JP2013069961A - Manufacturing method of hollow sealed structure and hollow sealed structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a hollow sealed structure and the hollow sealed structure which form highly reliable hollow sealing of an element part provided on a substrate and enable hollow sealing at low cost.SOLUTION: A manufacturing method of a hollow sealed structure 150 includes: a first process where a first mold 151 is disposed on the other surface of a substrate 110 which is the opposite side of one surface of the substrate 110 where an element part 120 is disposed; a second process where molds are closed after a cap 130 is disposed on the one surface of the substrate 110 so as to cover the element part 120 and a second mold 152 is disposed on the one surface of the substrate 110 so as to cover the cap 130; and a third process where a resin is injected into the interior of the second mold 152 from a gate 153 provided at the second mold.

Description

  The present invention relates to a method for manufacturing a hollow sealing structure for hollow-sealing an element portion provided on a substrate, and a hollow sealing structure.

  In recent years, the use of communication devices used in a high frequency band, such as BS / CS broadcasting, microwave communication devices, and radar devices, has been increasing. In general, when the frequency is increased, the energy of the electromagnetic wave is greatly attenuated when propagating through a substance having a high dielectric constant, which causes a problem of deterioration in communication performance. For this reason, an airtight sealing structure in which an air layer having a low dielectric constant is formed around the element part of the electronic component and is hermetically sealed is employed in the electronic component of the communication device in order to sufficiently extract high-frequency characteristics. .

  Electronic components are required to have a variety of characteristics such as high performance, good reliability, miniaturization, and low cost. In addition to improving the element itself, a package for hollow sealing the element (hollow sealing structure) ) Is also needed. The requirements for the hollow sealing structure include good hermeticity, low cost, and securing a sufficient mounting area.

  As a manufacturing method of a hollow sealing structure in which an element part is hollow-sealed, for example, in Patent Document 1, an element part arranged on a substrate is covered with a resin cap, and a fixing film and an adhesive provided in the resin cap The method of fixing with is proposed.

  Moreover, in patent document 2, the 2nd metal mold | die, the 3rd metal mold | die, and the 4th metal mold | die in the position which opposes the recessed part of a 1st metal mold | die with the 1st metal mold | die, , A hollow resin package forming apparatus is proposed. In this hollow resin package forming apparatus, a substrate provided with an element portion is disposed on a third mold, and a cap is formed so as to cover the element portion by injection molding of resin using the mold. The And while suppressing the upper surface of a cap with a 1st metal mold | die, resin is further filled into the circumference | surroundings of a cap and the cap and a board | substrate are closely_contact | adhered and the hollow sealing structure is formed.

JP 2009-283553 A JP 2011-1000082 A

  When the cap is fixed with solder or adhesive as in Patent Document 1, since the solder or adhesive enters the substrate inside the hollow sealed cap, the element portion on the substrate to be hollow sealed or There was a problem that the mounting area of wiring and the like was reduced. Further, since the cap is fixed with an expensive film resin, there is a problem that the cost is increased.

  As a method for forming a hollow sealing structure at a low cost, it is conceivable to use injection molding, but the position of the cap may be shifted due to pressure during injection. In this case, there is a problem that outside air may enter the inside of the cap that is hollow-sealed, the airtightness of the hollow sealing structure cannot be maintained, and the high-frequency characteristics deteriorate. Furthermore, when the cap is displaced, the wiring on the substrate may be damaged, or the dielectric constant may vary around the element due to the displacement, which may adversely affect the high frequency characteristics. .

  Moreover, when fixing a cap with a resin film, it is difficult to raise the precision of an external shape by the flow and shrinkage | contraction of resin when a resin film hardens | cures. For this reason, a process such as flattening using a jig is required to maintain the outer shape accuracy, and there is a problem that work efficiency is poor and cost is increased.

  In the method of Patent Document 2, since the resin is formed around the cap while holding the upper surface of the cap with a mold, the cap is hollow-sealed without causing a positional shift. However, since the resin layer is not formed on the upper surface of the cap held by the mold, the strength is weak, and when external pressure is applied, cracks and the like occur, and the outside air enters the inside of the hollow seal There was a problem. In addition, since the configuration uses a plurality of molds, there is a problem that the cost is increased.

  The present invention has been made in view of the circumstances described above, and has a hollow sealing structure in which the hollow sealing of the element portion provided on the substrate is highly reliable and can be hollow sealed at a low cost. It aims at providing a manufacturing method and a hollow sealing structure.

  In order to solve the above-described problem, a first step of arranging a first mold on the other surface opposite to the one surface of the substrate having the element portion disposed on one surface, and covering the element portion A second step of disposing a cap on one surface of the substrate and placing a second mold on the one surface of the substrate so as to cover the cap, and clamping the mold. And a third step of injecting resin into the second mold from the gate.

  According to the method for manufacturing a hollow sealing structure of the present invention, since the resin layer is formed on the outer surface of the cap using a mold, a hollow sealing structure that is resistant to external pressure can be formed. . In addition, since the resin layer is formed with a reduced number of mold parts, the cost can be reduced.

It is sectional drawing of the hollow sealing structure which concerns on 1st embodiment. It is sectional drawing of the metal mold | die used by 1st embodiment. It is a schematic explanatory drawing which shows arrangement | positioning of the metal mold | die which concerns on 1st embodiment. It is sectional drawing of the hollow sealing structure which concerns on 2nd embodiment. It is a schematic explanatory drawing which shows arrangement | positioning of the metal mold | die which concerns on 2nd embodiment. It is sectional drawing of the hollow sealing structure which concerns on 3rd embodiment. It is a schematic explanatory drawing which shows arrangement | positioning of the metal mold | die which concerns on 3rd embodiment. It is a figure explaining the arrangement | positioning method of the cap and 2nd metal mold | die of the modification 1 of 3rd embodiment. It is a figure explaining 4th embodiment.

Embodiments of the present invention will be described below with reference to the accompanying drawings.
Embodiments of the present invention relate to a method for manufacturing a hollow sealing structure in which an element portion provided on a substrate is sealed with a cap and a resin layer.

First, the hollow sealing structure 100 produced in the embodiment of the present invention will be described.
As shown in FIG. 1, the hollow sealing structure 100 according to the embodiment of the present invention is disposed so as to cover the substrate 110, the element portion 120 provided on the upper surface (one surface) of the substrate 110, and the element portion 120. A cap 130 and a resin layer 140 covering the cap 130 are provided.

  The substrate 110 is a plate-shaped component in which the element unit 120 and the electronic component are fixed on the surface of the substrate 110 and connected between them by wiring on the substrate 110 to form an electronic circuit. As the substrate 110, for example, a resin material such as glass epoxy or a flexible substrate having excellent flexibility may be used.

  The element unit 120 is a semiconductor element and is provided on the substrate 110. The element unit 120 is fixed with, for example, an adhesive containing a silver filler or an insulating filler. In this embodiment, it is electrically connected to the wiring of the substrate 110 by wire bonding.

As shown in FIG. 1, the cap 130 has a box shape opened downward, and is disposed on the upper surface of the substrate 110 so as to cover the element portion 120.
The cap 130 has a sufficiently large box shape so as not to come into physical contact with the element part 120 or wire bonding when covering the element part 120. The cap 130 is made of, for example, a resin material, a metal material, a ceramic material, or the like. In particular, it is desirable to use an epoxy material having excellent heat resistance and adhesion. Further, when the cap 130 is made of the same material as that of the resin layer 140, the difference in thermal expansion coefficient between the cap 130 and the resin layer 140 is eliminated. Is prevented from peeling.

  The resin layer 140 is disposed so as to cover the cap 130. The resin layer 140 is made of, for example, a thermosetting resin or a thermoplastic resin. The resin layer 140 is in close contact with the substrate 110 and is used for hollow-sealing the element portion 120, so that outside air does not flow into the space where the element portion 120 is hollow-sealed by the cap 130 and the resin layer 140. Yes. When the outside air flows into the hollow sealed space, the element portion 120 and the wiring are deteriorated due to the humidity of the outside air, and the performance of the electronic component is lowered, and the original performance cannot be obtained.

Next, an injection molding mold 150 used for forming the resin layer 140 will be described.
As shown in FIG. 2, the mold 150 includes a first mold 151 and a second mold 152 that is disposed to face the first mold 151 and opens toward the first mold 151. ing.
The first mold 151 is provided and supported on a pedestal (not shown) or the like. The second mold 152 is provided with a gate 153 serving as a resin inlet filled in the second mold 152. In the present embodiment, a gate is provided at the center of the second mold 152.
A substrate 110 is disposed between the first mold 151 and the second mold 152 so that the mold can be clamped.

A method for manufacturing the hollow sealing structure 100 of the present embodiment configured as described above will be described below.
First, the element part 120 is fixed to the upper surface (one surface) of the substrate 110 using an adhesive containing a silver filler or an insulating filler, and is electrically connected by wire bonding.

  Next, as shown in FIG. 3, the first mold 151 is disposed on the lower surface (other surface) of the substrate 110 provided with the element portion 120. Then, the cap 130 is positioned and arranged at a predetermined location so as to cover the element portion 120 and the wire bonding. Further, the second mold 152 is disposed on the substrate 110 so as to cover the cap 130, and the mold is clamped by the first mold 151 and the second mold 152 (see FIG. 3).

  Next, resin is injected from the gate 153 into a region surrounded by the cap 130, the substrate 110, and the second mold 152. The resin heated to the softening temperature is injected by applying a predetermined pressure from the gate 153 which is an injection port. Since the resin is filled from the upper center part of the cap 130 in a state of high fluidity, the cap 130 can be filled without causing positional displacement. Then, it cools to normal temperature, the resin layer 140 is formed in the upper part of the cap 130, and the hollow sealing structure 100 which carried out the hollow sealing of the element part on the board | substrate 110 is obtained.

  According to the method for manufacturing the hollow sealing structure 100 according to the embodiment of the present invention, since the resin is filled from the center of the second mold 152, the resin is filled on the cap 130. At this time, the resin layer 140 can be formed without causing the displacement of the cap 130, and the highly reliable hollow sealing structure 100 can be obtained.

  In addition, since the resin layer 140 is formed over the entire outer surface of the cap 130 using the mold 150, even when pressure is applied from the outside of the resin layer 140, it is possible to prevent the cap 130 from cracking and It is possible to maintain the seal.

  In addition, since the resin layer 140 is formed using the first mold 151 and the second mold 152, the required mold mold 150 can be reduced and the manufacturing cost can be reduced. can do.

  In addition, since solder or an adhesive is not used, the solder or adhesive does not enter the substrate 151 in the hollow sealed space, and a sufficient mounting area for the wiring and the element portion can be secured. Is possible.

Next, the manufacturing method and hollow sealing structure of the hollow sealing structure of 2nd embodiment of this invention are demonstrated.
Note that the first mold 151, the substrate 110, the element unit 120, and the cap 130 have the same configuration as in the first embodiment, and therefore, the same reference numerals are used and detailed description thereof is omitted.

  As shown in FIG. 4, the hollow sealing structure 200 of the second embodiment is disposed so as to cover the substrate 110, the element portion 120 provided on the upper surface (one surface) of the substrate 110, and the element portion 120. A cap 130 and a resin layer 240 covering the cap 130 are provided.

  The resin layer 240 is disposed so as to cover the cap 130. The resin layer 240 is made of, for example, a thermosetting resin or a thermoplastic resin. The resin layer 240 is in close contact with the substrate 110 and is used to hollow-seal the element part 120, so that outside air does not flow into the space in which the element part 120 is hollow-sealed by the cap 130 and the resin layer 240. ing. When the outside air flows into the hollow sealed space, the element portion 120 and the wiring are deteriorated due to the humidity of the outside air, and the performance of the electronic component is lowered, and the original performance cannot be obtained. In the second embodiment, the resin layer 240 has a hole 241 formed at the center of the upper surface (surface).

The mold 250 includes a first mold 151 and a second mold 252 that opens toward the first mold 151.
In 2nd embodiment, as shown in FIG. 5, the convex part 253 is provided in the center part inside the 2nd metal mold | die 252. As shown in FIG. The convex portion 253 locks the cap 130 disposed on the substrate 110 and supports the cap 130.
The mold 252 is provided with a gate 254 below. The gate 254 serves as a resin injection port when the resin layer 240 is formed. The second embodiment is a side gate structure in which the gate 254 is provided on the side of the mold 253, but in this case, the cap 130 is likely to be displaced in a direction parallel to the substrate 110 (left and right direction in FIG. 5).

The manufacturing method of the hollow sealing structure 200 of 2nd embodiment comprised in this way is demonstrated below.
First, the element portion 120 is provided on the upper surface of the substrate 110 (one surface of the substrate 110 in FIG. 5). Next, the first mold 151 is disposed on the other surface of the substrate 110 (the lower surface of the substrate 110 in FIG. 5). Then, the cap 130 is positioned and arranged at a predetermined location so as to cover the element portion 120 and the wire bonding. Further, the mold mold 252 is disposed so as to cover the cap 130 so that the convex portion 253 contacts the upper portion of the cap 130. The first mold 151 and the mold 252 are clamped, and the convex portion 253 presses the cap 130 downward to fix the cap 130 (see FIG. 5).

  Next, resin is injected into a region surrounded by the cap 130, the substrate 110, and the second mold 252. The resin heated to the softening temperature is injected from a gate 254 which is an injection port under a predetermined pressure. Since the cap 130 is fixed to the convex portion 253, even if resin is injected from the side surface (left and right direction in FIG. 5), the resin is filled without causing positional displacement. Thereafter, the resin layer 240 having the hole 241 is formed on the upper surface (surface) by being cooled to room temperature, and the hollow sealing structure 200 in which the element portion 120 on the substrate 110 is hollow-sealed is obtained.

  According to the method for manufacturing the hollow sealing structure 200 according to the second embodiment, the cap 130 is pressed against the convex portion 253 of the second mold 252 and the resin is injected in a supported state. Yes. Therefore, the cap 130 is not displaced and the resin layer 240 can be formed, so that the more reliable hollow sealing structure 200 can be formed.

  Moreover, the hollow sealing structure 200 which has the hole part 241 on the upper surface can be manufactured. The hole 241 can be used as a package orientation or a package positioning marker, and can improve the workability of the next process.

  In order to further improve the reliability, the hole 241 of the resin layer 240 may be filled with the same type of resin as the resin layer 240. Moreover, when using also for a positioning marker etc., you may fill the hole part 241 with a different kind of resin.

In the second embodiment, the hole 241 is provided at the center of the upper surface of the resin layer 240. However, the hole 241 may be provided at any position on the upper surface, and the hole is formed at a position shifted from the center. As a result, the orientation of the package can be easily identified.
In addition, the direction of the package can be identified by making the shape of the hole asymmetrical.

Next, the manufacturing method of the hollow sealing structure 300 of 3rd embodiment is demonstrated.
In the third embodiment, the first mold 151, the substrate 110, and the element unit 120 have the same configuration as in the first embodiment, and therefore, the same reference numerals are used for detailed description. Omitted.

  In the third embodiment, as shown in FIG. 6, a substrate 110, an element portion 120 provided on the upper surface (one surface) of the substrate 110, a cap 330 disposed so as to cover the element portion 120, and a cap 330 And a resin layer 340 covering the.

As shown in FIG. 6, the cap 330 has a box shape that opens downward, and is arranged so as to cover the element portion 120. In the third embodiment, the cap 330 is provided with a recess 331 at the center of the upper surface.
The cap 330 is made of, for example, a resin material, a metal material, a ceramic material, or the like. In particular, it is desirable to use an epoxy material having excellent heat resistance and adhesion. Further, when the cap is made of the same material as the resin layer 340 described later, the difference in thermal expansion coefficient between the cap 330 and the resin layer 340 is eliminated, and thus the difference is caused by the difference in thermal expansion coefficient between the cap 330 and the resin layer 340. Separation of the interface is suppressed.

  The resin layer 340 is disposed so as to cover the cap 330. The resin layer 340 is made of, for example, a thermosetting resin or a thermoplastic resin. The resin layer 340 is in close contact with the substrate 110 and is used to hollow-seal the element part 120, so that outside air does not flow into the space where the element part 120 is hollow-sealed by the cap 330 and the resin layer 340. It has become. When the outside air flows into the hollow sealed space, the element portion 120 and the wiring are deteriorated due to the humidity of the outside air, and the performance of the electronic component is lowered, and the original performance cannot be obtained. In the third embodiment, the resin layer 340 has a hole 341 formed at the center of the upper surface (surface).

The mold 350 includes a first mold 151 and a second mold 352 that opens toward the first mold 151.
In the third embodiment, as shown in FIG. 7, a convex portion 353 is provided at the center inside the second mold 352. The convex portion 353 engages with the concave portion 331 of the cap 330 disposed on the substrate 110 and supports the cap 330.
The second mold 352 is provided with a gate 354 below. The gate 354 serves as a resin injection port when the resin layer 340 is formed.

The manufacturing method of the hollow sealing structure 300 of 3rd embodiment comprised in this way is demonstrated.
First, the element portion 120 is provided on the upper surface of the substrate 110 (one surface of the substrate substrate 110 in FIG. 7). Next, the first mold 151 is disposed on the lower surface of the substrate 110 (the other surface of the substrate 110 in FIG. 7). Then, the cap 330 is positioned and arranged at a predetermined location so as to cover the element portion 120 and the wire bonding. Further, the second mold 352 is disposed so as to cover the cap 330 and the convex portion 353 engages with the concave portion 331 of the cap 330. The first mold 151 and the second mold 352 are clamped, and the convex portion 353 presses the cap 330 toward one surface of the substrate 110 to fix the cap 330 on the substrate 110. (See FIG. 7).

  Next, resin is injected into a region surrounded by the cap 330 and the substrate 110 and the second mold 352. The resin heated to the softening temperature is injected by applying a predetermined pressure from the gate serving as the injection port. Since the concave portion 331 of the cap 330 is engaged with and fixed to the convex portion 353 of the second mold 352, the resin is filled without causing positional displacement. Then, it cools to normal temperature, the resin layer 340 which has the hole part 341 in the upper surface (surface) is formed, and the hollow sealing structure 300 which carried out the hollow sealing of the element part 120 on the board | substrate 110 is obtained.

  According to the method for manufacturing the hollow sealing structure 300 according to the third embodiment, the concave portion 331 of the cap 330 is engaged with the convex portion 353 of the second mold 352, and the cap 330 is supported on the substrate 110. It is like that. Therefore, the cap 330 is disposed at an accurate position, and the resin layer 340 can be formed without causing the positional displacement of the cap 330 from a predetermined position. Therefore, a more reliable hollow sealing structure 300 can be formed. .

  Moreover, according to the hollow sealing structure 300 which concerns on this embodiment, it has the hole part 341 in the upper surface (surface) of the resin layer 340. FIG. This hole 341 can be used as a package orientation or a package positioning marker, and can improve the workability of the next process.

  In order to further improve the reliability, the hole 341 of the resin layer 340 may be filled with the same kind of resin as the resin layer 340. Moreover, when using also for a positioning marker etc., you may fill with a different kind of resin.

  In the third embodiment, the hole 341 is provided at the center of the upper surface of the resin layer 340. However, the hole 341 may be located anywhere on the upper surface (surface), and the hole is shifted from the center. By forming the portion, the orientation of the package can be identified. Further, the direction of the package can be identified by making the shape of the hole portion asymmetric.

(Modification 1)
Next, Modification 1 of the third embodiment will be described. In addition, since the modification 1 is the structure similar to 3rd embodiment, it describes with the same code | symbol and abbreviate | omits detailed description.
In Modification 1, as shown in FIG. 8, the convex portion 353 of the second mold 352 and the concave portion 331 of the cap 330 are engaged with each other in advance and arranged on the substrate 110. In the third embodiment described above, the cap 330 and the second mold 352 are separately arranged. However, in the first modification, the substrate 110 has a configuration in which the cap 330 and the second mold 352 are integrated. Can be placed on top. Further, since the process of positioning the cap 330 on the substrate 110 can be omitted and the manufacturing can be automated, the cost can be reduced.

  In the second embodiment and the third embodiment, a hole is provided in the convex portion and the second mold, and when the second mold is raised by a predetermined amount after the resin filling is completed, the resin is removed from the hole. It is good also as filling predetermined amount. In this case, the resin to be filled may be the same resin as the resin layer or a different resin.

  Next, the manufacturing method of the hollow sealing structure 400 of 4th embodiment is demonstrated. Since the first mold 151, the substrate 110, and the element unit 120 have the same configuration as that of the first embodiment, they are denoted by the same reference numerals and detailed description thereof is omitted. Further, since the cap 330 has the same configuration as that of the third embodiment, the cap 330 is denoted by the same reference numeral, and detailed description thereof is omitted.

  In the fourth embodiment, as illustrated in FIG. 9A, the substrate 110, the element unit 120 provided on the substrate, the cap 330 disposed so as to cover the element unit 120, and the cap 330 are covered. And a resin layer 440. The configuration of the hollow sealing structure 400 is the same as that of the first embodiment except for the resin layer 440.

  The resin layer 440 is disposed so as to cover the cap 330. The resin layer 440 is made of, for example, a thermosetting resin or a thermoplastic resin. The resin layer 440 is in close contact with the substrate 110 and is used to hollow-seal the element part 120, so that outside air does not flow into the space where the element part 120 is hollow-sealed by the cap 330 and the resin layer 440. It has become. When the outside air flows into the hollow sealed space, the element portion 120 and the wiring are deteriorated due to the humidity of the outside air, and the performance of the electronic component is lowered, and the original performance cannot be obtained.

The mold die 450 includes a first die 151 and a second die 452 that is disposed to face the first die 151 and opens toward the first die 151.
In the fourth embodiment, a convex portion 453 is provided at the center inside the second mold 452. The convex portion 453 engages with the concave portion 331 of the cap and supports the cap 330. Further, the convex portion 453 is provided so as to be able to advance and retract, and the amount of protrusion can be varied.
The second mold 452 is provided with a gate 454 below. The gate 454 is an injection port when the resin layer 440 is formed.

The manufacturing method of the hollow sealing structure 400 of 4th Embodiment comprised in this way is demonstrated.
First, the substrate 110 provided with the element portion 120 is disposed on the first mold 151. And the 2nd metal mold | die 452 by which the convex part 453 was engaged with the recessed part 331 of the cap 330 is arrange | positioned on the board | substrate 110 (refer FIG.9 (b)). The first mold 151 and the second mold 452 are clamped, and the convex portion 453 presses the cap downward to fix the cap 330 on the substrate 110.

  Next, the resin is injected into a region surrounded by the cap 330, the substrate 110, and the second mold 452 (see FIG. 9C). The resin heated to the softening temperature is injected by applying a predetermined pressure from the gate 454 which is an injection port. Since the concave portion 331 of the cap 330 is engaged with and fixed to the convex portion 453 of the second mold 452, the resin is filled without causing positional displacement.

  At the beginning of filling of the resin, the cap 330 is pressed in the direction toward the substrate by the convex portion 453 (downward in FIG. 9C), but the filling of the resin proceeds and the filling with the resin fluidity remaining is completed. Immediately before, the convex portion 453 is moved upward (in a direction in which the protrusion amount decreases). Then, an injection pressure is applied so that the resin is also filled in the portion where the convex portion 453 is present.

  In this manner, the hollow sealing structure 400 in which the recess 331 of the cap 330 and the recess of the resin layer 440 are filled with the resin can be formed. Then, it cools to normal temperature and the hollow sealing structure 400 which carried out the hollow sealing of the element part 120 on the board | substrate 110 is obtained.

  According to the method for manufacturing the hollow sealing structure 400 according to the fourth embodiment, the concave portion 331 of the cap 330 is engaged with the convex portion 453 of the second mold 452, and the cap 330 is supported on the substrate 110. Since the second mold 452 can be disposed without causing the cap 330 to be displaced from a predetermined position and the resin layer 440 can be formed, the hollow sealing structure 400 with higher reliability can be formed. It can be.

  In addition, since the resin layer 440 is formed over the entire outer surface of the cap 330 using the mold 450, even when pressure is applied from the outside of the resin layer 440, the cap 330 can be prevented from cracking, and the hollow It is possible to maintain the seal.

  In addition, it is possible to form the resin layer in which the hole part was provided in the upper surface (surface) by changing the movement amount of the convex part 453 suitably. This hole can be used as a positioning marker for the package or a marker for identifying the orientation of the package.

  Further, in the fourth embodiment, the case where the cap 330 is provided with the recess 331 has been described, but the cap may not be provided with the recess. In this case, the cap may be arranged at a predetermined position on the substrate.

  Alternatively, a hole may be provided in the convex portion and the second mold, and after the convex portion is retracted by a predetermined amount, a predetermined amount of resin may be filled from the convex portion. In this case, the resin to be filled may be the same resin as the resin layer or a different resin.

  The method for manufacturing the hollow sealing structure according to the embodiment of the present invention has been described above, but the present invention is not limited to this and can be appropriately changed without departing from the technical idea of the present invention.

  In the second embodiment, the third embodiment, and the fourth embodiment, holes may be provided in the convex portions and the second mold, and the holes may be connected to the suction means. In this case, the cap can be adsorbed and fixed to the convex portion of the second mold, and the cap and the second mold can be integrated and disposed on the substrate. When filling the resin, the adsorption is turned off. In addition, it is desirable to have a sliding pin that can eliminate clogging of resin.

  In the above embodiment, the configuration in which the second mold is disposed on the upper surface of the substrate and the first mold is disposed on the lower surface of the substrate has been described. However, the first mold is disposed on the upper surface of the substrate. The second mold may be arranged on the lower surface of the substrate. Moreover, although the case where the board | substrate is arrange | positioned in parallel with a horizontal direction was demonstrated, a board | substrate may be arrange | positioned in parallel with a perpendicular direction.

  In the above embodiment, the resin injection conditions may be appropriately selected according to the strength of the cap, the heat resistant temperature of the element portion, and the like.

  In the above embodiment, the case where the element portion is a semiconductor element has been described. However, various sensors such as a MEMS device, a surface acoustic wave device, an infrared sensor, and a functional element such as a piezoelectric element may be used.

100, 200, 300, 400 Hollow sealing structure 110 Substrate 120 Element portion 130, 330 Cap 140, 240, 340, 440 Resin layer 151 First mold 152 Second mold 153, 254, 354, 454 Gate 241 , 341 Hole 253, 353, 453 Protrusion 331 Concavity

Claims (10)

A first step of disposing a first mold on the other surface opposite to the one surface of the substrate having the element portion disposed on the one surface;
A second step of disposing a cap on one surface of the substrate so as to cover the element portion and disposing a mold on the one surface of the substrate so as to cover the cap;
And a third step of injecting a resin into the second mold from a gate provided in the second mold. The second step is a step of disposing the cap on one surface of the substrate so as to cover the element portion;
The hollow sealing according to claim 1, further comprising a step of placing and clamping the second mold on one surface of the substrate so as to cover the cap disposed on the one surface of the substrate. Structure manufacturing method.   The second step includes a step of integrating the cap and the second mold, and a step of simultaneously placing and clamping the cap and the second mold so as to cover the element portion. The manufacturing method of the hollow sealing structure of Claim 1 characterized by the above-mentioned.   The said 2nd process WHEREIN: The said cap is pressed toward the one surface of the said board | substrate by the convex part provided in said 2nd metal mold | die, The any one of Claim 1 to 3 characterized by the above-mentioned. The manufacturing method of the hollow sealing structure of claim | item.   The said 2nd process WHEREIN: The convex part provided in the said 2nd metal mold | die and the recessed part formed in the said cap are engaged, The Claim 1 characterized by the above-mentioned. The manufacturing method of the hollow sealing structure of description.   The hollow sealing structure according to any one of claims 1 to 5, wherein, in the second step, the cap is adsorbed to a convex portion provided in the second mold. Manufacturing method. The convex part of the second mold is provided so as to be able to advance and retreat,
7. The method according to claim 1, wherein in the third step, while the resin is injected, the convex portion that protrudes and presses the cap is retracted and separated from the cap. 8. The manufacturing method of the hollow sealing structure of description. The convex part of the second mold is provided so as to be able to advance and retract, and a resin injection hole is provided,
In the third step, the resin layer is formed in a state of protruding and pressing the cap, and then the convex portion is retracted to be separated from the cap, and the resin is injected from the resin injection hole. The manufacturing method of the hollow sealing structure as described in any one of Claims 1-6. A hollow sealing structure comprising a substrate, an element portion provided on the substrate, a cap covering the element portion, and a resin layer covering the cap,
The said resin layer has a hole part opened to the surface and extended so that it might go to one surface of a board | substrate through a cap, The hollow sealing structure characterized by the above-mentioned. A hollow sealing structure comprising a substrate, an element portion provided on the substrate, a cap covering the element portion, and a resin layer covering the cap,
The said cap has a recessed part, The hollow sealing structure characterized by the above-mentioned.

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