this subclass
- H04L69/18—Multiprotocol handlers, e.g. single devices capable of handling multiple protocols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6691—Structural association with built-in electrical component with built-in electronic circuit with built-in signalling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/04—Connectors or connections adapted for particular applications for network, e.g. LAN connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
- H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
- H01R24/64—Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Computer Security & Cryptography (AREA)
- Small-Scale Networks (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Transceivers (AREA)
- Communication Control (AREA)
- Selective Calling Equipment (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
【解決手段】PCBを取り付けることができるモジュールは、論理回路のプリント回路ボード1107を収容する筐体1113と、電子部品を取り付ける回路ボード1106とを有する。論理回路ボードは、アンテナを接続するための電気コネクタ1103、1104、およびボードへの接続のための物理コネクタ1101とともに、シリアル通信プロトコルとワイヤレス通信プロトコルとの間の変換を行う論理回路を有する。電子部品を取り付けるボードは、そこに取り付けられた複数の電子部品1114を有する。モジュールは、セキュリティおよびウェブ関連のサービスを提供する。回路は、I2C、CAN、SNMP、UDP等の複数の規格をサポートすることができる。
【選択図】図11A
Description
Claims (26)
- シリアル通信プロトコルとワイヤレス通信プロトコルとの間で変換を行う論理回路を含む、電子部品ボードを取り付けることができる筐体と、
ボードへの接続のための物理コネクタと、
アンテナへのコネクタとを備える、モジュール。 - 筐体がRJ45コネクタの断面を有する、請求項1に記載のモジュール。
- 筐体がRJ45コネクタを含む、請求項1に記載のモジュール。
- 物理コネクタが、外部のRJ45ジャックを取り付けるためのピンを含む、請求項1に記載のモジュール。
- 回路が単一のチップ上に配置される、請求項1に記載のモジュール。
- 回路が複数の部品の間で分割される、請求項1に記載のモジュール。
- オペレーティングシステムを記憶する少なくとも256KBのメモリをさらに備える、請求項1に記載のモジュール。
- 少なくとも1つのウェブページを記憶する少なくとも2MBのメモリをさらに備える、請求項1に記載のモジュール。
- 電圧管理回路と5ボルト以下パワーフィードとをさらに備える、請求項1に記載のモジュール。
- 物理コネクタが少なくとも3つのピンの配列を備える、請求項1に記載のモジュール。
- 物理コネクタが少なくとも3つのフラットワイヤの配列を備える、請求項1に記載のモジュール。
- 筐体内に複数の汎用プログラム可能入力/出力ピン(PIO)をさらに備える、請求項1に記載のモジュール。
- シリアル通信プロトコルがI2C、CAN、ProfiBus、SPIおよびUSBからなるグループから選択される、請求項1に記載のモジュール。
- ワイヤレス通信プロトコルが802.11x規格に対応する、請求項1に記載のモジュール。
- ワイヤレス通信プロトコルがIP、ARP、UDP、TCP、ICMP、Telnet(登録商標)、TFTP、AutoIP、DHCP、HTTPおよびSNMPのうちの少なくとも1つと一致する、請求項1に記載のモジュール。
- セキュリティ機能を提供するソフトウェアをさらに備える、請求項1に記載のモジュール。
- ソフトウェア機能が、WEP(ワイヤードイクイバレントプロトコル)セキュリティとWPA(ワイヤレスネットワーキング保護アクセス)セキュリティとのうちの少なくとも1つの含む、請求項16に記載のモジュール。
- MILARRS機能のうちの少なくとも1つを提供するソフトウェアをさらに備える、請求項1に記載のモジュール。
- 電子メール警告と暗号化とのうちの少なくとも1つを提供するソフトウェアをさらに備える、請求項1に記載のモジュール。
- アンテナへのコネクタが同軸ケーブルを備え、モジュールの外部にあるアンテナをさらに備える、請求項1に記載のモジュール。
- データ転送またはプロトコル変換が、モジュールによってサポートされる少なくとも2つの物理インタフェースの間で提供される、請求項1に記載のモジュール。
- モジュールがボードにハンダ付けされる、請求項21に記載のデバイス。
- ボードがフレキシブル基板を備える、請求項21に記載のデバイス。
- ボードに取り付けられており、第1シリアル対ワイヤレス通信モジュールとワイヤレスで通信する第2シリアル対ワイヤレス通信モジュールをさらに備える、請求項21に記載のデバイス。
- 第1シリアル対ワイヤレス通信モジュールが、イーサネット(登録商標)プロトコルを使用してボード外の部品と通信する、請求項21に記載のデバイス。
- TCP/IPネットワークスタックおよびOSと、埋め込み型ウェブサーバとの実装を含む第1シリアル対ワイヤレス通信モジュールが取り付けられた電子部品ボードを有する、デバイス。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/084,342 | 2005-03-17 | ||
US11/084,342 US7309260B2 (en) | 2002-04-15 | 2005-03-17 | Wireless communication module |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008502145A Division JP5239096B2 (ja) | 2005-03-17 | 2006-03-17 | ワイヤレス通信ポート |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013081219A true JP2013081219A (ja) | 2013-05-02 |
JP2013081219A5 JP2013081219A5 (ja) | 2014-06-26 |
JP5689109B2 JP5689109B2 (ja) | 2015-03-25 |
Family
ID=36617301
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008502145A Active JP5239096B2 (ja) | 2005-03-17 | 2006-03-17 | ワイヤレス通信ポート |
JP2012265700A Active JP5689109B2 (ja) | 2005-03-17 | 2012-12-04 | ワイヤレス通信ポート |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008502145A Active JP5239096B2 (ja) | 2005-03-17 | 2006-03-17 | ワイヤレス通信ポート |
Country Status (6)
Country | Link |
---|---|
US (1) | US7309260B2 (ja) |
EP (1) | EP1703698B1 (ja) |
JP (2) | JP5239096B2 (ja) |
CA (2) | CA2600804C (ja) |
TW (1) | TWI355122B (ja) |
WO (1) | WO2006099627A1 (ja) |
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JP2021515508A (ja) * | 2018-02-22 | 2021-06-17 | ポート インダストリアル オートメーション ゲーエムベーハー | 一体型通信ユニット |
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- 2006-03-17 WO PCT/US2006/010061 patent/WO2006099627A1/en active Application Filing
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CA2600804C (en) | 2012-06-05 |
EP1703698B1 (en) | 2014-01-22 |
TW200642206A (en) | 2006-12-01 |
WO2006099627A1 (en) | 2006-09-21 |
JP2008533931A (ja) | 2008-08-21 |
CA2753406C (en) | 2014-02-11 |
JP5239096B2 (ja) | 2013-07-17 |
US20050181643A1 (en) | 2005-08-18 |
CA2753406A1 (en) | 2006-09-21 |
EP1703698A2 (en) | 2006-09-20 |
TWI355122B (en) | 2011-12-21 |
EP1703698A3 (en) | 2012-02-22 |
CA2600804A1 (en) | 2006-09-21 |
JP5689109B2 (ja) | 2015-03-25 |
US7309260B2 (en) | 2007-12-18 |
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