JP2013077751A - Wiring board for connector connection, method of manufacturing wiring board for connector connection, and connection structure of substrate and wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique for easily connecting a predetermined substrate such as a circuit board and a wiring board to each other without being contrary to demands for higher performance and downsizing of electronic equipment with circuit components and electronic components on the substrate.SOLUTION: There is provided the wiring board that includes a plurality of wiring layers arranged apart from one another and a plurality of insulating layers arranged between the wiring layers, and connects the predetermined substrate having a connector through the connector. At least one of the insulating layers has a recessed part which is opened on a side face of the wiring board and adapted to connect the connector from the side face of the wiring board toward the interior thereof, and a metal film which is electrically connected to at least one of the wiring layers is formed on an inner wall surface of the recessed part.

Description

  The present invention relates to a connector connection wiring board, a method for manufacturing a connector connection wiring board, and a board / wiring board connection structure.

  Conventionally, when two substrates, for example, a circuit board and a wiring board are joined, solder, an adhesive, a connector, or the like has been used. However, with the recent trend toward higher performance and downsizing of electronic devices, there is a need to improve the function of electronic devices by arranging circuit components and electronic components at high density. Even in the case where an electronic device is configured by mounting electronic components, it is required to improve the function of the electronic device by mounting the circuit components and the like on a substrate with high density.

  However, when circuit components or the like are mounted as described above, when bonding the substrates together, the area where the solder or adhesive is applied and the area where the connector is formed may become extremely narrow, or the area may be secured. There is a problem in that it becomes impossible to bond the substrates together using solder, an adhesive, or a connector.

  In view of such problems, in Patent Document 1, a plurality of end surface contacts are provided on the side surface of the rigid substrate, and a plurality of end surface contacts are also provided on one main surface of the flexible substrate. A technique for bonding to a side surface of a rigid substrate through a conductive film is disclosed.

  However, in the method described in Patent Document 1, it is necessary to accurately align the end surface contact provided on the side surface of the rigid substrate and the end surface contact provided on the main surface of the flexible substrate. Since complicated operations such as fixing after temporary fixing are required, there is a problem that the cost required to obtain the finally obtained rigid substrate and flexible substrate bonding structure increases.

JP 2008-84952 A

  The present invention simply connects a predetermined board such as a circuit board and a wiring board without violating the demand for high performance and miniaturization of electronic equipment by mounting circuit parts and electronic parts on the board. The purpose is to provide technology.

In order to achieve the above object, the present invention provides:
A plurality of wiring layers disposed apart from each other, and each layer includes a plurality of insulating layers disposed between the plurality of wiring layers, and a predetermined substrate having a connector is connected via the connector A wiring board for
In at least one of the plurality of insulating layers, an opening is formed on a side surface of the wiring board, and a recess for connecting the connector from the side surface of the wiring board toward the inside is formed. The present invention relates to a connector connecting wiring board, wherein a metal film electrically connected to at least one of a plurality of wiring layers is formed.

The present invention also provides:
A predetermined substrate having a connector;
A wiring board having a plurality of wiring layers disposed apart from each other and a plurality of insulating layers each disposed between the plurality of wiring layers;
The board and the wiring board are recesses in which the connector of the board is formed in at least one of the plurality of insulating layers from the side surface to the inside of the wiring board, and a metal film is formed on an inner wall surface. It is related with the connection structure of the board | substrate / wiring board characterized by connecting by engaging with.

  According to the present invention, from the side of the wiring board toward the inside, at least one of the plurality of insulating layers constituting the wiring board, the recess having the metal film formed on the inner wall surface is formed, The wiring board is electrically connected to at least one of a plurality of wiring layers constituting the wiring board. Therefore, the recess having the metal film formed on the inner wall surface functions as a socket for the connector. In this case, since the socket is formed on the side surface of the wiring board, the board and the wiring board are joined to each other on the side surface of the wiring board by inserting the connector into the socket of the predetermined board having the connector. can do.

  In general, circuit components and electronic components are mounted on the main surface of the wiring board and not mounted on the side surface of the wiring substrate, so the socket as described above can be used without reducing the mounting area of the circuit components and electronic components. A desired number can be formed on the side surface of the wiring board. Further, since the board and the wiring board can be joined simply by inserting the connector of the board into the socket of the wiring board and engaging them, a special operation such as temporary fixing is not required.

  As a result, it is possible to easily connect a predetermined board such as a circuit board and a wiring board without violating the demand for high performance and miniaturization of electronic equipment by mounting circuit parts and electronic parts on the board. Will be able to.

  In addition, although the said recessed part is requested | required that it opens to the side surface of a wiring board, you may open to the main surface of a wiring board. However, in this case, since the mounting area of the wiring board is slightly reduced, it is preferable that there is no opening on the main surface of the wiring board.

  The socket made of the concave portion of the connector connecting wiring board and the metal film can be formed by cutting and opening a through hole in which the metal film is formed in the wiring board in the thickness direction of the wiring board.

Specifically, when the recess is open on the main surface of the wiring board,
A plurality of wiring layers disposed apart from each other, and each layer includes a plurality of insulating layers disposed between the plurality of wiring layers, and a predetermined substrate having a connector is connected via the connector A method of manufacturing a wiring board for performing
Forming a through hole in the wiring board so that at least one tip of the plurality of wiring layers is exposed; and
Forming a metal film on the inner wall surface of the through hole;
Cutting the wiring board and the through hole in the thickness direction of the wiring board to open the through hole; and
It can be formed by the manufacturing method of the wiring board for connector connection characterized by comprising.

In addition, when the concave portion is not opened in the main surface of the wiring board,
A plurality of wiring layers disposed apart from each other, and each layer includes a plurality of insulating layers disposed between the plurality of wiring layers, and a predetermined substrate having a connector is connected via the connector A method of manufacturing a wiring board for performing
Forming a through hole in a first wiring board having a plurality of first wiring layers separated from each other by a plurality of first insulating layers;
Forming a metal film on the inner wall surface of the through hole;
Clogging the upper and lower openings of the through hole with a non-thermal fluid resin;
A second wiring board having a plurality of second wiring layers separated from each other by a plurality of second insulating layers and a plurality of third insulating layers are separated from each other from above and below the first wiring board. Laminating and bonding a third wiring substrate having a plurality of third wiring layers;
The first wiring board, the second wiring board, the third wiring board, and the through hole are arranged in the stacking direction of the first wiring board, the second wiring board, and the third wiring board. Cutting and opening the through hole;
It can manufacture by the manufacturing method of the wiring board for connector connection characterized by comprising.

  As described above, according to the present invention, a predetermined board such as a circuit board and a wiring board can be connected to the circuit board and the electronic component on the board without violating the demand for high performance and miniaturization of the electronic device. A technology for simple connection can be provided.

It is an upper top view showing a schematic structure of a wiring board for connector connection of a 1st embodiment. It is sectional drawing at the time of cutting along the II line | wire of the connector connection wiring board shown in FIG. It is a figure which shows the connection state of the wiring board for connector connection shown in FIG.1 and FIG.2, and a connector. It is a figure which shows an example of a structure of the circuit board which has a connector in 1st Embodiment. It is sectional drawing which shows the modification of the wiring board for connector connection of 1st Embodiment. It is sectional drawing which shows the modification of the wiring board for connector connection of 1st Embodiment. It is a figure which shows the connection state of the connector with respect to the wiring board for connector connection of 1st Embodiment. It is a figure which shows the connection state of the connector with respect to the wiring board for connector connection of 1st Embodiment. It is a figure which shows the connection state of the connector with respect to the wiring board for connector connection of 1st Embodiment. It is a figure which shows the connection state of the connector with respect to the wiring board for connector connection of 1st Embodiment. It is sectional drawing which shows the modification of the wiring board for connector connection of 1st Embodiment. It is sectional drawing which shows the modification of the wiring board for connector connection of 1st Embodiment. It is sectional drawing which shows the modification of the wiring board for connector connection of 1st Embodiment. It is an upper top view which shows schematic structure of the wiring board for connector connection of 2nd Embodiment. It is sectional drawing at the time of cutting along the III-III line of the connector connection wiring board shown in FIG. It is process drawing in the manufacturing method of the wiring board for connector connection of 1st Embodiment. It is process drawing in the manufacturing method of the wiring board for connector connection of 1st Embodiment. It is process drawing in the manufacturing method of the wiring board for connector connection of 1st Embodiment. It is process drawing in the manufacturing method of the wiring board for connector connection of 2nd Embodiment. It is process drawing in the manufacturing method of the wiring board for connector connection of 2nd Embodiment. It is process drawing in the manufacturing method of the wiring board for connector connection of 2nd Embodiment. It is process drawing in the manufacturing method of the wiring board for connector connection of 2nd Embodiment.

  Hereinafter, other features and advantages of the present invention will be described based on embodiments for carrying out the invention.

(First embodiment)
FIG. 1 is an upper plan view showing a schematic configuration of the connector connection wiring board of the present embodiment, and FIG. 2 is a cross-sectional view taken along line II of the connector connection wiring board shown in FIG. is there.

  As shown in FIG. 1, the connector connection wiring board 10 of the present embodiment includes a first wiring layer 11, a second wiring layer 12, a third wiring layer 13, and a fourth wiring layer 14 in order from the bottom. The fifth wiring layer 15 and the sixth wiring layer 16 are stacked so as to be separated from each other.

  A first insulating layer 21 to a fifth insulating layer 25 are disposed between adjacent wiring layers. Specifically, a first insulating layer 21 is disposed between the first wiring layer 11 and the second wiring layer 12, and between the second wiring layer 12 and the third wiring layer 13. A second insulating layer 22 is disposed, and a third insulating layer 23 is disposed between the third wiring layer 13 and the fourth wiring layer 14. A fourth insulating layer 24 is disposed between the fourth wiring layer 14 and the fifth wiring layer 15, and a fifth insulating layer 15 is interposed between the fifth insulating layer 15 and the sixth wiring layer 16. An insulating layer 25 is provided.

  In other words, the first wiring layer 11 to the sixth wiring layer 16 are stacked so as to be separated from each other by the first insulating layer 21 to the fifth insulating layer 25 disposed between the adjacent wiring layers. ing.

  Further, the first wiring layer 11 and the second wiring layer 12 are electrically connected by the first interlayer connector 31, and the second wiring layer 12 and the third wiring layer 13 are the second interlayer. The third wiring layer 13 and the fourth wiring layer 14 are electrically connected by a third interlayer connector 33. The fourth wiring layer 14 and the fifth wiring layer 15 are electrically connected by the fourth interlayer connector 34, and the fifth wiring layer 15 and the sixth wiring layer 16 are the fifth interlayer. The connection body 35 is electrically connected. Therefore, the connector connection wiring board 10 of the present embodiment constitutes a so-called multilayer wiring board.

  The first wiring layer 11 to the sixth wiring layer 16 may be configured as a wiring pattern or an electrode pad by performing predetermined patterning as necessary, or may be configured as a solid pattern. Good. In the present embodiment, the sixth wiring layer 16 is configured as an electrode pad.

  In addition, the connector connecting wiring board 10 of the present embodiment has a plurality of concave portions 41 for connecting the connectors in the width direction from the side surface 10C to the inner side (in the present embodiment, a total of nine). A metal film 42 is formed on the inner wall surface. The metal film 42 is electrically connected to the fourth wiring layer 14. In the present embodiment, due to the manufacturing method described below, the recess 41 is opened in the main surfaces 10A and 10B of the connector connecting wiring board 10.

  In the present embodiment, the metal film 42 is electrically connected to the fourth wiring layer 14, but may be connected to any wiring layer constituting the wiring substrate 10. Furthermore, the wiring layer to be connected may be single or plural.

  The metal film 42 can be made of a metal material having high conductivity such as gold, silver, copper, and aluminum.

  The connector connection wiring board 10 of the present embodiment has a recess 41 formed inwardly from the side surface 10 </ b> C, and a metal film 42 is electrically connected to the fourth wiring layer 14 on the inner wall surface. Is formed. Accordingly, the recess 41 and the metal film 42 function as a socket for the connector. In this case, since the socket is formed on the side surface 10C of the connector connection wiring board 10, the board and the connector connection wiring board 10 are connected by inserting the connector of the predetermined board having the connector into the socket. It can be joined at the side surface 10C of the connector connecting wiring board 10.

  Generally, circuit components and electronic components are mounted on the main surfaces 10A and 10B of the wiring board and not mounted on the side surface 10C of the wiring substrate. Therefore, the socket as described above reduces the mounting area of the circuit components and electronic components. Without being done, a desired number can be formed on the side surface of the connector connecting wiring board 10. Also, since the board and the connector connection wiring board 10 can be joined simply by inserting the connector of the board into the socket of the connector connection wiring board 10 and engaging them, a special operation such as temporary fixing is required. And not.

  As a result, a predetermined board such as a circuit board and the connector-connecting wiring board 10 can be simplified without violating the demand for mounting high-performance and downsized electronic devices by mounting circuit components and electronic components on the board. Will be able to connect to.

  Although not particularly illustrated, a hard coat layer such as a chromium plating layer can be formed on the metal film 42. As a result, even when the connector is inserted into and engaged with the recess 41 that functions as a part of the socket as described above, the wear of the metal film 42 by the connector is suppressed, and the connector can be engaged with the socket for a long time. It can be stably held over.

  Moreover, in order to strengthen the connection between the recess 41 and the connector inserted into and engaged with the recess 41, it is possible to fill these gaps with solder, resin, or the like.

  FIG. 3 is a diagram showing a connection state between the connector connecting wiring board 10 and the connector shown in FIGS. 1 and 2. In FIG. 3, in order to clarify the features of this modification, the connector connection wiring board 10 shown in FIG. 2 is cut along the line II-II including the fourth wiring layer 14. Furthermore, the cross section which paid its attention to one recessed part 41 is shown.

  As shown in FIG. 3, for example, when the pin connector 51 whose tip 51A is thicker than the base 51B is used, the tip 51A of the pin connector 51 is the side surface 41C of the recess 41, that is, the metal film 42. The pin connector 51 is engaged with and fixed to the recess 41 by engaging with the surface.

  However, since the recess 41 of the present embodiment is open to the main surfaces 10A and 10B of the wiring board, the pin connector 51 is preferably engaged with the recess 41 so as not to be exposed to the main surfaces 10A and 10B. When the pin connector 51 is exposed on the main surfaces 10A and 10B, the pin connector 51 is in electrical contact with the wiring or the like of the electronic component mounted on the main surfaces, and thus the electronic component, that is, the board having the connector connecting wiring board 10 and the connector 51. This may cause an electrical failure in the connection structure between the wiring board 10 and the wiring board 10 and cause malfunction of the wiring board 10 and the connection structure.

  FIG. 4 shows an example of the configuration of the circuit board 50 having the connector 51 described above. The connector 51 and the recess 41 as shown in FIG. 3 are engaged with each other to connect the connector connecting wiring board 10 shown in FIGS. 1 and 2 and the board 50 shown in FIG. Can be obtained.

  However, the substrate configuration shown in FIG. 4 is merely an example, and the substrate having the connector 51 to be connected to the connector connection wiring substrate 10 of the present embodiment can be arbitrarily configured as necessary.

  5 and 6 are modifications of the connector connecting wiring board 10 of the present embodiment. 5 and 6, the II-II line including the fourth wiring layer 14 of the connector connecting wiring board 10 shown in FIG. 2 is used, as in FIG. A cross section focusing on one recess 41 is shown.

  In the connector connecting wiring board 10 shown in FIG. 5, the opening 41A of the recess 41 is narrower than the size of the inside 41B. Specifically, the interior 41B has a shape in which the width of the opening 41A is increased in one direction from the central axis X of the recess 41 with respect to the opening 41A. On the other hand, in the connector connecting wiring board 10 shown in FIG. 6, the inside 41B of the recess 41 has a shape in which the width is uniformly expanded in both directions from the central axis X of the recess 41 with respect to the opening 41A. Yes.

  In any case, for example, when the diameter (opening width) of the opening 41A is d1, and the diameter (width) of the inside 41B is d2, d1 / d2 is set to 0.99 to 0.8. ing. When d1 / d2 is close to 0.8, if the rigidity of the connector is relatively large, the opening may be broken or cannot be inserted during insertion, so the rigidity of the connector may be relatively small. On the other hand, when d1 / d2 is close to 0.99, the amount of deformation at the connector tip is relatively small when the connector is inserted. It is preferable that the connector is relatively large and the connector is difficult to come off. Although the rigidity of the connector depends on the material of the connector, it cannot be generally stated. For example, when the main material of the connector is a copper alloy, the Young's modulus indicating the rigidity is 110 to 180 GPa. By changing the composition, the rigidity may be adjusted as appropriate. As a result, when the connector is inserted into the recess 41 and engaged, the engaged state can be firmly held, and the connector can be effectively prevented from coming off from the recess 41.

  The connector can be connected to the connector connection wiring board 10 shown in FIG. 5 in the form shown in FIGS. 7 and 8, for example.

  In FIG. 7, the connector 51 has a so-called pin connector shape in which the tip 51 </ b> A is thickened. The tip 51 </ b> A is inserted into and engaged with the recess 41, and the connector connection wiring via the metal film 42. The substrate 10 is electrically and mechanically joined. In FIG. 8, the connector 51 has a so-called spring-like connector shape in which the tip 51 </ b> A has a leaf spring shape, and the tip 51 </ b> A is inserted into and engaged with the recess 41. 10 and are electrically and mechanically joined.

  If the tip 51C of the connector 51 is smaller than the width of the opening 41A of the recess 41, the tip 51A of the connector 51 is compressed at the time of insertion, so the tip 51A is inserted into the recess 41. Can be engaged.

  The connector can be connected to the connector connection wiring board 10 shown in FIG. 6 in the form shown in FIGS. 9 and 10, for example.

  In FIG. 9, the connector 51 has a so-called pin connector shape with a thickened tip 51 </ b> A. The tip 51 </ b> A is inserted into and engaged with the recess 41, and the connector connection wiring is provided via the metal film 42. The substrate 10 is electrically and mechanically joined. In FIG. 10, the connector 51 has a pin connector shape in which the tip 51 </ b> A has a conical shape, and the tip 51 </ b> A is inserted into and engaged with the recess 41, for connector connection via the metal film 41. It is electrically and mechanically joined to the wiring board 10.

  Even in this case, if the most distal portion 51C of the connector 51 is smaller than the width of the opening 41A of the recess 41, the tip 51A of the connector 51 can be inserted into the recess 41 and engaged.

  Further, in any of the connection states shown in FIGS. 7 to 10, for example, the board having the connector 51 can be a board 50 as shown in FIG. 4, thereby connecting the wiring board 10 and the board 50. Can be formed. However, the substrate configuration shown in FIG. 4 is merely an example, and the substrate having the connector 51 to be connected to the connector connection wiring substrate 10 of the present embodiment can be arbitrarily configured as necessary.

  11 and 12 are modifications of the connector connection wiring board 10 of the present embodiment. 11 and 12, the II-II line including the fourth wiring layer 14 of the connector connecting wiring board 10 shown in FIG. 2 is also provided in the same manner as FIG. 3 in order to clarify the features of this modification. A cross section focusing on one recess 41 is shown.

  In the connector connecting wiring board 10 shown in FIG. 11, the pin connector 51 as shown in FIG. 9 is inserted and engaged in the recess 41 formed in the side surface 10C, but the slit 51S is formed in the base 51B of the connector 51. Is formed, and the base 51B of the connector 51 is narrowed. Similarly, in the connector connecting wiring board 10 shown in FIG. 12, a plate spring-like connector 51 as shown in FIG. 8 is inserted and engaged in the recess 41 formed in the side surface 10C. A slit 51S is formed in the base portion 51B of the connector 51, and the base portion 51B of the connector 51 is narrowed.

  Therefore, after a predetermined board (for example, a circuit board as shown in FIG. 4) having the connector 51 is electrically and mechanically connected to the connector connecting wiring board 10 via the connector 51 and the recess 41, the board is connected to the connector. When the connector 51 is pulled out from the connection wiring board 10, the connector 51 is broken at the base 51 </ b> S, and the tip 51 </ b> A of the connector 51 remains in the recess 41.

  As a result, since the connector can no longer be connected in the concave portion 41 of the connector connecting wiring board 10, when the connector connecting wiring board 10 is mounted with an IC chip or the like, a board in which another person has a separate connector. Cannot be read in the IC chip or the like. Therefore, the security with respect to the connector connecting wiring board 10 can be improved.

  FIG. 13 is a modification of the connector connecting wiring board 10 of the present embodiment. In FIG. 13 as well, in order to clarify the characteristics of this modification, as in FIG. 3, along the II-II line including the fourth wiring layer 14 of the connector connecting wiring board 10 shown in FIG. A cross-section focusing on one of the recesses 41 is shown.

  In this modification, the opening 41A is formed in a tapered shape so that the size of the opening 41A of the recess 41 narrows from the outside toward the inside. Therefore, the engagement of the connector 51 with the recess 41 can be performed more easily. In particular, as shown in FIGS. 7 and 9, when the pin connector 51 whose tip 51A is thicker than the base 51B is engaged in the recess 41, Can be more easily engaged.

(Second Embodiment)
14 is an upper plan view showing a schematic configuration of the connector connection wiring board of the present embodiment, and FIG. 15 is a cross-sectional view taken along the line III-III of the connector connection wiring board shown in FIG. FIG. In addition, the same code | symbol is used about the component similar to or the same as the component shown in FIG.1 and FIG.2.

  The wiring board 10-1 for connector connection of this embodiment has a plurality of recesses 41 for connecting connectors in the width direction from the side surface 10-1C to the inside (in this embodiment, a total of 9 The metal film 42 is formed on the inner wall surface. The metal film 42 is electrically connected to the fourth wiring layer 14. However, in this embodiment, due to the manufacturing method described below, the recess 41 is formed in the second insulating layer 22, the third insulating layer 23, and the fourth insulating layer 24, and the connector connecting wiring There are no openings in the main surfaces 10-1A and 10-1B of the substrate 10-1.

  Other configurations and features are the same as those of the connector connection wiring board 10 in the first embodiment, and thus the description thereof is omitted.

  The connector connection wiring board 10-1 of the present embodiment has a recess 41 formed inward from the side surface 10-1C, and a metal film 42 is electrically connected to the fourth wiring layer 14 on the inner wall surface. It is formed so as to be connected to. Accordingly, the recess 41 and the metal film 42 function as a socket for the connector. In this case, since the socket is formed on the side surface 10-1C of the connector connecting wiring board 10-1, the board and the connector connecting wiring are inserted into the socket of the predetermined board having the connector. The board 10-1 can be bonded to the side face 10-1C of the connector connection wiring board 10-1.

  In general, circuit components and electronic components are mounted on the main surfaces 10-1A and 10-1B of the wiring board and not mounted on the side surface 10-1C of the wiring board. A desired number can be formed on the side surface 10-1C of the connector connecting wiring board 10-1 without reducing the mounting area of the components. Further, since the board and the connector connecting wiring board 10-1 can be joined by simply inserting the connector of the board into the socket of the connector connecting wiring board 10-1, and engaging with each other. No special operation is required.

  As a result, a predetermined board such as a circuit board and a connector connection wiring board 10-1 can be obtained without violating the demand for high performance and downsizing of electronic devices by mounting circuit components and electronic components on the board. Can be easily connected.

  In the present embodiment, since the recess 41 is not opened on the main surfaces 10-1A and 10-1B of the connector connection wiring board 10-1, the mounting area of the wiring board 10-1 is increased by the opening of the recess 41. There is no decrease. Therefore, since the mounting area can be increased as compared with the connector connection wiring board 10 of the first embodiment, the connector connection wiring board 10-1 of the present embodiment has an opening of the recess 41. Therefore, the size can be reduced, or high-density mounting can be realized.

  In addition, the shape of the recessed part 41 of the connector connection wiring board 10-1 of this embodiment can be made into the aspect as shown in FIG.5 and FIG.6 in 1st Embodiment, and the connection of a connector is FIG. It can be set as an aspect as shown in FIG.

(Third embodiment)
Next, a method for manufacturing the connector connecting wiring board 10 of the third embodiment will be described. 16 to 18 are views showing process diagrams in the manufacturing method of the present embodiment. These drawings are shown as cross-sectional views corresponding to FIG. 2 of the first embodiment.

First, as shown in FIG. 16, the first wiring layer 11, the second wiring layer 12, the third wiring layer 13, the fourth wiring layer are sequentially formed from the bottom by, for example, the B ² it (Bsquare It) method. The wiring layer 14, the fifth wiring layer 15 and the sixth wiring layer 16 are laminated so as to be separated from each other, and between the adjacent wiring layers, the first insulating layer 21 to the fifth insulating layer, respectively. 25, and the adjacent wiring layers are electrically connected by the first interlayer connection body 31 to the fifth interlayer connection body 35, respectively.

  Since the fourth wiring layer 14 is electrically connected to the metal film 42 in the concave portion 41 to be formed later, the fourth wiring layer 14 extends toward the left end of the multilayer wiring board 10X where the concave portion 41 is to be formed rather than the other wiring layers. It is formed as it exists.

  Next, as shown in FIG. 17, a through hole 10O is formed so as to penetrate through the multilayer wiring board 10X by drilling or irradiating with a laser beam from above the multilayer wiring board 10X. Since the opening area of the through hole 10O is sufficiently larger than the drill diameter or the laser beam diameter, the multilayer wiring board 10X is usually subjected to drilling or laser beam irradiation a plurality of times for irradiation. The through hole 10O is formed by combining a plurality of relatively small through holes formed every time.

  Next, a metal film 42X is formed on the inner wall surface of the through hole 10O by, for example, a plating method.

  Next, as shown in FIG. 18, the multilayer wiring board 10X and the through hole 10O are cut in the thickness direction of the multilayer wiring board 10X, and the side end face (left end face in the present embodiment) of the through hole 10O is opened. As a result, the opened through hole 10O functions as a recess 41 opened on the side surface of the multilayer wiring board 10X, and the metal film 42X functions as a metal film 42 formed on the inner wall surface of the recess 41, resulting in FIG. And the wiring board 10 for connector connection as shown in FIG. 2 can be obtained.

  Since the metal film 42X functions as the metal film 42 later, the metal film 42X is made of the same metal material as the metal film 42, such as gold, silver, copper, and aluminum.

(Fourth embodiment)
Next, a manufacturing method of the connector connecting wiring board 10-1 of the second embodiment will be described. 19-22 is a figure which shows the process drawing in the manufacturing method of this embodiment. These drawings are shown as cross-sectional views corresponding to FIG. 2 of the first embodiment. In addition, the same code | symbol is used about the component similar to or the same as the component shown in FIGS.

  First, in accordance with the steps shown in FIGS. 16 and 17 in the third embodiment, the second wiring layer 12, the third wiring layer 13, the fourth wiring layer 14, and the fifth wiring are sequentially arranged from the bottom. The layers 15 are stacked so as to be separated from each other, and second to fourth insulating layers 24 to 24 are disposed between the adjacent wiring layers, and further, the adjacent wiring layers are respectively connected to the first wiring layer. A multilayer wiring board 10P (first wiring board) that is electrically connected by the second interlayer connection body 32 to the fourth interlayer connection body 34 and has a through hole 10O having a metal film 42P on the inner wall surface is formed. Prepared (FIG. 19).

  Next, as shown in FIG. 20, the upper and lower openings of the through hole 10O are formed by non-thermal fluid resins 21X and 25X, such as high viscosity epoxy resin and NCF film, which are not fluidized in the heating process described later. Occlude. Further, the second wiring substrate 10Q including the prepreg 21Q in which the silver bump or the copper bump 31Q penetrates and the first wiring layer 11 is formed on the back surface is formed, and the silver bump or the copper bump 35R penetrates, A third wiring substrate 10R including the prepreg 25R having the sixth wiring layer 16 formed on the back surface is formed.

  Next, the second wiring board 10Q, the first wiring board 10P, and the third wiring board 10R are laminated in this order, and heated under pressure, so that the prepreg 21Q of the second wiring board 10Q is made to the first wiring board. While being fused to 10P, the prepreg 25R of the third wiring board 10R is fused to the first wiring board 10P to produce a multilayer wiring board 10X as shown in FIG. That is, in order from the bottom, the first wiring layer 11, the second wiring layer 12, the third wiring layer 13, the fourth wiring layer 14, the fifth wiring layer 15, and the sixth wiring layer 16 are mutually connected. The first insulating layer 21 to the fifth insulating layer 25 are disposed between the adjacent wiring layers which are stacked so as to be separated from each other, and each of the adjacent wiring layers is further connected to the first interlayer connection body. A multilayer wiring board 10X that is electrically connected by the 31st to 5th interlayer connectors 35 is produced.

  It should be noted that the resins 21X and 25X closing the through hole 10O by the heating process described above are integrated with the first insulating layer 21 and the fifth insulating layer 25, respectively, and are apparently difficult to identify.

  Next, as shown in FIG. 22, the multilayer wiring board 10X (that is, the first wiring board 10P, the second wiring board 10Q, and the third wiring board 10R) and the through hole 10O are arranged in the thickness direction of the multilayer wiring board 10X. That is, it is cut into (that is, the stacking direction of the first wiring board 10P, the second wiring board 10Q, and the third wiring board 10R) to open the side end face (the left end face in the present embodiment) of the through hole 10O. As a result, the opened through hole 10O functions as a recess 41 opened on the side surface of the multilayer wiring board 10X, and the metal film 42P functions as a metal film 42 formed on the inner wall surface of the recess 41. As a result, FIG. And the connector connection wiring board 10-1 as shown in FIG. 15 can be obtained.

  The present invention has been described in detail based on the above specific examples. However, the present invention is not limited to the above specific examples, and various modifications and changes can be made without departing from the scope of the present invention.

  For example, in the above-described embodiment, the connector connection wiring board is configured as a multilayer wiring board having six wiring layers, but the number of wiring layers may be any number as necessary.

DESCRIPTION OF SYMBOLS 10, 10-1 Connector connection wiring board 11 1st wiring layer 12 2nd wiring layer 13 3rd wiring layer 14 4th wiring layer 15 5th wiring layer 16 6th wiring layer 21 1st Insulating layer 22 2nd insulating layer 23 3rd insulating layer 24 4th insulating layer 25 5th insulating layer 31 1st interlayer connection body 32 2nd interlayer connection body 33 3rd interlayer connection body 34 4th Interlayer connection body 35 Fifth interlayer connection body 41 Recess 42 Metal film 50 Circuit board 51 (circuit board) connector

Claims (8)

A plurality of wiring layers disposed apart from each other, and each layer includes a plurality of insulating layers disposed between the plurality of wiring layers, and a predetermined substrate having a connector is connected via the connector A wiring board for
In at least one of the plurality of insulating layers, an opening is formed on a side surface of the wiring board, and a recess for connecting the connector from the side surface of the wiring board toward the inside is formed. A connector connecting wiring board, wherein a metal film electrically connected to at least one of a plurality of wiring layers is formed.   2. The connector connection wiring board according to claim 1, wherein the size of the opening of the recess is narrower than the size of the inside of the recess.   The connector connection wiring board according to claim 2, wherein the opening is formed in a tapered shape so that the size of the opening of the recess narrows from the outside toward the inside.   4. The connector-connecting wiring board according to claim 1, wherein the concave portion is formed inside the wiring board and is not opened in a main surface of the wiring board. 5. A plurality of wiring layers disposed apart from each other, and each layer includes a plurality of insulating layers disposed between the plurality of wiring layers, and a predetermined substrate having a connector is connected via the connector A method of manufacturing a wiring board for performing
Forming a through hole in the wiring board so that at least one tip of the plurality of wiring layers is exposed; and
Forming a metal film on the inner wall surface of the through hole;
Cutting the wiring board and the through hole in the thickness direction of the wiring board to open the through hole; and
A method of manufacturing a connector-connecting wiring board, comprising: A plurality of wiring layers disposed apart from each other, and each layer includes a plurality of insulating layers disposed between the plurality of wiring layers, and a predetermined substrate having a connector is connected via the connector A method of manufacturing a wiring board for performing
Forming a through hole in a first wiring board having a plurality of first wiring layers separated from each other by a plurality of first insulating layers;
Forming a metal film on the inner wall surface of the through hole;
Clogging the upper and lower openings of the through hole with a non-thermal fluid resin;
A second wiring board having a plurality of second wiring layers separated from each other by a plurality of second insulating layers and a plurality of third insulating layers are separated from each other from above and below the first wiring board. Laminating and bonding a third wiring substrate having a plurality of third wiring layers;
The first wiring board, the second wiring board, the third wiring board, and the through hole are arranged in the stacking direction of the first wiring board, the second wiring board, and the third wiring board. Cutting and opening the through hole;
A method of manufacturing a connector-connecting wiring board, comprising: A predetermined substrate having a connector;
A wiring board having a plurality of wiring layers disposed apart from each other and a plurality of insulating layers each disposed between the plurality of wiring layers;
The board and the wiring board are recesses in which the connector of the board is formed in at least one of the plurality of insulating layers from the side surface to the inside of the wiring board, and a metal film is formed on an inner wall surface. A board / wiring board connection structure, wherein the board / wiring board is connected by engaging with the board.   The board / wiring board connection structure according to claim 6, wherein a slit is formed at a base of the connector.

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