JP2013076410A - Blower device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To aim at miniaturization, regarding a blower device used for, for example, a ventilating fan, and an air conditioner.SOLUTION: In the present invention, at least a part other than a body case 1 and a control circuit 15 are integrated with a mold resin body 17 in a motor 8, a small part 17a and a large part 17b are formed by the mold resin body 17, the mold resin body 17 is fixed to the body case 1 while the small part 17a in a through hole 5 provided in the body case 1 is plunged inside the body case 1, the control circuit 15 is disposed in the large part 17b and is disposed outside the case body 1, a centrifugal fan 6 has an air suction port 2 side as a large diameter opening 6a and the opposite side as a small diameter opening 6b having a diameter smaller than the large diameter opening 6a, and an outer diameter of the centrifugal fan 6 is formed small on the small diameter opening 6b side than the large diameter opening 6a side, and the control circuit 15 is configured with a semiconductor element 18 mounted on a body case 1 opposed surface side of a substrate 16 of the control circuit.

Description

  The present invention relates to a blower used for a ventilation fan or an air conditioner, for example.

  In recent years, blowers used in ventilation fans and air conditioners have been required to have a high output and be compatible with a wide range of operating environment temperatures while being small and light.

  The structure of this type of conventional blower has the following structure.

  That is, a main body case having an air inlet and an air outlet, a fan provided in the main body case, a rotation shaft connected to the fan, a motor fixed to the main body case, And a control circuit for controlling the rotation of the motor. This control circuit has a configuration in which electronic components are mounted on a substrate (for example, Patent Document 1 below).

Japanese Patent Laid-Open No. 62-10551

  The problem in the conventional example is that the apparatus becomes large.

  That is, the control circuit of the above conventional example has a configuration in which an electronic component is mounted on a substrate, and the electronic component is heated to high temperature due to heat generation. It was mounted on the coolest part.

  For this reason, a dedicated installation space for the control circuit is required in the main body case, which causes an increase in the size of the apparatus.

  In addition, ventilation fans and air conditioners have come to be used even in regions where the operating environment temperature is very high, so compliance with outer temperature regulation by laws and regulations, and regulation of the operating temperature range of electronic components. In order to cope with this, it is necessary to use electronic parts having large specifications such as current capacity, which also causes an increase in the size of the apparatus.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to reduce the size of the apparatus.

In order to achieve this object, the present invention
A body casing having an air inlet and an air outlet, and a centrifugal fan provided in the main body case, in this centrifugal fan, with its rotary shaft is connected, a motor fixed to the main body case The centrifugal fan includes a control circuit mounted on a circuit board, the electronic fan performing rotation control of the motor, and the centrifugal fan has a large-diameter opening at the air suction port side of the main body case, and vice versa. A small-diameter opening having a smaller diameter than the large-diameter opening, and an outer diameter of the centrifugal fan is formed such that the small-diameter opening side is smaller than the large-diameter opening side, and the motor is at least partially And the control circuit is disposed close to the motor portion outside the main body case, and at least the motor portion outside the main body case and the control circuit are molded. Integrated in fat body, this molded resin body, and a small portion,
A state where a large portion is formed, a through hole is provided in the main body case portion facing the small diameter opening of the centrifugal fan, and the small portion is protruded into the main body case from the outside of the main body case. The mold resin body is fixed to the main body case, the control circuit is disposed in the large portion outside the main body case, and the control circuit is disposed on the main body case facing surface side of the substrate. In this way, the initial purpose is achieved.

As described above, the present invention includes a main body case having an air suction port and an air discharge port, a centrifugal fan provided in the main body case, and a rotary shaft connected to the centrifugal fan. A motor fixed to the main body case and an electronic component that controls the rotation of the motor, and a control circuit mounted on the board; and the centrifugal fan is provided on the air inlet side of the main body case. The opening is a large-diameter opening, the opposite opening is a small-diameter opening having a smaller diameter than the large-diameter opening, and the outer diameter of the centrifugal fan is smaller than the large-diameter opening side. and, wherein the motor is at least a portion protruding outside the body case, as well as placing the control circuitry in close proximity to the motor section outside the main body case, before the motor portion of the outer least these main case Integrating the control circuit in the molded resin body, this molded resin body is provided with small portions, to form a large part, a through hole in the main body case portion opposed to the small diameter opening of the centrifugal fan, the The mold resin body is fixed to the main body case in a state in which the small portion is inserted into the main body case from the outside of the main body case, and the control circuit is connected to the large portion outside the main body case. Since the control circuit is configured to mount electronic components on the substrate case facing surface side of the substrate, the apparatus can be reduced in size.

  That is, in the present invention, at least a part of the motor protrudes out of the main body case, and a control circuit is arranged close to the motor portion outside the main body case, and at least the motor portion outside the main body case and the control circuit And the control circuit in this integrated state is a configuration in which electronic parts are mounted on the substrate case facing surface side of the substrate, so the motor and the control circuit are integrated. As a result, it is not necessary to provide a dedicated space for installing only the control circuit, and the apparatus can be downsized.

  In addition, the heat of the electronic components of the control circuit can be transferred and diffused to the main body case through the mold resin body, and can be dissipated by the air blown by the fan flowing through the inner surface of the main body case, so that the operation of the control circuit becomes unstable. Can be prevented, and the motor output can be improved without changing the motor dimensions and without increasing the specifications of the electronic components. In addition, even when used in areas where the operating environment temperature is extremely high, the size of the device can be reduced by complying with the regulation of the outer temperature by laws and regulations and the regulation of the operating temperature range of electronic components. Can be planned.

  Further, since the heat generated by the electronic components of the control circuit is transmitted and diffused to the main body case as described above, sufficient cooling can be performed, that is, there is no need to provide additional cooling fins. The size can be reduced.

The perspective view which shows one Embodiment of this invention Cross section Cross section of the main part Expanded sectional view of the main part Block diagram of the controller

  An embodiment in which an embodiment of the present invention is applied to a ceiling-embedded ventilation fan will be described below with reference to the accompanying drawings.

  In FIG. 1, reference numeral 1 denotes a substantially rectangular parallelepiped main body case. As shown in FIG. 2, an air suction port 2 is formed on the lower surface, and an air discharge port 3 is integrally formed on the outer peripheral surface with a synthetic resin.

  The ceiling surface 4 of the main body case 1 is formed of a metal plate, and a through hole 5 is formed at a substantially central portion thereof.

  In addition, a centrifugal fan 6 is provided in the main body case 1, and a lower end of a rotating shaft 9 of a motor 8 is passed through a circular shaft support portion 7 provided in a substantially central shaft portion thereof. The centrifugal fan 6 is attached to the lower end portion of the rotating shaft 9 in a substantially fixed state (including detachable if necessary).

  As shown in FIGS. 2 and 3, the motor 8 is provided with bearings 10 and 11 above and below the rotating shaft 9, and the rotor 12 is disposed on the rotating shaft 9 portion between the upper and lower bearings 10 and 11. Is fixed.

  Further, in the outer circumferential direction of the rotor 12, a stator 14 (stator) in which a drive coil 24 is wound around a stator core 23 (stator core) on which an insulator 13 is mounted at a predetermined interval is disposed.

  On the other hand, a substrate 16 constituting the control circuit 15 shown in FIG. 5 is arranged on the opposite side of the motor 8 from the centrifugal fan 6.

  As shown in FIG. 3, the substrate 16 is integrated with the motor 8 by a mold resin body 17 (naturally, the rotating portion of the rotating shaft 9, the rotor 12, and the bearings 10 and 11 are molded. The resin body 17 is in a state where it can move without being in direct contact).

  More specifically, this state is such that the mold resin body 17 covering the motor 8 and the substrate 16 of the control circuit 15 has a cylindrical portion covering the outer periphery of the lower motor 8 portion as shown in FIG. A small portion 17a is formed, and a portion of the control circuit 15 covering the outer periphery of the substrate 16 is a large portion 17b.

  Then, the small portion 17a is inserted into the main body case 1 from the outside of the main body case 1 into the main body case 1 from the upper side to the lower side as shown in FIG. In the state shown, a screw (not shown) is screwed onto the ceiling surface 4 of the main body case 1 from the upper surface of the mold resin body 17, and thereby the motor 8 and the control to the ceiling surface 4 of the main body case 1 are controlled. Fixing with the circuit 15 is completed.

  Now, in the state where the fixing of the motor 8 and the control circuit 15 to the ceiling surface 4 of the main body case 1 is completed as described above, the main body case 1 is covered with the mold resin body 17 in the portion of the substrate 16 as shown in FIG. The electronic component such as the semiconductor element 18 having a large calorific value of the control circuit 15 shown in FIG.

  The semiconductor element 18 constitutes an inverter in FIG. 5, and generates a large amount of heat during operation.

  That is, in FIG. 5, the power source 19 is full-wave rectified by a full-wave rectifier circuit 20, and then rectified to a state closer to a direct current by a coil 21 and a capacitor 22. The number of revolutions of the motor 8 is controlled.

  The semiconductor element (inverter) 18 generates a large amount of heat because a large current flows and is switched. Therefore, in the present embodiment, as described above, the semiconductor element (inverter) 18 is a portion of the substrate 16 covered with the mold resin body 17. 4, the semiconductor element 18 of the control circuit 15 shown in FIG. 5 is mounted on the lower surface side facing the ceiling surface 4 of the main body case 1.

  In this case, since heat conductive filler (not shown) made of, for example, aluminum hydroxide or calcium carbonate is mixed in the mold resin body 17, heat generation of electronic components such as the semiconductor element 18 It is efficiently transmitted to the ceiling surface 4 of the main body case 1 through the resin body 17, where it is diffused to the ceiling surface 4 made of a metal plate and radiated.

  Here, in the present embodiment, the opening on the side of the air suction port 2 (lower side) of the main body case 1 of the centrifugal fan 6 disposed below the ceiling surface 4 is a large-diameter opening 6a, and the opposite side (upper side) of the centrifugal fan 6 is disposed. The opening is a small-diameter opening 6b having a smaller diameter than the large-diameter opening 6a, and the motor 8 is fixed to the ceiling surface 4 portion of the main body case 1 facing the small-diameter opening 6b as shown in FIG.

  That is, the mold resin body 17 in which the through hole 5 is formed in the ceiling surface 4 portion of the main body case 1 facing the centrifugal fan 6 small-diameter opening 6b, and the motor 8 and the control circuit 15 are integrated as described above. Is fixed.

  In such a state, a part of the air blown by driving the centrifugal fan 6 easily reaches the ceiling surface 4 made of a metal plate, and the semiconductor that has been effectively transmitted to the ceiling surface 4 from this point. Since the heat generated by the electronic component such as the element 18 can be radiated more effectively by this air blowing, the motor output can be improved without increasing the specifications of the electronic component such as the semiconductor element 18. In addition, even when used in areas where the operating environment temperature is extremely high, the size of the device can be reduced by complying with the regulation of the outer temperature by laws and regulations and the regulation of the operating temperature range of electronic components. Can be planned.

  The reason why a part of the air blown by driving the centrifugal fan 6 can easily reach the ceiling surface 4 made of a metal plate by the above configuration is not sufficiently analyzed at present, but as one reason The following points are cited as reasons.

That is, since the diameter of the fan is large at the large-diameter opening 6a of the centrifugal fan 6, a large amount of wind can be sucked from the air suction port 2 and discharged to the air discharge port 3, whereas the centrifugal fan 6 In the small-diameter opening 6b, since the fan has a small diameter, the discharge force to the air discharge port 3 is small, so that a part of the air blown by driving the centrifugal fan 6 easily reaches the ceiling surface 4 made of metal plate. Ku made things and, in the present circumstances is to be considered.

  In the present embodiment, as shown in FIG. 4, an annular protrusion 4 a that covers the outer peripheral space of the semiconductor element 18 is formed on the outer peripheral portion of the mold resin body 17 on the ceiling surface 4 of the main body case 1. Therefore, not only the strength of the ceiling surface 4 is strengthened by work hardening, but also noise emission from the semiconductor element 18 can be suppressed.

  That is, the semiconductor element 18 constitutes an inverter as described above, and noise may be generated due to switching. In this case, the protrusion 4a serves as a barrier and can suppress noise emission.

  Also, from the viewpoint of noise generation, it is effective to dispose the semiconductor element 18 on the lower surface side of the substrate 16, but it is opposite to the mounting surface (lower surface) of the semiconductor element 18 of the substrate 16 as shown in FIG. If the ground line copper foil 16a is provided on the side surface (upper surface), noise radiation can be more effectively suppressed.

As described above, the present invention includes a main body case having an air suction port and an air discharge port, a centrifugal fan provided in the main body case, and a rotary shaft connected to the centrifugal fan. A motor fixed to the main body case and an electronic component that controls the rotation of the motor, and a control circuit mounted on the board; and the centrifugal fan is provided on the air inlet side of the main body case. The opening is a large-diameter opening, the opposite opening is a small-diameter opening having a smaller diameter than the large-diameter opening, and the outer diameter of the centrifugal fan is smaller than the large-diameter opening side. and, wherein the motor is at least a portion protruding outside the body case, as well as placing the control circuitry in close proximity to the motor section outside the main body case, before the motor portion of the outer least these main case Integrating the control circuit in the molded resin body, this molded resin body is provided with small portions, to form a large part, a through hole in the main body case portion opposed to the small diameter opening of the centrifugal fan, the The mold resin body is fixed to the main body case in a state in which the small portion is inserted into the main body case from the outside of the main body case, and the control circuit is connected to the large portion outside the main body case. Since the control circuit is configured to mount electronic components on the substrate case facing surface side of the substrate, the apparatus can be reduced in size.

  That is, in the present invention, at least a part of the motor protrudes outside the main body case, and the control circuit is arranged close to the motor portion outside the main body case, and at least the motor portion outside the main body case and the control The circuit is integrated with a molded resin body, and the control circuit in this integrated state is configured such that an electronic component having a large calorific value such as a semiconductor element is mounted on the surface of the substrate facing the body case. As a result, the motor and the control circuit are integrated, and as a result, it is not necessary to provide a dedicated space for installing only the control circuit, and thus the size of the apparatus can be reduced.

  In addition, the heat of electronic components such as semiconductor elements in the control circuit can be transferred and diffused to the main body case through the mold resin body, and can be dissipated by the air blown from the fan that flows through the inner surface of the main body case. Instability can also be prevented.

  Furthermore, the heat of the electronic components of the control circuit can be transmitted and diffused to the main body case through the mold resin body and can be dissipated by the air blown from the fan that flows through the inner surface of the main body case. The output can also be improved.

  Furthermore, the heat of the electronic components such as the semiconductor elements of the control circuit can be transferred and diffused to the main body case as described above, so that sufficient cooling can be performed. In other words, there is no need to separately provide cooling fins. The size can be reduced.

  Therefore, for example, utilization to a ventilation fan or an air conditioner is greatly expected.

DESCRIPTION OF SYMBOLS 1 Main body case 2 Air intake port 3 Air exhaust port 4 Ceiling surface 4a Projection part 5 Through-hole 6 Centrifugal fan 6a Large diameter opening 6b Small diameter opening 7 Shaft support part 8 Motor 9 Rotating shaft 10 Bearing 11 Bearing 12 Rotor 13 Insulator 14 Stator DESCRIPTION OF SYMBOLS 15 Control circuit 16 Board | substrate 16a Copper foil 17 Mold resin body 17a Small part 17b Large part 18 Semiconductor element 19 Power supply 20 Full wave rectifier circuit 21 Coil 22 Capacitor 23 Stator core 24 Drive coil

Claims (6)

A body case having an air inlet and an air outlet;
A centrifugal fan provided in the body case;
The centrifugal fan is connected to the rotating shaft, and a motor fixed to the body case;
Consists of electronic components that control the rotation of this motor, and includes a control circuit mounted on a board,
The centrifugal fan has a large-diameter opening on the air suction port side of the main body case, and an opening on the opposite side is a small-diameter opening having a smaller diameter than the large-diameter opening.
And, the outer diameter of the centrifugal fan is formed such that the small-diameter opening side is smaller than the large-diameter opening side,
The motor has at least a part projecting out of the main body case, and the control circuit is arranged close to the motor portion outside the main body case,
At least the motor part outside the main body case and the control circuit are integrated with a molded resin body,
With this mold resin body, a small part and a large part are formed,
A through hole is provided in the main body case portion facing the small-diameter opening of the centrifugal fan,
In the state where the small portion is inserted into the through hole from the outside of the main body case into the main body case, the mold resin body is fixed to the main body case,
The control circuit is arranged in the large portion outside the main body case,
The air blower characterized in that the control circuit is configured to mount an electronic component on the substrate case facing surface side of the substrate. The blower according to claim 1, wherein the electronic component mounted on the surface facing the main body case is an electronic component that generates heat. The blower according to claim 2, wherein the heat generating electronic component is a semiconductor element. The blower according to claim 3 , wherein a copper foil is provided on a surface opposite to the semiconductor mounting surface of the substrate constituting the control circuit. The blower according to any one of claims 1 to 4 , wherein a protrusion that covers an outer peripheral space of the electronic component is formed on an outer peripheral portion of the mold resin body of the main body case. The blower according to claim 1 , wherein a heat conductive filler is mixed in the mold resin body.

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