JP2013044050A - Thin film evaporator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve such problems that the conventional resin material coating method requires time to make a resin material flow to the extent of a heating plate surface to be coated due to a natural flow by gravity, and also easily causes uneven coating thickness and defective coating during flow, while the practical use of thin films requires both the quality of the films and productivity because uneven coating thickness and defective coating occurring in forming an electronic component using the thin resin film reduce the effect of using the thin films in half and lead to poor performance of the electronic component.SOLUTION: It is feasible to discharge an even amount of the resin onto the heating plate by utilizing an ejecting method using a needle valve as the method of applying the resin material. Further, the efficient and even ejection of the resin is practicable by installing a plurality of resin supply points according to the width of applying the resin. It is also feasible to control the grain diameter and amount of the resin to be ejected. It is feasible to form a thin film on a base material stably at a high speed, without being likely to be influenced by variations in the viscosity of the resin, by evaporating the films while the resin is evenly discharged, because the application of the resin is not of the type of a natural flow by gravity.

Description

  The present invention relates to a thin film manufacturing method and manufacturing apparatus.

  Resin thin films are widely used as electronic materials such as capacitors and semiconductors. To be widely used, it is important to be able to manufacture stably and economically. Many attempts have been made as a method of forming a resin thin film that satisfies these requirements. For example, in applications such as capacitors, continuous winding vacuum deposition, which is advantageous for high-speed mass production, is performed. At that time, it is selected according to the purpose of the thin film that forms the evaporation material and the substrate material, and at the same time, the reactive gas is introduced into the vacuum chamber as necessary, or the thin film is formed with the potential applied to the substrate. Thus, a thin film having desired characteristics can be formed. (Patent Documents 1 to 5)

  In the conventional method for producing a resin thin film, as shown in FIG. 10, the resin material is introduced into the vacuum chamber 5 through the supply valve 4. The long substrate 1 serving as a support is rolled out from the rolling-out roll 15, travels along the cylindrical can 7 through the guide roll, and is scraped off by the winding-up roll 16 through the guide roll 17. Resin vapor for forming a resin thin film on a long substrate is obtained by vaporizing a resin material supplied from a supply pipe. A part of the resin material supplied in liquid form is vaporized while flowing along the heating plate 11, and spreads in a thin liquid film along the heating plate. If the resin material is stopped in one place and heated, the convection of the resin material is poor and it will not be heated uniformly, so the resin material near the heating body will be thermally cured, or a large number of coarse particles may be generated due to bumping. The low temperature resin material supplied prevents the resin temperature from rising, and a large amount of stable evaporation cannot be secured. That is, in the case of the method for supplying a resin material by natural gravity, the supply pipe is clogged due to the thermal effect of the resin material, making it difficult to obtain a stable supply of the resin material. In addition, in the case of the flow method on the heating plate by natural gravity of the supplied resin material, depending on the supply amount of the resin material, the flow of the resin material on the heating plate tends to be uneven, and a stable evaporation amount cannot be secured. .

  Thin film formation using resin materials is widely used by painting, and reverse coating and die coating methods are used industrially. Generally, resin materials diluted with solvents are applied and dried and cured. is there. Moreover, although the minimum of the film thickness of the resin film formed by these construction methods is based on the material to be used, it is often about 1 μm, and a film thickness of less than that is often difficult to obtain. In a general coating means, the thickness immediately after coating is several μm or more, and therefore, it is necessary to dilute the solvent to form an extremely thin resin thickness, and a resin thin film of 1 μm or less cannot often be obtained. Further, when the solvent is diluted, defects are likely to occur in the dried coating film. Further, it is not preferable from the viewpoint of environmental protection. Therefore, a method has been proposed in which a resin thin film can be formed without solvent dilution. This is a method in which a resin material is vaporized or atomized in vacuum and then adhered to a support. According to this method, a resin thin film without void defects can be formed, and there is no need for solvent dilution.

  By depositing a combination of different types of thin films on the resin thin film, it becomes possible to obtain composite coatings having various performances such as high heat resistance and high moisture resistance, which have not been obtained in the past. In particular, the demand in the field of electronic parts is very promising, and capacitors, coils, resistors, capacitive batteries, or composite parts of these are being made extremely thin and high performance by thin film stacking, and commercialization has begun. ing.

JP 2004-346339 A Special Table 2007-517134 JP-A-9-310172 Japanese Patent No. 3485297 Japanese Patent No. 3500395

  When forming these resin thin films, the thickness unevenness and defects of the resin thin film are important. If there is uneven thickness or defects, the efficiency of thinning will be halved, leading to poor performance in some cases.

  The practical use of thin films requires compatibility between film quality and productivity, but the conventional methods have not always been sufficient. In securing the film quality, it has been difficult to ensure uniformity with respect to the coating amount and the range of the applied heating plate surface by the conventional resin material coating method. In addition, in order to ensure productivity, the conventional method requires a certain amount of flow time for the range of the heating plate surface to be applied due to the natural flow of the resin material due to gravity, and the resin material that flows on the heating plate surface There is a case where the amount differs depending on the resin material supply position and a position away from the resin material supply position, and a high-speed and stable film forming method has been desired.

  In order to solve these problems, the present invention provides a method for evaporating a resin material in a vacuum and uniformly adhering it to a support. The manufacturing apparatus is characterized in that it is applied to the predetermined range with a constant thickness and uniformly and evaporated. Further, by providing a plurality of resin supply points according to the width of the resin material attached to the support, efficient and uniform supply is possible. In particular, according to the present invention, the supply amount and the supply speed can be controlled by controlling the nozzle portion of the needle valve. Further, by adopting a structure in which the tip of the needle valve protrudes from the nozzle hole, the needle can be opened and closed to prevent clogging of the resin material. Therefore, the resin material supply unit can continuously supply a stable resin material. That is, it is possible to realize both high-speed and stable film formation. Further, by using an electric actuator to control the needle, it is possible to remotely control the supply amount and supply speed of the resin material.

  According to the present invention, it is possible to manufacture a thin film having a high quality and a stable film quality.

It is a figure which shows one Example of manufacture of the thin film of this invention, and a manufacturing apparatus. It is the figure which showed the example of the setting distance of a needle valve and a heating plate, using a needle valve as a resin material supply method used for this invention. It is a figure which shows the example of the setting relative angle of a needle valve and a heating plate, using a needle valve as a resin material supply method used for this invention. It is a figure which shows the example which used the needle valve as a resin material supply method used for this invention, and provided multiple needle valves in the width direction of the heating plate. It is a figure which shows the example which used the needle | hook as a resin material supply method used for this invention, and provided multiple needle valves in the advancing direction of the heating plate. It is a figure which shows the example which provided multiple needle valves and a heating plate in the advancing direction of a heating plate as a resin material supply method used for this invention, and a resin material evaporation method. It is a figure which shows the example which employ | adopted the electric actuator as the opening / closing and adjustment method of a needle valve valve, using a needle valve as the resin material supply method used for this invention. It is a figure which shows the example made into the structure which used the needle valve as a resin material supply method used for this invention, and when the needle valve valve was operated in the closed direction, the needle tip of the needle valve protruded from the nozzle hole. It is an example which shows the case where a needle valve is used as a resin material supply method used in the present invention and the needle valve valve is opened. It is a figure which shows the manufacturing apparatus of the conventional thin film.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

FIG. 1 is a diagram showing an embodiment of a thin film manufacturing and manufacturing apparatus of the present invention.
In FIG. 1, the resin material is introduced into the vacuum chamber through the supply valve 4. The long substrate 1 that is a support is rolled out from the rolling roll 15, travels along the cylindrical can 7 through the guide roll 17, and is rolled up by the winding roll 16 through the guide roll 17. The resin vapor for forming the resin thin film on the long substrate is obtained by vaporizing the resin material supplied from the supply valve 4. The resin material supplied in the form of a liquid spreads in the form of a mist in a thin liquid film form on the heating plate 11. That is, the resin material is uniformly supplied and applied to the surface of the heating plate, whereby the resin material is uniformly heated on the surface of the heating plate and the evaporation amount is stabilized. If the resin material is stopped in one place and heated, the amount of resin material supplied becomes excessive and the resin material in the vicinity of the heating body is thermally cured because it is not heated uniformly, or a large number of coarse particles are emitted due to bumping. The temperature of the resin material is hindered by the low-temperature resin materials that are sequentially supplied, or a large amount of stable evaporation cannot be ensured.

  By using a needle valve in the resin material supply section as shown in FIG. 1, the resin material can be supplied and applied to the required amount and the required area on the heating plate surface. Further, by changing the heating temperature of the heating plate, an optimum temperature rising pattern can be set according to the resin material.

  The resin material just in contact with the heating plate may become coarse particles due to rapid temperature rise and partly scatter. This is thought to be because when the resin material is dropped, it becomes a lump of resin material even though it has a small diameter when dropped onto the heating plate surface. If a needle valve is used in the resin material supply section, the resin material can be applied to the surface of the heating plate in a fine particle size or in the form of a mist, so that it is not easily affected by a sudden rise in temperature when contacting the heating plate. Scattering is unlikely to occur. Also, the material efficiency of the resin material can be improved by making the surrounding wall a heating structure and causing the resin material that adheres to the surrounding wall to re-evaporate even though it is in a small amount. As the curing device 14 for curing the resin thin film, an ultraviolet irradiation device was used.

Next, a second embodiment of the present invention will be described with reference to the drawings.
FIG. 2 is a schematic view showing an example of resin material supply used in the thin film manufacturing method and manufacturing apparatus of the present invention.

  As shown in FIG. 2, a needle valve is used as a method for supplying the resin material. By setting the distance from the tip of the needle valve to the heating plate surface to 5 to 200 mm, the resin material supplied from the tip of the needle valve spreads over a wide area on the heating plate. That is, since the resin material can be spread over a wide area while being spread, the resin material is uniform and the evaporation efficiency is improved. That is, it is possible to form a thin film stably at high speed.

  Next, a third embodiment of the present invention will be described with reference to the drawings.

  FIG. 3 is a schematic view showing still another example of the resin material supply method used in the thin film manufacturing method and manufacturing apparatus of the present invention.

  As shown in FIG. 3, a needle valve is used as a method for supplying the resin material. Resin material supplied from the tip of the needle valve by setting the distance from the tip of the needle valve to the heating plate surface to 5 to 200 mm and the relative angle between the tip of the needle valve and the heating plate to 95 to 150 degrees Spreads over a large area on the heating plate. That is, since the resin material can be spread while being applied to a large area at a high speed, the resin material is uniformly and efficiently evaporated. That is, it is possible to form a thin film stably at high speed.

  Next, a fourth embodiment of the present invention will be described with reference to the drawings.

  FIG. 4 is a schematic view showing still another example of the resin material supplying method used in the thin film manufacturing method and manufacturing apparatus of the present invention. As shown in FIG. 4, a needle valve is used as a method for supplying the resin material. A plurality of needle valves are provided in accordance with the width of the resin material attached to the support. By providing a plurality of needles in the width direction of the heating plate surface, it is possible to improve the evaporation efficiency of the resin material by supplying the resin material to a large area at a high speed, that is, to form a stable thin film at a high speed.

  Next, a fifth embodiment of the present invention will be described with reference to the drawings.

  FIG. 5 is a schematic view showing still another example of the method for supplying a tree material used in the thin film manufacturing method and manufacturing apparatus of the present invention. As shown in FIG. 5, a plurality of needle valves are provided in the traveling direction with respect to the heating plate in accordance with the width of the resin material attached to the support. By providing a plurality of needle valves in the traveling direction of the heating plate surface, the evaporation efficiency of the resin material can be improved by supplying the resin material to a large area at a high speed, that is, a stable thin film can be formed at a high speed.

  Next, a sixth embodiment of the present invention will be described with reference to the drawings.

  FIG. 6 is a schematic view showing still another example of the resin material supplying method used in the thin film manufacturing method and manufacturing apparatus of the present invention. As shown in FIG. 6, a plurality of needles and heating plates are provided, and the evaporation area can be increased even if the apparatus is downsized. As shown in FIG. 6, each needle valve can arbitrarily set the distance between the needle valve tip and the heating plate surface within a range of 5 to 200 mm, and the relative angle between the needle valve tip and the heating plate surface is 95 to 150 degrees. Therefore, even if the apparatus is downsized or the apparatus is downsized, the evaporation area can be increased. That is, it is possible to form a thin film stably at high speed.

  Next, a seventh embodiment of the present invention will be described with reference to the drawings.

  FIG. 7 is a schematic view showing still another example of the resin material method used in the thin film manufacturing method and manufacturing apparatus of the present invention. As shown in FIG. 7, a needle valve is used as a method for supplying the resin material. As an adjustment method of the needle valve, an electric actuator can be used to arbitrarily and automatically control the amount of resin material supplied from the needle valve tip. Further, when a plurality of needle valves are used, the adjustment of each needle valve can be arbitrarily and automatically controlled. In addition, remote control is possible by using an electric actuator as a method for adjusting the needle valve. Therefore, it is possible to stably obtain a thin film having an arbitrary thickness by linking the information on the thickness of adhesion to the support and the information on the amount of resin material supplied from the needle valve.

  Next, an eighth embodiment of the present invention will be described with reference to the drawings.

  8 and 9 are schematic views showing still another example of the resin material supply method used in the thin film manufacturing method and manufacturing apparatus of the present invention. 8 shows a closed state of the needle bubble valve of the nozzle valve, and FIG. 9 shows an opened state. When the nozzle hole is clogged due to the heat curing of the resin material with the needle valve valve open as shown in FIG. 9, the clogged portion is removed by making the needle tip protrude from the hole as shown in FIG. Resin supply can be recovered. With this structure, even if the resin material is cured by heat, clogging can be recovered by opening and closing the needle valve valve, and clogging can be prevented by operating before work. That is, a continuous and stable thin film can be formed.

  As shown in FIG. 1, when a needle valve is used as a method for supplying a resin material, the resin material can be uniformly applied to a predetermined range on the heating plate surface with a constant thickness. As a result, it is possible to ensure a stable amount of resin from the heating plate and to provide more efficient and uniform supply by providing a plurality of resin supply points in accordance with the width of the resin material attached to the support. It has been described that a stable resin supply can be achieved by using a needle valve in the resin material supply method. Further, by adopting a structure in which the tip of the needle valve protrudes from the nozzle hole, the needle valve valve can be opened and closed during operation of the equipment, and clogging of the resin material can be prevented and avoided. In addition, since the resin material is uniformly applied on the heating plate, the resin material does not spread only by natural gravity, so that the stagnation of the resin material on the heating plate can be prevented. An ultraviolet irradiation device was used as the curing device 14 for curing the resin thin film.

  A resin thin film was prepared using the configurations of Embodiments 2 to 8 and the comparative example, and the relationship between the preparation conditions and the film quality was examined. Film formation was performed using an acrylate resin material and changing the deposition rate of the resin thin film. A range of 5 cm × 5 cm of the prepared film was observed with an optical microscope, and grains having a diameter of 3 μm or more were regarded as defects, and the resin film quality was evaluated by this number. The results are shown in Table 1.

  In Examples 2 to 6 shown in (Table 1), the devices shown in the above forms 2 to 8 were used in order.

  From Table 1, the number of defects in the produced resin thin film is small when the deposition rate of the resin thin film is low even in the configuration of the conventional example. However, it can be seen that the number of defects increases rapidly when the deposition rate is approximately 1000 mm / sec or more.

  On the other hand, in the configurations of the second to eighth embodiments, the number of defects in the resin thin film produced is small even when the deposition rate is 1000 mm / sec or more. The reason is considered as follows. That is, in order to increase the deposition rate, it is necessary to increase the supply amount of the resin material. However, in the configuration of the conventional example, the evaporation area becomes insufficient, and in order to ensure the deposition rate, it is necessary to increase the temperature condition on the heating plate. It is shown that there is.

    Next, in the configurations of Embodiments 2 to 8, the nozzle clogging state was evaluated by changing the distance between the needle valve tip and the heating plate surface and the relative angle between the needle valve tip and the heating plate surface. . The results are shown in Table 2.

  From Table 2, the nozzle clogging of the needle valve does not occur because the distance between the needle tip and the heating plate surface is set in the range of 5 to 200 mm, and the relative angle between the needle valve tip and the heating plate surface is 95 to It can be seen that the range of 150 degrees may be set.

  Therefore, the distance between the needle valve tip and the heating plate surface can be arbitrarily set within a range of 5 to 200 mm, and the relative angle between the needle valve tip and the heating plate surface can be arbitrarily set within a range of 95 to 150 degrees. Even if the apparatus is downsized, it is possible to supply the resin material to a large area at high speed, and even if the apparatus is downsized, the evaporation area can be increased. That is, it has been shown that a thin film can be formed stably at high speed.

  On the other hand, when the amount of resin material supplied increases, the amount of resin material spread tends to be non-uniform with respect to the surface area on the heating plate. And sudden bumping occurs. The number of defects observed at a high deposition rate in the configuration of the conventional example is considered that a part of such bumping particles adhere to the support. In the case of an evaporation method using a vacuum, such bumping particles are highly straight and highly likely to adhere to the support.

  On the other hand, in the configurations of the first to eighth embodiments, the resin material supply amount is designed to be uniform and wide on the heating plate surface. Even when the deposition rate is high, bumping and thermosetting hardly occur. Therefore, it seems that a resin thin film with a small number of defects can be obtained.

  Further, in the configuration of the third embodiment, the resin material can be supplied uniformly and in a short time by setting a plurality of resin material supply locations in the traveling direction of the resin material according to the width of the heating plate. Therefore, bumping and thermosetting hardly occur even when the amount of the resin material supplied is large, that is, when the deposition rate is high. Therefore, it seems that a resin thin film with a small number of defects can be obtained.

  In the configurations of the fourth to fifth embodiments, a resin material can be supplied uniformly and in a short time by setting a plurality of combinations of resin material supply locations and heating plates, thereby allowing the resin material to evaporate. Bumping and thermal curing are unlikely to occur even when the supply amount of is large, that is, when the deposition rate is high. Therefore, it seems that a resin thin film with a small number of defects can be obtained.

  In the configuration of the comparative example, as described above, when the deposition rate is high, the rate at which the resin is thermally cured is large, and the evaporation rate of the resin material easily changes with the deposition time. It was difficult as compared with the first to eighth embodiments. Further, as in the first to eighth embodiments, bumping and thermosetting hardly occur even in a place where a high deposition rate of the resin material is desired. That is, since the resin material hardly scatters, a scattering prevention wall becomes unnecessary, and The mechanism becomes simple.

  From the above results, according to the thin film manufacturing method and manufacturing apparatus of the present invention, the resin material can be efficiently evaporated, and stable film formation can be performed at a high deposition rate while suppressing thermosetting and bumping as much as possible. Moreover, since the mechanism of an evaporation part is simple, it seems that the industrial significance is large.

  In the above embodiment, the case where an acrylate resin material is used as the dielectric has been described. However, other materials such as an epoxy resin can be used. In the embodiment, the case where ultraviolet curing and electron beam curing are used as the curing method has been described, but the present invention is not particularly limited by the curing means.

  As described above, according to the thin film manufacturing method and manufacturing apparatus of the present invention, an excellent resin thin film can be obtained at high speed.

DESCRIPTION OF SYMBOLS 1 Long board | substrate 2, 2a, 2b, 2c, 2d Needle valve 3, 3a, 3b, 3c, 3d Nozzle 4 Supply valve 5 Vacuum tank 6 Exhaust system 7 Can 11, 11a, 11b Heating plate 13 Perimeter wall 14 Curing apparatus 15 Separation roll 16 Separation roll 17 Guide roll 18 Driving direction

Claims (11)

  A method of manufacturing an evaporation apparatus, wherein a resin material is evaporated in vacuum and adhered to a support, wherein the resin material is evaporated while being jetted onto a heating plate surface to a uniform thickness.   2. The method for manufacturing an evaporation apparatus according to claim 1, wherein a needle valve is used in the method for supplying the resin material.   2. The method for manufacturing an evaporation apparatus according to claim 1, wherein in the resin material supply method, an electric actuator is used for opening / closing drive and control of the needle valve.   2. The resin material supply method according to claim 1, wherein a plurality of resin material supply points using a needle valve are provided in a length direction of the heating plate in accordance with a length of the resin material attached to the support. The manufacturing method of the evaporation apparatus as described in any one of.   2. The resin material supply method according to claim 1, wherein a plurality of resin material supply points using a needle valve are provided in a width direction of the heating plate in accordance with a width in which the resin material is attached to the support. Method for manufacturing the evaporation apparatus.   2. The evaporation according to claim 1, wherein in the resin material supply method, a plurality of units are provided in the length direction of the heating plate as a unit consisting of a combination of a resin material supply unit using a needle valve and the heating plate. Device manufacturing method.   2. The manufacturing apparatus according to claim 1, wherein in the resin material supply method, a distance from a tip of the needle bubble to the heating plate is set to 5 to 200 mm.   2. The manufacturing apparatus according to claim 1, wherein in the resin material supply method, a relative angle between a tip portion of the needle valve and a heating plate surface is set to 95 to 150 degrees.   2. The manufacturing apparatus according to claim 1, wherein, in the resin material supply method, a tip needle tip portion of the needle valve can be ejected from a lower surface of the needle valve nozzle portion.   2. The manufacturing apparatus according to claim 1, wherein, in the resin material supply method, a jumping distance from the lower surface of the needle valve nozzle portion to the needle valve tip needle tip portion is set to 2 mm.   2. The method of manufacturing an evaporation apparatus according to claim 1, wherein an angle of the needle valve nozzle portion is set to 12.5 degrees in the resin material supply method.

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