JP2013058418A - Connection terminal and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connection terminal having a low friction coefficient, and to provide a low cost manufacturing method therefor.SOLUTION: In the connection terminal consisting of a male terminal and a female terminal abutting each other, the male terminal and female terminal are composed, respectively, of a plating material where a plating layer such as an Sn plating layer, an Ag plating layer or an Au plating layer is formed on the surface of a conductor substrate composed of copper or a copper alloy. The part where the male terminal and female terminal are abutting each other is coated with a lubricant having a composition only of a base oil such as liquid paraffin or silicon oil having a kinetic viscosity of 6000 cSt or higher, preferably 8000 cSt or higher, and further preferably 10000 cSt or higher.

Description

  The present invention relates to a connection terminal and a manufacturing method thereof, and more particularly to a connection terminal that can be inserted and removed and a manufacturing method thereof.

  Conventionally, an Sn plated material obtained by applying Sn plating to the outermost layer of a conductor material such as copper or copper alloy has been used as a material for a connection terminal that can be inserted and removed. In particular, Sn plating materials have low contact resistance, and from the viewpoints of contact reliability, corrosion resistance, solderability, economy, etc., control boards for industrial equipment such as automobiles, mobile phones, personal computers and other industrial equipment such as robots, Used as a material for terminals and bus bars of connectors, lead frames, relays, switches, etc.

  In general, such Sn plating is performed by electroplating, and a reflow process (Sn melting process) is performed immediately after electroplating in order to remove internal stress of the Sn plating material and suppress the generation of whiskers. It has been broken. When the reflow treatment is performed after Sn plating in this way, a part of Sn diffuses into the material and the base component to form a compound layer, and a Sn layer (hereinafter referred to as “pure”) having a soft molten and solidified structure on this compound layer. Sn layer ") is formed. This pure Sn layer plays an extremely important role in order to obtain excellent contact reliability, corrosion resistance and solderability.

  However, since the pure Sn layer is soft and easily deformed, if the Sn-plated material subjected to reflow processing is used as a material such as a connection terminal that can be inserted and removed, the surface is scraped when the connection terminal is inserted and the friction coefficient is increased. There is a problem that power becomes high. In connection terminals of automobiles and the like, the number of terminals is increasing, and the insertion force at the time of assembly increases in proportion to the number of terminals, and the work load becomes a problem.

  In order to solve such problems, in the Sn plating material subjected to reflow treatment, the film thickness of the pure Sn layer, which is a soft layer, is reduced, and a compound layer such as a hard Cu—Sn compound layer is ground by reflow treatment. Thus, the friction coefficient is reduced. However, when the pure Sn layer is thinned, the material and the base component diffuse quickly to the outermost surface due to changes over time, and heat resistance and contact reliability are lowered. Therefore, a method of laminating a Ni plating layer, a Cu plating layer, and a thin Sn plating layer having a thickness of 0.4 to 1.1 μm in this order on the surface of the base material has been proposed (for example, Patent Document 1). reference).

  Also, there is a method of reducing the insertion force by forming irregularities having an arithmetic average roughness Ra of 0.15 μm or more on the surface of the material to reduce the contact area and exposing the Cu—Sn compound layer at the convex portions. It has been proposed (see, for example, Patent Document 2).

  There has also been proposed a method in which the friction coefficient is lowered and the insertion force is lowered by applying fluorine resin fine particles and fluorine oil to the surface of the substrate (see, for example, Patent Document 3).

  In addition, a base material having a diameter of 10 to 100 μm is obtained by plating a base metal after heating and oxidizing a base material of a steel alloy containing Sn and immersing it in a fluorine compound solution whose hydrogen ion concentration is adjusted to a predetermined range. There has also been proposed a method of forming a plurality of recesses in a material, plating a contact metal, and applying a lubricating material to obtain a contact having sufficient wear resistance and high lubricity (see, for example, Patent Document 4). ).

  Furthermore, by applying a water-soluble metal surface lubricant containing a hydrocarbon-based material and a surfactant for emulsifying this hydrocarbon-based material to the surface of an electronic component such as a connector, the friction coefficient is lowered and contact is made. A method of reducing the resistance value has also been proposed (see, for example, Patent Document 5).

JP 2003-147579 A (paragraph number 0007) JP 2006-183068 A (paragraph number 0012-0013) Japanese Patent Laying-Open No. 2005-19103 (paragraph number 0034) JP 2006-202569 A (paragraph numbers 0012 and 0018) JP 2002-212582 A (paragraph numbers 0007 and 0014)

  However, as in Patent Document 1, in the method of inserting the Ni layer, the number of steps increases by the Ni plating step, the plating line management cost and the initial cost increase, and the effect of reducing the friction coefficient. Is not enough.

  Further, as disclosed in Patent Document 2, in the method of forming irregularities having an arithmetic average roughness Ra of 0.15 μm or more on the surface of the material to expose the Cu—Sn compound layer, the solder is exposed due to the exposure of the Cu—Sn compound layer. Adhesiveness and corrosion resistance are deteriorated, and the formation of irregularities is expensive.

  Further, as disclosed in Patent Document 3, in the method of applying the fluorine resin fine particles and the fluorine oil to the surface of the base material, the fluorine resin fine particles are required in addition to the fluorine oil as the lubricant. Raw material costs and management costs increase.

  In addition, as in Patent Document 4, in the method of forming irregularities on the surface of a copper alloy substrate containing Sn, the type of the substrate is limited to the copper alloy containing Sn, and the material processing costs are enormous. And the processing of the material reduces the productivity.

  Furthermore, as in Patent Document 5, the method of applying a water-soluble metal surface lubricant to the surface of an electronic component such as a connector uses a water-soluble metal surface lubricant, and therefore, compared with the case of using a non-aqueous lubricant. Thus, the effect of reducing the friction coefficient is reduced.

  Therefore, in view of such a conventional problem, an object of the present invention is to provide a connection terminal having a low friction coefficient and a method for manufacturing the connection terminal at a low cost.

  As a result of diligent research to solve the above problems, the present inventors have found that in a connection terminal composed of a male terminal and a female terminal that are in contact with each other, a lubricant having a kinematic viscosity of 6000 cSt or more is applied to a portion where the male terminal and the female terminal are in contact. By applying, it has been found that a connection terminal having a low friction coefficient can be produced at a low cost, and the present invention has been completed.

  That is, the connection terminal according to the present invention is characterized in that a lubricant having a kinematic viscosity of 6000 cSt or more is applied to a portion where the male terminal and the female terminal are in contact with each other in the connection terminal composed of the male terminal and the female terminal that are in contact with each other. . In this connection terminal, the male terminal and the female terminal are each preferably made of a plating material in which a plating layer such as an Sn plating layer, an Ag plating layer, or an Au plating layer is formed on the surface of the conductor base material. It is preferably made of copper or a copper alloy. The lubricant is preferably liquid paraffin or silicone oil.

  Further, the manufacturing method of the connection terminal according to the present invention is a method of manufacturing a connection terminal comprising a male terminal and a female terminal that are in contact with each other, and a lubricant having a kinematic viscosity of 6000 cSt or more is applied to a portion where the male terminal and the female terminal are in contact. It is characterized by. In this connection terminal manufacturing method, the male terminal and the female terminal are preferably made of a plating material in which a plating layer such as an Sn plating layer, an Ag plating layer, or an Au plating layer is formed on the surface of the conductor base material. The substrate is preferably made of copper or a copper alloy. The lubricant is preferably liquid paraffin or silicone oil.

  According to the present invention, a connection terminal having a low coefficient of friction can be manufactured at low cost.

It is a figure which shows the relationship between the friction coefficient of the test piece obtained in Examples 1-6 and Comparative Examples 1-7, and kinematic viscosity of a lubricant.

  The embodiment of the connection terminal according to the present invention includes a male terminal and a female terminal that are in contact with each other, and a lubricant having a kinematic viscosity of 6000 cSt or more is applied to a portion where the male terminal and the female terminal are in contact.

  In this connection terminal, the male terminal and the female terminal are each preferably made of a plating material in which a plating layer such as an Sn plating layer, an Ag plating layer, or an Au plating layer is formed on the surface of the conductor base material. It is preferable to be made of a Sn plating material on which is formed. Moreover, when forming the Sn plating layer on the surface of the conductor base material, the Ni plating layer and the Cu plating layer may be formed in this order between the surface of the conductor base material and the Sn plating layer. Cu plating layer and CuSn plating layer may be formed in this order, or CuSn plating layer or Ni plating layer may be formed. The plating layer may be formed by ordinary electroplating or the like, and it is not necessary to perform fine uneven processing on the surface.

  The lubricant is a lubricant having a kinematic viscosity of 6000 cSt or more, preferably a lubricant having a kinematic viscosity of 8000 cSt or more, and more preferably a lubricant having a kinematic viscosity of 10,000 cSt or more. As described above, the lubricant having a very high kinematic viscosity can greatly reduce the friction coefficient as compared with the lubricant having a kinematic viscosity of 1 to 1000 cSt which is used as a conventional lubricant. The lubricant is preferably liquid paraffin or silicone oil, and the composition thereof may be a composition of only base oil such as liquid paraffin or silicone oil. That is, even if a lubricant with a composition of only a base oil such as liquid paraffin or silicone oil is used without using a lubricant having a composition in which various additives are added to the base oil, a lubricant having an extremely high kinematic viscosity may be used. As compared with a lubricant having a kinematic viscosity of 1 to 100 cSt used as a conventional lubricant, the friction coefficient can be greatly reduced.

  It should be noted that such an extremely high kinematic viscosity lubricant may be applied to a portion where the male terminal and the female terminal on the surface of the male terminal or the female terminal abut (the contact portion of the male terminal and the female terminal). The male terminal and the female terminal may be attached to the contact portion of the male terminal with the female terminal before the work is brought into contact by fitting or the male terminal of the female terminal after the female terminal is formed into a terminal shape. You may make it adhere to the contact part (indent front-end | tip part) with a terminal.

  In addition, when such a high kinematic viscosity lubricant is applied to the contact portion of the male terminal and the female terminal, it is retained without flowing out from the contact portion, and even a small amount can reduce the friction coefficient of the contact portion. A small amount of lubricant may be applied. Note that the higher the viscosity of the lubricant of the same composition, the lower the volatility.Therefore, such a high kinematic viscosity lubricant has a low volatility and reduces the friction coefficient even when left in a high temperature environment for a long time. Therefore, the durability in a high temperature environment is excellent. Moreover, even if such a high kinematic viscosity lubricant is applied to the contact portions of the male terminal and the female terminal, the contact resistance value does not increase and the function as an electrical contact is not impaired.

  The conductor base material is preferably made of copper or a copper alloy, and has a CDA number such as C19025 alloy (for example, NB-109 alloy manufactured by DOWA Metaltech Co., Ltd.) or C19020 alloy (for example, NB-105 alloy). Ni-Sn alloy, Cu-Ni-Si alloy, phosphor bronze, brass and the like can be used. In particular, the conductor base material of the female terminal is preferably made of a Cu—Ni—Sn alloy or phosphor bronze rather than a high-strength and high-cost copper alloy such as Be copper or titanium copper. It is preferably made of brass. A conductive base material made of an iron-based material such as stainless steel (SUS) or an aluminum alloy may be used.

  Examples of the connection terminal and the manufacturing method thereof according to the present invention will be described in detail below.

[Example 1]
First, a flat conductor substrate made of a Cu-Ni-Sn alloy having a thickness of 0.25 mm (NB-109-EH material (0.1% by mass of Ni and 0.9% by mass of DOWA Metaltech Co., Ltd.) Of Sn and 0.9% by mass of P, with a balance of Cu being a Cu alloy base material)), a Sn plating material having a thickness of 1 μm was applied, and two reflow-treated Sn plating materials were prepared.

Next, silicon oil (KF-96-10000 cs, flash point 315 ° C., pour point −50 ° C., density 0) as a lubricant is applied to a region of 70 mm × 70 mm of one Sn plating material as a lubricant at 40 ° C. A test piece obtained by dripping and spreading 1 mL of .98 g / cm ³ ) at room temperature (25 ° C.) was used as an evaluation sample (test piece as a male terminal). Further, a test piece obtained by indenting (R1 mm) the other Sn plating material was used as an indenter (test piece as a female terminal). Although the indented test piece (indenter) is not coated with a lubricant, it is brought into a state where the lubricant is also applied to the indenter by bringing it into contact with a flat evaluation sample.

  Next, the evaluation sample is fixed on a horizontal platform of a horizontal load measuring instrument (an apparatus combining an electric contact simulator, a stage controller, a load cell, and a load cell amplifier manufactured by Yamazaki Seiki Laboratory Co., Ltd.). After the indenter is brought into contact with each other, the evaluation sample is pulled horizontally by 10 mm with a sliding speed of 80 mm / min while pressing the indenter against the surface of the evaluation sample with a load of 1N, 2N, 3N, 5N, 10N and 13N, respectively. The force applied in the horizontal direction between 1 mm and 4 mm (measurement distance 3 mm) was measured to calculate the average value F, and the dynamic friction coefficient (μ) between the test pieces was calculated from μ = F / N. As a result, the dynamic friction coefficients (average values of the values measured twice each) of the test pieces obtained in this example in the case of loads 1N, 2N, 3N, 5N, 10N and 13N were 0.17 and 0, respectively. .13, 0.13, 0.14, 0.13 and 0.14.

[Example 2]
Instead of silicone oil having a kinematic viscosity at 40 ° C. of 10,000 cSt (KF-96-10000 cs), silicon oil having a kinematic viscosity at 40 ° C. of 100,000 cSt (KF-96-100,000 cs, flash point 315 ° C., pour point−50 ° C., density Except for using 0.98 g / cm ³ ), after obtaining two test pieces by the same method as in Example 1, the dynamic friction coefficient (μ) between the test pieces was calculated. As a result, the dynamic friction coefficients (average values of the values measured twice each) of the test pieces obtained in this example in the case of loads 1N, 2N, 3N, 5N, 10N and 13N were 0.19 and 0, respectively. .15, 0.13, 0.12, 0.12 and 0.13.

[Example 3]
Instead of silicone oil having a kinematic viscosity at 40 ° C. of 10,000 cSt (KF-96-10000 cs), silicon oil having a kinematic viscosity at 40 ° C. of 1,000,000 cSt (KF-96-1000000 cs, flash point 315 ° C., pour point −50 ° C., density) Except for using 0.98 g / cm ³ ), after obtaining two test pieces by the same method as in Example 1, the dynamic friction coefficient (μ) between the test pieces was calculated. As a result, the dynamic friction coefficients (average values of the values measured twice each) of the test pieces obtained in this example in the case of loads 1N, 2N, 3N, 5N, 10N and 13N were 0.18 and 0, respectively. .14, 0.13, 0.12, 0.12, and 0.10.

[Example 4]
Instead of silicon oil having a kinematic viscosity at 40 ° C. of 10,000 cSt (KF-96-10000 cs), vacuum grease having a kinematic viscosity at 40 ° C. higher than 1,000,000 cSt (flash point> 101 ° C., density 1.1 g / cm ³ ) was used. Except for the above, after obtaining two test pieces by the same method as in Example 1, the dynamic friction coefficient (μ) between the test pieces was calculated. As a result, the dynamic friction coefficients (average values of the values measured twice each) of the test pieces obtained in this example in the case of loads 1N, 2N, 3N, 5N, 10N and 13N were 0.22 and 0, respectively. .17, 0.15, 0.19, 0.17 and 0.16.

[Comparative Example 1]
Instead of silicon oil (KF-96-10000cs) with a kinematic viscosity at 40 ° C of 10,000 cSt, silicon oil with a kinematic viscosity at 40 ° C of 1000 cSt (KF-96-10000cs, flash point 315 ° C, pour point -50 ° C, density Except for using 0.97 g / cm ³ ), after obtaining two test pieces by the same method as in Example 1, the dynamic friction coefficient (μ) between the test pieces was calculated. As a result, the dynamic friction coefficients (average values of the values measured twice each) of the test pieces obtained in this example in the case of loads 1N, 2N, 3N, 5N, 10N and 13N were 0.26 and 0, respectively. .21, 0.19, 0.17, 0.16 and 0.16.

[Comparative Example 2]
Instead of silicone oil (KF-96-10000cs) having a kinematic viscosity at 40 ° C of 10,000 cSt, silicon oil (KF-96-5000cs, flash point 315 ° C, pour point-50 ° C, density at 40 ° C) Except for using 0.98 g / cm ³ ), after obtaining two test pieces by the same method as in Example 1, the dynamic friction coefficient (μ) between the test pieces was calculated. As a result, the dynamic friction coefficients (average values of the values measured twice each) of the test pieces obtained in this example in the case of loads 1N, 2N, 3N, 5N, 10N and 13N were 0.26 and 0, respectively. .22, 0.20, 0.17, 0.16 and 0.16.

[Comparative Example 3]
After obtaining two test pieces by the same method as in Example 1 except that silicon oil (KF-96-10000cs) having a kinematic viscosity at 40 ° C. of 10,000 cSt was not applied, the dynamic friction coefficient between the test pieces was obtained. (Μ) was calculated. As a result, the dynamic friction coefficients (average values of the values measured twice each) of the test pieces obtained in this example in the case of loads 1N, 2N, 3N, 5N, 10N and 13N were 0.48, 0, respectively. .34, 0.33, 0.28, 0.24 and 0.21.

[Comparative Example 4]
Instead of silicon oil (KF-96-10000cs) with a kinematic viscosity at 40 ° C of 10,000 cSt, liquid paraffin with a kinematic viscosity at 40 ° C of 5 cSt (No. 40-S, flash point 134 ° C, pour point -8 ° C, density) Except for using 0.83 g / cm ³ ), after obtaining two test pieces by the same method as in Example 1, the dynamic friction coefficient (μ) between the test pieces was calculated. As a result, the dynamic friction coefficients (average values of the values measured twice each) of the test pieces obtained in this example in the case of loads 1N, 2N, 3N, 5N, 10N and 13N were 0.38 and 0, respectively. .32, 0.24, 0.22, 0.19 and 0.18.

[Comparative Example 5]
Instead of silicone oil (KF-96-10000cs) with a kinematic viscosity at 40 ° C of 10,000 cSt, liquid paraffin with a kinematic viscosity at 40 ° C of 28 cSt (No. 150-S, flash point 220 ° C, pour point -8 ° C, density) Except for using 0.86 g / cm ³ ), after obtaining two test pieces by the same method as in Example 1, the dynamic friction coefficient (μ) between the test pieces was calculated. As a result, the dynamic friction coefficients (average values of the values measured twice each) of the test pieces obtained in this example in the case of loads 1N, 2N, 3N, 5N, 10N and 13N were 0.33 and 0, respectively. .24, 0.23, 0.19, 0.17 and 0.16.

[Comparative Example 6]
Instead of silicon oil (KF-96-10000cs) having a kinematic viscosity at 40 ° C. of 10,000 cSt, liquid paraffin (No. 350-S having a kinematic viscosity at 40 ° C. of 78 cSt, flash point 224 ° C., pour point −8 ° C., density Except for using 0.88 g / cm ³ ), after obtaining two test pieces by the same method as in Example 1, the dynamic friction coefficient (μ) between the test pieces was calculated. As a result, the dynamic friction coefficients (average values of the values measured twice each) of the test pieces obtained in this example in the case of loads 1N, 2N, 3N, 5N, 10N and 13N were 0.27 and 0, respectively. .22, 0.20, 0.15, 0.15 and 0.15.

[Comparative Example 7]
Instead of silicone oil (KF-96-10000cs) having a kinematic viscosity at 40 ° C of 10,000 cSt, silicon oil having a kinematic viscosity of 10 cSt at 40 ° C (KF-96-10cs, flash point 160 ° C, pour point -100 ° C, density Except for using 0.94 g / cm ³ ), after obtaining two test pieces by the same method as in Example 1, the dynamic friction coefficient (μ) between the test pieces was calculated. As a result, the dynamic friction coefficients (average values of the values measured twice each) of the test pieces obtained in this example in the case of loads 1N, 2N, 3N, 5N, 10N and 13N were 0.33 and 0, respectively. .30, 0.25, 0.23, 0.19 and 0.14.

[Comparative Example 8]
Instead of silicone oil (KF-96-10000cs) having a kinematic viscosity at 40 ° C of 10,000 cSt, silicon oil (KF-96-100cs, flash point 315 ° C, pour point -50 ° C, density) having a kinematic viscosity at 40 ° C of 100 cSt Except for using 0.97 g / cm ³ ), after obtaining two test pieces by the same method as in Example 1, the dynamic friction coefficient (μ) between the test pieces was calculated. As a result, the dynamic friction coefficients (average values of the values measured twice each) of the test pieces obtained in this example in the case of loads 1N, 2N, 3N, 5N, 10N and 13N were 0.28 and 0, respectively. .22, 0.20, 0.19, 0.17 and 0.16.

[Comparative Example 9]
Instead of silicon oil (KF-96-10000cs) with a kinematic viscosity at 40 ° C of 10,000 cSt, press oil with a kinematic viscosity of 6 cSt at 40 ° C (Unipress PA5, flash point 140 ° C, pour point -38 ° C, density 0.83g Except for using / cm ³ ), after obtaining two test pieces by the same method as in Example 1, the coefficient of dynamic friction (μ) between the test pieces was calculated. As a result, the dynamic friction coefficients (average values of the values measured twice each) of the test pieces obtained in this example in the case of loads 1N, 2N, 3N, 5N, 10N and 13N were 0.31 and 0, respectively. .26, 0.23, 0.22, 0.18 and 0.17.

  Table 1 shows the types and characteristics of the lubricants of the test pieces obtained in these Examples and Comparative Examples, and Table 2 shows the friction coefficient and the ratio of the friction coefficient with respect to the absence of the lubricant. Moreover, the relationship between the friction coefficient of the test piece obtained by the Example and the comparative example and kinematic viscosity of a lubricant is shown in FIG.

Claims (10)

A connection terminal comprising a male terminal and a female terminal which are in contact with each other, wherein a lubricant having a kinematic viscosity of 6000 cSt or more is applied to a portion where the male terminal and the female terminal are in contact with each other. 2. The connection terminal according to claim 1, wherein each of the male terminal and the female terminal is made of a plating material in which a plating layer is formed on a surface of a conductor base material. The connection terminal according to claim 2, wherein the plating layer is a Sn plating layer, an Ag plating layer, or an Au plating layer. The connection terminal according to claim 2, wherein the conductor base is made of copper or a copper alloy. The connection terminal according to claim 1, wherein the lubricant is liquid paraffin or silicon oil. A method of manufacturing a connection terminal comprising a male terminal and a female terminal which are in contact with each other, wherein a lubricant having a kinematic viscosity of 6000 cSt or more is applied to a portion where the male terminal and the female terminal are in contact. The method of manufacturing a connection terminal according to claim 6, wherein each of the male terminal and the female terminal is made of a plating material in which a plating layer is formed on a surface of a conductor base material. The method for manufacturing a connection terminal according to claim 7, wherein the plating layer is a Sn plating layer, an Ag plating layer, or an Au plating layer. The method for manufacturing a connection terminal according to claim 7, wherein the conductor base material is made of copper or a copper alloy. The method for manufacturing a connection terminal according to claim 6, wherein the lubricant is liquid paraffin or silicon oil.

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