JP2013053893A - X-ray analyzer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an X-ray analyzer capable of suppressing influence due to variation of performance characteristics of a preamplifier prestage.SOLUTION: The X-ray analyzer comprises: a preamplifier prestage including a semiconductor X-ray detection element for detecting a fluorescent X-ray emitted from a standard sample and a first-stage FET circuit for receiving an output signal of the semiconductor X-ray detection element; a cooler for cooling the preamplifier prestage; a signal analyzer for analyzing a detection signal outputted from the preamplifier prestage; and a controller for monitoring a performance value showing performance characteristics of the preamplifier prestage obtained by analyzing the detection signal, and a temperature of the preamplifier prestage in a real time, controlling the cooler to adjust the temperature of the preamplifier prestage so that the performance value satisfies a specified value. The preamplifier prestage analyzes a fluorescent X ray emitted from a measuring object at the adjusted temperature.

Description

  The present invention relates to an X-ray analyzer having a semiconductor X-ray detector.

  An energy dispersive X-ray analyzer that analyzes X-rays specific to a substance emitted from a substance includes a semiconductor X-ray detection element, a first stage FET circuit that amplifies an electrical output signal from the semiconductor X-ray detection element, and the like. It has a semiconductor X-ray detector.

  In general, semiconductor X-ray detection elements and first-stage FET circuits have better performance as the temperature is lower. For example, a semiconductor X-ray detection element or a first stage FET circuit is used in the range of −20 ° C. to −160 ° C. In this range, the freezing of the donor does not occur, so the noise amount of the first stage FET circuit is smaller as the temperature is lower.

  As the cooling method, liquid nitrogen, a multistage thermo module, a refrigerator, or the like can be used. When liquid nitrogen is used, the semiconductor X-ray detection element can be cooled to the liquid nitrogen temperature. However, since the use of liquid nitrogen involves work risks, in recent years, cooling means using multistage thermomodules or refrigerators are becoming mainstream. In the background, with respect to semiconductor X-ray detection elements (especially elements using Si), the characteristics of Si ingots have been improved, so that it is possible to obtain characteristics that do not require cooling to the liquid nitrogen temperature. Can be mentioned.

  For example, a semiconductor X-ray detection element and a first stage FET circuit (hereinafter referred to as “preamplifier front stage”) are supported and cooled by a cold finger, and the cold finger is cooled by a cooling device such as a multistage thermo module or a refrigerator. It is cooled (for example, refer to Patent Document 1). At this time, the temperature of the cold finger near the front stage of the preamplifier unit is monitored, and the cooling device is controlled based on the monitored temperature, whereby the front stage of the preamplifier unit is cooled to a desired temperature.

JP 2009-186403 A

  The inside of the semiconductor X-ray detection apparatus is thermally insulated by a vacuum to prevent the gas from adsorbing to the front stage of the preamplifier during cooling and changing the characteristics. However, even if vacuum insulation is used, the degree of vacuum deteriorates due to degassing from the material and the inner wall inside the semiconductor X-ray detector. For this reason, degassing is adsorbed to the front stage of the preamplifier and fluctuations in performance characteristics occur.

  In view of the above problems, an object of the present invention is to provide an X-ray analysis apparatus in which an influence due to a change in performance characteristics of a pre-amplifier front stage is suppressed.

  According to one aspect of the present invention, (a) a preamplification including a semiconductor X-ray detection element that detects fluorescent X-rays emitted from a standard sample, and a first-stage FET circuit that receives an output signal of the semiconductor X-ray detection element (B) a cooling device for cooling the front stage of the preamplifier, (c) a signal analyzer for analyzing the detection signal output from the front stage of the preamplifier, and (d) analyzing the detection signal The obtained performance value indicating the performance characteristics of the preamplifier front stage and the temperature of the preamplifier front stage are monitored in real time, and the cooling unit is controlled so that the performance value satisfies the specified value. There is provided an X-ray analyzer that includes a control device that adjusts the temperature and analyzes the fluorescent X-rays emitted from the measurement object at the temperature at which the pre-amplifier front stage is adjusted.

  ADVANTAGE OF THE INVENTION According to this invention, the X-ray-analysis apparatus by which the influence by the fluctuation | variation of the performance characteristic of a pre-amplifier front part was suppressed can be provided.

It is a schematic diagram which shows the structure of the X-ray analyzer which concerns on embodiment of this invention. It is a schematic diagram which shows the structure of the holder for sample mounting used for the X-ray analyzer which concerns on embodiment of this invention. It is a graph which shows the relationship between preset temperature and the resolution | decomposability of a preamplifier front part. It is a graph which shows the relationship between generated energy and a count number. It is a graph which shows the relationship between temperature and the variation | change_quantity of the gain of a pre-amplifier front part. It is a flowchart for demonstrating the analysis method using the X-ray analyzer which concerns on embodiment of this invention. It is a schematic diagram which shows the measurement state of the measuring object by the X-ray analyzer which concerns on embodiment of this invention. It is a schematic diagram which shows the structure of the X-ray analyzer which concerns on other embodiment of this invention.

  Embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic. Therefore, specific thicknesses and dimensions should be determined in consideration of the following description.

  Further, the embodiments described below exemplify apparatuses and methods for embodying the technical idea of the present invention, and the embodiments of the present invention include the material, shape, structure, arrangement, etc. of components. Is not specified as follows. The embodiment of the present invention can be variously modified within the scope of the claims.

  As shown in FIG. 1, an X-ray analyzer 1 according to an embodiment of the present invention includes an X-ray tube 200 that emits excitation X-rays X1, a measurement chamber 300 that stores a standard sample 500 and a measurement object 600, A semiconductor X-ray detection apparatus 10 on which a fluorescent X-ray X2 emitted from a standard sample 500 irradiated with an excitation X-ray X1 or a measurement object 600 enters is provided. The standard sample 500 is mounted on a holder 400 disposed in the measurement chamber 300. Details of the holder 400 will be described later. Further, as shown in FIG. 1, the measurement object 600 is stored in the measurement chamber 300 so as to be located behind the holder 400 when viewed from the X-ray tube 200.

  The semiconductor X-ray detection device 10 outputs a detection signal ST indicating a magnitude proportional to the energy of the fluorescent X-ray X2 emitted from the standard sample 500 or measurement object 600 irradiated with the excitation X-ray X1. Pre-amplifier 100, cooling device 50 that cools pre-amplifier pre-stage 100, signal analyzer 30 that analyzes detection signal ST output from pre-amplifier pre-stage 100, and performance value of pre-amplifier pre-stage 100 Includes a control device 40 that controls the cooling device 50 so as to adjust the temperature of the pre-amplifier pre-stage 100 so that the predetermined prescribed value is satisfied. That is, the X-ray analyzer 1 irradiates an object with the excitation X-ray X1 output from the X-ray tube 200, and detects and analyzes the fluorescent X-ray X2 emitted from the object. It is. The preamplifier front stage 100 includes a semiconductor X-ray detection element 12 and a first stage FET circuit 13.

  When the fluorescent X-ray X2 enters the semiconductor X-ray detection device 10, the fluorescent X-ray X2 is detected by the semiconductor X-ray detection element 12, and the fluorescent X-ray is received from the first stage FET circuit 13 that has received the output signal of the semiconductor X-ray detection element 12. A detection signal ST indicating a magnitude proportional to the energy of X2 is output. The fluorescent X-ray X2 has energy specific to the element contained in the measurement object. For this reason, the element contained in the measurement object is specified by analyzing the detection signal ST by the signal analyzer 30.

  The control device 40 includes a performance value indicating the performance characteristics of the preamplifier front stage 100 obtained from the detection signal ST for detecting and analyzing the fluorescent X-ray X2 emitted from the standard sample 500, and the preamplifier front stage 100. Is monitored in real time to adjust the temperature of the preamplifier pre-stage 100 so that the performance value satisfies a preset specified value.

  Thereafter, the X-ray analyzer 1 analyzes the fluorescent X-ray X2 emitted from the measurement object 600 by the preamplifier pre-stage 100 set to the temperature adjusted using the standard sample 500.

  The standard sample 500 is used for performance characteristic variation correction of the preamplifier pre-stage 100. Therefore, a sample whose analysis result by the X-ray analyzer 1 is known is adopted as the standard sample 500. As an index for inspecting the variation in the performance characteristics of the preamplifier pre-stage 100, for example, resolution obtained from the spectral characteristics, background noise, or the like is used.

  2A and 2B show an example of a holder 400 on which two types of standard samples 501 and 502 can be mounted and an entrance window 410 is formed. As the material of the standard samples 501 and 502, a metal having a high purity (for example, about 99.9999%) or the like is selected according to the performance characteristics to be inspected for the preamplifier pre-stage 100. For example, when inspecting the resolution of the preamplifier pre-stage 100, a high-purity manganese (Mn) material is prepared as the standard sample 500. Alternatively, when inspecting for background noise, a high purity antimony (Sb) material is prepared as the standard sample 500. In addition, a standard sample 500 such as an aluminum (Al) material or a tin (Sn) material is appropriately used.

  In the holder 400 shown in FIGS. 2A and 2B, the excitation X-ray X1 is irradiated onto the measurement object 600 through the incident window 410, and the fluorescent X-ray X2 is emitted from the measurement object 600. Released. Therefore, when analyzing the measurement object 600, the holder 400 is moved so that the excitation X-ray X1 and the fluorescent X-ray X2 pass through the incident window 410.

  The holder 400 shown in FIG. 2A is a turret type. By rotating the holder 400 in the direction of the arrow about the center, the holder 400 is excited to one of the standard sample 501, the standard sample 502, or the incident window 410. The line X1 is irradiated. As a result, the X-ray analysis is performed on the desired target among the standard sample 501, the standard sample 502, and the measurement target 600 using the excitation X-ray X1. For example, if a Mn material for resolution inspection is disposed as the standard sample 501 and an Sb material for background noise inspection is disposed as the standard sample 502, the resolution inspection and the background noise inspection can be continuously performed. .

  The holder 400 shown in FIG. 2B is a slide type. By sliding the holder 400 in the direction of the arrow, X-ray analysis can be performed on a desired object among the standard sample 501, the standard sample 502, and the measurement object 600. Done.

  Next, details of the semiconductor X-ray detection apparatus 10 will be described. As shown in FIG. 1, a semiconductor X-ray detection apparatus 10 includes a preamplifier front stage 100 including a semiconductor X-ray detection element 12 and a first stage FET circuit 13, and a cold finger 14 that supports and cools the preamplifier front stage 100. And a vacuum vessel 11 for storing the preamplifier front stage 100 and the cold finger 14 and vacuum-insulating the internal preamplifier front stage 100 and the like from the outside.

  At the time of X-ray detection, the inside of the vacuum vessel 11 is maintained in a vacuum state. The fluorescent X-ray X2 passes through the incident window disposed in the vacuum vessel 11 and enters the semiconductor X-ray detection element 12. The incident window is made of beryllium (Be), for example.

  The semiconductor X-ray detection element 12 is a semiconductor element having a P-I-N junction formed by, for example, diffusing lithium (Li) into a silicon (Si) single crystal. When the fluorescent X-ray X2 enters the semiconductor X-ray detection element 12, electrons and holes are generated in the semiconductor X-ray detection element 12 by the fluorescent X-ray X2 incident on the I layer, and are detected as current pulses outside. The electrical output signal output from the semiconductor X-ray detection element 12 is amplified by the field effect transistor (FET) of the first stage FET circuit 13.

  The cold finger 14 has, for example, a cylindrical shape, and the semiconductor X-ray detection element 12 and the first stage FET circuit 13 are stored inside the cold finger 14. A temperature sensor 17 is attached in the vicinity of the preamplifier front stage 100 of the cold finger 14, and the temperature TC of the cold finger 14 measured by the temperature sensor 17 is transmitted via the signal cable 19 and the vacuum terminal 18 to the control device 40. Is transmitted to. As the temperature sensor 17, a platinum resistor, a thermistor, a thermocouple, or the like can be used.

  As described above, the control device 40 can monitor the temperature near the preamplifier front stage 100 of the cold finger 14 as the temperature of the preamplifier front stage 100 by the temperature sensor 17.

  As shown in FIG. 1, the cooling device 50 includes a refrigerator 51, a refrigerator driving device 52 that drives the refrigerator 51, a cold head 53, and a heat conduction wire 54. The refrigerator driving device 52 controls the cooling capacity of the refrigerator 51 by adjusting the drive output SD. The cold finger 14 is cooled by a cold head 53 that is connected to the refrigerator 51 outside the vacuum vessel 11 and a part of which is disposed in the vacuum vessel 11. The cold finger 14 and the cold head 53 are connected by a heat conducting wire 54. That is, the cooling device 50 cools the preamplifier pre-stage 100 by cooling the cold finger 14.

  Note that activated carbon 20 is disposed inside the vacuum vessel 11 in order to suppress characteristic fluctuation caused by the internal gas adsorbed on the pre-amplifier pre-stage 100 during cooling. The activated carbon 20 works more effectively as the temperature is lower. For this reason, in the example shown in FIG. 1, the activated carbon 20 is attached to the cold head 53, and the activated carbon 20 is cooled by the refrigerator 51.

  The detection signal ST output from the preamplifier pre-stage 100 is transmitted to the signal analyzer 30 via the signal cable 19 and the vacuum terminal 18. The result of analyzing the detection signal ST by the signal analysis device 30 is transmitted to the control device 40.

  The control device 40 uses the analysis result of the signal analysis device 30 to determine whether or not the performance value indicating the performance characteristic of the preamplifier pre-stage 100 satisfies a preset specified value. When the performance value does not satisfy the specified value, the cooling device 50 is controlled to adjust the temperature of the preamplifier pre-stage 100. Specifically, the refrigerator driving device 52 is controlled by the control signal SC so that the temperature of the preamplifier front stage 100 monitored by the temperature sensor 17 becomes a temperature at which the performance value of the preamplifier front stage 100 satisfies a specified value. Is controlled to adjust the cooling capacity of the refrigerator 51. The specified value of the performance value is set to a value at which a highly reliable analysis result can be obtained by the X-ray analyzer 1. For this reason, according to the X-ray analyzer 1, it is possible to obtain an analysis result with high stability and good reproducibility.

  FIG. 3 shows an example of the relationship between the set temperature and the resolution of the preamplifier pre-stage 100. The definition of the resolution is the half value of the Kα ray of Mn. In either case of the elements A and B made of different materials, the resolution is improved by lowering the set temperature. The specified value of resolution is, for example, 155 eV.

  FIG. 4 shows an example of the relationship between the set temperature and the background noise. FIG. 4 is an X-ray analysis result using an Sb material as a sample, where the horizontal axis represents energy and the vertical axis represents the count number. In FIG. 4, a characteristic T1 is a spectral characteristic when the set temperature is −90 ° C., and a characteristic T2 is a spectral characteristic when the set temperature is −110 ° C. As shown in FIG. 4, the background noise is reduced by lowering the set temperature. In the background noise measurement using the Sb material as a sample, for example, the measurement time is 300 seconds, and the total of the region where the Sb peak does not exist (for example, 10 KeV to 15 Kev) is set as the background noise. The specified value of the background noise is, for example, 250 count · KeV (50 count × 5 KeV).

  As described above, performance characteristics such as resolution and background noise are improved by lowering the temperature of the pre-amplifier pre-stage 100.

  Further, since the cooling capacity by the cooling device 50 is increased, the activated carbon 20 works more effectively and adsorbs the internal gas generated in the vacuum vessel 11. Thereby, the internal gas adsorption amount to the pre-amplifier pre-stage 100 is reduced, and the characteristic variation of the pre-amplifier pre-stage 100 is suppressed.

  However, by reducing the temperature of the preamplifier pre-stage 100, the energy position of the spectral characteristics varies. FIG. 5 shows an example of the relationship between temperature and peak position variation. FIG. 5 shows the peak position of the Kβ line when the Sn material is used for the sample. FIG. 5 shows that the gain varies with temperature.

  Therefore, when the temperature of the preamplifier pre-stage 100 is lowered, it is necessary to calibrate the fluctuation of the energy position in the X-ray analyzer 1 and to adjust the peak value of the spectral characteristics to the appropriate position.

  Below, with reference to FIG. 6, the X-ray-analysis method by the X-ray-analysis apparatus 1 is demonstrated. Here, a case where resolution and background noise are used as indices will be described as an example.

  In step S1, the temperature of the cold finger 14 is set to an initial set temperature by the cooling device 50. The initial set temperature is a value with a margin for the cooling performance of the refrigerator 51. The initial set temperature is preferably set to about 70% to 80% of the maximum cooling performance of the refrigerator 51. For example, when a Stirling refrigerator is used as the refrigerator 51, the minimum temperature reached by the refrigerator 51 is about −130 ° C., so that the initial set temperature is set in the vicinity of −90 ° C. to −100 ° C. The control device 40 controls the cooling device 50 while monitoring the temperature measured by the temperature sensor 17, and sets the temperature of the cold finger 14 to the initial set temperature.

  In step S2, the X-ray analyzer 1 performs X-ray analysis of the standard sample 500, and measures the resolution. For example, the Mn material is used for the standard sample 500, and the signal analyzer 30 calculates the half value of the Kα ray of Mn using the detection signal ST output from the preamplifier pre-stage 100. In step S3, the control device 40 determines whether or not the measured resolution satisfies a specified value. If the resolution satisfies the specified value, the process proceeds to step S6. If the resolution does not satisfy the specified value, the process proceeds to step S4.

  In step S4, the control device 40 controls the cooling device 50 to lower the temperature of the cold finger 14 and reset the set temperature. As a result, the temperature of the pre-amplifier pre-stage 100 is lowered, and in step S5, the signal analyzer 30 calibrates the fluctuation of the energy position according to the change amount of the set temperature. Thereafter, the process returns to step S2, and the resolution is measured again.

  If the resolution satisfies the specified value, in step S6, the X-ray analyzer 1 performs X-ray analysis of the standard sample 500, and the background noise is measured using the spectral characteristics. For example, an Sb material is used for the standard sample 500, and the signal analyzer 30 measures the sum of count values in a region where no Sb peak exists as background noise. In step S7, the control device 40 determines whether or not the measured background noise satisfies a specified value. If the background noise satisfies the specified value, the process proceeds to step S10. If the background noise does not satisfy the specified value, the process proceeds to step S8.

  In step S8, the control device 40 controls the cooling device 50 to lower the temperature of the cold finger 14 and reset the set temperature. As a result, the temperature of the preamplifier pre-stage 100 is lowered, and in step S9, the signal analyzer 30 calibrates the fluctuation of the energy position according to the change amount of the set temperature. Thereafter, the process returns to step S6, and the background noise is measured again.

  When the background noise satisfies the specified value, the target to be irradiated with the excitation X-ray X1 is automatically exchanged from the standard sample 500 to the measurement object 600 in step S10. For example, the holder 400 shown in FIGS. 2A and 2B is operated by the control device 40 so that the measurement target 600 is irradiated with the excitation X-ray X1 through the incident window 410 of the holder 400. To do. In step S11, the measurement object 600 is analyzed. At this time, as shown in FIG. 7, the fluorescent X-ray X2 emitted from the measurement object 600 irradiated with the excitation X-ray X1 enters the semiconductor X-ray detection element 12 of the semiconductor X-ray detection apparatus 10.

  As described above, in the X-ray analyzer 1 according to the embodiment of the present invention, the performance value indicating the performance characteristic of the preamplifier pre-stage 100 is monitored, and the preamplification is performed so that the performance value satisfies the specified value. The temperature of the front stage 100 is adjusted. For this reason, according to the X-ray analyzer 1, the performance characteristics necessary for obtaining a highly reliable analysis result are ensured. As a result, the influence of fluctuations in the performance characteristics of the preamplifier pre-stage 100 due to the material inside the apparatus, degassing from the inner wall, and the like is suppressed, and analysis with high stability and high reproducibility can be realized.

  The amount of change in the set temperature can be arbitrarily set. For example, the set temperature of the cold finger 14 is decreased by 5 ° C. or 10 ° C., for example. In order to operate the refrigerator 51 with a sufficient cooling capacity, it is preferable that the change amount of the set temperature is small. On the other hand, in order to determine the set temperature early, it is better that the change amount of the set temperature is large.

  By cooling the pre-amplifier pre-stage 100, performance characteristics such as resolution and background noise are improved, and the activated carbon 20 works better. That is, it is preferable to cool the cold finger 14 as much as possible in order to improve the degree of vacuum and the performance of the preamplifier pre-stage 100. However, when the refrigerator 51 is fully operated, the cooling performance is decreasing and the life of the refrigerator 51 is shortened.

  On the other hand, in the X-ray analyzer 1, the initial set temperature is set to a cooling temperature having a margin for the maximum cooling performance. Then, the performance characteristics of the preamplifier pre-stage 100 are monitored, and the set temperature is gradually lowered so that the performance value satisfies the standard value. For this reason, the cooling capacity of the refrigerator 51 is optimized so that the temperature at a limit at which the pre-amplifier pre-stage 100 can exhibit a desired performance. Therefore, it is not necessary to fully operate the refrigerator 51.

  As described above, in the X-ray analyzer 1, the performance of the preamplifier pre-stage 100 and the cooling capacity of the refrigerator 51 are optimized, so that there is a margin in the output of the refrigerator 51. By operating the refrigerator 51 with a margin with respect to the maximum cooling performance, it is possible to extend the life of the refrigerator 51 without causing a decrease in cooling performance.

(Other embodiments)
As mentioned above, although this invention was described by embodiment, it should not be understood that the description and drawing which form a part of this indication limit this invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

  In the description of the embodiment already described, an example in which resolution and background noise are used as the performance characteristics of the preamplifier front stage 100 has been described. However, the temperature of the preamplifier front stage 100 is set using performance characteristics other than these. You may adjust.

  The optical axis of the X-ray is optimized in the path of the X-ray tube 200 -the measurement object 600 -the semiconductor X-ray detection device 10. For this reason, due to the difference in position between the measurement object 600 and the standard sample 500, an optical axis shift may occur in the path of the X-ray tube 200-standard sample 500-semiconductor X-ray detection apparatus 10. In order to correct this optical axis deviation, as shown in FIG. 8, it is possible to provide an inclination to the surface of the standard sample 500 on which the excitation X-ray X1 is incident, thereby correcting the optical axis. An X-ray X20 indicated by a broken line in FIG. 8 is a fluorescent X-ray from the measurement object 600, and the semiconductor X-ray detection apparatus 10 for the fluorescent X-ray X2 from the standard sample 500 and the fluorescent X-ray from the measurement object 600. It is possible to make the incident position on the same.

  As described above, the present invention naturally includes various embodiments not described herein. Therefore, the technical scope of the present invention is defined only by the invention specifying matters according to the scope of claims reasonable from the above description.

DESCRIPTION OF SYMBOLS 1 ... X-ray analyzer 10 ... Semiconductor X-ray detector 11 ... Vacuum container 12 ... Semiconductor X-ray detector 13 ... First stage FET circuit 14 ... Cold finger 17 ... Temperature sensor 18 ... Vacuum terminal 19 ... Signal cable 20 ... Activated carbon 30 ... Signal analysis device 40 ... control device 50 ... cooling device 51 ... refrigerator 52 ... refrigerator drive device 53 ... cold head 54 ... heat conduction wire 100 ... pre-amplifier pre-stage 200 ... X-ray tube 300 ... measurement chamber 400 ... holder 410 ... Incident window 500 ... Standard sample 600 ... Measurement object X1 ... Excitation X-ray X2 ... Fluorescent X-ray

Claims (6)

A pre-amplifier front stage including a semiconductor X-ray detection element for detecting fluorescent X-rays emitted from a standard sample, and a first-stage FET circuit for receiving an output signal of the semiconductor X-ray detection element;
A cooling device for cooling the pre-amplifier front stage;
A signal analyzer for analyzing the detection signal output from the pre-amplifier front stage;
The performance value indicating the performance characteristics of the preamplifier front stage obtained by analyzing the detection signal and the temperature of the preamplifier front stage are monitored in real time, and the performance value is defined by controlling the cooling device. A control device that adjusts the temperature of the front stage of the preamplifier unit so as to satisfy the value, and the front stage of the preamplifier unit analyzes the fluorescent X-rays emitted from the measurement object at the adjusted temperature. X-ray analyzer characterized by the above.   The X-ray analysis apparatus according to claim 1, wherein the performance characteristic includes at least one of resolution and background noise. A cold finger for supporting and cooling the preamplifier front stage;
The cooling device cools the cold finger;
The X-ray analyzer according to claim 1, wherein the control device monitors a temperature of the cold finger near the front stage of the preamplifier unit as a temperature of the front stage of the preamplifier unit. An X-ray tube that emits the excitation X-ray;
The X-ray analysis apparatus according to claim 1, further comprising a measurement chamber that stores the standard sample and the measurement object.   5. The method according to claim 4, wherein after adjusting the temperature of the front stage of the preamplifier, the target irradiated with the excitation X-ray is automatically exchanged from the standard sample to the measurement target in the measurement chamber. The X-ray analyzer described. A vacuum container that thermally insulates the inside storing the pre-amplifier front stage, and
An X-ray analyzer according to any one of claims 1 to 5, further comprising activated carbon disposed inside the vacuum vessel, wherein the activated carbon is cooled by the cooling device.

Images