JP2013030533A - Electronic component mounting system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting system capable of determining the execution sequence of a plurality of production programs while taking account of whether or not the production of both surfaces of a double-sided mounting board continues.SOLUTION: A controller 90 of an electronic component mounting system 9 determines the execution sequence of a plurality of production programs A1-E. The plurality of production programs A1-E include one side program A1 for producing one side of a double-sided mounting board, and the other side program A2 for producing the other side. The controller 90 determines the execution sequence of the plurality of production programs A1-E while taking account of the selection situation of a continuous mode for executing the one side program A1 and the other side program A2 continuously, and an intermittent mode for executing the one side program A1 and the other side program A2 intermittently while inserting other production programs B-E.

Description

  The present invention relates to an electronic component mounting system that determines the execution order of a plurality of production programs executed on the same production line.

  Patent Document 1 discloses a component mounting method for determining a board production order according to a predetermined sort condition. This document exemplifies a component supply unit coincidence, a component type coincidence, a board cradle ID, a reflow ID, and the like as sorting conditions.

  For example, when the board production order is determined as “sort condition = part supply unit coincidence degree”, a plurality of boards having a high degree of commonality of the part supply units are successively produced. For this reason, when changing the board to be produced, that is, when changing the setup, the replacement work of the component supply unit can be performed in a short time. Therefore, the total production time which is the sum of the production time required for the production of all the substrates and the production preparation time required for the setup change can be shortened.

JP-A-2005-159160

  By the way, in recent electronic devices, in order to integrate electronic components, a double-sided mounting board having electronic components mounted on both front and back surfaces is often used. The schematic diagram of the production line at the time of producing a double-sided mounting board in Drawing 6 (a)-(g) is shown. As shown in FIGS. 6A to 6G, in the production line 100, three electronic component mounting machines 101 and one reflow furnace 102 are arranged in a line. The number of double-sided mounting boards 103 produced is three. When the double-sided mounting substrate 103 is produced, the same double-sided mounting substrate 103 is allowed to flow through the production line 100 twice. In the first production, one side of the double-sided mounting substrate 103 is turned face up, and the double-sided mounting substrate 103 is allowed to flow through the production line 100. As shown in FIGS. 6A to 6C, the electronic component 104 is mounted on the one surface step by step by the three electronic component mounting machines 101. As shown in FIGS. 6D to 6F, the reflow furnace 102 heat-treats the double-sided mounting substrate 103 on which electronic components are mounted. Similarly, as shown in FIG. 6 (g), in the second production, the double-sided mounting board 103 with the one side facing down and the other side (shown with hatching to distinguish it from the one side) is facing up. To the production line 100. The electronic component 104 is mounted on the other surface by the electronic component mounting machine 101. The reflow furnace 102 heat-treats the double-sided mounting substrate 103 on which electronic components have been mounted.

  In the production of a double-sided mounting substrate, the double-sided mounting substrate 103 (the double-sided mounting substrate 103 in a state between FIG. 6 (f) and FIG. 6 (g)) in which the electronic component 104 is mounted on only one surface. The occurrence of an unfinished double-sided mounting board 103 in which the component 104 is mounted and the electronic component 104 is not mounted on the other surface (hereinafter referred to as “in-process product”) is a problem. Here, as shown in FIG. 6 (f) and FIG. 6 (g), if one side and the other side are continuously produced, the generation of work-in-process can be suppressed. However, in this case, “play” tends to occur in the production line 100. That is, as indicated by “x” marks in FIGS. 6D to 6G, the electronic component mounting machine 101 in the “vacant” state is likely to occur. For this reason, considering not only the double-sided mounting substrate 103 but also the production of other types of substrates, the total production time tends to be long. This tendency becomes more prominent as the number of double-sided mounting boards 103 produced (three in this example) is smaller than the number of electronic component mounting machines 101.

  Here, in order to shorten the total production time, the number of “x” marks on the production line 100 may be reduced. Specifically, the production of a substrate of another substrate type may be interrupted between the production of one surface of the double-sided mounting substrate 103 and the production of the other surface.

  However, in this case, of course, work-in-progress is likely to occur. Further, depending on the substrate type of the substrate to be interrupted, the total production time may be shortened when the production of one surface of the double-sided mounting substrate 103 and the production of the other surface are performed continuously. On the other hand, depending on the number of “x” marks (the length of the double-sided production interval between one side and the other side), the production of substrates of other board types may vary between the production of one side and the production of the other side. Sometimes it is better to interrupt.

  The electronic component mounting system of the present invention has been completed in view of the above problems. An object of the present invention is to provide an electronic component mounting system capable of determining the execution order of a plurality of production programs in consideration of whether or not the production of both sides of a double-sided mounting board is continuous.

(1) In order to solve the above-described problem, an electronic component mounting system according to the present invention sequentially controls a board for a plurality of board types in accordance with the control apparatus that determines the execution order of a plurality of production programs related to board production. An electronic component mounting system comprising: a production line, wherein at least one of the substrates of a plurality of substrate types is a double-sided mounting substrate on which electronic components are mounted on both sides, and a plurality of the production The program includes a one-side program for producing one side of the double-sided mounting board, and another side program for producing the other side of the double-sided mounting board, and the control device considers the following (A), and The execution order is determined.
(A) A selection mode of a continuous mode in which the one-side program and the other-side program are continuously executed, and an intermittent mode in which the one-side program and the other-side program are executed intermittently with the other production program in between.

  According to the electronic component mounting system of the present invention, selection between whether one side and the other side of the double-sided mounting board are to be produced continuously (continuous mode) or between the production of other boards (intermittent mode) is selected. The execution sequence of the production program can be determined in consideration of the situation. For this reason, the execution order of the production program can be determined according to the user's preference, such as shortening the total production time, reducing the work in progress, improving the operating rate, and reducing the workload of the worker.

  Further, in many cases, an order determination program for determining the execution order of a plurality of production programs is stored in a control device of an existing electronic component mounting system. For this reason, the electronic component mounting system of this invention is realizable only by updating the order determination program of the existing electronic component mounting system. Thus, the electronic component mounting system of the present invention is highly versatile.

(2) Preferably, in the configuration of (1) above, the control device may be configured to determine the execution order in consideration of the following (B).
(B) Replacement time of components constituting the production line at the time of changeover performed when the production program is switched.

  According to this configuration, the execution order of the production program can be determined in consideration of not only the selection status of the continuous mode and the intermittent mode, but also the replacement time of the component devices at the time of setup change.

(3) Preferably, in the configuration of (2), the production line supports a component supply unit that supplies an electronic component to be mounted on the substrate and the substrate when the electronic component is mounted on the substrate. And (B) includes the following (b1) and (b2), and the control device includes at least one of (b1) and (b2). It is better to determine the execution order considering one of them.
(B1) The replacement time of the component supply unit at the time of the setup change.
(B2) The replacement time of the backup unit at the time of the setup change.

  Here, the replacement of the “component supply unit” includes both the case where the entire component supply unit is replaced and the case where the component supply unit is partially replaced. Similarly, the replacement of the “backup unit” includes both the case where the entire backup unit is replaced and the case where the backup unit is partially replaced.

  In the case of two production programs that are executed in succession, that is, two types of boards that are produced in succession, if the commonality of the component types of electronic components is high, the replacement time of the component supply unit is shortened accordingly. . In this case, the time required for the setup change executed between the two production programs is shortened.

  Similarly, in the case of two production programs that are executed in succession, that is, in the case of two types of boards that are produced in succession, when the commonality such as the board size is high, the replacement time of the backup unit is shortened accordingly. . In this case, the time required for the setup change executed between the two production programs is shortened.

  According to this configuration, the execution order of the production program is determined by considering not only the selection status of the continuous mode and intermittent mode, but also the replacement time of the parts supply unit at the time of setup change and the replacement time of the backup unit at the time of setup change. be able to.

(4) Preferably, in the configuration according to any one of (1) to (3), the production line includes an electronic component mounting machine, and one piece of the electronic component mounting machine according to the one-surface program. The mounting time of the electronic component with respect to the one surface of the double-sided mounting board is T1, the production number of the double-sided mounting board is N1, and when any electronic component mounting machine is switched from the one-side program to the other-side program, The setup change time required for the setup change is T2, and from the completion of the mounting of the electronic component to the one side of the double-sided mounting board by the one-side program of the electronic component mounting machine, the double-sided mounting board by the other-side program Assuming that the double-sided production interval required for starting the mounting of the electronic component on the other side is T3, in (A), when the following equation (1) is satisfied, the continuous mode is set. But the discontinuous mode if the expression (1) is not satisfied, it is preferable to adopt a configuration in which each is selected.
T1 × (N1-1) + T2> T3 Formula (1)

  When Expression (1) is satisfied, even if the one-side program and the other-side program are continuously executed, the constituent devices constituting the production line do not enter the substrate waiting state. That is, the constituent devices do not play. For this reason, the continuous mode is automatically selected.

  On the other hand, when the formula (1) is not established, if the one-side program and the other-side program are continuously executed, the constituent devices constituting the production line are in a board waiting state. In other words, the components are idle. For this reason, the intermittent mode is automatically selected.

  As described above, according to this configuration, the control device automatically selects the continuous mode or the intermittent mode according to the formula (1) based on the mounting time T1, the number N1 of production, the setup change time T2, and the double-sided production interval T3. can do.

(4-1) Preferably, in the configuration of (4), a post-processing time from completion of mounting of the electronic component to the one surface of the first double-sided mounting board by the one-surface program until completion of a post-processing step is t1. N3 is the number of batch transports that can be transported to the upstream end of the production line at a time, as N3, the work-in-process products that are the double-sided mounting substrates on which the electronic components are mounted and the post-processing step is completed. The double-sided production interval T3 is preferably calculated from the following equation (3), where t3 is a fixed time including
T3 = t1 × N3 + t3 (3)

  According to this configuration, the control device can automatically calculate the double-sided production interval T3 according to Equation (3) based on the post-processing time t1, the batch conveyance number N3, and the fixed time t3.

(5) Preferably, in the configuration of the above (4), when the formula (1) is not satisfied, according to any production program other than the one-side program and the other-side program per one electronic component mounting machine Assuming that the mounting time of the electronic component on one board is T4 and the number of boards produced is N2, the control device sets the one-side program and the other-side program so that the following equation (2) is satisfied. It is better to insert the production program between the two.
T1 × (N1-1) + T2 + (T4 × N2)> T3 Expression (2)

  According to this configuration, the control device can automatically calculate which production program can be inserted between the one-surface program and the other-surface program in the intermittent mode.

  If another production program (single, plural, or part of the program may be part) is inserted between the one-side program and the other-side program so that the formula (2) is established, the constituent devices constituting the production line are , It is difficult to wait for the substrate.

  (5-1) Preferably, in the configuration of (5), the control device inserts the production program between the one-side program and the other-side program up to a limit where the formula (2) is satisfied. It is better to have a configuration to do.

  According to this configuration, in the intermittent mode, another production program can be inserted between the one-side program and the other-side program to the limit that the production line does not play. In other words, in the intermittent mode, it is possible to execute the one-side program and the other-side program close to each other in time series to the limit where the production line does not play. For this reason, work in progress can be reduced while shortening the total production time.

  (5-2) Preferably, in the configuration of (5), the control device is configured to insert the production program in units of the production program between the one-side program and the other-side program. Is good. According to this configuration, there is no possibility that only a part of the production program is inserted between the one-side program and the other-side program. For this reason, the number of setup changes can be reduced.

  According to the present invention, it is possible to provide an electronic component mounting system capable of determining the execution order of a plurality of production programs in consideration of whether or not the production of both sides of a double-sided mounting board is continuous.

1 is a schematic diagram of an electronic component mounting system according to a first embodiment. It is a perspective view of the electronic component mounting machine of the production line of the same electronic component mounting system. (A) is a perspective view in case the conveyance width near the backup part of the electronic component mounting machine is narrow. (B) is a perspective view when the conveyance width near the backup unit is wide. It is a perspective view near the component supply part of the electronic component mounting machine. It is a flowchart of the execution order determination method of the production program of the same electronic component mounting system. (A)-(g) is a schematic diagram of the production line at the time of producing a double-sided mounting board.

  Embodiments of an electronic component mounting system according to the present invention will be described below.

<First embodiment>
[Configuration of electronic component mounting system]
First, the configuration of the electronic component mounting system of this embodiment will be described. In FIG. 1, the schematic diagram of the electronic component mounting system of this embodiment is shown. As shown in FIG. 1, the electronic component mounting system 9 of this embodiment includes a control device 90 and a production line 91.

  The production line 91 includes a plurality of electronic component mounting machines 1, a board appearance inspection machine 910, and a reflow furnace 911. The substrate (not shown) is conveyed on the production line 91 from the left side (upstream side) to the right side (downstream side). The plurality of electronic component mounters 1 mount electronic components in stages on the upper surface of the substrate. The board appearance inspection machine 910 inspects the mounting state of the electronic component on the board. The reflow furnace 911 heat-treats the substrate with a predetermined temperature pattern. And the cream solder which joins a board | substrate and an electronic component is fuse | melted and solidified.

  The control device 90 performs overall control of the production line 91. The control device 90 includes a calculation unit 900 and a storage unit 901. The storage unit 901 stores a board production program for each board type. The calculation unit 900 determines the execution order of the board production programs for a plurality of board types to be produced in a predetermined period (for example, one day, one week, etc.). Then, the determined execution order is transmitted to the plurality of electronic component mounting machines 1, the board appearance inspection machine 910, and the reflow furnace 911 constituting the production line 91.

[Configuration of Electronic Component Mounting Machine 1]
Next, the configuration of the electronic component mounting machine 1 will be described. FIG. 2 is a perspective view of the electronic component mounting machine in the production line of the electronic component mounting system of the present embodiment. As shown in FIG. 2, the electronic component mounting machine 1 includes a base 2, a module 3, a component supply unit 4, and a device pallet 5.

(Base 2, Module 3)
The base 2 is disposed on the floor F of the factory. The base 2 accommodates a control device 90 (not shown) for communicating with the control device 90 and other electronic component mounting machines 1.

  The module 3 is replaceably disposed on the upper surface of the base 2. The module 3 includes a pair of left and right Y-direction guide rails 20, a substrate transport unit 30, an XY robot 31, a mounting head 32, and a backup unit 35.

  The Y direction guide rail 20 extends in the front-rear direction. The substrate transport unit 30 includes a reference wall 300, a movable wall 301, and a pair of front and rear conveyor belts 302. The reference wall 300 is disposed on the upper surface of the base 2. A clamping piece 300 a is disposed on the upper edge of the reference wall portion 300. The movable wall portion 301 is juxtaposed behind the reference wall portion 300. A sandwiching piece 301 a is disposed on the upper edge of the movable wall portion 301. The movable wall portion 301 is movable in the front-rear direction along the Y-direction guide rail 20. The pair of front and rear conveyor belts 302 are disposed to face the rear surface of the reference wall portion 300 and the front surface of the movable wall portion 301. The substrate 10 is conveyed from the left side to the right side by a pair of front and rear conveyor belts 302.

  FIG. 3A is a perspective view when the conveyance width in the vicinity of the backup unit of the electronic component mounting machine in the production line of the electronic component mounting system of the present embodiment is narrow. FIG. 3B shows a perspective view when the conveyance width in the vicinity of the backup unit is wide. In FIGS. 3A and 3B, the substrate 10 is shown in a transparent manner.

  As shown in FIGS. 2, 3 (a), and 3 (b), the backup unit 35 includes a backup plate 350 and a plurality of backup pins 351. The backup plate 350 can be moved in the vertical direction by a ball screw mechanism (not shown). The plurality of backup pins 351 are disposed on the upper surface of the backup plate 350. When the electronic component is mounted, the substrate 10 is sandwiched and fixed in the vertical direction by the lower backup pin 351 and the upper sandwiching pieces 300a and 301a.

  As shown in FIGS. 3A and 3B, the conveyance width of the substrate 10 can be adjusted to be enlarged or reduced by moving the movable wall portion 301 along the Y-direction guide rail 20. As shown in FIG. 3A, when the transport width is narrow, in other words, when the substrate 10 having a narrow front-rear width is produced, a backup plate 350 having a narrow front-rear width is used. On the other hand, as shown in FIG. 3B, when the transport width is wide, in other words, when the substrate 10 having a wide front-rear width is produced, a backup plate 350 having a wide front-rear width is used. Further, the position and number of the backup pins 351 with respect to the backup plate 350 are appropriately changed according to the mounting state of electronic components on the lower surface of the substrate 10.

  Returning to FIG. 2, the XY robot 31 includes a Y-direction slider 310, an X-direction slider 311, a pair of left and right Y-direction guide rails 312, and a pair of upper and lower X-direction guide rails 313.

  The pair of left and right Y-direction guide rails 312 are disposed on the upper surface of the housing internal space of the module 3. The Y-direction slider 310 is attached to a pair of left and right Y-direction guide rails 312 so as to be slidable in the front-rear direction. The pair of upper and lower X-direction guide rails 313 is disposed on the front surface of the Y-direction slider 310. The X-direction slider 311 is attached to a pair of upper and lower X-direction guide rails 313 so as to be slidable in the left-right direction.

  The mounting head 32 is attached to the X direction slider 311. For this reason, the mounting head 32 can be moved in the front-rear and left-right directions by the XY robot 31. A suction nozzle 320 is attached below the mounting head 32. The suction nozzle 320 is movable downward with respect to the mounting head 32. For this reason, the suction nozzle 320 can be moved in the front-rear, left-right, up-down directions by the XY robot 31 and the mounting head 32.

(Part supply unit 4, device pallet 5)
The device pallet 5 is attached to the front opening of the module 3. FIG. 4 is a perspective view of the vicinity of the component supply unit of the electronic component mounting machine in the production line of the electronic component mounting system of this embodiment. In FIG. 4, the component supply unit 4 is shown in a transparent manner. As shown in FIG. 4, the device pallet 5 includes a number of slots 50. The component supply unit 4 includes a number of tape feeders 40. The tape feeder 40 is attached to the slot 50. Electronic components are enclosed in the tape 400 of the tape feeder 40 at a predetermined interval in the longitudinal direction.

  The component supply unit 4 can be attached to and detached from the device pallet 5 as a whole. The tape feeder 40 can be individually attached to and detached from the slot 50. When replacing an electronic component to be mounted at the time of setup change, the board 10 produced before the setup change is compared with the board 10 produced after the setup change. If it is higher, the electronic parts are replaced in units of 40 tape feeders. If the commonality of electronic components is low, the entire component supply unit 4 is replaced.

[Production program execution order determination method]
Next, the execution order determination method of the production program of the electronic component mounting system of this embodiment will be described. Table 1 shows a list of production programs A1 to E that are targets of execution order determination.

  As shown in Table 1, in the execution order determination method, the execution order of a total of six production programs A1 to E is determined. The production programs A1 and A2 are for production on one side and production on the other side of a double-sided mounting board having the same board type. The production program A1 is included in the concept of “one-side program” of the present invention. The production program A2 is included in the concept of the “other surface program” of the present invention. Production programs B to E are for production of single-sided mounting boards with different board types.

  FIG. 5 shows a flowchart of the method for determining the execution order of the production program of the electronic component mounting system of this embodiment.

(Step 1)
In this step, as shown in FIG. 5, the worker inputs the production number N1 of each of the production programs A1 to E to the control device 90 shown in FIG. 1 (S1). Specifically, the production number N1 in Table 1 is input.

(Step 2)
In this step, whether the operator continuously produces both sides of the double-sided mounting board (that is, whether the production program A1 and the production program A2 are executed continuously) or intermittently produces both sides of the double-sided mounting board. (That is, whether the production program A1 and the production program A2 are executed intermittently) is selected and input to the control device 90 shown in FIG. 1 (S2). Specifically, either continuous mode or intermittent mode is selected.

(Step 3)
When the operator selects the continuous mode, the control device 90 shown in FIG. 1 fixes that the production program A1 and the production program A2 are continuously executed (S3). On the other hand, when the worker selects the intermittent mode, steps 3 to 5 are skipped. In this case, it is not fixed that the control device 90 shown in FIG. 1 continuously executes the production program A1 and the production program A2.

(Step 4)
In this step, the operator inputs the double-sided production interval T3 of the double-sided mounting board to the control device 90 shown in FIG. 1 (S4). Here, the double-sided production interval T3 is determined from the completion of the mounting of the electronic component on one side of the double-sided mounting board by the production program A1 of the electronic component mounting machine 1 at the most upstream end of the production line 91 to the other side of the double-sided mounting board by the production program A2. This is the time required to start mounting the electronic component on the surface.

  The double-sided production interval T3 includes the inspection time of the mounting state of the electronic component on one surface of the first double-sided mounting board by the board appearance inspection machine 910 shown in FIG. Further, the double-sided production interval T3 includes a heat treatment time for one surface of the first double-sided mounting substrate by the reflow furnace 911. Further, the double-sided production interval T3 includes a conveyance time until the first double-sided mounting board is sent from the outlet side (downstream side) of the reflow furnace 911 to the electronic component mounting machine 1 on the most upstream side.

(Step 5)
In this step, the control device 90 shown in FIG. 1 digitizes the double-sided production interval T3 (S5). For example, in Table 1, it is quantified to “10”. The longer the double-sided production interval T3, the larger the numerical value.

(Step 6)
In this step, the control device 90 shown in FIG. 1 digitizes the non-commonality of the component supply unit 4 shown in FIG. 4 for all the electronic component mounting machines 1 (S6). The lower the commonality, the higher the value. Specifically, when the entire component supply unit 4 is replaced during the setup change between any two production programs A1 to E that are successively executed, the numerical value increases. When the replacement of the tape feeder 40 is sufficient, the smaller the replacement number, the smaller the numerical value. Further, when it is not necessary to replace the component supply unit 4 at all, the numerical value becomes zero.

  For example, in Table 1, the non-commonness between the production program A1 and the production program A2 is quantified as “15”. Further, the non-commonality between the production program A2 and the production program D is quantified as “20”. Further, the non-commonality between the production program C and the production program E is quantified as “20”.

(Step 7)
In this step, the control device 90 shown in FIG. 1 quantifies the non-commonality of the backup unit 35 shown in FIGS. 3A and 3B for all the electronic component mounting machines 1 ( S7). The lower the commonality, the higher the value. Specifically, when the backup plate 350 is replaced at the time of the setup change between any two production programs A1 to E that are successively executed, the numerical value becomes large. In addition, when the replacement of the backup pin 351 (including addition and removal of the backup pin 351) is sufficient, the smaller the replacement number, the smaller the numerical value. Further, when it is not necessary to replace the backup unit 35 at all, the numerical value becomes 0.

  For example, in Table 1, the non-commonality between the production program A1 and the production program A2 is quantified as “1”. Further, the non-commonality between the production program A2 and the production program D is quantified as “4”. The non-commonality between the production program C and the production program E is quantified as “5”.

(Step 8)
In this step, the numerical value acquired in steps 5 to 7 is converted into the distance between the production programs A1 to E (S8).

  Table 2 shows a distance conversion table. In Table 2, the distance is calculated using the numerical values in Table 1 as they are for convenience of explanation. For example, the distance “26” between the production programs A1 and A2 is the double-sided production interval “10” in Table 1, the non-commonality (production program A1 vs. production program A2) “15” of the component supply unit 4, and the backup unit. It is the sum of 35 non-commonality (production program A1 vs. production program A2) “1”.

  In this case, a value obtained by multiplying each numerical value by a correction value (for example, the double-sided production interval “10α”, the non-commonness “15β” of the component supply unit 4, the non-commonness “1γ” of the backup unit 35, (α, β , Γ may be calculated based on correction values)). In addition, the correction value may be multiplied in advance before the numerical value is acquired in Steps 5 to 7.

(Step 9)
In this step, the control device 90 shown in FIG. 1 performs production based on the distance between the converted production programs A1 to E (see Table 2) so that the route of all the production programs A1 to E becomes the shortest. The execution order of the programs A1 to E is determined (S9).

  When the continuous mode is selected in step 2, the control device 90 shown in FIG. 1 indicates that “the production program A2 must be executed after the production program A1” and “the route of all the production programs A1 to E is the shortest. The execution order is determined in preference to “becoming”.

  On the other hand, when the intermittent mode is selected in step 2, the control device 90 shown in FIG. 1 determines the execution order with the highest priority given to “the shortest route for all production programs A1 to E”.

(Step 10)
In this step, the control device 90 shown in FIG. 1 outputs the execution order of the determined production programs A1 to E to the electronic component mounting machine 1, the board appearance inspection machine 910, and the reflow furnace 911 that constitute the production line 91. (S10).

  Thereafter, the production programs A1 to E are sequentially executed according to the output execution order. That is, the substrate types 10 corresponding to the production programs A1 to E are sequentially produced by a predetermined production number.

[Function and effect]
Next, the effect of the electronic component mounting system of this embodiment will be described. As shown in FIG. 5, according to the electronic component mounting system 9 of the present embodiment, one side and the other side of the double-sided mounting board are produced continuously (continuous mode), or produced with the production of other boards in between. The execution order of the production programs A1 to E can be determined in consideration of the selection status of whether to perform (intermittent mode). For this reason, the execution order of the production programs A1 to E can be determined according to the user's preference, such as shortening the total production time, reducing the work in progress, improving the operating rate, and reducing the workload of the worker. .

  In addition, as illustrated in FIG. 1, the storage unit 901 of the control device 90 of the existing electronic component mounting system 9 may store an order determination program that determines the execution order of the plurality of production programs A1 to E. Many. For this reason, the electronic component mounting system 9 of this embodiment is realizable only by updating the order determination program of the existing electronic component mounting system 9. FIG. Thus, the electronic component mounting system 9 of this embodiment is highly versatile.

  Further, according to the electronic component mounting system 9 of the present embodiment, as shown in FIG. 5, the execution order of the production programs A1 to E is determined in consideration of the non-commonality of the component supply unit 4. Here, the higher the non-commonality of the component supply unit 4, the longer the replacement time of the component supply unit 4 at the time of setup change. For this reason, according to the electronic component mounting system 9 of the present embodiment, the execution order of the production programs A1 to E can be determined in consideration of the replacement time of the component supply unit 4.

  Further, according to the electronic component mounting system 9 of the present embodiment, as shown in FIG. 5, the execution order of the production programs A1 to E is determined in consideration of the non-commonality of the backup unit 35. Here, the higher the non-commonality of the backup unit 35, the longer the replacement time of the backup unit 35 at the time of setup change. For this reason, according to the electronic component mounting system 9 of the present embodiment, it is possible to determine the execution order of the production programs A1 to E in consideration of the replacement time of the backup unit 35.

  Further, according to the electronic component mounting system 9 of the present embodiment, as shown in FIG. 5, the double-sided production interval, the non-commonness of the component supply unit 4, and the non-commonness of the backup unit 35 are set between the production programs A1 to E. In terms of distance, the execution order of the production programs A1 to E is optimized. For this reason, when the execution order is output on a screen, paper, or the like, the operator can easily grasp the execution order of the production programs A1 to E sensuously.

<Second embodiment>
The difference between the electronic component mounting system of the present embodiment and the electronic component mounting system of the first embodiment is that the control device, not the operator, selects the continuous mode and the intermittent mode. Here, only differences will be described. In addition, in description, FIGS. 1-5 is used.

In the electronic component mounting system of the present embodiment, the control device 90 in FIG. 1 automatically performs mode selection in step 2 (S2) in FIG. Specifically, mode selection is performed using the following formula (1).
T1 × (N1-1) + T2> T3 Formula (1)

  In Formula (1), T1 is the mounting time of the electronic component on one surface of one double-sided mounting board by the production program A1 (for single-surface production) per electronic component mounting machine 1. N1 is the number of double-sided mounting boards produced (= 30 sheets (see Table 1)). T2 is a setup change time required for the setup change performed when the electronic component mounting machine 1 at the most upstream end of the production line 91 is switched from the production program A1 to the production program A2 (for other side production). T3 is the mounting of the electronic component on the other side of the double-sided mounting board by the production program A2 from the completion of the mounting of the electronic component on one side of the double-sided mounting board by the production program A1 of the electronic component mounting machine 1 at the most upstream end of the production line 91. This is the double-sided production interval required until the start.

Further, the control device 90 calculates the double-sided production interval T3 from the following equation (3).
T3 = t1 × N3 + t3 (3)

  In formula (3), t1 is a post-processing step (inspection step by the substrate visual inspection machine 910 shown in FIG. 1, reflow furnace 911) from completion of mounting of the electronic component to one surface of the first double-sided mounting substrate by the production program A1. Is the post-treatment time until the heat treatment step) is completed. N3 is a batch when conveying work in progress from the outlet side (downstream side) of the reflow furnace 911 shown in FIG. 1 to the electronic component mounting machine 1 on the most upstream side, for example, by a carriage or a rack. It is the number of conveyances. t3 is the batch conveyance time.

  When Expression (1) is satisfied, even if the production program A1 and the production program A2 are continuously executed, the component devices (the electronic component mounting machine 1 and the board appearance inspection machine 910) that constitute the production line 91 of FIG. However, it does not go into the waiting state for the substrate. That is, the constituent devices do not play. For this reason, the control device 90 in FIG. 1 selects the continuous mode.

  On the other hand, when Expression (1) is not established, when the production program A1 and the production program A2 are continuously executed, the constituent devices (electronic component mounting machine 1, board appearance inspection) constituting the production line 91 of FIG. The machine 910) is in a state of waiting for a substrate. In other words, the components are idle. For this reason, the control device 90 of FIG. 1 selects the intermittent mode.

  In the intermittent mode, the control device 90 in FIG. 1 determines which production program B to E among the remaining production programs B to E is inserted between the production program A1 and the production program A2. .

Specifically, the determination is performed using the following equation (2).
T1 × (N1-1) + T2 + (T4 × N2)> T3 Expression (2)

  In formula (2), T1, N1, T2, and T3 are the same as in formula (1). T4 is a mounting time of the electronic component on one board by the production programs B to E per one electronic component mounting machine 1. N2 is the number of boards produced (40 for production program B, 50 for production program C, 25 for production program D, 35 for production program E (see Table 1)). is there.

  When other production programs B to E are inserted between the production program A1 and the production program A2 so that the expression (2) is established, the components (electronic component mounting machine 1) constituting the production line 91 of FIG. Thus, the board appearance inspection machine 910) does not enter the board waiting state. That is, the constituent devices will not play.

  The electronic component mounting system according to the present embodiment has the same effects as the electronic component mounting system according to the first embodiment with respect to the parts having the same configuration. Further, according to the electronic component mounting system of the present embodiment, the control device 90 in FIG. 1 can automatically select the continuous mode and the intermittent mode according to the equation (1). In addition, the control device 90 can automatically calculate the double-sided production interval T3 from the equation (3).

  Further, according to Expression (2), the control device 90 automatically calculates which production programs B to E can be inserted between the production program A1 and the production program A2 in the intermittent mode. can do. For this reason, it is possible to insert other production programs B to E between the production program A1 and the production program A2 until the production line 91 does not play. In other words, in the intermittent mode, the production program A1 and the production program A2 can be executed close to each other in time series until the production line 91 does not play. For this reason, work in progress can be reduced while shortening the total production time.

<Others>
The embodiment of the electronic component mounting system of the present invention has been described above. However, the embodiment is not particularly limited to the above embodiment. Various modifications and improvements that can be made by those skilled in the art are also possible.

  The configuration of the production line 91 shown in FIG. 1 is not particularly limited. For example, a screen printing machine and a printing state inspection machine may be arranged on the upstream side of the electronic component mounting machine 1. Further, a substrate appearance inspection machine 910 may be disposed on the downstream side of the reflow furnace 911. Further, the board appearance inspection machine 910 may not be arranged on the production line 91. The number of component supply units 4 in the electronic component mounting machine 1 shown in FIG. 4 is not particularly limited. Single or multiple. Moreover, you may arrange | position the component supply part 4 of a pallet type (a type with which the electronic component is mounted on the plate-shaped pallet).

  In the above embodiment, the work-in-process is batch transported from the outlet side (downstream side) of the reflow furnace 911 shown in FIG. 1 to the electronic component mounting machine 1 on the most upstream side. However, the work in progress may be continuously conveyed by a conveyor or the like.

  The number and configuration of the production programs A1 to E shown in Table 1 are not particularly limited. There may be a plurality of production programs A1 and A2 for the double-sided mounting board. Further, one side and the other side of the double-sided mounting substrate may be the front side or the back side. That is, when a double-sided mounting board is produced, the front surface may be produced by the production program A1, and the back surface may be produced by the production program A2. Conversely, the back surface may be produced by the production program A1, and the front surface may be produced by the production program A2.

  In the above embodiment, as shown in FIG. 5, the replacement time of the component supply unit 4 and the backup unit 35 at the time of setup change is reflected in the determination of the execution order of the production programs A1 to E. However, the time for replacing the suction nozzle 320 and the mounting head 32 shown in FIG. 2, the time for changing the conveyance width of the substrate 10 shown in FIG. You may let them. Moreover, the execution order of step 5 (S5)-step 7 (S7) shown in FIG. 5 is not specifically limited.

  In the second embodiment, the production programs B to E inserted between the production program A1 and the production program A2 may be singular or plural. If the production programs B to E are inserted, the number of setup changes can be reduced. Further, only a part of the production programs B to E may be inserted.

1: electronic component mounting machine, 2: base, 3: module, 4: component supply unit, 5: device pallet, 9: electronic component mounting system.
10: substrate, 20: Y direction guide rail, 30: substrate transport unit, 31: XY robot, 32: mounting head, 35: backup unit, 40: tape feeder, 50: slot, 90: control device, 91: production line .
300: reference wall, 300a: clamping piece, 301: movable wall, 301a: clamping piece, 302: conveyor belt, 310: Y-direction slider, 311: X-direction slider, 312: Y-direction guide rail, 313: X-direction Guide rail, 320: suction nozzle, 350: backup plate, 351: backup pin, 400: tape, 900: calculation unit, 901: storage unit, 910: substrate visual inspection machine, 911: reflow furnace.
F: Floor.

Claims (5)

An electronic component mounting system comprising: a control device that determines an execution order of a plurality of production programs related to board production; and a production line that sequentially produces the boards of a plurality of board types according to the execution order,
Among the substrates of a plurality of substrate types, at least one of the substrates is a double-sided mounting substrate for mounting electronic components on both sides,
The plurality of production programs include a one-side program that produces one side of the double-sided mounting board, and an other-side program that produces the other side of the double-sided mounting board,
The control device determines the execution order in consideration of the following (A).
(A) A selection mode of a continuous mode in which the one-side program and the other-side program are continuously executed, and an intermittent mode in which the one-side program and the other-side program are executed intermittently with the other production program in between. The electronic component mounting system according to claim 1, wherein the control device determines the execution order in consideration of the following (B).
(B) Replacement time of components constituting the production line at the time of changeover performed when the production program is switched. The production line includes an electronic component mounting machine including a component supply unit that supplies an electronic component to be mounted on the substrate, and a backup unit that supports the substrate when the electronic component is mounted on the substrate.
(B) includes the following (b1) and (b2),
The electronic component mounting system according to claim 2, wherein the control device determines the execution order in consideration of at least one of the (b1) and the (b2).
(B1) The replacement time of the component supply unit at the time of the setup change.
(B2) The replacement time of the backup unit at the time of the setup change. The production line has an electronic component mounting machine,
The mounting time of the electronic component on the one surface of the one double-sided mounting board by the one-surface program per one electronic component mounting machine is T1,
The production quantity of the double-sided mounting board is N1,
A setup change time required for the setup change to be performed at the time of switching from the one-side program to the other-side program of any electronic component mounting machine is T2,
From the completion of mounting of the electronic component to the one surface of the double-sided mounting board by the one-side program of the electronic component mounting machine from the start of mounting of the electronic component to the other side of the double-sided mounting substrate by the other-side program The required double-sided production interval is T3.
In (A), the continuous mode is selected when the following expression (1) is satisfied, and the intermittent mode is selected when expression (1) is not satisfied, respectively. The electronic component mounting system described in Crab.
T1 × (N1-1) + T2> T3 Formula (1) When the formula (1) is not satisfied,
The mounting time of the electronic component on one board by the arbitrary production program excluding the one surface program and the other surface program per one electronic component mounting machine is T4,
The production number of the substrate is N2,
The electronic component mounting system according to claim 4, wherein the control device inserts the production program between the one-surface program and the other-surface program so that the following expression (2) is satisfied.
T1 × (N1-1) + T2 + (T4 × N2)> T3 Expression (2)

Images