JP2013026293A - Capacitor and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To relax flexural stress of a lead terminal to be folded, and to prevent deterioration in connection strength between the lead terminal and a capacitor element side.SOLUTION: A capacitor has: an exterior member (6) encapsulating a capacitor element (4); and lead terminals (10A and 10B) connected to the capacitor element, extracted from the exterior member or a base member (30) juxtaposed to the exterior member, and folded. Each lead terminal has a flat part (23); a first recessed part (a notch 24) formed in a surface part of a folding direction side of the flat part; and a second recessed part (a notch 26) formed in a surface part of an opposite direction side opposite from the folding direction side. These first and second recessed parts are set at different positions from a terminal extracting surface part (18) of the exterior member, and the lead terminals (10A and 10B) are folded using the first recessed part as a fulcrum (origin).

Description

The present invention relates to a capacitor formed into a chip by molding a lead terminal drawn from an exterior member, such as a chip capacitor, and a method for manufacturing the same.

  The chip type capacitor is provided with its lead terminal formed into a face bonding terminal. For example, the lead terminal is bent on the exterior member of the capacitor, or is folded on the base member installed on the exterior member, thereby enabling surface mounting on the wiring board.

Regarding such bending of the lead terminal, Patent Document 1 describes forming a notch or thin portion in the lead terminal, and Patent Document 2 describes forming a wedge-shaped bending groove. Yes.

JP 62-162323 A JP 2000-21683 A

  By the way, regarding the bending process of the lead terminal, if a notch part or a thin part (Patent Document 1) or a wedge-shaped bending groove (Patent Document 2) is formed in the lead terminal, the bending of the lead terminal is facilitated. The inner surface portion is compressed and the outer surface portion is stretched, and a large bending stress is generated in the bent lead terminal. This bending stress acts between the lead terminal to be bent and the exterior member, that is, the mold resin, thereby reducing the adhesion between the lead terminal and the resin mold (exterior member), or causing cracks in the exterior member to improve the airtightness. There are issues such as loss.

  Further, when this bending stress acts on the connection portion between the lead terminal and the capacitor element (specifically, the connection portion between the electrode foil of the capacitor element and the lead terminal) from the lead terminal, the connection strength between the lead terminal and the capacitor element is increased. There is also a problem that the reliability of connection is impaired, such as a decrease and an increase in connection resistance.

  When a wedge-shaped bending groove formed for facilitating bending is formed on the side opposite to the bending direction of the lead terminal (Patent Document 2), the bending stress of the lead terminal is reduced or stress relaxation is achieved. However, there is a problem that the bent portion of the lead terminal is weakened, and the mechanical strength of the lead terminal and the connection strength with the board-side conductor are expected to decrease.

Therefore, in view of such a problem, an object of the present invention is to alleviate bending stress of a lead terminal to be bent and prevent deterioration of connection strength between the lead terminal and the capacitor element side.

  In order to achieve the above object, the capacitor of the present invention is drawn and bent from an exterior member that seals the capacitor element, and the exterior member or the base member that is connected to the exterior member and is juxtaposed to the exterior element. The lead terminal is formed on a flat portion, a first concave portion formed on a surface portion of the flat portion in a bending direction, and a surface portion in a direction opposite to the bending direction before the bending process. The second concave portion is provided, and the first concave portion and the second concave portion are set at different positions from the terminal lead-out surface portion of the exterior member.

  In order to achieve the above object, in the capacitor of the present invention, the first recess may be set at a position closer to the terminal lead-out surface portion than the second recess.

  In order to achieve the above object, in the capacitor of the present invention, a non-flat portion is provided between the exterior member or the base member and the flat portion of the lead terminal, and the first recess is in the vicinity of the non-flat portion. It may be formed.

  In order to achieve the above object, in the capacitor of the present invention, the flat portion may be formed on the first concave portion side, and the first concave portion may be formed in the vicinity of the non-flat portion.

  In order to achieve the above object, in the capacitor of the present invention, the exterior member may be a mold resin.

  In order to achieve the above object, in the capacitor of the present invention, the first recess and the second recess are formed in a lead terminal made of aluminum, and a metal plating layer is formed on the flat portion of the lead terminal. May be.

  In order to achieve the above object, a method of manufacturing a capacitor according to the present invention includes a step of forming a flat portion on a lead terminal connected to a capacitor element and drawn out from an exterior member covering the capacitor element, and a surface portion of the lead terminal. Forming the first concave portion, forming the first concave portion in a folding direction, and forming a second concave portion on a surface portion opposite to the bending direction from the surface portion of the exterior member or the base member; and Bending the lead terminal in the bending direction.

In order to achieve the above object, the capacitor manufacturing method of the present invention may include a step of forming a non-flat portion between the exterior member or the base member and the flat portion of the lead terminal.

  According to the capacitor of the present invention or the manufacturing method thereof, one of the following effects can be obtained.

  (1) The bending stress of the lead terminal can be alleviated, and the decrease in connection strength between the lead terminal and the capacitor element and the increase in connection resistance can be suppressed.

  (2) The relaxation of the bending stress of the lead terminal can reduce the stress action from the lead terminal to the close contact portion between the exterior member and the lead terminal, and can prevent deterioration in airtightness between the exterior member and the lead terminal.

  (3) Product defects associated with lead terminal bending can be suppressed, and yield can be improved.

Other objects, features, and advantages of the present invention will become clearer with reference to the accompanying drawings and each embodiment.

It is a figure which shows an example of the shaping | molding process of the capacitor | condenser which concerns on 1st Embodiment, and its lead terminal. It is a figure which shows an example of the shaping | molding process of the capacitor | condenser which concerns on 2nd Embodiment, and its lead terminal. It is a figure which shows an example of the variation of each notch of a lead terminal, and a shaping | molding die. It is a figure which shows an example of the variation and function of each notch of a lead terminal.

[First Embodiment]

  The first embodiment is a case of a chip type capacitor using a resin mold as an exterior member. FIG. 1 shows an example of the forming process of the capacitor and its lead terminal according to the first embodiment. The configuration illustrated in FIG. 1 is an example, and the present invention is not limited to such a configuration.

  A capacitor 2 shown in FIG. 1 is, for example, a mold type chip capacitor. In the capacitor 2, the capacitor element 4 is packaged by an exterior member 6 made of a sealing resin and sealed. Capacitor element 4 is, for example, wound with a separator sandwiched between electrode foils on the anode side and the cathode side, for example, a solid capacitor element in which a solid electrolyte layer is formed between electrode foils, or electrolysis impregnated with a driving electrolyte solution A capacitor element such as a capacitor element.

  Lead terminals 10 </ b> A and 10 </ b> B connected to the anode side and the cathode side of the capacitor element 4 are drawn out from the element end face 8 of the capacitor element 4. As an example, the lead terminal 10A is the anode side, and the lead terminal 10B is the cathode side. Each lead terminal 10A, 10B flattens the part connected to the anode side or cathode side electrode foil of the capacitor element 4, and the part drawn out from the capacitor element 4 (that is, the illustrated part and before molding) is the original form. In order to function as a shape and a cylindrical external terminal, it has a cylindrical shape (round bar shape) with mechanical strength.

  <Molding mold>

  As shown in FIG. 1A, a molding die (mold) 12 is used for molding each lead terminal 10A, 10B. The mold 12 includes one middle mold 12M as a first mold and two outer molds 12A and 12B as a second mold. In the first embodiment, by using two outer molds 12A and 12B for a single middle mold 12M, flattening of each lead terminal 10A and 10B and notch (notch) can be performed in a single molding process. : Notch, dent) and molding. Notch molding is an example of recess molding.

  A middle mold 12M is disposed between the lead terminals 10A and 10B, and a pair of outer molds 12A and 12B are disposed with the lead terminals 10A and 10B interposed between the front and back surfaces of the middle mold 12M. That is, a sandwich structure is constituted by the middle mold 12M and the outer molds 12A and 12B with the lead terminals 10A and 10B sandwiched around the middle mold 12M.

The middle mold 12M is a rectangular parallelepiped, and has two molding surfaces 14A and 14B, at least one reference surface 16, and a reference width W ₁ for maintaining the molding surfaces 14A and 14B in parallel on the front and back surfaces facing the outer molds 12A and 12B. Is provided. The molding surfaces 14 </ b> A and 14 </ b> B are orthogonal to the reference surface 16. The reference surface 16 is a flat surface and abuts on the terminal lead surface 18 of the exterior member 6. The molding surfaces 14 </ b> A and 14 </ b> B include a flat molding portion 142 and a notch molding portion 144 that protrudes from the flat molding portion 142. The notch forming portion 144 is a triangular protrusion for forming a notch having a V-shaped cross section as an example. The notch forming portion 144 has a height h ₁ . The notch forming portion 144 is formed at a distance t ₁ from the reference surface 16 and has a width of W ₂ .

The outer molds 12A and 12B are both formed in a rectangular parallelepiped shape, and have one molding surface 20 and at least one reference surface 22 on one surface facing the middle mold 12M. The molding surface 20 is orthogonal to the reference surface 22. A fixed interval t ₂ is set between the reference surface 22 and the terminal lead surface 18 of the exterior member 6. The molding surface 20 includes a flat molding part 202 and a notch molding part 204. As an example, the notch forming portion 204 is a rectangular protrusion for forming a notch having a square cross section. The notch forming portion 204 is set to a height h ₂ and a width W ₃ .

A fixed distance t ₃ is set between the molding surfaces 14A and 14B of the middle mold 12M and the molding surfaces 20 of the outer molds 12A and 12B, and the flat molding portion 142 and the flat molding portion 202 constitute parallel surfaces. That is, this interval t ₃ is the molding thickness of the lead terminals 10A and 10B (that is, the collapsed width of the lead terminals 10A and 10B).

  <Molding of lead terminals 10A and 10B>

As shown in FIG. 1A, an intermediate mold 12M is installed between the lead terminals 10A and 10B, and the reference surface 16 of the intermediate mold 12M is brought into contact with the terminal lead-out surface 18 of the exterior member 6 of the capacitor 2. 12M is positioned. The outer molds 12A and 12B opposed to the middle mold 12M have the reference surfaces 22 of the outer molds 12A and 12B drawn out from the terminals of the exterior member 6 with reference to the reference surface 16 of the middle mold 12M positioned against the terminal drawing surface 18. apart positioning from the surface 18 by the distance t _2. That is, the interval t ₂ is set between the reference surfaces 16 and 22 of the middle mold 12M and the outer molds 12A and 12B.

The outer dies 12A and 12B are moved relative to the intermediate die 12M in the sandwiching direction of the intermediate die 12M, and the applied pressure F is applied to crush the lead terminals 10A and 10B. Medium 12M each outer mold 12A, by maintaining the distance between 12B to t _3, the molding the lead terminals 10A, and 10B in a flat shape having a thickness t _3. Thereby, the flat part 23 is formed in each lead terminal 10A, 10B.

  At the same time as the forming process, the flat portion 23 of each lead terminal 10A, 10B is formed with a notch 24 as a first recess by the outer die 12A or 12B, and a notch 26 as a second recess by the middle die 12M. Is done. That is, the notch 24 is formed on the surface portion in the bending direction of each lead terminal 10A, 10B, and the notch 26 is formed on the surface portion in the direction opposite to the bending direction of each lead terminal 10A, 10B. These notches 24 and 26 are formed at different positions in the length direction of the lead terminals 10 </ b> A and 10 </ b> B from the terminal lead surface 18 of the exterior member 6. The part is formed at a position farther from the deepest part closest to the lead terminal drawing surface of the notch 24.

Each lead terminal 10A, the 10B, an outer mold 12A, 12B and a non-contact, as a portion not subjected to pressure F, the width of t ₂ between the terminal lead surface 18 and the notch 24 of the outer member 6 Thus, the non-molded surface portion 28 is formed. The non-molded surface portion 28 is thicker in the radial direction with respect to the flattened lead terminals 10A and 10B than the original cylindrical shape, and forms a protruding protrusion. That is, a non-molded surface portion 28 is formed as a non-flat portion with respect to the flat portion 23. Note that the interval t ₂ in order to avoid the spread of the molding stress, 0.05-0.15 (mm) is preferred. As described above, when the lead terminals 10A and 10B are molded, molding stress is applied to the non-molded surface portions 28 of the lead terminals 10A and 10B which are molded by the outer molds 12A and 12B. Therefore, if the above-described interval t ₂ is provided between the exterior member 6, it is possible to reduce the molding stress applied to the non-molded surface portion 28 from being applied to the contact surface between the exterior member 6 and the lead terminals 10 A and 10 B. It can alleviate the effect of stress on the sealing performance.

  <Material of lead terminals 10A and 10B>

  A round bar member made of aluminum is used for the lead terminals 10A and 10B, one end thereof is formed into a flat shape to form a flat portion, and the electrode foil constituting the capacitor element is stitched to the flat portion, ultrasonic welding, The other end is led out from the exterior member 6 by cold pressure welding or the like. As the lead terminal, another configuration in which another metal wire is welded to a round bar portion led out from the exterior member 6 can be used. In such a configuration, the shape of the capacitor is equal to the length of the welded portion. Since (dimension) becomes large, as described above, it is preferable to lead out the lead terminal as it is from the exterior member 8 with the aluminum round bar-shaped material.

  <Bending of lead terminals 10A and 10B>

As shown in FIG. 1B, each lead terminal 10A, 10B molded in the above-described molding process protrudes in a direction orthogonal to the terminal lead surface 18 of the exterior member 6, so that the bending direction The lead terminals 10 </ b> A and 10 </ b> B are bent in a direction parallel to the terminal lead-out surface 18 of the exterior member 6 using the notch 24 formed in the above as a bending fulcrum (starting point). Since the radius of curvature on the notch 24 side is small and the radius of curvature on the notch 26 side is increased by the thickness t ₃ of each lead terminal 10A, 10B, the notch 26 extends along the curvature of the lead terminals 10A, 10B. It is formed into a gentle surface portion similar to the peripheral surface portion.

  <Metal plating of lead terminals 10A and 10B>

  Each lead terminal 10 </ b> A, 10 </ b> B is bent in a direction parallel to the terminal lead surface 18 of the exterior member 6. For example, a nickel plating layer and a tin plating layer are formed as soldering layers on the lower surfaces of the lead terminals 10A and 10B formed by bending. In order to form such a nickel plating layer and a tin plating layer, the lower surface of each lead terminal 10A, 10B is subjected to an uneven surface (roughening) treatment such as sandblasting, knurling, etching treatment, etc. If the surface is formed, this uneven surface can enhance the adhesion between the nickel plating layer and the tin plating layer, and the soldering strength can be increased.

  <Effect of the first embodiment>

  According to the first embodiment described above, the following effects can be obtained.

  (1) When the lead terminals 10A and 10B are bent to the notch 24 side, the notch 24 side is in a compressed state and the notch 26 side is in an extended state. That is, the compressive stress due to bending acts on the notch 24 side, and the extensional stress acts on the notch 26 that is separated from the notch 24. If the bending center line of each lead terminal 10A, 10B is used as a reference, the compressive stress and the extension stress are concentrated at the symmetrical position, and the bending stress is absorbed by the notches 24, 26. For this reason, stress propagation from the lead terminals 10A, 10B to the exterior member 6 side is avoided. As a result, a decrease in adhesion between the exterior member 6 and the lead terminals 10A and 10B can be prevented, and a reduction in connection strength between the lead terminals 10A and 10B and the capacitor element 4 can be prevented. The adhesion of the boundary surface between the exterior member 6 and the lead terminals 10A and 10B is not impaired, and the airtightness of the exterior member 6 is not impaired.

  In other words, double notches having different positions and the same shape may be used. In addition, when bending lead terminals 10A and 10B having different notches, that is, notches 24 and 26, bending is performed by the notches 24 and 26 ( Compression) and elongation (elongation or elongation) are facilitated, and bending stress can be concentrated to reduce the ripple and influence on the exterior member 6. In this case, the elongation due to bending includes both elongation in the length direction and expansion in the width direction of the lead terminals 10A and 10B. Therefore, the function of the connecting portion between the lead terminals 10A and 10B and the capacitor element 4 is not degraded, and the reliability of the capacitor can be maintained.

  (2) Since the positions where the notches 24 and 26 are formed are different, the lead terminals 10A and 10B are not weakened, the lead terminals 10A and 10B are easily bent, and the lead terminals 10A and 10B are mechanically A reduction in strength can be prevented.

(3) Since the non-molded surface portion 28 is interposed between the notch 24 and the terminal lead surface 18, the non-molded surface portion 28 can prevent the bending stress from spreading. That is, although the non-molding surface portion 28 is formed by setting the interval t ₂ , if such a non-molding surface portion 28 is provided, spring back in a bent state can be taken into consideration, and dimensional stability can be ensured. In addition, the inner compression of the bent portion and the outer extension are not applied to the outer side of the exterior member 6, that is, the mold. Can be prevented. Further, since the notch 24 is formed adjacent to the non-molded surface portion 28, the depth of the notch 24 from the non-molded surface portion 28 increases, and the notch 24 serves as a fulcrum (starting point) when bending the lead terminal, Bending accuracy is improved by preventing the bending position from being shifted in the production process.

  In this embodiment, the flat forming of the lead terminals 10A and 10B and the notch forming are performed by a single forming process by the forming die 12. However, the forming die 12 is formed by the flat forming die and the notch forming. If the mold is set separately, a molding process for performing notch molding after flattening molding can be performed.

  As described above, if the unification process is performed, the number of molds to be prepared is small and the molding process can be performed only once. On the other hand, if the flattening process and the notch molding process are performed separately, each molding is performed. There is an advantage that the notch position can be adjusted as necessary.

[Second Embodiment]

  The second embodiment is a case of a chip capacitor using a base member together.

  FIG. 2 shows an example of the forming process of the capacitor and its lead terminal according to the second embodiment. The configuration illustrated in FIG. 2 is an example, and the present invention is not limited to such a configuration.

  In the capacitor 2 of this embodiment, the capacitor element 4 is enclosed in a metal case 7 as an exterior member, and the metal case 7 is formed of a conductor such as aluminum. Therefore, the base member is used as an insulating member on the sealing body 29 side. 30 (FIG. 2B) is arranged to constitute a chip capacitor capable of face bonding.

The second In the exemplary embodiment the metal case 7 and the lead terminals 10A, described above, which is installed between a 10B base member 30 (FIG. 2 (B)) is interposed, the notch 24 only that the thickness W ₄ minutes , 26 are shifted from the terminal lead surface 18 of the exterior member 6.

In this case, while the distance t ₄ to notched molding part 144 and the reference surface 16 in the mid-size 12M is in the first embodiment is the interval t _2, corresponding to intermediate width W ₄ of the base member 30 intervals t ₄ (> t ₂ ).

Further, the outer mold 12A, while the distance between the notch forming section 204 and the reference surface 22 in 12B is the interval in the first embodiment are 0, in this embodiment is set interval t ₅ Yes. The size of the interval t ₅ corresponds to the interposed width W ₄ of the base member 30 described above.

  According to such a configuration, as shown in FIG. 2B, the lead terminals 10 </ b> A and 10 </ b> B through which the base member 30 is penetrated are pulled out from the through holes 31 in the base member 30, and inside the terminal housing recess 32. Similarly to the first embodiment, the notch 24 can be bent at the fulcrum and disposed in the terminal housing recess 32 of the base member 30. Even when such a base member 30 is used, bending stress due to bending of the lead terminals 10A and 10B can be absorbed by the notch 26 on the opposite surface to the surface in the bending direction. The ripple to the connection portion can be suppressed, and the reliability of the capacitor 2 can be maintained without reducing the airtightness of the exterior member 6 and the connection strength with the capacitor element 4.

[Other Embodiments]

  (1) The shape of the notches 24 and 26 of the lead terminals 10A and 10B may be both rectangular as shown in FIG. 3A. As shown in FIG. The cross section may be V-shaped and the notch 26 may be square. Further, as shown in FIG. 3C, the notch 24 may have a square cross section and the notch 26 may have a semicircular cross section. Although not shown, the notches 24 and 26 may both have a V-shaped cross section and a semicircular cross section. In FIGS. 3A to 3C, Bx indicates the bending direction of the lead terminals 10A and 10B.

(2) Regarding the dimensions of the notch forming portions 144, 204 of the middle mold 12M and the outer molds 12A, 12B, as an example, elements for 25 [WV] -15 [μF]: round bar element chemical conversion, polymerization element, exterior member 6 ( Molded resin) Epoxy resin, crushing thickness of lead terminals 10A and 10B: 600 [μm]. In this case, the dimensions of the middle mold 12M and the outer molds 12A and 12B are as shown in FIG. The dimensions of each part are t ₁ = 0.15 [mm], W ₂ = 0.3 [mm], W ₃ = 0.3 [mm], and h ₂ = 0.05 [mm].

  (3) As described above, the notches 24 of the lead terminals 10A and 10B are formed on the surface portions of the lead terminals 10A and 10B in the bending direction and bent inward. At that time, the position of the deepest part (notch edge) 24d of the notch 24 closest to the exterior member 6 of the capacitor 2 becomes a bending fulcrum (starting point). Therefore, as shown in FIGS. 4A and 4B, when the edge of the deepest portion 26d of the notch 26 is equidistant from the exterior member 6 with respect to the deepest portion 24d of the notch 24, each notch 24 is provided. , 26 are not preferable because the lead terminals 10A and 10B are weakened even if the widths of 26 and 26 are different. When the edges on the exterior member 6 side of the notches 24 and 26 are at the same position, the bending stress applied by using the edge 24d of the notch 24 of the lead terminals 10A and 10B as a fulcrum during bending is applied to the edge 24d. Since the bending stress is applied to the non-flat portions 28 of the lead terminals 10A and 10B, the bending stress is applied to the contact surface between the exterior member 6 and the lead terminals 10A and 10B. The lead terminals 10A and 10B and the capacitor foil 2 are joined to the connection portion of the electrode foil. For this reason, it is preferable to shift the positions of the edge 24d of the notch 24 and the notch 26d of the notch 26.

  Further, with respect to the notch 24, the notch 26 has a predetermined angle from the folding fulcrum (starting point) of the notch 24. For example, the lead terminals 10A and 10B are bent 90 [°], so It is preferable that it is displaced. For example, it is the form of (C), (D) or (E) in FIG. In particular, the edge 26 d of the notch 26 is preferably present at a position of 45 ° from the bending fulcrum of the notch 24. As shown in FIG. 4C, the notch 26 may have the same depth and the same length as long as the notch 24 is displaced as described above, and the width of the notch 26 is expanded during bending. (Length) area. As shown in FIG. 4C, the notch 26 is formed at a position of 45 [°] with respect to the folding fulcrum of the notch 24, and as shown in FIG. The edge 26d is formed at a position of 45 ° with respect to the bending fulcrum of the notch 24. Also, as shown in FIG. 4E, the notch 26 may have an obtuse angled V-shaped cross section. In this case, the deepest portion 26d is an intermediate portion (notch bottom) of the V-shaped notch 26 and has a rectangular shape. Like the notch 26, it becomes an extended region.

Regarding the extension on the notch 26 side, as shown in FIG. 4C, the extension occurs in a region 1.2 to 1.4 times the thickness t ₃ of the lead terminals 10A and 10B. At this time, if the width of the notch 26 is 0.4 to 1.5 times the thickness t ₃ of the lead terminals 10A and 10B, the stretching stress can be reduced.

The width of the notch 24 is preferably 0.2 to 1.2 times the thickness t ₃ of the lead terminals 10A and 10B. The widths of the notches 24 and 26 are preferably (the width of the notch 24) <(the width of the notch 26).

The depths (h ₁ , h ₂ ) of the notches 24 and 26 are preferably set to 0.15 [mm] or less, for example, so as not to reduce the strength of the lead terminals 10A and 10B.

As described above, the most preferable embodiment and the like of the present invention have been described. However, the present invention is not limited to the above description, and is described in the claims or a form for carrying out the invention. It goes without saying that various modifications and changes can be made by those skilled in the art based on the gist of the invention disclosed in the above, and such modifications and changes are included in the scope of the present invention.

The capacitor according to the present invention and the method of manufacturing the capacitor are bent when the lead terminal is bent with the notch deepest part of the bent surface closest to the lead drawing surface of the exterior member as a fulcrum with respect to the surface portion in the bending direction of the lead terminal and the surface portion in the opposite direction. Since the largest bending stress is applied to the deepest notch portion closest to the lead drawing surface on the opposite side of the surface, the notch on the opposite surface of the bending surface extends, and the stress extending to the lead drawing surface side is reduced. Further, it is possible to provide a highly reliable capacitor, such as prevention of a decrease in connection strength between the lead terminal and the capacitor element, which is useful.

2 Capacitor 4 Capacitor element 6 Exterior member 7 Metal case 8 Element end face 10A, 10B Lead terminal 12 Mold (mold)
12M Medium mold 12A, 12B Outer mold 14A, 14B Molded surface 16 Reference surface 18 Terminal lead surface 20 Molded surface 142 Flat molded part 144 Notch molded part 202 Flat molded part 204 Notch molded part 22 Reference surface 23 Flat part 24 First notch 26 2nd notch 28 Non-molding surface part 29 Sealing body 30 Base member 31 Through-hole 32 Terminal storage recessed part

Claims (8)

An exterior member for sealing the capacitor element;
A lead terminal connected to the capacitor element and pulled out from the exterior member or a base member juxtaposed to the exterior member and bent;
Before the bending process, the lead terminal includes a flat portion, a first concave portion formed on a surface portion of the flat portion in a bending direction, and a second concave portion formed on a surface portion in a direction opposite to the bending direction. The capacitor is characterized in that the first concave portion and the second concave portion are set at different positions from the terminal lead-out surface portion of the exterior member.   The capacitor according to claim 1, wherein the first recess is set at a position closer to the terminal lead-out surface portion than the second recess.   The non-flat portion is provided between the exterior member or the base member and the flat portion of the lead terminal, and the first concave portion is formed in the vicinity of the non-flat portion. Capacitor described in.   4. The capacitor according to claim 1, wherein the flat portion is formed on the first concave portion side, and the first concave portion is formed in the vicinity of the non-flat portion. 5.   The capacitor according to claim 1, wherein the exterior member is a mold resin.   6. The first concave portion and the second concave portion are formed in a lead terminal made of aluminum, and a metal plating layer is formed on a flat portion of the lead terminal. A capacitor according to any one of the above. Forming a flat portion on a lead terminal connected to a capacitor element and drawn out from an exterior member covering the capacitor element;
The first concave portion is formed in the surface portion of the lead terminal, the first concave portion is set as a folding direction, and the second concave portion is positioned on the surface portion opposite to the bending direction from the surface portion of the exterior member or the base member. Forming the step,
Bending the lead terminal in the bending direction;
A method for manufacturing a capacitor, comprising: The method for manufacturing a capacitor according to claim 7, comprising a step of forming a non-flat portion between the exterior member or the base member and the flat portion of the lead terminal.

Images