JP2013043241A - Cutting device and cutting system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cutting device, which accurately inspects cutting targets stacked at multiple stages to cut the cutting target, or the like.SOLUTION: The cutting device includes: a cutting blade part 31 that cuts cutting targets Bk stacked at multiple stages; and a light receiving element (35) for receiving light from the cutting targets in order to determine, before cutting, whether or not the cutting targets stacked at multiple stages are good. The light receiving element is disposed in a position associated with an adjustment operation for adjusting the cutting position of the cutting blade part according to the sizes of the cutting targets.

Description

  The present invention relates to a cutting apparatus and a cutting system for inspecting a cutting object.

  Conventionally, after a printed material such as a book or a booklet is collated by a bookbinding machine, cutting is performed to cut off unnecessary portions. After the cutting, it is inspected whether the cutting is performed at a predetermined position. For example, Patent Document 1 discloses a transport unit that transports a cutting book to a predetermined position, a photoelectric sensor that detects a finishing width defect of the cutting book transported to the predetermined position, and a judgment for determining the presence or absence of the cutting book at the predetermined position. There is disclosed a cutting failure detection device provided with a cutting book presence / absence detection sensor, and a discharge mechanism that discharges a cutting book with a defective finishing width by a finishing width failure signal and a cutting book presence signal.

JP 2004-322286 A

  However, since Patent Document 1 inspects the state of a book being transported on a conveyor, in a state in which books are stacked in multiple stages, there is a possibility of load collapse or misalignment during transportation. It was difficult.

  Therefore, the present invention has been made in view of the above-described problems, and an example of the problem is to provide a cutting device that can accurately inspect and cut a multi-stage cutting object. .

  In order to solve the above-described problem, the invention according to claim 1 is to determine a cutting blade portion that cuts a multi-stage cutting object and a quality of the multi-stage cutting object before cutting. A light receiving element that receives light from the cutting object side, and the light receiving element is in a position interlocked with an adjustment operation in which a cutting position of the cutting blade portion is adjusted according to the size of the cutting object. It is installed.

  According to a second aspect of the present invention, in the cutting apparatus according to the first aspect, the light receiving element is installed in a holding portion that holds the cutting blade portion.

  The invention according to claim 3 is the cutting device according to claim 1 or 2, further comprising a light emitting element installed at a position interlocked with the cutting operation of the cutting blade portion, wherein the light receiving element is The light reflected from the light emitting element is received.

  According to a fourth aspect of the present invention, in the cutting apparatus according to the third aspect, the light receiving element and the light emitting element are integrated.

  The invention according to claim 5 is the cutting apparatus according to claim 3 or 4, further comprising a reflecting member that reflects light from the light emitting element to the light receiving element.

  According to a sixth aspect of the present invention, there is provided a cutting system for inspecting a cutting object to be cut by the cutting blade portion of the cutting apparatus in a state where the cutting object is stacked in a multi-stage, according to the size of the cutting object. Installed at a position interlocking with the adjustment operation for adjusting the cutting position of the cutting blade portion, the light receiving element that receives light from the cutting object side, and the multi-stage stacked according to the output from the light receiving element And a pass / fail determination means for determining pass / fail of the object to be cut before cutting.

  According to the present invention, a cutting blade section that cuts a multi-stage cutting object, and a light receiving element that receives light from the cutting object side in order to determine the quality of the multi-stage cutting object before cutting. , And the light receiving element is installed at a position interlocked with an adjustment operation in which the cutting position of the cutting blade part is adjusted according to the size of the cutting object, so that the cutting blade part matches the size of the cutting object. Even if replacement or the like is performed, it is possible to accurately inspect and cut the stacked cutting objects.

It is a mimetic diagram showing an example of outline composition of a cutting system concerning an embodiment of the present invention. It is a block diagram which shows an example of schematic structure of the control apparatus of FIG. It is a schematic diagram which shows the example of a schematic structure of the cutting blade part and holding | maintenance part of the cutting apparatus of FIG. It is a schematic diagram which shows an example of the installation position of the reflection member in the cutting stage of the cutting apparatus of FIG. It is a schematic diagram which shows a perfect binding bookbinding process. It is a flowchart which shows the operation example which supplies the cutting object to the cutting apparatus of FIG. It is a flowchart which shows the operation example of the test | inspection of the cutting object in the control apparatus of FIG. It is a schematic diagram which shows an example of a mode that the cutting object piled up in multiple stages is measured. It is a schematic diagram which shows an example of a mode that the cutting object piled up in multiple stages is measured. It is a schematic diagram which shows an example of the positional relationship of the reflective member in the cutting stage of the cutting apparatus of FIG. 1, and a cutting object. It is a schematic diagram which shows an example of the positional relationship of the reflective member in the cutting stage of the cutting apparatus of FIG. 1, and a cutting object. It is a schematic diagram which shows the modification of the installation position of the reflection member in the cutting stage of the cutting apparatus of FIG. It is a schematic diagram which shows the modification of the installation position of the light emission / light-receiving element part in the cutting device of FIG. It is a schematic diagram which shows the modification of the installation position of the light receiving element and light emitting element in the cutting device of FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, embodiment described below is embodiment at the time of applying this invention with respect to a cutting system.

[1. Outline of Configuration and Function of Cutting System and Control Device 10]
(1.1 Configuration and Function of Cutting System 1)

  First, the configuration and outline function of a cutting system according to an embodiment of the present invention will be described with reference to FIG.

  FIG. 1 is a schematic diagram illustrating a schematic configuration example of a cutting system 1 according to the present embodiment.

  As shown in FIG. 1, the cutting system 1 includes a control device 10 (an example of a cutting target inspection device) that controls the cutting system 1, a transport device 20 that transports the multi-stage cutting target Bk, and is stacked in multiple stages. And a cutting device 30 that cuts the cutting target Bk.

  The control device 10, the transport device 20, and the cutting device 30 are connected by a cable for transmitting and receiving data. The transport device 20, the cutting device 30, and the like are controlled by the control device 10.

  As a controller (for example, a programmable logic controller), the control device 10 controls the conveyance of the cutting target Bk by the conveying device 20 and the cutting of the cutting target Bk by the cutting device 30.

  The conveyance device 20 includes a conveyance unit 21 that conveys the cutting target Bk, and a control unit 22 that controls the conveyance device 20 in accordance with a command from the control device 10. Then, the conveying device 20 conveys the cutting object Bk such as a printed matter, which has been collated, glued, and attached with a cover, to the cutting device 30 by the conveyor of the conveying unit 21 in a multi-stacked state.

  The cutting device 30 includes a cutting blade portion 31 that cuts the cutting target Bk, a pressing plate portion 32 that presses the stacked cutting target Bk from above, and a control unit 33 that controls the cutting device 30 in accordance with a command from the control device 10. And a cutting stage 34 on which the cutting object Bk is placed, and a light emitting / receiving element portion 35 that emits a laser to receive light. Further, the cutting device 30 includes a position sensor (not shown) that senses whether or not the cutting target Bk has been conveyed to the cutting stage 34.

  The cutting blade portion 31 has a cutting blade that cuts the three directions of the top, the ground, and the fore edge of the book. The cutting blade unit 31 is lowered toward the cutting target Bk by a drive unit (not shown) with an encoder, and cuts the cutting target Bk stacked in multiple stages. The encoder of the drive unit detects the position of how much the cutting blade portion 31 is lowered in order to press the cutting target Bk. The control unit 33 reads the information of the encoder and transmits data to the control device 10.

  The pressing plate 32 presses the cutting target Bk stacked in multiple stages by a driving unit (not shown) with an encoder. The position of how much the pressing plate 32 is lowered to detect the cutting target Bk is detected by the encoder of the driving unit. The control unit 33 reads the information of the encoder and transmits data to the control device 10.

  The trimming stage 34 is provided with a reflecting member 34 a that retroreflects the light emitting / receiving element portion 35. The reflection member 34 a reflects the laser light L from the light emitting / receiving element portion 35 to the light emitting / receiving element portion 35.

  The light emitting / receiving element unit 35 (an example of a light receiving element) includes a light emitting element that emits a laser beam L such as a semiconductor laser, a light receiving element that receives light such as an optical position sensor (PSD (Position Sensitive Detector)), and a photodiode. Is an integrated element. The light emitting / receiving element portion 35 is an element that reflects the laser light L from the light emitting element by the reflecting member 34a or the like and senses it with the light receiving element, and is a displacement that measures the distance from the light emitting / receiving element portion 35 to the reflecting member 34a. It is a sensor or a stock sensor. The light emitting / receiving element unit 35 is installed in the vicinity of the cutting blades 31 on the ground side, the top side, and the fore edge side, and is cut in order to determine the quality of the cutting target stacked in multiple stages before cutting. Receives light from the target side. Then, the light emitting / receiving element portion 35 is installed at a position interlocked with an adjustment operation in which the cutting position of the cutting blade portion 31 is adjusted according to the size of the cutting target Bk. Further, as shown in FIG. 1, the light emitting / receiving element portion 35 can cover the entire side surface of the cutting target Bk stacked in multiple stages so that the laser light L can face the side surface of the cutting target Bk diagonally. is set up.

(1.2 Configuration and Function of Control Device 10)
Next, the configuration and function of the control device 10 will be described with reference to FIG.
FIG. 2 is a block diagram illustrating an example of a schematic configuration of the control device 10.

  As illustrated in FIG. 2, the control device 10 that functions as a cutting target inspection device is, for example, a personal computer or a programmable logic controller, and includes a communication unit 11, a storage unit 12, a display unit 13, and an operation unit 14. The input / output interface unit 15 and the system control unit 16 are provided. The system control unit 16 and the input / output interface unit 15 are connected via a system bus 17.

  The communication unit 11 transmits and receives data and signals between the control unit 22 and the control unit 33 and the like.

  The storage unit 12 includes, for example, a hard disk drive and stores an operating system, a control program, an image processing program, and the like.

  The display unit 13 is configured by, for example, a liquid crystal display element or an EL (Electro Luminescence) element. The display unit 13 displays input information for controlling the cutting system 1, results of image processing, and the like.

  The operation unit 14 is configured by, for example, a keyboard and a mouse. The user inputs input information for controlling the cutting system 1 using the operation unit 14.

  The input / output interface unit 15 is an interface between the communication unit 11 and the storage unit 12 and the system control unit 16.

  The system control unit 16 includes, for example, a CPU 16a, a ROM 16b, and a RAM 16c. In the system control unit 16, the CPU 16 a reads out and executes various programs stored in the ROM 16 b, the RAM 16 c, and the storage unit 12.

(1.3 Configuration of cutting blade part and holding part of cutting device)
Next, the structure of the cutting blade part and holding | maintenance part of the cutting apparatus 30 is demonstrated using FIG.
FIG. 3 is a schematic diagram illustrating a schematic configuration example of the cutting blade portion and the holding portion of the cutting device 30.

  As shown in FIG. 3, the holding portion 36 that holds the cutting blade portion 31 fixes the cutting blade portion 31 with a bolt or the like. And the cutting blade part 31 is replaced | exchanged according to the magnitude | size (for example, the size of the cutting object Bk is A4, B5). The holding portion 36 is connected to a feed screw 37, and moves in the left-right direction in the figure by turning the handle 38. And the cutting position of the cutting blade part 31 hold | maintained at the holding | maintenance part 36 is adjusted according to the magnitude | size of cutting object Bk.

  A mounting member 39 for attaching the light emitting / receiving element portion 35 is fixed to the holding portion 36. The light emitting / light receiving element portion 35 is attached to the outside in the vicinity of the cutting blade portion 31 by the attachment member 39. The light emitting / receiving element portion 35 is installed by the attachment member 39 so that the laser light L from the light emitting / receiving element portion 35 is irradiated along the outside of the cutting object Bk before being cut. That is, the light emitting / receiving element portion 35 is installed at a position where the laser beam L can be irradiated about 1 to 2 mm outside the cutting margin of the cutting target Bk. The attachment member 39 is attached to the outside of the holding portion 36 and has a shape (for example, an L shape) such that the light emitting / light receiving element portion 35 can be brought close to the inner cutting blade portion 31.

  The reflection member 34a is installed on the cutting stage 34 so that the center of the reflection member 34a comes to a position about 1 or 2 mm outside the cutting object Bk.

(1.4 Installation position of the reflecting member on the cutting stage of the cutting device)
Next, the installation position of the reflecting member 34a in the cutting stage 34 of the cutting apparatus 30 will be described with reference to FIG.
FIG. 4 is a schematic diagram illustrating an example of an installation position of the reflecting member 34 a in the cutting stage 34 of the cutting apparatus 30.

  As shown in FIG. 4, the reflecting member 34a is installed at a position where the cutting object Bk is planned to be installed according to the size of the cutting object Bk (for example, the size of the cutting object Bk is A4, B5). The reflecting member 34a is located near the ground side at the corner between the back side and the ground side, near the small edge side at the corner between the ground side and the small edge side, and between the small edge side and the top side with respect to the cutting object Bk of one size. Three places are installed near the top of the corner.

[2. Operation of the cutting system]
Next, the operation of the cutting system according to one embodiment of the present invention will be described with reference to FIGS.

(2.1 Bookbinding process)
First, the bookbinding process when the object to be cut is a printed matter such as a book will be described with reference to FIG. Note that, as an example of the bookbinding process, the perfect binding will be described.
FIG. 5 is a schematic diagram illustrating a perfect binding bookbinding process.

  As shown in FIG. 4, the saddle stitching process includes “(1) collation process” for collecting printed signatures in page order, and (2) milling process for cutting in the back of the collated signature. “Apply the adhesive to the back of the cut” (3) Applying process ”, Attaching the cover to the applied adhesive“ (4) Covering process ”, cutting the folds and margins “(5) Cutting process” to make a book a predetermined size. In addition, the cutting process of (5) is performed in a state where the printed matter attached by the cover attaching process of (4) is stacked in multiple stages. The cutting process of (5) will be described in detail in the following “supply of cutting object” and “inspection of cutting object”. Note that the printed material, which is an example of the cutting target, is not limited to the saddle stitch bookbinding, but may be a saddle stitch bookbinding or a saddle stitch bookbinding.

(2.2 Supply for cutting)
Next, an operation of supplying the cutting objects stacked in multiple stages to the cutting device 30 will be described with reference to FIG.
FIG. 6 is a flowchart illustrating an operation example of supplying the cutting target Bk to the cutting device 30.

  As illustrated in FIG. 6, the cutting system 1 accepts multi-stage stacked cutting targets (Step S <b> 1). Specifically, as shown in FIG. 1, the printed matter (the cutting target Bk) attached with the cover is supplied to the transport device 20 in a stacked state. As shown in FIG. 1, the printed materials are stacked in multiple stages.

  Next, the cutting system 1 arranges a cutting target (step S2). Specifically, the cutting targets Bk stacked in multiple stages such as a bundle are aligned using the side walls and guides of the transport device 20.

  Next, the cutting system 1 supplies the cutting object Bk to the cutting device 30 (step S3). Specifically, the aligned cutting targets Bk are conveyed onto the cutting stage 34 of the cutting device 30. When the cutting target Bk is conveyed to the cutting stage 34, it is sensed by the position sensor and a signal is transmitted to the control device 10.

(2.3 Inspection of objects to be cut)
Next, the inspection to be cut will be described with reference to FIGS.
FIG. 7 is a flowchart illustrating an operation example of the inspection of the cutting target Bk in the control device 10. FIG. 8 and FIG. 9 are schematic diagrams illustrating an example of a state in which multi-layered cutting objects are measured. 10 to 12 are schematic diagrams illustrating an example of a positional relationship between the reflecting member 34a in the cutting stage 34 of the cutting apparatus 30 and the cutting target Bk.

  As shown in FIG. 7, the control device 10 confirms the fixing of the multi-stage stacked cutting target Bk supplied from the transport device 20 (step S5). Specifically, the system control unit 16 of the control device 10 cuts a command signal so that the bunch of cutting objects Bk conveyed on the cutting stage 34 of the cutting device 30 is pressed from the upper surface by the pressing plate 32. 30 to the control unit 33. Then, the control unit 33 of the cutting device 30 lowers the holding plate unit 32 by the drive unit, detects the machine position information by the encoder and the position sensor of the drive unit, and stops at a predetermined position. The control unit 33 of the cutting device 30 transmits a signal indicating that the cutting target Bk has been pressed to the control device 10. The system control unit 16 of the control device 10 receives a signal indicating that the cutting target Bk has been pressed from the control device 10 and confirms the pressing of the cutting targets Bk stacked in multiple stages. In this way, the system control unit 16 of the control device 10 functions as an example of a fixing detection unit that detects whether or not the multi-stage stacked cutting target is fixed.

  Next, the control apparatus 10 detects the positional information on the cutting blade part 31 (step S6). Specifically, the system control unit 16 of the control device 10 detects the machine position information of the cutting blade unit 31 with an encoder or a position sensor of the drive unit.

  Next, the control apparatus 10 irradiates a laser beam (step S7). Specifically, the system control unit 16 of the control device 10 irradiates the laser light L from the light emitting element of each light emitting / receiving element unit 35 after confirming that the position of the cutting blade unit 31 is at a predetermined position. As shown in FIG. 1 or FIG. 8, the laser beam L is irradiated toward the reflecting member 34a.

  Next, the control device 10 receives the laser beam (step S9). Specifically, the light receiving element of each light emitting / receiving element unit 35 receives the reflected light of the laser beam L emitted from the light emitting element of the light emitting / receiving element unit 35, and sends the signal to the system control unit 16 of the control device 10. Output to. As shown in FIG. 8, when the cutting target Bk stacked in multiple stages is not shifted, the light receiving element of the light emitting / receiving element unit 35 receives the laser light L reflected by the reflecting member 34a. Further, as shown in FIG. 9, when the cutting target Bk2 of the multi-layered cutting target Bk is shifted, the amount of light received by the light receiving element of the light emitting / light receiving element unit 35 is zero or less, The position of the light to be moved is greatly displaced.

  Next, the control device 10 calculates position information (step S9). Specifically, the system control unit 16 of the control device 10 determines whether or not the multi-stage cutting target Bk is at a position shifted in accordance with the light quantity or displacement signal received from each light emitting / receiving element unit 35. The position information, the position information in the height direction of the cutting target Bk stacked in multiple stages, and the position information of the distance shifted in the horizontal direction are calculated. When the system control unit 16 of the control device 10 outputs a signal corresponding to the amount of light received by the light emitting / receiving element unit 35, the light amount may be calculated as position information from this signal. Further, in the case of an ON-OFF type sensor that outputs a signal when there is light according to the light amount (more than a predetermined light amount), and does not output a signal when there is no light (below the predetermined amount), the control device 10 The system control unit 16 may calculate the position information that the multi-stage cutting target Bk is at a shifted position when there is no light, that is, there is no light.

  Next, the control device 10 stores position information (step S10). Specifically, the system control unit 16 of the control device 10 stores the calculated position information in the storage unit 12. In addition, for example, when cutting is performed for the first time, or when the multistage stacked cutting target Bk is arranged on the cutting stage 34 of the cutting apparatus 30 to obtain the reference position, the multistage stacked cutting target Bk is When set on the cutting stage 34 of the cutting apparatus 30, the system control unit 16 of the control apparatus 10 stores the calculated position information as reference position information of the reference position. In this case, the system control unit 16 of the control device 10 may store the signal of the light emitting / light receiving element unit 35 as a reference signal (reference light amount).

  Next, the control device 10 determines whether or not cutting is possible (step S11). When the position of the position information is shifted by a predetermined value or more from the reference position, the system control unit 16 of the control device 10 determines that the multi-stage stacked cutting target Bk is defective and determines that cutting is impossible. The system control unit 16 of the control device 10 determines that cutting is impossible if even one piece of position information from the light emitting / receiving element unit 35 on the ground side, the edge side, and the top side is shifted by a predetermined value or more.

  On the other hand, when the amount of the step is equal to or lower than a predetermined value, the system control unit 16 of the control device 10 determines that the cutting target Bk stacked in multiple stages is good and determines that cutting is possible. The system control unit 16 of the control device 10 determines that cutting is possible when the position information from all the light emitting / receiving element units 35 on the ground side, the edge side, and the top side is equal to or lower than a predetermined value.

  If the position information position is shifted from the reference position in the horizontal direction by a predetermined value or more, or if the position information is shifted in the height direction by a predetermined value or more, it is determined that the multi-stage stacked cutting target Bk is defective and cutting is impossible. May be determined. Further, when the amount of light received by the light emitting / receiving element unit 35 is smaller than the reference light amount, or when there is no signal output, the system control unit 16 of the control device 10 determines that the multi-stage cutting target Bk is defective and performs cutting. May be determined to be impossible.

  Next, when cutting is possible (step S11; YES), the control device 10 transmits a cutting command (step S13). Specifically, the system control unit 16 of the control device 10 transmits a cutting command to the control unit 33 of the cutting device 30. Then, the control unit 33 of the cutting apparatus 30 lowers the cutting blade of the cutting blade unit 31 and cuts the cutting targets Bk1, Bk2, and Bk3 together. The cut cut pieces (unnecessary portions) are discharged to the collecting groove by free fall or air.

  If cutting is not possible (step S11; NO), the system control unit 16 of the control device 10 transmits a command signal for stopping the cutting device 30 to the control unit 33 of the cutting device 30 before cutting (step S12). The cutting device 30 stops the cutting operation.

  Next, the determination of whether or not cutting is possible in step S11 will be described with reference to FIGS.

  As shown in FIG. 10, when the cutting target Bk is at the reference position, the reflecting members 34a1, 34a2, and 34a3 (particularly the central portion of the reflecting member) do not overlap the cutting target Bk, and the optical path of the laser light L is blocked. Since the laser beam L is reflected, the light emitting / receiving element unit 35 can receive the laser beam L, and the system control unit 16 of the control device 10 determines that the stacked cutting target Bk is good.

  On the other hand, as shown in FIG. 10, when the cutting object Bk (at least one of the cutting objects Bk1, Bk2, and Bk3) is shifted to the ground side, the reflecting member 34a1 is separated from the cutting object Bk on the optical path of the laser light L. The overlapping light-emitting / light-receiving element unit 35 cannot receive the reflected laser light L, and the system control unit 16 of the control device 10 determines that the multi-stage cutting target Bk is defective. When the cutting target Bk is shifted to the top side, the reflecting member 34a3 overlaps the cutting target Bk on the optical path of the laser light L, and the light emitting / receiving element unit 35 on the top side receives the reflected laser light L. The system control unit 16 of the control device 10 determines that the multi-stage stacked cutting target Bk is defective. When the cutting target Bk is shifted to the fore edge side and the ground side, the reflecting member 34a2 overlaps the cutting object Bk on the optical path of the laser beam L, and the light emitting / receiving element unit 35 on the fore edge side reflects the reflected laser beam. L cannot be received, and the system control unit 16 of the control device 10 determines that the cutting target Bk stacked in multiple stages is defective.

  As shown in FIG. 11, when the cutting target Bk is shifted counterclockwise around the reflection member 34a2, the reflection member 34a3 overlaps with the cutting target Bk on the optical path of the laser beam L, and the top side The light emitting / receiving element unit 35 cannot receive the reflected laser beam L, and the system control unit 16 of the control device 10 determines that the multi-stage cutting target Bk is defective. When the cutting target Bk is shifted clockwise around the vicinity of the reflecting member 34a2, the reflecting member 34a1 overlaps the cutting target Bk on the optical path of the laser light L, and the light emitting / receiving element unit 35 on the ground side The reflected laser beam L cannot be received, and the system control unit 16 of the control device 10 determines that the cutting target Bk stacked in multiple stages is defective.

  As mentioned above, according to this embodiment, in order to determine the quality of the cutting blade part 31 which cuts the cutting target Bk1, Bk2, and Bk3 stacked in multiple stages and the quality of the cutting target Bk1, Bk2, and Bk3 stacked in multiple stages before cutting. A light-receiving element (light-emitting / light-receiving element part 35) that receives light from the cutting object side, and the light-receiving element is adjusted so that the cutting position of the cutting blade part 31 is adjusted according to the size of the cutting object Even if the cutting blade part 31 is replaced in accordance with the size of the cutting object Bk or the distance between the cutting blade parts 31 is adjusted by the feed screw 37, it is stacked in multiple stages. The cutting targets Bk1, Bk2, and Bk can be inspected and cut with high accuracy.

  Further, according to the present embodiment, it is possible to automatically determine the quality of the cutting target stacked in multiple stages, to save labor, to make an objective determination as compared with human visual inspection, and to improve productivity.

  Further, according to the present embodiment, it is possible to stop the cutting operation before cutting, to correct the positions of the cutting target stacked in multiple stages, and to suppress the generation of defective products.

  In addition, when the light emitting / receiving element portion 35 (an example of the light receiving element) is installed in the holding portion 36 that holds the cutting blade portion 31, the position of the light emitting / receiving element portion 35 is maintained even if the cutting blade portion 31 is replaced. Therefore, the cutting device 30 can accurately inspect and cut the cutting targets Bk1, Bk2, and Bk stacked in multiple stages.

  Further, when the light emitting / receiving element portion 35 is installed at a position interlocked with the adjustment operation in which the cutting position of the cutting blade portion is adjusted by the attachment member 39 according to the size of the cutting target, the cutting target Bk is cut. It becomes easy to install the light emitting / receiving element portion 35 at a position where the laser beam L can be irradiated about 1 to 2 mm outside the margin.

  The cutting device 30 further includes a light emitting / light receiving element unit 35 installed at a position interlocked with the cutting operation of the cutting blade 31, and the light receiving element of the light emitting / light receiving element unit 35 reflects the reflected light of the laser light L of the light emitting element. When the light is received, the deviation of the cutting objects Bk1, Bk2, and Bk3 can be accurately detected by the light of the light emitting element of the light emitting / receiving element unit 35.

  Further, in the case of the light emitting / light receiving element unit 35 in which the light receiving element and the light emitting element are integrated, the installation on the cutting device 30 is reduced and the maintenance is facilitated as compared with the case where the light emitting element and the light receiving element are separated.

  Further, when the reflecting member 34a that reflects the light from the light emitting element to the light receiving element is installed in the cutting device 30, it is determined whether the reflecting member 34a and the cutting object Bk overlap with each other by the reflecting member 34a. Since the determination can be made based on the presence or absence of reflection of L, the determination becomes clear, and the cutting device 30 can inspect and cut with high accuracy. In particular, in the case where the reflecting member 34a is a reflecting member that retroreflects, the optical accuracy that the incident angle and the reflecting angle are equal is not required, so that the installation to the cutting device 30 is facilitated.

  In addition, the system control unit 16 of the control device 10 detects whether or not the multi-stage stacked cutting target is fixed by the pressing plate unit 32, and after detecting that the cutting target is fixed, the system controller 16 irradiates the laser beam L and receives the laser beam L. In this case, since the inspection is performed in a state where the posture to be cut is stable, a stable inspection result can be obtained.

Next, a modified example of the installation position of the reflecting member 34a in the cutting stage 34 will be described with reference to FIG.
FIG. 12 is a schematic diagram illustrating a modification of the installation position of the reflecting member 34 a in the cutting stage 34 of the cutting apparatus 30.

  As shown in FIG. 12, the reflecting members 34a1, 34a2, and 34b3 may be installed on the cutting stage 34 so as to be within the range of the cutting object Bk. When the cutting target Bk stacked in multiple stages is not displaced, the light receiving element of the light emitting / receiving element unit 35 cannot receive the laser light L reflected by the reflecting member 34a. When the multi-stage stacked cutting target Bk is shifted, the amount of light received by the light receiving element of the light emitting / receiving element unit 35 increases. Therefore, in step S9, when the system control unit 16 of the control device 10 is an ON-OFF type sensor, the system control unit 16 of the control device 10 is stacked in multiple stages when there is an ON signal, that is, light. Position information indicating that the cutting target Bk is at a shifted position may be calculated.

Next, a modified example of the installation position of the light emitting / receiving element portion 35 will be described with reference to FIG.
FIG. 13 is a schematic diagram illustrating a modified example of the installation position of the light emitting / receiving element portion 35 in the cutting device 30.

  As shown in FIG. 13, two light emitting / receiving element portions 35 may be installed in the vicinity of the cutting blade portions 31 on the ground side, the fore edge side, and the top side. Each light emitting / receiving element portion 35 is installed in a substantially vertical direction toward the cutting stage 34. On the cutting stage 34, a reflecting member 34a is installed corresponding to the two light emitting / receiving element portions 35. When the cutting target Bk rotates or shifts in the horizontal direction, at least one of the two laser beams L is blocked by the cutting target Bk, the shift of the cutting target Bk is detected. In addition, since the reflecting member 34a is a reflecting member that retroreflects, high accuracy is not required for the installation direction of each light emitting / receiving element portion 35.

Next, a modified example of the installation positions of the light receiving elements and the light emitting elements in the cutting apparatus 30 will be described with reference to FIG.
FIG. 14 is a schematic diagram illustrating a modified example of the installation positions of the light receiving elements and the light emitting elements in the cutting apparatus 30.

  As shown in FIG. 14, the light-emitting / light-receiving element unit 35 may be divided into two parts, a light-emitting element 35a and a light-receiving element 35b. The light emitting element 35a and the light receiving element 35b are installed at a position where the incident angle and the reflection angle are equal to the reflecting member 34b. The reflective member 34b may not be a reflective member that retroreflects.

  In the cutting device 30, a light emitter such as an LED or a phosphorescent material may be set on the cutting stage 34 instead of the reflecting member. In this case, a light receiving element is installed instead of the light emitting / light receiving element unit 35. In the case of a phosphorescent material, light may be applied from the lighting device before measurement by the light receiving element, the light from the lighting device may be turned off, and the light receiving element may measure the presence or absence of light detection.

  In addition, the above-described embodiment can also be applied to a plate-like plastic or metal as a cutting target.

DESCRIPTION OF SYMBOLS 1: Cutting system 10: Control apparatus 30: Cutting apparatus 31: Cutting blade part 34a: Reflecting member 35: Light emitting / light receiving element part (light receiving element, light emitting element)
35a: Light emitting element 35b: Light receiving element Bk, Bk1, Bk2, Bk3: Cutting object L: Laser light

Claims (6)

A cutting blade portion for cutting a multi-layered cutting object;
In order to determine the quality of the cutting target stacked in multiple stages before cutting, a light receiving element that receives light from the cutting target side;
With
The cutting device, wherein the light receiving element is installed at a position interlocked with an adjustment operation in which a cutting position of the cutting blade portion is adjusted according to a size of the cutting object. The cutting apparatus according to claim 1,
The cutting device, wherein the light receiving element is installed in a holding portion that holds the cutting blade portion. In the cutting device according to claim 1 or 2,
A light emitting element installed at a position interlocked with the cutting operation of the cutting blade part;
The cutting device, wherein the light receiving element receives reflected light of the light from the light emitting element. In the cutting device according to claim 3,
The cutting device, wherein the light receiving element and the light emitting element are integrated. In the cutting device according to claim 3 or 4,
The cutting device further comprising a reflecting member that reflects light from the light emitting element to the light receiving element. In a cutting system for inspecting a cutting object to be cut by a cutting blade portion of a cutting apparatus in a state where the cutting object is stacked in a multi-stage,
A light receiving element that is installed at a position interlocked with an adjustment operation in which a cutting position of the cutting blade portion is adjusted according to the size of the cutting object, and that receives light from the cutting object side;
In accordance with the output from the light receiving element, the quality determination means for determining the quality of the cutting target stacked in multiple stages before cutting,
A cutting system characterized by comprising:

Images