JP2013074175A - Manufacturing method of electric component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electric component which achieves high productivity and low cost.SOLUTION: Since a thermosetting resin 12 is used, high reliability and the increase of heat radiation performance are achieved with the manufacturing method. Further, holes 13 are made at a thermosetting resin material before thermal hardening by a picosecond pulse laser 22. Therefore, the process using a mask, such as photo-lithography, can be omitted and high productivity and low cost are achieved.

Description

  The present invention relates to a method for manufacturing an electrical component, and more particularly to a method for manufacturing an electrical component using a thermosetting resin.

  IC, discrete, and electronic components (IPD (Intelligent Power Device)) applicable to wafer level CSP (Chip Size Package), fan-out CSP, TSV (Through Silicon Via) silicon interposer, stacked chip, etc. packages or their composite modules. Re-wiring technology is applied. The redistribution technique has been widely used in the electric and electronic fields in order to realize improvement in handling, reliability, and testability by rearranging elements while increasing the terminal pitch. Currently, an insulating layer for rewiring is formed by patterning by a lithography technique using a photosensitive material such as polyimide (PI) or polybenzoxazole (PBO) as a mask.

  For example, Patent Document 1 discloses a laminate suitable for a printed wiring board having an insulating resin composition layer and a photosensitive composition layer containing a compound that decomposes upon exposure on a support. This laminate is subjected to pattern exposure to form a plating resist with a photosensitive composition layer, and then contacted with a reactive polymer precursor such as a polymerizable compound and exposed to a graft polymer in a region where no resist exists. After producing | generating, a printed wiring board can be obtained by providing a conductive layer there.

JP 2007-144820 A

  By the way, in the above technique, since it is a patterning method using a lithography technique using a photosensitive material as a mask, an expensive mask must be used, and the number of processes is high, resulting in high cost and low production. The problem is that it is difficult to cope with the future, the rewiring insulation layer having a multilayer structure, high reliability, and high heat dissipation. In particular, since the above-mentioned technology is an extension of the IC passivation film formation technology in the first place, it is a technology that assumes a single layer or two layers. There is a limit to dealing with the increase in the number of rewiring insulation layers, higher reliability, and higher heat dissipation due to the higher functionality and performance of composite products.

  The present invention has been made in view of the above problems, and an object thereof is to provide a method of manufacturing an electrical component capable of realizing high productivity and low cost.

  The present invention is a method for manufacturing an electrical component including a step of drilling holes in a thermosetting material before thermosetting with light.

  According to this configuration, since the thermosetting material is used, it is possible to cope with high reliability and high heat dissipation. In addition, since the holes are formed in the thermosetting material before thermosetting by light, it is possible to omit the process of using a mask as in lithography, thereby realizing high productivity and low cost. .

  In this case, the light is preferably picosecond pulse laser light.

  According to this configuration, since the light is a picosecond pulse laser beam, it is possible to make a hole in the thermosetting material with high accuracy.

  Moreover, the light can use a light emitting diode as a light source.

  According to this configuration, the light source can be made inexpensive.

  Further, it is preferable to simultaneously drill a plurality of holes in the thermosetting material with a plurality of lights.

  According to this configuration, since a plurality of holes are bored simultaneously by a plurality of lights, the productivity of electrical parts can be further improved.

  In this case, it is preferable to irradiate a mirror array capable of changing the reflectance of light at a plurality of locations, and to simultaneously drill a plurality of holes by the plurality of lights reflected from the mirror array.

  According to this configuration, light is irradiated onto a mirror array that can change the reflectance of light at a plurality of locations, and a plurality of holes are simultaneously drilled by the plurality of light reflected from the mirror array. For this reason, an electrical component can be manufactured efficiently.

  According to the method for manufacturing an electrical component of the present invention, high productivity and low cost can be realized.

(A)-(d) is a figure which shows the procedure of the patterning method which concerns on 1st Embodiment of this invention. It is a figure which shows the patterning apparatus and patterning method which concern on 2nd Embodiment of this invention.

  With reference to drawings, an example of the manufacturing method of the electrical component which concerns on embodiment of this invention is demonstrated. As shown in FIG. 1A, in the maskless patterning method according to the first embodiment of the present invention, rewiring is performed by patterning the Si wafer 10 on which the Cu pads 11 are already installed. As shown in FIG. 1B, a thermosetting resin 12 such as an epoxy resin containing a solvent, a latent curing agent, a silica filler, and the like is applied to the surface of the Si wafer 10 and dried. As the thermosetting resin 12, in order to increase the toughness of the epoxy resin, a resin containing an epoxy resin as a main component and polyimide as an additive can be used. As the thermosetting resin 12, for example, a product name “UFR108” manufactured by Nagase ChemteX Corporation can be used. As a method for applying the thermosetting resin 12, methods such as spin coating, spraying, printing, and ink jetting can be used.

  As shown in FIG. 1C, a thermal history is given to the periphery by selectively irradiating a picosecond pulse laser 22 from a laser light source 21 to an uncured thermosetting resin 12 before thermosetting. Without irradiating, the irradiation site is instantly volatilized and the drilling hole 13 is drilled. By adjusting the energy of the laser light source 21 and the pulse wavelength, it is also possible to use short-wavelength or long-wavelength laser light. However, by applying the picosecond pulse laser 22, the accuracy of the drilling hole 13 can be improved.

  After providing the hole 13, a desired device is constructed by installing a Cu pattern 14 and solder 15 as shown in FIG.

  According to this embodiment, since the thermosetting resin 12 is used, it is possible to cope with high reliability and high heat dissipation. Further, since the perforation hole 13 is perforated by the picosecond pulse laser 22 in the thermosetting material before thermosetting, it is possible to omit the process of using a mask as in photolithography, thereby achieving high productivity and low cost. Can be realized.

  Further, according to the present embodiment, since the laser beam is the picosecond pulse laser 22, the drilling hole 13 can be drilled in the thermosetting resin 12 with high accuracy.

  Hereinafter, a second embodiment of the present invention will be described. In the first embodiment, patterning is performed by drawing with a single picosecond pulse laser 22, but in this embodiment, patterning is performed in a lump with a plurality of laser beams.

  As shown in FIG. 2, the patterning apparatus 30 of this embodiment includes a white LED 31, a galvanometer mirror 33, and a mirror array 34 as a laser light source. The white LED 31 emits a laser 32 having a visible wavelength. The galvanometer mirror 33 can switch the reflection angle of the laser 32 from the white LED 31 in units of microseconds, and can switch in units of microseconds whether or not the laser 32 is irradiated on the mirror array 34. The mirror array 34 has, for example, 1 to 10 μm square semiconductor elements arranged in a total reflection area of about 30 to 40 mm square as a whole, and has, for example, 1920 × 1080 pixels. The semiconductor elements forming these pixels can be switched between reflection and non-reflection in units of microseconds independently. Therefore, the thermosetting resin 12 of the Si wafer 10 to be patterned is irradiated with a picosecond pulse laser so that desired patterning is performed on the entire surface.

  In the present embodiment, since a plurality of perforations 13 are perforated simultaneously by a plurality of lasers, the productivity of electrical parts can be further improved. In particular, in this embodiment, a laser array 32 is irradiated to a mirror array 34 that can change the reflectance of laser light at a plurality of locations, and a plurality of perforations 13 are simultaneously formed by the plurality of laser lights reflected from the mirror array 34. Drill all at once. For this reason, an electrical component can be manufactured efficiently. Furthermore, since the light source is an inexpensive white LED 31, the cost can be reduced.

  The present invention is not limited to the above embodiment, and various modifications can be made.

DESCRIPTION OF SYMBOLS 10 ... Si wafer, 11 ... Cu pad, 12 ... Thermosetting resin, 13 ... Drilling hole, 14 ... Cu pattern, 15 ... Solder, 21 ... Laser light source, 22 ... Picosecond pulse laser, 30 ... Patterning apparatus, 31 ... White LED, 32 ... Laser, 33 ... Galvano mirror, 34 ... Mirror array.

Claims (5)

  A method for manufacturing an electrical component, comprising a step of drilling holes in a thermosetting material before thermosetting with light.   The method of manufacturing an electrical component according to claim 1, wherein the light is a picosecond pulse laser beam.   The method of manufacturing an electrical component according to claim 1, wherein the light uses a light emitting diode as a light source.   The method for manufacturing an electrical component according to claim 1, wherein a plurality of holes are simultaneously formed in the thermosetting material by a plurality of the lights.   5. The electricity according to claim 4, wherein the light is irradiated onto a mirror array capable of changing the reflectance of the light at a plurality of locations, and a plurality of holes are simultaneously drilled by the plurality of light reflected from the mirror array. A manufacturing method for parts.

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