JP2013073869A - Photoirradiation device - Google Patents

Photoirradiation device Download PDF

Info

Publication number
JP2013073869A
JP2013073869A JP2011213926A JP2011213926A JP2013073869A JP 2013073869 A JP2013073869 A JP 2013073869A JP 2011213926 A JP2011213926 A JP 2011213926A JP 2011213926 A JP2011213926 A JP 2011213926A JP 2013073869 A JP2013073869 A JP 2013073869A
Authority
JP
Japan
Prior art keywords
led mounting
mounting substrate
locking portion
locking
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011213926A
Other languages
Japanese (ja)
Other versions
JP5846365B2 (en
Inventor
Tadahiro Matsushita
忠洋 松下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CCS Inc
Original Assignee
CCS Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CCS Inc filed Critical CCS Inc
Priority to JP2011213926A priority Critical patent/JP5846365B2/en
Priority to PCT/JP2012/074029 priority patent/WO2013047313A1/en
Publication of JP2013073869A publication Critical patent/JP2013073869A/en
Application granted granted Critical
Publication of JP5846365B2 publication Critical patent/JP5846365B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/27Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

PROBLEM TO BE SOLVED: To reduce warping of an LED mounting substrate caused when attaching the LED mounting substrate on a base member.SOLUTION: The base member 3 has a first engaging part 6 and a second engaging part 7 for engaging each side part 2a, 2b of the LED mounting substrate 2, and positioned so as to face one another. The dimension of the distance by which the first engaging part 6 and the second engaging part 7 are separated is set to be less than the dimension of the distance between the side parts of the LED mounting substrate 2. The configuration is such that the first engaging part 6 and the second engaging part 7 hold the LED mounting substrate in an elastically deformed curved state. The LED mounting substrate 2 has recesses 21 formed toward the inside widthwise direction in each side part 2a, 2b.

Description

本発明は、弾性変形可能な基板にLEDを搭載したLED搭載基板を有する光照射装置に関するものである。   The present invention relates to a light irradiation apparatus having an LED mounting substrate in which an LED is mounted on an elastically deformable substrate.

この種の光照射装置には、特許文献1に示すように、LEDが搭載された弾性変形可能な長尺形状をなすLED搭載基板と、このLED搭載基板を収容するケーシングとを備えたものがある。具体的にこの光照射装置は、LED搭載基板が係止される2つの係止部がケーシングに設けられており、この2つの係止部間の離間寸法がLED搭載基板の側辺部間寸法よりも小さく設定され、LED搭載基板が弾性変形した湾曲状態で前記係止部に係止されるように構成されている。そして、この光照射装置では、弾性変形により湾曲状態とされたLED搭載基板の側辺部を係止部に軸方向にスライドさせて係止することにより、LED搭載基板がケーシング内に収容される。   As shown in Patent Document 1, this type of light irradiation apparatus includes an LED mounting substrate having an LED-mounted substrate having an elastically deformable long shape and a casing for housing the LED mounting substrate. is there. Specifically, in this light irradiation device, two locking portions to which the LED mounting substrate is locked are provided in the casing, and the distance between the two locking portions is the dimension between the side portions of the LED mounting substrate. The LED mounting substrate is configured to be locked to the locking portion in an elastically deformed curved state. And in this light irradiation apparatus, an LED mounting board is accommodated in a casing by sliding the side part of the LED mounting board made into the curved state by elastic deformation to an engaging part by sliding in an axial direction. .

ところが、LED搭載基板の側辺部を係止部に軸方向にスライドさせて係止するものでは、LED搭載基板の側辺部を係止部にスライドさせるに連れてそれらの摩擦による抵抗が大きくなり、組み立て作業が極めて困難になるという問題がある。特に、LED搭載基板が弾性変形可能な薄い基板からなる場合には、スライド挿入する際に前記摩擦抵抗によりLED搭載基板がケーシング外部で屈曲して挿入しにくくなり、上記の問題が一層顕著となる。   However, in the case where the side portion of the LED mounting board is slid in the locking portion in the axial direction, the resistance due to friction increases as the side portion of the LED mounting board is slid to the locking portion. Therefore, there is a problem that assembly work becomes extremely difficult. In particular, when the LED mounting substrate is made of a thin substrate that can be elastically deformed, it becomes difficult to insert the LED mounting substrate by bending outside the casing due to the frictional resistance at the time of sliding insertion, and the above problem becomes more remarkable. .

特開2011−100707号公報JP 2011-1000070 A

このようなことから本願発明者は、LED搭載基板の側辺部を係止部に対して軸方向にスライドさせることなく、LED搭載基板を係止部上に配置して、当該LED搭載基板をその厚み方向に係止部に向かって押し込むことにより、LED搭載基板を係止部に係止させることを考えている。   For this reason, the present inventor arranges the LED mounting board on the locking portion without sliding the side portion of the LED mounting substrate in the axial direction with respect to the locking portion. It is considered that the LED mounting substrate is locked to the locking portion by pushing toward the locking portion in the thickness direction.

しかしながら、前記LED搭載基板が長尺矩形状をなすことから、LED搭載基板をその厚み方向に係止部に向かって押し込む際に、係止部に対してLED搭載基板の側辺部がずれやすく、このずれによってLED搭載基板の側辺部が歪んで皺が発生してしまうという問題がある。そして、LED搭載基板の側辺部の歪み又は皺により、LED搭載基板の側辺部が係止部に確実に係止されず、LED搭載基板の固定が不十分になり、ケーシングに対してLED搭載基板がずれてしまうという問題が生じる。また、このLED搭載基板の歪み又は皺により、ケーシングに対してLEDの光軸がずれてしまうという問題も生じる。   However, since the LED mounting substrate has a long rectangular shape, when the LED mounting substrate is pushed in the thickness direction toward the locking portion, the side portion of the LED mounting substrate is easily displaced with respect to the locking portion. This shift causes a problem that the side portion of the LED mounting substrate is distorted and wrinkles are generated. Then, due to distortion or wrinkles on the side portion of the LED mounting substrate, the side portion of the LED mounting substrate is not securely locked to the locking portion, and the LED mounting substrate is not sufficiently fixed, and the LED is not attached to the casing. There arises a problem that the mounting substrate is displaced. Moreover, the problem that the optical axis of LED will shift | deviate with respect to a casing also arises with the distortion or wrinkles of this LED mounting substrate.

そこで本発明は、上記問題点を一挙に解決するためになされたものであり、LED搭載基板をベース部材に取り付ける際に生じるLED搭載基板の歪み又は皺を低減することをその主たる所期課題とするものである。   Accordingly, the present invention has been made to solve the above-mentioned problems all at once, and its main intended problem is to reduce distortion or wrinkles of the LED mounting substrate that occurs when the LED mounting substrate is attached to the base member. To do.

すなわち本発明に係る光照射装置は、複数のLEDが搭載された弾性変形可能な長尺形状をなすLED搭載基板と、前記LED搭載基板が取り付けられるベース部材とを備え、前記ベース部材が、前記LED搭載基板の長手方向に垂直な幅方向両側の各側辺部に係止する互いに対向して設けられた第1の係止部及び第2の係止部を有しており、前記第1の係止部及び第2の係止部間の離間寸法を前記LED搭載基板の側辺部間寸法よりも小さく設定して、前記LED搭載基板が弾性変形して幅方向に湾曲した湾曲状態で前記第1の係止部及び第2の係止部に係止されるように構成されており、前記LED搭載基板が、前記各側辺部に幅方向内側に向かって形成された切り込み又は凹部を有することを特徴とする。   That is, the light irradiation apparatus according to the present invention includes an LED mounting substrate having an elastically deformable long shape on which a plurality of LEDs are mounted, and a base member to which the LED mounting substrate is attached. The first mounting portion and the second locking portion provided opposite to each other, which are locked to the respective side portions on both sides in the width direction perpendicular to the longitudinal direction of the LED mounting substrate, In the curved state in which the separation dimension between the engagement part and the second engagement part is set smaller than the dimension between the side parts of the LED mounting board, and the LED mounting board is elastically deformed and curved in the width direction. A notch or a recess that is configured to be locked to the first locking portion and the second locking portion, and in which the LED mounting substrate is formed in each side portion toward the inner side in the width direction. It is characterized by having.

このようなものであれば、LED搭載基板の各側辺部に幅方向内側に向かって形成された切り込み又は凹部が形成されているので、LED搭載基板の各側辺部を各係止部に係止させる際に歪みが生じたとしても、当該歪みによりその他の側辺部に与える歪み影響は、当該歪み発生部分に隣接する切り込み又は凹部により吸収される。これにより、切り込み又は凹部を挟んで歪み発生部分に隣接するその他の側辺部に与える影響を低減することができる。その結果、歪み発生部分から歪み影響を受ける部分を低減することができ、LED搭載基板を確実に固定することができる。また、歪み発生部分から歪み影響を受ける部分を低減することができるため、当該歪みにより光軸ずれを生じるLEDの数を低減することができる。さらに、歪み発生部分から歪み影響を受ける部分を低減することができるため、LED搭載基板を係止部に係止した状態の見た目を良くすることができる。   If it is such, since the cut | notch or recessed part formed toward the width direction inner side is formed in each side part of an LED mounting board, each side part of an LED mounting board is used as each latching | locking part. Even if a distortion occurs during the locking, the influence of the distortion on the other side part due to the distortion is absorbed by a notch or a recess adjacent to the distortion occurrence part. Thereby, the influence which it has on the other side part adjacent to a distortion generation part on both sides of a notch | incision or a recessed part can be reduced. As a result, it is possible to reduce the portion affected by the distortion from the distortion generating portion, and it is possible to securely fix the LED mounting substrate. Moreover, since the part which receives a distortion influence from a distortion generation part can be reduced, the number of LED which produces an optical axis offset by the said distortion can be reduced. Furthermore, since the part which receives a distortion influence from a distortion generation part can be reduced, the appearance of the state which latched the LED mounting board to the latching | locking part can be improved.

また本発明によれば、LED搭載基板の各側辺部において各係止部に係止される部分が切り込み又は凹部により区画される構成となるため、歪み発生部分を含む歪み発生区画のみを各係止部から取り外すことができ、既に係止部に係止された当該歪み発生区画に隣接する側辺部を係止部から取り外す必要が無く、LED搭載基板の取り付け作業の二度手間を防止し、取り付けの作業性を向上させることができる。なお、LED搭載基板がLEDから射出された光を反射する機能を有する場合には、当該LED搭載基板における歪み発生部分から歪み影響を受ける部分を低減することができるので、LEDからの光の反射光量を多くするだけでなく、反射ムラを低減することができる。   Further, according to the present invention, each of the side portions of the LED mounting substrate is configured such that the portions locked to the respective locking portions are partitioned by the cuts or the recesses, so that only the strain generating sections including the strain generating portions are each It can be removed from the locking part, and there is no need to remove the side part adjacent to the distortion generating section already locked by the locking part from the locking part, thus preventing twice the trouble of mounting the LED mounting board. In addition, the workability of mounting can be improved. When the LED mounting substrate has a function of reflecting light emitted from the LED, the portion affected by the distortion can be reduced from the distortion generating portion in the LED mounting substrate, so that the reflection of light from the LED can be reduced. Not only can the amount of light be increased, but also reflection unevenness can be reduced.

LED搭載基板のLEDをベース部材に対して確実に固定しつつ位置決めするためには、LED搭載基板の各側辺部においてLEDを挟む位置にある各側辺部が各係止部に係止することが望ましい。このため、前記切り込み又は凹部が、前記各側辺部において、前記LED搭載基板の長手方向に沿って互いに隣接するLEDの間に形成されていることが望ましい。特に、LED搭載基板の歪みにより影響を受けるLED数を少なくするためには、前記切り込み又は凹部が、前記各側辺部において、前記LED搭載基板の長手方向に沿って互いに隣接するLEDの間それぞれに形成されていることが望ましい。これならば、LED搭載基板の各側辺部において係止部に係止する被係止部分が各LEDを挟むように形成されることから、ベース部材に対してLEDを確実に位置決めして固定することができる。   In order to position the LED mounting board while securely fixing the LED to the base member, each side part of the LED mounting board at a position sandwiching the LED is locked to each locking part. It is desirable. For this reason, it is desirable that the notch or the recess is formed between the LEDs adjacent to each other along the longitudinal direction of the LED mounting substrate in each of the side portions. In particular, in order to reduce the number of LEDs affected by the distortion of the LED mounting substrate, the notches or the recesses are formed between the adjacent LEDs along the longitudinal direction of the LED mounting substrate at each side portion. It is desirable that it is formed. If this is the case, each of the side portions of the LED mounting substrate is formed so that the locked portion that is locked to the locking portion sandwiches each LED, so that the LED is reliably positioned and fixed with respect to the base member. can do.

前記切り込み又は凹部が、前記LED搭載基板の長手方向に沿って互いに隣接するLEDの中間位置に形成されていることが望ましい。これにより、長手方向に隣り合う2つの切り込み又は凹部の中間位置にLEDが配置される構成となる。したがって、切り込み又は凹部により区画された領域内に含まれるLEDが、当該領域の両側にある領域で歪みが発生した場合でも、その影響を受けにくくすることができる。具体的に前記LED搭載基板上に搭載されるLEDが長手方向に等間隔に配置されるものの場合には、前記LED搭載基板の長手方向に沿って互いに隣接するLEDの間隔と、前記LED搭載基板の長手方向に沿って互いに隣接する切り込み又は凹部の間隔とが略同一であることが望ましい。   It is desirable that the notch or the recess is formed at an intermediate position between the LEDs adjacent to each other along the longitudinal direction of the LED mounting substrate. Thereby, it becomes the structure by which LED is arrange | positioned in the intermediate position of two notches or recessed parts adjacent to a longitudinal direction. Therefore, even if the LED included in the region partitioned by the cuts or the recesses is distorted in the regions on both sides of the region, it can be made less susceptible to the influence. Specifically, in the case where the LEDs mounted on the LED mounting substrate are arranged at equal intervals in the longitudinal direction, the interval between the LEDs adjacent to each other along the longitudinal direction of the LED mounting substrate, and the LED mounting substrate It is desirable that the intervals between the notches or recesses adjacent to each other along the longitudinal direction are substantially the same.

LED搭載基板における歪み発生部分のみを簡単に取り外すことができる構成とするためには、一方の側辺部に形成された切り込み又は凹部と他方の側辺部に形成された切り込み又は凹部とが、前記LED搭載基板の長手方向において略同一位置に形成されていることが望ましい。これならば、LED搭載基板の各側辺部に形成された切り込み又は凹部が対称となるため、LED搭載基板を単に厚み方向に引っ張るだけで歪み発生部分のみを取り外すことができる。   In order to make it possible to easily remove only the strain-generating portion of the LED mounting substrate, the notch or recess formed on one side and the notch or recess formed on the other side, It is desirable that they are formed at substantially the same position in the longitudinal direction of the LED mounting substrate. If this is the case, the cuts or recesses formed on each side of the LED mounting substrate are symmetrical, so that only the strain-generating portion can be removed by simply pulling the LED mounting substrate in the thickness direction.

前記光照射装置が、前記ベース部材における係止部間の部位と、前記LED搭載基板におけるLED搭載領域の裏面又はその近傍との間に配設された熱伝導性を有する介在体を備え、前記LED搭載基板が前記第1の係止部及び第2の係止部に係止した湾曲状態において、当該LED搭載基板の弾性変形によって当該LED搭載基板が前記介在体を介して前記ベース部材を押圧するように構成していることが望ましい。これならば、LED搭載基板の歪みを低減しつつも、その歪みが低減されたLED搭載基板を介在体に密着させることができるので、LEDを効率的に放熱することができる。   The light irradiating device includes an intermediate body having thermal conductivity disposed between a portion between the locking portions of the base member and the back surface of the LED mounting region of the LED mounting substrate or the vicinity thereof, In a curved state in which the LED mounting substrate is locked to the first locking portion and the second locking portion, the LED mounting substrate presses the base member via the intermediate body due to elastic deformation of the LED mounting substrate. It is desirable to be configured to do so. If it is this, since the LED mounting board | substrate with which the distortion was reduced can be closely_contact | adhered to an intervening body, reducing the distortion | strain of an LED mounting board | substrate, LED can be thermally radiated efficiently.

前記光照射装置が、前記LED搭載基板が前記第1の係止部及び第2の係止部に係止していない非係止状態から前記LED搭載基板をその厚み方向に前記第1の係止部及び第2の係止部に対して押し込むことによって、前記LED搭載基板が前記第1の係止部及び第2の係止部に係止されるように構成されており、前記非係止状態のLED搭載基板を前記第1の係止部及び第2の係止部に対して位置決めするガイド面を備えることが望ましい。このガイド面は、前記第1の係止部及び第2の係止部に対して押し込み方向とは反対側に設けられている。これならば、LED搭載基板を係止部に係止させる際に、係止部に対してLED搭載基板を位置決めすることができるとともに、ガイド面により位置決めされたLED搭載基板を厚み方向に押圧するだけで、LED搭載基板を係止部に固定することができ、LED搭載基板の取り付け作業をより一層簡単にすることができる。   The light irradiation device moves the LED mounting board in the thickness direction from the non-locking state in which the LED mounting board is not locked to the first locking part and the second locking part. The LED mounting substrate is configured to be locked to the first locking portion and the second locking portion by being pushed into the locking portion and the second locking portion. It is desirable to provide a guide surface for positioning the LED mounting substrate in a stopped state with respect to the first locking portion and the second locking portion. The guide surface is provided on the side opposite to the pushing direction with respect to the first locking portion and the second locking portion. In this case, when the LED mounting substrate is locked to the locking portion, the LED mounting substrate can be positioned with respect to the locking portion, and the LED mounting substrate positioned by the guide surface is pressed in the thickness direction. As a result, the LED mounting substrate can be fixed to the locking portion, and the mounting operation of the LED mounting substrate can be further simplified.

上述した光照射装置は、長尺形状をなすLED搭載基板を有するものであったが、部分円環形状又は円環形状をなすLED搭載基板を有するものであっても同様の効果を奏する。つまり、本発明に係る光照射装置は、複数のLEDが搭載された弾性変形可能な部分円環形状又は円環形状をなすLED搭載基板と、前記LED搭載基板が取り付けられるベース部材とを備え、前記ベース部材が、前記LED搭載基板の円周方向に垂直な幅方向両側の各側辺部に係止する互いに対向して設けられた第1の係止部及び第2の係止部を有しており、前記第1の係止部及び第2の係止部間の離間寸法を前記LED搭載基板の側辺部間寸法よりも小さく設定して、前記LED搭載基板が弾性変形して幅方向に湾曲した湾曲状態で前記第1の係止部及び第2の係止部に係止されるように構成されており、前記LED搭載基板が、前記各側辺部に幅方向内側に向かって形成された切り込み又は凹部を有することを特徴とする。   The light irradiation device described above has an LED mounting substrate having a long shape, but the same effect can be obtained even if the LED mounting substrate has a partial annular shape or an annular shape. That is, the light irradiation device according to the present invention includes an LED mounting substrate having a partially annular shape or an annular shape on which a plurality of LEDs are mounted, and a base member to which the LED mounting substrate is attached. The base member has a first locking portion and a second locking portion that are provided opposite to each other and that are locked to each side portion on both sides in the width direction perpendicular to the circumferential direction of the LED mounting substrate. The distance between the first locking portion and the second locking portion is set to be smaller than the dimension between the side portions of the LED mounting substrate, and the LED mounting substrate is elastically deformed to have a width. The LED mounting substrate is configured to be locked to the first locking portion and the second locking portion in a curved state that is curved in the direction, and the LED mounting board faces inward in the width direction at each side portion. It has the notch | incision or recessed part formed in this way, It is characterized by the above-mentioned.

このように構成した本発明によれば、LED搭載基板をベース部材に取り付ける際に生じるLED搭載基板の歪みを低減するだけでなく、歪みが生じた場合にその歪み部分のみを簡単に取り外すことができる。   According to the present invention configured as described above, not only the distortion of the LED mounting substrate that occurs when the LED mounting substrate is attached to the base member, but also the strained portion can be easily removed when distortion occurs. it can.

本発明の一実施形態における光照射装置の一端側の構成を示す斜視図。The perspective view which shows the structure of the one end side of the light irradiation apparatus in one Embodiment of this invention. 同実施形態における光照射装置の軸方向に垂直な断面図。Sectional drawing perpendicular | vertical to the axial direction of the light irradiation apparatus in the embodiment. 同実施形態におけるLED搭載基板の構成を示す平面図。The top view which shows the structure of the LED mounting board in the embodiment. 同実施形態における基板の係止状態を示すベース部材の断面図。Sectional drawing of the base member which shows the latching state of the board | substrate in the embodiment. 同実施形態における基板の非係止状態を示すベース部材の断面図。Sectional drawing of the base member which shows the non-locking state of the board | substrate in the embodiment. LED搭載基板の変形例を示す平面図。The top view which shows the modification of a LED mounting substrate. 凹部の機能を模式的に示す図。The figure which shows the function of a recessed part typically. LED搭載基板の変形例を示す平面図。The top view which shows the modification of a LED mounting substrate. LED搭載基板の変形例を示す平面図。The top view which shows the modification of a LED mounting substrate. LED搭載基板の変形例を示す平面図。The top view which shows the modification of a LED mounting substrate.

以下に本発明に係る光照射装置の一実施形態について図面を参照して説明する。   An embodiment of a light irradiation apparatus according to the present invention will be described below with reference to the drawings.

本実施形態に係る光照射装置100は、室内外の一般照明、検査用照明又は植物育成用照明等に用いることができるライン型のものであって、図1及び図2に示すように、概略直円筒状をなす円筒体1と、この円筒体1の内部に収容されるLED搭載基板2と、前記LED搭載基板2を前記円筒体1内で保持するベース部材3と、前記円筒体1の軸方向両端部に取り付けられてLED搭載基板2に給電する口金部材4とを備えている。   The light irradiation apparatus 100 according to the present embodiment is a line type that can be used for indoor / outdoor general illumination, inspection illumination, plant growth illumination, or the like, as shown in FIGS. 1 and 2. A cylindrical body 1 having a right cylindrical shape, an LED mounting board 2 accommodated in the cylindrical body 1, a base member 3 for holding the LED mounting board 2 in the cylindrical body 1, and the cylindrical body 1 And a base member 4 that is attached to both ends in the axial direction and feeds power to the LED mounting substrate 2.

円筒体1は、例えばガラス製の透光性を有するものであり、軸方向両端部に開口を有する概略直円筒状をなすものである。その両端開口には、前記LED搭載基板2及びベース部材3が収容された後に、それぞれ口金部材4が装着される。   The cylindrical body 1 is made of, for example, glass and has a light-transmitting property, and has a substantially straight cylindrical shape having openings at both ends in the axial direction. After the LED mounting substrate 2 and the base member 3 are accommodated in the openings at both ends, the base members 4 are respectively attached.

LED搭載基板2は、配線が予めプリントされたいわゆるプリント基板と称されるもので、図3に示すように、その表面に複数のLED5が搭載されている。ここでは、厚みが例えば0.5mm以下で非常に薄く、弾性変形して湾曲するタイプのものを用いている。また、このLED搭載基板2は、外力を与えない自然状態では、概略長尺矩形平板状をなすものであり、その長手方向(長尺方向)の寸法は、前記円筒体1の収容空間の長手方向の寸法よりも若干小さい。さらに、このLED搭載基板2における少なくともLED搭載側の面のほぼ全面に、反射コーティングを施すなどして鏡面化し、光反射率を向上させてある。鏡面の他に白色塗料を塗布するなどして白色面にしてもよい。   The LED mounting board 2 is called a so-called printed board on which wiring is printed in advance, and a plurality of LEDs 5 are mounted on the surface thereof as shown in FIG. Here, a type that is very thin, for example, 0.5 mm or less, and is elastically deformed and curved is used. In addition, the LED mounting substrate 2 has a substantially long rectangular flat plate shape in a natural state where no external force is applied, and the longitudinal direction (longitudinal direction) dimension is the length of the housing space of the cylindrical body 1. It is slightly smaller than the dimension in the direction. Furthermore, at least almost the entire surface of the LED mounting substrate 2 on the LED mounting side is mirrored by applying a reflective coating or the like to improve the light reflectance. In addition to the mirror surface, a white paint may be applied to form a white surface.

LED5は、例えば白色光を発する表面実装型高輝度タイプのチップ型LEDであり、ここでは、近紫外光を発するLED素子(図示しない)と、そのLED素子から出る光を波長変換して白色光に変える蛍光部材とを利用して構成してある。そして、図3に示すように、このLED5を、LED搭載基板2の表面における幅方向中央に、長手方向に沿って一列に端から端まで等間隔で搭載している。   The LED 5 is, for example, a surface-mounted high-luminance type chip LED that emits white light. Here, an LED element (not shown) that emits near-ultraviolet light and wavelength-converted light emitted from the LED element are white light. And a fluorescent member to be changed into And as shown in FIG. 3, this LED5 is mounted in the center of the width direction in the surface of the LED mounting substrate 2 at equal intervals from the end to the end in a line along the longitudinal direction.

ベース部材3は、前記LED搭載基板2を保持した状態で、前記円筒体1内に収容配置されるものである。具体的にベース部材3は、図4及び図5に示すように、概略部分円筒状をなし、直線有底溝状の収容空間3aが内部に形成された例えばアルミニウムなどの金属製のものである。なお、部分筒状とは、筒を端面から視たときに一部が欠けた環状となる形状のことである。そして本実施形態では、その外周面は前記円筒体1の内周面に沿った概略部分円弧形状をなしている。また、ベース部材3の長手方向の寸法は、前記円筒体1の収容空間の長手方向の寸法よりも若干小さく、前記LED搭載基板2の長手方向の寸法と略同じである。   The base member 3 is accommodated in the cylindrical body 1 while holding the LED mounting substrate 2. Specifically, as shown in FIGS. 4 and 5, the base member 3 has a substantially partial cylindrical shape, and is made of a metal such as aluminum in which a linear bottomed groove-like accommodation space 3 a is formed. . In addition, a partial cylinder shape is an annular shape with a part missing when the cylinder is viewed from the end face. In this embodiment, the outer peripheral surface has a substantially partial arc shape along the inner peripheral surface of the cylindrical body 1. Further, the length in the longitudinal direction of the base member 3 is slightly smaller than the length in the longitudinal direction of the housing space of the cylindrical body 1 and is substantially the same as the length in the longitudinal direction of the LED mounting substrate 2.

そして、そのベース部材3の長手方向に平行な縁部内面、すなわちベース部材3の開口3bの内縁部にそれぞれ第1の係止部6及び第2の係止部7を設け、これら係止部6、7にLED搭載基板2の前記長手方向と平行な各側縁部2a、2bを係止させるようにしている。この係止部6、7は、ベース部材3の前記各内縁部から対向する方向に延出する突条状をなすものであり、この係止部6、7に、又はこの係止部6、7及びベース部材3の内周面3cの間に前記LED搭載基板2の側辺部2a、2bが係止される。   And the 1st latching | locking part 6 and the 2nd latching | locking part 7 are each provided in the inner surface of the edge part parallel to the longitudinal direction of the base member 3, ie, the inner edge part of the opening 3b of the base member 3, These latching parts The side edge portions 2a and 2b parallel to the longitudinal direction of the LED mounting substrate 2 are engaged with the LED mounting substrate 6 and 7, respectively. The locking portions 6 and 7 have a ridge shape extending from the inner edge portions of the base member 3 to face each other. The locking portions 6 and 7 or the locking portions 6 and 7 7 and the inner peripheral surface 3 c of the base member 3 are engaged with the side portions 2 a and 2 b of the LED mounting substrate 2.

また、ベース部材3の内周面3cにおける幅方向中央から、長手方向に沿って端から端まで延びる突条状の熱伝導性を有する介在体8が一体に突出させてある。この介在体8の突出端面8a(以下、先端面8aとも言う。)は、ベース部材3の開口面と平行な平面で、かつ、その幅は、LED5の幅と同じ又はそれよりも大きくなるように設定してある。   In addition, an intermediary body 8 having a protrusion-like thermal conductivity extending from the center in the width direction on the inner peripheral surface 3c of the base member 3 from end to end along the longitudinal direction is integrally protruded. The protruding end surface 8a (hereinafter, also referred to as the front end surface 8a) of the intermediate body 8 is a plane parallel to the opening surface of the base member 3, and the width thereof is the same as or larger than the width of the LED 5. It is set to.

ところで、ベース部材3の開口3bの幅寸法、すなわち係止部6、7間の寸法をLED搭載基板2の幅方向寸法よりも小さく設定してある。したがって、LED搭載基板2を係止部6、7に係止した状態では、LED搭載基板2は収容空間3a側(介在体8側)に向かって幅方向に湾曲することになるが、そのとき、LED搭載基板2におけるLED搭載領域D1の裏面2cと、前記介在体8の先端面8aとが押圧接触するように構成してある。このようにして、LED搭載基板2は、横断面視、その両側辺部2a、2b及び中央部(LED搭載領域D1の裏面2c)の3箇所のみで支えられて固定される。   By the way, the width dimension of the opening 3 b of the base member 3, that is, the dimension between the locking portions 6 and 7 is set smaller than the dimension in the width direction of the LED mounting substrate 2. Therefore, in a state where the LED mounting substrate 2 is locked to the locking portions 6 and 7, the LED mounting substrate 2 is curved in the width direction toward the accommodation space 3a side (intervening body 8 side). The back surface 2c of the LED mounting region D1 in the LED mounting substrate 2 and the tip surface 8a of the interposition body 8 are configured to be in press contact. In this way, the LED mounting substrate 2 is supported and fixed only at three places, that is, in cross-sectional view, both side portions 2a and 2b and the central portion (the back surface 2c of the LED mounting region D1).

また、ベース部材3の開口3bの内縁部には、第1の係止部6及び第2の係止部7よりも開口側(押し込み方向とは反対側)である上部に、LED搭載基板2をそれら係止部6、7に対して位置決めするガイド面9a、9bが形成してある。このガイド面9a、9bは、前記第1の係止部6及び第2の係止部7と同様に、ベース部材3の長手方向に平行な縁部内面に互いに対向して形成してある。そして、このガイド面9a、9b間の寸法は、前記LED搭載基板2が若干のがたつきを持って嵌る程度に設定してあり、このガイド面9a、9b間にLED搭載基板2が配置されることで、LED搭載基板2の長手方向に沿った中心軸が第1の係止部6及び第2の係止部7の中心位置に位置決めされる。   Further, on the inner edge portion of the opening 3 b of the base member 3, the LED mounting substrate 2 is disposed on the upper side that is the opening side (opposite to the pushing direction) from the first locking portion 6 and the second locking portion 7. Is formed with guide surfaces 9a and 9b for positioning them with respect to the locking portions 6 and 7. The guide surfaces 9 a and 9 b are formed opposite to each other on the inner surface of the edge parallel to the longitudinal direction of the base member 3, similarly to the first locking portion 6 and the second locking portion 7. The dimension between the guide surfaces 9a and 9b is set such that the LED mounting board 2 fits with a slight backlash, and the LED mounting board 2 is disposed between the guide surfaces 9a and 9b. Thus, the central axis along the longitudinal direction of the LED mounting substrate 2 is positioned at the center position of the first locking portion 6 and the second locking portion 7.

LED搭載基板2の係止方法の一例としては、図5に示すように、LED搭載基板2をベース部材3の係止部6、7上に載置する。このとき、LED搭載基板2はガイド面9a、9bにより位置決めされる。そして、LED搭載基板2が第1の係止部6及び第2の係止部7に係止していない非係止状態で、LED搭載基板2をその厚み方向に第1の係止部6及び第2の係止部7に向かって収容空間3a側に押し込む。これにより、LED搭載基板2が湾曲するとともに、LED搭載基板2の各側辺部2a、2bが係止部6、7を乗り越えて収容空間3a側に移動することで、LED搭載基板2の各側辺部2a、2bが第1の係止部6及び第2の係止部7に係止する(図4参照)。その後、ベース部材3を円筒体1内に軸方向に挿入して収容配置した後に、円筒体1の軸方向両端部の開口を口金部材4で閉塞する。この口金部材4は、LED搭載基板2の端部に設けられた接続端子と電気的に接続するコネクタを有し、円筒体1の開口を閉塞すると同時に、円筒体1に対してベース部材3を位置決めし、LED搭載基板2の端部に設けられた接続端子に接続されるように構成されている。   As an example of the locking method of the LED mounting substrate 2, the LED mounting substrate 2 is placed on the locking portions 6 and 7 of the base member 3 as shown in FIG. 5. At this time, the LED mounting substrate 2 is positioned by the guide surfaces 9a and 9b. And the LED mounting board 2 is the 1st locking part 6 in the thickness direction in the non-locking state in which the LED mounting board 2 is not locked to the first locking part 6 and the second locking part 7. And it pushes in toward the 2nd latching | locking part 7 in the accommodation space 3a side. As a result, the LED mounting substrate 2 is curved, and the side portions 2a and 2b of the LED mounting substrate 2 move over the engaging portions 6 and 7 and move toward the accommodation space 3a. The side portions 2a and 2b are locked to the first locking portion 6 and the second locking portion 7 (see FIG. 4). Thereafter, the base member 3 is inserted and accommodated in the cylindrical body 1 in the axial direction, and then the openings at both axial ends of the cylindrical body 1 are closed by the base member 4. The base member 4 has a connector that is electrically connected to a connection terminal provided at an end of the LED mounting substrate 2, and closes the opening of the cylindrical body 1, and at the same time, attaches the base member 3 to the cylindrical body 1. It is configured to be positioned and connected to a connection terminal provided at an end of the LED mounting substrate 2.

したがって、本実施形態の構成によれば、LED搭載基板2の弾性力によってLED搭載領域D1の裏面2cが介在体8に確実に押圧されて面接触するので、チップ型LED5で発生した熱を、効率的に、この介在体8を通じてベース部材3に逃がすことができる。また湾曲可能な基板2は一般的に薄い部材で形成してあることから、その厚みによる熱伝達の阻害影響を小さくでき、その点でも介在体8への熱伝達が効率的に営まれることとなる。しかも、介在体8へLED搭載基板2を接触させるにあたって、ネジ締めや特別な治具等を必要とせず、単にLED搭載基板2を第1の係止部6及び第2の係止部7に係止させるだけなので、組み立てが飛躍的に簡単になる。また、LED搭載基板2が湾曲してその表面が凹反射面の役割を果たすので、特に専用の反射部材を設けずとも、チップ型LED5からの光の指向性を良好にできるとともにロス光を低減させ得るといった効果も得られる。   Therefore, according to the configuration of the present embodiment, the back surface 2c of the LED mounting region D1 is reliably pressed against the interposition body 8 by the elastic force of the LED mounting substrate 2 and comes into surface contact. It is possible to efficiently escape to the base member 3 through the intermediate body 8. In addition, since the bendable substrate 2 is generally formed of a thin member, the influence of heat transfer inhibition due to its thickness can be reduced, and in that respect, heat transfer to the interposition body 8 is efficiently performed. Become. In addition, when the LED mounting substrate 2 is brought into contact with the interposition body 8, screw fastening or a special jig is not required, and the LED mounting substrate 2 is simply attached to the first locking portion 6 and the second locking portion 7. As it is only locked, assembly is greatly simplified. Further, since the LED mounting substrate 2 is curved and its surface functions as a concave reflecting surface, the directivity of light from the chip-type LED 5 can be improved and loss light can be reduced without providing a special reflecting member. The effect that it can be made is also acquired.

しかして、本実施形態のLED搭載基板2は、図3に示すように、各側辺部2a、2bに幅方向内側に向かって形成された複数の部分円弧状の凹部21を有し、各側辺部2a、2bが凹凸構造を有する。   Therefore, as shown in FIG. 3, the LED mounting substrate 2 of the present embodiment has a plurality of partial arc-shaped concave portions 21 formed in the side portions 2 a and 2 b toward the inner side in the width direction. The side portions 2a and 2b have an uneven structure.

具体的にこのLED搭載基板2においては、複数の凹部21は同一形状をなし、各凹部21が各側辺部2a、2bにおいてLED搭載基板2の長手方向に沿って互いに隣接するLED5の間それぞれに形成してある。具体的には、一方の側辺部2aに形成された凹部21と、他方の側辺部2bに形成された凹部21とは、LED搭載基板2の長手方向において略同一位置に形成してあり、LED搭載基板2は平面視において中心軸に対して対称形状をなす。また、LED搭載基板2の長手方向に沿って互いに隣接するLED5の間隔(ピッチ)L1とLED搭載基板2の長手方向に沿って互いに隣接する凹部21の間隔(ピッチ)L2とが略同一となるように形成してある。また、凹部21は、LED搭載基板2の長手方向に沿って互いに隣接するLED5の中間位置に形成してある。   Specifically, in the LED mounting substrate 2, the plurality of recesses 21 have the same shape, and each recess 21 is between the LEDs 5 adjacent to each other along the longitudinal direction of the LED mounting substrate 2 at each of the side portions 2 a and 2 b. Is formed. Specifically, the recess 21 formed in one side 2a and the recess 21 formed in the other side 2b are formed at substantially the same position in the longitudinal direction of the LED mounting substrate 2. The LED mounting substrate 2 is symmetrical with respect to the central axis in plan view. The interval (pitch) L1 between the LEDs 5 adjacent to each other along the longitudinal direction of the LED mounting substrate 2 and the interval (pitch) L2 between the recesses 21 adjacent to each other along the longitudinal direction of the LED mounting substrate 2 are substantially the same. It is formed as follows. The recess 21 is formed at an intermediate position between the LEDs 5 adjacent to each other along the longitudinal direction of the LED mounting substrate 2.

このように凹部21が形成されたLED搭載基板2において、LED5は、各側辺部2a、2bに形成された凹部21によって区画されるように配置されており、この凹部21によって区画された領域(以下、区画領域という。)にはそれぞれ1つのLED5が含まれることになる。なお、図3において各区画領域の境界を点線で示している。この構成により、LED搭載基板2の各側辺部2a、2bにおいて係止部6、7に係止する被係止部分が各LED5を挟むように形成されることから、ベース部材3に対してLED5を確実に位置決めできるとともに、介在体8の先端面8aにLED搭載基板2の裏面2cを確実に密着させることができる。また、区画領域に1つずつLED5が配置される構成であるため、ある区画領域で歪みが生じてもその歪み影響は、当該区画領域に隣接する区画領域には及ばないようになり、その隣接する区画領域を係止部6、7に確実に係止させることができる。また、歪み影響を受けるLED5の数を少なくすることができる。   In the LED mounting substrate 2 in which the recesses 21 are formed in this way, the LEDs 5 are arranged so as to be partitioned by the recesses 21 formed in the side portions 2a and 2b, and the regions partitioned by the recesses 21 One LED 5 is included in each (hereinafter referred to as a partitioned area). In addition, in FIG. 3, the boundary of each partition area | region is shown with the dotted line. With this configuration, the locked portions that are locked to the locking portions 6 and 7 in the side portions 2 a and 2 b of the LED mounting substrate 2 are formed so as to sandwich the LEDs 5. The LED 5 can be reliably positioned, and the back surface 2 c of the LED mounting substrate 2 can be reliably adhered to the distal end surface 8 a of the interposed body 8. In addition, since the LEDs 5 are arranged one by one in the partition area, even if distortion occurs in a certain partition area, the distortion effect does not reach the partition area adjacent to the partition area. The partition area to be held can be reliably locked to the locking portions 6 and 7. In addition, the number of LEDs 5 affected by distortion can be reduced.

また、凹部21は、LED搭載基板2の歪みが生じ易い部分、つまり、LED搭載基板2の幅方向において湾曲する部分(LED搭載領域D1を挟んだ両側の部分D2)の範囲内に形成されている(図3参照)。すなわち、凹部21の幅方向の深さ寸法は、LED搭載領域D1に到達しない程度であり、幅方向において湾曲する部分D2の幅寸法以下に設定してある。   The concave portion 21 is formed within a range of a portion where the LED mounting substrate 2 is likely to be distorted, that is, a portion that is curved in the width direction of the LED mounting substrate 2 (portions D2 on both sides of the LED mounting region D1). (See FIG. 3). That is, the depth dimension of the recess 21 in the width direction is such that it does not reach the LED mounting region D1, and is set to be equal to or less than the width dimension of the portion D2 curved in the width direction.

なお、凹部21の平面視形状としては、部分円弧状や部分楕円弧状の他、コの字状(矩形状)であっても良いし(図6(A)参照)、V字形状(図6(B)参照)やU字形状(図6(C)参照)であっても良い。   In addition, as a planar view shape of the recessed part 21, a U-shape (rectangular shape) other than partial arc shape or partial elliptical arc shape may be sufficient (refer FIG. 6 (A)), or V shape (FIG. 6). (See (B)) or a U-shape (see FIG. 6C).

次にこのように構成した凹部21の機能とともにLED搭載基板2の取り付け及び取り外しについて図7を参照して説明する。   Next, the attachment and detachment of the LED mounting substrate 2 together with the function of the recess 21 configured as described above will be described with reference to FIG.

LED搭載基板2の凹部21により区画された各区画領域(図7において2A〜2D)を、LED搭載基板2の長手方向の一方(例えば区画領域2A)から1つ1つ係止部6、7に押し込んでいき、LED搭載基板2を係止部6、7に係止させてベース部材3に取り付ける。   Each partition region (2A to 2D in FIG. 7) partitioned by the concave portion 21 of the LED mounting substrate 2 is locked one by one from the longitudinal direction of the LED mounting substrate 2 (for example, the partition region 2A) one by one. The LED mounting substrate 2 is locked to the locking portions 6 and 7 and attached to the base member 3.

ここで、仮に1つの区画領域2Bに歪みが生じた場合に、その歪み影響は、当該区画領域2Bに隣接する凹部21により吸収されて、隣の区画領域2A、2Cまで到達しにくい。そして、そのまま隣の区画領域2Cを係止部6、7に押し込んで係止させたとしても、通常通り、区画領域2Cは係止部6、7に係止し、その後の区画領域2Dも通常通り係止部6、7に係止させることができる。   Here, if a distortion occurs in one partition region 2B, the distortion effect is absorbed by the concave portion 21 adjacent to the partition region 2B and hardly reaches the adjacent partition regions 2A and 2C. And even if it pushes the adjacent division area 2C into the latching | locking parts 6 and 7 as it is, the division area 2C latches to the latching | locking parts 6 and 7 as usual, and the subsequent division area 2D is also normal. It can be made to latch to the street latching | locking parts 6 and 7. FIG.

また、上記の区画領域2Bに歪みが生じた場合に、その歪みを修正する場合には、当該区画領域2Bと既に係止している区画領域2Aの間の凹部21の存在により、区画領域2Bのみを係止部から取り外すことができる。取り外した区画領域2Bの歪みを直した後に再度区画領域2Bを係止部6、7に係止させる。これにより、必要最低限の区画領域2Bのみを取り外す作業のみで、歪みを修正することができる。この作業を繰り返すことによって、LED搭載基板2をベース部材3に取り付けていく。   Further, when distortion occurs in the partition area 2B, when the distortion is corrected, the partition area 2B is present due to the presence of the concave portion 21 between the partition area 2B and the partition area 2A that is already locked. Only can be removed from the locking part. After correcting the distortion of the removed partitioned area 2B, the partitioned area 2B is again locked by the locking portions 6 and 7. Thereby, distortion can be corrected only by the operation | work which removes only the required minimum division area 2B. By repeating this operation, the LED mounting substrate 2 is attached to the base member 3.

このように構成した本実施形態に係る光照射装置100によれば、LED搭載基板2の各側辺部2a、2bに幅方向内側に向かって形成された凹部21が形成されているので、LED搭載基板2の各側辺部2a、2bを係止部6、7に係止させる際に歪みが生じたとしても、当該歪み発生部分(図7において区画領域2B)に隣接する凹部21により吸収される。これにより、歪み発生部分(区画領域2B)に凹部21を挟んで隣接するその他(区画領域2A、2C)の側辺部2a、2bに与える影響を低減することができる。その結果、歪み発生部分から歪み影響を受ける部分を低減することができ、LED搭載基板2の固定が確実にすることができる。また、歪み発生部分を低減することができるため、当該歪みにより生じるLED5の光軸ずれを低減することができ、さらに、LED搭載基板2を係止部6、7に係止した状態の見た目を良くすることができる。   According to the light irradiation device 100 according to the present embodiment configured as described above, since the concave portions 21 formed toward the inner side in the width direction are formed in the side portions 2a and 2b of the LED mounting substrate 2, the LED Even if distortion occurs when the side portions 2a and 2b of the mounting substrate 2 are locked to the locking portions 6 and 7, they are absorbed by the concave portion 21 adjacent to the distortion generation portion (partition region 2B in FIG. 7). Is done. Thereby, the influence which it has on the side part 2a, 2b of other (partition area | region 2A, 2C) adjacent to the distortion generation part (partition area | region 2B) on both sides of the recessed part 21 can be reduced. As a result, it is possible to reduce the portion affected by the distortion from the distortion generating portion, and to fix the LED mounting substrate 2 reliably. Moreover, since the distortion generation part can be reduced, the optical axis deviation of the LED 5 caused by the distortion can be reduced, and the appearance of the state in which the LED mounting substrate 2 is locked to the locking portions 6 and 7 is also achieved. Can be better.

また、LED搭載基板2の各側辺部2a、2bにおいて各係止部6、7に係止される部分が凹部21により区画される構成となるため、歪み発生部分を含む区画領域(図7において2B)のみを係止部6、7から取り外すことができ、既に係止部6、7に係止された区画領域(図7において2A)を係止部6、7から取り外す必要が無く、LED搭載基板2の取り付け作業の二度手間を防止し、取り付けの作業性を向上させることができる。   Moreover, since the part latched by each latching | locking part 6 and 7 in each side part 2a, 2b of the LED mounting board 2 becomes a structure partitioned off by the recessed part 21, the division area | region containing a distortion generation | occurrence | production part (FIG. 7). 2B) can be removed from the locking portions 6 and 7, and it is not necessary to remove the partition area (2A in FIG. 7) already locked to the locking portions 6 and 7 from the locking portions 6 and 7, The trouble of attaching the LED mounting substrate 2 twice can be prevented, and the attachment workability can be improved.

さらに、LED搭載基板2における歪み発生部分から歪み影響を受ける部分を低減することができるので、LED5からの光の反射光量を多くするだけでなく、反射ムラを低減することができる。   Furthermore, since the part affected by the distortion from the distortion generating part in the LED mounting substrate 2 can be reduced, not only the amount of reflected light from the LED 5 can be increased, but also the reflection unevenness can be reduced.

なお、本発明は前記実施形態に限られるものではない。
例えば、前記実施形態では、LED搭載基板2の各側辺部2a、2bに凹部21を形成したものであったが、図8に示すように、単に切り込み22を形成したものであっても良い。これならば、LED搭載基板2に切り込み22を入れるだけで、前記実施形態と同様の効果を得ることができ、光照射装置100の製造を簡単にすることができる。なお、切り込み22を挟んで隣接する区画領域同士の対向辺が実質的に接触又は近接した構成であるため、一方の区画領域が歪んだ場合にその一方の区画領域の対向辺が他方の区画領域の対向辺に接触しまう恐れがある。一方、前記実施形態では、区画領域の対向辺が離間しているため、この心配が無い。
The present invention is not limited to the above embodiment.
For example, in the above-described embodiment, the concave portions 21 are formed in the side portions 2a and 2b of the LED mounting substrate 2. However, as shown in FIG. . If this is the case, it is possible to obtain the same effect as that of the above-described embodiment simply by making the cut 22 in the LED mounting substrate 2, and the light irradiation device 100 can be easily manufactured. In addition, since the opposing sides of the adjacent partitioned areas are substantially in contact with or close to each other with the notch 22 interposed therebetween, when one partitioned area is distorted, the facing side of one partitioned area is the other partitioned area. There is a risk of touching the opposite side of the. On the other hand, in the said embodiment, since the opposing side of a division area is spaced apart, there is no this worry.

また、図9(A)に示すように、凹部21又は切り込み22を長手方向に沿って複数のLED5毎に形成しても良い。なお、図9(A)では、LED2つ置きに形成した場合を示している。さらに図9(B)に示すように、各側辺部2a、2bに形成する凹部21が対向しないように互い違いとなるように形成しても良い。   Moreover, as shown in FIG. 9A, the recess 21 or the notch 22 may be formed for each of the plurality of LEDs 5 along the longitudinal direction. FIG. 9A shows a case where every two LEDs are formed. Further, as shown in FIG. 9B, the recesses 21 formed on the side portions 2a and 2b may be formed alternately so as not to face each other.

また、前記実施形態では、光照射装置は、ベース部材を円筒体内に収容配置したものであったが、ベース部材の開口に透明又は光拡散性を有するカバーを取り付けることにより、光照射装置を構成しても良い。   In the above-described embodiment, the light irradiating device is configured such that the base member is accommodated in the cylindrical body. However, the light irradiating device is configured by attaching a transparent or light diffusing cover to the opening of the base member. You may do it.

さらに、前記実施形態ではベース部材に熱伝導性を有する介在体を一体形成したものであったが、別部材の熱伝導部材を介在体としてLED搭載基板の裏面及びベース部材の内周面との間に配置したものであっても良い。また、介在体を有さず、ベース部材3の内周面3cにLED搭載基板2の裏面2cが接触するように構成しても良い。   Furthermore, in the said embodiment, the base member was integrally formed with an intermediate body having thermal conductivity. However, with the thermal conductive member of another member as an intermediate body, the back surface of the LED mounting substrate and the inner peripheral surface of the base member It may be arranged between them. Moreover, you may comprise so that the back surface 2c of the LED mounting board | substrate 2 may contact the internal peripheral surface 3c of the base member 3, without having an interposition body.

その上、LED搭載基板におけるLEDの配置態様としては、前記実施形態のように長尺方向に沿って1列配置の他、複数列配置としても良い。   In addition, as an arrangement mode of the LEDs on the LED mounting substrate, a plurality of rows may be arranged in addition to the one row arrangement along the longitudinal direction as in the embodiment.

加えて、前記実施形態の光照射装置は、ライン型のものであったが、リング型のものであっても良い。このとき、LED搭載基板2は部分円環状又は円環状をなすものである。そして、このLED搭載基板2には、図10に示すように、LED搭載基板2の円周方向に垂直な幅方向両側の内側辺部及び外側辺部に凹部21又は切り込みが形成してある。そして、中心に貫通孔を有したリング状ボディの環状溝にLED搭載基板2を押し込むことより取り付けられる。   In addition, the light irradiation device of the above embodiment is a line type, but may be a ring type. At this time, the LED mounting substrate 2 has a partial annular shape or an annular shape. In addition, as shown in FIG. 10, the LED mounting substrate 2 is formed with recesses 21 or cuts on inner side portions and outer side portions on both sides in the width direction perpendicular to the circumferential direction of the LED mounting substrate 2. And it attaches by pushing the LED mounting substrate 2 in the cyclic | annular groove | channel of the ring-shaped body which has the through-hole in the center.

また、前記実施形態では、1つのベース部材に1つのLED搭載基板が取り付けられる態様について説明したが、1つのベース部材に対して複数のLED搭載基板を長手方向に連続するように取り付けるように構成しても良い。さらに、1つの円筒体内に複数のベース部材を長手方向に連続するように収容配置しても良い。   Moreover, although the said embodiment demonstrated the aspect in which one LED mounting board was attached to one base member, it comprised so that a some LED mounting board might be attached to one base member so that it may continue in a longitudinal direction. You may do it. Furthermore, a plurality of base members may be accommodated and disposed in one cylindrical body so as to be continuous in the longitudinal direction.

その他、本発明は前記実施形態に限られず、その趣旨を逸脱しない範囲で種々の変形が可能であるのは言うまでもない。   In addition, it goes without saying that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

100・・・光照射装置
1 ・・・円筒体
2 ・・・LED搭載基板
2a ・・・一方の側辺部
2b ・・・他方の側辺部
3 ・・・ベース部材
5 ・・・LED
6 ・・・第1の係止部
7 ・・・第2の係止部
DESCRIPTION OF SYMBOLS 100 ... Light irradiation apparatus 1 ... Cylindrical body 2 ... LED mounting substrate 2a ... One side part 2b ... The other side part 3 ... Base member 5 ... LED
6 ... 1st latching | locking part 7 ... 2nd latching | locking part

Claims (5)

複数のLEDが搭載された弾性変形可能な長尺形状をなすLED搭載基板と、前記LED搭載基板が取り付けられるベース部材とを備え、
前記ベース部材が、前記LED搭載基板の長手方向に垂直な幅方向両側の各側辺部に係止する互いに対向して設けられた第1の係止部及び第2の係止部を有しており、前記第1の係止部及び第2の係止部間の離間寸法を前記LED搭載基板の側辺部間寸法よりも小さく設定して、前記LED搭載基板が弾性変形して幅方向に湾曲した湾曲状態で前記第1の係止部及び第2の係止部に係止されるように構成されており、
前記LED搭載基板が、前記各側辺部に幅方向内側に向かって形成された切り込み又は凹部を有することを特徴とする光照射装置。
An LED mounting board having a long shape that is elastically deformable and on which a plurality of LEDs are mounted, and a base member to which the LED mounting board is attached,
The base member has a first locking portion and a second locking portion that are provided opposite to each other and locked to each side portion on both sides in the width direction perpendicular to the longitudinal direction of the LED mounting substrate. The distance between the first locking portion and the second locking portion is set smaller than the dimension between the side portions of the LED mounting substrate, and the LED mounting substrate is elastically deformed to cause the width direction. And is configured to be locked to the first locking portion and the second locking portion in a curved state.
The said LED mounting substrate has the notch | incision or recessed part formed toward the width direction inner side in each said side part, The light irradiation apparatus characterized by the above-mentioned.
前記切り込み又は凹部が、前記各側辺部において、前記LED搭載基板の長手方向に沿って互いに隣接するLEDの間それぞれに形成されている請求項1記載の光照射装置。   The light irradiation device according to claim 1, wherein the cuts or recesses are formed between the LEDs adjacent to each other along the longitudinal direction of the LED mounting substrate in each of the side portions. 前記ベース部材における係止部間の部位と、前記LED搭載基板におけるLED搭載領域の裏面又はその近傍との間に配設された熱伝導性を有する介在体を備え、
前記LED搭載基板が前記湾曲状態において、当該LED搭載基板の弾性変形によって当該LED搭載基板が前記介在体を介して前記ベース部材を押圧するように構成している請求項1又は2記載の光照射装置。
An intermediate body having thermal conductivity disposed between a portion between the locking portions of the base member and the back surface of the LED mounting region of the LED mounting substrate or the vicinity thereof;
3. The light irradiation according to claim 1, wherein the LED mounting substrate is configured such that the LED mounting substrate presses the base member via the intermediate body by elastic deformation of the LED mounting substrate when the LED mounting substrate is in the curved state. apparatus.
前記LED搭載基板が前記第1の係止部及び第2の係止部に係止していない非係止状態から前記LED搭載基板をその厚み方向に前記第1の係止部及び第2の係止部に対して押し込むことによって、前記LED搭載基板が前記第1の係止部及び第2の係止部に係止されるように構成されており、
前記第1の係止部及び第2の係止部に対して押し込み方向とは反対側に設けられ、前記非係止状態のLED搭載基板を前記第1の係止部及び第2の係止部に対して位置決めするガイド面を備える請求項1、2又は3記載の光照射装置。
From the non-locking state in which the LED mounting board is not locked to the first locking part and the second locking part, the LED mounting board is moved in the thickness direction of the first locking part and the second locking part. The LED mounting substrate is configured to be locked to the first locking portion and the second locking portion by being pushed into the locking portion,
Provided on the opposite side of the pushing direction with respect to the first locking portion and the second locking portion, the LED locking substrate in the non-locking state is connected to the first locking portion and the second locking portion. The light irradiation apparatus of Claim 1, 2, or 3 provided with the guide surface positioned with respect to a part.
複数のLEDが搭載された弾性変形可能な部分円環形状又は円環形状をなすLED搭載基板と、前記LED搭載基板が取り付けられるベース部材とを備え、
前記ベース部材が、前記LED搭載基板の円周方向に垂直な幅方向両側の各側辺部に係止する互いに対向して設けられた第1の係止部及び第2の係止部を有しており、前記第1の係止部及び第2の係止部間の離間寸法を前記LED搭載基板の側辺部間寸法よりも小さく設定して、前記LED搭載基板が弾性変形して幅方向に湾曲した湾曲状態で前記第1の係止部及び第2の係止部に係止されるように構成されており、
前記LED搭載基板が、前記各側辺部に幅方向内側に向かって形成された切り込み又は凹部を有することを特徴とする光照射装置。
An LED mounting substrate having a partially annular shape or an annular shape on which a plurality of LEDs are mounted, and a base member to which the LED mounting substrate is attached,
The base member has a first locking portion and a second locking portion that are provided opposite to each other and that are locked to each side portion on both sides in the width direction perpendicular to the circumferential direction of the LED mounting substrate. The distance between the first locking portion and the second locking portion is set to be smaller than the dimension between the side portions of the LED mounting substrate, and the LED mounting substrate is elastically deformed to have a width. Configured to be locked to the first locking portion and the second locking portion in a curved state curved in a direction,
The said LED mounting substrate has the notch | incision or recessed part formed toward the width direction inner side in each said side part, The light irradiation apparatus characterized by the above-mentioned.
JP2011213926A 2011-09-29 2011-09-29 Light irradiation device Expired - Fee Related JP5846365B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011213926A JP5846365B2 (en) 2011-09-29 2011-09-29 Light irradiation device
PCT/JP2012/074029 WO2013047313A1 (en) 2011-09-29 2012-09-20 Photoirradiation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011213926A JP5846365B2 (en) 2011-09-29 2011-09-29 Light irradiation device

Publications (2)

Publication Number Publication Date
JP2013073869A true JP2013073869A (en) 2013-04-22
JP5846365B2 JP5846365B2 (en) 2016-01-20

Family

ID=47995345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011213926A Expired - Fee Related JP5846365B2 (en) 2011-09-29 2011-09-29 Light irradiation device

Country Status (2)

Country Link
JP (1) JP5846365B2 (en)
WO (1) WO2013047313A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015065093A (en) * 2013-09-25 2015-04-09 パナソニックIpマネジメント株式会社 Light source for lighting and lighting device
JP2016220568A (en) * 2015-05-28 2016-12-28 京セラ株式会社 Lighting device for plant growth
JP2019169278A (en) * 2018-03-22 2019-10-03 三菱電機株式会社 On-vehicle lighting fixture and method of manufacturing on-vehicle lighting fixture
JP2020009788A (en) * 2015-07-27 2020-01-16 三菱電機株式会社 Light source unit and lighting device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104676327B (en) * 2015-02-11 2017-04-26 普天智能照明研究院有限公司 LED (light-emitting diode) glass lamp tube and assembling method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011043166A1 (en) * 2009-10-06 2011-04-14 シーシーエス株式会社 Light irradiating device
JP4755323B1 (en) * 2010-01-13 2011-08-24 パナソニック株式会社 LED lamp

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011043166A1 (en) * 2009-10-06 2011-04-14 シーシーエス株式会社 Light irradiating device
JP4755323B1 (en) * 2010-01-13 2011-08-24 パナソニック株式会社 LED lamp

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015065093A (en) * 2013-09-25 2015-04-09 パナソニックIpマネジメント株式会社 Light source for lighting and lighting device
JP2016220568A (en) * 2015-05-28 2016-12-28 京セラ株式会社 Lighting device for plant growth
JP2020009788A (en) * 2015-07-27 2020-01-16 三菱電機株式会社 Light source unit and lighting device
JP2019169278A (en) * 2018-03-22 2019-10-03 三菱電機株式会社 On-vehicle lighting fixture and method of manufacturing on-vehicle lighting fixture

Also Published As

Publication number Publication date
JP5846365B2 (en) 2016-01-20
WO2013047313A1 (en) 2013-04-04

Similar Documents

Publication Publication Date Title
US8147113B2 (en) Backlight device and flat display using it
TWI411747B (en) Light illumination device
JP4715895B2 (en) Lighting equipment
US20140071667A1 (en) Straight tube lamp
JP5846365B2 (en) Light irradiation device
JP5467232B2 (en) Light irradiation device
KR101855513B1 (en) Flat lighting device
JP2004039570A (en) Surface light emitting device and liquid crystal display device
JP5615789B2 (en) Light emitting device
JP2007322541A (en) Illuminator and liquid crystal display
WO2020147679A1 (en) Optical assembly, vehicle lamp and vehicle
JP2007193946A (en) Light-emitting device
JP2010118277A (en) Led lighting fixture
JP5564696B1 (en) Lighting device
JP2012089442A (en) Light guide member and light-emitting device having the same
WO2011046133A1 (en) Light source device and display device
WO2014076872A1 (en) Lighting apparatus
JP2017174728A (en) Lighting fixture
JP2009170642A (en) Electric device
KR20150062914A (en) Light emitting unit, straight tubular lamp and lighting apparatus
JP2015149120A (en) Light emitting unit, straight tube lamp, and luminaire
JP6484923B2 (en) Lighting lamp and lighting device
US10563848B2 (en) Backlight module and display apparatus
WO2013047387A1 (en) Led lighting device
JP2005064145A (en) Light emitting device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140925

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150709

RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20150901

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150903

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20151029

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20151110

R150 Certificate of patent or registration of utility model

Ref document number: 5846365

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees