JP2013026237A - Light-emitting element production apparatus and production method thereof, light-emitting module production apparatus and production method thereof, light-emitting module, light source apparatus, and liquid crystal display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance the accuracy of variation in luminescence properties against the target luminescence properties when the luminescence properties of each group are combined or synthesized, without increasing the accuracy of grouping of the luminescence properties.SOLUTION: When plural LED elements 3 extracted from plural groups are combined, an LED element 3 which constitutes a combination near the center of a region of desired properties is selected from each group and then the LED elements are mounted on a substrate, or when plural LED slave chips 9 extracted from plural groups are combined, an LED chip 9 which constitutes a combination near the center of a region of desired properties is selected from each group and then the LED chips are packaged.

Description

  The present invention relates to a light emitting element production apparatus and method for producing a light emitting element by packaging a plurality of light emitting element chips such as a plurality of light emitting diodes (LEDs), and mounting the packaged light emitting elements on a substrate. The present invention relates to a light emitting module production apparatus and a production method thereof, a light source device using a plurality of the light emitting modules, and a liquid crystal display device using the light source device as a backlight.

  This type of conventional liquid crystal display device has a transmissive liquid crystal panel, and has a backlight behind the transmissive liquid crystal panel. Conventionally, CCFL (Cold Cathode Fluorescent Lamp) has been the mainstream as a light source device used as a backlight, but it is promising to use LED as a light source instead of CCFL due to recent technological progress of LED. Has been.

  Patent Document 1 proposes a method of obtaining target chromaticity / luminosity by combining light emitters (LEDs). The light emitters (LEDs) are stocked by grouping (sorting / sorting) each other so that the light emission characteristics do not overlap according to the light emission characteristics of chromaticity and light intensity. When the groups are combined, a combination pattern close to the target light emission characteristic is calculated, the priority to be used is determined from the stock amount, etc., and the combination of light emission characteristics to be produced is selected.

  Patent Document 2 proposes a method for manufacturing a backlight (surface light source device) of a liquid crystal panel. In order to use LEDs whose emission colors vary with respect to the target chromaticity, classify them into two groups (or three groups) on both sides across the target chromaticity, and with regularity, alternately By arranging, the averaged (leveled) chromaticity is set to the target chromaticity.

  Patent Document 3 proposes a method for manufacturing a backlight (surface light source) for a liquid crystal panel. On the chromaticity diagram, the light emitting elements (LEDs) are classified into two groups having respective chromaticities sandwiching the target chromaticity from both sides. Two pairs are treated as a pair of light emitting elements, and a target chromaticity is obtained between the chromaticities of the two groups.

Special table 2011-515819 gazette JP 2010-175594 A JP 2009-158417 A

  In the conventional configuration disclosed in Patent Document 1, when the respective groups are combined to obtain a target light emission characteristic between them, the characteristic dispersion (variation) in each group is more than due to “additiveness of dispersion”. The characteristic dispersion at the time of combination always increases. Depending on the characteristic distribution after the combination, there is a concern that the yield will decrease. In order to suppress the characteristic variation at the time of combination, if the group classification is made finer, it will not only increase the labor of measurement due to accuracy improvement, but also increase the complexity due to multi-ranking and discard of non-standard distribution products, etc. There is a problem that production and management are complicated, cost is increased, and yield is lowered.

  In the conventional configuration disclosed in Patent Document 2, it depends on the standard (tolerance) of the obtained panel, but as in Patent Document 1, the degree of variation is larger than that of the original group. When it is arranged in combination, it becomes larger. As a result, a non-standard product panel can be produced, and further improvement in grouping accuracy is required. In addition, it is necessary to set an array having regularity in advance.

  Even in the conventional configuration disclosed in Patent Document 3, as in Patent Document 2, the characteristic variation at the time of combination / combination of each group becomes larger than the characteristic variation in each group.

  In all of Patent Documents 1 to 3, even if they are non-standard products of packaged light emitting elements, by combining them and mounting on a substrate, a light emitting module having a target light emitting characteristic is obtained. As described above, there has been a problem that the variation in the light emission characteristics at the time of combination / synthesis of each group becomes larger than the variation within each group.

  The present invention solves the above-described conventional problems, and without increasing the accuracy of grouping the light emission characteristics, increases the accuracy of the light emission characteristic variation with respect to the target light emission characteristics when combining and synthesizing the light emission characteristics of each group. It is an object of the present invention to provide a light-emitting module that can be used, a production device and a production method for the light-emitting module, a light source device that uses a plurality of the light-emitting modules, and a liquid crystal display device that uses the light source device as a backlight.

  The light emitting module production method of the present invention is a light emitting module production method in which a plurality of light emitting elements are mounted on a substrate to produce a light emitting module having desired characteristics, and the group classification means measures the characteristics of the plurality of light emitting elements. Then, based on the measured characteristics of the plurality of light emitting elements, a group classification process for classifying the light emitting elements having similar characteristics into a plurality of groups, and the group selection unit has a center of the characteristic distribution on both sides or around the desired characteristic region. A group selection step for selecting one or a plurality of groups, and a characteristic confirmation unit randomly extract a plurality of light emitting elements from the selected group or groups, and each of the plurality of light emitting elements extracted from each group Based on the characteristic confirmation step for confirming the characteristics of the element and the result of confirming the characteristics, the element mounting means can emit light extracted from each group. And a device mounting step of selecting a combination of light emitting devices that are close to the center of the region of the desired characteristics from the respective groups and mounting them on a substrate. Achieved.

  The light emitting module production method of the present invention is a light emitting module production method for producing a light emitting module having a desired characteristic by mounting a plurality of light emitting elements on a substrate, wherein the storage means stores characteristic measurement result data when the light emitting element is manufactured. And a light emitting element in which the element determining means is close to the center of the area of the target characteristic from among a plurality of characteristics stored in the storage means. A device determining step for determining a light emitting element to be combined based on the calculation result, and means for taking out a desired combination of light emitting elements from all elements, and using this means, an element mounting means is provided. And a device mounting step of mounting the determined combination of light emitting devices on the substrate, thereby achieving the above object. In this element mounting step, the element mounting means having means for taking out a desired combination of light emitting elements from all elements mounts the determined combination of light emitting elements on the substrate.

  The light emitting module production method of the present invention is a light emitting module production method for producing a light emitting module having a desired characteristic by mounting a plurality of light emitting elements on a substrate, and storing characteristic measurement result data at the time of manufacturing the light emitting element. However, when the memory step of storing the light emitting element so as to correspond one-to-one with the manufactured light emitting element and the element determining unit combine a predetermined number of the stored characteristics, the area near the center of the desired characteristic is obtained. An element determination step for determining the combination of light emitting elements to be combined from the calculation result, and means for mounting the individual elements at desired positions on the substrate according to the order of picking up the individual light emitting elements; The element mounting means using the means includes an element mounting step of mounting the determined combination of light emitting elements at a predetermined position on the substrate. Target is achieved. In this element mounting process, according to the order of picking up the individual light emitting elements, the element mounting means for mounting the individual elements at a desired position on the substrate mounts the determined combination of the light emitting elements at the predetermined positions on the substrate. .

  The light emitting device production method of the present invention is a light emitting device production method in which a plurality of light emitting device chips are packaged to produce a light emitting device having desired characteristics, and the group classification means measures the characteristics of the plurality of light emitting device chips. Then, the group classification step of classifying light emitting element chips having similar characteristics into a plurality of groups, and the group selection means select one or a plurality of groups having the center of the characteristic distribution on both sides or around the desired characteristics. A group selection step and a characteristic confirmation means for randomly extracting a plurality of light emitting element chips from one or a plurality of selected groups and confirming the characteristics of the plurality of light emitting element chips extracted from each group When the confirmation step and the element mounting means combine the light emitting element chips extracted from each group, the desired characteristic region The light emitting device chip of combination of near heart are those having an element mounting step of packaging by mounting selected from respective groups, the object is achieved.

  The light emitting device production method of the present invention is a light emitting device production method for producing a light emitting device having a desired characteristic by packaging a plurality of light emitting device chips. A storage step of storing the light-emitting element chip in a one-to-one correspondence with the manufactured light-emitting element chip, and the light-emitting element chip whose element determining means is close to the center of the target characteristic area from among the characteristics stored in the storage means A device determining step for determining a light emitting element chip to be combined from the calculation result, and means for taking out a light emitting element chip of any desired combination from all the element chips, and using this means And a device mounting step of combining and mounting the light emitting device chips of the determined combination in combination. Serial object is achieved. In this element mounting step, an element mounting unit having a unit capable of taking out a desired combination of light emitting element chips from all the element chips is combined and packaged by combining the determined light emitting element chips.

  The light emitting device production method of the present invention is a light emitting device production method in which a plurality of light emitting device chips are packaged to produce a light emitting device having desired characteristics. A storage step of storing the light-emitting element chip in a one-to-one correspondence with the manufactured light-emitting element chip; An element determining step for calculating a combination of chips and determining a light emitting element chip to be combined from the calculation result, and means for bonding the light emitting element chip at a desired position on the substrate according to the order of picking up the light emitting element chips, Using this means, the element mounting means combines the determined combination of light emitting element chips and mounts them at a predetermined position for packaging. Are those having a degree, the objects can be achieved. In this element mounting process, the light emitting element chips are mounted and packaged at desired positions on the substrate in accordance with the order in which the element mounting means picks up the determined combination of light emitting element chips.

  The light emitting module production apparatus of the present invention is a light emitting module production apparatus for producing a light emitting module having a desired characteristic by mounting a plurality of light emitting elements on a substrate. Element holding means for holding a plurality of light emitting elements, and a characteristic check for randomly extracting a plurality of light emitting elements from one or a plurality of groups and confirming the characteristics of the plurality of light emitting elements extracted from the one or a plurality of groups A device and a light emitting device extracted from the one or more groups, and a light emitting device of a combination that is close to the center of the region having the desired characteristic is selected from each group and the light emitting device is mounted. Means for achieving the above object.

  The light emitting module production apparatus of the present invention is a light emitting module production apparatus for producing a light emitting module having a desired characteristic by mounting a plurality of light emitting elements on a substrate. When a predetermined number of the characteristics stored in the storage means are combined with the storage means that stores the light-emitting elements in a one-to-one correspondence with the light-emitting elements, There is an element determining means for calculating a combination and determining a light emitting element to be combined from the calculation result, and a means for taking out a desired combination of light emitting elements from all elements, and using the means, the determined combination of light emission Element mounting means for mounting the element on the substrate, thereby achieving the above object. The element mounting means mounts the determined combination of the light emitting elements on the substrate by using means capable of taking out a desired combination of light emitting elements from all the elements.

  The light emitting module production apparatus of the present invention is a light emitting module production apparatus for producing a light emitting module having a desired characteristic by mounting a plurality of light emitting elements on a substrate. When a predetermined number of the characteristics stored in the storage means are combined with the storage means that stores the light-emitting elements in a one-to-one correspondence with the light-emitting elements, An element determining means for calculating a combination and determining a light emitting element to be combined from the calculation result, and a means for mounting the light emitting element at a desired position on the substrate according to the order of picking up the light emitting elements, and using the means And a device mounting means for mounting the determined combination of light emitting devices on the substrate, thereby achieving the above object. The element mounting means mounts the light emitting elements at desired positions on the substrate in accordance with the order of picking up the determined combination of light emitting elements.

  The light-emitting element production apparatus of the present invention is a light-emitting element production apparatus that produces a light-emitting element having desired characteristics by packaging a plurality of light-emitting element chips. A plurality of light emitting element chips each randomly extracted from one or a plurality of groups, and characteristics of each of the plurality of light emitting element chips extracted from the one or a plurality of groups are confirmed. When combining the light emitting element chips extracted from the plurality of groups with the characteristic confirmation means, the light emitting element chips of the combination that is close to the center of the region of the desired characteristic are selected and mounted from each group and packaged Element mounting means for achieving the above object.

The light emitting element production apparatus of the present invention is a light emitting element production apparatus for producing a light emitting element having desired characteristics by packaging a plurality of light emitting element chips.
The characteristic measurement result data at the time of manufacturing the light emitting element chip is combined with a storage means for storing the light emitting element chip in a one-to-one correspondence with the manufactured light emitting element chip, and a predetermined number of the characteristics stored in the storage means are combined. In this case, element combination means for calculating a combination of light emitting element chips that are close to the center of the target characteristic region and determining a light emitting element chip to be combined based on the calculation result, and a light emitting element having any desired combination among all elements It has means for taking out the chip, and it has element mounting means for selecting and mounting the light emitting element chip of the determined combination by using the means, and packaging the element, thereby achieving the above object. This element mounting means selects and mounts the determined combination of light-emitting element chips using means capable of taking out a desired combination of light-emitting element chips from all elements.

  The light emitting element production apparatus according to the present invention is a light emitting element production apparatus that produces a light emitting element having a desired characteristic by packaging a plurality of light emitting element chips. A light-emitting element that is close to the center of the target characteristic region when a predetermined number of light-emitting characteristics stored in the storage means are combined with storage means that stores the light-emitting element chip in a one-to-one correspondence. There are element determining means for calculating a combination of chips and determining a light emitting element chip to be combined from the calculation result, and means for bonding the light emitting element chip at a desired position on the substrate according to the order of picking up the light emitting element chips, And element mounting means for selecting and mounting light emitting element chips of the determined combination by using the means and packaging them. The objects can be achieved. This element mounting means mounts the light emitting element chip at a desired position on the substrate in accordance with the order of picking up the determined combination of the light emitting element chips and packages it.

  In the light emitting module of the surface light source or the line light source of the present invention, the characteristic standard width distribution of the light emitting element to be configured is distributed over a wide distribution width equal to or greater than the characteristic standard width of the module.

  Preferably, in the light emitting module of the surface light source or line light source of the present invention, the characteristic distribution of each light emitting element constituting the module is a combination of a plurality of characteristic groups distributed in a region that does not overlap with the characteristic specification distribution of the module. It has become.

  Further preferably, in the light emitting module of the surface light source or the line light source of the present invention, the characteristic distribution of the individual light emitting elements constituting the module is classified into a plurality of characteristic groups, and among these, the characteristics of at least one group are included. The standard deviation width of the distribution is configured not to overlap the standard deviation width of the module characteristic standard distribution.

  Further preferably, in the light emitting module of the surface light source or the line light source of the present invention, the characteristic distribution width of the light emitting element chips in the light emitting elements constituting the module is distributed in a range wider than the module characteristic distribution width.

  The light source device of the present invention is one in which one or a plurality of the light emitting modules of the present invention are arranged to irradiate light in a planar shape, thereby achieving the above object.

  In the liquid crystal display device of the present invention, the light source device of the present invention is provided on the back side of the liquid crystal panel and used as a backlight, thereby achieving the above object.

  With the above configuration, the operation of the present invention will be described below.

  In the present invention, the group classification means measures the characteristics of a plurality of light emitting elements, and classifies the light emitting elements having similar characteristics into a plurality of groups based on the measured characteristics of the plurality of light emitting elements, and a group The selection means selects a plurality of groups having the center of the characteristic distribution on both sides or around the desired characteristic region, and the characteristic confirmation means randomly selects a plurality of light emitting elements from the selected plurality of groups. Extracting and confirming the characteristics of each of the plurality of light emitting elements extracted from each group, and when the element mounting means combines the light emitting elements extracted from each group based on the confirmation result of the characteristics In addition, a combination of light emitting elements that are close to the center of the region having the desired characteristics is selected from each group and mounted on the substrate. And a mounting process.

  As a result, when a plurality of LED elements 3 extracted from a plurality of groups are combined, the LED element 3 having a combination close to the center of the region having the desired characteristics is selected from each group, and the LED element 3 is mounted on the substrate. Alternatively, in the case where a plurality of LED child chips 9 extracted from a plurality of groups are combined, the LED chip 9 that becomes a combination close to the center of the region having the desired characteristics is selected from each group and packaged. The variation in emission characteristics at the time of combination / synthesis is not larger than the variation within each group, so the accuracy of emission characteristics variation relative to the target at the time of combination / synthesis of each group is improved without increasing the accuracy of grouping of emission characteristics. Can be increased.

  As described above, according to the present invention, the variation in the light emission characteristics at the time of combination / combination of each group does not become larger than the variation in each group. -It is possible to increase the accuracy of the variation in the light emission characteristics with respect to the aim at the time of synthesis.

It is a conceptual diagram which shows on the chromaticity diagram the case where the target light emission characteristic is obtained by combining the group of two light emission characteristics performed in Embodiment 1 of the manufacturing method of the light emitting module of this invention. The figure for demonstrating the case where four LED elements are extracted from two groups of two light emission characteristics in Embodiment 1 of the manufacturing method of the light emitting module of this invention, and it combines efficiently and obtains the target light emission characteristic between each group. It is. (A) is a conceptual diagram showing on a chromaticity diagram a case where a target light emission characteristic is obtained by combining two conventional light emission characteristic groups, and (b) is a diagram illustrating a conventional method for producing a light emitting module. It is a figure for demonstrating the case where the target light emission characteristic is acquired by combining an LED element from the group of one light emission characteristic. It is a figure which shows the synthetic | combination result which simulated the case where each LED element of a different rank like FIG. 3 was extracted one by one from each package reel in order, and was combined. It is a figure which shows the synthetic | combination result which simulated the case where each LED element of a different rank was taken out from each package reel like FIG. 2, and each rank goods were combined so that it might become the target region center most. It is a figure which shows the case where the combination of each rank goods is simulated so that it may become near the center of the area | region T1, T2 which takes out several LED elements of rank a, b, and is aimed. It is a figure which shows the simulation result of the yield change in case the target area | region with respect to the extraction number from rank a, b of FIG. 6 is T1, T2. It is a figure for explaining how LED chips as light-emitting element chips and how the characteristics of the LED elements in the package state vary, and how the LED element rank products according to the characteristics variation are mounted in combination. (A) is a diagram showing a state where a wafer is divided into a large number of LED chips, (b) is a diagram showing a characteristic distribution of the LED chip, (c) is a diagram showing a state where the LED chip is packaged, (d) (A) is a figure which shows the characteristic distribution and rank AD of each packaged LED element, (e) is a figure which shows a mode that each packaged LED element is mounted on a board | substrate. It is a block diagram which shows the production apparatus of the light emitting module in Embodiment 1 of this invention, and its production method. (A) is a figure which shows the chromaticity change by fluorescent substance application | coating with respect to the wavelength distribution of several LED chip on a chromaticity diagram, (b) is a figure of several LED chip which can be used in order to obtain target chromaticity. FIG. 5C is a diagram showing a chromaticity change on a chromaticity diagram due to phosphor coating with respect to a narrow wavelength distribution, and FIG. 5C is a diagram showing that a target chromaticity can be obtained with high accuracy by combining LED chips having non-standard wavelengths. FIG. In the first embodiment of the LED element production method of the present invention, four LED chips are extracted from two groups of chromaticity characteristics and efficiently combined between the groups to obtain an LED element of the desired chromaticity characteristics. It is a figure for demonstrating. It is a block diagram which shows the production apparatus of the light emitting element in Embodiment 1 of this invention, and its production method. In Embodiment 2 of the LED element production method of the present invention, when all or a part of characteristic data is extracted from the stored chromaticity characteristics of the LED chip and efficiently combined to obtain an LED element having a target chromaticity characteristic It is a figure for demonstrating. It is a block diagram which shows the production apparatus of the LED element 3 as a light emitting element in Embodiment 2 of this invention, and its production method. It is a figure for demonstrating the case where the test result and rank are hold | maintained as test data for every LED element sequentially mounted in the tape of one reel in Embodiment 2 of the production method of the LED module of this invention. FIG. 16 is a diagram for explaining an example in which a plurality of LED elements sequentially mounted on the line light source substrate in the tape of one reel in FIG. 15 are sequentially mounted on the substrate. It is a block diagram which shows the modification of the production apparatus of the LED module as a light emitting module in Embodiment 2 of this invention, and its production method. In Embodiment 3 of the manufacturing method of the LED element of this invention, it is a conceptual diagram which shows on the chromaticity diagram the case where 3 groups of LED chips which have red, green, and blue luminescent color are combined and a uniform white light is obtained. . It is a conceptual diagram which shows on the chromaticity diagram the case where the target light emission characteristic is acquired by combining each group of the chromaticity characteristic as three light emission characteristics performed in Embodiment 3 of the manufacturing method of the light emitting module of this invention. The figure for demonstrating the case where four LED elements are extracted from the group of three light emission characteristics in Embodiment 3 of the production method of the light emitting module of this invention, and it combines efficiently and obtains the target light emission characteristic. It is. In Embodiment 3 of the method for producing a light emitting module of the present invention, the target light emission characteristics are obtained by combining several chromaticity LED elements selected from a plurality of chromaticity characteristics around the target light emission characteristic region T. It is a conceptual diagram which shows the case where it obtains on a chromaticity diagram. In Embodiment 3 of the LED module production method of the present invention, LED elements are efficiently combined from a reel made up of a collection of LED elements having a characteristic distribution width wider than a target characteristic range in one reel tape. It is a figure for demonstrating the example which obtains the target light emission characteristic.

  Embodiments 1 to 3 of the light emitting module production apparatus and production method of the present invention will be described below in detail with reference to the drawings. In addition, each thickness, length, etc. of the structural member in each figure are not limited to the structure to illustrate from a viewpoint on drawing preparation.

(Embodiment 1)
FIG. 1 is a conceptual diagram showing on a chromaticity diagram a case where a target light emission characteristic is obtained by combining groups of chromaticity characteristics as two light emission characteristics performed in Embodiment 1 of the light emitting module production method of the present invention. is there. The chromaticity diagram in this case can represent all the chromaticities, and the central portion is white and blue toward the left, and red toward the right. Combining bluish and reddish chromaticity results in white. Here, the chromaticity characteristic is mainly described as the light emission characteristic, but the present invention can be applied even if the light emission characteristic is a light quantity characteristic (light flux characteristic) or a VF characteristic (VI characteristic). .

  As shown in FIG. 1, in the method for producing a light emitting module according to the first embodiment, n (n ≧ 2) LED elements as light emitting elements in advance from each group constituting each rank a and b of chromaticity characteristics. , And the chromaticity characteristics of each of the n LED elements thus extracted are measured in advance, and the result of the chromaticity characteristics after each combination is calculated to obtain the target chromaticity characteristics within the region T. Two LED elements to be combined are selected from the ranks a and b and mounted on the substrate. The production method of Embodiment 1 will be described more specifically with reference to FIG.

  FIG. 2 illustrates a case where four LED elements are extracted from two groups having two light emission characteristics in the first embodiment of the method for producing a light emitting module of the present invention and efficiently combined between the groups to obtain a target light emission characteristic. It is a figure for doing.

  As shown in FIG. 2, the light emitting module production method according to the first embodiment first includes a plurality of sorted (classified) ranks, here, package reels 1 and 2 having two ranks a and b of chromaticity characteristics. prepare. These two ranks a and b are located on both sides of the target chromaticity characteristic region T. When combining the light emission of the LED elements of ranks a and b, the target chromaticity characteristics are obtained.

  Next, a plurality (four in this case) of LED elements 3 in the package reels 1 and 2 are taken out onto the measurement stage 4. The chromaticity characteristics of each of the four LED elements 3 are measured, or four LED elements 3 of rank a and four LED elements 3 of rank b are measured based on the chromaticity characteristics measured and stored in advance. There are a total of 16 combinations. A combined result of the chromaticity characteristics after the 16 combinations in total is calculated. A pair of two LED elements 3 that is a combination near the center of the region in the region T of the chromaticity characteristics targeted by these calculated values is selected from ranks a and b, respectively. In short, one of 16 combinations is selected as a combination near the center of the region in the region T of the target chromaticity characteristic. As a result, when the LED element 3 of rank a and the LED element 3 of rank b are combined, they can be placed near the center of the region in the region T of the target chromaticity characteristics. In order to fit the region of the chromaticity characteristic T in the vicinity of the center of the region with high accuracy, it is necessary to extract four or more, for example, about five or six, from each rank. Two or three extractions may be used.

  Thereafter, the selected pair of LED elements 3 are sequentially mounted on the line light source substrate 5 or the surface light source substrate 6 configured to form one unit of the light source to manufacture the light emitting module 7 or 8.

  One LED element 3 is extracted from each of the package reels 1 and 2 in the space corresponding to one LED element on the measurement stage 4 of each of the ranks a and b generated by mounting the selected LED element 3. Then replenish each measurement stage. The characteristic of the newly replenished LED element 3 is measured or a total of 16 combinations are calculated based on the characteristic measured and stored in advance, and the target chromaticity characteristic in the region T is calculated. A pair of two LED elements 3 that is a combination near the center of the region is selected. Thereafter, the above operation is repeated until the light emitting module 7 or 8 is completed.

  Here, in order to explain the effect of the first embodiment, a case of obtaining a conventional light emission characteristic will be described with reference to FIG.

  FIG. 3A is a conceptual diagram showing on a chromaticity diagram a case where a target light emission characteristic is obtained by combining two conventional light emission characteristic groups, and FIG. 3B is a diagram of a conventional light emitting module. It is a figure for demonstrating the case where a target light emission characteristic is obtained by simply combining LED elements sequentially from two groups of light emission characteristics in the production method.

  As shown in FIGS. 3A and 3B, each LED element 3 of ranks a and b having two chromaticity characteristics existing on both sides of the region T on the target chromaticity diagram is package reel 1. 2 are simply combined in order, and the region T on the chromaticity diagram can be obtained. At this time, as shown in FIG. 4 to be described later, when the LED elements 3 of ranks a and b that produce optical characteristics of desired chromaticity in two pairs are simply and randomly combined, “addition of dispersion” Therefore, the variation of the target chromaticity characteristic with respect to the region T on the chromaticity diagram is larger than the variation of the chromaticity characteristics of the original ranks a and b.

  FIG. 4 is a diagram showing a synthesis result simulating the case where LED elements of different ranks are simply extracted one by one from each package reel and combined as shown in FIG. 3, and FIG. It is a figure which shows the synthetic | combination result which simulated the case where each LED element of a different rank was taken out from each package reel like Embodiment 1, and each rank goods were combined so that it might become the center of the target area | region. .

  In FIGS. 4 and 5, the distribution when the coordinates are combined from the two groups (ranks a and b) distributed in the upper right and lower left of the coordinates as the target region T is examined. The number of samples is 2,000, the distribution width of the samples is ± 0.5 for both x and y, and the radius of the target circle is ± 0.71.

  As shown in FIG. 4, in the case of the conventional case where simple one-by-one extraction and combination are performed, the distribution width (standard deviation) at the time of synthesis was 0.579, and the yield was 75.8%.

  As shown in FIG. 5, in the case of the first embodiment where four combinations are extracted from each group and the combination closest to the center of the region in the target region T is selected, the distribution width (standard deviation) at the time of synthesis is At 0.252, the yield is 99.8 percent.

  The variation of the synthesis result in FIG. 4 (conventional method) is significantly wider than the variation of the synthesis result in FIG. 5 (the first embodiment), and the variation in chromaticity of the original ranks a and b. Has also spread significantly. Therefore, according to the first embodiment, it is possible to increase the accuracy of the emission characteristic variation with respect to the target emission characteristic at the time of combination / synthesis of the emission characteristics of each group without increasing the accuracy of grouping the emission characteristics.

  Next, the number extracted from each group in the case of the first embodiment will be considered.

  FIG. 6 is a diagram showing a case where a combination of rank products is simulated so that a plurality of LED elements of ranks a and b are taken out to be close to the center of the target areas T1 and T2. The target area T1 is wider than the area T2.

  As shown in FIG. 6, the chromaticity characteristic region of rank a in the upper right is within a square range in which the center (x, y) is (1.5, 1.5) and the distance between one side is 1 on the xy coordinates. It is distributed randomly. Further, the chromaticity characteristic region of the lower left rank b is randomly within a square range in which the center (x, y) is (−1.5, −1.5) and the distance between one side is 1 on the xy coordinates. Distributed. When combining the LED element of rank a and the LED element of rank b, a plurality of LED elements of rank a and b are extracted, and the target region T1 or the target area T1 is selected from the extracted LED elements of rank a and b. A pair of LED elements whose combination is close to the center of the region in T2 is selected, and ranks a and b are combined with the aim of the center coordinate (0, 0). The target circle has two radii of 0.50 in the region T2 and 0.71 in the region T1.

  FIG. 7 is a diagram showing a simulation result of the yield change when the target areas are T1 and T2 with respect to the number of extracted elements from ranks a and b in FIG.

  As shown in FIG. 7, a region T1 having a wide target area by a combination from ranks a and b is plotted with diamond points, and a region T2 having a narrow target area is plotted with circular points. When the number of extractions from ranks a and b is 7 or more, the yield is 100%, but the number of combinations is 7 × 7, 49, and the amount of computation is significantly increased. On the other hand, the yield is significantly improved from 49% to 82% in the narrow area T2 with high accuracy, and the yield is greatly increased in the wide area T1. This is a significant improvement from 76 percent to 96 percent. When the number of extractions from ranks a and b is two, one of the four combinations in the vicinity of the center of the region in the region T of the target chromaticity characteristics is selected. As a result, it is possible to select a chromaticity characteristic in the vicinity of the center of the area in the target chromaticity characteristic area T (T1 or T2) and obtain a more uniform chromaticity. it can. Therefore, if there are a plurality of extractions from ranks a and b, the chromaticity characteristics relative to the target chromaticity characteristics when combining and synthesizing the light emission characteristics without increasing the accuracy of grouping the chromaticity characteristics. The accuracy of variation can be increased.

  FIG. 9 is a block diagram showing a light emitting module production apparatus and production method according to Embodiment 1 of the present invention.

  In FIG. 9, the LED module production apparatus 30 according to the first embodiment measures the characteristics including the chromaticity characteristics of the LED elements 3 as the plurality of light emitting elements, and determines the characteristics from the measured characteristics of the plurality of LED elements 3. Classifying means 31 for classifying LED elements 3 having close characteristics into a plurality of groups, group selecting means 32 for selecting a plurality of groups having center of characteristic distribution on both sides of desired characteristics, and LED elements having similar characteristics in advance Light emitting element holding means (not shown) for holding a plurality of groups classified into three, and a plurality of LEDs extracted from a plurality of groups by randomly extracting a plurality of LED elements 3 from each of the plurality of groups When combining the characteristic confirmation means 33 for confirming the characteristics of each of the elements 3 and the LED elements 3 extracted from a plurality of groups, a desired characteristic range is obtained. The LED element 3 is selected from each group as a combination close to the center, and the element mounting means 34 for mounting the LED element 3 on the substrate is provided. Produces light emitting modules with special characteristics.

  In the LED module production method of the first embodiment using the LED module production apparatus 30 of the first embodiment, the group classification unit 31 measures characteristics including the chromaticity characteristics of the LED elements 3 as a plurality of light emitting elements. Then, based on the measured characteristics of the plurality of LED elements 3, the group classification step of classifying the LED elements 3 having similar characteristics into a plurality of groups, and the group selection means 32, the center of the characteristic distribution is on both sides of the desired characteristics. The group selection step of selecting a plurality of groups, and the characteristic confirmation means 33 randomly extract a plurality of LED elements 3 from the selected groups, and each of the plurality of LED elements 3 extracted from each group. When the characteristic confirmation step for confirming the characteristics and the element mounting means 34 combine the light emitting elements extracted from each group, the desired characteristics A device mounting step of selecting a combination of LED elements 3 close to the center of the area from each group and mounting them on a substrate, and mounting a plurality of LED elements 3 on the substrate to produce a light emitting module having desired characteristics To do.

  So far, the production method for producing the light emitting module 7 or 8 from the LED element 3 as the light emitting element according to the first embodiment has been described. However, the present embodiment is also applied when producing the LED light emitting element 3 from the LED chip. Is possible. Hereinafter, the first embodiment will be described in more detail.

  In the light emitting module production method of Embodiment 1, the first half chip forming means forms a plurality of semiconductor elements such as a plurality of light emitting elements arranged in a matrix on the wafer, and the chip test means comprises: After dividing the wafer for each LED element, the plurality of divided LED elements are tested, and divided into a plurality of ranks according to the test result, and the chip is mounted on the adhesive sheet for each group of the plurality of ranks. The test process and the packaging means package the LED chip on the light emitting part by sealing the mold containing the phosphor in a dome shape, test the packaged LED element, and depending on the test results, For each group of multiple ranks divided into ranks, for example, a packaging process to be mounted on a reel tape or the like, and module means are tested. And a module process of producing light emitting module by mounting on a substrate by combining a group of LED elements mounted on, for example, on a tape for each group in accordance with (LED module in this case) to.

  FIG. 8 explains how the LED chip 9 as the light emitting element chip and the LED element 3 in the package state have variations in characteristics, and how the LED element 3 rank products corresponding to the variation in characteristics are mounted in combination. FIG. 8A is a diagram illustrating a state in which a wafer is divided into a large number of LED chips 9, FIG. 8B is a diagram illustrating a characteristic distribution of the LED chips 9, and FIG. ) Is a diagram showing how the LED chip 9 is packaged, FIG. 8D is a diagram showing the characteristic distribution and ranks A to D of each packaged LED element 3, and FIG. 8E is each packaged. It is a figure which shows a mode that mounted LED element 3 is mounted on a board | substrate. In addition, the vertical axis | shaft of (b) and (d) is a number, and the horizontal axis has shown the LED characteristic. The LED characteristics are a chromaticity characteristic of hue (wavelength), a light emission characteristic of light quantity characteristic (light flux characteristic), and a VI (voltage current) characteristic (VF characteristic). Here, the chromaticity characteristic will be described in particular as the light emission characteristic of the hue (wavelength), but the present invention can also be applied to other characteristics.

  As shown in FIGS. 8B and 8D, the LED chip 9 and the packaged LED element 3 have variations in characteristic distribution in the manufacturing process. The LED chip 9 and the LED element 3 (package product) that can be used are limited due to restrictions on product use. (B) (1) and (2) in FIG. 8 (b) are nonstandard products and other nonstandard product LED chips 9 are combined to produce the packaged LED element 3 in FIG. 8 (c). Nevertheless, as shown in FIG. 8D, when the packaged LED element 3 (package product) is tested, non-standard products are generated as shown in (3) and (4) of FIG. 8D. According to the test result, each characteristic (light emission characteristic and VI characteristic) is divided into a plurality of ranks, for example, ranks A to D. As shown in FIG. 8E, a plurality of ranks A to D of LED elements 3 (package products) having characteristics are combined and mounted on a substrate (line light source substrate 5 or surface light source substrate 6). When the LED elements 3 (package products) are arranged in a straight line on the line light source substrate 5, the rank C LED elements 3 (package products) are arranged between the ranks A, and the rank D LEDs are arranged between the ranks B. Element 3 (package product) is arranged. When the LED elements 3 (package products) are arranged in a straight line on the surface light source substrate 6, the rank A and rank C LED elements 3 (package products) are alternately arranged, and the rank B and rank D LEDs are arranged. The elements 3 (package products) are alternately arranged and arranged in a matrix in a matrix. Here, in order to simplify the description, the LED elements 3 are mounted one by one on the line light source substrate 5 or the surface light source substrate 6, but in the first embodiment, as described above, the LED elements 3 are selected. The light emitting module 7 or 8 is manufactured by sequentially mounting the two LED elements 3 of the pair on the line light source substrate 5 or the surface light source substrate 6 configured to form one unit of the light source. In the first embodiment, nonstandard products such as (1) and (2) in FIG. 8B and nonstandard products such as (3) and (4) in FIG. An in-house item can be obtained.

  FIG. 10A is a diagram showing a chromaticity change on the wavelength distribution of a plurality of LED chips due to phosphor coating on the chromaticity diagram, and FIG. 10B is a diagram that can be used to obtain a target chromaticity. FIG. 10C is a diagram showing the chromaticity change by phosphor coating for a narrow wavelength distribution of the LED chip of FIG. 10, and FIG. 10C is a combination of LED chips of non-standard wavelengths to obtain the target chromaticity with high accuracy. It is a figure for demonstrating this on a chromaticity diagram.

  As shown in FIG. 10A, the wavelength of the LED chip is a blue short wavelength, and in the chromaticity diagram, the leftmost elliptical portion indicates the chip wavelength distribution position. In order to obtain the target chromaticity (here, white), a phosphor that emits yellow is applied. However, on the chromaticity diagram, the target chromaticity ( Here, white) cannot be obtained. In short, the wavelength range of the LED chip that can obtain the targeted chromaticity (here, white) is determined. As shown in FIG. 10B, when trying to obtain the target chromaticity, the wavelength range of the LED chip is limited to a narrow range at the center of the leftmost elliptical portion. When trying to obtain the target chromaticity from the wavelength range of the LED chip outside this narrow range (the chip wavelength range on the upper and lower sides of the ellipse at the left end), a different phosphor suitable for this is required. It becomes necessary to have many types of phosphors separately.

  On the other hand, as shown in FIG. 10 (c), if the LED element is a packaged product having a structure in which one unit of the light source is formed by two pairs of LED chips 9, the combination with the phosphor is aimed. When obtaining the chromaticity region T, a narrow specific wavelength region F of the LED chip is required. In short, by combining the two LED chips 9 of the wavelength regions F1 and F2 on both sides of the specific wavelength region F of the LED chip 9 for obtaining the target chromaticity characteristic region T with the phosphor, the specific wavelength region is obtained. It becomes an F LED chip, and a region T having a target chromaticity can be obtained by combining this with a phosphor.

  FIG. 11 shows LED elements having a target chromaticity characteristic by extracting four LED chips from two chromaticity characteristic groups in Embodiment 1 of the LED element production method of the present invention and combining them efficiently between the groups. It is a figure for demonstrating the case where it obtains.

  As shown in FIG. 11, the production method of the LED element (package product) as the light emitting element of the first embodiment is as follows. First, a plurality of sorted (classified) ranks, here, two ranks A, Sheets 10 and 11 on which B LED chips 9 are mounted are prepared. These two LED chips 9 of ranks A and B correspond to the LED chips 9 in the wavelength regions F1 and F2 on both sides of the specific wavelength region F.

  Next, a plurality (four in this case) of LED chips 9 are taken out from the sheets 10 and 11 onto the measurement stage 4 by the pickup collet 12. The chromaticity characteristics of each of the four LED chips 9 are measured, or four LED chips 9 in the wavelength band F1 of rank A and the wavelength band of rank B based on the chromaticity characteristics measured and stored in advance. There are a total of 16 combinations of four F2 LED elements 3. A combined result of the chromaticity characteristics after the 16 combinations in total is calculated. Two LED chip pairs in which these calculated values are combinations near the center of the region within the specific wavelength region F are selected from ranks A and B, respectively. In short, out of a total of 16 combinations, one of the combinations near the center of the region in the specific wavelength region F is selected. Accordingly, when the LED chip 9 of rank A and the LED chip 9 of rank B are combined, the combined result can be stored near the center of the region in the specific wavelength region F. In order to put the combined result in the vicinity of the center of the region within the specific wavelength region F with high accuracy, it is necessary to extract four or more, for example, about five or six from each rank A and B, and the accuracy is so high. May not be required, it is possible to extract a few from each rank.

  After that, the selected pair of LED chips 9 are sequentially mounted on the package substrate 13 configured to make one unit of the light source, and the light emitting portion of the LED chip 9 is set on the light emitting unit. The LED element 3 is produced by sealing a mold containing the phosphor in a dome shape and packaging it. The packaged LED element 3 is further subjected to a characteristic test.

  In short, the LED chip 9 that is a combination close to the central part in the target specific wavelength range F is selected and transferred onto the package substrate 13. That is, n (n ≧ 2) LED chips 9 are previously extracted from each group constituting each rank A and B of the chromaticity characteristics, and each of the extracted n LEDs is extracted. Measure the chromaticity characteristics of each chip, calculate the result of chromaticity characteristics after each combination, and select two LED chips from the ranks A and B that form a combination near the center of the area within the specific wavelength band F Then, it is mounted on the package substrate 13.

  After the chips of the combination are mounted, the chips of each rank are replenished to each measurement stage, the characteristics are measured, and the calculation and selection of the combination are repeated.

  FIG. 12 is a block diagram showing a production apparatus and production method for the LED element 3 as the light emitting element in the first embodiment of the present invention.

  In FIG. 12, the LED element 3 production apparatus 30 </ b> A according to Embodiment 1 measures the characteristics including the chromaticity characteristics of the LED chips 9 as the plurality of light emitting element chips, and from the measured characteristics of the plurality of LED chips 9. The group classification means 31A for classifying the LED chips 9 having similar characteristics into a plurality of groups, and the group selection means 32A for selecting a plurality of groups having the center of the characteristic distribution on both sides of the desired characteristics are close in advance to the characteristics Light emitting element holding means (not shown) for holding a plurality of groups classified as LED chips 9, and a plurality of LED chips 9 randomly extracted from the plurality of groups and extracted from the plurality of groups The characteristic confirmation means 33A for confirming the characteristics of each of the LED chips 9 is combined with a plurality of LED child chips 9 extracted from a plurality of groups. Device mounting means 34A for selecting and packaging the LED chip 9 that is a combination close to the center of the desired characteristic region from each group, and packaging the plurality of LED chips 9 to obtain desired characteristics. LED element 3 is produced.

  In the LED element 3 production method of the first embodiment using the LED element 3 production apparatus 30A of the first embodiment, the group classification means 31A measures the characteristics of the plurality of LED chips 9, and the LEDs having similar characteristics are measured. A group classification step for classifying chips 9 into a plurality of groups, a group selection unit 32A for selecting a plurality of groups having a center of characteristic distribution on both sides of a desired characteristic, and a characteristic confirmation unit 33A A plurality of LED chips 9 are randomly extracted from a plurality of selected groups, and a characteristic confirmation step for confirming the characteristics of each of the plurality of LED chips 9 extracted from each group, and an element mounting means 34A are provided for each group. When the LED chips extracted from the above are combined, the LED sub-chips 9 of the combination that are close to the center of the region of the desired characteristics are attached to each group. And a device mounting step of packaging selected from the-loop, producing the LED elements 3 of the desired characteristics to package a plurality of LED chips 9.

  As described above, according to the first embodiment, when a plurality of LED elements 3 extracted from a plurality of groups are combined, the LED element 3 that becomes a combination close to the center of the region having the desired characteristics is selected from each group and the LED is selected. When the element 3 is mounted on a substrate or a plurality of LED chips 9 extracted from a plurality of groups are combined, the LED chip 9 having a combination close to the center of the region having a desired characteristic is selected from each group and packaged. Therefore, the variation in emission characteristics during combination / combination of each group does not become larger than the variation in each group. It is possible to increase the accuracy of the light emission characteristic variation with respect to the light emission characteristic targeted at the time of synthesis.

(Embodiment 2)
In the first embodiment, for example, in the packaging process, the chromaticity characteristics of the LED chips extracted by four from each of the ranks A and B of the chromaticity characteristics are respectively measured, and the result of the chromaticity characteristics after each combination is a specific wavelength range. Although the description has been given of the case where two LED chips, which are combinations near the center of the region in F, are selected from the ranks A and B and mounted on the package substrate 13, in the second embodiment, the LED chip 9 is changed from the wafer to the LED chip 9. After the division, the plurality of divided LED elements are tested, and the plurality of LED chips 9 are placed in a matrix on the adhesive sheet in a state where the characteristic data of the test result is stored corresponding to the chip address. However, in the packaging process, the characteristic data of all the chip addresses of the wafer is used to calculate the chromaticity characteristics from a group of groups or an ungrouped distribution. D between the extracted all or a part group of chips, or in a distribution case of obtaining the LED elements chromaticity characteristics aim by combining efficiently will be described.

  FIG. 13 is a diagram illustrating a method of producing an LED element according to Embodiment 2 of the present invention, in which all or part of LED chips are extracted from a plurality of groups of chromaticity characteristics or distributions that are not grouped, and between groups or within distributions. It is a figure for demonstrating the case where it combines efficiently and obtains the LED element of the target chromaticity characteristic.

  In FIG. 13, the LED element production method according to the second embodiment is a test process in which the wafer 15 in a state in which the plurality of divided LED chips 9 are attached to the adhesive sheet 14 is divided after the wafer is divided into LED chips 9. have. In this test, a VI characteristic (VF characteristic) is tested in addition to a light emission characteristic composed of a chromaticity characteristic (wavelength characteristic) and a light amount characteristic (light flux characteristic). The test data 16 is preferably stored in a database (storage means) of a medium such as a hard disk that can be handled by a computer. In the test result, the chip coordinates (chip address) on the adhesive sheet 14 and the stored characteristic data have a one-to-one correspondence. Divide into multiple ranks according to the test results. Chip addresses are assigned to the plurality of LED chips 9 arranged in a matrix on the adhesive sheet 14, and test data 16 is stored in a database (storage means) corresponding to the chip addresses. In short, all the test data 16 is stored in the database during the chip test. The LED chips do not have to be sorted as in the first embodiment.

  In the LED element production method of the second embodiment, all or a part (plurality) of characteristic data of the LED chip 9 on the wafer 15 is selected. Using the test data 16 corresponding to the addresses of the plurality of LED chips 9, two LED chips 9 are selected in which the result of chromaticity characteristics after each combination is a combination near the center of the region in the specific wavelength region F. And a device mounting step of producing the LED device 3 by mounting the selected LED chip 9 on the package substrate 13 with the pickup collet 12, sealing a mold containing a predetermined phosphor into a dome shape, and packaging it. Yes.

  In short, the two LED chips 9 that are closest to the target at the time of combination are selected using a part or all of the test data 16 (approximately 100,000 wafer data in total), and the LED chips of the selected pair are selected. 9 is die-bonded on the package substrate 13 with the pickup collet 12. The coordinate data of the used LED chip 9 is stored in the database as “used”. It is better to have two or more adhesive sheets 14 having different characteristic distributions set at the same time and use them in case the characteristics are biased by only one adhesive sheet 14 and the desired characteristics cannot be obtained. preferable.

  FIG. 14 is a block diagram showing a production apparatus and production method for an LED element 3 as a light emitting element in Embodiment 2 of the present invention.

  In FIG. 14, the LED element 3 production apparatus 40 according to the second embodiment includes a storage unit 41 that stores characteristic measurement result data at the time of LED chip manufacturing in a one-to-one correspondence with the manufactured LED chip 9. When a predetermined number of the characteristics stored in the storage means 41 are combined, the combination of the LED chips 9 near the center of the target characteristic area is calculated, and the LED chip 9 to be combined is determined from the calculation result. A plurality of LED chips, including element determining means 42 and element mounting means 43 that has means for taking out a desired combination of LED chips 9 from all elements, and packages the determined combination of LED chips 9; 9 is packaged to produce the LED element 3 having desired characteristics.

  In the LED element 3 production method of the second embodiment using the LED element 3 production apparatus 40 according to the second embodiment, the storage means 41 uses the characteristic measurement result data at the time of LED chip production to produce the manufactured LED chip. 9 and the element determination means 42 calculate the combination of the LED chips 9 that are close to the center of the area of the target characteristic from the characteristics stored in the storage means 41. An element determining step for determining the LED chip 9 to be combined from the calculation result, and a means for taking out the LED chip 9 of the desired combination from all the element chips, and packaging the determined combination of the LED chips 9 And mounting a plurality of LED chips 9 to produce LED elements 3 having desired characteristics.

  Here, the production device of the light emitting module and the production method thereof are the same as those of the production device 40 of the LED element 3 and the production method thereof.

  In FIG. 14, the LED module production apparatus 40A according to the second embodiment has storage means 41A for storing the characteristic measurement result data at the time of manufacturing the LED element so as to correspond to the manufactured LED element 3 on a one-to-one basis. An element that determines a combination of LED elements 3 that are close to the center of the area of the target characteristic when a predetermined number is combined from the characteristics stored in the storage unit 41A, and determines the LED element 3 to be combined from the calculation result 42 A of determination means, and the means which has the means which can take out LED element 3 of the desired combination arbitrarily from all the elements, has element mounting means 43A which mounts LED element 3 of the determined combination, and has a plurality of LED elements 3 A light emitting module having desired characteristics is produced by mounting on a substrate.

  In the LED module production method according to the second embodiment using the LED module production apparatus 40A according to the second embodiment, the storage means 41A uses the LED element 3 produced by the characteristic measurement result data when the LED element is produced. The step of storing in a one-to-one correspondence and the element determining means 42A calculates a combination of the LED elements 3 that are close to the center of the area of the target characteristic from the characteristics stored in the storage means 41A, and the calculation The element determining step for determining the LED element 3 to be combined from the result and means for taking out the LED element 3 of any desired combination from all the elements are included, and the element mounting means 43A mounts the LED element 3 of the determined combination. And a plurality of LED elements 3 are mounted on a substrate to produce a light emitting module having desired characteristics.

  FIG. 15 is a diagram for explaining a case where test results and ranks are held as test data for each LED element sequentially mounted in one reel tape in Embodiment 2 of the LED module production method of the present invention. FIG. FIG. 16 is a diagram for explaining an example in which a plurality of LED elements 19 sequentially mounted in the tape 18 of one reel 17 are sequentially mounted on the line light source substrate.

  15 and 16, the packaged LED elements 19 are tested and divided into a plurality of ranks according to the test results, but a plurality of LED elements 19 are sequentially mounted on the tape 18 of one reel 17. Test results and ranks are stored in the database as test data (for example, [1-a]) for each time.

  In short, the test result (characteristic information) and rank information of the packaged LED element 19 and the winding order (address) of the tape 18 around the reel 17 are made to correspond one-to-one, and appropriate data is obtained. To store and hold in the storage means (database). Based on the stored characteristic information, the package layout on the board is calculated so that the layout of the desired characteristics (chromaticity, luminous flux, power) is locally and entirely on the board. According to the order (address) of the characteristics of the LED elements 19 sequentially arranged on the tape 18 of the reel 17, the packaged LED elements 19 are sequentially transferred onto the substrate according to the package layout on the substrate calculated in advance. Note that the means for using the tested package is not limited to the reel 17 and may be any method as long as the order can be managed. The LED elements 19 may be arranged on a sleeve or tray that can maintain the order. If a tray is used, a method of arranging and mounting in order on the tray may be used in accordance with the order of use on the substrate to be used.

  In addition, depending on the characteristic distribution of the packaged LED elements 19 and the order of the reels, it may be necessary to transfer to a plurality of substrates. If the configuration is such that a plurality of substrates can be set at the same time and transfer is possible, the utilization efficiency can be further increased.

  FIG. 17: is a block diagram which shows the modification of the production apparatus of the LED module as a light emitting module in Embodiment 2 of this invention, and its production method.

  In FIG. 17, the LED module production apparatus 50 according to the second embodiment includes a storage unit 51 that stores characteristic measurement result data at the time of manufacturing the LED elements so as to correspond to the manufactured LED elements 19 on a one-to-one basis. When a predetermined number of light emission characteristics stored in the storage means 51 are combined, a combination of LED elements 19 near the center of the target characteristic area is calculated, and the LED element 19 to be combined is determined from the calculation result. An element determining means 52 and an element mounting means 53 for mounting the LED element 19 at a desired position on the substrate according to the order of picking up the LED elements 19 and mounting the determined combination of the LED elements 3 are provided. A plurality of LED elements 19 are mounted on a substrate to produce an LED module having desired characteristics.

  In the LED module production method of the second embodiment using the LED module production apparatus 50 of the second embodiment, the characteristic measurement result data at the time of manufacturing the light emitting element is stored in the LED elements 19 and 1 manufactured by the storage means 51. The step of storing so as to correspond to the pair 1 and the element determining means 52 calculate a combination that is close to the center of the target characteristic area when a predetermined number of characteristics are combined from the characteristics stored in the storage means 51 Then, according to the element determination step for determining the LED element 19 to be combined from the calculation result and the order of picking up the individual LED elements 19, the element mounting means 53 has means for mounting the individual at a desired position on the substrate. Has an element mounting step of mounting the determined combination of the LED elements 3 on the substrate, and a plurality of LED elements 19 are mounted on the substrate to obtain the desired L The production of D module.

  Here, the production device and the production method of the LED element 19 are the same as those of the production device 50 and the production method of the light emitting module.

  In FIG. 17, the LED device 19 production apparatus 50 </ b> A according to the second embodiment includes storage means 51 </ b> A that stores characteristic measurement result data at the time of manufacturing LED chips in a one-to-one correspondence with the manufactured LED chips 9. In the case where a predetermined number of characteristics stored in the storage means 51A are combined, an element determination means for calculating a combination of the LED chips 9 close to the target characteristics and determining the LED chip 9 to be combined from the calculation result. 52A and an element mounting means 53A that has means for bonding the LED chip at a desired position on the substrate in accordance with the order of picking up the LED chips 9, and mounts and packages the determined combination of the LED elements 19 A plurality of LED chips 9 are packaged to produce an LED element 19 having desired characteristics.

  In the production method of the LED element 19 using the production device 50A for the LED element 19 of the second embodiment, the storage unit 51A has one-to-one correspondence with the produced LED chip 9 on the characteristic measurement result data at the time of producing the LED chip. And the element determination means 52A calculates the combination of the LED chips 9 that are close to the center of the target characteristic area from the characteristics stored in the storage means 51A. In accordance with the element determination step for determining the LED chip 9 to be combined and the order of picking up the LED chips 9, the device mounting means 53A has a means for bonding the LED chip 9 to a desired position on the substrate. A device mounting process for mounting and packaging the LED elements 19, and packaging the plurality of LED chips 9 to obtain desired characteristics. To produce the LED element 19.

  As described above, according to the second embodiment, as in the case of the first embodiment, the light emission characteristics targeted for the combination / synthesis of the light emission characteristics of each group can be achieved without increasing the accuracy of the grouping of the light emission characteristics. The accuracy of variation in light emission characteristics can be increased.

(Embodiment 3)
In the first and second embodiments, the case where the elements of the two chromaticity characteristic regions on both sides are combined to obtain the region T on the chromaticity diagram of the target chromaticity characteristics has been described. Now, a description will be given of a case where elements in three or more chromaticity characteristic regions are combined in order to obtain a region T on the chromaticity diagram having a target chromaticity characteristic.

  FIG. 18 is a chromaticity diagram showing a case where uniform white light is obtained by combining three groups of LED chips having red, green and blue emission colors in Embodiment 3 of the LED element production method of the present invention. It is a conceptual diagram.

  In FIG. 18, the LED element production method according to the third embodiment extracts a plurality of LED chips randomly from each group having red, green, and blue emission colors. Each chromaticity characteristic is measured, and a combination of LED chips near the center of the target chromaticity characteristic area T (white) is selected from each group, mounted, and packaged. As a result, more uniform and beautiful white light can be obtained. Note that the white color is not limited to the three colors of red, green, and blue, and a uniform white color may be created with three colors of yellow, cyan (light blue), and magenta (purple). The aim is not limited to white, and even with other colors, a light emitting body package with uniform characteristics can be obtained by utilizing the LED element production method of the third embodiment.

  FIG. 19 is a conceptual diagram showing, on a chromaticity diagram, a case where target light emission characteristics are obtained by combining each group of chromaticity characteristics as three light emission characteristics performed in Embodiment 3 of the method for producing a light emitting module of the present invention. It is. Here, the chromaticity characteristic is mainly described as the light emission characteristic, but the present invention can be applied even if the light emission characteristic is a light quantity characteristic (light flux characteristic) or a VF characteristic (VI characteristic). .

  As shown in FIG. 19, in the light emitting module production method of the first embodiment, n (n ≧ 2) light emitting elements in advance from each group constituting each rank a, b, c of chromaticity characteristics are used. Each of the LED elements is extracted, the chromaticity characteristics of each of the extracted n LED elements are measured in advance, and the result of the chromaticity characteristics after each combination is calculated to obtain a target chromaticity characteristics region T. Three LED elements that are combinations of the above are selected from the respective ranks a, b, and c and mounted on the substrate. The production method of the third embodiment will be described more specifically with reference to FIG.

  FIG. 20 illustrates a case where four LED elements are extracted from three groups of light emission characteristics and are efficiently combined between the groups to obtain a target light emission characteristic in Embodiment 3 of the light emitting module production method of the present invention. It is a figure for doing.

  As shown in FIG. 20, the light emitting module production method according to the third embodiment first has a plurality of sorted (classified) ranks, in this case, package reels 21 having three ranks a, b, c of chromaticity characteristics, 22 and 23 are prepared. These three ranks a, b, and c are located around the target chromaticity region T, and when combined by combining the light emission of the LED elements of ranks a, b, and c, the target chromaticity properties are obtained. (Region T).

  Next, the LED elements 24 of a plurality of packages (here, four packages) are taken out from the package reels 21, 22, and 23 onto the measurement stage 25. The chromaticity characteristics of each of the four LED elements 24 are measured, or four LED elements 24 of rank a and four LED elements 24 of rank b are measured based on the chromaticity characteristics measured and stored in advance. There are a total of 64 combinations of four LED elements 24 of rank c. A combined result of the chromaticity characteristics after a total of 64 combinations is calculated. A set of three LED elements 3 is selected from ranks a, b, and c, which are combinations near the center of the region in the region T of the chromaticity characteristics targeted by these calculated values. As a result, when the LED element 24 of rank a, the LED element 24 of rank b, and the LED element 24 of rank c are combined, they can be stored near the center of the region in the region T of the target chromaticity characteristics. In order to fit the chromaticity characteristic region T in the vicinity of the center of the region with high accuracy, it is necessary to extract four or more, for example, about five or six from each rank a to c, and when accuracy is not so required. May be a few extracted from each rank a to c.

  Thereafter, the selected three LED elements 24 are sequentially mounted on the line light source substrate 26 or the surface light source substrate 27 having a configuration for forming one unit of the light source, and the light emitting module 28 or 29 is manufactured. Accordingly, by arranging the three packaged LED elements 24 close to each other, more uniform and beautiful white light can be obtained.

  FIG. 21 shows a combination of LED elements having several chromaticity characteristics selected from a plurality of chromaticity characteristics around a target light emission characteristic region T in Embodiment 3 of the light emitting module production method of the present invention. It is a conceptual diagram which shows the case where the light emission characteristic is obtained on a chromaticity diagram.

FIG. 21 shows a lot of packaged LED elements which are not sorted (classified) and have a characteristic distribution range wider than the target characteristic range around the target chromaticity characteristic. In addition, it is possible to obtain a light emitter package having uniform characteristics.
A plurality of LED elements packaged in advance are randomly extracted, and the chromaticity characteristics of the extracted LED elements are measured. Further, when a predetermined number (three in this case) is combined from the extracted ones, the three LED elements are respectively selected so as to be a combination near the center of the region in the region T of the target chromaticity characteristics. In this way, three LED elements that are close to the target are selected and mounted on the substrate.

  FIG. 22 shows a LED module according to Embodiment 3 of the method for producing an LED module of the present invention from a reel formed of a collection of LED elements having a characteristic distribution width wider than a target characteristic range in one reel tape. It is a figure for demonstrating the example which obtains the target light emission characteristic by combining efficiently.

  In FIG. 22, a plurality of tested packaged LED elements are sequentially mounted on one reel of tape. It has been found that the LED elements in the reel are not ranked and have a characteristic distribution width wider than the target characteristic area.

  A plurality of (11 in the illustrated example) LED elements are randomly extracted from the reel, and the characteristics of each LED element are measured by the measurement stage 25. After that, a characteristic (for example, one or more characteristics among chromaticity, luminous flux, and electric power) obtained by combining a predetermined plurality of numbers (three in the illustrated example) from the extracted values is calculated (the illustrated example). Then, since 11 to 3 are combined, there are a total of 165 patterns), and three LED elements that are combinations near the center of the region having the desired characteristics are selected and mounted on the substrate. After the selected element is mounted, the gap generated in the measurement stage is randomly refilled and measured from the reel each time, and the next combination is calculated. Thereafter, these procedures are repeated until a predetermined combination to be mounted on the substrate is completed. Note that the use means of the tested package may not be a reel, but LED elements may be arranged on a sleeve or a tray. If a tray is used, a method of arranging and mounting in order on the tray may be used in accordance with the order of use on the substrate to be used.

  As described above, according to the third embodiment, as in the case of the first embodiment, the light emission characteristics targeted for the combination / combination of the light emission characteristics of each group can be achieved without increasing the accuracy of the grouping of the light emission characteristics. The accuracy of variation in light emission characteristics can be increased.

  As described above in the first to third embodiments, when the LED elements 3 of ranks a and b that produce optical characteristics of desired chromaticity in two pairs are combined simply and randomly, “dispersion of dispersion” Due to the “additivity”, the variation of the target chromaticity characteristic with respect to the region T on the chromaticity diagram is generally larger than the variation of the chromaticity characteristics of the original ranks a and b. For example, the variation of the target chromaticity characteristic with respect to the region T on the chromaticity diagram can be made smaller than the variation of the chromaticity characteristics of the original ranks a and b.

  An LED module using the present invention in which a combination is selected from ranks a and b in advance so as to be close to the center of the target chromaticity characteristic region is a light source module of a surface light source or a line light source, On the other hand, the characteristic standard width distribution of the constituent light emitting elements is distributed over a wide distribution width equal to or greater than that.

  Further, in a light emitting module of a surface light source or a line light source, the characteristic distribution of individual light emitting elements constituting the module is a combination of a plurality of characteristic groups distributed in a region that does not overlap with the characteristic specification distribution of the module.

  Furthermore, in a light source module of a surface light source or a line light source, the characteristic distribution of each light emitting element constituting the module is classified into a plurality of characteristic groups, and the standard deviation width of the characteristic distribution of at least one group among them is The module is configured not to overlap with the standard deviation width of the module characteristic specification distribution.

  Further, in the light emitting module of the surface light source or the line light source, the characteristic distribution width of the light emitting element chips in the light emitting elements constituting the module is distributed in a range wider than the module characteristic distribution width.

  A light source device can be obtained in which one or a plurality of light emitting modules of the present invention are arranged and light is irradiated in a planar shape. Such a light source device of the present invention is provided on the back side of the liquid crystal panel and can be used as a backlight.

  In the first to third embodiments, the LED element is described as the light emitting element. However, the present invention is not limited to this, and a combination of a laser element and a light emitter may be used.

  As mentioned above, although this invention has been illustrated using preferable Embodiment 1-3 of this invention, this invention should not be limited and limited to this Embodiment 1-3. It is understood that the scope of the present invention should be construed only by the claims. It is understood that those skilled in the art can implement an equivalent range based on the description of the present invention and the common general technical knowledge from the description of specific preferred embodiments 1 to 3 of the present invention. Patents, patent applications, and documents cited herein should be incorporated by reference in their entirety, as if the contents themselves were specifically described herein. Understood.

  The present invention relates to a light emitting element production apparatus and method for producing a light emitting element by packaging a plurality of light emitting element chips such as a plurality of light emitting diodes (LEDs), and mounting the packaged light emitting elements on a substrate. In the field of light emitting module production apparatus and production method thereof, light source apparatus using a plurality of the light emitting modules, and liquid crystal display apparatus using the light source apparatus as a backlight, the light emission characteristics at the time of combination / synthesis of each group Since the variation does not become larger than the variation within each group, the accuracy of the emission characteristic variation with respect to the aim at the time of combination / synthesis of each group can be increased without increasing the accuracy of grouping of the emission characteristics.

DESCRIPTION OF SYMBOLS 1, 2 Package reel 3 Packaged LED element 4 Measurement stage 5 Line light source substrate 6 Surface light source substrate 7, 8 LED module 9 LED chip 10, 11 Sheet 12 Pickup collet 13 Package substrate 14 Adhesive sheet 15 It is divided | segmented into LED chip Wafer 16 Test data 17 Reel 18 Tape 19 LED element 21, 22, 23 Package reel 24 LED element 25 Measurement stage 26 Line light source substrate 27 Surface light source substrate 28, 29 Light emitting module 30 LED module production device 30A LED element production device 31, 31A Group classification means 32, 32A Group selection means 33, 33A Characteristic confirmation means 34, 34A Element mounting means 40 LED element production apparatus 40A LED module production apparatus 41, 41A Memory means 42, 42A Element determination means 43, 43A Element mounting means 50 LED module production apparatus 50A LED element production apparatus 51 51A Storage means 52, 52A Element determination means 53, 53A Element mounting means a, b, c, A to D Rank T Area on the chromaticity diagram of the target chromaticity characteristic T1 Area where the target area is wide T2 Area where the target area is narrow F Specific wavelength range in the center F1 Wavelength range of rank a F2 Wavelength range of rank b

Claims (18)

In a light emitting module production method for producing a light emitting module having desired characteristics by mounting a plurality of light emitting elements on a substrate,
A group classification step in which the group classification means measures the characteristics of the plurality of light emitting elements and classifies the measured characteristics of the plurality of light emitting elements into a plurality of groups of light emitting elements having similar characteristics;
A group selection step in which the group selection means selects one or a plurality of groups having the center of the characteristic distribution on both sides or around the desired characteristic region;
A characteristic confirmation step, wherein the characteristic confirmation means randomly extracts a plurality of light emitting elements from each of the selected one or a plurality of groups, and confirms the characteristics of each of the plurality of light emitting elements extracted from each group;
Based on the confirmation result of the characteristics, when the element mounting means combines the light emitting elements extracted from the respective groups, the combination light emitting elements that are close to the center of the region of the desired characteristics are selected from the respective groups. A method for producing a light emitting module, comprising an element mounting step of mounting each on a substrate. In a light emitting module production method for producing a light emitting module having desired characteristics by mounting a plurality of light emitting elements on a substrate,
A storage step of storing the characteristic measurement result data at the time of manufacturing the light emitting element so as to correspond to the manufactured light emitting element on a one-to-one basis;
An element determining step in which the element determining means calculates a combination of light emitting elements that is close to the center of the area of the target characteristic from the characteristics stored in the storage means, and determines a light emitting element to be combined from the calculation result;
A light emitting module having means for taking out a desired combination of light emitting elements from all elements, and using the means, the element mounting means mounts the determined combination of light emitting elements on a substrate. Production method. In a light emitting module production method for producing a light emitting module having desired characteristics by mounting a plurality of light emitting elements on a substrate,
A storage step of storing the characteristic measurement result data at the time of manufacturing the light emitting element so that the storage unit has a one-to-one correspondence with the manufactured light emitting element;
An element determining step for calculating a combination that is close to the center of the region of a desired characteristic when the element determining means combines a predetermined number of stored characteristics, and determining a light emitting element to be combined from the calculation result;
According to the order of picking up the individual light emitting elements, the light emitting element has means for mounting the individual at a desired position on the substrate, and the element mounting means uses the means to place the determined combination of light emitting elements on the substrate at a predetermined position. A method for producing a light emitting module, comprising: an element mounting step for mounting on a substrate. In a method for producing a light emitting device for producing a light emitting device having desired characteristics by packaging a plurality of light emitting device chips,
A group classification step of measuring the characteristics of the plurality of light emitting element chips and classifying the light emitting element chips having similar characteristics into a plurality of groups;
A group selection step, wherein the group selection means selects one or a plurality of groups having the center of the characteristic distribution on both sides or around the desired characteristic;
A characteristic confirmation step in which the characteristic confirmation unit randomly extracts a plurality of light emitting element chips from one or a plurality of selected groups, and confirms the characteristics of each of the plurality of light emitting element chips extracted from the groups,
When the element mounting means combines light emitting element chips extracted from each group, an element for selecting and mounting a combination of light emitting element chips that are close to the center of the region having the desired characteristics is packaged. A method for producing a light-emitting element including a mounting process. In a method for producing a light emitting device for producing a light emitting device having desired characteristics by packaging a plurality of light emitting device chips,
A storage step of storing the characteristic measurement result data at the time of manufacturing the light emitting element chip so as to correspond to the manufactured light emitting element chip on a one-to-one basis;
An element determining step in which the element determining means calculates a combination of light emitting element chips that is close to the center of the area of the target characteristic from the characteristics stored in the storage means, and determines a light emitting element chip to be combined from the calculation result;
An element mounting process in which a light emitting element chip having a desired combination can be taken out from all the element chips, and the element mounting means uses the means to mount the light emitting element chips of the determined combination and package them. A method for producing a light emitting device comprising: In a method for producing a light emitting device for producing a light emitting device having desired characteristics by packaging a plurality of light emitting device chips,
A storage step of storing the characteristic measurement result data at the time of manufacturing the light emitting element chip so that the storage unit has a one-to-one correspondence with the manufactured light emitting element chip;
An element determining step in which the element determining means calculates a combination of light emitting element chips near the center of the area of the target characteristic from the light emitting characteristics stored in the storage means, and determines a light emitting element chip to be combined from the calculation result; ,
There is means for bonding the light emitting element chip at a desired position on the substrate according to the order of picking up the light emitting element chips, and the element mounting means using the means combines the determined combination of light emitting element chips into a predetermined position. A method for producing a light emitting element, comprising: an element mounting step for mounting and packaging. In a light emitting module production apparatus for producing a light emitting module having desired characteristics by mounting a plurality of light emitting elements on a substrate,
Element holding means for holding a plurality of groups classified in advance as light emitting elements having similar characteristics;
Characteristic confirmation means for randomly extracting a plurality of light emitting elements from one or a plurality of groups and confirming the characteristics of the plurality of light emitting elements extracted from the one or a plurality of groups,
When combining light emitting elements extracted from the one or more groups, element mounting means for selecting a light emitting element of a combination that is close to the center of the region of the desired characteristics from the respective groups and mounting the light emitting element A light emitting module production apparatus. In a light emitting module production apparatus for producing a light emitting module having desired characteristics by mounting a plurality of light emitting elements on a substrate,
Storage means for storing characteristic measurement result data at the time of manufacturing the light emitting element so as to correspond to the manufactured light emitting element on a one-to-one basis;
An element determining means for calculating a combination of light emitting elements that are close to the center of the area of the target characteristic when combining a predetermined number of characteristics stored in the storage means, and determining a light emitting element to be combined from the calculation result When,
An apparatus for producing a light-emitting module, having means for taking out a desired combination of light-emitting elements from all elements and using the means to mount a light-emitting element of a determined combination on a substrate. In a light emitting module production apparatus for producing a light emitting module having desired characteristics by mounting a plurality of light emitting elements on a substrate,
Storage means for storing characteristic measurement result data at the time of manufacturing the light emitting element so as to correspond to the manufactured light emitting element on a one-to-one basis;
An element determining means for calculating a combination of light emitting elements that are close to the center of the area of the target characteristic when combining a predetermined number of characteristics stored in the storage means, and determining a light emitting element to be combined from the calculation result When,
In accordance with the order of picking up the light emitting elements, it has means for mounting the light emitting elements at a desired position on the substrate, and using the means, it has element mounting means for mounting the light emitting elements of the determined combination on the substrate. Light emitting module production equipment. In a light emitting device production apparatus for producing a light emitting device having desired characteristics by packaging a plurality of light emitting device chips,
Light emitting element holding means for holding a plurality of groups classified in advance between light emitting element chips having similar light emission characteristics;
A plurality of light emitting element chips each randomly extracted from one or a plurality of groups, and a characteristic confirmation means for confirming the characteristics of each of the plurality of light emitting element chips extracted from the one or a plurality of groups;
Element combining means for selecting and mounting a combination of light emitting element chips that are close to the center of the region having the desired characteristics when the light emitting element chips extracted from the plurality of groups are combined; A light emitting device production apparatus. In a light emitting device production apparatus that produces a light emitting device with desired characteristics by packaging a plurality of light emitting device chips,
Storage means for storing characteristic measurement result data at the time of manufacturing the light emitting element chip so as to correspond to the manufactured light emitting element chip on a one-to-one basis;
An element that calculates a combination of light emitting element chips that are close to the center of the target characteristic area when a predetermined number is combined from the characteristics stored in the storage means, and determines a light emitting element chip to be combined from the calculation result A determination means;
Light emitting device having means for taking out a light emitting element chip of any desired combination from all elements, and element mounting means for selecting and mounting the light emitting element chip of the determined combination by using the means and packaging it Element production equipment. In a light emitting device production apparatus for producing a light emitting device having desired characteristics by packaging a plurality of light emitting device chips,
Storage means for storing characteristic measurement result data at the time of manufacturing the light emitting element chip so as to correspond to the manufactured light emitting element chip on a one-to-one basis;
When a predetermined number of light emitting characteristics stored in the storage means are combined, a combination of light emitting element chips near the center of the target characteristic area is calculated, and a light emitting element chip to be combined is determined from the calculation result. Element determining means;
According to the order of picking up the light emitting element chips, it has means for bonding the light emitting element chips at a desired position on the substrate. Using the means, the light emitting element chips of the determined combination are selected, mounted and packaged. A light-emitting element production apparatus having element mounting means. In light emitting modules of surface light sources or line light sources,
A light emitting module in which the characteristic standard width distribution of the constituent light emitting elements is distributed over a wide distribution width equal to or greater than the characteristic standard width of the module. In light emitting modules of surface light sources or line light sources,
A light emitting module comprising a combination of a plurality of characteristic groups in which the characteristic distribution of individual light emitting elements constituting the module is distributed in a region that does not overlap with the characteristic specification distribution of the module. In light emitting modules of surface light sources or line light sources,
The characteristic distributions of the individual light emitting elements constituting the module are classified into a plurality of characteristic groups, and among these, the standard deviation width of the characteristic distribution of at least one group overlaps the standard deviation width of the module's characteristic standard distribution. A light emitting module that is configured so that it does not become. In light emitting modules of surface light sources or line light sources,
A light emitting module in which the characteristic distribution width of the light emitting element chips in the light emitting elements constituting the module is distributed in a wider range than the module characteristic distribution width.   A light source device in which one or a plurality of light emitting modules according to any one of claims 13 to 16 are arranged to irradiate light in a planar shape.   A liquid crystal display device in which the light source device according to claim 17 is provided on the back side of a liquid crystal panel and used as a backlight.