JP2013060637A - Complex of organic compound and nano copper particle, complex of organic compound and nano copper oxide (i) particle, and method for manufacturing them - Google Patents
Complex of organic compound and nano copper particle, complex of organic compound and nano copper oxide (i) particle, and method for manufacturing them Download PDFInfo
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- JP2013060637A JP2013060637A JP2011200561A JP2011200561A JP2013060637A JP 2013060637 A JP2013060637 A JP 2013060637A JP 2011200561 A JP2011200561 A JP 2011200561A JP 2011200561 A JP2011200561 A JP 2011200561A JP 2013060637 A JP2013060637 A JP 2013060637A
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- organic compound
- copper
- saturated hydrocarbon
- particles
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- 239000002245 particle Substances 0.000 title claims abstract description 171
- 239000010949 copper Substances 0.000 title claims abstract description 88
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 79
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 71
- 229910000431 copper oxide Inorganic materials 0.000 title claims abstract description 20
- 239000005751 Copper oxide Substances 0.000 title claims abstract description 18
- 150000002894 organic compounds Chemical class 0.000 title claims description 150
- 238000004519 manufacturing process Methods 0.000 title claims description 24
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 title abstract description 13
- 238000000034 method Methods 0.000 title description 45
- 150000001875 compounds Chemical class 0.000 claims abstract description 52
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 18
- 229910052717 sulfur Inorganic materials 0.000 claims abstract description 14
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 9
- VYGUBTIWNBFFMQ-UHFFFAOYSA-N [N+](#[C-])N1C(=O)NC=2NC(=O)NC2C1=O Chemical compound [N+](#[C-])N1C(=O)NC=2NC(=O)NC2C1=O VYGUBTIWNBFFMQ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 150000003568 thioethers Chemical class 0.000 claims description 70
- 239000002131 composite material Substances 0.000 claims description 52
- -1 thiol compound Chemical class 0.000 claims description 49
- 229930195734 saturated hydrocarbon Natural products 0.000 claims description 30
- 238000006722 reduction reaction Methods 0.000 claims description 20
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 18
- 150000002430 hydrocarbons Chemical group 0.000 claims description 18
- 229920000570 polyether Polymers 0.000 claims description 18
- 125000004432 carbon atom Chemical group C* 0.000 claims description 14
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 13
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 claims description 12
- 229910052799 carbon Inorganic materials 0.000 claims description 12
- 229910001431 copper ion Inorganic materials 0.000 claims description 12
- 125000004434 sulfur atom Chemical group 0.000 claims description 12
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 claims description 11
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 claims description 11
- 239000002904 solvent Substances 0.000 claims description 10
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 7
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 7
- 238000003763 carbonization Methods 0.000 claims description 6
- WCYWZMWISLQXQU-UHFFFAOYSA-N methyl Chemical group [CH3] WCYWZMWISLQXQU-UHFFFAOYSA-N 0.000 claims description 6
- 229920006395 saturated elastomer Polymers 0.000 claims description 6
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 claims description 5
- 238000001000 micrograph Methods 0.000 claims description 5
- RHUYHJGZWVXEHW-UHFFFAOYSA-N 1,1-Dimethyhydrazine Chemical compound CN(C)N RHUYHJGZWVXEHW-UHFFFAOYSA-N 0.000 claims description 4
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims description 4
- XLSMFKSTNGKWQX-UHFFFAOYSA-N hydroxyacetone Chemical compound CC(=O)CO XLSMFKSTNGKWQX-UHFFFAOYSA-N 0.000 claims description 4
- 229920001174 Diethylhydroxylamine Polymers 0.000 claims description 3
- FVCOIAYSJZGECG-UHFFFAOYSA-N diethylhydroxylamine Chemical compound CCN(O)CC FVCOIAYSJZGECG-UHFFFAOYSA-N 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000012279 sodium borohydride Substances 0.000 claims description 3
- 229910000033 sodium borohydride Inorganic materials 0.000 claims description 3
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 claims description 2
- 229960005070 ascorbic acid Drugs 0.000 claims description 2
- 235000010323 ascorbic acid Nutrition 0.000 claims description 2
- 239000011668 ascorbic acid Substances 0.000 claims description 2
- 150000001880 copper compounds Chemical class 0.000 abstract description 12
- 239000005749 Copper compound Substances 0.000 abstract description 11
- 239000002105 nanoparticle Substances 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 5
- 229910052760 oxygen Inorganic materials 0.000 abstract description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 abstract description 4
- 239000007791 liquid phase Substances 0.000 abstract description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 abstract 4
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- 229920001223 polyethylene glycol Polymers 0.000 description 67
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(i) oxide Chemical compound [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 61
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- 230000015572 biosynthetic process Effects 0.000 description 50
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- 238000003786 synthesis reaction Methods 0.000 description 44
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 41
- HEDRZPFGACZZDS-MICDWDOJSA-N Trichloro(2H)methane Chemical compound [2H]C(Cl)(Cl)Cl HEDRZPFGACZZDS-MICDWDOJSA-N 0.000 description 32
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 32
- 125000003827 glycol group Chemical group 0.000 description 30
- 239000010408 film Substances 0.000 description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 24
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- 238000005160 1H NMR spectroscopy Methods 0.000 description 18
- LKMJVFRMDSNFRT-UHFFFAOYSA-N 2-(methoxymethyl)oxirane Chemical compound COCC1CO1 LKMJVFRMDSNFRT-UHFFFAOYSA-N 0.000 description 18
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- 239000001257 hydrogen Substances 0.000 description 15
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- 239000002609 medium Substances 0.000 description 15
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 14
- 239000011521 glass Substances 0.000 description 14
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- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 12
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 12
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- 238000004736 wide-angle X-ray diffraction Methods 0.000 description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 11
- 239000012298 atmosphere Substances 0.000 description 11
- 239000003638 chemical reducing agent Substances 0.000 description 10
- PSYGHMBJXWRQFD-UHFFFAOYSA-N 2-(2-sulfanylacetyl)oxyethyl 2-sulfanylacetate Chemical compound SCC(=O)OCCOC(=O)CS PSYGHMBJXWRQFD-UHFFFAOYSA-N 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 238000009826 distribution Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 238000000746 purification Methods 0.000 description 9
- 239000011541 reaction mixture Substances 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 9
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 8
- 238000000862 absorption spectrum Methods 0.000 description 8
- 229910052786 argon Inorganic materials 0.000 description 8
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 8
- 239000000084 colloidal system Substances 0.000 description 8
- 125000000466 oxiranyl group Chemical group 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 230000009467 reduction Effects 0.000 description 7
- CWERGRDVMFNCDR-UHFFFAOYSA-M thioglycolate(1-) Chemical compound [O-]C(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-M 0.000 description 7
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- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 6
- 239000010419 fine particle Substances 0.000 description 6
- 125000000524 functional group Chemical group 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
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- 238000003756 stirring Methods 0.000 description 6
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 5
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Landscapes
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
本発明は、分子内に複数のスルフィド(C−S−C)基を有するポリチオエーテル有機化合物と、ナノ銅粒子又はナノ酸化銅(I)粒子との複合体に関する。更に、チオエーテル含有有機化合物を金属コロイド保護剤として用い、その存在下で銅化合物を還元する、有機化合物とナノ銅粒子との複合体、有機化合物とナノ酸化銅(I)粒子との複合体の製造方法に関する。 The present invention relates to a composite of a polythioether organic compound having a plurality of sulfide (C—S—C) groups in a molecule and nano copper particles or nano copper (I) particles. Furthermore, using a thioether-containing organic compound as a metal colloid protective agent, reducing the copper compound in the presence thereof, a composite of an organic compound and nano-copper particles, a composite of an organic compound and nano-copper (I) particles It relates to a manufacturing method.
電子回路の配線パターンの形成は、現状では専らフォトリソグラフィーに基づく複雑な工程を経て製造されるものであるが、近年開発が進んでいるナノ材料を何らかの媒体に分散させて塗布型配合物とし、これを各種の印刷技術を用いてパターニング、デバイスに組みあげるという塗布型電子デバイス製造技術の開発も進展してきている。このような技術をプリンタブルエレクトロニクスと呼ぶが、この手法には電子回路がroll−to−rollプロセスで大量生産できる可能性があること、オンデマンド性、工程の単純化と省資源が図れることによる経済性などの点から、電子デバイスの製造方法を一変させうる革新的技術として期待されているものである。塗布材料は、ナノ金属粒子またはナノ金属酸化物粒子をインキ化することで調製可能となるので、プリンタブルエレクトロニクスにおける基幹材料はナノ金属(またはナノ金属酸化物)粒子であるといっても過言ではない。そのような観点により、導電性材料としてのナノ銀粒子、ナノ銅粒子の開発は非常に活発で、特に原料が安価でプリント配線としたときにマイグレーションによる断線が起きにくいナノ銅粒子、半導体特性を有するナノ酸化銅(I)粒子には大きな期待が寄せられている。 The formation of the wiring pattern of the electronic circuit is currently produced through a complicated process based exclusively on photolithography, but a nanomaterial that has been developed in recent years is dispersed in some medium to form a coating composition, Development of coating-type electronic device manufacturing technology is also progressing, in which this is patterned into various devices using various printing techniques. Such a technique is called printable electronics, but this method has the possibility that an electronic circuit can be mass-produced by a roll-to-roll process, economy on demand, simplification of processes, and resource saving. It is expected as an innovative technology that can completely change the manufacturing method of electronic devices from the viewpoint of performance. Since the coating material can be prepared by inking nano metal particles or nano metal oxide particles, it is no exaggeration to say that the basic material in printable electronics is nano metal (or nano metal oxide) particles. . From such a viewpoint, the development of nano silver particles and nano copper particles as conductive materials is very active, especially nano copper particles and semiconductor characteristics that are less likely to cause disconnection due to migration when the raw material is inexpensive and printed wiring is used. The nano copper oxide (I) particle which has has great expectation.
一方、電子デバイスの高集積化、電子回路の高密度実装化は、装置の小型化と省エネルギーの観点から常に追求され続ける技術であるが、これに応えるべく配線印刷も極細化が求められている。たとえば、実装用としては、ライン幅およびラインとラインとのスペースが数十μmで、厚みは10μm以下などであり、また、半導体のナノパターニングに用いるためには、30nm程度の線幅を成形しなければならない。従って、これをプリンタブルエレクトロニクスで達成する為には、用いるナノ金属粒子も当然10〜20nm径以下とする必要がある。 On the other hand, high integration of electronic devices and high-density mounting of electronic circuits are technologies that are constantly being pursued from the viewpoint of miniaturization of devices and energy savings. . For example, for mounting, the line width and the space between lines are several tens of μm, the thickness is 10 μm or less, etc. In addition, for use in semiconductor nanopatterning, a line width of about 30 nm is formed. There must be. Therefore, in order to achieve this with printable electronics, the nano metal particles to be used need to have a diameter of 10 to 20 nm or less.
銅の産業上の利用価値は、導電部材だけに留まるものではない。たとえば、酸化銅(I)は、古くは整流器などに用いられたp型半導体であって初歩的な太陽電池の実験にもしばしば用いられてきた(例えば、非特許文献1、2参照)。これをナノ粒子化すれば、探索途上にある金属酸化物p型半導体の塗布型材料の提供に繋がるだけでなく、10nm前後の原子クラスターサイズの微粒子とすることで久保効果(量子サイズ効果/多電子効果)による、バルク粒子では観察され得ない特異な現象が観察されると期待されており、その実用化は大いに検討されるべきであろう。 The industrial utility value of copper is not limited to conductive members. For example, copper (I) oxide is a p-type semiconductor used for rectifiers and the like in the old days, and has often been used for elementary solar cell experiments (for example, see Non-Patent Documents 1 and 2). If this is converted into nanoparticles, not only will it lead to the provision of coating materials for metal oxide p-type semiconductors that are still in the search process, but the Kubo effect (quantum size effect / It is expected that a unique phenomenon that cannot be observed in bulk particles due to the electronic effect) will be observed, and its practical application should be greatly studied.
また、酸化銅(I)は、毒性懸念のある無機材料を代替し、環境負荷の少ない、経済的な太陽電池としても注目が集まる材料である(例えば、非特許文献3、4、5参照)。このような観点から、ナノレベルで構造化・界面制御したホモジャンクション型太陽電池、金属酸化物薄膜太陽電池としての研究もすすめられている(例えば、特許文献1、2参照)。 In addition, copper (I) oxide is a material that has attracted attention as an economical solar cell that substitutes for an inorganic material that is of concern for toxicity and has a low environmental load (see, for example, Non-Patent Documents 3, 4, and 5). . From such a point of view, research on homojunction type solar cells and metal oxide thin film solar cells that are structured and interface-controlled at the nano level is also being promoted (see, for example, Patent Documents 1 and 2).
注目を集めるナノ銅/ナノ酸化銅(I)粒子ではあるが、その実用化には未解決の問題も多い。すなわち、粒子径をナノメートルレベルで制御する合成法、分散安定化、極めて容易に酸化・不均化される性質の抑制、また、導電材料として用いる場合にはナノ銅粒子の融着温度を低下させることも重要な課題である。 Although it is a nano copper / nano copper (I) particle attracting attention, there are many unsolved problems in its practical application. In other words, a synthesis method that controls the particle size at the nanometer level, dispersion stabilization, suppression of properties that are very easily oxidized and disproportionated, and lowering the fusion temperature of nano copper particles when used as a conductive material It is also an important issue.
ナノ銅粒子の製造方法としては、銅化合物(酸化物、ハロゲン化物、カルボン酸塩など)を金属コロイド保護剤の存在下、ヒドラジン水和物等の還元剤を用いて還元し、合成するという液相還元法が一般的である。出発原料を銅(II)化合物にした場合には、還元剤の種類と条件の選択により、1価銅への部分還元が可能であり、銅(I)化合物中間体を経て、還元銅を製造する方法を採用することができる。その工程で得られる銅(I)中間体がコロイド状であって、ナノメートルレベルでの粒径制御ができれば、これ自体が塗布型半導体材料として応用可能である。また、引き続き行なわれる0価銅への還元工程における粒子の肥大化抑制も容易となる。 As a method for producing nano-copper particles, a copper compound (oxide, halide, carboxylate, etc.) is synthesized by reducing and synthesizing with a reducing agent such as hydrazine hydrate in the presence of a metal colloid protective agent. Phase reduction methods are common. When the starting material is a copper (II) compound, partial reduction to monovalent copper is possible by selecting the type and conditions of the reducing agent, and the reduced copper is produced via the copper (I) compound intermediate. The method to do can be adopted. If the copper (I) intermediate obtained in the process is colloidal and the particle size can be controlled at the nanometer level, it can itself be applied as a coating-type semiconductor material. Moreover, it becomes easy to suppress the enlargement of particles in the subsequent reduction step to zero-valent copper.
例えば、貴金属シード(種結晶)を用いて酸化銅(I)の粒径を制御し、続いてヒドラジン水和物で還元することにより、二段階で微細な銅粒子を製造する方法が述べられている(例えば、特許文献3参照)。また、酢酸銅(II)と酢酸銀をヒドロキシルアミン化合物で還元し、先行して生成するナノ銀粒子をシードとして利用することにより微細ナノ酸化銅(I)を得、つづいてナノ銅粒子へと2段階で還元する製造方法も提供されている(例えば、特許文献4参照)。 For example, a method for producing fine copper particles in two stages by controlling the particle size of copper (I) oxide using a noble metal seed (seed crystal) and subsequently reducing with hydrazine hydrate is described. (For example, see Patent Document 3). In addition, copper (II) acetate and silver acetate are reduced with a hydroxylamine compound, and the nano silver particles produced in advance are used as seeds to obtain fine nano copper oxide (I), followed by nano copper particles. A production method in which the reduction is performed in two stages is also provided (for example, see Patent Document 4).
シードを用いずに酸化銅(I)を小粒径に制御する方法として、粒子成長の場を流体工学的な手法で制御する試みもある。例えばマイクロリアクター内の層流領域を反応場として利用する手法(例えば、特許文献5参照。)では、15−20nm程度の酸化銅(I)ができると報告されている。 As a method for controlling copper (I) oxide to a small particle size without using a seed, there is an attempt to control the field of particle growth by a fluid engineering method. For example, it has been reported that copper oxide (I) having a thickness of about 15-20 nm can be produced by a technique using a laminar flow region in a microreactor as a reaction field (see, for example, Patent Document 5).
しかしながら、これらの方法には、幾つかの欠点がある。まず、前二者は粒径制御の為に高価な貴金属シードを必要としている点である。前記特許文献3に記載の方法では、保護剤の選択が限定されるため、得られる粒径が300nm程度と大きく、微細粒子の粒径制御法にはなっていない。また、貴金属シードを添加するため、必ず多元系金属粒子(例えば銀コア銅シェル型粒子)として得られることにもなり、純粋な銅元素の性質を有する材料が得られないことが欠点である。これは、ナノ酸化銅(I)粒子を金属酸化物半導体として応用する場合には致命的といえる。また、シードとして加えた貴金属微粒子が、すべて銅粒子に複合化(例えばコアシェル構造化)されるかどうかは、製造条件と精製結果に依存し、それぞれの単独粒子が混在してしまう可能性があるので、性能のばらつきを生みやすい。一方、流体工学的方法には、多元系粒子となる欠点こそないものの、マイクロリアクター内の層流形成を維持する流量設定が微妙であり、特定の設定範囲に条件を維持せざるを得ない。従って、マスプロダクションにはリアクターを多数用意することでしか対応できないので、甚だ非効率である。 However, these methods have several drawbacks. First, the former two require an expensive noble metal seed for particle size control. In the method described in Patent Document 3, since the selection of the protective agent is limited, the obtained particle size is as large as about 300 nm, which is not a method for controlling the particle size of fine particles. Further, since the noble metal seed is added, it is always obtained as multi-component metal particles (for example, silver core copper shell type particles), and it is a disadvantage that a material having the property of pure copper element cannot be obtained. This is fatal when the nano copper (I) oxide particles are applied as a metal oxide semiconductor. In addition, whether all the precious metal fine particles added as seeds are combined with copper particles (for example, core-shell structure) depends on the manufacturing conditions and the purification results, and each single particle may be mixed. Therefore, it is easy to produce performance variations. On the other hand, although the fluid engineering method does not have the disadvantage of becoming multi-component particles, the flow rate setting for maintaining laminar flow formation in the microreactor is delicate, and the condition must be maintained within a specific setting range. Therefore, mass production can be dealt with only by preparing a large number of reactors, which is very inefficient.
マイクロエマルジョンを反応場とする方法もあるが(例えば、特許文献6参照)、この方法では、まず、酢酸銅(I)と有機アミン化合物から錯化物を調製し、これをアルコール類の溶液とする工程が必要である。これを、水、有機溶媒および界面活性剤から調製したw/oマイクロエマルジョン中に添加して、その中で錯化物を分解することにより微細酸化銅(I)を調製するのであるが、1価の酢酸銅は入手し易い銅塩とは言い難く、操作も煩雑である。 There is also a method using a microemulsion as a reaction field (see, for example, Patent Document 6). In this method, first, a complex is prepared from copper acetate (I) and an organic amine compound, and this is used as a solution of alcohols. A process is required. This is added to a w / o microemulsion prepared from water, an organic solvent and a surfactant, and fine copper oxide (I) is prepared by decomposing the complex in it. The copper acetate is difficult to obtain and is difficult to operate.
上記の実情を鑑みた本発明の課題は、銅化合物を液相中で還元して微細なナノ酸化銅(I)粒子およびナノ銅粒子を製造するのに必須な、粒子成長抑制効果(キャッピング効果)を有し、かつ生成したナノ粒子を媒体中で安定に分散させることができる有機化合物(すなわち金属コロイド保護剤)と、当該ナノ銅粒子、ナノ酸化銅(I)粒子との複合体を提供することであり、とりわけ、粒度分布の狭い10nm以下のナノ酸化銅(I)粒子、又は20nm以下のナノ銅微粒子を含有する複合体を提供することである。更には、それらの簡便な製造方法を提供することである。 In view of the above circumstances, the problem of the present invention is that a particle growth inhibitory effect (capping effect) essential for producing fine nano copper (I) particles and nano copper particles by reducing a copper compound in a liquid phase. A composite of an organic compound (that is, a metal colloid protective agent) that can stably disperse the produced nanoparticles in a medium, and the nanocopper particles and nanocopper oxide (I) particles. In particular, it is to provide a composite containing nano copper (I) particles having a narrow particle size distribution of 10 nm or less or nano copper fine particles of 20 nm or less. Furthermore, it is providing the simple manufacturing method of those.
上記の課題を解決するには、高いキャッピング能力と分散安定化能力を有する金属コロイド保護剤を設計し、ナノ酸化銅(I)やナノ銅粒子の粒径を10〜20nm以下に制御・合成することが必要である。 In order to solve the above problems, a metal colloid protective agent having high capping ability and dispersion stabilizing ability is designed, and the particle size of nano copper oxide (I) or nano copper particles is controlled and synthesized to 10 to 20 nm or less. It is necessary.
本発明者らは、鋭意研究の結果、チオエーテル基(スルフィド結合)を分子内に複数含む特定構造の有機化合物の存在下、銅化合物に還元剤を作用させることで、当該有機化合物で保護された、粒子径が均一かつ非常に小さいナノ酸化銅(I)粒子、およびナノ銅粒子が得られ、得られた粒子/有機化合物複合体が、媒体中で長期間安定な分散状態を保つことを見出し、本発明を完成するに至った。 As a result of diligent research, the present inventors have been protected with an organic compound by allowing a reducing agent to act on a copper compound in the presence of an organic compound having a specific structure containing a plurality of thioether groups (sulfide bonds) in the molecule. Found that nano-copper oxide (I) particles and nano-copper particles having a uniform and very small particle diameter were obtained, and that the obtained particle / organic compound composite maintained a stable dispersion state in a medium for a long period of time. The present invention has been completed.
即ち本発明は、多価チオール化合物との反応により分子中に2つ以上のチオエーテル基を含む下記一般式(1)または一般式(2)で表される構造を有するチオエーテル含有有機化合物(A)と、ナノ銅粒子(B)又はナノ銅粒子(I)粒子(C)とを含有することを特徴とする有機化合物とナノ銅粒子との複合体、又は有機化合物とナノ酸化銅(I)粒子との複合体を提供するものである。 That is, the present invention provides a thioether-containing organic compound (A) having a structure represented by the following general formula (1) or general formula (2) containing two or more thioether groups in the molecule by reaction with a polyvalent thiol compound. And a composite of an organic compound and nanocopper particles, or an organic compound and nanocopper oxide (I) particles, characterized by containing nanocopper particles (B) or nanocopper particles (I) particles (C) And provide a complex.
[X−(OCH2CHR)n−O−CH2−CH(OH)−CH2−S−]mY (1)
[X−(OCH2CHR)n−O−CH2−CH(OH)−CH2−S−R’−]lZ (2)
〔式(1)及び(2)中のXはC1〜C8のアルキル基であり、Rは水素原子又はメチル基であり、nは2〜100の繰り返し数を示す整数であって、Rは繰り返し単位ごとに独立し同一であっても異なっていても良く、Yは硫黄原子と直接結合するものが炭素原子である2〜4価の基であって、C1〜C4の飽和炭化水素基又はC1〜C4の飽和炭化水素基が−O−、−S−若しくは−NHR”−(R”はC1〜C4の飽和炭化水素基である。)で2〜3個連結した基である。式(1)中のmは2〜4の整数である。式(2)中のR’はC2〜C5のアルキルカルボニルオキシ基であり、Zは硫黄原子と直接結合するものが炭素原子である2〜6価の基であって、C2〜C6の飽和炭化水素基、C2〜C6の飽和炭化水素基が−O−、−S−若しくは−NHR”−(R”はC1〜C4の飽和炭化水素基である。)で2〜3個連結した基、又はイソシアヌル酸−N,N’,N”−トリエチレン基であり、lは2〜6の整数である。〕
[X— (OCH 2 CHR) n —O—CH 2 —CH (OH) —CH 2 —S—] m Y (1)
[X— (OCH 2 CHR) n —O—CH 2 —CH (OH) —CH 2 —S—R′—] l Z (2)
[X in the formula (1) and (2) is an alkyl group of C 1 -C 8, R is a hydrogen atom or a methyl radical, n is an integer indicating the number of repetitions of 2 to 100, R May be the same or different for each repeating unit, and Y is a divalent to tetravalent group in which a carbon atom is directly bonded to a sulfur atom, and is a C 1 -C 4 saturated carbonization Two or three hydrogen groups or C 1 -C 4 saturated hydrocarbon groups are connected by —O—, —S— or —NHR ″ — (R ″ is a C 1 to C 4 saturated hydrocarbon group). It is a group. M in Formula (1) is an integer of 2-4. R ′ in the formula (2) is a C 2 to C 5 alkylcarbonyloxy group, Z is a divalent to hexavalent group in which a carbon atom is directly bonded to a sulfur atom, and C 2 to C 6 saturated hydrocarbon groups and C 2 -C 6 saturated hydrocarbon groups are —O—, —S— or —NHR ″ — (R ″ is a C 1 to C 4 saturated hydrocarbon group). ~ 3 linked groups, or isocyanuric acid-N, N ', N "-triethylene group, and l is an integer of 2-6.]
更に本発明は、前記一般式(1)又は一般式(2)で表される構造を有するチオエーテル含有有機化合物(A)の存在下で、銅化合物を還元する、有機化合物とナノ銅粒子との複合体、又は有機化合物とナノ酸化銅(I)粒子との複合体の製造方法をも提供するものである。 Furthermore, the present invention provides an organic compound and a nano copper particle that reduce a copper compound in the presence of the thioether-containing organic compound (A) having the structure represented by the general formula (1) or the general formula (2). The present invention also provides a method for producing a composite or a composite of an organic compound and nano-copper (I) particles.
本発明の有機化合物とナノ銅粒子との複合体、有機化合物とナノ酸化銅(I)粒子との複合体の分散液は、気密、冷蔵保存下で、3月以上の分散安定性が確保できる分散液である。ナノ酸化銅(I)粒子およびナノ銅粒子の平均粒子径は5〜20nmに制御されており、ナノ酸化銅(I)粒子複合体の分散液に、還元剤(例えばグルコース)を添加し、塗膜化した後、不活性ガス雰囲気の下(例えば窒素ガス雰囲気下)で、例えば300℃で30分加熱することにより、10−4Ωcm程度の体積抵抗率を有する銅皮膜を容易に製造することができる。また、ナノ銅粒子複合体から製造した塗膜は、不活性ガス雰囲気の下(例えば、3%水素含有アルゴン雰囲気下)で、例えば250℃で30分加熱することにより、10−5Ωcm程度の体積抵抗率を有する銅皮膜を容易に製造することができ、従って、本発明の有機化合物とナノ銅粒子との複合体、有機化合物とナノ酸化銅(I)粒子との複合体の分散液は、プリンタブルエレクトロニクスに用いられる導電性インクおよび半導体インク、または、導電性接合剤および熱伝導体を提供できる。また、ナノ酸化銅(I)粒子との複合体の分散液からは、光応答性を有する半導体膜の形成も可能である。 The dispersion of the composite of the organic compound and nano-copper particles of the present invention and the composite of the organic compound and nano-copper (I) particles can ensure dispersion stability for 3 months or more under airtight and refrigerated storage. It is a dispersion. The average particle diameter of the nano copper (I) particles and the nano copper particles is controlled to 5 to 20 nm, and a reducing agent (for example, glucose) is added to the dispersion of the nano copper (I) particle composite, After forming into a film, a copper film having a volume resistivity of about 10 −4 Ωcm is easily manufactured by heating at, for example, 300 ° C. for 30 minutes under an inert gas atmosphere (for example, under a nitrogen gas atmosphere). Can do. Moreover, the coating film manufactured from the nano copper particle composite is heated to about 10 −5 Ωcm by heating at 250 ° C. for 30 minutes under an inert gas atmosphere (for example, under an argon atmosphere containing 3% hydrogen). A copper film having a volume resistivity can be easily produced. Therefore, a composite liquid of the organic compound of the present invention and nano-copper particles, and a dispersion of a composite of organic compound and nano-copper oxide (I) particles are A conductive ink and a semiconductor ink used for printable electronics, or a conductive bonding agent and a heat conductor can be provided. In addition, a semiconductor film having photoresponsiveness can be formed from a dispersion of a complex with nano copper (I) particles.
以下、本発明について詳述する。
〔チオエーテル含有有機化合物(A)〕
ナノ銅粒子またはナノ酸化銅(I)粒子が、例えばプリンタブルエレクトロニクス材料として用いる場合に求められる粒径およびその分布、分散安定性、加えてナノ銅粒子については低温融着現象による低抵抗率の発現をこれらに付与するためには、高いキャッピング効果と分散安定化効果を発揮するコロイド保護剤の設計が必要である。そのためには、酸化銅(I)粒子または銅粒子の表面に対して適切に親和する吸着基と、媒体に対して親和しやすい官能基を合わせて有する有機化合物が必要である。
Hereinafter, the present invention will be described in detail.
[Thioether-containing organic compound (A)]
Nano copper particles or nano copper (I) particles, for example, the required particle size and distribution when used as a printable electronics material, dispersion stability, and low resistance due to low-temperature fusion phenomenon for nano copper particles Therefore, it is necessary to design a colloid protective agent that exhibits a high capping effect and a dispersion stabilizing effect. For this purpose, an organic compound having both an adsorbing group having an appropriate affinity for the surface of copper (I) oxide particles or copper particles and a functional group having an affinity for the medium is required.
適切な親和吸着とは、媒体中では金属粒子表面によく吸着しているが、乾燥すると粒子から容易に離脱して、粒子同士の密着を妨げないということである。このような性質を示す化合物をコロイド保護剤として用いなければ、酸化銅(I)粒子からなる均一な半導体膜や低温焼結による高導電性銅薄膜は実現できない。 Appropriate affinity adsorption means that it is well adsorbed on the surface of metal particles in the medium, but is easily detached from the particles when dried and does not hinder the adhesion between the particles. Unless a compound exhibiting such properties is used as a colloid protective agent, a uniform semiconductor film composed of copper (I) oxide particles and a highly conductive copper thin film by low-temperature sintering cannot be realized.
金属表面への親和基としてはチオール基(−SH)が頻用されているが、これは金属とチオラートのような強固な結合を形成するため、脱離性には劣る。そこで鋭意探索の結果、チオエーテル型(R−S−R’)のイオウ官能基含有化合物が、親和性と脱離性とのバランスにおいて好適であることが分かり、これを金属表面への吸着基として選択した。 As an affinity group for the metal surface, a thiol group (-SH) is frequently used, but this forms a strong bond such as a thiolate with the metal, and is inferior in detachability. Thus, as a result of diligent search, it was found that a sulfur functional group-containing compound of the thioether type (RSR ′) is suitable in terms of the balance between affinity and detachment, and this is used as an adsorbing group on the metal surface. Selected.
このような吸着現象は、使用する条件下では吸着速度と脱離速度が同一となる動的吸着平衡に達しているものと理解される。すなわち、吸着官能基が一個しかないコロイド保護剤の場合、ある一分子に着目すれば、粒子表面に吸着している時と吸着していない時があり、このことが総体としては一定の吸着量を示すことになる。従って、吸着官能基が分子内に複数個あるならば、いずれかの吸着基が粒子上にある確率が高くなり、総体としての高い吸着性が示されるようになる。このような考察から、分子内にチオエーテル構造が複数ある化合物をコロイド保護剤として用いれば、ナノ銅粒子又はナノ酸化銅(I)粒子の複合体の分散安定化は優れたものとなると考えた。チオエーテル官能基の数は2〜6であることが取り扱い上、並びに分散安定性の観点から好ましいものである。 It is understood that such an adsorption phenomenon reaches a dynamic adsorption equilibrium where the adsorption rate and the desorption rate are the same under the conditions used. In other words, in the case of a colloid protective agent having only one adsorption functional group, focusing on a single molecule, there are cases where it is adsorbed on the particle surface and when it is not adsorbed. Will be shown. Therefore, if there are a plurality of adsorptive functional groups in the molecule, the probability that any one of the adsorbing groups is on the particle is increased, and a high adsorptivity as a whole is exhibited. From such considerations, it was considered that when a compound having a plurality of thioether structures in the molecule was used as a colloid protective agent, the dispersion stabilization of the composite of nanocopper particles or nanocopper (I) oxide particles would be excellent. The number of thioether functional groups is preferably 2 to 6 from the viewpoint of handling and dispersion stability.
また、本発明において、ナノ銅粒子又はナノ酸化銅(I)粒子を含む複合体の分散安定性に寄与する官能基としては、エチレングリコール及びプロピレングリコールを繰り返し単位として有する鎖状の官能基を選択した。その繰り返し数は、通常2〜100のものを用いることができ、特に7〜50のもの(分子量としては300〜2000程度のもの)がより分散安定性に優れ、好ましい。 In the present invention, as the functional group contributing to the dispersion stability of the composite containing nano copper particles or nano copper (I) oxide particles, a chain functional group having ethylene glycol and propylene glycol as repeating units is selected. did. The number of repetitions is usually 2 to 100, and in particular 7 to 50 (with a molecular weight of about 300 to 2000) is more preferable because of excellent dispersion stability.
前述の、エチレングリコール及びプロピレングリコールを繰り返し単位として有する鎖状の官能基の片末端は非反応性基であって、製造方法や、工業的な入手の容易さ、および保護剤として使用したときの分散安定性の点からは、直鎖状または分岐状の炭素数1〜8のアルキル基であり、特に水性媒体中での安定性の観点から炭素数1〜4のアルキル基であることが好ましい。 One end of the chain-like functional group having ethylene glycol and propylene glycol as a repeating unit as described above is a non-reactive group, and when used as a production method, industrial availability, and a protective agent From the viewpoint of dispersion stability, it is a linear or branched alkyl group having 1 to 8 carbon atoms, and particularly preferably an alkyl group having 1 to 4 carbon atoms from the viewpoint of stability in an aqueous medium. .
以上の検討によって、本発明者がナノ銅粒子又はナノ酸化銅(I)粒子の保護剤として選択したポリマーは下記一般式(1)または一般式(2)の構造を有するものである。
[X−(OCH2CHR)n−O−CH2−CH(OH)−CH2−S−]mY (1)
[X−(OCH2CHR)n−O−CH2−CH(OH)−CH2−S−R’−]lZ (2)
〔式(1)及び(2)中のXはC1〜C8のアルキル基であり、Rは水素原子又はメチル基であり、nは2〜100の繰り返し数を示す整数であって、Rは繰り返し単位ごとに独立し同一であっても異なっていても良く、Yは硫黄原子と直接結合するものが炭素原子である2〜4価の基であって、C1〜C4の飽和炭化水素基又はC1〜C4の飽和炭化水素基が−O−、−S−若しくは−NHR”−(R”はC1〜C4の飽和炭化水素基である。)で2〜3個連結した基である。式(1)中のmは2〜4の整数である。式(2)中のR’はC2〜C5のアルキルカルボニルオキシ基であり、Zは硫黄原子と直接結合するものが炭素原子である2〜6価の基であって、C2〜C6の飽和炭化水素基、C2〜C6の飽和炭化水素基が−O−、−S−若しくは−NHR”−(R”はC1〜C4の飽和炭化水素基である。)で2〜3個連結した基、又はイソシアヌル酸−N,N’,N”−トリエチレン基であり、lは2〜6の整数である。〕
The polymer which the inventor has selected as a protective agent for the nano copper particles or the nano copper oxide (I) particles has the structure represented by the following general formula (1) or general formula (2).
[X— (OCH 2 CHR) n —O—CH 2 —CH (OH) —CH 2 —S—] m Y (1)
[X— (OCH 2 CHR) n —O—CH 2 —CH (OH) —CH 2 —S—R′—] l Z (2)
[X in the formula (1) and (2) is an alkyl group of C 1 -C 8, R is a hydrogen atom or a methyl radical, n is an integer indicating the number of repetitions of 2 to 100, R May be the same or different for each repeating unit, and Y is a divalent to tetravalent group in which a carbon atom is directly bonded to a sulfur atom, and is a C 1 -C 4 saturated carbonization Two or three hydrogen groups or C 1 -C 4 saturated hydrocarbon groups are connected by —O—, —S— or —NHR ″ — (R ″ is a C 1 to C 4 saturated hydrocarbon group). It is a group. M in Formula (1) is an integer of 2-4. R ′ in the formula (2) is a C 2 to C 5 alkylcarbonyloxy group, Z is a divalent to hexavalent group in which a carbon atom is directly bonded to a sulfur atom, and C 2 to C 6 saturated hydrocarbon groups and C 2 -C 6 saturated hydrocarbon groups are —O—, —S— or —NHR ″ — (R ″ is a C 1 to C 4 saturated hydrocarbon group). ~ 3 linked groups, or isocyanuric acid-N, N ', N "-triethylene group, and l is an integer of 2-6.]
これらのうち、Yがエーテル(C−O−C)、チオエーテル(C−S−C)を部分構造として含む構造のもの、R’がメチレンカルボキシ基(−CH2COO−)またはエチレンカルボキシ基(−CH2CH2COO−)であって、Zがエチレン基、2−エチル−2−メチレンプロパン−1,3−ジイル基、2,2−ビスメチレンプロパン−1,3−ジイル基であるものはナノ銅粒子/ナノ酸化銅(I)粒子の保護剤として最も好適である。 Among these, Y has a structure containing ether (C—O—C) and thioether (C—S—C) as a partial structure, and R ′ represents a methylene carboxy group (—CH 2 COO—) or an ethylene carboxy group ( a -CH 2 CH 2 COO-), those wherein Z is an ethylene group, 2-ethyl-2-methylene-1,3-diyl, 2,2-bis-methylene-1,3-diyl Is most suitable as a protective agent for nano copper particles / nano copper (I) oxide particles.
本発明のチオエーテル含有有機化合物(A)は、具体的には、ポリエチレングリコール又はポリプロピレングリコールを有するエポキシドと多価チオール化合物との反応により得られる化合物である。多価チオール化合物としては、下記に示すような化合物を使用することで、前記一般式(1)および一般式(2)で表される構造を有する化合物を容易に得ることができる。 The thioether-containing organic compound (A) of the present invention is specifically a compound obtained by reacting an epoxide having polyethylene glycol or polypropylene glycol with a polyvalent thiol compound. As the polyvalent thiol compound, a compound having a structure represented by the general formula (1) and the general formula (2) can be easily obtained by using a compound as shown below.
〔チオエーテル含有有機化合物(A)の製造方法〕
前述のように、本発明において用いる保護剤は、前記一般式(1)および一般式(2)で表される構造を有する化合物である。この有機化合物(A)を合成する方法について、以下詳述する。
[Method for producing thioether-containing organic compound (A)]
As described above, the protective agent used in the present invention is a compound having a structure represented by the general formula (1) and the general formula (2). The method for synthesizing this organic compound (A) will be described in detail below.
チオエーテル含有有機化合物(A)を簡便に合成する方法としては、グリシジル基を末端に有するポリエーテル化合物(a1)とチオール化合物(a2)とを反応させればよい。前記グリシジル基を末端に有するポリエーテル化合物(a1)は、下記一般式で表すことができる。 As a method for easily synthesizing the thioether-containing organic compound (A), the polyether compound (a1) having a glycidyl group at the terminal and the thiol compound (a2) may be reacted. The polyether compound (a1) having the glycidyl group at the end can be represented by the following general formula.
グリシジル基を末端に有するポリエーテル化合物(a1)の合成方法としては、カリウム第三級ブトキシドを用いてポリエチレン/プロピレングリコールモノメチルエーテルをアルコキシドとし、これとエピクロロヒドリンとを縮合させればよい。 As a method for synthesizing the polyether compound (a1) having a glycidyl group at the terminal, polyethylene / propylene glycol monomethyl ether may be converted into alkoxide using potassium tertiary butoxide, and this may be condensed with epichlorohydrin.
前記グリシジル基を末端に有するポリエーテル化合物(a1)の末端オキシラン環を、チオール化合物(a2)のSH基の求核攻撃により開環させ、目的とするチオエーテル含有有機化合物(A)を得ることができる。この反応については様々な活性化法が知られているが、化合物(A)の収率、反応の位置選択性に優れるフッ化テトラアルキルアンモニウムを触媒とする方法が好ましい(Penso et al.,Synthesis,1994,34−36)。この方法を適用することによって、グリシジル基を末端に有するポリエーテル化合物(a1)とチオール化合物(a2)の反応後、特別な精製を行わなくても、本発明で用いることができるチオエーテル含有有機化合物(A)を収率よく得ることができる。 The target thioether-containing organic compound (A) can be obtained by opening the terminal oxirane ring of the polyether compound (a1) having a glycidyl group at the terminal by nucleophilic attack of the SH group of the thiol compound (a2). it can. Various activation methods are known for this reaction, but a method using a tetraalkylammonium fluoride which is excellent in the yield of the compound (A) and the regioselectivity of the reaction as a catalyst is preferable (Penso et al., Synthesis). 1994, 34-36). By applying this method, a thioether-containing organic compound that can be used in the present invention without any special purification after the reaction of the polyether compound (a1) having a glycidyl group at the terminal and the thiol compound (a2). (A) can be obtained with good yield.
〔有機化合物とナノ酸化銅(I)粒子との複合体〕
本発明の有機化合物とナノ酸化銅(I)粒子との複合体は、前述のチオエーテル含有有機化合物(A)と、ナノメートルオーダーの粒子径を有するナノ酸化銅(I)粒子とを含有するものであって、特には10nm前後の平均粒子径を有するナノ酸化銅(I)粒子がチオエーテル含有有機化合物(A)によって被覆され、全体として粒子状の複合体となっているものである。
[Composite of organic compound and nano copper (I) oxide particles]
The complex of the organic compound of the present invention and nano-copper (I) particles contains the above-mentioned thioether-containing organic compound (A) and nano-copper (I) particles having a nanometer order particle size. In particular, nano-copper oxide (I) particles having an average particle diameter of about 10 nm are coated with the thioether-containing organic compound (A) to form a particulate composite as a whole.
有機化合物とナノ酸化銅(I)粒子との複合体の粒子径や粒子径分布の測定は、透過型電子顕微鏡像(以下、TEMと称する。)で行なうことができる。また、有機化合物とナノ酸化銅(I)粒子との複合体の形状観察も同じくTEMによって行なうことが可能である。粒子状の複合体における粒子径やその分布の測定は、TEM観察と併用して動的光散乱法により行なうことも可能である。 Measurement of the particle size and particle size distribution of a complex of an organic compound and nano copper (I) oxide particles can be performed with a transmission electron microscope image (hereinafter referred to as TEM). In addition, the shape of the complex of the organic compound and nano copper (I) oxide particles can be similarly observed by TEM. Measurement of the particle diameter and its distribution in the particulate composite can also be performed by a dynamic light scattering method in combination with TEM observation.
TEMにより複合体100個の粒子径を求め、その平均粒子径(一次粒子径)を算出すると、およそ5〜20nm、好ましくは5〜15nmの範囲であり、この範囲であれば、これを中間体としてナノ銅粒子を製造した場合にも20〜40nm程度の微細なものが得られる。動的光散乱法で求められる平均粒子径は、TEM観察によって得られる粒子径よりも大きく、100nm程度である。 When the particle diameter of 100 composites is determined by TEM and the average particle diameter (primary particle diameter) is calculated, it is approximately 5 to 20 nm, preferably 5 to 15 nm. Even when nano copper particles are produced, a fine one of about 20 to 40 nm is obtained. The average particle size obtained by the dynamic light scattering method is larger than the particle size obtained by TEM observation and is about 100 nm.
また、後述する精製を行なった後の有機化合物とナノ酸化銅(I)粒子との複合体を乾固して得られる不揮発物について、これを強熱したときの重量減少率を熱重量分析計(TG/DTA法)により測定すると、これをもって複合体中における有機化合物の含有率とみなすことができる。この様にして求められるチオエーテル含有有機化合物(A)の含有率としては、2〜15質量%であるものが種々の応用方法に用いる材料として好適である。 In addition, for a non-volatile material obtained by drying a complex of an organic compound and nano-copper oxide (I) particles after purification, which will be described later, a thermogravimetric analyzer is used to determine the weight loss rate when this is ignited. When measured by (TG / DTA method), this can be regarded as the content of the organic compound in the complex. As a content rate of the thioether containing organic compound (A) calculated | required in this way, what is 2-15 mass% is suitable as a material used for various application methods.
複合体をスライドガラスなどの基板に塗布、乾燥させて生成した皮膜の広角X線回折によると、複合体を構成する金属粒子は1価の酸化銅のみからなることが確認できるので、酸化銅(I)の含有率は不揮発物の重量からTG/DTA法で測定される有機化合物の含有率を差し引いたものと考えて差し支えない。 According to wide-angle X-ray diffraction of a film formed by applying the composite to a substrate such as a glass slide and drying, it can be confirmed that the metal particles constituting the composite consist only of monovalent copper oxide. The content of I) can be considered to be obtained by subtracting the content of the organic compound measured by the TG / DTA method from the weight of the nonvolatile material.
〔有機化合物とナノ銅粒子との複合体〕
本発明の有機化合物とナノ銅粒子との複合体は、前述のチオエーテル含有有機化合物(A)と、ナノメートルオーダーの粒子径を有するナノ銅粒子とを含有するものであって、特には5〜20nmの平均粒子径を有するナノ銅粒子がチオエーテル含有有機化合物(A)によって被覆され、全体として粒子状の複合体となっているものである。
[Composite of organic compound and nano copper particles]
The composite of the organic compound and nanocopper particles of the present invention contains the above-mentioned thioether-containing organic compound (A) and nanocopper particles having a particle diameter of the order of nanometers. Nano copper particles having an average particle diameter of 20 nm are coated with the thioether-containing organic compound (A) to form a particulate composite as a whole.
ナノ銅粒子の粒子径や粒子径分布の測定は、有機化合物とナノ酸化銅(I)粒子との複合体のそれと同じくTEMおよび動的光散乱法によるもので行なうことができ、同様にTG/DTA法により、不揮発物中の有機化合物含有率測定を行なうことができる。この様にして求められるチオエーテル含有有機化合物(A)の含有率として2〜15質量%であるものは、複合体やその分散体を導電性材料等として用いる場合に好適である。 Measurement of the particle size and particle size distribution of the nanocopper particles can be performed by TEM and dynamic light scattering as in the case of the complex of the organic compound and nanocopper oxide (I) particles. By the DTA method, the organic compound content in the non-volatile material can be measured. What is 2-15 mass% as a content rate of the thioether containing organic compound (A) calculated | required in this way is suitable when using a composite_body | complex or its dispersion as an electroconductive material.
広角X線回折によると、複合体を構成する金属粒子は0価の還元銅のみからなることが確認でき、銅(0)の含有率は不揮発物の重量からTG/DTA法で測定される有機化合物の含有率を差し引いたものと考えて差し支えない。 According to wide-angle X-ray diffraction, it can be confirmed that the metal particles constituting the composite are composed only of zero-valent reduced copper, and the content of copper (0) is an organic content measured by the TG / DTA method from the weight of nonvolatiles. It can be considered that the content of the compound is subtracted.
〔有機化合物とナノ酸化銅(I)粒子との複合体、有機化合物とナノ銅粒子との複合体の製造方法〕
本発明の有機化合物とナノ酸化銅(I)粒子との複合体、有機化合物とナノ銅粒子との複合体の製造方法は、前述のチオエーテル含有有機化合物(A)の存在下で、2価の銅イオン化合物を溶媒と混合する工程と、銅イオンを還元する工程と、を有することを特徴とするものである。
[Composite of organic compound and nano-copper (I) particles, production method of composite of organic compound and nano-copper particles]
The method for producing a composite of an organic compound and nano-copper oxide (I) particles of the present invention and a composite of an organic compound and nano-copper particles is a bivalent compound in the presence of the above-mentioned thioether-containing organic compound (A). It has the process of mixing a copper ion compound with a solvent, and the process of reduce | restoring a copper ion, It is characterized by the above-mentioned.
2価の銅イオン化合物としては、一般的に入手可能な銅化合物が利用可能であり、硫酸塩、硝酸塩、カルボン酸塩、炭酸塩、塩化物、アセチルアセトナート錯体等が利用できる。0価のナノ銅粒子との複合体を得る場合には2価の化合物から出発しても1価の化合物から製造してもよく、水分や結晶水を有していても差し支えない。ナノ酸化銅(I)粒子を含む複合体を製造する場合には、2価の銅化合物を部分還元して行えばよい。具体的には、結晶水を除いて表現すれば、CuSO4、Cu(NO3)2、Cu(OAc)2、Cu(CH3CH2COO)2、Cu(HCOO)2、CuCO3、CuCl2、Cu2O、C5H7CuO2などが挙げられる。さらに、上記塩類を加熱したり、塩基性雰囲気に曝したりすることにより得られる塩基性塩、たとえばCu(OAc)2・CuO、Cu(OAc)2・2CuO、Cu2Cl(OH)3等は最も好適に用いることができる。これら塩基性塩は、反応系内で調製してもよいし、反応系外で別途調製したものを使用してもよい。また、アンモニアやアミン化合物を加えて錯体形成し、溶解度を確保してから還元に用いる一般的な方法も適用可能である。 As the divalent copper ion compound, generally available copper compounds can be used, and sulfates, nitrates, carboxylates, carbonates, chlorides, acetylacetonate complexes and the like can be used. When obtaining a complex with zero-valent nano copper particles, it may be produced from a divalent compound or may be produced from a monovalent compound, or it may have water or crystal water. When producing a composite containing nano copper (I) oxide particles, a divalent copper compound may be partially reduced. Specifically, if expressed excluding crystal water, CuSO 4 , Cu (NO 3 ) 2 , Cu (OAc) 2 , Cu (CH 3 CH 2 COO) 2 , Cu (HCOO) 2 , CuCO 3 , CuCl 3 2 , Cu 2 O, C 5 H 7 CuO 2 and the like. Further, basic salts obtained by heating the above salts or exposing them to a basic atmosphere, such as Cu (OAc) 2 .CuO, Cu (OAc) 2 .2CuO, Cu 2 Cl (OH) 3, etc. Most preferably, it can be used. These basic salts may be prepared within the reaction system, or those prepared separately outside the reaction system may be used. Further, a general method can be applied in which ammonia or an amine compound is added to form a complex to ensure solubility and then used for the reduction.
これらの銅イオン化合物を、予めチオエーテル含有有機化合物(A)を溶解又は分散した媒体に溶解、または混合する。このとき用いることができる媒体としては、使用する有機化合物(A)の構造にもよるが、ポリエチレングリコール系の有機化合物(A)を用いて複合体を作製する場合には、水、エタノール、アセトン、エチレングリコール、ジエチレングリコール、グリセリンおよびそれらの混合物が好適に用いられ、水−エチレングリコール混合物は特に好ましい。一方、ポリプロピレングリコール系の有機化合物(A)を用いる場合には、エチレングリコールジメチルエーテル、ジエチレングリコールジメチルエーテル、プロピレングリコールメチルエーテルアセタート、ブチルジエチレングリコールアセタートなどのなどのグライム系溶媒を用いることができる。 These copper ion compounds are dissolved or mixed in a medium in which the thioether-containing organic compound (A) is previously dissolved or dispersed. The medium that can be used at this time depends on the structure of the organic compound (A) to be used, but when a complex is prepared using the polyethylene glycol-based organic compound (A), water, ethanol, acetone , Ethylene glycol, diethylene glycol, glycerin and mixtures thereof are preferably used, and water-ethylene glycol mixtures are particularly preferred. On the other hand, when the polypropylene glycol organic compound (A) is used, glyme solvents such as ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, propylene glycol methyl ether acetate, butyl diethylene glycol acetate and the like can be used.
チオエーテル含有有機化合物(A)の、各種媒体中における濃度としては、引き続き行なう還元反応の制御が容易になる点から、0.3〜10質量%の範囲に調整することが好ましい。 The concentration of the thioether-containing organic compound (A) in various media is preferably adjusted to a range of 0.3 to 10% by mass from the viewpoint of easy control of the subsequent reduction reaction.
上記で調製した媒体中に、前記2価の銅イオン化合物を、一括又は分割して添加し、混合する。溶解しにくい媒体を使用する場合には、予め少量の良溶媒に溶解させておいてから、媒体中に添加する方法であっても良い。 The divalent copper ion compound is added to the medium prepared above in a lump or dividedly and mixed. In the case of using a medium that is difficult to dissolve, a method in which the medium is dissolved in a small amount of a good solvent in advance and then added to the medium may be used.
混合するチオエーテル含有有機化合物(A)と銅イオン化合物との使用割合としては、反応媒体中でのチオエーテル含有有機化合物(A)の保護能力に応じて適宜選択することが好ましいが、通常、銅イオン化合物1molあたりに、チオエーテル含有有機化合物(A)として1mmol〜30mmol(分子量2000のポリマーを用いる場合、2〜60g程度)の範囲で調製し、特に5〜30mmolの範囲で用いることが好ましい。 The proportion of the thioether-containing organic compound (A) and the copper ion compound to be mixed is preferably appropriately selected according to the protective ability of the thioether-containing organic compound (A) in the reaction medium. It is preferably prepared in the range of 1 mmol to 30 mmol (about 2 to 60 g when a polymer having a molecular weight of 2000 is used) as the thioether-containing organic compound (A) per 1 mol of the compound, and particularly preferably in the range of 5 to 30 mmol.
引き続き、銅イオンの還元を、各種還元剤を用いて行なう。還元剤としては、ヒドラジン化合物、ヒドロキシルアミンおよびその誘導体、金属水素化物、ホスフィン酸塩類、アルデヒド類、エンジオール類、ヒドロキシケトン類など、氷冷温から80℃以下の温度で銅の還元反応を進行させることができる化合物であることが、銅鏡や沈殿物形成の少ない複合体を与えるため、好適である。 Subsequently, copper ions are reduced using various reducing agents. As reducing agents, hydrazine compounds, hydroxylamine and its derivatives, metal hydrides, phosphinates, aldehydes, enediols, hydroxyketones, etc., promote the copper reduction reaction at temperatures from ice-cold temperature to 80 ° C or lower. It is preferable that the compound can be a copper mirror or a complex with less precipitate formation.
具体的にはヒドラジン水和物、非対称ジメチルヒドラジン、ヒドロキシルアミン水溶液、水素化ホウ素ナトリウムなどの強力な還元剤である。これらは、銅化合物を0価まで還元する能力を有するので、2価および1価の銅化合物を還元銅とし、有機化合物とナノ銅粒子との複合体を製造する場合に適している。また、ナノ酸化銅(I)粒子を得る場合には、ヒドラジン水和物、非対称ジメチルヒドラジン、またはヒドロキシルアミン水溶液を、添加当量を約四分の1倍モル程度に抑制した上で、ゆっくり添加するか、アスコルビン酸、アセトアルデヒド、ヒロドキシアセトン、N,N−ジエチルヒドロキシルアミンなどを用いて部分還元する。これらの還元剤は、単独で用いてもよいし、複数を組み合わせて使用してもよい。 Specifically, it is a strong reducing agent such as hydrazine hydrate, asymmetric dimethylhydrazine, aqueous hydroxylamine, sodium borohydride and the like. Since these have the ability to reduce the copper compound to zero valence, the divalent and monovalent copper compounds are reduced copper and are suitable for producing a composite of an organic compound and nano-copper particles. In addition, when obtaining nano copper (I) oxide particles, hydrazine hydrate, asymmetric dimethylhydrazine, or an aqueous hydroxylamine solution is slowly added after the addition equivalent is suppressed to about 1 / 4-fold mole. Alternatively, partial reduction is performed using ascorbic acid, acetaldehyde, hydroxyacetone, N, N-diethylhydroxylamine or the like. These reducing agents may be used alone or in combination.
還元反応に適する条件は、原料として用いる銅化合物、還元剤の種類、錯化の有無、媒体、チオエーテル含有有機化合物(A)の種類によって様々である。例えば、水系で酢酸銅(II)を水素化ホウ素ナトリウムで還元する場合には、氷冷程度の温度でも0価のナノ銅粒子が調製できる。一方、ヒドラジン水和物を用いる場合には、室温では反応は遅く、60℃程度に加熱してはじめて円滑な還元反応が起こる。また、アンモニアで錯化した場合には、錯体イオンの酸化還元電位はより貴となるため、さらに20℃程度高温を要するようになる。反応条件の決定においては、そのモニタリングが不可欠である。反応系の色調変化は重要な情報であるが、反応の完結は、反応液または反応液の限外濾過濾液に濃アンモニア水を加えて生成する、アンミン銅イオンの呈色消失によって知ることができる。また、銅イオン試験紙(メルク社メルコクァント1.10003)よると、半定量的な反応率を知ることができる。このようなモニタリングを行いながら反応の終結まで還元反応を行うが、エチレングリコール/水系で酢酸銅を還元する場合には、60℃で2時間程度の反応時間を要する。このようにして還元反応が終了すると、有機化合物とナノ銅粒子との複合体または有機化合物とナノ酸化銅(I)粒子との複合体を含む反応混合物が得られる。 Conditions suitable for the reduction reaction vary depending on the copper compound used as a raw material, the type of reducing agent, the presence or absence of complexation, the medium, and the type of the thioether-containing organic compound (A). For example, when copper (II) acetate is reduced with sodium borohydride in an aqueous system, zero-valent nano copper particles can be prepared even at a temperature of about ice cooling. On the other hand, when hydrazine hydrate is used, the reaction is slow at room temperature, and a smooth reduction reaction occurs only after heating to about 60 ° C. Further, when complexed with ammonia, the redox potential of the complex ion becomes more noble, so that a higher temperature of about 20 ° C. is required. In determining the reaction conditions, monitoring is essential. The color change of the reaction system is important information, but the completion of the reaction can be detected by the disappearance of the color of the ammine copper ion generated by adding concentrated aqueous ammonia to the reaction solution or the ultrafiltration filtrate of the reaction solution. . Further, according to a copper ion test paper (Merck Quant 1.10003, Merck), a semi-quantitative reaction rate can be known. The reduction reaction is carried out until the completion of the reaction while performing such monitoring, but when copper acetate is reduced in an ethylene glycol / water system, a reaction time of about 2 hours at 60 ° C. is required. When the reduction reaction is thus completed, a reaction mixture containing a composite of an organic compound and nanocopper particles or a composite of an organic compound and nanocopper (I) oxide particles is obtained.
〔分散液の製造方法〕
還元反応後は、必要に応じて銅化合物残渣、還元試薬残渣、余剰のチオエーテル含有有機化合物(A)等を除く工程が設けられる。特に余剰のチオエーテル含有有機化合物(A)が多いと、複合体中に含まれているナノ酸化銅(I)粒子又はナノ銅粒子同士の融着を阻害するおそれがあるため、複合体を半導体や導電性材料等として用いる場合には、これらを除く精製工程が必須となる。複合体の精製には、再沈殿、遠心沈降または限外濾過が適用可能であり、得られた複合体を含む反応混合物を洗浄溶媒、例えば水、エタノール、アセトンおよびこれらの混合物によって洗浄することで、前述の不純物を洗い流すことができる。特に、ナノ酸化銅(I)粒子の精製は、錯化剤となる還元剤の量がナノ銅粒子との複合体を含む反応混合物に比べ少ない為、遠心沈降が容易である。
[Method for producing dispersion]
After the reduction reaction, a step of removing a copper compound residue, a reducing reagent residue, an excess thioether-containing organic compound (A) and the like is provided as necessary. In particular, if there is a large amount of the excess thioether-containing organic compound (A), there is a possibility that the nanocopper oxide (I) particles contained in the composite or the fusion between the nanocopper particles may be inhibited. When used as a conductive material or the like, a purification step excluding these is essential. For the purification of the complex, reprecipitation, centrifugal sedimentation or ultrafiltration can be applied, and the reaction mixture containing the resulting complex is washed with a washing solvent such as water, ethanol, acetone and a mixture thereof. The aforementioned impurities can be washed away. In particular, the purification of nano copper (I) oxide particles is easy to perform centrifugal sedimentation because the amount of reducing agent as a complexing agent is smaller than that of a reaction mixture containing a complex with nano copper particles.
精製の最終段階において、複合体に洗浄用溶媒を加える代わりに、使用目的にあわせた溶媒を加え、媒体交換することにより、目的によって選ばれた媒体中に複合体が分散してなる分散体を調製することができる。例えば水、エタノールおよびこれらの混合物を加えれば、乾燥が容易な分散体となり、導電性材料として好適である。 In the final stage of purification, instead of adding a washing solvent to the composite, a solvent that is suitable for the purpose of use is added and the medium is exchanged to obtain a dispersion in which the composite is dispersed in the medium selected according to the purpose. Can be prepared. For example, when water, ethanol and a mixture thereof are added, a dispersion that can be easily dried is obtained, which is suitable as a conductive material.
また、一旦、水またはエタノールに置換した後に、トルエン、ジエチレングリコールジメチルエーテル、プロピレングリコールメチルエーテルアセタート等の水、エタノールより沸点の高い溶媒を加え、続いて水またはエタノールを留去して、非極性溶媒分散体とすることも可能である。この場合は、インクジェット印刷法などへの適用を図ることができる。 In addition, after substituting with water or ethanol, water such as toluene, diethylene glycol dimethyl ether, propylene glycol methyl ether acetate, etc., a solvent having a boiling point higher than ethanol is added, followed by distilling off the water or ethanol to obtain a nonpolar solvent It can also be a dispersion. In this case, application to an inkjet printing method or the like can be achieved.
分散体の濃度は使用目的により様々に調製でき、一般的な塗工用としては5〜40質量%、また、インクジェット印刷用途としては20〜80質量%程度のものが要求されるので、適宜媒体の添加量を加減してその濃度に調製すればよい。このように調製した複合体の分散体は、密閉容器中で保存すれば、調製濃度によらず3月は安定である。 The concentration of the dispersion can be variously prepared depending on the purpose of use, and it is required to be about 5 to 40% by mass for general coating and about 20 to 80% by mass for inkjet printing. What is necessary is just to adjust and adjust the addition amount of to the density | concentration. The composite dispersion prepared in this way is stable for 3 months regardless of the preparation concentration if stored in a closed container.
〔酸化銅(I)皮膜、銅皮膜の製造方法〕
得られた複合体の分散体を、バーコーター(8番)等で基材に塗布し、不活性ガスまたは空気中で乾燥させると、安定な皮膜となる。酸化銅(I)皮膜は、3%水素混合アルゴンガス雰囲気下、300℃,30分加熱した。銅皮膜は不活性ガス雰囲気下で、300℃,30分、または3%水素混合アルゴンガス雰囲気下で250℃,30分加熱した後、比抵抗と膜厚を測定して薄膜の導電性を評価することにより、導電性材料としての評価を行なった。
[Copper (I) oxide film, copper film production method]
When the obtained dispersion of the composite is applied to a substrate with a bar coater (No. 8) or the like and dried in an inert gas or air, a stable film is formed. The copper (I) oxide film was heated at 300 ° C. for 30 minutes in a 3% hydrogen mixed argon gas atmosphere. The copper film was heated in an inert gas atmosphere at 300 ° C. for 30 minutes or in a 3% hydrogen mixed argon gas atmosphere at 250 ° C. for 30 minutes, and then measured for resistivity and film thickness to evaluate the conductivity of the thin film. Thus, evaluation as a conductive material was performed.
還元性雰囲気は水素の他、一酸化炭素、エチレングリコール、グリセリンなどのアルコール蒸気およびそれらの混合物なども用いることができる。アルコール蒸気を用いる場合には250〜300℃程度の加熱が必要となるので、水素、一酸化炭素の方が加熱温度はやや低く、より好ましい。 As the reducing atmosphere, hydrogen, alcohol vapor such as carbon monoxide, ethylene glycol, glycerin, and a mixture thereof can be used. In the case of using alcohol vapor, heating at about 250 to 300 ° C. is required, so that hydrogen and carbon monoxide are more preferable because the heating temperature is slightly lower.
基材は、上記焼成温度に耐えうるものであれば特に制限はないが、ガラス、ポリイミドフィルムはこの用途に用いることができる。 The substrate is not particularly limited as long as it can withstand the firing temperature, but glass and polyimide film can be used for this purpose.
以下、本発明を実施例により説明する。特に断わりのない限り「部」、「%」は質量基準である。 Hereinafter, the present invention will be described with reference to examples. Unless otherwise specified, “part” and “%” are based on mass.
1H−NMRの測定
0.03%テトラメチルシラン含有重クロロホルム約0.8mLに、測定する化合物約20mgを溶かし、これを外径5mmのガラス製NMR測定用サンプル管に入れ、JEOL JNM−LA300型核磁気共鳴吸収スペクトル測定装置により1H−NMRスペクトルを取得した。化学シフト値δは、テトラメチルシランを基準物質として表わした。
Measurement of 1 H-NMR About 20 mg of the compound to be measured was dissolved in about 0.8 mL of 0.03% tetramethylsilane-containing deuterated chloroform, and this was put into a glass NMR measurement sample tube with an outer diameter of 5 mm, and JEOL JNM-LA300 A 1 H-NMR spectrum was obtained by a type nuclear magnetic resonance absorption spectrum measuring apparatus. The chemical shift value δ was expressed using tetramethylsilane as a reference substance.
紫外可視吸収スペクトルの測定
エチレングリコール約10mLに、複合体の分散体1滴を加えて振り混ぜ、直ちに日本分光工業株式会社製MV−2000型フォトダイオードアレイ式紫外可視吸収スペクトル測定装置を用いて、400nm〜800nmまで0.1秒間で掃引して、紫外可視吸収スペクトルを測定した。
Measurement of UV-Vis Absorption Spectra Add about 1 mL of the dispersion of ethylene glycol to about 10 mL of ethylene glycol and shake, and immediately use an MV-2000 type photodiode array type UV-Vis absorption spectrum measuring device manufactured by JASCO Corporation. The ultraviolet-visible absorption spectrum was measured by sweeping from 400 nm to 800 nm in 0.1 second.
銅薄膜の電気抵抗率の測定
得られた皮膜について、表面抵抗率(Ω/□)をロレスタ−GP MCP−T610型低抵抗率計(三菱化学株式会社製)を用い、JIS K7194「導電性プラスチックの4探針法による抵抗率試験」に準拠して測定した。薄膜厚み(cm)と表面抵抗率(Ω/□)から体積抵抗率(Ωcm)を次式により算出した。
Measurement of electrical resistivity of copper thin film About the obtained film, surface resistivity (Ω / □) was measured using a Loresta-GP MCP-T610 type low resistivity meter (manufactured by Mitsubishi Chemical Corporation) and JIS K7194 “Conductive plastic” ”Resistivity test by 4-probe method”. The volume resistivity (Ωcm) was calculated from the following equation from the thin film thickness (cm) and the surface resistivity (Ω / □).
体積抵抗率(Ωcm)=表面抵抗率(Ω/□)×厚み(cm)
なお、皮膜の厚みは、1LM15型走査型レーザー顕微鏡(レーザーテック株式会社製)を用いて計測した。
Volume resistivity (Ωcm) = Surface resistivity (Ω / □) × Thickness (cm)
The thickness of the film was measured using a 1LM15 scanning laser microscope (manufactured by Lasertec Corporation).
粒子径、粒子径分布の測定
透過型電子顕微鏡(TEM)観察
少量の分散体を精製水で希釈し、直ちにその一滴を電子顕微鏡観察用コロジオン膜付銅グリッドに滴下し、これをJEM−2200FS型透過型電子顕微鏡(加速電圧200kV、日本電子株式会社製)を用いて検鏡観察し、得られた写真像から粒子径を計測した。
Measurement of particle size and particle size distribution Transmission electron microscope (TEM) observation Dilute a small amount of dispersion with purified water and immediately drop one drop onto a copper grid with a collodion film for electron microscope observation. This is JEM-2200FS type. Microscopic observation was performed using a transmission electron microscope (acceleration voltage 200 kV, manufactured by JEOL Ltd.), and the particle diameter was measured from the obtained photographic image.
動的光散乱法による粒径分布測定
分散体の一部をエチレングリコールで希釈し、FPAR−1000型濃厚系粒径アナライザー(大塚電子株式会社製)により、粒子径分布、平均粒子径を測定した。このとき、測定を25℃で行い、媒体の屈折率を1.4306、粘度を17.4cPとして解析した。
Particle size distribution measurement by dynamic light scattering method A part of the dispersion was diluted with ethylene glycol, and the particle size distribution and average particle size were measured with an FPAR-1000 type concentrated particle size analyzer (Otsuka Electronics Co., Ltd.). . At this time, the measurement was performed at 25 ° C., and the medium was analyzed with a refractive index of 1.4306 and a viscosity of 17.4 cP.
広角X線回折法
分散体:分散体を液体サンプルホルダーに充填し、直ちにRINT TTR2(50kv、300mA、株式会社リガク製)を用いて回折角(2θ)に対する回折X線の強度を測定した。
Wide-angle X-ray diffraction method Dispersion: The dispersion was filled in a liquid sample holder, and the intensity of the diffracted X-ray with respect to the diffraction angle (2θ) was immediately measured using RINT TTR2 (50 kv, 300 mA, manufactured by Rigaku Corporation).
銅皮膜:銅皮膜付きスライドガラスを適当な大きさに切断して試料台に載せ、直ちにRINT TTR2(50kv、300mA、株式会社リガク製)を用いて回折角(2θ)に対する回折X線の強度を測定、記録した。 Copper film: A glass slide with a copper film is cut to an appropriate size and placed on a sample stage. Immediately using RINT TTR2 (50 kv, 300 mA, manufactured by Rigaku Corporation), the intensity of diffracted X-rays with respect to the diffraction angle (2θ) is measured. Measured and recorded.
熱分析(熱重量分析(TG/DTA法)による銅/酸化銅(I)の含有率
得られた分散体約1mLをガラスサンプル瓶にとり、温水上で窒素気流下加熱濃縮し、残渣を更に40℃、8時間真空乾燥して乾固物を得た。この乾固物およそ5mgを熱重量分析用アルミパンに精密にはかり、EXSTAR TG/DTA6300型示差熱重量分析装置(セイコーインスツル株式会社製)に載せ、窒素気流下、室温から500℃まで毎分10℃の割合で昇温して、加熱に伴う重量減少率を測定した。銅または酸化銅(I)の含有率は以下の式で算出した。
Content of copper / copper (I) oxide by thermal analysis (thermogravimetric analysis (TG / DTA method)) About 1 mL of the obtained dispersion was placed in a glass sample bottle, heated and concentrated in a nitrogen stream on warm water, and the residue further increased to 40 A dried product was obtained by vacuum drying at 8 ° C. for 8 hours, and approximately 5 mg of this dried product was precisely measured on an aluminum pan for thermogravimetric analysis, and an EXSTAR TG / DTA6300 type differential thermogravimetric analyzer (manufactured by Seiko Instruments Inc.). ) And heated at a rate of 10 ° C. per minute from room temperature to 500 ° C. under a nitrogen stream, and the weight loss rate with heating was measured.The content of copper or copper (I) oxide was as follows: Calculated.
含有率(%)=100−重量減少率(%) Content rate (%) = 100-weight reduction rate (%)
合成例1.ポリエチレングリコールメチルグリシジルエーテル(ポリエチレングリコール鎖の分子量2000) Synthesis Example 1 Polyethylene glycol methyl glycidyl ether (molecular weight of polyethylene glycol chain 2000)
1000gの脱水トルエン中に、カリウムt−ブトキシド(100.8g,0.8983mol)を加えて攪拌し、この混合物にポリエチレングリコールモノメチルエーテル(分子量2000,600g)のトルエン(2000g)溶液を、室温で3時間かけて滴下した。このまま室温で2時間攪拌した後、40℃に昇温して更に2時間攪拌した。この混合物に同温度でエピクロルヒドリン(168g,1.82mol)を滴下し、40℃で5.5時間攪拌した。反応混合物を濾過し、濾液を濃縮して得られた残渣にクロロホルムを加えて再び溶かし、これを水で5回洗浄した。クロロホルム層に乾燥アルミナを加えて脱色し、アルミナを濾過し、濾液を濃縮した。濃縮残渣をトルエン/n−ヘキサンにより再沈殿精製し、生じた固体を集めて減圧乾燥すると、標題化合物が507.0g得られた(収率82%)。 To 1000 g of dehydrated toluene, potassium t-butoxide (100.8 g, 0.8983 mol) was added and stirred. To this mixture was added a toluene (2000 g) solution of polyethylene glycol monomethyl ether (molecular weight 2000, 600 g) at room temperature. It was added dropwise over time. After stirring for 2 hours at room temperature, the temperature was raised to 40 ° C. and stirring was continued for 2 hours. Epichlorohydrin (168 g, 1.82 mol) was added dropwise to the mixture at the same temperature, and the mixture was stirred at 40 ° C. for 5.5 hours. The reaction mixture was filtered, and the filtrate was concentrated. The residue obtained was dissolved again by adding chloroform, and this was washed 5 times with water. The chloroform layer was decolorized by adding dry alumina, the alumina was filtered, and the filtrate was concentrated. The concentrated residue was purified by reprecipitation with toluene / n-hexane, and the resulting solid was collected and dried under reduced pressure to obtain 507.0 g of the title compound (yield 82%).
1H−NMR(重クロロホルム):δ=3.9−3.4(m,ポリエチレングリコール鎖他),3.43(dd,1H,J=6.0,5.7Hz,−オキシラン環隣接メチレン水素のうちのひとつ),3.38(s,3H,PEG末端メトキシ基),3.16(m,1H,オキシラン環メチン水素),2.79(m,1H,オキシラン環末端メチレン水素),2.61(m,1H,オキシラン環末端メチレン水素). 1 H-NMR (deuterated chloroform): δ = 3.9-3.4 (m, polyethylene glycol chain, etc.), 3.43 (dd, 1H, J = 6.0, 5.7 Hz, -oxirane ring adjacent methylene One of hydrogen), 3.38 (s, 3H, PEG terminal methoxy group), 3.16 (m, 1H, oxirane ring methine hydrogen), 2.79 (m, 1H, oxirane ring terminal methylene hydrogen), 2.61 (m, 1H, oxirane ring terminal methylene hydrogen).
合成例2.ポリエチレングリコールメチルグリシジルエーテル(ポリエチレングリコール鎖の分子量400) Synthesis Example 2 Polyethylene glycol methyl glycidyl ether (molecular weight of polyethylene glycol chain 400)
合成例1のポリエチレングリコールモノメチルエーテル(分子量2000,600g)のかわりに、ポリエチレングリコールモノメチルエーテル(分子量400,90g)として、他は合成例1と同様に操作すると、標題化合物が96g得られた(収率94%)。 96 g of the title compound was obtained by operating in the same manner as in Synthesis Example 1 except that polyethylene glycol monomethyl ether (molecular weight: 400, 90 g) was used instead of polyethylene glycol monomethyl ether (molecular weight: 2000, 600 g) of Synthesis Example 1. 94%).
1H−NMR(重クロロホルム):δ=3.9−3.4(m,ポリエチレングリコール鎖他),3.55(dd,1H,J=6.0,5.7Hz,オキシラン環隣接メチレン水素のうちのひとつ),3.38(s,3H,PEG末端メトキシ基),3.17(m,1H,オキシラン環メチン水素),2.79(m,1H,オキシラン環末端メチレン水素),2.61(m,1H,オキシラン環末端メチレン水素). 1 H-NMR (deuterated chloroform): δ = 3.9-3.4 (m, polyethylene glycol chain, etc.), 3.55 (dd, 1H, J = 6.0, 5.7 Hz, oxirane ring adjacent methylene hydrogen 1), 3.38 (s, 3H, PEG terminal methoxy group), 3.17 (m, 1H, oxirane ring methine hydrogen), 2.79 (m, 1H, oxirane ring terminal methylene hydrogen), 2 61 (m, 1H, oxirane ring terminal methylene hydrogen).
合成例3.チオエーテル含有有機化合物(A−1)
エチレン=ビス(3−(メトキシ(ポリエトキシ)エトキシ)−2−ヒドロキシプロピルスルファニルプロピオナート)
(ポリエチレングリコールメチルグリシジルエーテル(ポリエチレングリコール鎖の分子量2000)のエチレングリコールビス(メルカプトプロピオナート)による開環付加化合物)
Synthesis Example 3 Thioether-containing organic compound (A-1)
Ethylene bis (3- (methoxy (polyethoxy) ethoxy) -2-hydroxypropylsulfanylpropionate)
(Ring-opening addition compound of polyethylene glycol methyl glycidyl ether (polyethylene glycol chain molecular weight 2000) with ethylene glycol bis (mercaptopropionate))
合成例1で得られたポリエチレングリコールメチルグリシジルエーテル(メトキシポリエチレングリコールの分子量2000,5.01g)に、エチレングリコール=ビス(メルカプトプロピオナート)(325mg,1.23mmol)および1mol/Lテトラブチルアンモニウムフルオリド/テトラヒドロフラン溶液(121μL,0.12mmol)を加えた後昇温し、70〜75℃で1時間攪拌した。冷却後、この混合物に水50mLと酢酸エチル50mLを加えて良く攪拌し、静置分液した。その後、更に水層を酢酸エチル(50mL)で2回洗浄した。水層に硫酸ナトリウムを加えると、油状物が析出したので、これを塩化メチレン(50mL×3回)で抽出した。塩化メチレン層を集めて、無水硫酸ナトリウムで乾燥した後、濃縮乾固すると4.29gの標題チオエーテル含有有機化合物(A−1)が得られた(収率約81%)。1H−NMRから、特段の精製が不要な純度であった。 To the polyethylene glycol methyl glycidyl ether (molecular weight of methoxypolyethylene glycol 2000, 5.01 g) obtained in Synthesis Example 1, ethylene glycol bis (mercaptopropionate) (325 mg, 1.23 mmol) and 1 mol / L tetrabutylammonium After adding a fluoride / tetrahydrofuran solution (121 μL, 0.12 mmol), the temperature was raised, and the mixture was stirred at 70 to 75 ° C. for 1 hour. After cooling, 50 mL of water and 50 mL of ethyl acetate were added to this mixture and stirred well, followed by liquid separation for standing. Thereafter, the aqueous layer was further washed twice with ethyl acetate (50 mL). When sodium sulfate was added to the aqueous layer, an oily substance was precipitated, and this was extracted with methylene chloride (50 mL × 3 times). The methylene chloride layer was collected, dried over anhydrous sodium sulfate, and concentrated to dryness to obtain 4.29 g of the title thioether-containing organic compound (A-1) (yield: about 81%). From 1 H-NMR, the purity required no special purification.
1H−NMR(重クロロホルム):δ=4.32(t,4H,エステル隣接エチレン基),3.9−3.4(m,ポリエチレングリコール鎖他),3.38(s,6H,PEG末端メトキシ基),2.83(m,4H,チオール化合物側S隣接メチレン基),2.66(m,8H,ポリエーテル化合物側S隣接メチレン基,エステルカルボニル基α位メチレン基). 1 H-NMR (deuterated chloroform): δ = 4.32 (t, 4H, ester adjacent ethylene group), 3.9-3.4 (m, polyethylene glycol chain, etc.), 3.38 (s, 6H, PEG Terminal methoxy group), 2.83 (m, 4H, thiol compound side S adjacent methylene group), 2.66 (m, 8H, polyether compound side S adjacent methylene group, ester carbonyl group α-position methylene group).
合成例4.チオエーテル含有有機化合物(A−2)
エチレン=ビス(3−(メトキシ(ポリエトキシ)エトキシ)−2−ヒドロキシプロピルスルファニルアセタート)
(ポリエチレングリコールメチルグリシジルエーテル(ポリエチレングリコール鎖の分子量400)のエチレングリコールビス(メルカプトアセタート)による開環付加化合物)
Synthesis Example 4 Thioether-containing organic compound (A-2)
Ethylene = bis (3- (methoxy (polyethoxy) ethoxy) -2-hydroxypropylsulfanyl acetate)
(Ring-opening addition compound of polyethylene glycol methyl glycidyl ether (molecular weight of polyethylene glycol chain 400) with ethylene glycol bis (mercaptoacetate))
合成例2で得られたポリエチレングリコールメチルグリシジルエーテル(メトキシポリエチレングリコールの分子量400,5.02g)に、ビス(メルカプト酢酸)エチレングリコール(1.11g,5.30mmol)および1mol/Lテトラブチルアンモニウムフルオリド/テトラヒドロフラン溶液(0.53mL,0.53mmol)を加え、室温で1時間攪拌した。この混合物に水50mLと酢酸エチル50mLを加えて良く攪拌し、静置分液した。その後、更に水層を酢酸エチル(50mL)で2回洗浄した。水層に硫酸ナトリウムを加えると、油状物が析出したので、これを塩化メチレン(50mL×3回)で抽出した。塩化メチレン層を集めて、無水硫酸ナトリウムで乾燥した後、濃縮乾固すると5.35gの標題チオエーテル含有有機化合物(A−2)が得られた(収率約87%)。1H−NMRから、特段の精製が不要な純度であった。 Polyethylene glycol methyl glycidyl ether (molecular weight 400, 5.02 g of methoxypolyethylene glycol) obtained in Synthesis Example 2 was added to bis (mercaptoacetic acid) ethylene glycol (1.11 g, 5.30 mmol) and 1 mol / L tetrabutylammonium fluoride. A solution of tetrahydrofuran / tetrahydrofuran (0.53 mL, 0.53 mmol) was added, and the mixture was stirred at room temperature for 1 hour. To this mixture, 50 mL of water and 50 mL of ethyl acetate were added and stirred well, followed by liquid separation for standing. Thereafter, the aqueous layer was further washed twice with ethyl acetate (50 mL). When sodium sulfate was added to the aqueous layer, an oily substance was precipitated, and this was extracted with methylene chloride (50 mL × 3 times). The methylene chloride layer was collected, dried over anhydrous sodium sulfate, and concentrated to dryness to obtain 5.35 g of the title thioether-containing organic compound (A-2) (yield: about 87%). From 1 H-NMR, the purity required no special purification.
1H−NMR(重クロロホルム):δ=4.33(t,4H,エステル隣接エチレン基),3.9−3.5(m,ポリエチレングリコール鎖他),3.38(s,6H,PEG末端メトキシ基),3.33(s,4H,チオール化合物側S隣接メチレン基),2.75(m,4H,ポリエーテル化合物側S隣接メチレン基他). 1 H-NMR (deuterated chloroform): δ = 4.33 (t, 4H, ester adjacent ethylene group), 3.9-3.5 (m, polyethylene glycol chain, etc.), 3.38 (s, 6H, PEG Terminal methoxy group), 3.33 (s, 4H, thiol compound side S adjacent methylene group), 2.75 (m, 4H, polyether compound side S adjacent methylene group, etc.).
合成例5.チオエーテル含有有機化合物(A−3)
エチレン=ビス(3−(メトキシ(ポリエトキシ)エトキシ)−2−ヒドロキシプロピルスルファニルプロピオナート)
(ポリエチレングリコールメチルグリシジルエーテル(ポリエチレングリコール鎖の分子量400)のエチレングリコール ビス(メルカプトプロピオン酸)による開環付加化合物)
Synthesis Example 5 Thioether-containing organic compound (A-3)
Ethylene bis (3- (methoxy (polyethoxy) ethoxy) -2-hydroxypropylsulfanylpropionate)
(Ring-opening addition compound of polyethylene glycol methyl glycidyl ether (molecular weight of polyethylene glycol chain 400) with ethylene glycol bis (mercaptopropionic acid))
合成例4のエチレングリコール=ビス(メルカプトアセタート)(1.11g,5.30mmol)のかわりにエチレングリコール=ビス(メルカプトプロピオナート)(1.41g,5.61mmol)とし、他は合成例4と同様にしておこなうと、5.44gの標題チオエーテル含有有機化合物(A−3)が得られた(収率約87%)。 Instead of ethylene glycol bis (mercaptoacetate) (1.11 g, 5.30 mmol) in Synthesis Example 4, ethylene glycol = bis (mercaptopropionate) (1.41 g, 5.61 mmol) was used, and the others were synthesis examples. In the same manner as in No. 4, 5.44 g of the title thioether-containing organic compound (A-3) was obtained (yield: about 87%).
1H−NMR(重クロロホルム):δ=4.27(t,4H,エステル隣接エチレン基),3.9−3.5(m,ポリエチレングリコール鎖他),3.35(s,6H,PEG末端メトキシ基),2.81(m,4H,チオール化合物側S隣接メチレン基),2.63(m,8H,ポリエーテル化合物側S隣接メチレン基,エステルカルボニル基α位メチレン基他). 1 H-NMR (deuterated chloroform): δ = 4.27 (t, 4H, ester adjacent ethylene group), 3.9-3.5 (m, polyethylene glycol chain, etc.), 3.35 (s, 6H, PEG Terminal methoxy group), 2.81 (m, 4H, thiol compound side S adjacent methylene group), 2.63 (m, 8H, polyether compound side S adjacent methylene group, ester carbonyl group α-position methylene group, etc.).
合成例6.チオエーテル含有有機化合物(A−4)
テトラメチレン=ビス(3−(メトキシ(ポリエトキシ)エトキシ)−2−ヒドロキシプロピルスルファニルアセタート)
(ポリエチレングリコールメチルグリシジルエーテル(ポリエチレングリコール鎖の分子量400)の1,4−ブタンジオール=ビス(メルカプトアセタート)による開環付加化合物)
Synthesis Example 6 Thioether-containing organic compound (A-4)
Tetramethylene bis (3- (methoxy (polyethoxy) ethoxy) -2-hydroxypropylsulfanyl acetate)
(Ring-opening addition compound of 1,4-butanediol = bis (mercaptoacetate) of polyethylene glycol methyl glycidyl ether (molecular weight of polyethylene glycol chain 400))
合成例4のエチレングリコール=ビス(メルカプトアセタート)(1.11g,5.30mmol)のかわりに1,4−ブタンジオール ビス(メルカプトタート)(1.32g,5.41mmol)とし、他は合成例4と同様にしておこなうと、5.56gの標題チオエーテル含有有機化合物(A−4)が得られた(収率約89%)。 Instead of ethylene glycol bis (mercaptoacetate) (1.11 g, 5.30 mmol) in Synthesis Example 4, 1,4-butanediol bis (mercaptotate) (1.32 g, 5.41 mmol) was used, and the others were synthesized. When carried out in the same manner as in Example 4, 5.56 g of the title thioether-containing organic compound (A-4) was obtained (yield: about 89%).
1H−NMR(重クロロホルム):δ=4.14(t,4H,エステル隣接メチレン基),4.0−3.5(m,ポリエチレングリコール鎖他),3.36(s,6H,PEG末端メトキシ基),3.29(s,4H,チオール化合物側S隣接メチレン基),2.73(m,4H,ポリエーテル化合物側S隣接メチレン基),1.72(m,4H,エステル酸素β位メチレン基). 1 H-NMR (deuterated chloroform): δ = 4.14 (t, 4H, ester adjacent methylene group), 4.0-3.5 (m, polyethylene glycol chain, etc.), 3.36 (s, 6H, PEG Terminal methoxy group), 3.29 (s, 4H, thiol compound side S adjacent methylene group), 2.73 (m, 4H, polyether compound side S adjacent methylene group), 1.72 (m, 4H, ester oxygen) β-position methylene group).
合成例7.チオエーテル含有有機化合物(A−5)
テトラメチレン=ビス(3−(メトキシ(ポリエトキシ)エトキシ)−2−ヒドロキシプロピルスルファニルプロピオナート)
(ポリエチレングリコールメチルグリシジルエーテル(ポリエチレングリコール鎖の分子量400)の1,4−ブタンジオール=ビス(メルカプトプロピオナート)による開環付加化合物)
Synthesis Example 7 Thioether-containing organic compound (A-5)
Tetramethylene bis (3- (methoxy (polyethoxy) ethoxy) -2-hydroxypropylsulfanylpropionate)
(Ring-opening addition compound of 1,4-butanediol = bis (mercaptopropionate) of polyethylene glycol methyl glycidyl ether (molecular weight of polyethylene glycol chain 400))
合成例4のエチレングリコール=ビス(メルカプトアセテート)(1.11g,5.30mmol)のかわりに1,4−ブタンジオール=ビス(メルカプトプロピオン酸)エステル(1.51g,5.38mmol)とし、他は合成例4と同様にしておこなうと、5.81gの標題チオエーテル含有有機化合物(A−5)が得られた(収率約90%)。 1,4-butanediol = bis (mercaptopropionic acid) ester (1.51 g, 5.38 mmol) instead of ethylene glycol bis (mercaptoacetate) (1.11 g, 5.30 mmol) in Synthesis Example 4, and others Was carried out in the same manner as in Synthesis Example 4, and 5.81 g of the title thioether-containing organic compound (A-5) was obtained (yield: about 90%).
1H−NMR(重クロロホルム):δ=4.11(t,4H,エステル隣接メチレン基),3.7−3.5(m,ポリエチレングリコール鎖他),3.35(s,6H,PEG末端メトキシ基),2.81(m,4H,チオール化合物側S隣接メチレン基),2.62(m,8H,ポリエーテル化合物側S隣接メチレン基,エステルカルボニル基α位メチレン基),1.69(m,4H,エステル酸素β位メチレン基). 1 H-NMR (deuterated chloroform): δ = 4.11 (t, 4H, ester adjacent methylene group), 3.7-3.5 (m, polyethylene glycol chain, etc.), 3.35 (s, 6H, PEG Terminal methoxy group), 2.81 (m, 4H, thiol compound side S adjacent methylene group), 2.62 (m, 8H, polyether compound side S adjacent methylene group, ester carbonyl group α-position methylene group), 1. 69 (m, 4H, ester oxygen β-position methylene group).
合成例8.チオエーテル含有有機化合物(A−6)
2−エチル−2−(3−(メトキシ(ポリエトキシ)エトキシ)−2−ヒドロキシプロピルスルファニルアセトキシメチル)プロパン−1,3−ジイル=ビス(3−(メトキシ(ポリエトキシ)エトキシ)−2−ヒドロキシプロピルスルファニルアセタート)
(ポリエチレングリコールメチルグリシジルエーテル(ポリエチレングリコール鎖の分子量400)のトリメチロールプロパン=トリス(メルカプトアセタート)による開環付加化合物)
Synthesis Example 8 Thioether-containing organic compound (A-6)
2-ethyl-2- (3- (methoxy (polyethoxy) ethoxy) -2-hydroxypropylsulfanylacetoxymethyl) propane-1,3-diyl bis (3- (methoxy (polyethoxy) ethoxy) -2-hydroxypropylsulfanyl Acetate)
(Ring-opening addition compound of polyethylene glycol methyl glycidyl ether (molecular weight of polyethylene glycol chain 400) with trimethylolpropane = tris (mercaptoacetate))
合成例4のエチレングリコール=ビス(メルカプトアセタート)(1.11g,5.30mmol)のかわりにトリメチロールプロパン=トリス(メルカプトアセタート)(1.12g,2.95mmol)とし、他は合成例4と同様にしておこなうと、5.33gの標題チオエーテル含有有機化合物(A−6)が得られた(収率約85%)。 Instead of ethylene glycol bis (mercaptoacetate) (1.11 g, 5.30 mmol) in Synthesis Example 4, trimethylolpropane = tris (mercaptoacetate) (1.12 g, 2.95 mmol) was used. When conducted in the same manner as in No. 4, 5.33 g of the title thioether-containing organic compound (A-6) was obtained (yield: about 85%).
1H−NMR(重クロロホルム):δ=4.10(s,6H,エステル隣接メチレン基),3.9−3.5(m,ポリエチレングリコール鎖他),3.37(s,9H,PEG末端メトキシ基),3.33(s,6H,チオール化合物側S隣接メチレン基),2.75(m,6H,ポリエーテル化合物側S隣接メチレン基),1.51(q,2H,末端エチルメチレン基),0.91(t,3H,末端エチルメチル基). 1 H-NMR (deuterated chloroform): δ = 4.10 (s, 6H, ester adjacent methylene group), 3.9-3.5 (m, polyethylene glycol chain, etc.), 3.37 (s, 9H, PEG Terminal methoxy group), 3.33 (s, 6H, thiol compound side S adjacent methylene group), 2.75 (m, 6H, polyether compound side S adjacent methylene group), 1.51 (q, 2H, terminal ethyl) Methylene group), 0.91 (t, 3H, terminal ethylmethyl group).
合成例9.チオエーテル含有有機化合物(A−7)
2−エチル−2−(3−(メトキシ(ポリエトキシ)エトキシ)−2−ヒドロキシプロピルスルファニルプロパノイルオキシメチル)プロパン−1,3−ジイル=ビス(3−(メトキシ(ポリエトキシ)エトキシ)−2−ヒドロキシプロピルスルファニルプロピオナート)
(ポリエチレングリコールメチルグリシジルエーテル(ポリエチレングリコール鎖の分子量400)のトリメチロールプロパン=トリス(メルカプトプロピオナート)による開環付加化合物)
Synthesis Example 9 Thioether-containing organic compound (A-7)
2-ethyl-2- (3- (methoxy (polyethoxy) ethoxy) -2-hydroxypropylsulfanylpropanoyloxymethyl) propane-1,3-diyl-bis (3- (methoxy (polyethoxy) ethoxy) -2-hydroxy Propylsulfanylpropionate)
(Ring-Opening Addition Compound of Polyethylene Glycol Methyl Glycidyl Ether (Polyethylene Glycol Chain Molecular Weight 400) with Trimethylolpropane = Tris (Mercaptopropionate))
合成例4のエチレングリコール=ビス(メルカプトアセタート)(1.11g,5.30mmol)のかわりにトリメチロールプロパン=トリス(メルカプトプロピオナート)(1.66g,4.03mmol)とし、他は合成例4と同様にしておこなうと、5.88gの標題チオエーテル含有有機化合物(A−7)が得られた(収率約92%)。 Instead of ethylene glycol bis (mercaptoacetate) (1.11 g, 5.30 mmol) in Synthesis Example 4, trimethylolpropane = tris (mercaptopropionate) (1.66 g, 4.03 mmol) was used. When carried out in the same manner as in Example 4, 5.88 g of the title thioether-containing organic compound (A-7) was obtained (yield: about 92%).
1H−NMR(重クロロホルム):δ=4.06(s,4H,エステル隣接エチレン基),3.9−3.5(m,ポリエチレングリコール鎖他),3.37(s,9H,PEG末端メトキシ基),2.82(t,6H,チオール化合物側S隣接メチレン基),2.66(m,12H,ポリエーテル化合物側S隣接メチレン基,エステルカルボニル基α位メチレン基),1.49(q,2H,末端エチルメチレン基),0.89(t,3H,末端エチルメチル基). 1 H-NMR (deuterated chloroform): δ = 4.06 (s, 4H, ester adjacent ethylene group), 3.9-3.5 (m, polyethylene glycol chain, etc.), 3.37 (s, 9H, PEG Terminal methoxy group), 2.82 (t, 6H, thiol compound side S adjacent methylene group), 2.66 (m, 12H, polyether compound side S adjacent methylene group, ester carbonyl group α-position methylene group), 1. 49 (q, 2H, terminal ethylmethylene group), 0.89 (t, 3H, terminal ethylmethyl group).
合成例10.チオエーテル含有有機化合物(A−8)
2,2−ビス((3−(メトキシ(ポリエトキシ)エトキシ)−2−ヒドロキシプロピルスルファニルアセトキシメチル)プロパン−1,3−ジイル=ビス((3−(メトキシ(ポリエトキシ)エトキシ)−2−ヒドロキシプロピルスルファニルアセタート)
(ポリエチレングリコールメチルグリシジルエーテル(ポリエチレングリコール鎖の分子量400)のペンタエリトリトール=テトラキス(メルカプトアセタート)による開環付加化合物)
Synthesis Example 10 Thioether-containing organic compound (A-8)
2,2-bis ((3- (methoxy (polyethoxy) ethoxy) -2-hydroxypropylsulfanylacetoxymethyl) propane-1,3-diyl bis ((3- (methoxy (polyethoxy) ethoxy) -2-hydroxypropyl Sulfanyl acetate)
(Ring-opening addition compound of polyethylene glycol methylglycidyl ether (molecular weight of polyethylene glycol chain 400) with pentaerythritol = tetrakis (mercaptoacetate))
合成例4のエチレングリコール=ビス(メルカプトアセタート)(1.11g,5.30mmol)のかわりにペンタエリトリトール=テトラキス(メルカプトアセタート)(1.21g,2.79mmol)とし、他は合成例4と同様にしておこなうと、5.33gの標題チオエーテル含有有機化合物(A−8)が得られた(収率約86%)。 Instead of ethylene glycol = bis (mercaptoacetate) (1.11 g, 5.30 mmol) in Synthesis Example 4, pentaerythritol = tetrakis (mercaptoacetate) (1.21 g, 2.79 mmol) was used. In the same manner as above, 5.33 g of the title thioether-containing organic compound (A-8) was obtained (yield: about 86%).
1H−NMR(重クロロホルム):δ=4.21(s,8H,エステル隣接メチレン基),3.9−3.5(m,ポリエチレングリコール鎖他),3.36(s,12H,PEG末端メトキシ基),3.35(s,8H,チオール化合物側S隣接メチレン基),2.73(m,8H,ポリエーテル化合物側S隣接メチレン基). 1 H-NMR (deuterated chloroform): δ = 4.21 (s, 8H, ester adjacent methylene group), 3.9-3.5 (m, polyethylene glycol chain, etc.), 3.36 (s, 12H, PEG Terminal methoxy group), 3.35 (s, 8H, thiol compound side S adjacent methylene group), 2.73 (m, 8H, polyether compound side S adjacent methylene group).
合成例11.チオエーテル含有有機化合物(A−9)
2,2−ビス((3−(メトキシ(ポリエトキシ)エトキシ)−2−ヒドロキシプロピルスルファニルプロパノイルオキシメチル)プロパン−1,3−ジイル=ビス((3−(メトキシ(ポリエトキシ)エトキシ)−2−ヒドロキシプロピルスルファニルプロピオナート)
(ポリエチレングリコールメチルグリシジルエーテル(ポリエチレングリコール鎖の分子量400)のペンタエリトリトール=テトラキス(メルカプトプロピオナート)による開環付加化合物
Synthesis Example 11 Thioether-containing organic compound (A-9)
2,2-bis ((3- (methoxy (polyethoxy) ethoxy) -2-hydroxypropylsulfanylpropanoyloxymethyl) propane-1,3-diyl bis ((3- (methoxy (polyethoxy) ethoxy) -2- Hydroxypropylsulfanylpropionate)
Ring Opening Addition Compound of Polyethylene Glycol Methyl Glycidyl Ether (Molecular Weight of Polyethylene Glycol Chain 400) with Pentaerythritol = Tetrakis (Mercaptopropionate)
合成例4のエチレングリコール=ビス(メルカプトアセタート)(1.11g,5.30mmol)のかわりにペンタエリトリトール=テトラキス(メルカプトプロピオナート)(1.37g,2.68mmol)とし、他は合成例4と同様にしておこなうと、5.61gの標題チオエーテル含有有機化合物(A−9)が得られた(収率約89%)。 Instead of ethylene glycol = bis (mercaptoacetate) (1.11 g, 5.30 mmol) in Synthesis Example 4, pentaerythritol = tetrakis (mercaptopropionate) (1.37 g, 2.68 mmol) was used. In the same manner as in Example 4, 5.61 g of the title thioether-containing organic compound (A-9) was obtained (yield: about 89%).
1H−NMR(重クロロホルム):δ=4.17(s,4H,エステル隣接エチレン基),3.9−3.5(m,ポリエチレングリコール鎖他),3.35(s,12H,PEG末端メトキシ基),2.82(t,8H,チオール化合物側S隣接メチレン基),2.66(m,16H,ポリエーテル化合物側S隣接メチレン基,エステルカルボニル基α位メチレン基). 1 H-NMR (deuterated chloroform): δ = 4.17 (s, 4H, ester adjacent ethylene group), 3.9-3.5 (m, polyethylene glycol chain, etc.), 3.35 (s, 12H, PEG Terminal methoxy group), 2.82 (t, 8H, thiol compound side S adjacent methylene group), 2.66 (m, 16H, polyether compound side S adjacent methylene group, ester carbonyl group α-position methylene group).
合成例12.チオエーテル含有有機化合物(A−10)
1,2−ビス(3−(メトキシ(ポリエトキシ)エトキシ)−2−ヒドロキシプロピルスルファニル)エタン
(ポリエチレングリコールメチルグリシジルエーテル(ポリエチレングリコール鎖の分子量400)の1,2−エタンジチオールによる開環付加化合物)
Synthesis Example 12 Thioether-containing organic compound (A-10)
1,2-bis (3- (methoxy (polyethoxy) ethoxy) -2-hydroxypropylsulfanyl) ethane (polyethylene glycol methylglycidyl ether (polyethylene glycol chain molecular weight 400) ring-opening addition compound with 1,2-ethanedithiol)
合成例4のエチレングリコール=ビス(メルカプトアセタート)(1.11g,5.30mmol)のかわりに1,2−エタンジチオール(0.488g,5.18mmol)とし、他は合成例4と同様にしておこなうと、4.80gの標題チオエーテル含有有機化合物(A−10)が得られた(収率約87%)。 Instead of ethylene glycol bis (mercaptoacetate) (1.11 g, 5.30 mmol) in Synthesis Example 4, 1,2-ethanedithiol (0.488 g, 5.18 mmol) was used, and the others were the same as in Synthesis Example 4. Then, 4.80 g of the title thioether-containing organic compound (A-10) was obtained (yield: about 87%).
1H−NMR(重クロロホルム):δ=3.9−3.4(m,ポリエチレングリコール鎖他),3.35(s,6H,PEG末端メトキシ基),2.78(t,4H,チオール化合物側S隣接メチレン基),2.66(m,4H,ポリエーテル化合物側S隣接メチレン基). 1 H-NMR (deuterated chloroform): δ = 3.9-3.4 (m, polyethylene glycol chain, etc.), 3.35 (s, 6H, PEG terminal methoxy group), 2.78 (t, 4H, thiol) Compound side S adjacent methylene group), 2.66 (m, 4H, polyether compound side S adjacent methylene group).
合成例13.チオエーテル含有有機化合物(A−11)
1,9−ビス(3−(メトキシ(ポリエトキシ)エトキシ)−2−ヒドロキシプロピルスルファニル)−3,7−ジチアノナン
(ポリエチレングリコールメチルグリシジルエーテル(ポリエチレングリコール鎖の分子量400)の3,7−ジチア−1,9−ノナンジチオールによる開環付加化合物)
Synthesis Example 13 Thioether-containing organic compound (A-11)
1,9-bis (3- (methoxy (polyethoxy) ethoxy) -2-hydroxypropylsulfanyl) -3,7-dithianonane (polyethylene glycol methyl glycidyl ether (polyethylene glycol chain molecular weight 400) 3,7-dithia-1 , 9-nonanedithiol ring-opening addition compound)
合成例4のエチレングリコール=ビス(メルカプトアセタート)(1.11g,5.30mmol)のかわりに3,7−ジチア−1,9−ノナンジチオール(1.39g,5.90mmol)とし、他は合成例4と同様にしておこなうと、4.58gの標題チオエーテル含有有機化合物(A−11)が得られた(収率約92%)。 3,7-dithia-1,9-nonanedithiol (1.39 g, 5.90 mmol) instead of ethylene glycol bis (mercaptoacetate) (1.11 g, 5.30 mmol) in Synthesis Example 4, When carried out in the same manner as in Synthesis Example 4, 4.58 g of the title thioether-containing organic compound (A-11) was obtained (yield: about 92%).
1H−NMR(重クロロホルム):δ=3.9−3.5(m,ポリエチレングリコール鎖他),3.36(s,6H,PEG末端メトキシ基),2.76−2.59(m,12H,チオール化合物側S隣接メチレン基),1.82(m,2H,チオール化合物Sβ位メチレン基). 1 H-NMR (deuterated chloroform): δ = 3.9-3.5 (m, polyethylene glycol chain, etc.), 3.36 (s, 6H, PEG terminal methoxy group), 2.76-2.59 (m , 12H, thiol compound side S adjacent methylene group), 1.82 (m, 2H, thiol compound Sβ methylene group).
合成例14.チオエーテル含有有機化合物(A−12)
トリス((3−(メトキシ(ポリエトキシ)エトキシ)−2−ヒドロキシプロピルスルファニルプロパノイルオキシ)エチル)=イソシアヌレート
Synthesis Example 14 Thioether-containing organic compound (A-12)
Tris ((3- (methoxy (polyethoxy) ethoxy) -2-hydroxypropylsulfanylpropanoyloxy) ethyl) = isocyanurate
合成例2で得られたポリエチレングリコールメチルグリシジルエーテル(ポリエチレングリコール鎖の分子量400)(2.4g,5mmol)、トリス((3−メルカプトプロピオニルオキシ)エチル)イソシアヌレート(0.8g,1.5moml)、および1mol/Lテトラブチルアンモニウムフルオリド/テトラヒドロフラン溶液(500μL,0.5mmol)を混合し、70〜75℃で5時間攪拌した。後処理は、実施例3と同様に行ない、得られた濃縮乾固物にヘプタン50mLを加えてよく混ぜ、残った油状物をデカンテーションで回収した。この操作をあと2回繰り返し、残渣を減圧乾燥すると、標題チオエーテル含有有機化合物(A―12)が得られた(1.3g,収率58%)。 Polyethylene glycol methyl glycidyl ether (polyethylene glycol chain molecular weight 400) (2.4 g, 5 mmol), tris ((3-mercaptopropionyloxy) ethyl) isocyanurate (0.8 g, 1.5 moml) obtained in Synthesis Example 2 And 1 mol / L tetrabutylammonium fluoride / tetrahydrofuran solution (500 μL, 0.5 mmol) were mixed and stirred at 70 to 75 ° C. for 5 hours. The post-treatment was carried out in the same manner as in Example 3. 50 mL of heptane was added to the resulting concentrated dry solid and mixed well, and the remaining oil was recovered by decantation. This operation was repeated two more times, and the residue was dried under reduced pressure to give the title thioether-containing organic compound (A-12) (1.3 g, yield 58%).
1H−NMR(重クロロホルム):δ=3.9−3.5(m,ポリエチレングリコール鎖、N−エチレン基),3.54(t,6H,O−エチレン基),3.38(末端メトキシ基),2.8−2.6(m,チオール化合物側S隣接メチレン基およびチオール化合物Sβ位メチレン基). 1 H-NMR (deuterated chloroform): δ = 3.9-3.5 (m, polyethylene glycol chain, N-ethylene group), 3.54 (t, 6H, O-ethylene group), 3.38 (terminal) Methoxy group), 2.8-2.6 (m, thiol compound side S adjacent methylene group and thiol compound Sβ methylene group).
比較合成例1.チオエーテル含有有機化合物(A−13)
メチル=3−(メトキシ(ポリエトキシ)エトキシ)−2−ヒドロキシプロピルスルファニル)プロピオナート
(ポリエチレングリコールメチルグリシジルエーテル(ポリエチレングリコール鎖の分子量400)の3−メルカプトプロピオン酸メチルによる開環付加化合物)
Comparative Synthesis Example 1 Thioether-containing organic compound (A-13)
Methyl = 3- (methoxy (polyethoxy) ethoxy) -2-hydroxypropylsulfanyl) propionate (ring-opening addition compound of polyethylene glycol methyl glycidyl ether (molecular weight of polyethylene glycol chain 400) with methyl 3-mercaptopropionate)
合成例4のエチレングリコール=ビス(メルカプトアセテート)(1.11g,5.30mmol)のかわりに、ポリエチレングリコールメチルグリシジルエーテル(メトキシポリエチレングリコールの分子量400,97.2g)に対して、3−メルカプトプロピオン酸メチル(22.5ml,207.5mmol)とし、他は合成例4と同様にしておこなうと、115.0gの標題チオエーテル含有有機化合物(A−13)が得られた(収率約94%)。 Instead of ethylene glycol bis (mercaptoacetate) (1.11 g, 5.30 mmol) in Synthesis Example 4, 3-mercaptopropion was used with respect to polyethylene glycol methyl glycidyl ether (molecular weight of methoxypolyethylene glycol 400, 97.2 g). 115.0 g of the title thioether-containing organic compound (A-13) was obtained in the same manner as in Synthesis Example 4 except that methyl acid (22.5 ml, 207.5 mmol) was used (yield: about 94%). .
1H−NMR(重クロロホルム):δ=3.9−3.5(m,ポリエチレングリコール鎖他),3.70(s,3H,エステルメチル基),3.36(s,3H,PEG末端メトキシ基),2.84(t,2H,J=7.2Hz,チオール化合物側S隣接メチレン基),2.76−2.59(m,4H,ポリエーテル化合物側S隣接メチレン基,エステルカルボニル基α位メチレン基). 1 H-NMR (deuterated chloroform): δ = 3.9-3.5 (m, polyethylene glycol chain, etc.), 3.70 (s, 3H, ester methyl group), 3.36 (s, 3H, PEG end Methoxy group), 2.84 (t, 2H, J = 7.2 Hz, thiol compound side S adjacent methylene group), 2.76-2.59 (m, 4H, polyether compound side S adjacent methylene group, ester carbonyl Group α-position methylene group).
比較合成例2.比較メタクリレート共重合物
メチルエチルケトン(以下、MEK)70部を、窒素気流中80℃に保ち、攪拌しながらメタクリル酸10部、メタクリル酸ベンジル5部、メトキシポリエチレングリコールメタクリレート;分子量1000を85部、チオグリコール酸2部、MEK80部、および重合開始剤(「パーブチル(登録商標)O」〔日油(株)製〕)4部からなる混合物を2時間かけて滴下した。滴下終了後、「パーブチル(登録商標)O」2部を添加し、80℃で22時間攪拌した。得られた反応混合物に水を加え、減圧脱溶剤した後、水で不揮発分量を調整した(不揮発分41%)。得られた共重合物の重量平均分子量は9800(ゲルパーミエーション・クロマトグラフ法)、酸価は76.5mgKOH/gであった。
Comparative Synthesis Example 2 Comparative methacrylate copolymer 70 parts of methyl ethyl ketone (hereinafter referred to as MEK) is kept at 80 ° C. in a nitrogen stream, and while stirring, 10 parts of methacrylic acid, 5 parts of benzyl methacrylate, methoxypolyethylene glycol methacrylate; 85 parts of molecular weight 1000, thioglycol A mixture comprising 2 parts of acid, 80 parts of MEK, and 4 parts of a polymerization initiator (“Perbutyl (registered trademark) O” manufactured by NOF Corporation) was added dropwise over 2 hours. After completion of the dropwise addition, 2 parts of “Perbutyl (registered trademark) O” was added and stirred at 80 ° C. for 22 hours. Water was added to the resulting reaction mixture and the solvent was removed under reduced pressure, and the nonvolatile content was adjusted with water (41% nonvolatile content). The obtained copolymer had a weight average molecular weight of 9800 (gel permeation chromatography) and an acid value of 76.5 mgKOH / g.
実施例1.有機化合物とナノ銅粒子との複合体の合成
(有機化合物とナノ銅粒子との複合体の調製)
酢酸銅(II)一水和物(3.00g、15.0mmol)、上記合成例3で得たチオエーテル含有有機化合物(A−1)(0.454g)およびエチレングリコール(10mL)からなる混合物に、窒素を200mL/分の流量で吹き込みながら加熱し、125℃で2時間通気攪拌して脱気した。この混合物を室温に戻し、ヒドラジン水和物(1.50g、30.0mmol)を水7mLで希釈した溶液を、シリンジポンプを用いてゆっくり滴下した。このとき、初期の還元反応に伴う窒素の発生により、激しく発泡するので注意を要した。約1/4量を2時間かけてゆっくり滴下し、ここで一端滴下を停止し、2時間攪拌して発泡が沈静化するのを確認した後、残量を更に1時間かけて滴下した。得られた褐色の溶液を60℃に昇温して、さらに2時間攪拌し、還元反応を終結させた。このとき、黒色の反応溶液を少量、経時的に採取し、0.1%ヒドラジン水和物添加の脱気精製水で希釈して、直ちに紫外可視吸収スペクトルを取得すると、570〜580nmにピークが観測された。これは、ナノサイズの還元銅が示すプラズモン共鳴吸収に由来する吸収であり、これによりナノ銅粒子の生成が確認できた(図1)。
Example 1. Synthesis of complex of organic compound and nano copper particles (Preparation of complex of organic compound and nano copper particles)
To a mixture of copper (II) acetate monohydrate (3.00 g, 15.0 mmol), the thioether-containing organic compound (A-1) (0.454 g) obtained in Synthesis Example 3 and ethylene glycol (10 mL). The mixture was heated while blowing nitrogen at a flow rate of 200 mL / min, and deaerated by aeration and stirring at 125 ° C. for 2 hours. The mixture was returned to room temperature, and a solution of hydrazine hydrate (1.50 g, 30.0 mmol) diluted with 7 mL of water was slowly added dropwise using a syringe pump. At this time, caution was required because foaming was vigorously caused by the generation of nitrogen accompanying the initial reduction reaction. About 1/4 amount was dripped slowly over 2 hours, and the dripping of one end was stopped here. After stirring for 2 hours and confirming that foaming subsided, the remaining amount was further dropped over 1 hour. The resulting brown solution was heated to 60 ° C. and further stirred for 2 hours to complete the reduction reaction. At this time, a small amount of the black reaction solution was collected over time, diluted with degassed purified water added with 0.1% hydrazine hydrate, and an ultraviolet-visible absorption spectrum was immediately obtained. A peak was observed at 570 to 580 nm. Observed. This is an absorption derived from the plasmon resonance absorption exhibited by nano-sized reduced copper, and this confirmed the formation of nano-copper particles (FIG. 1).
(水分散体の調製)
つづいて、この反応混合物をダイセン・メンブレン・システムズ社製中空糸型限外濾過膜モジュール(HIT−1−FUS1582、145cm2、分画分子量15万)中に循環させ、滲出する濾液と同量の0.1%ヒドラジン水和物水溶液を加えながら、限外濾過モジュールからの濾液が約500mLとなるまで循環させて精製した。0.1%ヒドラジン水和物水溶液の供給を止め、そのまま限外濾過法により濃縮すると、2.85gの有機化合物とナノ銅粒子との複合体の水分散体が得られた。分散体中の不揮発物含量は18%、不揮発物中の金属含量は86%であった。分散体の広角X線回折からは、還元銅であることが確認できた(図2)。
(Preparation of aqueous dispersion)
Subsequently, this reaction mixture is circulated in a hollow fiber type ultrafiltration membrane module (HIT-1-FUS1582, 145 cm 2 , molecular weight cut off 150,000) manufactured by Daisen Membrane Systems Co., Ltd. While adding 0.1% hydrazine hydrate aqueous solution, it was circulated until the filtrate from the ultrafiltration module was about 500 mL and purified. When the supply of the 0.1% hydrazine hydrate aqueous solution was stopped and concentrated as it was by an ultrafiltration method, an aqueous dispersion of a composite of 2.85 g of an organic compound and nano copper particles was obtained. The non-volatile content in the dispersion was 18% and the metal content in the non-volatile was 86%. Wide-angle X-ray diffraction of the dispersion confirmed that it was reduced copper (FIG. 2).
実施例2〜12(有機化合物とナノ銅粒子との複合体の水分散体)
その他のチオエーテル含有有機化合物A−2〜12についても同様に行い、有機化合物とナノ銅粒子との複合体を調製した。反応混合物の一部をとり、紫外可視吸収スペクトルを測定したところ、何れの化合物を用いた場合においても、ナノ銅粒子表面プラズモン共鳴由来の吸収極大が570〜600nmの間に観測されることを確認した。
Examples 2-12 (Aqueous dispersion of complex of organic compound and nano copper particles)
It carried out similarly about the other thioether containing organic compound A-2-12, and the composite_body | complex of an organic compound and nano copper particle was prepared. When a part of the reaction mixture was taken and the UV-visible absorption spectrum was measured, it was confirmed that the absorption maximum derived from the surface plasmon resonance of the nanocopper particles was observed between 570 and 600 nm when any compound was used. did.
(分散体の粒子径測定)
実施例3(合成例3で得られた化合物A−3を使用した場合)で得られた銅粒子を電子顕微鏡で観察すると平均粒子径7nmの微粒子であることが判明した(図3)。また、このとき動的光散乱法により測定した平均粒子径は106nmであった。その他の実施例については、以下の表1にまとめた。
(Measurement of particle size of dispersion)
When the copper particles obtained in Example 3 (when the compound A-3 obtained in Synthesis Example 3 was used) were observed with an electron microscope, they were found to be fine particles having an average particle diameter of 7 nm (FIG. 3). Moreover, the average particle diameter measured by the dynamic light scattering method at this time was 106 nm. Other examples are summarized in Table 1 below.
実施例13.有機化合物とナノ酸化銅(I)粒子との複合体の合成
酢酸銅(II)1水和物(2.00g、10.0mmol)、上記合成例3で得たチオエーテル含有有機化合物A−1(0.30g)およびエチレングリコール(6.6mL)からなる混合物に、N,N−ジエチルヒドロキシルアミン(85%,1.15g、11.0mmol)を水4.6mLで希釈した溶液を添加した。室温で30分攪拌した後、ポリプロピレン製遠沈管に移し、遠心分離機で13000Gの加速度を20分間与え、遠心沈降させた。上澄み液を捨て、沈降物にアルゴンガスで30分バブリングにより脱気した水を加え、不揮発物含量を30%に調製した。不揮発物中のナノ酸化銅(I)含量は85%であった。沈降物を電子顕微鏡で観察すると平均粒子径5nm程度の微粒子の凝集体であった(図5)。
Example 13 Synthesis of Complex of Organic Compound and Nano Copper (I) Oxide Particles Copper (II) acetate monohydrate (2.00 g, 10.0 mmol), thioether-containing organic compound A-1 obtained in Synthesis Example 3 above ( 0.30 g) and ethylene glycol (6.6 mL) was added a solution of N, N-diethylhydroxylamine (85%, 1.15 g, 11.0 mmol) diluted with 4.6 mL of water. After stirring at room temperature for 30 minutes, it was transferred to a centrifuge tube made of polypropylene, and an acceleration of 13000 G was applied for 20 minutes with a centrifuge to cause centrifugal sedimentation. The supernatant was discarded, and water degassed by bubbling with argon gas for 30 minutes was added to the sediment to adjust the nonvolatile content to 30%. The content of nano copper (I) oxide in the nonvolatile material was 85%. When the sediment was observed with an electron microscope, it was an aggregate of fine particles having an average particle diameter of about 5 nm (FIG. 5).
実施例14〜24(有機化合物とナノ酸化銅(I)粒子との複合体の水分散体)
上記実施例13のチオエーテル含有有機化合物A−1のかわりに、チオエーテル含有有機化合物A−2〜12についても同様に行い、ナノ酸化銅(I)の水分散体を作製した。得られる酸化銅(I)の粒径については、表2にまとめた。
Examples 14 to 24 (Aqueous dispersions of composites of organic compounds and nano copper (I) oxide particles)
In place of the thioether-containing organic compound A-1 in Example 13, the thioether-containing organic compounds A-2 to A-12 were similarly processed to prepare an aqueous dispersion of nano copper (I) oxide. The particle diameter of the obtained copper (I) oxide is summarized in Table 2.
比較例1
実施例1において、チオエーテル含有有機化合物A−1の代わりに比較合成例1で合成したチオエーテル含有有機化合物A−13を用いる以外は、実施例1と同様にして還元反応を行った。部分還元時の反応混合物の一部をとり、酸化銅(I)の一次粒子径をTEMにより測定すると、平均粒子径は8nmであった。
Comparative Example 1
In Example 1, a reduction reaction was performed in the same manner as in Example 1 except that the thioether-containing organic compound A-13 synthesized in Comparative Synthesis Example 1 was used instead of the thioether-containing organic compound A-1. When a part of the reaction mixture at the time of partial reduction was taken and the primary particle diameter of copper (I) oxide was measured by TEM, the average particle diameter was 8 nm.
反応混合物の一部をとり、紫外可視吸収スペクトルを測定したところ、ナノ銅粒子表面プラズモン共鳴由来の吸収極大が570〜590nmの間に観測されることを確認した。また、得られた銅粒子を電子顕微鏡で観察すると粒子径5nmの微粒子もあるが、20nm程度の粒子も混じっており、平均は15nmで、形状が不揃いであることが判明した(図4)。 When a part of the reaction mixture was taken and the ultraviolet-visible absorption spectrum was measured, it was confirmed that the absorption maximum derived from the surface plasmon resonance of the nanocopper particles was observed between 570 and 590 nm. Further, when the obtained copper particles were observed with an electron microscope, there were fine particles having a particle diameter of 5 nm, but particles of about 20 nm were also mixed, the average was 15 nm, and the shape was irregular (FIG. 4).
比較例2
実施例1において、チオエーテル含有有機化合物A−1の代わりに比較合成例で合成した比較メタクリレート共重合物を用いる以外は、実施例1と同様にして還元反応を行った。反応後の混合物から、実施例1と同様にして一部をとり、紫外可視吸収スペクトルを測定したところ、570〜600nmの間に観測されるピークは存在していないことを確認した。
Comparative Example 2
In Example 1, a reduction reaction was performed in the same manner as in Example 1 except that the comparative methacrylate copolymer synthesized in the comparative synthesis example was used instead of the thioether-containing organic compound A-1. A part of the mixture after the reaction was taken in the same manner as in Example 1, and the ultraviolet-visible absorption spectrum was measured. As a result, it was confirmed that there was no peak observed between 570 and 600 nm.
応用例1.銅薄膜の作成と薄膜の比抵抗測定
アルゴンを満たしたグローブバッグ中、上記実施例5で得られた複合体の水分散液を、7.6×2.6cmの清浄なスライドガラスの一端からおよそ0.5cm付近に約0.2mL程度滴下し、バーコーター(8番)を用いて展開して薄膜とし、そのまま、アルゴン雰囲気下で乾燥させた。乾燥したスライドガラスを広角X線回折法により確認すると、乾燥後6日経過後も銅のみが検出された(図6)この銅皮膜を3%水素含有アルゴンガスを0.5L/分の流量で流した雰囲気で、250℃で30分加熱した。放冷後、電気抵抗率を測定したところ、1.9×10−4Ω・cmであった。
Application example 1. Preparation of copper thin film and measurement of specific resistance of thin film In an argon-filled glove bag, the aqueous dispersion of the composite obtained in Example 5 was roughly removed from one end of a clean glass slide of 7.6 × 2.6 cm. About 0.2 mL was dropped in the vicinity of 0.5 cm, developed using a bar coater (No. 8) to form a thin film, and dried as it was under an argon atmosphere. When the dried glass slide was confirmed by wide-angle X-ray diffraction, only copper was detected even after 6 days from drying (FIG. 6). 3% hydrogen-containing argon gas was flowed through this copper film at a flow rate of 0.5 L / min. And heated at 250 ° C. for 30 minutes. After standing to cool, the electrical resistivity was measured and found to be 1.9 × 10 −4 Ω · cm.
比較応用例1
比較例1で得られた複合体の分散液についても、同様にスライドガラス上に塗布し、窒素ガスで乾燥させたが、乾燥翌日に酸化銅(I)がわずかに検出され、チオエーテル含有有機化合物をポリチオエーテルとすることで銅コロイド保護剤としての能力が高くなることが確認できた(図7)。また、この乾燥スライドガラスをホットプレート上に置き、3%水素含有アルゴンガスを0.5L/分の流量で流した雰囲気で、250℃で30分加熱したところ、2.4×10−4Ω・cmであった。
Comparative application example 1
The composite dispersion obtained in Comparative Example 1 was also similarly applied on a slide glass and dried with nitrogen gas. However, copper (I) oxide was slightly detected the next day after drying, and the thioether-containing organic compound was detected. It was confirmed that the ability as a colloidal copper protective agent was increased by using polythioether (FIG. 7). Moreover, when this dry glass slide was placed on a hot plate and heated at 250 ° C. for 30 minutes in an atmosphere in which 3% hydrogen-containing argon gas was flowed at a flow rate of 0.5 L / min, 2.4 × 10 −4 Ω -It was cm.
応用例2.酸化銅(I)ナノ粒子複合体を用いた銅薄膜の作製と薄膜の比抵抗測定
上記実施例13で得られたナノ酸化銅複合体の水分散液を、7.6×2.6cmの清浄なスライドガラスの一端からおよそ0.5cm付近に約0.2mL程度滴下し、バーコーター(8番)を用いて展開して薄膜とし、窒素ガスを0.2L/分の流量で流した雰囲気で乾燥させた。乾燥したスライドガラスを広角X線回折法により確認すると、酸化銅(I)のみが検出された(図8)。
Application Example 2 Preparation of copper thin film using copper (I) oxide nanoparticle composite and measurement of specific resistance of thin film The aqueous dispersion of nano copper oxide composite obtained in Example 13 above was cleaned at 7.6 × 2.6 cm. In an atmosphere where about 0.2 mL was dropped from one end of a simple slide glass to about 0.5 cm and developed into a thin film using a bar coater (No. 8), and nitrogen gas was flowed at a flow rate of 0.2 L / min. Dried. When the dried slide glass was confirmed by the wide-angle X-ray diffraction method, only copper (I) oxide was detected (FIG. 8).
上記実施例で得られたナノ酸化銅(I)複合体の水分散液を用い、上記と同様の方法でスライドガラス上に酸化銅(I)薄膜を作製した。乾燥したスライドガラスを、窒素ガスで置換した炉の中に置き、3%水素含有アルゴンガスを3L/分の流量で流した雰囲気中、300℃で30分加熱した。放冷後、電気抵抗率を測定し、結果は表にまとめた。また、比抵抗測定を実施した後、焼成したスライドガラスを広角X線回折法により、銅の生成が確認できた(図9)。 A copper (I) oxide thin film was prepared on a slide glass by the same method as described above, using the aqueous dispersion of the nano copper (I) complex obtained in the above example. The dried glass slide was placed in a furnace substituted with nitrogen gas, and heated at 300 ° C. for 30 minutes in an atmosphere in which 3% hydrogen-containing argon gas was flowed at a flow rate of 3 L / min. After standing to cool, the electrical resistivity was measured, and the results are summarized in a table. Moreover, after carrying out a specific resistance measurement, the production | generation of copper has been confirmed with the wide-angle X-ray-diffraction method by baking the slide glass (FIG. 9).
実施例3で得られたナノ銅粒子の複合体の分散液体を、ポリプロピレン製密閉容器中冷蔵庫で保存し、3月経過後の外観と紫外可視吸収スペクトル、動的光散乱法および電子顕微鏡による粒子径分布を測定したところ、3月にわたって変化がなかった(表3)。 The dispersion liquid of the composite of nano copper particles obtained in Example 3 was stored in a refrigerator in a polypropylene sealed container, and the appearance, ultraviolet-visible absorption spectrum, dynamic light scattering method and electron microscope particle after 3 months passed When the diameter distribution was measured, there was no change over March (Table 3).
Claims (10)
[X−(OCH2CHR)n−O−CH2−CH(OH)−CH2−S−]mY (1)
[X−(OCH2CHR)n−O−CH2−CH(OH)−CH2−S−R’−]lZ (2)
〔式(1)及び(2)中のXはC1〜C8のアルキル基であり、Rは水素原子又はメチル基であり、nは2〜100の繰り返し数を示す整数であって、Rは繰り返し単位ごとに独立し同一であっても異なっていても良く、Yは硫黄原子と直接結合するものが炭素原子である2〜4価の基であって、C1〜C4の飽和炭化水素基又はC1〜C4の飽和炭化水素基が−O−、−S−若しくは−NHR”−(R”はC1〜C4の飽和炭化水素基である。)で2〜3個連結した基である。式(1)中のmは2〜4の整数である。式(2)中のR’はC2〜C5のアルキルカルボニルオキシ基であり、Zは硫黄原子と直接結合するものが炭素原子である2〜6価の基であって、C2〜C6の飽和炭化水素基、C2〜C6の飽和炭化水素基が−O−、−S−若しくは−NHR”−(R”はC1〜C4の飽和炭化水素基である。)で2〜3個連結した基、又はイソシアヌル酸−N,N’,N”−トリエチレン基であり、lは2〜6の整数である。〕
で表されるチオエーテル含有有機化合物(A)と、ナノ銅粒子とを含有することを特徴とする有機化合物とナノ銅粒子との複合体。 The following general formula (1) or general formula (2)
[X— (OCH 2 CHR) n —O—CH 2 —CH (OH) —CH 2 —S—] m Y (1)
[X— (OCH 2 CHR) n —O—CH 2 —CH (OH) —CH 2 —S—R′—] l Z (2)
[X in the formula (1) and (2) is an alkyl group of C 1 -C 8, R is a hydrogen atom or a methyl radical, n is an integer indicating the number of repetitions of 2 to 100, R May be the same or different for each repeating unit, and Y is a divalent to tetravalent group in which a carbon atom is directly bonded to a sulfur atom, and is a C 1 -C 4 saturated carbonization Two or three hydrogen groups or C 1 -C 4 saturated hydrocarbon groups are connected by —O—, —S— or —NHR ″ — (R ″ is a C 1 to C 4 saturated hydrocarbon group). It is a group. M in Formula (1) is an integer of 2-4. R ′ in the formula (2) is a C 2 to C 5 alkylcarbonyloxy group, Z is a divalent to hexavalent group in which a carbon atom is directly bonded to a sulfur atom, and C 2 to C 6 saturated hydrocarbon groups and C 2 -C 6 saturated hydrocarbon groups are —O—, —S— or —NHR ″ — (R ″ is a C 1 to C 4 saturated hydrocarbon group). ~ 3 linked groups, or isocyanuric acid-N, N ', N "-triethylene group, and l is an integer of 2-6.]
The composite of the organic compound and nano copper particle characterized by containing the thioether containing organic compound (A) represented by these, and a nano copper particle.
[X−(OCH2CHR)n−O−CH2−CH(OH)−CH2−S−]mY (1)
[X−(OCH2CHR)n−O−CH2−CH(OH)−CH2−S−R’−]lZ (2)
〔式(1)及び(2)中のXはC1〜C8のアルキル基であり、Rは水素原子又はメチル基であり、nは2〜100の繰り返し数を示す整数であって、Rは繰り返し単位ごとに独立し同一であっても異なっていても良く、Yは硫黄原子と直接結合するものが炭素原子である2〜4価の基であって、C1〜C4の飽和炭化水素基又はC1〜C4の飽和炭化水素基が−O−、−S−若しくは−NHR”−(R”はC1〜C4の飽和炭化水素基である。)で2〜3個連結した基である。式(1)中のmは2〜4の整数である。式(2)中のR’はC2〜C5のアルキルカルボニルオキシ基であり、Zは硫黄原子と直接結合するものが炭素原子である2〜6価の基であって、C2〜C6の飽和炭化水素基、C2〜C6の飽和炭化水素基が−O−、−S−若しくは−NHR”−(R”はC1〜C4の飽和炭化水素基である。)で2〜3個連結した基、又はイソシアヌル酸−N,N’,N”−トリエチレン基であり、lは2〜6の整数である。〕
で表されるチオエーテル含有有機化合物(A)と、ナノ酸化銅(I)粒子とを含有することを特徴とする有機化合物とナノ酸化銅(I)粒子との複合体。 The following general formula (1) or general formula (2)
[X— (OCH 2 CHR) n —O—CH 2 —CH (OH) —CH 2 —S—] m Y (1)
[X— (OCH 2 CHR) n —O—CH 2 —CH (OH) —CH 2 —S—R′—] l Z (2)
[X in the formula (1) and (2) is an alkyl group of C 1 -C 8, R is a hydrogen atom or a methyl radical, n is an integer indicating the number of repetitions of 2 to 100, R May be the same or different for each repeating unit, and Y is a divalent to tetravalent group in which a carbon atom is directly bonded to a sulfur atom, and is a C 1 -C 4 saturated carbonization Two or three hydrogen groups or C 1 -C 4 saturated hydrocarbon groups are connected by —O—, —S— or —NHR ″ — (R ″ is a C 1 to C 4 saturated hydrocarbon group). It is a group. M in Formula (1) is an integer of 2-4. R ′ in the formula (2) is a C 2 to C 5 alkylcarbonyloxy group, Z is a divalent to hexavalent group in which a carbon atom is directly bonded to a sulfur atom, and C 2 to C 6 saturated hydrocarbon groups and C 2 -C 6 saturated hydrocarbon groups are —O—, —S— or —NHR ″ — (R ″ is a C 1 to C 4 saturated hydrocarbon group). ~ 3 linked groups, or isocyanuric acid-N, N ', N "-triethylene group, and l is an integer of 2-6.]
A composite of an organic compound and nano-copper oxide (I) particles, characterized in that it comprises a thioether-containing organic compound (A) represented by formula (1) and nano-copper oxide (I) particles.
[X−(OCH2CHR)n−O−CH2−CH(OH)−CH2−S−]mY (1)
[X−(OCH2CHR)n−O−CH2−CH(OH)−CH2−S−R’−]lZ (2)
〔式(1)及び(2)中のXはC1〜C8のアルキル基であり、Rは水素原子又はメチル基であり、nは2〜100の繰り返し数を示す整数であって、Rは繰り返し単位ごとに独立し同一であっても異なっていても良く、Yは硫黄原子と直接結合するものが炭素原子である2〜4価の基であって、C1〜C4の飽和炭化水素基又はC1〜C4の飽和炭化水素基が−O−、−S−若しくは−NHR”−(R”はC1〜C4の飽和炭化水素基である。)で2〜3個連結した基である。式(1)中のmは2〜4の整数である。式(2)中のR’はC2〜C5のアルキルカルボニルオキシ基であり、Zは硫黄原子と直接結合するものが炭素原子である2〜6価の基であって、C2〜C6の飽和炭化水素基、C2〜C6の飽和炭化水素基が−O−、−S−若しくは−NHR”−(R”はC1〜C4の飽和炭化水素基である。)で2〜3個連結した基、又はイソシアヌル酸−N,N’,N”−トリエチレン基であり、lは2〜6の整数である。〕
で表されるチオエーテル含有有機化合物(A)の存在下、
(i)2価の銅イオン化合物を溶媒と混合する工程と、
(ii)銅イオンを0価のナノ銅粒子(B)に還元する工程と、
を有することを特徴とする有機化合物とナノ銅粒子との複合体の製造方法。 The following general formula (1) or general formula (2)
[X— (OCH 2 CHR) n —O—CH 2 —CH (OH) —CH 2 —S—] m Y (1)
[X— (OCH 2 CHR) n —O—CH 2 —CH (OH) —CH 2 —S—R′—] l Z (2)
[X in the formula (1) and (2) is an alkyl group of C 1 -C 8, R is a hydrogen atom or a methyl radical, n is an integer indicating the number of repetitions of 2 to 100, R May be the same or different for each repeating unit, and Y is a divalent to tetravalent group in which a carbon atom is directly bonded to a sulfur atom, and is a C 1 -C 4 saturated carbonization Two or three hydrogen groups or C 1 -C 4 saturated hydrocarbon groups are connected by —O—, —S— or —NHR ″ — (R ″ is a C 1 to C 4 saturated hydrocarbon group). It is a group. M in Formula (1) is an integer of 2-4. R ′ in the formula (2) is a C 2 to C 5 alkylcarbonyloxy group, Z is a divalent to hexavalent group in which a carbon atom is directly bonded to a sulfur atom, and C 2 to C 6 saturated hydrocarbon groups and C 2 -C 6 saturated hydrocarbon groups are —O—, —S— or —NHR ″ — (R ″ is a C 1 to C 4 saturated hydrocarbon group). ~ 3 linked groups, or isocyanuric acid-N, N ', N "-triethylene group, and l is an integer of 2-6.]
In the presence of a thioether-containing organic compound (A) represented by
(I) mixing a divalent copper ion compound with a solvent;
(Ii) a step of reducing copper ions to zero-valent nano copper particles (B);
The manufacturing method of the composite_body | complex of the organic compound and nano copper particle | grains characterized by having.
[X−(OCH2CHR)n−O−CH2−CH(OH)−CH2−S−]mY (1)
[X−(OCH2CHR)n−O−CH2−CH(OH)−CH2−S−R’−]lZ (2)
〔式(1)及び(2)中のXはC1〜C8のアルキル基であり、Rは水素原子又はメチル基であり、nは2〜100の繰り返し数を示す整数であって、Rは繰り返し単位ごとに独立し同一であっても異なっていても良く、Yは硫黄原子と直接結合するものが炭素原子である2〜4価の基であって、C1〜C4の飽和炭化水素基又はC1〜C4の飽和炭化水素基が−O−、−S−若しくは−NHR”−(R”はC1〜C4の飽和炭化水素基である。)で2〜3個連結した基である。式(1)中のmは2〜4の整数である。式(2)中のR’はC2〜C5のアルキルカルボニルオキシ基であり、Zは硫黄原子と直接結合するものが炭素原子である2〜6価の基であって、C2〜C6の飽和炭化水素基、C2〜C6の飽和炭化水素基が−O−、−S−若しくは−NHR”−(R”はC1〜C4の飽和炭化水素基である。)で2〜3個連結した基、又はイソシアヌル酸−N,N’,N”−トリエチレン基であり、lは2〜6の整数である。〕
で表されるチオエーテル含有有機化合物(A)の存在下、
(i)2価の銅イオン化合物を溶媒と混合する工程と、
(ii’)銅イオンを1価のナノ酸化銅(I)粒子(C)に還元する工程と、
を有することを特徴とする有機化合物とナノ酸化銅(I)粒子との複合体の製造方法。 The following general formula (1) or general formula (2)
[X— (OCH 2 CHR) n —O—CH 2 —CH (OH) —CH 2 —S—] m Y (1)
[X— (OCH 2 CHR) n —O—CH 2 —CH (OH) —CH 2 —S—R′—] l Z (2)
[X in the formula (1) and (2) is an alkyl group of C 1 -C 8, R is a hydrogen atom or a methyl radical, n is an integer indicating the number of repetitions of 2 to 100, R May be the same or different for each repeating unit, and Y is a divalent to tetravalent group in which a carbon atom is directly bonded to a sulfur atom, and is a C 1 -C 4 saturated carbonization Two or three hydrogen groups or C 1 -C 4 saturated hydrocarbon groups are connected by —O—, —S— or —NHR ″ — (R ″ is a C 1 to C 4 saturated hydrocarbon group). It is a group. M in Formula (1) is an integer of 2-4. R ′ in the formula (2) is a C 2 to C 5 alkylcarbonyloxy group, Z is a divalent to hexavalent group in which a carbon atom is directly bonded to a sulfur atom, and C 2 to C 6 saturated hydrocarbon groups and C 2 -C 6 saturated hydrocarbon groups are —O—, —S— or —NHR ″ — (R ″ is a C 1 to C 4 saturated hydrocarbon group). ~ 3 linked groups, or isocyanuric acid-N, N ', N "-triethylene group, and l is an integer of 2-6.]
In the presence of a thioether-containing organic compound (A) represented by
(I) mixing a divalent copper ion compound with a solvent;
(Ii ′) a step of reducing copper ions to monovalent nano-copper oxide (I) particles (C);
The manufacturing method of the composite_body | complex of the organic compound and nano copper (I) particle | grains characterized by having.
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JP2016145397A (en) * | 2015-02-09 | 2016-08-12 | 日立化成株式会社 | Producing method of copper membrane and conductor obtained thereby |
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