JP2013068678A - Optical deflector and optical deflector array - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical deflector suitable for miniaturization.SOLUTION: An optical deflector comprises: a substrate 150; a pair of driving electrodes 120A and 120B provided on the substrate 150; a pair of fixed parts 107 fixed on the substrate 150; a pair of hinges 110 respectively connected to the pair of fixed parts 107; a connecting part 105 rockably supported by the pair of hinges 110; a support column 102 fixed to the connecting part 105; and movable plate 101 fixed to the support column 102. The movable plate 101 is supported at a space from the substrate 150 so as to face the driving electrodes 120A and 120B. The movable plate 101 comprises: a counter electrode on a first surface facing the driving electrodes 120A and 120B; and a reflecting surface 103 on a second surface at a side opposite to the first surface. The driving electrodes 120A and 120B, the fixing part 107, the hinges 110 and the connecting part 105 are formed of the same layer.

Description

  The present invention relates to an optical deflector.

  In an optical deflector array used for an optical switch in the field of optical modulation or optical communication, it is desired that reflecting surfaces are arranged with a high fill factor. In order to fabricate such an optical deflector array, each optical deflector may be configured such that no component of the optical deflector exists between the reflecting surfaces in the array direction. Desired.

  One such optical deflector is disclosed in US Pat. No. 6,934,439. In this optical deflector, two movable plates having a reflection surface on the upper surface are connected by a brace. One end of the hinge is connected to the brace, and the other end of the hinge is fixed to the support column. As described above, this optical deflector has a configuration in which the two movable plates and the brace are supported by the support column so that they can be tilted by the hinge.

  Since the total of the width of the hinge and the width of the brace is smaller than the width of the two movable plates, this optical deflector can be arranged so that the reflection surface has a high fill factor.

US Pat. No. 6,934,439

  In the optical deflector described above, the brace and the hinge that exist between the two movable plates do not function as a reflecting surface, and the two movable plates cannot move independently. Therefore, this optical deflector can be provided with a reflecting surface on the upper surfaces of the two movable plates, but the effective reflecting surface is only the upper surface of one of the movable plates, and is not suitable for miniaturization.

  The present invention has been made paying attention to this point, and an object thereof is to provide an optical deflector suitable for miniaturization.

  An optical deflector according to the present invention includes a substrate, a pair of drive electrodes provided on the substrate, a pair of fixed portions fixed to the substrate, and a pair of elastic portions respectively connected to the pair of fixed portions. And a connection part supported to be swingable by the pair of elastic parts, a support column fixed to the connection unit, and a movable plate fixed to the support column. The movable plate is supported at a distance from the substrate so as to face the driving electrode, has a counter electrode on a first surface facing the driving electrode, and has a second electrode opposite to the first surface. The second surface has a reflecting surface. The drive electrode, the fixed portion, the elastic portion, and the connection portion are formed from the same layer.

  According to the present invention, an optical deflector suitable for miniaturization is provided.

It is a perspective view of the optical deflector of a 1st embodiment. FIG. 3 is a vertical sectional view of the optical deflector of FIG. 1 taken along line BB shown in FIG. 1. The first process of the manufacturing method of the optical deflector of FIG. 1 is shown. FIG. 3B shows a step that follows the step of FIG. 3A in the method of manufacturing the optical deflector of FIG. 1. FIG. 3B shows a step that follows the step of FIG. 3B in the method of manufacturing the optical deflector of FIG. 1. The first process of the manufacturing method of the optical deflector of FIG. 1 is shown. 4B shows a step subsequent to the step of FIG. 4A in the method of manufacturing the optical deflector of FIG. FIG. 4B shows a step that follows the step of FIG. 4B in the method of manufacturing the optical deflector of FIG. 1. It is a perspective view of the optical deflector of 2nd Embodiment. FIG. 6 is an enlarged view of the vicinity of the center of the optical deflector in FIG. 5. FIG. 6 is a vertical sectional view of the optical deflector of FIG. 5 taken along line CC shown in FIG. 5. FIG. 6 is a top view of the optical deflector of FIG. 5 in a state where the movable plate 201 and the support column 202 shown in FIG. 5 are removed. It is a perspective view of the one-dimensional optical deflector array of 3rd Embodiment. FIG. 10 is a perspective view showing a single optical deflector extracted from the one-dimensional optical deflector array of FIG. 9. FIG. 11 is an enlarged view of the vicinity of the center of the optical deflector in FIG. 10 with the movable plate shown in FIG. 10 removed. It is a perspective view of the two-dimensional optical deflector array of 3rd Embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<First Embodiment>
(Constitution)
FIG. 1 is a perspective view of the optical deflector according to the first embodiment. FIG. 2 is a vertical sectional view of the optical deflector of FIG. 1 taken along line BB shown in FIG.

  As shown in FIGS. 1 and 2, the optical deflector of the first embodiment includes a substrate 150, a pair of drive electrodes 120 </ b> A and 120 </ b> B provided on the substrate 150, and a pair of fixed members fixed to the substrate 150. Portion 107, a pair of hinges 110 connected to each of the pair of fixing portions 107, a connection portion 105 supported to be swingable by the pair of hinges 110, a column 102 fixed to the connection portion 105, and a column 102 And a movable plate 101 fixed to.

  The movable plate 101 is supported at a distance from the substrate 150 so as to face the drive electrodes 120A and 120B. The movable plate 101 has a counter electrode on a first surface facing the drive electrodes 120A and 120B, and a reflection surface 103 on a second surface opposite to the first surface. The movable plate 101 is made of, for example, single crystal silicon, and can itself function as a counter electrode. The reflecting surface 103 is provided by depositing a metal such as gold on the upper surface of the movable plate 101.

  The column 102 is made of single crystal silicon, for example, like the movable plate 101.

  The movable plate 101, the support column 102, and the connection portion 105 constitute a movable portion 106. The connection part 105 is connected to the fixed part 107 via a hinge 110. The hinge 110 functions as a so-called torsion bar that is an elastic part that can be torsionally deformed about the torsion shaft 141. As a result, the movable portion 106 is supported by the substrate 150 by the hinge 110 so as to be tiltable about the torsion shaft 141.

  The substrate 150 has a through-hole 190 that surrounds the connecting portion 105 and the hinge 110. The through-hole 190 provides a movable space for the connecting portion 105 and the hinge 110.

  The fixed portion 107, the hinge 110, and the connecting portion 105 are formed from the same layer. This layer is made of, for example, single crystal silicon, and is electrically connected to the movable plate 101 via the support column 102.

  The drive electrodes 120A and 120B are formed from the same layer as the fixed portion 107, the hinge 110, and the connection portion 105. The drive electrodes 120A and 120B are provided on both sides of the torsion shaft 141 with the torsion shaft 141 interposed therebetween. Although not shown, for example, wiring for supplying a voltage to the drive electrodes 120A and 120B is integrally formed in the same layer as the drive electrodes 120A and 120B. Furthermore, wiring for supplying a voltage to the drive electrodes 120A and 120B is electrically connected to a drive circuit (not shown).

(Drive principle)
The driving principle will be described below. As shown in FIG. 1, the drive electrodes 120A and 120B are disposed on both sides of the torsion shaft 141 with the torsion shaft 141 interposed therebetween. A voltage can be applied independently to the drive electrodes 120A and 120B. The movable plate 101 is electrically set to a ground potential or a predetermined potential. When a voltage is applied to the drive electrode 120A, an electrostatic attractive force is generated between the movable plate 101 and the drive electrode 120A. Therefore, torque about the torsion shaft 141 is applied to the hinge 110, and the movable plate 101 is inclined so as to approach the drive electrode 120A. Further, when a voltage is applied to the drive electrode 120B, a torque in the opposite direction is generated this time, so that the movable plate 101 is inclined so as to approach the drive electrode 120B. In other words, by applying a voltage to one of the drive electrodes 120A and 120B, the movable plate 101 is inclined with the torsion shaft 141 as an axis so as to approach the drive electrodes 120A and 120B to which the voltage is applied.

(Production method)
A manufacturing method will be described below. 3A to 3C and FIGS. 4A to 4C show a series of steps of an example of a method for manufacturing the optical deflector shown in FIG. 3A to 3C are vertical sectional views taken along line AA shown in FIG. 4A to 4C are vertical sectional views taken along line BB shown in FIG.

  The optical deflector of this embodiment is manufactured using a substrate 171 and a substrate 172 as shown in FIG. 3A. Here, the substrate on which the movable plate 101 is formed is called a mirror substrate 171 and the substrate on which the drive electrodes 120A and 120B are formed is called a base substrate 172.

  The mirror substrate 171 is a three-layer SOI substrate. A three-layer SOI (Silicon on Insulator) substrate has a configuration in which an intermediate layer 183 sandwiched between a first insulating layer 185 and a second insulating layer 188 is sandwiched between a device layer 181 and a support layer 187. ing. The first insulating layer 185 and the second insulating layer 188 are made of silicon oxide. The intermediate layer 183, the device layer 181 and the support layer 187 are made of single crystal silicon. The base substrate 172 is composed of an SOI substrate.

  The SOI substrate has a form in which an insulating layer 186 is sandwiched between a device layer 182 and a support layer 184. The insulating layer 186 is made of silicon oxide. The device layer 182 and the support layer 184 are made of single crystal silicon.

  3A and 4A are process diagrams for processing the device layer 181 and the first insulating layer 185 of the mirror substrate 171 and the device layer 182 and the insulating layer 186 of the base substrate 172. First, the column 102 is formed on the device layer 181 of the mirror substrate 171 by applying a DRIE (Deep Reactive Ion Etching) method which is a processing method in the MEMS field. Next, a region of the first insulating layer 185 of the mirror substrate 171 that is not in contact with the column 102 is removed by etching. On the other hand, the connection portion 105, the hinge 110, the fixing portion 107, and the drive electrodes 120A and 120B are collectively formed by applying the DRIE method to the device layer 182 of the base substrate 172. Subsequently, the insulating layer 186 other than the region near the connecting portion 105, the hinge 110, the fixed portion 107, and the drive electrodes 120A and 120B is removed by etching.

  3B and 4B are process diagrams for connecting the mirror substrate 171 and the base substrate 172. As shown in FIG. 3B and FIG. 4B, the tip of the support column 102 formed on the mirror substrate 171 and the connection portion 105 formed on the base substrate 172 can be connected to each other so that an electrical connection such as a direct bonding method or a eutectic bonding method can be established. Join by law. Thereby, the mirror substrate 171 and the base substrate 172 are connected. Further, reference numerals 191 and 192 shown in FIG. 3B and FIG. 4B indicate removal regions to be removed in the subsequent steps. The first removal region 191 is a region near the connection portion 105 and the hinge 110 in the support layer 184 of the base substrate 172. On the other hand, the second removal region 192 is a region in the insulating layer 186 near the connection portion 105 and the hinge 110.

  3C and 4C are process diagrams for processing the support layer 184 of the base substrate 172 and forming the reflective surface 103. First, the first removal region 191 shown in FIGS. 3B and 4B is removed by the DRIE method. Next, the second removal region 192 is removed by an RIE (Reactive Ion Etching) method, and the through-hole 190 for moving the connecting portion 105 and the hinge 110 is formed. Subsequently, the support layer 187 and the insulating layer 188 of the mirror substrate shown in FIGS. 3B and 4B are removed by etching as shown in FIGS. 3C and 4C. Subsequently, a reflective surface 103 is formed by forming a metal film on the upper surface of the intermediate layer 183 that is the movable plate 101 by vapor deposition or the like.

(Function)
In the optical deflector of the present embodiment, a support column 102 is provided on the back surface of the surface of the movable plate 101 on which the reflecting surface 103 is provided, and a hinge 110 is provided on the lower end of the support plate 102 via a connecting portion 105. That is, unlike the conventional example, there is no hinge on the reflecting surface of the movable plate. Therefore, since the entire upper surface of the movable plate 101 can function as a reflection surface, the optical deflector has a configuration in which a movable plate larger than the effective reflection surface is not required.

  Further, in the optical deflector of the present embodiment, since the connecting portion 105, the hinge 110, and the fixing portion 107 are integrally formed with the same layer, the connecting portion 105, the hinge 110, or the fixing portion 107 is formed. There is no need to add a separate layer. Therefore, it is possible to minimize the number of manufacturing steps of the optical deflector.

  In general, in a processing method in the MEMS field, in order to add a layer and produce a structure in the layer, a step of adding the layer, a step of forming a protective film for processing on the surface of the layer, and a protection It is necessary to add a number of processes such as the process of transferring the shape of the structure to the film, the process of processing the layer into the transferred shape, and the process of removing the protective film, greatly increasing the number of manufacturing steps of the optical deflector. Will increase. In general, an increase in the number of manufacturing steps is undesirable because it promotes dimensional variations and causes performance variations.

  In addition, the optical deflector of the present embodiment is a single layer of an SOI substrate, particularly a device layer, in which the member of the hinge 110 is made of single crystal silicon. In the industry, the hinge of an optical deflector is usually a bulk micromachining technology that fabricates a structure by processing a single crystal silicon substrate, or a surface micro that creates a structure by processing a thin film deposited on the substrate. Manufactured by machining technology. In general, a structure manufactured by a bulk micromachining technique has, for example, a smaller internal residual stress than a structure manufactured by a surface micromachining technique. A small internal residual stress means that the initial strain generated in the structure is small. Accordingly, the hinge 110 according to the present embodiment, which is manufactured on a single layer of an SOI substrate made of single crystal silicon, has little initial strain, and thus has excellent stability in the initial posture of the optical deflector.

  Further, in the optical deflector of the present embodiment, since the through-hole 190 that provides the movable space between the connecting portion 105 and the hinge 110 passes through the substrate 150, the connecting portion 105 is joined after the support column 102 and the connecting portion 105 are joined. The substrate 150 near the hinge 110 can be removed. Therefore, it is possible to prevent the connection portion 105 and the hinge 110 from being damaged due to stress at the time of joining.

  Furthermore, in the optical deflector of the present embodiment, the drive electrodes 120A and 120B can be manufactured in the same layer as the connection portion 105, the hinge 110, and the fixed portion 107. That is, it is not necessary to add a separate process for installing the drive electrodes 120A and 120B. Of course, wiring for supplying a voltage to the drive electrodes 120A and 120B can also be produced in a single layer in the same layer as the connecting portion 105, the hinge 110, and the fixing portion 107.

(effect)
As described above, the optical deflector according to the present embodiment can function the entire upper surface of the movable plate as a reflecting surface, so that the optical deflector can be downsized.

  In addition, by integrally manufacturing the hinge, connecting portion, and fixing portion with the same layer, it is possible to minimize the number of steps of manufacturing the optical deflector. Less mass production.

  In addition, the optical deflector of the present embodiment is excellent in the stability of the initial posture because the member of the hinge 110 is a single layer of an SOI substrate made of single crystal silicon.

  Further, in the optical deflector of the present embodiment, by providing a space penetrating the substrate, it is possible to release the connection portion and the hinge from the substrate after joining the support column and the connection portion, so the mass yield is high. Excellent.

  Furthermore, the optical deflector of the present embodiment can be manufactured in a lump in the same layer as the connection portion and the hinge, particularly by providing the drive electrode on the substrate so as to face the movable plate. Excellent mass productivity with little variation.

(variation)
In the present embodiment, the shape of the surface on which the reflecting surface 103 of the movable plate 101 is provided is a rectangle, but the shape is only required to have a larger area than the spot of light incident on the reflecting surface 103. For example, a shape that can be processed by a technology in the MEMS field, such as a polygon or a circle, can be used.

  Moreover, the cross-sectional shape of the support | pillar 102 can be made into the shape which can be processed with the technique of MEMS fields, such as a polygon and a circle, for example.

  In this embodiment, an SOI substrate is used for manufacturing a deflector. However, for example, silicon, glass, or the like on one surface of a substrate that can be mechanically processed including etching or the like by a technique in the MEMS field, etc. A substrate on which a material that can be mechanically processed including etching and the like using a technique in the MEMS field such as polycrystalline silicon, silicon nitride, organic matter, and metal can be used.

  In this embodiment mode, the movable plate 101 and the column 102 are formed in different layers. However, the movable plate 101 and the column 102 can be formed in the same layer.

  In this embodiment, direct bonding is used as a means for bonding the mirror substrate and the base substrate. However, for example, other bonding methods used in the MEMS field such as eutectic bonding and anodic bonding may be used. Is possible.

  In addition, although an example of electrostatic driving is shown as the present embodiment, it is of course possible to employ an electromagnetic driving method that requires forming a complex coil on one surface of the movable plate 101, and of course, piezoelectric It is also possible to adopt a piezoelectric drive method that requires the material to be placed on the hinge 110 or the like.

<Second Embodiment>
(Constitution)
FIG. 5 is a perspective view of an optical deflector according to the second embodiment. FIG. 6 is an enlarged view of the vicinity of the center of the optical deflector of FIG. FIG. 7 is a vertical sectional view of the optical deflector of FIG. 5 taken along line CC shown in FIG.

  As shown in FIGS. 5, 6, and 7, the optical deflector according to the second embodiment includes a substrate 250, two pairs of drive electrodes 221 </ b> A, 221 </ b> B, 222 </ b> A, 222 </ b> B provided on the substrate 250, and the substrate 250. A pair of fixed portions 207 fixed, a pair of first hinges 212 connected to the pair of fixed portions 207, respectively, and a pair of first hinges 212 so as to be swingable around the first torsion shaft 242 A supported movable frame 215, a pair of second hinges 211 connected to the movable frame 215, and a connection supported by the pair of second hinges 211 so as to be swingable around the second torsion shaft 241. Part 205, column 202 fixed to connection unit 205, and movable plate 201 fixed to column 202.

  The movable plate 201 is supported at a distance from the substrate 250 so as to face the drive electrodes 221A, 221B, 222A, and 222B. The movable plate 201 has a counter electrode on a first surface facing the drive electrodes 221A, 221B, 222A, and 222B, and a reflection surface 203 on a second surface opposite to the first surface. The movable plate 201 is made of, for example, single crystal silicon, and can itself function as a counter electrode. The reflection surface 203 is provided by depositing a metal such as gold on the upper surface of the movable plate 201.

  The column 202 is made of single crystal silicon, for example, like the movable plate 201.

  The movable plate 201, the support column 202, and the connection unit 205 constitute a movable unit 206. The first hinge 211, the movable frame 215, and the second hinge 212 constitute a gimbal structure 230. The connection part 205 is connected to the fixing part 207 via the gimbal structure 230. Specifically, the connecting portion 205 is connected to the movable frame 215 via the first hinge 211, and the movable frame 215 is connected to the fixed portion 207 via the second hinge 212. The first hinge 211 functions as a so-called torsion bar that is a torsionally deformable elastic portion around the torsion shaft 241. The hinge 212 functions as a so-called torsion bar that is an elastic part that can be torsionally deformed about the torsion shaft 242. The torsion shaft 241 and the torsion shaft 242 are orthogonal to each other, for example. Thereby, the connection part 205 can be inclined with respect to the movable frame 215 with the torsion shaft 241 as an axis. The connecting portion 205 can be inclined with respect to the substrate 250 about the torsion shaft 242 together with the movable frame 215. Therefore, the movable plate 201 is supported by the substrate 250 by the gimbal structure 230 so as to be tiltable about the first torsion shaft 241 and the second torsion shaft 242.

  The substrate 250 has a through-hole 290 that surrounds the first hinge 212, the movable frame 215, the second hinge 211, and the connection portion 205. The through-hole 290 provides a movable space between the gimbal structure 230 and the connection portion 205.

  The fixed portion 207, the first hinge 212, the movable frame 215, the second hinge 211, and the connecting portion 205 are formed from the same layer. This layer is made of, for example, single crystal silicon, and is electrically connected to the movable plate 201 via the support column 202.

  In the drive electrodes 221A, 221B, 222A, and 222B, the fixed portion 207, the first hinge 212, the movable frame 215, the second hinge 211, and the connecting portion 205 are formed from the same layer.

  The substrate 250 is provided with a step formed by a first substrate plane portion 251, a second substrate plane portion 252, and an inclined surface 253 connecting the first substrate plane portion 251 and the second substrate plane portion 252. ing. The step is formed so that the distance between the first substrate plane portion 251 and the movable plate 201 is narrower than the distance between the second substrate plane portion 252 and the movable plate 201. Therefore, the first substrate plane portion 251 is located closer to the movable plate 201 than the second substrate plane portion 252. The first substrate plane portion 251 is located inside the movable plate 201 in the projection onto the movable plate 201. The drive electrodes 221A, 221B, 222A, 222B and the fixing portion 207 are disposed on the first substrate plane portion 251.

  FIG. 8 is a top view of the optical deflector of FIG. 5 with the movable plate 201 and the support column 202 shown in FIG. 5 removed. As shown in FIGS. 5, 6, and 7, the first drive electrodes 221 </ b> A and 221 </ b> B and the second drive electrodes 222 </ b> A and 222 </ b> B are the same as the gimbal structure 230 on the first substrate plane portion 251 of the substrate 250. It is formed in a lump with layers. The first drive electrodes 221A and 221B are provided on both sides of the torsion shaft 241 with the torsion shaft 241 interposed therebetween so as to face the movable plate 201. Similarly, the second drive electrodes 222A and 222B are provided on both sides of the torsion shaft 242 with the torsion shaft 242 interposed therebetween so as to face the movable plate 201.

  The first drive electrodes 221A and 221B and the second drive electrodes 222A and 222B are provided inside a square formed by four points 245 ', 246', 247 ', and 248'. The points 245 ′ and 246 ′ are located on the first torsion shaft 241, and the points 247 ′ and 248 ′ are located on the second torsion shaft 242. A point 245 ′ is an intersection of the pull-in limit line 245 and the first torsion shaft 241 in a state where the movable plate 201 is inclined so as to approach the first drive electrode 221A, and a point 246 ′ is the movable plate. This is an intersection of the first torsion shaft 241 and the Pull-in limit line 246 in a state where 201 is inclined so as to approach the first drive electrode 221B. Similarly, the point 247 ′ is an intersection of the Pull-in limit line 247 and the second torsion shaft 242 in a state where the movable plate 201 is inclined so as to approach the first drive electrode 222A, and the point 248 ′ is movable. This is an intersection of the Pull-in limit line 248 and the second torsion shaft 242 in a state where the plate 201 is inclined so as to approach the first drive electrode 222B.

(Drive principle)
The driving principle will be described below. As shown in FIGS. 5 and 8, the first drive electrodes 221A and 221B are disposed on both sides of the first torsion shaft 241 with the first torsion shaft 241 interposed therebetween. A voltage can be applied independently to the first drive electrodes 221A and 221B. The movable plate 201 is electrically set to a ground potential or a predetermined potential. When a voltage is applied to the first drive electrode 221A, an electrostatic attractive force is generated between the movable plate 201 and the first drive electrode 221A. Therefore, torque about the first torsion shaft 241 is applied to the first hinge 211, and the movable plate 201 is inclined so as to approach the drive electrode 221A. Further, when a voltage is applied to the first drive electrode 221B, a torque in the opposite direction is generated this time, so that the movable plate 201 is inclined so as to approach the drive electrode 221B. That is, by applying a voltage to one of the first drive electrodes 221A and 221B, the movable plate 201 is moved toward the drive electrodes 221A and 221B to which the voltage is applied with the first torsion shaft 241 as an axis. Tilt to approach.

  On the other hand, the second drive electrodes 222A and 222B are disposed on both sides of the second torsion shaft 242 with the second torsion shaft 242 interposed therebetween. A voltage can be independently applied to the second drive electrodes 222A and 222B. When a voltage is applied to the second drive electrode 222A, an electrostatic attractive force is generated between the movable plate 201 and the second drive electrode 222A. Accordingly, torque about the second torsion shaft 242 is applied to the second hinge 212, and the movable plate 201 is inclined so as to approach the drive electrode 222A. Further, when a voltage is applied to the second drive electrode 222B, a torque in the opposite direction is generated this time, so that the movable plate 201 is inclined so as to approach the drive electrode 222B. That is, by applying a voltage to one of the second drive electrodes 222A and 222B, the movable plate 201 is moved toward the drive electrodes 222A and 222B to which a voltage is applied, with the second torsion shaft 242 as an axis. Tilt to approach.

  Therefore, by applying an arbitrary voltage to the first drive electrodes 221A and 221B and the second drive electrodes 222A and 222B, the movable plate 201 has two first torsion shafts 241 and 242. Tilt around the axis.

(Function)
In the optical deflector of the present embodiment, since the support column 202 is provided on the back surface of the movable plate 201 on which the reflection surface 203 is provided, the gimbal structure 230 can be provided on the lower end of the support column 202. That is, unlike the conventional example, there is no gimbal structure on the reflecting surface of the movable plate. Therefore, since the entire upper surface of the movable plate 201 can function as a reflection surface, the optical deflector has a configuration in which a movable plate larger than the effective reflection surface is not required.

  In the optical deflector of the present embodiment, the connecting portion 205, the first hinge 211, the movable frame 215, the second hinge 212, and the fixed portion 207 are integrally formed in the same layer. There is no need to separately add a layer for manufacturing the connecting portion 205, the first hinge 211, the movable frame 215, the second hinge 212, or the fixed portion 207. Therefore, it is possible to minimize the number of manufacturing steps of the optical deflector.

  In general, in a processing method in the MEMS field, in order to add a layer and produce a structure in the layer, the step of adding the layer, the step of forming a protective film for processing on the surface of the layer, and the protective film It is necessary to add a number of processes, such as a process of transferring the shape of the structure, a process of processing the layer into the transferred shape, and a process of removing the protective film, which greatly increases the number of manufacturing steps of the optical deflector. Become. In general, an increase in the number of manufacturing steps is undesirable because it promotes dimensional variations and causes performance variations.

  In addition, the optical deflector of the present embodiment is, in particular, one layer of an SOI substrate in which the members of the first hinge 211 and the second hinge 212 are made of single crystal silicon, in particular, a device layer. In the industry, the hinge of an optical deflector is usually a bulk micromachining technology that fabricates a structure by processing a single crystal silicon substrate, or a surface micro that creates a structure by processing a thin film deposited on the substrate. Manufactured by machining technology. In general, a structure manufactured by a bulk micromachining technique has a feature that, for example, internal residual stress is smaller than a structure manufactured by a surface micromachining technique. A small internal residual stress means that the initial strain generated in the structure is small. Therefore, the hinges 211 and 212 of this embodiment manufactured on a single layer of an SOI substrate made of single crystal silicon have a low initial strain, and thus are excellent in the stability of the initial posture of the optical deflector.

  In addition, the optical deflector of the present embodiment is inclined with two torsion axes, ie, the first torsion axis 241 and the second torsion axis 242 as axes. The gimbal structure for driving the movable plate in two axes uses two sets of hinges for driving the movable plate in one axis. That is, in general, the mechanism for driving the movable plate in two axes is larger and more complicated than the mechanism for driving the movable plate in one axis. In the optical deflector of the present embodiment, the support 202 is provided on the back surface of the movable plate 201 on which the reflection surface 203 is provided, so that the gimbal structure 230 can be provided at the tip of the support 202. That is, unlike the conventional example, there is no gimbal structure 230 on the surface of the movable plate 201 on which the reflection surface 203 is provided. Therefore, even if there are two drive axes of the optical deflector, the optical deflector has a configuration in which the area of the reflection surface 203 does not decrease.

  In the optical deflector of the present embodiment, since the through-hole 290 provided for obtaining the movable space of the gimbal structure 230 penetrates the substrate 250, after the support column 202 and the connection portion 205 are joined. The substrate 250 near the gimbal structure 230 can be removed. Therefore, it is possible to prevent the gimbal structure 230 from being damaged due to stress during bonding.

  Further, in the substrate 250 of the optical deflector according to the present embodiment, the interval between the movable plate 201 and the first substrate plane portion 251 is narrower than the interval between the movable plate 201 and the second substrate plane portion 252. Such a step is provided. By bringing only the first substrate plane portion 251 near the center of the substrate 250 closer to the movable plate 201, the column 202 can be shortened while ensuring the movable space of the movable plate 201. Since the column 202 can be shortened, the distance between the center of gravity and the rotation center of the movable part including the movable plate 201, the column 202, and the gimbal structure 230 is reduced, and the inertia around the first torsion shaft 241 and the second torsion shaft 242 is achieved. The moment becomes smaller. Since the moment of inertia around the first torsion shaft 241 and the second torsion shaft 242 is reduced, the natural frequency around the torsion axis of the movable part is increased.

(effect)
As described above, the optical deflector according to the present embodiment can function the entire upper surface of the movable plate as a reflecting surface, so that the optical deflector can be downsized.

  In addition, since the hinge, the connecting portion, the movable frame, and the fixed portion are integrally manufactured in the same layer, the number of steps of manufacturing the optical deflector can be minimized, so that the yield can be easily improved. There is little variation and it is excellent in mass productivity.

  In addition, the optical deflector of the present embodiment is particularly excellent in the stability of the initial posture because the members of the hinges 211 and 212 are a single layer of an SOI substrate made of single crystal silicon.

  In addition, since the optical deflector according to the present embodiment is provided with a column on the lower surface of the movable plate, the gimbal structure can be provided at the tip of the column. Therefore, even a two-axis drive optical deflector can be downsized.

  In addition, in the optical deflector of the present embodiment, by providing a space penetrating the substrate, the gimbal structure 230 can be released from the substrate after joining the support column and the connection portion, so that the yield is high and the mass productivity is high. Excellent.

  Further, the optical deflector of the present embodiment can shorten the support column because the step is provided on the substrate. Therefore, it is possible to obtain a stable optical deflector whose posture hardly changes even when there is a disturbance such as an impact from the outside.

(variation)
In the present embodiment, the shape of the surface on which the reflecting surface 203 of the movable plate 201 is provided is shown as a rectangle. However, the shape is not limited as long as the area larger than the spot of light incident on the reflecting surface 203 can be obtained. For example, a shape that can be processed by a technology in the MEMS field, such as a polygon or a circle, can be used.

  Moreover, the cross-sectional shape of the support | pillar 202 can be made into the shape which can be processed with the technique of MEMS fields, such as a polygon and a circle, for example.

  In this embodiment, an SOI substrate is used for manufacturing a deflector. However, for example, silicon, glass, or the like on one surface of a substrate that can be mechanically processed including etching or the like by a technique in the MEMS field, etc. A substrate on which a material that can be mechanically processed including etching and the like using a technique in the MEMS field such as polycrystalline silicon, silicon nitride, organic matter, and metal can be used.

  In this embodiment mode, the movable plate 201 and the support column 202 are formed in different layers. However, the movable plate 201 and the support column 202 can be manufactured in the same layer.

  In this embodiment, direct bonding is used as a means for bonding the mirror substrate and the base substrate. However, for example, other bonding methods used in the MEMS field such as eutectic bonding and anodic bonding may be used. Is possible.

  In addition, although an example of electrostatic driving has been described as the present embodiment, it is of course possible to employ an electromagnetic driving method although it is necessary to form a complex coil on one surface of the movable plate 201, and of course, piezoelectric It is also possible to adopt a piezoelectric drive method although it is necessary to install the material on a hinge or the like.

  In this embodiment, single crystal silicon is used as the material of the drive electrode. However, for example, a conductor and a semiconductor material that can be processed by etching or the like using a technique in the MEMS field such as polycrystalline silicon and metal are used. be able to. In selecting the material for the drive electrode, the influence on the fixed portion, the elastic portion, and the connecting portion formed as the same layer should be taken into consideration. In particular, it is necessary to design in consideration of fatigue characteristics and rigidity of the elastic portion.

  Further, in the present embodiment, the substrate 250 has a first substrate plane portion 251, a second substrate plane portion 252, a slope 253 that connects the first substrate plane portion 251 and the second substrate plane portion 252. Of course, it is possible to provide a plurality of substrate flat portions and inclined surfaces.

  Further, the angle formed by one surface of the slope 253 and the first substrate plane portion 251 can be set to an arbitrary angle from 0 degrees to 90 degrees.

  Further, the shapes of the surfaces of the first drive electrodes 221A and 221B and the second drive electrodes 222A and 222B facing the movable plate 201 are formed by four points 245 ′, 246 ′, 247 ′, and 248 ′. It is only necessary to be arranged inside the quadrangle, and for example, a shape that can be processed by a technology in the MEMS field, such as a polygon or a circle, can be used.

<Third Embodiment>
(Constitution)
FIG. 9 is a perspective view of a one-dimensional optical deflector array according to the third embodiment. FIG. 10 is a perspective view showing a single optical deflector extracted from the one-dimensional optical deflector array of FIG. 11 is an enlarged view of the vicinity of the center of the optical deflector of FIG. 10 in a state where the movable plate shown in FIG. 10 is removed.

  As shown in FIG. 9, the one-dimensional optical deflector array of the present embodiment has a plurality of optical deflectors arranged one-dimensionally. Each optical deflector is configured similarly to the optical deflector of the second embodiment, for example. That is, each optical deflector includes a substrate 350, two pairs of drive electrodes 321A, 321B, 322A, 322B provided on the substrate 350, and a pair of fixing portions 307 fixed to the substrate 350, as shown in FIG. A pair of first hinges 312 connected to the pair of fixed portions 307, a movable frame 315 supported by the pair of first hinges 312 so as to be swingable around the first torsion shaft 342, A pair of second hinges 311 respectively connected to the movable frame 315, a connection part 305 supported by the pair of second hinges 311 so as to be swingable around the second torsion shaft 341, and a connection part 305 It has a fixed column 302 and a movable plate 301 fixed to the column 302.

  The movable plate 301 is supported at a distance from the substrate 350 so as to face the drive electrodes 321A, 321B, 322A, 322B. The movable plate 301 has a counter electrode on a first surface facing the drive electrodes 321A, 321B, 322A, and 322B, and has a reflective surface 303 on a second surface opposite to the first surface. The movable plate 301 is made of, for example, single crystal silicon, and can itself function as a counter electrode. The reflection surface 303 is provided by depositing a metal such as gold on the upper surface of the movable plate 301.

  The column 302 is made of single crystal silicon, for example, like the movable plate 301.

  The movable plate 301, the support column 302, and the connection portion 305 constitute a movable portion 306. The first hinge 311, the movable frame 315, and the second hinge 312 constitute a gimbal structure 330. The connection part 305 is connected to the fixing part 307 via the gimbal structure 330. Specifically, the connecting portion 305 is connected to the movable frame 315 via the first hinge 311, and the movable frame 315 is connected to the fixed portion 307 via the second hinge 312. The first hinge 311 functions as a so-called torsion bar that is a torsionally deformable elastic portion around the torsion shaft 341. In addition, the hinge 312 functions as a so-called torsion bar that is an elastic portion that can be torsionally deformed about the torsion shaft 342. The torsion shaft 341 and the torsion shaft 342 are, for example, orthogonal to each other. Thereby, the connection part 305 can be inclined with respect to the movable frame 315 about the torsion shaft 341. The connecting portion 305 can be inclined with respect to the substrate 350 about the torsion shaft 342 along with the movable frame 315. Therefore, the movable plate 301 is supported by the substrate 350 by the gimbal structure 330 so as to be tiltable about the first torsion shaft 341 and the second torsion shaft 342.

  The substrate 350 has a through-hole 390 that surrounds the first hinge 312, the movable frame 315, the second hinge 311, and the connection portion 305. The through-hole 390 provides a movable space for the gimbal structure 330 and the connection portion 305.

  The fixed portion 307, the first hinge 312, the movable frame 315, the second hinge 311 and the connecting portion 305 are formed from the same layer. This layer is made of, for example, single crystal silicon, and is electrically connected to the movable plate 301 via the support column 302.

  In the drive electrodes 321A, 321B, 322A, and 322B, the fixed portion 307, the first hinge 312, the movable frame 315, the second hinge 311 and the connecting portion 305 are formed from the same layer.

  The substrate 350 is provided with a step formed by a first substrate plane portion 351, a second substrate plane portion 352, and an inclined surface 353 connecting the first substrate plane portion 351 and the second substrate plane portion 352. ing. The step is formed such that the distance between the first substrate plane part 351 and the movable plate 301 is narrower than the distance between the second substrate plane part 352 and the movable plate 301. Therefore, the first substrate plane portion 351 is located closer to the movable plate 301 than the second substrate plane portion 352. The first substrate plane portion 351, the second substrate plane portion 352, and the slope 353 constituting the terrace are arranged along the torsion axis 341. The drive electrodes 321A, 321B, 322A, 322B and the fixing portion 307 are disposed on the first substrate plane portion 351.

  The first drive electrodes 321A and 321B and the second drive electrodes 322A and 322B are collectively formed in the same layer as the gimbal structure 330 on the first substrate plane portion 351 of the substrate 350. The first drive electrodes 321A and 321B are provided on both sides of the torsion shaft 341 with the torsion shaft 341 interposed therebetween so as to face the movable plate 301. Similarly, the second drive electrodes 322A and 322B are provided on both sides of the torsion shaft 342 with the torsion shaft 342 interposed therebetween so as to face the movable plate 301. The range where the first drive electrodes 321A and 321B and the second drive electrodes 322A and 322B are installed is located inside the movable plate 301 in the projection onto the movable plate 301.

  As shown in FIG. 9, in the one-dimensional optical deflector array according to the present embodiment, movable plates 301 </ b> A, 301 </ b> B, and 301 </ b> C are densely arranged in a direction parallel to the first torsion shaft 342. The movable plates 301A, 301B, 301C can be tilted about the first torsion shaft 342. Further, the movable plates 301A, 301B, 301C can be tilted about the second torsion shafts 341A, 341B, 341C, respectively. The second torsion shafts 341A, 341B, 341C are parallel to each other.

  FIG. 12 is a perspective view of a two-dimensional optical deflector array according to the third embodiment. This two-dimensional optical deflector array is configured by combining three one-dimensional optical deflector arrays shown in FIG. As shown in FIG. 12, the two-dimensional optical deflector array of the present embodiment includes a first movable plate group composed of movable plates 301AA, 301AB, and 301AC and a second movable plate composed of movable plates 301BA, 301BB, and 301BC. A third movable plate group including a plate group and movable plates 301CA, 301CB, and 301CC is provided. That is, the two-dimensional optical deflector array has a plurality of optical deflectors arranged two-dimensionally.

  The movable plates 301AA, 301AB, 301AC of the first movable plate group are densely arranged in a direction parallel to the first torsion shaft 342A. Similarly, the movable plates 301BA, 301BB, 301BC of the second movable plate group are densely arranged in a direction parallel to the first torsion shaft 342B, and the movable plates 301CA, 301CB, 301CC of the third movable plate group are the first ones. They are densely arranged in a direction parallel to one torsion shaft 342C. The first torsion shafts 342A, 342B, and 342C are parallel to each other. The first movable plate group, the second movable plate group, and the third movable plate group are densely arranged in a direction parallel to the second torsion shafts 341A, 341B, and 341C.

  The movable plates 301AA, 301AB, 301AC can be tilted about the first torsion shaft 342A. Similarly, the movable plates 301BA, 301BB, and 301BC can be tilted about the first torsion shaft 342B, and the movable plates 301CA, 301CB, and 301CC can be tilted about the first torsion shaft 342C. The movable plates 301AA, 301BA, and 301CA can be tilted about the second torsion shaft 341A. Similarly, the movable plates 301AB, 301BB, and 301CB can be tilted about the second torsion shaft 341B, and the movable plates 301AC, 301BC, and 301CC can be tilted about the second torsion shaft 341C.

(Drive principle)
The driving principle will be described below. As shown in FIGS. 10 and 11, the first drive electrodes 321A and 321B are installed on both sides of the first torsion shaft 341 with the first torsion shaft 341 interposed therebetween. A voltage can be applied independently to the first drive electrodes 321A and 321B. The movable plate 301 is electrically set to a ground potential or a predetermined potential. When a voltage is applied to the first drive electrode 321A, an electrostatic attractive force is generated between the movable plate 301 and the first drive electrode 321A. Therefore, torque about the first torsion shaft 341 is applied to the first hinge 311 and the movable plate 301 is inclined so as to approach the drive electrode 321A. Further, when a voltage is applied to the first drive electrode 321B, a torque in the opposite direction is generated this time, so that the movable plate 301 is inclined so as to approach the drive electrode 321B. That is, by applying a voltage to one of the first drive electrodes 321A and 321B, the movable plate 301 has the first torsion shaft 341 as an axis toward the drive electrodes 321A and 321B to which a voltage is applied. Tilt to approach.

  On the other hand, the second drive electrodes 322A and 322B are disposed on both sides of the second torsion shaft 342 with the second torsion shaft 342 interposed therebetween. A voltage can be independently applied to the second drive electrodes 322A and 322B. When a voltage is applied to the second drive electrode 322A, an electrostatic attractive force is generated between the movable plate 301 and the second drive electrode 322A. Therefore, torque about the second torsion shaft 342 is applied to the second hinge 312, and the movable plate 301 is inclined so as to approach the drive electrode 322A. Further, when a voltage is applied to the second drive electrode 322B, a torque in the opposite direction is generated this time, so that the movable plate 301 is inclined so as to approach the drive electrode 322B. That is, by applying a voltage to one of the second drive electrodes 322A and 322B, the movable plate 301 has the second torsion shaft 342 as an axis toward the drive electrodes 322A and 322B to which a voltage is applied. Tilt to approach.

  Therefore, by applying an arbitrary voltage to the first drive electrodes 321A and 321B and the second drive electrodes 322A and 322B, the movable plate 301 has two first torsion shafts 341 and second torsion shafts 342. Tilt around the axis.

(Function)
In the optical deflector of the present embodiment, since the support 302 is provided on the back surface of the movable plate 301 on which the reflection surface 303 is provided, the gimbal structure 330 can be provided at the lower end of the support 302. That is, unlike the conventional example, there is no gimbal structure on the reflecting surface of the movable plate. Therefore, since the entire upper surface of the movable plate 301 can function as a reflection surface, the optical deflector has a configuration in which a movable plate larger than the reflection effective surface is unnecessary.

  Further, in the optical deflector of the present embodiment, the connection portion 305, the first hinge 311, the movable frame 315, the second hinge 312 and the fixed portion 307 are integrally formed in the same layer. There is no need to add a layer for manufacturing the connecting portion 305, the first hinge 311 or the movable frame 315, the second hinge 312 or the fixed portion 307. Therefore, it is possible to minimize the number of manufacturing steps of the optical deflector.

  In general, in a processing method in the MEMS field, in order to add a layer and produce a structure in the layer, the step of adding the layer, the step of forming a protective film for processing on the surface of the layer, and the protective film It is necessary to add a number of processes, such as a process of transferring the shape of the structure, a process of processing the layer into the transferred shape, and a process of removing the protective film, which greatly increases the number of manufacturing steps of the optical deflector. Become. In general, an increase in the number of manufacturing steps is undesirable because it promotes dimensional variations and causes performance variations.

  In addition, the optical deflector of the present embodiment is a layer of an SOI substrate, in particular, a device layer, in which the members of the first hinge 311 and the second hinge 312 are made of single crystal silicon. In the industry, the hinge of an optical deflector is usually a bulk micromachining technology that fabricates a structure by processing a single crystal silicon substrate, or a surface micro that creates a structure by processing a thin film deposited on the substrate. Manufactured by machining technology. In general, a structure manufactured by a bulk micromachining technique has a feature that, for example, internal residual stress is smaller than a structure manufactured by a surface micromachining technique. A small internal residual stress means that the initial strain generated in the structure is small. Accordingly, the hinges 311 and 312 of this embodiment manufactured on a single layer of an SOI substrate made of single crystal silicon have a low initial strain, and thus are excellent in the stability of the initial posture of the optical deflector.

  Further, since the optical deflector of the present embodiment is provided with the support post 302 on the back surface of the movable plate 301 on which the reflection surface 303 is provided, the gimbal structure 330 can be provided at the lower end of the support post 302. That is, it has a configuration in which the entire upper surface of the movable plate 301 can function as the reflection surface 303 and a configuration in which the gap between the adjacent movable plate and the movable plate can be narrowed. Therefore, it is possible to reduce the size of the optical deflector array. In particular, when a two-dimensional optical deflector array in which optical deflectors are two-dimensionally arranged is manufactured, in the configuration of the conventional optical deflector, the effective area as a reflecting surface is about half of the area of the upper surface of the movable plate. Therefore, it cannot be two-dimensionally arranged so that the gap between adjacent reflecting surfaces becomes narrow. On the other hand, the optical deflector of the present embodiment is configured to be two-dimensionally arranged so that the gap between the adjacent reflecting surfaces becomes narrow.

  Furthermore, in the optical deflector of the present embodiment, the first substrate plane portion 351 near the center of the substrate 350 is brought close to the movable plate 301. Further, since the drive electrode is provided only on the first substrate plane portion 351, the electrostatic gap between the drive electrode and the movable plate 301 is narrowed. Since the electrostatic gap is narrowed, the force generated between the drive electrode and the movable plate 301 is increased, so that the area of the drive electrode can be reduced accordingly. Accordingly, since the distance between the drive electrodes of the adjacent optical deflector and the optical deflector can be increased compared to the distance between the movable plate and the drive electrode facing the movable plate, the optical deflection of the present embodiment The device is configured to reduce electrical crosstalk between adjacent optical deflectors.

(effect)
As described above, the optical deflector according to the present embodiment can function the entire upper surface of the movable plate as a reflecting surface, so that the optical deflector can be downsized.

  Further, since the hinges 311, 312, the connecting portion 305, the movable frame 315, and the fixed portion 307 are integrally manufactured in the same layer, it is possible to minimize the number of steps of manufacturing the optical deflector. Yield can be improved easily, with little variation and excellent mass productivity.

  In addition, the optical deflector of the present embodiment is particularly excellent in the stability of the initial posture because the members of the hinges 311 and 312 are a single layer of an SOI substrate made of single crystal silicon.

  In addition, since the optical deflector according to the present embodiment is provided with a column on the lower surface of the movable plate, the gimbal structure can be provided at the tip of the column. Therefore, even a two-axis drive optical deflector can be downsized.

  In addition, the optical deflector of the present embodiment has a configuration that allows the entire upper surface of the movable plate to function as a reflective surface, and is arranged so that the gap between the adjacent movable plate and the movable plate is narrowed. Since it has a possible configuration, it is possible to reduce the size of the optical deflector array.

  Furthermore, in the optical deflector of the present embodiment, the drive electrode is provided only on the first substrate plane portion, which is the convex portion of the substrate, so that the electrostatic gap between the drive electrode and the movable plate is narrowed. Therefore, electrical crosstalk between adjacent optical deflectors is reduced.

(variation)
In the present embodiment, the shape of the surface on which the reflecting surface 303 of the movable plate 301 is provided is shown as a rectangle. However, the shape is not limited as long as an area larger than the spot of light incident on the reflecting surface 303 can be obtained. For example, a shape that can be processed by a technology in the MEMS field, such as a polygon or a circle, can be used.

  Moreover, the cross-sectional shape of the support | pillar 302 can be made into the shape which can be processed with the technique of MEMS fields, such as a polygon and a circle, for example.

  In this embodiment, an SOI substrate is used for manufacturing a deflector. However, for example, silicon, glass, or the like on one surface of a substrate that can be mechanically processed including etching or the like by a technique in the MEMS field, etc. A substrate on which a material that can be mechanically processed including etching and the like using a technique in the MEMS field such as polycrystalline silicon, silicon nitride, organic matter, and metal can be used.

  In this embodiment mode, the movable plate 301 and the column 302 are formed in different layers, but the movable plate 301 and the column 302 can be formed in the same layer.

  In the present embodiment, the substrate 350 has a slope 353 that connects the first substrate plane 351, the second substrate plane 352, the first substrate plane 351, and the second substrate plane 352. Of course, it is possible to provide a plurality of substrate flat portions and inclined surfaces.

  Further, the angle formed by one surface of the inclined surface 353 and the first substrate plane portion 351 can be set to an arbitrary angle from 0 degrees to 90 degrees.

  Although the embodiments of the present invention have been described above with reference to the drawings, the present invention is not limited to these embodiments, and various modifications and changes can be made without departing from the scope of the present invention. May be. The various modifications and changes described here include an implementation in which the above-described embodiments are appropriately combined.

DESCRIPTION OF SYMBOLS 101 ... Movable plate, 102 ... Support | pillar, 103 ... Reflecting surface, 105 ... Connection part, 106 ... Movable part, 107 ... Fixed part, 110 ... Hinge, 120A, 120B ... Drive electrode, 141 ... Torsion shaft, 150 ... Substrate, 171 ... Mirror substrate, 172 ... Base substrate, 181,182 ... Device layer, 183 ... Intermediate layer, 184,187 ... Support layer, 185,186,188 ... Insulating layer, 190 ... Through hole, 191,192 ... Removal region, 201 DESCRIPTION OF SYMBOLS ... Movable plate, 202 ... Column, 203 ... Reflecting surface, 205 ... Connection part, 206 ... Movable part, 207 ... Fixed part, 211, 212 ... Hinge, 215 ... Movable frame, 221A, 221B, 222A, 222B ... Drive electrode 230 ... Gimbal structure 241,242 ... Torsion shaft, 245,246,247,248 ... Pull-in limit line 245 ', 246', 24 ', 248' ... Point, 250 ... Substrate, 251,252 ... Substrate flat portion, 253 ... Slope, 290 ... Through hole, 301, 301AA, 301AB, 301AC, 301BA, 301BB, 301BC, 301CA, 301CB, 301CC ... Movable plate , 302 ... pillar, 303 ... reflecting surface, 305 ... connection part, 306 ... movable part, 307 ... fixed part, 311, 312 ... hinge, 315 ... movable frame, 321A, 321B, 322A, 322B ... drive electrode, 330 ... gimbal Structure, 341, 341A, 341B, 341C, 342, 342A, 342B, 342C ... twist axis, 350 ... substrate, 351, 352 ... substrate flat part, 353 ... slope, 390 ... through-hole.

Claims (7)

A substrate,
A pair of drive electrodes provided on the substrate;
A pair of fixing parts fixed to the substrate;
A pair of elastic portions respectively connected to the pair of fixed portions;
A connecting portion supported to be swingable by the pair of elastic portions;
A support post fixed to the connecting portion;
A movable plate fixed to the column,
The movable plate is supported at a distance from the substrate so as to face the driving electrode, has a counter electrode on a first surface facing the driving electrode, and has a second electrode opposite to the first surface. A reflective surface on the second surface,
The drive electrode, the fixed portion, the elastic portion, and the connection portion are optical deflectors formed of the same layer.   The optical deflector according to claim 1, wherein the substrate has a through-hole that surrounds the connection portion and the elastic portion. A substrate,
Two pairs of drive electrodes provided on the substrate;
A pair of fixing parts fixed to the substrate;
A pair of first elastic portions respectively connected to the pair of fixed portions;
A movable frame supported to be swingable around a first axis by the pair of first elastic portions;
A pair of second elastic portions respectively connected to the movable frame;
A connecting portion supported by the pair of second elastic portions so as to be swingable around a second axis;
A support post fixed to the connecting portion;
A movable plate fixed to the column,
The movable plate is supported at a distance from the substrate so as to face the driving electrode, has a counter electrode on a first surface facing the driving electrode, and has a second electrode opposite to the first surface. A reflective surface on the second surface,
The optical deflector, wherein the drive electrode, the fixed portion, the first elastic portion, the movable frame, the second elastic portion, and the connection portion are formed from the same layer.   The optical deflector according to claim 3, wherein the substrate has a through-hole that surrounds the first elastic portion, the movable frame, the second elastic portion, and the connection portion.   The substrate has a first plane portion and a second plane portion, and the first plane portion is located closer to the movable plate than the second plane portion, and the drive electrode The optical deflector according to claim 1, wherein the fixed portion is disposed on the first flat portion.   An optical deflector array having a plurality of one-dimensionally arranged optical deflectors, each optical deflector comprising the optical deflector according to any one of claims 1 to 5. An optical deflector array.   An optical deflector array having a plurality of optical deflectors arranged two-dimensionally, each optical deflector comprising the optical deflector according to any one of claims 1 to 5. An optical deflector array.

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