JP2013080815A - Substrate support structure - Google Patents

Substrate support structure Download PDF

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JP2013080815A
JP2013080815A JP2011219955A JP2011219955A JP2013080815A JP 2013080815 A JP2013080815 A JP 2013080815A JP 2011219955 A JP2011219955 A JP 2011219955A JP 2011219955 A JP2011219955 A JP 2011219955A JP 2013080815 A JP2013080815 A JP 2013080815A
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circuit board
substrate
connector
boss
support structure
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Yasuhiko Asahi
保彦 旭
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Yamaha Corp
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Yamaha Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a substrate support structure which can prevent breakage of a substrate due to a load imposed when attaching or detaching an external device.SOLUTION: A substrate support structure comprises: a connector 15 for holding an external device 100 provided on a mounting surface of a circuit board 20; and a screw 31, a boss 32 and a foam material spacer 34 for supporting the circuit board 20 with keeping one end (movable end) in a plane direction in a swingable state in a thickness direction, at another end (fixed end). The screw 31 can be screwed in the boss 32. The boss 32 is inserted in a through hole 22 provided on the circuit board 20 and having a diameter larger than that of the boss 32. The screw 31 ia screwed in the boss 32 until the screw 31 contacts the mounting surface, and the circuit board 20 is sandwiched in the thickness direction and fixed by the screw 31 and the foam material spacer 34 provided on a rear face of the circuit board 20.

Description

本発明は、外部装置を装着するコネクタを有する基板支持構造に関する。   The present invention relates to a substrate support structure having a connector for mounting an external device.

近年、携帯機器で音楽を聴くユーザが増えてきている。これに伴い、携帯機器を接続するためのコネクタを有し、携帯機器に保存された音楽データを出力することができるオーディオ機器も増えてきている。このようなオーディオ機器において、例えば、特許文献1に記載のように、コネクタが傾斜されて設けられているため、携帯機器を水平方向に対して傾斜させて、着脱させる必要がある場合がある。   In recent years, an increasing number of users listen to music on mobile devices. Accordingly, an increasing number of audio devices have a connector for connecting a portable device and can output music data stored in the portable device. In such an audio device, for example, as described in Patent Document 1, since the connector is inclined and provided, it may be necessary to attach and detach the portable device with respect to the horizontal direction.

特開2009−110645号公報JP 2009-110645 A

コネクタは回路基板に半田などで装着されているため、コネクタに携帯機器を差し込む際に加わる力により、コネクタと回路基板との間の半田が剥離し、接触不良が生じるおそれがある。この問題は、特許文献1に記載のように、携帯機器を傾斜させて着脱する場合に顕著となる。   Since the connector is mounted on the circuit board with solder or the like, the force applied when the portable device is inserted into the connector may cause the solder between the connector and the circuit board to peel off, resulting in poor contact. This problem becomes prominent when the portable device is attached and detached while being tilted as described in Patent Document 1.

そこで、本発明の目的は、外部装置の着脱時にかかる負荷による基板の損傷を防ぐことができる基板支持構造を提供することにある。   SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate support structure that can prevent the substrate from being damaged by a load applied when an external device is attached or detached.

本発明に係る基板支持構造は、基板と、該基板を支持する支持部と、前記基板の厚み方向に突出して前記基板の一面に設けられ、外部装置を装着するコネクタ部と、を備え、前記支持部は、剛体および弾性体を有し、厚み方向において前記剛体および前記弾性体で前記基板を挟み込み、前記基板に装着されたコネクタ部が厚み方向に揺動可能に支持している、ことを特徴とする。   A substrate support structure according to the present invention includes a substrate, a support portion that supports the substrate, and a connector portion that protrudes in the thickness direction of the substrate and is provided on one surface of the substrate and mounts an external device. The support part has a rigid body and an elastic body, sandwiches the board in the thickness direction with the rigid body and the elastic body, and supports the connector part mounted on the board so as to be swingable in the thickness direction. Features.

この構成では、外部装置を装着するコネクタ部が、揺動可能な基板の一部側に設けられているため、外部装置の着脱時にコネクタ部を介して基板にかかる負荷は、基板の揺動によって軽減される。これにより、外部装置の着脱時における基板の破損を防ぐことができる。   In this configuration, since the connector part for mounting the external device is provided on a part of the swingable board, the load applied to the board via the connector part when the external device is attached / detached is caused by the swing of the board. It is reduced. As a result, it is possible to prevent the substrate from being damaged when the external device is attached or detached.

また、この構成では、基板を剛体および弾性体で挟んで支持するため、基板の一部が揺動可能としつつも、基板を安定させることができる。例えば、基板の表面側を剛体、裏面側を弾性体とした場合、基板が裏面側に揺動したとき、基板裏面と支持部との間にかかる負荷を弾性体によって軽減できると共に、表面側の剛体によって揺動した基板のぐらつきを抑制できる。これにより、支持部により固定支持された場合のように、基板部分が破損するおそれを軽減できる一方、剛体と弾性体とによる挟持固定により、基板が安定するため、外部装置をコネクタ部へ装着しやすくなる。   Further, in this configuration, since the substrate is sandwiched and supported by the rigid body and the elastic body, the substrate can be stabilized while allowing a part of the substrate to swing. For example, when the front surface side of the substrate is a rigid body and the back surface side is an elastic body, when the substrate swings to the back surface side, the load applied between the back surface of the substrate and the support portion can be reduced by the elastic body, The wobbling of the substrate that is swung by the rigid body can be suppressed. As a result, the possibility of damage to the board portion can be reduced as in the case where the board is fixedly supported by the support section, while the board is stabilized by pinching and fixing between the rigid body and the elastic body, so that an external device is attached to the connector section. It becomes easy.

本発明に係る基板支持構造において、前記基板は厚み方向に貫通する孔を有し、前記剛体は、前記孔より径が小さく、前記孔に挿入される柱部、および前記孔より径が大きく、前記柱部と係合する係合部を有し、前記基板は、前記係合部および前記弾性体で挟み込まれて支持されていることを特徴とする。   In the substrate support structure according to the present invention, the substrate has a hole penetrating in the thickness direction, the rigid body has a smaller diameter than the hole, a column part inserted into the hole, and a larger diameter than the hole, It has an engaging part engaged with the said pillar part, The said board | substrate is inserted | pinched and supported by the said engaging part and the said elastic body, It is characterized by the above-mentioned.

この構成では、柱部が挿入される基板の孔が、柱部よりも径が大きいため、基板と柱部との間に隙間が生じる。このため、基板の孔と柱部の径との差分の大きさだけ基板の揺動が可能である。   In this configuration, since the hole of the substrate into which the column part is inserted has a larger diameter than the column part, a gap is generated between the substrate and the column part. For this reason, the substrate can be swung by the difference between the hole of the substrate and the diameter of the column portion.

本発明に係る基板支持構造において、前記コネクタ部は、前記基板からの突出方向が、前記基板の一面の法線方向に対して傾斜して設けられている、ことを特徴とする。   The board | substrate support structure which concerns on this invention WHEREIN: The said connector part is provided so that the protrusion direction from the said board | substrate may incline with respect to the normal line direction of the one surface of the said board | substrate.

この構成では、コネクタ部の突出方向からずれて外部装置がコネクタ部に着脱された場合であっても、基板とコネクタ部との間にかかる負荷を、基板の揺動によって吸収でき、基板またはコネクタ部の破損を防止できる。   In this configuration, even when an external device is attached to and detached from the connector part with a deviation from the protruding direction of the connector part, the load applied between the board and the connector part can be absorbed by the swinging of the board. Damage to the part can be prevented.

本発明に係る基板支持構造は、前記基板の前記一方端部の所定角度以上の揺動を防止する防止部、をさらに備えることを特徴とする。   The substrate support structure according to the present invention further includes a prevention unit that prevents the one end portion of the substrate from swinging a predetermined angle or more.

この構成では、基板が可動範囲を超えて揺動することで、基板が破損するおそれを防止できる。   In this configuration, the substrate can be prevented from being damaged by swinging beyond the movable range.

本発明に係る基板支持構造において、前記支持部は、少なくとも二点で前記基板を支持していることを特徴とする。   In the substrate support structure according to the present invention, the support portion supports the substrate at at least two points.

この構成では、揺動する基板を少ない支点で安定させることができる。   In this configuration, the swinging substrate can be stabilized with a small number of fulcrums.

本発明によれば、外部装置を装着するコネクタ部を、揺動可能な基板の一部側に設けることで、着脱時にコネクタ部を介して基板にかかる負荷を軽減でき、この結果、外部装置の着脱時における基板の破損を防ぐことができる。   According to the present invention, by providing the connector portion to which the external device is mounted on a part of the swingable substrate, it is possible to reduce the load applied to the substrate through the connector portion when attaching and detaching. It is possible to prevent the substrate from being damaged during attachment / detachment.

実施形態に係るオーディオ装置の斜視図。The perspective view of the audio apparatus which concerns on embodiment. 回路基板に装着されるコネクタの説明図。Explanatory drawing of the connector with which a circuit board is mounted | worn. オーディオ装置の上方から視た場合の回路基板を示す図。The figure which shows the circuit board at the time of seeing from the upper direction of an audio apparatus. (A)は図3のIVA−IVA線の断面図、(B)は図3のIVB−IVB線の断面図、(C)は図3のIVC−IVC線の断面図。3A is a cross-sectional view taken along line IVA-IVA in FIG. 3, FIG. 3B is a cross-sectional view taken along line IVB-IVB in FIG. 3, and FIG. 4C is a cross-sectional view taken along line IVC-IVC in FIG. コネクタへ外部装置を差し込む際の回路基板の動きを示す模式図。The schematic diagram which shows the motion of the circuit board at the time of inserting an external device in a connector. コネクタから外部装置を抜く際の回路基板の動きを示す模式図。The schematic diagram which shows the motion of the circuit board at the time of extracting an external device from a connector. オーディオ装置を下方から視た場合の回路基板を示す。The circuit board at the time of seeing an audio apparatus from the downward direction is shown. (A)は図7のVIIA−VIIA線の断面図、(B)は図7のVIIB−VIIB線の断面図、(C)は図7のVIIC−VIIC線の断面図。7A is a cross-sectional view taken along line VIIA-VIIA in FIG. 7, FIG. 7B is a cross-sectional view taken along line VIIB-VIIB in FIG. 7, and FIG. 8C is a cross-sectional view taken along line VIIC-VIIC in FIG.

(実施形態1)
以下、本発明に係る基板支持構造の実施形態1について図面を参照して説明する。以下の実施形態では、本発明に係る基板支持構造を備えたオーディオ装置を例に挙げて説明する。
(Embodiment 1)
Hereinafter, a substrate support structure according to a first embodiment of the present invention will be described with reference to the drawings. In the following embodiments, an audio apparatus provided with a substrate support structure according to the present invention will be described as an example.

図1は本実施形態に係るオーディオ装置の斜視図である。   FIG. 1 is a perspective view of an audio apparatus according to this embodiment.

オーディオ装置1は、略直方体形状で、角部がR形状となった筐体10を備えている。筐体10の一面(以下、この面を前面という)には、スピーカ9および音量などを調整するためのダイヤル8が設けられている。図示しないが、筐体10の背面には、電源ケーブルなどを接続するコネクタが設けられている。   The audio apparatus 1 includes a housing 10 having a substantially rectangular parallelepiped shape and a corner portion having an R shape. A speaker 9 and a dial 8 for adjusting the volume and the like are provided on one surface of the housing 10 (hereinafter, this surface is referred to as a front surface). Although not shown, a connector for connecting a power cable or the like is provided on the rear surface of the housing 10.

筐体10の上面には、電源ボタンなどの操作パネル7、および外部装置100を装着する装着部14が設けられている。装着部14は、筐体10の上面に開口部を有する空間であり、内部には外部装置100を接続するコネクタ15が設けられている。外部装置100は、音データを記憶するメモリを有する装置であって、例えば、携帯音楽プレーヤ、PDA(Personal Digital Assistant)、携帯電話機などが挙げられる。オーディオ装置1は、コネクタ15に外部装置100が装着され、再生開始操作を受け付けると、外部装置100に保存された音データを取得して、スピーカ9から放音する。   On the upper surface of the housing 10, an operation panel 7 such as a power button and a mounting portion 14 for mounting the external device 100 are provided. The mounting portion 14 is a space having an opening on the upper surface of the housing 10, and a connector 15 for connecting the external device 100 is provided inside. The external device 100 is a device having a memory for storing sound data, and examples thereof include a portable music player, a PDA (Personal Digital Assistant), and a mobile phone. When the external device 100 is attached to the connector 15 and a reproduction start operation is accepted, the audio device 1 acquires sound data stored in the external device 100 and emits sound from the speaker 9.

図2は回路基板に装着されるコネクタ15の説明図である。   FIG. 2 is an explanatory diagram of the connector 15 attached to the circuit board.

コネクタ15は、装着部14の下方で、筐体10の内部に配置される回路基板20の実装面に設けられていて、外部装置100が装着可能なように装着部14の底面から露出している。回路基板20は、基板平面の奥行方向の一端部(以下、可動側端部という)側が基板厚み方向(図中、破線矢印)に揺動するように、他端部(以下、固定側端部という)近傍で、ボス32に差し込まれたネジ31の頭部と発泡材スペーサ34とに挟まれて支持されている。ネジ31、ボス32および発泡材スペーサ34などについては後に詳述する。コネクタ15は、ネジ31などによる回路基板20の支持位置より可動側端部側となる位置に装着されている。また、コネクタ15は、回路基板20の実装面の法線方向nから約15度傾けた状態で回路基板20に設けられている。本実施形態では、回路基板20は、オーディオ装置1を水平に設置した場合に水平配置となるものとする。従って、コネクタ15に接続する外部装置100は、鉛直方向から約15度傾けた状態でコネクタ15に装着される。   The connector 15 is provided on the mounting surface of the circuit board 20 disposed inside the housing 10 below the mounting portion 14 and is exposed from the bottom surface of the mounting portion 14 so that the external device 100 can be mounted. Yes. The circuit board 20 has the other end (hereinafter referred to as a fixed side end) so that one end (hereinafter referred to as a movable side end) in the depth direction of the substrate plane swings in the thickness direction of the substrate (broken arrow in the figure). In the vicinity, the head of the screw 31 inserted into the boss 32 and the foam material spacer 34 are sandwiched and supported. The screw 31, the boss 32, the foam material spacer 34, etc. will be described in detail later. The connector 15 is mounted at a position on the movable side end side from the position where the circuit board 20 is supported by screws 31 or the like. The connector 15 is provided on the circuit board 20 in a state where the connector 15 is inclined about 15 degrees from the normal direction n of the mounting surface of the circuit board 20. In the present embodiment, the circuit board 20 is assumed to be horizontally arranged when the audio device 1 is horizontally installed. Therefore, the external device 100 connected to the connector 15 is attached to the connector 15 in a state inclined about 15 degrees from the vertical direction.

図3は、オーディオ装置1の上方から視た場合の回路基板20を示す図である。図4(A)は図3のIVA−IVA線の断面図、図4(B)は図3のIVB−IVB線の断面図、図4(C)は図3のIVC−IVC線の断面図を示す。なお、図4(A)および図4(B)では、筐体10は省略している。   FIG. 3 is a diagram illustrating the circuit board 20 when viewed from above the audio device 1. 4A is a cross-sectional view taken along line IVA-IVA in FIG. 3, FIG. 4B is a cross-sectional view taken along line IVB-IVB in FIG. 3, and FIG. 4C is a cross-sectional view taken along line IVC-IVC in FIG. Indicates. 4A and 4B, the housing 10 is omitted.

回路基板20は、長辺および短辺からなる略矩形状であり、装着部14を形成する筐体10の一部と一定の距離をおいて支持されている。以下では、回路基板20の長辺に沿った方向を回路基板20の幅方向とし、短辺に沿った方向を回路基板20の奥行方向とする。回路基板20の奥行方向の一方端部が上述の可動側端部となり、他方端部が固定側端部となる。回路基板20は、固定側端部に凹部20Aが形成されている。この凹部20Aには、例えばフレキシブルケーブルを有するコネクタ(不図示)などが設けられ、オーディオ装置1内の他の回路基板などに接続される。   The circuit board 20 has a substantially rectangular shape including long sides and short sides, and is supported at a certain distance from a part of the housing 10 forming the mounting portion 14. Hereinafter, the direction along the long side of the circuit board 20 is defined as the width direction of the circuit board 20, and the direction along the short side is defined as the depth direction of the circuit board 20. One end of the circuit board 20 in the depth direction is the above-described movable side end, and the other end is the fixed side end. The circuit board 20 has a recessed portion 20A formed at the fixed side end. The recess 20A is provided with a connector (not shown) having a flexible cable, for example, and is connected to another circuit board in the audio apparatus 1 or the like.

回路基板20には、貫通孔22および貫通孔23がそれぞれ二つずつ形成されている。二つの貫通孔22は、固定側端部側の二つの角部近傍に形成され、中心が回路基板20の幅方向に沿った直線上に位置している。二つの貫通孔23は、可動側端部側の二つの角部近傍に形成され、中心が回路基板20の幅方向に沿った直線上に位置している。さらに、貫通孔22,23は、中心が回路基板20の奥行方向に沿った直線上に位置している。   Two through holes 22 and two through holes 23 are formed in the circuit board 20. The two through holes 22 are formed in the vicinity of the two corners on the fixed side end portion side, and the center is located on a straight line along the width direction of the circuit board 20. The two through holes 23 are formed in the vicinity of the two corners on the movable side end portion side, and the center is located on a straight line along the width direction of the circuit board 20. Further, the through holes 22 and 23 are located on a straight line whose center is along the depth direction of the circuit board 20.

貫通孔22,23はそれぞれ同じ大きさの径を有し、かつ、挿入される後述の円筒形のボス32,33の径よりも僅かに大きい径を有している。貫通孔22,23の径は、回路基板20の可動側端部が上下に揺動する際に回路基板20が破損しない揺動範囲、および、ボス32,33の径を考慮して設定される。より詳しくは、回路基板20の可動側端部が上下に揺動する際、貫通孔22,23は、ボス32,33の軸方向に対して中心軸が傾斜する。このとき、ボス32,33の周囲に空隙を設けて、貫通孔22,23の内壁面がボス32,33に接触しないよう、貫通孔22,23の径が設定される。   The through holes 22 and 23 have the same diameter, and have a diameter slightly larger than the diameter of cylindrical bosses 32 and 33 to be described later. The diameters of the through holes 22 and 23 are set in consideration of the swing range in which the circuit board 20 is not damaged when the movable side end of the circuit board 20 swings up and down, and the diameters of the bosses 32 and 33. . More specifically, when the movable side end of the circuit board 20 swings up and down, the through holes 22 and 23 are inclined at the center axis with respect to the axial direction of the bosses 32 and 33. At this time, a space is provided around the bosses 32 and 33, and the diameters of the through holes 22 and 23 are set so that the inner wall surfaces of the through holes 22 and 23 do not contact the bosses 32 and 33.

回路基板20の下部には、回路基板20を支持する剛体の支持板30が設けられている。この支持板30は筐体10の一部であってもよいし、筐体10とは別の部材であってもよい。支持板30には、支持する回路基板20の貫通孔22,23と一致する位置に、ボス32,33が一体形成されている。ボス32,33は内部中空の円筒形状をしており、ボス32の中空部は、ネジ31のネジ穴となる。ボス32は、回路基板20の裏面側から貫通孔22に挿入されている。ボス33は、回路基板20の裏面側から貫通孔23に挿入されている。   A rigid support plate 30 that supports the circuit board 20 is provided below the circuit board 20. The support plate 30 may be a part of the housing 10 or may be a member different from the housing 10. Bosses 32 and 33 are integrally formed on the support plate 30 at positions corresponding to the through holes 22 and 23 of the circuit board 20 to be supported. The bosses 32 and 33 have an internal hollow cylindrical shape, and the hollow portion of the boss 32 is a screw hole of the screw 31. The boss 32 is inserted into the through hole 22 from the back side of the circuit board 20. The boss 33 is inserted into the through hole 23 from the back side of the circuit board 20.

貫通孔22に挿入されるボス32には、ネジ31が差し込まれている。ネジ31は、貫通孔22の径より大きい頭部、およびボス32の中空部にねじ込みできる軸部を有している。ネジ31は、頭部が回路基板20の実装面に当接するよう、軸部がボス32にねじ込まれている。また、ボス32の周囲には、回路基板20の裏面に当接する円筒形状の発泡材スペーサ(弾性体)34が設けられている。発泡材スペーサ34は、例えば、クロロプレンラバーフォームなどから形成されている。回路基板20は、この発泡材スペーサ34と、ボス32にねじ込まれたネジ31の頭部とで挟み込まれて固定されている。なお、発泡材スペーサ34は、貫通孔23に挿入されたボス33の周囲にも、回路基板20の裏面に当接するよう設けられている。   A screw 31 is inserted into the boss 32 inserted into the through hole 22. The screw 31 has a head portion larger than the diameter of the through hole 22 and a shaft portion that can be screwed into the hollow portion of the boss 32. The shaft portion of the screw 31 is screwed into the boss 32 so that the head portion comes into contact with the mounting surface of the circuit board 20. In addition, a cylindrical foam spacer (elastic body) 34 is provided around the boss 32 so as to be in contact with the back surface of the circuit board 20. The foam material spacer 34 is made of, for example, chloroprene rubber foam. The circuit board 20 is sandwiched and fixed between the foam spacer 34 and the head of the screw 31 screwed into the boss 32. The foam spacer 34 is also provided around the boss 33 inserted into the through hole 23 so as to contact the back surface of the circuit board 20.

以下に、外部装置100の着脱時における、上述した構成で支持される回路基板20の動きについて説明する。   Hereinafter, the movement of the circuit board 20 supported by the above-described configuration when the external device 100 is attached / detached will be described.

図5はコネクタ15へ外部装置100を差し込む際の回路基板20の動きを示す模式図である。図5は、図4(C)の断面図に相当する図であり、筐体10は省略している。   FIG. 5 is a schematic diagram showing the movement of the circuit board 20 when the external device 100 is inserted into the connector 15. FIG. 5 is a view corresponding to the cross-sectional view of FIG. 4C, and the housing 10 is omitted.

外部装置100のコネクタ15への差し込む際、回路基板20には下向きの応力がかかる。このとき、回路基板20は固定側端部で固定され、さらに、コネクタ15は、回路基板20の奥行方向の中央より可動側端部側に設けられているため、回路基板20は固定側端部を中心として可動側端部が下側(裏面側)に回動する。貫通孔23はボス33より径が大きく、ボス33周囲には空隙が形成されている。このため、可動側端部が下側に多少回動しても、貫通孔23の内壁面がボス33に当接することがなく、貫通孔23とボス33との間で負荷がかかり、回路基板20自体が撓んで破損するおそれがない。   When the external device 100 is inserted into the connector 15, downward stress is applied to the circuit board 20. At this time, the circuit board 20 is fixed at the fixed side end, and the connector 15 is provided on the movable side end side from the center of the circuit board 20 in the depth direction. The movable side end pivots downward (back side) around the center. The through hole 23 has a larger diameter than the boss 33, and a gap is formed around the boss 33. For this reason, even if the movable side end portion is slightly rotated downward, the inner wall surface of the through hole 23 does not come into contact with the boss 33, and a load is applied between the through hole 23 and the boss 33. There is no possibility that 20 itself will bend and break.

また、回路基板20の裏面側の貫通孔23周囲には発泡材スペーサ34が設けられているため、下側に回動する回路基板20の可動側端部が下方向に押し圧する力は、発泡材スペーサ34の収縮により吸収される。これにより、回路基板20の裏面を剛体などで直接固定した場合との対比において、回路基板20が上側からの力(外部装置100の装着時の力)によって破損するおそれを軽減することができる。   Further, since the foam material spacer 34 is provided around the through hole 23 on the back surface side of the circuit board 20, the force that the movable side end of the circuit board 20 that rotates downward presses downward is foaming. It is absorbed by the contraction of the material spacer 34. Thereby, in contrast with the case where the back surface of the circuit board 20 is directly fixed by a rigid body or the like, it is possible to reduce the possibility that the circuit board 20 is damaged by the force from the upper side (force when the external device 100 is attached).

また、可動側端部が下側に回動する際、回路基板20は、固定側端部が上側(実装面側)に多少移動しようとする。このとき、貫通孔23およびボス33の場合と同様に、貫通孔23の周囲には空隙が形成されているため、貫通孔22の内壁面がボス32に当接せず、回路基板20の貫通孔22部分が破損するおそれがない。また、回路基板20の実装面ではネジ31の頭部により固定されているが、回路基板20の裏面側の貫通孔22周囲に設けられた発泡材スペーサ34の収縮により、回路基板20の実装面とネジ31の頭部との間にかかる負荷が吸収されるため、回路基板20の破損のおそれを軽減できる。   Further, when the movable side end rotates downward, the circuit board 20 tends to move somewhat upward (on the mounting surface side). At this time, as in the case of the through hole 23 and the boss 33, since a gap is formed around the through hole 23, the inner wall surface of the through hole 22 does not contact the boss 32, and the circuit board 20 penetrates. There is no possibility that the hole 22 is damaged. Further, although the mounting surface of the circuit board 20 is fixed by the head of the screw 31, the mounting surface of the circuit board 20 is contracted by contraction of the foam spacer 34 provided around the through hole 22 on the back surface side of the circuit board 20. Since the load applied between the screw 31 and the head of the screw 31 is absorbed, the possibility of damage to the circuit board 20 can be reduced.

図6はコネクタ15から外部装置100を抜く際の回路基板20の動きを示す模式図である。   FIG. 6 is a schematic diagram showing the movement of the circuit board 20 when the external device 100 is removed from the connector 15.

外部装置100のコネクタ15から抜く際、回路基板20には上向きの応力がかかる。このとき、回路基板20は可動側端部が上側(実装面側)に回動する。図5の場合と同様に、ボス33周囲には空隙が形成されているため、可動側端部が上側に多少回動しても、貫通孔23の内壁面がボス33に当接することがなく、回路基板20が破損するおそれがない。また、回路基板20は、可動側端部近傍では実装面側からの固定はないため、上側に回動する可動端部近傍の実装面との間にかかる負荷はなく、回路基板20の破損のおそれがない。   When pulling out from the connector 15 of the external device 100, upward stress is applied to the circuit board 20. At this time, the movable side end of the circuit board 20 rotates upward (mounting surface side). As in the case of FIG. 5, since a gap is formed around the boss 33, the inner wall surface of the through hole 23 does not come into contact with the boss 33 even if the movable side end is slightly rotated upward. There is no possibility that the circuit board 20 is damaged. In addition, since the circuit board 20 is not fixed from the mounting surface side in the vicinity of the movable side end portion, there is no load applied to the mounting surface in the vicinity of the movable end portion that rotates upward, and the circuit board 20 is damaged. There is no fear.

本実施形態では、回路基板20の可動側端部が所定角度以上、上側に回動しないように、筐体10の装着部14により、回路基板20の上側への回動を抑止している。すなわち、装着部14は、本発明に係る防止部を構成している。これにより、回路基板20の可動側端部が上側に回動しすぎて、回路基板20自体が撓んで折れ、または、回路基板20に設けられた電極パターンが断線、およびコネクタ部が破損するおそれを防止できる。   In the present embodiment, the circuit board 20 is prevented from turning upward by the mounting portion 14 of the housing 10 so that the movable side end of the circuit board 20 does not turn upward by a predetermined angle or more. That is, the mounting portion 14 constitutes a prevention portion according to the present invention. As a result, the movable side end of the circuit board 20 may rotate too much upward, causing the circuit board 20 to bend and bend, or the electrode pattern provided on the circuit board 20 to be disconnected and the connector part to be damaged. Can be prevented.

また、可動側端部が上側に回動する際、回路基板20は、固定側端部が下側に多少回動しようとする。このとき、貫通孔23の周囲には空隙が形成されているため、貫通孔22の内壁面がボス32に当接せず、回路基板20の貫通孔22部分が破損するおそれがない。また、回路基板20の裏面に当接している発泡材スペーサ34により、回路基板20の実装面とネジ31の頭部との間にかかる負荷が吸収されるため、回路基板20の破損のおそれを軽減できる。   Further, when the movable side end portion rotates upward, the circuit board 20 tends to slightly rotate the fixed side end portion downward. At this time, since a gap is formed around the through hole 23, the inner wall surface of the through hole 22 does not contact the boss 32, and the through hole 22 portion of the circuit board 20 is not damaged. Further, since the load applied between the mounting surface of the circuit board 20 and the head of the screw 31 is absorbed by the foam material spacer 34 that is in contact with the back surface of the circuit board 20, there is a risk of damage to the circuit board 20. Can be reduced.

以上のように、回路基板20に実装されたコネクタ15に対して外部装置100を脱着する際にかかる負荷によって、回路基板20が破損するおそれを防止することができる。また、回路基板20の実装面を剛体のネジ31の頭部で固定しているため、回路基板20の可動側端部は揺動可能であるが、回路基板20は安定的に固定されている。   As described above, it is possible to prevent the circuit board 20 from being damaged by the load applied when the external device 100 is attached to and detached from the connector 15 mounted on the circuit board 20. Further, since the mounting surface of the circuit board 20 is fixed by the head of the rigid screw 31, the movable side end of the circuit board 20 can swing, but the circuit board 20 is stably fixed. .

また、コネクタ15は、回路基板20の実装面に対して傾斜して装着されているため、オーディオ装置1を水平に設置した場合、ユーザは、外部装置100を鉛直方向から約15度傾けた状態でコネクタ15に抜き差しする必要があるが、ユーザにとってはどの程度外部装置100を傾斜する必要があるかが把握しづらい。このため、コネクタ15の抜き差し方向(法線方向nから約15度傾けた方向)に対し、傾斜した状態で外部装置100が抜き差しされる場合がある。   In addition, since the connector 15 is mounted to be inclined with respect to the mounting surface of the circuit board 20, when the audio device 1 is installed horizontally, the user tilts the external device 100 about 15 degrees from the vertical direction. However, it is difficult for the user to grasp how much the external device 100 needs to be inclined. For this reason, the external device 100 may be inserted / removed in an inclined state with respect to the insertion / removal direction of the connector 15 (a direction inclined about 15 degrees from the normal direction n).

この場合、例えば、回路基板20を貫通孔22,23の四点で固定支持したとすると、コネクタ15と回路基板20との間に大きな負荷がかかり、コネクタ15の破損、または、コネクタ15および回路基板20間の接続不良などが生じるおそれがある。そこで、回路基板20の一端部(可動側端部)を上下に揺動可能な構成とする本実施形態では、外部装置100がコネクタ15に対して傾斜していても、回路基板20の揺動によって、コネクタ15にかかる負荷を軽減でき、破損などを防止することができる。   In this case, for example, if the circuit board 20 is fixedly supported at the four points of the through holes 22 and 23, a large load is applied between the connector 15 and the circuit board 20, and the connector 15 is damaged or the connector 15 and the circuit are connected. There is a risk of poor connection between the substrates 20. Therefore, in this embodiment in which one end portion (movable side end portion) of the circuit board 20 can swing up and down, even if the external device 100 is inclined with respect to the connector 15, the circuit board 20 swings. Thus, the load on the connector 15 can be reduced, and damage and the like can be prevented.

(実施形態2)
以下に、本発明に係る基板支持構造の実施形態2について図面を参照して説明する。実施形態1では、回路基板20の裏面側に配置した支持板30により回路基板20を支持している構成に対し、本実施形態は、筐体10の一部を利用して回路基板20の実装面側を支持している。以下では、実施形態1と同様の部材については同じ符号を付して、説明は省略する。
(Embodiment 2)
Below, Embodiment 2 of the board | substrate support structure which concerns on this invention is demonstrated with reference to drawings. In the first embodiment, the circuit board 20 is supported by the support plate 30 disposed on the back side of the circuit board 20. In the present embodiment, the circuit board 20 is mounted using a part of the housing 10. Supports the surface side. Below, the same code | symbol is attached | subjected about the member similar to Embodiment 1, and description is abbreviate | omitted.

図7は、オーディオ装置1を下方から視た場合の回路基板20を示すである。図8(A)は図7のVIIA−VIIA線の断面図、図8(B)は図7のVIIB−VIIB線の断面図、図8(C)は図7のVIIC−VIIC線の断面図を示す。   FIG. 7 shows the circuit board 20 when the audio device 1 is viewed from below. 8A is a cross-sectional view taken along line VIIA-VIIA in FIG. 7, FIG. 8B is a cross-sectional view taken along line VIIB-VIIB in FIG. 7, and FIG. 8C is a cross-sectional view taken along line VIIC-VIIC in FIG. Indicates.

筐体10には、対向配置された回路基板20の貫通孔22,23と一致する位置に、ボス12,13が一体形成されている。ボス12,13は円筒形状であって、回路基板20の実装面側から貫通孔22,23に挿入される。貫通孔22,23およびボス12,13などの径は実施形態1と同様である。   Bosses 12 and 13 are integrally formed in the housing 10 at positions that coincide with the through holes 22 and 23 of the circuit board 20 that are arranged to face each other. The bosses 12 and 13 have a cylindrical shape and are inserted into the through holes 22 and 23 from the mounting surface side of the circuit board 20. The diameters of the through holes 22 and 23 and the bosses 12 and 13 are the same as those in the first embodiment.

貫通孔22に挿入されるボス12には、ネジ31が差し込まれている。ネジ31は、頭部が回路基板20の裏面に当接するよう、軸部がボス12にねじ込まれている。また、ボス12の周囲には、回路基板20の実装面に当接する発泡材スペーサ34が設けられている。回路基板20は、この発泡材スペーサ34と、ボス12にねじ込まれたネジ31の頭部とで挟み込まれて固定されている。なお、発泡材スペーサ34は、貫通孔23に挿入されたボス13の周囲にも、回路基板20の実装面に当接するよう設けられている。   A screw 31 is inserted into the boss 12 inserted into the through hole 22. The shaft portion of the screw 31 is screwed into the boss 12 so that the head portion contacts the back surface of the circuit board 20. A foam spacer 34 is provided around the boss 12 so as to come into contact with the mounting surface of the circuit board 20. The circuit board 20 is sandwiched and fixed between the foam spacer 34 and the head of the screw 31 screwed into the boss 12. The foam spacer 34 is also provided around the boss 13 inserted in the through hole 23 so as to contact the mounting surface of the circuit board 20.

このような構成で回路基板20が支持された場合であっても、実施形態1と同様に、コネクタ15に対する外部装置100の着脱時に回路基板20にかかる負荷を軽減することができる。この結果、コネクタ15または回路基板20などの損傷を抑制することができる。   Even when the circuit board 20 is supported with such a configuration, the load on the circuit board 20 when the external device 100 is attached to and detached from the connector 15 can be reduced as in the first embodiment. As a result, damage to the connector 15 or the circuit board 20 can be suppressed.

なお、オーディオ装置1の具体的構成などは、適宜設計変更可能であり、上述の実施形態に記載された作用及び効果は、本発明から生じる最も好適な作用及び効果を列挙したに過ぎず、本発明による作用及び効果は、上述の実施形態に記載されたものに限定されるものではない。   Note that the specific configuration of the audio device 1 can be appropriately changed in design, and the actions and effects described in the above-described embodiment are merely a list of the most preferable actions and effects resulting from the present invention. The actions and effects of the invention are not limited to those described in the above embodiment.

例えば、コネクタ15は回路基板20の実装面側に装着されているが、コネクタ15の装着面は回路基板20の配線パターン側の面であってもよい。また、回路基板20は、角部がR状となっていてもよく、形状は適宜変更可能である。コネクタ15の回路基板20に対する傾斜角度は、15度でなくてもよく、15度以上傾斜していてもよいし、基板平面に垂直であってもよい。   For example, although the connector 15 is mounted on the mounting surface side of the circuit board 20, the mounting surface of the connector 15 may be a surface on the wiring pattern side of the circuit board 20. Further, the circuit board 20 may have a rounded corner, and the shape can be changed as appropriate. The inclination angle of the connector 15 with respect to the circuit board 20 may not be 15 degrees, may be inclined by 15 degrees or more, or may be perpendicular to the board plane.

1−オーディオ装置
10−筐体
14−装着部
15−コネクタ
20−回路基板
22,23−貫通孔
30−支持板(支持部)
31−ネジ
32,33−ボス
34−発泡材スペーサ
22,23−貫通孔
100−外部装置
1-Audio device 10-Case 14-Mounting part 15-Connector 20-Circuit board 22, 23-Through hole 30-Support plate (support part)
31-Screw 32, 33-Boss 34-Foam spacer 22, 23-Through hole 100-External device

Claims (5)

基板と、
該基板を支持する支持部と、
前記基板の厚み方向に突出して前記基板の一面に設けられ、外部装置を装着するコネクタ部と、
を備え、
前記支持部は、
剛体および弾性体を有し、
厚み方向において前記剛体および前記弾性体で前記基板を挟み込み、前記基板に装着されたコネクタ部が厚み方向に揺動可能に支持している、
ことを特徴とする基板支持構造
A substrate,
A support for supporting the substrate;
A connector portion that protrudes in the thickness direction of the substrate and is provided on one surface of the substrate, and for mounting an external device;
With
The support part is
Having a rigid body and an elastic body,
The substrate is sandwiched between the rigid body and the elastic body in the thickness direction, and a connector portion mounted on the substrate is supported so as to be swingable in the thickness direction.
Substrate support structure characterized in that
前記基板は厚み方向に貫通する孔を有し、
前記剛体は、
前記孔より径が小さく、前記孔に挿入される柱部、および前記孔より径が大きく、前記柱部と係合する係合部、
を有し、
前記基板は、
前記係合部および前記弾性体で挟み込まれて支持されている、
ことを特徴とする請求項1に記載の基板支持構造。
The substrate has a hole penetrating in the thickness direction,
The rigid body is
A diameter smaller than the hole and inserted into the hole; and an engagement portion larger in diameter than the hole and engaged with the pillar;
Have
The substrate is
Sandwiched between and supported by the engaging portion and the elastic body,
The substrate support structure according to claim 1.
前記コネクタ部は、
前記基板からの突出方向が、前記基板の一面の法線方向に対して傾斜して設けられている、
をさらに備える請求項1または2に記載の基板支持構造。
The connector part is
The protruding direction from the substrate is provided inclined with respect to the normal direction of one surface of the substrate.
The substrate support structure according to claim 1, further comprising:
前記基板の所定角度以上の揺動を防止する防止部、
をさらに備えたことを特徴とする請求項1から3の何れか一つに記載の基板支持構造。
A prevention unit for preventing the substrate from swinging more than a predetermined angle;
The substrate support structure according to claim 1, further comprising:
前記支持部は、少なくとも二点で前記基板を支持している、
ことを特徴とする請求項1から4の何れか一つに記載の基板支持構造。
The support portion supports the substrate at at least two points.
The substrate support structure according to claim 1, wherein the substrate support structure is a substrate support structure.
JP2011219955A 2011-10-04 2011-10-04 Substrate support structure Pending JP2013080815A (en)

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JP (1) JP2013080815A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017034068A (en) * 2015-07-31 2017-02-09 シャープ株式会社 Substrate support structure and electrical apparatus
KR101975708B1 (en) * 2018-07-11 2019-05-07 정준석 Driving Apparatus in a louver system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017034068A (en) * 2015-07-31 2017-02-09 シャープ株式会社 Substrate support structure and electrical apparatus
KR101975708B1 (en) * 2018-07-11 2019-05-07 정준석 Driving Apparatus in a louver system

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