JP2013029614A - Imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imaging device configured by connecting first and second substrates surrounded by a shield case and fixing the second substrate to the shield case via a joint member, while allowing an easy determination in an assembly step as to whether electromagnetic wave countermeasures are maintained or not.SOLUTION: The imaging device includes: a first substrate with an imaging element mounted thereon to optically convert an image formed by an imaging optical system; a second substrate connected to the first substrate and performing image processing on the image optically converted by the imaging element; and a shield case connected to the earth and surrounding the first and second substrates. The second substrate is fixed to the shield case via a joint member. An electronic component that causes an abnormal output image due to a contact with the earth is mounted in a position where the shield case is brought into contact with the electronic component when the shield case is deformed in a range having no influence on assembling.

Description

  The present invention relates to an imaging device with electromagnetic wave countermeasures taken.

  An imaging device including an imaging lens (an example of an imaging optical system) and an imaging element such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor) is known. Such an imaging apparatus is used for a digital camera, a video camera, an in-vehicle camera attached to an automobile, a surveillance camera provided outdoors, and the like.

  As such an imaging apparatus, there is one in which a board and a board are connected by a connector (see, for example, Patent Document 1).

  The imaging apparatus of Patent Document 1 includes an exterior case that is divided into a front case and a rear case that form an exterior, a barrel that is incorporated in the exterior case, and an imaging optical system that includes a lens that is incorporated in the barrel. An imaging device that captures an image of a subject guided by the imaging optical system, a first substrate on which the imaging device is mounted, fixed to the exterior case, and connected to the first substrate via a connector and connected to an external device And a second board having wiring connected to the cable. The first substrate is fixed with respect to the front case by soldering or the like after being positioned with respect to the photographing optical system so that an image photographed by the photographing optical system is stored in a good state. The second substrate is connected to the first substrate via a connector.

  Further, in the imaging device of Patent Document 1, the first substrate and the second substrate are surrounded by a shield case as a countermeasure against electromagnetic waves. The shield case is directly or indirectly connected to the ground. The second substrate is fixed to the shield case. As a fixing method, for example, a projection is provided on the shield case and fixed with the projection positioned, or a projection provided on the board is inserted into the recess of the shield case and fixed by soldering. The method to do is mentioned. When such a structure is used, after the second board is received in the shield case and fixed by soldering, the second board and the first board are connected by a connector, and the shield case is attached to the front case. Will be assembled.

  In the above-described structure, the first substrate is fixed to the front case after adjusting the position so as to form a good image according to the photographing optical system. On the other hand, after the second board is fixed to the shield case, the second board is connected to the first board via a connector, and the shield case is assembled to the front case.

  That is, the position of the first substrate is positioned according to the photographing optical system, whereas the second substrate is fixed at a fixed position with respect to the front case and the shield case, so Deviation may occur. When this deviation is large, a desired connection state cannot be obtained at the connector when the two boards are connected, or the connector and the two boards are overloaded, resulting in a decrease in connection reliability. In particular, in the case of a vehicle-mounted device, in a connected state where a load is applied to the connector, the connection may be disconnected due to the vibration of the vehicle, and photographing may not be possible.

  In order to solve such a problem, in a configuration in which the first substrate and the second substrate are surrounded by a shield case as a countermeasure against electromagnetic waves, when the first substrate and the second substrate are connected by a connector, the second substrate becomes the shield case. There is an imaging device (for example, the configuration shown in FIGS. 1 to 12 described later) that is fixed to the shield case via a joining member without touching. However, with this configuration of the imaging device, if the shield case is deformed within the range that does not hinder assembly during assembly work, it is time-limited whether electromagnetic wave countermeasures, which are a design guarantee item, are maintained. However, it is very difficult to make a judgment in the severe mass production assembly process.

  The present invention has been made in view of the above circumstances, and a first substrate and a second substrate surrounded by a shield case are connected, and the second substrate is fixed to the shield case via a bonding member. It is an object of the present invention to provide an imaging apparatus that can easily determine whether the countermeasure against electromagnetic waves is maintained in the imaging process.

  In order to achieve such an object, an image pickup apparatus of the present invention includes a first substrate on which an image pickup device that optically converts an image formed by a photographing optical system is mounted, and is connected to the first substrate and optically picked up by the image pickup device. A second substrate that performs image processing on the converted image, and a shield case that is connected to the ground and is disposed so as to surround the first substrate and the second substrate, and the second substrate is attached to the shield case via the bonding member. A fixed imaging device that mounts an electronic component whose output image is abnormal when it comes in contact with the ground at a position where the shield case and the electronic component come into contact when the shield case is deformed within the range that does not interfere with its assembly. It is characterized by doing.

  According to the present invention, in the imaging device in which the first substrate and the second substrate surrounded by the shield case are connected and the second substrate is fixed to the shield case via the bonding member, the countermeasure against electromagnetic waves is maintained. It can be easily determined in the assembly process.

1 is a perspective view illustrating an external appearance example of an imaging apparatus that is an embodiment of the present invention. 1 is a perspective view illustrating an example of an external appearance of an imaging apparatus according to an embodiment of the present invention as viewed from the back of a connection cord. It is a perspective view showing an example of appearance in the state where a rear case and a connection cord are removed from an imaging apparatus according to an embodiment of the present invention. 1 is a perspective cross-sectional view illustrating an example of an internal configuration in a state in which a rear case and a connection cord are removed from an imaging apparatus that is an embodiment of the present invention. It is a perspective view showing an example of appearance which looked at what fixed the 1st substrate to the front case of the imaging device which is one embodiment of the present invention from the slanting back. It is a perspective view showing an example of appearance of a front case of an imaging device which is one embodiment of the present invention. It is a perspective view showing an example of the appearance of the state where the rear case of the imaging device which is one embodiment of the present invention is removed. It is a disassembled perspective view which shows the external appearance example of the 1st board | substrate and 2nd board | substrate of the imaging device which is one Embodiment of this invention. It is a perspective view showing an example of appearance of a shield case of an imaging device which is one embodiment of the present invention. It is a disassembled perspective view which shows the example of an external appearance of the shield case of the imaging device which is one Embodiment of this invention. FIG. 2 is a perspective view showing an essential part of an imaging apparatus according to an embodiment of the present invention and showing an external appearance example of a state before joining between a joining convex piece and a joining opening. It is a perspective view showing an important example of an imaging device which is one embodiment of the present invention, and showing an appearance example in a state in which a joining convex piece and a joining opening are joined by a joining member. FIG. 6 is a perspective view illustrating an example of an installation position of an electronic component in a state where a rear case of the imaging apparatus that is an embodiment of the present invention is removed.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the accompanying drawings.

  The image pickup apparatus according to the present embodiment includes a first substrate on which an image pickup device that optically converts an image formed by a photographing optical system is mounted, and an image that is connected to the first substrate and optically converted by the image pickup device. And a shield case connected to ground and surrounding the first substrate and the second substrate and fixed to the holding member. The second substrate is fixed to the shield case via the bonding member. This configuration has the following characteristics.

  In short, the position where the shield case and the electronic component come into contact with each other when the shield case is deformed within a range that does not interfere with the assembly of the electronic component (including the fact that no image is output). It is characterized by being mounted on.

  Such features of the present embodiment will be described in detail below using specific examples.

  FIG. 1 is a diagram illustrating an example of an appearance of the imaging apparatus A according to the present embodiment. As illustrated in FIG. 1, the imaging apparatus A includes a photographing optical system 1, an outer case 2, and a connection cord 3.

  The outer case 2 is divided in the front-rear direction into a front case (holding member) 21 that houses and holds the photographing optical system 1 and a rear case 22 that houses the first substrate 41 and the second substrate 42. In this specification, the imaging direction by the imaging apparatus A indicated by the arrow FR is referred to as “front”, and the direction indicated by the arrow RR that is the opposite direction is referred to as “rear”.

  The imaging device A is installed as, for example, a vehicle-mounted camera that is installed in the vicinity of a bumper or a license plate at the rear of the vehicle and is mounted so as to capture an image of a diagonally lower part behind the vehicle. The captured image of the imaging device A is transmitted to an in-vehicle computer (not shown) for each imaging frame and displayed on a liquid crystal display device (not shown) installed in the vehicle interior. In addition, the usage example of the in-vehicle camera is not limited to the above, and the front of the vehicle can be imaged and used for obstacle detection.

  Of course, the imaging apparatus A can be applied not only to the above-described in-vehicle camera but also to a digital camera, a video camera, a surveillance camera, and the like.

  FIG. 2 is a diagram illustrating an example in which the imaging device A is viewed from behind the connection cord 3. As shown in FIG. 2, screw holes 22 b and 22 c used for screwing the imaging device A to a vehicle body (not shown) or the like on the rear surface 22 a of the rear case 22 of the imaging device A, and the connection cord 3. Screw holes 22d and 22e used for screwing to the rear case 22 are formed.

  FIG. 3 is a diagram illustrating an example of a state in which the rear case 22 and the connection cord 3 are removed from the imaging apparatus A. FIG. 4 is a sectional view thereof. The front case 21 is a member formed of resin, for example, and holds the photographing optical system 1 as shown in FIG. The photographing optical system 1 is composed of, for example, six lenses 11 to 16.

  A first substrate 41 is joined to the rear side of the front case 21. This first substrate 41 holds an image sensor 411 on the front side. The image sensor 411 is a solid-state image sensor using a CCD, a CMOS, or the like. The image sensor 411 photoelectrically converts an image formed by the photographing optical system 1 and outputs the image signal to the outside (for example, an in-vehicle computer). For this reason, the first substrate 41 can also be referred to as a “sensor substrate”.

  FIG. 5 is a view showing an example in which the first substrate 41 is fixed to the front case 21 shown in FIG. 3 as seen obliquely from the rear. As shown in FIG. 5, the first substrate is formed in a substantially rectangular shape, and concave portions 41 a and 41 b that are formed in a concave shape are formed at two corners located at opposite corners. ing. In addition, on the rear surface side, the first substrate 41 is provided with an electronic component 41e such as a capacitor and a resistor, and a first connector 412 for connecting to a second substrate 42 described later. Note that the electronic component 41e is not mounted in the vicinity of the defective portions 41a and 41b of the first substrate 41.

  Further, the front case 21 is similarly formed with the defect portions 21a and 21b corresponding to the defect portions 41a and 41b, and is formed with the defect portion 41a and the defect portion 21a, and the defect portion 41b and the defect portion 21b, respectively. The cylindrical side surface-shaped space is used as a space through which the screw penetrates when the front case 21 and the rear case 22 are connected by two screws (not shown).

  Next, a configuration for fixing the first substrate 41 to the front case 21 will be described. FIG. 6 is a diagram illustrating an example of the front case 21 viewed from obliquely rearward. As shown in FIG. 6, the front case 21 is provided with a substantially rectangular cylindrical outer peripheral wall 211 surrounding the outer periphery, and four substantially rectangular insertion grooves 216 formed between the outer peripheral wall 211. The support walls 212a, 212b, 212c, and 212d are integrally provided with a substantially cylindrical lens barrel 213 disposed inside the support walls 212a, 212b, 212c, and 212d. Further, in the corner portion between the support wall 212a and the support wall 212b and the corner portion between the support wall 212c and the support wall 212d, although detailed illustration is omitted, vertical grooves 214 are respectively formed. Yes. Each of the support walls 212a, 212b, 212c, and 212d includes a rear end surface 215 on a plane orthogonal to the optical axis of the photographing optical system 1.

  The position of the first substrate 41 is adjusted in the optical axis direction of the photographic optical system 1 and in the direction perpendicular to the optical axis so that the subject image guided by the photographic optical system 1 is formed at the center of the imaging surface of the image sensor 411. In this state, it is fixed to the rear end face 215. The first substrate 41 is fixed to the front case 21 by bonding with an adhesive and partially bonded through a fixing member 23 (see FIGS. 3 and 4).

  The reason why the adhesive is used without screwing or the like is to prevent an increase in size and weight.

  Further, the fixing member 23 is formed in a substantially L-shaped cross-section by a material that transmits ultraviolet rays, and is bonded so as to fit in the recesses 212 e formed in the support walls 212 b and 212 d of the front case 21.

  Further, an ultraviolet curable adhesive is used to bond the fixing member 23 to the first substrate 41 and the front case 21, and a thermosetting adhesive is used to connect the other first substrates 41. ing.

  Next, the configuration of the rear portion of the imaging apparatus A will be described. FIG. 7 is a view showing an example of the inner structure of the rear case 22. As shown in FIG. 7, a shield case 5 (an example of a shield member) is provided inside the rear case 22. The shield case 5 shields electromagnetic waves (electromagnetic wave countermeasures), and a metal casing or a resin casing whose interior is covered with a metal film is used. The shield case 5 is directly or indirectly connected to the ground (ground).

  A first substrate 41 and a second substrate 42 are provided inside the shield case 5. As shown in FIG. 8, the second board 42 is provided with a second connector 422 on the front side thereof, and by connecting the second connector 422 to the first connector 412 of the first board 41, Both are electrically connected.

  Note that a plurality of electronic components 42 e are provided on the rear surface side of the second substrate 42. The second substrate 42 performs image processing on an image optically converted by the image sensor 411 by a plurality of electronic components 42e. For this reason, the second substrate 42 can also be called a “main substrate”.

  The second substrate 42 is joined to the shield case 5, and the shield case 5 is assembled and joined to the front case 21. Here, in describing the bonding structure of the second substrate 42 to the shield case 5, the shield case 5 will be described first.

  FIG. 9 shows an example of the appearance of the shield case 5, and FIG. 10 is a diagram showing an exploded example of the shield case 5. As shown in these drawings, the shield case 5 includes a case bottom surface portion 51, a case tube portion 52, and a case top surface portion 53. The shape of the shield case 5 is not limited to the shape shown in FIGS. 9 and 10, and the shape that covers the entire periphery of the first substrate 41 and the second substrate 42 as long as the electromagnetic wave countermeasure function is established, or The shape may be any of a shape in which a part (for example, a predetermined surface) of the entire periphery of the first substrate 41 and the second substrate 42 is opened and covered.

  As shown in FIGS. 9 and 10, the case cylinder 52 is formed in a substantially rectangular parallelepiped cylinder. A square frame-like case upper surface portion 53 is attached to the rear end portion of the case tube portion 52.

  The case cylinder 52 is formed by bending a single rectangular thin plate at four corners 52b, 52c, 52d, and 52e, and joining portions 52g provided at positions adjacent to the corner 52b. It is made to join and is formed in the substantially square cylinder shape provided with the four side walls 521,522,523,524.

  The shield case 5 is fixed to the front case 21 with an adhesive or the like in a state where the case cylinder portion 52 is inserted into an insertion groove 216 formed between the outer peripheral wall 211 of the front case 21 and the support walls 212a to 212d. Is done.

  The second substrate 42 is not directly in contact with the outer periphery of the second substrate 42 and the case tube portion 52 inside the case tube portion 52 of the shield case 5, and the space sp1 and the gap sp2 between them (see FIG. 11). In a state of interposing, it is joined to the case tube portion 52 via a joining member 6 described later. Hereinafter, a detailed example of this joining structure will be described.

  As shown in FIG. 8, bonding convex pieces (bonding convex portions) 42 a are formed so as to protrude in the outer peripheral direction of the second substrate 42 at at least one position on the four sides of the outer periphery of the second substrate 42. In the present embodiment, the bonding convex pieces 42a are formed on three sides of the second substrate 42 (two of them are shown in FIG. 8), but are formed on all four sides. desirable.

  On the other hand, the inner circumference of the case cylinder 52 is formed to be larger than the outer circumference of the second substrate 42, and a space sp <b> 1 is formed between the inner circumference of the case cylinder 52 and the outer circumference of the second substrate 42. ing. Then, the second substrate 42 is connected to the first substrate 41 on the side walls 521 to 523 excluding the side wall 524 among the four side walls 521 to 524 that form the square cylindrical case tube portion 52 of the case tube portion 52. In this case, a rectangular bonding opening 52a is opened at a position facing the outer peripheral direction of the bonding convex piece 42a of the second substrate 42.

  The bonding opening 52a has a dimension in the front-rear direction larger than the thickness dimension of the second substrate 42, and a dimension in the width direction indicated by an arrow SD orthogonal to the front-rear direction has a convex piece for bonding. It is formed in a dimension larger than the width dimension of 42a. That is, when the second substrate 42 is connected to the first substrate 41 and the shield case 5 is fixed to the front case 21, as shown in FIG. 11, the bonding convex piece 42 is formed from the bonding opening 52 a. While projecting slightly to the outside of the case cylinder 52, a gap sp2 is formed between the projection 42a for bonding and the opening 52a for bonding in the front-rear direction and the width direction.

  The dimensional difference between the inner periphery of the case cylinder 52 and the outer periphery of the second substrate 42 (the dimension of the space sp1) and the dimensional difference between the bonding opening 52a and the bonding convex piece 42a (the dimension of the gap sp2) are as follows. The second substrate 42 is set to a dimension that does not interfere with each other even when the second substrate 42 moves within a preset movable range.

  That is, the position of the first substrate 41 is adjusted with respect to the photographing optical system 1 of the front case 21 so as to obtain good image formation, and its movable range is set in advance. Accordingly, the movable range of the second substrate 42 connected to the first substrate 41 via both connectors 412 and 422 is set in accordance with the first substrate 41. Therefore, as the first substrate 41 moves relative to the front case 21 within the set movable range, the second substrate 42 is fixed to the front case 21 even if it moves within the set movable range. The dimensional difference (space sp1 and gap sp2) is set so as not to interfere with the case cylinder portion 52 of the shield case 5.

  In the present embodiment, when the dimensions of the four sides of the second substrate 42 are 20 × 20 (mm), the thickness is 1 (mm), and the width of the bonding convex side 42a is 3 (mm), the bonding is performed. The opening 52a has a width of 5 × 5 (mm). This dimension is appropriately determined in consideration of the above movable range, the dimensional accuracy of the second substrate 42, the shield case 5, etc., the mounting accuracy, and the like. Is set.

  Further, a flange 52f is projected from the front side edge of the bonding opening 52a in the outer peripheral direction so as to face the bonding convex side 42a of the second substrate 42 in the front-rear direction.

  The second substrate 42 and the case cylinder 52 are joined by a joining member 6 shown in FIG. 12 with a joining convex piece 42a of the second substrate 42 and a flange 52f formed on the front edge of the joining opening 52a. It is made by joining. Examples of the joining member 6 include non-conductive adhesives such as epoxy, silicone, and acrylic resins, and solvent-based adhesives. Among these, an ultraviolet curable adhesive or a room temperature curable adhesive is preferable. Thus, by using a non-conductive member 6 as the bonding member 6, even when the bonding member 6 spreads on the first substrate 41, the second substrate 42, or inside the shield case 5 during bonding, There is no risk of short circuit without passing through.

  Next, an example of an assembly work procedure (assembly process) of the imaging apparatus A will be described.

  First, the first substrate 41 is bonded to the front case 21 on which the photographing optical system 1 is held. At this time, the first substrate 41 performs imaging while being supported by a jig (not shown). Then, the jig is positioned in the optical axis direction of the imaging optical system 1 and in the direction perpendicular to the optical axis so that the subject image guided by the imaging optical system 1 is formed at the center of the imaging surface of the image sensor 411. Adjustments are made. When this position adjustment is completed, the first substrate 41 and the front case 21 are joined by an adhesive.

  Next, the joining convex piece 42 a of the second substrate 42 is disposed in the joining opening 52 a of the shield case 5. In addition, what is inserted into the case cylinder 52 in a state where the outer periphery of the second substrate 42 is separated from the inner periphery of the shield case 5 is from the rear with respect to the front case 21 to which the first substrate 41 is fixed. Installed.

  Then, the second connector 422 of the second substrate 42 is connected to the first connector 412 of the first substrate 41, and the second substrate 42 is supported by the first substrate 41.

  On the other hand, in the shield case 5, the front end portion of the case cylinder portion 52 is inserted and positioned in the insertion groove 216 of the front case 21 and then joined by an adhesive.

  At this time, a sufficient space sp1 is secured between the case cylindrical portion 52 of the shield case 5 and the second substrate 42 based on the dimensional difference, and the joining convex piece 42a and the joining opening 52a. A gap sp2 is secured between the two. For this reason, while the shield case 5 is positioned with respect to the front case 21, even if the second substrate 42 follows the position of the first substrate 41, the second substrate 42 and the case tube portion 52 interfere with each other. The first connector 412 and the second connector 422 can be connected without applying a load.

  Next, the joining convex piece 42 a of the second substrate 42 and the flange 52 f of the joining opening 52 a are joined from the outside of the case tube portion 52 by the joining member 6.

  Thereafter, the shield case 5 is covered with the rear case 22. Then, the front case 21 and the rear case 22 are joined. Then, the connection cord 3 is connected to the second substrate 42.

  As described above, the assembling work of the image pickup apparatus A is completed.

  In the imaging apparatus A configured as described above, the following effects (a) to (e) can be obtained.

  (A) The second substrate 42 and the shield case 5 are joined through the joining member 6 after being in non-contact by the space sp1 and the gap sp2. Thereby, the position of the first substrate 41 relative to the front case 21 and the position of the first substrate 42 connected to the first substrate 41 are varied by adjusting the position of the first substrate 41 according to the photographing optical system 1. In addition, the relative displacement between the shield case 5 and the second substrate 42 is absorbed by the space sp <b> 1 and the gap sp <b> 2 set between the shield case 5.

  Therefore, even when the connectors 412, 422 are connected, even if the second substrate 42 follows the first substrate 41, the second substrate 42 and the shield case 5 do not interfere with each other, and the connectors 412, 422 are forced. Connection without any heavy load. Thereby, according to the imaging device A, it is possible to prevent a connection failure from occurring in both the connectors 412 and 422, and it is possible to maintain the connection state even if vibration or the like is input.

  In addition, since the second substrate 42 and the shield case 5 are joined via the joining member 6, the load of the second substrate 42 is distributed to the shield case 5, and the second connector 42 and the shield case 5 are connected to the connection portions by the connectors 412 and 422. The load applied to the two substrates 42 can be suppressed, and the load acting on the connecting portions of the connectors 412 and 422 can be distributed to the shield case 5 due to vibration during use. Thereby, according to the imaging device A, it can prevent that the connection state of both the connectors 412 and 422 deteriorates by the said load and load.

  (B) When joining the second substrate 42 and the shield case 5, the joining convex piece 42 a protrudes outward from the outer periphery of the second substrate 42, and shields through the joining opening 52 a opened in the shield case 5. It arrange | positions so that the case 5 may face outward, and it was made to join by this convex piece 42a for joining and the inner peripheral outer edge part of the opening part 52a for joining.

  Therefore, even if the space sp <b> 1 is secured between the outer periphery of the second substrate 42 and the inner periphery of the shield case 5, the joining operation can be performed from the outside of the shield case 5 and is joined inside the shield case 5. Compared with, it is excellent in workability.

  In addition, since the gap sp2 is secured in the front-rear direction and in the direction orthogonal to the gap between the bonding convex piece 42a and the bonding opening 52a, the second substrate 42 is attached to the first substrate 42 as described above. Even if it follows the board | substrate 41, it can prevent that the load is applied to both the connectors 412 and 422 by the interference, without the protrusion 42a for joining and the opening part 52a for joining interfering.

  (C) When the joining convex piece 42a of the second substrate 42 and the inner peripheral edge of the joining opening 52a of the shield case 5 are joined, a flange 52f is provided at the lower edge of the joining opening 52a, and the flange 52f And the joining convex piece 42 a are joined via the joining member 6.

  Therefore, according to the imaging apparatus A, compared with the case where the flange 52f is not provided, the contact area of the shield case 5 with respect to the joining member 6 can be secured, and the joining strength between the joining convex piece 42a and the joining opening 52a is increased. Can be increased.

  (D) Since a non-conductive adhesive is used as the bonding member 6, even when the bonding member 6 spreads on the second substrate 42 or the first substrate 41 or the shield case 5 during bonding, There is no risk of short circuit.

  (E) Since the case cylinder 52 is formed by bending a single resin or metal thin plate, it is easy to manufacture.

  In the imaging apparatus A described above, the shield case 5 and the rear case 22 are parallel to each other on each surface, and once completed as the imaging apparatus A (when the completed state shown in FIGS. 1 and 2 is reached), the shield. The case 5 is not deformed. However, if the shield case 5 is deformed during the assembly operation described above and the deformation is within a range that does not hinder the assembly, the assembly is performed without any problem. In this case, the imaging apparatus A is in a completed state as shown in FIGS. 1 and 2 with a defect (deformation of the shield case 5) inside.

  In the imaging apparatus A, the electromagnetic wave countermeasure (electromagnetic wave countermeasure function), which is a design guarantee item, is affected by the positional relationship between the electric circuit component and the shield case 5. In other words, the electromagnetic wave countermeasure is evaluated at a dedicated evaluation site, for example, based on the positional relationship between the electrical circuit component and the shield case 5 which are approximately correct in design. Therefore, the electromagnetic wave countermeasure guaranteed by this evaluation is out of the guarantee when the shield case 5 is deformed and the positional relationship between the electric circuit component and the shield case 5 changes.

  For this reason, it is desirable to detect the deformation of the shield case 5 before the imaging device A is completed. However, it is not possible to determine whether the countermeasure against electromagnetic waves is maintained (whether the shield case 5 is deformed and the positional relationship between the electric circuit component and the shield case 5 is not changed) in a mass production assembly process with strict time restrictions. There is a problem that it is very difficult.

  Therefore, the imaging apparatus A of the present embodiment is characterized in that the following devices are applied to the configuration described with reference to FIGS.

  In other words, in the image pickup apparatus A, an electronic component in which an output video becomes abnormal when touching the ground (including that “an image is not output”) is mounted on a predetermined portion of the second substrate 42. The predetermined portion is a position where the shield case 5 and the electronic component come into contact when the shield case 5 is deformed. Further, the amount of deformation of the shield case 5 is an amount that causes an unacceptable influence on electromagnetic wave countermeasures when the shield case 5 is further deformed.

  FIG. 13 shows an example of mounting electronic components. As shown in FIG. 13, the electronic component 8 is mounted (arranged) on the second substrate 42. As described above, when the electronic component 8 comes into contact with the ground, the output image becomes abnormal. The position where the electronic component 8 is mounted is a position where the shield case 5 comes into contact with the electronic component 8 when the shield case 5 is deformed. In the example of FIG. 13, a part of the shield case 5 in the vicinity of the electronic component 8 is deformed (deformed portion 9) and is in contact with the electronic component 8. Such deformation occurs in the assembly work (assembly process), and does not occur in the completed state shown in FIGS.

  With the electronic component mounting structure shown in FIG. 13, when the shield case 5 is deformed in a range that does not hinder the assembly of the shield case 5 during assembly work, the shield case 5 and the second substrate 42 are mounted. The electronic component 8 comes into contact. Due to this contact, the output image of the electronic component 8 becomes abnormal. This abnormality in the output image is discovered by inspection of the finished product in the assembling operation (manufacturing process) of the imaging apparatus or in the middle of the assembling (such inspection is widely performed in general). .

  In summary, according to the imaging apparatus A having the structure shown in FIG. 13, when the deformation of the shield case 5 that affects the electromagnetic wave countermeasure function occurs, the deformation can be easily inspected. That is, it is possible to determine whether the electromagnetic wave countermeasure function is maintained in a mass production assembly process with severe time restrictions. As a result, it is possible to prevent the outflow of defective products to the market.

  Note that the mounting position of the electronic component 8 is not limited to the position illustrated in FIG. 13, and may be a position that contacts the shield case 5 when the shield case 5 is deformed.

  Further, the mounting position of the electronic component 8 is not limited to the second substrate 42 shown in FIG. 13, and the first substrate 41 is a position that contacts the shield case 5 when the shield case 5 is deformed. It may be on the top or another place.

  In addition, since the electronic component 8 has a more free layout on the substrate, it is preferable that the influence on the electromagnetic wave countermeasure function itself is small. In other words, electronic components have a great influence on electromagnetic wave countermeasures and can be mounted only at specific locations on a specific board (if they are mounted outside a specific location, the required electromagnetic wave countermeasures cannot be satisfied). In this case, the place of mounting is limited, and the degree of freedom of layout on the board is reduced. On the other hand, if the electronic component has a property that has little influence on electromagnetic wave countermeasures, the mounting location is not limited, and the degree of freedom in layout on the substrate is increased. Therefore, as the electronic component 8 mounted on the substrate, it is preferable to use an electronic component having a small influence on electromagnetic wave countermeasures.

  The electronic component 8 may be a wiring or a circuit pattern as long as the output image becomes abnormal due to contact with the ground (shield case).

  As described above, according to the present embodiment, the first substrate and the second substrate surrounded by the shield case are connected, and the second substrate is fixed to the shield case via the bonding member. Therefore, it can be easily determined in the mass production assembly process whether the electromagnetic wave countermeasure is maintained. As a result, the outflow of defective products can be prevented.

  As mentioned above, although embodiment of this invention was described, it is not limited to the said embodiment, A various deformation | transformation is possible in the range which does not deviate from the summary.

A imaging device sp1 space sp2 gap 1 imaging optical system 2 outer case 3 connection cord 5 shield case 6 joining member 8 electronic component 9 part where shield case is deformed 21 front case 41 first substrate 42 second substrate 42a bonding convex piece 52a Joint opening 52f Flange 411 Image sensor (image sensor)
412 1st connector 422 2nd connector 521 Side wall 522 Side wall 523 Side wall 524 Side wall

JP 2008-33010 A

Claims (3)

A first substrate on which an image sensor that optically converts an image formed by the photographing optical system is mounted;
A second substrate connected to the first substrate and performing image processing on an image optically converted by the imaging device;
A shield case connected to ground and arranged to surround the first substrate and the second substrate,
The second substrate is an imaging device fixed to the shield case via a joining member,
An electronic component whose output image becomes abnormal when in contact with ground is mounted at a position where the shield case and the electronic component come into contact with each other when the shield case is deformed in a range that does not hinder its assembly. Imaging device. The position where the electronic component is mounted is
The imaging apparatus according to claim 1, wherein the imaging apparatus is on the first substrate or the second substrate. The electronic component is
The imaging apparatus according to claim 1, wherein an influence on electromagnetic wave countermeasures realized by the shield case is small.

Images