JP2013055055A - Improved accessory for led lamp - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide accessories for LED lamps, and to mount the accessories on illumination sources such as the LED lamp simply at low cost.SOLUTION: The LED lamp comprises a lens, wherein the lens is mechanically affixed to the LED lamp. The lens is designed to be fitted to a first fixture mechanically attached to the lens. The accessory is designed to have a second fixture. The second fixture is engaged with the first fixture, thereby a retaining force is generated between the first accessory and the lens by using the first and second fixtures. In some embodiments, the retaining force is a mechanical force and is achieved by mechanical engagement of a mechanical fixture. In other embodiments, the retaining force is a magnetic force and is achieved by a magnet fixture configured to have the magnetic force.

Description

  This application claims priority to US Application No. 13 / 480,767 (filing date: May 25, 2012). This application claims priority to US Provisional Application No. 61 / 530,832 (filing date: September 2, 2011). This application claims priority to US Provisional Application No. 61 / 655,894 (filing date: June 5, 2012). Each of these applications is incorporated herein by reference and for all purposes.

  The present disclosure relates to the field of LED lighting, and more particularly to improved accessory technology for LED lamps.

  For example, accessories for standard halogen lamps such as MR16 lamps include lenses, diffusers, color filters, polarizers, linear dispersion, accessories, collimators, projection frames, louvers and baffles. Examples of such accessory vendors include Abrisa, Rosco, and Lee Filters. These accessories can be used to control the quality of light from the lamp (eg, removing glare, changing the color temperature of the lamp, or fine-tuning the beam profile for a particular application).

  In general, accessories for certain lamps (eg, halogen lamps) are required to withstand high temperatures. Further, in the case of such a halogen lamp accessory, it is often necessary to remove the lamp from the lighting fixture when attaching the accessory. Due to these disadvantages, accessories are expensive and cumbersome and / or expensive and / or complicated to install.

  Therefore, an improved approach is needed to obtain accessories that can be attached to the lamp in the field.

  The present application relates to an apparatus for easily and inexpensively realizing an accessory for an LED lamp that can be modified in accordance with an existing lighting fixture.

  In a first aspect of the present application, the disclosed apparatus includes an LED lamp, a lens mechanically fixed to the LED lamp, a first fixture mechanically attached to the lens, and a second fixture. A first accessory having a first fixture and a first accessory meshed in the vicinity of the lens using the second fixture, the first fixture and the second fixture. The tool is configured to generate a holding force between the first accessory and the lens.

  In a second aspect of the present application, a method for providing and assembling an LED lamp accessory is provided.

  Those skilled in the art will appreciate that the drawings described herein are exemplary only. The drawings are not intended to limit the scope of the present disclosure.

  FIG. 1A shows an LED lamp assembled with an accessory according to certain embodiments.

  FIG. 1B shows an exploded view of LED lamps and accessories, according to certain embodiments.

  FIG. 2 illustrates an exploded view of an LED lamp and a plurality of accessories, according to certain embodiments.

  3A and 3B illustrate various embodiments provided by the present disclosure.

  4A and 4B illustrate modular diagrams according to certain embodiments of the present disclosure.

  5A and 5B are flow diagrams of assembly procedures provided by embodiments of the present disclosure.

  6A and 6B illustrate various embodiments of the present disclosure.

  FIG. 7 illustrates an exploded view of an LED lamp and multiple accessories according to certain embodiments of the present disclosure.

  FIG. 8A illustrates an arrangement of an LED lamp collimator according to a particular embodiment of the present disclosure.

  FIG. 8B is a perspective view of an LED lamp collimator according to certain embodiments of the present disclosure.

  FIG. 8C is a perspective view of a collimator for an LED lamp according to certain embodiments of the present disclosure.

  FIG. 9A illustrates a projector accessory for an LED lamp according to certain embodiments of the present disclosure.

  FIG. 9B is a front view of a projector accessory for an LED lamp according to certain embodiments of the present disclosure.

  FIG. 9C is a side view of a projector accessory for an LED lamp according to certain embodiments of the present disclosure.

  FIG. 10 is an exploded view of an LED lamp with a magnet accessory, according to certain embodiments of the present disclosure.

  FIG. 11A is a front elevation view of an LED lamp assembly having a magnet accessory, according to certain embodiments of the present disclosure.

  FIG. 11B is a rear elevation view of an LED lamp assembly having a magnet accessory, according to certain embodiments of the present disclosure.

  FIG. 11C is a rear cutaway view of an LED lamp assembly with a magnet accessory, according to certain embodiments of the present disclosure.

  FIG. 12 is a rear elevation view of an LED lamp assembly having a magnet accessory, according to certain embodiments of the present disclosure.

  The accessory (s) in this application includes any mechanical, optical or electromechanical component or electrical component that is mated with the LED lamp. In certain embodiments, the accessory comprises a light transmissive film, sheet, collimator, frame, plate, or any combination of the above. In certain embodiments, the accessory includes a mechanical fixture for holding the accessory in a mating position. Also, in certain embodiments, the accessory is held magnetically in place.

  Hereinafter, specific embodiments will be described in detail. The disclosed embodiments are not intended to limit the scope of the claims.

  In one embodiment, the LED lamp includes a lens having a center and a diameter, a first magnet attached to the center of the lens, a first accessory disposed on the lens, and the first accessory. A second magnet attached to the center of the second magnet. The first magnet and the second magnet are configured to hold the first accessory relative to the lens. In yet another embodiment, the magnet is configured so that the magnetic force between the first magnet and the second magnet allows self-centering of the accessory onto the lamp.

  FIG. 1A illustrates an embodiment LED lamp assembly 100 having an improved LED lamp accessory. As shown in FIG. 1A, the MR16 lamp including the lens 106 includes an LED lamp with attached accessories.

  FIG. 1B is an exploded view of an LED lamp 150 with an accessory in a system having an improved LED lamp accessory.

FIG. 1B shows an example of the LED lamp 150. The LED lamp 150 has an MR16 form factor that includes the heat sink 120. The lens 106 is attached to the heat sink 102 or other part of the lamp. In certain embodiments, lens 106 includes a folded total reflection lens. A first magnet (eg, magnet 102 ₁ ) is attached to the center of the lens 106. An accessory 104 (eg, a plastic accessory) with a second magnet (eg, magnet 102 ₂ ) attached to the center can be disposed on the lens 106. Opposing magnets (eg, magnet 102 ₁ , magnet 102 ₂ ) can hold accessory 104 against lens 106. These opposing first and second magnets can be configured to hold the accessory against the lens. For example, the opposing magnets can have both polarities. The accessory 104 can have substantially the same diameter as the lens, and in certain embodiments covers the optical area of the lens (eg, an area that exceeds 90% of the optical aperture of the LED lamp). For example, in certain embodiments, the accessory has a diameter of about 99% to 101% of the lens diameter, about 95% to 105% of the lens diameter, and in certain embodiments about 90% of the lens diameter. % To about 110%. In certain embodiments, the accessory includes a transparent film, such as a plastic film. In other embodiments, the accessory may be a plate made of a light transmissive material such as plastic or glass. In certain embodiments, the accessory is selected from a diffuser, color filter, polarizer, linear dispersive element, projector, louver, baffle, and / or any combination of the above. Also, in certain embodiments, the sum of the thicknesses of the first magnet and the first accessory is less than about 5 mm, less than about 3 mm, less than about 1 mm, less than about 0.5 mm, in certain embodiments. Less than about 0.25 mm.

  In some embodiments, a metal member (eg, iron, nickel, cobalt, certain steels and / or other alloys, and / or other hard or semi-hard materials) is substituted for one of the magnets. Can be used to receive mechanical interlocking accessories. Any one or more techniques known in the art can be applied to the design of the lens 106 (and / or lens subassembly) to accommodate the mechanical engagement accessory. For example, the mechanical engagement technique described above includes mechanical fixtures (eg, ring clip members, bayonet members, screwed ring members, leaf spring members, hinges, or any combination of the above). In addition, any of the engagement techniques described herein can be used to center the accessory during installation and / or use.

  FIG. 2 is an exploded view 200 of an LED lamp with multiple accessories in a system with an improved LED lamp accessory.

  In a particular embodiment as shown in FIG. 2, the LED lamp includes a second accessory 202. The second accessory 202 is disposed adjacent to the first accessory 104. In certain embodiments, a second magnet is attached to the center of the second accessory and uses the second magnet to secure the second accessory to the lamp.

  In certain embodiments, a third accessory 203 can be attached. For example, the third accessory may be a projection frame (as shown), a collimator (see FIG. 8A), or other accessory or combination of accessories.

  A collimator is a tube having a light-attenuating wall or an opaque (eg, light impervious) wall. The purpose of the collimator is to block or “cut off” or reduce high angle light projection emitted from the lamp. The collimator may be formed of a tube portion including an opening portion (for example, a tube portion in which one opening portion is provided at each end portion of the tube). At the end near the lamp, light enters the tube, low angle light exits the tube at the other end of the collimator opening, and high angle light is absorbed and / or extracted by the collimator wall. The length of the collimator can be determined at least in part based on the amount of high angle light emitted from the lamp.

  The projection frame is like a set of light frame features, such as shutters, baffles and / or louvers, added to the collimator and placed at the output of the end of the collimator. Since these light frame features are located at a position remote from the lens, it is possible to project the feature formed by the shape of the frame onto the wall. The frame may include a set of baffles, for example. The set of baffles intercepts, directs and / or reflects at least a portion of the light to provide any set of patterns of projection light from the lamp (eg, rectangular, square, elliptical and / or Or a triangular pattern). In certain embodiments, the silhouette image of the frame may be designed to be projected onto a surface such as a wall.

The term “LED lamp” may refer to any type of LED illumination source, for example, a type of lamp in which the outgoing light distribution is primarily directed into a single hemisphere. Examples of such lamps include form factor lamps such as MR, PAR, BR or AR. Listed in Table 1 below are some of the items specified in the form factor.
Also, some embodiments of LED lamps take the form of directional lamps with various designations as shown in Table 2.

In addition to the described GU5.3MR16 lamp, there are a number of LED lamp base configurations that can be used in the embodiments described in the present disclosure (see, eg, FIG. 3A). For example, Table 3 shows lamp-based standards (see “Nomenclature”) and their corresponding characteristics.

  In addition, there are a number of G-type lamps as listed in Listing 1 below.

  List 1: G4, GU4, GY4, GZ4, G5, G5.3, G5.3-4.8, GU5.3, GX5.3, GY5.3, G6.35, GX6.35, GY6.35, GZ6 .35, G8, GY8.6, G9, G9.5, GU1O, G12, G13, G23, GU24, G38, GX53.

  The accessories and accessory attachment methods of the present disclosure can be used with any suitable LED lamp configuration (eg, the configuration described in Table 1 and / or the configuration described in Table 2 and / or described in Table 3). And / or any of the configurations listed in Listing 1).

  The accessories shown in FIGS. 1 and 2 are attached to the central axis of the lamp / lens, but it is possible to attach these accessories to other locations mechanically or magnetically (but with sufficient light If output is available). For example, the attachment location may be provided in the vicinity of the lens periphery, or may be provided in the vicinity of the lamp form factor envelope. Various embodiments for attaching the accessory to other locations mechanically or magnetically are disclosed herein.

  FIG. 3A illustrates an embodiment of the present disclosure. Specifically, FIGS. 3A and 3B show an embodiment of an LED light source 300 that conforms to the MR16 form factor. The LED light source 300 has a base 320 that conforms to the GU 5.3 form factor. A GU5.3MR16 light source typically operates with an alternating current of 12 volts (eg, VAC). In the illustrated example, the LED light source 300 is configured to emit a spot beam having an angle of less than 15 degrees. In other embodiments, the LED light source may be configured to illuminate flood illumination with a beam angle greater than 15 degrees. In certain embodiments, the LED assembly may be used within the LED light source 300. Advanced LED assemblies are currently under development by the assignee of the present patent application. In various embodiments, the peak output of the LED light source 300 can exceed about 1,000 candela (or can exceed 100 lumens). In certain high power applications, the center beam candle power can exceed 10,000 candela or 100,000 candela, and the associated light level can exceed 1000 or 5000 lumens. Various embodiments of the present disclosure achieve brightness equal to or greater than that of conventional halogen bulb MR16 light.

  FIG. 3B shows a modular diagram in accordance with various embodiments of the present disclosure. As can be seen from FIG. 3B, in various embodiments, the LED light source 400 includes a lens 410, a light source in the form of an LED module / assembly 420, a heat sink 430, a base module 440, and a mechanically held accessory 460. And a holder 470. As described further below, in various embodiments, using such a modular approach when assembling the light source 400 reduces manufacturing complexity, reduces manufacturing costs, and reduces the cost of such light sources. Increased reliability.

  In various embodiments, the lens 410 and the mechanically held accessory 460 can be formed from a transparent material such as glass, polycarbonate, acrylic, COC material, or other material. In certain embodiments, the lens 410 can be configured in a folded path configuration, which produces a narrow output beam angle. With such a folded optical lens, it is possible to obtain output light with a narrower cylindrical structure from the embodiment of the light source 400 (than that normally available from conventional reflectors of corresponding depth) It becomes. The mechanically held accessory 460 may perform any of the functions (single or multiple) described for the accessory.

  In FIG. 3B, the lens 410 can be secured to the heat sink 430 by one or more clips. These one or more clips are integrally formed on the edge of the reflective lens 410. In addition, the reflective lens 410 can be fixed using an adhesive disposed in the vicinity of the portion where the LED assembly 420 is fixed to the heat sink 430. In various embodiments, a separate clip can be used to secure the reflective lens 410. These clips can be made of a heat-resistant plastic material, for example. By making such a heat-resistant plastic material white, it becomes possible to reflect backscattered light through the lens.

  In other embodiments, the clip 410 can be used to secure the lens 410 to the heat sink 430. Alternatively, the lens 410 can be secured to one or more indentations of the heat sink 430 as described in detail below. In some embodiments, once the lens 410 is secured to the heat sink 430, this attachment cannot be removed manually. That is, one or more instruments are required to separate these components without damage.

  The embodiment of FIGS. 3A and 3B is merely an exemplary embodiment. The details of the basic LED lamp component 445 can vary from LED lamp to LED lamp, so selecting one of the optional components of the basic LED lamp component 445 for efficiency, brightness, color An assembly having certain characteristics, such as thermal characteristics, is determined.

  In certain embodiments as described below, an integrated LED assembly and module may include a plurality of LEDs (eg, 36 series arranged LEDs, 36 parallel arranged LEDs (eg, , 12 LEDs arranged in 3 parallel rows), or other configurations). In certain embodiments, any number of LEDs can be used (eg, 1, 10, 16 or more). In certain embodiments, the LEDs can be connected in series electrically or in any other suitable configuration.

  In certain embodiments, the target power consumption of the LED assembly is less than 13 watts. This is much lower than the typical power consumption of halogen-based MR16 light (50 watts). As such, embodiments of the present disclosure can match the brightness or intensity of halogen-based MR16 light and use less than 20% of the energy. In certain embodiments, the LED assembly can be configured for higher power operation (eg, higher than 13 W), and higher power lamps such as PAR30, PAR38, and other lamp form factors. It can be incorporated into form factors. In certain applications, the LED assembly can be employed in a luminaire, and the lens assembly can be fitted with accessories according to embodiments provided by the present disclosure. This embodiment is not limited to lamp modifications.

  In various embodiments of the present disclosure, the LED assembly 420 is secured directly to the heat sink 430 to dissipate heat from the light output and / or electrical drive circuitry. In some embodiments, the heat sink 430 can include a protrusion 450 to be connected to an electrical drive circuit. As described below, the LED assembly 420 typically includes a flat substrate such as silicon. In various embodiments, it is contemplated that the operating temperature of the LED assembly 420 can be approximately 125 ° C to 140 ° C. Thereafter, the silicon substrate is fixed to the heat sink using a high thermal conductivity epoxy (eg, having a thermal conductivity of ~ 96 W / mk). In some embodiments, thermoplastic / thermosetting epoxies such as TS-369 and TS-3332-LD sold by Tanaka Kikinzoku Kogyo, for example, can be used, and other epoxies can also be used. In some embodiments, screws are not used in securing the LED assembly to the heat sink, but screws or other fastening means can be used in other embodiments.

In an embodiment, the heat sink 430 may be formed from a low heat / high heat conductive material. In some embodiments, the heat sink 430 may be formed from an anodized 6061-T6 aluminum alloy (thermal conductivity k = 167 W / mk and thermal emissivity e = 0.7). In other embodiments, other materials are also available (eg, 6063-T6 or 1050 aluminum alloy (thermal conductivity k = 225 W / mk. And thermal emissivity e = 0.9). For example, still other alloys such as AL1100 are available, and in yet other embodiments, die cast alloys with a low thermal conductivity of 96 W / mK are used, and additional coatings are added to improve thermal emissivity. (For example, if a paint using CR ₂ O ₃ or CeCO ₂ provided by ZYPCoatings, Inc is used, a thermal emissivity e = 0.9 can be obtained, and it is called Duracon from Materials Technologies Corporation With a coating sold under the trade name, heat Can be obtained Iritsu e> 0.98). In other embodiments, the heat sink 430 may include other metals such as copper.

  In some examples, the thermal resistance of the heat sink 430 is measured at approximately 8.5 ° C./Watt and the thermal resistance of the heat sink 430 is measured at approximately 7.5 ° C./Watt in free natural convection at an ambient temperature of 50 ° C. It was done. Further development and testing would reduce the thermal resistance to 6.6 ° C / Watt. In view of this patent disclosure, one of ordinary skill in the art will be able to conceive of other materials having other thermal properties consistent with embodiments of the present disclosure.

  In certain embodiments, the base module 440 in FIG. 3B is a standard GU5.3 physical and electronic interface to the lighting socket. As will be described in more detail below, a high temperature resistant electronic circuit is provided in the cavity in the base module 440. This high temperature tolerant electronic circuit is used to drive the LED assembly 420. In a ° C embodiment, a 12 VAC input voltage to the lamp is converted to 120 VAC, 40 VAC or other voltage by the LED drive circuit. The drive voltage can be set according to the specific LED configuration desired (eg, series, parallel / series). In various embodiments, the protrusion 450 extends within the cavity of the base module 440.

  The shell of the base module 440 can be formed from an aluminum alloy or a zinc alloy and / or can be formed from an alloy similar to that used for the heat sink 430 and / or the heat sink 430. In one example, an alloy (eg, AL1100) can be used. In other embodiments, high temperature plastic materials can be used. In some embodiments, instead of the base module 440 being a separate unit, the base module 440 can be monolithic with the heat sink 430.

  As shown in FIG. 3B, a portion of the LED assembly 420 (LED device silicon substrate) contacts the heat sink 430 in a recess in the heat sink 430. Further, another portion of the LED assembly 420 (including the LED drive circuit) is bent downward and inserted into the internal cavity of the base module 440.

  In an embodiment, an embedding resin can be used to facilitate heat transfer from the LED drive circuit to the shell of the base assembly and heat transfer from the silicon substrate of the LED device. The embedding resin can be applied to the internal cavity of the base module 440 and / or the recess in the heat sink 430 in one step. In certain embodiments, a suitable embedding resin can be used, such as Omegabond (R) 200 (Omega Engineering, Inc) or 50-1225 (Oxyx). In other embodiments, other types of heat transfer materials can be used.

  4A and 4B illustrate an embodiment of the present disclosure. More particularly, FIG. 4A illustrates an LED package subassembly (LED module) according to certain embodiments. More specifically, a state in which a plurality of LEDs 500 are arranged on the substrate 510 is illustrated. In some embodiments, the plurality of LEDs 500 can be connected in series and are powered from a power supply (VAC) of approximately 120 volts AC. In various embodiments, 30-40 LEDs can be used to allow sufficient voltage drop (eg, 3-4 volts) on each LED 500. In certain embodiments, 27-39 LEDs can be connected in series. In another embodiment, the LED 500 is connected in series and parallel and is powered by a power supply of approximately 40 VAC. For example, the plurality of LEDs 500 includes 36 LEDs. These 36 LEDs can be divided into 3 groups and 12 LEDs 500 connected in series can be provided in each group. Thus, each group is connected in parallel to a voltage source (40 VAC) obtained by the LED driver circuit, so that a sufficient voltage drop (eg, 3-4 volts) is achieved on each LED 500. In other embodiments, other drive voltages can be used and the LED 500 can have other arrangements.

  In certain embodiments, the LED 500 is mounted on a silicon substrate 510 or other thermally conductive substrate. In certain embodiments, a thin insulating layer and / or reflective layer may separate the LED 500 and the silicon substrate 510. The heat generated from the LED 500 can be transferred to the silicon substrate 510 and / or to the heat sink by a thermally conductive epoxy as described herein.

  In a specific embodiment, the size of the silicon substrate is approximately 5.7 mm x 5.7 mm and the depth is approximately 0.6 mm. Alternatively, the silicon substrate has a size of about 8.5 mm × 8 mm and a depth of about 0.6 mm. Such dimensions may vary depending on specific lighting requirements. For example, if a lower luminance intensity is required, a smaller number of LEDs may be mounted on the substrate, thus reducing the size of the substrate. In other embodiments, other substrate materials can be used, and other shapes and sizes can be used.

  As shown in FIG. 4A, a ring-shaped silicone (for example, a silicon dam 515) is provided around the LED 500 to define a well-type structure. In certain embodiments, a phosphorus support material is provided in the well structure. In operation, the LED 500 provides a blue, violet or UV emission output. As a result, the phosphorus support material is excited by the output light, and a white light output is emitted.

  As shown in FIG. 4A, a plurality of adhesive pads 520 can be provided on the substrate 510 (eg, 2-4). Thereafter, a conventional solder layer (eg, 96.5% tin and 5.5% gold) is provided on the silicon substrate 510 to form one or more solder balls 530 on the substrate. In the embodiment shown in FIG. 4A, four bond pads 520 are provided, each facing each corner and two for each power supply connection. In other embodiments, only two bond pads may be used, each provided for each AC power supply connection.

  FIG. 4A shows a flexible printed circuit (FPC) 540. In certain embodiments, the FPC 540 may include a flexible substrate material such as polyimide (eg, DuPont Kapton). As shown, the FPC 540 may include a series of bond pads 550 for bonding to the silicon substrate 510 and bond pads 550 for connecting to a high supply voltage (eg, 120 VAC, 40 VAC). Further, in some embodiments, an opening 570 is provided. Light emission from the LED 500 is sent through the opening 570.

  In embodiments of the present disclosure, FPC 540 of various shapes and sizes can be used. For example, as shown in FIG. 4A, by providing a series of cut portions 580 in the FPC 540, the influence of expansion and contraction of the FPC 540 on the substrate 510 is reduced. As another example, the number of adhesive pads 550, such as two, may be different. As another example, the FPC 540 can be crescent shaped and the opening 570 need not be a through hole. In other embodiments, other shapes and sizes of FPC 540 may be used in accordance with this patent disclosure.

  To combine the elements shown in FIG. 4A to obtain the assembly shown in FIG. 4B, the substrate 510 is bonded to the FPC 540 via the solder balls 530 in a conventional flip-chip arrangement with respect to the top surface of silicon. By making electrical connections on the top surface of the silicon, the FPC is electrically isolated from the heat transfer surface of the silicon. As a result, heat is transferred from the entire lower surface of the silicon substrate 510 to the heat sink. In addition, as a result, the LEDs can be directly bonded to the heat sink, thereby maximizing heat transfer instead of printed circuit board materials that typically suppress heat transfer. it can. As can be seen from this configuration, the LED 500 is arranged to emit light from the opening 570 in this way. In various embodiments, the above-described embedding resin can also be used when filling the space between the substrate 510 and the FPC 540 (see, for example, the notch 580). After bonding the electronic drive device and silicon substrate 510 to the FPC 540, the LED package submodule or assembly 420 is thus constructed.

  As an alternative, the LED 500 may be arranged to emit light into the lamp cavity, and powering the LED may be performed by a separate conductor. In various embodiments, the LED can be tested for proper operation, and such testing can be performed after the LED lamp is fully assembled or partially assembled.

  5A and 5B are block diagrams of a manufacturing process according to an embodiment of the present disclosure. In certain embodiments, portions of the manufacturing process can be performed in parallel or sequentially. For understanding, please refer to the functions in the preceding figure.

  In certain embodiments, the following process can be performed to form an LED assembly / module. First, a plurality of LEDs 500 are provided on an electrically insulated silicon substrate 510 and wired (step 600). As shown in FIG. 4A, a silicone dam 515 is placed on the silicon substrate 510 to form a well, which is then filled with a phosphorus support material (step 610). Next, the silicon substrate 510 is bonded to the flexible printed circuit 540 (step 620). As described above, in various embodiments, solder balls and flip chip solder can be used in the soldering process.

  Next, a plurality of electronic drive circuit devices and contacts can be soldered to the flexible printed circuit 540 (step 630). These contacts receive a drive voltage of approximately 12 VAC. As noted above, unlike current MR16 bulbs in the art, the electronic circuit device is capable of continuous high temperature operation (eg, 120 ° C.) in various embodiments.

  In various embodiments, the second portion of the flexible printed circuit (including the electronic driver circuit) is inserted into the heat sink and the inner cavity of the base module (step 640). As shown, the first portion of the flexible printed circuit is then bent approximately 90 degrees so that the silicon substrate is adjacent to the recess of the heat sink. Thereafter, the rear side of the silicon substrate is bonded to the heat sink in the recess of the heat sink using epoxy or the like (step 650).

  In various embodiments, one or more of the heat generating electronic drive components / circuits can be adhered to the protrusions of the heat sink (step 660). In some embodiments, the electronic drive component / circuit may have a heat dissipation contact (eg, a metal contact). These metal contacts can be attached to the protrusions of the heat sink via screws (eg, metal, nylon, etc.). In some embodiments, thermal epoxy can be used to secure one or more electronic drive components to the heat sink. Thereafter, the filling material is used to fill the space in the base module and function under the filling compound for the silicon substrate (step 670).

  Thereafter, the reflective lens can be secured to the heat sink (step 680). Thereafter, the LED light source is tested to check if it works properly (step 690).

  In certain embodiments, a properly operating base subassembly / module can be packaged (step 700) with one or more light transmissive member offerings and / or retaining rings (as described above); Shipped to one or more wholesalers, resellers, retailers or consumers (step 710). In certain embodiments, the module and the separate light transmissive member offering can be stored, stored, etc. The one or more light transmissive member offerings can be one or more lenses.

  Thereafter, in various embodiments, the end user desires a particular lighting solution (step 720). In certain examples, different beam angles, different cut-off angles or roll-offs, different coloring, different field angles, etc. may be required in the lighting solution. In various embodiments, the beam angle, the field angle, and the full cut-off angle may differ from the above depending on technical requirements and / or marketing requirements. Furthermore, the maximum strength can also vary depending on technical and / or marketing requirements.

  A second light transmissive member can be selected based on the end user's application (step 730). In various embodiments, the selected lens may or may not be part of a lighting module kit. That is, in some examples, each illumination module is provided on various light transmissive members. In another example, the illumination module is provided separately from the light transmissive member.

  In various embodiments, the assembly process can include attaching a retaining ring to one or more light transmissive members and snapping the retaining ring into a groove of the heat sink (step 740). In other embodiments, a retaining ring is already attached to each light transmissive member provided.

  In some embodiments, after the retaining ring is snapped to the heat sink, clip, etc., the retaining ring (and the second optical lens) cannot be removed by hand. In such a case, in order to remove the second optical lens (light transmissive member) from the assembled unit, it is necessary to use an instrument (for example, a thin screwdriver or pick). In other embodiments, the restraining mechanism can be removed by hand.

  In FIG. 5B, the assembled lighting unit is delivered to the end user and assembled (step 750).

  6A and 6B illustrate heat sink embodiments according to certain embodiments of the present disclosure. More specifically, FIG. 6A is a perspective view of a heat sink. FIG. 6B is a cross-sectional view of the heat sink.

  6A and 6B, the heat sink 800 includes a plurality of heat dissipating fins 810. FIG. Further, the fin 810 may include a meshing mechanism with the retaining ring / light transmissive member. As shown in the example of FIGS. 6A and 6B, the engagement mechanism includes a recess 820 on the fin 810. In some embodiments, the fins 810 can each include a recess 820, and in other embodiments, some of the fins 810 can include a recess. In other embodiments, the engagement mechanism may include the use of additional clips, clips on reflective optics, and the like.

  FIG. 7 shows another arrangement of the LED lamp accessory.

  In certain embodiments, the light transmissive member may be connected to a heat sink and / or an intermediate grating or the like connected to a reflective lens. Thus, embodiments of the present disclosure can be utilized in wide beam light sources or narrow beam light sources.

FIG. 8A shows an arrangement configuration of the LED lamp collimator 812. The arrangement 850 shows the LED lamp 150. The LED lamp 150 includes a lens having a center and a diameter. A first magnet is attached to the lens to accommodate the collimator accessory. The collimator accessory is placed on the lens, it is held in place by a second magnet 102 _2. Second magnet 102 ₂ is attached to the center of the collimator accessory (see Figure 8B).

  FIG. 8B is a rear view 860 of a collimator design for an LED lamp. In the illustrated configuration, the collimator can block side radiation. The surface of the collimator can be textured, polished, anodized or painted for decorative purposes or other purposes.

FIG. 8C is a rear view 890 of a collimator design for an LED lamp. In the illustrated arrangement, the collimator can interrupt lateral synchrotron radiation, it includes a magnet 102 _2. Magnet 102 ₂ is fixed to the diffuser 822. The diffuser 822 is integrated with the collimator 812.

FIG. 9A shows an arrangement 900 of projector accessories 910 for LED lamps. As used herein, the term “projector accessory” refers to an accessory attached to an LED lamp or other LED light source. As shown, the projector accessory 910 is magnetically attached to the LED lamp (see also the collimator 812 in FIGS. 8A and 8B). Projector accessory 910 includes a second optic and an adjustable baffle 903. As shown in FIG. 9A, the arrangement 900 shows an LED lamp 150. The LED lamp 150 includes a lens having a center and a diameter. A first magnet is attached to the lens to accommodate a projector accessory. The projector accessory is placed on the lens, it is held in place by the second magnet 102 _2. Second magnet 102 ₂ is attached to the center of the projector accessory (see Figure 9B). Projector accessory 910 includes an adjustable aperture and a focus lens (s) that allow manipulation of the projection light beam. In some cases, the LED lamp includes a lamp output mechanical aperture. In some cases, the LED lamp includes a first lens or a second lens. The first lens or the second lens is configured to cover more than 90% of the lamp output mechanical aperture.

  FIG. 9B is a front view 950 of a projector accessory 910 for an LED lamp, according to various embodiments of the present disclosure. As shown in FIG. 9B, the projector accessory 910 includes a housing 904. A plurality of adjustable baffles 903 mesh within the housing 904. Although these illustrated baffles are substantially straight, these baffles may be non-rectangular or irregularly shaped. Further, the projector accessory 910 of some embodiments has one or more focus lens (s). With these focus lenses, it is possible to manipulate the projection light beam to focus the pattern on the surface (e.g. wall, application, door). The surface is disposed at a predetermined distance from the focus lens.

FIG. 9C is a side view 975 of a projector accessory for an LED lamp. Rear view shows the magnet 102 _2.

FIG. 10 is an exploded view 1000 of an embodiment of the present disclosure. As shown, the LED lamp is fixed to the lens 106. Center and diameter of the lens 106 is configured to first magnet 102 ₁ mesh attached to the center 106 of the lens. The first accessory 104 is disposed on the lens 106 using the second magnet 102 _2. Second magnet 102 ₂ is attached mechanically to the center of the first accessory 104. The first magnet 102 ₁ and a second magnet 102 ₂ is configured to hold the first accessory 104 to the lens 106. The second accessory 202 is disposed on the first accessory 104 using the third magnet 102 _3. The third magnet 102 ₃ is attached mechanically to the center of the second accessory 202.

In some embodiments, for example, for the embodiment not attached to magnet 102 ₁ to the center of the lens 106, light leakage occurs at high optical angle. Undesirable glare occurs due to such light leakage. Magnet 102 ₁ blocking at least a portion of the undesired high angle light. In response to the shape and position of the magnet, glare is reduced. In some embodiments, by providing a special reflective coating on the magnet 102 _1, the high angle light more to reflect back to the general direction of the LED light sources or be directed in general direction of the LED light source Can do. In some embodiments, the magnets 102 ₁ may be coated with a material which absorbs the light. In other embodiments, by a magnet 102 ₁ untreated surface, it is possible to finely adjust the absorption and / or reflection. Further, the magnet can be realized as a disk, ring, donut or any other suitable shape.

FIG. 11A is a front elevation view 1100 of an LED lamp assembly. As shown in FIG. 11A, the lens 106 is attached to the heat sink 120. The design of the lens 106 includes a magnet (eg, a ring-shaped or donut-shaped magnet 102 ₃ ). This magnet can hold the accessory 104 against the lens 106. The first magnet (donut magnet 102 ₃ ) and the second magnet (eg, 102 ₄ ) are opposing magnets and can be configured to hold the accessory 104 against the lens 106. For example, the magnet 102 ₃ and 102 ₄ of these opposed may have opposite polarities. Further, the opposing magnets are shaped and positioned so as to be self-centering with respect to the lens 106 when attached.

FIG. 11B is a rear elevation view 1120 of the LED lamp assembly. As shown, the donut magnet 102 _3, only to close the part of the light emitted from the LED light source, the shaping in a particular position on the lens 106 and is fixed. In certain embodiments, the shape and position of the donut magnet attenuates glare (see emitted light pattern 1104).

FIG. 11C is a rear cut view 1140 of the LED lamp assembly. As shown, the donut magnet 102 _3, a portion of light emitted from the LED light source so as to return by reflection toward a general direction of the LED light source, the shaping in a particular position on the lens 106 And fixed. In some embodiments, the treated surface 1102 ₁ of the donut magnet 102 _3, as to reflect light in a specific pattern and direction, are treated. Specific patterns and directions can be pre-determined, and the choice of shape, position and surface treatment can be fine-tuned (emission light) so that the above can be adjusted using the predetermined specific patterns and directions. (See pattern 1104).

FIG. 12 is a rear elevation view 1200 of the LED lamp assembly. As shown, the disk magnet 102 _5, only to close the part of the light emitted from the LED light source, shaping and is fixed at a certain position on the lens 106. In some embodiments, the shape and position of the disk magnet functions to attenuate glare (see emitted light pattern 1104). Can be pre-determined specific pattern and direction, the disc magnet 102 ₅ and the processing surface 1102 ₂ shape, the choice of location and surface treatment, the above using a specific pattern and direction which is the pre-determined Fine adjustment can be made (see the radiation pattern 1204).

  In certain embodiments, an illumination source configured to output light having beam characteristics that can be changed by a user is provided. The illumination source includes: an LED light unit configured to provide light output in response to an output drive voltage, a drive module connected to the LED light unit, the input light receiving the input drive voltage A drive module configured to provide the output drive voltage; and a heat sink connected to the LED light unit, the heat sink generated from the LED light unit and the drive module. A heat sink, a reflector connected to the heat sink, the reflector configured to receive the light output and configured to output a first light beam having a first beam characteristic A lens connected to the heat sink for receiving the first light beam having the first beam characteristic. And the lens includes a lens configured to output a second light beam having a second beam characteristic, wherein the lens is selected by the user to achieve the second beam characteristic And the lens is connected to the heat sink by the user.

  In certain embodiments (eg, the most recent embodiment), an illumination source is provided. The illumination source is a transmissive optical lens and a retaining ring connected to the transmissive optical lens, the retaining ring configured to connect the transmissive optical lens to the heat sink. And a retaining ring.

  In certain embodiments, the retaining ring includes an incomplete circle.

  In certain embodiments of the illumination source, the lens connected to the heat sink is configured to require the use of an instrument to disconnect the lens from the heat sink.

  In a particular embodiment of the illumination source, the intensity of the light output from the illumination source is greater than approximately 1500 candela.

  In a particular embodiment of the illumination source, the first beam characteristic is selected from a beam angle, a cut-off angle, a roll-off characteristic, a field angle, and any combination of the above.

  In certain embodiments of the illumination source, the heat sink includes a plurality of radiating fins. At least one of the plurality of radiating fins includes a holding mechanism. The lens is configured to be connected to at least one of the plurality of heat radiating fins by a holding mechanism.

  In a particular embodiment of the illumination source, the holding mechanism is selected from a depression on the heat radiating fin, a clip connected to the heat radiating fin, and combinations thereof.

  In certain embodiments of the illumination source, the heat sink includes an MR16 form factor heat sink.

  In a particular embodiment of the illumination source, the drive module includes a GU 5.3 conform base.

  Certain embodiments provided by the present disclosure include a method of providing an accessory and a component for assembling the accessory for a user. Certain embodiments further provide a method of assembling the accessory provided by the present disclosure.

In a particular embodiment of a method of configuring a light source to provide a light beam having a user selected beam characteristic,
Receiving a light source, the light source comprising:
An LED light unit configured to provide a light output in response to an output drive voltage;
A drive module connected to the LED light unit, the drive module configured to receive an input drive voltage and configured to provide the output drive voltage;
A heat sink connected to the LED light unit, the heat sink configured to dissipate heat generated from the LED light unit and the drive module;
A reflector connected to the heat sink, the reflector configured to receive the light output, the reflector configured to output a light beam having a first beam characteristic;
Receiving a lens selected by a user to achieve a second beam characteristic, wherein the lens is configured to receive the light beam having the first beam characteristic; A step configured to output a light beam having beam characteristics;
Receiving the lens in response to the lens selected by the user, wherein the lens is separate from the light source;
Connecting the lens to the light source;
including.

In certain methods, such as the method just described, the lens includes an optical lens and a retaining ring connected to the optical lens, the retaining ring connecting the optical lens to the heat sink. Configured to do. Connecting the lens to the heat sink,
Compressing the retaining ring around the optical lens;
Placing the retaining ring compressed in a portion of the heat sink;
Releasing the retaining ring such that the retaining ring is connected to the portion of the heat sink;
including.

  In a particular embodiment of the method, the retaining ring comprises a circular metal.

  In certain embodiments, the method further comprises disconnecting the lens from the heat sink using an instrument. In the disconnection step, it is necessary to use an instrument when disconnecting the lens from the heat sink.

  In certain embodiments, the intensity of the light output is greater than approximately 1500 candela.

  In a particular embodiment of the method, the first beam characteristic is selected from the group consisting of a beam angle, a cut-off angle, a roll-off characteristic and a field angle.

  In a particular embodiment of the method, the heat sink includes a plurality of radiating fins. At least one of the plurality of radiating fins includes a holding mechanism. The step of connecting the lens to the heat sink includes the step of connecting the lens to the at least one radiation fin via the holding mechanism.

  In a particular embodiment of the method, the holding mechanism is selected from the group consisting of a recess on the radiating fin and a clip connected to the radiating fin.

  In a particular embodiment of the method, the heat sink comprises an MR16 form factor heat sink.

  In a particular embodiment of the method, the drive module comprises a GU 5.3 conform base.

  Those of ordinary skill in the art will appreciate additional embodiments after reading this disclosure. In other embodiments, combinations or subcombinations of the above disclosure can be advantageously obtained. The architecture and flowchart block diagrams are grouped for clarity. However, it should be understood that combinations of blocks, addition of new blocks, rearrangement of blocks, etc. are contemplated in other embodiments of the present disclosure.

  The specification and drawings are accordingly to be regarded as illustrative rather than restrictive. However, it will be apparent that various modifications and changes can be made in the specification and drawings without departing from the broader intent and scope.

The above examples describe examples of components of the embodiments disclosed herein. It will be apparent to those skilled in the art that many modifications, both in materials and methods, can be made without departing from the scope of the disclosure. It should also be noted that there are other ways to implement the embodiments disclosed herein. Accordingly, the embodiments are to be regarded as illustrative rather than restrictive, and the scope of the claims is not intended to be limited to the details described herein, It should be considered as being modifiable within the scope and range of equivalents thereof.

Claims (19)

An LED lamp,
A lens mechanically fixed to the LED lamp;
A first accessory having a first fixture mechanically attached to the lens and a second fixture;
A first accessory meshed in the vicinity of the lens using the first fixture and the second fixture;
The apparatus wherein the first fixture and the second fixture are configured to generate a holding force between the first accessory and the lens.   The apparatus according to claim 1, wherein the holding force is a mechanical force of a fixture.   The apparatus of claim 1, wherein the first fixture includes a magnet.   The apparatus according to claim 1, wherein the holding force is a magnetic force.   The apparatus of claim 1, wherein the first fixture includes a magnet.   The apparatus of claim 1, wherein the first fixture includes a disk magnet.   7. The apparatus of claim 6, wherein the disk magnet includes at least one surface that is treated to adjust the emitted light pattern.   The apparatus of claim 1, wherein the first fixture includes a donut magnet.   9. The apparatus of claim 8, wherein the donut magnet includes at least one surface that is treated to adjust the emitted light pattern.   6. The apparatus of claim 5, wherein the combined thickness of the first magnet and the first accessory is less than 2 mm.   The apparatus of claim 1, wherein the first accessory comprises thin plastic.   The apparatus of claim 11, wherein the thin plastic film has a thickness of less than 3 mm.   The apparatus of claim 1, wherein the diameter of the first accessory is substantially the same as the diameter of the lens.   The apparatus of claim 1, wherein the first accessory is selected from a lens, a diffuser, a color filter, a polarizer, a linear dispersive element, a collimator, a projector accessory, and any combination of the above. .   The apparatus of claim 1, further comprising an accessory, wherein the accessory is selected from a louver, a baffle, a second lens, and any combination of the above.   The apparatus of claim 1, wherein the lens comprises a folded total reflection lens.   The apparatus of claim 1, wherein the LED lamp is characterized by a lamp output mechanical aperture, and the lens is configured to cover more than 90% of the lamp output mechanical aperture.   A second accessory having a third fixture, wherein the second accessory is engaged with the first accessory using the second fixture and the third fixture; The apparatus of claim 1, wherein the second fixture and the third fixture are configured to generate a holding force between the second accessory and the third accessory. . The apparatus of claim 1, wherein at least one surface of the first fixture is treated to adjust the emitted light pattern.